Conductor wire connecting method, half strip jig, connecting device, and electronic device

Abstract

Provided are a conductor wire connection method that enables easy and reliable soldering of a conductor wire to an electrode on a substrate, a half-strip jig for exposing the conductor wire at a portion of the longitudinal direction of an insulating coated electric wire, a connection device equipped with the half-strip jig, and an electronic device equipped with a substrate on which a plurality of electrodes are formed and a plurality of conductor wires soldered to the plurality of electrodes. [Solution] A conductor wire connecting method for connecting a conductor wire (31) to an electrode (20) formed on a substrate (2) includes an arrangement step in which the conductor wire (31) is arranged on the electrode (20) while tension is applied to the conductor wire (31), and a soldering step in which the conductor wire (31) is pressed against the substrate (2) side by a heater chip (7) to solder the conductor wire (31) to the electrode (20).

Description

[Technical Field]

[0001] The present invention relates to a conductor wire connecting method for connecting a conductor wire to an electrode formed on a substrate, a half-strip jig for exposing the conductor wire in a portion of the longitudinal direction of an insulated coated electric wire, a connection device equipped with the half-strip jig, and an electronic device in which multiple conductor wires are connected to multiple electrodes on a substrate. [Background technology]

[0002] Conventionally, electronic devices that are required to be small, such as medical catheters inserted into the human body, have had conductor wires soldered to a plurality of electrodes formed at a narrow pitch on a substrate. Methods for soldering conductor wires to a plurality of electrodes formed at a narrow pitch include those described in Patent Documents 1 and 2, for example.

[0003] The method described in Patent Document 1 involves aligning a plurality of micro multi-core cables on a substrate on which a rectangular solid pad is formed, soldering the central conductors of the micro multi-core cables to the solid pad, and then cutting the central conductors together with the solid pad by irradiating them with laser light.The method described in Patent Document 2 involves arranging a plurality of insulated electric wires in a predetermined arrangement direction, removing the insulating coating from a portion of the longitudinal direction of each insulated electric wire to expose the core wire, and soldering the core wires to electrode pads on the substrate while applying longitudinal tension to the plurality of insulated electric wires. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2003-180015 [Patent Document 2] Japanese Patent Application Publication No. 2022-189648 Summary of the Invention [Problem to be solved by the invention]

[0005] In the method described in Patent Document 1, if the twist tendency of the central conductor causes it to bend significantly on the solid pad, there is a risk that the length of the portion of the central conductor soldered to the solid pad after it is cut will be shortened. Also, in the method described in Patent Document 2, while bending of the core wire can be reduced by applying tension to the insulated wire, a gap corresponding to at least the thickness of the insulating coating is created between the board and the core wire, which means that, for example, cream solder must be applied to a thickness greater than the thickness of the insulating coating.

[0006] Therefore, an object of the present invention is to provide a conductor wire connection method that enables easy and reliable soldering of a conductor wire to an electrode on a circuit board.An object of the present invention is also to provide a half-strip jig for exposing a conductor wire at a portion of its longitudinal direction in an insulated electric wire in which the conductor wire is covered with an insulator, a connection device including the half-strip jig, and an electronic device including a circuit board on which multiple electrodes are formed and multiple conductor wires soldered to the multiple electrodes. [Means for solving the problem]

[0007] In order to achieve the above-mentioned object, the present invention provides a method for connecting a conductor wire to an electrode formed on a substrate, the conductor wire connecting method comprising: an arrangement step of arranging the conductor wire on the electrode while applying tension to the conductor wire; and a soldering step of pressing the conductor wire against the substrate using a heating element to solder the conductor wire to the electrode.

[0008] Furthermore, in order to achieve the above-mentioned object, the present invention provides a half-strip jig for collectively half-stripping a plurality of insulated electric wires, each of which has a conductor wire covered with an insulator, the half-strip jig having a pair of comb-shaped bodies with a plurality of slits formed therein, each of which has a width greater than the diameter of the conductor wire and smaller than the outer diameter of the insulator, and the conductor wires are exposed between the pair of comb-shaped bodies by inserting the conductor wires into the slits and then separating the pair of comb-shaped bodies along the longitudinal direction of the conductor wires.

[0009] In addition, in order to achieve the above-mentioned object, the present invention provides a connection device having the above-mentioned half strip jig and a heating element that presses and solders the multiple conductor wires between the pair of comb-shaped bodies against multiple electrodes, respectively.

