Mounting device and mounting method

Abstract

The present invention provides a mounting apparatus and mounting method that can reduce mounting defects when mounting electronic components onto a mounting target. [Solution] The mounting apparatus 1 of the embodiment includes a mounting device 30 that mounts an electronic component 2 onto a substrate W to be mounted using a mounting tool 31 that holds the electronic component 2 in close contact with a holding surface 311; a detection device 40 that detects interference fringes based on light irradiated by the holding surface 311 toward the electronic component 2 held by the holding surface 311; a contact state determination unit 72 that determines whether the contact state of the electronic component 2 with the holding surface 311 is suitable for mounting to the mounting target based on the interference fringes detected by the detection device 40; and a mounting control unit 73 that, if the contact state determination unit 72 determines that mounting is possible, causes the mounting tool 31 to mount the electronic component 2 onto the mounting target.

Description

Technical Field

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[0001] The present invention relates to a mounting device and a mounting method.

Background Art

[0002] When mounting chip-shaped electronic components, such as semiconductor elements like logic, memory, and image sensors, onto a substrate, the electronic components are picked up one by one and transferred to the substrate for mounting.

[0003] The electronic components are mounted by pressing the electronic components against the substrate using a mounting tool that holds the electronic components on a holding surface. When pressing, it is preferable that no void remains between the electronic component and the substrate.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, when the mounting tool holds the electronic component, if misalignment or deformation occurs, the adhesion state of the electronic component to the holding surface of the mounting tool may become non-uniform within the holding surface. When mounting the electronic component on the substrate in such a state, connection failures and mounting failures due to insufficient strength may occur due to the voids remaining between the mounting surface and the substrate.

[0006] An embodiment of the present invention aims to provide a mounting device and a mounting method capable of reducing mounting failures when mounting an electronic component on a mounting target.

Means for Solving the Problems

[0007] An embodiment of the present invention includes a mounting device that mounts an electronic component onto a mounting target using a mounting tool that holds the electronic component in close contact with a holding surface; a detection device that detects interference fringes based on light irradiated by the holding surface toward the electronic component held by the holding surface; a contact state determination unit that determines whether the contact state of the electronic component with the holding surface allows it to be mounted onto the mounting target based on the interference fringes detected by the detection device; and a mounting control unit that, when the contact state determination unit determines that it is possible to mount the electronic component, causes the mounting tool to mount the electronic component onto the mounting target.

[0008] Furthermore, an embodiment of the present invention of a mounting method includes: a holding step in which a mounting tool of a mounting device for mounting electronic components onto a mounting target holds an electronic component in close contact with a holding surface; a detection step in which a detection device detects interference fringes based on light irradiated toward the mounting surface of the electronic component held on the holding surface of the mounting tool; a contact state determination step in which a contact state determination unit determines, based on the interference fringes detected by the detection device, whether or not the contact state of the electronic component with respect to the holding surface makes it possible to mount it onto the mounting target; and a mounting step in which, if the contact state determination unit determines that it is possible to mount the electronic component, the mounting control unit causes the mounting tool to mount the electronic component onto the mounting target. [Effects of the Invention]

[0009] According to embodiments of the present invention, mounting defects when mounting electronic components onto a mounting target can be reduced. [Brief explanation of the drawing]

[0010] [Figure 1] This is a front view showing the implementation device of the embodiment. [Figure 2] This is a plan view showing the implementation device of the embodiment. [Figure 3] This is a cross-sectional view showing the retaining member of the embodiment. [Figure 4] This is a cross-sectional view showing an implementation tool of an embodiment. [Figure 5]Figure 1 is a front view showing the transfer of electronic components from the transfer device to the mounting device in the mounting apparatus. [Figure 6] Figure 1 is a front view showing the detection of interference fringes by a detection device in the mounting apparatus. [Figure 7] This is a schematic diagram of interference fringes detected by a detection device when the mounting tool has a V-shaped holding surface, with (A) showing the case where the adhesion is good and (B) showing the case where the adhesion is poor. [Figure 8] This is a functional block diagram of the control device of the embodiment. [Figure 9] This is a flowchart showing the procedure for mounting the electronic components of the embodiment. [Figure 10] This is a front view showing a modified example having a mounting platform for the mounting device of the embodiment. [Figure 11] This is a plan view of a modified example of Figure 10. [Figure 12] This is a schematic diagram of interference fringes detected by a detection device in the case of a mounting tool with a flat holding surface, where (A) shows the case of poor adhesion and (B) shows other cases of poor adhesion. [Modes for carrying out the invention]

[0011] The implementation device of the embodiment will be described with reference to the drawings. Note that the drawings are schematic diagrams, and the sizes and proportions of each part may be exaggerated for ease of understanding.

[0012] As shown in Figures 1 and 2, the mounting apparatus 1 includes a supply device 10, a transfer device 20, a mounting device 30, a detection device 40, an imaging device 50, a storage device 60, and a control device 70. The mounting apparatus 1 transfers the electronic components 2 from the supply device 10 to the mounting device 30 via the transfer device 20, and the mounting device 30 mounts them onto the substrate W on the substrate stage 80. The electronic components 2 are, for example, chip-shaped components. In this embodiment, the electronic components 2 are semiconductor chips obtained by dividing a wafer into individual pieces. The substrate W to be mounted is a circuit board.

[0013] [Feeding device] The supply device 10 is a device that supplies electronic components 2. The supply device 10 of the present embodiment supplies the electronic components 2 to the transfer device 20. The supply device 10 moves the electronic components 2 to be picked up to the supply position P1. The supply position P1 is the position where the transfer device 20 picks up the electronic components 2 to be picked up. The supply device 10 includes a supply stage 12 that supports the sheet 11 to which the electronic components 2 are attached, and a stage moving mechanism 13 that moves the supply stage 12. As the stage moving mechanism 13, for example, a linear guide in which a slider moves on a rail by a ball screw mechanism driven by a servo motor can be used.

[0014] The sheet 11 to which the electronic components 2 are attached is, here, an adhesive wafer sheet attached to a wafer ring (not shown). The electronic components 2 are arranged in a matrix (matrix) on the sheet 11. In the present embodiment, the electronic components 2 are arranged in a face-up state with the functional surface exposed upward. The functional surface is the mounting surface that is mounted in contact with the substrate W.

[0015] The supply stage 12 is a table that horizontally supports the wafer ring to which the sheet 11 is attached. That is, the sheet 11 to which the electronic components 2 are attached is supported via the wafer ring. The supply stage 12 is provided so as to be movable in the horizontal direction by the stage moving mechanism 13. Since the sheet 11 is horizontally supported together with the supply stage 12, the sheet 11 and the electronic components 2 placed on the sheet 11 are also provided so as to be movable in the horizontal direction.

[0016] Note that, among the horizontal directions, the direction in which the supply device 10 and the mounting device 30 are arranged is called the X-axis direction, and the direction orthogonal to the X-axis is called the Y-axis direction. Also, the direction orthogonal to the plane of the sheet 11 is called the Z-axis direction or the vertical direction. The upward direction is the direction on the side where the electronic components 2 are placed with the plane of the sheet 11 as a boundary, and the downward direction is the direction on the side where the electronic components 2 are not placed with the plane of the sheet 11 as a boundary.

[0017] [Transfer device] The transfer device 20 is a device that transfers the electronic components 2 from the supply device 10 to the mounting device 30 and hands them over to the mounting tool 31 of the mounting device 30. In this embodiment, the transfer device 20 picks up the electronic components 2 from the sheet 11 of the supply device 10, transfers the picked-up electronic components 2 to the mounting device 30, and hands them over to the mounting tool 31. This transfer device 20 includes a holding member 21, a moving mechanism 22, and a direction changing unit 23.

