Substrate transport unit, substrate processing device, transport device

Abstract

A substrate transfer unit is provided that can quickly and reliably transfer substrates (e.g., wafers) between multiple processing modules without contaminating the substrates. [Solution] The substrate transport unit comprises a temporary placement stage and a transport hand. The temporary placement stage and the transport hand are configured to hold the substrate at different points depending on the processing state of the substrate.

Description

Technical Field

[0001] The present invention relates to a substrate transfer unit, a substrate processing apparatus, and a transfer apparatus.

Background Art

[0002] In the manufacture of semiconductor devices, many types of materials are repeatedly formed in a film shape on a wafer to form a laminated structure. In order to form such a laminated structure, a technique for flattening the surface of the wafer has become important. As one means for flattening the surface of such a wafer, a polishing apparatus that performs chemical mechanical polishing (CMP) is used.

[0003] A substrate processing apparatus is an apparatus having a polishing module that performs chemical mechanical polishing (CMP), a cleaning module that cleans the polished wafer, and a drying module that dries the cleaned wafer. The wafer polished by the polishing module is transferred to the cleaning module and the drying module by a transfer robot, and is cleaned and dried by the cleaning module and the drying module. Hereinafter, the polishing module, the cleaning module, and the drying module may be collectively referred to simply as a processing module.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Patent Document 3

Summary of the Invention

Problems to be Solved by the Invention

[0005] To improve wafer productivity, it is desirable to optimize each process of the substrate processing equipment (i.e., to improve wafer productivity without unnecessarily increasing the footprint size of the substrate processing equipment). However, when a new processing module, different from conventional processing modules, is introduced into the substrate processing equipment for various purposes, it may not be possible to directly integrate the new processing module into the substrate processing equipment.

[0006] For example, if a new processing module has a different size than a conventional processing module, the new processing module must be placed in a separate space. As a result, there is a risk that the new processing module must be placed at a distance from existing processing modules (i.e., processing modules already incorporated into the substrate processing device).

[0007] In this case, wafers processed by existing processing modules cannot be quickly transferred to new processing modules, which may prevent optimization of each process in the substrate processing apparatus. In particular, when the cleaning module and drying module are spaced apart from each other, it is necessary to quickly transfer wafers between the cleaning module and the drying module without contaminating them.

[0008] Furthermore, in order to optimize each process, it is necessary to reliably transport the wafer to the next process. For example, if the substrate transport unit has a fragile structure or is large in size, it may not be possible to easily achieve optimization of each process.

[0009] Therefore, the present invention aims to provide a substrate transfer unit and a substrate processing apparatus that can quickly and reliably transfer substrates (e.g., wafers) between multiple processing modules without contaminating the substrates.

[0010] The need to reliably transport objects to the next process is not necessarily limited to wafers; it exists equally for objects other than wafers. Therefore, the present invention aims to provide a transport device that can reliably transport objects. [Means for solving the problem]

[0011] In one embodiment, a substrate transport unit is provided. The substrate transport unit comprises a temporary placement stage on which a substrate is placed, and a transport hand positioned in the same transport space as the temporary placement stage and transporting the substrate placed on the temporary placement stage, wherein the temporary placement stage and the transport hand are configured to hold the substrate at different points depending on the processing state of the substrate.

[0012] In one embodiment, the substrate transport unit includes an extension / retraction mechanism for extending and retracting the transport hand, and a lifting / lowering mechanism and a rotation mechanism for moving the transport hand in the vertical and rotational directions. In one embodiment, the lifting mechanism is configured to move the temporary placement stage and the transport hand together in the vertical direction. In one embodiment, the temporary placement stage includes a first holding pin for holding a substrate before processing, a second holding pin for holding a substrate after processing, and a holding pin switching mechanism for switching between the first and second holding pins for holding the substrate according to the processing state of the substrate.

[0013] In one embodiment, the first retaining pin and the second retaining pin have different heights, and the temporary placement stage is provided with a pin cover that covers the upper surface of the second retaining pin, except when the second retaining pin is holding the substrate. In one embodiment, the transport hand includes a first clamp for clamping the substrate before processing, and a second clamp for clamping the substrate after processing, and located above the first clamp. In one embodiment, the substrate transport unit is equipped with a hand lifting actuator that raises and lowers the transport hand relative to the temporary placement stage, and the hand lifting actuator is configured to raise and lower the transport hand when the substrate is being transferred. In one embodiment, the substrate transport unit is equipped with a stage lifting actuator that moves the temporary placement stage up and down relative to the transport hand, and the stage lifting actuator is configured to move the temporary placement stage up and down when the substrate is being transferred.

[0014] In one embodiment, a substrate processing apparatus is provided. The substrate processing apparatus comprises a substrate transport unit, a substrate processing unit for processing substrates transported by the substrate transport unit, and a temporary storage table for receiving the substrates transported by the substrate transport unit.

[0015] In one embodiment, the substrate processing unit comprises at least one of a drying module for drying the substrate and a measuring module for measuring the surface condition of the substrate. In one embodiment, the substrate processing apparatus includes a polishing unit for polishing the substrate and a cleaning unit disposed between the polishing unit and the substrate processing unit for cleaning the substrate polished by the polishing unit. In one embodiment, the substrate transport unit is equipped with a detection device for detecting the presence or absence of the substrate, and the substrate processing device is equipped with a control device for determining the presence or absence of the substrate based on the substrate blocking the light irradiated from the detection device.

[0016] In one embodiment, a substrate processing apparatus is provided. The substrate processing apparatus comprises a temporary placement stage for transporting a substrate in a first transport direction and a second transport direction perpendicular to the first transport direction, and a transport hand disposed in the same transport space as the temporary placement stage and for reciprocating transport of the substrate in the first transport direction.

[0017] In one aspect, a conveying device is provided. The conveying device includes a conveying hand for conveying an object, a group of tubes for supplying fluid to the conveying hand, and a fixing structure for fixing the ends of the group of tubes. The group of tubes includes a first tube as a core wire and a second tube wound around the first tube so as to be in close contact with the first tube when the conveying hand moves.

