Cooling device and imaging system
The cooling device addresses durability issues by using a deformable storage container and heat sink structure to manage refrigerant expansion, ensuring efficient and durable heat transfer.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-10-02
- Publication Date
- 2026-04-14
AI Technical Summary
Existing cooling devices face durability issues due to refrigerant expansion and excessive load on heat conduction members, particularly in temperature changes.
A cooling device with a deformable storage container for refrigerant and a heat diffusion section, utilizing a deformable material to absorb refrigerant volume changes, and a heat sink structure to transfer heat efficiently without direct contact between heat conductive members.
Provides a highly durable cooling solution that maintains effective heat transfer and prevents damage to the containment vessel and heat sink, ensuring consistent performance across temperature variations.
Smart Images

Figure 2026064384000001_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a cooling device and an imaging system.
Background Art
[0002] Conventionally, a cooling device for cooling the heat of electronic components has been known. Patent Document 1 discloses a cooling device that dissipates the heat of electronic components by connecting between a housing and a cooling unit with a flow path through which a refrigerant flows. Patent Document 2 discloses a heat dissipation structure having a heat conduction member and an elastic member provided inside a battery.
Prior Art Documents
Patent Documents
[0003]
Patent Document 1
Patent Document 2
Summary of the Invention
Problems to be Solved by the Invention
[0004] However, the cooling device disclosed in Patent Document 1 has a problem from the viewpoint of durability because the refrigerant expands according to a temperature change. The heat dissipation structure disclosed in Patent Document 2 has a problem from the viewpoint of durability because an elastic member contacts the heat conduction member, resulting in an excessive load on the heat conduction member.
[0005] Therefore, an object of the present invention is to provide a highly durable cooling device.
Means for Solving the Problems
[0006] One aspect of the present invention is a cooling device that can be attached to and detached from an electronic device, comprising a storage container for storing a refrigerant and a heat diffusion section for transferring heat from the electronic components of the electronic device to the refrigerant, wherein at least a part of the storage container is made of a deformable material.
[0007] Other objects and features of the present invention are described in the following embodiments. [Effects of the Invention]
[0008] According to the present invention, a highly durable cooling device can be provided. [Brief explanation of the drawing]
[0009] [Figure 1(a)] This is an external view (front perspective view) of the camera body in the first embodiment. [Figure 1(b)] This is an external view (rear perspective view) of the camera body in the first embodiment. [Figure 1(c)] This is a cross-sectional view of the camera body in the first embodiment. [Figure 2] These are external views and cross-sectional views of the cooling device in the first embodiment. [Figure 3] This is a schematic diagram of the imaging system in the first embodiment. [Figure 4] This is a block diagram of the imaging system in the first embodiment. [Figure 5] This is a cross-sectional view of the absorbent member of the external cooling accessory in the first embodiment in a compressed state. [Figure 6] This is a cross-sectional view of the cooling device in the second embodiment. [Figure 7] This is a cross-sectional view of the cooling device in the third embodiment. [Figure 8] This is a cross-sectional view of the cooling device in the fourth embodiment. [Figure 9] This is a cross-sectional view of the cooling device in the fifth embodiment. [Modes for carrying out the invention]
[0010] Embodiments of the present invention will be described in detail below with reference to the drawings.
[0011] (First Embodiment) First, the camera body (imaging device, electronic equipment) 100 in the first embodiment of the present invention will be described with reference to Figures 1(a) to 1(c). Figure 1(a) is an external view (front perspective view) of the camera body 100. Figure 1(b) is an external view (rear perspective view) of the camera body 100. Figure 1(c) is a cross-sectional view of the camera body 100, showing the shape of the camera body 100 cut in half along the optical axis.
[0012] The display unit 101, located on the rear of the camera body 100, is mounted to the camera body 100 so as to be openable and rotatable, and displays images generated by imaging and various information related to imaging. The display unit 101 is equipped with a touch panel and can detect user touch operations on its display surface (operating surface). The viewfinder-external display unit 102, located on the top of the camera body 100, can display the set values of various imaging parameters such as shutter speed and aperture.
[0013] The shutter button 103 is an operating component that the user operates when instructing the camera body 100 to take an image. The mode selector switch 104 is an operating component that the user operates when switching between various modes. The terminal cover 105 is a cover that protects the connector to which connection cables extending from external devices are connected. The main electronic dial 106 is an operating component that the user rotates when changing the setting value of the imaging parameters. The power switch 107 is an operating component that the user operates when switching the power of the camera body 100 ON / OFF. The sub electronic dial 108 is an operating component that the user operates when moving selection frames such as the autofocus (AF) frame or when advancing images.
[0014] On the back of the camera body 100, a multi-controller 109 is provided. The multi-controller 109 is configured to enable input by pressing the key top and tilting operations in the up, down, left, right, and diagonal directions. By the user operating the multi-controller 109, the selection frame can be moved or items in various menus can be selected.
[0015] The rear electronic dial 110 is an operation member that the user operates when moving the selection frame or performing image advancement. The rear electronic dial 110 is arranged at a position where it is intuitive and easy for the user to operate while the captured image is being reproduced on the display unit 101, and is also easy to operate even when the user holds the camera body 100 vertically.
[0016] At the center of the rear electronic dial 110, a SET button 111 is provided. The SET button 111 is an operation member as a push button that the user operates when making a decision on a selected item or the like.
