Light-emitting module

Abstract

The present invention provides a method for manufacturing a light-emitting module that can efficiently accommodate various specifications regarding the light output. Alternatively, it provides a suitable form of light-emitting module in which the number of light-emitting elements mounted is adjusted. [Solution] The method for manufacturing a light-emitting module includes the steps of: preparing a first light-emitting device 20a and a second light-emitting device 20b, each having a plurality of light-emitting elements mounted on it, with each having one different number of mounted light-emitting elements; preparing a first mounting substrate 10a having a mounting surface with a connection pattern corresponding to one light-emitting device 20, and having multiple identical connection patterns; and mounting a plurality of light-emitting devices 20 selected from the first light-emitting device 20a and the second light-emitting device 20b to the plurality of connection patterns provided on the mounting surface of the first mounting substrate 10a. This method makes it possible to manufacture a light-emitting module 100 having any number of light-emitting elements selected from at least three consecutive numbers.

Description

Technical Field

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[0001] The present disclosure relates to a light-emitting module.

Background Art

[0002] Conventionally, a light-emitting module in which a light-emitting device having a plurality of light-emitting elements mounted in one package is mounted on one mounting substrate has been developed. Patent Document 1 discloses an optical unit including a plurality of semiconductor devices each having four semiconductor elements mounted in one package on a unit substrate.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The light output required for a light-emitting module varies depending on the use, size, etc. of the product on which it is mounted. Therefore, as a method for flexibly corresponding to the required light output, a method of adjusting the number of light-emitting elements mounted on the product can be considered. However, there is room for improvement in efficiently corresponding to various required specifications regarding the emitted light.

[0005] Therefore, an embodiment according to the present disclosure aims to provide a manufacturing method of a light-emitting module that can efficiently correspond to various specifications regarding the emitted light.

[0006] Alternatively, an embodiment according to the present disclosure aims to provide a light-emitting module in a suitable form in which the number of mounted light-emitting elements is adjusted.

Means for Solving the Problems

[0007] The light-emitting module according to the embodiment of this disclosure comprises: a first light-emitting device comprising a plurality of first semiconductor laser elements and a first package on which the plurality of first semiconductor laser elements are mounted in a unidirectional arrangement; a second light-emitting device comprising a plurality of second semiconductor laser elements and a second package on which the plurality of second semiconductor laser elements are mounted in a unidirectional arrangement; and a mounting substrate having a mounting surface provided with a first connection pattern on which the first light-emitting device is mounted and a second connection pattern on which the second light-emitting device is mounted, wherein the number of plurality of second semiconductor laser elements mounted on the second light-emitting device is one more than the number of first semiconductor laser elements mounted on the first light-emitting device, and the first package and the second package are packages with the same external shape. A method for manufacturing a light-emitting module according to an embodiment of the present disclosure is a method for manufacturing a light-emitting module on which one or more light-emitting devices on which a plurality of light-emitting elements are mounted are mounted, and the method for manufacturing the light-emitting module includes the steps of: preparing a first light-emitting device and a second light-emitting device, which are light-emitting devices on which the number of mounted light-emitting elements differs by one from each other; preparing a first mounting substrate having a mounting surface on which a plurality of connection patterns corresponding to one of the light-emitting devices are provided; and mounting a plurality of light-emitting devices selected from the first light-emitting device and the second light-emitting device to the plurality of connection patterns provided on the mounting surface of the first mounting substrate, and the method for manufacturing the light-emitting module on which any number of light-emitting elements selected from at least three consecutive numbers are mounted is possible.

[0008] The light-emitting module according to the embodiment of the present disclosure comprises a first light-emitting device which has a plurality of light-emitting elements mounted on it, a second light-emitting device which has one more light-emitting elements mounted on it than the first light-emitting device, and a first mounting substrate having a mounting surface on which a plurality of the same connection patterns corresponding to one of the light-emitting devices are provided, wherein one or more of the first light-emitting devices and one or more of the second light-emitting devices are connected to the plurality of connection patterns provided on the mounting surface of the first mounting substrate.

[0009] A projector according to the embodiment of the present disclosure comprises the light-emitting module described above, a sealing member provided on a mounting substrate of the light-emitting module, a sealing member that is joined to the mounting substrate via the sealing member to form a sealed space, a light-emitting device mounted on the mounting substrate within the formed sealed space, and an optical unit provided within the formed sealed space. [Effects of the Invention]

[0010] The method for manufacturing a light-emitting module according to the embodiment of this disclosure can efficiently accommodate various specifications. Furthermore, the light-emitting module according to the embodiment of this disclosure can provide a preferred configuration in which the number of light-emitting elements mounted is adjusted. [Brief explanation of the drawing]

[0011] [Figure 1A] This is a schematic perspective view showing an example of the configuration of a light-emitting module according to the first embodiment. [Figure 1B] This is a schematic plan view showing an example of the configuration of a light-emitting module according to the first embodiment. [Figure 1C] This is a schematic plan view showing an example of the configuration of a mounting board according to the first embodiment. [Figure 1D] This is a plan view showing the mounting board in Figure 1C separated into two first mounting boards. [Figure 2A] This is an exploded perspective view schematically showing the configuration of the first light-emitting device. [Figure 2B] This is a schematic plan view showing the internal configuration of the package of the first light-emitting device. [Figure 3A] This is an exploded perspective view schematically showing the configuration of the second light-emitting device. [Figure 3B] This is a schematic plan view showing the internal configuration of the package of the second light-emitting device. [Figure 3C] Figure 3B is a cross-sectional view along the IIIC-IIIC line. [Figure 3D] This is a schematic plan view showing the configuration of the lower surface of the second light-emitting device. [Figure 4]It is a flowchart showing the procedure of the manufacturing method of the light-emitting module according to the first embodiment. [Figure 5A] It is a perspective view schematically showing an example of the configuration of the light-emitting module according to the second embodiment. [Figure 5B] It is a plan view schematically showing an example of the configuration of the light-emitting module according to the second embodiment. [Figure 5C] It is a plan view schematically showing an example of the configuration of the mounting substrate according to the second embodiment. [Figure 5D] It is a plan view showing the state where the mounting substrate of FIG. 5C is separated into a first mounting substrate and a second mounting substrate. [Figure 6] It is a flowchart showing the procedure of the manufacturing method of the light-emitting module according to the second embodiment. [Figure 7A] It is a plan view schematically showing an example of the configuration of the light-emitting module according to the third embodiment. [Figure 7B] It is a plan view schematically showing an example of the configuration of the light-emitting module according to the third embodiment. [Figure 7C] It is a plan view schematically showing an example of the configuration of the light-emitting module according to the third embodiment. [Figure 8] It is a plan view schematically showing an example of the configuration of the light-emitting module according to the embodiment. [Figure 9A] It is a perspective view schematically showing an example of the configuration of the light-emitting module according to the fourth embodiment. [Figure 9B] It is a plan view schematically showing an example of the configuration of the light-emitting module according to the fourth embodiment. [Figure 9C] It is a plan view schematically showing for explaining the first mounting substrate according to the fourth embodiment. [Figure 9D] It is a plan view schematically showing for explaining the light-emitting device and the thermistor mounted on the second mounting substrate according to the fourth embodiment. [Figure 9E] It is a plan view schematically showing for explaining the second mounting substrate according to the fourth embodiment. [Figure 10A] It is a perspective view schematically showing an example of the mounting when applying the light-emitting module according to one embodiment to a projector. [Figure 10B] This is a perspective cross-sectional view illustrating the sealing structure of a light-emitting module according to one embodiment. [Figure 11A] This is a schematic perspective view showing an example of implementation when applying a light-emitting module according to one embodiment to a projector. [Figure 11B] This is a schematic plan view showing an example of the configuration of the projector according to the embodiment of Figure 11A. [Figure 11C] This is a schematic side view showing an example of the configuration of a projector according to the embodiment of Figure 11A. [Figure 12A] This is a schematic perspective view showing an example of implementation when applying a light-emitting module according to one embodiment to a projector. [Figure 12B] This is a schematic side view showing an example of the configuration of a projector according to the embodiment of Figure 12A. [Figure 13] This is a perspective cross-sectional view illustrating another sealing structure for a light-emitting module according to one embodiment. [Modes for carrying out the invention]

[0012] Embodiments will be described below with reference to the drawings. However, the embodiments shown below are illustrative examples of a light-emitting module and a method for manufacturing a light-emitting module that embody the technical concept of this embodiment, and are not limited to those described below. Furthermore, the dimensions, materials, shapes, relative arrangements, etc. of the components described in the embodiments are merely illustrative examples and are not intended to limit the scope of the present invention unless specifically stated otherwise. Note that the size and positional relationships of the members shown in each drawing may be exaggerated for the sake of clarity. In addition, in each embodiment, members that use the same reference numerals as in other embodiments represent the same or corresponding members, and their description may be omitted.

