electronic machinery

Abstract

We provide highly convenient electronic devices that are worn on the body. [Solution] An arm-mounted electronic device having a display panel, a power storage device, a circuit, and a encapsulant. The display panel uses power supplied from the energy storage device to display information. The circuit uses an antenna. It has a wireless charger for the power storage device. The encapsulant contains a display panel, a power storage device, and a circuit inside. The seal has a portion that transmits visible light. Is the seal wearable on the arm? It is connected to a structure that can be worn on the arm.

Description

[Technical Field]

[0001] One aspect of the present invention relates to electronic devices. One aspect of the present invention relates particularly to wearable electronic devices. For example, regarding arm-worn electronic devices.

[0002] Furthermore, one aspect of the present invention is not limited to the above-mentioned technical field. For example, semiconductor devices, display devices, light-emitting devices, energy storage devices, memory devices, electronic devices, lighting devices, Input devices (e.g., touch sensors), input / output devices (e.g., touch panels), and Examples of these driving methods, or methods for manufacturing them, can be given.

[0003] In this specification, etc., "electronic equipment" refers to all devices that operate by being supplied with electricity. Electro-optical devices and information terminals that have a power source (e.g., an energy storage device) are all electronic devices.

[0004] In this specification, the term "energy storage device" refers to all elements and devices having an energy storage function, and lithium Rechargeable batteries such as lithium-ion secondary batteries (also called secondary batteries), lithium-ion capacitors, and Electric double-layer capacitors and similar devices are all energy storage devices. [Background technology]

[0005] In recent years, display devices and electronic devices that are worn on the human body have been proposed, and wearable displays have been developed. These are also called wearable devices. For example, head-mounted devices that are worn on the head. Development is underway on displays and smartwatches that are worn on the wrist.

[0006] Patent Document 1 discloses a ring-shaped display device that can be worn on the human body.

[0007] Wearable devices are worn on the human body, and therefore require high portability and comfortable wear. To achieve this, weight reduction of the entire device, including the display panel, drive circuit, and power supply, is required. It can be seen.

[0008] Wearable devices often have built-in energy storage devices. For example, lithium-ion batteries. Because secondary batteries offer the potential for increased capacity and miniaturization, development is progressing rapidly.

[0009] Also, electroluminescence (EL) The light-emitting element (also known as an EL element) used is easily made thin, lightweight, and flexible. Features include the ability to respond quickly to input signals and the ability to be driven using a DC low-voltage power supply. It possesses certain characteristics and is one of the display elements suitable for wearable displays. [Prior art documents] [Patent Documents]

[0010] [Patent Document 1] U.S. Patent Application Publication No. 2015 / 0077438 [Overview of the Initiative] [Problems that the invention aims to solve]

[0011] Swimming, scuba diving and other water sports (including marine sports), or There is a need for wearable devices that can be used while bathing.

[0012] Furthermore, since wearable devices are used in a variety of environments, a wide temperature range is required for their use. Display panels and energy storage devices are required. For example, on the dashboard or near a window in a car. Places exposed to direct sunlight, inside a car parked in the blazing sun, high-temperature environments such as deserts, or ice In cold environments such as those near rivers, electronic devices may malfunction. ru.

[0013] One aspect of the present invention aims to provide electronic equipment usable underwater. One aspect of the present invention aims to provide a highly waterproof electronic device. Or, One aspect of the present invention aims to provide an electronic device that is worn on the body. Alternatively, one aspect of the present invention aims to provide an all-weather electronic device. One aspect of the present invention aims to provide a highly convenient electronic device. Or, One aspect of the present invention aims to provide highly reliable electronic equipment. One aspect of the invention aims to provide an electronic device that is highly visible regardless of ambient brightness. Let it be one.

[0014] Alternatively, one aspect of the present invention aims to provide an electronic device with a wide operating temperature range. One aspect of the present invention is a small, lightweight, or flexible electric One objective is to provide a sub-device. Alternatively, one aspect of the present invention provides a highly safe electronic device. One objective of the present invention is to provide an electronic device with low power consumption. Alternatively, one aspect of the present invention is to provide an electronic device with low power consumption. One objective of the present invention is to provide a device that can be used for a long time on a single charge. One objective is to provide an electronic device that can be used for a certain amount of time. Or, one aspect of the present invention One of its objectives is to provide novel electronic devices.

[0015] Furthermore, the description of these problems does not preclude the existence of other problems. The embodiments do not need to solve all of these problems. It is possible to extract other issues from the description of the requested terms. [Means for solving the problem]

[0016] One aspect of the present invention is an electronic device having a display panel, an energy storage device, a circuit, and a encapsulant. The display panel has light-emitting elements. The light-emitting elements use power supplied from the energy storage device to generate electricity. It has a light-emitting function. The circuit has an antenna. The circuit is a device that wirelessly charges a power storage device. It has the ability. The encapsulant has a display panel, a power storage device, and a circuit inside. At the very least, it has the function of transmitting light emitted by the light-emitting element. The sealant can be worn on the arm. That is the case.

[0017] The above electronic devices, when the user attaches the sealing device to their arm, include a power storage device, an antenna, and The display panels may also be stacked in this order.

[0018] Alternatively, one aspect of the present invention comprises a display panel, an energy storage device, a circuit, a encapsulant, and a structure. It is an electronic device. The display panel has light-emitting elements. The light-emitting elements are supplied from a power storage device. It has the function of emitting light using electricity. The circuit has an antenna. The circuit stores power wirelessly. It has a function to charge the device. The encapsulant is connected to the structure. The encapsulant has a display inside. It comprises a panel, an energy storage device, and a circuit. At least a portion of the encapsulant is light emitted by the light-emitting element. It has the ability to transmit light. The structure can be worn on the arm.

[0019] The above electronic devices, when worn on the arm by the user, include a power storage device, an antenna, and The display panels may also be stacked in this order.

[0020] Alternatively, one aspect of the present invention relates to an electronic device having a display panel, a power storage device, a circuit, and a encapsulant. The display panel has the function of displaying information using power supplied from the energy storage device. The circuit has an antenna. The circuit has the function of wirelessly charging the energy storage device. The encapsulant It has a display panel, a power storage device, and circuits inside. At least a portion of the encapsulation is visible It has the function of transmitting light. The display panel has a first display element and a second display element. The first display element has a reflective layer that has the function of reflecting light. It has a function to control the transmission of light. The reflective layer has an opening. The second display element has an opening. It has an overlapping portion. The second display element has the function of emitting light toward the aperture. The opening preferably has an area of ​​5% to 20% of the area of ​​the reflective layer.

[0021] In the above-mentioned electronic device, the display panel further comprises signal lines, pixel circuits, a first conductive layer, and It is preferable to have two conductive layers and an insulating layer. The second display element is electrically connected to the pixel circuit. The first display element is electrically connected to the first conductive layer. , has a portion that overlaps with the second conductive layer via an insulating layer. The first conductive layer has a portion that overlaps with the second conductive layer The second conductive layer is electrically connected to the pixel circuit. It is electrically connected to the railway line.

[0022] Alternatively, one aspect of the present invention relates to an electronic device having a display panel, a power storage device, a circuit, and a encapsulant. The display panel has the function of displaying information using power supplied from the energy storage device. The circuit has an antenna. The circuit has the function of wirelessly charging the energy storage device. The encapsulant It has a display panel, a power storage device, and circuits inside. At least a portion of the encapsulation is visible It has the function of transmitting light. The display panel has liquid crystal elements and light-emitting elements. The liquid crystal elements are It has a liquid crystal layer, a first conductive layer, and a second conductive layer. The first conductive layer is a liquid crystal layer that reflects light. It has the ability. The first conductive layer has an opening. The light-emitting element has a layer containing a light-emitting material, the It has three conductive layers and a fourth conductive layer. The light-emitting element has a portion that overlaps with the opening. The optical element has the function of emitting light toward the aperture. The aperture is the area of ​​the first conductive layer It is preferable that the area be between 5% and 20%.

[0023] In the above-mentioned electronic device, the display panel further comprises signal lines, pixel circuits, a fifth conductive layer, and It is preferable to have a conductive layer and an insulating layer. The light-emitting element is electrically connected to the pixel circuit. The liquid crystal element is electrically connected to the fifth conductive layer. The fifth conductive layer is connected via an insulating layer. The fifth conductive layer has a portion that overlaps with the sixth conductive layer. The fifth conductive layer is electrically connected to the sixth conductive layer. The sixth conductive layer is electrically connected to the pixel circuit. The pixel circuit is electrically connected to the signal lines. It connects to the network.

[0024] In the electronic device with each of the above configurations, it is preferable that the seal is wearable on the arm. When the sealing body is attached to the arm, the electronic device according to one aspect of the present invention includes, from the arm side, a power storage device, an antenna The components and the display panel may be stacked in this order.

[0025] Alternatively, it is preferable that the electronic device having each of the above configurations has a structure. The encapsulant is structure It connects to the body. The structure can be attached to the arm. When the user attaches the structure to their arm, An electronic device according to one aspect of the present invention comprises, from the arm side, a power storage device, an antenna, and a display panel in this order. They may be stacked and held together.

[0026] Furthermore, in each of the above configurations, the voice input unit, touch sensor, illuminance sensor, or arm-mounted unit It may have one or more of the following components: an audio input unit or a touch sensor. These can be placed inside or outside the seal. (Audio input unit, touch sensor, and lighting) The degree sensors are preferably placed inside the encapsulation. The sensor and the illuminance sensor are connected to a display panel, a power storage device, or a circuit, respectively. It may have one. Or, the display panel may have a touch sensor. The component is connected to the sealant or structure.

[0027] Furthermore, in each of the above configurations, the display panel is a curved surface with a radius of curvature of 1 mm or more and 150 mm or less. It may also have the following: In addition, in each of the above configurations, the display panel has a radius of curvature of 150 mm It may have a larger curved surface. For example, the display panel may have a radius of curvature greater than 150 mm. It may have a curved surface with a radius of curvature of less than 1m, or a curved surface with a radius of curvature of 1m or more and 10m or less. The curved surface of the display panel is either a concave surface, a convex surface, or both a concave and a convex surface. Either is acceptable. In addition, in each of the above configurations, the display panel has a flexible portion. It may have.

[0028] Furthermore, in each of the above configurations, the energy storage device has a curved surface with a radius of curvature of 10 mm or more and 150 mm or less. It may also have a flexible part. It's okay to do so.

