Conveying device and conveying method

Abstract

A transport device and a transport method are provided that can transport a semiconductor chip to a predetermined position while holding the semiconductor chip from the bonding surface side, while suppressing changes in the state of the bonding surface of the semiconductor chip. [Solution] A transport device 1 for transporting a semiconductor chip β includes a stage 10 that holds the semiconductor chip β on a mounting surface 11, and a drive device 20 that moves the stage 10. The stage 10 has protrusions 12 on the mounting surface 11 that support the semiconductor chip β while in contact with the bonding surface of the semiconductor chip β. The protrusions 12 are configured to contact the bonding surface except for an outer edge β3, and the total area of ​​the parts that contact the bonding surface is less than 5% of the area of ​​the bonding surface.

Description

[Technical Field]

[0001] The present invention relates to a transfer device and a transfer method for transferring semiconductor chips. [Background technology]

[0002] A transport device for transporting semiconductor chips is known. The transport device, for example, holds a semiconductor chip attached to an adhesive sheet with a pickup collet and transports it to a predetermined position. The transport device transports the semiconductor chip while holding it from the bonding surface (active surface) side so that the molded surface of the semiconductor chip can be grasped by a downstream mounting device. The semiconductor chip transported by the transport device has its molded surface grasped by a pickup head of the mounting device, and the bonding surface is bonded to a substrate.

[0003] As circuits become increasingly miniaturized, semiconductor chips and bonding methods are known for directly bonding connection terminals on the bonding surface to connection terminals on the substrate without using bumps or the like. The bonding surfaces of the semiconductor chips to be directly bonded are subjected to a surface treatment such as a surface activation treatment. For semiconductor chips that have undergone such treatment, it is necessary to prevent contact of the bonding surface with a pickup collet or the like during transportation in order to maintain the activation state of the bonding surface and suppress particle generation.

[0004] Therefore, a transfer device (pickup device) is known that holds and transfers the bonding surface side of a semiconductor chip without contacting the activated bonding surface with a pickup collet, etc. The pickup device described in Patent Document 1 transfers the semiconductor chip using a pickup collet that has an air supply hole that blows positive pressure gas onto the semiconductor chip and a suction hole that sucks the semiconductor chip with negative pressure.

[0005] The pickup collet blows positively pressurized gas toward the semiconductor chip through the air supply hole. The pressure of the blown gas pushes the semiconductor chip up from the pickup collet, forming a gas layer between the pickup collet and the semiconductor chip. The pickup collet then sucks gas through the air intake hole. The pickup collet attracts the semiconductor chip to the pickup collet through the suction force of the gas. Thus, the semiconductor chip is held in a position where the upward force of the blown gas and the attractive force of the sucked gas are balanced. At this time, a gas layer is formed between the bonding surface of the semiconductor chip and the pickup collet, so the pickup collet and the bonding surface remain in a non-contact state. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Publication No. 2022-157318 Summary of the Invention [Problem to be solved by the invention]

[0007] The pickup device described in Patent Document 1 holds the semiconductor chip without contacting the pickup collet, resulting in large variations in the positioning of the semiconductor chip relative to the pickup collet. Furthermore, the pickup device's holding state of the semiconductor chip changes due to fluctuations in positive or negative gas pressure or gas flow rate. Furthermore, acceleration during transportation can cause the holding position of the semiconductor chip to shift.

[0008] An object of the present invention is to provide a transport device that can transport a semiconductor chip to a predetermined position while holding the semiconductor chip from the bonding surface side, while suppressing changes in the state of the bonding surface of the semiconductor chip. [Means for solving the problem]

[0009] The present inventors have studied a conveying device and a semiconductor chip conveying method that can hold a semiconductor chip from the bonding surface side while suppressing contact with the bonding surface of the semiconductor chip. As a result of intensive research, the present inventors have come up with the following configuration.

[0010] A transport device according to an embodiment of the present invention is a transport device for transporting semiconductor chips. The transport device includes a stage that holds the semiconductor chip on a mounting surface and a drive device that moves the stage. The stage has protrusions on the mounting surface that support the semiconductor chip while contacting the bonding surface of the semiconductor chip. The protrusions are configured to contact a portion of the bonding surface excluding the outer edge, and the total area of ​​the portions that contact the bonding surface is less than 5% of the area of ​​the bonding surface.

[0011] Furthermore, a method for transporting a semiconductor chip according to an embodiment of the present invention is a method for transporting the semiconductor chip in a state in which the semiconductor chip is supported by an area that is less than 5% of the area of ​​the bonding surface of the semiconductor chip.

[0012] The transport device and transport method support the bonding surface of the semiconductor chip with protrusions, thereby suppressing the contact area of ​​the bonding surface where the protrusions are in contact to less than 5% of the bonding surface. The protrusions contact the bonding surface except for the outer edge, where particles are likely to be generated by contact. In other words, the transport device holds the semiconductor chip from the bonding surface side without the protrusions contacting 95% or more of the bonding surface, including the outer edge, where particles are likely to be generated. Therefore, the transport device suppresses particle generation in the semiconductor chip it holds and maintains the current state of 95% or more of the bonding surface, where the protrusions are not in contact with the protrusions. Therefore, when the semiconductor chip is bonded to a substrate, the loss of bonding strength in the less than 5% of the bonding surface that is in contact with the protrusions can be compensated for by other portions. Furthermore, because the transport device supports the semiconductor chip from the bonding surface side with the protrusions in contact with the bonding surface, the semiconductor chip is less likely to shift position relative to the stage during transport. This makes it possible to transport the semiconductor chip to a predetermined position while holding it from the bonding surface side, while suppressing changes in the state of the bonding surface of the semiconductor chip.