[0013] <First Embodiment> Figure 1A is a schematic perspective view showing an example of the configuration of the light-emitting module according to the first embodiment. Figure 1B is a schematic plan view showing an example of the configuration of the light-emitting module according to the first embodiment. Figure 1C is a schematic plan view showing an example of the configuration of the mounting substrate according to the first embodiment. Figure 1D is a plan view showing the mounting substrate of Figure 1C separated into two first mounting substrates. Figure 2A is a schematic exploded perspective view showing the configuration of the first light-emitting device. Figure 2B is a schematic plan view showing the configuration inside the package of the first light-emitting device. Figure 3A is a schematic exploded perspective view showing the configuration of the second light-emitting device. Figure 3B is a schematic plan view showing the configuration inside the package of the second light-emitting device. Figure 3C is a cross-sectional view taken along the line IIIC-IIIC in Figure 3B. Figure 3D is a schematic plan view showing the configuration of the bottom surface of the second light-emitting device.

[0014] <Light-emitting module> The light-emitting module 100 is equipped with either a first light-emitting device 20a with three light-emitting elements 22, or a second light-emitting device 20b with one more light-emitting element 22 than the first light-emitting device 20a, i.e., four light-emitting elements 22. The module also has a first mounting substrate 10a on which two connection patterns 15 corresponding to either the first light-emitting device 20a or the second light-emitting device 20b are provided on the mounting surface. A desired light-emitting device 20, selected from the first light-emitting device 20a and the second light-emitting device 20b, is connected to the two connection patterns 15 provided on the mounting surface of the first mounting substrate 10a. Specifically, it is connected in any combination of two first light-emitting devices 20a, two second light-emitting devices 20b, or one first light-emitting device 20a and one second light-emitting device 20b. Furthermore, a mounting board 10 is formed using one first mounting board 10a, or a mounting board 10 is formed using two first mounting boards 10a placed side by side.

[0015] Furthermore, when two mounting boards 10 are formed side by side, one of the two first mounting boards 10a may have only one light-emitting device selected and connected from the first light-emitting device 20a and the second light-emitting device 20b, or it may have both light-emitting devices selected and connected. It is also possible to form the mounting board 10 with one first mounting board 10a, and to realize a light-emitting module 100 in which only one light-emitting device selected from the first light-emitting device 20a and the second light-emitting device 20b is connected to the one first mounting board 10a. In the example shown in Figure 1, a mounting board 10 is formed by arranging two first mounting boards 10a side by side, and two connection patterns 15 on each first mounting board 10a are marked with a light-emitting module 100 in which one first light-emitting device 20a and one second light-emitting device 20b are joined together. The following describes the various components of the light-emitting module 100.

[0016] The light-emitting module 100 comprises a mounting substrate 10 and a light-emitting device 20. [Mounted circuit board] The mounting board 10 is composed of one first mounting board 10a, or two first mounting boards 10a, each having the same configuration. In the example shown in Figure 1C, two first mounting boards 10a are arranged side by side to form the mounting board 10. The first mounting substrate 10a has a bottom surface, a top surface, and side surfaces. On the top surface, a connection pattern 15 consisting of a metal portion 11 and a first metal film 12, a second metal film 13, and an insulating film 14 are formed. The first mounting substrate 10a has a mounting surface on its upper surface with two identical connection patterns 15. One light-emitting device 20 is mounted on one connection pattern 15, so the first mounting substrate 10a is formed to mount two light-emitting devices 20. The first mounting substrate 10a facilitates the formation of connection patterns on the first mounting substrate 10a by using the same connection pattern 15 to provide two connection patterns. Note that there may be more than two connection patterns 15; for example, three connection patterns 15 may be arranged in a row. Multiple connection patterns 15 are provided on one first mounting substrate 10a. The connection pattern 15 consists of a metal portion 11 exposed from the insulating film 14 and a first metal film 12 formed on the insulating film 14, and the metal portion 11 and the first metal film 12 form the mounting surface for the light-emitting device. Note that the metal portion 11 may be configured to have a metal film formed on its upper surface. For example, similar to the first metal film 12, a metal film may be formed on the insulating film 14 to provide the metal portion 11.

[0017] The metal portion 11 is the area on which the light-emitting device 20 is mounted, and is formed in a rectangular shape in plan view, with two of them arranged side by side in the horizontal direction. The metal portion 11 is formed on the upper surface of the first mounting substrate 10a without an insulating film 14, leaving the substrate exposed. The metal portion 11 may be formed of multiple metal layers. For example, a metal layer may be provided in the area of ​​the metal portion 11 on the substrate to make it the same height as the insulating film 14 or the first metal film 12 provided on the upper surface of the substrate, resulting in a configuration in which it is formed of multiple metal layers. The insulating film 14 is provided on the upper surface of the first mounting substrate 10a, excluding the metal portion 11. The first metal film 12 and the second metal film 13 are provided on top of the insulating film 14.

[0018] The first metal film 12 is formed in pairs on each metal part 11, with three on the upper side and three on the lower side in a plan view. The second metal film 13 is provided on one side of the first metal film 12, but not on the other side of the first metal film 12. The second metal film 13 and the first metal film 12 provided on the side of the second metal film 13 are formed by providing a single metal film on top of an insulating film 14, and then providing an insulating film 14 on top of that so that the first metal film 12 and the second metal film 13 are separated. In other words, the first metal film 12 and the second metal film 13 are connected and electrically linked, although they are not visible from the surface. The three first metal films 12 on the side where the second metal film 13 is not provided are connected between the two connection patterns 15. In other words, similarly, a single connected metal film is provided on the insulating film 14, and the insulating film 14 is provided on top of this so that there are three first metal films 12 in each connection pattern 15. Therefore, the two connection patterns 15 are connected to each other by the first metal films 12 on the side where the second metal film 13 is not provided, and are electrically connected. The metal part 11 is not connected to the first metal films 12. The first metal films 12, which are arranged in pairs above and below the metal part 11, are electrically connected from one to the other by joining with the metal film 37 provided on the lower surface of the light-emitting device 20. Furthermore, by mounting the light-emitting device 20 on the two connection patterns 15, electrical conductivity can be established from one second metal film 13 through the two light-emitting devices 20 to the other second metal film 13.

[0019] In this way, the first mounting substrate 10a and the light-emitting device 20 can be made electrically connected. Furthermore, because the first metal film 12 on the first mounting substrate 10a is provided in three separate regions, self-alignment can be effectively performed when mounting the light-emitting device 20. When only one light-emitting device 20 is mounted, electrical connection can be made from the first metal film 12 on the side of the connection pattern 15 where the light-emitting device is not joined and where the second metal film 13 is not provided. Also, because the second metal film 13 is provided on only one side, the mounting orientation can be determined from the position of the second metal film. The two first mounting substrates 10a on the mounting substrate 10 are arranged side by side so that the sides opposite to the side on which the second metal film 13 is formed face each other. The first mounting substrate 10a has through holes that penetrate in the substrate thickness direction at positions on the left and right sides when the direction in which the first metal film 12 is provided, with the metal portion 11 in between, is considered as up and down, outside the area where the two connection patterns 15 are provided side by side. These through holes are provided for fastening positioning pins and fixing screws.

[0020] [Light-emitting device] The light-emitting device 20 includes a first light-emitting device 20a and a second light-emitting device 20b. The first light-emitting device 20a and the second light-emitting device 20b each include a package 21, a semiconductor laser element 22, a submount 23, a light-reflecting member 24, a protective element 25, a wire 26, a lid member 27, an adhesive portion 28, and a lens member 29.