[0029] Furthermore, in each of the above configurations, it is preferable that the inside of the seal is in a reduced-pressure atmosphere. In each of the above configurations, it is preferable to have a buoyancy material inside the sealing body. [Effects of the Invention]

[0030] According to one aspect of the present invention, an electronic device usable underwater can be provided. Or, an aspect of the present invention Depending on the method, a highly waterproof electronic device can be provided. Alternatively, according to one aspect of the present invention, it can be attached to the body. We can provide electronic devices that are worn and used. Or, according to one aspect of the present invention, an all-weather electronic device. We can provide equipment. Or, according to one aspect of the present invention, we can provide a highly convenient electronic device. Alternatively, according to one aspect of the present invention, a highly reliable electronic device can be provided. In one embodiment, it is possible to provide electronic devices that are highly visible regardless of ambient brightness.

[0031] Alternatively, according to one aspect of the present invention, an electronic device with a wide operating temperature range can be provided. According to one aspect of the present invention, a small, lightweight, or flexible electronic device is provided. It can be provided. Or, according to one aspect of the present invention, a highly heat-resistant electronic device can be provided. Or According to one aspect of the present invention, a highly safe electronic device can be provided. Or, according to one aspect of the present invention This makes it possible to provide electronic devices with low power consumption. Alternatively, according to one aspect of the present invention, once By charging, an electronic device that can be used for a long time can be provided. Or, according to one aspect of the present invention This allows us to provide new electronic devices.

[0032] Furthermore, the description of these effects does not preclude the existence of other effects. The embodiment does not necessarily have to have all of these effects. It is possible to extract other effects from the descriptions in the section. [Brief explanation of the drawing]

[0033] [Figure 1] A diagram showing an example of an electronic device. [Figure 2] A diagram showing an example of an electronic device. [Figure 3] A diagram showing an example of an electronic device. [Figure 4] A diagram showing an example of an electronic device. [Figure 5] A diagram showing an example of an electronic device. [Figure 6] A diagram showing an example of components of an electronic device. [Figure 7] A diagram showing an example of components of an electronic device. [Figure 8] A diagram showing an example of components of an electronic device. [Figure 9] A diagram showing an example of an electronic device. [Figure 10] A diagram showing an example of an electronic device. [Figure 11] A diagram showing an example of how electronic devices are installed. [Figure 12] A diagram showing an example of an energy storage device and an example of electrodes. [Figure 13] A diagram showing an example of an energy storage device. [Figure 14] A diagram showing an example of an energy storage device. [Figure 15] A diagram showing an example of an energy storage device. [Figure 16] A diagram showing an example of an energy storage device. [Figure 17] A diagram showing an example of an energy storage device. [Figure 18] A diagram showing an example of an energy storage device. [Figure 19] A diagram showing an example of a method for manufacturing an energy storage device. [Figure 20] A diagram showing an example of an energy storage device. [Figure 21] A diagram showing an example of an energy storage device. [Figure 22] A diagram showing an example of a method for manufacturing an energy storage device. [Figure 23] A diagram showing an example of an energy storage device. [Figure 24] A diagram showing an example of a light-emitting device. [Figure 25] A diagram showing an example of a light-emitting device. [Figure 26] A diagram showing an example of a light-emitting device. [Figure 27] A diagram showing an example of a light-emitting device. [Figure 28] A diagram showing an example of an input / output device. [Figure 29] A diagram showing an example of an input / output device. [Figure 30] A diagram showing an example of an input / output device. [Figure 31] A diagram showing an example of an input / output device. [Figure 32] A diagram showing an example of components of an electronic device. [Figure 33] A diagram showing an example of components of an electronic device. [Figure 34] A diagram showing an example of a transistor. [Figure 35] A diagram showing an example of an electronic device. [Figure 36] A diagram showing an example of an electronic device. [Figure 37] A diagram showing an example of an electronic device. [Figure 38] A diagram showing an example of an electronic device. [Figure 39] A diagram showing an example of an electronic device. [Figure 40] A diagram showing an example of components of an electronic device. [Figure 41] A diagram showing an example of a pixel circuit in a display device. [Figure 42] A diagram showing an example of a display device. [Figure 43] A diagram showing an example of a display device. [Figure 44] A diagram showing an example of a display device. [Figure 45] A diagram showing an example of components of an electronic device. [Modes for carrying out the invention]

[0034] Embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description. Without departing from the spirit and scope of the present invention, its form and details may be modified in various ways. It will be easily understood by those skilled in the art to obtain this. Therefore, the present invention is as shown in the embodiments below. The interpretation is not limited to the content stated herein.

[0035] In the configuration of the invention described below, the same part or part having a similar function is used. The same symbol is used consistently across different drawings, and explanations of its repetition are omitted. When referring to a function, the same hatch pattern may be used, and a specific symbol may not be assigned.

[0036] Furthermore, the position, size, and extent of each component shown in the drawings are, for the sake of ease of understanding, actually The location, size, and range may not be described. Therefore, the disclosed invention is not always Furthermore, it is not limited to the location, size, scope, etc., disclosed in the drawings.

[0037] Furthermore, the words "membrane" and "layer" may differ depending on the context or situation. And they can be interchanged. For example, the term "conductive layer" can be replaced with "conductive film." It is possible to change the term to this. Or, for example, the term "insulating film" can be changed to It is possible to change the term to "insulating layer".

[0038] (Embodiment 1) In this embodiment, an electronic device according to one aspect of the present invention will be described with reference to Figures 1 to 11.

[0039] In this embodiment, the explanation will mainly be given using wrist-worn electronic devices and wristwatch-type electronic devices as examples. However, the method of using the electronic device according to one aspect of the present invention is not particularly limited. For example, without attaching anything It can be used on the arms, or it can be worn on other parts of the body (such as the waist or legs).

[0040] One aspect of the present invention is an electronic device having a display panel, an energy storage device, a circuit, and a encapsulant. The display panel has light-emitting elements. The light-emitting elements use power supplied from the energy storage device to generate electricity. It has a light-emitting function. The circuit has an antenna and a function to wirelessly charge the energy storage device. The encapsulant has a display panel, a power storage device, and a circuit inside. In part, both have the function of transmitting light emitted by the light-emitting element. In one embodiment of the present invention, The sealing body may be attachable to the arm, or a structure connected to the sealing body may be attachable to the arm. That's fine.

[0041] By using a sealing material, the sealed components such as the display panel, energy storage device, and circuits are protected. This allows for the creation of robust electronic devices. Furthermore, by using a highly waterproof seal, protection It is possible to create electronic devices with high water resistance that can be used underwater.

[0042] In this specification, etc., among the components of an electronic device according to one aspect of the present invention, the inside of the sealant Components located in a specific position and sealed by an encapsulating body are collectively referred to as the "encapsulated body."

[0043] In the manufacture of an electronic device according to one aspect of the present invention, the display panel and the energy storage device are collectively enclosed by a encapsulant. It can be covered and sealed. Therefore, it is possible to easily manufacture reliable electronic devices. This can be done. And by making the sealing body into a shape that is easy to attach to the human body, such as a strip, the sealing body It can be attached to the human body and used as a wearable device.

[0044] An electronic device according to one aspect of the present invention can charge a power storage device using contactless power transmission. Therefore, there is no need to remove the energy storage device from the encapsulation during charging. The entire seal can be completely covered with the seal, further enhancing the waterproofing of electronic devices. ru.

[0045] In one embodiment of the present invention, even if one or more components of the sealed body are flexible, That's fine. For example, the display panel or the energy storage device may be flexible, or the display panel Both the energy storage device and the energy storage device may be flexible.

[0046] Since the sealing body is flexible, at least one of the display panel and the energy storage device is flexible. If present, these can be protected without impairing their flexibility. As described above, by applying one aspect of the present invention, a highly reliable, safe, and flexible electric device can be constructed. Sub-devices can be realized. If the electronic device is flexible, it can be easily attached and detached. This is desirable because it provides the user with a comfortable fit and other benefits.

[0047] In the electronic device of this embodiment, the entire object to be sealed is covered with a flexible sealant. It is possible to cover the sealed object with a flexible sealant so that it can be repeatedly bent and stretched. This makes it possible to create electronic devices that are less likely to be damaged even when exposed to strong currents.

[0048] Furthermore, by using a highly heat-resistant encapsulant, the display panel can be driven even at high temperatures. It can also bend electronic devices reversibly even at high temperatures. In this case, heat resistance It is even preferable to use high-performance light-emitting elements and energy storage devices.

[0049] Next, the electronic device of this embodiment will be described in detail.

[0050] Figure 1(A) shows a perspective view of the electronic device 100. Figure 1(B) shows the electronic device 100. A top view is shown, and a cross-sectional view between the dashed line A and B in Figure 1(B) is shown in Figure 1(C), one point Figure 1(F) shows a cross-sectional view between the dashed lines C and D.

[0051] The electronic device 100 includes a display panel 10, a power storage device 20, a circuit 30, and a encapsulant 40. In Figure 1(A), etc., the portion of the display panel 10 that can be seen by the user is shown on the electronic device 10. This is indicated as the display unit 15 for 0.

[0052] <Display section 15> The electronic device 100 has a display unit 15. In Figure 1(A), the display unit 15 has a curved surface. In this embodiment, an example is shown in which the display panel 10 has a light-emitting element. In Figure 1(C), etc., the direction in which the light emitted from the light-emitting element is extracted is indicated by an arrow.

[0053] The display unit 15 may be flexible. That is, the display unit 15 can be deformed. The curvature of can be changed from the state shown in Figure 1(A). Also, the state shown in Figure 1(A) The display unit 15 is deformed from a state having a curved surface to a flat state as shown in Figure 1(B). It may be possible. Furthermore, the flexible display section 15 does not need to be deformed to a flat state. good.

[0054] Furthermore, the display unit 15 does not need to be flexible. A non-flexible display unit 15 is flat. It may be a curved surface, or it may have a curved surface.

[0055] If the flexibility of the display panel is lower than the flexibility of the sealing body, then the electronic device according to one embodiment of the present invention When worn on the arm or other body part, the radius of curvature of the display unit 15 hardly changes, and the end of the electronic device... It is preferable to have a flexible shape.

[0056] <Sealing body 40> The electronic device 100 has a sealing body 40. In Figure 1(A), the sealing body 40 has a curved surface. do.

[0057] The sealing body 40 has a band-shaped portion that can be worn on the arm. The band-shaped portion is the electronic device 100 It can function as a band.

[0058] The sealing body 40 is flexible. That is, the curvature of the sealing body 40 can be changed by deforming the sealing body 40. The state shown in 1(A) can be changed. The curvature of the sealant 40 is as shown in Figure 1(A). It can be made larger than the state, or smaller, or both are possible. Furthermore, the state changes from having a curved surface as shown in Figure 1(A) to a flat state as shown in Figure 1(B). The sealing body 40 may be deformed. The flexible sealing body 40 may be in a flat state. It doesn't need to be able to deform to that extent.

