electronic machinery
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- CANON KK
- Filing Date
- 2025-09-11
- Publication Date
- 2026-04-20
AI Technical Summary
Electronic devices with resin outer casings are prone to electrostatic discharge, which can cause noise superimposition on wiring boards and potentially damage ICs, despite existing grounding configurations.
A conductive member is positioned between gaps in the exterior and the wiring board, with a first part having an open end and a second part facing it via an insulator, ensuring the shortest distance to the first part is shorter than to the second part, effectively canceling electromagnetic fields and reducing noise superimposition.
This configuration enhances resistance to electrostatic discharge, minimizing malfunctions and damage to ICs by suppressing noise superimposition on wiring patterns, thereby improving the device's electrostatic discharge resistance.
Smart Images

Figure 2026067369000001_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to electronic devices.
Background Art
[0002] Due to reasons such as weight reduction or design properties, electronic devices having resin outer casings are known. There are gaps at various locations in the outer casing. When static electricity enters the inside of the outer casing through these gaps, the static electricity is discharged to the wiring pattern of the wiring board arranged near the gaps, and there is a risk that the IC connected to the wiring pattern malfunctions or the IC is damaged. Patent Document 1 discloses arranging a grounded conductive linear member near the gap of the outer casing.
Prior Art Documents
Patent Documents
[0003]
Patent Document 1
Summary of the Invention
Problems to be Solved by the Invention
[0004] However, even with the configuration disclosed in Patent Document 1, there is a risk that noise due to electrostatic discharge is superimposed on the wiring board, and further improvement is required.
Means for Solving the Problems
[0005] The present disclosure provides a technique for improving resistance to electrostatic discharge.
[0006] One aspect of the present disclosure is an electronic device comprising a resin exterior, a wiring board disposed inside the exterior, and a conductive member disposed inside the exterior, wherein the conductive member has a portion disposed between the gap in the exterior and the wiring board, the portion having a first part having an open end at one end in a first direction, and a second part that is continuous with the other end of the first part in the first direction and, in a second direction intersecting the first direction, at least a portion of which faces the first part via an insulator, and the first distance, which is the shortest distance between the gap in the exterior and the first part, is shorter than the second distance, which is the shortest distance between the gap in the exterior and the second part. [Effects of the Invention]
[0007] According to this disclosure, a technology is provided that improves resistance to electrostatic discharge. [Brief explanation of the drawing]
[0008] [Figure 1] (a) is a perspective view of the electronic device according to the first embodiment. (b) is a cross-sectional view of a part of the electronic device according to the first embodiment. [Figure 2] (a) is an explanatory diagram of the vicinity of the shielded portion of the operating unit according to the first embodiment. (b) is an explanatory diagram of the vicinity of the shielded portion of the operating unit according to the first embodiment. [Figure 3] This is an explanatory diagram for electrostatic testing of the operating unit according to the first embodiment. [Figure 4] This is a cross-sectional view of a part of the electronic device according to the second embodiment. [Figure 5] This is a cross-sectional view of a part of the electronic device according to the third embodiment. [Figure 6] This is a cross-sectional view of a part of the electronic device used as an example. [Figure 7] This graph shows the experimental results for Example 1 and the comparative example. [Modes for carrying out the invention]
[0009] The embodiments of this disclosure will be described in detail below with reference to the drawings. In each drawing, the same reference numerals are used for the same components, and redundant explanations are omitted.
[0010] [First Embodiment] Figure 1(a) is a perspective view of the electronic device 1 according to the first embodiment. Hereinafter, the electronic device 1, which is an electronic device, will be described using an office machine that is an image forming device such as a printer, copier, or multifunction device as an example. The electronic device 1 comprises an operating unit 20 and an operation unit 10 provided on the operating unit 20. The operation unit 10 is provided for operating the operating unit 20. In the first embodiment, the operating unit 20 is an image forming device that forms an image on a sheet such as paper. The operating unit 20 comprises an exterior and a metal frame 200 arranged inside the exterior. The frame 200 is the metal housing of the operating unit 20.
[0011] Figure 1(b) is a cross-sectional view of a part of the electronic device 1 according to the first embodiment. Figure 1(b) shows a cross-section of the operating unit 10, which is part of the electronic device 1.
