Processing apparatus and processing method

Abstract

The present invention provides a processing apparatus and a processing method that can suitably adjust the relative orientation between the object to be processed and the gripping portion of the loading unit. [Solution] The present invention relates to an apparatus for processing a plate-shaped workpiece having an intangible area and a tangible area on its surface, comprising: a first holding part and a second holding part for holding the workpiece; an area information acquisition part for acquiring information about the tangible area of ​​the workpiece held by the first holding part; a transport unit having a gripping part that contacts the workpiece held by the first holding part and lifts the workpiece, and transports the workpiece to the second holding part; a first rotating part for rotating the first holding part or the gripping part; a processing unit for processing the workpiece; and a first rotation control unit that controls the rotation of the first holding part or the gripping part via the first rotating part based on information about the tangible area of ​​the workpiece acquired by the area information acquisition part.

Description

Technical Field

[0001] The present invention relates to an apparatus and a method for processing a plate-like workpiece such as a semiconductor wafer.

Background Art

[0002] Device chips such as ICs (Integrated Circuits) are essential components in various electronic devices such as mobile phones and personal computers. Such chips are manufactured, for example, by a procedure of dividing a semiconductor wafer having a plurality of devices formed on its surface into regions each including a device. The division of the wafer is performed by a method such as ablation processing using a laser beam or cutting processing using a cutting blade.

[0003] As documents describing technologies related to such division of semiconductor wafers, there are, for example, Patent Documents 1, 2, and the like.

[0004] In the process of manufacturing device chips, various processes such as photolithography, etching, grinding, polishing, division, and ultraviolet irradiation are performed on the semiconductor wafer. The wafer to be processed is transported between apparatuses (processing apparatuses) for performing each process, and the necessary processes are performed in a determined order.

[0005] In each processing apparatus, after the wafer to be processed is carried in from the carry-in port, it may be transported to a holding mechanism, and the wafer may be processed while being held by the holding mechanism.

[0006] At this time, as a mechanism for transporting the wafer to the holding mechanism, for example, an adsorption pad type transport unit that directly contacts the surface of the wafer and adsorbs and grips the wafer may be used (hereinafter, among the transport units for transporting a workpiece such as a wafer, the portion such as an adsorption pad that contacts the workpiece is referred to as a "gripping portion").

[0007] In this case, for example, if a device is formed on a portion of the wafer surface, it is desirable that the wafer be gripped and transported with the gripping portion (suction pad) not in contact with the area where the device is formed, but in contact with other areas, in order to prevent damage to the device.

[0008] However, the areas on the wafer where devices are formed and the areas where they are not, that is, which areas should not be in contact with the gripping part and which areas may be in contact with the gripping part, may vary depending on the type and orientation of the wafer. In this specification, areas on the surface of the workpiece (wafer) that are preferably not to be touched by the gripping part, etc., will be referred to as "untouchable areas," and areas that may be touched will be referred to as "touchable areas."

[0009] For example, if, among wafers processed by a certain processing device, one group of wafers has m devices formed on its surface, while another group of wafers has n devices formed on its surface, then the setting of the tactile area (the area where devices are not formed) in one group may differ from the setting of the tactile area in the other group. In that case, even if the dimensions of the wafers in one group are the same as those of the wafers in the other group, the position where the gripping part may make contact with the wafers in one group may be located in the tactile area of ​​the wafers in the other group.

[0010] Furthermore, even if the dimensions and tactile area settings are the same for a wafer, if the intactile area is not set concentrically with the wafer itself, the contact portion of the wafer with the gripping portion may be either a tactile area or an intactile area depending on the angle of the wafer with respect to the gripping portion.

[0011] If wafers with the same dimensions and contact area settings are always fed into the processing device in a constant orientation, then it is sufficient to set the position and orientation of the gripping part so that the gripping part is in a constant orientation relative to the fed wafer. However, if this is not the case, keeping the position and orientation of the gripping part constant may cause the gripping part to come into contact with the intangible area during the transport operation, depending on the wafer.

[0012] Based on the above, in order to avoid the inaccessible area and bring the gripping part into contact with the accessible area, the condition of the wafer being transported must be monitored, and the angle of the wafer or the gripping part must be adjusted as necessary.

[0013] Traditionally, this angle adjustment was performed manually by the processing machine operator. However, every time a wafer with a different contact area setting was loaded, or if the wafer's angle shifted during loading, the operator had to stop the processing machine and adjust the orientation of the gripping part. This process was time-consuming and laborious. [Prior art documents] [Patent Documents]

[0014] [Patent Document 1] Japanese Patent Publication No. 2009-176957 [Patent Document 2] Japanese Patent Publication No. 2022-35059 [Overview of the project] [Problems that the invention aims to solve]

[0015] The object of the present invention is to provide a processing apparatus and a processing method that can suitably adjust the relative orientation between the object to be processed and the gripping portion of the loading unit. [Means for solving the problem]

[0016] According to one aspect of the present invention, there is a processing apparatus for processing a plate-shaped workpiece having an intangible area and a tangible area set on its surface, comprising: a first holding part for holding the workpiece; a second holding part for holding the workpiece; an area information acquisition part for acquiring information about the tangible area of ​​the workpiece held by the first holding part; a transport unit having a gripping part that contacts the workpiece held by the first holding part and lifts the workpiece, and transports the workpiece lifted by the gripping part to the second holding part; a first rotating part that rotates at least one of the first holding part or the gripping part about an axis that intersects the surface of the workpiece held by the gripping part; a processing unit for processing the workpiece; and a first rotation control unit that controls the rotation of at least one of the first holding part or the gripping part via the first rotating part based on information about the tangible area of ​​the workpiece acquired by the area information acquisition part.

[0017] Preferably, the system further includes a second rotating part that rotates the second holding part about an axis that intersects the surface of the workpiece held by the second holding part, and a second rotation control unit that, before the workpiece being transported by the transport unit is held by the second holding part, rotates the second holding part via the second rotating part to a preparation angle corresponding to the amount of rotation of at least one of the first holding part or the gripping part by the first rotation control unit.

[0018] Preferably, the second rotation control unit rotates the second holding part to a reference angle after the workpiece is held in the second holding part at the preparation angle and before the processing of the workpiece is performed by the processing unit, and rotates the second holding part to the preparation angle after the processing of the workpiece is performed by the processing unit while the workpiece is held in the second holding part at the reference angle.

[0019] Preferably, a second rotating unit that rotates the second holding unit about an axis intersecting the surface formed by the object to be processed held by the second holding unit, and after the object to be processed conveyed by the conveying unit is held by the second holding unit at a reference angle, the second holding unit is rotated by a rotation amount corresponding to the rotation amount of at least one of the first holding unit or the gripping unit by the first rotation control unit via the second rotating unit, and the second holding unit is further provided with a second rotation control unit that arranges the second holding unit at a processing angle.

[0020] Preferably, after the processing of the object to be processed by the processing unit is executed in a state where the object to be processed is held by the second holding unit, the second rotation control unit rotates the second holding unit to the reference angle.

