Substrate transport device, substrate processing system including the same, and substrate processing device

Abstract

To provide a substrate transport device capable of reliably transporting a dry substrate and a wet substrate. [Solution] The hand 81 for dry substrates of the present invention comprises a first branch blade 81b, a pair of base end guides 812 provided at the base end of the first branch blade 81b and contacting the end of the substrate, and a pair of tip end guides 811 provided at the tip end of the first branch blade 81b and contacting the end of the substrate; the hand 82 for wet substrates comprises a second branch blade 82b, a pair of base end protrusions 822 provided at the base end of the second branch blade 82b and contacting the underside of the substrate W to support the substrate W, and a pair of tip end protrusions 821 provided at the tip end of the second branch blade 82b and contacting the underside of the substrate W to support the substrate W.

Description

[Technical Field]

[0001] The present invention relates to a substrate processing system and a substrate processing apparatus capable of performing a predetermined liquid process on a substrate, and more particularly to a substrate transport apparatus for transporting a substrate provided in the substrate processing system or the substrate processing apparatus. [Background technology]

[0002] Patent Document 1 describes a substrate transport device that can reliably prevent liquid from splashing when transporting a substrate on which liquid has been puddled. That is, the substrate transport device is equipped with a hand that holds the substrate, and a cover that houses the hand in a predetermined internal space. Liquid puddled on the substrate held by the hand does not splash outside the cover. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2020-188228 Summary of the Invention [Problem to be solved by the invention]

[0004] However, the above configuration does not sufficiently consider the transportation of dry substrates. The substrate transport device of Patent Document 1 is configured specifically for transporting puddled substrates. When it is necessary to transport dry substrates in addition to puddled substrates, a substrate transport device that only has a hand for transporting wet substrates will cause the dry substrates to become wet with the liquid adhering to the hand.

[0005] The present invention has been made in consideration of the above circumstances, and aims to provide a substrate transport device that can reliably transport dry substrates and wet substrates, as well as a substrate processing system and substrate processing device equipped with the same. [Means for solving the problem]

[0006] In order to solve the above problems, the present invention has the following configuration. That is, a substrate transfer device of the present invention is a substrate transfer device for transferring a substrate, comprising: At least one dry substrate hand for holding a dry substrate in a horizontal position; a wet substrate hand provided below the dry substrate hand for supporting a substrate on which a liquid has been puddled; a first moving mechanism that movably supports the dry substrate hand; a second moving mechanism that movably supports the wet substrate hand; a base member supporting the first movement mechanism and the second movement mechanism, The dry substrate hand includes: A first blade; a pair of base end guides provided at a base end of the first blade and in contact with an end of the substrate; a pair of tip guides provided at the tip of the first blade and in contact with the edge of the substrate; a substrate gripping pusher that is disposed at a base end of the first blade at a position sandwiched between a pair of first base end guides, and that contacts an edge of a substrate and presses the substrate toward the tip end guides to grip the substrate in cooperation with the tip end guides, The wet substrate hand includes: A second blade; a pair of base end protrusions provided at a base end of the second blade, the base end protrusions contacting a lower surface of the substrate to support the substrate; a pair of tip protrusions provided at the tip of the second blade and contacting the lower surface of the substrate to support the substrate; It is characterized by the following.

[0007] [Actions and Effects] According to the above configuration, the dry substrate hand and the wet substrate hand are provided separately, preventing the dry substrate from accidentally becoming wet with liquid. Furthermore, the dry substrate hand and the wet substrate hand are provided with separate substrate support structures suited to their respective applications, as described below, enabling reliable transport of both dry and wet substrates. Specifically, the dry substrate hand includes a first blade, a pair of base guides attached to the base end of the first blade and contacting the substrate edge, a pair of tip guides attached to the tip end of the first blade and contacting the substrate edge, and a substrate gripping pusher at the base end of the first blade, positioned between the pair of first base guides, that contacts the edge of the substrate and presses it toward the tip guide, thereby gripping the substrate in cooperation with the tip guide. This configuration provides a substrate transport device capable of high-speed transport while securely gripping a dry substrate.

[0008] The wet substrate hand also includes a second blade, a pair of base end protrusions attached to the base end of the second blade that contact the underside of the substrate to support it, and a pair of tip end protrusions attached to the tip end of the second blade that contact the underside of the substrate to support it. Because the base end protrusions and tip end protrusions do not contact the edge of the substrate, liquid piled on the substrate does not drip down the base end protrusions or tip end protrusions. If a member such as a substrate gripping pusher attached to the dry substrate hand were to be pressed against the edge of the substrate, the liquid piled on the substrate would undesirably drip down the member.

[0009] According to the above configuration, a dry substrate hand is provided separately from the wet substrate hand. By providing separate hands depending on the wetness state of the substrate, a dry substrate is not transported by a wet hand. According to the configuration of the present invention, the substrate can be transported while reliably maintaining its dry state.

[0010] According to the above configuration, the wet substrate hand is provided below the dry substrate hand, and this configuration prevents liquid dripping from the wet substrate hand from reaching the dry substrate hand, because the dry substrate hand is provided above the wet substrate hand.

[0011] In addition, in the above-mentioned substrate transport device, a fixed tray supported by the base member below the wet substrate hand for collecting liquid dropped from the wet substrate hand; a movable tray provided between the wet substrate hand and the fixed tray for receiving the liquid dropped from the wet substrate hand and guiding it to the fixed tray; a moving butt advance / retract mechanism that moves the moving butt back and forth horizontally relative to the base member; It is preferable to have the following.

[0012] [Actions and Effects] The above-described configuration includes a fixed tray supported on a base member below the wet substrate hand to collect liquid dropped from the wet substrate hand, and a movable tray located between the wet substrate hand and the fixed tray to receive liquid dropped from the wet substrate hand and guide it to the fixed tray. With this configuration, liquid dripping from the wet substrate hand is collected in the fixed tray. By having the movable tray follow the forward and backward movement of the wet substrate hand, the liquid on the substrate can be received in the movable tray regardless of the position of the wet substrate hand. Therefore, the above-described configuration provides a substrate transport device that can suppress liquid splashing.

[0013] In addition, in the above-mentioned substrate transport device, a tray hand provided below the wet substrate hand; a third moving mechanism that movably supports the tray hand and is supported by the base member, The tray hand preferably includes a tray for receiving the liquid dropping from the wet substrate hand.

[0014] [Actions and Effects] The above-described configuration includes a tray hand provided below the wet substrate hand, and a third movement mechanism movably supporting the tray hand and supported by a base member. The tray hand includes a tray that catches liquid dropping from the wet substrate hand. This configuration allows the tray to be configured to closely follow the wet substrate hand, allowing the tray to catch liquid placed on the substrate. Therefore, the above-described configuration provides a substrate transport device that can suppress liquid splashing.

[0015] In addition, in the above-mentioned substrate transport device, The drying substrate hand is composed of two hands, an upper hand and a lower hand, which are arranged vertically, It is preferable that the upper hand and the lower hand are each movably supported by the first movement mechanism provided separately.

[0016] [Actions and Effects] According to the above configuration, the dry substrate hand is composed of two hands, an upper hand and a lower hand, arranged one above the other, and the upper hand and the lower hand are movably supported by the first moving mechanism provided separately. With this configuration, the transport of the dry substrate before substrate processing and the transport of the dry substrate after substrate processing can be performed by different hands, respectively. Therefore, it is possible to prevent a situation in which a hand contaminated by a dry substrate before substrate processing grips a clean dry substrate after substrate processing. The above configuration provides a substrate transport device that improves the reliability of substrate processing in a substrate processing apparatus.

[0017] This specification describes an invention of a substrate processing system including the above-mentioned substrate transport apparatus. The substrate processing system includes: a batch processing device that performs batch processing for processing a plurality of substrates at once; a relay device that receives a plurality of substrates that have been batch-processed from the batch processing device, converts each substrate into a horizontal position, and transfers the substrates in the horizontal position by piling up liquid; a single-wafer processing device that receives the liquid-pile substrates transported to the relay device and processes each substrate one by one; a control unit that controls the batch processing device, the single wafer processing device, and the relay device, The single wafer processing apparatus includes: a drying chamber capable of drying the substrates one by one; the substrate transport device; an indexer robot that returns the dried substrate to the carrier; The control unit controlling the substrate transport device to receive the puddled substrate with the wet substrate hand and transport it to the drying chamber; controlling the drying chamber to perform a drying process on the substrate; controlling the substrate transport device to receive the substrate that has been dried in the drying chamber with the dried substrate hand and transport it to the indexer robot; Controlling the indexer robot to return the dried substrate to the carrier. It is characterized by the following.

[0018] [Actions and Effects] According to the above-described configuration, the control unit controls the substrate transport device to receive the puddled substrate with the wet substrate hand and transport it to the drying chamber, controls the drying chamber to dry the substrate, and controls the substrate transport device to receive the substrate dried in the drying chamber with the dry substrate hand and transport it to the indexer robot. In this way, by providing individual hands depending on the wetness state of the substrate, dry substrates are not transported by wet hands. According to the configuration of the present invention, substrates can be transported while reliably maintaining their dry state.

[0019] Similarly, this specification describes an invention of a substrate processing apparatus including the above-mentioned substrate transfer apparatus. The substrate processing apparatus is a substrate processing apparatus that includes a substrate transport device and performs single-substrate processing, processing substrates one by one, The apparatus includes an indexer robot that transports substrates within the apparatus, a processing block that performs substrate processing, and a control unit that controls the apparatus; The processing block comprises: a liquid supply chamber for piling liquid onto the substrate; a drying chamber for receiving the puddled substrate and performing a drying process; the substrate transport device, The control unit controlling the indexer robot to remove the substrate from the carrier; controlling the substrate transport device to receive the substrate taken out by the index robot with the dry substrate hand and transport it to the liquid supply chamber; controlling the liquid supply chamber to cause the substrate to be filled with liquid; controlling the substrate transport device to receive the substrate on which the liquid has been puddled in the liquid supply chamber with the wet substrate hand and transport it to the drying chamber; controlling the drying chamber to perform a drying process on the substrate; controlling the substrate transport device to receive the substrate that has been dried in the drying chamber with the dried substrate hand and transport it to the indexer robot; Controlling the indexer robot to return the dried substrate to the carrier. It is characterized by the following.

[0020] [Actions and Effects] According to the above-described configuration, the control unit controls the substrate transport device to receive the substrate removed by the indexer robot with the dry substrate hand and transport it to the liquid supply chamber, controls the liquid supply chamber to puddle the substrate, controls the substrate transport device to receive the substrate puddled in the liquid supply chamber with the wet substrate hand and transport it to the drying chamber, controls the drying chamber to dry the substrate, and controls the substrate transport device to receive the substrate dried in the drying chamber with the dry substrate hand and transport it to the indexer robot. In this way, by providing individual hands according to the wetness state of the substrate, dry substrates are not transported by wet hands. According to the configuration of the present invention, substrates can be transported while reliably maintaining their dry state. [Effects of the Invention]

[0021] According to the present invention, it is possible to provide a substrate transfer device capable of reliably transferring both dry and wet substrates, and a substrate processing system and substrate processing apparatus including the same. [Brief explanation of the drawings]

