Compounds, molded products, cured products, compacted magnetic cores, and electronic components

Abstract

To provide a compound that improves the fluidity of the compound and increases the mechanical strength and relative permeability of the cured compound. [Solution] The compound comprises a metal powder and a resin composition. The metal powder is a soft magnetic material. The resin composition comprises a thermosetting resin and a fatty acid amide. The proportion of fatty acid amide in the resin composition is 1.2% by mass or more and 20.1% by mass or less.

Description

[Technical Field]

[0001] This disclosure relates to compounds, molded articles, cured products, compacted magnetic cores, and electronic components. [Background technology]

[0002] Compounds containing soft magnetic metal powder and electrically insulating resin compositions (thermosetting binders) are used as raw materials for various industrial products. (See Patent Document 1 below.) For example, the compound is used as a raw material for inductors, reactors, transformers, motor stators, motor yokes, power modules, thyristor valves, noise filters (EMI filters), choke coils, and solenoid cores. The compound is also used as a encapsulant for electronic equipment such as semiconductors or electronic circuit boards. [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2023-049648 [Overview of the Initiative] [Problems that the invention aims to solve]

[0004] The cured products of the compounds used in the various industrial products mentioned above require high relative permeability. The relative permeability of the cured compound increases with increasing the filling rate (by volume) of metal powder in the compound. In other words, the relative permeability increases with increasing the metal powder content (by mass) in the compound. However, increasing the metal powder content degrades the fluidity of the compound. Thus, relative permeability and fluidity are in a trade-off relationship. The deterioration of the compound's fluidity makes molding difficult, and thus makes it difficult to manufacture various industrial products from the compound. The fluidity of the compound can be improved by adding wax (lubricant) such as zinc stearate. However, the addition of wax to the compound degrades the affinity (wettability) of the resin composition (binder) to the metal powder. This deterioration in wettability reduces the mechanical strength (e.g., flexural strength) of the cured compound. In other words, the addition of wax to the compound reduces the mechanical strength of various industrial products, including the cured compound. Furthermore, as the metal powder content in the compound increases, the resin composition (binder) content in the compound decreases. As a result, the mechanical strength of the cured compound decreases. In short, there is a trade-off relationship between relative permeability and mechanical strength.

[0005] One aspect of this disclosure is to provide a compound that improves the fluidity of the compound and increases the mechanical strength and relative permeability of the cured compound, a molded article containing the compound, a cured compound, a compacted magnetic core containing the cured compound, and an electronic component containing the cured compound or compacted magnetic core. [Means for solving the problem]

[0006] As described below, one aspect of this disclosure relates to a compound according to any one of [1] to [9], a molded article according to

[10] , a cured product according to

[11] , a compacted magnetic core according to

[12] , and an electronic component according to any one of

[13] to

[15] .

[0007] [1] comprising metal powder and resin composition, The aforementioned metal powder is a soft magnetic material. The resin composition comprises a thermosetting resin and a fatty acid amide. The proportion of the fatty acid amide in the resin composition is 1.2% by mass or more and 20.1% by mass or less. Compound.

[0008] [2] The fatty acid amide is at least one selected from the group consisting of oleic acid amide, stearic acid amide, behenic acid amide (also known as beheninic acid amide), erucic acid amide, ethylenebisoleic acid amide, hexamethylenebisoleic acid amide, dioleyl adipic acid amide, methylenebiserucic acid amide, ethylenebiserucic acid amide, N,N'-hexamethylenebis(erucic acid amide), m-xylenebiserucic acid amide, p-phenylenebiserucic acid amide, methylenebisstearate amide, and ethylenebislauric acid amide. The compound described in [1].

[0009] [3] The content of the metal powder in the compound is 93.0% by mass or more and 98.0% by mass or less. The compound described in [1] or [2].

[0010] [4] The minimum melt viscosity of the compound at 175°C is 10 Pa·s or more and 250 Pa·s or less. The compound listed in any one of [1] to [3].

[0011] [5] The resin composition further comprises at least one component selected from the group consisting of a curing agent, a curing accelerator, a coupling agent, and a wax. The compound listed in any one of [1] to [4].

[0012] [6] The content of the fatty acid amide in the compound is 0.04% by mass or more and 0.70% by mass or less. The compound listed in any one of [1] to [5].

[0013] [7] The mass of the fatty acid amide with respect to 100 parts by mass of the thermosetting resin is 2.0 parts by mass or more and 40.0 parts by mass or less. [1] The compound according to any one of [1] to [6]. [8] The metal powder contains nanocrystals. [1] The compound according to any one of [1] to [7].

[0014] [9] It is a raw material for a dust core. [1] The compound according to any one of [1] to [8].

[0015]

[10] It is a sealing material. [1] The compound according to any one of [1] to [8].

[0016]

[11] It contains the compound according to any one of [1] to [8]. Compact.

[0017]

[12] The cured product of the compound according to any one of [1] to [8].

[0018]

[13] It contains the cured product of the compound according to

[12] . Dust core.

[14] The iron loss of the dust core per unit volume of the dust core is 396 kW / m ,

[0015] , , , , , ,

[0019] ,

[0018] ,

[0017] , , ,

[0016] , , , , , , , , , 3 , , , , , Is as follows, The maximum magnetic flux density of the dust core during the measurement of the iron loss is 20 mT, The alternating current frequency during the measurement of the iron loss is 1 MHz.

[13] The dust core according to

[13] .

[15] The relative permeability of the dust core is 59 or more.

[13] or

[14] The dust core according to

[13] or

[14] .

[0019]

[16]

[13] The dust core according to

[13] , and A coil, Includes, The compacted magnetic core is placed inside the coil, Electronic components.

[17] The iron loss of the powdered magnetic core per unit volume is 396 kW / m 3 The following: The maximum magnetic flux density of the compacted magnetic core during the measurement of the iron loss is 20 mT. The frequency of the AC current during the measurement of the iron loss is 1 MHz.

[16] The electronic components described.

[18] The relative permeability of the powdered magnetic core is 59 or higher. The electronic components described in

[16] or

[17] .

[0020]

[19]

[12] Includes the cured compound of the compound described above, Electronic components.

[0021]

[20] Coil and, The cured product and, Includes, The coil is sealed in the cured material.

[19] The electronic components described. [Effects of the Invention]

[0022] According to one aspect of this disclosure, a compound is provided that improves the fluidity of the compound and increases the mechanical strength and relative permeability of the cured compound; a molded article containing the compound; a cured compound; a compacted magnetic core containing the cured compound; and an electronic component containing the cured compound or the compacted magnetic core. [Brief explanation of the drawing]

[0023] [Figure 1] Figure 1 is a schematic perspective view of a specific example of an electronic component (inductor) including a hardened compound and a coil. [Figure 2] Figure 2 is a schematic cross-sectional view of the electronic component shown in Figure 1. The cross-section shown in Figure 2 includes the central axis of the coil and crosses the pair of terminal electrodes of the electronic component. [Modes for carrying out the invention]

[0024] Preferred embodiments of the present disclosure will be described below with reference to the drawings. In the drawings, equivalent components are denoted by equivalent reference numerals. The present disclosure is not limited to the embodiments described below.