[0017] The movie button 112 is an operation member that the user operates when instructing the start and stop of movie recording. The button group 113 is an operation member related to focus and exposure, and includes an AF start button, an AE lock button, and an AF frame selection button arranged horizontally. When the user presses these button groups 113 in the imaging standby state, AF can be started, the AF frame can be changed, or the exposure can be fixed.
[0018] The button group 114 includes a zoom in / out button, an information display button, and a quick setting button arranged in an L shape. By the user operating the zoom in / out button in the live view display state in the imaging mode, the ON / OFF of the zooming of the live view display image can be switched. Also, by the user operating the zoom in / out button in the playback mode, the ON / OFF of the zooming of the reproduced captured image can be switched.
[0019] By operating the information display button, the user can switch the display method of the information shown on the display unit 101. By operating the quick setting button, the user can quickly switch the display on the display unit 101 to the screen for changing the setting values of the imaging parameters.
[0020] The button group 115 includes a play button and an erase button. By operating the play button, the user can switch between imaging mode and playback mode. When the play button is operated in imaging mode, the system switches to playback mode, and the most recent image captured from the images recorded on the media (not shown) can be displayed on the display unit 101. In playback mode, the user who has selected an image can erase the selected image by operating the erase button.
[0021] The button group 116 includes a menu button and a rating button. When the user operates the menu button, a menu screen displaying configurable items is displayed on the display unit 101. The user can intuitively select items and make settings by touching the menu screen displayed on the display unit 101, or by operating the multi-controller 109, the rear electronic dial 110, or the SET button 111. In playback mode, the user can rate the playback image by operating the rating button.
[0022] A replacement lens (lens device) (not shown) is detachably attached to the mount portion 117 of the camera body 100. A communication terminal 118 provided inside the mount portion 117 is used for communication between the camera body 100 and the replacement lens.
[0023] The viewfinder 119, located on the upper rear of the camera body 100, is an electronic viewfinder that allows the user to view a live view image or the like when looking through it. The viewfinder 119 is equipped with an eyepiece detection unit, which allows it to detect when the user is looking through (looking through) the viewfinder 119. The eyepiece cover 121 is a rubber material that comes into contact with the face around the user's eye when they look through the viewfinder 119.
[0024] The grip portion 122 is a gripping portion that has a shape that makes it easy for the user to hold the camera body 100 with their right hand. The card cover 123 is a cover that covers the media slot 153 for storing media. The card cover 123 is provided on the part of the grip portion 122 where the user's palm rests. The tripod mount 125 is a mounting member used when attaching external accessories to the bottom surface of the camera body 100. The bottom exterior member 137 is an exterior member that forms the bottom surface of the camera body 100. The bottom exterior member 137 has an opening (not shown), and the opening is shaped so that the main body cover (lid member) 124 can be attached to it. The main body cover 124 is a protective member that is attached to the opening of the bottom exterior member 137 and protects the main body heat dissipation member 135 that is exposed from the exterior.
[0025] Referring to Figure 1(c), the internal configuration of the camera body 100 will be described. The first circuit board 130 has an image sensor (electronic component) 131 such as a CMOS (Complementary Metal-Oxide-Semiconductor) or CCD (Charge Coupled Device), which is a heat source, mounted on it. The second circuit board 132 has an electronic component 133 such as a CPU (Central Processing Unit) 133a or DRAM (Dynamic Random Access Memory), which is a heat source, mounted on it.
[0026] A first heat transfer member 134, made of a highly thermally conductive material such as aluminum sheet metal, copper sheet metal, or heat pipe, is positioned between the first circuit board 130 and the second circuit board 132. The image sensor 131 of the first circuit board 130 and the first heat transfer member 134 are thermally connected by a heat transfer material, such as a heat dissipation rubber or graphite sheet (not shown). The heat from the image sensor 131 of the first circuit board 130 is transferred to the first heat transfer member 134 via a heat transfer material (not shown).
[0027] The electronic component 133 of the second circuit board 132 and the first heat transfer member 134 are thermally connected by a heat transfer member, such as a heat dissipation rubber or graphite sheet (not shown). The heat from the electronic component 133 of the second circuit board 132 is transferred to the first heat transfer member 134 via the heat transfer member (not shown).
[0028] A bottom exterior member 137, which constitutes the bottom exterior, is placed on the bottom surface of the camera body 100, and a portion of the main body heat dissipation member 135, made of a highly thermally conductive material such as aluminum, magnesium, or copper, is exposed from the bottom exterior member 137. In this embodiment, an example in which the bottom exterior member 137 and the main body heat dissipation member 135 are placed on the bottom surface of the camera body 100 has been described, but it is not limited to this. Similar effects can be obtained by placing each member in a position that is substantially perpendicular to the first circuit board 130 and the second circuit board 132 (for example, on the top surface or side surface).
[0029] The first heat transfer member 134 and the main heat dissipation member 135 are thermally connected by screws (not shown) or the like, and heat from the image sensor 131 and electronic components 133 is transferred to the main heat dissipation member 135 via the first heat transfer member 134. In this embodiment, sheet metal is used as the first heat transfer member 134, but a heat transfer member such as a graphite sheet may also be used. Alternatively, heat may be directly transferred from the first circuit board 130 and the second circuit board 132 to the main heat dissipation member 135 using separate heat transfer members.
