mold

Abstract

To provide a mold capable of improving resin fluidity. [Solution] The apparatus comprises a plunger, a cal, multiple cavities, and multiple runners. The plunger is provided to move back and forth vertically inside the opening of one of the upper and lower molds. The cal is provided in the other of the upper and lower molds, facing the opening. The cavities are capable of housing semiconductor chips. Multiple runners connect the cal and the multiple cavities. The cal has multiple first channels and multiple second channels. The first channels extend from the center toward the connection points with the multiple runners. The second channels extend circumferentially around the center. The second channels surround the multiple first channels. The second channels connect with the multiple first channels.

Description

Technical Field

[0001] Embodiments of the present invention relate to a mold.

Background Art

[0002] In semiconductor device manufacturing, a semiconductor chip is sandwiched between a pair of resin-sealing molds composed of a heated upper mold and a lower mold, and uncured resin is press-fitted into a cavity of the mold.

[0003] In the above mold, for example, when a plunger provided in the lower mold so as to be able to move forward and backward in the vertical direction rises, a thermosetting resin is pressed against the upper part of a cal provided in the upper mold and melts. The melted resin is press-fitted into a cavity capable of accommodating a semiconductor chip via a cal, a runner, and a gate.

[0004] The direction in which the resin melts in the cal is not determined. Also, when the center of the plunger is taken as the center, the melting rate of the resin in the cal is slower at the center than on the outside. In addition, resin that is not sufficiently melted is likely to entrain air. If air is contained in the resin, it may affect the filling property of the resin into the cavity that accommodates the semiconductor chip, and the resin sealing property may deteriorate.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] The problem to be solved by the present invention is to provide a mold capable of improving resin fluidity.

Means for Solving the Problems

[0007] The mold of the embodiment includes a plunger, a cal, a plurality of cavities, and a plurality of runners. The plunger is provided so as to be able to move up and down inside the opening of one of the upper and lower molds. The cal is provided in the other of the upper and lower molds opposite the opening. The cavities are capable of housing semiconductor chips. The plurality of runners connect the cal and the plurality of cavities. The cal has a plurality of first channels and a plurality of second channels. The first channels extend from the center toward the connection points with the plurality of runners. The second channels extend circumferentially with respect to the center. The second channels surround the plurality of the first channels. The second channels connect with the plurality of the first channels. [Brief explanation of the drawing]

[0008] [Figure 1] A plan view of a molded product formed using the mold of the embodiment, viewed from above. [Figure 2] Side view of a molded product containing a semiconductor chip. [Figure 3] A magnified perspective view of the area around Cal. [Figure 4] A cross-sectional view of the mold of the first embodiment, corresponding to the BB cross-section in Figure 3. [Figure 5] A view of the car from below. [Figure 6] A cross-sectional view of the mold of the first embodiment, corresponding to the BB cross-section in Figure 3. [Figure 7] A view of the car from below. [Figure 8] Cross-sectional view of the mold according to the second embodiment. [Modes for carrying out the invention]

[0009] The mold of the embodiment will be described below with reference to the drawings. In the following description, components having the same or similar function will be denoted by the same reference numerals. Duplication of these components may be omitted.

[0010] In this specification, the upward direction in Figures 2 and 4 may be described as "up" and the downward direction in the drawings as "down" to indicate the positional relationship of parts, etc. In this specification, the concepts of "up" and "down" do not necessarily indicate a relationship with the direction of gravity.

[0011] Let's explain the mold configuration. Figure 1 is a plan view from above of a molded product containing multiple semiconductor devices 41, which is molded as a resin-sealed package 40 using the mold 21 of the embodiment. Figure 2 is a side view of the molded product containing multiple semiconductor devices 41.

[0012] First, let me explain about molded products. The molded product comprises a semiconductor device 41, a cal 42, and a runner 43. The semiconductor device 41 comprises a semiconductor chip 50, a lead frame 51, and a resin encapsulation portion 52. The semiconductor chip 50 is mounted on the upper side of the rectangular lead frame 51 in a plan view. Multiple semiconductor chips 50 (four in Figure 1) are mounted on the upper side of the lead frame 51, along the long side of the lead frame 51, via connecting portions 53 to form a row.

