Method for processing workpieces, method for manufacturing wafers, and method for manufacturing chips

Abstract

The resin component, which is placed on the workpiece before processing, can be easily peeled off after processing. [Solution] The method includes: a first coating step of covering the first surface side of the central region of a workpiece, which includes a central region and an outer peripheral region, with a first resin member; a second coating step of covering the first surface sides of the outer peripheral region and the central region with a second resin member to form a workpiece unit; a processing step of processing the workpiece unit; an exposure step of removing a portion of the first resin member to form a groove or step in a region that does not overlap with the center of the workpiece, and exposing the first resin member on the inner surface of the groove or step; and a peeling step of peeling the first resin member from the workpiece in a region closer to the center of the workpiece than the groove or step, thereby removing the second resin member together with the first resin member.

Description

Technical Field

[0001] The present invention relates to a processing method for processing a workpiece such as a substrate made of a semiconductor material, and a manufacturing method for manufacturing a wafer or a chip by processing the workpiece.

Background Art

[0002] A device chip (chip) used in an electronic device such as a mobile phone or a computer is manufactured by grinding and thinning a wafer on which a plurality of devices are arranged side by side on the front surface from the back surface side, and dividing the wafer for each device. Further, the wafer on which the devices are arranged is manufactured by performing predetermined processing on a substrate cut out from an ingot.

[0003] The division of a workpiece such as a wafer or a substrate is performed by a cutting device provided with an annular cutting blade, a laser processing device for laser processing the workpiece, etc., and the grinding of the workpiece is performed by a grinding device provided with grinding wheels arranged in a circle. Further, in the process of manufacturing a chip, the workpiece is subjected to various processes such as polishing, cleaning, drying, heating, cooling, taping, tape peeling, inspection, imaging, conveyance, storage, etc.

[0004] In a processing device (processing device etc.) for performing any of the processes, the workpiece is held by a holding table such as a chuck table with the back surface side exposed upward, and the workpiece held by the holding table is processed. At this time, in order to protect the held surface of the workpiece or for other purposes, a protective member such as a tape in which a base material layer and an adhesive layer are laminated is preliminarily adhered to the held surface of the workpiece.

[0005] Also, in some cases, a liquid resin is applied to the workpiece as a protective member or for other purposes, and this is cured to form a resin film. Further, when applying the liquid resin to the workpiece, a resin sheet may be disposed on the workpiece in advance and the liquid resin may be applied to the resin sheet (see, for example, Patent Document 1). The resin member disposed on the workpiece is removed from the workpiece after the workpiece is processed.

Prior Art Documents

[0006] [Patent Document 1] Japanese Patent Publication No. 2022-162633 [Overview of the project] [Problems that the invention aims to solve]

[0007] If the resin component is firmly fixed to the workpiece, a large force is applied to the workpiece when the resin component is removed, causing damage to the workpiece. In addition, some of the resin component may remain on the workpiece as residue. On the other hand, if the resin component is weakly fixed to the workpiece, it may detach from the workpiece during processing, preventing the resin component from fully performing its function.

[0008] The present invention has been made in view of the above problems, and its object is to provide a method for processing a workpiece in which a resin member disposed on the workpiece before processing can be easily peeled off after processing the workpiece, and a manufacturing method for processing a workpiece to produce a wafer or chip. [Means for solving the problem]

[0009] According to one aspect of the present invention, a method for processing a workpiece is provided, comprising: a first coating step of covering the first surface side of the central region of a workpiece, which includes a central region and an outer peripheral region located outside the central region, with a first resin member; a second coating step, after the first coating step, covering the first surface sides of the outer peripheral region and the central region with a second resin member to form a workpiece unit; a processing step, after the second coating step, processing the workpiece unit; an exposure step, after the processing step, removing a part of the first resin member to form a groove or step in a region that does not overlap the center of the workpiece, and exposing the first resin member on the inner surface of the groove or step; and a peeling step, in a region closer to the center of the workpiece than the groove or step, peeling the first resin member from the workpiece to remove the second resin member together with the first resin member.

[0010] Preferably, the first resin member is an ultraviolet-curable liquid resin, and in the first coating step, the first resin member is supplied to the first surface side of the workpiece, and then the first resin member is cured by irradiating it with ultraviolet light.

[0011] Preferably, the second resin member is an ultraviolet-curable liquid resin, and in the second coating step, the second resin member is supplied to the first surface side of the workpiece, and then ultraviolet light is irradiated onto the second resin member to cure it.

[0012] More preferably, the processing step involves forming a recess on a second surface of the workpiece opposite to the first surface and an annular projection surrounding the recess, and the exposure step involves dividing the workpiece in the region overlapping with the groove, simultaneously with the formation of the groove, so as to cut off the annular projection from the workpiece.

[0013] Preferably, the second resin member has the function of suppressing the peeling of the first resin member from the workpiece during the processing step.

[0014] Furthermore, according to another aspect of the present invention, a wafer manufacturing method is provided, comprising: a first coating step of covering the first surface side of the central region of the workpiece with a first resin member; a second coating step after the first coating step of covering the first surface side of the outer peripheral region and the central region with a second resin member to form a workpiece unit; a thinning step after the second coating step of processing the workpiece from the second surface side opposite to the first surface to thin the workpiece to a predetermined thickness and manufacture a wafer; an exposure step after the thinning step of removing a part of the first resin member to form a groove or step in a region that does not overlap with the center of the wafer and exposing the first resin member on the inner surface of the groove or step; and a peeling step of peeling the first resin member from the wafer in a region closer to the center of the wafer than the groove or step, thereby removing the second resin member together with the first resin member.

[0015] Preferably, the second resin member has the function of suppressing the peeling of the first resin member from the workpiece during the thinning step.

[0016] Furthermore, according to yet another aspect of the present invention, a method for manufacturing a chip is provided, which involves dividing a workpiece including a central region and an outer peripheral region located outside the central region, and comprising: a first coating step of covering the first surface side of the central region of the workpiece with a first resin member; a second coating step, after the first coating step, covering the outer peripheral region and the first surface side of the central region with a second resin member to form a workpiece unit; a dividing step, after the second coating step, dividing the workpiece to manufacture a plurality of chips; an exposure step, after the second coating step, removing a part of the first resin member to form a groove or step and exposing the first resin member on the inner surface of the groove or step; and a peeling step, in a region of the first resin member closer to the center of the first resin member than the groove or step, peeling the first resin member from the chip to remove the second resin member together with the first resin member.

[0017] Preferably, the second resin member has the function of suppressing the peeling of the first resin member from the workpiece during the splitting step. [Effects of the Invention]

[0018] In a wafer processing method, wafer manufacturing method, and chip manufacturing method according to one aspect of the present invention, the first surface side of the central region of a workpiece is covered with a first resin member, and then the first surface side of the outer peripheral region and the central region of the workpiece is covered with a second resin member to form a workpiece unit. Then, workpiece processing is performed, such as thinning the workpiece to manufacture a wafer or dividing the workpiece to manufacture a chip. After processing the workpiece, the first resin member and the second resin member are peeled off from the workpiece (wafer, chip). At this time, a part of the first resin member is removed to form a groove or a stepped portion, and the first resin member is exposed on the inner surface of the groove or the like.

[0019] For example, during workpiece processing, the second resin component, which has relatively high adhesion, covers the first resin component and adheres closely to the workpiece in the outer peripheral region, making it difficult for the first and second resin components to peel off the workpiece. In other words, the peeling of the resin components during workpiece processing can be prevented mainly by the second resin component. Furthermore, by forming grooves or the like on the inner surface in which the first resin component is exposed, the second resin component, which contributed to suppressing the peeling of the resin components, is cut away by the grooves or the like, so the resin components can be peeled off the workpiece relatively easily without applying a large force to the workpiece. Therefore, damage to the workpiece and residue of the resin components on the workpiece can be suppressed.

[0020] Thus, in a wafer processing method, wafer manufacturing method, and chip manufacturing method according to one aspect of the present invention, the properties and functions of the resin member can be switched before and after removing a portion of the first resin member to form a groove or stepped portion on the inner surface in which the first resin member is exposed.

[0021] Therefore, according to one aspect of the present invention, there are provided a method for processing a workpiece, which can easily peel off a resin member disposed on the workpiece after the processing of the workpiece, and a manufacturing method for manufacturing a wafer or a chip by processing the workpiece.

Brief Description of the Drawings

[0022] [Figure 1] FIG. 1(A) is a cross-sectional view schematically showing a workpiece in the first coating step, and FIG. 1(B) is a cross-sectional view schematically showing a state where ultraviolet rays are irradiated onto the first resin member disposed on the workpiece. [Figure 2] FIG. 2(A) is a cross-sectional view schematically showing a workpiece in the second coating step, and FIG. 2(B) is a cross-sectional view schematically showing a state where ultraviolet rays are irradiated onto the second resin member disposed on the workpiece. [Figure 3] FIG. 3(A) is a cross-sectional view schematically showing a workpiece in a processing step according to an example, and FIG. 3(B) is a cross-sectional view schematically showing the workpiece after the processing step is performed. [Figure 4] FIG. 4(A) is a cross-sectional view schematically showing a workpiece in the exposure step, and FIG. 4(B) is a cross-sectional view schematically showing the workpiece after the exposure step is performed. [Figure 5] FIG. 5(A) is a cross-sectional view schematically showing a workpiece in the peeling step, and FIG. 5(B) is a cross-sectional view schematically showing the workpiece after the peeling step is performed. [Figure 6] FIG. 6(A) is a cross-sectional view schematically showing a workpiece in an exposure step according to a modified example, and FIG. 6(B) is a cross-sectional view schematically showing a state where the workpiece is divided to form chips. [Figure 7] FIG. 7(A) is a cross-sectional view schematically showing a workpiece in an exposure step according to another modified example, and FIG. 7(B) is a cross-sectional view schematically showing a workpiece in an exposure step according to yet another modified example. [Figure 8]Figure 8(A) is a schematic cross-sectional view showing the workpiece in the first coating step of the modified example, and Figure 8(B) is a schematic cross-sectional view showing the workpiece in the second coating step of the modified example. [Figure 9] This flowchart shows the flow of each step in the workpiece processing method (chip manufacturing method, wafer manufacturing method). [Modes for carrying out the invention]

[0023] An embodiment of one aspect of the present invention will be described with reference to the attached drawings. In the workpiece processing method according to this embodiment, the first surface of a plate-shaped workpiece made of a material such as a semiconductor is covered with a resin member, the workpiece is processed, and the resin member is removed from the workpiece. First, the workpiece, the resin member covering the workpiece, and the processing performed on the workpiece will be described.

