Processing equipment

Abstract

To provide a processing device that processes a workpiece using a tool, which can reduce adhesion of chips generated during processing of the workpiece and maintain processing accuracy while processing the workpiece. [Solution] A processing device comprising a spindle that holds and rotates a tool, a holding part (41) that holds the workpiece to be processed by the tool, and a moving means (10) that moves the spindle and holding part (41) relative to each other in a predetermined direction, characterized in that the spindle and holding part (41) are housed inside a processing chamber for processing the workpiece and the surface of a member inside the processing chamber is provided with fine irregularities.

Description

[Technical Field]

[0001] The present invention relates to a processing device that processes an object to be processed using a tool. [Background technology]

[0002] 2. Description of the Related Art In a processing device, when a workpiece is processed with a tool, chips fly around. Therefore, some processing devices process the workpiece inside a processing chamber.

[0003] It is known to provide a cleaning mechanism in the machining chamber in order to remove chips in the machining chamber (see Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2018-020402 Summary of the Invention [Problem to be solved by the invention]

[0005] In a processing device that processes a workpiece using a tool such as that described in Patent Document 1, chips are generated during processing and scatter and adhere to the processing chamber. As the processing of the workpiece progresses, more chips adhere and tend to accumulate. If a large amount of chips accumulates, it can interfere with the air flow, processing operations, etc.

[0006] The present invention provides a technique for reducing adhesion of chips generated during machining. [Means for solving the problem]

[0007] In order to solve the above problems, the processing device of the present invention is a processing device comprising a spindle that holds and rotates a tool, a holding part that holds an object to be processed by the tool, and a moving means that moves the spindle and the holding part relative to each other in a predetermined direction, and is characterized in that the spindle and the holding part are housed inside a processing chamber for processing the object to be processed, and the surface of a member in the processing chamber for processing the object to be processed is provided with a fine uneven portion. [Effects of the Invention]

[0008] According to the present invention, adhesion of chips generated during machining of a workpiece can be reduced, so that the workpiece can be machined while maintaining machining accuracy. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is an external perspective view of a processing device according to an embodiment of the present invention; [Figure 2] FIG. 2 is a perspective view of an internal configuration of the processing device according to the embodiment. [Figure 3] FIG. 4 is a perspective view of the internal configuration showing the relationship between the housing portion, the main shaft, and the holding portion. [Figure 4] FIG. 2 is a control block diagram of the processing device according to the embodiment. [Figure 5] Relationship between the surface roughness of the holding part 41 and the state of chip adhesion DETAILED DESCRIPTION OF THE INVENTION

[0010] The present invention will be described in detail below based on embodiments.

[0011] <Embodiment> A processing device according to an embodiment of the present invention will be described with reference to Figures 1 to 5. Figure 1 is a perspective view of the appearance of a processing device according to an embodiment of the present invention.

[0012] 1, the processing apparatus 100 houses the processing apparatus main body in an exterior cover 101. The exterior cover 101 has an opening / closing door 102, and opening the opening / closing door 102 allows replacement of the workpiece.

[0013] The processing device 100 comprises a frame 1 as a moving mechanism support member, a first moving mechanism 10, a second moving mechanism 20 and a third moving mechanism 30 each supported by the frame 1, a support mechanism 40 that supports a workpiece W as an object to be processed, a first rotating mechanism 50 and a second rotating mechanism 60 that can rotate the support mechanism 40, a tool magazine 70 and an electrical unit 80.

[0014] The frame 1 is placed on a stand 2 having a hollow interior, and as shown in Figure 2, is composed of a first frame portion 3 and a second frame portion 4 bent at a right angle from the end of the first frame portion 3.

[0015] The first movement mechanism 10 is supported on the first surface 3a of the first frame portion 3 of the frame 1 via the second movement mechanism 20 and is capable of moving the spindle 11 in the Z-axis direction (vertical direction, first direction). A processing tool 12 is detachably attached to the spindle 11 via a tool holder (clamp). The spindle 11 is driven to rotate by a motor 13. As shown in FIG. 2, the first movement mechanism 10 has a motor 14 and a guide shaft (not shown) arranged in the Z-axis direction. Driven by the motor 14, the spindle 11 is moved back and forth (raised and lowered) along the guide shaft in the Z-axis direction. The spindle 11 is supported via a Z-axis support member 16 so as to be movable along the guide shaft. For example, the guide shaft may be a ball screw, and the Z-axis support member 16 is a member that moves along the guide shaft (ball screw) that rotates when driven by the motor 14. The guide shaft and the Z-axis support member 16 are covered by a cover 17.