[0022] [Figure 1] 1 is a plan view illustrating an overall configuration of a substrate processing system according to a first embodiment. [Figure 2] FIG. 1 is a plan view illustrating the overall configuration of a batch processing apparatus according to a first embodiment. [Figure 3] FIG. 2 is a cross-sectional view illustrating the configuration of a carrier according to the first embodiment. [Figure 4] FIG. 2 is a perspective view illustrating a transfer block according to the first embodiment. [Figure 5] 4A to 4C are cross-sectional views illustrating the operation of the inverting chuck according to the first embodiment. [Figure 6] 4A to 4C are cross-sectional views illustrating the operation of the inverting chuck according to the first embodiment. [Figure 7] 4A to 4C are cross-sectional views illustrating the operation of the inverting chuck according to the first embodiment. [Figure 8] 4A to 4C are cross-sectional views illustrating the operation of the inverting chuck according to the first embodiment. [Figure 9] 4A to 4C are cross-sectional views illustrating the operation of the inverting chuck according to the first embodiment. [Figure 10] 4A to 4C are cross-sectional views illustrating the operation of the inverting chuck according to the first embodiment. [Figure 11] 5A to 5C are cross-sectional views illustrating the operation of the relay transport mechanism according to the first embodiment. [Figure 12] 5A to 5C are cross-sectional views illustrating the operation of the relay transport mechanism according to the first embodiment. [Figure 13] 5A to 5C are cross-sectional views illustrating the operation of the relay transport mechanism according to the first embodiment. [Figure 14] 5A to 5C are cross-sectional views illustrating the operation of the relay transport mechanism according to the first embodiment. [Figure 15] 4A to 4C are cross-sectional views illustrating the opening and closing operations of the reversing chuck according to the first embodiment. [Figure 16] 4A to 4C are cross-sectional views illustrating the opening and closing operations of the reversing chuck according to the first embodiment. [Figure 17] 4A to 4C are cross-sectional views illustrating the opening and closing operations of the reversing chuck according to the first embodiment. [Figure 18] 4A to 4C are cross-sectional views illustrating the opening and closing operations of the reversing chuck according to the first embodiment. [Figure 19] FIG. 2 is a cross-sectional view illustrating a liquid supply system to a substrate according to the first embodiment. [Figure 20] 4 is a cross-sectional view illustrating a state in which a substrate is placed on a carry-out path according to the first embodiment. FIG. [Figure 21] 4 is a cross-sectional view illustrating a state in which a substrate is placed on a carry-out path according to the first embodiment. FIG. [Figure 22] 4 is a cross-sectional view illustrating a state in which a substrate is placed on a carry-out path according to the first embodiment. FIG. [Figure 23] 4 is a cross-sectional view illustrating a state in which a substrate is placed on a carry-out path according to the first embodiment. FIG. [Figure 24] 4 is a cross-sectional view illustrating a state in which a substrate is placed on a carry-out path according to the first embodiment. FIG. [Figure 25] 1 is a plan view illustrating the overall configuration of a single-wafer processing apparatus according to a first embodiment. [Figure 26]1 is a side view illustrating the overall configuration of a single-wafer processing apparatus according to a first embodiment. [Figure 27] FIG. 2 is a plan view illustrating the configuration of the center robot according to the first embodiment. [Figure 28] FIG. 2 is a perspective view illustrating the configuration of a center robot according to the first embodiment. [Figure 29A] FIG. 2 is a cross-sectional view illustrating the configuration of a hand according to the first embodiment. [Figure 29B] FIG. 2 is a cross-sectional view illustrating the configuration of a hand according to the first embodiment. [Figure 30] FIG. 2 is a plan view illustrating the configuration of a hand according to the first embodiment. [Figure 31] FIG. 2 is a plan view illustrating the configuration of a hand according to the first embodiment. [Figure 32] FIG. 1 is a perspective view illustrating a configuration of a bat according to a first embodiment. [Figure 33] FIG. 2 is a perspective view illustrating the operation of the bat according to the first embodiment. [Figure 34] FIG. 2 is a perspective view illustrating the operation of the bat according to the first embodiment. [Figure 35] FIG. 2 is a perspective view illustrating the operation of the bat according to the first embodiment. [Figure 36] FIG. 2 is a perspective view illustrating the operation of the bat according to the first embodiment. [Figure 37] FIG. 2 is a perspective view illustrating the operation of the bat according to the first embodiment. [Figure 38] 1 is a flowchart illustrating a flow of substrate processing according to the first embodiment. [Figure 39] FIG. 2 is a plan view illustrating a substrate transfer path in the substrate processing according to the first embodiment. [Figure 40] FIG. 2 is a plan view illustrating a substrate transfer path in the substrate processing according to the first embodiment. [Figure 41] FIG. 2 is a plan view illustrating a substrate transfer path in the substrate processing according to the first embodiment. [Figure 42] 4A to 4C are cross-sectional views illustrating a method for transporting a wet substrate in substrate processing according to the first embodiment. [Figure 43]FIG. 2 is a plan view illustrating a substrate transfer path in the substrate processing according to the first embodiment. [Figure 44] 1A to 1C are cross-sectional views illustrating a method for transporting a dry substrate in substrate processing according to the first embodiment. [Figure 45] FIG. 10 is a plan view illustrating a substrate processing apparatus according to a second embodiment. [Figure 46] 10 is a flowchart illustrating a flow of substrate processing according to the second embodiment. [Figure 47] FIG. 10 is a plan view illustrating a substrate transfer path in substrate processing according to the second embodiment. [Figure 48] FIG. 10 is a plan view illustrating a substrate transfer path in substrate processing according to the second embodiment. [Figure 49] FIG. 10 is a plan view illustrating a substrate transfer path in substrate processing according to the second embodiment. [Figure 50] FIG. 10 is a cross-sectional view illustrating the configuration of an apparatus according to a modified example of the present invention. [Figure 51] FIG. 10 is a perspective view illustrating the configuration of an apparatus according to a modified example of the present invention. [Figure 52] FIG. 10 is a perspective view illustrating the configuration of an apparatus according to a modified example of the present invention. [Figure 53] FIG. 10 is a cross-sectional view illustrating the configuration of an apparatus according to a modified example of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0023] Hereinafter, a substrate processing system and a substrate processing apparatus according to the present invention will be described with reference to the drawings. The substrate processing system of Example 1 performs batch processing, which processes a plurality of substrates W collectively, and single-wafer processing, which processes substrates W one by one, in succession, and is configured such that the batch processing apparatus for batch processing and the single-wafer processing apparatus for single-wafer processing are connected by a relay device.

[0024] The substrate processing system according to the first embodiment performs various processes such as chemical processing, cleaning processing, and drying processing on substrates W. The substrate processing system employs a processing method (a so-called hybrid method) that combines a batch processing method in which a plurality of substrates W are processed collectively, and a single-wafer processing method in which substrates W are processed one by one. The batch processing method is a processing method in which a plurality of substrates W arranged in a vertical position are processed collectively. The single-wafer processing method is a processing method in which substrates W in a horizontal position are processed one by one. The substrate processing system of the present invention successively performs batch processing in which a plurality of substrates are processed collectively, and single-wafer processing in which substrates are processed one by one. The substrate processing system of the present invention includes a batch processing device and a single-wafer processing device. The batch processing device performs batch processing in which substrates are processed collectively. The single-wafer processing device performs single-wafer processing in which substrates are processed one by one.

[0025] That is, the substrate processing system of the present invention comprises a batch processing device 1 that processes multiple substrates W all at once, a relay device 6 that receives multiple substrates W that have been batch-processed from the batch processing device 1, converts each substrate to a horizontal position, and puddles liquid on the horizontally positioned substrates W for transport, and a single-wafer processing device 2 that receives the puddled substrates W transported to the relay device 6 and performs single-wafer processing by processing each substrate W one by one.

[0026] The substrate processing apparatus of the second embodiment is a substrate processing apparatus that performs predetermined processing on a substrate in a horizontal position. The substrate processing apparatus of the second embodiment does not necessarily need to be capable of performing batch processing. [Example]

[0027] <1. Overall structure> As shown in Fig. 1, the substrate processing system comprises a batch processing device 1 and a single wafer processing device 2 that are configured separately, and a relay device 6 that connects the two devices 1 and 2. The batch processing device 1 is involved in batch processing, which processes multiple substrates at once, while the single wafer processing device 2 is involved in single wafer processing, which processes substrates one by one. The relay device 6 is configured to transport substrates that have been batch processed from the batch processing device 1 to the single wafer processing device 2, and is a bridge structure provided at a position intermediate the batch processing device 1 and the single wafer processing device 2.

[0028] As shown in Fig. 1, the batch processing apparatus 1 and the single wafer processing apparatus 2 each have blocks separated by partitions. That is, the batch processing apparatus 1 has a stocker block 3, a transfer block 5 adjacent to the stocker block 3, and a batch processing block 7 adjacent to the transfer block 5. Fig. 2 shows a specific configuration of the batch processing block 7 in the batch processing apparatus 1. On the other hand, the single wafer processing apparatus 2 has an indexer block 4 and a single wafer processing block 8 adjacent to the indexer block 4.

[0029] The batch processing apparatus 1 is configured to perform batch processing and has a first housing 1A that houses the blocks that make up the batch processing apparatus 1. The single-wafer processing apparatus 2 is configured to perform single-wafer processing on substrates W that have already been batch-processed and has a second housing 2A that houses the blocks that make up the single-wafer processing apparatus 2. The first housing 1A has a first load port 9 that protrudes from a first wall surface that is one of the walls that make up the first housing and is perpendicular to the Y direction from the batch processing block 7 toward the transfer block 5. The second housing 2A has a second load port 10 that protrudes from a second wall surface that is one of the walls that make up the second housing 2A and is perpendicular to the Y direction, and the second load port 10 is located at the same position as the first load port 9 in the Y direction. A carrier C can be placed on the second load port 10.

[0030] For convenience, in this specification, the direction in which the stocker block 3, the transfer block 5, and the batch processing block 7 in the batch processing apparatus 1 are arranged is referred to as the "front-rear direction X." The front-rear direction X is also the direction in which the indexer block 4 and the single-wafer processing block 8 in the single-wafer processing apparatus 2 are arranged. The front-rear direction X extends horizontally. Within the front-rear direction X, the direction from the transfer block 5 toward the stocker block 3 in the batch processing apparatus 1 is referred to as the "front." The front also refers to the direction from the single-wafer processing block 8 toward the indexer block 4 in the single-wafer processing apparatus 2. The direction opposite the front is referred to as the "rear." The horizontal direction perpendicular to the front-rear direction X is referred to as the "width direction Y." For convenience, one direction of the "width direction Y" is referred to as the "right" and the other direction is referred to as the "left." For convenience, the direction perpendicular to the front-rear direction X and the width direction Y (height direction) is referred to as the "vertical direction Z." In each figure, for reference, front, rear, right, left, top, and bottom are indicated as appropriate.

[0031] In the substrate processing system of the present invention, first, a first batch processing is performed on substrates W in a batch processing device 1, and the substrates W after the batch processing are transported to the single wafer processing device 2 by the relay device 6. Thereafter, the substrates W undergo a drying process in the single wafer processing device 2. Thereafter, the substrates W undergo a second batch processing again in the batch processing device 1. After the batch processing, the substrates W are transported again by the relay device 6 to the single wafer processing device 2. Then, the substrates W undergo a drying process in the single wafer processing device 2. Thereafter, the substrates W are stored in the carrier C placed on the second load port 10. In this way, the substrate processing system completes the entire substrate processing process. Below, the specific configurations of each device in the substrate processing system of the present invention are described in the order of the batch processing device 1, relay device 6, and single wafer processing device 2.

[0032] <2. Batch processing equipment: Stocker block> The stocker block 3 is equipped with a first load port 9, which serves as an entrance through which a carrier C, which stores multiple substrates W in a horizontal position and vertically spaced at predetermined intervals, is introduced into the block. The first load port 9 protrudes from the outer wall of the stocker block 3, which extends in the width direction (Y direction).

[0033] FIG. 3 illustrates the configuration of a carrier C of the present invention. The carrier C has a plurality of horizontally extending slots S formed therein, which hold substrates W with their surfaces spaced apart. The slots S are arranged vertically at a specific pitch (e.g., 10 mm), and each slot S accommodates a substrate W. 25 slots S are provided in one carrier C. Therefore, in the carrier C, rows of substrates are arranged vertically at a specific pitch. A mounting plate Cb is located at a position that separates each slot S, and supports both ends of the substrate W together with its paired mounting plate Cb. Therefore, one mounting plate Cb is provided on each side of the carrier C and on a surface parallel to that side. An example of a carrier C is a sealed FOUP (Front Opening Unify Pod). In the present invention, an open container may be used as the carrier C.

[0034] The internal structure of the stocker block 3 will now be described. The stocker block 3 is equipped with a transport storage unit ACB that stocks and manages carriers C. The transport storage unit ACB is equipped with a carrier transport mechanism 11 that transports the carriers C and shelves 13 on which the carriers C are placed. The stocker block 3 can stock one or more carriers C.

[0035] The stocker block 3 has a plurality of shelves 13 on which carriers C are placed. The shelves 13 are provided on a partition wall separating the stocker block 3 and the transfer block 5. The shelves 13 include a stock shelf 13b on which carriers C are simply placed temporarily, and a carrier placement shelf 13a which is accessed by the handling robot HTR of the transfer block 5 and is used to remove substrates.

[0036] The carrier mounting shelf 13a is configured to be able to mount a carrier C that stores multiple horizontally oriented substrates at a predetermined interval in the vertical direction. The carrier mounting shelf 13a is configured to mount a carrier C from which a substrate W is to be removed. In this embodiment, one carrier mounting shelf 13a is provided, but multiple carrier mounting shelves 13a may be provided. The carrier transport mechanism 11 takes in a carrier C that stores an unprocessed substrate W from the first load port 9 and places it on the carrier mounting shelf 13a for substrate removal. At this time, the carrier transport mechanism 11 can also temporarily place the carrier C on a stock shelf 13b before placing it on the carrier mounting shelf 13a. The stocker block 3 has one or more carrier mounting shelves 13a.

[0037] <3. Batch processing equipment: Transfer block> The transfer block 5 is adjacent to the carrier mounting shelf 13a. The transfer block 5 is disposed adjacent to and rear of the stocker block 3. The transfer block 5 is equipped with a handling robot HTR that can access carriers C placed on the carrier mounting shelf 13a for removing substrates, an HVC position conversion unit 23 that converts the position of multiple substrates W collectively from a horizontal position to a vertical position, and a pusher mechanism 25. The HVC position conversion unit 23 converts multiple substrates W collectively from a horizontal position to a vertical position. Furthermore, a substrate transfer position PP is set in the transfer block 5 for transferring multiple substrates W to the substrate transport mechanism WTR provided in the batch transport region R2.

[0038] As shown in FIG. 4, the handling robot HTR, HVC posture conversion unit 23, and pusher mechanism 25 are arranged in this order in the Y direction. The handling robot HTR has a hand 211 that can hold a substrate W in a horizontal posture. Each hand 211 can hold a single substrate W. The handling robot HTR has hands 211 arranged in the vertical direction. The handling robot HTR can transport multiple substrates W at once by holding a substrate with each hand 211. The movement support mechanism 213 is a mechanism that constitutes the handling robot HTR, and is configured to rotate the hand 211 around a vertical axis, raise and lower the hand 211, move the hand 211 forward and backward in the forward and backward direction X, and move the hand 211 laterally in the left and right direction Y.

[0039] The handling robot HTR has 25 hands 211. The handling robot HTR uses these hands to transport 25 substrates stored in the carrier C all at once.

[0040] The HVC attitude conversion unit 23 is configured to convert the substrate W taken out of the carrier C by the handling robot HTR from a horizontal attitude to a vertical attitude. The HVC attitude conversion unit 23 includes a pair of mounting rods 231 and a pair of clamping rods 232 extending in the vertical direction (Z direction). The support base 237 has a support surface extending in the XY plane that supports the mounting rods 231 and clamping rods 232. The rotation drive mechanism 238 is configured to rotate the mounting rods 231 and clamping rods 232 together with the support base 237 by 90°. This rotation causes the mounting rods 231 and clamping rods 232 to extend in the left-right direction (Y direction).

[0041] The pusher mechanism 25 includes a pusher 251 that can arrange the substrate W in a vertical position in the horizontal direction. The pusher 251 is a half-pipe type that follows the curve of the bottom of the substrate W. In the initial state, the pusher 251 has a U-shaped groove 251a that forms the half-pipe extending in the left-right direction Y. In this state, the pusher 251 can receive the substrate W from the HVC position conversion unit 23.

[0042] The pusher shift mechanism 254 can reciprocate the pusher 251 in the initial state in the left-right direction Y. The pusher shift mechanism 254 can move the pusher 251 closer to the HVC attitude conversion unit 23, and can also move the pusher 251 closer to the substrate transport mechanism WTR.