[0021] The first light-emitting device 20a and the second light-emitting device 20b have the same external shape, but differ in the number of semiconductor laser elements 22 mounted inside the external shape. That is, in this embodiment, a package 21 capable of mounting four semiconductor laser elements 22 is used for both the first light-emitting device 20a and the second light-emitting device 20b. Therefore, the first light-emitting device 20a, which mounts three semiconductor laser elements 22 as shown in Figures 2A and 2B, and the second light-emitting device 20b, which mounts four semiconductor laser elements 22 as shown in Figures 3A and 3B, are manufactured using the same package 21. By using the same package, the first light-emitting device 20a and the second light-emitting device 20b have the same external shape, and when bonding them to a mounting substrate, the mounting substrate does not need to consider the difference in size of the light-emitting devices regardless of which light-emitting device is mounted. This makes it possible to prepare a unified layout for multiple connection patterns, as in the first mounting substrate 10a. Figures 3C and 3D show the cross-section of the second light-emitting device and the bottom (back) surface of the second light-emitting device, respectively, and the same applies to the first light-emitting device. Note that the number of semiconductor laser elements 22 mounted on the first light-emitting device 20a is not limited to three. For example, there may be two, or four or more, or even just one. The number of semiconductor laser elements 22 mounted on the second light-emitting device 20b is one more than the number of semiconductor laser elements 22 mounted on the first light-emitting device 20a. Note that there may be two more.

[0022] The three semiconductor laser elements 22 of the first light-emitting device 20a are positioned in the same locations as three of the four semiconductor laser elements 22 of the second light-emitting device 20b. This allows the mounting positions of the semiconductor laser elements 22 in the package 21 to be common to both the first light-emitting device 20a and the second light-emitting device 20b. The arrangement of the four semiconductor laser elements 22 can be arbitrarily determined. For example, the three semiconductor laser elements 22 of the first light-emitting device 20a can be arranged side by side, biased towards one side of the package 21. In other words, one of the four semiconductor laser elements 22 arranged in the second light-emitting device 20b is removed from the end. This allows the light from the first light-emitting device 20a to be contained within a small area. Alternatively, the three semiconductor laser elements 22 of the first light-emitting device 20a can be arranged such that one of the four semiconductor laser elements 22 arranged in the second light-emitting device 20b is removed from the end. This reduces the difference in the length of the light-emitting region from end to end between the first light-emitting device 20a and the second light-emitting device 20b. Note that the arrangement is not limited to these examples; for example, the three semiconductor laser elements 22 may be evenly distributed in the region where the four semiconductor laser elements 22 are arranged.

[0023] Package 21 is formed in a rectangular shape in plan view and has a rectangular recess 30 in plan view. Here, "rectangle" includes shapes that are generally rectangular, such as package 21 with cut-out corners or parts of the sides, or recess 30 with curved corners. Package 21 also has stepped portions 33 formed on a part of the inner surface 32 of the recess 30. Specifically, the stepped portions 33 are provided on two of the four inner surface 32 of the recess 30 that are opposite each other in the shorter direction. Package 21 can be formed using ceramic as the main material. However, package 21 may be formed from metal, not just ceramic. For example, in the case of ceramics, aluminum nitride, silicon nitride, aluminum oxide, and silicon carbide can be used as the main material of package 21. In the case of metals, copper, aluminum, iron, and as composites, copper-molybdenum, copper-diamond composite materials, and copper-tungsten can be used as the main material of package 21.

[0024] Metal films are provided on the lower surface 34 of the package 21 and the upper surface of the stepped portion 33. The metal film on the lower surface 34 of the package 21 has a pair of metal films 37 provided at both ends of the package 21, and a metal film 38 provided in the center of the lower surface 34 of the package 21 between the metal films 37 at both ends. Each of the metal films 37 is provided in approximately rectangular shapes in three locations along each of the two opposing sides, spaced apart from each other. These metal films 37 are formed opposite each other so as to be able to connect to the first metal film 12 of the first mounting substrate 10a. The metal film 38 provided in the center of the lower surface 34 of the package 21 has a larger area than any of the metal films 37. This metal film 38 is formed opposite each other so as to be able to connect to the metal portion 11 of the first mounting substrate 10a. In the package 21, the metal film on the upper surface of the stepped portion 33 and the metal film 37 on the lower surface 34 are electrically connected by metal wiring running through the inside.

[0025] The package 21 may be formed by joining a frame portion 35 that forms the frame of the recess 30 and a bottom portion 36, each made of different main materials. For example, the package 21 may be formed by joining a plate-shaped bottom portion 36 with a predetermined thickness, made primarily of metal, and a frame portion 35 with a predetermined height, made primarily of ceramic. In this case, instead of providing a metal film 38, the lower surface of the bottom portion 36 can be connected to the metal portion 11 of the first mounting substrate 10a.

[0026] The semiconductor laser element 22 and the protective element 25 are electrically connected to the connecting wiring, which is a metal film provided on the upper surface of the stepped portion 33. A wire 26 is joined to ensure this conductivity. Figures 2B and 3B show examples of how the wire 26 is joined when each semiconductor laser element 22 is connected in series. However, the method of connection is not limited to this. Multiple semiconductor laser elements 22 may also be connected in parallel. In this case, the semiconductor laser element 22 and the protective element 25 are electrically connected via the metal film 37 provided on the lower surface 34 of the package 21.

[0027] Stepped portions 33 are not provided on the two opposing longitudinal inner surfaces 32 of the package 21. By not providing stepped portions 33 around the entire circumference of the inner surfaces 32, the size of the package 21 can be reduced. Alternatively, a stepped portion 33 may be provided on the inner surface 32 on the side furthest from the light-reflecting member 24. By expanding the area where the stepped portion 33 is provided, a larger wiring area can be secured. On the other hand, a stepped portion 33 does not need to be provided on the inner surface 32 on the side closer to the light-reflecting member 24. Even if a stepped portion 33 is provided in this part, the wire 26 must be joined to the semiconductor laser element 22 and the wiring area so as not to obstruct the optical path, making it difficult to provide a wiring area for the semiconductor laser element 22. Furthermore, by not providing a step portion 33 on the inner surface 32, the light-reflecting member 24 can be positioned closer to the outer surface of the package 21. As will be described in detail later, when mounting two light-emitting devices 20 on the mounting substrate 10, the distance between the light emitted from the two light-emitting devices 20 can be reduced. Note that, as shown in Figures 2B and 3B, the inner surface 32 on the side closer to the light-reflecting member 24 can also be said to be the inner surface at the end of the direction in which the laser light emitted from the semiconductor laser element travels.

[0028] In this type of light-emitting device 20, a pair of metal films 37 provided on the lower surface 34 are bonded to the first metal film 12 of the first mounting substrate 10a. In addition, a metal film 38 provided between the pair of metal films 37 is bonded to the metal part 11 of the first mounting substrate 10a. The light-emitting device 20 and the first mounting substrate 10a can be joined by soldering. In the joining of the metal films 37 and 38 on the lower surface 34 of the light-emitting device 20 to the first metal film 12 and metal part 11 of the first mounting substrate 10a, self-alignment is utilized when fixing the light-emitting device 20 to the first mounting substrate 10a.

[0029] The semiconductor laser element 22 has a bottom surface, a top surface, and a side surface, and emits laser light from one of its side surfaces. The laser light emitted from the semiconductor laser element 22 has a broadened shape and forms an elliptical far-field pattern (hereinafter referred to as "FFP") on a plane parallel to the light emission end surface.

[0030] The semiconductor laser element 22 is mounted on the bottom surface 31 (bottom upper surface) of the recess 30 of the package 21 via a submount 23. A separate submount 23 is provided for each semiconductor laser element 22. The light-emitting device 20 may mount multiple semiconductor laser elements 22 on the top surface of a single submount 23. Alternatively, the light-emitting device 20 may mount the semiconductor laser elements 22 directly on the bottom surface 31 of the recess 30 of the package 21 without using a submount 23. As shown in Figures 2B and 3B, the multiple semiconductor laser elements 22 mounted on the light-emitting device 20 are arranged in a single direction. Specifically, they are arranged along the longitudinal direction of the package 21. Furthermore, the orientation of the emission end faces of each mounted semiconductor laser element 22 is aligned so that they emit laser light in the same direction. The positions of the emission end faces are designed so that the emission end faces of each mounted semiconductor laser element 22 lie on the same plane. However, they do not necessarily have to lie on the same plane. Multiple semiconductor laser elements 22, arranged in a line in one direction, are electrically connected in series using wires 26. Laser light is emitted from the emission end faces of the multiple semiconductor laser elements 22 in a direction perpendicular to the direction in which the multiple semiconductor laser elements 22 are aligned.