[0013] In this embodiment, two rows of semiconductor chips 50 are mounted on a single lead frame 51, spaced apart in the short-side direction of the lead frame 51. Two lead frames 51, each mounted with two rows of semiconductor chips 50, are arranged in the long-side direction of the lead frame 51, flanking the CAL 42.

[0014] In the following explanation, the vertical direction perpendicular to the surface of the lead frame 51 will be referred to as the "Z direction," the longer side direction along the surface of the lead frame 51 will be referred to as the "Y direction," and the shorter side direction along the surface of the lead frame 51 will be referred to as the "X direction." In the "Z direction," the "+Z side" may be referred to as the "upper side," and the "-Z side" as the "lower side."

[0015] Each row including a plurality of semiconductor devices 41 and connection portions 53 is covered with a molding resin material. The semiconductor chip 50 covered with the covered resin sealing portion 52 formed of the molding resin material constitutes a part of the resin sealed package 40. In the embodiment, four resin sealing portions 52 are provided to form a row. The resin sealing portion 52 is formed of a thermosetting resin such as a phenolic resin or an epoxy resin by, for example, a transfer molding method or the like.

[0016] The cal 42 is circular in plan view. The arc center of the cal 42 in plan view is referred to as the central portion P. FIG. 3 is an enlarged perspective view of the periphery of the cal 42. As shown in FIG. 3, the cal 42 has a cal recess 44, a first rib 45, and a second rib 46. The cal recess 44 is recessed downward from the upper surface of the cal 42. The maximum depth dimension of the cal recess 44 in the Z direction is not less than half of the maximum thickness dimension of the cal 42 in the Z direction.

[0017] A plurality of cal recesses 44 are arranged at intervals in the circumferential direction (hereinafter simply referred to as the "circumferential direction") centered on the central portion P. In the embodiment, four cal recesses 44 are provided. In plan view, the cal recess 44 is fan-shaped. The central angles of the cal recesses 44 located on both sides in the X direction sandwiching the central portion P are the same. The central angles of the cal recesses 44 located on both sides in the Y direction sandwiching the central portion P are the same.

[0018] The radii opposing each other in the circumferentially adjacent cal recesses 44 are parallel to each other at a constant interval. A first rib 45 extending in the radial direction is formed between the radii opposing each other in the circumferentially adjacent cal recesses 44. The cal 42 having four circumferentially adjacent cal recesses 44 is provided with four first ribs 45 at intervals in the circumferential direction. The four first ribs 45 linearly extend outward in the radial direction centered on the central portion P from the central portion P.

[0019] In the embodiment, the central angles of the caul concave portions 44 located on both sides in the X direction sandwiching the central portion P are the same, and the central angles of the caul concave portions 44 located on both sides in the Y direction sandwiching the central portion P are the same. Therefore, the two first ribs 45 located on both sides sandwiching the central portion P become one rib arranged on the same straight line with the same width. That is, the caul 42 has two ribs that extend in the radial direction passing through the central portion P and intersect each other. Hereinafter, the rib formed by the two first ribs 45 located on both sides sandwiching the central portion P may be generically referred to as the first rib 45. The first rib 45 has a tapered shape with a width that tapers from the lower side to the upper side.

[0020] The second rib 46 is annular and extends in the circumferential direction. The second rib 46 surrounds the periphery of the plurality of first ribs 45. The second rib 46 is connected to the plurality of first ribs 45 from the outside in the radial direction. The second rib 46 has a tapered shape with a width that tapers from the lower side to the upper side. The maximum width dimension of the width of the first rib 45 is less than or equal to the maximum width dimension (the maximum width dimension in the radial direction) of the width of the second rib 46.

[0021] The runner 43 connects the caul 42 and the plurality (4) of resin sealing portions 52 respectively. Four runners are provided corresponding to the four resin sealing portions 52 that form a column. The runner 43 is connected orthogonally to the outer peripheral surface of the caul 42 and the side surface of the resin sealing portion 52. If the runner 43 is connected while being inclined from the direction orthogonal to the outer peripheral surface of the caul 42 and the side surface of the resin sealing portion 52, an edge may be formed at the intersection of the portion where the runner 43 is formed in the mold 21 and the portion where the caul 42 or the resin sealing portion 52 is formed, and there is a possibility of damage during molding or during operations of the mold 21 such as maintenance. By connecting the runner 43 orthogonally to the outer peripheral surface of the caul 42 and the side surface of the resin sealing portion 52, damage to the mold 21 can be suppressed.

