Manufacturing method for collection containers and electronic components

Abstract

To provide a recovery device that mitigates the impact on electronic components and a method for manufacturing electronic components. [Solution] The collection container of the electronic component sorting device comprises a box-shaped storage section having an opening at the top, and a buffer member that is cantilevered to the inner wall of the storage section in a downward-sloping position and has a receiving surface on the track of the electronic components supplied from the discharge passage of the electronic component sorting device through the opening.

Description

Technical Field

[0004] ,

[0006] , , , , , ,

[0005] , , ,

[0003] , , ,

[0007] , , ,

[0001] The present disclosure relates to a recovery container and a method for manufacturing electronic components.

Background Art

[0002] There has been proposed an electronic component sorting device for inspecting and sorting electronic components such as chip capacitors. For example, Patent Document 1 discloses a device for individually sorting tested components into any one of a plurality of recovery containers (classification bins). The recovery container has an opening at the upper part and is formed in a box shape.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the above-described electronic component sorting device, the electronic components are discharged toward the recovery container by air pressure and gravity. Therefore, it is assumed that the electronic components are subjected to excessive impact by falling into the recovery container or colliding with and contacting the electronic components already in the recovery container.

[0005] An object of the present disclosure is to provide a recovery container and a method for manufacturing electronic components that mitigate the impact applied to the electronic components.

Means for Solving the Problems

[0006] The recovery container according to the present disclosure is a recovery container of an electronic component sorting device, and the recovery container includes a box-shaped storage portion having an opening at the upper part, and a buffer member that is supported in a cantilever manner on the inner wall portion of the storage portion in an inclined state downward and has a receiving surface on the trajectory of the electronic components supplied from the discharge path of the electronic component sorting device through the opening.

[0007] The method for manufacturing electronic components according to this disclosure is a method for manufacturing electronic components using an electronic component sorting device, wherein the electronic component sorting device includes a collection container for collecting the sorted electronic components, the collection container having a box-shaped storage section with an opening at the top, and a cushioning member cantilevered to the inner wall of the storage section in a downward-sloping position, wherein the electronic components supplied from the discharge passage of the electronic component sorting device through the opening are brought into contact with the receiving surface of the cushioning member to absorb the impact and reduce the falling speed, and are then stored in the storage section. [Effects of the Invention]

[0008] According to this disclosure, it is possible to provide a recovery container that mitigates the impact on electronic components and a method for manufacturing electronic components. [Brief explanation of the drawing]

[0009] [Figure 1] This is a front view showing an example configuration of an electronic component sorting device. [Figure 2] This is a schematic diagram of the conveying component. [Figure 3] This is a perspective view of the collection container. [Figure 4] (a) A plan perspective view and (b) A bottom perspective view of the cushioning member and support member. [Figure 5] Figure 3 is a VV cross-sectional view of the collection container. [Figure 6] Figure 5 is an enlarged view of section B of the collection container. [Modes for carrying out the invention]

[0010] Embodiments of this disclosure will be described below with reference to the drawings. The electronic component sorting device 1 (inspection and sorting device) shown in Figure 1 is a characteristic sorting machine that inspects the electrical characteristics of chip electronic components C (also simply called "electronic components") having electrodes on at least a part of their side or plane, and sorts them based on the inspection results. The chip electronic component C in this embodiment is a multilayer ceramic capacitor. The chip electronic component C has a rectangular parallelepiped shape with design dimensions such as length dimension L > width dimension W = thickness dimension T, or length dimension L > width dimension W > thickness dimension T. The chip electronic component C can be a so-called two-terminal capacitor, three-terminal capacitor, multi-terminal capacitor, or array capacitor, which has end-face electrodes, side electrodes, or both.