[0013] From another viewpoint, the transport device of the present invention preferably includes the following configuration: the stage has a suction hole that opens to the mounting surface and sucks in gas, and the stage attracts the semiconductor chip to the protrusion by sucking in gas between the mounting surface and the bonding surface of the semiconductor chip supported by the protrusion.

[0014] In the above-described configuration, the transport device sucks in gas, thereby generating a negative pressure between the mounting surface of the stage and the bonding surface of the semiconductor chip supported by the protrusion. The semiconductor chip is pressed against the protrusion by the negative pressure. A frictional force proportional to the suction force is generated on the contact surface of the semiconductor chip on the protrusion. Therefore, even if the transport device supports the semiconductor chip over an area less than 5% of the area of ​​the bonding surface, the frictional force suppresses misalignment of the semiconductor chip relative to the protrusion. This allows the semiconductor chip to be transported to a predetermined position while being held from the bonding surface side, while suppressing changes in the state of the bonding surface of the semiconductor chip.

[0015] From another viewpoint, the transport device of the present invention preferably includes the following configuration: The protrusions are at least two or more protrusions having a curved surface or a flat surface that contacts the joining surface.

[0016] In the above-described configuration, the contact surfaces of the two or more protrusions that come into contact with the bonding surface are formed as curved or flat surfaces. In other words, the protrusions distribute the stress that occurs between the contact surface and the semiconductor chip when they come into contact with the semiconductor chip across the two or more protrusions, and suppress stress concentration on the contact surface. Therefore, the transport device suppresses the generation of microscopic scratches on the bonding surface by the protrusions and suppresses wear on the protrusions. This allows the semiconductor chip to be transported to a predetermined position while being held from the bonding surface side, while suppressing changes in the state of the bonding surface of the semiconductor chip.

[0017] Furthermore, in the above-described configuration, when the protruding portion is two protrusions, the semiconductor chip may be supported by the two protrusions as well as compressed air, etc. The transport device configured in this manner can transport the semiconductor chip to a predetermined position while maintaining the position of the semiconductor chip by the frictional force generated between the supporting semiconductor chip and the two protrusions, while minimizing changes in the state of the bonding surface of the semiconductor chip by contact-supporting the semiconductor chip with the two protrusions.

[0018] From another viewpoint, the transport device of the present invention preferably includes the following configuration: The protrusions are a plurality of protrusions arranged at equal intervals in a predetermined direction.

[0019] In the above configuration, the transport device supports the semiconductor chip using multiple protrusions arranged at equal intervals, thereby reducing the weight of the semiconductor chip applied to each protrusion and supporting the entire semiconductor chip in a manner that supports the entire surface of the semiconductor chip. This reduces the contact area of ​​each protrusion that comes into contact with the bonding surface. This allows the semiconductor chip to be transported to a predetermined position while being held from the bonding surface side, while suppressing changes in the state of the bonding surface of the semiconductor chip.

[0020] From another viewpoint, the transport device of the present invention preferably includes the following configuration: The protrusion has a linear contact surface that comes into contact with the joining surface.

[0021] In the above configuration, the transport device supports the semiconductor chip with linear protrusions that correspond to the shape of the semiconductor chip, thereby distributing the weight of the semiconductor chip applied to the linear protrusions. This reduces stress at the contact points between the linear protrusions and the semiconductor chip. Furthermore, the transport device reduces the occurrence of microscopic scratches on the bonding surface caused by the linear protrusions and reduces wear on the protrusions. This allows the semiconductor chip to be transported to a predetermined position while being held from the bonding surface side, while suppressing changes in the state of the bonding surface.

[0022] From another viewpoint, it is preferable that the transport device of the present invention includes the following configuration: the stage has an electrode therein, and the stage attracts the semiconductor chip supported by the protrusion to the protrusion by electrostatic attraction force generated by applying a voltage to the electrode.

[0023] In the above-described configuration, the transport device applies a voltage to the electrodes to generate an electrostatic attraction force that attracts the semiconductor chip supported on the stage. The electrostatic attraction force presses the semiconductor chip against the protrusion without directly applying force to the surface of the semiconductor chip, making it less likely to scratch the semiconductor chip. This allows the semiconductor chip to be transported to a predetermined position while being held from the bonding surface side, while suppressing changes in the state of the bonding surface of the semiconductor chip.

[0024] From another viewpoint, it is preferable that the transport device of the present invention includes the following configuration: the stage has an electromagnet inside, and the stage attracts the semiconductor chip supported by the protrusion to the protrusion by magnetic force generated by supplying power to the electromagnet.

[0025] In the above-described configuration, the transport device generates a magnetic force that attracts the semiconductor chip supported on the stage by an electromagnet inside the stage. The magnetic force presses the semiconductor chip against the protrusion without directly applying force to the surface of the semiconductor chip, making it less likely to cause scratches on the semiconductor chip. This allows the semiconductor chip to be transported to a predetermined position while being held from the bonding surface side, while suppressing changes in the state of the bonding surface of the semiconductor chip.

[0026] The terminology used herein is for the purpose of defining particular embodiments only and is not intended to limit the invention.

[0027] As used herein, the use of "including," "comprising," or "having" and variations thereof identify the presence of stated features, steps, operations, elements, components, and / or equivalents thereof, but may include one or more of the steps, operations, elements, components, and / or groups thereof.