[0016] The second movement mechanism 20 is supported on the first surface 3a of the first frame portion 3 of the frame 1, and is capable of moving the main shaft 11 together with the first movement mechanism 10 in the X-axis direction (horizontal direction, second direction) perpendicular to the Z-axis direction. The second movement mechanism 20 has a motor 21 and a guide shaft (not shown) arranged in the X-axis direction, and is driven by the motor 21 to move the first movement mechanism 10 back and forth in the X-axis direction along the guide shaft.

[0017] The third movement mechanism 30 is supported on the second surface 4a of the second frame portion 4 of the frame 1, and is capable of moving the support mechanism 40 in the Y-axis direction (horizontal direction, third direction) perpendicular to the Z-axis direction and the X-axis direction. The third movement mechanism 30 has a motor (not shown) and a guide shaft (not shown) arranged in the Y-axis direction, and is driven by the motor to move the support mechanism 40 back and forth in the Y-axis direction along the guide shaft.

[0018] The third movement mechanism 30 also includes a support plate 31 that supports the second rotation mechanism 60, and the support plate 31 moves back and forth in the Y-axis direction along the guide shaft. The movement of the three axes can be achieved by relatively moving in a predetermined direction, and either side can be moved.

[0019] The support mechanism 40 supports a workpiece W, such as a dental prosthesis, which is an object to be machined by the processing tool 12. The support mechanism 40 has a holding part 41 that holds the workpiece W, and a support part 42 whose two end parts are respectively connected to the rotating part 51 of the first rotating mechanism 50 and that supports the workpiece W via the holding part 41.

[0020] The first rotation mechanism 50 can rotate the support mechanism 40 around an a-axis, which is a rotation axis perpendicular to the Z-axis direction. In this embodiment, the a-axis is parallel to the X-axis direction. The first rotation mechanism 50 includes a support frame 53 that rotatably supports a rotating unit 51 and a motor that rotates the rotating unit 51. The support frame 53 is formed in a substantially U-shape so as to surround the periphery of the support mechanism 40 and includes a first support unit 53a that supports the motor and the rotating unit 51, a second support unit 53b that supports a rotating unit (not shown) that is provided opposite the rotating unit 51, and a connecting unit 53c that connects the first support unit 53a and the second support unit 53b.

[0021] The rotating portion 51 supported by the first supporting portion 53a and the rotating portion supported by the second supporting portion 53b are arranged to face each other in the a-axis direction and to be rotatable about the a-axis as the rotation axis.

[0022] The first rotation mechanism 50 can rotate at least 180 degrees, and can turn the workpiece W supported by the support mechanism 40 over.

[0023] The second rotation mechanism 60 is capable of rotating the support mechanism 40 around the b-axis, which is another rotation axis perpendicular to the Z-axis direction and the a-axis. In this embodiment, the b-axis is parallel to the Y-axis direction. The second rotation mechanism 60 has a rotation unit to which the support frame 53 of the first rotation mechanism 50 is attached, and a motor that rotates and drives the rotation unit 61. The rotation unit 61 is attached to a connecting portion 53c of the support frame 53, and is rotated by a motor 62, thereby rotating the support frame 53 around the b-axis.

[0024] The tool magazine 70 serving as a tool holding section can hold a plurality of processing tools, is disposed adjacent to the first rotation mechanism 50, and is supported so as not to rotate together with the second rotation mechanism 60. The tool magazine 70 can also be moved in the Y-axis direction together with the support mechanism 40 and the like by the third movement mechanism 30.

[0025] In the tool magazine 70, a plurality of types of processing tools, each formed integrally with the tool holder 12a, are held and arranged in a plurality of rows along the Y-axis direction. The processing tools attached to the spindle 11 are replaceable.