[0018] (Retaining member) The holding member 21 holds the electronic component 2 and releases the holding state to detach the electronic component 2. In this embodiment, the holding member 21 holds the electronic component 2 in a non-contact manner with respect to the mounting surface of the electronic component 2 and the surface opposite to it. As shown in Figure 3, the holding member 21 has a porous member 211 and a base 212.

[0019] The porous member 211 is a permeable member that supplies gas supplied to its interior through pores on the opposing surface 211a facing the electronic component 2. Sintered metal, ceramic, resin, etc., can be used as the porous member 211. When gas (indicated by the black arrows in the figure) is supplied to the interior of the porous member 211 from the back side opposite to the opposing surface 211a, the gas G is ejected from the dense and uniformly distributed pores on the opposing surface 211a. This ejection is a substantially planar ejection that spreads across the entire surface of the opposing surface 211a from which it was ejected.

[0020] Furthermore, the porous member 211 is provided with a suction hole 211b, which is a through-hole that attracts the electronic component 2 by negative pressure. The end of the suction hole 211b is an opening in the center of the opposing surface 211a. As described above, by ejecting gas G from the opposing surface 211a and attracting the mounting surface of the electronic component 2 by the negative pressure acting on the suction hole 211b, the electronic component 2 is held in a non-contact manner with the opposing surface 211a by interposing a gas layer of gas G.

[0021] With this holding member 21, the electronic component 2 can be picked up without contact with the mounting surface of the electronic component 2 in the face-up state. Note that "non-contact" means that there is no contact with the mounting surface of the electronic component 2 and the surface opposite to it, and the guide portion 212c, which will be described later, may be in contact with the side surface of the electronic component 2.

[0022] The base 212 is a member that covers the surfaces of the porous member 211 other than the opposing surface 211a. In this embodiment, the base 212 is a rectangular box with an opening at the bottom. The porous member 211 is inserted through the opening of the base 212 so that its bottom surface is exposed as the opposing surface 211a, and is assembled and fixed inside the base 212.

[0023] The top surface of the base 212 is provided with an air intake hole 212a and an exhaust hole 212b. The air intake hole 212a is a through-hole for supplying air to the porous member 211. The exhaust hole 212b is a through-hole for generating negative pressure at the opening via the suction hole 211b. The exhaust hole 212b extends downward and is continuous with the suction hole 211b of the porous member 211.

[0024] The air intake port 212a is connected to a gas supply circuit via piping (not shown). The supply circuit includes a gas source, pump, valve, etc. Here, the gas supplied to the porous member 211 through the air intake port 212a is an inert gas. The exhaust port 212b is in communication with a negative pressure generation circuit including a vacuum pump, valve, etc. via piping (not shown).

[0025] Furthermore, guide portions 212c are provided on the sides of the base 212, along the outer edge of the opposing surface 211a, to restrict the movement of the electronic component 2. The guide portions 212c are rectangular plate-like bodies provided on the four sides of the base 212, and each has a protruding portion that extends downward from the opposing surface 211a.

[0026] (Movement mechanism) The moving mechanism 22 is a mechanism that reciprocates the holding member 21 between the supply position P1 and the transfer position P2 shown in Figure 1, and also raises and lowers the holding member 21 at the supply position P1 and the transfer position P2. Specifically, the moving mechanism 22 includes a sliding mechanism 221 and a lifting mechanism 222, as shown in Figure 2. The transfer position P2 is the position where the transfer device 20 transfers the electronic component 2 picked up at the supply position P1 to the mounting tool 31, which functions as a receiving unit described later.

[0027] The supply position P1 and the handover position P2 primarily refer to positions in the XY direction, and do not necessarily refer to positions in the Z-axis direction.

[0028] The slide mechanism 221 reciprocates the holding member 21 between a supply position P1 and a transfer position P2. The slide mechanism 221 has a rail 221b that extends parallel to the X-axis direction and is fixed to the support frame 221a, and a slider 221c that travels on the rail 221b. The slider 221c is driven by a known drive mechanism. The lifting mechanism 222 moves the holding member 21 in the vertical direction. Specifically, the lifting mechanism 222 causes the holding member 21 to move up and down along the Z-axis direction, driven by a known drive mechanism.

[0029] (Direction change section) The direction changing unit 23 is provided between the holding member 21 and the moving mechanism 22. The direction changing unit 23 is an actuator that includes a drive source such as a motor and a rotation guide such as a ball bearing for changing the orientation of the holding member 21. Changing the orientation means rotating it vertically from 0° to 180°. For example, the holding member 21 with the opposing surface 211a facing downwards, that is, with the opposing surface 211a facing the supply stage 12, holds the electronic component 2 at the supply position P1. At this time, the rotation angle is 0°. Subsequently, the direction changing unit 23 changes the orientation of the holding member 21 so that the opposing surface 211a faces upwards. At this time, the rotation angle is 180°. As a result, the holding member 21 that has picked up the electronic component 2, which is positioned in a face-up state with its functional surface facing upwards, can flip the electronic component 2 so that its functional surface faces downwards (face-down) and hand it over to the mounting device 30.

[0030] [Onboard equipment] The mounting device 30 is a device that mounts electronic components 2 onto a substrate W using a mounting tool 31. In this embodiment, the mounting device 30 receives the electronic components 2 from the transfer device 20 at the transfer position P2, transports them to the mounting position P3, and mounts them onto the substrate W. The mounting position P3 is the position where the electronic components 2 are mounted on the substrate W. The mounting device 30 includes a mounting tool 31 and a tool movement mechanism 32. (See Figure 1)

[0031] (Implementation tool) The mounting tool 31 holds the electronic component 2 in close contact with the holding surface 311. In this embodiment, the mounting tool 31 functions as a receiving unit that receives the electronic component 2 from the holding member 21 at the transfer position P2 (see Figure 5), and is a component that mounts the electronic component 2 onto the substrate W at the mounting position P3. The mounting tool 31 holds the electronic component 2, and after mounting, it releases the holding state to detach the electronic component 2.

[0032] Specifically, as shown in Figures 4(A) and (B), the mounting tool 31 of this embodiment is a block with a roughly rectangular cross-section and has a holding surface 311, an opening 312, and ventilation holes 313. The holding surface 311 is the bottom surface of the mounting tool 31 and is a raised surface that allows the electronic component 2 to contact it in a curved manner. Curving means bending without creating corners, and includes so-called bending, such as when a curved surface is created between flat surfaces as shown in Figure 4(A). The holding surface 311 of this embodiment is V-shaped. Here, V-shaped refers to a shape in which two flat surfaces with different angles are gently continuous at the ridge portion that includes the highest point in the center. Note that Figure 4(A) exaggerates the shape of the V-shape for ease of understanding. The actual deformation (curving, bending) of the electronic component 2 is only a small amount, not enough to damage an electronic component 2 with a thickness of about 200 μm.

[0033] As shown in Figure 4(B), multiple openings 312 are provided on the holding surface 311. The multiple openings 312 are arranged in multiple rows (shown by dashed lines in the figure). Each row of openings 312 is parallel to the most raised peak of the holding surface 311. Multiple ventilation holes 313 are provided, and as shown in Figure 4(A), one end of each ventilation hole 313 communicates with its respective opening 312. The multiple ventilation holes 313 attract and hold the electronic component 2 in a curved state that conforms to the holding surface 311 by creating negative pressure inside the holes. In other words, by sequentially creating negative pressure in the ventilation holes 313 adjacent to the most raised peak of the holding surface 311, in a direction intersecting the peak and moving away from the peak, the electronic component 2 is attracted to the holding surface 311. In this embodiment, negative pressure is applied sequentially from the central ventilation hole 313 of the electronic component 2 to the adjacent ventilation holes 313 (from the central row to the adjacent row). By applying negative pressure sequentially from the center (sequentially applying negative pressure to each row), the flat electronic component 2 is attracted and held so that it gradually conforms to the holding surface 311 from the ridge outwards.