[0011] Figure 1 is a schematic front view of the electronic component sorting device 1. The electronic component sorting device 1 includes a supply unit 12 that supplies chip electronic components C to a disc-shaped transport member 2 (see Figure 2) that is rotatably supported on a base unit 111 provided on the device body 11; a transport unit 13 that transports the chip electronic components C supplied by the supply unit 12 using the transport member 2; an inspection unit 14 that inspects the electrical characteristics (insulation resistance, withstand voltage, capacitance, etc.) of the chip electronic components C transported by the transport member 2 in the transport unit 13; and a sorting and discharge unit 15 that sorts and discharges the chip electronic components C according to the inspection results from the inspection unit 14.

[0012] Figure 2 is a schematic diagram of the transport member 2. The transport member 2 temporarily houses and transports chip electronic components C. The transport member 2 has a plurality of housing holes 21 (also called chip electronic component housing and holding holes or through holes) on the circumference around the rotation axis P. The housing holes 21 are arranged in multiple rows around the rotation axis P. The transport member 2 in Figure 2 shows an example with 8 rows of housing holes 21a to 21h (enlarged view of part A), but the housing holes 21 may be configured with 6, 10, or 12 rows, or any other number of rows.

[0013] The housing hole 21 in this embodiment is a through hole. Depending on the shape of the chip electronic component C and the inspection method of the inspection unit 14, the housing hole 21 can be a rectangular hole, a round hole, or the like. Most of the opening on the base portion 111 side of the housing hole 21 is closed by the base portion 111, and when the transport member 2 is attached to the base portion 111, the housing hole 21 is configured to have a bottom. The housing hole 21 is sucked in through a vacuum groove formed in the base portion 111, so the chip electronic component C can be stably housed and transported.

[0014] The transport member 2 rotates intermittently around the rotation axis P by a rotary drive device 112 (see Figure 1) provided on the base portion 111 side. In the front view in Figure 1, the transport member 2 rotates clockwise around the rotation axis P. The electronic component sorting device 1 transports the chip electronic components C supplied to the transport member 2 by the supply unit 12 to the inspection unit 14 and then to the sorting and discharge unit 15 in that order.

[0015] The supply unit 12 includes a hopper unit 121, a feeder 122 for transporting the chip electronic components C supplied from the hopper unit 121, a chute 123 for supplying the chip electronic components C supplied from the feeder 122 to a bucket 124 via a transport path (not shown), and a bucket 124 for supplying the chip electronic components C supplied to the chute 123 to the receiving hole 21 of the transport member 2.

[0016] The hopper section 121 stores chip electronic components C before inspection and transports them to the feeder 122 (parts feeder). The hopper section 121 is a silo with an inverted triangular cross-section, where the inner diameter narrows from top to bottom.

[0017] The feeder 122 in this embodiment is a linear feeder that has a linearly recessed transport path on its upper side and supplies chip electronic components C to the chute 123 by vibrating the transport path.

[0018] The shooter 123 has a plurality of linear conveyance paths partitioned by partition walls inside. The shooter 123 of the present embodiment has eight columns of conveyance paths. These conveyance paths are arranged parallel to each other. The chip electronic component C supplied from the feeder 122 is selected and supplied to any of the conveyance paths in the shooter 123 by, for example, a sorting mechanism provided on the inlet side of the shooter 123.

[0019] The bucket 124 supplies the chip electronic component C supplied from the shooter 123 to the accommodation holes 21 of the conveyance member 2. The bucket 124 is arranged on the front side of the conveyance member 2. The bucket 124 has a plurality of conveyance paths partitioned for each column of the accommodation holes 21 (21a to 21h) of the conveyance member 2. Each conveyance path extends parallel to the arrangement direction (circumferential direction) around the rotation axis P of the accommodation hole 21. The chip electronic component C supplied from the shooter 123 into the conveyance path of the bucket 124 is accommodated one by one into the accommodation hole 21 by the negative pressure generated in the accommodation hole 21 via the base portion 111.

