Sensors and detection devices

Abstract

To provide a sensor that can be applied to housings of various sizes. [Solution] According to the embodiment, the sensor comprises an insulating substrate having first island portions and second island portions arranged in a first direction, and a strip portion disposed between the first island portions and the second island portions and connecting the first island portions and the second island portions; an insulating layer disposed above the insulating substrate; a plurality of first electrodes disposed on the insulating layer and superimposed on each of the first island portions and the second island portions in a plan view; and a semiconductor layer disposed on the plurality of first electrodes, wherein the strip portion is curved.

Description

Technical Field

[0001] Embodiments of the present invention relate to a sensor and a detection device.

Background Art

[0002] Optical sensors capable of detecting fingerprint patterns and vein patterns are known. Such an optical sensor may be incorporated into a ring-shaped housing to form a ring-shaped detection device. In such a sensor, there is a need for a sensor that can be applied to housings of various sizes.

Summary of the Invention

Problems to be Solved by the Invention

[0003] An object of the present embodiment is to provide a sensor that can be applied to housings of various sizes.

Means for Solving the Problems

[0004] According to one embodiment, the sensor includes an insulating substrate having a first island portion and a second island portion arranged in a first direction, and a band portion disposed between the first island portion and the second island portion and connecting the first island portion and the second island portion, an insulating layer disposed above the insulating substrate, a plurality of first electrodes disposed on the insulating layer and overlapping each of the first island portion and the second island portion in a plan view, and a semiconductor layer disposed on the plurality of first electrodes, and the band portion is curved.

[0005] Further, according to an embodiment, the detection device includes an insulating substrate having a first island portion and a second island portion arranged in a first direction, and a band portion disposed between the first island portion and the second island portion and connecting the first island portion and the second island portion, an insulating layer disposed above the insulating substrate, a plurality of first electrodes disposed on the insulating layer and overlapping each of the first island portion and the second island portion in a plan view, and a semiconductor layer disposed on the plurality of first electrodes, and the band portion is curved, a sensor, and a ring-shaped housing, and the sensor is disposed inside the housing.

[0006] Furthermore, according to the embodiment, the detection device comprises an insulating substrate having first island portions and second island portions arranged in a first direction, and a strip portion disposed between the first island portion and the second island portion and connecting the first island portion and the second island portion; an insulating layer disposed above the insulating substrate; a plurality of first electrodes disposed on the insulating layer and superimposed on each of the first island portion and the second island portion in a plan view; and a semiconductor layer disposed on the plurality of first electrodes, wherein the strip portion is curved; a sensor; a first light source disposed between the first island portion and the second island portion in a plan view; a second light source disposed between the first island portion and the first light source in the first direction; a third light source disposed between the second island portion and the first light source in the first direction; and a ring-shaped housing, wherein the sensor, the first light source, the second light source and the third light source are disposed inside the housing. [Brief explanation of the drawing]

[0007] [Figure 1] Figure 1 is a schematic diagram showing one configuration example of the detection device of this embodiment, viewed from the side of the housing, with a finger placed inside. [Figure 2] Figure 2 is a schematic cross-sectional view of the detection device along the line II-II in Figure 1. [Figure 3] Figure 3 is a plan view showing one example of the sensor configuration of this embodiment. [Figure 4] Figure 4 is a schematic cross-sectional view of the sensor along the IV-IV line in Figure 3. [Figure 5] Figure 5 is a cross-sectional view showing one example configuration of the detection device shown in Figure 2. [Figure 6] Figure 6 is a plan view showing the state in which the strip portion of the sensor shown in Figure 3 is extended in the first direction. [Figure 7] Figure 7 is a plan view showing a comparative example sensor. [Figure 8] Figure 8 is a plan view showing another example configuration of the sensor shown in Figure 3. [Figure 9]Figure 9 is a plan view showing another example configuration of the sensor shown in Figure 8. [Figure 10] Figure 10 is a plan view showing another example configuration of the sensor shown in Figure 3. [Figure 11] Figure 11 is a schematic cross-sectional view of the sensor along the line XI-XI in Figure 10. [Modes for carrying out the invention]

[0008] Hereinafter, this embodiment will be described with reference to the drawings. It should be noted that the disclosure is merely an example, and any modifications that a person skilled in the art could easily conceive while maintaining the spirit of the invention are naturally included within the scope of the present invention. Furthermore, the drawings may schematically represent the width, thickness, shape, etc., of each part compared to the actual embodiment in order to clarify the explanation; however, these are merely examples and do not limit the interpretation of the present invention. In addition, in this specification and in each drawing, components that perform the same or similar functions as those described above in previously shown drawings are denoted by the same reference numerals, and redundant detailed explanations may be omitted as appropriate.

[0009] Figure 1 is a schematic diagram showing one configuration example of the detection device 1 of this embodiment with a finger Fg placed inside, as viewed from the side of the housing 200.

[0010] The detection device 1 shown in Figure 1 is a ring-shaped device that can be attached to and detached from the object to be detected, such as the human body. In the example shown in Figure 1, the detection device 1 is attached to a finger Fg of the human body, but it is not limited to this and may be attached to the wrist, foot, or other parts of the human body. The finger Fg includes the thumb, index finger, middle finger, ring finger, and little finger, etc. The detection device 1 can detect information about the biological components of the object to be detected, i.e., biological information, from the finger Fg, etc., to which the detection device 1 is attached.