[0024] Each figure (for example, Figure 1(A)) includes a schematic cross-sectional view of workpiece 1. Workpiece 1 is a workpiece, object to be processed, substrate, etc., and is, for example, a rectangular or circular plate-like object having a first surface 1a and a second surface 1b opposite to the first surface 1a. Workpiece 1 undergoes various processes such as polishing, washing, drying, heating, cooling, tape application, tape removal, inspection, imaging, transport, and storage.

[0025] Workpiece 1 is a wafer formed from a semiconductor material such as Si (silicon), SiC (silicon carbide), GaN (gallium nitride), GaAs (gallium arsenide), or other semiconductor materials. Multiple devices such as ICs (Integrated Circuits) and LSIs (Large Scale Integrations) are formed vertically and horizontally on the first surface 1a of workpiece 1.

[0026] For example, if workpiece 1 is thinned by grinding from the second surface 1b side, a thinned wafer is manufactured. Also, if a workpiece with multiple devices formed on the first surface 1a side is divided into individual devices, individual device chips are manufactured.

[0027] Note that Workpiece 1 is not limited to a wafer on which multiple devices are formed on the first surface 1a. Workpiece 1 does not need to have any devices formed on it. Alternatively, Workpiece 1 may be a substantially disc-shaped substrate made of a material such as sapphire, glass, or quartz. Alternatively, Workpiece 1 may be an ingot on which multiple wafers can be manufactured by forming a large number of divided surfaces in layers.

[0028] Furthermore, workpiece 1 may be a package substrate formed by sealing multiple devices arranged on a plane with a sealing resin. By grinding the sealing resin of the package substrate to thin it and then dividing the package substrate into individual devices, individual device chips of a predetermined thickness, each sealed with the sealing resin, can be formed. However, workpiece 1 does not necessarily have to be divided into individual chips.

[0029] The following describes the processing method for a workpiece according to this embodiment, using the case where workpiece 1 is a circular plate-shaped object made of a semiconductor material as an example. However, workpiece 1 is not limited to a circular plate-shaped object made of a semiconductor material.

[0030] Here, the processing performed on workpiece 1 refers not only to the machining of workpiece 1 but also to any actions performed on workpiece 1, and the properties and state of workpiece 1 may or may not change before and after the processing. The processing is not limited to actions performed on workpiece 1 in the processing steps described later, but may also include actions performed on workpiece 1 in steps other than the processing steps. There are no limitations on the specific content of the processing.

[0031] In the workpiece processing method according to this embodiment, a resin member is placed on the workpiece 1 before a predetermined processing is performed on the workpiece 1. The resin member covers the first surface 1a of the workpiece 1 to protect the surface of the workpiece 1 from processing, to support the workpiece 1 and facilitate handling of the workpiece 1, or for other purposes.

[0032] More specifically, the first resin member is disposed on the first surface 1a side of the central region 3 of workpiece 1, and the second resin member is disposed on the first surface 1a side of both the central region 3 and the outer peripheral region 5 of workpiece 1. Conversely, the main part of the area of ​​workpiece 1 where the first resin member is disposed on the first surface 1a side is the central region 3, and the main part of the area where the second resin member is disposed on the first surface 1a side is the outer peripheral region 5.

[0033] The central region 3 is, for example, the region that includes the center of workpiece 1 and is located away from the outer periphery of workpiece 1. The outer periphery region 5 is, for example, the region located outside the central region 3 of workpiece 1 and is an annular region with the outer periphery of workpiece 1 as its outer edge. Note that the central region 3 does not need to be a circular region, and the outer periphery region 5 does not need to be an annular region with a fixed width.

[0034] In the main portion of the central region 3 of workpiece 1, the first resin member is in contact with the first surface 1a, and the second resin member is arranged so as to overlap with the first resin member. In the main portion of the outer peripheral region 5 of workpiece 1, the second resin member is in contact with the first surface 1a, and the first resin member is not provided. On the first surface 1a of workpiece 1, the first resin member is covered by the second resin member from above and from the outer periphery. Preferably, the outer periphery of the first resin member is covered by the second resin member and is not exposed to the outside.

[0035] However, the first resin member does not need to be placed over the entire central region 3, nor does the second resin member need to be placed over the entire outer peripheral region 5. The first resin member may be placed over a portion of the outer peripheral region 5, and the first resin member may be partially exposed from the second resin member. The shape of the contact area between the second resin member and the workpiece 1 may be a continuous closed annular shape, or it may not be a discontinuous closed annular shape.

[0036] Here, the first resin member and the second resin member are fixed to the workpiece 1 by applying a certain adhesive force (tackiness, bonding force, fixing force) to the workpiece 1. For example, the adhesive force of the second resin member to the workpiece 1 is greater than the adhesive force of the first resin member to the workpiece 1. For example, the adhesive force of the first resin member to the workpiece 1 may be less than 20 N / 25 mm, and the adhesive force of the second resin member to the workpiece 1 may be 20 N / 25 mm or more. However, the adhesive forces of the first and second resin members are not limited to these.

[0037] For example, the first resin component is made of an ultraviolet-curable resin that hardens when irradiated with ultraviolet light, and the second resin component is also made of an ultraviolet-curable resin. The first and second resin components mainly consist of a main material that affects adhesion, shrinkage, and curability, a secondary material for adjusting curability and physical properties, and a photopolymerization initiator.

[0038] The main materials constituting the first and second resin components are selected from urethane acrylicate, epoxy acrylicate, acrylicate, polyester acrylicate, alicyclic epoxy, oxetane compounds, etc., the auxiliary materials are selected from polyfunctional acrylicate monomer, monofunctional acrylicate monomer, vinyl ether monomer, etc., and the photopolymerization initiator is appropriately selected and mixed from benzophenone-based, acetophenone-based, sulfonium salt-based, etc.

[0039] When preparing the first and second resin components to have the desired properties, the adhesion to the workpiece 1 and the volume shrinkage rate are adjusted by appropriately selecting materials from the main and auxiliary materials mentioned above and adjusting the amounts when mixing them. For example, the first and second resin components may be prepared by appropriately selecting acrylic resin and epoxy resin from the main and auxiliary materials and changing their mixing ratio to adjust their physical properties.

[0040] For example, when preparing a UV-curable resin, increasing the mixing ratio of acrylic resin to epoxy resin tends to result in a relatively strong adhesion to workpiece 1 after shrinking and curing due to UV irradiation. Conversely, decreasing the mixing ratio of acrylic resin tends to result in a relatively easy peeling from workpiece 1 after shrinking and curing due to UV irradiation.

[0041] Therefore, in order to prepare a first resin component that hardens upon irradiation with ultraviolet light and can be peeled off relatively easily from workpiece 1, for example, a liquid ultraviolet-curable resin is formed by mixing an acrylic resin and an epoxy resin selected from the above-mentioned main material and auxiliary material in approximately equal amounts (49.5% each) in addition to a photopolymerization initiator (1%).

[0042] Furthermore, in order to prepare a second resin component that hardens upon irradiation with ultraviolet light and adheres relatively strongly to the workpiece 1 compared to the first resin component, the proportion of acrylic resin is increased (for example, 69.5%) and the proportion of epoxy resin is decreased (29.5%) compared to the first resin component, and these are mixed to form a liquid ultraviolet-curable resin. It is preferable that the first and second resin components be set so that their volume shrinkage rates when irradiated with ultraviolet light are approximately the same.

[0043] However, the first resin member and the second resin member are not limited to UV-curable resins. They may be cured by irradiation with light other than ultraviolet light, or by other methods such as heat. Furthermore, the first resin member and the second resin member may be supplied to the first surface 1a side of the workpiece 1 in liquid resin form and cured to be fixed to the workpiece 1 as a resin film, or they may be arranged on the workpiece 1 in the form of a sheet.

[0044] Furthermore, if the adhesion force of the second resin member to the workpiece 1 is greater than the adhesion force of the first resin member to the workpiece 1, this relationship does not need to be maintained throughout the entire process of the workpiece processing method according to this embodiment. It is preferable that this relationship holds true with respect to adhesion force when the resin members disposed on the workpiece 1 are peeled off.

[0045] More specifically, when the first resin member and the second resin member are placed on the workpiece 1 and processing is performed on the workpiece 1, the adhesion force of the second resin member to the workpiece 1 may be equal to or less than the adhesion force of the first resin member to the workpiece 1. In this case, the peeling of the resin member from the workpiece 1 is suppressed by the first resin member. At this time, the second resin member suppresses the peeling of the first resin member from the workpiece 1 by performing a function that prevents deterioration of the first resin member due to the processing of the workpiece 1. Specifically, when a liquid is supplied to the workpiece 1 during processing of the workpiece 1, and the first resin member has the property of being deteriorated by this liquid, the second resin member suppresses the peeling of the first resin member by preventing this liquid from coming into contact with the first resin member.

[0046] In this case, it is preferable that a treatment is performed to alter the first resin member when peeling the resin member from the workpiece 1. For example, the first resin member may be irradiated with ultraviolet light, the first resin member may be heated, or a specific liquid may be applied to the first resin member exposed on the inner surface of a groove or the like, as described later. At this time, the adhesion force of the second resin member to the workpiece 1 becomes greater than the adhesion force of the first resin member to the workpiece 1.

[0047] Here, when comparing the adhesion force of the second resin member to workpiece 1 with the adhesion force of the first resin member to workpiece 1, it is not necessarily required that both are in contact with workpiece 1. If both are in contact with workpiece 1 in a similar manner, and the force required to peel off the first resin member is less than the force required to peel off the second resin member, then the relationship that the adhesion force of the second resin member to workpiece 1 is greater than the adhesion force of the first resin member to workpiece 1 is established.