[0059] The sealing body 40 preferably has a film. The film has surface protection properties and shape retention properties. The film has one or more properties selected from properties, optical properties, and gas barrier properties. , having either an inorganic film or an organic film or both. The sealant 40 may have a single-layer structure, or it may be laminated. The structure is also acceptable.

[0060] The encapsulated body 40 contains a display panel 10, a power storage device 20, a circuit 30, etc., as the encapsulated components inside. The sealed object is sealed by the sealant 40 and isolated from the outside atmosphere of the electronic device 100. ru.

[0061] For example, placing the object to be sealed between two folded films, or between a pair of films. The object to be sealed is placed on top, and one or a pair of films are laminated (e.g., pouch lamination). The object to be sealed may be sealed by doing the following.

[0062] Alternatively, one or a pair of films can be bonded together using an adhesive to seal the object to be sealed. These are also good options. As adhesives, there are photocuring adhesives such as UV-curing adhesives, reaction-curing adhesives, and thermocuring adhesives. Various types of curing adhesives, such as mold adhesives and anaerobic adhesives, can be used. Epoxy resin, acrylic resin, silicone resin, phenolic resin, polyimide resin , imide resin, PVC (polyvinyl chloride) resin, PVB (polyvinyl butyral) resin Examples include lipids, EVA (ethylene vinyl acetate) resin, etc. In particular, epoxy resin, etc. Materials with low moisture permeability are preferred. Alternatively, a two-component resin may be used.

[0063] Furthermore, if irregularities following the shape of the sealed object occur on the surface of the electronic device 100, the visibility of the display will be reduced. This may occur. Therefore, the sealed object is placed in a case such as a plastic case, and the case Sealing it with the sealant 40 makes the surface of the electronic device 100 flat, which is preferable.

[0064] By using a film for the sealant 40, the flexibility of the sealant 40 can be increased.

[0065] The material of the sealing body 40 is not particularly limited, as long as it is a material that can withstand the temperature of the operating environment. The stopper 40 can be made from various materials such as glass, organic resin, rubber, plastic, or metal. It can be formed.

[0066] For example, the sealing body 40 is made of polyethylene tereum, which has flexibility and transparency to visible light. Polyester resins such as phthalate (PET) and polyethylene naphthalate (PEN), Riacrylonitrile resin, polyimide resin, polymethyl methacrylate resin, polycarbonate Polyphosphate (PC) resin, polyethersulfone (PES) resin, polyamide resin, cyclophosphate Refin resin, polystyrene resin, polyamide-imide resin, polyvinyl chloride resin, aramic resin Resin can be used.

[0067] The sealant 40 preferably has high water resistance. Specifically, the sealant 40 should contain a material with high water resistance. It is preferable to use a material or to apply a waterproof coating to the surface of the sealant 40. This allows the display to The flannel 10 and other materials prevent moisture from entering the electronic device 100 from the outside, and the electronic device 100 Reliability can be improved. Also, by improving the waterproofness of the sealant 40, the electronic device 10 The value 0 can be used underwater.

[0068] The sealing body 40 can transmit visible light at least in the display section 15. Furthermore, the display on the display panel 10 can be viewed through the sealing body 40. The energy storage device 20 and the circuit 30 may be visible.

[0069] In one aspect of the present invention, the sealant 40 does not need to transmit visible light except for the display portion 15. i. For example, the parts other than the display unit 15 are configured to block visible light, and the user is provided with a power storage device 20 and At least one of the circuits 30 may be made invisible.

[0070] In the electronic device 100, a display panel 10, a power storage device 20, and a circuit 30 are stacked. The stacking order of these panels is not particularly limited, as long as the user can see the display on the display panel 10. Furthermore, these do not necessarily have to be stacked; the display panel 10 and the energy storage device 2 may be placed on the same plane. Two or more of either circuit 0 and circuit 30 may be present.

[0071] For example, as shown in Figure 1(F), the electronic device 100 has a circuit 30 on the energy storage device 20. The circuit 30 may also have a display panel 10. When the seal 40 is attached to the arm, the arm The configuration is such that the energy storage device 20, the circuit 30, and the display panel 10 are stacked in order from the side closest to the front. Then, the user can see the display on the display panel 10. Alternatively, starting from the arm closest to the user, rotate The circuit 30, the energy storage device 20, and the display panel 10 may be stacked in that order.

[0072] The space sealed by the sealant 40 is preferably in a reduced-pressure atmosphere or an inert atmosphere. i. By creating these atmospheres, the display panel This can improve the reliability of the 10th place ranking.

[0073] Figures 1(D) and (E) show the dashed lines in Figure 1(B), which are different from those in Figure 1(C), respectively. This is a cross-sectional view between A and B. Also, Figure 1(G) is different from Figure 1(F), and is similar to Figure 1(B). This is a cross-sectional view between the dashed lines C and D.

[0074] In Figures 1(C) and 1(F), the sealant 40 on the front (display side) of the electronic device 100 is the sealed body Figure 1 shows, but is not limited to, an example where the sides are covered and the back surface of the electronic device 100 is flat. As shown in (D) and (G), the sealing body 40 on the front (display side) and the sealing body on the back side of the electronic device 100 Both sides of the stopper 40 cover the sides of the sealed object, and the electronic device 100 is not covered by other parts (ba It may have a portion that protrudes from the end portion, etc. Also, as shown in Figure 1(E), The sealant 40 on the back of the electronic device 100 covers the side of the sealed object, and the front of the electronic device 100 (front The surface on the indicator side may be flat. Also, as shown in Figure 1(C), the electronic device 100 The portion including the display unit 15 may protrude more than other parts (such as the band portion). As shown in 1(E), the back side of the electronic device 100 protrudes more than other parts (such as the band). It may have a part that is doing so.

[0075] Figures 2 to 5 show electronic devices different from electronic device 100.

[0076] Figure 2(A) shows a perspective view of the electronic device 100a. Figure 3(A) also shows a perspective view of the electronic device 100a. Figure 3(A) shows a top view, and Figure 3(B) shows a cross-sectional view between the dashed lines EF in Figure 3(A), Figure 3(F) shows a cross-sectional view between the dotted lines GH.

[0077] The electronic device 100a has a display unit 15. The electronic device 100a also has a sealing body 40. The electronic device 100a also includes a display panel 10 and a power storage device 20 inside the encapsulation body 40. It also has a circuit 30.

[0078] In the electronic device 100a, the display panel 10 overlaps with the energy storage device 20, and the circuit 30 overlaps with the energy storage device 2 It overlaps with 0, and the display panel 10 and the circuit 30 do not overlap. In this way, the encapsulant 40 The part that functions as a band may also contain the material to be sealed. For example, a flexible material When using the energy storage device 20, the energy storage device 20 is placed in a wide area inside the sealing body 40. This makes it possible to create electronic devices that can be used for extended periods on a single charge.

[0079] The sealing body 40 may contain a buoyancy material inside. Examples of buoyancy materials include solid buoyancy. A material or a gas-filled buoyancy material can be used. As the buoyancy material, polymer materials (such as resins) can be used. It may also contain gas (such as carbon dioxide). As a buoyancy material, polyethylene, polyp Polypropylene or foamed resin made from foamed polystyrene may also be used.

[0080] By using a buoyancy material, an electronic device according to one aspect of the present invention can be made to float easily in water, thereby enabling the electronic device to float in water. This makes it easier to find lost devices.

[0081] Furthermore, the sealing body 40 may have a rubber-elastic member inside. The material is such that the internal stress generated during deformation is easily dispersed. Therefore, in one embodiment of the present invention, the electronic device To alleviate the localized stress on the bent portion when the device is bent, thereby preventing damage to the electronic device. It can do that. Furthermore, it can function as a cushioning material to disperse physical pressure or impact from the outside. .

[0082] Rubber elasticity refers to the ability of a material to absorb energy when an external force is applied and to return to its original shape. This refers to the elasticity that can be stored as ghee. A component with rubber elasticity can undergo reversible changes. It is possible to create a shape.

[0083] Figures 3(C) to 3(E) are different from Figure 3(B) in that they show the dashed line in Figure 3(A). This is a cross-sectional view between E and F.

[0084] For example, in the space 42 shown in Figures 3(B), (C), (D), and (F), a buoyancy material or rubber elasticity is used. It is preferable to have a component that possesses such a component.

[0085] As shown in Figure 3(B), the display panel 10 and the energy storage device 20, or the circuit 30 and the energy storage device 20 They may be in contact with each other. Also, as shown in Figure 3(C), the display panel 10 and the power storage device The device 20 does not need to be in contact. Similarly, the circuit 30 and the energy storage device 20 do not need to be in contact. Furthermore, the display panel 10, the energy storage device 20, and the circuit 30 are each in contact with the sealing body 40. It may also be done in this way. Figures 3(B) and (C) show an example in which the energy storage device 20 and the sealing body 40 are in contact. Figure 3(C) shows an example where the display panel 10 and the sealing body 40 are in contact. Also, Figure 3( As shown in D), the sealant 40 and the object to be sealed do not need to be in contact. Note that the display panel 1 Two or more of the 0, energy storage device 20, circuit 30, and sealing body 40 have parts that are in contact with each other. If present, they may be fixed with adhesive or the like, or they may be in contact in a way that allows for relative movement. good.

[0086] Furthermore, as shown in Figure 3(E), the inside of the sealant 40 may be sufficiently depressurized. As a result, the display panel 10, the energy storage device 20, and the circuit 30, etc., may deteriorate due to impurities, etc. This can suppress [the effects of the device]. Furthermore, it can enable the thinning and weight reduction of electronic devices.

[0087] In Figures 3(B) and 3(F), the sealing body 40 on the front (display side) of the electronic device 100a is the sealed body This example shows, but is not limited to, a case where the sides are covered and the back surface of the electronic device 100a is flat. As shown in Figure 3(D), the sealing body 40 on the front (display side) and the sealing body on the back side of the electronic device 100a Both sides of the body 40 cover the sides of the sealed object, and the electronic device 100a is on both the front and back sides of the other parts (ba It may have a portion that protrudes more than the end portion, etc.

[0088] Furthermore, the display panel 10, energy storage device 20, and circuit 30 of the electronic device according to one aspect of the present invention The number of each is not limited to one, but may be two or more, independently of each. The number of display units 15 in one embodiment of the electronic device is not limited to one, but may be two or more. stomach.

[0089] Figure 2(B) shows a display unit having three display units (display unit 15a, display unit 15b, and display unit 15c). A perspective view of the electronic device 100b is shown.