[0031] All semiconductor laser elements 22 mounted on the first light-emitting device 20a and the second light-emitting device 20b are semiconductor laser elements that emit blue light. However, semiconductor laser elements that emit light other than blue, such as red or green light, may also be used. Furthermore, the color of light emitted by the semiconductor laser element 22 mounted on the first light-emitting device 20a and the color of light emitted by the semiconductor laser element 22 mounted on the second light-emitting device 20b may be different. For example, the first light-emitting device 20a may be equipped with a semiconductor laser element 22 that emits blue light, and the second light-emitting device 20b may be equipped with a semiconductor laser element 22 that emits red light. In addition, two first light-emitting devices 20a or two second light-emitting devices 20b may be mounted on the first mounting substrate 10a by joining them with two connection patterns 15, and in this case, semiconductor laser elements 22 that emit different colors may be mounted between the two mounted light-emitting devices 20.

[0032] Here, blue light refers to light whose emission peak wavelength is in the range of 420 nm to 494 nm. Red light refers to light whose emission peak wavelength is in the range of 605 nm to 750 nm. Green light refers to light whose emission peak wavelength is in the range of 495 nm to 570 nm. The semiconductor laser element 22 is an example of a light-emitting element mounted in the light-emitting module according to the present invention. The light-emitting element is not limited to the semiconductor laser element 22.

[0033] The submount 23 is joined to the bottom surface 31 of the recess 30 of the package 21 on its lower surface and to the semiconductor laser element 22 on its upper surface. The semiconductor laser element 22 is mounted on the submount 23 such that its emission end face is aligned with the side surface of the submount 23 or protrudes from it. This prevents light emitted from the semiconductor laser element 22 from irradiating the upper surface of the submount 23. The submount 23 can be formed using, for example, silicon nitride, aluminum nitride, or silicon carbide. A metal film is also provided on the upper surface of the submount 23.

[0034] The light-reflecting member 24 is a member that reflects light from the semiconductor laser element 22. The light-reflecting member 24 is placed on the bottom surface of the recess 30 of the package 21. The light-reflecting member 24 is arranged separately for each semiconductor laser element 22. Furthermore, in the case of three or four semiconductor laser elements 22, the distance between the output end face of each semiconductor laser element 22 and the corresponding light-reflecting member 24 is designed to be the same. Note that the distance may be determined according to the semiconductor laser element 22, and the distance may differ among multiple semiconductor laser elements 22. In addition, the light-emitting device 20 may have one light-reflecting member 24 corresponding to multiple semiconductor laser elements 22.

[0035] The light-reflecting member 24 has a bottom surface, a top surface, side surfaces, and an inclined surface, the inclined surface being the light-reflecting surface. The light-reflecting surface is flat and slopes from the top surface to the bottom surface. The light-reflecting surface is designed to form a 45-degree angle with respect to the bottom surface. However, this angle is not limited to 45 degrees, and the light-reflecting surface may be curved instead of flat.

[0036] The light-reflecting member 24 can be formed by creating its outer shape using a main material and then depositing a light-reflecting film on the surface of the formed outer shape where a light-reflecting surface is desired. The main material is preferably a heat-resistant material, such as glass like quartz or BK7 (borosilicate glass), metals like aluminum, or Si. The light-reflecting film is preferably made of a material with high light reflectivity, such as metals like Ag or Al, or dielectric multilayer films like Ta2O5 / SiO2, TiO2 / SiO2, or Nb2O5 / SiO2. Note that if the outer shape of the light-reflecting member 24 is formed using a material with high light reflectivity such as metal as the main material, the formation of the light-reflecting film may be omitted.

[0037] The main portion of the light emitted from the semiconductor laser element 22 is directed onto the light-reflecting surface of the corresponding light-reflecting member 24. By passing through the light-reflecting member 24, the optical path length of the light emitted from the semiconductor laser element 22 before it enters the lens can be increased compared to the case without the light-reflecting member 24. A longer optical path length reduces the influence of mounting misalignment between the light-reflecting member 24 and the semiconductor laser element 22. Alternatively, the light-emitting device 20 may have no light-reflecting member 24, with the output end face of the semiconductor laser element 22 facing upwards.

[0038] The protective element 25 is mounted on the upper surface of the submount 23. The protective element 25 is, for example, a Zener diode. The wire 26 is a metal wire. The material of the wire 26 may be a metal such as Au, Ag, Cu, Pt, Al, or an alloy thereof. Note that the light-emitting device 20 may not have the protective element 25.

[0039] The lid member 27 is a member that covers the semiconductor laser element 22 and the light reflecting member 24. The lid member 27 is translucent as a whole, but may have a non-translucent area in part. The lid member 27 can be formed using sapphire as the main material. In addition, a metal film is provided in part of the lid member 27. Note that in addition to sapphire, glass or other materials can also be used as the main material. The lid member 27 is joined to the upper surface (upper surface of the frame) of the package 21 at its lower surface. The lid member 27 and the package 21 are fixed together via a metal film in the area where they are joined, using Au-Sn or the like. The light-emitting device 20 forms a closed space when the package 21 and the lid member 27 are joined. This closed space is hermetically sealed. By hermetically sealing the light-emitting device 20 in this way, the accumulation of organic matter and the like on the light-emitting end face of the semiconductor laser element 22 can be suppressed.

[0040] The adhesive portion 28 is formed on the upper surface of the lid member 27 in the region where the lid member 27 and the lens member 29 are bonded. For example, an ultraviolet-curing resin can be used as the adhesive portion 28. The adhesive portion 28 is formed so that the lid member 27 and the lens member 29 do not come into contact with each other. The adhesive portion 28 is bonded to the lid member 27 after its position and height are adjusted by adding thickness. Furthermore, the adhesive portion 28 is formed so as not to be located in the optical path of the light emitted from the semiconductor laser element 22, for example, in a position facing the outer edge of the lens member 29. Figures 2A and 3A show an example of the shape of the adhesive portion 28 after curing, but a flexible adhesive portion 28 can be used when applying it.

[0041] The lens member 29 is provided facing the upper surface of the lid member 27. The lens member 29 is integrally formed from a lens portion 51 having a lens shape and a rectangular support plate portion 52 that supports the lens portion 51. Each lens portion 51 of the lens member 29 is positioned opposite the optical axis of the semiconductor laser element 22. The arrangement and shape of each lens portion 51 are designed so that reflected light emitted from the corresponding semiconductor laser element 22 and reflected by the light reflecting member 24 passes through the lens portion 51 and is collimated. As shown in Figures 2A and 3A, the same lens member 29 is used in both the first light-emitting device 20a and the second light-emitting device 20b, which have different numbers of semiconductor laser elements 22 mounted on them. In other words, the same lens member 29 used in the second light-emitting device 20b is also used in the lens member 29 of the first light-emitting device 20a. In this way, even if the first light-emitting device 20a is configured in a way that excludes any of the four semiconductor laser elements 22 in the second light-emitting device 20b, the lens member 29 can be standardized. Furthermore, a single design of lens member 29 can be used for both the first light-emitting device 20a and the second light-emitting device 20b.

[0042] Furthermore, the lens member 29 used in the first light-emitting device 20a may be one in which the number and arrangement of lens portions 51 correspond to the number and arrangement of semiconductor laser elements 22 mounted on the package 21. By matching the number of lens portions 51 to the number of semiconductor laser elements 22, it is possible to reduce the weight compared to the lens member 29 of the second light-emitting device 20b, which is matched to the number of semiconductor laser elements 22. For example, the lens component 29 can be made of glass such as BK7 or B270.