[0043] The pusher lifting mechanism 255 can lift the pusher 251 from the initial position to the sky position. The pusher lifting mechanism 255 can also return the pusher 251 from the sky position to the initial position.

[0044] The following describes how the handling robot HTR retrieves horizontally oriented substrates W from the carrier C and transports them to the pusher 251. First, the handling robot HTR orients its hand 211 forward to retrieve the row of horizontally oriented substrates from the carrier C all at once. Then, the handling robot HTR rotates the hand 211 around a rotation axis extending vertically, and directs the hand 211 toward the HVC posture conversion unit 23, as shown in Fig. 4. Note that the substrates W held by the hand 211 are omitted from Fig. 4.

[0045] Thereafter, the hand 211 delivers the row of substrates to the HVC attitude conversion unit 23. At this time, the substrates W are held by a pair of placement rods 231.

[0046] Having acquired the substrate row, the HVC attitude conversion unit 23 operates the rotation drive mechanism 238 as shown by the arrow in Figure 4 to convert the attitude of the substrates W constituting the substrate row from a horizontal attitude to a vertical attitude. As a result, the substrates W that were aligned vertically and in a horizontal attitude are now aligned in the left-right direction Y (horizontal direction). At this time, the substrates W are separated from the pair of placement rods 231 and supported by the pair of clamping rods 232.

[0047] 4, before the HVC attitude conversion unit 23 rotates, the pusher mechanism 25 moves the pusher 251 downward and waits until the train of substrates arrives. The pusher mechanism 25 then raises the pusher 251 toward the substrate W supported by the clamping rod 232, as shown by the arrow in FIG. 4. The substrate W is then pushed up by the pusher 251 and separated from the clamping rod 232, and is eventually held only by the pusher 251. In this way, the pusher mechanism 25 obtains the substrate W from the HVC attitude conversion unit 23.

[0048] The pusher mechanism 25 repeats this process of acquiring a substrate row twice, thereby forming a lot of 50 substrates arranged horizontally. The lot is made up of substrates W for two carriers C as described in FIG. 3, and the arrangement pitch of the substrates W in the lot is half (5 mm) of the arrangement pitch of the substrates W in the carrier C. Furthermore, in the substrate processing apparatus of the present invention, an operation of rotating the pusher 251 180° around the vertical axis can be added between the operation of acquiring the first substrate row and the operation of acquiring the second substrate row. Such a lot is a type of substrate row in the present invention.

[0049] The substrate row support section 33 is configured to be able to temporarily store a row of substrates made up of dry substrates. If a congestion of substrate rows occurs during the subsequent chemical treatment, the substrate transport mechanism WTR can make the substrate row support section 33 wait for the substrate row before chemical treatment.

[0050] <4. Batch processing device: Batch processing block> The batch processing block 7 is adjacent to the transfer block 5. The batch processing block 7 performs batch processing on the above-mentioned lots. The batch processing block 7 is divided into a batch processing region R1, which is arranged in the width direction (Y direction), and a batch transport region R2. Each region extends in the front-to-rear direction (X direction). In detail, the batch processing region R1 is located inside the batch processing block 7. The batch transport region R2 is adjacent to the batch processing region R1 and is located at the leftmost side of the batch processing block 7 (see Figure 2).

[0051] <5. Batch Processing Block: Batch Processing Area> The batch processing area R1 in the batch processing block 7 is a rectangular area extending in the front-to-rear direction (X direction). One end (front side) of the batch processing area R1 is adjacent to the relay device 6. The other end (rear side) of the batch processing area R1 extends in a direction away from the transfer block 5 and the relay device 6. Therefore, the relay device 6 is a device inserted at a position that separates the batch processing device 1 from the middle. When transporting a row of substrates from the batch processing device 1 to the relay device 6, a second substrate transport mechanism WTR possessed by the batch processing device 1 is used.

[0052] The second substrate transport mechanism WTR transports multiple substrates W in a batch in a vertical position between the transfer block 5, the batch processing units BPU1 to BPU6, and the loading position IP of the relay device 6. Therefore, the batch transport area R2, which is the area in which the second substrate transport mechanism WTR can move, is not divided by the relay device 6, but extends in the Y direction along the left end of the relay device 6. The relay device 6 is configured to be fitted inside the batch processing device 1, but does not reach the left end of the batch processing device 1, because the batch transport area R2 is provided at the left end of the batch processing device 1.

[0053] The batch processing region R1 is equipped with a batch processing section that mainly performs batch processing. Specifically, the batch processing region R1 has multiple batch processing units BPU1 to BPU6 arranged in the direction in which the batch processing region R1 extends, which immerse multiple substrates W all at once. The batch processing units BPU1 to BPU6 immerse multiple substrates W all at once in a vertical position. The arrangement of the batch processing units BPU1 to BPU6 will be specifically described. The first batch processing unit BPU1 is adjacent to the relay device 6 from the rear. The second batch processing unit BPU2 is adjacent to the first batch processing unit BPU1 from the rear. The third batch processing unit BPU3 is adjacent to the second batch processing unit BPU2 from the rear. The fourth batch processing unit BPU4 is adjacent to the third batch processing unit BPU3 from the rear. The fifth batch processing unit BPU5 is adjacent to the fourth batch processing unit BPU4 from the rear. The sixth batch processing unit BPU6 is adjacent to the fifth batch processing unit BPU5 from the rear. Therefore, the first batch processing unit BPU1, the second batch processing unit BPU2, the third batch processing unit BPU3, the fourth batch processing unit BPU4, the fifth batch processing unit BPU5, and the sixth batch processing unit BPU6 are arranged in this order, away from the relay device 6. For convenience of illustration, the second batch processing unit BPU2 to the sixth batch processing unit BPU6 are omitted from Figure 1. This configuration can be understood by referring to Figure 2.

[0054] The batch processing units BPU1 to BPU6 each have a batch processing tank according to the present invention. The batch processing tank is a liquid tank that holds a chemical solution or pure water. The chemical solution may be an acidic aqueous solution, such as a phosphoric acid aqueous solution. In this specification, the chemical solution and pure water are collectively referred to as the processing liquid. The batch processing tanks that hold the chemical solution are referred to as batch chemical processing tanks CHB2 to CHB6, and the batch processing tank that holds pure water is referred to as the batch rinse processing tank ONB.

[0055] Specifically, the second batch processing unit BPU2 includes a batch chemical processing bath CHB2 that performs chemical processing on the array of substrates collectively, and a lifter LF2 that raises and lowers the array of substrates between a substrate transfer position and a chemical processing position (see FIG. 2). The substrate transfer position is a position set above the batch chemical processing bath CHB2 that is accessible to the second substrate transport mechanism WTR, and the chemical processing position is a position set within the batch chemical processing bath CHB2 where the array of substrates can be immersed in the chemical solution. The batch chemical processing bath CHB2 performs acid processing on the array of substrates. The acid processing may be phosphoric acid processing, but may also be processing using other acids. The phosphoric acid processing is performed by etching the multiple substrates W that make up the array of substrates. The etching processing, for example, chemically etches the nitride film on the surface of the substrate W.

[0056] The batch chemical processing tank CHB2 contains an acid solution such as a phosphoric acid solution. A lifter LF2 is attached to the batch chemical processing tank CHB2 to move the array of substrates up and down. The lifter LF2 moves up and down in the vertical direction (Z direction). Specifically, the lifter LF2 moves up and down between a processing position inside the batch chemical processing tank CHB2 and a transfer position above the batch chemical processing tank CHB2. The lifter LF2 holds the array of substrates W in a vertical position. At the transfer position, the lifter LF2 transfers the array of substrates between the second substrate transport mechanism WTR. When the lifter LF2 moves down from the transfer position to the processing position while holding the array of substrates, the entire area of ​​the substrates W is below the surface of the chemical solution. When the lifter LF2 moves up from the processing position to the transfer position while holding the array of substrates, the entire area of ​​the substrates W is above the surface of the chemical solution. The lifter LF2 can immerse, in a batch processing tank, a plurality of substrates in a vertical position whose position has been changed by the HVC position change unit 23. At this time, the lifter LF2 descends from the transfer position to the processing position.

[0057] Specifically, the third batch processing unit BPU3 includes a batch chemical processing tank CHB3 and a lifter LF3 that raises and lowers the substrate row between the substrate transfer position and the chemical processing position. The batch chemical processing tank CHB3 has the same configuration as the batch chemical processing tank CHB2 described above. That is, the batch chemical processing tank CHB3 contains the chemical solution described above and is equipped with a lifter LF3. The batch chemical processing tank CHB3 performs the same processing on the substrate row as the batch chemical processing tank CHB2. The batch processing apparatus 1 of this example includes multiple processing tanks capable of performing the same chemical processing. This is because phosphoric acid processing takes longer than other processes. Phosphoric acid processing takes a long time (e.g., 60 minutes). Therefore, the apparatus of this example is designed to perform acid processing in parallel using multiple batch chemical processing tanks.

[0058] The fourth batch processing unit BPU4 to the sixth batch processing unit BPU6 have the same configuration as the second batch processing unit BPU2 and the third batch processing unit BPU3. Specifically, the fourth batch processing unit BPU4 includes a batch chemical processing tank CHB4 and a lifter LF4 that raises and lowers the substrate array between the substrate transfer position and the chemical processing position. Similarly, the fifth batch processing unit BPU5 includes a batch chemical processing tank CHB5 and a lifter LF5 that raises and lowers the substrate array between the substrate transfer position and the chemical processing position. The sixth batch processing unit BPU6 includes a batch chemical processing tank CHB6 and a lifter LF6 that raises and lowers the substrate array between the substrate transfer position and the chemical processing position. Therefore, the substrate array is acid-treated in one of the batch chemical processing tanks CHB2 to CHB6. Performing chemical processing in parallel using five processing units in this manner increases the throughput of the apparatus.

[0059] Specifically, the first batch processing unit BPU1 includes a batch rinse processing bath ONB containing a rinse liquid and a lifter LF1 for raising and lowering the substrate array between a substrate transfer position and a rinse position. The substrate transfer position is a position above the batch rinse processing bath ONB accessible to the second substrate transport mechanism WTR, and the rinse position is a position within the batch rinse processing bath ONB where the substrate array can be immersed in the rinse liquid. The batch rinse processing bath ONB has a configuration similar to the batch chemical processing bath CHB2 described above. That is, the batch rinse processing bath ONB contains a rinse liquid and is equipped with a lifter LF1. Unlike the other processing baths, the batch rinse processing bath ONB contains pure water and is provided for the purpose of cleaning the chemical liquid adhering to multiple substrates W. In the batch rinse processing bath ONB, the cleaning process is completed when the resistivity of the pure water in the bath increases to a predetermined value.

[0060] As described above, the batch rinse processing tank ONB in ​​this embodiment is located closer to the relay device 6 than the batch chemical processing tanks CHB2 to CHB6. This configuration allows the mechanisms constituting the relay device 6 to be separated as far as possible from the batch chemical processing tanks CHB2 to CHB6, preventing the relay device 6 from being adversely affected by acids such as phosphoric acid. Furthermore, by locating the relay device 6 and the batch rinse processing tank ONB close to each other, the row of substrates for which rinsing processing has been completed can be transported a short distance and immediately loaded into the relay device 6. Therefore, according to the configuration of this embodiment, the transport of the substrates W can be completed quickly while maintaining the wet state of the substrates W.

[0061] <6. Batch processing block: bulk transport area> The batch transfer area R2 in the batch processing block 7 is a rectangular area extending in the front-to-back direction (X direction). The batch transfer area R2 is provided along the outer edge of the batch processing area R1, with one end extending to the transfer block 5 and the other end extending in a direction away from the transfer block 5. Therefore, the batch transfer area R2 is configured to also follow the relay device 6 located between the transfer block 5 and the batch processing block 7.

[0062] A second substrate transport mechanism WTR is provided in the batch transfer region R2 to transport multiple substrates W in a batch. The second substrate transport mechanism WTR transports the substrate rows in a batch between a substrate transfer position PP defined in the transfer block 5, the substrate row support section 33, each of the batch processing units BPU1 to BPU6, and a load position IP in the relay device 6 (described below). The second substrate transport mechanism WTR is configured to be able to reciprocate in the front-to-back direction (X direction) across the transfer block 5, the relay device 6, and the batch processing block 7. The second substrate transport mechanism WTR is also able to move to the substrate transfer position PP in the transfer block 5, the substrate row support section 33, and the load position IP in the relay device 6, in addition to the batch transfer region R2 in the batch processing block 7.

[0063] The second substrate transport mechanism WTR is equipped with a pair of chucks 29 that transports the substrate row. The pair of chucks 29 can be switched between a closed state in which they are close to each other and an open state in which they are separated from each other. The chucks 29 are members extending in the Y direction and have grooves for gripping substrates W arranged at a full pitch (the same pitch as the substrate row). The pair of chucks 29 are in a closed state to receive the multiple substrates W that make up the substrate row. The pair of chucks 29 are in an open state to transfer the multiple substrates W that make up the substrate row to another member (such as the lifter LF1). The second substrate transport mechanism WTR transfers the substrate row between the substrate transfer position PP and the substrate row support section 33 in the transfer block 5 and the immersion tank 73 provided at the load position IP in the relay device 6. In addition, the second substrate transport mechanism WTR transfers the substrate row between the lifters LF1 to LF6 that belong to the batch processing units BPU1 to BPU6 in the batch processing block 7.

[0064] The batch transfer region R2 is provided with guide rails 31X extending in the X direction to guide the second substrate transport mechanism WTR. The second substrate transport mechanism WTR is capable of moving forward and backward in the X direction along the guide rails 31X. Therefore, the guide rails 31X extend from the batch processing block 7 to the transfer block 5 via the relay device 6. More specifically, the guide rails 31X face the substrate transfer position PP in the transfer block 5 from the Y direction, and face the sixth batch processing unit BPU6 in the batch processing block 7 from the Y direction. In addition to these, the guide rails 31X face the substrate row support section 33 in the transfer block 5, the immersion tank 73 in the relay device 6, and the first batch processing units BPU1 to BPU6 in the batch processing block 7 from the Y direction.