[0026] When automatically replacing a processing tool, the second movement mechanism 20 and the third movement mechanism 30 move an empty space in the tool magazine 70 where no processing tool is stored to below the spindle 11. Then, the first movement mechanism 10 lowers the spindle 11, and an attachment / detachment device, such as a chuck, provided on the spindle 11 is operated to remove the processing tool 12 attached to the spindle 11 and place it in an empty space in the tool magazine 70. Next, the first movement mechanism 10 raises the spindle 11, and the second movement mechanism 20 and the third movement mechanism 30 move the position in the tool magazine 70 where the processing tool 12 to be replaced is located to below the spindle 11. Then, the first movement mechanism 10 lowers the spindle 11 again, and the attachment / detachment device is operated to attach the processing tool 12 to be replaced to the spindle 11. The processing tool 12 is, for example, a drill or an end mill.

[0027] As shown in FIG. 1, the processing apparatus 100 includes an external terminal 300 equipped with a CPU 310 and a memory 311.

[0028] Furthermore, the machining apparatus 100 of this embodiment is an NC machining apparatus that performs automatic machining under computer control. Specifically, machining data is created by a CAD / CAM system using an external terminal 300 such as a personal computer, and the workpiece W is machined by numerical control based on this data. For this purpose, an external terminal such as a personal computer that issues commands to the machining apparatus 100 is communicably connected to a control board of the machining apparatus 100. The external terminal may create NC code according to conditions and send it to the control board. Note that the machining apparatus 100 itself may be provided with a computer equipped with a CPU, memory, and display capable of numerical control.

[0029] For example, when a dental prosthesis is produced using the processing device 100, data of the dental prosthesis measured by a three-dimensional measuring device is transferred to a CAD / CAM system, and an NC file containing the processing data is created by the CAD / CAM system. Then, based on this NC file, the processing device 100 is controlled to cut the workpiece W with the processing tool 12, thereby producing the dental prosthesis.

[0030] 3 is a perspective view of the state in which the Z-axis drive mechanism is housed within the machine body. The housing section 400 is provided within the exterior cover 101 of the processing device 100 (see FIG. 1). The tip end side of the spindle 11, the holder 41, the tool magazine 70, etc. are arranged inside the housing section 400, forming a machining space for the tools. When the opening / closing door 102 (see FIG. 1) of the exterior cover 101 is opened, an opening 401 is formed that allows access to the machining space. In addition, an opening 402 is formed on the top surface side to allow the first movement mechanism 10 to move in the X-axis direction.

[0031] 4, the electrical unit 80 includes a CPU 85 as a calculation means, an input / output port (I / O) 86i, motor control units 84x, 84y, and 84z, a spindle control unit 84c, an a-axis control unit 84a, and a b-axis control unit 84b. The CPU 85 provided on the control board performs various calculations using a memory 86m based on input data and signals, and transmits instructions regarding rotation speed and position to the connected control units 84x, 84y, 84z, 84a, 84b, and 84c as servo amplifiers.

[0032] The I / O 86i is connected to the air blow unit 87, dust collector 88, and tool length sensor 96 of the processing device main body. The air blow unit 87 blows air onto the tool as described above, and collects the removed chips in the dust collector 88. The tool length sensor 96 detects the length of the tool and sends a signal to the CPU 85.

[0033] The motor control units 84x, 84y, and 84z drive the X, Y, and Z motors based on commands from the CPU 85. Each motor control unit 84x, 84y, and 84z is provided with an encoder. The encoder detects, for example, the number of rotations, angle of rotation, and direction of rotation of the rotation axis of each motor control unit 84x, 84y, and 84z. The encoder then detects the amount (position) of movement of each stage x, y, and z due to the driving of each motor control unit 84x, 84y, and 84z.

[0034] The control unit 84c controls the rotation speed of the main shaft (spindle) by controlling a motor (not shown) that rotates the main shaft 11. In addition, the a-axis and b-axis control units 84a and 84b drive the a-axis and b-axis motors based on commands from the CPU 85.

[0035] In this way, the CPU 85 controls each part of the machining device 100, whereby predetermined machining is performed on the workpiece W held as described above.