[0025] (Compound overview) The compound according to this embodiment comprises a metal powder and a resin composition. The compound may be described as a mixture comprising the metal powder and the resin composition. The metal powder consists of a plurality of metal particles. The metal powder is a soft magnetic material. The metal powder may be described as a metal filler. The resin composition comprises a thermosetting resin and a fatty acid amide. The resin composition is electrically insulating. The resin composition may be described as a thermosetting binder (adhesive). The compound may contain either or both of the uncured resin composition and the semi-cured resin composition (B-stage resin composition). The compound may consist only of the metal powder and the resin composition. The compound may further contain other components in addition to the metal powder and the resin composition.

[0026] The compound may be solid (e.g., powder) at room temperature (e.g., 20±15℃). Part or all of the surface of each of the multiple metal particles constituting the metal powder may be covered with a resin base composition. The compound may contain one or more metal particles that are not covered with a resin composition. The compound may contain one or more particles consisting only of a resin composition. The compound may contain one or more composite particles (granules) consisting of one or more metal particles constituting the metal powder and a resin composition covering one or more metal particles. One composite particle may consist of multiple metal particles bound together via a resin composition.

[0027] The molded article according to this embodiment includes the compound described above. The molded article according to this embodiment may consist only of the compound. The molded article may also include other components such as coils in addition to the compound. The molded article may include one or both of the uncured resin composition and the semi-cured resin composition. The cured compound according to this embodiment includes the cured resin composition (C-stage resin composition). In the molded article containing the compound, or the cured compound, the resin composition or its cured product binds a plurality of metal particles together. Furthermore, the resin composition or its cured product interposed between adjacent plurality of metal particles electrically insulates the plurality of metal particles.

[0028] The hydrocarbon chains of the fatty acid amides contained in the compound act on the surface of each of the multiple metal particles that make up the metal powder, lubricating the surface of each metal particle. As a result, friction between multiple metal particles is suppressed, the multiple metal particles disperse more easily in the compound, and the compound becomes more fluid. Due to the amide group of the fatty acid amide (a structure containing an amide bond represented as -NHCO-), multiple metal particles are more easily bonded to each other through the cured resin composition. As a result, the mechanical strength (e.g., flexural strength) of the cured compound is improved. Furthermore, the inventors discovered that fatty acid amides increase the relative permeability of the cured compound. This increase in relative permeability due to fatty acid amides is a unique and unexpected effect that is difficult to achieve with conventional compounds that do not contain fatty acid amides.

[0029] The proportion of fatty acid amides in the resin composition is 1.2% by mass or more and 20.1% by mass or less. When the proportion of fatty acid amides in the resin composition is within the above range, the compound flows easily, and the mechanical strength and relative permeability of the cured compound tend to increase. When the proportion of fatty acid amides in the resin composition is less than 1.2% by mass, the compound does not flow easily, and the relative permeability of the cured compound tends to decrease. When the proportion of fatty acid amides in the resin composition is greater than 20.1% by mass, the mechanical strength of the cured compound tends to decrease.

[0030] The fatty acid amide content in the compound may be 0.04% by mass or more and 0.70% by mass or 0.04% by mass or more and 0.60% by mass, for the reasons that the compound flows easily and the mechanical strength and relative permeability of the cured compound tend to increase. When the fatty acid amide content in the compound is 0.04% by mass or more, the compound flows easily and the relative permeability of the cured compound tends to increase. When the fatty acid amide content in the compound is 0.70% by mass or less, the decrease in the mechanical strength of the cured compound tends to be suppressed.

[0031] For the reasons that the compound flows easily and the mechanical strength and relative permeability of the cured compound tend to increase, the mass of fatty acid amide per 100 parts by mass of thermosetting resin may be 2.0 parts by mass or more and 40.0 parts by mass or less. When the mass of fatty acid amide per 100 parts by mass of thermosetting resin is 2.0 parts by mass or more, the compound flows easily and the relative permeability of the cured compound tends to increase. When the mass of fatty acid amide per 100 parts by mass of thermosetting resin is 40.0 parts by mass or less, the decrease in the mechanical strength of the cured compound tends to be suppressed.

[0032] For example, the fatty acid amide may be at least one selected from the group consisting of oleic acid amide, stearic acid amide, behenic acid amide (also known as beheninic acid amide), erucic acid amide, ethylenebisoleic acid amide, hexamethylenebisoleic acid amide, dioleyl adipic acid amide, methylenebiserucic acid amide, ethylenebiserucic acid amide, N,N'-hexamethylenebis(erucic acid amide), m-xylenebiserucic acid amide, p-phenylenebiserucic acid amide, methylenebisstearate amide, and ethylenebislauric acid amide. The compound may contain multiple types of fatty acid amides.

[0033] The compound may be fluidized by heating at a temperature below the thermosetting temperature of the resin composition, and the fluidized compound may be molded. For example, the compound is often used in transfer molding. Transfer molding is a type of injection molding. Transfer molding may be rephrased as pressure molding. Transfer molding may include the steps of heating the compound in a heating chamber to fluidize it, and supplying (pressure-injecting) the fluidized compound from the heating chamber into the mold through a casting runner. The method of molding the compound is not limited to transfer molding. For example, the method of molding the compound may be extrusion molding or compression molding (powder compaction molding).

[0034] The minimum melt viscosity of the compound at 175°C may be between 10 Pa·s and 250 Pa·s. Pa·s stands for Pascal-second. When the minimum melt viscosity is within the above range, the heated compound has excellent fluidity, allowing it to flow smoothly through narrow runners without interruption (without enclosing air bubbles) and to fill the mold cavity evenly. As a result, molded articles and their cured products with fewer defects such as surface defects, voids, and burrs can be easily produced by the above molding method.

[0035] The content of metal powder in the compound is not particularly limited. For example, the content of metal powder in the compound may be 90% by mass or more and less than 100% by mass, 93.0% by mass or more and 98.0% by mass or less, or 94.0% by mass or more and 98.0% by mass or less. The content of resin composition in the compound is also not particularly limited. For example, the content of resin composition in the compound may be greater than 0% by mass and 10% by mass or less, 2.0% by mass or more and 7.0% by mass or less, or 2.0% by mass or more and 6.0% by mass or less. The higher the content of metal powder in the compound, the higher the relative permeability of the cured compound. In other words, the lower the content of resin composition in the compound, the higher the relative permeability of the cured compound. The lower the content of metal powder in the compound, the higher the mechanical strength of the cured compound. In other words, the higher the content of resin composition in the compound, the higher the mechanical strength of the cured compound. If a compound does not contain fatty acid amides, the fluidity of a compound with a metal powder content of 93.0% by mass or more is difficult to improve. Also, if a compound does not contain fatty acid amides, the mechanical strength of the cured product of a compound with a metal powder content of 93.0% by mass or more tends to decrease. However, even when the metal powder content in the compound is 93.0% by mass or more, compounds containing fatty acid amides are more fluid, and the decrease in mechanical strength of compounds containing fatty acid amides is suppressed.