[0021] According to another aspect of the present invention, there is provided a processing method for processing a plate-shaped object to be processed having an untouchable area and a touchable area set on its surface, the method including: a first holding step of holding the object to be processed by a first holding unit; an area information acquisition step of acquiring information regarding the touchable area of the object to be processed held by the first holding unit; a conveying step of conveying the object to be processed from the first holding unit to a second holding unit by a conveying unit; a second holding step of holding the object to be processed conveyed to the second holding unit by the second holding unit; and a processing step of processing the object to be processed after the second holding step, and further executing a first orientation adjustment step of adjusting the relative orientation between the object to be processed conveyed from the first holding unit to the second holding unit and the gripping unit of the conveying unit according to the information regarding the touchable area of the object to be processed acquired in the area information acquisition step.

Effects of the Invention

[0022] According to the processing apparatus and the processing method according to one aspect of the present invention, based on the information regarding the touchable area of the object to be processed, the relative orientation between the object to be processed and the gripping unit of the loading unit can be suitably adjusted.

Brief Description of the Drawings

[0023] [Figure 1] FIG. 1 is a perspective view schematically showing an example of the form of a processing apparatus. [Figure 2] FIG. 2 is a block diagram schematically showing the connection relationship of each part in the processing apparatus of FIG. 1. [Figure 3] FIG. 3 is a perspective view showing an example of the form of the object to be processed. [Figure 4] FIG. 4 is a perspective view showing another example of the form of the first holding part provided in the processing apparatus together with the object to be processed. [Figure 5] FIG. 5 is a plan view showing an example of the state of the object to be processed held by the first holding part, showing the state where there is no deviation in the angle of the object to be processed together with the contact point by the gripping part of the conveying unit. [Figure 6] FIG. 6 is a plan view showing another example of the state of the object to be processed held by the first holding part, showing the state where there is a deviation in the angle of the object to be processed together with the contact point by the gripping part of the conveying unit. [Figure 7] FIG. 16 is a plan view showing yet another example of the state of the object to be processed held by the first holding part, showing the state where a different type of object to be processed from FIG. 5 is held together with the contact point by the gripping part of the conveying unit. [Figure 8] FIG. 8 is a flowchart showing an example of the procedure of the processing method of the object to be processed by the processing apparatus of FIG. 1 (the first procedure example). [Figure 9] FIG. 9 is a plan view schematically showing the state where the second holding part is at the reference angle and the state where the second holding part is at the preparation angle, superimposed on each other in the first procedure example. [Figure 10] FIG. 10 is a plan view schematically showing the state where the object to be processed is held by the second holding part at the preparation angle in the first procedure example. [Figure 11] FIG. 11 is a plan view schematically showing the state where the second holding part rotates to the reference angle while holding the object to be processed in the first procedure example. [Figure 12] FIG. 12 is a flowchart showing another example of the procedure of the processing method of the object to be processed by the processing apparatus of FIG. 1 (the second procedure example). [Figure 13] FIG. 13 is a plan view schematically showing the state where the object to be processed is held by the second holding part at the reference angle in the second procedure example. [Figure 14] Figure 14 is a schematic plan view showing the state in the second procedure example where the second holding unit has rotated to the processing angle while holding the workpiece. [Figure 15] Figure 15 is a flowchart showing yet another example (a third example of the procedure) of processing the material to be processed using the processing apparatus shown in Figure 1. [Modes for carrying out the invention]

[0024] Embodiments of the present invention will be described with reference to the attached drawings. Figure 1 is a schematic perspective view showing an example of the configuration of the processing apparatus. Figure 2 is a schematic block diagram showing the connection relationships of each part in the processing apparatus of Figure 1. Figure 3 is a perspective view showing an example of the configuration of an object to be processed. Figure 4 is a perspective view showing another example of the configuration of the first holding part provided in the processing apparatus together with an object to be processed.

[0025] In Figure 1, the X, Y, and Z directions represent the orientations of three mutually orthogonal axes in three-dimensional space. The X direction (left-right direction) and the Y direction (front-back direction) are mutually orthogonal horizontal directions. The Z direction (up-down direction) is orthogonal to the X and Y directions and is the vertical direction. Furthermore, in the processing apparatus (machining apparatus) 2 of this embodiment, the direction along the X direction is the machining feed direction, and the direction along the Y direction is the indexing feed direction.

[0026] In this specification, expressions such as "along the X direction" or "along the horizontal plane" are used, but these do not necessarily mean that the orientation of the members or surfaces strictly coincides with or is parallel to these axes or planes. For example, they also include cases where they are at a slight angle to each other but are generally facing the same direction, or where the angle or movement of the members includes a component in that direction.

[0027] The processing apparatus 2 in this embodiment is a processing apparatus that performs laser processing on the workpiece 11. However, there are no restrictions on the type of processing apparatus; any apparatus that performs some kind of processing on a plate-shaped workpiece is acceptable. The processing apparatus may be, for example, a cutting apparatus, a grinding apparatus, a polishing apparatus, a cleaning apparatus, etc.

[0028] The processing apparatus (processing apparatus) 2 comprises a base 4 that supports each part constituting the processing apparatus 2, and each component (first holding part 10, transport unit 14, second holding part 18, processing unit 42, etc.) supported by the base 4. The base 4 is a frame-like structure that supports the entire processing apparatus 2.

[0029] As shown in Figure 3, the workpiece 11 is a plate-shaped (disk-shaped in this example) wafer formed using a semiconductor such as silicon. The surface (top surface in Figure 3) of this workpiece 11 is divided into multiple small regions by multiple intersecting processing lines (streets), and devices such as ICs (Integrated Circuits) are formed in each small region. Alternatively, the workpiece 11 is an item called a COW (Chip On Wafer), in which multiple semiconductor chips are arranged on the surface of a substrate wafer.

[0030] On the surface of the object to be processed 11, depending on the presence or absence of a device, there are areas that should not be touched by other equipment, etc. (untouchable area) A1 and areas that may be touched (touchable area) A2. In other words, the area where the device is located is the untouchable area A1, and the area around the untouchable area A1 where there is no device is the touchable area A2.

[0031] An orientation identification portion 11a, which is a notch (cutout) for indicating the crystal orientation, is provided at one point on the outer edge of the disc-shaped workpiece 11. The orientation identification portion 11a can be anything that can be used as a mark that can identify the orientation of the workpiece 11, for example, it may be a so-called orientation flat (orifura), or it may be a mark made with ink or the like on the surface of the workpiece 11.

[0032] The material, shape, structure, size, etc., of the workpiece 11 are not limited to the examples described herein. For example, substrates formed using other semiconductors (e.g., GaN, SiC, etc.), ceramics, resins, metals, etc., may be used as the object to be processed in the processing apparatus (processing apparatus) 2.

[0033] Similarly, the type, number, shape, structure, size, arrangement, etc., of devices formed on the workpiece 11 are not limited to the embodiments described in this embodiment, and devices may not even be formed on the workpiece 11.

