Plated molded product and method for manufacturing the same

Abstract

The present invention provides plated molded products that can form an electroless metal plating layer with excellent plating deposition properties while also reducing manufacturing costs. [Solution] A plated molded product 1 having a titanium oxide layer 3 composed of titanium oxide and synthetic resin, which does not contain conductive polymer fine particles or reducing polymer fine particles, or a titanium oxide layer 3 which contains titanium oxide and additives other than synthetic resin in an amount of less than 5 parts by weight per 100 parts by weight of synthetic resin, the titanium oxide layer 3 is laminated and fixed to the surface of a substrate 2, and an electroless metal plating layer 4 is laminated and fixed to the outside of the titanium oxide layer 3.

Description

Technical Field

[0001] The present invention relates to a plated molded product in which an electroless metal plating layer is formed on a substrate and a method for manufacturing the same.

Background Art

[0002] Conventionally, there is a plated molded product disclosed in Patent Document 1 as a plated molded product in which an electroless plating layer is formed on a substrate. The plated molded product of Patent Document 1 is a plated molded product in which an electroless metal plating film of a thin wire electrode member is formed. A base coating containing conductive or reducible polymer fine particles, synthetic resin, inorganic fillers such as titanium oxide, etc. is printed on the substrate with a thin wire to form a plating base coating film layer, a catalytic metal such as palladium chloride is applied to the substrate with the coating film layer, and the substrate with the coating film layer to which the catalytic metal is applied is immersed in a plating solution to form a thin wire electroless metal plating film.

[0003] In this plated molded product, at the time of the plated product in which a metal plating film is formed by the electroless plating method, a catalytic metal such as palladium is reduced and adsorbed on the conductive or reducible polymer fine particles to become conductive polymer fine particles, and there is a state where there is a base layer of a thin wire containing conductive polymer fine particles between the electroless metal plating film and the substrate. Further, the content of the conductive or reducible polymer fine particles in the base coating is 5 parts by mass or more and 19 parts by mass or less with respect to 100 parts by mass of the synthetic resin in terms of solid content ratio, and the content of the inorganic fillers such as titanium oxide is 11 parts by mass or more and 45 parts by mass or less with respect to 100 parts by mass of the synthetic resin in terms of solid content ratio.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] Incidentally, the plated molded product described in Patent Document 1 is obtained by forming an electroless metal plating film using conductive polymer fine particles or reducing polymer fine particles as an undercoat layer. However, since it uses a relatively large amount of expensive conductive polymer fine particles or reducing polymer fine particles, there is a problem in that the manufacturing cost is high. This increase in manufacturing cost is even more pronounced when forming an electroless metal plating film over a wider area, rather than a fine wire electroless metal plating film as in Patent Document 1. Therefore, there is a need for a plated molded product that can form an electroless metal plating layer with excellent plating deposition properties while also reducing manufacturing costs.

[0006] This invention is proposed in view of the above problems, and aims to provide a plated molded product and a method for manufacturing the same that can form an electroless metal plating layer with excellent plating deposition properties and can reduce manufacturing costs. [Means for solving the problem]

[0007] The plated molded product of the present invention is composed of titanium oxide and a binder synthetic resin, and has a titanium oxide layer that does not contain conductive polymer fine particles or reducing polymer fine particles, wherein the titanium oxide layer is laminated and fixed to the surface of a substrate, and an electroless metal plating layer is laminated and fixed to the outside of the titanium oxide layer. According to this method, the titanium oxide in the titanium oxide layer, which is composed of titanium oxide and synthetic resin, allows for the formation of an electroless metal plating layer with excellent plating deposition properties. Furthermore, since plated molded products can be formed without using expensive conductive polymer fine particles or reducing polymer fine particles, the manufacturing cost of plated molded products can be significantly reduced.

