Processing device and processing method

Abstract

A processing device and a processing method are provided that can properly place a workpiece on a holding table and improve productivity. [Solution] The processing device 1 includes a mounting table 5 on which a storage container 100 that stores a package substrate W is placed, a holding table 30 on which the package substrate W transported from the mounting table 5 is placed and which holds the package substrate W, a processing unit 40 that processes the package substrate W held on the holding table 30, and a position information acquisition unit 60 that acquires position information of the package substrate W transported from the mounting table 5. The package substrate W is placed on the holding table 30 based on the position information of the package substrate W acquired by the position information acquisition unit 60.

Description

[Technical Field]

[0001] The present invention relates to a processing device and a processing method. [Background technology]

[0002] Cutting machines are known as machines for dividing multiple devices formed on the surface of a workpiece, such as a silicon wafer, into individual device chips. The devices formed on the surface of the workpiece include, for example, devices such as integrated circuits (ICs) and large scale integrations (LSIs), as well as packaged devices such as chip size packages (CSPs) and quad flat non-leaded packages (QFNs), which are used in various electrical equipment.

[0003] For example, Patent Document 1 describes a cutting device equipped with cutting means for cutting a substrate, which is a workpiece held on a holding table. In the cutting device of Patent Document 1, a substrate stored in a cassette is transported by a carrying-out means and placed in a temporary storage area, and then transported to the holding table by a first transport means. The substrate is transported by the first transport means by suction. Then, cutting is performed on the substrate held on the holding table. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2000-232080 Summary of the Invention [Problem to be solved by the invention]

[0005] In Patent Document 1, if a substrate is transferred from a cassette and placed in a misaligned position in the temporary placement area, the substrate will be placed in a misaligned position on the holding table when it is transferred to the holding table by the first transfer means. In this case, it is necessary to reposition the substrate in an appropriate position on the holding table after transferring it to the holding table, which leaves room for improvement in terms of productivity.

[0006] The present invention provides a processing apparatus and a processing method that can properly place a workpiece on a holding table and improve productivity. [Means for solving the problem]

[0007] The present invention provides a mounting table on which a container for accommodating the workpiece is placed; a holding table on which the workpiece transferred from the mounting table is placed and which holds the workpiece; a processing unit that processes the workpiece held on the holding table; a position information acquisition unit that acquires position information of the workpiece transported from the mounting table, The workpiece is placed on the holding table based on the position information of the workpiece acquired by the position information acquisition unit.

[0008] The present invention also provides A processing method for processing a workpiece held on a holding table, comprising: transporting the workpiece from a mounting table on which a container for accommodating the workpiece is placed to the holding table; acquiring position information of the workpiece being transported from the mounting table; placing the workpiece on the holding table based on the position information of the workpiece; The workpiece held on the holding table is machined. [Effects of the Invention]

[0009] According to the present invention, even if the workpiece is displaced when removed from the container, the workpiece can be appropriately placed on the holding table taking into consideration the displacement. Therefore, there is no need to reposition the workpiece due to the displacement after placing it on the holding table, thereby improving productivity. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a schematic perspective view of a processing device 1 according to an embodiment of the present invention. [Figure 2] FIG. 2 is an enlarged perspective view of the holding table 30 and the processing unit 40. [Figure 3] 10 is a top view of a package substrate W in which misalignment has occurred on the first transport unit 10. FIG. [Figure 4] 1 is a schematic side view showing a specific configuration of a position information acquisition unit 60. FIG. [Figure 5] 10 is a top view of a package substrate W that has been transported to a position where it can be imaged by an imaging device 62. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0011] An embodiment of the processing apparatus of the present invention will be described below with reference to the accompanying drawings. In the following description, the arrow directions shown in the drawings will be referred to as the X-axis, Y-axis, and Z-axis directions, respectively.

[0012] [Overall overview of the processing equipment] 1 is a schematic perspective view of a processing apparatus 1. The processing apparatus 1 includes a base 2 that supports components described below, and performs a predetermined processing process on a workpiece. In this embodiment, the processing apparatus 1 performs cutting processing on, for example, a package substrate W (an example of a workpiece) on which a plurality of devices D are formed, and separates the package substrate W into individual device chips.