[0010] In addition, in order to achieve the above-mentioned object, the present invention provides an electronic device comprising a substrate on which a plurality of electrodes are formed, and a plurality of conductor wires soldered to the plurality of electrodes, each of the tip ends of the plurality of conductor wires being curved so as to rise above the substrate. [Effects of the Invention]

[0011] The conductor wire connecting method of the present invention allows conductor wires to be soldered to electrodes on a circuit board easily and reliably. Furthermore, the half-strip jig and connection device of the present invention allow conductor wires, even if covered with an insulator, to be easily exposed from the insulator and soldered. Furthermore, the electronic device of the present invention can be manufactured by applying tension to multiple conductor wires and soldering them while pressing them against multiple electrodes on a circuit board, allowing conductor wires to be soldered to electrodes on a circuit board easily and reliably. [Brief explanation of the drawings]

[0012] [Figure 1] 1(a) is a perspective view showing a part of an electronic device according to an embodiment of the present invention, and FIG. 1(b) is a cross-sectional view taken along line AA in FIG. [Figure 2] 1(a) is a side view of a single electric wire viewed from a direction perpendicular to the longitudinal direction, and FIG. 1(b) is a cross-sectional view of the electric wire. [Figure 3] FIG. 2 is a plan view of a substrate in the periphery of a plurality of electrodes. [Figure 4] FIG. 10 is a diagram showing a configuration of a pair of comb-shaped bodies of a half strip jig used in a half strip process. [Figure 5] FIG. 2 is a perspective view showing a plurality of electric wires before a half stripping process is performed. [Figure 6]FIG. 1 is a perspective view showing a first stage of a half strip process. [Figure 7] FIG. 10 is a perspective view showing a second stage of the half strip process. [Figure 8] FIG. 10 is a perspective view showing a third stage of the half strip process. [Figure 9] FIG. 10 is a cross-sectional view showing a plurality of electric wires together with a connecting device in an arrangement step. [Figure 10] FIG. 2 is a perspective view showing a substrate, a solder foil, a protective material, and a plurality of electric wires. [Figure 11] 1(a) is an explanatory view showing a soldering step, and FIG. 1(b) is a cross-sectional view taken along line BB in FIG. [Figure 12] 1A is an explanatory view showing the removing step, and FIG. 1B is an explanatory view showing the cutting tool, the moving member, the contact member, the support member, and the clamping member used in the removing step. [Figure 13] 10(a) is a perspective view showing a heater chip as a heating element according to a modified example, and FIG. 10(b) is a perspective view showing the heater chip and a plurality of electric wires. [Figure 14] 10(a) and 10(b) are diagrams showing a soldering process using a heater chip according to a modified example, and a connection device having a heater chip 70. FIG. [Figure 15] 14(a) is a cross-sectional view taken along line CC in FIG. 14(a), and FIG. 14(b) is a cross-sectional view taken along line DD in FIG. [Figure 16] 10 is a cross-sectional view showing a conductor wire soldered to an electrode on a substrate using a heater chip according to a modified example. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0013] [Embodiment Mode] Fig. 1(a) is a perspective view showing a part of an electronic device 1 according to an embodiment of the present invention. Fig. 1(b) is a cross-sectional view taken along line AA in Fig. 1(a). The electronic device 1 is a product whose commercial value is enhanced by its high integration and small size, such as an endoscope or a wearable terminal, and includes a substrate 2 and a plurality of electric wires 3.

[0014] A plurality of electrodes 20 are formed on the substrate 2. The electric wire 3 is an insulated-coated electric wire having a conductor wire 31 and an insulator 32 that coats the conductor wire 31. The conductor wires 31 of the plurality of electric wires 3 are connected to the plurality of electrodes 20 by solder 4. In this embodiment, ten electrodes 20 are formed on the substrate 2, and the conductor wires 31 are soldered to each of the ten electrodes 20. The substrate 2 is a flexible substrate having a flexible, flat-plate-shaped substrate 21 made of polyimide or the like, and has a conductive layer 22 on which a wiring pattern of a predetermined shape is formed, and a coverlay 23 that covers the substrate 21 and the conductive layer 22.

[0015] As shown in FIG. 1(b), the tip portion 311 of each conductor wire 31 of the multiple electric wires 3 is curved so as to rise above the substrate 2. Furthermore, the tip surface 311a of each of the multiple conductor wires 31 is located on the coverlay 23 of the substrate 2. Here, the tip portion 311 refers to the portion of the conductor wire 31 near the tip surface 311a. The shape of the tip portion 311 of the conductor wire 31 allows the conductor wire 31 to be connected to the electrode 20 by a connection method described below.