[0028] As used herein, the terms "attached," "connected," "coupled," and / or their equivalents are used broadly to encompass both "direct and indirect" attachments, connections, and couplings. Furthermore, "connected" and "coupled" are not limited to physical or mechanical connections or couplings, but can also include direct or indirect electrical connections or couplings.

[0029] Furthermore, in the following description, expressions such as "fix," "connect," "join," and "attach" (hereinafter referred to as "fixing") include not only cases where members are directly fixed to each other, but also cases where members are fixed via other members. In other words, in the following description, expressions such as "fixing" include both direct and indirect fixing of members to each other.

[0030] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. [Semiconductor chips] In this specification, a semiconductor chip refers to an integrated circuit made of a semiconductor such as silicon molded in an insulator. The semiconductor chip is a chip for flip-chip bonding, mounted with the bonding surface (active surface) facing the substrate. The bonding surface of the semiconductor chip is polished. Furthermore, in order to activate-bond at least one of the insulator (e.g., SiO2) or connection terminal on the bonding surface to a corresponding insulator (e.g., SiO2) or connection terminal on the substrate, the bonding surface is subjected to high-level cleaning, plasma treatment, surface activation treatment, etc. This enables activated bonding via functional groups on the bonding surface. [Effects of the Invention]

[0031] According to one embodiment of the present invention, the transport device and the semiconductor chip transport method can transport the semiconductor chip to a predetermined position while holding the semiconductor chip from the bonding surface side, while suppressing changes in the state of the bonding surface of the semiconductor chip. [Brief explanation of the drawings]

[0032] [Figure 1] FIG. 1 is a diagram showing the overall configuration of a transport device according to an embodiment of the present invention. [Figure 2] FIG. 2 is a plan view of a stage in the transfer device according to the embodiment of the present invention. [Figure 3] FIG. 3 is a partial enlarged view of a stage and a protrusion in an implementation form of the present invention. [Figure 4] FIG. 4 is a control block diagram of the transport device according to the embodiment of the present invention. [Figure 5] FIG. 5 is a process diagram of a transfer method for transferring semiconductor chips by a transfer device according to an embodiment of the present invention. [Figure 6] FIG. 6 is a schematic diagram showing a semiconductor chip fixing step and a stage positioning step in the transfer device according to the embodiment of the present invention. [Figure 7] FIG. 7 is a schematic diagram showing a state in which the stage is brought close to the semiconductor chip in the semiconductor chip holding step in the transfer device according to the embodiment of the present invention. [Figure 8] FIG. 8 is a schematic diagram showing a state in which the semiconductor chip and the stage are moved in the Z direction in the semiconductor chip holding step in the transfer device according to the embodiment of the present invention. [Figure 9] FIG. 9 is a schematic diagram showing a semiconductor chip transport process in the transport device according to the embodiment of the present invention. [Figure 10] FIG. 10 is a schematic diagram showing a state in which a semiconductor chip transferred by a transfer device according to an embodiment of the present invention is bonded to a substrate. [Figure 11] FIG. 11 is a schematic diagram showing the relationship between the bonding area of ​​the bonding surface of the semiconductor chip transported by the transport device in the embodiment of the present invention, the contact area with the protrusion, and the support area. [Figure 12] FIG. 12 is a plan view of a stage of a transfer device according to another embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0033] The conveying device according to the present invention will be described below with reference to the drawings. In each drawing, the same parts are designated by the same reference numerals, and the description of those parts will not be repeated. The dimensions of the components in each drawing do not faithfully represent the actual dimensions of the components or the dimensional ratios of the components. In the following description of the embodiments of the present invention, the X and Y directions are assumed to be directions on a horizontal plane. The Y direction is a direction perpendicular to the X direction. The Z direction is a direction perpendicular to the X and Y directions. In this embodiment, the Z direction is defined as the vertical direction. However, this definition of the directions is not intended to limit the orientation of the positioning device in each embodiment during use.

[0034] <Embodiment> <Conveyor device configuration> A conveying device 1, which is an embodiment of a conveying device according to the present invention, will be described with reference to Figures 1 to 4. Figure 1 is an overall configuration diagram of the conveying device 1 in the embodiment of the present invention. Figure 2 is a plan view of a stage 10 in the conveying device 1. Figure 3 is a partially enlarged view of the stage 10 and protrusions 12. Figure 4 is a control block diagram of the conveying device 1.

[0035] As shown in Fig. 1, the conveying device 1 separates the semiconductor chip β attached to the holding sheet α from the holding sheet α and conveys it. The conveying device 1 is provided upstream of a mounting device (not shown). The conveying device 1 has a stage 10, a moving device 20, a camera 30, a semiconductor chip supply unit 40, and a control device 50 (see Fig. 4).

[0036] As shown in FIGS. 1 and 2, a stage 10 holds a semiconductor chip β. The stage 10 is supported by a moving device 20. The stage 10 is configured to be movable to any position on the XY plane by the moving device 20. The stage 10 is also configured to be movable to any position in the Z direction by the moving device 20. The stage 10 has a mounting surface 11 on which the semiconductor chip β is mounted, and has at least three or more protrusions 12, and stage suction holes 13 for attracting the semiconductor chip β to the protrusions 12.

[0037] The multiple protrusions 12 support the semiconductor chip β. The multiple protrusions 12 protrude in a direction perpendicular to the mounting surface 11. The multiple protrusions 12 are arranged at equal intervals in the X direction of the mounting surface 11. Furthermore, a group of the multiple protrusions 12 arranged at equal intervals in the X direction are arranged at equal intervals in the Y direction. In other words, the multiple protrusions 12 are arranged at equal intervals in both the X direction and the Y direction of the mounting surface 11. Therefore, the multiple protrusions 12 are arranged at a uniform density on the mounting surface 11.