[0036] For example, the content of each of the metal powder and the resin composition in the compound may be specified by the following method based on the specific gravity of each of the compound, the metal powder, and the resin composition. The specific gravity (unit: none) may be the ratio of the density of each of the compound, the metal powder, and the resin composition to the density of a standard substance (for example, the density of water at 4°C). For example, the specific gravity of each of the compound, the metal powder, and the resin composition may be measured by a general method (such as the water displacement method) based on Archimedes' principle. The specific gravity of each of the metal powder and the resin composition may be measured in advance before the production of the compound. Using an inert organic solvent that does not react with the metal powder and the resin composition, the compound may be separated into the metal powder and the resin composition (organic substances dissolved in the organic solvent), and the specific gravity of each of the separated metal powder and resin composition may be measured. The specific gravity of the metal powder is S M and may be expressed as such. The content of the metal powder in the compound may be expressed as α mass%. The specific gravity of the resin composition is S R and may be expressed as such. The content of the resin composition in the compound may be expressed as (100 - α) mass%. The specific gravity S C of the compound may be expressed by the following formula 1. Based on the following formula 1, the content α of the metal powder in the compound may be calculated from the measured specific gravities (S M , S R , and S C ). S C = [(S M ×α) + {S R ×(100 - α)}] / 100 (1)

[0037] For example, specific industrial products manufactured using the compound may be an inductor, a reactor, a transformer, a stator of a motor, a yoke of a motor, a power module, a thyristor valve, a noise filter (EMI filter), a choke coil, and a solenoid core, etc.

[0038] Compounds, molded articles containing compounds, or cured compounds may be encapsulants. Compounds can possess both the electrical insulation properties required for encapsulants for electronic or electrical equipment and the soft magnetic properties (electromagnetic shielding ability) required for electromagnetic shielding materials. For example, compounds, molded articles containing compounds, or cured compounds may be encapsulants for electronic components. For example, compounds, molded articles containing compounds, or cured compounds may be encapsulants (underfills, etc.) for semiconductor packages such as IC packages and LSI packages.

[0039] For example, the compound may be a raw material for an electronic component. That is, the electronic component may include a cured compound. For example, the compound may be a raw material for a powdered magnetic core. That is, the powdered magnetic core may include a cured compound. The structure of an electronic component including a cured compound is not limited. For example, as shown in Figures 1 and 2, the electronic component 1 (inductor) may include a cured compound 2 and a coil 5, with the coil 5 sealed within the cured compound 2. In other words, the electronic component 1 may include a powdered magnetic core 2dc containing the cured compound 2 and a coil 5, with the powdered magnetic core 2dc being located inside the coil 5. The electronic component 1 may further include a pair of terminal electrodes 3, one of which may be located on one end face of the electronic component 1 and the other terminal electrode 3 on the other end face of the electronic component 1. One end of the coil 5 (outlet 5a) may be connected to one terminal electrode 3, and the other end of the coil 5 (outlet 5b) may be connected to the other terminal electrode 3. The iron loss of the compacted magnetic core containing the cured compound according to this disclosure tends to be lower than that of conventional compacted magnetic cores containing the cured compound. For example, according to this disclosure, the iron loss per unit volume of the compacted magnetic core (Pcv) is 396 kW / m 3 Below, 150kW / m 3 More than 396kW / m 3 The following, or 200kW / m 3 More than 396kW / m 3The following may apply: For example, the maximum magnetic flux density of the powder core during iron loss measurement may be 20 mT (millitesla). For example, the frequency of the alternating current during iron loss measurement may be 1 MHz. In other words, according to this disclosure, iron loss of the powder core can be suppressed in the high-frequency band of 1 MHz or higher. The frequency of the alternating current during iron loss measurement may be rephrased as the frequency of the alternating current flowing through the coil surrounding the powder core. The relative permeability of a compacted magnetic core containing the cured compound according to this disclosure tends to be higher than that of conventional compacted magnetic cores containing the cured compound. For example, according to this disclosure, the relative permeability (unit: none) of the compacted magnetic core may be 59 or more, or 59 to 75.

[0040] (Specific examples of metal powders) For example, the average particle size of the metal powder (multiple metal particles) may be between 0.1 μm and 45 μm.

[0041] The metal powder (multiple metal particles) may contain multiple types of metal powders with different particle sizes. For example, the metal powder may contain a first soft magnetic powder (multiple first soft magnetic particles) and a second soft magnetic powder (multiple second soft magnetic particles), and the particle size of the first soft magnetic powder may be larger than that of the second soft magnetic powder. For example, the average particle size of the first soft magnetic powder may be larger than the average particle size of the second soft magnetic powder. For example, the D50 (median diameter) of the first soft magnetic powder may be larger than that of the second soft magnetic powder. For example, the D90 of the first soft magnetic powder may be larger than that of the second soft magnetic powder. If the compound contains only first soft magnetic powder with large particle sizes as the metal powder, gaps are easily formed between multiple adjacent first soft magnetic particles, making it difficult to increase the packing density of the metal powder in the compound. On the other hand, when the compound contains first and second soft magnetic powders as metal powders, the second soft magnetic particles, which are smaller than the first soft magnetic particles, fill the gaps between multiple first soft magnetic particles, increasing the filling density of the metal powder in the compound. In other words, the specific gravity of the compound increases because it contains first and second soft magnetic powders with different particle sizes. As a result, the relative permeability improves. Furthermore, with the increase in the filling density of the metal powder in the compound, the cured compound becomes denser, and the mechanical strength of the cured compound improves. For example, the average particle size of the first soft magnetic powder may be between 11 μm and 45 μm. For example, the average particle size of the second soft magnetic powder may be between 0.1 μm and 9.0 μm. When the average particle size of the first soft magnetic powder is within the above range and the average particle size of the second soft magnetic powder is within the above range, the filling density of the metal powder in the compound tends to increase, and the relative permeability and mechanical strength tend to increase.