[0090] The three display units of the electronic device 100b are connected by a single display panel 10 having three display units. It may be configured as follows, or by three display panels 10, each having one display unit. It may be composed of such things.

[0091] When an electronic device has multiple display units, the diversity of the display can be increased. Each section may be used as an independent display unit and may display different images. The same image may be displayed on multiple display units. Alternatively, a single image may be displayed across two or more display units. good.

[0092] An electronic device according to one aspect of the present invention also includes the user's line of sight, the vertical direction of the electronic device, or the rotational angle. It is preferable to provide sensors that detect direction, etc. For example, a gyro sensor, image sensor A sensor or similar device can be used. This allows the display to be oriented in a way that is easy for the user to see. Alternatively, the information can be displayed on a display unit that is easy for the user to see. By turning off the display unit that is difficult to see, power consumption can be reduced. The user may operate the electronic device to select the display unit to be used or the content of the display unit.

[0093] The electronic device 100c shown in Figure 2(C) has a larger display unit 15 than the electronic device 100a. ru.

[0094] Even in the case of electronic devices with large displays, if the above-mentioned sensors are used, or if the user By operating electronic devices, the display is shown only in the parts that are easy for the user to see, and other By turning off this part, power consumption can be reduced.

[0095] An electronic device according to one aspect of the present invention may be configured to be worn on the arm, or the sealing body may be in contact with The connected structure may be configured to be worn on the arm. The structure may be a band (string, wire). Examples include wires, nets, belts, etc., or springs. Methods of attachment include electronic devices. Methods of wearing the device directly against the skin, methods of wearing the electronic device on the arm over clothing, and methods of overlapping the arm with clothing One method involves sewing electronic devices into the part that overlaps with the sleeve of the garment using a sewing process, and the other involves using Velcro on the part that overlaps with the sleeve of the garment. Methods such as attaching electronic devices using surface fasteners, exemplified by the registered trademark ☐. There is.

[0096] The sealing body is made by combining a film and a strip-shaped leaf spring made of a convex material (such as stainless steel). It may also be a combined structure. Alternatively, as a structural element, a convex member (stainless steel) may be used. A strip-shaped leaf spring made of (or) may be used. This allows for instantaneous attachment of electronic devices, It can be removed. In this case, the electronic device is fixed in close contact with the skin, or the clothing can be removed. The electronic device is secured to the arm by being placed between the device and the band. The length of the band can be adjusted using a leaf spring. This eliminates the need for manual attachment and allows for the creation of an electronic device that can be worn regardless of arm size.

[0097] Figure 4(A) shows a perspective view of the electronic device 100d. Figure 5(A) also shows a perspective view of the electronic device 100d. Figure 5(B) shows a top view of d and a cross-sectional view between the dashed lines J and K in Figure 5(A). In Figure 5(B), the direction from which the light emitted from the light-emitting element of the display panel 10 is extracted is indicated by the arrow. Indicate with a mark.

[0098] The electronic device 100d has a seal 40 and a band 155. Inside the seal 40 is a surface The display panel 10, circuit 30, energy storage device 20, etc. are included. The sealant 40 and band 155 are It is connected.

[0099] It is preferable that the sealant 40 and the band 155 are detachably connected. For example, the sealant It can connect to 40, and has multiple bands with different designs, for the day Depending on the location, time, and circumstances of use, select the band to connect to the sealing body 40. This increases opportunities to use electronic devices. Also, the old Band 155 It is also possible to replace it with a new band. In addition, there are multiple sealing bodies 40 that differ in shape or performance, etc. You may prepare the following and, depending on the situation, select the sealing body 40 to connect to the band.

[0100] Furthermore, as shown in Figure 4(B), the electronic device 100e has a recess, and the recess A configuration in which a sealing body 40 is placed inside is also possible. The sealing body 40 protrudes compared to the band 155. If left exposed, the electronic device may rub against or collide with other objects while in use. Due to these factors, the display unit 15 may be scratched, and furthermore, the electronic device may be damaged. The band 155 and the sealing body 40 are sealed so that the surfaces of the band 155 and the sealing body 40 form approximately the same plane. It is preferable that the body 40 can be connected. Note that the recess of the band 155 is greater than the thickness of the sealing body 40. It can be deep.

[0101] Figures 4(A) and 5(A) show examples where the width of the sealant 40 and the width of the band 155 are equal. However, the present invention is not limited to this. As shown in Figure 5(C), the width of the sealant 40 However, it may be narrower than the width of band 155. Alternatively, as shown in Figure 5(D), the sealant 4 The width of 0 may be wider than the width of band 155.

[0102] Next, an example of a component of an electronic device according to one aspect of the present invention is shown.

[0103] The element 150 shown in Figure 6(A) consists of the display panel 10, the energy storage device 20, the circuit 30, and the encapsulant. It has 40. The encapsulant 40 contains a display panel 10, a power storage device 20, and a circuit 30 inside. It has. In the following, the display panel 10, the energy storage device 20, and the circuit 30 are collectively referred to as the sealed body. It may be noted.

[0104] Element 150 is, for example, element 150a in Figure 4(A) and element 150b in Figure 4(B). The sealing body 40 can be used by connecting it to the band 155. Alternatively, as shown in Figure 3(A)~ As shown in (E), by forming the sealing body 40 in a strip shape, the sealing body 40 itself can be attached to the arm. That's fine.

[0105] An example of the connection relationships of the sealed object is shown in a block diagram in Figure 6(B).

[0106] The display panel 10 has a light-emitting element 11. The light-emitting element 11 is supplied from the energy storage device 20. It has the function of emitting light using electricity.

[0107] Furthermore, the display panel 10 has a function to emit light using power supplied from sources other than the energy storage device 20. It is acceptable to have it.

[0108] The energy storage device 20 has a portion that overlaps with the display panel 10.

[0109] The energy storage device 20 may also have a function to supply power to devices other than the display panel 10.

[0110] The energy storage device 20 includes a positive electrode, a negative electrode, a separator, an electrolyte, and an outer casing, etc.

[0111] The circuit 30 has an antenna 31. The antenna 31 has a portion that overlaps with the display panel 10. The circuit 30 can charge the energy storage device 20 wirelessly (or contactlessly). .

[0112] The portion where the display panel 10 and the circuit 30 overlap each other, or the portion where the display panel 10 and the energy storage device 20 The overlapping portions of the elements allow for miniaturization of element 150. In particular, the table It is preferable to provide overlapping sections for the three components: the display panel 10, the energy storage device 20, and the circuit 30. It seems so. Miniaturizing element 150 is particularly effective when a band is provided separately from the sealant 40. Furthermore, when the sealing body 40 is used as a band for electronic equipment, the miniaturization of element 150 is possible. If not required, the portion where the display panel 10 and the circuit 30 overlap each other, or the display panel 10 The and the energy storage device 20 do not need to have any overlapping portions.

[0113] The energy storage device 20 preferably has a portion that overlaps with the circuit 30. For example, the antenna 31 At least a portion of it may overlap with the energy storage device 20. Antenna 31 is on display panel 10 The antenna 31 is positioned between the battery storage device 20, so that it is not easily visible to the user of the electronic device. By stacking the display panel 10, the power storage device 20, and the circuit 30 in such a way, the electronic device This is preferable as it helps to prevent damage to the appearance. Display between the external antenna and antenna 31. Even with panel 10 in place, radio waves can still be transmitted and received. In other words, an external antenna is The radio wave to be transmitted passes through the display panel 10, and the antenna 31 receives the radio wave.

[0114] When the usage environment of the electronic device is determined, a light-emitting element capable of emitting light and a power storage device capable of supplying power to the display panel in that environment are used.

[0115] The electronic device according to one aspect of the present invention is preferably usable in a low-temperature environment and a high-temperature environment. Alternatively, the electronic device according to one aspect of the present invention can be used in a wide temperature range (for example, 0°C or higher and 100°C or lower, preferably -25°C or higher and 150°C or lower, more preferably -50°C or higher and 200°C or lower). The electronic device according to one aspect of the present invention can be used either indoors or outdoors.

[0116] The light-emitting element included in the electronic device according to one aspect of the present invention preferably can emit light in an environment of 0°C and an environment of 100°C, respectively. Further, the power storage device included in the electronic device according to one aspect of the present invention preferably can supply power to the display panel in an environment of 0°C and an environment of 100°C, respectively.

[0117] The electronic device may have a switch. In FIGS. 6(C) and (D), the display panel 10, the power storage device 20, the circuit 30, the circuit 50, and the switch 51 are shown as the sealed body.

[0118] For example, as shown in FIG. 6(C), when the switch 51 is in the off state, the circuit 30 can charge the power storage device 20 wirelessly.

[0119] For example, as shown in FIG. 6(D), when the switch 51 is in the on state, the power storage device 20 can supply power to the display panel 10. ​​​​​​

[0120] The following describes in detail the components of an electronic device according to one aspect of the present invention.

[0121] <Display Panel 10> The display panel 10 has a light-emitting element 11. An example of the configuration of the display panel 10 is shown in the embodiment. Section 3 will describe the light-emitting device in detail, and Embodiment 4 will describe the input / output device in detail. The display elements of the display panel 10 are not limited to light-emitting elements. Furthermore, the display panel is touch-sensitive. It may have a detection element such as a sensor.

[0122] The display panel 10 has an active element (active element, nonlinear element) in the pixel. Use a passive matrix system or a passive matrix system in which the pixels do not have active elements. It is possible.

[0123] The display panel 10 may be flexible. For example, the support substrate and encapsulation of the light-emitting element 11. By using a film on at least one of the substrates, the flexibility of the display panel 10 is increased. It is possible.

[0124] For example, a display that can withstand 100,000 bending and stretching cycles in a bending and stretching test with a radius of curvature of 5 mm. It is preferable to use the following. The display panel has a radius of curvature in the range of 1 mm to 150 mm. In addition, when electronic equipment is used in a state where the radius of curvature is bent within the range of 5 mm to 150 mm, It would be preferable if this could be done.

[0125] The light-emitting element 11 uses an element that can emit light in both low-temperature and high-temperature environments. This is preferable. As a low-temperature environment, for example, an environment of -100°C or higher and 0°C or lower, preferably - An environment between 100°C and -25°C, more preferably an environment between -100°C and -50°C. can be cited. As a high-temperature environment, for example, an environment of 100°C or higher and 300°C or lower, preferably an environment of 150°C or higher and 300°C or lower, more preferably an environment of 200°C or higher and 300°C or lower can be cited. Note that the light-emitting element 11 can emit light not only in a low-temperature environment or a high-temperature environment, but also in an environment higher than 0°C and lower than 1 00°C. For example, the light-emitting element 11 can emit light at room temperature (20°C or higher and 30°C or lower).