[0038] 3, the plurality of protrusions 12 are truncated cone-shaped protrusions that protrude in a direction perpendicular to the mounting surface 11. The tips of the plurality of protrusions 12 are formed into protruding curved surfaces 12a. Therefore, the plurality of protrusions 12 are configured so that the curved surfaces 12a come into contact with the semiconductor chip β.

[0039] As shown in FIG. 1, the stage suction hole 13 is a through-hole that sucks in gas. One opening of the stage suction hole 13 is formed in the mounting surface 11. In this embodiment, four openings are formed in the mounting surface 11 (see FIG. 2). A plurality of protrusions 12 are positioned around one opening of the stage suction hole 13 so as to surround the suction hole. A suction pump 14 is connected to the other opening of the stage suction hole 13 via a pipe. With the semiconductor chip β placed on the protrusions 12, the suction pump 14 sucks in gas between the bonding surface of the semiconductor chip β and the mounting surface 11 through the stage suction hole 13.

[0040] 1 and 4, the moving device 20 moves the stage 10 in the X, Y, and Z directions. The moving device 20 also moves the stage 10 in the Y direction to a placement position where a semiconductor chip β is placed on the stage 10 and to a semiconductor chip supply position of a mounting device (not shown). The moving device 20 has a Z-direction linear motor 21 (see FIG. 4) that moves the stage 10 in the Z direction, an X-direction linear motor 22 that moves the stage 10 and the Z-direction linear motor 21 in the X direction, and a Y-direction linear motor 23 (not shown) that moves the stage 10, the Z-direction linear motor 21, and the X-direction linear motor 22 in the Y direction. Thus, the moving device 20 moves the stage 10 in the X, Y, and Z directions at the placement position and the supply position.

[0041] The camera 30 acquires image data for measuring the position of the semiconductor chip β. The camera 30 is provided on the stage 10. The camera 30 takes an image of the semiconductor chip β at the placement position. The camera 30 transmits the taken image to the control device 50.

[0042] The semiconductor chip supply unit 40 supplies the semiconductor chips β. The semiconductor chip supply unit 40 has a holding sheet fixing table 41 and a push-out pin 42.

[0043] The holding sheet fixing base 41 fixes the holding sheet α that it holds. The holding sheet fixing base 41 has a sheet fixing surface 41a and fixing base suction holes 41b. The sheet fixing surface 41a is a flat surface that supports the holding sheet α. The fixing base suction holes 41b are through holes that suck in gas. One opening of the fixing base suction holes 41b is formed in the sheet fixing surface 41a. The holding sheet fixing base 41 is positioned so that the sheet fixing surface 41a faces the mounting surface 11 of the stage 10. In other words, the holding sheet fixing base 41 is positioned in the Z direction of the stage 10.

[0044] The other opening of the fixing base suction hole 41b is connected to the suction pump 14. With the holding sheet α placed on the holding sheet fixing base 41, the suction pump 14 sucks gas between the holding sheet α and the sheet fixing surface 41a via the fixing base suction hole 41b. As a result, the holding sheet α holding the semiconductor chip β is fixed to the sheet fixing surface 41a of the holding sheet fixing base 41 by suction.

[0045] The ejector pin 42 pushes out the semiconductor chip β attached to the holding sheet α. The ejector pin 42 is a rod-shaped member. When viewed in a direction perpendicular to the sheet fixing surface 41a of the holding sheet fixing base 41, the ejector pin 42 is positioned so as to overlap the holding sheet α and the semiconductor chip β, which are fixed by suction to the holding sheet fixing base 41. The ejector pin 42 is also positioned so that its axis extends in a direction perpendicular to the sheet fixing surface 41a. The ejector pin 42 is configured to be movable in the axial direction relative to the holding sheet fixing base 41 by an ejector pin actuator 43. Therefore, by moving in the axial direction, the ejector pin 42 can push out the semiconductor chip β, which is fixed by suction to the holding sheet fixing base 41 via the holding sheet α, toward the mounting surface 11 of the stage 10 via the holding sheet α.

[0046] 4, the control device 50 controls the suction pump 14, the Z-direction linear motor 21, the X-direction linear motor 22, the Y-direction linear motor 23, and the camera 30. The control device 50 essentially comprises a CPU, a ROM, a RAM, a HDD, and the like connected via a bus. Alternatively, the control device 50 may be configured with a one-chip LSI or the like. The control device 50 stores various programs and data for controlling the operations of the suction pump 14, the Z-direction linear motor 21, the X-direction linear motor 22, the Y-direction linear motor 23, the camera 30, and the ejector pin actuator 43.

[0047] The control device 50 is electrically connected to the suction pump 14. The control device 50 is electrically connected to the Z-direction linear motor 21, the X-direction linear motor 22, the Y-direction linear motor 23, and the ejector pin actuator 43. The control device 50 is electrically connected to the camera 30.

[0048] The control device 50 sends a control signal to the suction pump 14 to start or stop the suction pump 14. The control device 50 sends position control signals to the Z-direction linear motor 21, the X-direction linear motor 22, and the Y-direction linear motor 23. The control device 50 sends a control signal to the camera 30 to capture an image. The control device 50 can acquire the X-coordinate and Y-coordinate of the semiconductor chip β based on the image of the semiconductor chip β acquired from the camera 30. The control device 50 can acquire the Z-direction, X-coordinate, and Y-coordinate of the stage 10 using the encoders of the Z-direction linear motor 21, the X-direction linear motor 22, and the Y-direction linear motor 23. The control device 50 can acquire the Z-coordinate of the semiconductor chip β using the encoder of the ejector pin actuator 43.