[0018] In one aspect, the second tube is wound around the first tube a plurality of times in one direction. In one aspect, the fixing structure includes a movable end structure and a fixed end structure for fixing the group of tubes, and the movable end structure is attached to the conveying hand.

Advantages of the Invention

[0019] Each of the temporary placement stage and the conveying hand is configured to hold the substrate at different sites according to the processing state of the substrate. Therefore, the substrate conveying unit can convey the substrate to the next process quickly and reliably without contaminating the substrate.

Brief Description of the Drawings

[0020] [Figure 1] It is a diagram showing an embodiment of a substrate processing apparatus. [Figure 2] It is a view taken in the direction of arrow A of FIG. [Figure 3] FIG. 3(a) is a diagram showing an embodiment of a substrate conveying unit. FIG. 3(b) is a diagram showing another embodiment of the substrate conveying unit. [Figure 4] It is a diagram showing an example of a processing step of a wafer. [Figure 5] FIG. 5(a) is a diagram showing an embodiment of a substrate conveying unit. FIG. 5(b) is a diagram showing an embodiment of a holding pin of a temporary placement stage. [Figure 6] It is a diagram showing a wafer before processing that is conveyed from a pen cleaning chamber to a substrate conveying unit by a conveying robot in a second conveying chamber and held by a first holding pin. [Figure 7] This figure shows a wafer before processing, which has been transported from the pen cleaning chamber to the substrate transport unit by the transport robot in the second transport chamber and is held by the first holding pin. [Figure 8] This figure shows a wafer clamped to the first clamp of a transport hand by the proximity movement of two hand arms. [Figure 9] This figure shows a wafer clamped to the first clamp of a transport hand by the proximity movement of two hand arms. [Figure 10] This figure shows a wafer clamped to the second clamp of the transport hand. [Figure 11] This figure shows a wafer clamped to the second clamp of the transport hand. [Figure 12] This figure shows a wafer held by the second holding pin of the temporary placement stage. [Figure 13] This figure shows a wafer held by the second holding pin of the temporary placement stage. [Figure 14] This figure shows one embodiment of a group of tubes for supplying fluid to a transport hand. [Figure 15] This figure shows one embodiment of a fixing structure for securing the ends of a group of tubes. [Figure 16] This figure shows one embodiment of a fixing structure for securing the ends of a group of tubes. [Modes for carrying out the invention]

[0021] Embodiments of the present invention will be described below with reference to the drawings. In the drawings described below, the same or corresponding components are denoted by the same reference numerals, and redundant descriptions are omitted. In the multiple embodiments described below, the configuration of one embodiment that is not specifically described is the same as that of the other embodiments, so redundant descriptions are omitted.

[0022] Figure 1 shows one embodiment of a substrate processing apparatus. As shown in Figure 1, the substrate processing apparatus PA is an apparatus for processing a wafer W as an example of a substrate. The substrate processing apparatus PA is equipped with a substantially rectangular housing 1.

[0023] The housing 1 divides the internal area of ​​the substrate processing apparatus PA into multiple regions (for example, a loading / unloading section 2, a polishing section 3, and a cleaning section 4) by multiple partitions formed inside it. The loading / unloading section 2, the polishing section 3, and the cleaning section 4 are each assembled independently and exhausted independently.

[0024] The substrate processing apparatus PA includes a control device 5 that controls the processing operation of the wafer W. The control device 5 is electrically connected to multiple devices arranged in multiple areas, including a load / unload unit 2, a polishing unit 3, and a cleaning unit 4, and is configured to control the operation of each device.

[0025] The control unit 5 comprises a storage device 5a in which a program is stored, and an arithmetic unit 5b that performs calculations according to the instructions contained in the program. The control unit 5 is composed of at least one computer. The storage device 5a comprises a main memory such as random access memory (RAM) and an auxiliary storage device such as a hard disk drive (HDD) or solid-state drive (SSD). Examples of arithmetic units 5b include a CPU (central processing unit) and a GPU (graphics processing unit). However, the specific configuration of the control unit 5 is not limited to these examples.

[0026] The load / unload section 2 includes two or more (three in this embodiment) front load sections 20 on which wafer cassettes for stocking a number of wafers W are mounted. The front load sections 20 are positioned adjacent to the housing 1 and are arranged along the width direction (perpendicular to the longitudinal direction) of the substrate processing apparatus PA. The front load sections 20 are configured to accommodate open cassettes, SMIF (Standard Manufacturing Interface) pods, or FOUP (Front Opening Unified Pod).

[0027] The substrate processing apparatus PA includes a transport robot 22 located in the load / unload section 2, and a horizontal movement mechanism and a vertical movement mechanism for moving the transport robot 22 horizontally and vertically. The horizontal movement mechanism and the vertical movement mechanism are not shown in the illustration.

[0028] The transport robot 22 is configured to move along the alignment direction of the front load section 20 (i.e., the width direction of the substrate processing device PA) by a horizontal movement mechanism, and accesses the wafer cassette mounted on the front load section 20.

[0029] The transport robot 22 is configured to take one wafer W to be polished from the wafer cassette and transport the wafer W to the first linear transporter 6 (more specifically, the first transport position TP1). The first linear transporter 6 is a mechanism for transporting the wafer W between four transport positions (the first transport position TP1, the second transport position TP2, the third transport position TP3, and the fourth transport position TP4, which are arranged along the longitudinal direction of the substrate processing apparatus PA).

[0030] The transport robot 22 can access the temporary storage platform 505 (described later), which is located above the first transport position TP1, via a vertical movement mechanism. Therefore, the transport robot 22 is configured to take out the wafer W placed on the temporary storage platform 505 and return it to the wafer cassette.

[0031] The polishing section 3 is the region where the wafer W is polished (planarized). The polishing section 3 comprises a first polishing module 3A, a second polishing module 3B, a third polishing module 3C, and a fourth polishing module 3D. The first polishing module 3A, the second polishing module 3B, the third polishing module 3C, and the fourth polishing module 3D are arranged along the longitudinal direction of the polishing apparatus, as shown in Figure 1.