[0011] Figure 2 is a schematic cross-sectional view of the detection device 1 along the line II-II in Figure 1.

[0012] As shown in Figure 2, the detection device 1 comprises a sensor 100 and a ring-shaped housing 200. The detection device 1 also includes a battery (not shown) inside the housing 200. The detection device 1 operates using the power of the battery.

[0013] In the example shown in Figure 2, the housing 200 comprises a first housing 210 and a second housing 220. The first housing 210 has a ring shape and has an outer circumferential surface 210A and an inner circumferential surface 210B. The first housing 210 contacts the object to be detected, for example, a finger Fg, with its inner circumferential surface 210B. The second housing 220 covers the outer circumferential surface 210A of the first housing 210. The housing 200 houses the sensor 100 inside the first housing 210.

[0014] The first housing 210 is formed from a material such as a light-transmitting synthetic resin or silicon. The second housing 220 is formed from a material such as metal or an opaque synthetic resin.

[0015] Figure 3 is a plan view showing one example configuration of the sensor 100 of this embodiment. In this example, the first direction X, the second direction Y, and the third direction Z are orthogonal to each other, but they may intersect at angles other than 90 degrees. The first direction X and the second direction Y correspond to directions parallel to the main surface of the substrate constituting the sensor 100, and the third direction Z corresponds to the thickness direction of the sensor 100. In this specification, the direction from the first substrate SUB1 toward the second substrate SUB2 is referred to as the "upper side" (or simply "up"), and the direction from the second substrate SUB2 toward the first substrate SUB1 is referred to as the "lower side" (or simply "down"). When referring to the "second member above the first member" and the "second member below the first member," the second member may be in contact with the first member or separated from the first member. Furthermore, it is assumed that there is an observation position for observing the sensor 100 on the tip side of the arrow indicating the third direction Z, and viewing from this observation position toward the XY plane defined by the first direction X and the second direction Y is called a plan view.

[0016] In FIG. 3, the first photodiode PD1, the second photodiode PD2, the plurality of signal lines SL, and the power supply wirings CL1 and CL2 are shown passing through the second substrate SUB2.

[0017] The sensor 100 includes a first substrate SUB1 and a second substrate SUB2. The first substrate SUB1 and the second substrate SUB2 are formed in a flat plate shape parallel to the X - Y plane. The first substrate SUB1 and the second substrate SUB2 may be bent, for example.

[0018] The first substrate SUB1 has a first island portion I1, a second island portion I2, and a band portion B that is disposed between the first island portion I1 and the second island portion I2 and connects the first island portion I1 and the second island portion I2.

[0019] In the example shown in FIG. 3, each of the first island portion I1 and the second island portion I2 of the first substrate SUB1 has a substantially rectangular shape. Each of the first island portion I1 and the second island portion I2 of the first substrate SUB1 extends along the second direction Y and has edges E1 and E2 that face each other. The edge E1 of the first island portion I1 faces the edge E1 of the second island portion I2 in the first direction X.

[0020] Also, in the example shown in FIG. 3, each of the first island portion I1 and the second island portion I2 of the first substrate SUB1 extends along the first direction X and has edges E3 and E4 that face each other. The edge E3 is located on the side of the protruding direction D1 of the band portion B, which will be described later, rather than the edge E4 in the second direction Y.

[0021] [[ID=又は19]] The band portion B of the first substrate SUB1 is curved in the X - Y plane. In the example shown in FIG. 3, the band portion B protrudes and curves in the direction from the edge E4 to the edge E3 in the second direction Y, that is, in the D1 direction shown in FIG. 3. In the example shown in FIG. 3, the band portion B has one portion protruding in the D1 direction, but is not particularly limited, and may have one or more portions protruding in the D1 direction.

[0022] In the example shown in Figure 3, the strip portion B of the first substrate SUB1 has opposing edges E5 and E6 in the second direction Y. Edge E5 is located closer to edge E3 than edge E6 in the second direction Y. In other words, edge E5 is located closer to the protruding direction D1 of strip portion B than edge E6 in the second direction Y. Each of edges E5 and E6 has a curved edge in the curved portion.

[0023] The strip portion B of the first substrate SUB1 connects the first island portion I1 and the second island portion I2 of the first substrate SUB1. In the example shown in Figure 3, one end of strip portion B is connected to edge E1 of the first island portion I1. The other end of strip portion B is connected to edge E1 of the second island portion I2. More specifically, the connection portion between one end of strip portion B and the first island portion I1 is close to edge E4 in the second direction Y. Similarly, the connection portion between the other end of strip portion B and the second island portion I2 is close to edge E4 in the second direction Y. In the example shown in Figure 3, edge E6 is continuously connected to edge E4 of the first island portion I1 and edge E4 of the second island portion I2.

[0024] The second substrate SUB2 has a first island portion I1, a second island portion I2, and a strip portion B that is positioned between the first island portion I1 and the second island portion I2 and connects the first island portion I1 and the second island portion I2.

[0025] In the example shown in Figure 3, the first island portion I1 and the second island portion I2 of the second substrate SUB2 each have a substantially rectangular shape. The first island portion I1 and the second island portion I2 of the second substrate SUB2 each have edges E1 and E2 that extend along the second direction Y and face each other. Edge E1 of the first island portion I1 faces edge E1 of the second island portion I2 in the first direction X.