[0065] <7.Relay Device> The relay device 6 has a structure that bridges the batch processing device 1 and the single wafer processing device 2, with its left end fitting into the interior of the batch processing device 1 and its right end fitting into the interior of the single wafer processing device 2. The relay device 6 is provided with a transport path for the substrate W that extends in the Y direction connecting the batch transport area R2 of the batch processing device 1 to the single wafer processing area R3 of the single wafer processing device 2. The transport path is configured to transport the substrate W in the Y direction (horizontally) without changing the position of the substrate W in the Z direction. Therefore, the insertion position of the relay device 6 in the batch processing device 1 and the insertion position of the relay device 6 in the single wafer processing device 2 are the same in the Z direction.

[0066] The relay device 6 is configured to transport batch-processed substrates W from the batch processing device 1 to the single-wafer processing device 2. The relay device 6 is located on the middle floor of the batch processing device 1 and the single-wafer processing device 2 (see FIG. 26). Therefore, the relay device 6 bridges the batch processing device 1 and the single-wafer processing device 2 at an aerial position away from the floor surface on which the batch processing device 1 and the single-wafer processing device 2 are installed. The specific location of the relay device 6 is related to the structure of the single-wafer processing device 2, and will be described in detail together with the explanation of the single-wafer processing device 2.

[0067] The relay device 6 includes an inverting chuck 71 that receives multiple substrates W arranged in the Y direction and converts the orientation of the multiple substrates W from a vertical orientation to a horizontal orientation by rotating the received substrates W 90° in water all at once, an intermediary transport mechanism OTR that transports the horizontally oriented substrates W one by one to an unloading position OP, and a path that can hold the horizontally oriented substrates W. The inverting chuck 71, intermediary transport mechanism OTR, and path are arranged in this order, starting from the left side of the batch processing device 1 and moving to the right. The immersion tank 73 has a loading position IP, into which the array of substrates is loaded from the batch processing device 1. Therefore, in the relay device 6, the loading position IP and the unloading position OP, where the path is provided, are arranged in the left-right direction perpendicular to the front-to-rear direction. Each part will be described in detail below.

[0068] <8. Relay device: Underwater conversion unit> The inverting chuck 71 converts the array of substrates received from the batch processing device 1 from a vertical position to a horizontal position. The loading position IP is equipped with an immersion tank 73 that holds pure water, an inverting chuck 71 located above the immersion tank 73, and a pair of chuck support mechanisms 72 that hold each of the inverting chucks 71 and raise and lower and rotate the inverting chucks 71. The inverting chuck 71 can be raised and lowered from a substrate transfer position with the substrate transport mechanism WTR set above the liquid surface of the immersion tank 73 to the liquid in the immersion tank 73. The inverting chuck 71 immerses the array of substrates received from the substrate transport mechanism WTR in the immersion tank 73 and can be rotated 90° in one direction or the other while in that state. The vertical position of multiple substrates W is converted to a horizontal position by rotating the pair of inverting chucks 71.

[0069] The inverting chuck 71 can be changed between a closed state in which it can hold multiple substrates W and an open state in which it releases the held substrates W by the operation of the pair of chuck support mechanisms 72. The inverting chuck 71 can also be rotated 90° in one direction or the other while maintaining its relative positional relationship by the operation of the pair of chuck support mechanisms 72. The inverting chuck 71 can be raised and lowered from above the immersion tank 73 to the liquid in the immersion tank 73 while maintaining its relative positional relationship by the operation of the pair of chuck support mechanisms 72.

[0070] The inverting chuck 71 has a comb-like shape with multiple V-grooves spaced at full pitch intervals, and the pair of inverting chucks 71 holds multiple substrates W from both sides by fitting the multiple substrates W into the V-grooves. When the inverting chucks 71 are in a closed state, each edge of the substrate abuts the deepest part of the V-groove, and even if the inverting chuck 71 is rotated in this state, the substrates W will not slip off the inverting chuck 71. When the inverting chuck 71 is in an open state, the substrates W can be received from the substrate transport mechanism WTR, which is waiting above the immersion tank 73 and holding multiple substrates W. The inverting chuck 71 can also be in a state between the closed state and the open state (half-open state), which will be described later.

[0071] <9. Relay device: Relay transport mechanism> The relay transport mechanism OTR is a mechanism provided between the loading position IP and the unloading position OP, and is capable of transporting the substrates W in a horizontal position, whose position has been changed by the inverting chuck 71, one by one to the single-wafer processing apparatus 2. As shown in FIG. 1, the relay transport mechanism OTR is movable in the Y direction while being guided by a relay rail 32Y extending in the Y direction from the immersion tank 73 (loading position IP) to an unloading position OP (described later). The relay transport mechanism OTR has a hand 103b that can support the substrates W in a horizontal position. The substrates W supported by the hand 103b are in a puddle state (liquid-puddle state) with pure water. The relay transport mechanism OTR can receive the substrates W in a horizontal position one by one from the inverting chuck 71 by facing the hand 103b toward the immersion tank 73. The relay transport mechanism OTR can also transport the substrates to the unloading position OP.

[0072] Specifically, the hand 103b has the same configuration as the wet substrate hand 82, which will be described later. The specific configuration of the wet substrate hand 82 will be described mainly with reference to FIG.

[0073] <10. Operation of the relay device> Next, we will explain how the relay device 6 transports the array of substrates acquired at the loading position IP to the unloading position OP. Figure 5 shows the state when the substrate transport mechanism WTR transports multiple substrates W above the immersion tank 73. At this time, the pair of inverting chucks 71 are positioned above the substrate transport mechanism WTR, and the rotation angle is at the initial state of 0°. In the initial state, the inverting chucks 71 extend horizontally and are capable of receiving multiple substrates W in a vertical position.

[0074] FIG. 6 shows the state in which the inverting chucks 71 are then lowered to the substrate transport mechanism WTR. The operation of this inverting chuck 71 is realized by the chuck support mechanism 72. FIG. 6 shows the state in which the row of substrates is transferred from the chucks 29 of the substrate transport mechanism WTR to the inverting chucks 71. That is, the pair of inverting chucks 71 maintains an open state as it descends to the substrate transport mechanism WTR and then closes. The pair of inverting chucks 71 in the open state are spaced apart enough to allow the substrates W to pass through, so they can approach the chucks 29 without coming into contact with the substrates W. The inverting chucks 71 are then closed by the operation of the chuck support mechanism 72 and grip the row of substrates. At this time, the row of substrates is gripped by both the chucks 29 and the inverting chucks 71. The chucks 29 then open and move out in the Y direction (to the left). In this manner, the transfer of the substrates W from the chucks 29 to the inverting chucks 71 is performed. FIG. 7 shows the state in which the row of substrates has been transferred to the inverting chucks 71. As shown by the arrow in FIG. 7, the inversion chuck 71 is lowered below the liquid surface of the immersion tank 73 , and the array of substrates is immersed in the pure water held in the immersion tank 73 .

[0075] FIG. 8 shows the state in which the inversion chuck 71 is then rotated 90° with the row of substrates immersed in the pure water. This movement of the inversion chuck 71 is achieved by the chuck support mechanism 72. FIG. 9 shows the state in which the inversion chuck 71 has completed its 90° rotation. In this way, the device surfaces of the row of substrates immersed in the immersion tank 73 and facing in the Y direction (leftward) are rotated 90° and now face upward. By tilting the substrates W in this manner, the orientation of the substrates W can be made horizontal with the device surfaces facing upward. The substrates W in the horizontal orientation will then be transported with the device surfaces facing upward.

[0076] FIG. 10 shows the state when the inverting chuck 71 subsequently moves one of the row of substrates above the liquid surface in the immersion tank 73. This operation of the inverting chuck 71 is achieved by the chuck support mechanism 72. As shown in FIG. 10, only one substrate W is above the liquid surface, and the remaining 24 substrates W are below the liquid surface in the immersion tank 73. This configuration prevents the 24 substrates W from drying out while waiting to be transported. The single substrate W above the liquid surface is transported to the unloading position OP by the relay transport mechanism OTR while maintaining its horizontal position. Thereafter, the chuck support mechanism 72 raises the pair of inverting chucks 71 by a height equivalent to a full pitch each time the relay transport mechanism OTR transports a substrate W. By repeating this operation, all of the row of substrates are transported to the unloading position OP by the relay transport mechanism OTR.

[0077] The opening and closing operations of the inverting chucks 71 in each state shown in FIGS. 5 to 10 will be described. As described above, the pair of inverting chucks 71 in the state shown in FIG. 5 are in an open state and are not able to grip the substrate W. In the open state, the inverting chucks 71 can pass through the substrate W, and therefore can move to the position shown in FIG. 6 without colliding with the substrate W. In FIG. 6, the pair of inverting chucks 71 are switched from the open state to the closed state. At this time, each of the V-grooves of the pair of inverting chucks 71 is inserted into and abuts against the end of the substrate row. The manner in which the substrate W fits into each V-groove is shown in detail in FIG. 15. The pair of inverting chucks 71 in FIGS. 7 to 9 are in a closed state and are able to grip the substrate W. In this state, even if the inverting chucks 71 are rotated, the gripped substrate W will not fall.

[0078] To achieve the state shown in Fig. 10, some measure is required to prevent the substrate W waiting in the immersion tank 73 from dropping while allowing the substrate W to be transported by the relay transport mechanism OTR. Therefore, according to this embodiment, in the state shown in Fig. 10, the pair of inversion chucks 71 are set to a half-open state. This achieves a state in which the substrate W is supported so that it can be removed. The half-open state will be described in detail in Figs. 17 and 18.

[0079] The following describes how the relay transport mechanism OTR transports a horizontally oriented substrate W from the inverting chuck 71 in the state shown in FIG. 10. FIG. 11 shows the state when the relay transport mechanism OTR has moved close to the immersion tank 73 to transport the substrate W. As shown in FIG. 11, the hand 103b of the relay transport mechanism OTR includes a slide mechanism 102 that moves the hand 103b forward and backward, and a support mechanism 101 that supports the slide mechanism 102. The slide mechanism 102 supports the base of the hand 103b and can move the hand 103b forward as shown in FIG. 12 or backward as shown in FIG. 14. The support mechanism 101 can move the slide mechanism 102 and the hand 103b back and forth in the Y direction. The support mechanism 101 can also rotate the hand 103b 180° to either face the immersion tank 73 or the unloading position OP.

[0080] 12 shows a state in which the hand 103b is inserted between the substrate W above the liquid surface and the substrate W below the liquid surface by the slide mechanism 102. When the hand 103b is in the state shown in FIG. 12, it is ready to acquire the substrate W in a horizontal position. At this time, the slide mechanism 102 moves from the initial position to the advanced position.

[0081] 13 shows a state in which the pair of inverting chucks 71 are lowered while maintaining their relative positions, and the substrate W on the liquid surface is brought into contact with the upper surface of the hand 103b. In this way, by lowering the inverting chucks 71 to allow the hand 103b to acquire the substrate W, the relay transport mechanism OTR can be configured without the need for a configuration for moving the hand 103b up and down, and therefore a substrate processing system with a simple device configuration and few malfunctions can be provided.

[0082] 14 shows the state when the hand 103b, having acquired the substrate W, is retracted by the slide mechanism 102 to the support mechanism 101 of the relay transport mechanism OTR. The pair of inversion chucks 71 are in a half-open state, and therefore support the substrate W held in the liquid while allowing the hand 103b to pull out the substrate W. At this time, the slide mechanism 102 moves from the advanced position to the initial position.

[0083] The half-open state of the pair of inverting chucks 71 will now be described. Fig. 15 is a cross-sectional view illustrating the state immediately after the row of substrates has been rotated 90° as shown in Fig. 9. At this time, the pair of inverting chucks 71 is in a closed state, and both ends of the substrate W have reached the deepest part of the V-groove. If the pair of inverting chucks 71 presses both ends of the substrate W to fix the substrate W in this way, the row of substrates will not slip off the pair of inverting chucks 71.

[0084] Fig. 16 is a cross-sectional view corresponding to the above-mentioned Fig. 12. With the pair of inversion chucks 71 in a closed state, the hand 103b is inserted between the substrates W. Note that the liquid level in the immersion tank 73 is omitted in Fig. 16 and the following Figs. 17 and 18.

[0085] FIG. 17 shows a state in which the pair of inverting chucks 71, which were in a closed state, have slightly separated and are now in a half-open state. When the pair of inverting chucks 71 are in the half-open state, both ends of the substrate W move from the deepest part of the V-groove and abut against the walls that define the V-groove. In this state, the substrate W will not slip off the inverting chucks 71 unless the inverting chucks 71 are rotated, and the substrate W itself is not fixed to the inverting chucks 71. Therefore, when the pair of inverting chucks 71 are in the half-open state, it is possible to hold a substrate W waiting in the liquid and transfer one substrate W to the hand 103b on the liquid surface. However, in the state shown in FIG. 17, the hand 103b has not yet abutted against the substrate W, and therefore, in order to transfer the substrate W to the hand 103b, the substrate W must be lowered relative to the hand 103b.

[0086] Fig. 18 is a cross-sectional view corresponding to Fig. 13 described above. In Fig. 18, the pair of inverting chucks 71 are slightly lowered from the state shown in Fig. 17, causing the substrate W to come into contact with the hand 103b. In the state shown in Fig. 18, the substrate W is placed on the hand 103b and is located away from the wall surface of the V-groove of the inverting chuck 71. In other words, in the state shown in Fig. 18, the substrate W is not in contact with the inverting chuck 71. Therefore, if the slide mechanism 102 is operated to move the hand 103b in this state, the substrate W is pulled out without coming into contact with the inverting chuck 71.

[0087] 1 is configured to supply pure water to the substrate W pulled out by the hand 103b, thereby putting the substrate W into a puddle state. The relay device 6 in this example is configured to transport the substrate W in a puddle state to the unloading position OP by the hand 103b.