[0043] In the light-emitting module 100 shown in Figure 1A, two first mounting substrates 10a are placed side by side to form a mounting substrate 10, and two light-emitting devices 20 are mounted on each, thereby realizing a light-emitting module 100 in which four light-emitting devices 20 are mounted in a 2x2 arrangement. Furthermore, in the light-emitting module 100 of Figure 1A, the two light-emitting devices 20 in a 1x2 arrangement structure are mounted on the mounting surface in orientations that are 180 degrees apart from each other. Specifically, the light-emitting module 100 is mounted on each of the first mounting substrates 10a such that one first light-emitting device 20a and one second light-emitting device 20b are adjacent to each other, and the light-reflecting members 24 are mounted adjacent to each other. In other words, with respect to the two light-emitting devices 20 mounted on one first mounting substrate 10a, the distance to the light-reflecting member 24 located on one light-emitting device 20 is shorter for the light-reflecting member 24 located on the other light-emitting device 20 than for the semiconductor laser element 22, and this condition is similarly maintained when one light-emitting device 20 and the other light-emitting device 20 are swapped. Furthermore, the first light-emitting devices 20a and the second light-emitting devices 20b are mounted in the light-emitting module 100 such that the first light-emitting devices 20a and the second light-emitting devices 20b are positioned diagonally opposite each other. In this way, the four light-emitting devices are mounted adjacent to each other on the mounting substrate 10 in the matrix direction, and the light-emitting devices 20 are mounted so that the light-reflecting members 24 are adjacent to each other in the row direction.

[0044] By arranging the two light-emitting devices 20 on a single first mounting substrate 10a in this manner, the light emitted from the two light-emitting devices 20 can be brought closer together. In addition, the distance between the semiconductor laser elements 22 can be increased between the two light-emitting devices 20, resulting in improved heat dissipation. Furthermore, by arranging the two first mounting substrates 10a in this manner, the light can be concentrated towards the center of the mounting substrate 10. In the optical unit disclosed in Patent Document 1, which comprises multiple semiconductor devices with four semiconductor elements mounted on a package, the light emitted from the semiconductor elements passes directly through the semiconductor device. Therefore, as in the light-emitting module 100, it was not necessary to consider how to best mount the two light-emitting devices 20 based on the arrangement relationship between the semiconductor laser element mounted on the package and the light-reflecting member. On the other hand, the light-emitting device 20 of the light-emitting module 100 has a package on which multiple semiconductor laser elements 22 and light-reflecting members 24 are mounted. In this case, the light-emitting module 100 that achieves the above-mentioned effects is realized by mounting the two light-emitting devices 20 on the mounting substrate 10 in a suitable configuration. Furthermore, when manufacturing a light-emitting module 100 on which two first light-emitting devices 20a and two second light-emitting devices 20b are mounted, each having three semiconductor laser elements 22 arranged in the same configuration, the semiconductor laser elements 22 in the two first light-emitting devices 20a can be arranged symmetrically from the center of the mounting substrate 10 by arranging the first light-emitting devices 20a diagonally opposite each other. In this description, the light-emitting devices 20 are assumed to be mounted so that the light-reflecting members 24 are adjacent to each other in the row direction on the paper. However, the light-emitting devices 20 may also be mounted so that the light-reflecting members 24 are adjacent to each other in the column direction on the paper. Furthermore, the light-emitting devices 20 may be arranged so that the first light-emitting devices 20a are adjacent to each other and the second light-emitting devices 20b are adjacent to each other in the row direction, or the light-emitting devices 20 may be arranged so that the first light-emitting devices 20a are adjacent to each other and the second light-emitting devices 20b are adjacent to each other in the column direction.

[0045] <Manufacturing method for light-emitting modules> Next, an example of a manufacturing method for the light-emitting module 100 according to the first embodiment will be described. Figure 4 is a flowchart showing the procedure for manufacturing a light-emitting module according to the first embodiment. The method for manufacturing a light-emitting module according to the first embodiment is the manufacture of a light-emitting module 100 on which one or more light-emitting devices, each on which a plurality of light-emitting elements are mounted, are mounted. The method for manufacturing the light-emitting module 100 includes a step S101 for preparing the light-emitting devices, a step S102 for preparing a first mounting substrate, and a step S103 for mounting the light-emitting devices, and these steps are performed in this order. Furthermore, the light-emitting module 100 manufactured by this method can be a light-emitting module 100 on which any number of light-emitting elements 22 selected from at least three consecutive numbers are mounted.

[0046] The following describes each step in the manufacturing process of the light-emitting module 100. The materials and arrangement of each component are as described in the above-mentioned description of the light-emitting module 100, so their explanation will be omitted here as appropriate.

[0047] [Preparation of the light-emitting device] Step S101, which involves preparing the light-emitting device, is a step in which a first light-emitting device and a second light-emitting device are prepared, each having a different number of semiconductor laser elements mounted on it. In this step S101, multiple first light-emitting devices 20a, each equipped with three semiconductor laser elements 22, and multiple second light-emitting devices 20b, each equipped with four semiconductor laser elements 22, are prepared.

[0048] [Process for preparing the first mounting board] Step S102, which prepares the first mounting substrate, is a step of preparing a first mounting substrate having a mounting surface on which multiple identical connection patterns 15 corresponding to one light-emitting device are provided. In step S102, one or more first mounting substrates 10a are prepared, each having a mounting surface with two connection patterns 15 corresponding to a single light-emitting device 20, which can accommodate either the first light-emitting device 20a or the second light-emitting device 20b.

[0049] [Process for mounting the light-emitting device] Step S103, which involves mounting light-emitting devices, is a step in which multiple light-emitting devices selected from the first light-emitting devices and the second light-emitting devices are mounted to multiple connection patterns provided on the mounting surface of the first mounting substrate. In step S103, two desired light-emitting devices, selected from the first light-emitting device 20a and the second light-emitting device 20b, are mounted to two connection patterns 15 provided on the mounting surface of the first mounting substrate 10a. Furthermore, as light-emitting modules 100 on which the two selected light-emitting devices 20 are mounted, at least three types of light-emitting modules 100 are manufactured: one with two first light-emitting devices 20a mounted, one with one first light-emitting device 20a and one with one second light-emitting device 20b mounted, and one with two second light-emitting devices 20b mounted. The number of light-emitting elements mounted on these three types of light-emitting modules 100 increases by one in each order. In this way, by manufacturing three light-emitting modules 100 each equipped with two different combinations of light-emitting devices 20, it is possible to manufacture a light-emitting module 100 equipped with any number of light-emitting elements 22 selected from three consecutive numbers.

[0050] The light-emitting module 100 manufactured by the manufacturing method according to the first embodiment, which has one or more light-emitting devices on which multiple light-emitting elements are mounted, is not limited to these three light-emitting modules 100. It is possible to manufacture a light-emitting module 100 in which one light-emitting device 20 is mounted on one first mounting substrate 10a, a light-emitting module 100 in which a total of three light-emitting devices 20 are mounted on two first mounting substrates 10a, and a light-emitting module 100 in which a total of four light-emitting devices 20 are mounted on two first mounting substrates 10a. In the manufacturing of the light-emitting module 100 shown in Figure 1A, in step S103, two light-emitting devices 20 (first light-emitting device 20a and second light-emitting device 20b) arranged in a 1x2 array are mounted on the mounting surface in orientations 180 degrees apart from each other. In step S103, two first mounting substrates 10a, each with two light-emitting devices 20 (first light-emitting device 20a and second light-emitting device 20b) mounted on them, are placed side by side to manufacture a light-emitting module 100 with four light-emitting devices 20 mounted in a 2x2 array. As a result, the four light-emitting devices 20 can be positioned in the center of the light-emitting module 100. Furthermore, on the outer circumference of the four light-emitting devices 20, through holes for screw fastening, etc., are provided at one end so as to sandwich the four light-emitting devices 20, and a second metal film 13 is provided at the other end. Providing the second metal film 13 at both ends makes it easier to connect to the power supply than if it were provided sandwiched between the two light-emitting devices 20.