[0012] In the following description of the operation unit 10, directions are indicated by the XYZ coordinate system. The X, Y, and Z axes intersect each other. The X, Y, and Z axes can be orthogonal to each other. The XYZ coordinate system can be a Cartesian coordinate system. The direction of the X axis is also called the X direction, the direction of the Y axis is also called the Y direction, and the direction of the Z axis is also called the Z direction. For example, when referring to the positive direction of the X axis, it refers to the same direction as indicated by the X-axis arrow in the illustrated coordinate system, and when referring to the negative direction of the X axis, it refers to the direction 180° opposite to the direction indicated by the X-axis arrow in the illustrated coordinate system. Furthermore, when simply referring to the X direction, it refers to the direction parallel to the X axis, regardless of whether it is the same as or different from the direction indicated by the X-axis arrow in the illustrated coordinate system. The same applies to the Y and Z axes other than the X axis. Furthermore, for example, a virtual plane containing the X and Y axes is expressed as the XY plane.
[0013] The operating unit 10 is equipped with a resin exterior 100. The exterior 100 has an upper cover 101 and a lower cover 102. The lower cover 102 is an example of a first cover, and the upper cover 101 is an example of a second cover. The lower cover 102 has a bottom plate portion and a side wall portion that extends in the positive Z-axis direction relative to the bottom plate portion. The upper cover 101 has a top plate portion and a side wall portion that extends in the negative Z-axis direction relative to the top plate portion. The side wall 150 of the exterior 100 is formed by the engagement of the side wall portion of the upper cover 101 and the side wall portion of the lower cover 102.
[0014] The operating unit 10 also includes a touch panel display 130, which includes a touch panel 116 and a liquid crystal display 117, a button 118, wiring boards 103 and 104, and a conductive member 112. The touch panel display 130 and the button 118 are fixed to the top plate portion of the upper cover 101. The wiring boards 103 and 104 and the conductive member 112 are located inside the outer casing 100. The touch panel display 130 may be electrically connected to either the wiring board 103 or 104, or the touch panel display 130 may be electrically connected to the operating unit 20.
[0015] Here, the direction perpendicular to the touch surface (main surface) of the touch panel display 130 is defined as the Z direction. The Z direction is also the height direction of the side wall 150 of the outer casing 100. Furthermore, the Z direction is also the direction perpendicular to the main surface of the wiring board 103. The Z direction is an example of a first direction. The X direction is an example of a second direction. The Y direction is an example of a third direction.
[0016] On wiring board 103, switch 119 and connector 107 are mounted. On wiring board 104, IC 110 and connector 108 are mounted. One end of cable 109 is connected to connector 107, and the other end of cable 109 is connected to connector 108. Thus, wiring board 103 and wiring board 104 are electrically connected via cable 109. On wiring board 103, wiring pattern 105 for electrically connecting switch 119 and connector 107 is arranged, and on wiring board 104, wiring pattern 106 for electrically connecting IC 110 and connector 108 is arranged. Each of wiring boards 103 and 104 is a rectangular wiring board when viewed in the Z direction, that is, in plan view.
[0017] Switch 119 faces button 118 in the Z direction. Switch 119 is, for example, a tact switch. When button 118 is pressed by the user, button 118 contacts switch 119 and switch 119 turns on. Also, when the user removes a finger from button 118, button 118 separates from switch 119 and switch 119 turns off.
[0018] The ON / OFF signal of switch 119 is transmitted to IC 110 via wiring pattern 105 of wiring board 103, connector 107, cable 10, connector 108, and wiring pattern 106 of wiring board 104, and the ON / OFF state of switch 119 is read by IC 110. Note that IC 110 may be configured to control touch panel display 130.
[0019] Wiring boards 103 and 104 are fixed to conductive fixing plate 111 with screws or the like. Thus, a ground pattern (not shown) of wiring boards 103 and 104 is electrically connected to fixing plate 111. Fixing plate 111 is fixed to conductive member 112 with screws or the like. Thus, fixing plate 111 is electrically connected to conductive member 112.
[0020] The conductive member 112 is connected to the metal frame 200 of the operation unit 20 via a grounding member 113. Thereby, the conductive member 112 and the ground patterns of the wiring boards 103 and 104 are electrically connected to the frame 200. The frame 200 is grounded to the ground by an earth wire or the like.
[0021] In the first embodiment, the fixing plate 111 and the conductive member 112 are separate bodies and are connected by screws or the like, but the present invention is not limited to this. For example, the fixing plate 111 and the conductive member 112 may be integrally formed of a single metal plate. Also, in the present embodiment, the grounding member 113 is also separate from the fixing plate 111 and the conductive member 112, but may be integrally formed of a single metal plate as well. Note that the conductive member 112 may be a member such as a metal sheet or a film formed by plating or the like on the surface of a resin member (not shown) instead of a metal plate. Also, the conductive member 112 is not limited to a metal member, and may be a conductive member such as a conductive carbon sheet or a conductive resin member.