[0034] More specifically, the workpiece 11 may be, for example, a sapphire substrate on which multiple LED (Light Emitting Diode) devices are discretely formed on its surface, or a ceramic substrate on which multiple predetermined circuits are discretely formed on its surface.

[0035] As shown in Figure 1, a protruding portion is provided at one corner of the rectangular base 4 in plan view, and a cassette elevator 6 for transporting the workpiece 11 to the processing device 2 is located in the space inside this protruding portion.

[0036] Cassette 8 is a container for housing the objects to be processed 11. Cassette 8 is a rectangular parallelepiped container as shown in Figure 1, and multiple plate-shaped objects to be processed 11 are housed inside in a horizontal orientation.

[0037] The shaft of the cassette elevator 6, located inside the base 4, opens on the upper surface of the base 4, and a lifting platform moves up and down within this shaft. A cassette 8 is placed on the lifting platform, and with the cassette 8 exposed on the base 4 through the opening in the shaft, the object to be processed 11 is loaded and unloaded from the cassette 8.

[0038] A first holding section 10 is provided on the base 4 adjacent to the cassette elevator 6. In this embodiment, the first holding section 10 is configured as a pair of rails 10a, 10a that are arranged parallel to each other and extend horizontally. The distance between the rails 10a, 10a is variable according to the diameter of the workpiece 11 to be processed, and the workpiece 11 can be held on the rails 10a, 10a by resting both ends on each rail 10a, 10a (see Figure 5). In other words, the rails 10a, 10a form a virtual holding surface between them on which the plate-shaped workpiece 11 is held.

[0039] The pair of rails 10a, 10a constituting the first holding section 10 are provided to extend along the Y direction from the edge of the opening of the shaft of the cassette elevator 6. The cassette 8 is placed on the lifting platform of the cassette elevator 6 with the opening on its side facing the first holding section 10 (note that in Figure 1, the opening of the cassette 8 faces the back and is not shown in the figure), and the workpiece 11 is pulled out from the opening in a direction along the Y direction and held by the first holding section 10.

[0040] Figure 4 shows an example of another configuration of the first holding unit 10. The first holding unit 10 shown in Figure 4 is configured to include, for example, a holding base 10b, which is a chuck table. The upper surface of the holding base 10b, which is a chuck table, is a surface that aligns with the XY plane (horizontal plane), and the workpiece 11 is held there. That is, the upper surface of the holding base 10b forms a holding surface 10c that holds the workpiece 11. The holding surface 10c is connected to a suction source (not shown), such as an ejector, via a suction passage or the like provided inside the holding base 10b.

[0041] Thus, the first holding unit 10 can be a device with an appropriate configuration, as long as it can suitably hold the object to be processed 11.

[0042] As shown in Figure 1, a region information acquisition unit (first region information acquisition unit) 12 is provided above the position where the object to be processed 11 is held in the first holding unit 10. The region information acquisition unit is responsible for acquiring information about the tactile region A2 of the object to be processed 11 held in the first holding unit 10. The first region information acquisition unit 12 shown in Figure 1 is configured as an imaging device that acquires an image of the object to be processed 11 held in the first holding unit 10.

[0043] The image acquired by the first region information acquisition unit 12, which is an imaging device, is input to the controller 50 as image data. The controller 50 can determine the angle of the object to be processed 11 held by the first holding unit 10 based on the position of the orientation identification unit 11a of the object to be processed 11 that is captured in the image. Alternatively, the controller 50 can determine the type of object to be processed 11 that is captured in the image and acquire data related to the setting of the untouchable area A1 / touchable area A2 associated with that type. The functions of the region information acquisition unit and the functions of the controller 50 related thereto will be described in detail later.

[0044] A transport unit 14 is provided near the first holding portion 10 on the base 4. The transport unit 14 is a device in which, for example, a gripping portion 14a, which is a suction pad, is provided at the tip of an arm. The transport unit 14 is designed to lift and transport the object to be processed 11 by bringing a part of the gripping portion 14a into contact with the surface of the object to be processed 11 and using negative pressure to suction the contacted portion.

[0045] A first rotating part 16 (see Figure 2) is provided at the mounting portion of the gripping part 14a on the arm of the transport unit 14.

[0046] In the example shown in Figure 1, the first rotating part 16 is provided on the transport unit 14 and rotates the gripping part 14a. The operation of this first rotating part 16 causes the gripping part 14a to rotate about an axis (an axis along the Z direction) that is perpendicular to the surface formed by the workpiece 11 held by the gripping part 14a (the surface formed by the plate-shaped workpiece 11 as a whole, and the surface parallel to the surface that the gripping part 14a adsorbs).

[0047] Furthermore, depending on the configuration of the first holding part 10, the first rotating part 16 may be configured to rotate the first holding part 10 (see Figure 2). The first holding part 10 shown in Figure 4 has its lower part connected to the first rotating part 16, which is a rotation drive source such as a motor, and rotates around a rotation axis along the Z axis by the operation of the first rotating part 16.

[0048] Thus, the first rotating part 16 may rotate the gripping part 14a of the transport unit 14, or it may rotate the first holding part 10, or it may rotate both. In other words, the first rotating part 16 is a mechanism that rotates at least one of the first holding part 10 or the gripping part 14a, with an axis that intersects the surface formed by the workpiece 11 held by the gripping part 14a as its center.

[0049] In addition to the first holding part 10, a second holding part 18 is positioned within the movable range of the transport unit 14 on the base 4. The second holding part 18 is a chuck table that holds the workpiece 11 during laser processing. The second holding part 18, which is a chuck table, is connected to a second rotating part 20 (see Figure 2), which is a rotational drive source such as a motor, and rotates around a rotation axis along the Z axis due to the operation of the second rotating part 20.

[0050] The upper surface of the second holding portion 18 is a surface aligned with the XY plane (horizontal plane), and the object to be processed 11 is held there. That is, the upper surface of the second holding portion 18 forms a holding surface 18a that holds the object to be processed 11. The holding surface 18a is connected to a suction source (not shown), such as an ejector, via a suction passage or the like provided inside the second holding portion 18.

[0051] The transport unit 14 lifts the unprocessed workpiece 11 held in the first holding section 10 and transports it to the second holding section 18. The transport unit 14 also lifts the processed workpiece 11 held in the second holding section 18 and transports it to the first holding section 10 or another location.

[0052] A Y-axis movement mechanism 22 and an X-axis movement mechanism 32 are connected to the lower part of the second holding part 18, and a processing unit 42, which is a processing unit, is positioned above the second holding part 18.

[0053] The Y-axis movement mechanism 22 is a mechanism that moves the second holding part 18 and the processing unit (processing unit) 42 relatively in a direction along the Y-axis, and in the processing apparatus 2 of this embodiment, the second holding part 18 is operated along the Y-axis. The X-axis movement mechanism 32 is a mechanism that moves the second holding part 18 and the processing unit 42 relatively in a direction along the X-axis, and in the processing apparatus 2 of this embodiment, the second holding part 18 is operated along the X-axis.

[0054] The Y-axis movement mechanism 22 includes a Y-axis guide rail 24, a Y-axis movement table 26, a screw shaft 28, and a rotary drive source 30.