[0008] The plated molded product of the present invention is characterized in that it has a titanium oxide layer composed of titanium oxide and synthetic resin, wherein additives other than titanium oxide and synthetic resin are contained in an amount of less than 5 parts by weight per 100 parts by weight of the synthetic resin, the titanium oxide layer is laminated and fixed to the surface of a substrate, and an electroless plated metal layer is laminated and fixed to the outside of the titanium oxide layer. According to this method, the titanium oxide in the titanium oxide layer, which is composed of titanium oxide and synthetic resin, allows for the formation of an electroless metal plating layer with excellent plating deposition properties. Furthermore, since plated molded products can be formed using the titanium oxide in the titanium oxide layer, without the need for expensive conductive polymer fine particles or reducing polymer fine particles, the manufacturing cost of plated molded products can be reduced.

[0009] The plated molded product of the present invention is composed of titanium oxide and synthetic resin, and has a titanium oxide layer that does not contain conductive polymer fine particles or reducing polymer fine particles, a coating layer that cannot be replaced by plating is fixed to the surface of the substrate, the titanium oxide layer is laminated and fixed to the surface of the coating layer, and an electroless metal plating layer is laminated and fixed to the outside of the titanium oxide layer. According to this method, an electroless metal plating layer can be formed on a non-displacement plating coating layer fixed to the surface of a substrate, with excellent plating deposition properties due to the titanium oxide in the titanium oxide layer composed of titanium oxide and synthetic resin. Furthermore, since plated molded products can be formed without using expensive conductive polymer fine particles or reducing polymer fine particles, the manufacturing cost of plated molded products can be significantly reduced.

[0010] The plated molded product of the present invention is characterized in that it has a titanium oxide layer composed of titanium oxide and synthetic resin, wherein additives other than titanium oxide and synthetic resin are contained in an amount of less than 5 parts by weight per 100 parts by weight of the synthetic resin, a coating layer that cannot be replaced by plating is fixed to the surface of the substrate, the titanium oxide layer is laminated and fixed to the surface of the coating layer, and an electroless plated metal layer is laminated and fixed to the outside of the titanium oxide layer. According to this method, an electroless metal plating layer can be formed on a non-displacement plating coating layer fixed to the surface of a substrate, due to the titanium dioxide in the titanium dioxide layer composed of titanium dioxide and synthetic resin, resulting in excellent plating deposition properties. Furthermore, since plated molded products can be formed due to the titanium dioxide in the titanium dioxide layer, rather than due to expensive conductive polymer fine particles or reducing polymer fine particles, the manufacturing cost of plated molded products can be reduced.

[0011] The plated molded product of the present invention is characterized in that the weight ratio of titanium oxide to synthetic resin in the titanium oxide layer is 1:9 to 9:1. According to this, good plating deposition properties of the electroless metal plating layer and good adhesion between the electroless metal plating layer and the titanium oxide layer can be obtained.

[0012] The plated molded product of the present invention is characterized in that the titanium oxide layer is partially laminated and fixed, and the electroless metal plating layer of partial plating is formed on the outside of the titanium oxide layer. According to this, the plated molded articles of the present invention can be applied to various products that are provided with partial plating of an electroless metal plating layer.

[0013] The present invention provides a method for manufacturing a plated molded product, comprising: a first step of forming a titanium oxide layer on the surface of a substrate as a base layer, composed of titanium oxide and synthetic resin, and not containing conductive polymer fine particles or reducing polymer fine particles; a second step of applying a catalyst to the surface of the titanium oxide layer; and a third step of forming an electroless metal plating layer on the surface of the titanium oxide layer to which the catalyst has been applied. According to this method, the titanium oxide in the titanium oxide layer, which is composed of titanium oxide and synthetic resin, allows for the formation of an electroless metal plating layer with excellent plating deposition properties. Furthermore, since plated molded products can be formed without using expensive conductive polymer fine particles or reducing polymer fine particles, the manufacturing cost of plated molded products can be significantly reduced. In addition, since the pretreatment for the catalyst application process is completed simply by forming the titanium oxide layer as a base layer, the manufacturing process of plated molded products can be simplified and the efficiency of the manufacturing process can be improved.