[0016] FIG. 2(a) is a side view of one electric wire 3 viewed from a direction perpendicular to the longitudinal direction. FIG. 2(b) is a cross-sectional view of the electric wire 3. The conductor wire 31 is made of, for example, copper or a copper alloy. In this embodiment, the conductor wire 31 is a twisted wire formed by twisting together a plurality of elemental wires 310 in a spiral shape. However, the conductor wire 31 may also be a solid wire. In the example shown in FIG. 2(a), the conductor wire 31 is formed by twisting together seven elemental wires 310, but the number of elemental wires forming the conductor wire 31 is not limited to this and may be six or less or eight or more. The insulator 32 is made of, for example, a fluororesin or polyester resin. The conductor diameter D1, which is the diameter of the conductor wire 31, is, for example, 0.02 mm or more and 0.10 mm or less. The outer diameter D2 of the insulator 32 is, for example, 0.03 mm or more and 0.15 mm or less. 1(a) and 1(b) and the drawings described later, the conductor wire 31 is shown as a single conductor, and the individual wires 310 are not shown.

[0017] FIG. 3 is a plan view of the substrate 2 in the periphery of the multiple electrodes 20. Rectangular openings 230 are formed in the coverlay 23, and portions of the conductive layer 22 exposed through these openings 230 form the electrodes 20. When viewed perpendicularly to the substrate 2, each electrode 20 has a rectangular shape that is long in the longitudinal direction of the electric wires 3. The pitch P of the multiple electrodes 20 is, for example, 0.20 mm or less. The conductive layer 22 electrically connects the multiple conductor lines 31 to electronic components (not shown) mounted on the substrate 2. Each electric wire 3 is connected to the electrode 20 of the substrate 2 as a signal line for transmitting an electric signal or as a power line for supplying operating power to the electronic components.

[0018] Next, a connection method for connecting conductor wires 31 to electrodes 20 on a substrate 2 will be described. This connection method includes a half-stripping step in which multiple insulators 32 covering the multiple conductor wires 31 are half-stripped; an arrangement step in which multiple conductor wires 31 are placed on electrodes 20 while being tensioned; a soldering step in which multiple conductor wires 31 placed in the arrangement step are pressed against the substrate 2 using a heating element to solder the conductor wires 31 to the electrodes 20; and a removal step in which the conductor wires 31 are removed from the distal end of the portion soldered to the electrode 20. The half-stripping step is performed prior to the arrangement step. The removal step is performed after the soldering step. Here, "half-stripping" refers to exposing a longitudinal portion of the conductor wire 31 from the insulator 32 while maintaining the end of the conductor wire 31 covered by the insulator 32 as it was before the arrangement step.

[0019] 4 is a structural diagram showing a pair of comb-shaped bodies 5A and 5B of a half-strip jig 5 used in the half-strip process. One comb-shaped body 5A and the other comb-shaped body 5B have the same structure. The comb-shaped bodies 5A and 5B are flat plates with multiple slits 50 formed therein, and protrusions 51 are provided between adjacent pairs of slits 50. In this embodiment, the comb-shaped bodies 5A and 5B are rectangular, and the slits 50 extend perpendicularly to the long side from one end face 5a in the short side direction. The width W of the slit 50 is greater than the conductor diameter D1 of the conductor wire 31 and smaller than the outer diameter D2 of the insulator 32.

[0020] FIG. 5 is a perspective view showing a plurality of electric wires 3 before the half stripping process. FIG. 6 is a perspective view showing a first stage of the half stripping process. FIG. 7 is a perspective view showing a second stage of the half stripping process. FIG. 8 is a perspective view showing a third stage of the half stripping process. In this embodiment, the half stripping process is performed with the pair of comb-shaped bodies 5A, 5B fixed to supports 61, 62, respectively. The insulators 32 of the plurality of electric wires 3 are fixed to the supports 61, 62 by tapes 63, 64, respectively. The tapes 63, 64 function as fixing members that fix the plurality of electric wires 3 to the supports 61, 62 at different positions in the longitudinal direction.

[0021] In the first stage of the half-stripping process, a portion of the insulator 32 of each of the multiple electric wires 3 is removed by irradiation with laser light to form a removed portion 30. A CO2 laser beam emitted from a CO2 laser light source can be suitably used as the laser light. In the second stage of the half-stripping process, the multiple conductor wires 31 in the removed portion 30 are inserted through the multiple slits 50 of the pair of comb-shaped bodies 5A, 5B. In the third stage of the half-stripping process, the multiple conductor wires 31 are inserted through the multiple slits 50 of the pair of comb-shaped bodies 5A, 5B, and the pair of comb-shaped bodies 5A, 5B are moved apart along the longitudinal direction of the multiple electric wires 3, thereby half-stripping the multiple insulators 32 and exposing the conductor wires 31 between the pair of comb-shaped bodies 5A, 5B.