[0048] Furthermore, the second resin component has the function of preventing the first resin component from peeling off during processing of workpiece 1, etc. For example, the second resin component protects the first resin component from processing performed on workpiece 1, etc., by covering it with the first resin component. More specifically, the second resin component suppresses deterioration of the first resin component by preventing contact between the first resin component and the liquid used in the processing. Alternatively, during processing of workpiece 1, etc., the second resin component covers the first resin component and directly contacts workpiece 1 with high adhesion force, thereby preventing the first resin component from peeling off.

[0049] On the other hand, the first resin member has the function of covering the workpiece 1 while being protected by the second resin member. Furthermore, the first resin member has the function of easily peeling off the workpiece 1, thereby facilitating the peeling of the second resin member from the workpiece 1.

[0050] Next, the workpiece processing method according to this embodiment will be described. Figure 8 is a flowchart showing the flow of each step. In the workpiece processing method according to this embodiment, all the steps shown in Figure 8 may be performed, some steps may be omitted, and steps not shown in Figure 8 may be performed. Each step will be described in detail below.

[0051] In the workpiece processing method according to this embodiment, first, a first coating step S10 is performed in which the first surface 1a side of the central region 3 of the workpiece 1, which includes the central region 3 and the outer peripheral region 5 located outside the central region 3, is coated with a first resin member. Figure 1(A) is a schematic cross-sectional view showing the workpiece 1 in the first coating step S10. The first coating step S10 shown in Figure 1(A) is performed by a spin coating method. However, the first coating step S10 may be performed by a method other than the spin coating method.

[0052] When the first coating step S10 is performed by the spin coating method, the first coating step S10 is performed by the spin coating apparatus 2. The spin coating apparatus 2 includes a support table (not shown) that rotatably supports the workpiece 1 to be coated, and a liquid resin supply unit 4 that supplies liquid resin to the workpiece 1 supported on the support table.

[0053] The support table is connected to a rotational drive source, such as a motor, which rotates the support table around a rotation axis that passes through the center of the upper surface on which the workpiece 1 is placed. The workpiece 1 is placed on the support table so that its center aligns with the center of the upper surface of the support table. At this time, the spin coating device 2 can rotate the workpiece 1 around the rotation axis by operating the rotational drive source.

[0054] The liquid resin supply unit 4 has a supply nozzle 6 having a downward-facing discharge port 8. The supply nozzle 6 includes a rotatable shaft portion (not shown) that extends perpendicularly to the upper surface of the support table, and an arm portion that extends from the upper end of the shaft portion in a direction parallel to this upper surface. A liquid resin supply source, such as a supply tank (not shown), is connected to the base end of the shaft portion, and a discharge port 8 is provided at the tip of the arm portion. The supply nozzle 6 can discharge a predetermined amount of liquid resin from the discharge port 8 at a predetermined flow rate.

[0055] When the shaft of the supply nozzle 6 is rotated, the discharge port 8 moves along an arc-shaped trajectory with the arm as its radius. The discharge port 8 can move between being above the support table and being outside the support table. The length of the arm is such that rotating the shaft positions the discharge port 8 above the center of the support table.

[0056] In the first covering step S10, the workpiece 1 is transported to the upper surface of the support table. At this time, the first surface 1a of the workpiece 1 that will be covered by the first resin member is exposed upwards, and the second surface 1b of the workpiece 1 faces the upper surface of the support table. At this time, the position of the workpiece 1 is adjusted so that its center coincides with the center of the upper surface of the support table. The position of the supply nozzle 6 is also adjusted so that the discharge port 8 is positioned above the center of the workpiece 1.

[0057] Next, the support table starts rotating around the axis of rotation, and the liquid resin (first resin component) 7 is discharged from the discharge port 8. The liquid resin 7 discharged near the center of the first surface 1a of the workpiece 1 spreads outwards on the first surface 1a due to the centrifugal force accompanying the rotation of the workpiece 1.

[0058] In the first coating step S10, the liquid resin 7 does not cover the entire first surface 1a of the workpiece 1. It is preferable to allow the liquid resin 7 to reach an area (central area 3) a predetermined distance inward from the outer periphery of the first surface 1a, and not allow the liquid resin 7 to advance to the area outside that area (outer periphery area 5). Conversely, the area of ​​the first surface 1a that the liquid resin 7 reaches in the first coating step S10 becomes the central area 3, and the area surrounded by the central area 3 becomes the outer periphery area 5.

[0059] Here, the area on the first surface 1a where the liquid resin 7 spreads varies depending on the properties of the liquid resin 7 (material, viscosity, temperature, etc.), the state of the first surface 1a of the workpiece 1, the amount of liquid resin 7 supplied, the rotation speed of the workpiece 1, etc. Therefore, in the first coating step S10, the amount of liquid resin 7 supplied and the rotation speed of the workpiece 1 are determined so that the liquid resin 7 covers the central region 3.

[0060] However, in the first coating step S10, the liquid resin 7 may partially reach the outer peripheral region 5 on the first surface 1a of the workpiece 1, and furthermore, the liquid resin 7 may partially reach the outer peripheral portion of the first surface 1a.

[0061] In the first coating step S10, liquid resin (first resin component) 7 is supplied to the workpiece 1, and then the liquid resin 7 is cured. If the liquid resin 7 is an ultraviolet-curable resin, ultraviolet light is irradiated onto the liquid resin 7 supplied to the workpiece 1 to cure the liquid resin 7 and form a resin film. Figure 1(B) is a schematic cross-sectional view showing the irradiation of the liquid resin (first resin component) 7 with ultraviolet light 12.

[0062] The irradiation of the liquid resin 7 with ultraviolet light 12 may be carried out, for example, using an ultraviolet irradiation device. In this case, in the first coating step S10, the liquid resin 7 is supplied to the first surface 1a of the workpiece 1 in the spin coating device 2, and then the workpiece 1 is moved to the ultraviolet irradiation device. The ultraviolet irradiation device has an ultraviolet source 10 such as an ultraviolet LED or an ultraviolet fluorescent lamp that irradiates the workpiece 1 with ultraviolet light 12, and the ultraviolet source 10 irradiates the liquid resin 7 with ultraviolet light 12.

[0063] Alternatively, the spin coating apparatus 2 may be equipped with an ultraviolet light source 10 in addition to the liquid resin supply unit 4. That is, the spin coating apparatus 2 may also function as an ultraviolet irradiation device. In this case, after the supply of liquid resin (first resin member) 7 to the workpiece 1 is completed in the spin coating apparatus 2, ultraviolet light 12 is irradiated onto the liquid resin 7 by the ultraviolet light source 10.

[0064] In any case, by irradiating the liquid resin 7 supplied to the workpiece 1 with ultraviolet light 12 to cure the liquid resin 7, a resin film 9 composed of the first resin member is disposed in the central region 3 of the first surface 1a of the workpiece 1.

[0065] However, the first resin component is not limited to an ultraviolet-curable liquid resin. For example, the first resin component may be made of a thermosetting resin material. In this case, the resin film 9 made of the first resin component is disposed on the workpiece 1 by heating the first resin component supplied to the central region 3 of the workpiece 1 with a heater or infrared lamp or the like.

[0066] Furthermore, the first coating step S10 is not limited to the case where the first resin member is supplied to the central region 3 of the workpiece 1 in the form of a liquid resin 7. For example, a sheet-like first resin member may be placed on the first surface 1a of the workpiece 1. In this case, a sheet-like first resin member, which has been pre-formed to a shape and size corresponding to the shape and size of the central region 3, is placed on the workpiece 1 so as to overlap with the central region 3. Moreover, in this case, the first resin member does not have to be an ultraviolet-curable resin.

[0067] Alternatively, a sheet-like first resin member, large enough to cover the entire surface 1a of the workpiece 1, is placed on the workpiece 1, and then the first resin member is cut on the workpiece 1 near the boundary between the central region 3 and the outer peripheral region 5. In this case, the first resin member is removed from the workpiece 1 outside the cutting groove formed in the sheet-like first resin member, thereby placing the resin film (first resin member) 9 on the workpiece 1.

[0068] As explained above, in the first coating step S10, the first surface 1a side of the central region 3 of the workpiece 1 is covered by the first resin member, while the first surface 1a side of the outer peripheral region 5 of the workpiece 1 is not covered by the first resin member and is exposed to the outside.

[0069] However, a portion of the first surface 1a side of the central region 3 does not need to be covered by the first resin member, and a portion of the first surface 1a side of the outer peripheral region 5 may be covered by the first resin member. Even in this case, at least a portion of the first surface 1a side of the outer peripheral region 5 is not covered by the first resin member, and the first resin member does not cover the entire first surface 1a side of the outer peripheral region 5.

[0070] In the workpiece processing method according to this embodiment, a second coating step S20 is performed after the first coating step S10. Next, the second coating step S20 will be described. In the second coating step S20, the outer peripheral region 5 and the central region 3 of the workpiece 1 are covered with a second resin member on the first surface 1a side to form a workpiece unit.

[0071] Figure 2(A) is a schematic cross-sectional view showing workpiece 1 in the second coating step S20. The second coating step S20 shown in Figure 2(A) is carried out by the spin coating method. However, the second coating step S20 may be carried out by a method other than the spin coating method. The second coating step S20 is carried out in the same manner as the first coating step S10.

[0072] When the second coating step S20 is performed by a spin coating method, for example, the second coating step S20 may be performed immediately after the first coating step S10 by the spin coating apparatus 2 described in Figure 1(A). For example, the liquid resin supply unit 4 that supplies the first resin member to the workpiece 1 may also supply the second resin member to the workpiece 1. However, the spin coating apparatus 2 may also be provided with a dedicated liquid resin supply unit for supplying the second resin member to the workpiece 1, and the second resin member may be supplied to the workpiece 1 by this dedicated liquid resin supply unit.