[0026] Furthermore, in the example shown in Figure 3, the first island portion I1 and the second island portion I2 of the second substrate SUB2 each extend along the first direction X and have opposing edges E3 and E4. Edge E3 is located in the second direction Y, closer to the protruding direction D1 of the strip portion B than edge E4.

[0027] The strip portion B of the second substrate SUB2 is curved in the XY plane. In the example shown in Figure 3, the strip portion B is curved by protruding in the second direction Y. That is, the strip portion B is curved by protruding in the direction from edge E4 to edge E3, i.e., in the D1 direction shown in Figure 3. In the example shown in Figure 3, the strip portion B has one portion that protrudes in the D1 direction, but it is not particularly limited and only needs to have one or more portions that protrude in the D1 direction.

[0028] In the example shown in Figure 3, the strip portion B of the second substrate SUB2 has opposing edges E5 and E6 in the second direction Y. Edge E5 is located closer to edge E3 than edge E6 in the second direction Y. In other words, edge E5 is located closer to the protruding direction D1 of strip portion B than edge E6 in the second direction Y. Each of edges E5 and E6 has a curved edge in the curved portion.

[0029] The strip portion B of the second substrate SUB2 connects the first island portion I1 and the second island portion I2 of the second substrate SUB2. In the example shown in Figure 3, one end of strip portion B is connected to edge E1 of the first island portion I1. The other end of strip portion B is connected to edge E1 of the second island portion I2. More specifically, the connection portion between one end of strip portion B and the first island portion I1 is close to edge E4 in the second direction Y. Similarly, the connection portion between the other end of strip portion B and the second island portion I2 is close to edge E4 in the second direction Y. In the example shown in Figure 3, edge E6 is continuously connected to edge E4 of the first island portion I1 and edge E4 of the second island portion I2.

[0030] The first substrate SUB1 and the second substrate SUB2 are superimposed in a plan view. The edges E1 of the first substrate SUB1 and the second substrate SUB2 are superimposed in a plan view. The edges E3 of the first substrate SUB1 and the second substrate SUB2 are superimposed in a plan view. The edges E4 of the first substrate SUB1 and the second substrate SUB2 are superimposed in a plan view. The edges E5 of the first substrate SUB1 and the second substrate SUB2 are superimposed in a plan view. The edges E6 of the first substrate SUB1 and the second substrate SUB2 are superimposed in a plan view.

[0031] The second island portion I2 of the first substrate SUB1 has an extension portion Ex that extends in the first direction X when viewed in plan. The extension portion Ex does not overlap with the second substrate SUB2 when viewed in plan. In other words, the edges E2 of the first substrate SUB1 and the second substrate SUB2 do not overlap when viewed in plan.

[0032] In other words, in a plan view, the sensor 100 has a first island portion I1, a second island portion I2, and a strip portion B positioned between the first island portion I1 and the second island portion I2, connecting the two island portions I1 and I2, in the region where the first substrate SUB1 and the second substrate SUB2 overlap. In the example shown in Figure 3, each of the first island portion I1 and the second island portion I2 of the sensor 100 has edges E1 and E2 that extend along the second direction Y and face each other. Also, each of the first island portion I1 and the second island portion I2 of the sensor 100 has edges E3 and E4 that extend along the first direction X and face each other.

[0033] The sensor 100 may further include a third substrate SUB3. The third substrate SUB3 is formed in a flat plate shape parallel to the XY plane. The third substrate SUB3 has, for example, a rectangular shape. The first substrate SUB1 and the second substrate SUB2 are superimposed on the third substrate SUB3 in a plan view.

[0034] Sensor 100 includes two detection regions AA1 and AA2 and a peripheral region GA in the area where the first substrate SUB1 and the second substrate SUB2 overlap. In the example shown in Figure 3, one detection region AA1 overlaps with the first island portion I1 in a plan view, and the other detection region AA2 overlaps with the second island portion I2 in a plan view. Peripheral region GA surrounds detection regions AA1 and AA2. Peripheral region GA also overlaps with the band portion B in a plan view. Detection region AA1 includes a first photodiode PD1, and detection region AA2 includes a second photodiode PD2.

[0035] The first photodiode PD1 and the second photodiode PD2 each output an electrical signal corresponding to the light irradiated upon them. The first photodiode PD1 and the second photodiode PD2 are, for example, organic photodiodes (OPDs) made of organic semiconductors.

[0036] Each of the first photodiode PD1 and the second photodiode PD2 has a semiconductor layer, a first electrode 31, and a second electrode 32. In the example shown in Figure 3, the first photodiode PD1 has an organic semiconductor layer OS, first electrodes 311, 312, and a second electrode 321. The first electrodes 312, 311 and the second electrode 321 are arranged in this order in the first direction X. In a plan view, the organic semiconductor layer OS of the first photodiode PD1 is superimposed on the first electrodes 311, 312, and the second electrode 321, and is provided spanning across the first electrodes 311, 312, and the second electrode 321. In a plan view, the organic semiconductor layer OS of the first photodiode PD1 is superimposed on the detection region AA1.