[0049] <Transportation method> Next, a method for transporting a semiconductor chip β in the transport device 1 will be described with reference to FIGS. 4 to 9. FIG. 5 is a process diagram of the transport method for transporting a semiconductor chip β by the transport device 1. FIG. 6 is a schematic diagram showing a semiconductor chip fixing step S1 and a stage positioning step S2 in the transport device 1. FIG. 7 is a schematic diagram showing a state in which the stage 10 is brought close to the semiconductor chip β in the semiconductor chip holding step S3 in the transport device 1. FIG. 8 is a schematic diagram showing a state in which the semiconductor chip β and the stage 10 are moved in the Z direction in the semiconductor chip holding step S3 in the transport device 1. FIG. 9 is a schematic diagram showing a semiconductor chip transport step S4 in the transport device 1. The method for transporting a semiconductor chip β in the transport device 1 includes a semiconductor chip fixing step S1, a stage positioning step S2, a semiconductor chip holding step S3, and a semiconductor chip transport step S4.

[0050] As shown in FIGS. 4 and 6, in the semiconductor chip fixing step S1 (see FIG. 5), the control device 50 sends a control signal to the suction pump 14 to start suction of the semiconductor chip supply unit 40 (see FIG. 4). The activated suction pump 14 sucks the holding sheet α through the fixing base suction holes 41b of the holding sheet fixing base 41. In this way, the conveying device 1 attracts the holding sheet α holding the semiconductor chip β to the sheet fixing surface 41a of the holding sheet fixing base 41 by the suction force of the suction pump 14. As a result, the semiconductor chip β is fixed to the sheet fixing surface 41a via the holding sheet α.

[0051] In the stage positioning step S2 (see FIG. 5), the control device 50 sends a control signal to the camera 30 to capture an image of the semiconductor chip β fixed to the holding sheet fixing base 41 (see FIG. 4). The camera 30 captures an image of the semiconductor chip β and sends the image to the control device 50. The control device 50 calculates the position of the semiconductor chip β relative to the position of the stage 10 based on the image acquired from the camera 30 (see FIG. 4). The control device 50 sends X-direction and Y-direction position control signals to the X-direction linear motor 22 and the Y-direction linear motor 23 based on the calculated position of the semiconductor chip β. The X-direction linear motor 22 and the Y-direction linear motor 23 move the stage 10 in the X-direction and Y-direction. In this way, the transport device 1 moves the stage 10 to a predetermined position based on the semiconductor chip β fixed to the holding sheet fixing base 41.

[0052] As shown in FIGS. 4 and 7, in the semiconductor chip holding step S3 (see FIG. 5), the control device 50 sends a Z-direction position control signal to the Z-direction linear motor 21 (see FIG. 4). The Z-direction linear motor 21 moves the stage 10 toward the semiconductor chip β. In this way, the transport device 1 positions the stage 10 at a predetermined position relative to the semiconductor chip β. The multiple protrusions 12 contact the bonding surface of the semiconductor chip β at equal intervals in the X and Y directions. At this time, the protrusions 12 do not contact the outer edge β3 of the semiconductor chip β.

[0053] As shown in FIGS. 4 and 8, in the semiconductor chip holding step S3 (see FIG. 5), the control device 50 sends a control signal to the suction pump 14 to start suction of the stage 10 (see FIG. 4). The activated suction pump 14 starts suction on the stage 10. The suction force of the suction pump 14 generates a force pressing the semiconductor chip β against the curved surface 12a of the protrusion 12. The control device 50 sends a Z-direction position control signal to the Z-direction linear motor 21 (see FIG. 4). The Z-direction linear motor 21 moves the stage 10 in a direction that separates the semiconductor chip β from the holding sheet α.

[0054] Furthermore, the control device 50 sends a control signal to the push-out pin actuator 43 to move the push-out pin 42 toward the stage 10 simultaneously with the start of movement of the stage 10 in the Z direction (see FIG. 4). The control device 50 also sends a control signal to the push-out pin actuator 43 to move the push-out pin 42 toward the stage 10 at the same speed as the movement speed of the stage 10 in the Z direction (see FIG. 4). Therefore, the push-out pin 42 moves in synchronization with the movement of the stage 10 in the Z direction, at the same timing, speed, and direction. The push-out pin 42 separates the holding sheet α holding the semiconductor chip β from the holding sheet fixing base 41 in accordance with the movement of the stage 10 in the Z direction. Furthermore, the push-out pin 42 peels the semiconductor chip β from the holding sheet α while moving the semiconductor chip β in the Z direction.

[0055] The semiconductor chip β, fixed to the holding sheet fixing base 41 via the holding sheet α, is pushed in the Z direction by the pusher pins 42 while being sucked onto the stage 10. The semiconductor chip β moves in the Z direction together with the stage 10 while being peeled off from the holding sheet α while in contact with the protrusions 12 of the stage 10. The transport device 1 positions the stage 10 at a predetermined position in the Z direction relative to the holding sheet α. As a result, the semiconductor chip β is held on the stage 10 in a state where it is completely separated from the holding sheet α. The transport device 1 holds the semiconductor chip β by the suction force of the suction pump 14.