[0030] A portion of the main body heat dissipation member 135 is exposed through an opening in the bottom exterior member 137, and a main body cover 124 is attached to the opening in the bottom exterior member 137 so as to cover the exposed portion of the main body heat dissipation member 135. The main body cover 124 makes it possible to reduce the likelihood of the user inadvertently touching the exposed portion of the main body heat dissipation member 135, which has become hot, when the external cooling accessory (cooling device) 200 is not attached, and experiencing discomfort. In this embodiment, instead of providing the main body cover 124, the amount of recess in the exposed portion of the main body heat dissipation member 135 exposed from the bottom exterior member 137 may be increased to make it more difficult for the user to inadvertently touch it.
[0031] The main body component 138 is a major component of the camera body 100. The main body heat dissipation member 135 and the main body component 138 are thermally connected by a second heat transfer member 136, such as a heat dissipation rubber or graphite sheet. Heat transferred from the image sensor 131 or electronic component 133 to the main body heat dissipation member 135 is transferred to the main body component 138 by the second heat transfer member 136, and then transferred to the entire camera body 100 via the main body component 138. Note that the heat may be transferred not only to the main body component 138, but also to exterior components or internal sheet metal components. As a result, when the external cooling accessory 200 is not attached, heat from the image sensor 131 or electronic component 133 is contained in the main body heat dissipation member 135, making it possible to suppress the temperature rise of the image sensor 131 or electronic component 133.
[0032] The second heat transfer member 136 may be provided in multiple locations to transfer heat from the main body heat dissipation member 135 to the entire camera body 100. For example, heat may be transferred to the main body member 138 not just at one location, but at multiple locations, or multiple locations may be provided to transfer heat to exterior members or other members in addition to the main body member 138.
[0033] Figures 2(a) and 2(b) are external views and cross-sectional views of the external cooling accessory (cooling device) 200 in this embodiment. Figure 2(a) is a front perspective view of the external cooling accessory 200. Figure 2(b) is a cross-sectional view of the external cooling accessory 200 as seen from the direction of arrow AA in Figure 2(a).
[0034] Referring to Figure 2(a), the external configuration of the external cooling accessory 200 will be described. The external cooling accessory 200 comprises an accessory casing 201, a tripod screw 202, and an accessory heat receiving member 203. The accessory heat receiving member 203 protrudes from the accessory casing 201a and is exposed from the accessory casing 201a. In this embodiment, there are two accessory heat receiving members 203, but it is not limited to this, and multiple accessory heat receiving members 203 may be provided in accordance with the locations of the main body heat dissipation members 135 provided on the camera body 100.
[0035] Referring to Figure 2(b), the internal configuration of the external cooling accessory 200 will be described. In addition to the accessory heat receiving member 203, the external cooling accessory 200 includes a storage container 204 that houses the refrigerant 206 and also serves as an exterior member, a heat sink (heat diffusion part) 205 that transfers heat to the refrigerant 206 inside the storage container 204, and an accessory exterior 201. In this embodiment, the storage container 204 that houses the refrigerant 206 also serves as the accessory exterior 201, but this is not limited to this, and the accessory exterior 201 may be placed outside the storage container 204. In that case, the storage container 204 is fixed to the accessory exterior 201 with screws (not shown) or the like.
[0036] The accessory heat receiving member 203 and the heat sink 205 are fixed together by the heat sink fixing part 207. In addition to receiving heat from the camera body 100, the accessory heat receiving member 203 also serves as a heat transfer path for transferring heat to the heat sink 205. In this embodiment, the accessory heat receiving member 203 and the heat sink 205 are separate parts, but the accessory heat receiving member 203 and the heat sink 205 may be constructed as a single unit without providing the heat sink fixing part 207.
[0037] The accessory heat receiving member 203 is mounted so as to penetrate the accessory casing 201a and has a liquid sealing portion 208 to prevent the refrigerant 206 from leaking out. The liquid sealing portion 208 is made of an elastic material and allows the accessory heat receiving member 203 to be finely adjusted in the vertical direction (Y direction). This configuration improves the contact between the main body heat dissipation member 135 of the camera body 100 and the accessory heat receiving member 203 of the external cooling accessory 200, thereby reducing thermal resistance.
[0038] Next, the applications of each part will be explained. The heat sink 205 can efficiently transfer heat to the refrigerant 206 by increasing its surface area. The heat sink 205 has multiple fins (protrusions) arranged along the Z direction. Each of the multiple fins protrudes in the -Y direction perpendicular to the Z direction. The shape of each of the multiple fins, such as the pitch or length, can be appropriately changed to be optimal depending on the size of the containment vessel 204 or the type of refrigerant 206.
[0039] The heat sink 205 may have multiple wall-shaped fins arranged as shown in this embodiment, or it may have cylindrical columns arranged at regular intervals. By arranging the cylindrical columns at intervals, the coolant 206 can move between the cylinders regardless of the orientation of the heat sink 205. As a result, temperature unevenness of the coolant 206 can be reduced regardless of the orientation (position) in which the camera body 100 and the external cooling accessory 200 are used. In order to ensure heat dissipation regardless of the orientation (position) of the external cooling accessory 200, the fin portion of the heat sink 205 is arranged so that it is not exposed to the air in any position and is filled with coolant 206.