[0055] The Y-axis guide rail 24 is a pair of members mounted parallel to each other along the Y-axis on the upper surface of the base 4. The Y-axis movable table 26 is mounted on the Y-axis guide rail 24 so that it can slide along the longitudinal direction of the Y-axis guide rail 24 (along the Y-axis).

[0056] A screw shaft 28 is positioned between a pair of Y-axis guide rails 24, along the longitudinal direction of the Y-axis guide rails 24. A nut portion (not shown) is provided on the underside of the Y-axis moving table 26, and the screw shaft 28 passes through this nut portion. A rotational drive source 30, such as a pulse motor, is connected to one end of the screw shaft 28, and the operation of the rotational drive source 30 causes the screw shaft 28 to rotate, so that the Y-axis moving table 26 moves in a direction along the longitudinal direction of the Y-axis guide rails 24 (direction along the Y-axis; indexing feed direction).

[0057] An X-axis movement mechanism 32 is provided on the upper surface of the Y-axis movement table 26. The X-axis movement mechanism 32 comprises an X-axis guide rail 34, an X-axis movement table 36, a screw shaft 38, and a rotary drive source 40.

[0058] The X-axis guide rails 34 are a pair of members mounted parallel to each other along the X-axis on the upper surface of the Y-axis movable table 26. The X-axis guide rails 34 are mounted so that the X-axis movable table 36 can slide along the X-axis.

[0059] Between a pair of X-axis guide rails 34, a screw shaft 38 is positioned along the longitudinal direction of the X-axis guide rails 34. A nut portion (not shown) is provided on the underside of the X-axis moving table 36, and the screw shaft 38 passes through this nut portion. A rotational drive source 40, such as a pulse motor, is connected to one end of the screw shaft 38, and the operation of the rotational drive source 40 causes the screw shaft 28 to rotate, so that the X-axis moving table 36 moves along the X-axis guide rails 34.

[0060] In this embodiment of the processing apparatus 2, the case described is one in which both the Y-axis moving mechanism 22 and the X-axis moving mechanism 32 move the second holding part 18. However, these moving mechanisms may be configured such that, for example, the Y-axis moving mechanism and the X-axis moving mechanism move the processing unit 42 along the Y-axis and X-axis, respectively, or both the second holding part 18 and the processing unit 42 move along the Y-axis and X-axis.

[0061] Thus, the second holding unit 18, which is a chuck table, holds the workpiece 11 on its holding surface 18a and moves along the X-axis (machining feed direction) and along the Y-axis (indexing feed direction) by the operation of the X-axis moving mechanism 32 and the Y-axis moving mechanism 22.

[0062] The processing unit 42 is a mechanism that has the function of processing the workpiece 11, and in this embodiment, it is a processing unit that performs laser processing on the workpiece 11 held by the second holding unit 18. The processing unit (processing unit) 42 is provided above the second holding unit 18. The processing unit 42 includes a support arm 44, a light concentrator 46, a laser oscillator (not shown), and a camera unit 48.

[0063] At the end of the base 4, a wall is provided that constitutes the housing of the processing device 2, extending upward from the upper surface of the base 4. A cantilevered support arm 44 is provided that protrudes from the wall into the space above the second holding part 18.

[0064] A substantially cylindrical light condenser 46 is positioned at the tip of the support arm 44. A laser beam is guided to the light condenser 46 from a laser oscillator (not shown) through an optical system (not shown). The laser oscillator (not shown) is composed of a rod-shaped laser medium made of, for example, Nd:YAG, Nd:YVO4, etc., and emits a pulsed laser beam having a wavelength (for example, a wavelength of 355 nm) that is absorbed by the material of the object to be processed 11.

[0065] Inside the light condenser 46 are a mirror (not shown) and a focusing lens (not shown). The laser beam, emitted from the laser oscillator and guided into the light condenser 46 by the optical system, is reflected downward by the mirror and then focused by the focusing lens to a position below the light condenser 46.

[0066] When the focusing point of the laser beam by the light concentrator 46 is positioned near the surface of the workpiece 11 held in the second holding unit 18, the workpiece 11 is subjected to laser processing (ablation processing).

[0067] A camera unit 48 is positioned at the tip of the support arm 44, adjacent to the light condenser 46. The camera unit 48 includes a lens, an image sensor, etc. (not shown), and is used, for example, to image the surface of the workpiece 11 held by the second holding unit 18.

[0068] A controller 50 is connected to the processing apparatus 2 to control the operation of each component of the processing apparatus 2. The controller 50 is a mechanism that monitors and controls the operation of each component of the processing apparatus 2, and is configured, for example, by a computer. The controller 50 includes a calculation unit that performs various calculations necessary for the operation of the processing apparatus 2, and a storage unit that stores various information (data, programs, etc.) used for the operation of the processing apparatus 2.

[0069] The arithmetic unit includes a processor such as a CPU (Central Processing Unit). The storage unit includes memory such as ROM (Read Only Memory) and RAM (Random Access Memory). The functions of the controller 50 are realized, for example, by the operation of the information processing device according to a program (software) stored in the storage device.

[0070] In addition, the controller 50 is equipped with a communication unit that communicates with each part of the processing device 2 and inputs control signals to them. The communication unit inputs various control signals to each part, such as the cassette elevator 6, the first area information acquisition unit 12, the transport unit 14, the first rotating unit 16, the second rotating unit 20, the Y-axis moving mechanism 22, the X-axis moving mechanism 32, and the processing unit 42, via wired or wireless communication.

[0071] The controller 50 having the above configuration, as shown in Figure 2, particularly includes a determination unit 50a, a first rotation control unit 50b, a second rotation control unit 50c, a region information acquisition unit (second region information acquisition unit) 50d, and a data storage unit 50e.

[0072] The determination unit 50a acquires information regarding the tactile region A2 (see Figure 3) of the object to be processed 11 from the first region information acquisition unit 12. The information regarding the tactile region A2 is, for example, the angle of the object to be processed 11 placed on the first holding unit 10. More specifically, the angle of the object to be processed 11 is the angle of the object to be processed 11 centered on an axis perpendicular to the plane formed by the plate-shaped object to be processed 11. The axis perpendicular to the plane formed by the object to be processed 11 is the axis along the vertical direction (Z direction) when the object to be processed 11 is placed so as to form a plane along the horizontal plane (XY plane).

[0073] The determination unit 50a acquires the angle of the workpiece 11 (the angle of the workpiece 11 around an axis that intersects the planes formed by the plate-shaped workpiece 11) based on the image data acquired by the first region information acquisition unit 12, which is an imaging device. The workpiece 11, which is a semiconductor wafer, has a notch provided as an orientation identification unit 11a at one location on its outer edge (see Figure 3). By identifying the position of the orientation identification unit 11a in the image, the angle of the workpiece 11 can be determined.

[0074] Alternatively, depending on the nature of the object to be processed 11, it may be possible to directly identify the intangible area A1 / tangible area A2 set on the surface of the object to be processed 11 from the image. For example, if a device is located in a part of the surface of the object to be processed 11, and the area where the device is located is the intangible area A1 and the other areas are the tangible area A2, then if the area where the device is located can be identified using image analysis or other methods, that information will directly indicate the intangible area A1 / tangible area A2 on the object to be processed 11.