[0014] The present invention provides a method for manufacturing a plated molded product, comprising: a first step of forming a titanium oxide layer on the surface of a substrate as a base layer, the titanium oxide layer being composed of titanium oxide and a synthetic resin, wherein additives other than titanium oxide and the synthetic resin are contained in an amount of less than 5 parts by weight per 100 parts by weight of the synthetic resin; a second step of applying a catalyst to the surface of the titanium oxide layer; and a third step of forming an electroless metal plating layer on the surface of the titanium oxide layer to which the catalyst has been applied. According to this method, the titanium dioxide in the titanium dioxide layer, which is composed of titanium dioxide and synthetic resin, allows for the formation of an electroless metal plating layer with excellent plating deposition properties. Furthermore, since plated molded products can be formed using the titanium dioxide in the titanium dioxide layer, without the need for expensive conductive polymer fine particles or reducing polymer fine particles, the manufacturing cost of plated molded products can be reduced. In addition, since the pretreatment for the catalyst application process is completed simply by forming a titanium dioxide layer as a base layer, the manufacturing process for plated molded products can be simplified and the efficiency of the manufacturing process can be improved.

[0015] The present invention provides a method for manufacturing a plated molded product, comprising: a first step of fixing a non-displacement plating coating layer to the surface of a substrate; a second step of forming a titanium oxide layer, composed of titanium oxide and synthetic resin and not containing conductive polymer fine particles or reducing polymer fine particles, on the surface of the coating layer as a base layer; a third step of applying a catalyst to the surface of the titanium oxide layer; and a fourth step of forming an electroless metal plating layer on the surface of the titanium oxide layer to which the catalyst has been applied. According to this method, an electroless metal plating layer can be formed on a non-displacement plating coating layer fixed to the surface of a substrate, due to the titanium dioxide in the titanium dioxide layer composed of titanium dioxide and synthetic resin, resulting in excellent plating deposition properties. Furthermore, since plated molded products can be formed due to the titanium dioxide in the titanium dioxide layer, rather than due to expensive conductive polymer fine particles or reducing polymer fine particles, the manufacturing cost of plated molded products can be reduced. In addition, since the pretreatment for the catalyst application process is completed simply by forming a titanium dioxide layer as a base layer, the manufacturing process of plated molded products can be simplified and the efficiency of the manufacturing process can be improved.

[0016] The present invention provides a method for manufacturing a plated molded product, comprising: a first step of fixing a non-displacement plating coating layer to the surface of a substrate; a second step of forming a titanium oxide layer on the surface of the coating layer as a base layer, wherein the titanium oxide layer is composed of titanium oxide and a synthetic resin, and additives other than titanium oxide and the synthetic resin are contained in an amount of less than 5 parts by weight per 100 parts by weight of the synthetic resin; a third step of applying a catalyst to the surface of the titanium oxide layer; and a fourth step of forming an electroless metal plating layer on the surface of the titanium oxide layer to which the catalyst has been applied. According to this method, an electroless metal plating layer can be formed on a non-displacement plating coating layer fixed to the surface of a substrate, due to the titanium dioxide in the titanium dioxide layer composed of titanium dioxide and synthetic resin, resulting in excellent plating deposition properties. Furthermore, since plated molded products can be formed due to the titanium dioxide in the titanium dioxide layer, rather than due to expensive conductive polymer fine particles or reducing polymer fine particles, the manufacturing cost of plated molded products can be reduced. In addition, since the pretreatment for the catalyst application process is completed simply by forming a titanium dioxide layer as a base layer, the manufacturing process of plated molded products can be simplified and the efficiency of the manufacturing process can be improved. [Effects of the Invention]

[0017] According to the present invention, an electroless metal plating layer can be formed on plated molded products with excellent plating deposition properties, and the manufacturing cost of plated molded products can be reduced. [Brief explanation of the drawing]

[0018] [Figure 1] Schematic cross-sectional view showing the plated molded product of the first embodiment according to the present invention. [Figure 2] (a) to (e) are process explanatory views for explaining the manufacturing process of the plated molded product of the first embodiment. [Figure 3] Schematic cross-sectional view showing the plated molded product of the second embodiment according to the present invention. [Figure 4] (a) to (e) are process explanatory views for explaining the manufacturing process of the plated molded product of the second embodiment.