[0037] In the example shown in Figure 3, the second photodiode PD2 has an organic semiconductor layer OS, first electrodes 313 and 314, and a second electrode 322. The second electrode 322 and the first electrodes 314 and 313 are arranged in this order in the first direction X. In a plan view, the organic semiconductor layer OS of the second photodiode PD2 is superimposed on the first electrodes 313 and 314 and the second electrode 322, and is provided spanning the first electrodes 313 and 314 and the second electrode 322. In a plan view, the organic semiconductor layer OS of the second photodiode PD2 is superimposed on the detection region AA2.

[0038] The sensor 100 further includes a plurality of terminals 40. The plurality of terminals 40 are provided on the extension Ex of the first substrate SUB1. In the example shown in Figure 3, the plurality of terminals 40 are arranged in the second direction Y. Each of the plurality of terminals 40 is connected to a control circuit (not shown).

[0039] The first electrode 31 is electrically connected to the signal line SL. In the example shown in Figure 3, each of the first electrodes 311, 312, 313, and 314 is connected to the signal line SL via contact holes (CH1, CH2, CH3, CH4) formed in the insulating layer 13, which will be described later.

[0040] The signal line SL connected to the first electrode 311 extends in the second direction Y from the connection point with the first electrode 311 (contact hole CH1), bends in the first direction X, and extends in the first direction X. The signal line SL connected to the first electrode 312 extends in the second direction Y from the connection point with the first electrode 312 (contact hole CH2), bends in the first direction X, and extends in the first direction X. In a plan view, each of the signal lines SL connected to the first electrodes 311 and 312 is superimposed on the band B.

[0041] The signal line SL connected to the first electrode 313 extends in the second direction Y from the connection point with the first electrode 313 (contact hole CH3), bends in the first direction X, and extends in the first direction X. The signal line SL connected to the first electrode 314 extends in the second direction Y from the connection point with the first electrode 314 (contact hole CH4), bends in the first direction X, and extends in the first direction X. Neither of the signal lines SL connected to the first electrodes 313 and 314 overlaps the band B in a plan view.

[0042] The signal line SL is connected to one of the multiple terminals 40. In other words, each of the first electrodes 311, 312, 313, and 314 is connected to the control circuit via the signal line SL and terminal 40.

[0043] The second electrode 32 is electrically connected to the power supply wiring CL. In the example shown in Figure 3, each of the second electrodes 321 and 322 is connected to the power supply wiring CL via contact holes CH5 and CH6 formed in the insulating layer 13, which will be described later.

[0044] The power supply wiring CL connected to the second electrode 321 extends in the second direction Y from the connection point with the second electrode 321 (contact hole CH5), bends in the first direction X, and extends in the first direction X. In a plan view, the power supply wiring CL connected to the second electrode 321 is superimposed on the band B.

[0045] The power supply wiring CL connected to the second electrode 322 extends in the second direction Y from the connection point (contact hole CH6) with the second electrode 322. In a plan view, the power supply wiring CL connected to the second electrode 322 does not overlap the band portion B.

[0046] The power supply wiring CL is connected to one of the multiple terminals 40. In other words, the second electrodes 321, 321 are connected to the control circuit via the power supply wiring CL and terminals 40.

[0047] The signal line SL and power supply wiring CL are superimposed on the surrounding region GA in a plan view. The signal line SL and power supply wiring CL are located on the same layer.

[0048] The control circuit controls the detection operation by supplying control signals to the first photodiode PD1 and the second photodiode PD2. The first photodiode PD1 and the second photodiode PD2 each output electrical signals corresponding to the light irradiated upon them as detection signals to the control circuit. The detection device 1 detects information about the object to be detected based on the detection signals.

[0049] The sensor 100 further includes light sources 50. In the example shown in Figure 3, the sensor 100 includes three light sources 50, namely a first light source 51, a second light source 52, and a third light source 53.

[0050] The first light source 51 is positioned between the first island portion I1 and the second island portion I2 in a plan view. The second light source 52 is positioned between the first island portion I1 and the first light source 51 in the first direction X. It can also be said that the second light source 52 is positioned between the curved portion of the band portion B and the first island portion I1 in the first direction X. The third light source 53 is positioned between the second island portion I2 and the first light source 51 in the first direction X. It can also be said that the third light source 53 is positioned between the curved portion of the band portion B and the second island portion I2 in the first direction X. In the second direction Y, the first light source 51 protrudes more than the second light source 52 and the third light source 53 in the same direction as the protruding direction D1 of the band portion B.

[0051] In a plan view, the light source 50 is not superimposed on the first substrate SUB1 and the second substrate SUB2. If the sensor 100 includes a third substrate SUB3, the light source 50 may be placed on the third substrate SUB3.

[0052] Light sources 50 can be, for example, inorganic LEDs (Light Emitting Diodes) or organic ELs (OLEDs: Organic Light Emitting Diodes). For example, the first light source 51 emits infrared or red light, and the second light source 52 and the third light source 53 emit green light.

[0053] Figure 4 is a schematic cross-sectional view of sensor 100 along the line IV-IV in Figure 3. This figure mainly shows the first island portion I1, the band portion B, and the extension portion Ex of sensor 100.

[0054] The first substrate SUB1 comprises an insulating substrate 10, a protective layer 11, a buffer layer 12, an insulating layer 13, a first photodiode PD1, a second photodiode PD2, a sealing adhesive layer 17, a signal line SL, a power supply wiring CL, and a terminal 40.