[0034] Furthermore, the electronic component 2 is detached from the holding surface 311 by sequentially applying positive pressure to the vent holes 313 adjacent to the vent hole 313 in a direction that intersects the vent hole and moves away from the vent hole, starting from the vent hole 313 closest to the most raised peak of the holding surface 311. In this embodiment, positive pressure is applied sequentially from the row of vent holes 313 on the central side of the electronic component 2 to the adjacent row of vent holes 313. By applying positive pressure sequentially row by row from the center in this way, the curved electronic component 2 gradually detaches from the vent hole outward, following the flat surface of the substrate W, and air bubbles are expelled to the outside as it is mounted on the substrate W.

[0035] The other end of each vent hole 313 is connected to an air pressure circuit (not shown) that switches between negative and positive pressure. In this embodiment, each row of vent holes 313 is connected to a pipe and a valve so that negative and positive pressure can be switched for each row. Such a valve functions as a switching unit that switches between negative and positive pressure for the vent holes 313.

[0036] (Tool movement mechanism) The tool movement mechanism 32 moves the mounting tool 31 back and forth between the handover position P2 and the mounting position P3, and raises and lowers it at both the handover position P2 and the mounting position P3. As shown in Figures 1 and 2, the tool movement mechanism 32 has a sliding mechanism 321 and a lifting mechanism 322.

[0037] The slide mechanism 321 moves the mounting tool 31 back and forth between the handover position P2 and the mounting position P3. Here, the slide mechanism 321 has two rails 321b that extend parallel to the X-axis direction and are fixed to the support frame 321a, and a slider 321c that runs on the rails 321b. The slider 321c is driven by a known drive mechanism. Although not shown in the figures, the slide mechanism 321 also has a slide mechanism that slides the mounting tool 31 in the Y-axis direction.

[0038] The lifting mechanism 322 moves the mounting tool 31 vertically by driving an arm to which the mounting tool 31 is detachably attached. Specifically, the lifting mechanism 322 moves the mounting tool 31 up and down along the Z-axis direction by driving a known drive mechanism.

[0039] Although not shown in the diagram, the tool movement mechanism 32 has a positioning mechanism that allows for the positioning of the electronic component 2 in the θ direction by rotating the mounting tool 31 around the Z axis.

[0040] The substrate stage 80 is a stand that supports the substrate W for mounting electronic components 2. The substrate stage 80 is provided on the stage moving mechanism 81. The stage moving mechanism 81 is a moving mechanism that slides the substrate stage 80 on the XY plane to position the mounting position P3 on the substrate W where the electronic components 2 will be mounted.

[0041] [Detection device] As shown in Figure 6, the detection device 40 detects interference fringes based on light irradiated toward the electronic component 2 held by the holding surface 311 of the mounting tool 31. The detection device 40 in this embodiment is an interferometer. An interferometer splits light irradiated from a light source, the split light is irradiated toward the object to be measured, and interference fringes are obtained by refocusing the reflected light. The detection device 40 is installed at a position where the optical axis coincides with the transfer position P2 and faces the electronic component 2 held by the mounting tool 31 when it reaches the transfer position P2. As a result, the detection device 40 in this embodiment can detect interference fringes based on light irradiated toward the mounting surface.

[0042] Based on the interference fringes detected by the detection device 40, the degree of contact between the electronic component 2 and the holding surface 311 of the mounting tool 31 can be determined. For example, in the case of an electronic component 2 held by the mounting tool 31 shown in Figure 4(A), if the shape of the interference fringes is symmetrical in the XY direction, as shown in Figure 7(A), the contact state is good. On the other hand, if the shape of the interference fringes is not symmetrical in the XY direction, as shown in Figure 7(B), the contact state is poor.

[0043] [Imaging device] The imaging device 50 captures images of the electronic component 2 held on the holding surface 311 and the mounting area of ​​the substrate W, after the mounting tool 31 has been received from the transfer device 20. The imaging device 50 can use, for example, a two-field camera consisting of a semiconductor image sensor. In this embodiment, the imaging device 50 is provided to be movable between an imaging position where it can advance below the mounting tool 31 positioned at the mounting position P3 and capture images of the electronic component 2 held on the holding surface 311 and the mounting area of ​​the substrate W, and a retracted position where it is moved away from below the mounting tool 31.

[0044] Based on the alignment marks of the electronic component 2 and the mounting area of ​​the substrate W in the image captured by the imaging device 50, the orientation of the electronic component 2 and the mounting area can be detected. In other words, the mounting tool 31 and the mounting area of ​​the substrate W are positioned at the mounting position P3, the imaging device 50 enters between them, and simultaneously captures the alignment marks of the electronic component 2 and the substrate W. The control device 70, described later, calculates the orientation of the electronic component 2 and the substrate W from the captured image and controls the mounting tool 31 and the substrate stage 80 to position them so that they match.

[0045] [Housing device] The storage device 60 houses the electronic components 2 that have been detached from the mounting tool 31. The storage device 60 is, for example, a container with an open top and is located near the transfer position P2. Electronic components 2 that have been received by the mounting tool 31 but have been detached from the mounting tool 31 because they are not to be mounted fall into the storage device 60 and are stored there.

[0046] [Control device] The control device 70 is a device that controls the mounting device 1, and controls the start, stop, speed, and operating timing of the supply device 10, transfer device 20, mounting device 30, and substrate stage 80. The control device 70 can be implemented, for example, by a dedicated electronic circuit or a computer that operates with a predetermined program. The control device 70 is connected to an input device for the operator to input instructions and information necessary for control, and an output device for checking the status of the device.

[0047] Figure 8 is a functional block diagram of the control device 70. The control device 70 includes a transfer control unit 71, a contact state determination unit 72, a mounting control unit 73, a detachment control unit 74, a return control unit 75, a re-holding control unit 76, a disposal determination unit 77, and a storage unit 78.

[0048] The transfer control unit 71 controls the operation of the supply stage 12, the moving mechanism 22, and the direction changing unit 23 of the supply device 10, thereby causing the electronic component 2 to be picked up and transferred to the handover position P2.

[0049] The adhesion state determination unit 72 determines, based on the interference fringes detected by the detection device 40, whether the adhesion state of the electronic component 2 to the holding surface 311 of the mounting tool 31 allows for mounting onto the substrate W. For example, the adhesion state determination unit 72 determines that mounting onto the substrate W is possible if the interference fringes are as shown in Figure 7(A), but determines that mounting onto the substrate W is not possible if the interference fringes are as shown in Figure 7(B).

[0050] It is advisable to determine in advance, through experiments or other means, the criteria for determining whether a mounting is possible based on such interference fringes. For example, interference fringes that result in mounting defects such as poor adhesion between the mounted electronic component 2 and the substrate W, insufficient adhesion strength, or the formation of voids, should be considered unmountable. In other words, interference fringes that result in actual mounting defects should be considered unmountable, and interference fringes that do not result in mounting defects should be considered mountable. It is advisable to model this relationship between interference fringes and mounting feasibility using machine learning.