[0013] The package substrate W is, for example, a CSP substrate or a QFN substrate, and is a rectangular plate-like object. The package substrate W is divided into multiple regions by division lines arranged in a grid pattern on its surface, and a device D is formed in each region.

[0014] The processing apparatus 1 includes a mounting table 5 on which a storage container 100 (sometimes referred to as a cassette) for storing a package substrate W is placed, a first transport unit 10 that transports the package substrate W from the mounting table 5 to a predetermined position A, a second transport unit 20 that transports the package substrate W from the predetermined position A, a holding table 30 on which the package substrate W transported from the predetermined position A by the second transport unit 20 is placed and which holds the package substrate W, a processing unit 40 that processes the package substrate W held by the holding table 30, a processing water supply unit 46 that can supply processing water to the package substrate W, a third transport unit 80 that transports the package substrate W processed by the processing unit 40, a cleaning unit 86 that cleans the processed package substrate W, and a drying unit 87 that dries the cleaned package substrate W. These units and the mounting table 5 that are components of the processing apparatus 1 are supported by a base 2.

[0015] One storage container 100 is placed on the mounting table 5. The storage container 100 has multiple shelves arranged at predetermined intervals in the vertical direction, and multiple package substrates W can be stored horizontally on the shelves. The mounting table 5 is arranged to be movable in the Z-axis direction (i.e., the vertical direction), and can adjust the height position of the package substrate W taken out of the storage container 100 to the height position of the mounting surface for the package substrate W in the first transport unit 10.

[0016] The first transport unit 10 is provided adjacent to the mounting table 5 and includes a conveyor 11 on which a package substrate W taken out of the container 100 in the +Y direction is placed and which transports the package substrate W to a predetermined position A. The conveyor 11 is, for example, a belt conveyor including an endless belt and a motor for driving the belt. Here, the predetermined position A is a downstream area on the conveyor 11, and is an area where the second transport unit 20 can hold the package substrate W.

[0017] The second transport unit 20 transports the package substrate W placed at a predetermined position A to the holding table 30. The second transport unit 20 has a suction pad 21 that suction-holds the upper surface of the package substrate W, a lifting mechanism 22 that supports the suction pad 21 and raises and lowers it up and down, an operating arm 23 that supports the lifting mechanism 22, and a moving mechanism (not shown) that moves the operating arm 23 along the Y-axis direction. The lifting mechanism 22 may be formed, for example, by an air cylinder or by a motor and a ball screw.

[0018] Two holding tables 30 are provided side by side along the Y-axis direction. Each holding table 30 has a circular holding surface, and suction holes (not shown) are exposed on this holding surface. A suction path is formed inside the holding table 30, which communicates with the suction holes and is connected to a suction source such as a vacuum pump. The holding table 30 having this configuration suction-holds the package substrate W transported by the second transport unit 20.

[0019] Further, around each holding table 30, a tray 65 is provided for receiving processing water supplied during processing and processing waste.

[0020] 2 is an enlarged perspective view of the holding table 30 and the processing unit 40. Note that the tray 65 is not shown.

[0021] The holding table 30 is provided so as to be movable along the X-axis direction (processing feed direction) by an X-axis direction moving means 35 provided below the holding table 30. The holding table 30 is also provided so as to be rotatable within a predetermined angle (for example, 90°) around a central axis extending in the Z-axis direction by a rotation drive mechanism (not shown).

[0022] The processing unit 40 cuts the package substrate W held on the holding table 30 along the planned division line. The processing unit 40 has a spindle 41 arranged along the Y-axis direction (indexing feed direction) and a disk-shaped cutting blade 42 attached to the tip of the spindle 41. The spindle 41 and the cutting blade 42 are provided so as to be movable in the Y-axis direction and the Z-axis direction by a Y-axis direction moving means 36 and a Z-axis direction moving means 37. The spindle 41 and the cutting blade 42 are rotated at a predetermined speed by, for example, a servo motor.

[0023] The processing water supply units 46 are provided on both sides of the cutting blade 42 in the X-axis direction and have spray nozzles 47 that can supply processing water. The processing water supplied from the spray nozzles 47 is supplied to the cutting area between the cutting blade 42 and the package substrate W. The processing water cools the cutting area and can wash away processing waste generated during cutting.