[0022] In the first step, the insulator 32 of each of the multiple electric wires 3 is divided into a first portion 321 and a second portion 322 by the removed portion 30. In the second step, a pair of comb-shaped bodies 5A and 5B is disposed between the first portion 321 and the second portion 322. In the third step, one comb-shaped body 5B is moved relative to the other comb-shaped body 5A to widen the gap between the first portion 321 and the second portion 322. When the half-strip process is complete, the gap between the pair of comb-shaped bodies 5A and 5B is shorter than the length of the second portion 322, and a portion of the second portion 322 in the longitudinal direction is covered with the conductor wire 31.

[0023] 9 is a cross-sectional view showing the plurality of electric wires 3 together with the connection device 10 in the placement process. In the placement process, the plurality of conductor wires 31 in a state in which tension is applied between the pair of comb-shaped bodies 5A, 5B are placed on the plurality of electrodes 20 of the substrate 2. Also, in the placement process, each conductor wire 31 is covered with an insulator 32 on both longitudinal sides of the portion to be soldered to the electrode 20, and tension is applied to the conductor wire 31 by the frictional force between the conductor wire 31 and the insulator 32. This prevents the conductor wire 31 from bending, and the conductor wire 31 becomes straight between the pair of comb-shaped bodies 5A, 5B.

[0024] The connection device 10 includes a half-strip jig 5 and supports 61 and 62, a heater chip 7 as a heating element, and a support base 8. The support base 8 is configured by combining a first support portion 81 and a second support portion 82 made of, for example, metal with an insulating base 83 that has higher heat resistance and insulating properties than the first support portion 81 and the second support portion 82. The insulating base 83 is made of, for example, heat-resistant glass. The substrate 2 is placed on the support base 8 so that the multiple electrodes 20 are located above the insulating base 83. A first portion 321 of the insulator 32 is located above the first support portion 81, and a second portion 322 of the insulator 32 is located above the second support portion 82.

[0025] In the placement step, solder foil 40 is placed between the plurality of electrodes 20 on the substrate 2 and the plurality of conductor wires 31 between the pair of comb-shaped bodies 5A, 5B, and a protective material 90 is placed between the coverlay 23 on the substrate 2 and the plurality of conductor wires 31 between the pair of comb-shaped bodies 5A, 5B. The protective material 90 is made of, for example, resin or rubber, and prevents the substrate 2 from being scratched in the removal step.

[0026] 10 is a perspective view showing the substrate 2, the solder foil 40, the protective material 90, and the plurality of electric wires 3 with the conductor wires 31 exposed. The solder foil 40 is approximately the same size as the openings 230 of the coverlay 23, and its thickness T is, for example, 0.1 mm or less. The protective material 90 is disposed between the plurality of electrodes 20 and the second portion 322 of the insulator 32 in the longitudinal direction of the plurality of electric wires 3. The protective material 90 is strip-shaped and extends in the arrangement direction of the plurality of electrodes 20, and its length L1 in the longitudinal direction is longer than the length L2 of the openings 230 of the coverlay 23 in the same direction.

[0027] FIG. 11(a) is an explanatory diagram showing the soldering process. FIG. 11(b) is a cross-sectional view taken along line BB in FIG. 11(a). In the soldering process, a heater chip 7 presses multiple conductor wires 31 between a pair of comb-shaped bodies 5A and 5B toward multiple electrodes 20. The heater chip 7 generates heat when current is applied, melting the solder foil 40. Some of the molten solder adheres to the coverlay 23 and base material 21, but the coverlay 23 and base material 21 repel the molten solder, so the liquid solder adheres to the electrodes 20 and conductor wires 31. The liquid solder solidifies as the temperature drops while the heater chip 7 presses the conductor wires 31 against the electrodes 20, becoming solid solder 4.

[0028] 12(a) is an explanatory diagram showing the removal step. In the removal step, a plurality of conductor wires 31 are sandwiched between a protective material 90 and a cutting tool 91, and the cutting tool 91 is pressed against the protective material 90 to cut the plurality of conductor wires 31 all at once. As a result, as shown in FIGS. 1(a) and 1(b), the tip portions 311 of the plurality of conductor wires 31 are curved so as to rise above the substrate 2.

[0029] Figure 12(b) is an explanatory diagram showing a moving member 92 that moves relative to the substrate 2 together with the cutting tool 91, a contact member 93 against which the moving member 92 abuts when the cutting tool 91 bites into the protective material 90, a support member 94 that supports the cutting tool 91 and moves in a direction perpendicular to the substrate 2, and a clamping member 95 that clamps the cutting tool 91 between itself and the support member 94.