[0022] The lower cover 102 is fixed to at least the conductive member 112 by screws or the like. The conductive member 112 is fixed to the frame 200 via the grounding member 113. The upper cover 101 is fixed to the lower cover 102 by engaging with the lower cover 102. Due to variations in the manufacture of the operation unit 10 or the like, a gap 114 is formed along the outer periphery of the exterior 100 between the side wall portion of the lower cover 102 and the side wall portion of the upper cover 101. Thus, in the first embodiment, the gap 114 is formed in the side wall 150 of the exterior 100.
[0023] Note that in addition to the gap 114, gaps also exist around, for example, the touch panel display 130, the button 118, and LEDs (not shown) in the exterior 100, but the description will focus on the gap 114 closest to the wiring board 103.
[0024] The conductive member 112 is formed by bending a metal plate. In the first embodiment, the conductive member 112 has a base portion 112E and a shielding portion 120. The shielding portion 120 is continuous with the base portion 112E.
[0025] The base portion 112E is formed, for example, in the shape of a flat plate parallel to the XY plane. The base portion 112E may have irregularities or through holes. The base portion 112E faces the respective main surfaces (mounting surfaces) of the wiring boards 103 and 104 in the Z direction. The shielding portion 120 is continuous with the X-direction end of the base portion 112E via a bent portion 112D. The grounding member 113 is connected to the approximate center of the base portion 112E. The bent portion 112D is formed, for example, by bending. That is, the shielding portion 120 is bent in the positive Z-axis direction at the bent portion 112D relative to the base portion 112E.
[0026] The shielding portion 120 is positioned between the gap 114 and the wiring board 103 in the X direction. In the X direction, one of the four end faces 1031 of the wiring board 103 faces the side of the shielding portion 120. The end face 1031 extends in the Y direction, with the Z direction as its short side and the Y direction as its long side. The short side of the end face 1031 is also the thickness direction of the wiring board 103, and the long side of the end face 1031 is also the width direction of the wiring board 103.
[0027] In an electrostatic discharge test (air discharge) of the operating unit 10, when a charged metal rod or the like probe is brought close to the gap 114 from the outside of the casing 100, static electricity is discharged from the probe toward the gap 114. The static electricity discharged into the gap 114 flows along the defining surface 140 of the casing 100 that defines the gap 114 and propagates into the space inside the casing 100. The static electricity that enters the space inside the casing 100 through the gap 114 is discharged to the shielding part 120, preventing it from being discharged to the wiring board 103. In other words, the shielding part 120 is for shielding static electricity that would be directly discharged from the gap 114 to the wiring board 103. The static electricity discharged to the shielding part 120 becomes an electric current and flows from the shielding part 120 to the base 112E, and from the base 112E flows to the earth via the grounding member 113 and the frame 200.
[0028] In the first embodiment, the shielding portion 120 has a first portion 112A and a second portion 112B, and the first portion 112A and the second portion 112B are facing each other in a facing structure. In the X direction, at least a portion of the second portion 112B faces the first portion 112A via air, which is an insulator. In the first embodiment, in the X direction, a portion of the second portion 112B faces the first portion 112A via air, which is an insulator.
[0029] The first part 112A and the second part 112B are connected via a bent portion 112C, and the second part 112B and the base 112E are connected via a bent portion 112D.
[0030] The first section 112A has an open end 1121 in the Z direction, and the other end 1122 in the Z direction is continuous with the first end 1123 in the Z direction of the second section 112B via a bent section 112C. The other end 1124 in the Z direction of the second section 112B is continuous with the base 112E via a bent section 112D.
[0031] The open end 1121 of the first part 112A faces the bottom plate portion of the lower cover 102 in the Z direction, and the other end 1122 of the first part 112A and the one end 1123 of the second part face the top plate portion of the upper cover 101 in the Z direction. The other end 1124 of the second part 112B in the Z direction faces the bottom plate portion of the lower cover 102 in the Z direction. The base portion 112E is positioned between the bottom plate portion of the lower cover 102 and the wiring boards 103 and 104 in the Z direction.
[0032] In the X direction, the first portion 112A is positioned on the side of the gap 114 relative to the second portion 112B, and the second portion 112B is positioned on the side of the wiring board 103 relative to the first portion 112A. Furthermore, in the X direction, the end face 1031 of the wiring board 103 faces the second portion 112B. That is, in the X direction, the second portion 112B overlaps the end face 1031 of the wiring board 103.
[0033] The shielding portion 120 is formed by folding a metal plate back by bending it once or multiple times (for example, twice). Specifically, the first portion 112A is bent in the negative direction of the Z axis at the bent portion 112C relative to the second portion 112B. The second portion 112B is bent in the positive direction of the Z axis at the bent portion 112D relative to the base portion 112E.