[0055] The insulating substrate 10 comprises a main surface (bottom surface) 10A and a main surface (top surface) 10B opposite to the main surface 10A. The protective layer 11 covers the main surface 10B across the first island portion I1, the second island portion I2, and the strip portion B. The buffer layer 12 covers the protective layer 11. The signal line SL and the power supply line CL are each located on top of the buffer layer 12.

[0056] The insulating layer 13 covers the buffer layer 12, the signal line SL, and the power supply wiring CL. In a plan view, the first photodiode PD1 is positioned on the insulating layer 13 that overlaps with the first island portion I1. Although not shown in the diagram, in a plan view, the second photodiode PD2 is positioned on the insulating layer 13 that overlaps with the second island portion I2.

[0057] The first photodiode PD1 comprises first electrodes 311 and 312, a second electrode 321, and an organic semiconductor layer OS. In Figure 4, the first electrode 312 is omitted from the illustration. Although not shown, the second photodiode PD2 comprises first electrodes 313 and 314, a second electrode 322, and an organic semiconductor layer OS.

[0058] The first electrodes 311, 312 and the second electrode 321 are positioned on the insulating layer 13. Although not shown, the first electrodes 313, 314 and the second electrode 322 are also positioned on the insulating layer 13. In a plan view, the terminal 40 is positioned on the insulating layer 13 that overlaps with the extension portion Ex.

[0059] The first electrode 311 is electrically connected to the signal line SL via a contact hole (CH1) formed in the insulating layer 13. Although not shown in the diagram, each of the first electrodes 312, 313, and 314 is also electrically connected to the signal line SL via contact holes (CH2, CH3, CH4) formed in the insulating layer 13.

[0060] The second electrode 321 is electrically connected to the power supply wiring CL via a contact hole (CH5) formed in the insulating layer 13. Although not shown, the second electrode 322 is also electrically connected to the power supply wiring CL via a contact hole (CH6) formed in the insulating layer 13.

[0061] Terminal 40 is electrically connected to the signal line SL via a contact hole (CH7) formed in the insulating layer 13.

[0062] In a plan view, the organic semiconductor layer OS superimposed on the first island I1 covers the first electrodes 311, 312 and the second electrode 321. Although not shown in the figure, in a plan view, the organic semiconductor layer OS superimposed on the second island I2 covers the first electrodes 313, 314 and the second electrode 322. As shown in Figure 4, the organic semiconductor layer OS has an electron injection layer 14, an active layer 15, and a hole injection layer 16.

[0063] In a plan view, the electron injection layer 14 superimposed on the first island I1 continuously covers the first electrodes 311 and 312. Although not shown in the figure, in a plan view, the electron injection layer 14 superimposed on the second island I2 continuously covers the first electrodes 313 and 314. As shown in Figure 4, a portion of the first electrode 31 may be exposed from the electron injection layer 14.

[0064] The active layer 15 covers the upper surface of the electron injection layer 14. The hole injection layer 16 continuously covers the upper surface of the active layer 15, the side surface 15A facing the second electrode 32, and the second electrode 32. The hole injection layer 16 is in contact with the second electrode 32. As shown in Figure 4, the side surface 15B of the electron injection layer 14 that does not face the second electrode 32 may be exposed from the hole injection layer 16.

[0065] The sealing adhesive layer 17 is arranged across the first island portion I1, the second island portion I2, and the strip portion B. The sealing adhesive layer 17 covers the insulating layer 13, the hole injection layer 16, the side surface 15B of the active layer 15, and the first electrode 31 exposed from the active layer 15. By forming the sealing adhesive layer 17, the photodiode PD is well sealed, thereby suppressing the intrusion of moisture from the top side.

[0066] The sealing adhesive layer 17 is not present in the extended portion Ex. In other words, in the extended portion Ex, the insulating layer 13, the contact hole CH7, and the terminal 40 are exposed from the sealing adhesive layer 17.

[0067] The second substrate SUB2 comprises an insulating substrate 20, a protective layer 21, and a buffer layer 22. The insulating substrate 20 has a main surface (bottom surface) 20A and a main surface (top surface) 20B opposite to the main surface 20A. The protective layer 21 covers the main surface 20A. The buffer layer 22 covers the protective layer 21. The protective layer 21 is bonded to the first substrate SUB1 by a sealing adhesive layer 17. This bonds the first substrate SUB1 and the second substrate SUB2.

[0068] The third substrate SUB3 includes an insulating substrate 30. The insulating substrate 30 has a main surface (bottom surface) 30A and a main surface (top surface) 30B opposite to the main surface 30A. The main surface 30B of the third substrate SUB3 is bonded to the main surface 10A of the insulating substrate 10, for example, with an adhesive.

[0069] The insulating substrates 10, 20, and 30 are insulating substrates and are flexible. The insulating substrates 10, 20, and 30 are formed of, for example, a film-like resin. The protective layers 11 and 21 are formed of an inorganic insulating material, for example, a SiOx film. The buffer layers 12 and 22 are formed of an organic material. The insulating layer 13 may be an inorganic insulating film or an organic insulating film. The insulating layer 13 may be a single layer or a multilayer film. The signal line SL and the power supply wiring CL are formed of, for example, metal wiring.