[0030] In the removal step, a moving member 92 and a contact member 93 are used, and the moving member 92 contacts the contact member 93 to restrict movement of the cutting tool 91 toward the substrate 2. Specifically, the position of the moving member 92 relative to the cutting tool 91 is adjusted in advance so that the moving member 92 contacts the contact member 93 when the cutting tool 91 has dug into the protective material 90 by a predetermined amount (for example, about 10 μm), and the moving member 92 contacts the contact member 93 to restrict further movement of the cutting tool 91. As the contact member 93, for example, a part of the support base 8 can be used, but the contact member 93 may also be separate from the support base 8.

[0031] To adjust the position of the movable member 92, for example, a micrometer head that moves a spindle back and forth by rotating a thimble can be used. In this case, the spindle of the micrometer head or a member that moves axially together with the spindle is used as the movable member 92, and the position of the movable member 92 is adjusted every time the cutting tool 91 is replaced. As a result, when a used cutting tool 91 is removed from the support member 94 and replaced with a new one, even if the position of the cutting tool 91 relative to the support member 94 is slightly shifted, the cutting position of the cutting tool 91 can be adjusted to an appropriate position that can reliably cut the multiple conductor wires 31 and does not damage the substrate 2.

[0032] After the plurality of conductor wires 31 are cut in the removal step, the conductor wires 31 beyond the cut portion and the second portion 322 of the insulator 32 are removed from the substrate 2 together with the comb-shaped body 5B and the support 62, and the tape 63 that fixes the first portion 321 of the insulator 32 together with the conductor wires 31 inside it to the support 61 is removed. This results in an electronic device 1 having the connection structure shown in FIG. 1(a) between the plurality of conductor wires 31 and the plurality of electrodes 20 of the substrate 2.

[0033] (Actions and Effects of the Embodiments) According to the embodiment described above, the following effects (1) to (7) can be obtained.

[0034] (1) Since soldering is performed with tension applied to the multiple conductor wires 31, the multiple conductor wires 31 become straight on the electrode 20 during soldering, and the conductor wires 31 can be connected to the electrode 20 with a length sufficient to correspond to the length of the electrode 20.

[0035] (2) Since tension is applied to the conductor wire 31 by the frictional force between the conductor wire 31 and the insulator 32, excessive tension is not applied to the conductor wire 31. Therefore, even when an extremely thin conductor wire 31 (conductor diameter of 0.10 mm or less) is used, the conductor wire 31 is prevented from breaking due to tension.

[0036] (3) In the soldering process, a single heater tip 7 can be used to solder a plurality of conductor wires 31 at once, thereby shortening the time required for soldering.

[0037] (4) The plurality of electric wires 3 are half-stripped using a pair of comb-shaped bodies 5A, 5B and then the plurality of conductor wires 31 are arranged on the plurality of electrodes 20 of the substrate 2. This facilitates the half-strip processing and arrangement process, and reduces the work process and manufacturing time compared to, for example, removing the half-stripped plurality of electric wires 3 from the half-strip jig 5 and arranging them on the substrate 2.

[0038] (5) In the half-stripping process, the slits 50 of the comb-shaped bodies 5A and 5B are engaged with the conductor wire 31 between the first portion 321 and the second portion 322 of the insulator 32 separated by irradiation with laser light, so that the comb-shaped bodies 5A and 5B can be arranged between the first portion 321 and the second portion 322 of the insulator 32 while preventing damage to the conductor wire 31. In other words, if the insulator 32 were cut using blades formed on the comb-shaped bodies 5A and 5B, the conductor wire 31 would likely be damaged by the blades. However, by separating the insulator 32 into the first portion 321 and the second portion 322 by irradiation with laser light as in this embodiment, damage to the conductor wire 31 can be prevented.

[0039] (6) In the removal process, a protective material 90 is placed between the multiple conductor wires 31, and the moving member 92 abuts against the abutting member 93 to restrict the movement of the cutting tool 91 toward the substrate 2, making it possible to reliably cut the multiple conductor wires 31 all at once without damaging the substrate 2.

[0040] (7) Because the tip 311 of the conductor wire 31 is curved so as to rise above the substrate 2, soldering can be performed with the conductor wire 31 under tension pressed against the electrode 20. Furthermore, because the tip surface 311a of the conductor wire 31 is located on the coverlay 23 of the substrate 2, the excess length of the conductor wire 31 can be cut and removed on the coverlay 23, which reliably prevents the wiring pattern of the electrode 20 and the conductive layer 22 from being damaged.