[0051] In this way, a light-emitting module 100 can be manufactured using the first mounting substrate 10a, the first light-emitting device 20a, and the second light-emitting device 20b, with one to four light-emitting devices mounted on it. Furthermore, with such a light-emitting module 100, the number of mounted semiconductor laser elements 22 can be adjusted to any number from 3 to 16 (excluding 5), providing a light-emitting module 100 that can efficiently accommodate various specifications. Furthermore, if the number of semiconductor laser elements 22 mounted on the first light-emitting device 20a is 2 and the number of semiconductor laser elements 22 mounted on the second light-emitting device 20b is 3, a light-emitting module 100 that can be adjusted to any number from 2 to 12 can be provided. If the number of semiconductor laser elements 22 mounted on the first light-emitting device 20a is 4 and the number of semiconductor laser elements 22 mounted on the second light-emitting device 20b is 5, a light-emitting module 100 that can be adjusted to any number from 4 to 20 (excluding 6, 7, and 11) can be provided.

[0052] <Second Embodiment> Next, a second embodiment will be described. Figure 5A is a schematic perspective view showing an example of the configuration of the light-emitting module according to the second embodiment. Figure 5B is a schematic plan view showing an example of the configuration of the light-emitting module according to the second embodiment. Figure 5C is a schematic plan view showing an example of the configuration of the mounting substrate according to the second embodiment. Figure 5D is a plan view showing the mounting substrate of Figure 5C separated into a first mounting substrate and a second mounting substrate. The light-emitting module according to the second embodiment differs from the light-emitting module according to the first embodiment in that it employs a second mounting substrate in addition to the first mounting substrate used in the light-emitting module according to the first embodiment.

[0053] <Light-emitting module> The light-emitting module 100A shown in Figure 5A comprises a mounting substrate 10A and light-emitting devices 20. Furthermore, this light-emitting module 100A is a light-emitting module on which three light-emitting devices 20 are mounted. In this case, the mounting substrate 10A of the light-emitting module 100A consists of a first mounting substrate 10a and a second mounting substrate 10b. The second mounting board 10b has the same external shape as the first mounting board 10a. The second mounting board 10b has a bottom surface, a top surface, and side surfaces, and the top surface has a mounting surface on which one connection pattern 15, the same as the connection pattern 15 provided on the first mounting board 10a, is provided. By making the external shape the same while using only one connection pattern 15, the external shape can be made the same as when mounting with two first mounting boards 10a.

[0054] Furthermore, in this embodiment, the connection pattern 15 of the second mounting board 10b is provided near the center, and on the upper surface, the area where the connection pattern 15 of the second mounting board 10b is provided partially overlaps with each of the areas where the two connection patterns 15 are provided on the first mounting board 10a. On the other hand, the positions of the second metal film 13 and the through holes remain the same as on the first mounting board 10a. By making the position of the second metal film 13 the same, the connection method can be standardized between the first mounting board 10a and the second mounting board 10b when electrically connecting to an external power supply. For example, the connection to the second metal film 13 can be made through a connector, flexible substrate, glass epoxy substrate, leaf spring terminal, etc. When using such connection members, the same connection members can be used to connect to both the first mounting board 10a and the second mounting board 10b. By making the positions of the through holes the same, screw fastening, etc., can be done in the same position as when mounting on two first mounting boards 10a. In the second mounting substrate 10b, of the three pairs of first metal films 12 that are arranged on either side of the metal portion 11, the three first metal films 12 located closer to the second metal film 13 are connected to one of the two second metal films 13, thus providing an electrical connection. In addition, the three first metal films 12 located further away from the second metal film 13 are connected to the other second metal film 13, thus providing an electrical connection. One light-emitting device 20 is mounted on the second mounting substrate 10b, and in the example shown in Figure 5A, one second light-emitting device 20b is mounted. The first mounting substrate 10a and the second mounting substrate 10b are arranged so that their sides opposite to the side on which the second metal film 13 is formed face each other. Other details are the same as those of the light-emitting module 100 according to the first embodiment shown in Figure 1A.

[0055] <Manufacturing method for light-emitting modules> Next, an example of a manufacturing method for the light-emitting module 100A according to the second embodiment will be described. Figure 6 is a flowchart showing the procedure for manufacturing a light-emitting module according to the second embodiment. The manufacturing method for the light-emitting module 100A includes the steps of preparing a light-emitting device (S201), preparing a first mounting substrate (S202), preparing a second mounting substrate (S203), determining the number of mounting substrates (S204), mounting the light-emitting device (S205), and forming the light-emitting module (S206), and these steps are performed in this order. The materials and arrangement of each component are as described in the above-mentioned description of the light-emitting module 100, so their explanation is omitted here as appropriate. Furthermore, the steps of preparing the light-emitting device (S201) and preparing the first mounting substrate (S202) are the same as the steps of preparing the light-emitting device (S101) and preparing the first mounting substrate (S102) in the manufacturing method of the light-emitting module 100 according to the first embodiment, so their explanation is omitted here.

[0056] [Process for preparing the second mounting board] Step S203, which involves preparing the second mounting board, is a step in which a second mounting board is prepared having a mounting surface on which the same connection pattern as the connection pattern provided on the first mounting board is provided. In step S203, a second mounting substrate 10b is prepared, which has a mounting surface on which the same connection pattern 15 as the connection pattern 15 provided on the first mounting substrate 10a is provided.

[0057] [Process for determining the number of mounting boards, etc.] Step S204, which determines the number of mounting boards, is a step in which the number, or the number and combination of mounting boards, to be used in the manufacture of the light-emitting module is determined from among a plurality of mounting boards, including at least a first mounting board and a second mounting board. In this step S204, it is decided whether to form the mounting board 10A for the light-emitting module 100A using one mounting board or using two mounting boards. If one board is used, it is decided whether to use the first mounting board 10a or the second mounting board 10b. If two boards are used, it is decided whether to combine two first mounting boards 10a or combine one first mounting board 10a and one second mounting board 10b. Although it is possible to form the mounting board 10A by combining two second mounting boards 10b, if two light-emitting devices 20 are to be mounted, using one first mounting board 10a allows for a smaller light-emitting module 100A. In the manufacturing of the light-emitting module 100A shown in Figure 5A, it has been decided to use two mounting boards, one first mounting board 10a and one second mounting board 10b, to constitute the mounting board 10A.

[0058] [Process for mounting the light-emitting device] Step S205, which involves mounting the light-emitting device, is a step in which, when a second mounting substrate is used for the light-emitting module, one light-emitting device selected from the first light-emitting device and the second light-emitting device is mounted to the connection pattern of the second mounting substrate. Furthermore, when a first mounting substrate is used for the light-emitting module, step S205 is a step in which multiple light-emitting devices selected from the first light-emitting device and the second light-emitting device are mounted to multiple connection patterns provided on the mounting surface of the first mounting substrate. In the manufacturing of the light-emitting module 100A shown in Figure 5A, one second light-emitting device 20b is mounted on the second mounting substrate 10b. In addition, one first light-emitting device 20a and one second light-emitting device 20b are mounted side by side on the first mounting substrate 10a, so that the two light-emitting devices 20 in a 1x2 arrangement are mounted on the mounting surface in orientations 180 degrees apart from each other.

[0059] [Process for forming a light-emitting module] Step S206, which involves forming a light-emitting module, is a step in which a light-emitting module is formed using one or more of the first mounting substrates and the second mounting substrates on which a determined number, or a determined number and combination of light-emitting devices, are mounted. In the manufacturing of the light-emitting module 100A shown in Figure 5A, a first mounting substrate 10a on which one first light-emitting device 20a and one second light-emitting device 20b are mounted, and a second mounting substrate 10b on which one second light-emitting device 20b is mounted are arranged side by side to form the light-emitting module 100A. By using the second mounting substrate 10b when mounting one light-emitting device 20, it is possible to avoid the occurrence of unused connection patterns 15 compared to when using the first mounting substrate 10a. Furthermore, in the first mounting substrate 10a, in order to electrically connect to an external power supply, it is necessary to ensure conductivity between the second metal film 13 on the connection pattern 15 to which the light-emitting device 20 is attached and the first metal film 12 on the connection pattern 15 to which the light-emitting device 20 is not attached, but in the second mounting substrate 10b, conductivity can be achieved with two second metal films 13. By using the first mounting board 10a when mounting two light-emitting devices 20 on a single mounting board, and the second mounting board 10b when mounting one light-emitting device 20, electrical conductivity with an external power supply can be easily achieved in either case using two second metal films 13. As explained in the manufacturing method of the light-emitting module 100 according to the first embodiment, it is clear that a light-emitting module 100A manufactured by the manufacturing method according to the second embodiment can also be provided with any number of light-emitting devices 20 from 1 to 4 mounted on it.