[0073] When the second coating step S20 is performed in the spin coating apparatus 2 following the first coating step S10, the rotation of the support table around the rotation axis is started, and the discharge of liquid resin (second resin member) 11 from the discharge port 8 is started. The liquid resin 11 discharged near the center of the first surface 1a of the workpiece 1 spreads outward on the first surface 1a due to the centrifugal force accompanying the rotation of the workpiece 1. At this time, the liquid resin 11 covers the upper surface of the resin film (first resin member) 9.

[0074] In the second coating step S20, the outer peripheral region 5 and the central region 3 of the workpiece 1 are covered with liquid resin (second resin member) 11 on the first surface 1a side. In particular, it is preferable that the liquid resin 11 covers the entire upper surface of the resin film 9, and it is more preferable that the liquid resin 11 covers the entire first surface 1a of the workpiece 1.

[0075] Here, the area on the first surface 1a where the liquid resin 11 spreads varies depending on the properties of the liquid resin 11 (material, viscosity, temperature, etc.), the state of the first surface 1a of the workpiece 1, the amount of liquid resin 11 supplied, the rotation speed of the workpiece 1, etc. Therefore, conditions such as the amount of liquid resin 11 supplied and the rotation speed of the workpiece 1 are determined so that the liquid resin 11 covers the entire area on the first surface 1a side of the workpiece 1, and the second coating step S20 is performed according to these conditions.

[0076] In the second coating step S20, liquid resin (second resin member) 11 is supplied to the workpiece 1, and then the liquid resin 11 is cured in the same manner as in the first coating step S10. If the liquid resin 11 is an ultraviolet-curable resin, ultraviolet light is irradiated onto the liquid resin 11 supplied to the workpiece 1 to cure the liquid resin 11 and form a resin film. Figure 2(B) is a schematic cross-sectional view showing the irradiation of ultraviolet light 12 onto the liquid resin (second resin member) 11. The irradiation of ultraviolet light 12 onto the liquid resin 11 is preferably carried out using the ultraviolet irradiation device described above.

[0077] By irradiating the liquid resin 11 supplied to the workpiece 1 with ultraviolet light 12 to cure the liquid resin 11, a resin film 13 composed of the second resin member is arranged in the central region 3 and the outer peripheral region 5 of the first surface 1a of the workpiece 1. In this way, a workpiece unit 15 is formed in which the workpiece 1, the resin film (first resin member) 9, and the resin film (second resin member) 13 are integrated.

[0078] Alternatively, before curing the liquid resin 11, the liquid resin 11 supplied to the workpiece 1 may be pressed from above with a flat pressing member. In this case, it is preferable to maintain the orientation of the pressing surface of the pressing member parallel to the second surface 1b of the workpiece 1 while pressing the liquid resin 11. This ensures that the upper surface of the resin film 13 formed by the curing of the liquid resin 11 is parallel to the second surface (back surface) 1b of the workpiece 1.

[0079] Depending on the subsequent processing performed on the work unit 15 (work 1), if the upper surface of the resin film 13 is parallel to the second surface (back surface) 1b of the work 1, the processing may be performed appropriately and with high precision.

[0080] For example, when placing the workpiece unit 15 on the support table (chuck table) of the processing device with the second surface 1b of the workpiece 1 facing upwards, if the upper surface of the resin film 13 is parallel to the second surface (back surface) 1b of the workpiece 1, the second surface 1b will be parallel to the upper surface of the support table. In this state, if a thinning process of the workpiece 1, such as grinding, is performed from the second surface 1b side of the workpiece 1, it is easier to thin the entire surface of the workpiece 1 to a uniform thickness. Thus, pressing the liquid resin 11 supplied to the workpiece 1 with a flat pressing member from above before the liquid resin 11 hardens can be useful for subsequent processing.

[0081] Furthermore, the second resin member is not limited to an ultraviolet-curable liquid resin, similar to the first resin member, but may be composed of a thermosetting resin material. Also, the second resin member is not limited to a liquid resin, and a sheet-like second resin member may be arranged on the first surface 1a of the workpiece 1 so as to cover the resin film (first resin member) 9.

[0082] In this case, a sheet-like second resin member, which has been pre-formed to a shape and size corresponding to the shape and size of the first surface 1a of the workpiece 1, is placed on the first surface 1a of the workpiece 1. Alternatively, a sheet-like second resin member large enough to cover the entire first surface 1a of the workpiece 1 is placed on the workpiece 1, and then the second resin member is cut along the outer circumference of the workpiece 1.

[0083] As described above, in the second coating step S20, the central region 3 and the outer peripheral region 5 of the workpiece 1 are covered with a resin film (second resin member) 13. In the central region 3 of the workpiece 1, the resin film (first resin member) 9 is covered with the resin film (second resin member) 13. In the outer peripheral region 5 of the workpiece 1, the resin film (second resin member) 13 comes into contact with the first surface 1a of the workpiece 1.

[0084] Preferably, the resin film (first resin member) 9 is completely covered by the resin film (second resin member) 13 and not exposed to the outside from the resin film 13. In this case, the resin film 9 is protected by the resin film 13. However, the resin film 9 may be partially exposed from the resin film 13. Even in this case, the protective effect of the resin film 13 on the resin film 9 will still be considerable.

[0085] After the second coating step S20, a processing step S30 is performed on the work unit 15. In processing step S30, processing is performed on the work 1 of the work unit 15. The processing may include, for example, polishing, washing, drying, heating, and cooling. Alternatively, it may include tape application, tape removal, inspection, imaging, transport, and storage.

[0086] Furthermore, in processing step S30, parts of the work unit 15 other than workpiece 1 may be processed. For example, the resin film (first resin member) 9 or the resin film (second resin member) 13 of the work unit 15 may be processed. In this case, for example, the processing of the work unit 15 in processing step S30 may include inspection of the fixing status of the resin film 9 and resin film 13 to workpiece 1, and inspection of the flatness of the upper surface of the resin film 13.

[0087] The following describes a case in which, as a process for the work unit 15 in processing step S30, grinding is performed to form a recess and an annular protrusion surrounding the recess on the second surface (back surface) 1b of the work unit 1 opposite the first surface (front surface) 1a. Figure 3(A) is a schematic cross-sectional view showing the grinding of the work unit 1 from the second surface 1b side as an example of processing step S30. Figure 3(B) is a schematic cross-sectional view showing the work unit 1 with the recess 17 and annular protrusion 19 formed on the second surface 1b.

[0088] The grinding process of the workpiece 1 in processing step S30 is carried out by the grinding device 14. The grinding device 14 comprises a holding table (chuck table, not shown) that holds the workpiece 1 placed on its upper surface, and a grinding unit 16 that grinds the workpiece 1 held by the holding table. The holding table is rotatable around a rotation axis that passes through its upper surface.

[0089] The grinding unit 16 has a spindle housing (not shown). A ball screw type lifting mechanism (not shown) is connected to the spindle housing. The grinding unit 16 moves up and down by the lifting mechanism. A portion of a cylindrical spindle 18 is rotatably housed inside the spindle housing.

[0090] A rotational drive source (not shown), such as a motor, is provided on a portion of the upper part of the spindle 18. The lower end (tip) of the spindle 18 protrudes below the lower end of the spindle housing. A disc-shaped mount 20 is fixed to the lower end of the spindle 18. An annular grinding wheel 26 is mounted on the lower surface of the mount 20. In other words, the grinding wheel 26 is attached to the lower end of the spindle 18 via the mount 20.

[0091] The grinding wheel 26 has an annular wheel base (base) 22 made of a metal such as an aluminum alloy. On the lower surface (one side) of the wheel base 22, a plurality of grinding wheels 24 are arranged in an annular shape at approximately equal intervals along the circumferential direction of the wheel base 22.

[0092] Each grinding wheel 24 has abrasive grains made of cBN (cubic boron nitride), diamond, etc., and a bonding material such as a vitrified bond or resin bond for fixing the abrasive grains. When the spindle 18 is rotated, the annular region defined by the movement trajectories of the bottom surfaces of the multiple grinding wheels 24 becomes a grinding surface that grinds the second surface 1b of the workpiece 1 held by the holding table.

[0093] When performing a grinding process to form a recess 17 and an annular protrusion 19 on the second surface 1b of workpiece 1, the size of each grinding wheel 24 and its arrangement on the wheel base 22 are determined such that the diameter of the grinding surface is less than or equal to the radius of the second surface 1b of workpiece 1.

[0094] On the wheel base 22, on the inner circumference side of the grinding wheel 24, there are multiple openings (not shown) formed at approximately equal intervals along the circumferential direction of the wheel base 22, which can supply grinding water such as pure water to the grinding wheel 24, etc. During grinding, the grinding water is used for cooling and removal of grinding debris.

[0095] In processing step S30, first, the work unit 15 is placed on the upper surface of the holding table with the second surface (back surface) 1b of the workpiece 1 facing upwards, and the work unit 15 is held by the holding table. At this time, the position of the workpiece 1 is adjusted so that the center of the workpiece 1 and the rotation center of the holding table coincide. Note that the first surface 1a of the workpiece 1 is protected by the resin film (first resin member) 9 and the resin film (second resin member) 13, so the first surface 1a does not come into direct contact with the holding table.

[0096] Next, the relative positions of the grinding unit 16 and the holding table are adjusted so that the grinding wheel 26 is positioned above the workpiece 1, and in particular, so that the movement trajectory of the grinding wheel 26 (the grinding surface of the grinding wheel 24) passes above the center of the workpiece 1.

[0097] Subsequently, the grinding wheel 26 and the holding table are rotated around their respective axes, and the grinding unit 16 is lowered (i.e., fed for grinding). For example, the grinding wheel 26 is rotated at 4000 rpm, the holding table at 300 rpm, and the grinding unit 16 is lowered at a speed of 0.6 μm / s. The flow rate of the grinding water is, for example, 4.0 L / min.