[0056] As shown in FIGS. 4 and 9, in the semiconductor chip transport step S4 (see FIG. 5), the control device 50 sends a position control signal to the Y-direction linear motor 23 (see FIG. 4). The Y-direction linear motor 23 moves the stage 10 toward a mounting device (not shown). The semiconductor chip β is moved together with the stage 10 while being held by the frictional force generated between the semiconductor chip β and the protrusions 12 due to the suction of the suction pump 14. The suction of the holding sheet α by the suction pump 14 is also stopped. In this way, the transport device 1 transports the semiconductor chip β from the placement position to the supply position for the mounting device.

[0057] <Micro-contact support of semiconductor chips> The supported state of the semiconductor chip β will be described with reference to Figures 9 to 11. Figure 10 is a schematic diagram showing the state in which the semiconductor chip β transported by the transport device 1 is bonded to the substrate γ. Figure 11 is a schematic diagram showing the relationship between the bonding area A3 of the bonding surface of the semiconductor chip β transported by the transport device 1, the contact area A1 where the protrusion 12 comes into contact, and the supported area A2.

[0058] As shown in Figure 9, the insulator, which is part of the connection terminal and insulator at the bonding surface of the semiconductor chip β, is activated as a chip activated surface β1 (the dark, light-shaded area). The curved surface 12a (Figure 3) of the protrusion 12 comes into contact with the chip activated surface β1. The chip activated surface β1 loses its activity due to contact with the curved surface 12a, and changes to an inactive surface β2 (the light, light-shaded area).

[0059] 10, when the outer edge β3 and the defective activation surface β2 of the semiconductor chip β are surrounded by a chip activation surface β1 whose area is sufficiently larger than the area of ​​the defective activation surface β2, or when the area of ​​the defective activation surface β2 is sufficiently small, the semiconductor chip β can suppress a decrease in bonding strength by activated bonding between the surrounding chip activation surface β1 and the substrate activation surface γ1 (dark light gray part) of the substrate γ. Furthermore, the bonding of the defective activation surface β2 to the substrate activation surface γ1 is promoted by the action of the substrate activation surface γ1 through annealing treatment.

[0060] As shown in FIG. 11, the contact area A1 between the flat chip activation surface β1 and one curved surface 12a (see FIG. 4) is calculated using the well-known Hertz contact theory, etc. In this embodiment, the stage 10 supports the semiconductor chip β with 25 protrusions 12 (see FIG. 2). The stage 10 supports the semiconductor chip β with a support area A2, which is the sum of the contact areas A1 per protrusion 12 multiplied by 25. In this case, the ratio of the support area A2, which is the incomplete activation surface β2, to the bonding area A3, which is the chip activation surface β1 of the semiconductor chip β, is in the range of 0.0001 percent or more and less than 5 percent. The contact area A1 is 0.000001 mm 2 More than 0.01mm 2 It is preferable that the range is less than 10 ...

[0061] In this way, the transfer device 1 is configured so that the ratio of the support area A2 to the bonding area A3 falls within a predetermined range, thereby making it possible to compensate for the decrease in bonding strength due to the insufficiently activated surface β2 with the bonding strength of the chip activated surface β1. Also, by configuring the support area A2 to fall within a predetermined range, the transfer device 1 promotes activation bonding of the insufficiently activated surface β2 with the substrate activated surface γ1 of the substrate γ.

[0062] Furthermore, the multiple protrusions 12 do not contact the outer edge β3 (edge) where particles, microcracks, etc. are likely to occur due to contact (see FIG. 8). Therefore, even if the transport device 1 brings the protrusions 12 into contact with the semiconductor chip β, particles, cracks, etc. are unlikely to occur. Therefore, even if the transport device 1 brings the protrusions 12 into contact with the semiconductor chip β, it is possible to maintain the quality of the semiconductor chip β and the quality of the activated bond between the semiconductor chip β and the substrate γ.

[0063] As described above, the transfer device 1 and transfer method hold the semiconductor chip β from the bonding surface side without contacting the protrusions 12 with 95% or more of the bonding surface of the semiconductor chip β, including the outer edge β3 where particles are likely to be generated. Therefore, the transfer device 1 activates and bonds 95% or more of the chip activated surface β1 that is not in contact with the protrusions 12 to the substrate activated surface γ1 of the substrate γ while suppressing particle generation from the outer edge β3 of the semiconductor chip β. This compensates for the influence of the insufficiently activated surface β2, which accounts for less than 5% of the bonding surface. Furthermore, because the transfer device 1 supports the semiconductor chip β from the bonding surface side with the protrusions 12 in contact with the chip activated surface β1, the semiconductor chip β is less likely to become misaligned with respect to the stage 10 during transfer of the semiconductor chip β.

[0064] The transport device 1 presses the semiconductor chip β against the protrusions 12 by sucking in the gas. A frictional force proportional to the suction force of the gas is generated between the protrusions 12 and the contact surface of the semiconductor chip β. Therefore, even if the transport device 1 supports the semiconductor chip β in an area less than 5% of the area of ​​the bonding surface, the frictional force prevents the semiconductor chip β from shifting from the bonding surface side. This makes it possible to transport the semiconductor chip β to a predetermined position while holding it from the bonding surface side, while suppressing changes in the state of the chip activation surface β1 of the semiconductor chip β.

[0065] Furthermore, the contact surface of the protrusion 12 is formed as a curved surface 12a or a flat surface. That is, the protrusion 12 distributes the stress generated between the curved surface 12a and the semiconductor chip β when the protrusion 12 contacts the semiconductor chip β to three or more protrusions, and suppresses the concentration of stress on the curved surface 12a. Therefore, the transport device 1 suppresses the generation of fine scratches on the bonding surface by the protrusion 12 and the wear of the protrusion 12.