[0051] The mounting control unit 73, when determined by the contact state determination unit 72 to be mountable, instructs the mounting tool 31 to mount the electronic component 2 onto the substrate W. The mounting control unit 73 controls the operation of the tool movement mechanism 32 and the stage movement mechanism 81 so that the electronic component 2 is mounted onto the substrate W. At this time, the mounting control unit 73 controls the air pressure circuit that communicates with the ventilation holes 313 of the mounting tool 31, and switches between negative and positive pressure at the openings 312 of each row to control the holding and release of the electronic component 2.

[0052] The release control unit 74, when determined by the adhesion state determination unit 72 to be unable to mount the electronic component 2, causes the mounting tool 31 to release the electronic component 2. In this embodiment, the release control unit 74 controls the tool movement mechanism 32 to move the mounting tool 31 to the handover position P2 and releases the electronic component 2 in order to hand it over to the transfer device 20, as will be described later. During release, the release control unit 74 controls the pneumatic circuit that communicates with the ventilation holes 313 of the mounting tool 31 to switch the openings 312 in each row from negative pressure to positive pressure.

[0053] The return control unit 75 causes the transfer device 20 to receive the electronic component 2 that has been detached from the mounting tool 31 by the detachment control unit 74. In this embodiment, the return control unit 75 moves the holding member 21 to the handover position P2 by controlling the moving mechanism 22 and the direction changing unit 23, and approaches the electronic component 2 held by the mounting tool 31 with its opposing surface 211a facing it. The return control unit 75 also controls the supply circuit and the negative pressure generation circuit to generate an air layer on the opposing surface 211a and apply negative pressure to the suction hole 211b, thereby holding the electronic component 2 that has been detached from the mounting tool 31.

[0054] The re-holding control unit 76 causes the mounting tool 31 to receive the electronic component 2 again so that interference fringes on the electronic component 2 and the determination of whether or not it can be mounted can be made again. In this embodiment, the re-holding control unit 76 causes the mounting tool 31 to hold the electronic component 2 by controlling the negative pressure generation circuit of the mounting tool 31. Furthermore, the re-holding control unit 76 releases the negative pressure when the mounting tool 31 holds the electronic component 2 by controlling the negative pressure generation circuit of the holding member 21, thereby releasing the electronic component 2 from the holding member 21.

[0055] This allows the mounting tool 31 to re-hold the electronic component 2 that has been determined to be unmountable, and interference fringe detection and mounting feasibility determination can be performed again. In this embodiment, the receiving of the electronic component 2 by the transfer device 20 by the release control unit 74 and the return control unit 75, the receiving of the electronic component 2 by the mounting tool 31 by the re-holding control unit 76, and the determination of the adhesion state by the adhesion state determination unit 72 are repeated a predetermined number of times. In other words, as long as it is determined to be unmountable, the possibility of correcting the adhesion state of the electronic component 2 and making it mountable can be increased.

[0056] The discard determination unit 77 determines that the electronic component 2 should be discarded if the adhesion condition determination unit 72 has determined that mounting is impossible a predetermined number of times. Here, the number of determinations is the number of times the determination has been made for the same electronic component 2, as described above. If the discard determination unit 77 determines that the electronic component 2 should be discarded, it moves the mounting tool 31 onto the housing device 60 and detaches the electronic component 2. In other words, if the adhesion condition determination unit 72 has determined that mounting is impossible a predetermined number of times, it is determined that the problem cannot be corrected even if the holding is reattached, and the component is discarded by being placed in the housing device 60. At this time, the detachment control unit 74 controls the tool movement mechanism 32 to move the mounting tool 31 onto the housing device 60, and controls the pneumatic circuit of the mounting tool 31 to switch the negative pressure in the openings 312 of each row to positive pressure, thereby detaching the electronic component 2.

[0057] The memory unit 78 is a storage device that includes a recording medium. The memory unit 78 stores in advance the data and programs necessary for the operation of the mounting device 1. This necessary data includes, for example, the position coordinates of the supply position P1, the handover position P2, and the mounting position P3, and the position coordinates of each moving mechanism. The aforementioned moving mechanisms perform movement control of each component based on these coordinates. The memory unit also stores criteria for determining whether interference fringes make mounting possible, and the number of times the electronic component 2 is determined to be unmountable before being discarded.

[0058] [Operation] The operation of the implementation device 1 described above will be explained with reference to Figures 1 to 8, as well as the flowchart in Figure 9.

[0059] (Transportation of electronic components) First, we will explain the operation in which the transfer device 20 picks up the electronic component 2 from the supply device 10 and transfers the electronic component 2 to the mounting device 30. That is, as shown in Figure 1, the holding member 21 in the transfer device 20 is moved to the supply position P1, and the opposing surface 211a of the holding member 21 is brought into contact with the electronic component 2.

[0060] Meanwhile, the supply device 10 moves the supply stage 12 to position the electronic component 2 to be picked up at the supply position P1. After this, the holding member 21, from which gas G (see Figure 3) is blown out from the opposing surface 211a of the porous member 211, is lowered to approach the electronic component 2 at the supply position P1. At this time, the gas G is sandwiched between the opposing surface 211a and the electronic component 2, forming a gas layer. Then, suction is started by the negative pressure acting on the suction hole 211b.

[0061] In this state, by raising the holding member 21, as shown in Figure 3, the electronic component 2, which is attracted by negative pressure, is picked up while being peeled off the sheet 11, while maintaining non-contact with the opposing surface 211a by the layer of gas G (step S01).

[0062] The transfer device 20 reverses the holding member 21 using the direction changing unit 23. That is, it rotates the orientation of the holding member 21 by 180° in the vertical direction, so that the opposing surface 211a of the holding member 21 faces upward. Note that the reversal operation may be performed at any point between the supply position P1 and the handover position P2.

[0063] As shown in Figure 5, the transfer device 20 transfers the electronic component 2 to the mounting device 30 and hands it over to the mounting tool 31 (transfer process). In other words, the transfer device 20 moves the electronic component 2 held by the holding member 21 to the handover position P2 by the moving mechanism 22 (step S02). The mounting tool 31 of the mounting device 30 has moved to the handover position P2 by the tool moving mechanism 32, and its holding surface 311 faces the electronic component 2 held by the holding member 21.

[0064] Then, the mounting tool 31 descends toward the holding member 21, negative pressure is applied to the ventilation hole 313, and the electronic component 2 is held by the mounting tool 31. After that, the holding member 21 releases the negative pressure, and the electronic component 2 is transferred from the holding member 21 to the mounting tool 31 (step S03). As a result, as shown in Figure 4, the mounting tool 31 holds the electronic component 2 in close contact with the holding surface 311 (holding step). As a result, the electronic component 2 is held by suction so as to conform to the ridges of the holding surface 311.

[0065] (Determination of close contact) Next, as shown in Figure 6, the detection device 40 detects interference fringes based on light irradiated onto the holding surface 311 of the electronic component 2 held on the holding surface 311 (detection step). That is, after the holding member 21 is moved away from directly beneath the mounting tool 31, the detection device 40 detects interference fringes of the electronic component 2 held on the mounting tool 31 (step S04). Based on the detected interference fringes, the contact state of the electronic component 2 with respect to the holding surface 311 determines whether or not it is possible to mount it on the substrate W (contact state determination step). If it is determined that it is possible to mount it (YES in step S05), then, as described later, imaging of the electronic component 2 (step S06) and mounting of the electronic component 2 (step S07) are performed.

[0066] If it is determined that mounting is not possible (NO in step S05), and the number of times it has been determined that mounting is not possible has not reached a preset number (NO in step S08), the detachment control unit 74 detaches the electronic component 2 from the mounting tool 31 (detachment step), and the return control unit 75 has the electronic component 2 received by the transfer device 20 (return step). In other words, the holding member 21 moves to the transfer position P2, the opposing surfaces 211a of the mounting tool 31 and the holding member 21 face each other, the mounting tool 31 releases the negative pressure to detach the electronic component 2, and the holding member 21 holds the electronic component 2 due to the negative pressure (step S09).