[0040] Since the containment vessel 204 and heat sink 205 are constantly in contact with the refrigerant 206, it is preferable to select materials for them according to the type of refrigerant 206. When water is used as the refrigerant 206, it is preferable to use rust-resistant materials or apply a rust-preventive coating.
[0041] The refrigerant 206 in the containment vessel 204 may be non-replaceable, or it may be configured to be replaceable by providing a separate refrigerant replacement section. Making the refrigerant 206 replaceable improves convenience, as the containment vessel 204 can be emptied when the refrigerant 206 is not needed, such as during transport.
[0042] When the refrigerant 206 is water, it is known to expand due to solidification at low temperatures (for example, its volume increases by about 10%), and this expansion of the refrigerant 206 may damage the containment vessel 204. Therefore, in this embodiment, an absorbent member 252 (a deformable member) is provided inside the containment vessel 204 to absorb the volume increase of the refrigerant 206 when it expands (to reduce or suppress the increase in the volume of the containment vessel 204). That is, the absorbent member 252 deforms to absorb the change in the volume of the refrigerant 206 according to the temperature. The absorbent member 252 constitutes at least a part (or at least one surface) of the containment vessel 204. This prevents damage to the containment vessel 204 even when the refrigerant 206 solidifies and expands at low temperatures. In this embodiment, the refrigerant 206 is not limited to water. This embodiment can also be applied to refrigerants that expand at high temperatures, for example.
[0043] In Figure 2(b), h1 is the height of the absorbent member 252 before the refrigerant 206 solidifies. 257 is an air vent (a hole through which air passes), and when the absorbent member 252 is compressed, air escapes to the outside of the containment vessel 204 through the air vent 257. Details of the mechanism using the absorbent member 252 will be described later.
[0044] Figures 3(a) and 3(b) are schematic diagrams of the imaging system 10 configured by attaching the camera body 100 and the external cooling accessory 200 according to this embodiment. Figure 3(a) is a front perspective view of the camera body 100 and the external cooling accessory 200. Figure 3(b) is a cross-sectional view of the camera body 100 and the external cooling accessory 200, showing a cross-section on the same plane as in Figure 2(b).
[0045] Referring to Figure 3(a), the external configuration of the camera body 100 and the external cooling accessory 200 in their attached state will be described. The external cooling accessory 200 is detachably attached to the bottom surface of the camera body 100, and the camera body 100 and the external cooling accessory 200 are fixed together by the tripod mount 125 of the camera body 100 and the tripod screw 202 of the external cooling accessory 200.
[0046] Referring to Figure 3(b), the internal configuration of the camera body 100 and the external cooling accessory 200 when attached will be described. When the external cooling accessory 200 is attached to the camera body 100 by the tripod screw 202, the main body heat dissipation member 135 of the camera body 100 and the accessory heat receiving member 203 of the external cooling accessory 200 come into contact with each other. As a result, heat from the camera body 100 is transferred to the external cooling accessory 200.
[0047] Next, the method of heat transfer will be described in detail. Heat from the image sensor 131 and electronic components 133 of the camera body 100 is transferred to the main body heat dissipation member 135 by the first heat transfer member 134. When the external cooling accessory 200 is attached to the camera body 100, heat from the main body heat dissipation member 135 of the camera body 100 is transferred to the accessory heat receiving member 203 of the external cooling accessory 200.
[0048] The heat transferred to the accessory heat receiving member 203 is transferred to the heat sink 205, and then from the heat sink 205 to the refrigerant 206. The heat from the refrigerant 206 is transferred to the containment vessel 204, from the containment vessel 204 to the accessory outer casing 201, and then dissipated into the atmosphere from the surface of the accessory outer casing 201. Alternatively, an insulating configuration is also possible in which heat is not transferred from the containment vessel 204 to the accessory outer casing 201. This makes the refrigerant 206 inside the containment vessel 204 less susceptible to high ambient temperatures.
[0049] When water is used as the refrigerant 206, it is known that the heat capacity of water is very high compared to metals of a similar volume, and it can store a lot of heat. As a result, the heat from the image sensor 131 and electronic components 133 of the camera body 100 can be stored in the refrigerant 206, suppressing the temperature rise of the image sensor 131 and electronic components 133, and making it possible to extend the shooting time.
[0050] Unlike typical circulating water cooling systems, this embodiment does not directly transfer the cooled refrigerant to the heat-generating parts. Instead, it transfers the heat from the camera body 100 to an external cooling accessory 200 for cooling. This prevents the image sensor 131 and electronic components 133 from cooling down too rapidly, reducing the possibility of condensation on them. Furthermore, it eliminates the need for pumps, power supplies, and refrigerant circulation tubes required in circulating water cooling systems, resulting in a simpler configuration.
[0051] Next, the configuration of each part will be explained in detail. As mentioned above, in the camera body 100, the heat transferred to the main body heat dissipation member 135 is transferred to the entire camera body 100 by the second heat transfer member 136. This reduces the possibility that heat will accumulate in the main body heat dissipation member 135, making it difficult for the image sensor 131 and electronic components 133 to cool down, even when the external cooling accessory 200 is not attached.
[0052] On the other hand, when the external cooling accessory 200 is attached to the camera body 100, heat is transferred to the cooler side, so the heat from the camera body 100 is transferred to the external cooling accessory 200, which can suppress the temperature rise of the camera body 100.