[0032] The first polishing module 3A, the second polishing module 3B, the third polishing module 3C, and the fourth polishing module 3D have essentially the same configuration. Therefore, the configuration of the first polishing module 3A will be described below.

[0033] Although not shown in the diagram, the first polishing module 3A includes a polishing table to which a polishing pad (polishing tool) having a polishing surface is attached, a top ring that holds the wafer W and presses it against the polishing pad on the polishing table, a polishing fluid supply nozzle for supplying polishing fluid and dressing fluid (e.g., pure water) to the polishing pad, and a dresser for dressing the polishing surface of the polishing pad.

[0034] The substrate processing apparatus PA includes a second linear transporter 7 positioned adjacent to the third polishing module 3C and the fourth polishing module 3D. The second linear transporter 7 is a mechanism for transporting wafers W between three transport positions (a fifth transport position TP5, a sixth transport position TP6, and a seventh transport position TP7, positioned along the longitudinal direction of the substrate processing apparatus PA) along the direction in which the polishing modules 3C and 3D are arranged.

[0035] The first linear transporter 6 transports the wafer W to polishing modules 3A and 3B. The top ring of the first polishing module 3A moves between the polishing position and the second transport position TP2 by its swinging motion.

[0036] Similarly, the top ring of the second polishing module 3B moves between the polishing position and the third transport position TP3. The top ring of the third polishing module 3C moves between the polishing position and the sixth transport position TP6. The top ring of the fourth polishing module 3D moves between the polishing position and the seventh transport position TP7.

[0037] The substrate processing apparatus PA comprises a first linear transporter 6, a second linear transporter 7, a cleaning unit 4, and a swing transporter 12 positioned between them. The swing transporter 12 has a hand (not shown) that can move between a fourth transport position TP4 and a fifth transport position TP5. The swing transporter 12 is configured to transfer wafers W from the first linear transporter 6 to the second linear transporter 7.

[0038] The wafer W polished in the polishing section 3 is transported to the cleaning section 4. In the embodiment shown in Figure 1, the cleaning section 4 comprises a roll cleaning chamber 190, a first transport chamber 191, a pen cleaning chamber 192, a second transport chamber 193, a buffing chamber 300, a third transport chamber 195, and a substrate transport unit 502. The configuration of the substrate transport unit 502 will be described later.

[0039] The substrate processing apparatus PA includes an upper roll cleaning module 201A and a lower roll cleaning module 201B located in the roll cleaning chamber 190. The upper roll cleaning module 201A and the lower roll cleaning module 201B are arranged along the vertical direction. The upper roll cleaning module 201A and the lower roll cleaning module 201B have essentially the same configuration.

[0040] The upper roll cleaning module 201A and the lower roll cleaning module 201B are cleaning machines that clean wafers W by supplying cleaning fluid to the front and back surfaces of the rotating wafer W and pressing two rotating roll sponges (first cleaning tools) against the front and back surfaces of the wafer W, respectively.

[0041] The substrate processing apparatus PA comprises an upper pen cleaning module 202A and a lower pen cleaning module 202B located in the pen cleaning chamber 192. The upper pen cleaning module 202A and the lower pen cleaning module 202B are arranged along the vertical direction. The upper pen cleaning module 202A and the lower pen cleaning module 202B have essentially the same configuration.

[0042] The upper pen cleaning module 202A and the lower pen cleaning module 202B are cleaning machines that clean wafers W by supplying cleaning fluid to the surface of a rotating wafer W and pressing a rotating pencil sponge (second cleaning tool) against the surface of the wafer W, causing it to oscillate in the radial direction of the wafer W.

[0043] The substrate processing apparatus PA comprises an upper buffing module 300A and a lower buffing module 300B located in the buffing chamber 300. The upper buffing module 300A and the lower buffing module 300B have essentially the same configuration. Therefore, the configuration of the upper buffing module 300A will be described below.

[0044] Although not shown in the diagram, the upper buffing module 300A includes a buffing table on which the wafer W is placed, a buffing head to which a buffing pad (third cleaning tool) is attached for buffing the processing surface of the wafer W, a buffing arm for holding the buffing head, and a conditioning unit for conditioning (sharpening) the buffing pad.

[0045] Hereinafter, in this specification, the polishing module, the washing module, and the drying module may be collectively referred to as the processing module.

[0046] As mentioned above, it is desirable to optimize each process of the substrate processing apparatus PA, but new processing modules introduced into the substrate processing apparatus PA may have different sizes from conventional processing modules. In this case, it may be necessary to position the new processing module separately from the existing processing modules.

[0047] In this embodiment, even in such cases, the substrate processing apparatus PA has a configuration that enables optimization of each process of the wafer W. In particular, the substrate processing apparatus PA is equipped with a substrate transfer unit 502 that can quickly and reliably transfer the wafer W between multiple processing modules without contaminating the wafer W.

[0048] Figure 2 is a view taken along line A in Figure 1. As shown in Figure 2, the substrate processing apparatus comprises a substrate transport unit 502, a substrate processing unit 500 for processing the wafer W transported by the substrate transport unit 502, and a temporary storage table 505 for receiving the wafer W transported by the substrate transport unit 502.

[0049] In the embodiment shown in Figure 2, the substrate processing unit 500 includes a measuring module 500A for measuring the surface condition of the wafer W (for example, the film thickness formed on the surface of the wafer W, the cleanliness of the surface of the wafer W), and a drying module 500B for drying the wafer W. In one embodiment, the substrate processing unit 500 may include at least one of the measuring module 500A and the drying module 500B.

[0050] The 500A measurement module is a standalone measuring device that measures the surface condition of a wafer W while the wafer W is stationary. The measuring device is, for example, a film thickness measuring instrument (e.g., ITM (In-line Thickness Monitor)) that measures the film thickness profile of the wafer W, or a measuring instrument (particle analyzer, particle counter) that measures the number of particles on the surface of the wafer W.