[0067] Furthermore, the electronic component 2, which has been returned to the holding member 21, is re-held by the mounting tool 31 (re-holding step). In other words, at the transfer position P2, the holding member 21 releases the negative pressure, thereby releasing the electronic component 2, and the mounting tool 31 re-holds the electronic component 2 due to the negative pressure (step S10). Then, the above interference fringe detection (step S04) and the determination of whether mounting is possible based on the contact state are performed again (step S05).

[0068] If the number of times it has been determined that it cannot be implemented reaches a predetermined number (YES in step S08), the implementation tool 31 moves onto the housing device 60, releases the negative pressure to detach the electronic component 2, and discards it into the housing device 60 (step S11).

[0069] If it is determined in step S05 that the component can be mounted, the mounting tool 31 moves to the mounting position P3, and the imaging device 50 moves to the imaging position to image the electronic component 2 held by the mounting tool 31 (step S06).

[0070] After this, the mounting tool 31 corrects its orientation based on the image captured by the imaging device 50 and mounts the electronic component 2 onto the substrate W (step S07). In other words, when the electronic component 2 held by the mounting tool 31 faces the substrate W, and the mounting tool 31 descends and the electronic component 2 makes contact with the substrate W, the negative pressure is sequentially stopped and positive pressure is introduced from a part of the ventilation hole 313, thereby releasing the electronic component 2 and mounting it onto the substrate W. After that, the mounting tool 31 rises and moves away from the substrate W, leaving the electronic component 2 behind.

[0071] While electronic component 2 is being mounted, or when it is decided to discard electronic component 2, the holding member 21 returns to the supply position P1. Furthermore, if there is another electronic component 2 to be mounted (YES in step S12), the process returns to step S01 and the mounting operation of electronic component 2 is repeated. Even if electronic component 2 is discarded in step S11, if there is another electronic component 2 (YES in step S12), the mounting operation of electronic component 2 is repeated in the same manner. If there is no next electronic component 2 (NO in step S12), the process ends.

[0072] [effect] (1) The mounting apparatus 1 of this embodiment includes a mounting device 30 that mounts an electronic component 2 onto a substrate W to be mounted using a mounting tool 31 that holds the electronic component 2 in close contact with a holding surface 311; a transfer device 20 that transfers the electronic component 2 from the supply device 10 to the mounting device 30 and hands it over to the mounting tool 31; a detection device 40 that detects interference fringes based on light irradiated onto the electronic component 2 held by the holding surface 311; a contact state determination unit 72 that determines whether the contact state of the electronic component 2 with the holding surface 311 is suitable for mounting onto the target substrate based on the interference fringes detected by the detection device 40; and a mounting control unit 73 that, if the contact state determination unit 72 determines that mounting is possible, causes the mounting tool 31 to mount the electronic component 2 onto the target substrate.

[0073] Furthermore, the mounting method of this embodiment includes a holding step in which a mounting tool 31 of a mounting device 1 for mounting an electronic component 2 onto a substrate W holds the electronic component 2 in close contact with a holding surface 311; a detection step in which a detection device 40 detects interference fringes based on light irradiated onto the electronic component 2 held on the holding surface 311 of the mounting tool 31; a contact state determination step in which a contact state determination unit 72 determines, based on the interference fringes detected by the detection device 40, whether or not the contact state of the electronic component 2 with respect to the holding surface 311 is suitable for mounting onto the substrate W; and a mounting step in which, if the contact state determination unit 72 determines that mounting is possible, the mounting control unit 73 causes the mounting tool 31 to mount the electronic component 2 onto the substrate W.

[0074] Therefore, if the electronic component 2 does not adhere well to the holding surface 311, the electronic component 2 is not mounted. Thus, only electronic components 2 with good holding, i.e., good adhesion, can be mounted on the substrate W, and the contact of the mounting surface of the electronic component 2 with respect to the substrate W becomes uniform, preventing connection failures due to residual voids and mounting failures due to insufficient strength.

[0075] (2) The mounting device 1 has a release control unit 74 that releases the electronic component 2 from the mounting tool 31 when the adhesion state determination unit 72 determines that mounting is not possible. Furthermore, the mounting method of the embodiment includes a release step in which the release control unit 74 releases the electronic component 2 from the mounting tool 31 when the adhesion state determination unit 72 determines that mounting is not possible. As a result, the electronic component 2 that has been determined to be unmountable can be released from the mounting tool 31, re-held, and disposed of.

[0076] (3) The mounting apparatus 1 includes a supply device 10 for supplying electronic components 2, and a transfer device 20 for transferring the electronic components 2 from the supply device 10 to the mounting device 30 and handing them over to the mounting tool 31. The mounting method of the embodiment also includes a transfer step in which the transfer device 20 transfers the electronic components 2 from the supply device 10 to the mounting device 30 and hands them over to the mounting tool 31 of the mounting device 30. As a result, the pickup and mounting of the electronic components 2 can be performed in parallel, thereby increasing productivity. Furthermore, if the mounting tool 31 re-holds an electronic component 2 that has been determined to be unmountable, the transfer device 20 can receive the electronic component 2 that has been released from the mounting tool 31, eliminating the need for a separate receiving mechanism. This simplifies the configuration of the apparatus and allows only electronic components 2 with good adhesion to be mounted on the substrate W, which is the target of mounting.

[0077] (4) The mounting device 1 includes a return control unit 75 that causes the transfer device 20 to receive the electronic component 2 that has been detached from the mounting tool 31 by the detachment control unit 74, and a re-holding control unit 76 that causes the mounting tool 31 to receive the electronic component 2 again from the transfer device 20 so that interference fringes on the electronic component 2 and determination of whether or not it can be mounted can be performed again.

[0078] Furthermore, the implementation method of the embodiment includes a return step in which the return control unit 75 causes the electronic component 2, which has been detached from the implementation tool 31 by the detachment control unit 74, to be received by the transfer device 20, and a re-holding step in which the re-holding control unit 76 causes the electronic component 2 to be received again by the implementation tool 31 from the transfer device 20, so that interference fringes on the electronic component 2 and determination of whether or not it can be implemented can be performed again.

[0079] Therefore, if the electronic component 2 is not in good contact with the surrounding components, the likelihood of correcting the contact state of the electronic component 2 by re-attaching it with the mounting tool 31 can be increased.

[0080] (5) The mounting device 1 repeats the following a predetermined number of times: receiving the electronic component 2 from the transfer device 20 by the release control unit 74 and the return control unit 75, receiving the electronic component 2 from the mounting tool 31 by the re-holding control unit 76, and determining the adhesion state by the adhesion state determination unit 72. Therefore, by repeatedly holding the electronic component 2 with the mounting tool 31, the possibility of correcting the adhesion state of the electronic component 2 is increased.

[0081] (6) The mounting device 1 has a disposal determination unit 77 that determines that the electronic component 2 should be discarded if the adhesion condition determination unit 72 determines that mounting is not possible a predetermined number of times. Therefore, if the adhesion condition does not improve even after repeated holding by the mounting tool 31, the electronic component 2 is discarded.

[0082] (7) The mounting device 1 has a storage device 60 for storing electronic components 2 that have been determined by the waste determination unit 77 to be to be discarded and have been detached from the mounting tool 31. Therefore, electronic components 2 that are discarded without being used for mounting can be recovered.