[0022] [First Embodiment of Mold] Next, the first embodiment of the mold 21 will be described. FIG. 4 is a cross-sectional view of the mold 21 corresponding to the A-A cross-section around the caul 42 shown in FIG. 3.

[0023] As shown in Figure 4, the mold 21 comprises an upper mold 22 and a lower mold 23. As shown in Figures 1, 2, and 4, a plurality of cavities 24a, 24b and a runner 26 are formed in the mold 21 when the upper mold 22 and the lower mold 23 are clamped together.

[0024] Runner 26 and the cull 27, described later, are flow paths (spaces) through which the molding resin material flows in the mold 21. The cull 42 described above is a molded product formed from the molding resin material in the cull 27. The runner 43 described above is a molded product formed from the molding resin material in runner 26.

[0025] Multiple cavities 24a are spaces or recesses in which the resin-encapsulated package 40 is molded. Adjacent cavities 24a are connected via runners. Multiple cavities 24b are spaces or recesses that each connect to a runner 26. Multiple cavities 24a are located downstream of cavities 24b in the flow direction of the molding resin material. Cavities 24b are flow-regulating cavities in which semiconductor chips 50 are not located to regulate the flow rate of the molding resin material flowing into cavities 24a.

[0026] In this embodiment, the width dimensions of the cavity 24b in the X direction and the width dimensions in the Z direction are, for example, larger than the runner 26 and smaller than the cavity 24a. However, in practice, the width dimensions of the flow rate adjustment cavity 24b in the X direction and the width dimensions in the Z direction are set appropriately according to the size of the product (semiconductor chip 50), so the dimensional relationship may differ from the above. For example, the width dimension of the runner 26 may be tapered towards the cavity 24b.

[0027] If the width dimensions of cavity 24b in the X direction and the width dimensions in the Z direction are smaller than, for example, the runner 26, the filling pressure of the molding resin material into the cavity 24a located downstream of cavity 24b may be insufficient. In particular, if there are multiple cavities 24a located downstream of cavity 24b, the cavity 24a may remain unfilled. Furthermore, if the cavity 24a remains unfilled, the resin-sealed package 40 may be damaged when separating the runner 43 from the resin-sealed package 40. Therefore, in this embodiment, by providing a flow rate adjustment cavity 24b whose width dimension in the X direction and the width dimension in the Z direction are greater than that of the runner 26, it is possible to suppress the cavity 24a from remaining unfilled and damage to the resin-sealed package 40.

[0028] The lower mold 23 includes a pot 28 and a plunger 29. The pot 28 is cylindrical with a central point P. The upper end of the pot 28 is flush with the upper surface of the lower mold 23. The pot 28 has an opening 28a facing upward. The plunger 29 is provided with a small gap between it and the inner circumferential wall of the pot 28 so as to be able to move back and forth in the vertical direction.

[0029] The upper mold 22 has a cal 27. The cal 27 faces the opening 28a in the vertical direction. The cal 27 is the region in which the cal 42 is formed. The cal 27 is recessed upward from the lower surface facing the opening 28a. The cal 27 is recessed in a frustoconical shape from the lower surface with the central point P at its center.

[0030] The runner 26 sequentially communicates with each cavity 24b, 24a via the gate 25 while the upper mold 22 and lower mold 23 are clamped together. In cavity 24b, the flow rate adjustment section 52b is molded. In cavity 24a, the resin sealing section 52 is molded. There are four cavities 24b, an even number, corresponding to the four resin sealing sections 52. The runner 26 is the region where the runner 43 is molded.

[0031] Figure 5 is a view of the cal 27 from below. As shown in Figure 5, four runners 26 are provided, corresponding to the four runners 43. The runners 26 are connected perpendicularly to the outer surface of the cal 27 and to the cavity 24b, respectively. If the runners 26 were connected at an angle from a direction perpendicular to the outer surface of the cal 27 and the cavity 24b, as described above, an edge may be formed at the intersection with the outer surface of the cal 27 or the cavity 24b, which could cause damage during molding or during operation of the mold 21 such as maintenance. By connecting the runners 26 perpendicularly to the outer surface of the cal 27 and the cavity 24b, damage to the mold 21 can be suppressed.