Mode for Carrying Out the Invention

[0019] 〔Plated Molded Product of the First Embodiment and Its Manufacturing Method〕 The plated molded product 1 of the first embodiment according to the present invention can be applied to various molded products in which an electroless metal plating layer is formed on a part or all of the surface of a base material such as, for example, a vehicle member, a building member, tableware, or a circuit molded product (MID: Molded Interconnect Device). As shown in FIG. 1, it is composed of a base material 2, a titanium oxide layer 3 laminated and fixed on the surface of the base material 2, and an electroless metal plating layer 4 laminated and fixed outside the titanium oxide layer 3.

[0020] The base material 2 can be an appropriate base material on which the titanium oxide layer 3 can be laminated and fixed on the surface and the electroless metal plating layer 4 can be laminated and fixed outside the titanium oxide layer 3. For example, an insulating hard base material such as a synthetic resin base material, a ceramics base material, or a glass base material, or a conductive hard base material such as a metal base material is preferable. Further, it is preferable that the base material 2 is a base material that cannot be subjected to replacement plating.

[0021] The titanium dioxide layer 3 is composed of titanium dioxide and a synthetic resin that functions as a binder, and does not contain conductive polymer fine particles or reducing polymer fine particles, or it is composed of titanium dioxide and a synthetic resin that functions as a binder, and contains additives other than titanium dioxide and synthetic resin, such as conductive polymer fine particles or reducing polymer fine particles, in an amount of less than 5 parts by weight per 100 parts by weight of synthetic resin. The synthetic resin contained in the titanium dioxide layer 3 can be any synthetic resin within an applicable range, such as acrylic resin, urethane resin, epoxy resin, silicone resin, etc.

[0022] The weight ratio of titanium dioxide to synthetic resin in the titanium dioxide layer 3 is good when set to 1:9 to 9:1, and more preferably 1:7 to 3:2, from the viewpoint of obtaining good plating deposition properties of the electroless metal plating layer 4 and good adhesion between the electroless metal plating layer 4 and the titanium dioxide layer 3. For example, when the titanium dioxide layer 3 is applied as a coating, it is preferable that the additives make up 1% or less of the total, and that the weight ratio of titanium dioxide pigment to synthetic resin pigment is 1:7 to 3:2.

[0023] The method of laminating and fixing the titanium oxide layer 3 to the surface of the substrate 2 is appropriate within the applicable range. For example, it is preferable to laminate and fix the titanium oxide layer 3 to the surface of the substrate 2 using printing methods such as inkjet printing, screen printing, pad printing, or flexographic printing, or painting methods such as spray coating, or film formation methods such as spin coating.

[0024] The electroless metal plating layer 4 is preferably made of, for example, nickel or nickel alloy, copper or copper alloy, palladium or palladium alloy, tin or tin alloy, silver or silver alloy, gold or gold alloy, or cobalt or cobalt alloy. If necessary, an electroless plating treatment is performed using an electroless plating bath corresponding to these materials, and the electroless metal plating layer 4 is formed on the outer surface of the titanium oxide layer 3.

[0025] When forming the plated molded product 1 of the first embodiment, as shown in Figures 2(a) and (b), a titanium oxide layer 3 composed of titanium oxide and synthetic resin, which does not contain conductive polymer fine particles or reducing polymer fine particles, or a titanium oxide layer 3 composed of titanium oxide and synthetic resin, which contains additives other than titanium oxide and synthetic resin in amounts of less than 5 parts by weight per 100 parts by weight of synthetic resin, is formed as a base layer and fixed to the surface of the substrate 2. After forming the titanium oxide layer 3 on the substrate 2, degreasing treatment is performed as necessary to remove dirt 5 such as oil stains in order to improve the adhesion of the electroless metal plating layer 4 and to improve the appearance of the plated molded product 1 (see Figures 2(b) and (c)).