[0041] [Variations] FIG. 13(a) is a perspective view showing a heater chip 70 as a heating element according to a modified example. FIG. 13(b) is a perspective view showing the heater chip 70 and a plurality of electric wires 3. FIGS. 14(a) and 14(b) are configuration diagrams showing a soldering process using the heater chip 70 and a connection device 100 having the heater chip 70. FIG. 15(a) is a cross-sectional view taken along line CC in FIG. 14(a), and FIG. 15(b) is a cross-sectional view taken along line DD in FIG. 14(b). The connection device 100 has the same configuration as the connection device 10 according to the above embodiment, except that it has a heater chip 70 instead of the heater chip 7 in the above embodiment.

[0042] The heater chip 70 has a plurality of V-grooves 71 formed on its surface 70a facing the substrate 2. In a soldering process using the heater chip 70, the V-grooves 71 guide the conductor wire 31 to a position facing the center position of the electrode 20 in the width direction. Each V-groove 71 extends linearly along the longitudinal direction of the electric wire 3, and by accommodating the conductor wire 31 in the V-groove 71, the conductor wire 31 becomes parallel to the longitudinal direction of the electrode 20.

[0043] 14(a), the heater chip 70 is placed above the conductor wires 31 to which tension has been applied in the placement process. Thereafter, the heater chip 70 moves toward the substrate 2, whereby the multiple conductor wires 31 are sandwiched between the heater chip 70 and the substrate 2 with each of the multiple conductor wires 31 accommodated in the multiple V-grooves 71 of the heater chip 70. Then, the solder foil 40 melts due to the heat of the heater chip 70, and the multiple conductor wires 31 are soldered to the multiple electrodes 20.

[0044] According to the connection method using the heater chip 70 of this modified example, the above-mentioned effects (1) to (7) can be obtained, and even if the conductor wire 31 is undulated, the conductor wire 31 is soldered to the electrode 20 in a state where the undulation is straightened by the V-groove 71 of the heater chip 70, thereby more reliably soldering the conductor wire 31. In other words, as described above, tension is applied to the conductor wire 31 by the frictional force with the insulator 32, but this tension is not necessarily strong enough to straighten the entire portion of the conductor wire 31 exposed in the half-stripping process, and the exposed portion of the conductor wire 31 may undulate slightly. However, by using the heater chip 70 of this modified example, it is possible to remove even this slight undulation and perform soldering.

[0045] Furthermore, according to this modification, soldering can be performed while suppressing the amount of crushing of the conductor wire 31 when the heater chip 70 presses the conductor wire 31 against the substrate 2. Fig. 16 is a cross-sectional view showing the conductor wire 31 soldered to the electrode 20 of the substrate 2. In Fig. 16, the outline of the heater chip 70 is shown by a virtual line (two-dot chain line). As shown in Fig. 16, the conductor wire 31 pressed against the substrate 2 by the heater chip 70 is guided into the deepest part of the V-groove 71 with the multiple strands 310 twisted together and soldered to the electrode 20. In other words, if the conductor wire 31 were pressed against the electrode 20 using a heater chip with a flat surface facing the substrate 2, the multiple wires 310 would line up in the width direction of the electrode 20, causing the conductor wire 31 to be crushed, and there is a risk that the spacing between adjacent conductor wires 31 would become narrow. However, by using a heater chip 70 with a V-shaped groove 71 formed therein, it is possible to solder the conductor wire 31 near the center position in the width direction of the electrode 20 while preventing the conductor wire 31 from being crushed.

[0046] (Summary of the embodiment) Next, the technical ideas grasped from the above-described embodiments will be described by using the reference numerals and the like in the embodiments. However, the reference numerals in the following description do not limit the components in the claims to the members and the like specifically shown in the embodiments.

[0047] [1] A method for connecting a conductor wire (31) to an electrode (20) formed on a substrate (2), comprising: a placement step of placing the conductor wire (31) on the electrode (20) while applying tension to the conductor wire (31); and a soldering step of pressing the conductor wire (31) against the substrate (2) using a heating element (heater chip 7, 70) to solder the conductor wire (31) to the electrode (20).

[0048] [2] The conductor wire connecting method described in [1] above, wherein in the placement step, the conductor wire (31) is covered with an insulator on both longitudinal sides of the portion soldered to the electrode (20), and tension is applied to the conductor wire (31) by frictional force between the conductor wire (31) and the insulator.

[0049] [3] The conductor wire connecting method according to [2] above, wherein in the placing step, the plurality of conductor wires (31) in a tensioned state are placed on the plurality of electrodes (20) formed on the substrate (2), respectively, and in the soldering step, the plurality of conductor wires (31) are pressed collectively against the plurality of electrodes (20) by the heating element (7, 70) and soldered.