[0051] The control device 5 (see Figure 1) is electrically connected to the measurement module 500A. The control device 5 is configured to receive data measured by the measurement module 500A and to control the operation of the components of the substrate processing apparatus PA.

[0052] In the embodiment shown in Figure 2, the measurement module 500A is positioned above the drying module 500B. The substrate transport unit 502 is configured to have access to both the measurement module 500A and the drying module 500B.

[0053] Figure 3(a) shows one embodiment of the substrate transport unit. Figure 3(b) shows another embodiment of the substrate transport unit. As shown in Figure 3(a), the substrate transport unit 502 includes a temporary placement stage 600 on which wafers W are placed, and a transport hand 620 which is arranged in the same transport space as the temporary placement stage 600 and transports the wafers W placed on the temporary placement stage 600.

[0054] Furthermore, the substrate transport unit 502 includes a lifting mechanism LM that moves the temporary placement stage 600 and the transport hand 620 together in the vertical direction, and a rotating mechanism RM that moves at least the transport hand 620 in the rotational direction.

[0055] The substrate transport unit 502 is configured to move the wafer W in the vertical and rotational directions by the operation of the lifting mechanism LM and the rotating mechanism RM. With this configuration, the substrate transport unit 502 can move the transport hand 620 vertically by operating the lifting mechanism LM, thereby accessing the measurement module 500A and the drying module 500B. Furthermore, the substrate transport unit 502 can change the direction of the transport hand 620 by operating the rotating mechanism RM, thereby accessing the temporary storage table 505.

[0056] As shown in Figure 3(b), the substrate transport unit 502 further includes a mounting table 800 on which a temporary placement stage 600, a transport hand 620, and a rotating mechanism RM are placed and which is connected to a lifting mechanism LM. With this configuration, the substrate transport unit 502 moves not only the temporary placement stage 600 and the transport hand 620, but also the rotating mechanism RM in the vertical direction by operating the lifting mechanism LM.

[0057] In the embodiment shown in Figure 3(b), the rotation mechanism RM is configured to rotate not only the transport hand 620 but also the temporary placement stage 600. The rotation mechanism RM rotates the transport hand 620 and the temporary placement stage 600 together. Therefore, the rotation mechanism RM can prevent contact between the temporary placement stage 600 and the transport hand 620 caused by the relative rotation of the transport hand 620 with respect to the temporary placement stage 600.

[0058] In this embodiment, the cleaning unit 4 is located between the polishing unit 3 and the substrate processing unit 500 (see Figure 1). The substrate processing unit 500 is located in the load / unload unit 2 and is positioned adjacent to the transport robot 22.

[0059] As shown in Figure 1, the substrate transport unit 502 and the substrate processing unit 500 are arranged in a straight line along the longitudinal direction of the substrate processing apparatus PA. The temporary storage table 505 is positioned above the first transport position TP1. The substrate transport unit 502 and the temporary storage table 505 are arranged in a direction perpendicular to the arrangement direction of the substrate transport unit 502 and the substrate processing unit 500 (i.e., the width direction of the substrate processing apparatus PA).

[0060] In one embodiment, the substrate processing unit 500, the substrate transport unit 502, and the temporary storage table 505 may be arranged along the width direction of the substrate processing apparatus PA. In this case, the substrate processing unit 500 is located outside the housing 1.

[0061] In this embodiment, when the longitudinal direction of the substrate processing apparatus PA is defined as the first transport direction and the width direction of the substrate processing apparatus PA is defined as the second transport direction, the temporary placement stage 600 is positioned to transport the wafer W in both the first and second transport directions. The transport hand 620 is configured to reciprocate the wafer W between the substrate processing unit 500 and the transport hand in the first transport direction.

[0062] Figure 4 shows an example of the wafer processing process. As shown in steps S101 and S102 of Figure 4, the wafer W is polished in the polishing section 3 and then cleaned in the cleaning section 4. After that, the wafer W is transported from the pen cleaning section 192 to the substrate transport unit 502 by a transport robot (not shown) in the second transport chamber 193.

[0063] As shown in step S103, the substrate transport unit 502 transports the wafer W to the drying module 500B, and the drying module 500B dries the washed wafer W (see step S104).

[0064] Subsequently, the substrate transport unit 502 transports the dried wafer W to the measurement module 500A (see step S105), and the measurement module 500A measures the surface condition of the wafer W (see step S106).

[0065] The control device 5 determines whether or not to repolish the wafer W based on the surface condition of the wafer W measured by the measurement module 500A. If the wafer W is to be repolished, the wafer W is transported to the temporary storage table 505 (see steps S107 and S108). Subsequently, the transport robot 22 transports the wafer W placed on the temporary storage table 505 from the load / unload unit 2 to the first transport position TP1 (see steps S109 and S110).

[0066] If wafer W is not to be repolished, wafer W is transported to the temporary storage table 505 (see steps S111 and S112), and the transport robot 22 returns wafer W, which is placed on the temporary storage table 505, from the load / unload unit 2 to the front load unit 20 (see step S113).

[0067] As described above, the substrate transport unit 502 transports the wafer W before processing (in this embodiment, after cleaning and before drying) and the wafer W after processing (in this embodiment, after drying). In order to improve the productivity of the wafer W, it is necessary to transport the wafer W quickly without contaminating it. Therefore, the substrate transport unit 502 is configured to transport the wafer W quickly without contaminating it. The configuration of the substrate transport unit 502 will be described below with reference to the drawings.

[0068] Figure 5(a) shows one embodiment of the substrate transport unit. Figure 5(b) shows one embodiment of the holding pins of the temporary placement stage. In the embodiment shown in Figure 5(a), the temporary placement stage 600 and the transport hand 620 are configured to hold the wafer W at different locations depending on the processing state of the wafer W (i.e., before processing, after processing). With this configuration, the substrate transport unit 502 can transport the wafer W without contaminating it.