[0060] <Third Embodiment> Next, a third embodiment will be described. Figure 7A is a schematic plan view showing an example of the configuration of the light-emitting module according to the third embodiment. Figure 7B is a schematic plan view showing an example of the configuration of the light-emitting module according to the third embodiment. Figure 7C is a schematic plan view showing an example of the configuration of the light-emitting module according to the third embodiment.

[0061] In the light-emitting module 100B according to the third embodiment shown in Figure 7A, the mounting substrate 10B of the light-emitting module 100B is composed of one first mounting substrate 10c having a mounting surface on which four identical connection patterns 15 are arranged in a 2x2 configuration. In the light-emitting module 100B, any number of light-emitting devices 20 from 1 to 4 are mounted on these four connection patterns 15. Figures 7A to 7C show light-emitting module 100B with four light-emitting devices 20 mounted, light-emitting module 100C with three light-emitting devices 20 mounted, and light-emitting module 100D with two light-emitting devices 20 mounted, respectively. By mounting four light-emitting devices 20 on a single mounting substrate, the manufacturing process can be simplified.

[0062] Through the first, second, and third embodiments, we have described examples of the configuration and manufacturing method of the light-emitting module according to the present invention. In these descriptions, we have also stated that the light-emitting module comprises a first light-emitting device on which a plurality of light-emitting elements are mounted, a second light-emitting device on which one more light-emitting element is mounted than in the first light-emitting device, and a first mounting substrate having a mounting surface on which multiple identical connection patterns corresponding to one light-emitting device are provided, and that one or more first light-emitting devices and one or more second light-emitting devices are connected to the plurality of connection patterns provided on the mounting surface of the first mounting substrate. The light-emitting module 100E shown in Figure 8 shows a specific example of such a preferred form of light-emitting module in which the number of mounted light-emitting elements is adjusted. By realizing such a light-emitting module, it is possible to provide a light-emitting module that can efficiently respond to various specifications regarding the light output.

[0063] <Fourth Embodiment> Next, a fourth embodiment will be described. Figure 9A is a schematic perspective view showing an example of the configuration of a light-emitting module according to the fourth embodiment. Figure 9B is a schematic plan view showing an example of the configuration of a light-emitting module according to the fourth embodiment. Figure 9C is a schematic plan view illustrating the first mounting substrate according to the fourth embodiment. Figure 9D is a schematic plan view illustrating the light-emitting device and thermistor mounted on the second mounting substrate according to the fourth embodiment. Figure 9E is a schematic plan view illustrating the second mounting substrate according to the fourth embodiment.

[0064] The light-emitting module according to the fourth embodiment differs from the mounting substrates described in the first to third embodiments in that a metal film for mounting a thermistor is further provided on the mounting surface of the mounting substrate. As shown in Figure 9C, the first mounting substrate 10d according to the fourth embodiment includes a metal portion 11, a first metal film 12, a second metal film 13, an insulating film 14, and further, a third metal film 16 and a fourth metal film 17 provided on the mounting surface. The connection pattern 15, which is composed of the metal portion 11 and the first metal film 12, is the same as that described in the previous embodiments.

[0065] In the first mounting substrate 10d, since the third metal film 16 is provided, the distance between the first metal film 12 and the second metal film 13 is greater than that of the first mounting substrate 10a. The two third metal films 16 are provided between the first metal film 12 and the second metal film 13, and are positioned at the same distance from the emitted light emitted from the two light-emitting devices 20. Therefore, in the first mounting substrate 10d, the distance from the two connection patterns 15 is the same. In other words, the two third metal films 16 are provided such that the distance from one connection pattern 15 to one third metal film 16 is the same as the distance from the other connection pattern 15 to the other third metal film 16. Furthermore, since the fourth metal film 17 is provided between the two second metal films 13, the distance between the two second metal films 13 is greater than that of the first mounting substrate 10a. Both of the fourth metal films 17 are provided in positions sandwiched between the two second metal films 13. The third metal film 16 and the fourth metal film 17 are formed by providing a single metal film, which is connected to the third metal film 16, on top of the insulating film 14, and then providing the insulating film 14 on top of that so as to separate it into the third metal film 16 and the fourth metal film 17. In other words, the third metal film 16 and the fourth metal film 17 are connected, although they are not visible from the surface, and are electrically connected. One third metal film 16 is connected to one fourth metal film 17, and the other third metal film 16 is connected to the other fourth metal film 17.

[0066] In the light-emitting module 100F according to the fourth embodiment shown in Figures 9A and 9B, a thermistor 90 is mounted on the third metal film 16. The thermistor 90 is an example of a temperature sensing element used to measure the temperature when the light-emitting module 100F is operating. The thermistor 90 is mounted connected to both of the third metal films 16, thereby allowing conductivity from one of the fourth metal films 17 through the thermistor 90 to the other fourth metal film 17. In the light-emitting module 100F, the semiconductor laser elements 22 of the two light-emitting devices 20 mounted on the first mounting substrate 10d are the main heat sources. Therefore, it is preferable that the thermistor 90 be positioned close to both of the two light-emitting devices 20 and at the same distance from the light emitted by both light-emitting devices 20. In other words, if the light emitted from the multiple semiconductor laser elements 22 mounted on the two light-emitting devices 20 is designed to pass through the vertices of the lens portions 51, then in a top view, the thermistor 90 intersects with an intermediate line that is at an equal distance from the line connecting the vertices of each lens portion 51 of one light-emitting device 20 and the line connecting the vertices of each lens portion 51 of the other light-emitting device 20.

[0067] The second mounting substrate 10e according to the fourth embodiment shown in Figures 9D and 9E is provided with a third metal film 16 and a fourth metal film 17, similar to the first mounting substrate 10d, and the thermistor 90 is mounted on the third metal film 16. Furthermore, the third metal film 16 is provided between the first metal film 12 and the second metal film 13, and the fourth metal film 17 is provided in a position sandwiched between the two second metal films 13, similar to the first mounting substrate 10d. On the other hand, since the thermistor 90 is positioned close to the emitted light from the light-emitting device 20, on the second mounting substrate 10e it is positioned close to the vertex of the lens portion 51 of the lens member 29 of the light-emitting device 20. In other words, if the light emitted from the multiple semiconductor laser elements 22 mounted on the light-emitting device 20 is designed to pass through the vertex of the lens portion 51, then in a top view, the thermistor 90 intersects with the straight line connecting the vertices of each lens portion 51. Thus, in the light-emitting module 100F according to the fourth embodiment, a metal film for mounting the thermistor 90 is provided on the mounting substrate 10, which allows the temperature when the light-emitting module 100F is operating to be measured. Therefore, the operation of the semiconductor laser element 22 can be controlled according to the measured temperature.

[0068] The light-emitting modules manufactured in this manner can be used, for example, in various projectors with different specifications. Specifically, a light-emitting module formed using one or more of either a first mounting board or a second mounting board on which a determined number, or a number and combination of, light-emitting devices are mounted is mounted on a heat sink to become a component of the projector.

[0069] Next, an example of implementation when applying the light-emitting module according to this embodiment to a projector will be described. Here, an example of an implementation board composed of one or more first implementation boards 10a will be described, but it goes without saying that the implementation is not limited to this. The implementation board can be constructed using any desired first or second implementation board described in the first to fourth embodiments. Figure 10A is a schematic perspective view showing an example of implementation when a light-emitting module according to one embodiment is applied to a projector. Figure 10B is a perspective cross-sectional view illustrating the encapsulation structure of the light-emitting module according to one embodiment. Figure 11A is a schematic perspective view showing an example of implementation when a light-emitting module according to one embodiment is applied to a projector. Figure 11B is a schematic plan view showing an example of the configuration of a projector according to the embodiment of Figure 11A. Figure 11C is a schematic side view showing an example of the configuration of a projector according to the embodiment of Figure 11A. Figure 12A is a schematic perspective view showing an example of implementation when a light-emitting module according to one embodiment is applied to a projector. Figure 12B is a schematic side view showing an example of the configuration of a projector according to the embodiment of Figure 12A. Figure 13 is a perspective cross-sectional view illustrating another encapsulation structure of the light-emitting module according to one embodiment. For convenience, these diagrams show parts of the projector's interior transparently in some cases.