[0036] In this embodiment, each means and process described later is executed on the external terminal 300, but it is also possible to provide a display in the processing apparatus 100 itself and execute the processes. In this case, the CPU 85 loads a program into a storage means such as the memory 86m and executes the program.

[0037] (Formation of fine irregularities) The following describes the formation of micro-irregularities on the surfaces of components inside the machining chamber. Examples of components inside the machining chamber include those forming the surfaces of wall surfaces, ceiling surfaces, bottom surfaces, intake ports, exhaust ports, support mechanisms, moving devices, and rotating devices. Metal components are used inside the machining chamber. Micro-irregularities are formed on the surfaces of metal components by blasting, etching, electrolytic treatment, etc. By appropriately selecting the treatment method and conditions, the surface roughness Ra [μm] of the component can be adjusted to 0.010 to 1.000 and the surface roughness Rz [μm] to 0.100 to 10.000. By forming micro-irregularities on the component surface, the contact area (intermolecular forces) between the chips and the component can be reduced. As a result, chip adhesion to the component can be reduced compared to untreated components. For components inside the machining chamber, micro-irregularities can be formed directly on the surface, or a thin plate or film-like component with micro-irregularities can be attached to cover the surface where chip adhesion is desired to be reduced.

[0038] (antistatic treatment) An antistatic treatment is performed on the surface of a metal component on which a fine irregularity has been formed. The antistatic treatment can reduce the adhesion of chips due to static electricity. The antistatic treatment involves forming an antistatic layer on the substrate. The method for forming the antistatic layer can be selected from dry plating, wet plating, organic coating, inorganic coating, etc. However, the thickness of the antistatic layer is set to a value smaller than the height (depth) of the fine irregularities formed on the component surface. If the thickness of the antistatic layer is greater than the height (depth) of the fine irregularities, the fine irregularities formed on the component surface may be buried, increasing the contact area with chips and increasing the adhesion of chips. By adjusting the thickness of the antistatic layer, the contact area with chips can be reduced while suppressing static electricity, thereby effectively reducing chip adhesion.

[0039] (Application of fine irregularities) The following describes the areas in the machining chamber of a machining machine where fine irregularities are suitable. In FIG. 2, when a workpiece W is machined with a machining tool 12, chips are generated from the workpiece and scattered throughout the device. Chips tend to adhere particularly to the workpiece holder 41, support mechanism 40, support frame 53, rotating unit 51, and support unit 42, which are close to the workpiece W. Therefore, by forming fine irregularities in these areas and applying antistatic treatment, chip adhesion can be effectively reduced. Providing fine irregularities on the surfaces of components in the machining chamber can reduce chip adhesion, and applying antistatic treatment can further reduce the possibility of chip adhesion. Furthermore, since chips tend to accumulate on the surfaces of the workpiece holding portion 41, support mechanism 40, support frame 53, rotating portion 51, and support portion 42 that face the workpiece W, it is particularly advisable to arrange fine irregularities on the surfaces that face the workpiece W.

[0040] Furthermore, when machining a workpiece, air is blown onto the tool to prevent clogging and cool the tool. The air is not only blown onto the tool, but also onto the workpiece. As a result, the air is reflected off the workpiece and scattered to the surrounding area, and chips adhering to the materials around the workpiece are scattered over an even wider area by the air blow. As a result, chips also adhere to the wall surfaces 404, top surface 405, and bottom surface 406 inside the machining chamber. By forming fine irregularities on the wall, top, and bottom surfaces and performing antistatic treatment, chip adhesion can be reduced.

[0041] In particular, a dust collection unit 407 is installed on the bottom surface, which sucks up chips generated inside the processing device and discharges them outside the processing device. The bottom surface 406 is sloped toward the dust collection unit so that chips can slide down, but if left untreated, chips will adhere and not slide down. By forming a fine uneven shape on the bottom surface material and performing an anti-static treatment, the chips can slide down more easily, allowing for smooth chip discharge.