[0032] The cal 27 has a projection 30, a first flow path 31, and a second flow path 32. The projection 30 is the region in which the cal recess 44 is formed. The projection 30 protrudes from the bottom of the cal 27 toward the opening. Multiple projections 30 are provided at intervals in the circumferential direction. The cal 27 of this embodiment has four projections 30. In plan view, the projections 30 are fan-shaped. The central angles of the projections 30 located on both sides in the X direction with respect to the central point P are the same. The central angles of the projections 30 located on both sides in the Y direction with respect to the central point P are the same.

[0033] The radii of adjacent protrusions 30 in the circumferential direction are parallel to each other with a certain interval between them. Between the radii of adjacent protrusions 30 in the circumferential direction, a first flow channel 31 extending in the radial direction is formed. The cal 27 having four adjacent protrusions 30 in the circumferential direction has four first flow channels 31 spaced apart in the circumferential direction. Each of the four first flow channels 31 extends linearly outward in the radial direction from the center P.

[0034] In this embodiment, the central angles of the protrusions 30 located on both sides in the X direction with respect to the central point P are the same, and the central angles of the protrusions 30 located on both sides in the Y direction with respect to the central point P are the same. Therefore, the two first flow channels 31 located on both sides with respect to the central point P form a single flow channel with the same width and arranged on the same straight line. Accordingly, of the four first flow channels 31 provided (an even number), two are arranged on the same straight line.

[0035] As a result, the cal 27 appears to have two intersecting channels, each radially penetrating a frustoconical projection 30. Hereafter, the channels formed by the two first channels 31 located on either side of the central part P will be collectively referred to as the first channels 31.

[0036] The first channel 31 has a tapered shape, narrowing from top to bottom. Because the first channel 31 is tapered, its surface area is larger compared to a non-tapered channel, increasing the heat-receiving area. Therefore, the viscosity of the molding resin material M flowing through the first channel 31 decreases, resulting in an increased flow velocity.

[0037] The depth from the tip of the protrusion 30 to the bottom of the first channel 31 is preferably at least half the maximum depth of the cal 27. By making the depth of the first channel 31 at least half the maximum depth of the cal 27, sufficient fluidity of the resin material in the first channel 31 can be ensured. The depth of the first channel 31 is preferably 1 mm or more.

[0038] The second channel 32 is an annular shape that extends circumferentially along the cal 27. In a plan view, the second channel 32 is formed between the outer circumference of the cal 27 and the arc of the projection 30. In other words, the second channel 32 surrounds the four first channels 31. The second channel 32 connects with the four first channels 31. In short, the projection 30 demarcates the first channels 31 and the second channel 32 in the cal 27.

[0039] The second channel 32 has a tapered shape, narrowing from top to bottom. Because the second channel 32 is tapered, its surface area is larger compared to a non-tapered channel, increasing the heat-receiving area. Therefore, the viscosity of the molding resin material M flowing through the second channel 32 decreases, resulting in an increased flow velocity.

[0040] The depth from the tip of the protrusion 30 to the bottom of the second channel 32 is preferably more than half of the maximum depth of the cal 27. By making the depth of the second channel 32 more than half of the maximum depth of the cal 27, sufficient fluidity of the resin material in the second channel 32 can be ensured. The depth of the second channel 32 is the same as the depth of the first channel 31. By making the depth of the second channel 32 the same as the depth of the first channel 31, the resin material can flow smoothly from the first channel 31 to the second channel 32.

[0041] Viewed vertically, the first channel 31 extends with a constant maximum width dimension W1. The maximum width dimension W1 of the first channel 31 is less than or equal to the width dimension W2 of the second channel 32. Viewed vertically, the maximum width dimension W1 of the first channel 31 is less than or equal to the width dimension W3 of the connection position 26a between the cal 27 and the runner 26.

[0042] In the mold 21 with the above configuration, a lead frame 51 on which a semiconductor chip 50 is mounted is first placed inside during molding. The mold 21 is heated to a predetermined temperature (for example, 180-190°C). Once the lead frame 51 on which the semiconductor chip 50 is mounted is placed inside, with the upper mold 22 and lower mold 23 clamped together, a tablet-shaped molding resin material M, preheated to a predetermined temperature, is poured into the pot 28 from a resin inlet (not shown) and melted, as shown in Figure 4.