[0020] The inspection unit 14 has electrode terminals (contacts) for measuring electrical characteristics at positions close to the base portion 111 side and the opposite side of each accommodation hole 21 of the conveyance member 2. The electrode terminals are electrically connected to a measurement device 113 mounted on the electronic component sorting device 1. The electronic component sorting device 1 has a control device 114 that supplies a control signal regarding measurement processing to the measurement device 113.

[0021] The control device 114 controls the operations in each functional unit (supply unit 12, conveyance unit 13, inspection unit 14, classification and discharge unit 15, etc.) of the electronic component sorting device 1, and acquires and determines the detection values detected by various sensors. The control device 114 is, for example, a control unit such as a personal computer and is provided inside the electronic component sorting device 1. The control device 114 includes a control unit such as a CPU, a storage unit that stores data and programs, an input unit (for example, a touch panel, keyboard, switch, etc.), an output unit (for example, a display, indicator, sound emitting unit, etc.), a communication unit (a data communication unit by wire or wireless, etc.)

[0022] The sorting and discharge unit 15 has the function of discharging the chip electronic components C of the transport member 2 into the collection container 3 (also called a sorting box) according to the inspection results in the inspection unit 14. The sorting and discharge unit 15 has discharge paths 151 corresponding to each sorting item at different angular positions on the transport path around the rotation axis P. These discharge paths 151 are connected to the collection container 3 corresponding to the sorting item.

[0023] The discharge passage 151 is a cylindrical member made of resin or metal. The sorting and discharge section 15 has an exhaust port on the base section 111 side. When the chip electronic component C is located in the discharge passage 151 connected to the collection container 3 to be discharged, the sorting and discharge section 15 can switch the compressed air at the exhaust port of the base section 111 to ON, thereby sorting and collecting the chip electronic component C into the collection container 3 corresponding to the inspection result.

[0024] Figure 3 is a perspective view of the collection container 3. The collection container 3 is a container for collecting sorted chip electronic components C. The collection container 3 comprises a box-shaped storage section 31 and a U-shaped arched handle section 32 provided on the side of the storage section 31. The storage section 31 has an opening 311 at the top and is formed as a roughly rectangular parallelepiped overall. The handle section 32 is provided on the short side in a plan view of the storage section 31. As shown in Figure 1, the collection container 3 is formed so that the handle section 32 is positioned towards the front and can be inserted into and removed from the long direction D1 of the opening 311.

[0025] The storage compartment 31 includes a cushioning member 34 fixed to the inner wall portion 312 of the internal storage space by a support member 33. Figure 4(a) is a plan perspective view of the cushioning member 34 and the support member 33, and Figure 4(b) is a bottom perspective view of the cushioning member 34 and the support member 33.

[0026] The support member 33 is formed in a roughly rectangular prism shape with a right-angled trapezoidal cross-section. The support member 33 is fixed by contacting the inner wall portion 312 of the storage portion 31 with a fixing surface 331 corresponding to the lower base of the right-angled trapezoid. The support member 33 and the inner wall portion 312 are connected and fixed by an appropriate method such as fastening with a screw member (not shown) or adhesive.

[0027] The cushioning member 34 is formed from a flexible sheet member (or flat plate-shaped member) that has flexibility. For example, a resin film can be used for the cushioning member 34. However, other materials with high shock absorption properties, such as rubber sheets or cloth, may also be used for the cushioning member 34. The cushioning member 34 is formed in a substantially rectangular parallelepiped shape.

[0028] The base 341 of the cushioning member 34 is fixed to the inclined surface 332 of the support member 33 by adhesive or the like (see also the enlarged view of part B in Figures 5 and 6). Thus, the base 341 of the cushioning member 34 is connected to the inner wall portion 312, which is arranged along the longitudinal direction D1 of the storage portion 31, via the support member 33. Supported by the support member 33, the cushioning member 34 is cantilevered to the inner wall portion 312 of the storage portion 31 in a downward-inclined state, such that the tip portion 342 is located below the base portion 341.