[0098] When the bottom surface of the grinding wheel 24 contacts the second surface 1b of the workpiece 1, the workpiece 1 is ground from the second surface 1b side. When the grinding surface is fed from the second surface 1b of the workpiece 1 to a predetermined depth, a recess 17 is formed in the center of the second surface 1b side of the workpiece 1, as shown in Figure 3(B), and the unground area around the recess 17 remains as an annular protrusion 19. When the recess 17 formed on the second surface 1b side of the workpiece 1 reaches the predetermined depth, the grinding feed of the grinding unit 16 is stopped.

[0099] Furthermore, if multiple devices are pre-formed on the first surface 1a of workpiece 1, the outer periphery of the first surface 1a of workpiece 1 becomes the outer peripheral surplus region where no devices are formed, and the region surrounded by the outer peripheral surplus region where devices are formed becomes the device region. The recess 17 is then mainly formed on the second surface 1b, which corresponds to the device region.

[0100] Here, the region (central region 3) where the resin film (first resin member) 9 is formed on the first surface 1a side of workpiece 1 does not need to perfectly correspond to the region on the second surface 1b where the recess 17 is formed. Also, the region (outer peripheral region 5) where the resin film (second resin member) 13 on the first surface 1a side of workpiece 1 makes contact does not need to perfectly correspond to the region on the second surface 1b where the annular protrusion 19 is formed.

[0101] As described later, the annular projection 19 is removed from the work unit 15. Until then, the annular projection 19 reinforces the thinned recess 17 of the workpiece 1. Therefore, the annular projection 19 makes it easier to handle the workpiece 1.

[0102] The grinding fluid supplied to workpiece 1 during grinding does not come into contact with the resin film (first resin member) 9 disposed on the first surface 1a of workpiece 1. This is because the resin film 9 is covered by the resin film (second resin member) 13. In this way, since the resin film 9 is protected by the resin film 13, even when the fixing force of the resin film 9 to workpiece 1 is relatively low, the resin film 9 will not peel off from workpiece 1 during processing by the workpiece unit 15.

[0103] Furthermore, even when the fixing force of the resin film (first resin member) 9 to the workpiece 1 is sufficiently high, this fixing force may decrease if grinding water comes into contact with the resin film 9. However, since the resin film (first resin member) 9 is covered by the resin film (second resin member) 13, contact of the grinding water with the resin film 9 is suppressed by the resin film 13. As a result, the resin film 9 does not peel off from the workpiece 1 during processing by the workpiece unit 15.

[0104] Furthermore, even if the resin film (first resin member) 9 has sufficient resistance to grinding water, if the adhesion force of the resin film (second resin member) 13 to the workpiece 1 is greater than that of the resin film (first resin member) 9, the resin film 13 prevents the resin film 9 from peeling off the workpiece 1. In this way, the resin film (second resin member) 13 has the function of preventing the resin film (first resin member) 9 from peeling off the workpiece 1 during processing of the workpiece unit 15.

[0105] In processing step S30, a disc-shaped wafer may be ground as workpiece 1, or the entire surface of the second surface 1b may be ground. In this case, performing processing step S30 will result in a thinned wafer. In other words, processing step S30 is a thinning step in which workpiece 1 is processed from the second surface 1b side opposite to the first surface 1a to thin the workpiece 1 to a predetermined thickness and manufacture a wafer.

[0106] In the workpiece processing method according to this embodiment, if a thinning step is performed as processing step S30, a thinned wafer is manufactured. In this case, the workpiece processing method according to this embodiment becomes a wafer manufacturing method. Therefore, the above and below descriptions of each step are referred to as descriptions of each step of a wafer manufacturing method. In this case, in the above and below descriptions, workpiece 1 is read as wafer.

[0107] In processing step S30, when grinding the entire area of ​​the second surface 1b of a wafer as workpiece 1, a grinding wheel 26 having a diameter equal to the diameter of the second surface 1b of the wafer is used. In this grinding wheel 26, the size of each grinding wheel 24 and its arrangement on the wheel base 22 are determined so that the diameter of the grinding surface is equal to the diameter of the second surface 1b of workpiece 1. When grinding the second surface 1b of the wafer, the position of the grinding wheel 26 is adjusted in advance so that the annular grinding surface of the grinding wheel 26 coincides with the center of the wafer.

[0108] Furthermore, in processing step S30, elements of the work unit 15 other than the workpiece 1 may be processed. For example, in processing step S30, a resin member in close contact with the workpiece 1 may be processed. More specifically, in processing step S30, prior to thinning the workpiece 1 by grinding, the resin member in close contact with the workpiece 1 (the exposed surface of the resin film 13) may be flattened in advance in order to thin the workpiece 1 with high precision.

[0109] The exposed surface of the resin film (second resin member) 13 of the work unit 15 is flattened, for example, by a grinding device 14. In processing step S30, first, the second surface (back surface) 1b of the workpiece 1 is brought facing the holding table of the grinding device 14, and the work unit 15 is placed on the upper surface of the holding table, and the work unit 15 is held by the holding table.

[0110] Next, the relative positions of the grinding unit 16 and the holding table are adjusted so that the grinding wheel 26 is positioned above the work unit 15, and in particular, so that the movement trajectory of the grinding wheel 26 (the grinding surface of the grinding wheel 24) passes above the center of the workpiece 1.

[0111] Subsequently, the grinding wheel 26 and the holding table are rotated around their respective axes to lower the grinding unit 16 (i.e., to feed it for grinding). At this time, grinding fluid is supplied to the workpiece unit 15, etc. When the bottom surface of the grinding wheel 24 comes into contact with the exposed surface of the resin film (second resin member) 13, the resin film 13 is ground. When the exposed surface of the resin film 13 is sufficiently flattened, the grinding feed of the grinding unit 16 is stopped.

[0112] When the resin film (second resin member) 13 is ground with the grinding device 14, the exposed surface of the resin film 13 is flattened, and the exposed surface of the resin film 13 and the second surface 1b of the workpiece 1 become highly parallel. In this state, when the workpiece 1 of the workpiece unit 15 is ground with the grinding device 14 as described above, the workpiece unit 15 can be properly held from the resin film 13 side by the holding table of the grinding device 14. Furthermore, when the grinding of the workpiece 1 is performed according to the procedure described above, the entire surface of the workpiece 1 can be thinned to a predetermined thickness with high precision.

[0113] Furthermore, when flattening the resin film (second resin member) 13 of the work unit 15 with the grinding device 14, a grinding wheel suitable for grinding the resin film 13 may be used, which is different from the grinding wheel 26 suitable for grinding the workpiece 1. Also, if the grinding wheel 26 is suitable for grinding both the workpiece 1 and the resin film 13, both sides of the work unit 15 may be ground using a single grinding wheel 26.

[0114] Furthermore, the flattening of the exposed surface of the resin film (second resin member) 13 of the work unit 15 may be carried out by a method other than grinding. For example, the flattening of the resin film 13 may be carried out by a surface planer (cutting device) equipped with a cutting tool. The surface planer is a device configured in part the same way as the grinding device 14, and comprises a holding table for holding the work unit 15 and a cutting unit capable of processing the work unit 15 held by the holding table.

[0115] The surface planer's holding table is configured similarly to the holding table of the grinding device 14, but is movable along a direction parallel to the upper holding surface. The cutting unit, like the grinding unit 16 described above, has a spindle arranged vertically, a rotational drive source such as a motor connected to the upper end of the spindle, and a disc-shaped mount fixed to the lower end of the spindle. The cutting tool is fixed to the outer circumference of the lower surface of the mount. The cutting tool has a cutting edge that protrudes downward.

[0116] When the rotational drive source of the cutting unit is activated, the cutting tool orbits in an annular trajectory below the mount that rotates around the spindle. In this state, when the holding table that holds the workpiece unit 15 is moved in a direction parallel to the holding surface, passing below the cutting unit, the cutting edge of the cutting tool cuts the workpiece unit 15.

[0117] The procedure for flattening the resin film (second resin member) 13 of the workpiece unit 15 using a cutting machine is described below. First, the workpiece unit 15 is placed on the holding surface of the holding table. At this time, the second surface 1b side of the workpiece 1 is facing the holding surface, and the resin film 13 is exposed upwards. Then, the workpiece unit 15 is held in place by suction on the holding table.

[0118] Next, the height of the cutting unit is adjusted so that the lower end of the cutting edge of the cutting tool is slightly lower than the upper surface of the resin film 13. At this time, the holding table is moved in advance to an area that does not overlap with the mounting of the cutting unit.

[0119] Then, the rotation of the spindle of the cutting unit is started, initiating the movement of the cutting tool along its annular trajectory. Subsequently, the holding table is moved along a direction parallel to the holding surface, passing beneath the cutting unit. At this time, the cutting tool cuts off the upper part of the resin film 13.

[0120] The size of the annular trajectory along which the cutting tool moves is equal to the diameter of the work unit 15. Furthermore, the movement path of the holding table is determined to be linear so that the outer edge of the work unit 15 and this annular trajectory almost coincide temporarily while the holding table is moving. In other words, the movement path of the holding table is determined so that the center of the holding surface of the holding table passes through the area directly below the spindle of the cutting unit.

[0121] When the resin film (second resin member) 13 is cut with a cutting tool in a surface planer, the exposed surface of the resin film 13 is flattened. In processing step S30, after the resin film 13 is flattened, the workpiece 1 of the work unit 15 is ground with the grinding device 14, which allows for high-quality grinding of the workpiece 1.

[0122] After processing step S30, exposure step S40 is performed. In exposure step S40, a portion of the resin film (first resin member) 9 is removed to form a groove or step in a region that does not overlap with the center of the workpiece 1, and the resin film 9 is exposed on the inner surface of the groove or step.

[0123] Figure 4(A) is a schematic cross-sectional view showing an example of the exposure step S40. In the exposure step S40 shown in Figure 4(A), the recess 17 is divided near the inner edge of the annular protrusion 19 of the workpiece 1, and grooves 21 are formed in the resin film (first resin member) 9 and the resin film (second resin member) 13. That is, in the exposure step S40, the workpiece 1 is divided simultaneously with the formation of the groove 21 in the region overlapping with the groove 21, so as to cut off the annular protrusion 19 from the workpiece 1. However, the exposure step S40 is not limited to the case of dividing the workpiece 1.