[0069] Furthermore, the temporary placement stage 600 and the transport hand 620 are configured to hold the wafer W before processing at one end and the wafer W after processing at the other end. With this configuration, the substrate transport unit 502 can transport the wafer W quickly and reliably.

[0070] As shown in Figure 5(a), the substrate transport unit 502 includes a bracket 629 to which the transport hand 620 is fixed, and an extension / retraction mechanism AC1 that extends and retracts (i.e., moves back and forth) the transport hand 620 through the bracket 629.

[0071] The temporary placement stage 600 includes a mounting base 635 to which a bracket 629 is attached. The telescopic mechanism AC1 is configured to move the bracket 629 along the horizontally extending mounting base 635. The telescopic mechanism AC1 is, for example, an air cylinder. The transport hand 620, fixed to the bracket 629, moves horizontally with the bracket 629 as a result of the operation of the telescopic mechanism AC1 (see arrow α in Figure 5(a)).

[0072] The transport hand 620 has two hand arms 621 extending parallel to each other, and two projections 625 fixed to each of the two hand arms 621. The projections 625 extend from the hand arms 621 toward the mounting base 635.

[0073] The two hand arms 621 are configured to move closer to or further apart from each other by an actuator AC3 such as an air cylinder (see arrow β in Figure 5(a)). When the two hand arms 621 are close to each other, the projection 625 holds the periphery of the wafer W.

[0074] The temporary placement stage 600 includes a plurality of first holding pins 610A for holding the wafer W before processing, a plurality of second holding pins 610B for holding the wafer W after processing, and a holding pin switching mechanism AC2 that switches the holding pins for holding the substrate between the first holding pins 610A and the second holding pins 610B depending on the processing state of the wafer W.

[0075] The first retaining pin 610A and the second retaining pin 610B have different heights but are basically identical in configuration. Therefore, the configuration of the first retaining pin 610A will be described below.

[0076] As shown in Figure 5(b), the first retaining pin 610A has a conical upper surface 611 formed at its apex and a shoulder portion 612 located at the lowest part of the upper surface 611. The shoulder portion 612 has a larger diameter than the upper surface 611 and is configured to hold the peripheral edge of the wafer W.

[0077] The temporary placement stage 600 includes a movable base 550 mounted on a mounting base 635. The retaining pin switching mechanism AC2 is configured to move the movable base 550 along the direction in which the mounting base 635 extends (see arrow γ in Figure 5(a)).

[0078] The first retaining pin 610A and the second retaining pin 610B are fixed on the movable base 550 and move horizontally together with the movable base 550 due to the operation of the retaining pin switching mechanism AC2. The direction of movement of the first retaining pin 610A and the second retaining pin 610B is the same as the direction of movement of the transport hand 620.

[0079] Figures 6 and 7 show the wafer before processing, which has been transported from the pen cleaning chamber 192 to the substrate transport unit 502 by a transport robot (not shown) in the second transport chamber 193 and is held by the first holding pins 610A. As shown in Figures 6 and 7, the wafer W transported to the substrate transport unit 502 is held by four first holding pins 610A (see step S103 in Figure 4).

[0080] The first retaining pin 610A and the second retaining pin 610B have different heights, with the upper surface 611 of the first retaining pin 610A positioned lower than the upper surface 611 of the second retaining pin 610B. When the wafer W is lowered from the transport hand 620, the wafer W is guided by its periphery on the conical upper surface 611 at the top of the retaining pin 610A (or retaining pin 610B) and held by the shoulder portion 612 located at the lowest part of the upper surface 611.

[0081] Along the extension and retraction direction of the transport hand 620 (i.e., the direction of arrow α in Figure 5(a)), the distance between the front and rear first retaining pins 610A, 610A (see distance DT1 in Figure 7) is shorter than the distance between the front and rear second retaining pins 610B, 610B (see distance DT2 in Figure 7). Therefore, when the wafer W is held by all (4) first retaining pins 610A, all (4) second retaining pins 610B are not covered by the wafer W.

[0082] As shown in Figure 7, the substrate transport unit 502 is equipped with a stage lifting actuator LAC1 that moves the temporary placement stage 600 (more specifically, the mounting base 635 and the movable base 550) up and down relative to the transport hand 620.

[0083] The stage lifting actuator LAC1 is configured to raise and lower the temporary storage stage 600 when transferring wafers W. The stage lifting actuator LAC1 is, for example, an air cylinder. The control device 5 is electrically connected to the stage lifting actuator LAC1 and raises and lowers the temporary storage stage 600 by operating the stage lifting actuator LAC1.

[0084] The stage lifting actuator LAC1 lowers the temporary placement stage 600 to avoid collision between the transport hand 620 (more specifically, the projection 625) and the pin cover 615 when the transport hand 620 is moving.

[0085] When the transport hand 620 moves to an upper position above the temporary storage stage 600 while holding the wafer W, the stage lifting actuator LAC1 raises the temporary storage stage 600 in order to place the wafer W on the temporary storage stage 600.

[0086] The substrate transport unit 502 is equipped with a hand lifting actuator LAC2 that moves the transport hand 620 up and down relative to the temporary placement stage 600. The hand lifting actuator LAC2 is configured to move the transport hand 620 up and down when transferring wafers W.

[0087] The hand lifting actuator LAC2 is, for example, an air cylinder. The control device 5 is electrically connected to the hand lifting actuator LAC2 and raises and lowers the transport hand 620 by operating the hand lifting actuator LAC2.

[0088] When the transport hand 620 receives a wafer W from the first holding pin 610A, the processing (rotary drying) stage (not shown) of the drying module 500B, or the measurement stage (not shown) of the measurement module 500A, the hand lifting actuator LAC2 lowers the transport hand 620 to the holding height of the wafer W. Then, with the peripheral edge of the wafer W clamped by the transport hand 620, the hand lifting actuator LAC2 raises the transport hand 620 to the transport height of the wafer W.