[0070] The first electrode 31 and the second electrode 32 are formed from a light-transmitting conductive material such as ITO (Indium Tin Oxide) or IZO (Indium Zinc Oxide).

[0071] The electron injection layer 14 is formed of a material having electron injection properties. A material commonly used as an electron injection layer can be used as the electron injection layer 14. The hole injection layer 16 is formed of a material having hole injection properties. A material commonly used as a hole injection layer can be used as the hole injection layer 16.

[0072] The active layer 15 is made of a material whose properties (e.g., voltage-current characteristics and resistance) change depending on the light it is irradiated with. For example, the active layer 15 has a bulk heterostructure in which a p-type organic semiconductor and an n-type organic semiconductor, an n-type fullerene derivative (PCBM), are mixed. In addition, as the active layer 15, for example, low molecular weight organic materials such as C60 (fullerene), PCBM (phenyl C61-butyric acid methyl ester), CuPc (copper phthalocyanine), F16CuPc (fluorinated copper phthalocyanine), rubrene (5,6,11,12-tetraphenyltetracene), and PDI (derivative of perylene) can be used.

[0073] The active layer 15 can be formed by vapor deposition (Dry Process) using these low-molecular-weight organic materials. In this case, the active layer 15 may be, for example, a laminated film of CuPc and F16CuPc, or a laminated film of rubrene and C60. The active layer 15 can also be formed by coating (Wet Process). In this case, the active layer 15 uses a material that combines the low-molecular-weight organic material and the polymeric organic material described above. As the polymeric organic material, for example, P3HT (poly(3-hexylthiophene)), F8BT (F8-alt-benzothiadiazole), etc. can be used. The active layer 15 can be a film in which P3HT and PCBM are mixed, or a film in which F8BT and PDI are mixed.

[0074] The sealing adhesive layer 17 is formed of an inorganic film such as a silicon nitride film or an aluminum oxide film, or a resin film such as acrylic. The sealing adhesive layer 17 is not limited to a single layer, but may be a laminated film of two or more layers combining the above-mentioned inorganic films and resin films.

[0075] The sensor 100 of this embodiment, shown in Figures 3 and 4, is located inside a ring-shaped housing 200, as shown in Figure 2. The inner circumferential direction 200C of the housing 200 shown in Figure 2 coincides with the first direction X shown in Figure 3. In the example shown in Figure 2, the sensor 100 is located inside the first housing 210 of the housing 200. The main surface 10A of the insulating substrate 10 faces the inner circumferential surface 210B of the first housing 210, and the main surface 10B of the insulating substrate 10 faces the outer circumferential surface 210A of the first housing 210. The sensor 100 is curved along the outer circumferential surface 210A of the first housing 210.

[0076] Figure 5 is a cross-sectional view showing one example configuration of the detection device 1 shown in Figure 2. Only the sensor 100 of the detection device 1 is shown, and only the main parts of the sensor 100 are depicted. Figure 5 shows an example in which a finger Fg is placed inside the detection device 1 as the object to be detected. The light emitted from the light source 50 will be explained with reference to Figure 5.

[0077] The light source 50 emits light L1 towards the object to be detected, such as a finger Fg, which is housed inside the detection device 1. The light L1 emitted from the light source is either reflected from the surface or inside of the finger Fg, or it passes through the finger Fg. In the example shown in Figure 5, the light L1 is reflected from the surface of the finger Fg. The light L1 that is reflected from or passed through the finger Fg passes through the insulating substrate 10 and is incident on at least one of the first photodiode PD1 and the second photodiode PD2. As a result, the voltage-current characteristics and resistance of the active layer 15 change, and a current flows between the first electrode 31 and the second electrode 32 via the electron injection layer 14, the active layer 15, and the hole injection layer 16. The sensor 100 can detect information about the biological material of the object to be detected by detecting the current flowing between the first electrode 31 and the second electrode 32.

[0078] Information about living organisms includes, for example, fingerprints, pulse waves of fingers and palms, pulse rate, vascular images, and blood oxygen saturation. Different information about living organisms can be detected depending on the type of light L1 emitted from the light source 50. For example, if the light L1 emitted from the light source 50 is green light, the pulse rate of the subject can be detected. Also, if the light L1 emitted from the light source 50 is infrared light or red light, blood oxygen saturation can be detected. For example, if the first light source 51 shown in Figure 3 emits infrared or red light, and the second and third light sources emit green light, then to detect the pulse rate of the subject, it is sufficient to light up at least one of the second and third light sources, and to detect blood oxygen saturation, it is sufficient to light up only the first light source 51.

[0079] Figure 6 is a plan view showing the state in which the band portion B of the sensor 100 shown in Figure 3 is extended in the first direction X.

[0080] As shown in Figure 6, the band portion B extends in the first direction X as the curved portion extends in the first direction X. As a result, the sensor 100 extends in the first direction X.

[0081] If the sensor 100 is equipped with a third substrate SUB3, the third substrate SUB3 extends in the first direction X in accordance with the extension of the strip portion B. It is desirable that the distance in the first direction X between the second light source 52 and the first island portion I1, and the distance in the first direction X between the third light source 53 and the second island portion I2, remain unchanged before and after the extension of the strip portion B. This is to suppress the change in the angle of incidence of the light L1 emitted from the second light source 52 and the third light source 53 and reflected by a finger Fg, etc., when it enters the photodiode PD, in accordance with the degree of extension of the strip portion B.