[0053] Within the container 204 for the external cooling accessory 200, additional cooling means such as a Peltier element, a fan, or a cooling rod that thermally connects the external air and the refrigerant 206 may be provided. The cooling means can lower the temperature of the refrigerant 206, thereby further lowering the temperature of the camera body 100.
[0054] The external cooling accessory 200 may be housed in a container 204 that provides additional convection means, such as a fan or pump. The fan or pump can force convection into the refrigerant 206 inside the container 204. When the camera body 100 and the external cooling accessory 200 are stationary, no circulation or forced convection occurs, resulting in temperature unevenness in the refrigerant 206. By creating forced convection, the temperature unevenness in the refrigerant 206 is reduced, making it possible to lower the temperature of the camera body 100.
[0055] Figure 4 is a block diagram of an imaging system 10 equipped with a camera body 100 and an external cooling accessory 200. The CPU (Central Processing Unit) 133a is a control unit that controls the operation of the entire camera body 100 and executes various processes and instructions to each circuit section. Various electronic components 133, including the CPU 133a, which is one of the heat-generating components, are mounted on the second circuit board 132. The second circuit board 132 is a printed wired board (PWB) and many of the various electrical circuits (detection circuits, control circuits, processing circuits), such as the camera microcontroller, are mounted on it. The CPU 133a controls each functional block of the camera body 100 and performs the necessary calculations according to the computer program loaded from memory. The power supply 150 supplies power to each circuit section within the camera body 100.
[0056] The image sensor 131 is composed of a CCD sensor or a CMOS sensor and converts the optical image of the subject captured by the image sensor 131 into an image signal. The image signal obtained by the image sensor 131 is converted into image data by the image processing unit 151 and output to the CPU 133a. A shutter 156 is located in front of the image sensor 131 and adjusts the exposure time of the image sensor 131. The shutter control unit 154 drives the shutter 156 based on a signal input from the CPU 133a.
[0057] When the mode switch 104 is operated by the user, the operation detection unit 157 outputs a signal to the CPU 133a to change shooting conditions such as exposure and shutter speed. The camera body 100 can select the desired video shooting mode from among several video shooting modes by operating the mode switch 104. Video shooting modes include, for example, high-quality mode and low-quality mode. When shooting video in high-quality mode, the processing load on the image sensor 131 and CPU 133a is large, so the heat generated by the electronic component 133 and the media slot 153 is also large, and the video shooting time is shortened. On the other hand, in low-quality mode, the heat generated by the electronic component 133 is smaller compared to high-quality mode, and the video shooting time is longer.
[0058] The connection terminal 155 is an electrical component for electrically connecting to various external accessories. By connecting the connection terminal 155 to the connection terminal 251 of the external water cooling accessory 200, electrical connection and communication between the camera body 100 and the external water cooling accessory 200 becomes possible. The control board 250 controls the various parts of the external water cooling accessory 200.
[0059] Next, the internal structure of the external cooling accessory 200 in this embodiment will be described. Figure 5 is a cross-sectional view of the state inside the containment container 204 when the refrigerant 206 inside the containment container 204 in Figure 2(b) solidifies due to low temperature and the volume of the refrigerant 206 expands (the absorbent member 252 of the external cooling accessory 200 is compressed).
[0060] As explained with reference to Figure 2(b), let h1 be the height of the absorbent member 252 before the refrigerant 206 solidifies. As shown in Figure 5, let h1' be the height of the absorbent member 252 after the refrigerant 206 solidifies. At this time, the absorbent member 252 is compressed by a height of (h1-h1').
[0061] The absorbent member 252 is made of an elastically deformable material such as a cushioning material (an elastic material such as water-repellent poron), and is positioned in contact with the refrigerant 206 so that it can absorb the volume increase due to the solidification of the refrigerant 206. As a result, excessive pressure due to the expansion of the refrigerant 206 is not generated on the containment vessel 204 and the heat sink 205, and deformation or damage to the containment vessel 204 and the heat sink 205 is prevented.
[0062] In this embodiment, the heat sink 205 is fixed to the upper surface (+Y direction) (first surface) of the external cooling accessory 200. On the other hand, the absorbent member 252 is positioned on the opposite side, the bottom surface (-Y direction) (second surface facing the first surface). In other words, the heat sink 205 and the absorbent member 252 are not in contact with each other. As a result, the absorbent member 252 does not impose unnecessary load on the heat sink 205, and thus damage to the heat sink 205 can be effectively prevented.
[0063] Furthermore, as mentioned above, when the absorbent member 252 is compressed, air escapes to the outside of the containment vessel 204 through the air holes 257. This prevents the displacement of the absorbent member 252 from being hindered by the increase in air pressure due to air compression when the absorbent member 252 is displaced in the Y direction.
[0064] In this embodiment, the surface of the absorbent member 252 that contacts the refrigerant 206 is flat, but it is not limited to this. For example, in order to increase the surface area, the surface of the absorbent member 252 may be made uneven (the thickness of the surface may be changed according to the region (position) of the absorbent member 252), or multiple protrusions may be provided on the surface of the absorbent member 252. Also, for example, the thickness of the absorbent member 252 may be changed according to the region such that the surface region farther from each tip position of the multiple protrusions (fins) of the heat sink 205 is thicker than the surface region closer to each tip position. These points are also the same in the embodiments described later.
