Method for arranging heat transfer elements, electronic equipment, and heat dissipation paths.

Abstract

The present invention provides a heat transfer element, an electronic device, and a method for arranging a heat dissipation path that allows for flexible movement between a heat-generating element and a heat-dissipating element. [Solution] The heat transfer element comprises a flexible member that fills the space between a heat-generating surface of a heat-generating member and a heat-dissipating surface of a heat-dissipating member, and a plate-shaped member that contacts the flexible member and is interposed between the heat-generating surface and the heat-dissipating surface.

Description

Technical Field

[0001] The present disclosure relates to a heat transfer element, an electronic device, and a method of arranging a heat dissipation path.

Background Art

[0002] A heat transfer member that absorbs the gap between a heat generating member and a heat radiating member is known.

[0003] For example, Patent Document 1 discloses "a highly heat conductive heat transfer element mounted between a heat generating body and a heat radiating plate so that at least a part thereof abuts on the heat generating body and the heat radiating plate." The heat transfer element is formed by uniformly applying a highly heat conductive gel to both surfaces of a corrugated metal spring piece.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] By the way, in the heat transfer element disclosed in Patent Document 1, it may be difficult to move flexibly between the heat generating body and the heat radiating plate.

[0006] An object of the present disclosure is to provide a heat transfer element, an electronic device, and a method of arranging a heat dissipation path that solve the above problems.

Means for Solving the Problems

[0007] A heat transfer element according to an aspect of the present disclosure includes a flexible member that fills a space between a heat generating surface of a heat generating member and a heat radiating surface of a heat radiating member, and a plate-like member that contacts the flexible member and is interposed between the heat generating surface and the heat radiating surface.

[0008] A method for arranging a heat dissipation path according to one aspect of the present disclosure includes the steps of providing a heat-conducting flexible member and a heat-conducting plate-shaped member in contact with the flexible member and having heat-conducting properties on one of the heat-generating surface of a heat-generating member and the heat-dissipating surface of a heat-dissipating member, and providing the other of the heat-generating surface and the heat-dissipating surface such that the flexible member fills the space between the heat-generating surface of the heat-generating member and the heat-dissipating surface of the heat-dissipating member, and the plate-shaped member is interposed between the heat-generating surface and the heat-dissipating surface. [Effects of the Invention]

[0009] According to the above embodiment, the heat-generating element and the heat-dissipating element such as a heat sink can move flexibly. [Brief explanation of the drawing]

[0010] [Figure 1] This is a front view I showing an example of the electronic device related to this disclosure. [Figure 2] This is a perspective view showing an example of the configuration of the heat transfer element related to this disclosure. [Figure 3] This is a front view showing an example of the configuration of the heat transfer element related to this disclosure. [Figure 4] This figure shows the changes in the heat transfer element related to this disclosure. [Figure 5] This is flowchart I, which shows an example of the process for arranging the heat dissipation path related to this disclosure. [Figure 6] This is a perspective view I showing an example of the configuration of the heat transfer element in a modified example. [Figure 7] This is a perspective view II showing an example of the configuration of the heat transfer element in a modified example. [Figure 8] This is a perspective view III showing an example of the configuration of the heat transfer element in a modified example. [Figure 9] This is a front view II showing an example of the configuration of the heat transfer element related to this disclosure. [Figure 10] This is flowchart II, showing an example of the process for arranging the heat dissipation path related to this disclosure. [Modes for carrying out the invention]

[0011] The embodiments of this disclosure will be described below with reference to the drawings. The drawings and specific configurations used in each embodiment should not be used to interpret the disclosure. In all drawings, identical or corresponding components are denoted by the same reference numerals, and common descriptions are omitted. In this disclosure, the drawings are associated with one or more embodiments.

[0012] <First Embodiment> An embodiment of this disclosure will be described below with reference to the figures. An example of the configuration of the heat transfer element in this disclosure will be explained below with reference to Figures 1 to 4.

[0013] In this disclosure, the +X direction, -X direction, +Y direction, -Y direction, +Z direction, and -Z direction are defined as follows: The +Z direction is the direction from the heat-generating surface 10s toward the heat-dissipating surface 20s. The -Z direction is the direction opposite to the +Z direction. Hereinafter, when the +Z direction and -Z direction are not distinguished, they will simply be referred to as the "Z direction". The -X direction is the direction from the first plate-like member 32A toward the second plate-like member 32B. The +X direction is the direction opposite to the -X direction. Hereinafter, when the +X direction and -X direction are not distinguished, they will simply be referred to as the "X direction". The +Y direction and -Y direction are directions that intersect (e.g., are orthogonal to) the X direction and the Z direction. The +Y direction is the direction in which the plate-like member 32 extends. The -Y direction is the direction opposite to the +Y direction. Hereinafter, when the +Y direction and -Y direction are not distinguished, they will simply be referred to as the "Y direction". The +Z direction is an example of the "first direction". -The X direction is an example of the "second direction". +The Y direction is an example of the "third direction". -The X direction is an example of the "fourth direction". -The Z direction is an example of the "fifth direction". -The Y direction is an example of the "sixth direction".