[0026] Subsequently, as shown in Figure 2(d), catalyst 6 such as palladium is deposited and applied to the region of the substrate 2 where the titanium oxide layer 3 is formed by immersion in a catalyst solution, thereby applying catalyst 6 to the surface of the titanium oxide layer 3. For example, by immersing the substrate 2 on which the titanium oxide layer 3 is formed in an activator solution, catalyst 6 such as palladium is selectively adsorbed onto the region where the titanium oxide layer 3 is formed and applied to the surface of the titanium oxide layer 3.

[0027] Then, as shown in Figure 2(e), the substrate 2 having the titanium oxide layer 3 to which the catalyst 6 is applied is immersed in an electroless plating bath to form an electroless metal plating layer 4 on the surface of the titanium oxide layer 3 to which the catalyst 6 is applied. After that, if necessary, washing and drying treatments are performed to obtain the plated molded product 1 of this embodiment.

[0028] According to the first embodiment, the titanium oxide in the titanium oxide layer 3, which is composed of titanium oxide and synthetic resin, allows for the formation of an electroless metal plating layer 4 with excellent plating deposition properties. Furthermore, since plated molded products can be formed without using expensive conductive polymer fine particles or reducing polymer fine particles, or because plated molded products can be formed solely by the titanium oxide in the titanium oxide layer 3 without being affected by expensive conductive polymer fine particles or reducing polymer fine particles, the manufacturing cost of plated molded products can be reduced.

[0029] Furthermore, since the pretreatment for the catalyst application process is completed simply by forming a titanium oxide layer as a base layer, the manufacturing process for plated molded products can be simplified and the efficiency of the manufacturing process can be improved. Also, for example, when a plated molded product is used as a circuit molded product, with an insulating resin substrate and an electroless metal plating layer as a conductor, if conductive or reducing polymer fine particles are used as a base coat as in Patent Document 1, the dielectric constant of the substrate 2 itself increases, making it unsuitable as a circuit molded product. However, in the plated molded product 1 of this embodiment, a good circuit molded product can be made with a low dielectric constant of the substrate 2. Moreover, there is no need to use a paint containing special materials such as conductive or reducing polymer fine particles, and plating can be applied with a general-purpose white paint containing titanium oxide.

[0030] [Plated molded product of the second embodiment and method for manufacturing the same] The plated molded product 1a of the second embodiment of the present invention can also be applied to various molded products in which an electroless metal plating layer is formed on part or all of the surface of a substrate, such as vehicle components, building components, tableware, or molded interconnect devices (MIDs). As shown in Figure 3, it consists of a substrate 2, a non-displaceable plating coating layer 7 laminated and fixed to the surface of the substrate 2, a titanium oxide layer 3 laminated and fixed to the surface of the coating layer 7, and an electroless metal plating layer 4 laminated and fixed to the outside of the titanium oxide layer 3.

[0031] The substrate 2 can be any suitable substrate to which a non-replaceable coating layer 7 can be laminated and fixed to its surface. For example, a hard insulating substrate such as a synthetic resin substrate, a ceramic substrate, or a glass substrate, or a hard conductive substrate such as a metal substrate is preferable. Furthermore, the substrate 2 is suitable whether it is a non-replaceable or replaceable substrate. The structure of the titanium oxide layer 3 and its preferred examples, and the structure of the electroless metal plating layer 4 and its preferred examples are the same as in the first embodiment.

[0032] The coating layer 7 in the second embodiment can be formed from an appropriate material that cannot be substituted by plating, such as a thermosetting resin, a thermoplastic resin, a mixed synthetic resin of two or more types, a synthetic resin with a filler added, or a synthetic resin with a pigment added.