[0043] Subsequently, the transfer mechanism drives the plunger 29 toward the upper mold 22, and as shown in Figure 6, the molding resin material M, which has been molten at a predetermined pressure, is pushed out of the pot 28. The molding resin material M pushed out of the pot 28 is distributed in the cal 27 into the first channel 31 and the second channel 32. The molding resin material M distributed in the first channel 31 and the second channel 32 flows toward the connection point 26a between the cal 27 and the runner 26, as shown by the white arrows in Figure 7.

[0044] The molding resin material M distributed in the first channel 31 flows from the center P towards the connection point 26a between the cal 27 and the runner 26, and flows into the runner 26 from the confluence point of the first channel 31 and the second channel 32 via the shortest distance. The molding resin material M that has flowed into the runner 26 flows from the gate 25 into the interior of the cavities 24b and 24a.

[0045] On the other hand, the molding resin material M distributed to the second channel 32 has a width dimension W2 that is greater than or equal to the maximum width dimension W1 of the first channel 31, resulting in a large surface area and a large heat receiving area. As a result, the resin viscosity decreases, and it moves toward the junction with the first channel 31 at a large flow velocity. Therefore, even if the flow length of the molding resin material M that has flowed through the second channel 32 is longer than that of the first channel 31, it reaches the junction with the first channel 31 at almost the same time as the molding resin material M that has flowed through the first channel 31.

[0046] Since the maximum width dimension W1 of the first channel 31 is less than or equal to the width dimension W3 of the connection position 26a between the calf 27 and the runner 26, the amount of resin in the molding resin material M that flows through the first channel 31 is not sufficient to fill the runner 26. On the other hand, the molding resin material M that flows through the second channel 32 reaches the confluence position of the first channel 31 and the second channel 32, so the molding resin material M that flows through the second channel 32 will flow into the runner 26 from the confluence position, supplementing the amount of resin in the molding resin material M that flows through the first channel 31.

[0047] For example, if the maximum width dimension W1 of the first channel 31 is greater than the width dimension W2 of the second channel 32, the molding resin material M flowing through the second channel 32 may not be able to sufficiently merge with the molding resin material M flowing through the first channel 31 and may accumulate in the second channel 32. The accumulated molding resin material M may harden slowly, potentially causing incomplete filling of the Calc 42.

[0048] If the Cal 42 remains unfilled, it may interfere with the gate break device in a subsequent process that removes excess resin, including the Cal 42 and runner 43, by breaking the gate portion of the molded product including the resin-sealed package 40.

[0049] In this embodiment, the molding resin material M that flows through the second channel 32 flows into the runner 26 from the confluence point without stagnation, supplementing the amount of resin in the molding resin material M that flowed through the first channel 31, thus suppressing the occurrence of the above-mentioned problems.

[0050] When the molding resin material M is filled into the cavity 24a through the gate 25 and cavity 24b from the runner 26, a holding pressure state at a predetermined pressure is maintained for a predetermined time. After this, the holding pressure state is released and the plunger 29 is moved backward to open the mold 21. Subsequently, the molded product including the resin sealing package 40 is released from the opened mold 21 and transported to a gate break device that removes excess resin from the molded product, where the gate portion is broken and excess resin including the cal 42 and runner 43 is removed.

[0051] According to at least one embodiment described above, since it has a plurality of first channels 31 extending from the central P toward connection positions 26a with a plurality of runners 26, and a second channel 32 extending in the circumferential direction, surrounding the plurality of first channels 31 and connecting with the first channels 31, the molding resin material M can be introduced into the runner 26 from the confluence position of the first channels 31 and the second channels 32 at the shortest distance from the central P.

[0052] Furthermore, according to the at least one embodiment described above, since the first channel 31 and the second channel 32 are formed by being partitioned by a plurality of protrusions 30, the surface area of ​​the first channel 31 and the second channel 32 increases, and the heat receiving area increases. Accordingly, according to the at least one embodiment described above, the viscosity of the molding resin material M flowing through the first channel 31 and the second channel 32 decreases, increasing the flow velocity and improving the resin fluidity.

[0053] Furthermore, if the width dimension of the first channel 31 changes, for example, this can cause noise in the resin flow. According to at least one embodiment described above, since the first channel 31 extends with a constant maximum width dimension, noise in the resin flow can be suppressed, and the resin flowability can be further improved.