[0089] When the transport hand 620 transfers the wafer W to the second holding pin 610B, the processing stage of the drying module 500B, the measurement stage of the measurement module 500A, or the stage of the temporary stand 505, the hand lifting actuator LAC2 lowers to the holding height of the wafer W. Subsequently, the transport hand 620 releases the clamp on the peripheral edge of the wafer W, and the hand lifting actuator LAC2 raises the transport hand 620 to a predetermined standby height.

[0090] The wafer W before processing is, in other words, a wafer W that has been cleaned and is not yet dried. Therefore, the wafer W before processing is in a wet state. By positioning the upper surface of the first holding pin 610A below the upper surface of the second holding pin 610B, even if the first holding pin 610A holds the wet wafer W, droplets and particles adhering to the surface of the wafer W will not adhere to the second holding pin 610B. Therefore, the temporary placement stage 600 can prevent contamination of the second holding pin 610B.

[0091] Figures 8 and 9 show a wafer clamped to the first clamp of the transport hand 620 by the proximity movement of two hand arms 621. The transport hand 620 is equipped with a first clamp 626A and a second clamp 626B formed on a projection 625. Both the first clamp 626A and the second clamp 626B have a claw shape and are configured to grip the peripheral edge of the wafer W.

[0092] The first clamp 626A is configured to clamp the wafer W before processing. The second clamp 626B is configured to clamp the wafer W after processing. The second clamp 626B is positioned above the first clamp 626A. Therefore, even if the first clamp 626A holds the wet wafer W, droplets and particles adhering to the surface of the wafer W will not adhere to the second clamp 626B. Thus, the transport hand 620 can prevent contamination of the second clamp 626B.

[0093] The transport hand 620, while holding the wafer W before processing with the first clamp 626A, rotates 90 degrees by the rotation mechanism RM toward the direction in which the drying module 500B is located, and then moves forward by the extension / retraction mechanism AC1 to transport the wafer W to the drying module 500B (see step S104 in Figure 4). At this time, the wet wafer W passes over the second holding pin 610B adjacent to the drying module 500B. Therefore, there is a risk that droplets or particles adhering to the surface of the wafer W may fall off.

[0094] Therefore, the temporary placement stage 600 is equipped with a pin cover 615 that covers the upper surface of the second retaining pin 610B, except when the wafer W is being held by the second retaining pin 610B. The pin cover 615 is attached to the mounting base 635, but not to the movable base 550. Consequently, even if the movable base 550 moves, the pin cover 615 does not move with the movable base 550.

[0095] The pin cover 615 prevents droplets or particles adhering to the surface of the wafer W from adhering to the second retaining pin 610B. With this configuration, even when a wet wafer W passes over the second retaining pin 610B, the temporary placement stage 600 can prevent contamination of the second retaining pin 610B.

[0096] Figures 10 and 11 show a wafer clamped to the second clamp of the transport hand. After the wafer W is dried in the drying module 500B, the wafer W is again held by the transport hand 620, retracted by the telescopic mechanism AC1, rotated 90 degrees by the rotation mechanism RM toward the direction in which the substrate transport unit 502 is located, and transported to the substrate transport unit 502 (see step S105 in Figure 4).

[0097] As shown in Figures 10 and 11, the transport hand 620 clamps the dried wafer W with the second clamp 626B. The second clamp 626B is positioned above the first clamp 626A and maintains a clean state. Therefore, even when the second clamp 626B clamps the processed wafer W, the transport hand 620 can place the wafer W on the temporary storage stage 600 without contaminating the wafer W.

[0098] When the transport hand 620 holds the wafer W before processing with the first clamp 626A, the hand lifting actuator LAC2 lowers the transport hand 620 by a first distance so that the height of the wafer W matches the height of the first clamp 626A (first lowering operation). On the other hand, when the transport hand 620 holds the wafer W after processing with the second clamp 626B, the hand lifting actuator LAC2 lowers the transport hand 620 by a second distance greater than the first distance so that the height of the wafer W matches the height of the second clamp 626B (second lowering operation).

[0099] Figures 12 and 13 show a wafer held by the second retaining pins of the temporary placement stage. When the transport hand 620 places the wafer W on the temporary placement stage 600, the four second retaining pins 610B arranged around the wafer W move toward each other by the movement of the movable base 550 along the extension and retraction direction of the transport hand 620, thereby holding the wafer W. At this time, at least a portion of the second retaining pins 610B is exposed from the pin cover 615.

[0100] The second retaining pin 610B has a higher height than the first retaining pin 610A and maintains a clean state. Therefore, the second retaining pin 610B can hold the wafer W after processing without contaminating the wafer W.

[0101] The substrate transport unit 502 is equipped with a detection device 630 that detects whether or not a wafer W has been transferred (see Figures 5(a), 7, 9, 11, and 13). In this embodiment, the detection device 630 is an optical sensor having a light-emitting unit 631 and a light-receiving unit 632. The light-emitting unit 631 is configured to irradiate light perpendicularly onto the wafer W transported by the substrate transport unit 502. The light-receiving unit 632 is positioned opposite the light-emitting unit 631 and receives light irradiated from the light-emitting unit 631. In this embodiment, the light-receiving unit 632 is positioned above the light-emitting unit 631.

[0102] The control device 5 is electrically connected to the detection device 630 and is configured to determine the presence or absence of the wafer W based on the blocking of light emitted from the light-emitting unit 631 by the wafer W. When the light-receiving unit 632 receives light emitted from the light-emitting unit 631, the light-receiving unit 632 sends a detection signal to the control device 5.

[0103] When the control device 5 receives a detection signal from the light receiving unit 632, the control device 5 determines that the wafer W is not present in the substrate transport unit 502. On the other hand, if the light emitted from the light emitting unit 631 is blocked by the wafer W, the light receiving unit 632 does not detect the light emitted from the light emitting unit 631, and the light receiving unit 632 does not transmit a detection signal to the control device 5. In this way, the control device 5 determines whether or not the wafer W is present in the substrate transport unit 502 based on whether or not a detection signal is transmitted.