[0033] When forming the plated molded product 1a of the second embodiment, as shown in Figure 4(a), a coating layer 7 that cannot be replaced by plated is laminated and fixed to the surface of the substrate 2. Then, as shown in Figure 4(b), a titanium oxide layer 3 composed of titanium oxide and synthetic resin, which does not contain conductive polymer fine particles or reducing polymer fine particles, or a titanium oxide layer 3 composed of titanium oxide and synthetic resin, which contains additives other than titanium oxide and synthetic resin in amounts of less than 5 parts by weight per 100 parts by weight of synthetic resin, is formed as a base layer and fixed to the surface of the coating layer 7.

[0034] Subsequently, as shown in Figures 4(b) to (e), degreasing treatment, catalyst application treatment, and electroless metal plating layer 4 formation treatment are performed in the same manner as in the first embodiment to obtain the plated molded product 1a of the second embodiment.

[0035] According to the second embodiment, an electroless metal plating layer 4 can be formed on a non-displacement plating coating layer 7 fixed to the surface of the substrate 2 with excellent plating deposition properties, due to the titanium oxide in the titanium oxide layer 3 composed of titanium oxide and synthetic resin. Furthermore, the second embodiment can obtain the same effects as the first embodiment from the same configuration.

[0036] [Examples] An example of the plated molded product 1 of the present invention will be described. Using an epoxy resin substrate 2 and a UV-curable ink composed of 30% by weight titanium dioxide and 70% by weight synthetic resin which is an acrylic resin, the UV-curable ink was applied to a part of the surface of the substrate 2 by UV inkjet printing, and a titanium dioxide layer 3 was formed on the surface of the substrate 2 by the application of the UV-curable ink.

[0037] Next, the substrate 2 on which the titanium dioxide layer 3 was formed was immersed in a 100 mL / L solution of ICP Clean HAC (manufactured by Okuno Pharmaceutical Co., Ltd.) at 30°C for 5 minutes, and then degreased by washing it three times with deionized water. Furthermore, the substrate 2 on which the degreased titanium dioxide layer 3 was formed was immersed in a 50 mL / L solution of Activator (manufactured by Okuno Pharmaceutical Co., Ltd., model number 102210225) at 30°C for 5 minutes, and then washed three times with deionized water to adsorb palladium onto the surface of the titanium dioxide layer 3, thereby imparting a palladium catalyst 6.

[0038] Subsequently, the catalyst-treated substrate 2 was immersed at 60°C for 10 minutes in a mixed solution of 250 mL / L of ICP Nicolon LTN-NP-1 (manufactured by Okuno Pharmaceutical Co., Ltd.), 50 mL / L of ICP Nicolon LPW-LF lubricant (manufactured by Okuno Pharmaceutical Co., Ltd.), and ICP Nicolon LTN-NP-M (manufactured by Okuno Pharmaceutical Co., Ltd.) (the concentration is not specified in this section, but is this procedure feasible for those skilled in the art?), and then washed three times with deionized water. After drying the water, an electroless nickel plating film was laminated and fixed to the outside of the titanium oxide layer 3 as an electroless metal plating layer 4, yielding the plated molded product 1 of the example.

[0039] [Scope of the invention disclosed herein] The inventions disclosed herein include, in addition to the inventions and embodiments listed herein, those specified to the extent applicable by modifying the partial content of these inventions with other content disclosed herein, or by adding other content disclosed herein to these inventions, or by deleting the partial content of these inventions to the extent that partial effects can be obtained and defining them as higher-level concepts.

[0040] Furthermore, in the second embodiment described above, a titanium oxide layer 3 is laminated and fixed to the surface of a coating layer 7 that cannot be plated by displacement, and an electroless metal plating layer 4 is laminated and fixed to the outside of the titanium oxide layer 3. However, the present invention also includes a configuration in which a titanium oxide layer is laminated and fixed to the surface of a coating layer 7 that can be plated by displacement, and an electroless metal plating layer is laminated and fixed to the outside of the titanium oxide layer.