[0083] (8) The holding surface 311 of the mounting tool 31 is V-shaped. Therefore, compared to when the holding surface 311 is flat, if there is a misalignment in the holding of the electronic component 2, the contact state is more likely to be poor. However, the quality of the contact state due to this misalignment can be detected, and only those with good contact can be mounted.

[0084] (9) The transfer device 20 has a holding member 21 that holds the electronic component 2 in the supply device 10 in such a way that it does not come into contact with the mounting surface of the electronic component 2 and the surface opposite to it. Therefore, compared to the case where the electronic component 2 is held in contact with the device, the position of the electronic component 2 is not stable, and the electronic component 2 is more likely to shift relative to the holding surface 311 of the receiving mounting tool 31. However, the device can detect whether the contact state is good or bad due to this shift, and only those with good contact can be mounted.

[0085] [Differentiation] This embodiment can also be modified as follows: (1) As shown in Figures 10 and 11, a mounting device 90 may be provided on which the electronic component 2, which is detached from the mounting tool 31 by the detachment control unit 74, is placed. In this case, the re-holding control unit 76 causes the mounting tool 31 to receive the electronic component 2 placed on the mounting device 90 again. The mounting device 90 has a mounting table 91. The mounting table 91 has a mounting surface on which the electronic component 2 is placed from the holding member 21 at the transfer position P2. The mounting table 91 has nozzle holes opening on the mounting surface, although not shown. The nozzle holes are in communication with a negative pressure generating circuit (not shown), such as a vacuum pump, and the circuit generates negative pressure to attract and hold the electronic component 2. The holding state of the electronic component 2 from the mounting table 91 is released by releasing the negative pressure. The mounting table 91 is also provided to be movable in the horizontal direction including the transfer position P2 by a moving mechanism 92.

[0086] The mounting platform 91, upon reaching the transfer position P2, is positioned above the detection device 40 to avoid interference with it. At this position, the mounting platform 91 receives the electronic component 2 from the mounting tool 31, transfers the electronic component 2 back to the mounting tool 31, and then retracts from the transfer position P2. Subsequently, the detection device 40 detects interference fringes of the electronic component 2 held by the mounting tool 31 at the transfer position P2. This allows the mounting tool 31 to transfer the electronic component 2 to the mounting platform 91 and then repeat the holding process.

[0087] In this way, after the mounting tool 31 places the electronic component 2 on the mounting table 91, while it is readjusting the holding position of the electronic component 2, it can pick up the component in a corrected state, such as with its phase returning to normal, thus suppressing a decrease in productivity.

[0088] Furthermore, since the lower surface of the electronic component 2 is in contact with the mounting base 91, the position of the electronic component 2 is more stable than with the non-contact holding member 21. Therefore, it is expected that the displacement of the orientation when receiving the component can be reduced, and the degree of contact can be improved.

[0089] Furthermore, when using the mounting device 90, this can be achieved by using the face-up bonding presizer as the mounting table 91. In other words, in the supply device 10, the holding member 21 picks up the electronic component 2, which is positioned in a face-up state with the mounting surface facing upwards, and places it on the mounting table 91 without inverting it. The mounting tool 31 then holds the electronic component 2 and mounts it on the substrate W in a face-up state.

[0090] Furthermore, the mounting platform 91 can be moved away from the transfer position P2, that is, moved away from the detection device 40, and the mounting can be performed in the face-down state as shown in the above embodiment. In this way, mounting can be switched between the face-up state and the face-down state as needed.

[0091] In addition, in the supply device 10, the holding member 21 can pick up the electronic component 2, which is positioned face down with the mounting surface facing downwards, and place it on the mounting table 91 without inverting it. The mounting tool 31 then holds the electronic component 2 and mounts it to the substrate W in a face-down position.

[0092] In any of the above cases, the mounting tool 31 can transfer the electronic component 2 to the mounting base 91 and then repeat the holding process by the mounting tool 31.

[0093] Even when using the mounting device 90, the process of the detachment control unit 74 placing the electronic component 2 from the mounting tool 31 to the mounting device 90, the re-holding control unit 76 receiving the electronic component 2 from the mounting tool 31, and the adhesion state determination unit 72 determining the adhesion state may be repeated a predetermined number of times. Furthermore, the discard determination unit 77 may determine that the electronic component 2 should be discarded if the adhesion state determination unit 72 has determined that it cannot be mounted a predetermined number of times. The storage device 60 may then store the electronic component 2 that has been determined to be discarded and detached from the mounting tool 31.

[0094] Furthermore, if a mounting device 90 is provided, the return control unit 75 may cause the transfer device 20 to receive the electronic component 2 that has been detached from the mounting tool 31 by the detachment control unit 74, the transfer device 20 may place the received electronic component 2 on the mounting device 90, and the re-holding control unit 76 may cause the transfer device 20 to receive the electronic component 2 placed on the mounting device 90, and then allow the mounting tool 31 to receive it again. In other words, the holding member 21 receives the electronic component 2 from the mounting tool 31, inverts it, and places it on the mounting table 91. From this state, the transfer device 20 picks up the electronic component 2 again, inverts it, and hands it over to the mounting tool 31. This allows the mounting tool 31 to try holding it again.

[0095] In this case as well, the process of the return control unit 75 receiving the electronic component 2 from the mounting tool 31 to the transfer device 20, placing the electronic component 2 from the transfer device 20 to the placement device 90, the re-holding control unit 76 receiving the electronic component 2 from the transfer device 20 and the mounting tool 31, and the contact state determination unit 72 determining the contact state may be repeated a predetermined number of times. Furthermore, the discard determination unit 77 may determine that the electronic component 2 should be discarded if the contact state determination unit 72 has determined that it cannot be mounted a predetermined number of times. The storage device 60 may then store the electronic component 2 that has been determined to be discarded and detached from the mounting tool 31.

[0096] (2) The mounting platform 91 does not have to be configured to hold the electronic component 2 by suction. For example, if the orientation of the electronic component 2 moves automatically due to its own weight when it is placed on the platform for re-holding, it may increase the degree of contact when the mounting tool 31 re-holds it.

[0097] Furthermore, when the electronic component 2 is held by suction on a V-shaped or curved holding surface 311, parts of the electronic component 2 are likely to not be in close contact with the holding surface 311 depending on its orientation. In particular, if the electronic component 2 is held at an angle with respect to the ridge of the holding surface 311, the possibility of parts not being in close contact increases. Therefore, the mounting device 90 may be provided with an orientation changing unit to change the orientation of the electronic component 2.

[0098] The posture changing unit changes the posture of the electronic component 2 in one, two, or all three directions from the θ, X, and Y directions. The posture changing unit should change the posture of the electronic component 2 in a way that increases the probability of good contact with the holding surface 311. For example, it corrects the position so that the electronic component 2 is in the correct position relative to the holding surface 311. More specifically, it changes the posture so that the outer edge of the electronic component 2 is parallel to the edge of the holding surface 311, so that the mounting tool 31 can re-hold it. Alternatively, the posture may be changed randomly within an acceptable range as long as good contact is achieved.

[0099] An attitude detection unit, such as an imaging device, may be provided to detect the attitude of the electronic component 2 placed on the mounting table 91. This allows the attitude change unit to change the attitude of the electronic component 2 so that it is in a preset, correct attitude based on the attitude detected by the attitude detection unit.