[0126] As the light-emitting element 11, an element capable of self-emission can be used, and an element whose luminance is controlled by current or voltage is included in that category. For example, a light-emitting diode (LED), an organic EL element, an inorganic EL element, etc. can be used. Further, not limited to the light-emitting element, other display elements can also be applied.

[0127] The higher the heat resistance of the light-emitting element 11, the more preferable. For example, when an organic EL element is used for the light-emitting element 11, the glass transition temperature of each organic compound contained in the organic EL element is preferably 100°C or higher and 300 °C or lower, and more preferably 150°C or higher and 300°C or lower.

[0128] In one aspect of the present invention, in the case of a configuration in which the antenna 31 receives power from an external antenna via the display panel 10, the thinner the thickness of the pair of electrodes of the light-emitting element 11, the more preferable. For example , the sum of the thicknesses of the pair of electrodes is 1 μm or less, preferably 500 nm or less, more preferably 35 0 nm or less, and even more preferably 250 nm or less.

[0129] [<Power storage device 20> The power storage device 20 supplies power to the display panel 10 in a low-temperature environment and a high-temperature environment. It is preferable to use an energy storage device that can do this. As a low-temperature environment, for example, -100℃ or higher An environment below ℃, preferably an environment between -100℃ and -25℃, more preferably -100 Examples of high-temperature environments include those between 5°C and -50°C. Environment below 0°C, preferably an environment between 150°C and 300°C, more preferably 200°C The above examples include environments below 300°C. Note that the energy storage device 20 is used in low-temperature or high-temperature environments. Furthermore, it can be used in environments above 0°C but below 100°C. For example, energy storage. The device 20 can be used at room temperature (20°C to 30°C).

[0130] For example, the energy storage device 20 is a lithium polymer battery (lithium) that uses a gel electrolyte. Lithium-ion secondary batteries such as ion polymer batteries, nickel-metal hydride batteries, nickel-cadmium batteries, etc. Examples include mechanical radical batteries, lead-acid batteries, air-based rechargeable batteries, nickel-zinc batteries, and silver-zinc batteries. It can be done.

[0131] By using lithium-ion secondary batteries that can achieve high energy density, the weight of electronic devices can be increased. This is preferable because it allows for miniaturization and reduction in size.

[0132] For example, a secondary battery having a non-aqueous electrolyte can be used. The non-aqueous electrolyte is an ionic liquid. It contains a solid (molten salt at room temperature) and an alkali metal salt. The ionic liquid is flame-retardant and non-volatile. Therefore, it is possible to realize a secondary battery with high heat resistance. For example, an ionic liquid is imidazolium cati. It is preferable to have both an ion and an anion. Furthermore, the alkali metal salt is a lithium salt. It is preferable to have one.

[0133] Secondary batteries using gel electrolytes, or all-solid-state secondary batteries using solid electrolytes, have heat resistance or It is highly safe and desirable.

[0134] The energy storage device 20 can take various forms, such as coin-shaped (single-layer flat type), cylindrical, thin, rectangular, and sealed types. A rechargeable battery of a certain shape can be used. In addition, multiple positive electrodes, negative electrodes, and separators are stacked. The structure may be one in which the positive electrode, negative electrode, and separator are wound together (wound type). stomach.

[0135] Furthermore, in one embodiment of the present invention, the electronic device includes a lithium-ion capacitor as the energy storage device 20. It may also have a double-layer capacitor or the like.

[0136] The energy storage device 20 may be flexible. For example, by using a film for the outer casing, The flexibility of the energy storage device 20 can be increased. The area enclosed by the outer casing contains the positive electrode, the negative electrode, and It contains at least one electrolyte (or electrolyte solution).

[0137] In electronic devices, the light-emitting element 11 and the energy storage device 20 may be arranged in a stacked configuration. The larger the overlapping area between the optical element 11 and the energy storage device 20, the more the heat generated by the light-emitting element 11 can be utilized. This allows the energy storage device 20 to be heated over a wide area. Compared to high-temperature environments, it operates in low-temperature environments. Even when using energy storage devices that are difficult to implement, the reliability of electronic equipment can be improved.

[0138] An example of the configuration of the energy storage device 20 will be described in detail in Embodiment 2.

[0139] <Circuit 30> Circuit 30 has an antenna 31. Furthermore, circuit 30 has a controller 32. That's fine.

[0140] Antenna 31 can receive power from an external antenna (for example, the antenna 68 of the charger). Antenna 31 may receive power from an external antenna via the display panel 10. Alternatively, the antenna 31 may receive power from an external antenna via the energy storage device 20.

[0141] The controller 32 supplies the power received by the antenna 31 to the energy storage device 20. It has the function of converting to and outputting to the energy storage device 20. For example, the controller 32 has the function of ACD It may also function as a C converter. In that case, the power received by antenna 31 The electricity is converted into DC power and output to the energy storage device 20.

[0142] In the electronic device of this embodiment, the charger's antenna 68 (primary coil) and the electronic device's antenna The tenor 31 (secondary coil) is magnetically coupled, and the alternating magnetic field generated from the primary coil powers the secondary coil By using an electromagnetic induction method that generates voltage in the coil, power is transmitted to the secondary coil side without contact. Charging is performed using a mechanism. Note that the method of receiving power is not limited to electromagnetic induction.

[0143] The use of the antenna on the electronic device is not limited to non-contact charging of the energy storage device 20. For example, an electronic device may be equipped with an antenna and memory to transmit and receive electronic data. Depending on the received data, the display panel 10 may display images or information. , equipped with GPS (Global Positioning System) functionality for positioning An antenna capable of acquiring information or GPS time may be provided.

[0144] For safety reasons, the input and output terminals for charging or discharging the energy storage device should not be exposed on the surface of electronic equipment. This is preferable. If the input / output terminals are exposed, water such as rain can cause a short circuit in the input / output terminals. There is a risk of electric shock if the input / output terminals come into contact with the human body. If antenna 31 is used, Since the energy storage device can be charged by contact, the input and output terminals are not exposed on the surface of the electronic device. It can be configured as follows.

[0145] <Circuit 50> Circuit 50 converts the power supplied from the energy storage device 20 into power to make the light-emitting element 11 light up. It has the function of, for example, the output voltage of the energy storage device 20 is used to determine the amount of light required for the light-emitting element 11 to emit light. It may also have a function to convert (boost or buck) the voltage.

[0146] Furthermore, the circuit 50 generates signals to drive the display panel 10 and outputs them to the display panel 10. It may have a function to drive. Circuit 50 has a signal line drive circuit or a scan line drive circuit. It may also be the case that the display panel 10 has a signal line drive circuit or a scan line drive circuit. That's good too.

[0147] <Switch 51> Switch 51 is electrically connected to circuit 50. Switch 51 is also connected to an energy storage device. It is electrically connected to 20. Also, switch 51 is electrically connected to circuit 30. Yes, they are.

[0148] There are no particular limitations to the switch 51; for example, it could be an electrical switch, a mechanical switch, etc. It can be used. Specifically, transistors, diodes, magnetic switches, mechanical Examples include switches with contacts.

[0149] Figures 7(A) and 7(B) show specific examples of the sealed object. Figure 7(A) shows the surface (display surface) of the sealed object. Figure 7(B) shows the back surface of the sealed object.

[0150] Figures 7(A) and 7(B) show an example in which a laminated secondary battery is used as the energy storage device 20. As shown in Figure 7(B), the central part of the energy storage device 20 is a part where multiple electrodes are stacked. It is thicker than the edges.

[0151] Electrode 21a is electrically connected to either the positive or negative electrode of the energy storage device 20. b is electrically connected to the other of the positive or negative electrode of the energy storage device 20.

[0152] The electrodes 21a and 21b are bent via the circuit board 55 and connected to terminal 33 on the circuit board 55. a and 33b are electrically connected to each other.

[0153] The circuit board 55 contains elements (electronic components) that make up circuits 30, 50, etc., as shown in Figure 6(C), etc. A component (shown as 35 in the figure) is provided. The circuit board 55 includes, for example, capacitive elements and resistive elements. Electronic components such as sub-units or switch elements are provided. The circuit board 55 is, for example, a pre A 3D substrate can be used.

[0154] Furthermore, a switch 51 is provided on the circuit board 55. In Figures 7(A) and (B), An example using a magnetic switch is shown as switch 51. The switch is turned on by attaching and detaching a magnet. It can be switched off.

[0155] Antenna 31 is electrically connected to terminal 34 on circuit board 55. Some of them are located between the energy storage device 20 and the display panel 10. In other words, in electronic equipment The antenna 31 has a portion that overlaps with the display panel 10. The antenna 31 also has a battery storage It has a portion that overlaps with device 20.

[0156] Antenna 31 can receive power from an external antenna via the display panel 10.

[0157] The terminal 12a of the display panel 10 is connected to terminal 52a on the circuit board 55 via wiring 53a. It is electrically connected to the terminal 12b of the display panel 10 via the wiring 53b. It is electrically connected to terminal 52b on circuit board 55.

[0158] In one embodiment of the present invention, the power storage device and the antenna are independently connected to a display panel. It has an overlapping portion. It also has an overlapping portion between the energy storage device and the circuit. Figure 7(A), (B As shown in the diagram, for example, a part of the antenna 31 is between the display panel 10 and the power storage device 20. It may be located.

[0159] As described above, the electronic equipment consists of a power storage device, display panel, circuit board, antenna, etc. If at least two of the elements have overlapping portions, the encapsulated object can be miniaturized. This is preferable.

[0160] For example, the energy storage device 20 has a display panel 10, a circuit board 55, and an antenna 31, and a small number of these components are included. It is preferable that at least one of them has a portion that overlaps with the other. Figure 7(A), (B As shown in the image, the energy storage device 20 has a display panel 10, a circuit board 55, and an antenna 31. It is particularly preferable that each of them has an overlapping portion with the others.

[0161] The environment in which the electronic device according to one aspect of the present invention can be used is not limited to an atmospheric environment. These electronic devices can be used, for example, in water between 0°C and 100°C. (Light-emitting element) Furthermore, the usable temperature range of the energy storage device is wide, and the light-emitting element and energy storage device are sealed by an encapsulant. Because of the fact that it is stopped, the electronic device according to one aspect of the present invention has high reliability even when used underwater. It is possible to ensure reliability.