[0024] 1, the third transport unit 80 transports the individual devices D separated by the processing unit 40 to the cleaning unit 86. Similar to the second transport unit 20, the third transport unit 80 has a suction pad 81 that suction-holds the devices D, a lifting mechanism 82 that supports the suction pad 81 and raises and lowers it, an operating arm 83 that supports the lifting mechanism 82, and a moving mechanism (not shown) that moves the operating arm 83 along the Y-axis direction.

[0025] The cleaning unit 86 physically or chemically cleans the processed package substrate W. The cleaning unit 86 includes, for example, a mechanism for supplying a cleaning liquid and a cleaning tool such as a sponge that comes into contact with the device D to clean it.

[0026] The drying unit 87 dries the device D cleaned by the cleaning unit 86. The drying unit 87 includes, for example, a heater.

[0027] [Location information acquisition unit] When the package substrate W is taken out of the container 100 or during transport by the first transport unit 10, the package substrate W may be displaced.

[0028] 3 is a top view of a package substrate W in which misalignment has occurred on the first transport unit 10. The area surrounded by the two-dot chain line in FIG. 3 is a virtual area that matches the outline of the package substrate W in a top view when the package substrate W is transported without misalignment, and is hereinafter also referred to as a reference area B as an area that serves as a reference on the transport path of the package substrate W. The misalignment of the package substrate W includes, for example, a deviation of the center position CP of the package substrate W from the center position of the reference area B (the intersection of the thick dashed lines in FIG. 3) and / or an inclination θ of the package substrate W with respect to a reference direction (here, the Y-axis direction).

[0029] If the package substrate W is placed on the holding table 30 in such a state where the package substrate W is misaligned, it will be necessary to reposition the package substrate W due to the misalignment after placing the package substrate W on the holding table 30, which will reduce the productivity of the processing device 1.

[0030] 1, the processing apparatus 1 further includes a position information acquisition unit 60 that acquires position information of the package substrate W transported from the mounting table 5. Then, the package substrate W is placed on the holding table 30 based on the position information of the package substrate W acquired by the position information acquisition unit 60.

[0031] The position information of the package substrate W acquired by the position information acquisition unit 60 includes, for example, information about the center position CP of the package substrate W and / or information about the inclination θ of the package substrate W relative to the reference direction. In other words, this information can be said to be the deviation of the package substrate W from the reference area B described above.

[0032] 4 is a schematic side view showing a specific configuration of the position information acquisition unit 60. The position information acquisition unit 60 includes a light irradiation device 61 that irradiates light onto the package substrate W transported from the mounting table 5, an imaging device 62 that images the package substrate W, and an image processing device 63 that acquires position information of the package substrate W based on the image captured by the imaging device 62.

[0033] The light irradiation device 61 is provided below the conveyor 11 of the first transfer unit 10. The conveyor 11 is made of a material that transmits light, and the light irradiation device 61 irradiates the package substrate W with light from below the conveyor 11.

[0034] The imaging device 62 is configured with optical means such as a microscope or a CCD (Charge Coupled Device) camera, and transmits captured image data to the image processing device 63. The imaging device 62 is provided in the second transport unit 20, and captures an image of the package substrate W from above the conveyor 11.

[0035] The image processing device 63 is configured to include a processor, a memory, etc., and processes the image captured by the imaging device 62 to obtain position information of the package substrate W. Specifically, the image processing device 63 obtains the coordinate position of the center position CP of the package substrate W in a predetermined coordinate system that is set in advance, and / or the inclination θ of the package substrate W with respect to a reference direction.

[0036] 5 is a top view of the package substrate W transported to a position where it can be imaged by the imaging device 62. When the imaging field of view that can be imaged with sufficient resolution is smaller than the entire package substrate W, the imaging device 62 partially images multiple regions of the package substrate W. In the example shown in FIG. 5, the imaging device 62 partially images six regions surrounded by dashed circles (i.e., the imaging field of view). Note that when the imaging field of view that can be imaged with sufficient resolution includes the entire package substrate W, the imaging device 62 may image the entire package substrate W in one go.