[0014] For example, the X, Y, and Z directions may be orthogonal to each other. For example, the heat-generating surface may be a surface that aligns with the XY plane and faces the +Z direction. For example, the heat-dissipating surface may be a surface that aligns with the XY plane and faces the -Z direction.

[0015] The above expression is for convenience of explanation and does not limit the direction of the heat dissipation path from the heat generating surface 10s to the heat radiating surface 20s.

[0016] (Configuration of Electronic Device) As shown in FIG. 1, the electronic device 100 includes a heat generating member 10, a heat radiating member 20, and a heat transfer element 30. The heat generating member 10 generates heat inside the electronic device 100. Examples of the heat generating member 10 include a CENTRAL PROCESSING UNIT (hereinafter referred to as "CPU"). The heat generating member 10 has a heat generating surface 10s, and the heat transfer element 30 contacts the heat generating surface 10s. The heat generating member 10 transfers heat to the heat transfer element 30 through the heat generating surface 10s. The heat generating surface 10s in the present disclosure is a surface facing the first direction (for example, the +Z direction). The heat radiating member 20 is used as a cooling device for the heat generating member 10 provided in the electronic device 100. The heat radiating member 20 has a heat radiating surface 20s, and the heat transfer element 30 contacts the heat radiating surface 20s. For example, the heat radiating member 20 in the present disclosure is a housing having a plurality of fins. The heat of the heat generating member 10 is transferred to each fin through the heat transfer element 30. The heat radiating member 20 includes a heat conductive material. Examples of the heat conductive material included in the heat radiating member 20 include copper or aluminum.

[0017] (Configuration of Heat Transfer Element) As shown in FIG. 1, the heat transfer element 30 receives heat from the heat generating member 10 and transfers the received heat to the heat radiating member 20. As shown in FIGS. 1-3, the heat transfer element 30 includes a flexible member 31 and a plate-like member 32.

[0018] The flexible member 31 fills the space between the heat-generating surface 10s of the heat-generating member 10 and the heat-dissipating surface 20s of the heat-dissipating member 20. This allows the flexible member 31 to reduce the contact thermal resistance between the heat-generating member 10 and the heat-dissipating member 20. The flexible member 31 has a first surface 31a1 and a second surface 31a2. The first surface 31a1 faces the heat-generating surface 10s. The second surface 31a2 faces the heat-dissipating surface 20s. Through the first surface 31a1, the flexible member 31 receives heat from the heat-generating member 10. Through the second surface 31a2, the flexible member 31 transmits the heat received from the heat-generating member 10 to the heat-dissipating member 20.

[0019] The flexible member 31 is in close contact with the heat-generating surface 10s. That is, the first surface 31a1 follows the heat-generating surface 10s. The flexible member 31 is in close contact with the heat-dissipating surface 20s. That is, the second surface 31a2 follows the heat-dissipating surface 20s.

[0020] Here, the heating element 10 may have distortions or fine irregularities on its heating surface 10s. Similarly, the heat dissipation member 20 may have distortions or fine irregularities on its heat dissipation surface 20s. Therefore, when the heat-dissipating surface 20s faces the heat-generating surface 10s and the heat-dissipating surface 20 comes into contact without the flexible surface 31 in between, a fine gap may be formed between the heat-generating surface 10 and the heat-dissipating surface 20. This gap increases the contact thermal resistance between the heat-generating surface 10 and the heat-dissipating surface 20.

[0021] The flexible member 31 has heat-conducting properties. The flexible member 31 is a gel-like substance, grease, putty, or rubber.

[0022] The plate-shaped member 32 is in contact with the flexible member 31 and is interposed between the heat-generating surface 10s and the heat-dissipating surface 20s. The plate-shaped member 32 has thermal conductivity. The thermal conductivity of the plate-shaped member 32 is greater than that of the flexible member 31.

[0023] The plate-shaped member 32 is formed from ceramics, a composite material containing carbon fiber, graphite, or a metal material. As the ceramic, ceramics with a strength of 20 W / m·K or higher, such as aluminum nitride, silicon carbide, alumina, or silicon nitride, are preferred.