[0075] Alternatively, the settings for the intouchable area A1 / touchable area A2 may differ depending on the type of object 11 being processed. In that case, if the type of object 11 can be determined from its characteristics as seen in the image, it is possible to obtain information regarding the settings for the intouchable area A1 / touchable area A2 corresponding to that type.

[0076] In this context, the "type" of the workpiece 11 refers not to the material of the workpiece 11 or the type of device on its surface, but rather to the type of setting for the inaccessible area A1 / accessible area A2. In other words, for the convenience of transport by the transport unit 14, which will be explained later, workpieces 11 that have the same or can be considered to have the same inaccessible area A1 / accessible area A2 setting are described as "of the same type," and workpieces 11 that do not have the same setting are described as "of different types."

[0077] In summary, information relating to the tactile region A2 of the workpiece 11 refers to information that allows the user to grasp the intactile region A1 / tactile region A2 on the surface of the workpiece 11 held by the first holding unit 10, or the information relating to the intactile region A1 / tactile region A2 on the surface of the workpiece 11 held by the first holding unit 10 itself.

[0078] Specifically, the following information can be cited as information regarding the tactile area A2 of the object to be processed 11. • Setting of intangible area A1 / tangible area A2 on the surface of the workpiece 11. • Angle of the workpiece 11 held in the first holding unit 10 • Types of objects to be processed (11 types) The first rotation control unit 50b calculates the required amount of rotation for the gripping unit 14a based on the information regarding the tactile region A2 of the workpiece 11 identified by the determination unit 50a. The required amount of rotation is the amount of rotation necessary to adjust the angle of the gripping unit 14a so that it can avoid the intactile region A1 of the workpiece 11 and make contact with the tactile region A2. Furthermore, the first rotation control unit 50b controls the first rotation unit 16 to rotate the gripping unit 14a based on the calculated amount of rotation.

[0079] As shown in Figure 4, if the first holding portion 10 is configured to be rotatable by the first rotating portion 16, the first rotation control unit 50b may control the rotation of the first holding portion 10 via the first rotating portion 16. The rotation control by the first rotation control unit 50b via the first rotating portion 16 may target either the gripping portion 14a or the first holding portion 10, or both.

[0080] Thus, the first rotation control unit 50b controls the rotation of at least one of the first holding unit 10 or the gripping unit 14a via the first rotation unit 16, based on information regarding the tactile region of the workpiece 11 acquired by the first region information acquisition unit 12.

[0081] The second rotation control unit 50c controls the rotation of the second holding unit 18 via the second rotating unit 20. The second holding unit 18 rotates around an axis (an axis along the Z direction) that intersects the surface formed by the workpiece 11 held on the holding surface 18a, due to the operation of the second rotating unit 20. When the gripping unit 14a is rotated by the first rotation control unit 50b via the first rotating unit 16, the second rotation control unit 50c rotates the second holding unit in accordance with the amount of rotation.

[0082] The second area information acquisition unit 50d, like the first area information acquisition unit 12 which is an imaging device, is responsible for acquiring information about the tactile area A2 of the workpiece 11 held in the first holding unit 10. The information acquired by the second area information acquisition unit 50d provided in this controller 50 is, for example, the type of workpiece 11. For example, when the workpiece 11 is brought into the processing device 2, data identifying the type of workpiece 11 is input to the controller 50, and the second area information acquisition unit 50d acquires this data to determine the type of workpiece 11.

[0083] The data storage unit 50e stores data on the type of workpiece 11 to be loaded into the processing device 2 and the corresponding intangible area A1 / tangible area A2. Based on the type of workpiece 11 acquired from the second area information acquisition unit 50d, the determination unit 50a reads the intangible area A1 / tangible area A2 data corresponding to the type of workpiece 11 from the data storage unit 50e.

[0084] The first rotation control unit 50b controls the rotation of at least one of the first holding unit 10 or gripping unit 14a via the first rotation unit 16 based on the data of the intangible area A1 / tangible area A2 acquired by the determination unit 50a.

[0085] The determination unit 50a may, for example, determine the type of object to be processed 11 from the image data acquired from the first area information acquisition unit 12, and read the data of the untouchable area A1 / touchable area A2 corresponding to that type from the data storage unit 50e.

[0086] As described above, the first rotation control unit 50b controls the rotation of at least one of the first holding unit 10 or the gripping unit 14a via the first rotation unit 16 based on information regarding the tactile region A2 of the workpiece 11 acquired by the first region information acquisition unit 12 or the second region information acquisition unit 50d.

[0087] Furthermore, the acquisition of information by the first area information acquisition unit 12 and the acquisition by the second area information acquisition unit 50d may be used in combination, or only one of them may be used. For example, if only workpieces 11 of the same type are brought into the processing device 2, it is sufficient to acquire only the angle of the workpieces 11 by the first area information acquisition unit 12. Also, for example, if the angle of the workpieces 11 is adjusted in advance by another device when they are brought into the processing device 2, and it is sufficient to identify only the type of workpiece 11 as information regarding the tactile area A2, then it is sufficient to identify the type of workpiece 11 by the second area information acquisition unit 50d and acquire the corresponding tactile area A1 / tactile area A2 information from the data storage unit 50e.

[0088] An input / output unit 52 is connected to the controller 50. The input / output unit 52 is a user interface such as a keyboard or monitor display, and the operator operating the processing device 2 can operate various parts of the processing device 2 via the controller 50 by inputting commands to the input / output unit 52.

[0089] Figure 2 is a schematic diagram showing the connection relationships of the main components of the processing apparatus 2. Components that are not directly related to the transport of the workpiece 11 or the adjustment of the angle during processing are omitted from the illustration as appropriate. The same applies to Figure 1; for example, the cleaning unit and other components that are installed in the actual laser processing apparatus are omitted from the illustration.

[0090] The processing apparatus 2, having the above configuration, is capable of adjusting the position at which the gripping portion 14a of the conveying unit 14 contacts the workpiece 11, according to the state of the inaccessible area A1 / accessible area A2 of the workpiece 11 held by the first holding portion 10.

[0091] The state of the intouchable region A1 / touchable region A2 in the object to be processed 11 can change depending on, for example, the angle of the object to be processed 11, the type of object to be processed 11, etc. The relationship between the angle and type of the object to be processed 11 and the intouchable region A1 / touchable region A2 will be explained with reference to Figures 5 to 7.

[0092] Figures 5 and 6 are plan views showing examples of the state of the workpiece held by the first holding part 10. Figure 5 shows the workpiece 11 with no angular displacement, along with the contact point P1 made by the gripping part 14a. Figure 6 shows the workpiece 11 with an angular displacement, along with the contact points P1 and P2 made by the gripping part 14a.

[0093] The gripping portion 14a of the transport unit 14 shown in Figure 1 has a total of four contact points located at the four corners of a square relative to the object. These contact points make contact with the disc-shaped object to be processed 11 at four points on its outer circumference, thereby suctioning and lifting the object to be processed 11.