[0065] According to this embodiment, in a structure that cools electronic components using a refrigerant or heat conductive member, it is possible to provide an external cooling accessory that can accommodate various refrigerants, including water, and that can achieve high cooling performance without the heat conductive member and heat absorber coming into contact with each other. Therefore, according to this embodiment, it is possible to provide an external cooling accessory with high durability.
[0066] (Second Embodiment) Next, with reference to Figures 6(a) and (b), the structure of the external cooling accessory (cooling device) 300 in the second embodiment of the present invention will be described. Figures 6(a) and (b) are cross-sectional views of the containment vessel 204 as seen from the Z direction. Figure 6(a) shows the state before the refrigerant 206 in the containment vessel 204 solidifies due to low temperature, and Figure 6(b) shows the state after the refrigerant 206 has solidified and its volume has expanded.
[0067] 253 is an absorbent member in this embodiment. The absorbent member 253 is arranged on two sides of the containment container 204 in the X direction (two opposing surfaces in the X direction (the third surface and the fourth surface)). The configuration other than the arrangement of the absorbent member 253 is the same as in the first embodiment.
[0068] Let h2 be the thickness of the absorbent member 253 in the X direction before the refrigerant 206 solidifies, and let h2' be the thickness of the absorbent member 253 in the X direction after the refrigerant 206 solidifies. At this time, the absorbent member 253 is compressed in the X direction by a thickness of (h2-h2'). Similar to the first embodiment, the absorbent member 253 is made of an elastically deformable material (elastic member), such as a cushioning material, and is positioned in contact with the refrigerant 206, thereby absorbing the volume increase due to the solidification of the refrigerant 206. As a result, even when the refrigerant 206 solidifies, excessive pressure due to the expansion of the refrigerant 206 is not generated against the containment vessel 204, and deformation or damage to the containment vessel 204 can be prevented.
[0069] In this embodiment, as in the first embodiment, the heat sink 205 is fixed to the upper surface (+Y direction) side (first surface) of the external cooling accessory 300. The effect is the same as in the first embodiment.
[0070] Furthermore, the heat sink 205 has multiple protrusions (rectangular-shaped portions) that project in the first direction (-Y direction) within the refrigerant 206. The main surface (widest surface) of each of the multiple protrusions is perpendicular to the second direction (Z direction) (the normal direction of the main surface of the protrusion is the second direction). The absorbent members 253 are arranged in a plane (XY plane) parallel to the main surfaces of the protrusions of the heat sink 205 (a third direction (X direction) perpendicular to the first and second directions). That is, the absorbent members 253 are arranged on the third surface (side on the +X direction side) and the fourth surface (side on the -X direction side) that face each other in the third direction (X direction). As a result, when the refrigerant 206 during or after solidification moves in the same X direction as the direction in which the absorbent members 253 are positioned, excessive load is not applied to the heat sink 205 in the direction perpendicular to it.
[0071] In this embodiment, when the absorbent member 253 is compressed, air holes (holes through which air passes, ventilation holes) 257 may be formed on the third and fourth surfaces of the containment container 204 to release air to the outside of the containment container 204.
[0072] According to this embodiment, in a structure that cools electronic components using a refrigerant or heat conductive member, it is possible to provide an external cooling accessory that can accommodate various refrigerants, including water, and that can achieve high cooling performance without the heat conductive member and heat absorber coming into contact with each other. Therefore, according to this embodiment, it is possible to provide an external cooling accessory with high durability.
[0073] (Third embodiment) Next, with reference to Figures 7(a) and 7(b), the structure of the external cooling accessory (cooling device) 400 according to the third embodiment of the present invention will be described. Figures 7(a) and 7(b) are cross-sectional views of the containment vessel 204 as seen from the Z direction. Figure 7(a) shows the state before the refrigerant 206 in the containment vessel 204 solidifies due to low temperature, and Figure 7(b) shows the state after the refrigerant 206 has solidified and its volume has expanded.
[0074] 254 is an absorbent member in this embodiment. The absorbent member 254 is provided on the bottom surface (second surface) in the Y direction, in addition to the two sides in the X direction (third and fourth surfaces). The configuration other than the arrangement of the absorbent member 254 is the same as in the first embodiment.
[0075] Let h3 be the thickness of the absorbent member 254 in the X direction before the refrigerant 206 solidifies, and let h3' be the thickness of the absorbent member 254 in the X direction after the refrigerant 206 solidifies. At this time, the absorbent member 254 is compressed in the X direction by a thickness of (h3-h3'). Similarly, let h3a be the height of the absorbent member 254 in the Y direction, and let h3a' be the height of the absorbent member 254 in the Y direction after the refrigerant 206 solidifies. At this time, the absorbent member 254 is compressed in the Y direction by a height of (h3a-h3a'). Similar to the first and second embodiments, the absorbent member 254 is made of an elastically deformable material (elastic member), such as a cushioning material, and is positioned in contact with the refrigerant 206 to absorb the volume increase due to the solidification of the refrigerant 206. As a result, even if the refrigerant 206 solidifies, excessive pressure due to the expansion of the refrigerant 206 will not be generated in the containment vessel 204, making it possible to prevent deformation or damage to the containment vessel 204.
[0076] In this embodiment, as in the first and second embodiments, the heat sink 205 is fixed to the upper surface (+Y direction) side (first surface) of the external cooling accessory 400. The effect is the same as in the first and second embodiments.