[0042] The average particle size, D50, and D90 of the metal powder may be calculated from the particle size distribution based on the number, volume, or mass of the first soft magnetic particles constituting the first soft magnetic powder. The average particle size, D50, and D90 of the metal powder may be calculated from the particle size distribution based on the number, volume, or mass of the first soft magnetic particles constituting the first soft magnetic powder. The average particle size, D50, and D90 of the second soft magnetic powder may be calculated from the particle size distribution based on the number, volume, or mass of the second soft magnetic particles constituting the second soft magnetic powder. Each particle size distribution may be measured by a laser diffraction particle size distribution analyzer. Each particle size distribution may also be calculated based on the measurement of the mass or volume of each soft magnetic particle by sieving. The shapes of the metal powder (metal particles), the first soft magnetic particles, and the second soft magnetic particles are not particularly limited. For example, the shapes of the metal powder (metal particles), the first soft magnetic particles, and the second soft magnetic particles may be spherical, nearly spherical, flattened, or needle-shaped.

[0043] The mass of the first soft magnetic powder may be expressed as M1, and the mass of the second soft magnetic powder may be expressed as M2. M1 / (M1+M2) may be between 0.70 and 0.95, and M2 / (M1+M2) may be between 0.05 and 0.30. When M1 / (M1+M2) and M2 / (M1+M2) are within the above ranges, the second soft magnetic particles, which are smaller than the first soft magnetic particles, are more likely to fill the gaps between multiple first soft magnetic particles, and the filling rate of the metal powder in the compound (specific gravity of the compound) tends to increase. As a result, the relative permeability and mechanical strength tend to increase.

[0044] The compound may further contain non-metallic fillers in addition to the metal powder. For example, the compound may contain a filler (particulate filler) made of silica (SiO2) as the non-metallic filler. The particle size of the non-metallic filler may be approximately or exactly equal to the particle size of the metal powder.

[0045] As long as the metal powder is a soft magnetic material, the composition of the metal powder (each of the multiple metal particles) is not particularly limited. For example, the metal powder may contain iron. In addition to iron, the metal powder may further contain at least one metal element selected from the group consisting of base metal elements, noble metal elements, transition metal elements, and rare earth elements. For example, the metal elements other than iron contained in the metal powder may be at least one element selected from the group consisting of cobalt (Co), nickel (Ni), copper (Cu), titanium (Ti), manganese (Mn), zinc (Zn), aluminum (Al), tin (Sn), arsenic (As), antimony (Sb), chromium (Cr), beryllium (Be), barium (Ba), strontium (Sr), lead (Pb), bismuth (Bi), silver (Ag), niobium (Nb), hafnium (Hf), zirconium (Zr), tantalum (Ta), molybdenum (Mo), tungsten (W), and vanadium (V). The metal powder may also contain nonmetallic elements in addition to metal elements. For example, the nonmetallic element contained in the metal powder may be at least one element selected from the group consisting of boron (B), carbon (C), nitrogen (N), oxygen (O), silicon (Si), phosphorus (P), and sulfur (S).

[0046] The metal powder may contain at least one metal from among pure iron and iron-containing alloys (iron-based alloys). The metal powder may consist only of pure iron. The metal powder may consist only of iron-based alloys. The metal powder may consist only of pure iron and iron-based alloys. For example, the iron-based alloy contained in the metal powder may be at least one alloy selected from the group consisting of Fe-Cr-Si alloys, Fe-Cr alloys, Fe-Si alloys, Fe-Si-Al alloys, Fe-Ni alloys, Fe-Cu-Ni alloys, Fe-Co alloys, and Fe-Ni-Cr alloys. The iron or iron-based alloy contained in the metal powder may be crystalline or amorphous. The metal powder may contain multiple types of metal powders with different compositions. The metal powder may contain nanocrystals (for example, crystals with a maximum width of less than 1.0 μm) made of the aforementioned metal (soft magnetic material). In other words, each of the multiple metal particles constituting the metal powder may contain one or more nanocrystals. Each of the multiple metal particles constituting the metal powder may consist of only one or more nanocrystals. When the metal powder contains nanocrystals, the iron loss of the compacted magnetic core is easily suppressed, and the relative permeability of the compacted magnetic core is easily increased. For example, when the metal powder contains nanocrystals, the iron loss of the compacted magnetic core per unit volume is 396 kW / m 3 The following tend to occur: For example, if the metal powder contains nanocrystals, the relative permeability of the compacted magnetic core tends to be 59 or higher. The metal powder may consist only of multiple nanocrystals. The metal powder may contain both multiple nanocrystals and amorphous metal.

[0047] Some or all of the multiple metal particles constituting the metal powder may be covered with an insulating coating. Some or all of the surface of each metal particle may be covered with an insulating coating. Covering the metal powder with an insulating coating improves the electrical insulation of the compound. If the insulating coating contains glass, the surface of the insulating coating tends to become smoother, and friction between multiple metal particles tends to be suppressed. As a result, aggregation (blocking) of the compound tends to be suppressed, and the fluidity of the compound tends to be improved. Some or all of the surface of the insulating coating may be covered with a resin composition.

[0048] For example, the insulating film may contain at least one component selected from the group consisting of glass, phosphoric acid (phosphate), silica (SiO2), iron oxide (Fe2O3), and chromium oxide (Cr2O3). For example, in addition to silicon (Si), the glass may contain at least one element selected from the group consisting of oxygen (O), boron (B), sodium (Na), and aluminum (Al). For example, the glass may contain at least one component from silicate glass (silicate), phosphatesilicate glass (phosphate), and borosilicate glass (borosilicate). The composition of the insulating film may be measured by at least one analytical method from X-ray photoelectron spectroscopy (XPS) and energy-dispersive X-ray analysis (EDX). The insulating film may be formed by a wet method using an alkoxysilane solution, etc., or by a dry method such as mechanofusion. For example, the thickness of the insulating film may be 10 nm or more and 200 nm or less. The thickness of the insulating coating may be measured in the cross-section of the metal particles using a transmission electron microscope (TEM) and EDX.

[0049] (Specific examples of resin compositions) The resin composition may consist of the remaining portion of the compound excluding the metal powder (non-volatile components). As described above, the resin composition includes at least a thermosetting resin and a fatty acid amide. In addition to the thermosetting resin and fatty acid amide, the resin composition may further include at least one component selected from the group consisting of a curing agent, a curing accelerator (curing catalyst), a coupling agent, a wax (mold release agent), and a flame retardant. Specific examples of each component are as follows.

[0050] The thermosetting resin contained in the resin composition may be at least one resin selected from the group consisting of epoxy resins, phenolic resins, bismaleimide resins, polyimide resins, and polyamideimide resins. In addition to the thermosetting resin, the resin composition may further contain other resins (e.g., thermoplastic resins). For example, the resin composition may further contain at least one other resin selected from the group consisting of polyphenylene sulfide resins, acrylic resins, methacrylic resins, polyethylene, polypropylene, polystyrene, polyvinyl chloride, polyethylene terephthalate, and silicone resins.