[0029] When the collection container 3 is mounted on the electronic component sorting device 1 (see Figure 1), the discharge port 151a of the discharge passage 151 is positioned above the opening 311 (shown by a dashed line in Figure 5). In this embodiment, the electronic component sorting device 1 can process chip electronic components C in parallel in multiple rows, so multiple discharge passages 151 are provided, each corresponding to one of the multiple storage holes 21 in the same row. Furthermore, the discharge passage 151 in Figure 5 discharges chip electronic components C that have been determined to be good (acceptable) as a result of inspection by the electronic component sorting device 1. Therefore, the collection container 3 in Figure 5 is supplied with chip electronic components C that have been determined to be good.

[0030] The collection container 3 from which defective chip electronic components C are discharged may be configured without a support member 33 and a cushioning member 34.

[0031] The cushioning member 34 has a receiving surface 34a on its upper surface that absorbs the impact of the chip electronic component C. The receiving surface 34a is positioned on the track R1 of the chip electronic component C supplied from the discharge passage 151 through the opening 311.

[0032] Furthermore, since the electronic component sorting device 1 of this embodiment is a multi-row transport type, two or more discharge paths 151 are provided corresponding to the number of rows of chip electronic components C that are processed in parallel. Since the electronic component sorting device 1 of this embodiment processes in parallel with 8 rows, chip electronic components C are supplied to one collection container 3 by 8 discharge paths 151. The receiving surface 34a of the buffer member 34 is arranged to include the trajectory R1 of each of the multiple discharge paths 151 arranged in the depth direction in Figure 5.

[0033] Next, a method for manufacturing chip electronic components C using the electronic component sorting apparatus 1 of this embodiment will be described. The processing in each step of supplying chip electronic components C, transporting by the transport member 2, inspection section 14, and sorting / discharging section 15 is as described above and will be omitted from this explanation.

[0034] As shown in Figure 5, the chip electronic component C supplied from the discharge passage 151 of the electronic component sorting device 1 through the opening 311 hits the receiving surface 34a of the buffer member 34 (see trajectory R1 in Figure 5). As a result, the impact of the chip electronic component C is absorbed by the receiving surface 34a, reducing its falling speed and suppressing rebound. After hitting the receiving surface 34a, the chip electronic component C then falls along a trajectory R2 along the inclined surface of the buffer member 34 and is stored in the storage section 31.

[0035] Once the processing of the chip electronic components C supplied to the hopper section 121 is complete, the sorting process of the chip electronic components C using the electronic component sorting device 1 is finished. The operator can then remove the collection container 3 from the electronic component sorting device 1 by pulling out the handle section 32 and collect the chip electronic components C that have been collected according to their classification categories.

[0036] In this embodiment, the recovery container 3 of the electronic component sorting device 1 is described as comprising a box-shaped storage section 31 having an opening 311 at the top, and a buffer member 34 that is cantilevered to the inner wall 312 of the storage section 31 in a downward-sloping position and has a receiving surface 34a on the track R1 of the chip electronic components C supplied from the discharge passage 151 of the electronic component sorting device 1 through the opening 311.

[0037] After the impact of the chip electronic component C is absorbed by the receiving surface 34a of the cushioning member 34, it falls into the storage section 31 along the inclined surface of the receiving surface 34a. Therefore, the chip electronic component C, which is accelerated by the drop in the discharge passage 151, decelerates before being stored in the storage section 31. Accordingly, the recovery container 3 of this embodiment can mitigate the impact on the chip electronic component C even if it collides with other chip electronic components C or the inner wall surface of the storage section 31.