[0100] (3) The mounting surface of the mounting table 91 may be V-shaped or curved, and the electronic component 2 may be held in such a way that it does not come into contact with the mounting surface or the opposite surface by the ejection of gas G. If the mounting surface of the mounting table 91 is V-shaped or curved, multiple rows of ventilation holes may be provided, and the electronic component 2 may be held by sequentially applying negative pressure to the ventilation holes adjacent to the ridge portion in a direction that intersects the ridge portion and moves away from the ridge portion, starting from the ventilation hole closest to the ridge portion, and releasing the electronic component 2 by sequentially applying positive pressure to the ventilation holes adjacent to the ridge portion in a direction that intersects the ridge portion and moves away from the ridge portion, starting from the ventilation hole closest to the ridge portion.

[0101] Thus, when the surface of the mounting base 91 is shaped like an upward-convex mountain or a curved surface, the electronic component 2 can be held by attraction from the apex or peak of the convexity, making it less likely for the electronic component 2 to deform or be subjected to uneven stress during re-holding. Furthermore, if the electronic component is attracted and received or picked up sequentially from the end of the multi-row ventilation holes, it is less likely for it to deform or be subjected to uneven stress during placement on the mounting base 91 or during re-holding. As a result, the entire surface of the electronic component 2 can be made in close contact with the holding surface 311, or the areas that are not in contact can be minimized.

[0102] (4) The detection device 40 may also use an infrared (IR) camera. When an infrared camera is used, interference fringes indicating the state of close contact between the electronic component 2 and the holding surface 311 can be directly detected by passing through the electronic component 2. The imaging device 50 can also be used as an infrared camera and serve in conjunction with the detection device 40.

[0103] (5) If the contact state determination unit 72 determines that mounting is not possible, the housing device 60 may house the electronic component 2 that has detached from the mounting tool 31. In other words, in the above embodiment, the electronic component 2 was discarded when the determination of mounting was made a predetermined number of times, but the electronic component 2 may be discarded as soon as the determination of mounting is made even once.

[0104] (6) The holding member 21 of the transfer device 20 is not limited to one that holds the electronic component 2 in a non-contact manner. It may be a member that holds the electronic component 2 in contact with it. For example, the holding member 21 may be a pickup nozzle whose tip is a nozzle hole that attracts and holds the electronic component 2 and releases the electronic component 2 by releasing the attraction.

[0105] (7) The holding surface 311 of the mounting tool 31 may be a curved surface that is convex on the side that holds it. For example, the holding surface 311 may be a raised shape like a part of the side of a cylinder. This makes the curvature of the electronic component 2 gentler and reduces the impact on the electronic component 2.

[0106] Furthermore, the retaining surface 311 may be a flat surface. In this case, since the starting point of contact when the electronic component 2 contacts the substrate W is not fixed to a specific position, it is more preferable that the retaining surface 311 and the electronic component 2 are in close contact before contact with the substrate W. In other words, the state of contact between the flat retaining surface 311 and the electronic component 2 is more easily affected by the bonding state during mounting. Therefore, as in this embodiment, it is useful to perform mounting in a state where a secure contact state is acceptable.

[0107] If the holding surface 311 is a flat surface, for example, as shown in Figures 12(A) and (B), if the interference fringes are uneven, it can be said that the adhesion is not good. However, as mentioned above, it is advisable to determine in advance, through experiments or other means, whether the adhesion is suitable for mounting.

[0108] (8) In this embodiment, the degree of contact of the electronic component 2 with the holding surface 311 is determined by observing interference fringes, and it is sufficient that only the electronic component 2 that is mountable is mounted on the substrate W. For this reason, if it is determined that mounting is not possible, the worker can check and remove the electronic component 2 from the mounting tool 31. The worker can also reattach the removed electronic component 2 to the mounting tool 31.

[0109] (9) The ventilation holes provided in the mounting tool 31 and the mounting base 91 do not necessarily have to be arranged in rows. It is sufficient that the suction or supply of air can be controlled to move away from the point where contact between the electronic component 2 and the substrate W begins. For example, the ventilation holes may be formed in a regular arrangement such as a staggered pattern, or they may be formed in random positions. Also, as long as gas can flow through them, they may be grooves.

[0110] (10) Furthermore, although this embodiment is suitable for direct bonding equipment, it is not limited thereto. Direct bonding is a method of bonding electronic components 2 and substrates W by solid-state bonding, where the connection terminals of the electronic components 2 and substrates W are brought into direct contact without using bonding members (adhesives) such as solder bumps. Therefore, if the entire surface of the electronic components 2 cannot be brought into contact with the substrates W, voids may occur or the bonding strength may decrease. In direct bonding, thin electronic components 2 are often used, and such effects due to insufficient contact are more likely to occur. This embodiment can also be applied when bonding electronic components 2 to substrates W using bonding members.

[0111] Whether using direct bonding or a bonding component, when a thin electronic component 2 is mounted on a substrate W, the entire surface of the electronic component 2 may not be in close contact with the substrate W, resulting in void formation or reduced bonding strength. Specifically, for example, when the thickness of the electronic component 2 is generally less than 200 μm, problems such as poor adhesion and void formation become particularly apparent, and this method is suitable for such thin electronic components 2. Direct bonding is a face-down mounting method, but in the case of thin electronic components 2, it is also suitable for face-up mounting.

[0112] (11) The substrate W to be mounted can be any substrate W on which circuit wiring is formed on its surface, and its shape and material are not limited. For example, the shape can be circular or rectangular. Furthermore, it is widely applicable to wafers such as silicon and glass, insulating boards such as epoxy, glass, and ceramics, and insulating films such as polyimide, on which circuit wiring is printed.

[0113] (12) The electronic components 2 supplied by the supply device 10 are not limited to those arranged on a sheet 11. For example, the electronic components 2 may be arranged on a tray.

[0114] (13) In this embodiment, it is sufficient to observe the contact state of the electronic component 2 held by the mounting tool 31 with the holding surface 311 using interference fringes and to determine whether mounting is possible. For this reason, the manner in which the electronic component 2 is supplied to the mounting tool 31 is not limited to any particular one.

[0115] For example, the handover position P2 of the electronic component 2 to the mounting tool 31 may coincide with the mounting position P3. In other words, the transfer device 20 may transport the electronic component 2 to the mounting tool 31 waiting at the mounting position P3 and hand it over to the mounting tool 31 without the mounting tool 31 moving to the handover position P2. In this case, when the electronic component 2 is handed over, the substrate W is moved away from the mounting position P3 together with the substrate stage 80. After the handover, the holding member 21 of the transfer device 20 is moved away from the mounting position P3. The detection device 40 is positioned directly below the mounting position P3 and detects the interference fringes of the handed-over electronic component 2 to determine whether it is possible to mount it or not. If the holding must be redone, the holding member 21 is positioned again at the mounting position P3 and the handover is redone. The operation of the imaging device 50 is as described above.

[0116] However, when the imaging device 50 is positioned directly below the mounting position P3, the detection device 40 is provided to be able to move back and forth between a detection position, which is directly below the mounting position P3, and a retraction position, which is a position to which it moves away from the detection position. After the detection device 40 comes to the detection position and detects interference fringes, it moves to the retraction position, and the imaging device 50 performs imaging.

[0117] Alternatively, the mounting device 30 may move the mounting tool 31 to the supply position P1, pick up the electronic component 2 with the mounting tool 31, and then move the mounting tool 31 to the mounting position P3 to mount it onto the substrate W. In this case, interference fringes can be detected by the detection device 40 at any position between the pickup and mounting.

[0118] (14) The position of the imaging device 50 is not limited to the above-described configuration. For example, the imaging device 50 may be positioned adjacent to the detection device 40 directly below the movement path of the mounting tool 31. In this case, at the handover position P2, the detection device 40 detects interference fringes on the electronic component 2 of the mounting tool 31. If it is determined that mounting is possible, the mounting tool 31 moves to the adjacent position, and the imaging device 50 images the electronic component 2 to determine its orientation. The imaging may be performed by stopping the mounting tool 31 to perform high-precision position detection, or by moving the mounting tool 31 while imaging is performed to increase productivity.