[0024] The plate-like member 32 includes at least one strip-shaped plate material. For example, in this disclosure, the plate-like member 32 includes a first plate-like member 32A and a second plate-like member 32B. The second plate-like member 32B is aligned with respect to the first plate-like member 32A in a second direction (e.g., the X direction). The plate-like member 32 is tiltable depending on the distance between the heat-generating surface 10s and the heat-dissipating surface 20s.

[0025] The first plate-like member 32A and the second plate-like member 32B in this disclosure are strip-shaped plate materials as described above. The longitudinal direction of the first plate-like member 32A and the second plate-like member 32B is along a third direction (e.g., the Y direction) that intersects the first and second directions. The short direction of the first plate-like member 32A is along a direction inclined with respect to the first direction. The short direction of the second plate-like member 32B may or may not be along the short direction of the first plate-like member 32A. For example, the first plate-like member 32A and the second plate-like member 32B in this disclosure are tilted in a direction inclined with respect to the first direction (e.g., the +Z direction) in the second direction (e.g., the -X direction).

[0026] (Overview of heat transfer elements) Figure 4 shows how the flexible member 31 and the plate-shaped member 32 are provided on the heating surface 10s of the heating element 10. The plate-shaped member 32 is in contact with the flexible member 31. From this state, as shown in (4-1) of Figure 4, the heat dissipation member 20 comes into contact with the flexible member 31 at its heat dissipation surface 20s. Next, as shown in (4-2) of Figure 4, the flexible member 31 is pressed against the heat dissipation member 20. To illustrate the situation in Figure 4, it is conceivable that the flexible member 31 and the plate-shaped member 32 are provided on the heating surface 10s of the heating element 10 (for example, a CPU) provided on a substrate surface, and the substrate surface is covered with the heat dissipation member 20 (for example, a housing with multiple fins) in contact with the flexible member 31. When the heat dissipation member 20 is attached to a predetermined fixing part by screws (or bolts), the plate-shaped member 32 tilts according to the distance between the heating surface 10s and the heat dissipation surface 20s. Here, as shown in Figure 4, when the distance between the heat-generating surface 10s and the heat-dissipating surface 20s is distance L1, and the distance between the heat-generating surface 10s and the heat-dissipating surface 20s after the heat-dissipating member 20 is attached is distance L2, the following can be observed. In the heat transfer element 30 of this disclosure, the plate-shaped member 32 tilts in accordance with the change in the distance between the heat-generating surface 10s and the heat-dissipating surface 20s (change from distance L1 to distance L2).

[0027] (Method of arranging heat dissipation paths) An example of the heat dissipation path arrangement method in this disclosure will be explained below with reference to Figure 5.

[0028] First, the worker places a heat-conducting flexible member 31 and a heat-conducting plate-shaped member 32 in contact with the flexible member 31 and also having heat-conducting properties on either the heat-generating surface 10s of the heat-generating member 10 or the heat-dissipating surface 20s of the heat-dissipating member 20 (Step ST10: Step of providing the flexible member and the plate-shaped member).

[0029] Next, the worker installs the other heat-generating surface 10s and the heat-dissipating surface 20s (Step ST11: Step of installing the other heat-generating surface and the heat-dissipating surface). At that time, the worker places the other of the heating surface 10s and the heat dissipation surface 20s such that the flexible member 31 fills the space between the heating surface 10s of the heating surface 10 and the heat dissipation surface 20s of the heat dissipation surface 20, and the plate-shaped member 32 is interposed between the heating surface 10s and the heat dissipation surface 20s. Here, the heat transfer element 30 absorbs the gap between the heat generating element 10 and the heat dissipating element 20. (Complete)

[0030] (Mechanism of Action and Effects) The heat transfer element according to this disclosure comprises a heat-conducting flexible member 31 that fills the space between the heat-generating surface 10s of the heat-generating member 10 and the heat-dissipating surface 20s of the heat-dissipating member 20, and a heat-conducting plate-shaped member 32 that contacts the flexible member 31 and is interposed between the heat-generating surface 10s and the heat-dissipating surface 20s. The flexible member 31 in the heat transfer element 30 fills the space between the heat-generating surface 10s and the heat-dissipating surface 20s, making the heat transfer element 30 more likely to absorb the gap between the heat-generating member 10 and the heat-dissipating member 20. Therefore, the heat transfer element according to this disclosure is easily flexible between the heat-generating element and the heat sink.