[0094] For example, in the workpiece 11 shown in Figure 5, the area containing the center of the workpiece 11 is an intangible area (an area where it is undesirable for the gripping part 14a to come into contact) A1, which is a collection of multiple rectangular areas (areas where the device is located), and the area outside of that is a tangible area (an area where it is permissible for the gripping part 14a to come into contact) A2.

[0095] In Figure 5, the workpiece 11 is in a state where there is no angular displacement in the first holding part 10 (here, a virtual line along the Y direction is used as the reference line, and the line connecting the center of the disc-shaped workpiece 11 and the orientation identification part 11a coincides with the direction of the reference line). In this state, the workpiece 11 corresponds to the tactile area A2 around the four locations indicated by the symbol P1 in Figure 5.

[0096] Note that in Figure 5, for the sake of drawing convenience, the illustration of the small regions where each device is located is omitted, and only the outline of the intangible region A1 as a collection of multiple small regions (the boundary line between the intangible region A1 and the tangible region A2) is shown. The same applies to the workpiece 11 in Figures 6 and below.

[0097] In Figure 5, the point indicated by the symbol P1 shows the position of the contact portion (contact point) when attempting to lift the workpiece 11 without rotating the gripping portion 14a from its default state (in this case, the lines connecting the contact portions diagonally are at a 45° angle with respect to a virtual line along the Y direction). If the angle of the workpiece 11 does not deviate from the state shown in Figure 5, the gripping portion 14a will contact the tactile area A2 in its default state and be able to lift the workpiece 11.

[0098] However, this is not the case when the object to be processed 11 is at a different angle, for example, as shown in Figure 6. When the object to be processed 11 is in the position shown in Figure 6 (rotated by an angle θ around the Z direction from the state shown in Figure 5), and the gripping part 14a is brought into contact with the object to be processed 11 at the contact point P1, the gripping part 14a will come into contact with the uncontactable area A1.

[0099] In such a case, by rotating the gripping portion 14a by an angle θ to match the angle of the workpiece 11, and bringing the gripping portion 14a into contact with the workpiece 11 at a contact point P2 that is an angle θ away from the contact point P1 around the central axis of the workpiece 11, the gripping portion 14a can be brought into contact with the workpiece 11 in the tactile area A2.

[0100] Furthermore, if the first holding portion 10 is configured to be rotatable as shown in Figure 4, instead of rotating the gripping portion 14a, the gripping portion 14a can be rotated to the opposite side by an angle θ together with the workpiece 11, thereby similarly bringing the gripping portion 14a into contact with the workpiece 11 in the tactile area A2. Alternatively, the rotation of the gripping portion 14a and the rotation of the first holding portion 10 may be used in combination.

[0101] Figure 7 is a plan view showing yet another example of the state of the workpiece 11 held by the first holding unit 10, and shows the state in which a different type of workpiece 11 is held, along with the contact points P1 and P3 made by the gripping part 14a of the transport unit 14.

[0102] The object to be processed 11 shown in Figure 7 has a different setting for the intangible / tangible area A1 / tangible area A2 compared to the object to be processed 11 in Figure 5. If the gripping part 14a is to be brought into contact with the object to be processed 11 at contact point P1, it will come into contact with the intangible area A1. In this case, for example, by rotating the gripping part 14a and shifting the contact point to the position indicated by P3 in the figure, the gripping part 14a can be brought into contact with the object to be processed 11 at the tangible area A2. Of course, if the first holding part 10 is designed to rotate (see Figure 4), the first holding part 10 may be rotated instead.

[0103] Thus, in the processing apparatus 2 of this embodiment, depending on the state of the intangible area A1 / tangible area A2 of the workpiece 11, the first rotating part 16 rotates at least one of the first holding part 10 or the gripping part 14a, thereby bringing the gripping part 14a into contact with the tangible area A2 of the workpiece 11.

[0104] The procedure for processing the workpiece 11 using the above mechanism will be further explained with reference to Figures 8 to 11. Figure 8 is a flowchart of an example of the processing method procedure (first procedure example). Figures 9 to 11 are schematic plan views showing the state of the workpiece 11 or the second holding part 18 in the first procedure example, respectively.

[0105] Figure 9 schematically shows the state in which the second holding part 18 is at the reference angle and the state in which the second holding part 18 is at the preparation angle in the first procedure example. Figure 10 shows the state in which the workpiece 11 is held by the second holding part 18 at the preparation angle in the first procedure example. Figure 11 schematically shows the state in which the second holding part 18 has rotated to the reference angle while holding the workpiece 11 in the first procedure example.

[0106] First, the workpiece 11 is brought into the processing device 2 and held in the first holding unit 10 (first holding step S10). Multiple workpieces 11 are brought into the processing device 2 in a cassette 8 and placed on the lifting platform of the cassette elevator 6. One workpiece 11 is then pulled out from the cassette 8 and held in the first holding unit 10 adjacent to the cassette elevator 6 (see Figure 1).

[0107] Next, information regarding the tactile region A2 of the object to be processed 11 held by the first holding unit 10 is acquired (region information acquisition step S20). The object to be processed 11 held by the first holding unit 10 is angled around the Z axis, as shown in Figure 6, for example. The first region information acquisition unit 12, which is an imaging device, acquires an image of the object to be processed 11 held by the first holding unit 10 and inputs it to the controller 50 (see Figure 2). The determination unit 50a provided in the controller 50 detects the angle of the object to be processed 11, for example, from the position of the orientation identification unit 11a of the object to be processed 11 that is captured in the image.

[0108] Next, in accordance with the information on the tactile region A2 acquired in the region information acquisition step S20, the relative orientation of the workpiece 11 being transported from the first holding unit 10 to the second holding unit 18 and the gripping unit 14a of the transport unit 14 is adjusted (first orientation adjustment step S30). Here, the gripping unit 14a of the transport unit 14 is rotated by the first rotating unit 16 so that the contact portion of the gripping unit 14a on the workpiece 11 is positioned in the tactile region A2. The amount of rotation of the gripping unit 14a is adjusted by the first rotation control unit 50b.

[0109] With the gripping portion 14a in contact with the tactile area A2 of the workpiece 11, the workpiece 11 is lifted by the gripping portion 14a and transported from the first holding portion 10 to the second holding portion 18 (transport step S40). The transported workpiece 11 is held by the holding surface 18a of the second holding portion 18 (second holding step S50). Laser processing is performed on the workpiece 11 held by the second holding portion 18 by the processing unit 42, which is a processing unit (processing step S60).

[0110] However, in this first example procedure, the second orientation adjustment steps 71, 72, and 73, which rotate the second holding part 18, are performed before and after the second holding step S50 and after the processing step S60, respectively.

[0111] In the second orientation adjustment step 71, before the workpiece 11 to be transported by the transport unit 14 is held by the second holding unit 18 (before the second holding step S50), the second holding unit 18 is rotated from the reference angle to the preparation angle by the second rotation control unit 50c via the second rotation unit 20.