[0051] <Epoxy resin and hardener> Epoxy resins include biphenyl-type epoxy resins, stilbene-type epoxy resins, diphenylmethane-type epoxy resins, sulfur atom-containing epoxy resins, novolac-type epoxy resins, dicyclopentadiene-type epoxy resins, salicylaldehyde-type epoxy resins, copolymer epoxy resins of naphthols and phenols, epoxidized aralkyl-type phenol resins, bisphenol-type epoxy resins, glycidyl ether-type epoxy resins of alcohols, glycidyl ether-type epoxy resins of paraxylylene-modified phenol resins and / or metaxylylene-modified phenol resins, and glycidyl ether-type epoxy resins of terpene-modified phenol resins. The resin may be at least one resin selected from the group consisting of cyanoacrylate resins, cyclopentadiene-type epoxy resins, glycidyl ether-type epoxy resins of polycyclic aromatic ring-modified phenol resins, glycidyl ether-type epoxy resins of naphthalene ring-containing phenol resins, glycidyl ester-type epoxy resins, glycidyl-type or methylglycidyl-type epoxy resins, alicyclic epoxy resins, halogenated phenol novolac-type epoxy resins, orthocresol novolac-type epoxy resins, hydroquinone-type epoxy resins, trimethylolpropane-type epoxy resins, and linear aliphatic epoxy resins obtained by oxidizing olefin bonds with peracids such as peracetic acid.

[0052] At least some epoxy resins may be naphthalene-type epoxy resins having a naphthalene structure. Naphthalene-type epoxy resins are solid at room temperature. When a compound contains a naphthalene-type epoxy resin, the product manufactured from the compound (cured compound) tends to have high mechanical strength at both room temperature and high temperatures. The naphthalene-type epoxy resin may be at least one resin selected from the group consisting of naphthalene diepoxy compounds, naphthylene ether-type epoxy resins, naphthalene novolac-type epoxy resins, methylene-bonded dimers of naphthalene diepoxy compounds, and methylene-bonded compounds of naphthalene monoepoxy compounds and naphthalene diepoxy compounds. The epoxy resin may also include a bifunctional epoxy resin. For example, the bifunctional epoxy resin may be at least one resin from among α-naphthol-type epoxy resins and β-naphthol-type epoxy resins.

[0053] The epoxy resin may contain at least one of the trifunctional epoxy resins and tetrafunctional epoxy resins. The naphthalene-type epoxy resin described above may be at least one of the trifunctional epoxy resins and tetrafunctional epoxy resins. A trifunctional epoxy resin is an epoxy resin composed of structural units having three epoxy groups. A tetrafunctional epoxy resin is an epoxy resin composed of structural units having four epoxy groups. When the epoxy resin contains at least one of the trifunctional epoxy resins and tetrafunctional epoxy resins, the epoxy resins are crosslinked three-dimensionally during the thermal curing process of the compound, forming a strong crosslinked network. As a result, the movement of the epoxy resin in the cured compound is easily suppressed at high temperatures. In other words, the glass transition temperatures of the trifunctional epoxy resins and tetrafunctional epoxy resins are higher than those of the difunctional epoxy resin. Therefore, when the epoxy resin contains at least one of the trifunctional epoxy resins and tetrafunctional epoxy resins, the cured compound tends to have high mechanical strength at high temperatures.

[0054] The compound may contain one of the epoxy resins listed above. The compound may contain multiple types of epoxy resins listed above.

[0055] Curing agents are classified into two types: those that cure epoxy resins in a low temperature to room temperature range, and heat-curing curing agents that cure epoxy resins upon heating. For example, curing agents that cure epoxy resins in a low temperature to room temperature range include aliphatic polyamines, polyaminoamides, and polymercaptans. For example, heat-curing curing agents include aromatic polyamines, acid anhydrides, phenolic resins, phenol novolac resins, and dicyandiamide (DICY). From the viewpoint of improving the heat resistance (mechanical strength at high temperatures) of the cured compound, the curing agent may preferably be a heat-curing curing agent, more preferably a phenolic resin, and even more preferably a phenol novolac resin.

[0056] Part or all of the curing agent may be a phenolic resin. For example, the phenolic resin may be at least one resin selected from the group consisting of aralkyl phenolic resins, dicyclopentadiene phenolic resins, salicylaldehyde phenolic resins, novolac phenolic resins, copolymer phenolic resins of benzaldehyde phenol and aralkyl phenol, paraxylylene and / or metaxylylene modified phenolic resins, melamine modified phenolic resins, terpene modified phenolic resins, dicyclopentadiene naphthol resins, cyclopentadiene modified phenolic resins, polycyclic aromatic ring modified phenolic resins, biphenyl phenolic resins, and triphenylmethane phenolic resins. The phenolic resin may also be a copolymer composed of two or more of the above phenolic resins.

[0057] The phenol novolac resin may be a resin obtained by condensing or co-condensing phenols and / or naphthols with aldehydes under an acidic catalyst. The phenols constituting the phenol novolac resin may be at least one selected from the group consisting of phenol, cresol, xylenol, resorcinol, catechol, bisphenol A, bisphenol F, phenylphenol, and aminophenol. The naphthols constituting the phenol novolac resin may be at least one selected from the group consisting of α-naphthol, β-naphthol, and dihydroxynaphthalene. The aldehydes constituting the phenol novolac resin may be at least one selected from the group consisting of formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde, and salicylaldehyde.

[0058] The curing agent may be a compound having two phenolic hydroxyl groups in one molecule. For example, the compound having two phenolic hydroxyl groups in one molecule may be at least one compound selected from the group consisting of resorcinol, catechol, bisphenol A, bisphenol F, and substituted or unsubstituted biphenols.

[0059] The compound may contain one of the above-mentioned phenolic resins as a curing agent. The compound may contain multiple of the above-mentioned phenolic resins as a curing agent.

[0060] The ratio of hydroxyl group equivalents of phenolic resin to epoxy equivalents of epoxy resin may be between 0.5 and 1.5. In other words, the ratio of active groups (phenolic OH groups) in phenolic resin that react with epoxy groups in epoxy resin may be between 0.5 and 1.5 equivalents per equivalent of epoxy groups in epoxy resin.

[0061] <Curing accelerator> The curing accelerator (curing catalyst) is not limited to any composition that reacts with the epoxy resin to accelerate its curing. For example, the curing accelerator may be a urea compound. The curing accelerator may also be an alkyl-substituted imidazole or an imidazole such as benzimidazole. The curing accelerator may also be a phosphorus-based curing accelerator. The compound may contain one type of curing accelerator. The compound may contain multiple types of curing accelerators.