[0088] FIG. 19 shows the state of the substrate W in a horizontal position obtained by the pair of inversion chucks 71. The substrate processing system of this embodiment has a configuration for retaining water on the substrate W midway through the substrate transport path in the relay device 6. The shower head 69 supplies a mist of pure water to the substrate W. The shower head 69 is also depicted in FIG. 1, so it can be understood by referring to this. The tray 105 is a square-plate-shaped member inserted into the gap between the hand 103b and the support mechanism 101, and retains the pure water supplied from the shower head 69 and dripping from the substrate W. Since the tray 105 interferes with the operation of the slide mechanism 102, when the slide mechanism 102 operates as shown in FIGS. 12 and 13, the tray 105 retreats in the X direction relative to the slide mechanism 102. The tray moving mechanism 108 is configured to realize the operation of the tray 105.

[0089] 20 shows the state when the relay transport mechanism OTR transports the substrate W in the Y direction and moves close to the unloading position OP. At this time, the hand 103b supports the substrate W and faces the immersion tank 73 and the inversion chuck 71.

[0090] 21 shows the state after that when the support mechanism 101 of the relay transport mechanism OTR rotates 180° around the rotation axis 104 extending in the Z direction. By such operation of the support mechanism 101, the hand 103b, which had been facing the immersion tank 73 side, now faces the unloading position OP side.

[0091] 22 shows the state after that when the slide mechanism 102 performs a sliding operation and the hand 103b supporting the substrate W moves to the unloading position OP. At this time, the substrate W is positioned at the unloading position OP defined in the substrate processing system. Also, at this time, the slide mechanism 102 moves from the initial position to the advanced position.

[0092] The unloading position OP can be accessed by both the relay transport mechanism OTR and the center robot CR described below. The relay transport mechanism OTR delivers the substrate W to the center robot CR of the single wafer processing apparatus 2 through the unloading position OP. The unloading position OP is provided with a path having multiple (e.g., three) support pins 111 extending in the Z direction. The support pins 111 are capable of freely extending and retracting in the Z direction. Each of the support pins 111 extends and retracts synchronously so that their tips are at the same height. The bottom plate 110 is configured to support the base ends of the support pins 111. In Figure 22, the tips of the support pins 111 are located below the unloading position OP.

[0093] 23 shows a state where the support pins 111 are then extended and the substrate W supported by the hand 103b is moved to above the unloading position OP. In this way, the substrate W is transferred from the hand 103b to the support pins 111.

[0094] 24 shows the state after that when the slide mechanism 102 returns from the advanced position to the initial position and the hand 103b retreats from the unloading position OP. The substrate W is supported at the unloading position OP by the support pins 111. In this way, the substrate W is ready to be received by the center robot CR of the single-wafer processing apparatus 2.

[0095] <11. Single wafer processing equipment: Indexer block> Next, the configuration of the single-substrate processing apparatus 2 of this example will be described with reference to Fig. 25. The indexer block 4 is equipped with a second load port 10, which is an entrance through which a carrier C, which stores multiple substrates W in a horizontal position and vertically spaced at predetermined intervals, is introduced into the block. The second load port 10 is configured to protrude from the outer wall of the indexer block 4, which extends in the width direction (Y direction).

[0096] The internal configuration of the indexer block 4 will now be described. The indexer block 4 is equipped with an indexer robot IR that transports horizontally oriented substrates W one by one between the carrier C and a path 24 provided on the indexer block 4 side in the single-wafer processing block 8 described below. The path 24 is configured so that horizontally oriented substrates W can be placed on it. The indexer robot IR can access between the path 24 and a carrier C placed on the second load port 10.

[0097] The indexer robot IR stores the processed substrate W in an empty carrier C placed on the second load port 10. The indexer robot IR is equipped with a hand consisting of a pair of grippers at its tip for gripping the substrate W in a horizontal position, and an arm for supporting the hand. The arm has multiple joints, and its tip is connected to the hand and its base end is connected to an arm base provided in the indexer block 4. The indexer robot IR in this embodiment is configured to receive the processed substrate W from the path 24 and store it in a carrier C outside the indexer block 4.

[0098] The indexer robot IR is configured to return the dried substrate W to the carrier C in the second load port 10.

[0099] <12. Single-Wafer Processing Device: Single-Wafer Processing Block> The single wafer processing block 8 is adjacent to the indexer block 4. The single wafer processing block 8 has, in its central portion in the Y direction, a path 24 accessible by the indexer robot IR, and a center robot CR capable of placing a processed substrate W on the path 24. The center robot CR is configured to be able to access the unloading position OP of the relay device 6, the single wafer processing chamber 48, and the path 24. The center robot CR receives batch-processed substrates W in a horizontal position from the unloading position OP of the relay device 6, one by one, and transports them to the single wafer processing chamber 48. The center robot CR is a substrate transport robot that transports horizontally oriented substrates W one by one, and is capable of reciprocating movement in the Z direction. Therefore, as will be described later, the center robot CR can access both the single wafer processing chamber 48 and the unloading position OP that make up the stack.

[0100] The single wafer processing chamber 48 is a drying chamber that mainly dries the substrates. In this embodiment, the single wafer processing chamber 48 is a drying chamber that uses a supercritical fluid. The supercritical fluid used may be, for example, carbon dioxide. Furthermore, the present invention is not limited to the above-described configuration, and the single wafer processing chamber 48 may be configured to dry the substrates W by, for example, spin drying. The drying chamber dries the substrates W one by one.

[0101] In addition, the apparatus of this example is provided with a liquid supply chamber, which serves as a type of single wafer processing chamber 48, in which a liquid is poured onto the upper surface of the substrate W to make the substrate W into a puddle state. The liquid poured onto the substrate W at this time may be, for example, IPA (Isopropyl Alcohol). The liquid supply chamber receives the substrate W that has been puddled with pure water, and removes the substrate W that has been puddled with IPA. The removed substrate W in a puddle state is dried in a drying chamber.

[0102] 26 is a side view of the single wafer processing apparatus 2 as viewed from the batch processing apparatus 1. As shown in this figure, the single wafer processing chamber 47, the single wafer processing chamber 48, and the single wafer processing chamber 49 are stacked in the Z direction to form a stack. That is, the single wafer processing block 8 is provided with a lower region, a middle region, and an upper region. The single wafer processing chamber 47 is provided in the lower region. The single wafer processing chamber 48 is provided in the middle region. The single wafer processing chamber 49 is provided in the upper region.

[0103] The unloading position OP is located in the middle region of the single wafer processing block 8. Below the unloading position OP, a single wafer processing chamber 47 in the lower region is provided. Above the unloading position OP, a single wafer processing chamber 49 in the upper region is provided. Therefore, the unloading position OP is configured to replace the single wafer processing chamber 48 in the middle region in a stack configured by arranging the single wafer processing chambers 47, 48, and 49 in the Z direction.

[0104] 25 illustrates the middle region of the single wafer processing block 8. Three single wafer processing chambers 48 are provided in the middle region. Therefore, the single wafer processing block 8 is provided with a first stack to which the first single wafer processing chamber 48 belongs, a second stack to which the second single wafer processing chamber 48 belongs, and a third stack to which the third single wafer processing chamber 48 belongs. In addition, the single wafer processing chamber 49 and the single wafer processing chamber 47 are provided above and below the unloading position OP. Therefore, the single wafer processing block 8 is provided with a total of 11 single wafer processing chambers.

[0105] 26, the shielding plate 16 is part of the wall surface of the single wafer processing apparatus 2. The shielding plate 16 is provided in the middle region of the single wafer processing block 8, and closes the opening formed between the unloading position OP and the indexer block 4. If the shielding plate 16 is provided adjacent to the indexer block 4, the relay device 6 can be provided closer to the center robot CR. In this way, the center robot CR does not need to move significantly in the forward and backward directions when acquiring a substrate W at the unloading position OP.

[0106] The hand of the center robot CR can move in the Z direction while maintaining the orientation of the substrate W. With this configuration, the center robot CR can transport the substrate W at the unloading position OP to the single wafer processing chamber 49 in the upper region and the single wafer processing chamber 47 in the lower region. By providing the unloading position OP in the middle region of the single wafer processing block 8, the unloading position OP can be located near the upper region. Similarly, the unloading position OP is located near the lower region. Therefore, the movement distance of the substrate W in the Z direction at the unloading position OP is shorter than both the upper and lower regions.

[0107] <13. Single-Wafer Processing Device: Center Robot> Figure 27 explains the specific configuration of the center robot CR. The center robot CR in this example has two hands and a drive mechanism that drives the two hands independently. The two hands are arranged vertically, with the upper hand for transporting dry substrates and the lower hand for transporting wet substrates in a puddle state. Since Figure 27 is a plan view of the center robot CR, only the upper hand can be seen. The arrangement of the two hands on the center robot CR can be understood by referring to the perspective view in Figure 28.

[0108] The hand that transports the dry substrate is called the dry substrate hand 81. The dry substrate hand 81 can hold a dry substrate in a horizontal position. The dry substrate hand 81 has a flat shape that extends horizontally and has a first branch blade 81b composed of a base and two flat bars 831, 832 extending from the base (see Figures 27 and 30). The first branch blade 81b corresponds to the first blade of the present invention. A pair of tip guides 811 is provided at the tip of the first branch blade 81b, and a pair of base end guides 812 is provided at the base end of the first branch blade 81b. The tip guide 811 and the base end guide 812 are provided on the upper surface of the first branch blade 81b. Each of the flat bars 831, 832 of the first branch blade 81b is provided with one tip guide 811 and one base end guide 812.

[0109] The pair of tip guides 811 are provided at the tip end of the first branch blade 81b and are configured to be able to come into contact with the end of a substrate. The pair of base end guides 812 are provided at the base end of the first branch blade 81b and are configured to be able to come into contact with the end of a substrate.

[0110] A hand pusher 83 capable of contacting the side surface of the substrate W is provided at the base of the first branch blade 81b (see Figures 27 and 30). The hand pusher 83 corresponds to the pusher of the present invention. The hand pusher 83 has a drive unit at its base and moves back and forth in the direction in which the first branch blade 81b extends (extension direction B). When the hand pusher 83 is extended with the substrate W placed on the dry substrate hand 81, the substrate W is held by the dry substrate hand 81. When the hand pusher 83 is retracted from this state, the dry substrate hand 81 releases its grip. The hand pusher 83 is located at the base end of the first branch blade 81b and is positioned between a pair of base end guides 812. By pressing the end of the substrate W, the hand pusher 83 can grip the substrate W in cooperation with the tip guide 811.

[0111] The hand that supports the substrate W in a puddle state is called the wet substrate hand 82. The wet substrate hand 82 is capable of supporting a substrate with a puddle of liquid and is provided below the dry substrate hand 81. Like the dry substrate hand 81, the wet substrate hand 82 has a flat shape that extends horizontally and has a second branch blade 82b composed of a base and two flat bars 841, 842 extending from the base (see FIG. 31). A pair of tip projections 821 is provided at the tip of the second branch blade 82b, and a pair of base projections 822 is provided at the base end of the first branch blade 81b. The tip projections 821 and base projections 822 are provided on the upper surface of the second branch blade 82b. Each of the flat bars 841, 842 of the second branch blade 82b is provided with one tip projection 821 and one base projection 822.

[0112] The wet substrate hand 82 can support the substrate W in a puddle state using four protrusions on the upper surface of the second branch blade 82b. The tip protrusion 821 is provided at the tip of the second branch blade 82b and can abut against a predetermined portion of the underside of the liquid-filled substrate W, where the substrate end is removed. The base end protrusion 822 is provided at the base end of the second branch blade 82b and can abut against the above-mentioned predetermined portion of the underside of the liquid-filled substrate W. The predetermined portion will be described later.

[0113] A drive mechanism for driving the dry substrate hand 81 in the horizontal direction will be described. As shown in Fig. 27, the dry substrate hand 81 is connected to a first distal arm 91 extending in extension direction B. The first distal arm 91 is connected to a first base arm 94 via a first relay arm 92. The first relay arm 92 extends in a direction intersecting the extension direction B and parallel to the horizontal plane. The first base arm 94 also extends in a direction intersecting the extension direction B and parallel to the horizontal plane.

[0114] The first distal arm 91 is rotatable relative to the first intermediate arm 92. That is, the first distal arm 91 and the first intermediate arm 92 form a joint with the vertical axis as the rotation axis. Similarly, the first intermediate arm 92 is rotatable relative to the first base end arm 94. That is, the first intermediate arm 92 and the first base end arm 94 form a joint with the vertical axis as the rotation axis.

[0115] The first base end arm 94 is connected to the robot base 301. The first base end arm 94 is rotatable relative to the robot base 301. In other words, the first base end arm 94 and the robot base 301 form a joint with a vertical axis as the rotation axis.

[0116] The first distal arm 91, the first relay arm 92, and the first base end arm 94 rotate synchronously via joints provided on each of them, thereby moving the dry substrate hand 81 forward and backward in the extension direction B relative to the robot base 301. In other words, the first distal arm 91, the first relay arm 92, and the first base end arm 94 constitute a first movement mechanism of the present invention that movably supports the dry substrate hand 81.

[0117] The drive mechanism for driving the wet substrate hand 82 in the horizontal direction will now be described. The wet substrate hand 82 is connected to a second distal arm 96 extending in extension direction B as shown in Figure 28. The second distal arm 96 is connected to a second base arm 98 (see Figures 27 and 28) via a second intermediate arm 97 (see Figure 27). The second intermediate arm 97 extends in a direction parallel to the horizontal plane. The second base arm 98 also extends in a direction parallel to the horizontal plane.

[0118] The second distal arm 96 is rotatable relative to the second relay arm 97. That is, the second distal arm 96 and the second relay arm 97 form a joint with the vertical axis as the rotation axis. Similarly, the second relay arm 97 is rotatable relative to the second base end arm 98. That is, the second relay arm 97 and the second base end arm 98 form a joint with the vertical axis as the rotation axis.