[0054] Furthermore, according to the at least one embodiment described above, since the two first flow channels 31 are arranged on the same straight line, the direction of the pressure that the molding resin material M located in one of the first flow channels 31 receives from the molding resin material M located in the other first flow channel 31 is toward the connection position 26a with the runner 26. As a result, according to the at least one embodiment described above, it becomes possible to flow the molding resin material M from the first flow channel 31 into the runner 26 in an even shorter time.

[0055] Furthermore, according to at least one embodiment described above, since the widths of the first channel 31 and the second channel 32 are tapered towards the bottom, the surface area is larger and the heat receiving area is increased compared to the case where there is no tapered shape. Therefore, according to at least one embodiment described above, the viscosity of the molding resin material M flowing through the first channel 31 and the second channel 32 is reduced, which allows for an even greater increase in flow velocity.

[0056] [Second embodiment of the mold] Next, a second embodiment of the mold 21 will be described with reference to Figure 8. In this figure, elements identical to those in the first embodiment shown in Figures 1 to 7 are denoted by the same reference numerals, and their descriptions are omitted.

[0057] Figure 8 is a partial cross-sectional view showing the mold 21 of the second embodiment. As shown in Figure 8, the upper mold 22 has an insert 30A. The insert 30A is cylindrical. The insert 30A has a projection 30 on the side facing the lower mold 23. The insert 30A is detachably installed in a recess 22A formed in the upper mold 22.

[0058] The recess 22A opens on the side facing the lower mold 23. The recess 22A is formed in a circular shape when viewed from below, for example, with the radial position where the smallest diameter occurs on the inner circumferential surface of the tapering cal 27 towards the top as the inner circumferential surface. The recess 22A may have a bottom or it may penetrate the upper mold 22 in the vertical direction. The other configurations are the same as those of the first embodiment described above.

[0059] In the mold 21 with the above configuration, the insert 30A can be attached to and detached from the upper mold 22 through an opening on the side facing the lower mold 23. The insert 30A is provided in a replaceable manner relative to the upper mold 22. In the first embodiment described above, since the protrusion 30 was formed on the upper mold 22, if the number of resin-sealed packages 40 and runners 43, their positions in the mold 21, the number of first flow channels 31, their positions (tilts), their maximum width dimensions, and the maximum width dimensions of the second flow channel 32 are to be newly set, a new upper mold 22 is required.

[0060] Furthermore, even if the resin-encapsulated packages 40 are different but the protrusions 30 are the same, it becomes necessary to form the protrusions 30 on a new upper mold 22. In contrast, even if a new shape of protrusion 30 is required, a recess 22A can be formed on the upper mold 22 instead of a protrusion 30, thus improving the manufacturing efficiency of the upper mold 22. Moreover, if the resin-encapsulated packages 40 are different but the protrusions 30 are the same, it is possible to use a pre-made insert 30A or to manufacture only a new insert 30A, thus improving the production efficiency of the resin-encapsulated packages 40. Furthermore, maintenance of the mold 21 can be handled by simply replacing the insert 30A.

[0061] Therefore, according to at least one embodiment, in addition to obtaining the same effects and benefits as the first embodiment, it can contribute to improving the manufacturing efficiency of the upper mold 22 and the production efficiency of the resin-encapsulated package 40.

[0062] In the above embodiment, the mold 21 is exemplified as having a cull 27 in the upper mold 22 and a plunger 29 in the lower mold 23, but it is not limited to this configuration. It may also have a configuration where the plunger 29 is in the upper mold 22 and the cull 27 is in the lower mold 23.

[0063] Furthermore, although the above embodiment illustrates a configuration in which there are four resin-sealed packages 40 and four runners 43, the configuration is not limited to this. The number of resin-sealed packages 40 and four runners 43 may be two or more. It is preferable that the number of resin-sealed packages 40 and four runners 43 be an even number, from the viewpoint of arranging the two first flow channels 31 located on both sides of the central part P to be on the same straight line.