[0124] The exposure step S40, which divides the workpiece 1, is performed, for example, by a cutting device 28. The cutting device 28 comprises a holding table (chuck table, not shown) for holding the workpiece 1 to be processed, and a cutting unit 30 for cutting the workpiece 1 held by the holding table. The holding table is rotatable about a pivot axis that passes through its upper surface. It is also movable in a direction parallel to its upper surface.

[0125] The cutting unit 30 has a spindle housing 32. A ball screw type lifting mechanism (not shown) is connected to the spindle housing 32. The cutting unit 30 moves up and down by the lifting mechanism. A portion of a cylindrical spindle 34 is rotatably housed inside the spindle housing 32.

[0126] A rotational drive source (not shown), such as a motor, is provided at the base end of the spindle 34. The tip of the spindle 34 protrudes outward from the spindle housing 32. A cutting blade 36 is fixed to the tip of the spindle 34 via a flange mechanism or the like.

[0127] The cutting blade 36 has an annular hub base made of a metal such as an aluminum alloy. An annular grinding wheel portion is fixed to one side of the hub base. The grinding wheel portion has abrasive grains made of cBN, diamond, etc., and a bonding material such as a vitrified bond or resin bond for fixing the abrasive grains. When the spindle 34 is rotated and the grinding wheel portion of the rotating cutting blade 36 cuts into the workpiece, the workpiece is cut.

[0128] When cutting a workpiece 1 having a recess 17 formed on its second surface 1b side while forming a groove 21 in a workpiece unit 15, for example, the workpiece unit 15 is placed on the holding table of the cutting device 28, and the workpiece unit 15 is held by the holding table. At this time, the workpiece unit 15 is placed on the holding table so that the second surface 1b side of the workpiece 1 is exposed upwards. However, the workpiece 1 may also be held on the holding table so that the second surface 1b side of the workpiece 1 faces the upper surface of the holding table.

[0129] Next, the cutting unit 30 is moved so that the grinding wheel portion of the cutting blade 36 is positioned above the intended cutting location on the workpiece 1. Then, the cutting unit 30 is lowered while the spindle 34 is rotated at a rotational speed of approximately 30,000 revolutions per minute. As a result, the rotating grinding wheel portion cuts into the workpiece 1, and the workpiece 1 is cut.

[0130] As the cutting unit 30 is lowered further, the cutting blade 36 cuts into the vicinity of the outer edge of the resin film (first resin member) 9, and then into the resin film (second resin member) 13. For example, the lower end of the grinding wheel reaches the height of the lower end of the resin film 13, at which point the lowering of the cutting unit 30 is stopped.

[0131] Next, the holding table that holds the work unit 15 is rotated 360 degrees around an axis perpendicular to the upper surface. As a result, the work 1 is cut along the inner edge of the annular protrusion 19 by the cutting blade 36, and an annular groove 21 is formed in the work unit 15. At this time, the resin film (first resin member) 9 is exposed on the wall surface 23 of the groove 21. In this case, the outer periphery of the work unit 15, including the annular protrusion 19, is separated by the groove 21. Figure 4(B) is a schematic cross-sectional view showing the work unit 15 after the outside of the groove 21 has been removed.

[0132] However, the groove 21 does not have to be formed in a closed annular shape. The groove 21 may be formed in a cut, discontinuous annular shape. For example, an incomplete annular groove 21 can be formed by rotating the holding table that holds the work unit 15 with the cutting blade 36 cut into the resin film (first resin member) 9, etc., by an amount of rotation less than 360° around an axis perpendicular to the upper surface.

[0133] Furthermore, the groove 21 may be formed in an annular shape with multiple ruptures. The groove 21 with multiple ruptures is formed by raising and lowering a cutting blade 36 that has cut into the resin film (first resin member) 9, etc., while rotating a holding table that holds the work unit 15. The groove 21 may also be formed in other shapes.

[0134] The work unit 15, from which the outer portion of the groove 21 has been removed, becomes a laminate of workpieces 1 of the same diameter, a resin film (first resin member) 9, and a resin film (second resin member) 13. In this laminate, the resin film 9 is exposed on the outer surface. That is, in the work unit 15 in this laminated state, the area of ​​the resin film 13 that contacts the workpiece 1 is lost, and the resin film 13 does not contact the workpiece 1.

[0135] In other words, when a groove 21 is formed in the work unit 15 and the resin film (first resin member) 9 is exposed in the groove 21, the portion of the resin film (second resin member) 13 that is firmly in contact with the workpiece 1 is located outside the groove 21. Inside the groove 21, the resin film (first resin member) 9, which has relatively low adhesion force, is in contact with the workpiece 1. Therefore, the resin film 9 can be easily removed from the workpiece 1. Furthermore, by removing the resin film 9 from the workpiece 1, the resin film 13 can also be easily removed.

[0136] After the exposure step S40 is performed, a peeling step S50 is performed to remove the resin film (first resin member) 9 together with the resin film (second resin member) 13. In the peeling step S50, the resin film (first resin member) 9 is peeled off from the workpiece 1 in the region closer to the center of the workpiece 1 than the groove 21, thereby removing the resin film (first resin member) 9 together with the resin film (second resin member) 13.

[0137] Figure 5(A) is a schematic cross-sectional view showing the workpiece 1 in the peeling step S50. In Figure 5(A), the outer periphery of the workpiece unit 15, which was separated by the groove 21 formed in the exposure step S40, has been removed in advance. That is, Figure 5(A) shows a cross-sectional view of the region of the workpiece unit 15 that is closer to the center of the workpiece 1 than the groove 21.

[0138] When peeling the resin film 9 and resin film 13 from workpiece 1, for example, the resin film 9 and resin film 13 are lifted from workpiece 1 at the edge of workpiece 1. Here, the adhesion force of the second resin member to workpiece 1 is greater than that of the first resin member to workpiece 1, and the second resin member, which has a greater adhesion force, is not in contact with workpiece 1. Therefore, the resin film 9 can be easily peeled off from workpiece 1 with a relatively small force. And when the resin film 9 is peeled off from workpiece 1, the resin film 13 is also removed from workpiece 1.

[0139] When the resin films 9 and 13 are peeled off from workpiece 1 from one end to the other, the resin films 9 and 13 are removed from workpiece 1, leaving the treated workpiece 1. Figure 5(B) is a schematic cross-sectional view showing workpiece 1 from which the resin films 9 and 13 have been peeled off.

[0140] In addition, in the peeling step S50, the resin film (first resin member) 9 and the resin film (second resin member) 13 may be removed from the workpiece 1 by other methods. For example, the workpiece unit 15 may be immersed in a liquid such as water or an organic solvent. If the resin film (first resin member) 9 has properties that make it susceptible to erosion by the liquid, the resin film 9 will be eroded and peeled off from the workpiece 1. The resin film 13 will be removed from the workpiece 1 together with the resin film 9. The peeling step S50 may be carried out by yet another method.

[0141] Here, even when grooves 21 are formed in the resin film (first resin member) 9, etc., in a shape different from a closed ring, the resin film (first resin member) 9, etc., can be peeled off more easily than when grooves 21 are not formed. This is because the formation of grooves 21 allows a peeling-promoting liquid or the like to penetrate and act on a wide area of ​​the resin film 9 from the portion exposed on the inner surface of the grooves 21.

[0142] Furthermore, when performing the peeling step S50, the adhesion force of the resin film (first resin member) 9 to the workpiece 1 may be reduced by irradiating the resin film 9 with ultraviolet light, or by heating the resin film 9. In other words, in or before the peeling step S50, an adhesion force reduction step may be performed to reduce the adhesion force of the resin film 9 to the workpiece 1. In this adhesion force reduction step, ultraviolet light irradiation of the resin film (first resin member) 9, heating of the resin film 9, supply of liquid to the resin film 9, etc., may be performed.

[0143] Here, if a step to reduce adhesion force is performed when peeling the resin film (first resin member) 9 from the workpiece 1, the adhesion force of the resin film (second resin member) 13 to the workpiece 1 does not need to be greater than the adhesion force of the resin film 9 to the workpiece 1 before this step is performed. After this step, it is sufficient that the adhesion force of the resin film (second resin member) 13 to the workpiece 1 is greater than the adhesion force of the resin film 9 to the workpiece 1.

[0144] As explained above, in the workpiece processing method according to this embodiment, it is not necessary to apply a large force to the workpiece 1 during the process of peeling off the resin film 9 and resin film 13 from the workpiece 1. Therefore, no damage occurs to the workpiece 1 during this process. In addition, since the second resin member, which has a high adhesion force, does not come into contact with the workpiece 1, the resin member is less likely to remain on the workpiece 1 during this process.

[0145] In the exposure step S40 described above, the case in which the resin film (first resin member) 9 and the resin film (second resin member) 13 are partially removed to form the groove 21 was explained. However, the exposure step S40 is not limited to this. In the exposure step S40, a groove may be formed only on the resin film (first resin member) 9, and no groove may be formed on the resin film (second resin member) 13.

[0146] Next, an exposure step S40 relating to a modified example will be described. Figure 6(A) is a schematic cross-sectional view showing the work unit 15 in the exposure step S40 relating to a modified example. In the work 1 shown in Figure 6(A), a recess 17 and an annular projection 19 are formed on the second surface 1b side in processing step S30. Similar to the exposure step S40 described in Figure 4(A), a cutting device 28 is also used to form the groove in the exposure step S40 shown in Figure 6(A).

[0147] The grinding wheel portion of the cutting blade 36 is positioned above the planned cutting position on the workpiece 1, and the spindle 34 is rotated at a rotational speed of approximately 30,000 revolutions per minute to lower the cutting unit 30. At this time, the cutting blade 36 cuts into the resin film (first resin member) 9, and the lowering of the cutting unit 30 is stopped when it reaches the resin film (second resin member) 13. After that, the support table supporting the workpiece 1 is rotated to form an annular groove 21a in the resin film 9. At this time, the resin film (first resin member) 9 is exposed on the wall surface 23a of the groove 21a.