[0112] The reference angle referred to here is a fixed position with respect to the angle around the rotation axis of the second holding part 18, and in this case, it is set as, for example, the fixed position when the workpiece 11 is processed by the processing unit 42.

[0113] The preparation angle is a position relating to the angle of the second holding part 18 around its axis of rotation, which is determined according to the amount of rotation of the gripping part 14a by the first rotating part 16, and is the position set in order to rotate the second holding part 18 together with the workpiece 11 to a reference angle.

[0114] For example, as shown in Figure 6, if the gripping portion 14a is rotated by an angle θ in the first orientation adjustment step S30, then in the second orientation adjustment step 71, the second holding portion 18 is rotated by an angle θ from the reference angle, as shown in Figure 9. In Figure 9, for illustrative purposes, a mark M is placed on the outer circumference of the second holding portion 18 to indicate its position. When the second holding portion 18 is at the reference angle, the mark M is shown with a dashed line, and when the second holding portion 18 is at the preparation angle, the mark M is shown with a solid line. In practice, such a mark M does not necessarily have to be placed.

[0115] With the second holding part 18 in a ready angle position, the workpiece 11 is held by the second holding part 18 (the second holding step S50 is performed). As shown in Figure 10, the second holding part 18 is rotated to a ready angle corresponding to the amount of rotation (angle θ) of the gripping part 14a, and the workpiece 11, which is gripped by the gripping part 14a, is held there in a position rotated by angle θ.

[0116] Next, the second orientation adjustment step S72 is performed. The second holding part 18, which was in a preparation angle rotated by an angle θ from the reference angle, rotates in the opposite direction by an angle θ together with the workpiece 11, as shown in Figure 11, and returns to the reference angle.

[0117] In this state, the workpiece 11 is held in the second holding part 18 at a reference angle in an orientation suitable for laser processing by the processing unit 42. In this state, processing (laser processing) of the workpiece 11 is performed by the processing unit 42 (processing step S60).

[0118] After processing, the second holding unit 18 is rotated and returns to the preparation angle (see Figure 10) together with the workpiece 11 (second orientation adjustment step S73). As shown in Figure 10, the workpiece 11, which is held by the second holding unit 18 in a position rotated by an angle θ, is lifted by the gripping unit 14a, which is also rotated by an angle θ, and transported to the first holding unit 10 or another location.

[0119] Thus, in the first procedure example, the gripping part 14a and the second gripping part 18 are automatically rotated to match the angle of the workpiece 11 held by the first holding part 10. As a result, the workpiece 11 is lifted to the gripping part 14a in the tactile area A2, avoiding the intactible area A1, and the workpiece 11 is processed at the appropriate angle.

[0120] Another procedure for processing the workpiece 11 by the processing device 2 will be explained with reference to Figures 12 to 14. Figure 12 is a flowchart of another example of the processing method procedure (second procedure example). Figures 12 and 13 are schematic plan views showing the state of the workpiece 11 or the second holding unit 18 in the second procedure example, respectively.

[0121] Figure 13 shows the state in the second procedure example where the workpiece 11 is held by the second holding part 18 at the reference angle. Figure 14 shows the state in the second procedure example where the second holding part 18 has rotated to the processing angle while holding the workpiece 11.

[0122] The processing method according to this second example procedure is the same as the first example procedure shown in Figure 8 in terms of the steps from the first holding step S10 to the processing step S60, but the timing and content of the second orientation adjustment step are different. In this second example procedure, the second orientation adjustment steps 74 and 75 are executed before and after the processing step S60, respectively.

[0123] In this second procedure example, as shown in Figure 13, the object to be processed 11, which has been transported from the first holding unit 10 by the transport unit 14, is first held by the second holding unit 18 at a reference angle (second holding step S50). The reference angle here is, for example, the angle set as the fixed position of the second holding unit 18 when it is in standby mode, and has a different meaning from the reference angle in the first procedure example described above. However, the definition and numerical settings of the reference angle in this second procedure example and the reference angle in the first procedure may be the same.

[0124] Subsequently, the second holding portion 18, which is at the reference angle, is rotated to the processing angle as shown in Figure 14 by the operation of the second rotating portion 20 (second orientation adjustment step S74). The processing angle is an angle suitable for processing the workpiece 11 by the processing unit (processing unit) 42, and the amount of rotation of the second rotating portion 20 from the reference angle to the processing angle is determined according to the amount of rotation of the gripping portion 14a in the first orientation adjustment step S30.

[0125] As shown in Figure 14, the workpiece 11 is in a position suitable for laser processing by the processing unit 42. In this state, the processing unit 42 performs processing (laser processing) of the workpiece 11 (processing step S60).

[0126] After processing, the second holding part 18 is rotated and returns to the reference angle (see Figure 13) together with the workpiece 11 (second orientation adjustment step S75). The workpiece 11, which is held by the second holding part 18 in a position rotated by angle θ, is lifted by the gripping part 14a, which is also rotated by angle θ, and transported to the first holding part 10 or another location.

[0127] Thus, in the second procedure example as well, the gripping part 14a and the second gripping part 18 are automatically rotated to match the angle of the workpiece 11 held by the first holding part 10. As a result, the workpiece 11 is lifted to the gripping part 14a in the tactile area A2, avoiding the intactible area A1, and the workpiece 11 is processed at the appropriate angle.

[0128] Further steps regarding the processing of the workpiece 11 by the processing device 2 will be explained with reference to Figure 15. Figure 15 is a flowchart showing yet another example of the processing method (third example of steps).

[0129] This third example procedure is generally similar to the first and second examples procedure described above, but differs in that the second orientation adjustment step is not performed (the second holding part 18 does not rotate due to the transport and processing of the workpiece 11).

[0130] For example, as shown in Figure 4, if the first holding part 10 is configured to rotate by the first rotating part 16, in the first orientation adjustment step S30, instead of rotating the gripping part 14a, the relative orientation between the workpiece 11 and the gripping part 14a can be adjusted by rotating the first holding part 10 (see Figure 4).

[0131] In this case, since the angle of the workpiece 11 is already adjusted when it is transported by the transport unit 14, there is no need to adjust the angle of the second holding unit 18 to match the angle of the workpiece 11.

[0132] Furthermore, even if there is no deviation in the angle of the workpiece 11 held by the first holding part 10, and the gripping part 14a needs to rotate depending on the type of workpiece 11, the workpiece 11 can be transported without adjusting its angle. In that case as well, there is no need to adjust the angle of the second holding part 18.

[0133] However, although there is no deviation in the angle of the workpiece 11 held by the first holding part 10, depending on the type of workpiece 11, it may be necessary to adjust the relative angle of the workpiece 11 with respect to the gripping part 14a, and if this is adjusted by rotating the first holding part 10, then, as in the first and second procedure examples described above, it may be necessary to adjust the angle of the workpiece 11 during processing by rotating the second holding part 18. In that case, in the second orientation adjustment step, the second holding part 18 will be rotated in accordance with the amount of rotation of the first holding part 10.