[0031] Here, as Comparative Example 1, we consider a thermal interface material (TIM) that fills the space between the heat-generating surface 10s and the heat-dissipating surface 20s. Paste, gel, or pad-like TIMs have particles of metal or metal oxide with high thermal conductivity mixed into the base material. As the proportion of these particles in the TIM increases, the thermal conductivity of the TIM increases. However, as the proportion of these particles in the TIM increases, the flexibility of the TIM may decrease. This decrease in flexibility may lead to a decrease in the adhesion of the TIM to the heat-generating surface 10 and / or the heat-dissipating surface 20. This decrease in adhesion may lead to a decrease in the contact area between the TIM and the heat-generating surface 10 and / or the heat-dissipating surface 20. In this case, it becomes more difficult to reduce the contact pressure between the TIM and the heat-generating surface 10 and / or the heat-dissipating surface 20. Depending on the magnitude of the contact pressure, buckling may occur in the heat-generating surface 10 and / or the heat-dissipating surface 20. Furthermore, the contact thermal resistance between the TIM and the heat-generating element 10 and / or the heat-dissipating element 20 may increase.

[0032] In contrast, the heat transfer element according to this disclosure allows the flexibility of the heat transfer element 30, which includes a flexible member 31, to be appropriately changed by interposing a plate-shaped member 32 containing any number of plate materials between the heat-generating surface 10s and the heat-dissipating surface 20s. As a result, the heat transfer element 30 is better able to absorb the gap between the heat-generating element 10 and the heat-dissipating element 20. In addition, because the flexibility of the heat transfer element 30 can be changed as needed, the heat transfer element 30 can easily adhere to the heat-generating surface 10s. Therefore, the contact pressure between the heat transfer element 30 and the heat-generating member 10 is reduced. For the same reason, the heat transfer element 30 can easily adhere to the heat-dissipating surface 20s. Therefore, the contact pressure between the heat transfer element 30 and the heat-dissipating member 20 is reduced. The close contact of the heat transfer element 30 reduces the contact thermal resistance between the heat generating element 10 and the heat dissipating element 20.

[0033] Furthermore, as Comparative Example 2, we consider a case in which the TIM is placed on a heat-generating element 10 (e.g., a CPU) provided on a substrate surface, and assembly is performed with a heat-dissipating element 20 (e.g., a housing with multiple fins) in contact with the TIM. The gap between the heat-generating element 10 and the heat-dissipating element 20 may change depending on the dimensional tolerances of the heat-generating element 10 and the heat-dissipating element 20, respectively.

[0034] In contrast, the heat transfer element according to this disclosure fills the space between the heat-generating surface 10s and the heat-dissipating surface 20s with a flexible member 31, and interposes a plate-like member 32 containing any number of plate materials between the heat-generating surface 10s and the heat-dissipating surface 20s, thereby allowing the flexibility of the heat transfer element 30 to be appropriately changed. The heat transfer element 30 in this disclosure is better able to absorb the gap between the heat-generating element 10 and the heat-dissipating element 20, which is said to be not uniquely determined by assembly.

[0035] In addition to the above configuration, the heat transfer element 30 of this disclosure further provides the effect that "the plate-shaped member 32 includes a first plate-shaped member 32A and a second plate-shaped member 32B, and when the direction from the heat-generating surface 10s toward the heat-dissipating surface 20s is defined as the first direction and the direction intersecting the first direction is defined as the second direction, the first plate-shaped member 32A and the second plate-shaped member 32B are tilted in a direction that is inclined toward the second direction (for example, the -X direction) with respect to the first direction (for example, the +Z direction)," thereby "the flexibility of the heat transfer element 30 can be appropriately changed depending on the degree of tilting of the plate-shaped member 32."

[0036] In addition to the above configuration, the heat transfer element 30 of this disclosure also has the effect that, "the second plate-shaped member 32B is aligned with the first plate-shaped member 32A in the second direction," which makes it easier to adjust the tilt of the plate-shaped member 32 and to change the flexibility of the heat transfer element 30 as needed.

[0037] In addition to the above configuration, the heat transfer element of this disclosure has the following effects because "the plate-shaped member 32 can be tilted according to the distance between the heat-generating surface 10s and the heat-dissipating surface 20s": The flexibility of the heat transfer element 30 changes appropriately by tilting the plate-shaped member 32 in the heat transfer element 30. The heat transfer element 30 is better able to absorb the gap between the heat-generating member 10 and the heat-dissipating member 20.

[0038] In addition to the above configuration, the heat transfer element 30 of this disclosure also has the effect that "the heat transfer element 30 is more able to absorb the gap between the heat generating element 10 and the heat dissipating element 20" because "the flexible member 31 is a gel-like substance, grease, putty, or rubber."

[0039] In addition to the above configuration, the heat transfer element 30 of this disclosure also has the effect that "the thermal conductivity of the plate-shaped member 32 is greater than the thermal conductivity of the flexible member 31," thereby "the thermal conductivity of the heat transfer element 30, in which plate-shaped members 32 containing any number of plate materials are interposed between the heat-generating surface 10s and the heat-dissipating surface 20s in the flexible member 31, tends to be greater than the thermal conductivity of the flexible member 31."