[0038] Furthermore, the recovery container 3 can decelerate the chip electronic component C by having it collide with the tip 342 (free end side) opposite to the support side of the buffer member 34. In this way, not only is the impact on the chip electronic component C mitigated, but the load on the chip electronic component C can be greatly reduced by controlling it so that it falls along a trajectory R2 after being efficiently decelerated within the recovery container 3. Moreover, since the rebound of the chip electronic component C can be reduced and the falling trajectory R2 (behavior) can be made nearly constant, collisions between the rebounded chip electronic component C and chip electronic component C supplied later from the discharge path 151, as well as collisions with the inner wall 312 of the recovery container 3, can be suppressed. When the recovery container 3 is used to recover chip electronic component C that has been judged as good, it is possible to prevent the occurrence of physical defects such as cracks, chips, and scratches on the chip electronic component C due to discharge into the recovery container 3, even if it has been judged as good.

[0039] Furthermore, the recovery container 3 of this embodiment is expected to have a more significant effect in reducing impact in relatively high-capacitance, large chips of multilayer ceramic capacitors. In recent years, there has been a growing demand for product reliability in multilayer ceramic capacitors with higher capacitance. In particular, as the number of products prioritizing electrical performance over physical strength increases, there is a need for manufacturing methods that mitigate the impact on the chip electronic component C. The recovery container 3 of this embodiment can solve these problems.

[0040] Other configurations for shock mitigation methods when recovering large electronic components using a recovery container include, for example, Comparative Example 1 or Comparative Example 2 below.

[0041] Comparative Example 1 is a device that, similar to this embodiment, places some kind of buffering material on the trajectory of the chip electronic component C, and absorbs the falling energy by making contact with it once, thereby mitigating the impact when it falls into the collection container or comes into contact with a chip electronic component C already inside the collection container. A cylindrical resin member can be used as the buffering material placed on the trajectory of the chip electronic component C.

[0042] Because chip electronic components C are small in absolute terms and have low mass (even large chips are small in absolute terms), using soft rubber cushions or urethane results in excessive rebound, causing the chip electronic components C to bounce back significantly and increasing the impact when they collide with each other or with the inner wall of the container. On the other hand, using a cushioning material that is too soft can mitigate excessive collisions, but the chip electronic components C do not fall immediately after contacting the cushioning material and remain on it for a longer time. Therefore, when conventional recovery containers are used in high-speed electronic component sorting devices 1 used in recent years, it is anticipated that collisions with chip electronic components C supplied later will be more likely.

[0043] Compared to Application Example 1, the recovery container 3 of this embodiment can control the trajectory of the falling chip electronic component C by arranging the cushioning member 34 at an angle, and the chance of collision can be reduced by quickly moving the chip electronic component C discharged into the recovery container 3 to the bottom of the storage section 31.

[0044] Another comparative example is a configuration in which the bottom plate of the collection container is movable up and down. Generally, the volume of the collection container is increased in order to increase the manufacturing lot size (the number of items processed in one operation). For this reason, the depth of the collection container is sometimes set to be deep. On the other hand, if the collection container is made deeper, the distance the chip electronic component C falls will increase, and it is expected that the impact on the chip electronic component C will increase.

[0045] Comparative Example 2 has a structure in which the bottom plate of the collection container is movable up and down. Initially, when the number of stored chip electronic components C is small, the bottom plate is moved upward to shorten the distance they fall into the collection container, and as the number of stored chip electronic components C increases, the bottom plate is gradually lowered.

[0046] However, while this configuration can reduce the falling speed of the chip electronic components C, the chip electronic components C already stored in the collection container will collide with other chip electronic components C falling at high speed. Furthermore, the structure of the collection container itself becomes complex. Compared to Comparative Example 2, the collection container 3 of this embodiment has a simpler structure that can decelerate the chip electronic components C and reduce the chances of collision with other chip electronic components C or the inner wall 312 of the storage section 31.

[0047] Furthermore, in this embodiment, a configuration was described in which the cushioning member 34 is formed from a flexible sheet member. Therefore, the cushioning member 34 flexes upon impact with the chip electronic component C, and can absorb the impact with a simple configuration.