[0134] In the above embodiment, the processing apparatus was described as a laser processing apparatus, but the configuration of the processing apparatus is not limited to this. The processing apparatus may be a processing apparatus other than a laser processing apparatus, such as a cutting apparatus, grinding apparatus, or polishing apparatus, or it may be an apparatus that performs processing other than processing on the workpiece, such as a cleaning apparatus or inspection apparatus.

[0135] If the processing device is a cutting device, the cutting device includes, for example, a first holding unit for holding a workpiece, a transport unit for transporting the workpiece, a second holding unit for holding the workpiece, a cutting unit as a processing unit, and a nozzle for supplying cutting water as a processing liquid to the workpiece. The cutting unit includes a spindle on which a blade for cutting the workpiece held in the holding mechanism is mounted and which rotates with the blade, and the spindle is brought into contact with the workpiece while rotating.

[0136] If the processing apparatus is a grinding apparatus, the grinding apparatus includes, for example, a first holding unit for holding a workpiece, a transport unit for transporting a workpiece, a second holding unit for holding a workpiece, a grinding unit as a processing unit, and a nozzle for supplying grinding water as a processing liquid to the workpiece. The grinding unit includes a grinding wheel on which a grinding wheel for grinding the workpiece held in the holding mechanism is mounted, and a spindle that rotates together with the grinding wheel, and brings the grinding wheel into contact with the workpiece while rotating it.

[0137] If the processing apparatus is a polishing apparatus, the polishing apparatus includes, for example, a first holding unit for holding the workpiece, a conveying unit for transporting the workpiece, a second holding unit for holding the workpiece, a polishing unit as a processing unit, and a nozzle for supplying polishing water as a processing liquid to the workpiece. The polishing unit includes a polishing wheel on which a polishing pad for polishing the workpiece held by the holding mechanism is mounted, and a spindle that rotates together with the polishing wheel, and the polishing pad is brought into contact with the workpiece while rotating.

[0138] If the processing apparatus is a cleaning apparatus, the cleaning apparatus includes, for example, a first holding unit for holding the object to be processed, a conveying unit for transporting the object to be processed, a second holding unit for holding the object to be processed, and a cleaning unit as the processing unit. The cleaning unit includes a nozzle for supplying cleaning water as a processing liquid to the object to be processed.

[0139] If the processing device is an inspection device, the inspection device includes, for example, a first holding unit for holding the object to be processed, a transport unit for transporting the object to be processed, a second holding unit for holding the object to be processed, and an inspection unit as a processing unit. The inspection unit includes a camera, sensors, etc. for inspecting the object to be processed.

[0140] Of course, various other types of processing devices can be envisioned besides those listed here. Furthermore, processing devices equipped with the functionality to perform multiple processes on the object being processed can also be considered.

[0141] Furthermore, the structures, methods, etc., according to the embodiments described above are not limited to those embodiments and may be modified as appropriate without departing from the scope of the object of the present invention. [Explanation of Symbols]

[0142] 2: Processing equipment (processing device), 4: Base, 6: Cassette elevator, 8: Cassette 10: First retaining part, 10a: Rail, 10b: Retaining base, 10c: Retaining surface 11: Processed object, 11a: Direction identification part 12: Domain Information Acquisition Unit (First Domain Information Acquisition Unit) 14: Conveying unit, 14a: Gripping part 16: First rotating part, 18: Second holding part, 18a: Holding surface, 20: Second rotating part 22: Y-axis movement mechanism, 24: Y-axis guide rail, 26: Y-axis movement table 28: Screw shaft, 30: Rotary drive source 32: X-axis movement mechanism, 34: X-axis guide rail, 36: X-axis movement table 38: Screw shaft, 40: Rotary drive source 42: Processing unit (machining unit), 44: Support arm, 46: Light concentrator 48: Camera Unit 50: Controller, 50a: Determination unit, 50b: First rotation control unit 50c: Second rotation control unit, 50d: Region information acquisition unit (second region information acquisition unit) 50e: Data storage unit 52: Input / output section A1: Inaccessible area, A2: Accessible area P1: Contact point, P2: Contact point, P3: Contact point

Claims

1. An apparatus for processing a plate-shaped workpiece having an intangible area and an tangible area set on its surface, A first holding part for holding the object to be processed, A second holding part for holding the object to be processed, A region information acquisition unit that acquires information regarding the tactile region of the object to be processed held in the first holding unit, A conveying unit having a gripping portion that contacts the object to be processed held in the first holding portion and lifts the object to be processed, and transporting the object to be processed lifted by the gripping portion to the second holding portion, A first rotating part that rotates the first holding part or at least one of the gripping parts about an axis that intersects the surface of the workpiece held by the gripping part, A processing unit that processes the object to be processed, Based on information regarding the tactile region of the object to be processed acquired by the region information acquisition unit, a first rotation control unit controls the rotation of at least one of the first holding unit or the gripping unit via the first rotation unit. A processing device equipped with a device.

2. A second rotating part that rotates the second holding part about an axis that intersects the surface of the workpiece held by the second holding part, The processing apparatus according to claim 1, further comprising a second rotation control unit that, before the object to be processed, which is transported by the transport unit, is held in the second holding unit, rotates the second holding unit via the second rotating unit to a preparation angle corresponding to the amount of rotation of at least one of the first holding unit or the gripping unit by the first rotation control unit.

3. The second rotation control unit is After the object to be processed is held in the second holding part at the preparation angle, the second holding part is rotated to the reference angle before the processing of the object by the processing unit is performed. The processing apparatus according to claim 2, wherein after processing of the workpiece by the processing unit is performed while the workpiece is held in the second holding part at the reference angle, the second holding part is rotated to the preparation angle.

4. A second rotating part that rotates the second holding part about an axis that intersects the surface of the workpiece held by the second holding part, The processing apparatus according to claim 1, further comprising a second rotation control unit that, after the object to be processed, which is transported by the transport unit, is held in the second holding unit which is at a reference angle, rotates the second holding unit via the second rotating unit by an amount of rotation corresponding to the amount of rotation of at least one of the first holding unit or the gripping unit by the first rotation control unit, thereby positioning the second holding unit at the processing angle.

5. The second rotation control unit is The processing apparatus according to claim 4, wherein after processing of the workpiece by the processing unit is performed while the workpiece is held in the second holding part, the second holding part is rotated to the reference angle.

6. A processing method for a plate-shaped workpiece having an intangible area and an tangible area set on its surface, A first holding step in which the object to be processed is held in the first holding unit, A region information acquisition step is to acquire information regarding the tactile region of the object to be processed held by the first holding unit, A transport step in which the object to be processed is transported from the first holding unit to the second holding unit by a transport unit, A second holding step involves holding the object to be processed, which has been transported to the second holding unit, The process includes a second holding step followed by a processing step for processing the workpiece, A processing method further comprising performing a first orientation adjustment step to adjust the relative orientation between the object to be processed, which is being transported from the first holding unit to the second holding unit, and the gripping unit of the transport unit, in accordance with the information regarding the tactile area of ​​the object to be processed obtained in the area information acquisition step.

Images