[0037] In order to properly acquire position information of the package substrate W, the imaging device 62 preferably captures an image of at least an area including the periphery of the package substrate W. In the example shown in Fig. 5, the imaging device 62 partially captures images of six areas including four corners of the package substrate W as the area including the periphery of the package substrate W. With this configuration, even if an image of the entire package substrate W is not available, the image processing device 63 can acquire position information such as a position inside the periphery of the package substrate W (e.g., the center position CP) and the tilt θ of the package substrate W, based on the image of the area including the periphery of the package substrate W.

[0038] 1, the processing apparatus 1 further includes a control device 7 that adjusts the relative position of the holding table 30 and the package substrate W based on position information of the package substrate W acquired by a position information acquisition unit 60 when the second transport unit 20 places the package substrate W on the holding table 30. The control device 7 has a processor that performs arithmetic processing according to a control program, and memories such as a ROM (Read Only Memory) and a RAM (Random Access Memory), and is also configured to be able to receive the position information of the package substrate W transmitted by the position information acquisition unit 60. The control device 7 adjusts the position of the second transport unit 20 and / or the position of the holding table 30 (including the position in the rotational direction about the central axis) based on the position information of the package substrate W, thereby properly placing the package substrate W on the holding table 30.

[0039] As described above, the position information acquisition unit 60 acquires the position information of the package substrate W before placing the package substrate W on the holding table 30, and the package substrate W is placed on the holding table 30 based on the position information. Therefore, even if the package substrate W is misaligned, the package substrate W can be appropriately placed on the holding table 30 taking into account the misalignment. Furthermore, a mechanical mechanism for positioning the package substrate W before transport by the second transport unit 20 is not required.

[0040] The position information acquisition unit 60 acquires position information of the package substrate W while the package substrate W is being transported by the first transport unit 10, or when the package substrate W is placed at a predetermined position A, which is an area where the second transport unit 20 can hold the package substrate W. With this configuration, the position information acquisition unit 60 can appropriately acquire position information of the package substrate W while the package substrate W is being transported by the first transport unit 10.

[0041] As described above, the first transport unit 10 is configured such that the conveyor 11 carrying the package substrate W transports the package substrate W to the predetermined position A. Therefore, the package substrate W is stably transported by the conveyor 11, and the position information acquisition unit 60 can acquire the position information of the package substrate W with high accuracy.

[0042] Although one embodiment of the present invention has been described above with reference to the accompanying drawings, it goes without saying that the present invention is not limited to such an embodiment. It is clear that a person skilled in the art can conceive of various modifications or alterations within the scope of the claims, and it is understood that these also naturally fall within the technical scope of the present invention. Furthermore, the components of the above embodiment may be combined in any manner as long as they do not deviate from the spirit of the invention.

[0043] This specification describes at least the following: In parentheses, components corresponding to those in the above-described embodiments are shown as examples, but the present invention is not limited to these.

[0044] (1) a mounting table (mounting table 5) on which a container (container 100) for accommodating a workpiece (package substrate W) is placed; a holding table (holding table 30) on which the workpiece transferred from the mounting table is placed and which holds the workpiece; a processing unit (processing unit 40) that processes the workpiece held on the holding table; a position information acquisition unit (position information acquisition unit 60) that acquires position information of the workpiece transported from the mounting table, The workpiece is placed on the holding table based on the position information of the workpiece acquired by the position information acquisition unit. Processing equipment.

[0045] According to (1), position information of the workpiece is acquired before the workpiece is placed on the holding table, and the workpiece is placed on the holding table based on the position information, so even if the workpiece is displaced when being removed from the container, the workpiece can be appropriately placed on the holding table taking into account the positional displacement. Therefore, there is no need to reposition the workpiece due to the positional displacement after it has been placed on the holding table, thereby improving productivity.

[0046] (2) The processing device according to (1), The location information acquisition unit a light irradiation device (light irradiation device 61) that irradiates light onto the workpiece transported from the mounting table; an imaging device (imaging device 62) that images the workpiece; and an image processing device (image processing device 63) that acquires the position information of the workpiece based on the image captured by the imaging device. Processing equipment.

[0047] According to (2), it is possible to obtain position information of the workpiece being transported from the mounting table based on the captured image of the workpiece.

[0048] (3) The processing device according to (2), the imaging device images an area including at least the outer periphery of the workpiece; Processing equipment.