[0104] When the unprocessed wafer W, which has been transported by the substrate transport unit 502, is placed on the temporary placement stage 600, the light emitted from the light-emitting unit 631 is blocked by the wafer W, and the control device 5 determines the presence of the wafer W placed on the temporary placement stage 600 (see Figure 7).

[0105] Subsequently, when the transport hand 620 clamps the wafer W and transports it to the drying module 500B, the light emitted from the light-emitting unit 631 is not blocked by the wafer W, and the control device 5 determines that the wafer W has been transported from the substrate transport unit 502.

[0106] When the transport hand 620 introduces the wafer W, which has been dried in the drying module 500B, into the substrate transport unit 502 and moves it to a position above the temporary placement stage 600, the light emitted from the light-emitting unit 631 is blocked by the wafer W, and the control device 5 determines that the wafer W has been transported to the substrate transport unit 502 (see Figure 11).

[0107] Subsequently, from the time the transport hand 620 places the wafer W on the temporary placement stage 600 until the wafer W is transported from the temporary placement stage 600 to the temporary placement stand 505, the control device 5 determines that the wafer W is present in the substrate transport unit 502.

[0108] After the wafer W is transported to the temporary storage stand 505, the control device 5 determines that the wafer W has been transported from the substrate transport unit 502 if the light emitted from the light-emitting unit 631 is not blocked by the wafer W.

[0109] Figure 14 shows one embodiment of a group of tubes for supplying fluid to a transport hand. In order to optimize each process of the substrate processing apparatus PA, it is necessary to reliably transport the wafer W to the next process. To achieve such transport, it is desirable that the substrate transport unit 502 has a highly durable configuration.

[0110] In particular, the substrate transport unit 502 is equipped with a group of tubes CA for supplying the fluid necessary for its operation (see Figure 5(a)). This group of tubes CA connects a movable device such as the transport hand 620 to a stationary device such as a fluid supply source (not shown). Therefore, repeated extension and retraction of the transport hand 620 may cause the group of tubes CA to come into contact with the walls of the substrate transport unit 502 or the transport hand 620, potentially resulting in damage.

[0111] To prevent damage to such tube groups CA, it is conceivable to house the tube groups CA in a cable carrier (registered trademark) (not shown). However, using a cable carrier may generate dust that can contaminate the wafer W, and there are concerns from the standpoint of chemical resistance. Furthermore, since cable carriers require a large installation space, the overall size of the substrate transport unit 502, and even the overall size of the substrate processing apparatus PA, will increase.

[0112] Therefore, in the embodiment shown in Figure 14, the tube group CA has a configuration that prevents the generation of dust and does not require a large installation space. More specifically, the tube group CA comprises a first tube CA0 as a core wire, and second tubes CA1 and CA2 that are wrapped around the first tube CA0 so as to be in close contact with the first tube CA0 when the transport hand 620 is moving.

[0113] As shown in Figure 14, the first tube CA0 consists of one tube, and each of the second tubes CA1 and CA2 consists of two tubes. The second tubes CA1 and CA2 have different diameters. In this specification, for the sake of clarity in the drawings, each of the multiple second tubes CA1 and CA2 is not assigned a separate reference numeral, but rather a simplified reference numeral is assigned to each of the second tubes CA1 and CA2.

[0114] The first tube CA0 is thicker and more durable than the second tubes CA1 and CA2. The second tubes CA1 and CA2 are wrapped around the first tube CA0 in one direction. In one embodiment, the second tubes CA1 and CA2 may be wrapped around the first tube CA0 multiple times.

[0115] Due to this wrapping, the second tubes CA1 and CA2 adhere closely to the first tube CA0, and even when the conveyor hand 620 moves, the second tubes CA1 and CA2 do not separate from the first tube CA0, but remain wrapped around the first tube CA0 while moving together with the conveyor hand 620.

[0116] The second tubes CA1 and CA2 are wrapped around the first tube CA0 without the use of fasteners such as cable ties. Therefore, they can bend flexibly as the transport hand 620 moves. As a result, the second tubes CA1 and CA2 are not bent or pulled.

[0117] Figures 15 and 16 show one embodiment of a fixing structure for securing the ends of a group of tubes. As shown in Figures 15 and 16, the substrate transport unit 502 is equipped with a fixing structure for securing the ends of the group of tubes CA.

[0118] The fixed structure includes a movable end structure 700 (see Figure 15) and a fixed end structure 710 (see Figure 16) for clamping and fixing the tube group CA. As shown in Figure 15, the movable end structure 700 is attached to the transport hand 620. The movable end structure 700 has a lower end 701 for fixing the second tube CA2 and an upper end 702 for fixing the second tube CA1.

[0119] The second tube CA2 is inserted into the insertion hole 703C at the lower end 701, and the second tube CA1 is inserted into the insertion hole 703B at the upper end 702. The first tube CA0 is inserted into the insertion hole 703A formed by the lower end 701 and the upper end 702. The lower end 701 and the upper end 702 are close to each other and clamp the tube group CA in place.

[0120] As shown in Figure 16, the fixed end structure 710 is attached to the mounting base 635. The fixed end structure 710 has a lower end 711 for fixing the second tube CA2 and an upper end 712 for fixing the second tube CA1.

[0121] The second tube CA2 is inserted into the insertion hole 713C at the lower end 711, and the second tube CA1 is inserted into the insertion hole 713B at the upper end 712. The first tube CA0 is inserted into the insertion hole 713A formed by the lower end 711 and the upper end 712. The lower end 711 and the upper end 712 are close to each other and clamp the tube group CA in place.

[0122] In this way, by fixing the tube group CA with the fixed structure (i.e., the movable end structure 700 and the fixed end structure 710), it is possible to prevent the second tubes CA1 and CA2, which are wrapped around the first tube CA0, from coming apart.

[0123] The need to reliably transport the object to be transported to the next process is not necessarily limited to wafers W. Such a need exists equally for objects other than wafers W. Therefore, although the above-described embodiment described a substrate transport unit 502 configured to reliably transport wafers W to the next process, the configuration applied to the substrate transport unit 502 is also applicable to transport devices that can reliably transport objects other than wafers W.