[0077] Furthermore, the heat sink 205 has multiple protrusions (rectangular-shaped portions) that project in the first direction (-Y direction) within the refrigerant 206. The main surface (widest surface) of each of the multiple protrusions is perpendicular to the second direction (Z direction) (the normal direction of the main surface of the protrusion is the second direction). The absorbent members 254 are positioned on the second surface (bottom surface) opposite the first surface, and in the direction of the plane (XY plane) parallel to the main surface of the protrusions of the heat sink 205 (the third direction (X direction) perpendicular to the first and second directions). In other words, the absorbent members 254 are positioned on the second surface (bottom surface), and on the third surface (side on the +X direction side) and fourth surface (side on the -X direction side) that face each other in the third direction (X direction). This configuration prevents excessive load from being placed on the heat sink 205 in the orthogonal direction when the refrigerant 206, during or after solidification, moves in the same X and Y directions as the direction in which the absorbent members 254 are positioned.
[0078] In this embodiment, when the absorbent member 254 is compressed, air holes (holes through which air passes, ventilation holes) 257 for releasing air to the outside of the containment container 204 may be formed on the second, third, and fourth surfaces of the containment container 204.
[0079] According to this embodiment, in a structure that cools electronic components using a refrigerant or heat conductive member, it is possible to provide an external cooling accessory that can accommodate various refrigerants, including water, and that can achieve high cooling performance without the heat conductive member and heat absorber coming into contact with each other. Therefore, according to this embodiment, it is possible to provide an external cooling accessory with high durability.
[0080] (Fourth Embodiment) Next, with reference to Figures 8(a) and 8(b), the structure of the external cooling accessory (cooling device) 500 according to the fourth embodiment of the present invention will be described. Figures 8(a) and 8(b) are cross-sectional views of the containment vessel 304 as seen from the Z direction. Figure 7(a) shows the state before the refrigerant 206 in the containment vessel 304 solidifies due to low temperature, and Figure 7(b) shows the state after the refrigerant 206 has solidified and its volume has expanded.
[0081] 255 is a rigid body that does not elastically deform. 256 is an elastically deformable absorbent member (elastic member), such as a spring. In this embodiment, the rigid body 255 is positioned between the refrigerant 206 and the absorbent member 256. The absorbent member 256 is deformable by the movement of the rigid body 255. The configuration other than the rigid body 255 and the absorbent member 256 is the same as in the first embodiment.
[0082] When the refrigerant 206 solidifies, the rigid body 255 presses the absorbent member 256 in the Y direction, causing the height of the absorbent member 256 in the Y direction to displace. Let h4 be the height of the absorbent member 256 before the refrigerant 206 solidifies, and h4' be the height of the absorbent member 252 after the refrigerant 206 solidifies. At this time, the absorbent member 256 is compressed by a height of (h4-h4'). The elastic deformation of the absorbent member 256 makes it possible to absorb the volume increase due to the solidification of the refrigerant 206. As a result, even when the refrigerant 206 solidifies, excessive pressure due to the expansion of the refrigerant 206 is not generated against the containment vessel 304, and deformation or damage to the containment vessel 304 can be prevented.
[0083] In this embodiment, similar to the first embodiment, the heat sink 205 is fixed to the upper surface (+Y direction) of the external cooling accessory 500. On the other hand, the absorbent member 252 is positioned on the opposite, bottom surface (-Y direction). The effect is the same as in the first embodiment.
[0084] According to this embodiment, in a structure that cools electronic components using a refrigerant or heat conductive member, it is possible to provide an external cooling accessory that can accommodate various refrigerants, including water, and that can achieve high cooling performance without the heat conductive member and heat absorber coming into contact with each other. Therefore, according to this embodiment, it is possible to provide an external cooling accessory with high durability.
[0085] (Fifth embodiment) Next, with reference to Figure 9, the structure of the external cooling accessory (cooling device) 600 in the fifth embodiment of the present invention will be described. Figure 9 is a cross-sectional view of the containment vessel 404 as seen from the X direction. 404 is a containment vessel that stores the refrigerant 206. An exterior member 258 is arranged on the outside of the containment vessel 404. An air layer 259 exists between the containment vessel 404 and the exterior member 258. The rigidity of the heat sink 205 is greater than the rigidity of the containment vessel 404.
[0086] In this embodiment, when the refrigerant 206 solidifies due to low temperature and expands in volume, the containment vessel 404 undergoes elastic deformation. Furthermore, outside air can enter and exit the space of the air layer 259 through the air holes (holes through which air passes, ventilation holes) 260. This prevents excessive load from being placed on the containment vessel 404 and the exterior member 258, even in low-temperature environments, thus preventing damage to them. In this embodiment, only the air layer 259 exists between the containment vessel 404 and the exterior member 258, but this is not the only embodiment. A deformable member, such as an elastic member, may be provided between the containment vessel 404 and the exterior member 258 instead of, or together with, the air layer 259.
[0087] According to this embodiment, it is possible to use various refrigerants including water, and since air can be inhaled and exhaled through air holes provided in the exterior components, damage to each component can be prevented even in environments where the containment container expands. Therefore, according to this embodiment, a highly durable external cooling accessory can be provided.