[0062] The amount of curing accelerator added is not particularly limited. From the viewpoint of improving the curability and fluidity of the epoxy resin when it absorbs moisture, the amount of curing accelerator added may be 0.1 parts by mass or more and 30 parts by mass or less per 100 parts by mass of epoxy resin. The content of the curing accelerator may be 0.001 parts by mass or more and 5 parts by mass or less relative to the total mass of the epoxy resin and the curing agent (e.g., phenolic resin).

[0063] <Coupling agent> The coupling agent may be one that reacts with glycidyl groups present in a resin composition such as an epoxy resin. The coupling agent improves the adhesion between the metal powder and the resin composition, thereby improving the mechanical strength of the cured compound. The coupling agent that reacts with glycidyl groups may be a silane compound (silane coupling agent). For example, the silane coupling agent may be at least one coupling agent selected from the group consisting of epoxysilane, mercaptosilane, aminosilane, alkylsilane, ureidosilane, acid anhydride silane, methacrylicsilane, and vinylsilane. The compound may contain one of the above coupling agents. The compound may contain multiple types of the above coupling agents.

[0064] <wax> The compound may contain wax. Wax may be rephrased as a lubricant or release agent. The inclusion of wax in the compound improves its fluidity and moldability, and improves its release properties. As a result, the accuracy of the shape and dimensions of the product manufactured from the compound (cured compound) is improved, and structural defects in the product are more easily suppressed. For example, the wax may be at least one compound from saturated fatty acids, saturated fatty acid salts, and saturated fatty acid esters. The wax may also be a synthetic wax. The compound may contain one of the above types of wax. The compound may contain multiple types of the above types of wax.

[0065] <Flame retardant> The compound may contain a flame retardant. For example, the flame retardant may be at least one compound selected from the group consisting of brominated flame retardants, phosphorus-based flame retardants, hydrated metal compound-based flame retardants, silicone-based flame retardants, nitrogen-containing compounds, hindered amine compounds, organometallic compounds, and aromatic engineering plastics. The compound may contain one of the above flame retardants, or more of the above flame retardants.

[0066] (Method of manufacturing compound) The method for manufacturing the compound includes a step of preparing a mixed powder containing a metal powder and a resin composition.

[0067] For example, a mixed powder may be obtained by kneading a metal powder and each component constituting a resin composition while heating. A lump of mixed powder (aggregated mixed powder) may be obtained by heating and kneading the metal powder and the resin composition, and the mixed powder may be obtained by crushing the lump of mixed powder.

[0068] For example, the means for mixing the metal powder and the resin composition may be a kneader, rolls, or a stirrer. By heating and mixing the metal powder and the resin composition, the resin composition may coat part or all of the surface of each metal particle constituting the metal powder. By heating and mixing the metal powder and the resin composition, part or all of the resin composition may become a semi-cured product.

[0069] The metal powder and all the components constituting the resin composition may be kneaded together. A mixture of metal powder and a coupling agent may be prepared in advance, and this mixture may be kneaded with the other components of the resin composition. A mixture of each component of the resin composition, excluding the curing accelerator, and the metal powder may be prepared in advance, and this mixture may be kneaded with the curing accelerator. A mixture of each component of the resin composition, excluding the wax, and the metal powder may be prepared in advance, and this mixture may be kneaded with the wax.

[0070] The mixing time depends on the mixing means, the volume of the mixing means, and the amount of compound produced. The mixing time is not limited. For example, the mixing time may be between 1 minute and 20 minutes. For example, the temperature of the metal powder and resin composition during mixing (heating temperature) may be below the thermosetting temperature of the thermosetting resin. The heating temperature may be a temperature at which a semi-cured product of the thermosetting resin (resin composition of stage B) is formed and the formation of a cured product of the thermosetting resin (resin composition of stage C) is suppressed. The heating temperature may be lower than the activation temperature of the curing accelerator. For example, the heating temperature may be between 50°C and 150°C.

[0071] The method for preparing the mixed powder is not limited to the method described above. For example, a mixture may be obtained by kneading a metal powder, a resin composition, and an organic solvent while heating, and the mixed powder may be obtained by drying (and grinding) the mixture. When the organic solvent in which the resin composition is dissolved comes into contact with the surface of the metal particles, the metal particles are easily covered with the resin composition. For similar reasons, a mixture may be obtained by mixing the metal powder and the resin composition in an organic solvent, and the mixed powder may be obtained by drying (and grinding) the mixture. For example, the organic solvent may be at least one solvent selected from the group consisting of acetone, methyl ethyl ketone (2-butanone), methyl isobutyl ketone (4-methyl-2-pentanone), benzene, toluene, xylene, and N-methyl-2-pyrrolidone (NMP).

[0072] The mixed powder described above may be used as a compound itself. A compound with an adjusted particle size distribution may be obtained by grinding the mixed powder. A compound with an adjusted particle size distribution may also be obtained by classifying the mixed powder using a sieve.

[0073] (Method for manufacturing molded articles and cured products) A molded body is obtained by molding the compound described above. By heat-treating the molded body (thermosetting of the resin composition in the molded body), multiple metal particles are firmly bonded to each other by the cured resin composition, and a cured compound is obtained. For example, the molding method for the compound may be transfer molding, extrusion molding, or compression molding (powder compaction). Depending on the industrial product to be manufactured using the compound, the dimensions and shape of the mold used for molding the compound may be selected. The heat treatment temperature of the molded body should be a temperature at which the resin composition in the molded body is sufficiently cured, and may be above the activation temperature of the curing accelerator. For example, the heat treatment temperature may be 100°C or more and 300°C or less. For example, the heat treatment time may be several minutes or more and 10 hours or less. In order to suppress the oxidation of the metal powder in the molded body, the heat treatment of the molded body may be carried out under an inert atmosphere. A paste which is a mixture of the compound and an organic solvent may be used to manufacture a molded body containing the compound, a cured compound, an electronic component containing the cured compound, or a powder core containing the cured compound.

[0074] (Method of compositional analysis) The composition of the compound used in the manufacture of the molded article and the cured product may be retrospectively analyzed by analyzing the samples obtained by grinding the molded article and the cured product, respectively. The sample may be dissolved in an organic solvent, and the metal powder may be separated from the resin composition dissolved in the organic solvent. The separated metal powder and resin composition may be analyzed individually. Even when the unused compound itself is analyzed directly, the separated metal powder and resin composition may be analyzed individually using the above method. For example, metal powders may be analyzed and identified by one or more analytical methods selected from the group consisting of X-ray fluorescence analysis (XRF), inductively coupled plasma (ICP) emission spectroscopy, X-ray photoelectron spectroscopy (XPS), energy dispersive X-ray spectroscopy (EDS or EDX), and mass spectrometry (MS). For example, each component constituting the resin composition (such as a thermosetting resin) may be analyzed and identified by one or more analytical methods selected from the group consisting of infrared spectroscopy (IR), nuclear magnetic resonance (NMR), gas chromatography (GC), high-performance liquid chromatography (HPLC), and mass spectrometry.