[0042] Example 1 The method for applying the finely textured member of the present invention is described below. A blasting treatment was performed on the workpiece holder 41 (made of SUS304) in Figure 2 to form fine irregularities. The surface roughness of the workpiece holder 41 after the blasting treatment was measured, resulting in Ra of 0.050 μm and Rz of 1.000 μm. The surface was then subjected to an antistatic treatment. An inorganic coating agent (Silica Coat, manufactured by Chuo Motors) was used for the antistatic treatment. The coating agent was applied to the surface of the workpiece holder 41 and dried at 70°C for 1 minute to form an antistatic layer. The treated workpiece holder 41 was placed in a processing device, and processing of the workpiece was performed. After processing, the adhesion of chips from the workpiece to the workpiece holder 41 was checked, but almost no chips were observed.

[0043] Example 2 The support mechanism 40 (made of SUS304) in Figure 3 was subjected to a blasting treatment to form fine irregularities. The surface roughness of the workpiece holder 41 after the blasting treatment was measured, and the results were Ra 0.048 μm and Rz 0.985 μm. The surface was then subjected to an antistatic treatment. An inorganic coating agent (silica coat, manufactured by Chuo Motors) was used for the antistatic treatment. The coating agent was applied to the surface of the support mechanism 40 and dried at 70°C for 1 minute to form an antistatic layer. The treated support mechanism 40 was then placed in a processing device, and processing of the workpiece was carried out. After processing was completed, the adhesion of chips from the workpiece to the support mechanism 40 was checked, but almost no chips were observed.

[0044] Example 3 A blasting treatment was performed on the workpiece holder 41 (made of SUS304) in FIG. 3 to form irregularities. As a result of adjusting the blasting conditions, the surface roughness of the workpiece holder 41 became Ra 0.300 μm and Rz 1.500 μm. Thereafter, as in Example 1, an antistatic treatment was performed on the surface. The treated workpiece holder 41 was placed in a processing device, and processing of the workpiece was performed. After processing was completed, the adhesion of chips from the workpiece to the workpiece holder 41 was checked, and although some adhesion of chips was observed, chips were less likely to adhere compared to a state where no processing was performed.

[0045] (Comparative Example) The workpiece holder 41 (made of SUS304) in Figure 3 was placed in a processing device without being subjected to blasting or anti-static treatment, and the workpiece was processed. After processing was completed, the state of chip adhesion of the workpiece to the workpiece holder 41 was checked, and a large amount of chip adhesion was found.

[0046] The relationship between the surface roughness of the workpiece holder 41 and the state of chip adhesion is summarized in Figure 5. The workpiece holder 41 was subjected to antistatic treatment after blasting to form irregularities. When the surface roughness Ra was in the range of 0.100 to 0.045 μm and Rz was in the range of 0.100 to 1.025 μm, little chip adhesion was observed. On the other hand, when the surface roughness Ra was in the range of 0.300 to 1.000 and 1.500 to 10.000 μm, much chip adhesion was observed.

[0047] As described above, according to the present invention, by forming a fine uneven shape and applying an antistatic treatment to a member inside a processing device, adhesion of chips can be reduced. [Explanation of symbols]

[0048] 10 1st movement mechanism 11 Spindle 12 Processing tools 20 Second movement mechanism 30 Third movement mechanism 40 Support mechanism 41 Holding part 50 First rotation mechanism 53 Support Frame 60 Second rotation mechanism 100 Processing equipment 404 Processing equipment wall 405 Processing equipment top surface 406 Bottom of processing equipment 407 Chip dust collection section

Claims

1. a spindle that holds and rotates a tool; a holding unit that holds an object to be processed by the tool; a moving means for relatively moving the spindle and the holding portion in a predetermined direction, A processing device that houses the spindle and the holder inside and has a fine concave-convex portion on the surface of a member inside a processing chamber for processing the workpiece.

2. The fine uneven portion is 2. The processing device according to claim 1, wherein the surface roughness Ra [μm] is 0.010 to 1.000, and the surface roughness Rz [μm] is 0.100 to 10.

000.

3. 2. The processing apparatus according to claim 1, wherein an antistatic layer is provided on the surface of the fine concave-convex portion.

4. a rotation mechanism that rotates the holding portion, 4. The processing device according to claim 1, wherein the minute concave-convex portion is provided on a surface of the rotation mechanism facing the workpiece.

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