[0162] Furthermore, as shown in Figures 8(A) and (B), an electronic device according to one embodiment of the present invention is sealed with a sealing body 40. It may have multiple sealed regions. As shown in Figures 8(A) and (B), the sealed body may have multiple regions. The elements may be arranged in separate spaces, and the sealed region 41 contains the elements that are arranged separately. Wiring 45 etc. connecting them may overlap. This region is a flexible region 70 It can also be said that, as shown in Figure 8(B), the electronic device can be bent in the flexible region 70. This is possible. In Figure 8(B), even if the display panel 10 does not have flexibility, it can be made flexible. By bending the region 70, and further the portion of the sealing body 40 that overlaps with the energy storage device 20, the electronic equipment It can be bent and wrapped around the arm, etc. Furthermore, if the display panel 10 is flexible, the display The panel 10 may be bent to deform the electronic device.

[0163] In Figure 8(A), the upper space contains the display panel 10, and the lower space contains the energy storage device 20 and Circuit 30 is included. The display panel 10 is connected to the energy storage device 20 and circuit 30 by wiring 45. They are electrically connected to each other.

[0164] Furthermore, electronic devices may have a double sealing region. As shown in Figure 8(C), sealing A sealing region 41b surrounding region 41a may be provided, and the display panel 10, etc., may be double-sealed. By implementing double or more blocking measures, the reliability of electronic devices can be increased.

[0165] Furthermore, as shown in Figure 8(C), the display panel 10, the energy storage device 20, and the circuit 30 are It is preferable that the edges of each are chamfered. Display panel 10, power storage device 20, and rotation To prevent the seal from being broken at corners such as road 30, a film or the like is used in the sealant. This also helps to suppress the decline in the reliability of electronic devices.

[0166] Furthermore, an electronic device according to one aspect of the present invention has a photoelectric conversion element, and uses the photoelectric conversion element to store energy It is preferable that the storage device can be charged. For example, it is preferable that the storage device can be charged by solar power generation. i. Alternatively, an electronic device according to one aspect of the present invention has a function that generates and charges power using the movement of the user's arm. It is acceptable to have it.

[0167] An electronic device according to one aspect of the present invention preferably has one or more sensors. As For example, force, displacement, position, velocity, acceleration, angular velocity, rotational speed, distance, light (visible light, infrared light) (Ultraviolet light, etc.), liquid, magnetism, temperature, chemical substances, sound, time, hardness, electric field, current, voltage, electricity Using equipment that includes functions for measuring force, radiation, flow rate, humidity, gradient, vibration, or odor. It is possible.

[0168] An electronic device according to one aspect of the present invention measures the user's biological information, such as heart rate, respiratory rate, pulse, body temperature, or blood pressure. It is preferable to have a sensor for measuring information.

[0169] An electronic device according to one aspect of the present invention has a function to detect biological information and location information, and this information It is preferable that the device has a function to transmit data. For example, an electronic device can detect changes in the user's physical condition. It can transmit biometric and location information to other electronic devices. This allows the user to In the event of illness or accident, the user can receive prompt assistance. .

[0170] For example, an optical sensor can be used to measure heart rate from the constriction of capillaries in the arm, etc. .

[0171] Furthermore, it is possible to determine whether an electronic device is attached to the user's arm by measuring the electrical conductivity of the skin. By using sensors, it may be possible to automatically turn electronic devices on and off. .

[0172] These sensors are, for example, mounted on the side of electronic devices that comes into contact with the user's skin. It is preferable to do so.

[0173] Furthermore, an electronic device according to one embodiment of the present invention may be capable of measuring data on the operating environment. For example, purple It may have an external light sensor or an illuminance sensor. By understanding the amount of ultraviolet light, the user's daily It can be used to prevent overheating. Furthermore, the brightness of the display automatically adjusts according to the ambient light level. The sensitivity may also be adjustable. These sensors are used, for example, in electronic devices, to display It is preferable that it be mounted on the face side.

[0174] Furthermore, an electronic device according to one aspect of the present invention may be capable of receiving GPS signals.

[0175] An electronic device according to one aspect of the present invention includes a drive circuit for a display panel and a power storage device for wireless charging. It has a protection circuit to prevent overcharging of the circuit and energy storage device. Furthermore, it controls other functional elements. It may have a circuit for controlling or driving, specifically an integrated circuit (such as a CPU).

[0176] In addition, the electronic device according to one aspect of the present invention includes an image sensor, a power generation element, a speaker, a microphone, etc. It may have various functional elements or components.

[0177] An electronic device according to one aspect of the present invention may have a touch panel.

[0178] In one aspect of the present invention, a capacitive touch sensor or a pressure-sensitive touch sensor is used to display Configurations in which the panel is superimposed on another panel, or configurations in which the display panel itself has a touch sensor function ( In-cell type touch panel (also called an in-cell type touch panel) can be applied. Capacitive or optical touch sensors can be applied to the surface.

[0179] Please note that during water sports such as swimming and scuba diving, or while bathing, tap There are cases where touch operation is difficult or touch detection is difficult. Therefore, in one aspect of the present invention In electronic devices, it is preferable to have an audio input unit as an input means. For example, electronic devices It is preferable to have a microphone, especially a bone conduction microphone. Bone conduction microphones have excellent noise resistance. Therefore, it can detect voices with high sensitivity even in noisy or disruptive outdoor environments. Furthermore, bone conduction microphones... Furthermore, it can be used effectively even underwater. In addition, the microphone does not need to be positioned close to the mouth. Therefore, it offers greater flexibility in the placement of electronic devices and can be used without issue in arm-mounted electronic devices. Furthermore, the electronic device may have a bone conduction speaker as an output means. The device may have other microphones or speakers that can be used underwater.

[0180] Furthermore, by applying one aspect of the present invention, a wearable device having water resistance for everyday use may be provided. This can be achieved. For example, an electronic device according to one aspect of the present invention can withstand 2 atmospheres (bars) or more. Preferably 5 atmospheres or more, more preferably 10 atmospheres or more, and even more preferably 20 atmospheres or more. It is waterproof.

[0181] Furthermore, by applying one aspect of the present invention, a wearable device for diving can be realized. For example, an electronic device according to one aspect of the present invention is waterproof up to 100m, more preferably 20 Having water resistance down to 0m means it can be used when diving in shallow waters, such as during scuba diving. It is possible. Furthermore, an electronic device according to one aspect of the present invention may be waterproof up to 300m, more preferably The Mashiku has waterproofing up to 1000m, making it suitable not only for shallow seas but also for deep-sea diving. It can also be used. An electronic device according to one aspect of the present invention is a display panel using a light-emitting element. Therefore, it has the characteristic of being highly visible at night or underwater.

[0182] Furthermore, an electronic device according to one aspect of the present invention includes a rotating bezel for measuring diving time or decompression time. In particular, it is preferable to have a unidirectional rotating bezel.

[0183] Furthermore, an electronic device according to one aspect of the present invention is a device for measuring air temperature, water temperature, water depth, or dive log, etc. It may have a function for recording, displaying, or a chronograph function. It may have the function of transmitting location information identified by GPS signals to other electronic devices. This can improve safety during marine sports or underwater work.

[0184] Furthermore, if an electronic device according to one aspect of the present invention has saltwater resistance, it can be used for marine sports or in the sea. It can be suitably used when performing work, and is therefore preferable.

[0185] Figures 9(A)-(D) and 10(A)-(D) show an arm-mounted electronic device according to one embodiment of the present invention. Let me give you a specific example.

[0186] The electronic devices shown in Figures 9(A)-(D) and 10(A)-(D) each contain one or more It comprises a display unit 15 and one or more sealing bodies 40.

[0187] Figures 9(A), (B), and 10(A)-(C) show the sealing body 40 directly attached to an arm, etc. This is an example of an electronic device that can be wrapped around something.

[0188] The sealant 40 is flexible and can be bent to conform to the shape of the area where the electronic device is mounted. Furthermore, the display unit 15 may also be flexible.

[0189] The fastener 91 is connected to the sealant 40.

[0190] The sealing body 40 is provided with a plurality of openings 93. Starting from the end of the opening 93, the sealing body 40 This prevents damage to the sealant or prevents impurities from entering the interior of the sealant 40 from the end of the opening 93. To control this, it is preferable that the end of the opening 93 has a sealing portion 95. The sealing portion 95 is The vicinity of the end of the opening 93 of the sealing body 40 can be reinforced. The material of the sealing portion 95 is not limited. For example, metals, alloys, organic resins, etc., can be used.

[0191] Figures 9(A) and 10(A) show an example where the display unit 15 is rectangular, and Figure 9(B), Figures 10(B) and (C) show examples where the display unit 15 is circular. The shape of the display unit 15 is particularly It is not limited to polygons other than quadrilaterals, ellipses, semicircles, stars, hearts, etc. Various display shapes can be applied.

[0192] Figures 9(A) and (B) show an electronic device having a single display unit located approximately in the center of the device. However, the position and number of display units are not particularly limited. As shown in Figure 10(A), three It may also have a display unit. Also, as shown in Figures 10(B) and (C), the center of the electronic device The display unit may be located at a position offset from the center. In addition, the shapes of the multiple display units may be the same or they may be different from one another.

[0193] Furthermore, Figures 9(C), (D), and 10(D) show the structures connected to the sealing body 40, respectively. This is an example of an electronic device that can be worn on the arm or other body parts.

[0194] Electronic devices, for example, as shown in Figures 9(C) and 10(D), have a chain-like structure. It may have a 97. Alternatively, the electronic device may have a structure as shown in Figure 9(D) It may also have a belt-shaped band 155.

[0195] Figures 9(C) and 9(D) show an example having one sealing body 40 and one display unit 15, and Figure 10(D The following example shows a device having two sealing bodies 40 and two display units 15.

[0196] The structure may be made of one or more materials, such as metal, resin, or natural materials. Materials such as stainless steel, aluminum, and titanium alloys can be used. Acrylic resin, polyimide resin, etc. can be used as the resin. In addition, natural materials Materials such as wood, stone, bone, leather, paper, and processed cloth can be used.

[0197] Figures 11(A) to (C) show examples of mounting electronic equipment according to one embodiment of the present invention. Figure 11(A) is This is an example of wearing an electronic device according to one aspect of the present invention on the wrist. Figure 11(B) shows one aspect of the present invention. This is an example of wearing electronic devices over clothing, and can also be called an armband-type electronic device. Figure 11(C) This is an example of attaching an electronic device according to one aspect of the present invention to the upper arm.

[0198] Furthermore, an electronic device according to one aspect of the present invention is not limited to being attached to a part of the body, but can also be used in robots. Robots (factory robots, humanoid robots, etc.), columnar objects (building columns, utility poles, signposts) Alternatively, it may be used attached to tools or other objects.

[0199] An electronic device according to one aspect of the present invention has a communication function and is capable of sending and receiving emails, etc., on its own. It is permissible. For example, electronic devices include mobile phones, email, document viewing and creation, and music playback. It can run various applications such as internet communication and computer games. It is preferable.