[0049] According to (3), the imaging device captures an image of an area including the periphery of the workpiece, so that position information of the workpiece can be appropriately acquired.

[0050] (4) A processing device according to any one of (1) to (3), The position information of the workpiece includes a deviation of the workpiece from a reference area (reference area B) on the conveyance path of the workpiece. Processing equipment.

[0051] According to (4), the workpiece can be appropriately placed on the holding table based on the deviation of the workpiece from the reference area.

[0052] (5) A processing device according to any one of (1) to (4), a first conveying unit (first conveying unit 10) that conveys the workpiece from the mounting table to a predetermined position (predetermined position A); a second conveying unit (second conveying unit 20) that conveys the workpiece from the predetermined position to the holding table, the position information acquisition unit acquires the position information of the workpiece while the workpiece is being transported by the first transport unit or when the workpiece is placed at the predetermined position. Processing equipment.

[0053] According to (5), the position information of the workpiece can be appropriately acquired while the workpiece is being transported by the first transport unit.

[0054] (6) The processing device according to (5), The first transport unit includes a conveyor (conveyor 11), and the workpiece is placed on the conveyor and transported to the predetermined position. Processing equipment.

[0055] According to (6), since the first transport unit includes a conveyor, the workpiece can be transported stably, and position information of the workpiece can be obtained with high accuracy.

[0056] (7) A processing method for processing a workpiece (package substrate W) held on a holding table (holding table 30), comprising: The workpiece is transported from a mounting table (mounting table 5) on which a container (container 100) for accommodating the workpiece is placed to the holding table; acquiring position information of the workpiece being transported from the mounting table; placing the workpiece on the holding table based on the position information of the workpiece; processing the workpiece held on the holding table; Processing method.

[0057] According to (7), position information of the workpiece is acquired before the workpiece is placed on the holding table, and the workpiece is placed on the holding table based on the position information, so even if the workpiece is displaced when it is removed from the container, the workpiece can be appropriately placed on the holding table taking into account the positional displacement. Therefore, there is no need to reposition the workpiece due to the positional displacement after it has been placed on the holding table, which improves productivity. [Explanation of symbols]

[0058] 1 Processing equipment 5. Mounting table 10 First transport unit 11 Conveyor 20 Second transport unit 30 Holding table 40 Processing Unit 60 Location Information Acquisition Unit 61 Light irradiation device 62 Imaging device 63 Image processing device 100 Storage Container A Predetermined position B. Reference area (reference area) W Package substrate (workpiece)

Claims

1. a mounting table on which a container for accommodating the workpiece is placed; a holding table on which the workpiece transferred from the mounting table is placed and which holds the workpiece; a processing unit that processes the workpiece held on the holding table; a position information acquisition unit that acquires position information of the workpiece transported from the mounting table, The workpiece is placed on the holding table based on the position information of the workpiece acquired by the position information acquisition unit. Processing equipment.

2. The processing device according to claim 1, The location information acquisition unit a light irradiation device that irradiates light onto the workpiece transported from the mounting table; an imaging device that images the workpiece; an image processing device that acquires the position information of the workpiece based on the image captured by the imaging device, Processing equipment.

3. The processing device according to claim 2, the imaging device images an area including at least the outer periphery of the workpiece; Processing equipment.

4. The processing device according to any one of claims 1 to 3, The position information of the workpiece includes a deviation of the workpiece from a reference area on a transport path of the workpiece. Processing equipment.

5. The processing device according to any one of claims 1 to 3, a first transport unit that transports the workpiece from the mounting table to a predetermined position; a second transport unit that transports the workpiece from the predetermined position to the holding table, the position information acquisition unit acquires the position information of the workpiece while the workpiece is being transported by the first transport unit or when the workpiece is placed at the predetermined position. Processing equipment.

6. The processing device according to claim 5, the first transport unit includes a conveyor, and the workpiece is placed on the conveyor and transported to the predetermined position; Processing equipment.

7. A processing method for processing a workpiece held on a holding table, comprising: transporting the workpiece from a mounting table on which a container for accommodating the workpiece is placed to the holding table; acquiring position information of the workpiece being transported from the mounting table; placing the workpiece on the holding table based on the position information of the workpiece; processing the workpiece held on the holding table; Processing method.

Images