[0148] In this case, the formed groove 21a does not cut the work unit 15. However, inside the groove 21a (the region closer to the center of the work 1), the resin film (second resin member) 13 does not come into contact with the work 1. Therefore, inside the groove 21a, the resin film 9 and the resin film 13 can be easily peeled off from the work 1.

[0149] If the work unit 15 is not divided by the groove 21a, the areas inside and outside the groove 21a of the work unit 15 can be handled as a single unit, making further processing and transport of the work unit 15 easier. For example, after the exposure step S40 according to the modified example is performed, the work 1 may be divided as a processing of the work unit 15. Figure 6(B) is a schematic cross-sectional view showing the divided work 1.

[0150] When workpiece 1 is divided, individual chips 27 are manufactured. If multiple devices are formed on the first surface 1a of workpiece 1, dividing workpiece 1 device by device yields device chips 27. For example, division lines are set in a grid pattern on workpiece 1, and multiple devices are formed in each region demarcated by the division lines. Device chips are manufactured by dividing workpiece 1 along the division lines.

[0151] For dividing the workpiece 1 shown in Figure 6(B), a cutting device 28a, configured similarly to the cutting device 28, is used, for example. The cutting device 28a has a cutting unit 30a. The cutting unit 30a comprises a spindle 34a, a spindle housing 32a that rotatably houses the base end of the spindle 34a, and a cutting blade 36a mounted on the tip of the spindle 34a. For example, the cutting blade thickness of the cutting blade 36a is smaller than the cutting blade thickness of the cutting blade 36 mounted on the cutting device 28.

[0152] When dividing workpiece 1, one end of the planned division line of workpiece 1 is cut with the grinding wheel portion of the cutting blade 36a. Then, the support table supporting workpiece 1 is moved along the planned division line. As a result, workpiece 1 is cut along the planned division line, and division grooves 25 are formed in workpiece 1. In this way, when division grooves 25 are formed along all the planned division lines set on workpiece 1, individual device chips are manufactured.

[0153] The splitting of workpiece 1 may be performed after the exposure step S40 and before the peeling step S50, or it may be performed before the exposure step S40. For example, it may be performed after the processing step S30, or it may be performed as part of the processing of workpiece unit 15 in the processing step S30.

[0154] Furthermore, in processing step S30, following the formation of the recess 17 and the annular protrusion 19 by grinding from the second surface 1b side of the workpiece 1, the workpiece 1 may be divided. Moreover, in processing step S30, grinding of the workpiece 1 is not required, and only the division of the workpiece 1 may be performed. In any case, the division step of dividing the workpiece 1 to manufacture multiple chips may be performed as processing step S30.

[0155] When the splitting step is performed as processing step S30, the workpiece 1 is split and chips are manufactured. In this case, the workpiece processing method according to this embodiment is a chip manufacturing method that produces chips 27 by splitting the workpiece 1. The descriptions of each step of the workpiece processing method according to this embodiment described above may be referred to as appropriate when describing each step performed in the chip manufacturing method.

[0156] In other words, in the manufacturing method for producing chips by dividing workpiece 1, a first coating step S10, a second coating step S20, a dividing step for producing multiple chips 27 by dividing workpiece 1, an exposure step S40, and a peeling step S50 are performed. It is preferable that the adhesion force of the resin film (second resin member) 13 to workpiece 1 (chip 27) is greater than the adhesion force of the resin film (first resin member) 9 to workpiece 1. In this case, the chip 27 is ultimately easily peeled off from the resin film 9 and resin film 13.

[0157] To further explain, the splitting step may be performed simultaneously with the exposure step S40. For example, the splitting groove 25 formed by splitting the workpiece 1 along the planned splitting line may divide the resin film (first resin member) 9, and the resin film (first resin member) 9 may be exposed on the inner surface of the splitting groove 25.

[0158] In other words, the dividing groove 25 formed to divide the workpiece 1 may also function as a groove for exposing the resin film (first resin member) 9 to its inner surface. In this case, the step of forming one of the dividing grooves 25 in the workpiece 1 is the dividing step, and the step of forming any other dividing groove 25 in the workpiece 1 is the exposure step S40.

[0159] Next, another example of the exposure step S40 in the workpiece processing method will be described. In the exposure step S40 described above, the workpiece 1 is cut from the second surface 1b side and the resin film (first resin member) 9 is cut to form a groove 21. However, in the exposure step S40, a groove in which the resin film (first resin member) 9 is exposed on the inner surface may be formed by cutting the resin film (first resin member) 9 from the first surface 1a side of the workpiece 1.

[0160] Figure 7(A) is a schematic cross-sectional view showing the workpiece 1 in exposure step S40 according to another example. In exposure step S40 shown in Figure 7(A), for example, a cutting device 28b configured similarly to the cutting device 28 described in Figure 4(A) is used. The cutting device 28b comprises a spindle 34b, a spindle housing 32b that rotatably houses the base end of the spindle 34b, and a cutting blade 36b mounted on the tip of the spindle 34b.

[0161] When forming a groove in the work unit 15, first, the grinding wheel portion of the cutting blade 36b is positioned above the area where the groove is to be formed. For example, the boundary between the resin film (first resin member) 9 and the resin film (second resin member) 13 on the first surface 1a, or its vicinity, is the area where the groove is to be formed. Next, the cutting unit 30b is lowered while the cutting blade 36b is rotated at high speed. At this time, it is preferable that the lower end of the grinding wheel portion of the cutting blade 36b is positioned at the height of the lower end of the resin film (first resin member) 9.

[0162] In this state, when the support table supporting the workpiece 1 is rotated once around a rotation axis that passes through its upper surface, the resin film (first resin member) 9 is removed in an annular shape, forming a groove 29. The resin film (first resin member) 9 is then exposed on the inner surface of this groove 29. In the exposure step S40 according to this other example, the cutting blade 36b does not cut the workpiece 1. Therefore, the cutting blade 36b, which is particularly suitable for cutting the resin film (first resin member) 9 and the resin film (second resin member) 13, can be used to form the groove 29.

[0163] Next, a further example of the exposure step S40 in the workpiece processing method will be described. In the exposure step S40 described above, a groove is formed on the inner surface in which the resin film (first resin member) 9 is exposed by cutting the resin film (first resin member) 9 and the resin film (second resin member) 13. However, the exposure step S40 is not limited to this.

[0164] Figure 7(B) is a schematic cross-sectional view showing the workpiece 1 in exposure step S40 according to another example. In exposure step S40 shown in Figure 7(B), a stepped portion is formed in the resin film (first resin member) 9 instead of a groove.

[0165] Here, we will explain the difference between a stepped portion and a groove. A groove is a structure formed when a portion of one or both of the resin film 9 and the resin film 13 is removed, resulting in a structure where two inner surfaces are created on either side of the groove. On the other hand, a stepped portion is a structure formed when a portion of one or both of the resin film 9 and the resin film 13 is removed, resulting in a structure where an inner surface is created inside the stepped portion, and the parts of the resin film 9 and resin film 13 outside of this inner surface are completely removed.

[0166] In the exposed step S40 that forms the stepped portion, for example, a cutting device 28c configured similarly to the cutting device 28 is used. The cutting device 28c comprises a spindle 34c, a spindle housing 32c that rotatably houses the base end of the spindle 34c, and a cutting blade 36c mounted on the tip of the spindle 34c.

[0167] For example, the cutting blade thickness of the cutting blade 36c is greater than the cutting blade thickness of the cutting blade 36 mounted on the cutting device 28. More specifically, it is greater than the width from the position where the inner surface of the stepped portion is to be formed to the outer edge of the workpiece 1.

[0168] When forming a stepped portion 31 on workpiece 1, first, the grinding wheel portion of the cutting blade 36c is positioned above the location where the stepped portion 31 is intended to be formed. At this time, the grinding wheel portion overlaps with the outer edge of workpiece 1. Then, while rotating the cutting blade 36c, the cutting unit 30c is lowered to cut the resin film (first resin member) 9 and the resin film (second resin member) 13. After that, the holding table that holds workpiece 1 is rotated 1 turn around the rotation axis. As a result, the stepped portion 31 is formed in the resin film 9 and the resin film 13.

[0169] Even when a stepped portion 31 is formed instead of a groove, the resin film (first resin member) 9 is exposed on the inner surface of the stepped portion 31. That is, in the region closer to the center of the workpiece 1 than the stepped portion 31, the resin film (first resin member) 9, which has a relatively small adhesion force, adheres to the workpiece 1, and in that region, the resin film 9 and the resin film 13 can be easily peeled off together.

[0170] Next, the first coating step S10 and the second coating step S20 relating to modified examples will be described. The first coating step S10 described in Figure 1(A) and the second coating step S20 described in Figure 2(A) describe the case in which liquid resins 7 and 11 are supplied to the workpiece 1 by the spin coating apparatus 2 to coat the workpiece 1. However, the first coating step S10 and the second coating step S20 are not limited to these.

[0171] For example, in the first coating step S10 and the second coating step S20, the liquid resin 7,11 may be spread on the first surface 1a of the workpiece 1. For example, after supplying the liquid resin 7,11 to the first surface 1a of the workpiece 1, the liquid resin 7,11 may be spread along the first surface 1a by pressing a flat plate-shaped pressing member against the first surface 1a of the workpiece 1. Alternatively, after supplying the liquid resin 7,11 to the table surface, the liquid resin 7,11 may be spread by pressing the liquid resin 7,11 with the workpiece 1 while facing the first surface 1a of the workpiece 1 towards the table surface. Furthermore, instead of a flat plate-shaped pressing member, the liquid resin 7,11 may be spread by pressing with a pressing member composed of rollers.

[0172] Figure 8(A) is a schematic cross-sectional view showing the workpiece 1 in the first coating step S10 according to a modified example, and Figure 8(B) is a schematic cross-sectional view showing the workpiece 1 in the second coating step S20 according to a modified example. In Figures 8(A) and 8(B), the liquid resins 7 and 11 are spread out by the pressing device 38.