[0041] Furthermore, the plated molded product of the present invention is preferably configured such that a titanium oxide layer is partially laminated and fixed, and a partially plated electroless metal plating layer is formed on the outside of the titanium oxide layer. The plated molded product of the present invention can be applied to various products in which a partially plated electroless metal plating layer is provided by decorating or forming circuits with the partially plated electroless metal plating layer. For example, the plated molded product of the present invention can be applied to products such as antennas, heaters, magnetic coupling resonators, RF tags, and split ring resonators. [Industrial applicability]

[0042] This invention can be used, for example, in plated molded products in which an electroless metal plating layer is formed on a substrate. [Explanation of Symbols]

[0043] 1, 1a…Plated molded product 2…Substrate 3…Titanium oxide layer 4…Electroless metal plating layer 5…Dirt 6…Catalyst 7…Coating layer

Claims

1. It is composed of titanium dioxide and synthetic resin, and has a titanium dioxide layer that does not contain conductive polymer fine particles or reducing polymer fine particles. The titanium oxide layer is laminated and fixed to the surface of the substrate. A plated molded product characterized in that an electroless metal plating layer is laminated and fixed to the outside of the titanium oxide layer.

2. The titanium oxide layer is composed of titanium oxide and synthetic resin, and the additive other than titanium oxide and synthetic resin is contained in an amount of less than 5 parts by weight per 100 parts by weight of the synthetic resin. The titanium oxide layer is laminated and fixed to the surface of the substrate. A plated molded product characterized in that an electroless plated metal layer is laminated and fixed to the outside of the titanium oxide layer.

3. It is composed of titanium dioxide and synthetic resin, and has a titanium dioxide layer that does not contain conductive polymer fine particles or reducing polymer fine particles. A coating layer that cannot be replaced by plating is fixed to the surface of the substrate. The titanium oxide layer is laminated and fixed to the surface of the coating layer. A plated molded product characterized in that an electroless metal plating layer is laminated and fixed to the outside of the titanium oxide layer.

4. The plated molded product according to any one of claims 1 to 3, characterized in that the weight ratio of titanium oxide to the synthetic resin in the titanium oxide layer is 1:9 to 9:

1.

5. The plated molded product according to any one of claims 1 to 3, characterized in that the titanium oxide layer is partially laminated and fixed, and the partially plated electroless metal plating layer is formed on the outside of the titanium oxide layer.

6. The first step involves forming a titanium oxide layer on the surface of a substrate as a base layer, which is composed of titanium oxide and synthetic resin and does not contain conductive polymer fine particles or reducing polymer fine particles. A second step involves applying a catalyst to the surface of the titanium oxide layer, The method for manufacturing a plated molded product according to claim 1, comprising a third step of forming an electroless metal plating layer on the surface of the titanium oxide layer to which the catalyst has been applied.

7. A first step is to form a titanium oxide layer as a base layer on the surface of a substrate, the titanium oxide layer being composed of titanium oxide and synthetic resin, wherein additives other than titanium oxide and synthetic resin are contained in an amount of less than 5 parts by weight per 100 parts by weight of the synthetic resin, A second step involves applying a catalyst to the surface of the titanium oxide layer, The method for manufacturing a plated molded product according to claim 2, further comprising a third step of forming an electroless metal plating layer on the surface of the titanium oxide layer to which the catalyst has been applied.

8. A first step involves fixing a non-displaceable coating layer to the surface of the substrate, A second step involves forming a titanium oxide layer on the surface of the coating layer as a base layer, which is composed of titanium oxide and synthetic resin and does not contain conductive polymer fine particles or reducing polymer fine particles. A third step involves applying a catalyst to the surface of the titanium oxide layer, The method for manufacturing a plated molded product according to claim 3, further comprising a fourth step of forming an electroless metal plating layer on the surface of the titanium oxide layer to which the catalyst has been applied.

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