[0200] Alternatively, an electronic device according to one aspect of the present invention can be used with a mobile phone such as a smartphone or other portable information device. You may also send and receive emails by connecting wirelessly to a device. For example, a smartphone By using it together with the ON, the display unit of an electronic device according to one aspect of the present invention can be used as a sub-display. It may also be used in this way.

[0201] In one aspect of the present invention, a highly waterproof sealing body is used to seal a display panel, circuit, energy storage device, etc. By stopping this, a wearable device that can be used during water sports or bathing can be realized. This can be expressed. Furthermore, in one aspect of the present invention, a heat-resistant encapsulant, a display panel, and By applying an energy storage device, it is possible to realize a wearable device with a wide operating temperature range. ru.

[0202] This embodiment can be combined with other embodiments as appropriate.

[0203] (Embodiment 2) In this embodiment, regarding an energy storage device that can be used in an electronic device according to one aspect of the present invention, This will be explained using Figures 12 to 23. Note that the energy storage device in one embodiment of the present invention is... The configurations are not limited to those exemplified by the examples provided; various shapes and forms can be applied.

[0204] In this embodiment, a lithium-ion secondary battery will be used as an example, but one aspect of the present invention relates to this. Not limited to. One aspect of the present invention is a battery, a primary battery, a secondary battery, a lithium-air battery, a lead-acid battery. Ponds, lithium-ion polymer secondary batteries, nickel-metal hydride batteries, nickel-cadmium batteries Batteries, nickel-iron batteries, nickel-zinc batteries, silver oxide-zinc batteries, solid-state batteries, air Battery, zinc-air battery, capacitor, lithium-ion capacitor, electric double-layer capacitor It may also be applied to ultracapacitors, supercapacitors, etc.

[0205] In one embodiment of the present invention, the energy storage device is in contact with a power supply source (hereinafter also referred to as a power transmission device) In a state where it is not in operation, power is supplied to the object (hereinafter also referred to as the power receiving device) (non-contact). It can be powered by a method (also called power supply or wireless power supply). Examples include magnetic field resonance, electromagnetic induction, and electrostatic induction methods.

[0206] <Configuration Example 1> Figure 12(A) shows the battery unit 500. In Figure 12(A), the battery unit 500 As an example, a form of a thin secondary battery is shown, but the present invention is not limited to this. For example, a secondary battery using a wound body, or a cylindrical or coin-type secondary battery, is an embodiment of the present invention. It may be applied to electronic devices such as [name of device].

[0207] As shown in Figure 12(A), the battery unit 500 has a positive electrode 503, a negative electrode 506, and a separate It has a terminal 507 and an outer casing 509. The battery unit 500 has a positive lead 510 and a negative lead It may have pole leads 511.

[0208] Figures 13(A) and (B) show an example of a cross-sectional view between the dashed line A1 and A2 in Figure 12(A). These are shown below. Figures 13(A) and (B) show the results when a set of positive electrode 503 and negative electrode 506 is used. The cross-sectional structures of the battery unit 500 are shown below.

[0209] As shown in Figures 13(A) and (B), the battery unit 500 has a positive electrode 503, a negative electrode 506, It has a separator 507, an electrolyte 508, and an outer casing 509. The separator 507 is positive It is sandwiched between electrode 503 and negative electrode 506. The area enclosed by the outer casing 509 is the electrolyte 50 It is filled with 8.

[0210] The positive electrode 503 includes a positive electrode active material layer 502 and a positive electrode current collector 501. The negative electrode 506 is a negative electrode It includes an active material layer 505 and a negative electrode current collector 504. The active material layer is shaped on one or both sides of the current collector. This can be achieved. The separator 507 is located between the positive electrode current collector 501 and the negative electrode current collector 504. To be located.

[0211] A battery unit has one or more positive and negative electrodes. For example, a battery unit has multiple It can also be a layered structure consisting of several positive electrodes and multiple negative electrodes.

[0212] Figure 14(A) shows another example of the cross-sectional view between the dashed line A1 and A2 in Figure 12(A). Furthermore, Figure 14(B) shows a cross-sectional view of the section between the dashed line B1 and B2 in Figure 12(A).

[0213] Figures 14(A) and (B) show a battery unit made using multiple sets of positive electrode 503 and negative electrode 506. The cross-sectional structure of unit 500 is shown. There is no limit to the number of electrode layers that the battery unit 500 has. Electrode layer If the number is large, it is possible to use an energy storage device with a larger capacity. Also, the electrode layer When the number of units is small, the energy storage device can be made thinner and more flexible.

[0214] Figures 14(A) and (B) show a positive electrode having a positive electrode active material layer 502 on one side of the positive electrode current collector 501. Two 503s and two positive electrode 503s having positive electrode active material layers 502 on both sides of the positive electrode current collector 501. For example, an example using three negative electrodes 506, each having a negative electrode active material layer 505 on both sides of a negative electrode current collector 504. This shows that the battery unit 500 has 6 layers of positive electrode active material 502 and 6 layers of negative electrode active material It has a layer 505. Note that in Figures 14(A) and (B), the separator 507 is shown as an example of a bag shape. However, it is not limited to this, and the separator 507 may be in the shape of a strip or an accordion. stomach.

[0215] Next, Figure 12(B) shows an external view of the positive electrode 503. The positive electrode 503 is connected to the positive electrode current collector 501 and It has a positive electrode active material layer 502.

[0216] Furthermore, Figure 12(C) shows an external view of the negative electrode 506. The negative electrode 506 is connected to the negative electrode current collector 504 and It has a negative electrode active material layer 505.

[0217] Here, the positive electrode 503 and the negative electrode 506 are stacked together, with multiple positive electrodes or multiple negative electrodes interacting with each other. It is preferable to have a tab region for electrical connection. Furthermore, the tab region may contain electrode rings. It is preferable to electrically connect the codes.

[0218] As shown in Figure 12(B), it is preferable that the positive electrode 503 has a tab region 281. A portion of the tab region 281 is preferably welded to the positive lead 510. Tab region 281 Preferably, the positive electrode current collector 501 has an area in which it is exposed. By welding the positive lead 510 to the area, the contact resistance can be further reduced. Furthermore, in Figure 12(B), the positive electrode current collector 501 is exposed throughout the entire tab region 281. As shown in the example, the tab region 281 may have a positive electrode active material layer 502 in part.

[0219] As shown in Figure 12(C), it is preferable that the negative electrode 506 has a tab region 282. A portion of the tab region 282 is preferably welded to the negative electrode lead 511. Tab region 282 It is preferable that the negative electrode current collector 504 has an area in which it is exposed. By welding the negative electrode lead 511 to the area, the contact resistance can be further reduced. Furthermore, in Figure 12(C), the negative electrode current collector 504 is exposed throughout the entire tab region 282. As shown in the example, the tab region 282 may have a negative electrode active material layer 505 in part.

[0220] Note that Figure 12(A) shows an example where the ends of the positive electrode 503 and the negative electrode 506 are roughly aligned, The positive electrode 503 may have a portion that is located outside the end of the negative electrode 506.

[0221] In the battery unit 500, the area of ​​the region of the negative electrode 506 that does not overlap with the positive electrode 503 is small. It is quite desirable.

[0222] Figure 13(A) shows an example where the end of the negative electrode 506 is located inside the positive electrode 503. By using this configuration, all of the negative electrodes 506 are superimposed on the positive electrodes 503, or the positive electrodes 506 The area of ​​the region that does not overlap with pole 503 can be reduced.

[0223] Alternatively, in the battery unit 500, the areas of the positive electrode 503 and the negative electrode 506 are approximately the same. This is preferable. For example, the positive electrode 503 and the negative electrode 506 facing each other with the separator 507 in between. The areas are preferably approximately the same. For example, opposite each other with the separator 507 in between. It is preferable that the area of ​​the positive electrode active material layer 502 and the area of ​​the negative electrode active material layer 505 are approximately the same. stomach.

[0224] For example, as shown in Figures 14(A) and (B), the surface of the positive electrode 503 on the separator 507 side It is preferable that the product and the surface area of ​​the negative electrode 506 on the separator 507 side are approximately the same. Positive electrode The area of ​​the negative electrode 506 side of 503 and the area of ​​the positive electrode 503 side of negative electrode 506 are approximately the same. By doing so, the region of the negative electrode 506 that does not overlap with the positive electrode 503 is reduced (or ideally... This can be eliminated, and the irreversible capacity of the battery unit 500 can be reduced. It is preferable. Alternatively, as shown in Figures 14(A) and (B), the separation of the positive electrode active material layer 502 The area of ​​the surface on the -507 side and the area of ​​the surface of the negative electrode active material layer 505 on the separator 507 side are approximately the same. It is preferable that they be the same.

[0225] Furthermore, as shown in Figures 14(A) and (B), the ends of the positive electrode 503 and the negative electrode 506 are roughly It is preferable that they be aligned. Also, the edges of the positive electrode active material layer 502 and the negative electrode active material layer 505 should be roughly aligned. It is preferable.

[0226] Furthermore, Figure 13(B) shows an example where the end of the positive electrode 503 is located inside the negative electrode 506. By using this configuration, all of the positive electrodes 503 are stacked with the negative electrodes 506, or the positive electrodes 50 The area of ​​the region that does not overlap with the negative electrode 506 of 3 can be reduced. The end of the negative electrode 506 If it is located inside the end of the positive electrode 503, current will concentrate at the end of the negative electrode 506. There is a possibility of this occurring. For example, when current concentrates on a part of the negative electrode 506, lithium can form on the negative electrode 506. Precipitation may occur. Reduce the area of ​​the region of the positive electrode 503 that does not overlap with the negative electrode 506. This suppresses the concentration of current in a portion of the negative electrode 506. This allows for, for example, This is preferable because it suppresses the deposition of lithium on the negative electrode 506.

[0227] As shown in Figure 12(A), the positive lead 510 is electrically connected to the positive electrode 503. It is preferable. Similarly, it is preferable that the negative lead 511 be electrically connected to the negative electrode 506. The positive lead 510 and the negative lead 511 are exposed to the outside of the outer casing 509, and electrical contact with the outside is maintained. It functions as a terminal that obtains proper contact.

[0228] Alternatively, the positive electrode current collector 501 and the negative electrode current collector 504 serve as terminals to obtain electrical contact with the outside. It can also serve as a divider. In that case, without using electrode leads, the positive electrode current collector 501 and the negative electrode current collector are used. A portion of the polar current collector 504 may be positioned so as to be exposed to the outside from the outer casing 509.