[0034] Figures 2(a) and 2(b) are explanatory diagrams of the vicinity of the shielding portion 120 of the operating unit 10 according to the first embodiment. Figure 2(a) shows a part of the operating unit 10 as viewed in the positive direction of the Y axis, from a cross-section obtained by cutting the operating unit 10 with a virtual plane parallel to the XZ plane. Figure 2(b) is a perspective view of the conductive member 112 of the operating unit 10 and a part of the surrounding members.
[0035] In the first embodiment, the shortest distance A between the gap 114 and the first portion 112A is shorter than the shortest distance B between the gap 114 and the second portion 112B. The shortest distance A is an example of a first distance. The shortest distance B is an example of a second distance. That is, the first portion 112A is positioned on the gap 114 side relative to the second portion 112B, and the second portion 112B is positioned on the wiring board 103 side relative to the first portion 112A.
[0036] Figure 3 is an explanatory diagram of an electrostatic discharge test on the operating unit 10 according to the first embodiment. When an electrostatic discharge test (discharge in air) is performed on the operating unit 10 of the electronic device 1, static electricity is discharged to the first portion 112A of the conductive member 112 through the gap 114. The current due to the static electricity that has entered the conductive member 112 due to the electrostatic discharge flows to the frame 200 via the grounding member 113. At that time, the shielding portion 120 has a face-to-face structure in which the first portion 112A and the second portion 112B face each other in the X direction because the first portion 112A is folded back at the bent portion 112C. Therefore, the current I1 due to the static electricity flowing through the first portion 112A and the current I2 due to the static electricity flowing through the second portion 112B are in opposite directions. Therefore, the magnetic field generated by the current I1 flowing through the first part 112A and the magnetic field generated by the current I2 flowing through the second part 112B cancel each other out, suppressing the superposition of electrostatic noise due to electromagnetic field coupling from the conductive member 112 onto the wiring pattern 105 of the wiring board 103 located near the second part 112B. In other words, the voltage level of the electrostatic noise is reduced, making malfunctions and damage to the IC 110 less likely, and improving the resistance of the operating unit 10 to electrostatic discharge. That is to say, according to the first embodiment, a technology is provided that improves resistance to electrostatic discharge.
[0037] Here, the static electricity discharged into the gap 114 flows along the defining surface 140 that defines the gap 114. The sum of the shortest distance A between the gap 114 and the first portion 112A and the creepage distance C of the defining surface 140 that defines the gap 114 (A+C) may be 12 mm or less. 12 mm is the distance over which static electricity can be discharged to the conductive member 112 when an electrostatic discharge test (discharge in air) is performed with an electrostatic discharge strength of 1.25 kV / mm and a maximum applied voltage level of 15 kV. Because the sum of the shortest distance A and the creepage distance C (A+C) is 12 mm or less, static electricity that enters the space inside the outer casing 100 from the gap 114 is more easily discharged to the first portion 112A of the shielding portion 120.
[0038] Furthermore, the distance D in the X direction between the first part 112A and the second part 112B may be 5.8 mm or less. When the distance D between the first part 112A and the second part 112B is 5.8 mm or less, the canceling effect between the magnetic field generated by current I1 and the magnetic field generated by current I2 is strong, effectively suppressing noise superimposition on the wiring pattern 105 of the wiring board 103. The shorter the distance D, the stronger the canceling effect of the magnetic fields. Therefore, in some embodiments, the distance D is 5.0 mm or less. In a more specific embodiment, the distance D is 3.4 mm or less. Also, considering variations in the manufacturing of the conductive member 112, the distance D may be 0.1 mm or more.
[0039] In some embodiments, the Y-direction length E2 of the second portion 112B is longer than the Y-direction length F of the end face 1031 of the wiring board 103. This effectively hides the end face 1031 of the wiring board 103 from the gap 114 when viewed in the positive X-axis direction, which is the inside of the outer casing 100, and prevents static electricity entering the space inside the outer casing 100 from being directly discharged to the wiring pattern 105 or ground pattern of the wiring board 103. Also in some embodiments, the Y-direction length E1 of the first portion 112A is longer than the Y-direction length F of the end face 1031 of the wiring board 103. Furthermore, length E1 may be greater than or equal to length E2. This makes it easier for static electricity entering the space inside the outer casing 100 from the gap 114 to be discharged to the first portion 112A. Additionally, the Y-direction length E3 of the base portion 112E is longer than the Y-direction length F of the end face 1031 of the wiring board 103. This allows the base portion 112E to face the entire main surface of the wiring board 103 in the Z direction.