[0048] As an example, in this embodiment, a resin film, which is a sheet member supporting one side, was used as the buffer member 34. For example, the Young's modulus of a buffer member 34 (resin film) suitable for the chip electronic component C used in the experiment is 1500 to 3500 MPa. By using a sheet-like member with such a predetermined Young's modulus, the rebound when the chip electronic component C collides can be suppressed and kinetic energy can be effectively absorbed. Therefore, the buffer member 34 can decelerate the chip electronic component C in a short time and then control it to fall a short distance on a stable trajectory R2.

[0049] Furthermore, even when applied to an electronic component sorting device 1 capable of multi-row processing, a recovery container 3 with two or more discharge passages 151 and a receiving surface 34a of the buffer member 34 arranged to include the trajectory R1 of each discharge passage 151 can mitigate the impact on chip electronic components C with a simple structure using only one buffer member 34. The buffer member 34 in this embodiment is formed as a single flat plate without making a cut on the tip end 342 side. Therefore, when recovering chip electronic components C from the recovery container 3, the amount of residual chip electronic components C can be reduced. In addition, the buffer member 34 can be constructed with a simple and low-cost configuration.

[0050] Furthermore, the storage section 31 is formed in a rectangular parallelepiped shape, and the base 341 of the buffer member 34 is connected to the inner wall section 312 which is arranged along the longitudinal direction D1 of the storage section 31. The recovery container 3 can have many discharge passages 151 arranged along the longitudinal direction D1, so it can handle cases where the number of rows in multi-row processing is greater than the number of rows in this embodiment. In addition, the recovery container 3 can be formed with a narrow width in the short direction D2 of the storage section 31, so many can be mounted on the electronic component sorting device 1. As a result, chip electronic components C can be finely sorted and recovered according to the inspection results for each classification item, and lot analysis or product sorting (for example, ranking good products within a manufacturing lot and classifying them into multiple shipment items) can be easily performed.

[0051] Furthermore, the method for manufacturing electronic components using the electronic component sorting device 1 was described in which the electronic components supplied from the discharge passage 151 of the electronic component sorting device 1 through the opening 311 are brought into contact with the receiving surface 34a of the cushioning member 34 to absorb the impact and reduce the falling speed, and then stored in the storage section 31.

[0052] As described above, the chip electronic component C absorbs the impact of the receiving surface 34a of the cushioning member 34 and then falls into the storage section 31 along the slope of the receiving surface 34a. Therefore, the electronic component, which has been accelerated by the drop in the discharge passage 151, decelerates before being stored in the storage section 31. Thus, the manufacturing method of electronic components in this embodiment can mitigate the impact on the electronic component even if it collides with other electronic components or the inner wall 312 inside the storage section 31. Such a shock-mitigating recovery container 3 is effective when handling large electronic components with relatively large mass. Therefore, the reliability of the electronic component can be improved.

[0053] This concludes the description of the embodiments of the present disclosure, but the embodiments of the present disclosure are not limited to these embodiments. For example, in this embodiment, the collection container 3 of the electronic component sorting device 1 for inspecting and sorting multilayer ceramic capacitors has been described, but the electronic component sorting device 1 may be a device for inspecting and sorting other electronic components. The electronic component sorting device may not be limited to measuring electrical characteristics as an inspection device, but may also be a visual inspection device that inspects and sorts electronic components for cracks, chips, or one or more dimensions. Furthermore, the electronic components are not limited to surface mount device (SMD) chip electronic components such as multilayer ceramic capacitors (chip capacitors), chip inductors, and chip resistors, but may also include other types of electronic components, including DIP (Dual In-line Package) electronic components.