[0075] This disclosure is not necessarily limited to the embodiments described above. Various modifications to this disclosure are possible and are included in this disclosure, without departing from the spirit of this disclosure. [Examples]

[0076] The present disclosure will be illustrated in detail by the following examples and comparative examples. The present disclosure is not limited to the following examples. The term "g" (grams) used below may be replaced with "parts by mass".

[0077] (Example 1) <Step A: Preparation of mixed powder> As the metal powder, a mixture of the first soft magnetic powder and the second soft magnetic powder was used. As the first soft magnetic powder, "KUAMET 6B2" manufactured by Epson Atomics Corporation was used. The first soft magnetic powder was a powder of a soft magnetic alloy consisting of Fe, Cr, and Si. The cutoff diameter of the first soft magnetic powder was 75 μm. In other words, particles larger than 75 μm were removed from the first soft magnetic powder by sieving. The median diameter (D50) of the first soft magnetic powder was approximately 30 μm. As the second soft magnetic powder, "SAP-2C" manufactured by Shinto Kogyo Co., Ltd. was used. "SAP-2C" was a powder of a soft magnetic alloy consisting of Fe, Cr, and Si. The average particle size of the second soft magnetic powder was 2 μm. The content of the first soft magnetic powder in the metal powder was 82.0% by mass. The content of the second soft magnetic powder in the metal powder was 18.0% by mass.

[0078] The resin composition was composed of epoxy resin, a curing agent, a curing accelerator (catalyst), a coupling agent, a wax (release agent), and a fatty acid amide.

[0079] The epoxy resins used were "NC-3000" manufactured by Nippon Kayaku Co., Ltd. and "TECHMORE VG-3101L" manufactured by Printec Co., Ltd. "NC-3000" is a biphenyl aralkyl type epoxy resin. The mass of "NC-3000" was 60.0 g. "TECHMORE VG3101L" is a trifunctional epoxy resin and a derivative of 1-[α-methyl-α-(4-hydroxyphenyl)ethyl]-4-[α,α-bis(4-hydroxyphenyl)ethyl]benzene. The mass of "TECHMORE VG3101L" was 40.0 g.

[0080] As a curing agent, "HF-3M" manufactured by UBE Corporation (formerly Meiwa Kasei Co., Ltd.) was used. "HF-3M" is a phenol novolac resin. The mass of "HF-3M" was 43.2g.

[0081] As the curing accelerator (catalyst), "U-CAT3512T" manufactured by Sunapro Co., Ltd. was used. "U-CAT3512T" is an aromatic dimethylurea. The mass of "U-CAT3512T" was 5.9 g.

[0082] As coupling agents, "KBM-803" and "KBM-5803" manufactured by Shin-Etsu Chemical Co., Ltd. were used. "KBM-803" is 3-mercaptopropyltrimethoxysilane. The mass of "KBM-803" was 3.0 g. "KBM-5803" is 8-methacryloxyoctyltrimethoxysilane. The mass of "KBM-5803" was 5.0 g.

[0083] As the wax (release agent), "Licowax OP" manufactured by Clariant Chemicals Co., Ltd. was used. "Licowax OP" is a montanate ester partially saponified with calcium hydroxide. The mass of "Licowax OP" was 2.0 g.

[0084] As the fatty acid amide, "Daiwax EA" manufactured by Dainichi Chemical Industry Co., Ltd. was used. "Daiwax EA" is an erucic acid amide. The mass of "Daiwax EA" was 15.0 g.

[0085] A compound (powder) consisting solely of metal powder and resin composition was obtained by kneading all the raw materials, which consisted of various components of metal powder and resin composition, while heating. The maximum temperature of all the raw materials during kneading was 130°C. The metal powder content in the compound was adjusted to 97.0% by mass. In other words, the resin composition content in the compound was adjusted to 3.0% by mass.

[0086] <Specific gravity and relative permeability> A toroidal core was obtained from the cured compound by transfer molding of the compound at 175°C, followed by post-curing (heating at 175°C for 5.5 hours). The pressure applied to the compound during transfer molding was 6.9 MPa. The dimensions of the toroidal core were 20 mm outer diameter x 12 mm inner diameter x 2 mm thickness. The specific gravity of the toroidal core was measured. The specific gravity of Example 1 (unit: none) is shown in Table 1 below. The relative permeability of the toroidal core was measured. An impedance analyzer (E4990A) manufactured by Keysight Technologies, Inc. was used to measure the relative permeability. The frequency during the measurement of relative permeability was 1 MHz. The relative permeability (unit: none) of Example 1 is shown in Table 1 below.

[0087] <Bending strength> A sample consisting of a cured compound was obtained by transfer molding of the compound at 175°C, followed by post-curing (heating at 175°C for 5.5 hours). The pressure applied to the compound during transfer molding was 13.5 MPa. The sample was shaped like a rectangular parallelepiped. The dimensions of the sample were 80 mm (length) x 10 mm (width) x 3.0 mm (thickness). A three-point support bending test was performed using an Autograph AGS-500A manufactured by Shimadzu Corporation. In the bending test, one surface of the sample was supported by two supports placed 64 mm apart. A load was applied to the other surface of the sample. The area to which the load was applied was located midway between the two supports on the other surface of the sample. The load at the point of fracture was measured as the bending strength. The bending strength was measured in air at room temperature. The bending strength (unit: MPa) of Example 1 is shown in Table 1 below.

[0088] <Spiral Flow> The compound was placed in a transfer molding machine equipped with a mold. The spiral flow of the compound was measured at a mold temperature of 175°C, an injection pressure of 6.9 MPa, and a molding time of 120 seconds. Spiral flow is the length of the compound's flow within the groove formed in the mold. In other words, spiral flow is the flow distance of the softened or liquefied compound. The shape of the groove through which the compound flows is a spiral curve (Archimedes' spiral). The easier the compound flows, the greater the spiral flow. A 100KN transfer molding machine (PZ-10 type) manufactured by Kodaira Seisakusho Co., Ltd. was used as the transfer molding machine. A mold conforming to ASTM D3123 was used as the mold. The spiral flow (unit: cm) for Example 1 is shown in Table 1 below.

[0089] <Geltime> The gel time (gelation time) of the compound at 175°C was measured. A CURELASTOMETER manufactured by ENEOS Material Corporation (formerly JSR Corporation) was used as the gel time measuring device (vulcanization tester). The gel time (in seconds) for Example 1 is shown in Table 1 below.

[0090] <Disk Flow> 5g of compound was placed on the flat surface of the lower mold. The flat upper mold was pressed against the compound, sandwiching it between the upper and lower molds. By compressing the compound between the upper and lower molds with a load of 8kg for 360 seconds, a roughly disc-shaped molded body made of the compound was formed. The temperature of the compound was maintained at 175°C during compression. The maximum and minimum diameters of the disc-shaped molded body were measured. The average of the major and minor axes corresponds to the disc flow. The disc flow (unit: mm) for Example 1 is shown in Table 1 below. The more easily the compound flows, the greater the disc flow.