[0119] The second base end arm 98 is connected to the robot base 301, similar to the first base end arm 94. The second base end arm 98 is rotatable relative to the robot base 301. In other words, the second base end arm 98 and the robot base 301 form a joint with the vertical axis as the rotation axis.

[0120] The second distal arm 96, the second relay arm 97, and the second base end arm 98 rotate synchronously via joints provided on each of them, thereby moving the wet substrate hand 82 back and forth in the extension direction B relative to the robot base 301. In other words, the second distal arm 96, the second relay arm 97, and the second base end arm 98 constitute a second movement mechanism of the present invention that movably supports the wet substrate hand 82.

[0121] The robot base 301 corresponds to the base member of the present invention. The robot base 301 supports a first movement mechanism of the present invention that is composed of a first distal arm 91, a first relay arm 92, and a first base arm 94, and supports a second movement mechanism of the present invention that is composed of a second distal arm 96, a second relay arm 97, and a second base arm 98.

[0122] 28 supports the robot base 301 so that it can move up and down and rotate about a vertical axis. The lifting and rotating mechanism 302 is configured to move the dry substrate hand 81 up and down and pivot. The lifting and rotating mechanism 302 can also move the wet substrate hand 82 up and down and pivot. Therefore, the dry substrate hand 81 and the wet substrate hand 82 in this example move up and down and pivot while maintaining their relative positions.

[0123] 25 shows a slide mechanism 303 that supports the lifting and rotating mechanism 302. The slide mechanism 303 has rails that extend in the front-to-rear direction X, and is configured to move the lifting and rotating mechanism 302 back and forth in the front-to-rear direction X. The center robot CR has this slide mechanism 303, which allows the dry substrate hand 81 and the wet substrate hand 82 to move back and forth in the front-to-rear direction X.

[0124] 28 also illustrates the two trays possessed by the center robot CR. Specifically, the center robot CR is equipped with a fixed tray 316 and a movable tray 311 in anticipation of liquid splashing from the puddled substrate W. The fixed tray 316 is fixed to the robot base 301. Therefore, the fixed tray 316 is displaced in accordance with the vertical and backward movement of the robot base 301. The fixed tray 316 has a flat shape that extends horizontally and has wall portions 317 that border its edge. The wall portions 317 prevent pools of liquid that form when the fixed tray 316 receives liquid from dropping below the fixed tray 316. The fixed tray 316 is provided below the wet substrate hand 82 and is configured to collect liquid that drops from the wet substrate hand 82.

[0125] The fixed tray 316 is supported by the robot base 301 below the wet substrate hand 82 and is configured to collect the liquid that has dropped from the wet substrate hand 82.

[0126] The movable tray 311 has a top plate 312, a base 314, and a connecting portion 313 that connects the top plate 312 and the base 314. The top plate 312 has a flat shape that extends horizontally and has wall portions 318 at both ends. The wall portions 318 prevent pools of liquid that form when the top plate 312 of the movable tray 311 receives liquid from falling below the top plate 312. The top plate 312 does not have wall portions at both ends in the extension direction B of the hand. This configuration prevents interference between the wet substrate hand 82 and the top plate 312. The wall portions 318 are provided at both ends of the top plate 312 in the width direction perpendicular to the extension direction B of the hand and the vertical direction.

[0127] The movable vat 311 is provided between the wet substrate hand 82 and the fixed vat 316, and is configured to receive the liquid dropped from the wet substrate hand 82 and guide it to the fixed vat 316. The movable vat 311 corresponds to the second vat of the present invention.

[0128] The base 314 of the moving butt 311 is supported by the fixed butt 316. The base 314 forms the bottom surface of the moving butt 311 and can move back and forth relative to the fixed butt 316 in the extension direction B of the hand. Therefore, the moving butt 311 is configured to move back and forth relative to the fixed butt 316 in the extension direction B of the butt.

[0129] The advancing / retreating mechanism 315 is a drive mechanism provided on the upper surface of the fixed butt 316, and has rails extending in the hand extension direction B. The base 314 is connected to the advancing / retreating mechanism 315, which allows the movable butt 311 to move forward and backward in the hand extension direction B as shown by the arrow in Figure 28.

[0130] The advancing / retreating mechanism 315 is configured to move the movable vat 311 forward and backward in the horizontal direction relative to the fixed vat 316 and the robot base 301. The advancing / retreating mechanism 315 corresponds to a second vat advancing / retreating mechanism.

[0131] The top plate 312 of the movable tray 311 is provided below the wet substrate hand 82 and is configured to receive the liquid that drops from the wet substrate hand 82. The liquid pool that forms on the top plate 312 is guided by the wall 318 and drips down into the fixed tray 316.

[0132] 29A shows cross sections of the dry substrate hand 81 and the wet substrate hand 82. The dry substrate hand 81 has a tip guide 811 at its tip and a base guide 812 at its base. When the dry substrate hand 81 is in the open state, the hand pusher 83 is in a contracted state, and the dry substrate hand 81 is ready to receive a substrate W. The hand pusher drive mechanism 83a is configured to move the hand pusher 83 back and forth in the extension direction B of the hand.

[0133] On the other hand, the hand 82 for a wet substrate has a tip protrusion 821 at its tip end and a base protrusion 822 at its base end. The hand 82 for a wet substrate in Figure 29A is not supporting the substrate W and is therefore ready to receive the substrate W.

[0134] 29B is a view similar to FIG. 29A, but shows the state in which the dry substrate hand 81 has received the dry substrate. The dry substrate hand 81 presses the hand pusher 83 against the edge of the substrate W, and presses the substrate W against the front end guide 811. In this way, the substrate W is sandwiched and gripped between the hand pusher 83 and the front end guide 811 in the closed state.

[0135] On the other hand, the hand 82 for wet substrates can support the substrate W on which a liquid has been piled. The hand 82 for wet substrates supports the substrate W from below via a distal projection 821 and a proximal projection 822. In this case, the hand 82 for wet substrates does not have a member that abuts against the edge of the substrate W, and therefore the liquid L piled on the substrate W cannot drip down the hand 82 for wet substrates.

[0136] 30 is a plan view of the dry substrate hand 81 in the gripping state (closed state). The dry substrate hand 81 presses one end edge of the substrate W with the hand pusher 83, and presses the other end edge of the substrate W against the tip guide 811. The base end guide 812 is configured to support the end edge of the substrate W together with the tip guide 811 when the hand pusher 83 is in the contracted state and the dry substrate hand 81 is in the open state.

[0137] 31 is a plan view of the hand 82 for wet substrate supporting the puddled substrate W. At this time, the tip projection 821 and base projection 822 of the hand 82 for wet substrate abut against the substrate W at a predetermined portion LP that avoids the edge of the substrate W.

[0138] Next, the operation of the movable vat 311 will be described. Figure 32 shows a state in which a liquid-filled substrate W supported by the wet substrate hand 82 is positioned above the top plate 312 of the movable vat 311. Even if the liquid L on the substrate W falls from the substrate W at this point, the liquid L is reliably received by the movable vat 311. In Figure 32, the wet substrate hand 82 faces an entrance 481 for the substrate W in the single wafer processing chamber 48. In Figure 32, the wet substrate hand 82 is about to load the substrate W into the single wafer processing chamber 48 through the entrance 481. The single wafer processing chamber 48 at this time may be either a drying processing chamber or a liquid supply chamber, and the liquid filled on the substrate W may be either pure water or IPA.

[0139] 33 shows the movable vat 311 moving in the extension direction B of the wet substrate hand 82 before the wet substrate hand 82 is inserted into the carry-in opening 481. This movement causes the top plate portion 312 of the movable vat 311 to protrude from the fixed vat 316. As a result, the tip of the top plate portion 312 enters the carry-in opening 481 of the single-wafer processing chamber 48. This movement of the movable vat 311 is achieved by the advancing / retracting mechanism 315 provided in the fixed vat 316. Even if the liquid L held on the substrate W at this point falls from the substrate W, the liquid L is reliably received by the movable vat 311 or the fixed vat 316.

[0140] 34 shows the state when the wet substrate hand 82 introduces the substrate W with a puddle of liquid into the single wafer processing chamber 48 through the carry-in opening 481. The wet substrate hand 82 moves the substrate W with a puddle of liquid further into the single wafer processing chamber 48, beyond the movable tray 311 protruding toward the carry-in opening 481. The substrate W is then handed over to a support member for the substrate W, such as a pin or a chuck, of the single wafer processing chamber 48. Even if the liquid L on the substrate W falls from the substrate W at this point, the liquid L is reliably received by the movable tray 311 or inside the single wafer processing chamber 48.

[0141] In this way, when the substrate W on which the liquid is piled is introduced into the single wafer processing chamber 48, the tip of the movable vat 311 is positioned inside the loading port 481, so that the liquid L piled on the substrate W cannot splash out from the gap between the fixed vat 316 and the loading port 481 under any circumstances. This is because the movable vat 311 is positioned so as to bridge the gap between the interior of the single wafer processing chamber 48 and the fixed vat 316, and the liquid L is received by the movable vat 311.

[0142] After the single wafer processing chamber 48 receives the substrate W with the liquid puddle, the movable vat 311 and the wet substrate hand 82 exit the single wafer processing chamber 48. At this time, if the wet substrate hand 82 exits before the movable vat 311, the liquid L adhering to the wet substrate hand 82 will not splash out from the gap between the fixed vat 316 and the entrance 481. This is because the movable vat 311 is positioned so as to bridge the gap between the interior of the single wafer processing chamber 48 and the fixed vat 316, and the liquid L is received by the movable vat 311.

[0143] 35 shows the state when a substrate W filled with liquid is unloaded from a liquid supply chamber, which is a type of single wafer processing chamber 48. The liquid poured onto the substrate at this time is IPA. In FIG. 35, the wet substrate hand 82 faces an entrance 481 for the substrate W that the single wafer processing chamber 48 has.

[0144] 36 shows the state in which the movable vat 311 moves in the extension direction B of the wet substrate hand 82 before the wet substrate hand 82 is inserted into the carry-in opening 481. This movement causes the top plate portion 312 of the movable vat 311 to protrude from the fixed vat 316. Then, the tip of the top plate portion 312 enters the carry-in opening 481 of the single wafer processing chamber 48.

[0145] 37 shows the state after that. The wet substrate hand 82 receives the substrate W with the liquid puddle located deeper in the single wafer processing chamber 48 beyond the moving tray 311 protruding toward the entrance 481.

[0146] After the wet substrate hand 82 receives the substrate W on which the liquid is piled, the movable vat 311 and the wet substrate hand 82 exit the single wafer processing chamber 48. At this time, if the wet substrate hand 82 exits before the movable vat 311, the liquid L piled on the substrate W will not splash out from the gap between the fixed vat 316 and the entrance 481. This is because the movable vat 311 is positioned so as to bridge the gap between the interior of the single wafer processing chamber 48 and the fixed vat 316, and the liquid L is received by the movable vat 311.

[0147] <14. Other configurations> The substrate processing system includes a control unit 131 for controlling the batch processing device 1, a control unit 132 for controlling the single wafer processing device 2, and a control unit 136 for controlling the relay device 6. For details of each control unit, see FIG. 1. Although not shown in FIG. 1, the substrate processing system includes a memory unit corresponding to each control unit. The control units 131, 132, and 136 are configured, for example, by a CPU (Central Processing Unit). The specific configuration of each control unit is not limited, and for example, each control unit may be configured by a single processor, or each control unit may be configured by an individual processor. Furthermore, control related to the batch processing device 1 may be configured by multiple processors, and this also applies to the single wafer processing device 2 and the relay device 6.

[0148] Control related to the control unit 131 includes, for example, control of the carrier transport mechanism 11, handling robot HTR, HVC attitude conversion unit 23, pusher mechanism 25, substrate transport mechanism WTR, and batch processing units BPU1 to BPU6. Control related to the control unit 132 includes, for example, control of the center robot CR, single wafer processing chamber 48, and indexer robot IR. Control related to the third control unit 136 includes, for example, control of the inverting chuck 71, relay transport mechanism OTR, and pure water supply device connected to the shower head 69.

[0149] That is, the control unit 132 controls the center robot CR to receive the puddled substrate W with the wet substrate hand 82 and transport it to the drying chamber. The control unit 132 controls the drying chamber to perform a drying process on the substrate W. The control unit 132 controls the center robot CR to receive the substrate that has been dried in the drying chamber with the dry substrate hand 81 and transport it to the indexer robot IR. The control unit 132 then controls the indexer robot IR to return the dried substrate W to the carrier C.

[0150] The storage unit stores programs and parameters related to control. The storage unit may be configured as a single device, or may be configured as individual devices corresponding to each control unit. Furthermore, the substrate processing system of this embodiment does not have any particular limitations on the configuration of the device that realizes the storage unit.

[0151] <15. Substrate processing flow> Next, a substrate processing flow using the substrate processing system of this example will be described below. Figure 38 is a flowchart showing the operation of the substrate processing system of this example.

[0152] Step S11: A carrier C storing unprocessed substrates W is placed on the load port 9. The carrier C is transported to the carrier mounting shelf 13a by the carrier transport mechanism 11. The handling robot HTR takes out the row of substrates from the carrier C and transports them to the HVC attitude conversion unit 23.

[0153] Step S12: The HVC attitude conversion unit 23 tilts the row of substrates W that is in a horizontal position by 90°. This converts the position of the substrates W that make up the row of substrates from a horizontal position to a vertical position. The pusher mechanism 25 receives the row of substrates whose position has been converted from the HVC attitude conversion unit 23 and passes it to the substrate transport mechanism WTR. The substrate transport mechanism WTR passes the received row of substrates to, for example, the lifter LF6 of the batch processing unit BPU6.

[0154] Step S13: The batch processing unit BPU6 lowers the lifter LF6 to start batch chemical processing. After batch processing, the array of substrates is transported by the substrate transport mechanism WTR to the lifter LF1 of the batch processing unit BPU1. The batch processing unit BPU1 lowers the lifter LF1 to start batch rinsing processing. After batch processing, the array of substrates is transported by the substrate transport mechanism WTR to the immersion tank 73. At this point, the array of substrates is made up of substrates W in a vertical position, and is held by the pair of inversion chucks 71.