[0040] [Second Embodiment] A second embodiment will now be described. Hereinafter, elements denoted by the same reference numerals as those in the first embodiment will have substantially the same configuration and function as those described in the first embodiment unless otherwise specified. The differences from the first embodiment will be the main focus of this description.
[0041] Figure 4 is a cross-sectional view of a part of the electronic device according to the second embodiment. Figure 4 shows a cross-section of the operating unit 10A as part of the electronic device. In the second embodiment, the length in the Z direction of the first portion 112A of the shielding portion 120 of the conductive member 112 is longer than the length in the Z direction of the first portion 112A in the first embodiment. That is, in the second embodiment, in the X direction, the first portion 112A overlaps with the end face 1031 of the wiring board 103.
[0042] Thus, in the second embodiment, since the first portion 112A is longer, when viewed from the gap 114 in the positive direction of the X-axis, the second portion 112B is hidden by the first portion 112A and becomes invisible, making it easier for static electricity to discharge to the first portion 112A. In addition, since the portion where the first portion 112A and the second portion 112B face each other increases, the magnetic field cancellation effect is further enhanced. As a result, noise superposition on the wiring pattern 105 of the wiring board 103 can be suppressed. In other words, malfunctions and damage to the IC 110 due to static electricity become less likely, and resistance to electrostatic discharge is further improved.
[0043] [Third Embodiment] A third embodiment will now be described. Hereinafter, elements denoted by reference numerals common to the first or second embodiment will have substantially the same configuration and function as those described in the first or second embodiment unless otherwise specified. The differences from the first and second embodiments will be primarily described.
[0044] Figure 5 is a cross-sectional view of a part of the electronic device according to the third embodiment. Figure 5 shows a cross-section of the operating unit 10B as part of the electronic device. In the third embodiment, the insulator between the first part 112A and the second part 112B is an insulating film 115. The insulating film 115 is an example of an insulating member. The insulating film 115 is formed by applying an insulating coating to a part of the surface of the conductive member 112 by painting. Note that the method of forming the insulating film 115 is not limited to insulating coating; for example, insulating tape or the like may be attached to a part of the surface of the conductive member 112.
[0045] The conductive member 112 is formed by pressing and folding a metal plate using a U-bend (hemming bend) process. Even when the metal plate is pressed, the insulating film 115 remains between the first portion 112A and the second portion 112B. Furthermore, pressing can shorten the distance D between the first portion 112A and the second portion 112B. As a result, the magnetic field cancellation effect is further enhanced, and noise superposition on the wiring pattern 105 of the wiring board 103 is further suppressed. In other words, malfunctions and damage to the IC 110 due to static electricity become less likely, and resistance to electrostatic discharge is further improved.
[0046] [Examples] As Example 1, an electrostatic discharge test (discharge in air) was performed on the electronic device 1 of the first embodiment shown in Figure 1(a) under the following conditions. The maximum applied voltage level was 15kV.
[0047] The distance D between the first part 112A and the second part 112B was varied to 0.1 mm, 0.75 mm, 1.5 mm, and 3 mm. In this case, the shortest distance A between the gap 114 and the first part 112A changed to 5.2 mm, 4.55 mm, 3.8 mm, and 2.3 mm. When distance D is 0.1 mm, 0.75 mm, or 1.5 mm, the shortest distance A is longer than distance D.
[0048] The shortest distance B between the gap 114 and the second portion 112B was 5.5 mm, the creepage distance C was 2 mm, the lengths E1, E2, and E3 of each portion of the conductive member 112 were 140 mm, and the length F of the end face 1031 of the wiring board 103 was 122 mm.
[0049] The noise voltage superimposed on the wiring pattern 106 of the wiring board 104 was observed using an oscilloscope when the distance D between the first part 112A and the second part 112B was varied.
[0050] Figure 6 is a cross-sectional view of a part of the comparative electronic device. Figure 6 shows a cross-section of the control unit 10X of the comparative device as part of the electronic device. An electrostatic discharge test (discharge in air) was performed on the comparative electronic device under the following conditions. The maximum applied voltage level was 15kV.
[0051] The difference between the comparative example's operating unit 10X and the operating unit 10 of Example 1 is that the shielding portion 120X of the conductive member 112X is a straight plate-like portion, rather than a face-to-face structure of a first portion 112A and a second portion 112B as in the shielding portion 120 of Example 1. The noise voltage superimposed on the wiring pattern 106 of the comparative example's wiring board 104 was observed using an oscilloscope.
[0052] Figure 7 is a graph showing the experimental results for the examples and comparative examples. In Figure 7, the horizontal axis represents distance [mm] and the vertical axis represents noise voltage [mV].