[0124] The embodiments described above are intended to enable persons with ordinary skill in the art to implement the present invention. Various modifications of the above embodiments can be made naturally by those skilled in the art, and the technical idea of ​​the present invention can be applied to other embodiments as well. Therefore, the present invention is not limited to the embodiments described, but is to be interpreted in the broadest sense according to the technical idea defined by the claims. [Explanation of symbols]

[0125] 1 Housing 2 Load / Unload Section 3 Polishing section 3A~3D polishing module 4. Cleaning section 5 Control device 5a Storage device 5b Arithmetic unit 6. First linear transporter 7. Second linear transporter 12 Swing Transporter 20 Front Load Section 22 Transport robots 190 Roll Washing Room 191 First Transport Room 192 Pen Cleaning Room 193 Second transport room 195 Third Transport Room 201A Upper Roll Cleaning Module 201B Lower Roll Cleaning Module 202A Upper pen cleaning module 202B Lower pen cleaning module 300 buffing rooms 300A Upper buffing module 300B Lower buffing module 500 PCB processing units 500A Measurement Module 500B Drying Module 502 PCB transport unit 505 Temporary Stand 550 Movable Base 600 Temporary Stage 610A First retaining pin 610B Second retaining pin 611 Top surface 612 Shoulder 615 Pin Cover 620 Conveyor Hand 621 Hand Arm 625 Protrusion 626A First Clamp 626B Second Clamp 629 Bracket 630 Detection device 631 Lighting Unit 632 Light receiving part 635 Mounting base 700 Movable end structure 701 Lower end 702 Upper end 703A, 703B, 703C Insertion hole 710 Fixed end structure 711 Lower end 712 Upper end 713A, 713B, 713C Insertion holes 800 mounting platform PA substrate processing equipment TP1~TP7 Transport Positions LM Lifting Mechanism RM Rotation Mechanism AC1 telescopic mechanism AC2 holding pin switching mechanism AC3 Actuator LAC1 Stage Lifting Actuator LAC2 Hand Lifting Actuator CA Tube Group CA0 First Tube CA1, CA2 Second tube

Claims

1. A substrate transport unit, A temporary placement stage for mounting the circuit board, The system includes a transport hand positioned in the same transport space as the temporary placement stage, and for transporting the substrate placed on the temporary placement stage, A substrate transport unit in which the temporary placement stage and the transport hand are each configured to hold the substrate at different locations depending on the processing state of the substrate.

2. The aforementioned substrate transport unit is The aforementioned transport hand has an extendable mechanism, The substrate transport unit according to claim 1, further comprising a lifting mechanism and a rotation mechanism for moving the transport hand in the vertical and rotational directions.

3. The substrate transport unit according to claim 2, wherein the lifting mechanism is configured to move the temporary placement stage and the transport hand integrally in the vertical direction.

4. The aforementioned temporary stage is A first retaining pin that holds the substrate before processing, A second retaining pin for holding the substrate after processing, The substrate transport unit according to claim 1, further comprising a retaining pin switching mechanism that switches between a first retaining pin and a second retaining pin for holding the substrate, depending on the processing state of the substrate.

5. The first retaining pin and the second retaining pin have different heights. The substrate transport unit according to claim 4, wherein the temporary placement stage is provided with a pin cover that covers the upper surface of the second retaining pin, except when the second retaining pin is holding the substrate.

6. The aforementioned transport hand is A first clamp for clamping the substrate before processing, The substrate transport unit according to claim 1, further comprising a second clamp for clamping the processed substrate and positioned above the first clamp.

7. The substrate transport unit is equipped with a hand lifting actuator that raises and lowers the transport hand relative to the temporary placement stage. The substrate transport unit according to claim 1, wherein the hand lifting actuator is configured to raise and lower the transport hand when the substrate is being transferred.

8. The substrate transport unit is equipped with a stage lifting actuator that raises and lowers the temporary placement stage relative to the transport hand. The substrate transport unit according to claim 1, wherein the stage lifting actuator is configured to raise and lower the temporary placement stage when transferring the substrate.

9. A substrate processing apparatus, A substrate transport unit according to any one of claims 1 to 8, A substrate processing unit that processes substrates transported by the substrate transport unit, A substrate processing apparatus comprising a temporary stand for receiving the substrate transported by the substrate transport unit.

10. The substrate processing apparatus according to claim 9, wherein the substrate processing unit comprises at least one of a drying module for drying the substrate and a measuring module for measuring the surface state of the substrate.

11. The substrate processing apparatus is A polishing section for polishing the aforementioned substrate, The substrate processing apparatus according to claim 10, further comprising a cleaning unit disposed between the polishing unit and the substrate processing unit for cleaning the substrate polished in the polishing unit.

12. The substrate transport unit is equipped with a detection device for detecting the presence or absence of the substrate, The substrate processing apparatus according to claim 9, further comprising a control device that determines the presence or absence of the substrate based on the blocking of light irradiated from the detection device by the substrate.

13. A substrate processing apparatus, A temporary placement stage for transporting substrates in a first transport direction and a second transport direction perpendicular to the first transport direction, A substrate processing apparatus comprising a transport hand positioned in the same transport space as the temporary placement stage and transporting the substrate back and forth in the first transport direction.

14. A conveying device, A transport hand for transporting objects, A group of tubes for supplying fluid to the aforementioned transport hand, The system includes a fixing structure for fixing the ends of the tube group, The aforementioned group of tubes is The first tube serves as the core wire, A conveying device comprising: a second tube wrapped around the first tube so as to be in close contact with the first tube when the conveying hand is moving.

15. The conveying device according to claim 14, wherein the second tube is wrapped around the first tube multiple times in one direction.

16. The fixing structure includes a movable end structure and a fixed end structure for fixing the tube group, The conveying device according to claim 14, wherein the movable end structure is attached to the conveying hand.

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