[0040] The electronic device 100 of this disclosure comprises "the heat transfer element, the heat generating member 10, and the heat dissipation member 20, wherein the heat dissipation member 20 is a housing," thereby providing the following effects. The heat transfer element 30 in the electronic device 100 includes a heat-conducting flexible member 31 that fills the space between the heat-generating surface 10s of the heat-generating element 10 and the heat-dissipating surface 20s of the housing, and a heat-conducting plate-shaped member 32 that contacts the flexible member 31 and is interposed between the heat-generating surface 10s and the heat-dissipating surface 20s. The flexible member 31 in the heat transfer element 30 fills the space between the heat-generating surface 10s and the heat-dissipating surface 20s, making the heat transfer element 30 more likely to absorb the gap between the heat-generating element 10 and the housing. Therefore, in the electronic device relating to this disclosure, the heat transfer element can move flexibly between the heat generating element and the heat sink.

[0041] (Variation 1) The plate-like member 32 in the above disclosure includes a first plate-like member 32A and a second plate-like member 32B. The second plate-like member 32B is aligned with respect to the first plate-like member 32A in a second direction (e.g., the -X direction). Furthermore, the first plate-like member 32A and the second plate-like member 32B are strip-shaped plate-like members, and the longitudinal direction of the first plate-like member 32A and the second plate-like member 32B is along a third direction (e.g., the +Y direction) that intersects the first and second directions. In contrast to these, in this modified example, the plate-like member 32a includes a first plate-like member 32Aa and a second plate-like member 32Ba. The plate-like member 32a is identical to the plate-like member 32, except for the following characteristics. As shown in Figure 6, the second plate-like member 32Ba is aligned with respect to the first plate-like member 32Aa in a third direction (for example, the +Y direction). The first plate-like member 32Aa and the second plate-like member 32Ba are strip-shaped plate-like members. Here, the longitudinal dimensions of the first plate-shaped member 32Aa and the second plate-shaped member 32Ba in the plate-shaped member 32a are smaller than the longitudinal dimensions of the first plate-shaped member 32A and the second plate-shaped member 32B. The short-length directions of the first plate-like member 32Aa and the second plate-like member 32Ba are aligned with a third direction (for example, the +Y direction) that intersects the first and second directions. The longitudinal direction of the first plate-like member 32Aa is aligned with a direction inclined with respect to the first direction. The longitudinal direction of the second plate-like member 32Ba may or may not be aligned with the longitudinal direction of the first plate-like member 32Aa. In this modified example, the heat transfer element 30a equipped with the plate-shaped member 32a has the following effect because "the second plate-shaped member 32Ba is aligned with respect to the first plate-shaped member 32Aa in a third direction intersecting the first and second directions." The second plate-shaped member 32Ba and the first plate-shaped member 32Aa readily absorb strain and fine irregularities on the heat-generating surface 10s and / or the heat-dissipating surface 20s. The heat transfer element 30a has an advantage when such strain and irregularities are present in the third direction.

[0042] (Modification 2) In this modified example, the plate-like member 32a in Modification Example 1 further includes a third plate-like member 32Ca. As shown in Figure 7, the third plate-like member 32Ca is tilted in a direction that is inclined in a fourth direction (for example, the +X direction) opposite to the second direction with respect to the first direction. In addition, the third plate-like member 32Ca in this modified example is aligned with the first plate-like member 32Aa in the fourth direction (for example, the +X direction). In this modified example, the heat transfer element 30a equipped with a third plate-shaped member 32Ca has the following effects: "The plate-shaped member 32a further includes a third plate-shaped member 32Ca, and the third plate-shaped member 32Ca is tilted in a direction that is inclined in a fourth direction with respect to the first direction, and the fourth direction is opposite to the second direction." As a result, the third plate-shaped member 32Ca is tilted in the opposite direction to the second plate-shaped member 32Ba and the first plate-shaped member 32Aa, the flexible member 31 is less likely to tilt in a predetermined direction. The flexibility of the heat transfer element 30a can be more easily changed by appropriately setting the number of third plate-shaped members 32Ca relative to the second plate-shaped member 32Ba and the first plate-shaped member 32Aa. Furthermore, in the heat transfer element 30a equipped with the third plate-shaped member 32Ca in this modified example, it is stated that "the third plate-shaped member 32Ca is aligned in the fourth direction with respect to the first plate-shaped member 32Aa," but this is not limited to this. For example, the third plate-shaped member 32Ca may be aligned in the first direction with respect to the first plate-shaped member 32Aa. Furthermore, the heat transfer element 30 disclosed above may further include a third plate-shaped member 32Ca.