[0082] Figure 7 is a plan view showing a comparative example sensor 100'. Sensor 100' differs from sensor 100 of this embodiment shown in Figure 3 in that the band portion B is not curved.

[0083] The ring-shaped detection device 1 requires housings 200 of various sizes depending on the size of the object to be detected, such as a finger Fg. In this case, the size of the sensor 100 placed inside the housing 200 also needs to be changed according to the size of the inner circumference of the housing 200. This is to unify the angle of incidence of the light L1 emitted from the light source 50 when it enters the finger Fg, the angle of reflection when it is reflected by the finger Fg, and the angle of incidence when it enters the photodiode PD, regardless of the size of the housing 200.

[0084] In the comparative example, sensor 100' has a non-curved band B, and the band B does not extend in the first direction X. In other words, the size of sensor 100' in the first direction X does not change. Therefore, in order to unify the above-mentioned angle regardless of the size of the housing 200, it is necessary to create sensors 100' of various sizes according to the size of the housing 200.

[0085] On the other hand, the sensor 100 of this embodiment has a curved band portion B, and the band portion B is in the first direction X It extends in this manner. Therefore, the size of the sensor 100 in the first direction X can be changed according to the size of the inner circumference of the housing 200. Thus, according to this embodiment, a sensor 100 that can be applied to housings of various sizes can be provided.

[0086] Next, other configuration examples of this embodiment will be described.

[0087] Figure 8 is a plan view showing another configuration example of the sensor 100 shown in Figure 3. The configuration example shown in Figure 8 differs from the configuration example shown in Figure 3 in that the edges E5 and E6 of the band B have straight edges in the curved portion.

[0088] In the example shown in Figure 3, edge E5 includes a straight section S51 connected to the first island section I1, a straight section S52 connected to the straight section S51, a straight section S53 connected to the straight section S52, a straight section S54 connected to the straight section S53, and a straight section S55 connected to the straight section S54. The end of the straight section S55 opposite to the end connected to the straight section S54 is connected to the second island section I2.

[0089] In the example shown in Figure 8, the straight sections S51, S53, and S55 extend in the first direction X, but they may extend in a direction different from the first direction X. Also, in the example shown in Figure 8, the straight sections S52 and S54 extend in the second direction Y, but they may extend in a direction different from the second direction Y.

[0090] In the example shown in Figure 8, the angles formed by the straight sections S51 and S52, the angles formed by the straight sections S52 and S53, the angles formed by the straight sections S53 and S54, and the angles formed by the straight sections S54 and S55 are approximately 90 degrees, but are not limited to this.

[0091] Edge E6 includes a straight section S61 connected to the first island section I1, a straight section S62 connected to the straight section S61, a straight section S63 connected to the straight section S62, a straight section S64 connected to the straight section S63, and a straight section S65 connected to the straight section S63. The end of the straight section S65 opposite to the end connected to the straight section S64 is connected to the second island section I2.

[0092] In the example shown in Figure 8, the straight sections S61, S63, and S65 extend in the first direction X, but they may extend in a direction different from the first direction X. Also, in the example shown in Figure 8, the straight sections S62 and S64 extend in the second direction Y, but they may extend in a direction different from the second direction Y.

[0093] In the example shown in Figure 8, the angles formed by the straight sections S61 and S62, S62 and S63, S63 and S64, and S64 and S65 are approximately 90 degrees, but are not limited to this.

[0094] Even with this configuration example, the same effects as the configuration example shown in Figure 3 can be obtained.

[0095] Figure 9 is a plan view showing another configuration example of the sensor 100 shown in Figure 8. The configuration example shown in Figure 9 differs from the configuration example shown in Figure 8 in that the band portion B has a notched portion.

[0096] In the example shown in Figure 9, the strip portion B has a notch C1 at the intersection of the straight sections S51 and S52, a notch C2 at the intersection of the straight sections S52 and S53, a notch C3 at the intersection of the straight sections S53 and S54, and a notch C4 at the intersection of the straight sections S54 and S55.

[0097] In the example shown in Figure 9, the strip portion B has a notch C5 at the intersection of the straight sections S61 and S62, a notch C6 at the intersection of the straight sections S62 and S63, a notch C7 at the intersection of the straight sections S63 and S64, and a notch C8 at the intersection of the straight sections S64 and S65.

[0098] The sensor 100 shown in Figure 9 has a notch at the intersection of the straight sections in the curved portion of the strip B. This prevents the strip B from breaking at the intersection of the straight sections when it extends in the first direction X, as a load is applied to the intersection of the straight sections. Furthermore, the same effect as the example shown in Figure 3 can be obtained with this configuration example.

[0099] Figure 10 is a plan view showing another configuration example of the sensor 100 shown in Figure 3. Figure 11 is a schematic cross-sectional view of the sensor 100 along the line XI-XI in Figure 10. The configuration examples shown in Figures 10 and 11 differ from the configuration example shown in Figure 3 in that the strip portion B is curved in a direction perpendicular to the insulating substrate 10. In addition, the first light source 51, the second light source 52, and the third light source 53 are arranged side by side in the first direction X, and the first light source 51 does not protrude in the same direction D1 as the protrusion direction of the strip portion B in the second direction Y as the second light source 52 and the third light source 53.