[0053] In Figure 7, the measurement results of the noise voltage with respect to distance D in Example 1 are shown by filled black circles. As shown in Figure 7, the shorter the distance D, the lower the noise voltage. This is because, as mentioned earlier, the shorter the distance D, the stronger the magnetic field cancellation effect. Note that the long dashed line L1 in Figure 7 is the power approximation line of the filled black circles, and the short dashed line L2 in Figure 7 is the linear approximation line of the filled black circles.
[0054] Furthermore, in Figure 7, the measurement results of the noise voltage for the shortest distance A in Example 1 are shown as white-filled black circles. As shown in Figure 7, the longer the shortest distance A, the lower the noise voltage. Note that the solid line L3 in Figure 7 is the power approximation line for the white-filled black circles, and the dotted line L4 in Figure 7 is the linear approximation line for the white-filled black circles.
[0055] Furthermore, in Figure 7, the measurement results of the noise voltage for the comparative example are shown by the solid line L1X.
[0056] In Figure 7, the solid line L1X and the long dashed line L1 intersect at a distance D of 5.8 mm, which is greater than 5.0 mm, between the first part 112A and the second part 112B. In other words, if the distance D between the first part 112A and the second part 112B is preferably 5.8 mm or less, and more preferably 5.0 mm or less, then the magnetic field cancellation effect of the shielding portion 120 of the opposing conductive member 112 works, resulting in a lower noise voltage in IC 110. Therefore, the distance D between the first part 112A and the second part 112B can be 5.8 mm or less. Also, the distance D can be 5.0 mm or less.
[0057] Furthermore, when the distance D between the first part 112A and the second part 112B is 3.4 mm, the solid line L1X and the dashed line L2 in Figure 7 intersect. In other words, if the distance D between the first part 112A and the second part 112B is 3.4 mm or less, the magnetic field cancellation effect of the shielding portion 120 of the opposing conductive member 112 works, resulting in a lower noise voltage in IC 110. Therefore, the distance D between the first part 112A and the second part 112B can be 3.4 mm or less.
[0058] Furthermore, in Figure 7, the solid line L1X and the solid line L3, which represents the power approximation line of the shortest distance A, do not intersect even when the shortest distance A is 0.1 mm, and the noise voltage decreases as the shortest distance A becomes longer than 0.1 mm.
[0059] The minimum distance A can be 0.1 mm or more to ensure that the upper cover 101 and the lower cover 102 engage reliably even if there are variations in the manufacturing of the outer casing 100. Also, since the noise voltage decreases as the minimum distance A increases, the minimum distance A can be 1.0 mm or more.
[0060] Furthermore, in Figure 7, the solid line L1X and the dotted line L4, which represents the linear approximation line for the shortest distance A, intersect when the shortest distance A is less than 2.0 mm. In other words, the shortest distance A can be 2.0 mm or more.
[0061] Furthermore, considering the miniaturization of the operating unit 10, the shortest distance A may be 10.0 mm or less. Also, the shortest distance A may be 6.0 mm or less.
[0062] [Other variations] This disclosure is not limited to the embodiments described above, and many modifications are possible within the technical concept of this disclosure. For example, at least two of the embodiments and modifications described above may be combined. Furthermore, the effects described in this embodiment are merely a list of the most preferred effects arising from the embodiments of this disclosure, and the effects of the embodiments of this disclosure are not limited to those described in this embodiment.
[0063] In the above embodiment, two wiring boards 103 and 104 are arranged inside the outer casing 100, and the wiring board closest to the gap 114 is wiring board 103, as described as an example, but the embodiment is not limited to this. For example, the wiring board located near the gap 114 may be wiring board 104.
[0064] Furthermore, although the case in which there are two wiring boards arranged inside the outer casing 100 has been described, it is not limited to this. There may be one or more wiring boards arranged inside the outer casing 100. If there is one wiring board arranged inside the outer casing 100, it is sufficient that the one wiring board is shielded by the shielding portion 120 described in the above embodiment. Also, if there are multiple wiring boards arranged inside the outer casing 100, it is sufficient that at least the wiring board closest to the gap 114 is shielded by the shielding portion 120 described in the above embodiment.
[0065] Furthermore, while the above-described embodiment described an office device such as an image forming apparatus as the electronic device, it is not limited to this. The electronic device can also be an imaging device such as a digital camera, an information device such as a smartphone, tablet, or personal computer, a communication device such as a modem or router, a medical device such as an X-ray machine or endoscope, an industrial device such as a robot or semiconductor manufacturing equipment, or a transportation device such as a vehicle, airplane, or ship. It can also be applied to business equipment such as an automated teller machine (ATM), a currency exchange machine, a cash register, or a vending machine for various items such as food and beverages or tickets.