[0043] (Variation 3) In this modified example, the plate-like member 32 further includes a third plate-like member 32C. As shown in Figure 8, the third plate-like member 32C may be aligned with respect to the first plate-like member 32A in the first direction (for example, the +Z direction). Furthermore, the heat transfer element 30a disclosed above may further include a third plate-shaped member 32C. In that case, "first plate-shaped member 32A" shall be read as "first plate-shaped member 32Aa" and applied mutatis mutandis.

[0044] (Modification 4) For example, the second plate-shaped member 32B may face the first plate-shaped member 32A with the third plate-shaped member 32C in between. Similarly, the second plate-shaped member 32Ba may face the first plate-shaped member 32Aa with the third plate-shaped member 32Ca in between. By appropriately setting the number of third plate-shaped members (third plate-shaped member 32Ca, third plate-shaped member 32C) relative to the second plate-shaped members (second plate-shaped member 32B, second plate-shaped member 32Ba) and the first plate-shaped members (first plate-shaped member 32A, first plate-shaped member 32Aa), the flexibility of the heat transfer elements (heat transfer elements 30a, heat transfer elements 30) can be more easily modified.

[0045] (Variation 5) For example, the plate-shaped members (plate-shaped members 32a, plate-shaped members 32) may be in direct contact with the heat-generating member 10 and / or the heat-dissipating member 20. In this case, the heat dissipation efficiency of the heat transfer elements (heat transfer elements 30a, heat transfer elements 30) will be improved.

[0046] (Experimental variation 6) For example, the plate-shaped members (plate-shaped member 32a, plate-shaped member 32) may be enclosed within the flexible member 31.

[0047] <Second Embodiment> An embodiment of this disclosure will be described below with reference to the figures.

[0048] (composition) As shown in Figure 9, the heat transfer element 30m comprises a heat-conducting flexible member 31m that fills the space between the heat-generating surface 10sm of the heat-generating member and the heat-dissipating surface 20sm of the heat-dissipating member, and a heat-conducting plate-shaped member 32m that contacts the flexible member 31m and is interposed between the heat-generating surface 10sm and the heat-dissipating surface 20sm.

[0049] (Mechanism of Action and Effects) In the heat transfer element 30m of this disclosure, the flexible member 31m fills the space between the heat-generating surface 10sm and the heat-dissipating surface 20sm, so that the heat transfer element 30m can easily absorb the gap between the heat-generating member and the heat-dissipating member. Therefore, the heat transfer element according to this disclosure is easily flexible between the heat-generating element and the heat sink.

[0050] <Third Embodiment> An embodiment of this disclosure will be described below with reference to the figures.

[0051] The method for arranging a heat dissipation path includes the steps of providing a heat-conducting flexible member and a heat-conducting plate-shaped member that is in contact with the flexible member and is also heat-conducting on one of the heat-generating surface of the heat-generating member and the heat-dissipating surface of the heat-dissipating member (step ST10m: step of providing the flexible member and the plate-shaped member), and providing the other of the heat-generating surface and the heat-dissipating surface such that the flexible member fills the space between the heat-generating surface of the heat-generating member and the heat-dissipating surface of the heat-dissipating member, and the plate-shaped member is interposed between the heat-generating surface and the heat-dissipating surface (step ST11m: step of providing the other of the heat-generating surface and the heat-dissipating surface).

[0052] (Mechanism of Action and Effects) In the heat dissipation path arrangement method of this disclosure, a heat-conducting flexible member and a heat-conducting plate-shaped member that is in contact with the flexible member are provided on one of the heat-generating surface of the heat-generating member and the heat-dissipating surface of the heat-dissipating member. The other heat-generating surface and heat-dissipating surface are provided such that the flexible member fills the space between the heat-generating surface of the heat-generating member and the heat-dissipating surface of the heat-dissipating member, and the plate-shaped member is interposed between the heat-generating surface and the heat-dissipating surface. Because the flexible member fills the space between the heat-generating surface and the heat-dissipating surface, the arranged flexible member and plate-shaped member are able to easily absorb the gap between the heat-generating surface and the heat-dissipating surface. Therefore, in the heat dissipation path arrangement method according to this disclosure, the arranged flexible member and plate-shaped member can move flexibly between the heat-generating element and the heat sink. [Examples]

[0053] The effects of this disclosure will be further explained in detail below with reference to examples. The conditions in the examples are just one example of conditions adopted to confirm the feasibility and effectiveness of this disclosure, and this disclosure is not limited to this one example of conditions. This disclosure may adopt various conditions as long as they do not depart from the gist of this disclosure and achieve the objectives of this disclosure.