[0173] The pressing device 38 will now be described. The pressing device 38 comprises a table 40 having a flat upper surface 40a, and a pressing member 42 having a pressing surface 42a at its lower end that faces the upper surface 40a of the table 40. The pressing member 42 has a holding mechanism that suction-holds the workpiece 1 that comes into contact with the pressing surface 42a.

[0174] Furthermore, the pressing device 38 may also include a liquid resin supply unit configured similarly to the liquid resin supply unit 4 of the spin coating apparatus 2 shown in Figure 1(A), etc. This liquid resin supply unit can supply liquid resins 7,11 to the upper surface 40a of the table 40.

[0175] Figures 8(A) and 8(B) include schematic cross-sectional views of the pressing member 42. The pressing device 38 is equipped with a suction mechanism (not shown) connected to the pressing surface 42a of the pressing member 42. When the suction mechanism is activated while the workpiece 1 is in contact with the pressing surface 42a, the workpiece 1 is held in place by the pressing member 42. When the workpiece 1 is held in place by the pressing member 42, the orientation is adjusted so that the first surface 1a on which the resin member is arranged faces downwards, and the second surface 1b faces the pressing surface 42a of the pressing member 42.

[0176] Furthermore, the pressing member 42 can be raised and lowered by a lifting mechanism (not shown). The pressing surface 42a of the pressing member 42 and the upper surface 40a of the table 40 are both flat and their orientations are adjusted with high precision so that they are parallel to each other. The pressing device 38 can lower the pressing member 42 while holding the workpiece 1 with the pressing surface 42a, and press the liquid resins 7,11 from above with the pressing surface 42a via the workpiece 1.

[0177] In the first coating step S10 according to the modified example shown in Figure 8(A), first, the workpiece 1 is held by the pressing member 42 through suction, and a predetermined amount of liquid resin (first resin member) 7 is supplied to the upper surface 40a of the table 40 by the liquid resin supply unit. Then, the pressing member 42 that holds the workpiece 1 is lowered, and the liquid resin 7 is pressed by the pressing member 42 through the workpiece 1. When the liquid resin 7 is pressed by the upper surface 40a of the table 40 and the pressing surface 42a of the pressing member 42, the liquid resin 7 is spread outwards in the direction of the outer circumference of the workpiece 1.

[0178] In the first coating step S10, the supply amount of liquid resin 7 is adjusted so that the liquid resin 7 is spread to the first surface 1a of the workpiece 1 with the required thickness in a predetermined area (central area 3). The downward movement of the pressing member 42 is stopped when the liquid resin 7 has spread to the predetermined area (central area 3) of the first surface 1a of the workpiece 1.

[0179] In the first coating step S10, the spread liquid resin 7 may be cured by irradiating it with ultraviolet light. For example, the table 40 may have an ultraviolet light source (not shown) exposed on its upper surface 40a, and this ultraviolet light source is activated to irradiate the liquid resin 7 with ultraviolet light. As a result, the liquid resin 7 is cured and a resin film (first resin member) 9 is placed on the first surface 1a of the workpiece 1. In this case, an ultraviolet-curable resin is used for the liquid resin (first resin member) 7.

[0180] Furthermore, the method of curing the liquid resin 7 is not limited to this. For example, if the liquid resin (first resin member) 7 is a thermosetting resin, the liquid resin 7 is cured by heating the liquid resin 7 that has been sandwiched and spread between the workpiece 1 and the table 40. In this case, for example, a heating unit such as an electric heating wire may be incorporated inside the table 40, and by operating the heating unit to heat and cure the liquid resin 7, a resin film (first resin member) 9 is disposed on the first surface 1a of the workpiece 1.

[0181] In the second coating step S20 according to the modified example shown in Figure 8(B), first, a predetermined amount of liquid resin (second resin member) 11 is supplied to the upper surface 40a of the table 40 by the liquid resin supply unit. Then, the pressing member 42 that holds the workpiece 1 is lowered, and the liquid resin 11 is pressed by the pressing member 42 through the workpiece 1. When the liquid resin 11 is pressed by the upper surface 40a of the table 40 and the pressing surface 42a of the pressing member 42, the liquid resin 11 is spread outwards in the direction of the outer circumference of the workpiece 1.

[0182] In the second coating step S20, the supply amount of liquid resin 11 is adjusted so that the liquid resin 11 is spread to the first surface 1a of the workpiece 1 with the required thickness in the central region 3 and the outer peripheral region 5. The downward movement of the pressing member 42 is stopped when the liquid resin 11 has spread to the central region 3 and the outer peripheral region 5 of the first surface 1a of the workpiece 1.

[0183] Furthermore, in order to ensure that the first surface 1a of the workpiece 1 is reliably covered with the second resin member, it is preferable that an excess amount of liquid resin 11 be supplied to the upper surface 40a of the table 40. In this case, any excess liquid resin 11 supplied to the upper surface 40a of the table 40 will overflow outwards from between the table 40 and the pressing member 42 when the pressing member 42 is lowered to a predetermined height. The overflowed liquid resin 11 is then removed.

[0184] When the first coating step S10 according to the modified example described above is performed, the first surface 1a side of the central region 3 of the workpiece 1 is covered with the resin film (first resin member) 9. Furthermore, when the second coating step S20 according to the modified example is performed, the first surface 1a side of both the central region 3 and the outer peripheral region 5 of the workpiece 1 is covered with the resin film (second resin member) 13. At this time, it is preferable that the resin film 9 is sealed by the resin film 13.

[0185] Furthermore, the structures, methods, etc., relating to the above embodiments and modified examples can be modified as appropriate without departing from the scope of the present invention. [Explanation of Symbols]

[0186] 1 Work 1a Front page 1b Second side 3 Central area 5 Outer area 7,11 Liquid resin 9,13 Resin film 15 Work Units 17 Recess 19 Annular protrusion 21,21a Groove 23,23a Wall surface 25 split groove 27 chips 29 Groove 31 Stepped section 2. Spin Coating Apparatus 4. Liquid resin supply unit 6. Supply nozzle 8 outlet 10 UV source 12 Ultraviolet rays 14 Grinding equipment 16 Grinding Unit 18 spindles 20 Mounts 22 Wheel base 24 grinding wheels 26 grinding wheels 28,28a,28b,28c cutting equipment 30, 30a, 30b, 30c cutting units 32, 32a, 32b, 32c Spindle Housing 34, 34a, 34b, 34c spindles 36, 36a, 36b, 36c cutting blades 38 Pressing device 40 tables 40a top 42 Pressing member 42a Pressing surface

Claims

1. A first covering step of covering the first surface side of the central region of a workpiece, which includes a central region and an outer peripheral region located outside the central region, with a first resin member, Following the first coating step, a second coating step is performed in which the outer peripheral region and the central region and the first surface side are covered with a second resin member to form a work unit. After the second coating step, a processing step for processing the work unit, After the processing step, an exposure step is performed in which a portion of the first resin member is removed to form a groove or step in a region that does not overlap with the center of the workpiece, and the first resin member is exposed on the inner surface of the groove or step. The system includes a peeling step in which the first resin member is peeled from the workpiece in a region closer to the center of the workpiece than the groove or stepped portion, thereby removing the second resin member together with the first resin member. Method for processing workpieces.

2. The first resin component is an ultraviolet-curable liquid resin. The method for processing a workpiece according to claim 1, characterized in that in the first coating step, the first resin member is supplied to the first surface side of the workpiece, and then the first resin member is cured by irradiating it with ultraviolet light.

3. The second resin component is an ultraviolet-curable liquid resin, The method for processing a workpiece according to claim 1, characterized in that in the second coating step, the second resin member is supplied to the first surface side of the workpiece, and then the second resin member is cured by irradiating it with ultraviolet light.

4. In this processing step, a recess is formed on the second surface of the workpiece opposite to the first surface, and an annular protrusion is formed surrounding the recess. The method for processing a workpiece according to any one of claims 1 to 3, characterized in that the exposure step involves simultaneously forming the groove and dividing the workpiece in the region overlapping with the groove, so as to cut off the annular protrusion from the workpiece.

5. The method for processing a workpiece according to any one of claims 1 to 3, characterized in that the second resin member has the function of suppressing the peeling of the first resin member from the workpiece in the processing step.

6. A method for manufacturing a wafer by thinning a workpiece that includes a central region and an outer peripheral region located outside the central region, A first covering step involves covering the first surface side of the central region of the workpiece with a first resin member, Following the first coating step, a second coating step is performed in which the outer peripheral region and the central region and the first surface side are covered with a second resin member to form a work unit. After the second coating step, a thinning step is performed to manufacture a wafer by processing the workpiece from the second side opposite to the first side to thin the workpiece to a predetermined thickness, After the thinning step, an exposure step is performed in which a portion of the first resin member is removed to form a groove or step in a region that does not overlap with the center of the wafer, and the first resin member is exposed on the inner surface of the groove or step. The system includes a peeling step of removing the second resin member together with the first resin member by peeling the first resin member from the wafer in a region of the wafer closer to the center of the wafer than the groove or the stepped portion, A method for manufacturing wafers, characterized by the following features.

7. The method for manufacturing a wafer according to claim 6, characterized in that the second resin member has the function of suppressing the peeling of the first resin member from the workpiece in the thinning step.

8. A method for manufacturing a chip by dividing a workpiece that includes a central region and an outer peripheral region located outside the central region, A first covering step involves covering the first surface side of the central region of the workpiece with a first resin member, Following the first coating step, a second coating step is performed in which the outer peripheral region and the central region and the first surface side are covered with a second resin member to form a work unit. After the second coating step, a division step is performed to divide the workpiece and manufacture multiple chips, After the second coating step, an exposure step is performed in which a portion of the first resin member is removed to form a groove or step, and the first resin member is exposed on the inner surface of the groove or step. The system includes a peeling step in which the first resin member is peeled from the chip in a region closer to the center of the first resin member than the groove or stepped portion, thereby removing the second resin member together with the first resin member. A method for manufacturing chips, characterized by the following:

9. The method for manufacturing a chip according to claim 8, characterized in that the second resin member has the function of suppressing the peeling of the first resin member from the workpiece in the dividing step.

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