[0054] Furthermore, in this embodiment, a recovery container 3 has been described in which two or more discharge passages 152 are provided and the buffer member 34 is arranged such that its receiving surface 34a includes the trajectory R1 of each discharge passage 152. However, the electronic component sorting device 1 may be a device that sorts electronic components using a single-row transport method. In this case, one recovery container 3 corresponds to one discharge passage 151. The receiving surface 34a of the buffer member 34 may be configured such that the trajectory R1 of the chip electronic component C discharged from one discharge passage 152 is located approximately in the center of the longitudinal direction of the receiving surface 34a.

[0055] The structure of this disclosure is illustrated as follows: [1] A collection container for an electronic component sorting device, The aforementioned collection container is A box-shaped storage compartment with an opening at the top, A cushioning member is cantilevered to the inner wall of the storage section in a downward-sloping position and has a receiving surface on the track of electronic components supplied from the discharge passage of the electronic component sorting device through the opening, A collection container equipped with the following features. [2] The recovery container according to [1], wherein the cushioning member is formed of a flexible sheet member. [3] The aforementioned discharge passages are provided in two or more locations. The cushioning member is arranged such that the receiving surface includes the track of each of the discharge passages. The collection container described in [1] or [2]. [4] The storage compartment is formed in the shape of a rectangular parallelepiped, The base of the cushioning member is connected to the inner wall portion arranged along the longitudinal direction of the storage section. The collection container described in [1] or [2]. [5] A method for manufacturing electronic components using an electronic component sorting device, The electronic component sorting apparatus includes a collection container for collecting the sorted electronic components. The aforementioned collection container is A box-shaped storage compartment with an opening at the top, It has a cushioning member that is cantilevered to the inner wall of the storage compartment in a downward-sloping position, The electronic components supplied from the discharge path of the electronic component sorting device through the opening are brought into contact with the receiving surface of the cushioning member, thereby absorbing the impact and reducing the rate of fall, and then stored in the storage section. Manufacturing methods for electronic components. [Explanation of Symbols]

[0056] 1. Electronic component sorting device 2. Conveying Member 3. Collection container 11. Main unit of the device 12 Supply section 13 Conveying section 14. Inspection Department 15 Classification discharge section 21 (21a~21h) Intake holes 31 Storage compartment 32 Handle section 33 Support Member 34. Cushioning material 34a Receiving surface 111 Base section 112 Rotary drive device 113 Measuring device 114 Control device 121 Hopper section 122 feeders 123 Shooter 124 buckets 151 Exhaust channel 151a Outlet 311 Opening 312 Inner wall section 331 Fixed surface 332 Slope 341 Base 342 Tip C-chip electronic component D1 Long direction D2 Short direction P Rotation axis R1,R2 orbit

Claims

1. A collection container for an electronic component sorting device, The aforementioned collection container is A box-shaped storage compartment with an opening at the top, A cushioning member is cantilevered to the inner wall of the storage section in a downward-sloping position and has a receiving surface on the track of electronic components supplied from the discharge passage of the electronic component sorting device through the opening, A collection container equipped with the following features.

2. The recovery container according to claim 1, wherein the cushioning member is formed of a flexible sheet member.

3. The aforementioned discharge passages are provided in two or more locations. The cushioning member is arranged such that the receiving surface includes the track of each of the discharge passages. A collection container according to claim 1 or claim 2.

4. The storage compartment is formed in the shape of a rectangular parallelepiped, The base of the cushioning member is connected to the inner wall portion arranged along the longitudinal direction of the storage section. A collection container according to claim 1 or claim 2.

5. A method for manufacturing electronic components using an electronic component sorting device, The electronic component sorting apparatus includes a collection container for collecting the sorted electronic components. The aforementioned collection container is A box-shaped storage compartment with an opening at the top, It has a cushioning member that is cantilevered to the inner wall of the storage compartment in a downward-sloping position, The electronic components supplied from the discharge path of the electronic component sorting device through the opening are brought into contact with the receiving surface of the cushioning member, thereby absorbing the impact and reducing the rate of fall, and then stored in the storage section. Manufacturing methods for electronic components.

Images