[0155] Step S14: The pair of inversion chucks 71 tilts the substrate row by 90° in the immersion tank 73. This changes the orientation of the substrates W constituting the substrate row from vertical to horizontal. Figure 39 illustrates the transport path of the substrate row from step S11 to step S14. These steps are a process of transporting multiple substrates W together as a substrate row.

[0156] Step S15: The substrates W, now in a horizontal position, are transported one by one by the relay transport mechanism OTR from the immersion tank 73 to the unloading position OP. At this time, the substrates W have a puddle of pure water, and move in a puddle state from the immersion tank 73 to the unloading position OP. Figure 40 shows the transport path of the substrates W in this step. In this way, the substrates W are transported from the batch processing device 1 to the single wafer processing device 2, passing through the relay device 6.

[0157] Step S16: The substrate W in a puddle state due to the pure water is transported by the center robot CR from the unloading position OP to the single wafer processing chamber 48. Specifically, the center robot CR receives the substrate W with a puddle of pure water from the unloading position OP and transports it to a liquid supply chamber, which is one type of single wafer processing chamber 48. Then, the center robot CR receives the substrate W with a puddle of IPA from the liquid supply chamber and transports it to a drying processing chamber, which is one type of single wafer processing chamber 48. Figure 41 shows the transport path of the substrate W in this step.

[0158] The substrate is transported in this step using the wet substrate hand 82 of the center robot CR. As shown in Fig. 42, the wet substrate hand 82 can support and transport the substrate W on which a mound of pure water or IPA has been poured using a tip protrusion 821 and a base protrusion 822 provided at positions avoiding the edge of the substrate W.

[0159] Step S17: The substrate W transported to the single wafer processing chamber 48 is subjected to a substrate drying process.

[0160] Step S18: The substrate W that has been dried in the single wafer processing chamber 48 is transported to the path 24 by the center robot CR. The indexer robot IR receives the substrate W transported to the path 24 and stores the substrate W in the carrier C placed on the second load port 10. In this manner, the substrate processing according to this example is completed. Figure 43 shows the transport path of the substrate W in this step.

[0161] In this step, the center robot CR uses the dry substrate hand 81 to transport the substrate from the single wafer processing chamber 48 to the path 24. As shown in Fig. 44, the dry substrate hand 81 transports the substrate W while holding it with the tip guide 811 and the hand pusher 83. At this time, the substrate W is securely held by the dry substrate hand 81, allowing for high-speed substrate transport.

[0162] <16. Effects of the Present Invention> As described above, according to the configuration of the present invention, the dry substrate hand 81 comprises the first branch blade 81b, a pair of base end guides 812 provided at the base end of the first branch blade 81b and contacting the edge of the substrate, a pair of tip end guides 811 provided at the tip end of the first branch blade 81b and contacting the edge of the substrate, and the substrate gripping hand pusher 83 at the base end of the first branch blade 81b, located between the pair of base end guides 812, and capable of contacting the edge of the substrate W and pressing the substrate W towards the tip end guide 811, thereby gripping the substrate W in cooperation with the tip end guide 811. With this configuration, it is possible to provide a substrate transport device that can transport the substrate W at high speed while securely gripping it.

[0163] Furthermore, according to the above configuration, the wet substrate hand 82 comprises the second branch blade 82b, a pair of base end protrusions 822 provided at the base end of the second branch blade 82b and contacting the underside of the substrate W to support the substrate W, and a pair of tip end protrusions 821 provided at the tip end of the second branch blade 82b and contacting the underside of the substrate W to support the substrate W. With this configuration, by pressing a member against the edge of the substrate W, liquid piled on the substrate will not run down the member and drip.

[0164] According to the above configuration, the dry substrate hand 81 is provided separately from the wet substrate hand 82. By providing separate hands according to the wetness state of the substrate W in this manner, a dry substrate is not transported by a wet hand. According to the configuration of the present invention, the substrate W can be transported while reliably maintaining its dry state.

[0165] According to the above configuration, the wet substrate hand 82 is provided below the dry substrate hand 81. With this configuration, liquid dripping from the wet substrate hand 82 does not reach the dry substrate hand 81. This is because the dry substrate hand 81 is provided above the wet substrate hand 82.

[0166] The above-described configuration includes a fixed tray 316 that is supported by the robot base 301 below the wet substrate hand 82 and that collects liquid that drops from the wet substrate hand 82, and a movable tray 311 that is provided between the wet substrate hand 82 and the fixed tray 316 and that receives liquid that drops from the wet substrate hand 82 and guides it to the fixed tray 316. With this configuration, liquid that drips from the wet substrate hand 82 is collected in the fixed tray 316. If the movable tray 311 follows the forward and backward movement of the wet substrate hand 82, the liquid on the substrate W can be received by the movable tray 311 regardless of the position of the wet substrate hand 82. Therefore, the above-described configuration provides a substrate transport device that is capable of suppressing liquid splashing.

[0167] According to the above-described configuration, the control unit 132 controls the center robot CR to have the wet substrate hand 82 receive the puddled substrate W and transport it to the drying processing chamber, controls the drying processing chamber to perform drying processing on the substrate W, and controls the center robot CR to have the dry substrate hand 81 receive the substrate W that has been dried in the drying processing chamber and transport it to the indexer robot IR. In this way, by providing individual hands according to the wetness state of the substrate W, it is possible to prevent a dry substrate from being transported by a wet hand. According to the configuration of the present invention, substrates can be transported while reliably maintaining their dry state. [Example]

[0168] <17. Overall composition> Next, a substrate processing apparatus 2a according to Example 2 will be described. The substrate processing apparatus 2a according to Example 2 is a single-substrate processing apparatus that processes substrates W in a horizontal position. Figure 45 explains the substrate processing apparatus 2a according to this example. The substrate processing apparatus 2a has a similar configuration to the single-substrate processing apparatus 2 included in the substrate processing system according to Example 1.

[0169] That is, the substrate processing apparatus 2a of this example includes an indexer block 4 equipped with an indexer robot IR that retrieves unprocessed substrates W from carriers C and returns processed substrates W to carriers C, and a single wafer processing block 8 equipped with a single wafer processing chamber 48. The second load port 10 has a shelf-like configuration that protrudes from the indexer block 4, and is capable of placing a carrier C thereon.

[0170] The second load port 10, the indexer block 4, and the single wafer processing block 8 are similar in detail to the single wafer processing apparatus 2 of the first embodiment described above.

[0171] In the substrate processing apparatus 2a of this example, the indexer robot IR transports unprocessed substrates W stored in carriers C in the second load port 10 one by one to the path 24. The center robot CR of this example retrieves the unprocessed substrates W from the path 24 and transports the processed substrates W to the path 24 in return. The indexer robot IR of this example then returns the processed substrates W placed on the path 24 to the carrier C. In this way, the original substrate processing apparatus 2a transports substrates W in a manner different from that of the single-wafer processing apparatus 2 of the first embodiment.

[0172] <18. Single wafer processing block> The substrate processing apparatus 2a of this embodiment does not necessarily have to be configured to include the unloading position OP of Example 1. Since the substrate processing apparatus 2a of this embodiment does not need to be provided with the unloading position OP, a new single wafer processing chamber 48 is provided at the position where the unloading position OP is located in the single wafer processing apparatus 2 of Example 1.

[0173] The single wafer processing chamber 48 includes a plurality of drying process chambers for performing substrate drying process, as described in Example 1. The drying process chambers may use a supercritical fluid or may be of a spin dry type.

[0174] The single wafer processing chamber in this example also includes a chemical processing chamber that performs chemical processing on the substrate W. The chemical processing performed by the chemical processing chamber includes, for example, hydrofluoric acid processing to remove a natural oxide film grown on the upper surface of the substrate W, but is not limited to this. The chemical processing chamber is configured to retrieve a dry substrate from the center robot CR, perform a predetermined chemical processing, and then fill the substrate W with a liquid and hand it over to the center robot CR. The liquid filled on the substrate W is, for example, pure water or IPA.

[0175] <19. Control Unit> The control unit 132 in this example controls the indexer robot IR to remove the substrate W from the carrier C, controls the center robot CR to receive the substrate W removed by the indexer robot IR with the dry substrate hand 81 and transport it to the liquid supply chamber. The control unit 132 then controls the liquid supply chamber to puddle the substrate W, controls the center robot CR to receive the substrate W puddled in the liquid supply chamber with the wet substrate hand 82 and transport it to the drying chamber, and controls the drying treatment chamber to dry the substrate. Furthermore, the control unit 132 controls the center robot CR to receive the substrate W that has been dried in the drying chamber with the dry substrate hand 81 and transport it to the indexer robot IR, and controls the indexer robot IR to return the dried substrate W to the carrier C.

[0176] <20. Substrate processing flow> 46 is a flowchart illustrating the operation of the substrate processing apparatus 2a of this example. Hereinafter, the flow of substrate processing will be described with reference to this flowchart.

[0177] Step S31: A carrier C containing unprocessed substrates W is placed on the second load port 10.

[0178] Step S32: The indexer robot IR removes the unprocessed dry substrate from the carrier C in the second load port 10 and places it on the path 24. The center robot CR receives the dry substrate placed on the path 24 and transports it to a chemical liquid processing chamber, which is a type of single-wafer processing chamber 48. Figure 47 illustrates the transport path of the substrate W in steps S31 and S32.

[0179] In this step, the center robot CR uses the dry substrate hand 81 to transport the substrate from the path 24 to a chemical liquid processing chamber, which is one type of single wafer processing chamber 48. As shown in Fig. 44, the dry substrate hand 81 transports the substrate W while holding it with the tip guide 811 and the hand pusher 83. At this time, the substrate W is securely held by the dry substrate hand 81, allowing for high-speed substrate transport.

[0180] Step S33: The chemical processing chamber, which is one type of single wafer processing chamber 48, completes the chemical processing by supplying a predetermined chemical to the substrate W. After the chemical processing, the substrate W is put into a puddle state by supplying a predetermined liquid to its upper surface. The predetermined liquid may be, for example, pure water or IPA.

[0181] Step S34: The center robot CR receives the substrate W in a puddle state from the chemical liquid processing chamber, and transports it to a drying processing chamber, which is one type of single wafer processing chamber 48. Figure 48 illustrates the transport path of the substrate W in this step.

[0182] The substrate is transported in this step using the wet substrate hand 82 of the center robot CR. As shown in Fig. 42, the wet substrate hand 82 can support and transport the substrate W on which a mound of pure water or IPA has been poured using a tip protrusion 821 and a base protrusion 822 provided at positions avoiding the edge of the substrate W.

[0183] Step S35: The wet substrate W transported to the drying chamber is subjected to a drying process in the drying chamber.

[0184] Step S36: When the drying process of the substrate W is completed, the center robot CR receives the substrate from the drying process chamber and transports it to the path 24. The center robot CR achieves this transport using the dried substrate hand 81. The substrate W transported to the path 24 is returned to the carrier C in the second load port 10 by the indexer robot IR. In this way, the substrate processing in this example is completed. Figure 49 illustrates the transport path of the substrate W in this step.

[0185] 21. Effects of the Present Invention According to the configuration of this example, the control unit 132 controls the center robot CR to receive the substrate W removed from the carrier C by the indexer robot IR with the dry substrate hand 81 and transport it to the chemical treatment chamber, controls the chemical treatment chamber to puddle the substrate W, controls the center robot CR to receive the substrate W puddled in the chemical treatment chamber with the wet substrate hand 82 and transport it to the drying treatment chamber, controls the drying treatment chamber to dry the substrate, and controls the center robot CR to receive the substrate W that has been dried in the drying treatment chamber with the dry substrate hand 81 and transport it to the indexer robot IR. In this way, by providing individual hands according to the wetness state of the substrate W, it is possible to prevent a dry substrate from being transported by a wet hand. According to the configuration of this example, the substrate W can be transported while reliably maintaining its dry state.

[0186] <22. Variation> The present invention is not limited to the above-described embodiment, but can be modified as follows.

[0187] <Variation 1> The center robot CR in the embodiment described above has a fixed tray 316 fixed to the robot base 301 and a movable tray 311 provided on the fixed tray 316, but the present invention is not limited to this configuration. As shown in Figure 50, it can also be configured to include a tray hand 85 that receives liquid flowing down from a puddle of substrate W below the wet substrate hand 82. In this modified example, the fixed tray 316 and movable tray 311 are not necessarily required.

[0188] The configuration of the tray hand 85 will be described. The tray hand 85 is provided below the wet substrate hand 82. The tray hand 85 includes a plate-like blade 85b that extends horizontally, and a hand tray 851 provided on the upper surface of the blade 85b. The hand tray 851 is disk-shaped as shown in FIG. 51 , and has a wall that surrounds the hand tray 851. This wall prevents a liquid puddle that forms on the upper surface of the hand tray 851 from flowing downward below the hand tray 851. The size of the hand tray 851 is equal to or larger than the substrate W supported by the wet substrate hand 82. This ensures that liquid flowing down from the puddled substrate W is reliably received by the hand tray 851. The hand tray 851 corresponds to the tray of the present invention. The hand tray 851 is configured to receive liquid dropping from the wet substrate hand 82.

[0189] The hand tray moving mechanism 852 is configured to move the tray hand 85 back and forth in the hand extension direction B, and basically moves the hand tray 851 back and forth in synchronization with the wet substrate hand 82. That is, the hand tray moving mechanism 852 corresponds to the third moving mechanism of the present invention, movably supports the tray hand 85, and is supported by the robot base 301. The hand tray moving mechanism 852 basically causes the center of the hand tray 851 to coincide with the center of the puddled substrate W supported by the wet substrate hand 82. However, when the wet substrate hand 82 is positioned deep within the single wafer processing chamber 48 to introduce the substrate W into the single wafer processing chamber 48, the hand tray moving mechanism 852 causes the tray hand 85 to wait outside the single wafer processing chamber 48. With this configuration, the area below the wet substrate hand 82 within the single wafer processing chamber 48 is left empty. Such a state is convenient when transferring the substrate W to pins or a chuck inside the single wafer processing chamber 48 .