[0066] Furthermore, since the transport device 1 supports the semiconductor chip β by a plurality of equally spaced protrusions 12, the weight of the semiconductor chip β applied to each protrusion can be reduced. Therefore, the transport device 1 prevents the protrusions 12 from causing minute scratches on the bonding surface and also reduces wear of the protrusions 12. This makes it possible to transport the semiconductor chip β to a predetermined position while holding it from the bonding surface side, while suppressing changes in the state of the chip activation surface β1 of the semiconductor chip β.

[0067] <Modifications of the embodiment> A transfer device 1A, which is a modified example of the transfer device 1, will be described with reference to Fig. 12. The transfer device 1A differs in that it has linear protrusions 15. Fig. 12 is a plan view of a stage 10 of the transfer device 1A in another embodiment of the present invention.

[0068] As shown in FIG. 12 , the stage 10 has linear protrusions 15 on the mounting surface 11 on which the semiconductor chip β is placed. The linear protrusions 15 support the semiconductor chip β. The linear protrusions 15 protrude in a direction perpendicular to the mounting surface 11. The linear protrusions 15 have a plurality of X-direction protrusions 15x extending in the X direction of the mounting surface 11 and a plurality of Y-direction protrusions 15y extending in the Y direction. In this embodiment, the plurality of X-direction protrusions 15x and the plurality of Y-direction protrusions 15y are arranged in a rectangular shape that follows the shape of the semiconductor chip β when viewed in the direction perpendicular to the mounting surface 11.

[0069] The multiple X-direction protrusions 15x and the multiple Y-direction protrusions 15y are each a truncated cone-shaped protrusion that protrudes in a direction perpendicular to the mounting surface 11 when viewed in a direction orthogonal to the extension direction. The tips of the X-direction protrusions 15x and the Y-direction protrusions 15y are formed into protruding curved surfaces.

[0070] The transport device 1A supports the semiconductor chip β by, for example, distributing the weight of the semiconductor chip β applied to the protrusions 15 by supporting the semiconductor chip β using linear protrusions 15 that conform to the shape of the semiconductor chip β. This reduces stress generated at the contact points between the linear protrusions 15 and the semiconductor chip β. Furthermore, the transport device 1A reduces the occurrence of fine scratches on the bonding surface due to the protrusions 15 and reduces wear of the protrusions 15. This allows the semiconductor chip β to be transported to a predetermined position while being held from the bonding surface side, while reducing changes in the state of the bonding surface of the semiconductor chip β.

[0071] <Other embodiments> In the above-described configuration, the multiple protrusions 12 are truncated cone-shaped protrusions protruding perpendicular to the mounting surface 11. The contact surfaces of the protrusions 12 are formed on a curved surface 12a. However, the protrusions may have any shape that protrudes from the mounting surface, such as a columnar or hemispherical shape. The contact surfaces of the protrusions may also be formed on a flat surface. That is, the protrusions contact the semiconductor chip via a flat surface having a predetermined area. The protrusions suppress stress concentration on the contact surface. Therefore, the transport device suppresses the generation of fine scratches on the bonding surface by the protrusions and suppresses wear of the protrusions. This allows the semiconductor chip to be transported to a predetermined position while being held from the bonding surface side while suppressing changes in the state of the bonding surface of the semiconductor chip.

[0072] The conveying device 1 holds the semiconductor chip β in a state where the semiconductor chip β is pressed against the protrusion 12 by the suction force of the suction pump 14. However, the conveying device may be configured to attract the semiconductor chip supported on the protrusion to the protrusion by electrostatic adsorption. The conveying device has an electrode inside the stage. An electrostatic adsorption force is generated on the stage by applying a voltage to the electrode. The semiconductor chip β supported on the protrusion is pressed against the protrusion by the electrostatic adsorption force.

[0073] The transport device may be configured to attract the semiconductor chip supported by the protrusion to the protrusion by magnetic force. The transport device has an electromagnet inside the stage. A magnetic force is generated on the stage by supplying power to the electromagnet. Thus, the semiconductor chip β supported by the protrusion is pressed against the protrusion by magnetic force.

[0074] In the above-described configuration, the transport device applies a voltage to the electrodes to generate an electrostatic or magnetic force that attracts the semiconductor chip supported on the stage. The electrostatic or magnetic force presses the semiconductor chip against the protrusion without directly applying a force to the surface of the semiconductor chip, making it less likely to cause scratches on the semiconductor chip than when a force is applied directly to the semiconductor chip by gas suction. This allows the semiconductor chip to be transported to a predetermined position while being held from the bonding surface side, while suppressing changes in the state of the bonding surface of the semiconductor chip.

[0075] The transport device may be configured to press the semiconductor chip supported by the protrusion against the protrusion by a mechanical gripping device. The transport device has a gripping device on a stage. The semiconductor chip β is transported while being sandwiched between the gripping device and the protrusion.

[0076] The transport device 1 supports the semiconductor chip β using a stage 10 on which multiple protrusions 12 are arranged at equal intervals. However, the multiple protrusions on the stage may be arranged at any position based on the shape of the semiconductor chip β, the position and size of the stage suction holes, etc. For example, the multiple protrusions may be configured so that their positions and spacing are adjusted based on the distribution of force applied to the semiconductor chip β. In this case, the protrusions are arranged so that the spacing between them around the stage suction holes is narrower than the spacing between them in other areas. By arranging the multiple protrusions in this manner, the force applied to the contact surface between the multiple protrusions and the semiconductor chip β is kept within a certain range. Furthermore, the multiple protrusions may be configured so that their positions and spacing are adjusted based on the wiring of the semiconductor chip β.