[0054] The thermal conductivity in the first direction of a heat transfer element, which uses a flexible member 31 as a base material and encloses a plate-shaped member 32, was analyzed. The main analysis conditions are shown below.

[0055] (Flexible material) Material: Gel Thermal conductivity: 5 W / m·K Dimensions: 25mm x 25mm x 2mm

[0056] (Plate-shaped member) Material: Copper Thermal conductivity: 400 W / m·K Dimensions: 25mm x 2.63mm x 0.2mm Number of sheets: 16

[0057] (Analysis results) Thermal conductivity of the heat transfer element 30 in the first direction: 36.0 W / m·K

[0058] Analysis of the thermal conductivity of the heat transfer element 30, which contains a metal plate within its substrate, revealed that the thermal conductivity of the heat transfer element 30 was approximately seven times that of the substrate, as described above. This demonstrates the superiority of the heat transfer element 30 over using a gel material alone to fill the space between the heat-generating surface 10s and the heat-dissipating surface 20s.

[0059] Although the present disclosure has been described above with reference to embodiments, the present disclosure is not limited to the embodiments described above. Various modifications to the structure and details of the present disclosure can be made as can be understood by those skilled in the art within the scope of the present disclosure. Furthermore, each embodiment can be combined with other embodiments as appropriate.

[0060] Some or all of the above embodiments may also be described as follows, but are not limited to the following:

[0061] (Note 1) A flexible member having heat conductivity fills the space between the heat-generating surface of the heat-generating component and the heat-dissipating surface of the heat-dissipating component. A heat-conducting plate-shaped member that contacts the flexible member and is interposed between the heat-generating surface and the heat-dissipating surface, Equipped with, Heat transfer element.

[0062] (Note 2) The plate-like member includes a first plate-like member and a second plate-like member. When the direction from the heat-generating surface toward the heat-dissipating surface is defined as the first direction, and the direction intersecting the first direction is defined as the second direction, The first plate-shaped member and the second plate-shaped member are tilted in a direction that is inclined in the second direction with respect to the first direction. The heat transfer element described in Appendix 1.

[0063] (Note 3) The second plate-shaped member is aligned with respect to the first plate-shaped member in the second direction, The heat transfer element described in Appendix 2.

[0064] (Note 4) The second plate-shaped member is arranged in a third direction intersecting the first and second directions with respect to the first plate-shaped member, The heat transfer element described in Appendix 2.

[0065] (Note 5) The plate-like member further includes a third plate-like member, The third plate-like member is tilted in a direction that is inclined in a fourth direction with respect to the first direction. The fourth direction is opposite to the second direction. A heat transfer element described in any one of the appendices 2 through 4.

[0066] (Note 6) The third plate-shaped member is aligned with respect to the first plate-shaped member in the fourth direction, The heat transfer element described in Appendix 5.

[0067] (Note 7) The second plate-shaped member is positioned opposite the first plate-shaped member, with the third plate-shaped member in between. The heat transfer element described in Appendix 5.

[0068] (Note 8) The third plate-shaped member is aligned with respect to the first plate-shaped member in the first direction, The heat transfer element described in Appendix 5.

[0069] (Note 9) The plate-shaped member can be tilted depending on the distance between the heat-generating surface and the heat-dissipating surface. A heat transfer element described in any one of the appendices 1 through 8.

[0070] (Note 10) The flexible member is a gel-like substance, grease, putty, or rubber. A heat transfer element described in any one of the appendices 1 through 9.

[0071] (Note 11) The thermal conductivity of the plate-shaped member is greater than that of the flexible member. A heat transfer element as described in either Appendix 1 or Appendix 10.

[0072] (Note 12) A heat transfer element described in any one of the appendices 1 to 11, The aforementioned heating element, The heat dissipation member and, Equipped with, The heat dissipation member is a housing. electronic equipment.

[0073] (Note 13) The steps include providing a heat-conducting flexible member and a heat-conducting plate-shaped member that contacts the flexible member and also has heat-conducting properties on either the heat-generating surface of the heat-generating member or the heat-dissipating surface of the heat-dissipating member, The step of providing the other of the heating surface and the heat dissipation surface such that the flexible member fills the space between the heating surface of the heating element and the heat dissipation surface of the heat dissipation element, and the plate-shaped member is interposed between the heating surface and the heat dissipation surface, including, Method for arranging heat dissipation paths.

[0074] (Note 14) The plate-like member includes a first plate-like member and a second plate-like member. When the direction from the heat-generating surface toward the heat-dissipating surface is defined as the first direction, and the direction intersecting the first direction is defined as the second direction, The first plate-shaped member and the second plate-shaped member are tilted in a direction that is inclined in the second direction with respect to the first direction. The method for arranging the heat dissipation path as described in Appendix 13.