[0190] In practice, the hand tray moving mechanism 852 can move until half of the hand tray 851 has been introduced into the inlet 481 of the single-wafer processing chamber 48. That is, the hand tray 851 moves synchronously with the wet substrate hand 82 and stops when half of the substrate W has been introduced into the inlet 481 (see FIG. 52). The wet substrate hand 82 then moves further into the single-wafer processing chamber 48, leaving the hand tray 851 behind. Even if liquid flows down from the puddled substrate W while the wet substrate hand 82 is moving, leaving the hand tray 851 behind, the liquid is received within the hand tray 851 or the single-wafer processing chamber 48. In this way, the liquid flowing down from the puddled substrate W does not move away from the center robot CR and splash.

[0191] According to the above-described configuration, the apparatus includes a tray hand 85 provided below the wet substrate hand 82, and a hand tray moving mechanism 852 that movably supports the tray hand 85 and is supported by the robot base 301. The tray hand 85 includes a hand tray 851 that receives liquid dropping from the wet substrate hand 82. With this configuration, the hand tray 851 can be configured to closely follow the wet substrate hand 82, so that the liquid placed on the substrate W can be received by the hand tray 851. Therefore, according to the above-described configuration, a substrate transport device that can suppress liquid splashing can be provided. The tray hand 85 corresponds to the third hand of the present invention, and the hand tray moving mechanism 852 corresponds to the third moving mechanism of the present invention. The hand tray 851 corresponds to the third vat of the present invention.

[0192] <Variation 2> This modification is particularly a modification of the substrate processing apparatus according to Example 2. The center robot CR according to Example 2 has a single dry substrate hand 81, but may have multiple dry substrate hands 81. This modification particularly relates to a center robot CR provided with two dry substrate hands 81.

[0193] Figure 53 illustrates the hands of the center robot CR according to this modification. As shown in Figure 53, the center robot CR according to this modification has an upper hand 87 having a similar configuration to the hand 81 for dry substrates described in the embodiment, and a lower hand 88 having a similar configuration to the hand 81 for dry substrates. Below the lower hand 88 is located the hand 82 for wet substrates described in the embodiment.

[0194] The dry substrate hand of this modified example is made up of two hands, an upper hand 87 and a lower hand 88, which are arranged one above the other.

[0195] The lower hand 88 is a substrate gripping mechanism intended to transport dried substrates, and is a mechanism that performs the substrate transport described in Fig. 47, i.e., transporting unprocessed substrates from the path 24 to the single-wafer processing chamber 48. The lower hand 88 is equipped with a flat branch blade 88b that extends in a horizontal plane, a tip guide 881 provided at the tip of the branch blade 88b, and a base end guide 882 provided at the base end of the branch blade 88b. In addition, the lower hand 88 is equipped with a hand pusher 883 that presses the edge of the substrate W at the base end of the branch blade 88b, and a hand pusher drive mechanism 88a that drives the hand pusher 883.

[0196] A plan view of the lower hand 88 is as shown in Figure 30. That is, the lower hand 88 has a pair of tip guides 881 (reference numeral 811 in Figure 30) at the tip of a branch blade 88b (reference numeral 81b in Figure 30), and further has a pair of base end guides 882 (reference numeral 812 in Figure 30) at the base end of the branch blade 88b (reference numeral 81b in Figure 30). When the lower hand 88 is in the open state, it can support the substrate W by the tip guide 881 and the base end guide 882, and when it is in the closed state, it can grip the substrate W by the tip guide 881 and the hand pusher 883 (reference numeral 83 in Figure 30).

[0197] The upper hand 87 is a substrate gripping mechanism intended to transport dried substrates, and is a mechanism for transporting the substrates described in Fig. 49, i.e., transporting processed substrates from the single-wafer processing chamber 48 to the path 24. The upper hand 87 is equipped with a flat branch blade 87b that extends in a horizontal plane, a tip guide 871 provided at the tip of the branch blade 87b, and a base guide 872 provided at the base end of the branch blade 87b. In addition, the upper hand 87 is equipped with a hand pusher 873 that presses the edge of the substrate W at the base end of the branch blade 87b, and a hand pusher drive mechanism 87a that drives the hand pusher 873.

[0198] A plan view of the upper hand 87 also appears as shown in Figure 30. That is, the upper hand 87 has a pair of tip guides 871 (reference numeral 811 in Figure 30) at the tip of the branch blade 87b (reference numeral 81b in Figure 30), and further has a pair of base end guides 872 (reference numeral 812 in Figure 30) at the base end of the branch blade 87b (reference numeral 81b in Figure 30). When the upper hand 87 is in the open state, it can support the substrate W by the tip guide 871 and the base end guide 872, and when it is in the closed state, it can grip the substrate W by the tip guide 871 and the hand pusher 873 (reference numeral 83 in Figure 30).

[0199] The upper hand 87 and the lower hand 88 are movable forward and backward in the hand extension direction B, and can also be moved forward and backward independently. This configuration allows only the upper hand 87 to be introduced into the single wafer processing chamber 48 to transfer the substrate W, or only the lower hand 88 to be introduced into the single wafer processing chamber 48 to transfer the substrate W. A first distal arm 91 that supports such upper hand 87 and lower hand 88 is realized. The first distal arm 91 is provided individually for the upper hand 87 and the lower hand 88, and can be extended and retracted independently in the hand extension direction B.

[0200] In this manner, the upper hand 87 and the lower hand 88 are each movably supported by the first distal arm 91 provided separately.

[0201] In addition, since the upper hand 87 for transporting processed substrates is located above the lower hand 88 for transporting unprocessed substrates, particles and the like do not fall from the low-cleanliness substrate W held by the lower hand 88 onto the high-cleanliness substrate W held by the upper hand 87. Since particles have a tendency to fall from above downward, it can be said that the configuration of this modified example is optimized for maintaining the cleanliness of the substrate W.

[0202] According to the above configuration, the dry substrate hands include two hands, an upper hand 87 and a lower hand 88, arranged one above the other, and the upper hand 87 and the lower hand 88 are movably supported by first distal arms 91 provided separately. With this configuration, the transport of the dry substrate before substrate processing and the transport of the dry substrate after substrate processing can be performed by different hands, respectively. Therefore, it is possible to prevent a situation in which a hand contaminated by a dry substrate before substrate processing grips a clean dry substrate after substrate processing. The above configuration provides a substrate transport device that improves the reliability of substrate processing in a substrate processing apparatus. [Explanation of symbols]

[0203] 1. Batch processing equipment 1A First enclosure 2 Single wafer processing equipment 2a Substrate processing equipment 2A Second housing 3 Stocker Block 4 Indexer Blocks 5 Transfer block 6. Relay Device 7 Batch Processing Block 8 Single-Wafer Processing Block 9. Loading Port No. 1 10. Second Loading Port 11 Carrier transport mechanism 12 Carrier Block 13 Shelves 13a Carrier placement shelf 13b Shelf 16 Shielding plate 23 HVC attitude change unit 24 passes 25 Pusher mechanism 29 Zipper 31X Guide Rail 32Y relay rail 33 Substrate row support 41 Liquid supply nozzle 47 Single wafer processing chamber 48 Single-Wafer Processing Chambers 49 Single-Wafer Processing Chamber 62a side wall 62b bottom plate 62c top plate 69 shower head 71 Reversing Chuck 72 Chuck support mechanism 73 Soaking tank 81 Drying substrate hand 81b First branch blade 82 Wet substrate hand 82b Second branch blade 83 Hand Pusher 83a Hand pusher drive mechanism 87a Hand pusher drive mechanism 88a Hand pusher drive mechanism 85 Tray Hand 85b blade 87 Upper Hand 87b Branch Blade 88 Lower Hand 88b Branch Blade 91 First distal arm 92 First relay arm 94 First base arm 96 Second distal arm 97 Second relay arm 98 Second base arm 101 Support mechanism 102 Slide mechanism 103b Hand 104 Rotational Axis 105 trays 108 Tray moving mechanism 110 Bottom plate 111 Support pin 131 Control Unit 132 Control Unit 136 Control Unit 211 hands 213 Moving support mechanism 231 Mounting rod 232 Clamping rod 237 Support stand 238 Rotational Drive Mechanism 251 Pusher 251a U groove 254 Pusher shift mechanism 255 Pusher lifting mechanism 301 Robot Base 302 Lifting and Rotating Mechanism 303 Slide mechanism 311 Mobile Bat 312 Top plate 313 Connecting part 314 Base 315 Advancement / retraction mechanism 316 Fixed Bat 317 Wall section 318 Wall 481 Loading entrance 811 Tip guide 812 Base end guide 821 Tip protrusion 822 Proximal process 831 Flat Bar 832 Flat Bar 841 Flat Bar 842 Flat Bar 851 Hand Tray 871 Tip Guide 872 Base guide 873 Hand Pusher 852 Hand tray moving mechanism 881 Tip Guide 882 Base guide ACB transport storage area B Stretching direction BPU1 Batch Processing Unit BPU2 Batch Processing Unit BPU3 Batch Processing Unit BPU4 Batch Processing Unit BPU5 Batch Processing Unit BPU6 Batch Processing Unit C Carrier Cb mounting plate CHB2 batch chemical treatment tank CHB3 batch chemical treatment tank CHB4 batch chemical treatment tank CHB5 batch chemical treatment tank CHB6 batch chemical treatment tank CR Center Robot HTR Handling Robot IP loading position IR Indexer Robot L liquid LF1 Lifter LF2 Lifter LF3 Lifter LF4 Lifter LF5 Lifter LF6 Lifter LF65 Lifter LP prescribed part ONB batch rinse processing tank OP unloading position OTR relay transport mechanism PP handover position R1 Batch Processing Area R2 Batch Processing Area R3 Single wafer processing area S slot W substrate WTR substrate transport mechanism

Claims

1. A substrate transport device that transports a substrate, At least one dry substrate hand for holding a dry substrate in a horizontal position; a wet substrate hand provided below the dry substrate hand for supporting a substrate on which a liquid has been puddled; a first moving mechanism that movably supports the dry substrate hand; a second moving mechanism that movably supports the wet substrate hand; a base member supporting the first movement mechanism and the second movement mechanism, The dry substrate hand includes: A first blade; a pair of base end guides provided at a base end of the first blade and in contact with an end of the substrate; a pair of tip guides provided at the tip of the first blade and in contact with the edge of the substrate; a substrate gripping pusher that is disposed at a base end of the first blade at a position sandwiched between a pair of first base end guides, and that contacts an edge of a substrate and presses the substrate toward the tip end guides, thereby gripping the substrate in cooperation with the tip end guides; The wet substrate hand includes: A second blade; a pair of base end protrusions provided at a base end of the second blade and contacting a lower surface of the substrate to support the substrate; a pair of tip protrusions provided at the tip of the second blade and contacting the lower surface of the substrate to support the substrate; A substrate transport device characterized by:

2. 2. The substrate transport device according to claim 1, a fixed tray supported by the base member below the wet substrate hand for collecting liquid dropped from the wet substrate hand; a movable tray provided between the wet substrate hand and the fixed tray for receiving the liquid dropped from the wet substrate hand and guiding it to the fixed tray; a moving butt advance / retract mechanism that moves the moving butt back and forth horizontally relative to the base member; Equipped with A substrate transport device characterized by:

3. 2. The substrate transport device according to claim 1, a tray hand provided below the wet substrate hand; a third moving mechanism that movably supports the tray hand and is supported by the base member, The tray hand includes a tray that receives the liquid dropping from the wet substrate hand. A substrate transport device characterized by:

4. 2. The substrate transport device according to claim 1, The dry substrate hand is composed of two hands, an upper hand and a lower hand, which are arranged vertically, The upper hand and the lower hand are movably supported by the first moving mechanisms provided separately. A substrate transport device characterized by:

5. A substrate processing system including the substrate transfer device according to claim 1, The substrate processing system includes: a batch processing device that performs batch processing for processing a plurality of substrates at once; a relay device that receives a plurality of substrates that have been batch-processed from the batch processing device, converts each substrate into a horizontal position, and transfers the substrates in the horizontal position by piling up liquid; a single-wafer processing device that receives the liquid-pile substrates transported to the relay device and processes each substrate one by one; a control unit that controls the batch processing device, the single wafer processing device, and the relay device, The single wafer processing apparatus includes: a drying chamber capable of drying the substrates one by one; the substrate transport device; an indexer robot that returns the dried substrate to the carrier; The control unit controlling the substrate transport device to receive the puddled substrate with the wet substrate hand and transport it to the drying chamber; controlling the drying chamber to perform a drying process on the substrate; controlling the substrate transport device to receive the substrate that has been dried in the drying chamber with the dried substrate hand and transport it to the indexer robot; Controlling the indexer robot to return the dried substrate to the carrier. A substrate processing system comprising:

6. A substrate processing apparatus for single-substrate processing, comprising the substrate transfer apparatus according to claim 1, The apparatus includes an indexer robot that transports substrates within the apparatus, a processing block that performs substrate processing, and a control unit that controls the apparatus; The processing block comprises: a liquid supply chamber for piling liquid onto the substrate; a drying chamber for receiving the puddled substrate and performing a drying process; the substrate transport device, The control unit controlling the indexer robot to remove the substrate from the carrier; controlling the substrate transport device to receive the substrate removed by the indexer robot with the dry substrate hand and transport it to the liquid supply chamber; controlling the liquid supply chamber to cause the substrate to be filled with liquid; controlling the substrate transport device to receive the substrate on which the liquid has been puddled in the liquid supply chamber with the wet substrate hand and transport it to the drying chamber; controlling the drying chamber to perform a drying process on the substrate; controlling the substrate transport device to receive the substrate that has been dried in the drying chamber with the dried substrate hand and transport it to the indexer robot; Controlling the indexer robot to return the dried substrate to the carrier. A substrate processing apparatus characterized by:

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