[0064] Furthermore, although the above embodiment illustrates a configuration in which the first channel 31 extends linearly from the central point P toward the connection point 26a between the cal 27 and the runner 26, the configuration is not limited to this. From the viewpoint of arranging the two first channels 31 located on both sides of the central point P on the same straight line, it is optimal for the widthwise center of the first channel 31 to pass through the central point P. However, if the widthwise center at the intersection of the two first channels 31 located on both sides of the central point P is 1 mm or less, the same operation and effect as when the two first channels 31 are arranged on the same straight line can be obtained.

[0065] This embodiment includes the following appended aspects. (Note 1) A plunger is provided inside one of the openings of the upper and lower molds, which is capable of moving back and forth in the vertical direction. A cal is provided on the other side of the upper and lower molds, facing the opening, Multiple cavities capable of housing semiconductor chips, Multiple runners connecting the aforementioned cal and the multiple aforementioned cavities, Equipped with, The aforementioned cal, Multiple first channels extending from the center toward connection points with multiple runners, A second channel extends circumferentially from the central part, surrounds the multiple first channels, and connects to the multiple first channels, A mold having (Note 2) The cavities and runners are provided in an even number, The multiple first flow channels are arranged in pairs on the same straight line. The mold described in Appendix 1. (Note 3) The cal has a plurality of fan-shaped projections in the vertical direction that protrude from the bottom toward the opening and demarcate the first and second flow paths, The mold described in Appendix 2. (Note 4) The depth from the tip of the projection to the bottom of the first and second channels is more than half of the maximum depth of the cal. The mold described in Appendix 3. (Note 5) The other of the upper mold and the lower mold is provided with a removable insert having the protrusion. The mold described in Appendix 3 or Appendix 4. (Note 6) Viewed in the vertical direction, the maximum width dimension of the first flow path is less than or equal to the width dimension of the connection position. The mold described in any one of the appendices 1 through 5. (Note 7) When viewed in the vertical direction, the maximum width dimension of the first channel is less than or equal to the maximum width dimension of the second channel. The mold described in Appendix 6. (Note 8) The first flow path extends with a constant maximum width dimension, The mold described in any one of the appendices 1 through 7. (Note 9) The first channel and the second channel each have a tapered shape, with their width narrowing towards the bottom. The mold described in any one of the appendices 1 through 8.

[0066] While several embodiments of the present invention have been described, these embodiments are presented as examples only and are not intended to limit the scope of the invention. These embodiments can be carried out in a variety of other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their variations are included in the scope and spirit of the invention, as well as in the claims and their equivalents. [Explanation of Symbols]

[0067] 21…Mold, 22…Upper mold, 23…Lower mold, 24a, 24b…Cavity, 26…Runner, 26a…Connection position, 27…Call, 28a…Opening, 29…Plunger, 30…Protrusion, 30A…Insert, 31…First channel, 32…Second channel, 41…Semiconductor device, 50…Semiconductor chip, P…Center

Claims

1. A plunger is provided inside one of the openings of the upper and lower molds, which is capable of moving back and forth in the vertical direction. A cal is provided on the other side of the upper and lower molds, facing the opening, Multiple cavities capable of housing semiconductor chips, Multiple runners connecting the aforementioned cal and the multiple aforementioned cavities, Equipped with, The aforementioned cal, Multiple first channels extending from the center toward connection points with multiple runners, A second channel extends circumferentially from the central part, surrounds the multiple first channels, and connects to the multiple first channels, A mold having

2. The cavities and runners are provided in an even number, The multiple first flow channels are arranged in pairs on the same straight line. The mold according to claim 1.

3. The cal has a plurality of fan-shaped projections in the vertical direction that protrude from the bottom toward the opening and demarcate the first and second flow paths. The mold according to claim 2.

4. The depth from the tip of the protrusion to the bottom of the first and second channels is more than half of the maximum depth of the cal. The mold according to claim 3.

5. The other of the upper mold and the lower mold is provided with a removable insert having the protrusion. The mold according to claim 3.

6. When viewed in the vertical direction, the maximum width dimension of the first flow path is less than or equal to the width dimension of the connection position. A mold according to any one of claims 1 to 5.

7. When viewed in the vertical direction, the maximum width dimension of the first channel is less than or equal to the maximum width dimension of the second channel. The mold according to claim 6.

8. The first flow path extends with a constant maximum width dimension, The mold according to claim 6.

9. The first channel and the second channel each have a tapered shape, with their width narrowing towards the bottom. A mold according to any one of claims 1 to 5.

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