[0070] As shown in Figures 10A and 10B, the projector 200 is equipped with a sealing member 60. The sealing member 60 is a component that forms a sealed space surrounding the light-emitting device 20 mounted on the mounting substrate 10 in the light-emitting module. The optical system of the projector is mounted inside this sealed space. In other words, an optical unit for generating the projected image projected by the projector is mounted inside. The optical unit includes, for example, lenses, mirrors, DMDs (Digital Mirror Devices), prisms, etc. In addition, an optical unit including a liquid crystal panel, phosphor wheel, rod integrator, etc., or an optical unit using appropriate components from these components may be configured, and an appropriate optical system is designed. The projected image generated by the optical unit is emitted from the sealing member 60 to the outside and projected onto the projector screen. To further reduce the probability of a decrease in projector output due to light dust collection, it is preferable that all the components constituting the optical unit are housed in the sealed space formed by the sealing member 60 and the mounting substrate 10. When the sealing member 60 is miniaturized, only some of the components constituting the optical unit may be housed in the sealed space.

[0071] In the projector 200, a light-emitting module is manufactured in which two light-emitting devices 20 are mounted on a single first mounting substrate 10a, and this module is covered with a sealing member 60. While the sealing member 60 is formed in a rectangular parallelepiped shape here, its shape is not particularly limited. In other words, it can have a shape corresponding to the design of the optical unit. On the first mounting substrate 10a, a sealing member 70 is provided around the light-emitting device 20, enclosing the two light-emitting devices 20. The sealing member 70 is provided between the first metal film 12 and the second metal film 13 so that the second metal film 13 is located outside the sealed space. This allows the light-emitting device 20 to be easily connected to an external power supply. The sealing member 70 is also provided inside the through-holes on both sides so that the through-holes in the first mounting substrate 10a are located outside the sealed space. This eliminates the need to consider the influence of the through-holes when forming the sealed space. The sealing member 60 is joined to the first mounting substrate 10a via the sealing member 70, forming a sealed space. This prevents objects that cause photoaccumulation, such as dust, resin outgassing, and organic components of grease, from entering the sealing member 60.

[0072] Examples of materials for the sealing member 60 include metal, glass, and sapphire. The sealing member 60 only needs to have a portion that emits light to the outside made of a light-transmitting material such as glass or sapphire. Examples of materials for the sealing member 70 include metal, resin, and rubber. Alternatively, the sealing member 70 may be made of a material that deforms easily when pressed, such as sponge or clay. When using metal for the sealing member 70, it is preferable to leave a sufficient gap to avoid contact between the sealing member 70 and the first metal film 12, which is located on the side furthest from the second metal film 13. This prevents short circuits caused by the sealing member 70. If an insulating material is used, the sealing member 70 will not conduct electricity even if it comes into contact with the first metal film 12 or the second metal film 13.

[0073] The projector 200A shown in Figures 11A, 11B, and 11C is equipped with a sealing member 60A. In projector 200A, a light-emitting module is manufactured in which four light-emitting devices 20 are mounted on two first mounting substrates 10a and covered with a sealing member 60A. The sealing member 70 is formed so as to surround two light-emitting devices 20 for each first mounting substrate 10a. The sealing member 60A has a convex first pressing portion 63 that straddles the boundary between the first mounting substrates 10a and the first mounting substrates 10a. The first pressing portion 63 presses down on the sealing member 70 provided along the boundary on each of the first mounting substrates 10a and also closes the boundary between the two first mounting substrates 10a. Note that if the two first mounting substrates 10a are joined at the boundary, the first pressing portion 63 may not be necessary. For example, since each mounting substrate has material tolerances, it is possible to arrange the two first mounting substrates 10a side by side with a gap between them so that they do not touch, rather than joining the two first mounting substrates 10a to form the mounting substrate 10. Note that if the first mounting substrates 10a are too far apart, the size of the light-emitting module or projector will increase, so if miniaturization is desired, the gap should be reduced. For example, a gap of 0.1 mm to 1.0 mm is suitable between the two mounting substrates. Alternatively, it can be said that the distance from one mounting board to the other mounting board should be between 0.1 mm and 1.0 mm. When mounting with such a gap, the first retaining portion 63 can be provided to prevent outside air from entering from the boundary and ensure airtightness. Note that the light-emitting modules shown in Figures 10A and 11A are examples, and any light-emitting module manufactured using the manufacturing method described above can be applied. In other words, a light-emitting module can be applied in which one or two mounting boards are arbitrarily selected from the first mounting board 10a and the second mounting board 10b to form the mounting board 10. Furthermore, any number of light-emitting modules mounted on the mounting board 10 from the first light-emitting device 20a and the second light-emitting device 20b can be applied.

[0074] Furthermore, it is possible to apply not just one light-emitting module, but multiple light-emitting modules. The projector 200B shown in Figures 12A and 12B is equipped with a sealing member 60B. In projector 200B, two light-emitting modules are manufactured, each with two light-emitting devices 20 mounted on two first mounting substrates 10a, and two more light-emitting modules are arranged side by side. Therefore, a total of eight light-emitting devices 20 are covered by the sealing member 60B. In addition, the sealing member 70 is formed for each first mounting substrate 10a. In projector 200B, two mounting boards 10 are arranged side by side so that their through-holes are adjacent to each other. The sealing member 60B has a first pressing portion 63, as well as a convex second pressing portion 64 that spans the through holes of the two mounting substrates 10. The second pressing portion 64 presses down on the sealing members 70 provided on the two mounting substrates 10, forming a sealed space. Each mounting substrate 10 is fixed by fastening screws 80 for fixing the mounting substrate 10 to the heat sink, which are passed through the through holes. By providing the second pressing portion 64, it is possible to prevent outside air from entering through the through holes and ensure airtightness.

[0075] Figure 13 also shows another example of a sealing structure using a sealing member and a sealing member. Thus, the sealing member 60C may have projections 65 that join with the sealing member 70 on its side and bottom surface. The projections 65 cover the side of the sealing member 70 that faces the light-emitting device 20. The presence of projections 65 in the sealing member 60C creates a claw-like structure at the joint with the sealing member 70. With such a structure, the adhesion between the sealing member 60C and the sealing member 70 is further improved, and the sealing performance of the sealing member 60C is enhanced. [Explanation of Symbols]

[0076] 10, 10A, 10B, 10C mounted circuit board 10a, 10c, 10d First mounting board 10b, 10e Second mounting board 11 Metal parts 12 First metal film 13 Second metal film 14. Insulating film 15 connection patterns 16 Third metal film 17 Fourth metal film 20 Light-emitting device 21 packages 22. Light-emitting element (semiconductor laser element) 23 Submount 24 Light-reflecting member 25 Protective elements 26 wires 27 Lid component 28 Adhesive part 29 Lens components 30 recesses 31 Bottom surface of the recess 32 Inner surface of the recess 33 Stepped section 34 Bottom side 35 Frame section 36 Bottom 37 Metal film 38 Metal film 51 Lens section 52 Support plate part 60, 60A, 60B, 60C sealing components 63 First Pressing Section 64 Second Pressing Section 65 Protrusion 70 Sealing material 80 Fixing screws 90 Thermistor 100, 100A, 100B, 100C, 100D, 100E, 100F Light Modules Ru 200, 200A, 200B Projectors

Claims

[Claim 1] Two light-emitting devices comprising: a package; a plurality of semiconductor laser elements mounted on the package; and one or more light-reflecting members mounted on the package that reflect laser light emitted from the plurality of semiconductor laser elements; The mounting substrate has a mounting surface on which the two light-emitting devices are mounted, The two light-emitting devices are light-emitting modules mounted on the mounting surface of the mounting substrate in orientations that are 180 degrees different from each other.

Images