[0050] [4] The conductor wire connecting method according to [3] above, further comprising, prior to the arranging step, a half-stripping step of half-stripping the plurality of insulators (32) covering the plurality of conductor wires (31), respectively, in which the half-stripping step uses a pair of comb-shaped bodies (5A, 5B) having a plurality of slits (50) formed with a width (W) larger than the diameter (conductor diameter D1) of the conductor wires (31) and smaller than the outer diameter (D2) of the insulators (32), and in a state in which the conductor wires (31) are inserted into the plurality of slits (50) of the pair of comb-shaped bodies (5A, 5B), the pair of comb-shaped bodies (5A, 5B) are spaced apart along the longitudinal direction of the plurality of conductor wires (31), and the conductor wires (31) are exposed between the pair of comb-shaped bodies (5A, 5B).

[0051] [5] The conductor wire connecting method described in [4] above, wherein in the half stripping step, a plurality of the conductor wires (31) in the removed portions formed by removing a portion of the plurality of the insulators (32) by irradiating a laser beam are inserted into the plurality of slits (50) of the pair of comb-shaped bodies (5A, 5B), and then the pair of comb-shaped bodies (5A, 5B) are separated.

[0052] [6] The conductor wire connecting method according to [4] or [5] above, wherein in the placing step, the plurality of conductor wires (31) in a state where tension is applied between the pair of comb-shaped bodies (5A, 5B) are placed on the plurality of electrodes (20).

[0053] [7] The conductor wire connecting method according to [2] above, further comprising a removal step of cutting and removing the conductor wire (31) on the tip side of the portion soldered to the electrode (20) after the soldering step, wherein in the placement step, a protective material (90) is placed between the conductor wire (31) and the substrate (2), and in the removal step, the conductor wire (31) is sandwiched between the protective material (90) and a cutting tool (91), and the cutting tool (91) is pressed against the protective material (90) to cut the conductor wire (31).

[0054] [8] In the removal step, a movable member (92) that moves relative to the substrate (2) together with the cutting tool (91) and a contact member (93) that the movable member (92) contacts when the cutting tool (91) bites into the protective material (90) are used, and the movement of the cutting tool (91) is restricted by the movable member (92) contacting the contact member (93).

[0055] [9] A conductor wire connecting method according to any one of [1] to [5] above, wherein a V-shaped groove (71) is formed on a surface (70a) of the heating element (70) facing the substrate (2), and the V-shaped groove (71) guides the conductor wire (31) to a position facing the electrode (20) during the soldering process.

[0056]

[10] A half-strip jig (5) for collectively half-stripping a plurality of insulated-coated electric wires (electric wires 3) in which conductor wires (31) are covered with insulators (32), the half-strip jig (5) having a pair of comb-shaped bodies (5A, 5B) in which a plurality of slits (50) are formed, each of the plurality of slits (50) having a width (W) greater than a diameter (D1) of the conductor wires (31) and smaller than an outer diameter (D2) of the insulators (32), and the conductor wires (31) are exposed between the pair of comb-shaped bodies (5A, 5B) by separating the pair of comb-shaped bodies (5A, 5B) along the longitudinal direction of the conductor wires (31) while the conductor wires (31) are inserted through the plurality of slits (50).

[0057]

[11] A connection device (10, 100) having the half strip jig (5) described in

[10] above and a heating element (7, 70) that presses and solders the plurality of conductor wires (31) between the pair of comb-shaped bodies (5A, 5B) against the plurality of electrodes (20), respectively.

[0058]

[12] The connection device (100) described in

[11] above, wherein the heating element (70) is formed with a plurality of V-shaped grooves (71) that guide each of the plurality of conductor wires (31) to a position facing the plurality of electrodes (20).

[0059]

[13] An electronic device (1) comprising a substrate (2) on which a plurality of electrodes (20) are formed, and a plurality of conductor wires (31) soldered to the plurality of electrodes (20), respectively, wherein the tip (311) of each of the plurality of conductor wires (31) is curved so as to rise above the substrate (2).

[0060]

[14] The electronic device (1) according to

[13] above, wherein the tip surfaces (311a) of the plurality of conductor wires (31) are located on the coverlay (23) of the substrate (2).