[0066] The disclosures in this specification include not only what is explicitly stated herein, but also all matters that can be inferred from this specification and the drawings attached thereto. Furthermore, the disclosures in this specification include the complement of the individual concepts described herein. That is, if this specification states, for example, "A is B," then even if it omits the statement "A is not B," it can be said that this specification discloses "A is not B." This is because the statement "A is B" presupposes that the case "A is not B" is being considered.
[0067] The above disclosure of embodiments includes the following sections.
[0068] (Section 1) The exterior is made of resin, A wiring board located inside the aforementioned exterior, The exterior comprises a conductive member disposed inside the exterior, The conductive member is It has a portion that is positioned between the gap in the exterior and the wiring board, The aforementioned part is, A first portion having an open end at one end in the first direction, The first portion has a second portion which is continuous with the other end of the first portion in the first direction and which, in a second direction intersecting the first direction, at least a portion of which faces the first portion via an insulator, The first distance, which is the shortest distance between the gap in the exterior and the first portion, is shorter than the second distance, which is the shortest distance between the gap in the exterior and the second portion. An electronic device characterized by the following features.
[0069] (Section 2) The aforementioned gap is formed in the side wall of the exterior, The first direction is the height direction of the side wall. The electronic device according to item 1, characterized by the features described herein.
[0070] (Section 3) The exterior comprises at least a first cover fixed to the conductive member and a second cover that engages with the first cover. The gap is the gap between the first cover and the second cover. The electronic device according to item 1 or 2, characterized by the features described herein.
[0071] (Section 4) The wiring board has an end face that faces the second portion in the second direction and whose longitudinal direction is the third direction that intersects the first and second directions. The electronic device according to any one of items 1 to 3, characterized in that it is an electronic device.
[0072] (Section 5) The length of the second portion in the third direction is longer than the length of the end face of the wiring board in the third direction. The electronic device according to item 4, characterized by the features described herein.
[0073] (Section 6) The length of the first portion in the third direction is longer than the length of the end face of the wiring board in the third direction. The electronic device according to item 4 or 5, characterized by the features described herein.
[0074] (Section 7) In the second direction, the first portion overlaps the end face of the wiring board, The electronic device according to any one of items 4 to 6, characterized in that it is an electronic device.
[0075] (Section 8) The insulator contains air. The electronic device according to any one of items 1 to 7, characterized in that it is an electronic device.
[0076] (Section 9) The insulator includes an insulating member. The electronic device according to any one of items 1 to 7, characterized in that it is an electronic device.
[0077] (Section 10) The first distance is longer than the distance between the first part and the second part. The electronic device according to any one of items 1 to 9, characterized in that it is an electronic device.
[0078] (Section 11) The aforementioned first distance is 0.1 mm or more. The electronic device according to any one of claims 1 to 10, characterized in that it is an electronic device.
[0079] (Section 12) The aforementioned first distance is 1.0 mm or more. The electronic device according to any one of items 1 to 11, characterized in that it is an electronic device.
[0080] (Section 13) The aforementioned first distance is 2.0 mm or more. The electronic device according to any one of items 1 to 12, characterized in that it is an electronic device.
[0081] (Section 14) The first distance is 10.0 mm or less. The electronic device according to any one of items 1 to 13, characterized in that it is an electronic device.
[0082] (Section 15) The aforementioned first distance is 6.0 mm or less. The electronic device according to any one of items 1 to 14, characterized in that it is an electronic device.
[0083] (Section 16) The distance between the first part and the second part is 5.8 mm or less. The electronic device according to any one of claims 1 to 15, characterized in that it is an electronic device.
[0084] (Section 17) The distance between the first part and the second part is 5.0 mm or less. The electronic device according to any one of items 1 to 16, characterized in that it is an electronic device.
[0085] (Section 18) The distance between the first part and the second part is 3.4 mm or less. The electronic device according to any one of items 1 to 17, characterized in that it is an electronic device.
[0086] (Section 19) The distance between the first part and the second part is 0.1 mm or more. The electronic device according to any one of items 1 to 18, characterized in that it is an electronic device.
[0087] (Section 20) The exterior has a defining surface that defines the gap, The sum of the creepage distance along the defining surface and the first distance is 12 mm or less. The electronic device according to any one of items 1 to 19, characterized in that it is an electronic device.
[0088] (Section 21) The portion where the first part and the second part are continuous is formed by bending. The electronic device according to any one of claims 1 to 20, characterized in that it is an electronic device.