[0100] As shown in Figure 11, the strip portion B is curved and protrudes in the third direction Z, that is, in a direction perpendicular to the insulating substrate 10. In the examples shown in Figures 10 and 11, the strip portion B has three parts that protrude in the third direction Z, but it is not particularly limited and only needs to have one or more parts that protrude in the third direction Z. The same effect as the example shown in Figure 3 can be obtained with such a configuration example.

[0101] As described above, this embodiment provides a sensor that can be applied to housings of various sizes.

[0102] Within the scope of the spirit of the present invention, a person skilled in the art can conceive of various modifications, and such modifications are also understood to fall within the scope of the present invention. For example, modifications to the above-described embodiments in which a person skilled in the art has appropriately added, deleted, or modified components, or added, omitted, or modified processes, are also included within the scope of the present invention, as long as they retain the gist of the present invention.

[0103] Furthermore, any other effects and advantages brought about by the embodiments described above that are obvious from the description herein or that can be appropriately conceived by those skilled in the art are naturally considered to be brought about by the present invention. [Explanation of symbols]

[0104] 1. Detection device 100 sensors 10, 20, 30 Insulating substrate 11,21 Protective layer 12,22 Buffer Layers 13 Insulating layer OS Organic Semiconductor Layer 14 Electron injection layer 15 Active layer 16 Hole injection layer 16 17 Sealing adhesive layer 31 1st electrode 32 2nd electrode 40 terminals 50 Light source insulating film PD photodiode AA detection area GA related fields SL signal line CL power supply wiring 200 cabinets

Claims

1. An insulating substrate having first island portions and second island portions arranged in a first direction, and a strip portion disposed between the first island portion and the second island portion and connecting the first island portion and the second island portion, An insulating layer disposed above the insulating substrate, A plurality of first electrodes are arranged on the insulating layer and, in a plan view, superimposed on each of the first island portion and the second island portion, The semiconductor layer comprises a plurality of first electrodes arranged on top of the aforementioned plurality of electrodes, The aforementioned band is a curved sensor.

2. The sensor according to claim 1, wherein the strip portion is curved in a plane parallel to the insulating substrate.

3. The sensor according to claim 2, wherein the band portion is curved by protruding in a second direction perpendicular to the first direction.

4. Furthermore, in a plan view, a first light source is positioned between the first island portion and the second island portion, In the first direction, a second light source is disposed between the first island portion and the first light source, The sensor according to claim 3, further comprising a third light source disposed between the second island portion and the first light source in the first direction.

5. The sensor according to claim 4, wherein the first light source is positioned to protrude in the second direction more than the second light source and the third light source in a direction in which the band portion protrudes.

6. The sensor according to claim 1, wherein the strip portion is curved in a direction perpendicular to the insulating substrate.

7. Furthermore, in a plan view, a first light source is positioned between the first island portion and the second island portion, In the first direction, a second light source is disposed between the first island portion and the first light source, The sensor according to claim 6, further comprising a third light source disposed between the second island portion and the first light source in the first direction.

8. The sensor according to claim 4 or 7, wherein the first light source emits infrared light or red light.

9. The sensor according to claim 4 or 7, wherein the second light source and the third light source emit green light.

10. The sensor according to claim 1, wherein the band portion has a notched portion.

11. Furthermore, in a plan view, multiple terminals superimposed on the second island portion, In a plan view, it comprises the plurality of first electrodes superimposed on the first island portion, the plurality of terminals, and signal lines electrically connecting them, The sensor according to claim 1, wherein the signal line is superimposed on the band portion in a plan view.

12. The semiconductor layer comprises an electron injection layer in contact with the first electrode, The active layer in contact with the electron injection layer, The sensor according to claim 1, comprising a hole injection layer in contact with the active layer.

13. Furthermore, the sensor according to claim 12, further comprising a second electrode in contact with the hole injection layer.

14. The sensor according to claim 13, wherein the first electrode and the second electrode are arranged on the insulating layer.

15. An insulating substrate having first island portions and second island portions arranged in a first direction, and a strip portion disposed between the first island portion and the second island portion and connecting the first island portion and the second island portion, An insulating layer disposed above the insulating substrate, A plurality of first electrodes are arranged on the insulating layer and, in a plan view, superimposed on each of the first island portion and the second island portion, The semiconductor layer comprises a plurality of first electrodes arranged on top of the aforementioned plurality of electrodes, The aforementioned band portion is curved, and includes a sensor. It comprises a ring-shaped housing, The sensor is a detection device located inside the housing.

16. An insulating substrate having first island portions and second island portions arranged in a first direction, and a strip portion disposed between the first island portion and the second island portion and connecting the first island portion and the second island portion, An insulating layer disposed above the insulating substrate, A plurality of first electrodes are arranged on the insulating layer and, in a plan view, superimposed on each of the first island portion and the second island portion, The semiconductor layer comprises a plurality of first electrodes arranged on top of the aforementioned plurality of electrodes, The aforementioned band portion is curved, and includes a sensor. In a plan view, a first light source is positioned between the first island portion and the second island portion, In the first direction, a second light source is disposed between the first island portion and the first light source, In the first direction, a third light source is disposed between the second island portion and the first light source, It comprises a ring-shaped housing, The sensor, the first light source, the second light source, and the third light source are arranged inside the housing of the detection device.

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