[0119] As the mounting tool 31 moves to the mounting position P3, an imaging device for the substrate W, which is positioned adjacent to the mounting tool 31 in the Y direction, is positioned at the mounting position P3. The mounting area of ​​the substrate W positioned at the mounting position P3 is imaged to determine its orientation. Based on the orientation of the electronic component 2 and the orientation of the mounting area, both are positioned and the mounting tool 31 is moved to perform the mounting.

[0120] Furthermore, the detection device 40 and the imaging device 50 may be installed in a manner that allows them to be moved to the handover position P2. For example, if the detection device 40 and the imaging device 50 are mounted on a Y-direction stage, and the detection device 40 at the handover position P2 determines that it is possible to implement the device, the imaging device 50 moves to the handover position P2 in place of the detection device 40 to perform attitude recognition by imaging.

[0121] [Other embodiments] Although embodiments and modifications of the present invention have been described above, these embodiments and modifications are presented as examples only and are not intended to limit the scope of the invention. These novel embodiments described above can be implemented in various other forms, and various omissions, substitutions, modifications, and combinations can be made without departing from the spirit of the invention. These embodiments and their variations are included in the scope and spirit of the invention, as well as in the invention described in the claims. [Explanation of Symbols]

[0122] 1. Mounting device 2 Electronic components 10 Feeding device 20 Transfer device 21 Retaining member 22 Moving mechanism 23 Direction change section 30 Onboard equipment 31 Implementation Tools 32 Tool Movement Mechanism 40 Detection device 50 Imaging device 60. Housing device 70 Control device 71 Transfer Control Unit 72 Contact State Determination Unit 73 Implementation Control Unit 74 Detachment control unit 75 Return control unit 76 Re-holding control unit 77 Disposal Determination Unit 78 Memory section 80 PCB stage 90 Mounting device 91 Mounting platform 92 Moving mechanism 221 Slide mechanism 222 Lifting mechanism 311 Holding surface 312 Aperture 313 Ventilation holes 321 Slide mechanism 322 Lifting mechanism W board

Claims

1. A mounting device that mounts electronic components onto a mounting target using a mounting tool that holds the electronic components in close contact with the holding surface, A detection device for detecting interference fringes based on light irradiated toward the electronic component held by the holding surface, A contact state determination unit determines whether the contact state of the electronic component with respect to the holding surface is such that it can be mounted on the mounting target, based on the interference fringes detected by the detection device. If the contact state determination unit determines that mounting is possible, the mounting tool is configured to mount the electronic component onto the mounting target, An implementation device characterized by having the following features.

2. The mounting apparatus according to claim 1, characterized in that the mounting tool has a release control unit that releases the electronic component when the contact state determination unit determines that mounting is not possible.

3. A supply device for supplying the aforementioned electronic components, A transfer device that transfers the electronic components in the supply device to the mounting device and then hands them over to the mounting tool, The mounting device according to claim 1, characterized by having the following features.

4. If the adhesion state determination unit determines that mounting is not possible, the mounting tool is equipped with a detachment control unit that detaches the electronic component, A return control unit that causes the electronic component detached from the mounting tool by the detachment control unit to be received by the transfer device, A re-holding control unit that causes the mounting tool to receive the electronic component again from the transfer device, so that the detection of interference fringes on the electronic component and the determination of whether or not it can be mounted can be performed again, The mounting device according to claim 3, characterized by having the following features.

5. The mounting apparatus according to claim 4, characterized in that the receiving of the electronic component by the detachment control unit and the return control unit, the receiving of the electronic component by the mounting tool by the re-holding control unit, and the determination of the adhesion state by the adhesion state determination unit are repeated a predetermined number of times.

6. If the contact state determination unit determines that mounting is not possible, the mounting tool is equipped with a detachment control unit that detaches the electronic component, A mounting device on which the electronic component to be detached from the mounting tool by the detachment control unit is placed, A re-holding control unit that causes the electronic component placed on the mounting device to be received again by the mounting tool, The mounting device according to claim 1, characterized by having the following features.

7. The mounting apparatus according to claim 6, characterized in that the following steps are repeated a predetermined number of times: the detachment control unit places the electronic component from the mounting tool onto the mounting device, the re-holding control unit receives the electronic component from the mounting tool, and the adhesion state determination unit determines the adhesion state.

8. If the contact state determination unit determines that mounting is not possible, the mounting tool is equipped with a detachment control unit that detaches the electronic component, A return control unit that causes the electronic component detached from the mounting tool by the detachment control unit to be received by the transfer device, A mounting device on which the electronic components received by the transfer device are placed, A re-holding control unit that, after the electronic component placed on the mounting device is received by the transfer device, and then received again by the mounting tool, The mounting device according to claim 3, characterized by having the following features.

9. The return control unit receives the electronic components from the mounting tool to the transfer device, The mounting apparatus according to claim 8, characterized in that the process of placing the electronic component from the transfer device to the mounting device, receiving the electronic component from the transfer device and the mounting tool by the re-holding control unit, and determining the state of adhesion by the adhesion state determination unit is repeated a predetermined number of times.

10. The mounting apparatus according to claim 5, 7, or 9, further comprising a disposal determination unit that determines that the electronic component should be discarded when the adhesion condition determination unit determines that mounting is not possible a predetermined number of times.

11. The mounting apparatus according to claim 10, further comprising a storage device for storing the electronic components that have been determined by the disposal determination unit to be to be disposed of and have been detached from the mounting tool.

12. If the contact state determination unit determines that mounting is not possible, the mounting tool is equipped with a detachment control unit that detaches the electronic component, The mounting apparatus according to claim 1, characterized in that it has a housing device for housing the electronic component detached from the mounting tool.

13. The mounting apparatus according to claim 1, characterized in that the holding surface of the mounting tool is V-shaped or curved.

14. The mounting apparatus according to claim 3, characterized in that the transfer device has a holding member that holds the electronic component in a manner that is non-contact with the mounting surface of the electronic component and the surface opposite thereto.

15. A mounting tool for mounting electronic components onto a mounting target includes a holding step of holding the electronic component in close contact with a holding surface, A detection step in which the detection device detects interference fringes based on light irradiated toward the mounting surface of the electronic component held on the holding surface of the mounting tool, The adhesion state determination unit performs an adhesion state determination step in which it determines, based on the interference fringes detected by the detection device, whether the adhesion state of the electronic component to the holding surface is such that it can be mounted on the mounting target, If the contact state determination unit determines that mounting is possible, the mounting control unit performs a mounting step of mounting the electronic component onto the mounting target using the mounting tool, An implementation method characterized by including the following.

16. The mounting method according to claim 15, characterized in that, if the contact state determination unit determines that mounting is not possible, the detachment control unit includes a detachment step of detaching the electronic component from the mounting tool.

17. The mounting method according to claim 15, characterized in that the transfer device includes a transfer step of transferring the electronic components in the supply device to the mounting device and handing them over to the mounting tool of the mounting device.

18. If the adhesion state determination unit determines that mounting is not possible, the detachment control unit instructs the mounting tool to perform a detachment step to detach the electronic component, The return control unit performs a return step in which it causes the electronic component, which has been detached from the mounting tool by the detachment control unit, to be received by a transfer device. In order to enable the detection of interference fringes on the electronic component and the determination of whether or not it can be mounted again, the re-holding control unit performs a re-holding step in which it causes the mounting tool to receive the electronic component again from the transfer device, The implementation method according to claim 15, characterized by including the following:

Images