[0088] Each embodiment disclosed includes the following configuration: (Composition 1) A cooling device that can be attached to and detached from electronic equipment, A storage vessel for storing the refrigerant, It has a heat diffusion section that transfers heat from the electronic components of the electronic device to the coolant, A cooling device characterized in that at least a portion of the containment vessel is made of a deformable member. (Configuration 2) The cooling device according to configuration 1, characterized in that the storage container has holes through which air passes. (Composition 3) The cooling device according to configuration 1 or 2, characterized in that the member is an elastic member. (Composition 4) The cooling device according to any one of configurations 1 to 3, characterized in that the member is deformable to absorb changes in the volume of the refrigerant in response to temperature. (Composition 5) The cooling device according to any one of configurations 1 to 4, characterized in that the member is in contact with the refrigerant and not in contact with the heat diffusion part. (Composition 6) The heat diffusion section is fixed to the first surface of the cooling device. The cooling device according to any one of configurations 1 to 5, characterized in that the member is arranged on a second surface facing the first surface. (Composition 7) The heat diffusion section is fixed to the first surface of the cooling device. The heat diffusion portion has a plurality of protrusions that project in the first direction, The main surface of each of the aforementioned multiple protrusions is perpendicular to the second direction, The cooling device according to any one of configurations 1 to 5, characterized in that the member is arranged on a third surface and a fourth surface that face each other in a third direction perpendicular to the first and second directions. (Composition 8) The heat diffusion section is fixed to the first surface of the cooling device. The heat diffusion portion has a plurality of protrusions that project in the first direction, The main surface of each of the aforementioned multiple protrusions is perpendicular to the second direction, The cooling device according to any one of configurations 1 to 5, characterized in that the member is arranged on a second surface facing the first surface, and on a third and fourth surface facing each other in a third direction perpendicular to the first and second directions. (Composition 9) The system further comprises a rigid body disposed between the refrigerant and the member, The cooling device according to any one of configurations 1 to 4, characterized in that the member is deformable by the movement of the rigid body. (Composition 10) A cooling device that can be attached to and detached from electronic equipment, A storage vessel for storing the refrigerant, A heat diffusion unit that transfers heat from the electronic components of the electronic device to the coolant, It has an exterior member that is positioned outside the containment container via an air layer and has holes formed therein through which air passes, A cooling device characterized in that the rigidity of the heat diffusion section is greater than the rigidity of the containment vessel. (Composition 11) The aforementioned electronic device is an imaging device, The cooling device is characterized in that it is detachable from the bottom surface of the imaging device, as described in any one of configurations 1 to 10. (Composition 12) An imaging system characterized by having the cooling device described in configuration 11 and the imaging device.
[0089] Although preferred embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of its gist. [Explanation of symbols]
[0090] 100 Camera body (electronic device) 200, 300, 400, 500, 600 External Cooling Accessories (Cooling Devices) 204, 304, 404 containment vessels 205 Heatsink (Heat Dispersion Section) 206 Refrigerant 252, 253, 254 Absorbing members (deformable members) 131 Image sensor (electronic component) 133 Electronic Components
Claims
1. A cooling device that can be attached to and detached from electronic equipment, A storage vessel for storing the refrigerant, It has a heat diffusion section that transfers heat from the electronic components of the electronic device to the coolant, A cooling device characterized in that at least a portion of the containment vessel is made of a deformable member.
2. The cooling device according to claim 1, characterized in that the storage container has holes formed therein through which air passes.
3. The cooling device according to claim 1, characterized in that the member is an elastic member.
4. The cooling device according to claim 1, characterized in that the member is deformable to absorb changes in the volume of the refrigerant in response to temperature.
5. The cooling device according to claim 1, characterized in that the member is in contact with the refrigerant and not in contact with the heat diffusion part.
6. The heat diffusion section is fixed to the first surface of the cooling device. The cooling device according to any one of claims 1 to 5, characterized in that the member is arranged on a second surface facing the first surface.
7. The heat diffusion section is fixed to the first surface of the cooling device. The heat diffusion portion has a plurality of protrusions projecting in the first direction, The main surface of each of the aforementioned multiple protrusions is perpendicular to the second direction. The cooling device according to any one of claims 1 to 5, characterized in that the member is arranged on a third surface and a fourth surface that face each other in a third direction perpendicular to the first and second directions.
8. The heat diffusion section is fixed to the first surface of the cooling device. The heat diffusion portion has a plurality of protrusions projecting in the first direction, The main surface of each of the aforementioned multiple protrusions is perpendicular to the second direction. The cooling device according to any one of claims 1 to 5, characterized in that the member is arranged on a second surface facing the first surface, and on a third surface and a fourth surface facing each other in a third direction perpendicular to the first and second directions.
9. The system further comprises a rigid body disposed between the refrigerant and the member, The cooling device according to any one of claims 1 to 4, characterized in that the member is deformable by the movement of the rigid body.
10. A cooling device that can be attached to and detached from electronic equipment, A storage vessel for storing the refrigerant, A heat diffusion unit that transfers heat from the electronic components of the electronic device to the coolant, It has an exterior member that is positioned outside the containment container via an air layer and has holes formed therein through which air passes, A cooling device characterized in that the rigidity of the heat diffusion section is greater than the rigidity of the containment vessel.
11. The aforementioned electronic device is an imaging device, The cooling device according to any one of claims 1 to 5, characterized in that the cooling device is detachable from the bottom surface of the imaging device.
12. An imaging system characterized by comprising the cooling device described in claim 11 and the imaging device.
Citation Information
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