[0061] Although the embodiments of the present invention have been described above, the invention according to the claims is not limited to these embodiments. It should be noted that not all of the combinations of features described in the embodiments are necessarily essential to the means for solving the problems of the invention. Furthermore, while the above embodiments have described the case where the electric wire 3 comprises a conductor wire 31 and an insulator 32, the electric wire to which the present invention is applicable may also be a coaxial cable having an outer conductor around the insulator 32 of an insulated electric wire comprising the conductor wire 31 and the insulator 32. In this case, the insulator 32 is disposed between the conductor wire 31 as a central conductor and the outer conductor. [Explanation of symbols]

[0062] 1...Electronic device 10,100...Connection device 2...Substrate 20...Electrode 23...Coverlay 3...Electric wire 31...conductor wire 311...tip portion 311a...Tip surface 32...Insulator 5...Half strip jig 50...Slit 5A, 5B... Comb-shaped body 7, 70... Heater chip (heat generating element) 70a...Opposing surface 71...V groove 90...Protective material 91...Cut tool 92...moving member 93...contact member D1: Conductor diameter D2: Outer diameter W…width

Claims

1. A method for connecting a conductor wire to an electrode formed on a substrate, comprising the steps of: a placement step of placing the conductor wire on the electrode while applying tension to the conductor wire; a soldering step of pressing the conductor wire against the substrate using a heating element to solder the conductor wire to the electrode; A conductor wire connecting method comprising:

2. In the placing step, the conductor wire is covered with an insulator on both sides in the longitudinal direction of a portion to be soldered to the electrode, tension is applied to the conductor wire by friction between the conductor wire and the insulator; The conductor wire connecting method according to claim 1 .

3. In the placing step, the plurality of conductor wires in a tensioned state are placed on the plurality of electrodes formed on the substrate, respectively; In the soldering step, the plurality of conductor wires are soldered by being pressed against the plurality of electrodes at once by the heating element. The conductor wire connecting method according to claim 2 .

4. a half-stripping step of half-stripping the plurality of insulators covering the plurality of conductor wires, respectively, prior to the arranging step; In the half stripping step, a pair of comb-shaped bodies having a plurality of slits formed with a width larger than the diameter of the conductor wire and smaller than the outer diameter of the insulator is used, and the conductor wire is inserted into the plurality of slits of each of the pair of comb-shaped bodies, and the pair of comb-shaped bodies is separated along the longitudinal direction of the plurality of conductor wires, thereby exposing the conductor wire between the pair of comb-shaped bodies. The conductor wire connecting method according to claim 3.

5. In the half stripping step, the plurality of conductor wires in the removed portions formed by removing portions of the plurality of insulators by irradiating a laser beam are inserted into the plurality of slits of the pair of comb-shaped bodies, and then the pair of comb-shaped bodies are separated. The conductor wire connecting method according to claim 4.

6. In the arranging step, the plurality of conductor wires are arranged on the plurality of electrodes while tension is applied between the pair of comb-shaped bodies. The conductor wire connecting method according to claim 4 or 5.

7. a removing step of cutting and removing the conductor wire on the tip side of the portion soldered to the electrode after the soldering step, In the placing step, a protective material is placed between the conductor wire and the substrate; In the removing step, the conductor wire is sandwiched between the protective material and a cutting tool, and the cutting tool is pressed against the protective material to cut the conductor wire. The conductor wire connecting method according to claim 2 .

8. In the removing step, a moving member that moves relative to the substrate together with the cutting tool and a contact member that the moving member contacts when the cutting tool bites into the protective material are used, and the movement of the cutting tool is restricted by the moving member contacting the contact member. The conductor wire connecting method according to claim 7.

9. a V-shaped groove is formed on the surface of the heating element facing the substrate, In the soldering step, the conductor wire is guided to a position facing the electrode by the V-groove. The conductor wire connecting method according to any one of claims 1 to 5.

10. A half-strip jig for collectively half-stripping a plurality of insulation-coated electric wires, each of which has a conductor wire covered with an insulator, a pair of comb-shaped bodies each having a plurality of slits formed therein; a width of each of the plurality of slits being greater than a diameter of the conductor wire and smaller than an outer diameter of the insulator; With the conductor wires inserted into the slits, the pair of comb-shaped bodies is moved away from each other along the longitudinal direction of the conductor wires, thereby exposing the conductor wires between the pair of comb-shaped bodies. Half strip jig.

11. The half strip jig according to claim 10; a heating element that presses and solders the plurality of conductor wires between the pair of comb-shaped bodies against a plurality of electrodes, respectively; A connection device having:

12. a plurality of V-shaped grooves are formed in the heating element to guide the plurality of conductor wires to positions facing the plurality of electrodes, The connection device according to claim 11.

13. a substrate on which a plurality of electrodes are formed, and a plurality of conductor wires soldered to the plurality of electrodes, The tip end of each of the plurality of conductor wires is curved so as to rise above the substrate. electronic equipment.

14. a tip end surface of each of the plurality of conductor wires is located on a coverlay of the substrate; 14. The electronic device of claim 13.

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