[0077] The conveying device 1 first moves the stage 10 in the Z direction to bring it closer to the semiconductor chip β. However, the conveying device may be configured to first bring the semiconductor chip β held by the holding sheet α closer to the base. The conveying device may be configured to push the semiconductor chip β held by the holding sheet α toward the stage using, for example, a push rod.

[0078] The conveying device 1 conveys the semiconductor chip β to be mounted on the substrate γ with the bonding surface thereof supported by the protrusions 12 of the stage 10. However, the conveying device may be configured to convey the integrated package in which multiple semiconductor chips are integrated and molded on a package substrate with the bonding surface thereof supported by multiple protrusions. Also, the conveying device may convey the substrate γ with the bonding surface thereof supported by the protrusions 12 of the stage 10.

[0079] The transport device 1 moves the stage 10 in the X, Y, and Z directions using a Z-direction linear motor 21, an X-direction linear motor 22, and a Y-direction linear motor 23. However, the stage 10 may be configured to be moved by other actuators such as a servo motor.

[0080] The transport device 1 moves the stage 10 in the X, Y, and Z directions based on position information from encoders possessed by the Z-direction linear motor 21, the X-direction linear motor 22, and the Y-direction linear motor 23. However, the transport device may be configured to detect the positions of the stage in the X, Y, and Z directions using a scale such as a linear scale.

[0081] The conveying device 1 holds the semiconductor chip β by a stage 10 positioned below the semiconductor chip β with the bonding surface of the semiconductor chip β facing downward. In other words, the conveying device 1 is configured to receive the semiconductor chip β by a pick-down method in which the semiconductor chip β is pushed toward the stage 10 from above the stage 10 by an ejector pin 42. However, the conveying device may also be configured to hold the semiconductor chip β by a stage positioned above the semiconductor chip β with the bonding surface of the semiconductor chip β facing upward. In other words, the conveying device may also be configured to receive the semiconductor chip β by a pick-up method in which the semiconductor chip β is pushed toward the stage from below by an ejector pin.

[0082] The stage 10 sucks the four corners of the semiconductor chip β by means of four stage suction holes 13. However, the stage suction holes may be located at any position and in any number so long as the semiconductor chip β can be held by the protrusions.

[0083] The semiconductor chips β are adhesively held on the holding sheet α, but the semiconductor chips β may be supplied to the conveying device in a state where they are housed in a tray or the like.

[0084] Although the embodiments of the present invention have been described above, the above-described embodiments are merely examples for carrying out the present invention. Therefore, the present invention is not limited to the above-described embodiments, and it is possible to appropriately modify the above-described embodiments within the scope of the spirit of the present invention. [Explanation of symbols]

[0085] 1. Conveyor device 10 stages 11 Placement surface 12 Protrusion 12a Curved surface 13 Stage suction hole 14 Suction pump 15 Linear protrusions 15x X direction protrusion 15y Y direction protrusion 20 Mobile Device 21 Z-direction linear motor 22 X-direction linear motor 23 Y-direction linear motor 30 Camera 40 Semiconductor Chip Supply Department 41 Retaining sheet fixing stand 41a Sheet fixing surface 41b Fixed base suction hole 42 ejector pin 43 Ejector pin actuator 50 Control device S1 Semiconductor chip fixing process S2 Stage positioning process S3 Semiconductor chip holding process S4 Semiconductor chip transport process α Retention Sheet β Semiconductor chip β1 Chip activation surface β2 activation defective surface β3 outer edge γ substrate γ1 substrate activation surface A1 Contact area A2 Support area A3 joint area

Claims

1. A transport device for transporting semiconductor chips, a stage that holds the semiconductor chip on a mounting surface; a drive unit that moves the stage, The stage is a protrusion on the mounting surface that supports the semiconductor chip in a state of contact with the bonding surface of the semiconductor chip; The protrusion is The adhesive is configured to contact a portion of the joining surface excluding the outer edge portion, and the total area of ​​the portion in contact with the joining surface is less than 5% of the area of ​​the joining surface. Conveying device.

2. 2. The conveying device according to claim 1, The stage is a suction hole that opens to the mounting surface and sucks gas; attracting the semiconductor chip to the protrusion by suctioning gas between the mounting surface and the bonding surface of the semiconductor chip supported by the protrusion; Conveying device.

3. 3. The conveying device according to claim 1, The protrusion is At least two or more protrusions having curved or flat surfaces that come into contact with the joining surface. Conveying device.

4. 3. The conveying device according to claim 1, The protrusion is A plurality of protrusions arranged at equal intervals in a predetermined direction. Conveying device.

5. 3. The conveying device according to claim 1, The protrusion is A protrusion having a linear contact surface that contacts the joining surface. Conveying device.

6. 2. The conveying device according to claim 1, The stage is It has an electrode inside, applying a voltage to the electrode to generate an electrostatic attraction force, which attracts the semiconductor chip supported by the protrusion to the protrusion; Conveying device.

7. 2. The conveying device according to claim 1, The stage is It has an electromagnet inside, The semiconductor chip supported on the protrusion is attracted to the protrusion by a magnetic force generated by supplying power to the electromagnet. Conveying device.

8. A method for transporting semiconductor chips, comprising: transporting the semiconductor chip in a state in which the semiconductor chip is supported by an area that is less than 5% of the area of ​​the bonding surface of the semiconductor chip; Transportation method.

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