[0075] (Note 15) The second plate-shaped member is aligned with respect to the first plate-shaped member in the second direction, The method for arranging the heat dissipation path as described in Appendix 14.

[0076] (Note 16) The second plate-shaped member is arranged in a third direction intersecting the first and second directions with respect to the first plate-shaped member, The method for arranging the heat dissipation path as described in Appendix 14.

[0077] (Note 17) The plate-like member further includes a third plate-like member, The third plate-like member is tilted in a direction that is inclined in a fourth direction with respect to the first direction. The fourth direction is opposite to the second direction. The method of arranging the heat dissipation path as described in any one of the appendices 14 to 16.

[0078] (Note 18) The third plate-shaped member is aligned with respect to the first plate-shaped member in the fourth direction, The method for arranging the heat dissipation path as described in Appendix 17.

[0079] (Note 19) The second plate-shaped member is positioned opposite the first plate-shaped member, with the third plate-shaped member in between. The method for arranging the heat dissipation path as described in Appendix 17.

[0080] (Note 20) The third plate-shaped member is aligned with respect to the first plate-shaped member in the first direction, The method for arranging the heat dissipation path as described in Appendix 17.

[0081] (Note 21) The plate-shaped member can be tilted depending on the distance between the heat-generating surface and the heat-dissipating surface. The method of arranging the heat dissipation path as described in any one of the appendices 13 to 20.

[0082] (Note 22) The flexible member is a gel-like substance, grease, putty, or rubber. The method of arranging the heat dissipation path as described in any one of the appendices 13 to 21.

[0083] (Note 23) The thermal conductivity of the plate-shaped member is greater than that of the flexible member. A method for arranging a heat dissipation path as described in either Appendix 13 or Appendix 22. [Explanation of symbols]

[0084] 100 Electronic equipment 10 Heat-generating components 10s heating surface 20 Heat dissipation components 20s heat dissipation surface 30 Heat transfer elements 30a Heat transfer element 31 Flexible material 31a1 Front page 31a2 Second side 32 Plate-shaped member 32A First plate-shaped member 32B Second plate-shaped member 32C Third plate-shaped member 32a Plate-shaped member 32Aa First plate-shaped member 32Ba Second plate-shaped member 32Ca Third plate-shaped member L1 distance L2 distance 10m heating surface 20m heat dissipation surface 30m heat transfer element 31m flexible material 32m plate-shaped member

Claims

1. A flexible member having heat conductivity fills the space between the heat-generating surface of the heat-generating component and the heat-dissipating surface of the heat-dissipating component. A heat-conducting plate-shaped member that contacts the flexible member and is interposed between the heat-generating surface and the heat-dissipating surface, Equipped with, Heat transfer element.

2. The plate-like member includes a first plate-like member and a second plate-like member. When the direction from the heat-generating surface toward the heat-dissipating surface is defined as the first direction, and the direction intersecting the first direction is defined as the second direction, The first plate-shaped member and the second plate-shaped member are tilted in a direction that is inclined in the second direction with respect to the first direction. The heat transfer element according to claim 1.

3. The second plate-shaped member is aligned with respect to the first plate-shaped member in the second direction, The heat transfer element according to claim 2.

4. The second plate-shaped member is arranged in a third direction intersecting the first and second directions with respect to the first plate-shaped member, The heat transfer element according to claim 2.

5. The plate-like member further includes a third plate-like member, The third plate-like member is tilted in a direction that is inclined in a fourth direction with respect to the first direction. The fourth direction is opposite to the second direction. A heat transfer element according to any one of claims 2 to 4.

6. The third plate-shaped member is aligned with respect to the first plate-shaped member in the fourth direction, The heat transfer element according to claim 5.

7. The plate-shaped member can be tilted depending on the distance between the heat-generating surface and the heat-dissipating surface. A heat transfer element according to claim 1 or claim 2.

8. The thermal conductivity of the plate-shaped member is greater than that of the flexible member. A heat transfer element according to claim 1 or claim 2.

9. A heat transfer element according to claim 1 or claim 2, The aforementioned heating element, The heat dissipation member and, Equipped with, The heat dissipation member is a housing. electronic equipment.

10. The steps include providing a heat-conducting flexible member and a heat-conducting plate-shaped member that contacts the flexible member and also has heat-conducting properties on either the heat-generating surface of the heat-generating member or the heat-dissipating surface of the heat-dissipating member, The step of providing the other of the heating surface and the heat dissipation surface such that the flexible member fills the space between the heating surface of the heating element and the heat dissipation surface of the heat dissipation element, and the plate-shaped member is interposed between the heating surface and the heat dissipation surface, including, Method for arranging heat dissipation paths.

Images