[0091] (Examples 2-8 and Comparative Examples 1-4) The metal powder content in the compound of Example 2 was adjusted to the values ​​shown in Table 1 below. In Example 5, instead of "KUAMET 6B2" manufactured by Epson Atomics Corporation, "KUAMET NC1" was used as the first soft magnetic powder. The first soft magnetic powder (KUAMET NC1) in Example 5 was a powder of a soft magnetic alloy consisting of Fe, Si, Nb, B, and Cu. Each of the multiple first soft magnetic particles constituting the first soft magnetic powder in Example 5 contained one or more nanocrystals made of a soft magnetic alloy (Fe-Si-Nb-B-Cu alloy). The median diameter of the first soft magnetic powder in Example 5 was approximately 29 μm, and the cutoff diameter of the first soft magnetic powder in Example 5 was 53 μm. The fatty acid amides used in Examples 2-5 and Comparative Examples 3 and 4 were erucic acid amides, as in Example 1. In Example 6, instead of erucic acid amide (Daiwax EA), "NEUTRON" manufactured by Nippon Seika Co., Ltd. was used as the fatty acid amide. "NEUTRON" is an oleic acid amide. In Example 7, instead of erucic acid amide (Daiwax EA), "NEUTRON-2" manufactured by Nippon Seika Co., Ltd. was used as the fatty acid amide. "NEUTRON-2" is a stearic acid amide. In Example 8, instead of erucic acid amide (Daiwax EA), "BNT-22H" manufactured by Nippon Seika Co., Ltd. was used as the fatty acid amide. "BNT-22H" is a behenic acid amide. In the production of each compound in Examples 2-8 and Comparative Examples 3 and 4, the mass of fatty acid amide used in combination with 100g of epoxy resin is shown in Table 1 below. In the production of the compounds in Comparative Examples 1 and 2, fatty acid amides were not used. In the production of the compound in Comparative Example 2, zinc stearate was used instead of fatty acid amides. The mass of zinc stearate used in combination with 100 g of epoxy resin in the production of the compound in Comparative Example 2 is shown in Table 1 below.

[0092] Compounds for Examples 2-8 and Comparative Examples 1-4 were manufactured in the same manner as in Example 1, except for the matters mentioned above. Measurements for each compound in Examples 2-8 and Comparative Examples 1-4 were performed in the same manner as in Example 1. The results of the measurements for Examples 2-8 and Comparative Examples 1-4 are shown in Table 1 below. Furthermore, the iron loss (core loss) for each of Examples 1 and 5 was measured by the following method. The primary winding was wound 20 turns around the toroidal core (powder core) described above. Furthermore, the secondary winding was wound 5 turns around the toroidal core. The iron loss of the toroidal core around which the primary and secondary windings were wound was measured. The B-H analyzer described above was used to measure the iron loss. The frequency of the AC during the iron loss measurement was 1 MHz. The maximum magnetic flux density of the toroidal core during the iron loss measurement was 20 mT. The iron loss for each of Examples 1 and 5 is shown in Table 1 below. Iron loss shown in Table 1 below (unit: kW / m 3 This is the iron loss of the toroidal core per unit volume of the toroidal core.

[0093] [Table 1] [Industrial applicability]

[0094] For example, a compound relating to one aspect of this disclosure may be used as a raw material for an inductor. [Explanation of Symbols]

[0095] 1...Electronic component (inductor), 2...Hardened compound, 2dc...Powdered magnetic core, 3...Terminal electrode, 5...Coil, 5a, 5b...Coil lead-out section.

Claims

1. The invention comprises a metal powder and a resin composition, The aforementioned metal powder is a soft magnetic material. The resin composition comprises a thermosetting resin and a fatty acid amide. The proportion of the fatty acid amide in the resin composition is 1.2% by mass or more and 20.1% by mass or less. Compound.

2. The fatty acid amide is at least one selected from the group consisting of oleic acid amide, stearic acid amide, behenic acid amide, erucic acid amide, ethylenebisoleic acid amide, hexamethylenebisoleic acid amide, dioleyl adipic acid amide, methylenebiserucic acid amide, ethylenebiserucic acid amide, N,N'-hexamethylenebis(erucic acid amide), m-xylenebiserucic acid amide, p-phenylenebiserucic acid amide, methylenebisstearic acid amide, and ethylenebislauric acid amide. The compound according to claim 1.

3. The content of the metal powder in the compound is 93.0% by mass or more and 98.0% by mass or less. The compound according to claim 1.

4. The minimum melt viscosity of the compound at 175°C is 10 Pa·s or more and 250 Pa·s or less. The compound according to claim 1.

5. The resin composition further comprises at least one component selected from the group consisting of a curing agent, a curing accelerator, a coupling agent, and a wax. The compound according to claim 1.

6. The content of the fatty acid amide in the compound is 0.04% by mass or more and 0.70% by mass or less. The compound according to claim 1.

7. The mass of the fatty acid amide relative to 100 parts by mass of the thermosetting resin is 2.0 parts by mass or more and 40.0 parts by mass or less. The compound according to claim 1.

8. The aforementioned metal powder includes nanocrystals. The compound according to claim 1.

9. The raw material for powdered porcelain core, The compound according to claim 1.

10. It is a sealing material. The compound according to claim 1.

11. A compound comprising the compound according to any one of claims 1 to 8, Molded body.

12. A cured compound according to any one of claims 1 to 8.

13. A cured compound according to claim 12, Powder magnetic core.

14. The iron loss of the powdered magnetic core per unit volume is 396 kW / m². ３ The following: The maximum magnetic flux density of the compacted magnetic core during the measurement of the iron loss was 20 mT. The frequency of the AC current during the measurement of the iron loss is 1 MHz. The compacted magnetic core according to claim 13.

15. The relative permeability of the aforementioned powdered magnetic core is 59 or higher. The compacted magnetic core according to claim 13.

16. The compacted magnetic core according to claim 13, Coil and, Equipped with, The compacted magnetic core is placed inside the coil. Electronic components.

17. The iron loss of the powdered magnetic core per unit volume is 396 kW / m². ３ The following: The maximum magnetic flux density of the compacted magnetic core during the measurement of the iron loss was 20 mT. The frequency of the AC current during the measurement of the iron loss is 1 MHz. The electronic component according to claim 16.

18. The relative permeability of the aforementioned powdered magnetic core is 59 or higher. The electronic component according to claim 16.

19. A cured compound according to claim 12, Electronic components.

20. Coil and, The cured product and, Equipped with, The coil is sealed in the cured material. The electronic component according to claim 19.

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