[0089] (Section 22) The exterior is equipped with a touch panel display fixed to it. The electronic device according to any one of items 1 to 21, characterized by the features described herein.
[0090] (Section 23) Operating unit and The system comprises an operating unit for operating the aforementioned operating unit, The operating unit includes the exterior, the wiring board, and the conductive member. The aforementioned operating unit has a metal frame, The conductive member is electrically connected to the frame. The electronic device according to any one of items 1 to 22, characterized in that it is an electronic device.
[0091] (Section 24) The conductive member is a conductive sheet. The electronic device according to any one of items 1 to 23, characterized in that it is an electronic device.
[0092] (Section 25) The conductive member is a member formed on the surface of the resin member. The electronic device according to any one of items 1 to 23, characterized in that it is an electronic device.
[0093] (Section 26) The conductive member is a conductive resin member. The electronic device according to any one of items 1 to 23, characterized in that it is an electronic device. [Explanation of symbols]
[0094] A...shortest distance (first distance), B...shortest distance (second distance), C...creepage distance, 1...electronic equipment, 10...operating unit, 20...operating unit, 100...casing, 101...upper cover (second cover), 102...lower cover (first cover), 103...wiring board, 112...conductive material, 112A...first part, 112B...second part, 114...gap, 115...insulating film (insulating material), 120...shielding part (part)
Claims
1. The exterior is made of resin, A wiring board located inside the aforementioned exterior, The exterior comprises a conductive member disposed inside the exterior, The conductive member is It has a portion that is positioned between the gap in the exterior and the wiring board, The aforementioned part is, A first portion having an open end at one end in the first direction, The first portion has a second portion which is continuous with the other end of the first portion in the first direction and which, in a second direction intersecting the first direction, has at least a portion facing the first portion via an insulator, The first distance, which is the shortest distance between the gap in the exterior and the first portion, is shorter than the second distance, which is the shortest distance between the gap in the exterior and the second portion. An electronic device characterized by the following features.
2. The aforementioned gap is formed in the side wall of the exterior, The first direction is the height direction of the side wall. The electronic device according to feature 1.
3. The exterior comprises at least a first cover fixed to the conductive member and a second cover that engages with the first cover. The gap is the gap between the first cover and the second cover. The electronic device according to feature 1.
4. The wiring board has an end face that faces the second portion in the second direction and whose longitudinal direction is the third direction that intersects the first and second directions. The electronic device according to feature 1.
5. The length of the second portion in the third direction is longer than the length of the end face of the wiring board in the third direction. The electronic device according to feature 4.
6. The length of the first portion in the third direction is longer than the length of the end face of the wiring board in the third direction. The electronic device according to feature 4.
7. In the second direction, the first portion overlaps the end face of the wiring board, The electronic device according to feature 4.
8. The insulator contains air. The electronic device according to feature 1.
9. The insulator includes an insulating member. The electronic device according to feature 1.
10. The first distance is longer than the distance between the first part and the second part. The electronic device according to feature 1.
11. The first distance is 0.1 mm or more. The electronic device according to feature 1.
12. The first distance is 1.0 mm or more. The electronic device according to feature 1.
13. The first distance is 10.0 mm or less. The electronic device according to feature 1.
14. The distance between the first part and the second part is 5.8 mm or less. The electronic device according to feature 1.
15. The distance between the first part and the second part is 3.4 mm or less. The electronic device according to any one of claims 1 to 14.
16. The distance between the first part and the second part is 0.1 mm or more. The electronic device according to feature 1.
17. The exterior has a defining surface that defines the gap, The sum of the creepage distance along the defining surface and the first distance is 12 mm or less. The electronic device according to feature 1.
18. The portion where the first part and the second part are continuous is formed by bending. The electronic device according to feature 1.
19. The exterior is equipped with a touch panel display fixed to it. The electronic device according to any one of claims 1 to 14 and 16 to 18.
20. Operating unit and The system comprises an operating unit for operating the aforementioned operating unit, The operating unit includes the exterior, the wiring board, and the conductive member. The aforementioned operating unit has a metal frame, The conductive member is electrically connected to the frame. The electronic device according to any one of claims 1 to 14 and 16 to 18.
21. The conductive member is a conductive sheet. The electronic device according to any one of claims 1 to 14 and 16 to 18.
22. The conductive member is a member formed on the surface of the resin member. The electronic device according to any one of claims 1 to 14 and 16 to 18.
23. The conductive member is a conductive resin member. The electronic device according to any one of claims 1 to 14 and 16 to 18.
Citation Information
Patent Citations
Electrostatic noise preventing structure of electronic circuit
JP1993327259A