[0229] Furthermore, in Figure 12(A), the positive lead 510 and the negative lead 511 are connected to the battery unit 500. Although they are located on the same side, as shown in Figure 15, the positive lead 510 and the negative lead 51 1 may be placed on different sides of the battery unit 500. Thus, one embodiment of the present invention The pond unit offers a high degree of design flexibility because the electrode leads can be freely positioned. This increases the design flexibility of products using energy storage devices. This can increase product productivity.

[0230] The components of the battery unit will be described in detail below.

[0231] Current collector As long as the current collector exhibits high conductivity without causing significant chemical changes within the energy storage device, special There are no restrictions. The positive and negative electrode current collectors can be made from materials such as stainless steel, gold, platinum, zinc, or iron. , metals such as nickel, copper, aluminum, titanium, tantalum, manganese, and their alloys, Alternatively, sintered carbon or similar materials can be used. Or, copper or stainless steel. It may be used coated with carbon, nickel, or titanium, or silicon, titanium. Aluminum alloys to which elements such as neodymium, scandium, and molybdenum are added to improve heat resistance. A titanium alloy can be used, or it can react with silicon to form a silicide. A current collector may be formed from a metallic element. A metallic element that reacts with silicon to form a silicide. These include zirconium, titanium, hafnium, vanadium, niobium, tantalum, and chromium. Examples include molybdenum, tungsten, cobalt, and nickel.

[0232] Irreversible reactions with the electrolyte may occur on the surface of the positive electrode current collector or the negative electrode current collector. Therefore, it is preferable that the positive electrode current collector and the negative electrode current collector each have low reactivity with the electrolyte. For example, by using stainless steel or the like for the positive electrode current collector or the negative electrode current collector, the electrolyte This may allow for a lower reactivity with the substance, which is preferable.

[0233] Furthermore, the positive electrode current collector and the negative electrode current collector can be in the form of foil, plate (sheet), mesh, or cylinder, respectively. Forms such as coils, perforated metal, expanded metal, porous materials, and nonwoven fabrics. Various shapes can be used as appropriate. Furthermore, the adhesion with the active material layer can be improved. Therefore, the positive electrode current collector and the negative electrode current collector may each have fine irregularities on their surfaces. Furthermore, the positive electrode current collector and the negative electrode current collector shall each have a thickness of 5 μm or more and 30 μm or less. It would be good to use this.

[0234] Furthermore, an undercoat layer may be provided on a part of the surface of the current collector. This refers to reducing the contact resistance between the current collector and the active material layer, or improving the adhesion between the current collector and the active material layer. This refers to the outer coating layer. Note that the undercoat layer is not formed on the entire surface of the current collector. It is also possible that it is formed in an island-like (partial) manner. Furthermore, the undercoat layer is the active material and It is acceptable to express capacity in this way. For the undercoat layer, for example, a carbon material can be used. This can be done. As carbon materials, for example, carbon black such as acetylene black, Carbon nanotubes, graphite, etc. can be used. Also, as an undercoat layer, Metal layers, layers containing carbon and polymers, and layers containing metal and polymers can also be used. .

[0235] ≪Active material layer≫ The active material layer contains active material. Active material refers to substances involved in the insertion and removal of ions, which are carriers. In this specification, the term "active material layer" refers only to the quality of the active material. In addition to the active material, it may also contain conductive additives and binders.

[0236] The positive electrode active material layer has one or more positive electrode active materials. The negative electrode active material layer has one or more negative electrode active materials.

[0237] The positive electrode active material and the negative electrode active material play a central role in the battery reaction of the power storage device and are substances that release and absorb carrier ions. In order to increase the lifespan of the power storage device, it is preferable that the active material is a material with a small capacity related to the irreversible reaction of the battery reaction, and it is preferable that the active material is a material with high charge-discharge efficiency. To increase the lifespan of the power storage device, it is preferable that the active material is a material with a small capacity related to the irreversible reaction of the battery reaction, and it is preferable that the active material is a material with high charge-discharge efficiency. <0‎001591>It is preferably a material with a small capacity related to the irreversible reaction of the battery reaction, and it is preferably a material with high charge-discharge efficiency. It is preferably a material with a small capacity related to the irreversible reaction of the battery reaction, and it is preferably a material with high charge-discharge efficiency.

[0238] For the positive electrode active material, a material capable of inserting and desorbing carrier ions such as lithium ions can be used. Examples of the positive electrode active material include materials having an olivine-type crystal structure, a layered rock salt-type crystal structure, a spinel-type crystal structure, a NASICON-type crystal structure, etc. For example, as the positive electrode active material, compounds such as LiFeO₂, LiCoO₂, LiNiO₂, LiMn₂O ₄, V₂O₅, Cr₂O₅, MnO₂, etc. can be used as materials. It is preferably a material with a small capacity related to the irreversible reaction of the battery reaction, and it is preferably a material with high charge-discharge efficiency.

[0239] For example, as the positive electrode active material, compounds such as LiFeO₂, LiCoO₂, LiNiO₂, LiMn₂O ₄, V₂O₅, Cr₂O₅, MnO₂, etc. can be used as materials.

[0240] Examples of materials having an olivine-type crystal structure include lithium-containing composite phosphates (general formula LiM PO₄ (M is one or more of Fe(II), Mn(II), Co(II), Ni(II))) Examples of representative examples of the general formula LiMPO₄ include LiFePO₄, LiNiPO₄ , LiCoPO₄, LiMnPO₄, LiFe Ni b PO₄, LiFe a Co b PO₄ LiFe a Mn b PO₄, LiNi a Co b PO₄, LiNi a Mn bPO4(a + b is 1 or less, 0 < a < 1, 0 < b < 1), LiFe c Ni d Co e PO4, LiFe c Ni d Mn e PO4, LiNi c Co d Mn e PO4 (c + d + e is 1 or less, 0 < c < 1, 0 < d < 1, 0 < e < 1), LiFe f Ni g Co h Mn i PO4 (f + g + h + i is 1 or less , 0 < f < 1, 0 < g < 1, 0 < h < 1, 0 < i < 1), etc. Compounds such as these are included.

[0241] For example, lithium iron phosphate (LiFePO4) is preferable because it satisfies the requirements for a cathode active material, such as safety, stability, high capacity density, high potential , the presence of lithium ions that can be extracted during initial oxidation (charging), etc., in a well - balanced manner. Since it satisfies the requirements for a cathode active material, such as safety, stability, high capacity density, high potential, the presence of lithium ions that can be extracted during initial oxidation (charging), etc., in a well - balanced manner, it is preferable.

[0242] By using LiFePO4 as the cathode active material, a power storage device that is stable and highly safe against external loads such as overcharging can be realized. Therefore, for example, as a power storage device used in mobile devices that can be carried around or wearable devices worn on the body, etc., it is particularly excellent. or wearable devices worn on the body, etc., it is particularly excellent. Since it satisfies the requirements for a cathode active material, such as safety, stability, high capacity density, high potential, the presence of lithium ions that can be extracted during initial oxidation (charging), etc., in a well - balanced manner, it is preferable.

[0243] Examples of materials having a layered rock - salt - type crystal structure include, for example, lithium cobalt oxide (LiCoO 2), LiNiO2, LiMnO2, Li2MnO3, LiNi 0.8 Co 0.2 O2, etc. For NiCo - based (the general formula is LiNi x Co 1-x O2 (0 < x < 1)), LiNi 0.5 Mn0.5 NiMn-based materials such as O2 (general formula is LiNi x Mn 1-x O2(0 <x<1)) Li Limited 1 / 3 Mn 1 / 3 Co 1 / 3 NiMnCo-based materials such as O2 (also called NMC). The formula is LiCa x Mn y Co 1-x-y O2(x>0, y>0, x+y<1)) is one example. Furthermore, Li(Ni 0.8 Co 0.15 Al 0.05 )O2,Li2MnO3-L iMO2 (where M is Co, Ni, or Mn) is another example.

[0244] In particular, LiCoO2 has a large capacity and is more stable in the atmosphere than LiNiO2. Therefore, it is preferable because it has advantages such as being thermally stable compared to LiNiO2.

[0245] Examples of materials having a spinel-type crystal structure include LiMn2O4 and Li 1+x Mn 2-x O4(0 <x<2)、LiMn 2-x Al x O4(0 <x<2)、LiMn 1.5 Ni 0.5 Examples include O4.

[0246] A small amount of nickel is added to a material having a spinel-type crystal structure containing manganese, such as LiMn2O4. Lithium oxide (LiNiO2, or LiNi 1-x M x O2(0 <x<1)(M=Co、 Mixing with aluminum (such as Al) offers advantages such as suppressing manganese elution and inhibiting the decomposition of the electrolyte. This is preferable.

[0247] Alternatively, as the positive electrode active material, Li(2-j) MSiO4 (where M is one or more of Fe(II), Mn(II), Co(II), Ni(II); 0 ≦ j ≦ 2), etc., lithium-containing composite silicates can be used. The general formula is Li MSiO4. Representative examples of Li (2-j) MSiO4 include i (2-j) FeSiO4, Li (2-j) NiSiO4, Li (2-j) CoSiO4 、Li (2-j) MnSiO4, Li (2-j) Fe k Ni l SiO4, Li (2-j) Fe k Co l SiO4, Li (2-j) Fe k Mn l SiO4, Li (2-j) Ni k C o l SiO4, Li (2-j) Ni k Mn l SiO4 (k + l is 1 or less, 0 < k < 1, 0 < l < 1), Li (2-j) Fe m Ni n Co q SiO4, Li (2-j) Fe m Ni n Mn q SiO4, Li (2-j) Ni m Co n Mn q [[ID=7​​​​​​​​​​​​​​​​​​ Alternatively, as the positive electrode active material, A x M2(XO4)3 (where A = Li, Na, Mg, M = Fe, Mn, Ti, V, Nb, Al, X = S, P, Mo, W, As, Si) represented by the general formula NASICON-type compounds can be used. Examples of NASICON-type compounds include Fe 2(MnO4)3, Fe2(SO4)3, Li3Fe2(PO4)3, etc.

[0249] Alternatively, as the positive electrode active material, compounds represented by the general formula Li2MPO4F, Li2MP2O7, Li5MO4 (where M = Fe, Mn), perovskite-type fluorides such as FeF3, metal chalcogenides (sulfides, selenides, tellurides) such as Ti S2, MoS2, materials having an inverse spinel-type crystal structure such as LiMV O4 (where M = Mn, Co, Ni), vanadium oxide-based (V2O5, V6O ., LiV3O8, etc.), manganese oxides, organic sulfur compounds, etc. 13 of materials can be used.

[0250] Also, as the positive electrode active material, a material obtained by combining a plurality of the above materials may be used. For example, a solid solution obtained by combining a plurality of the above materials can be used as the positive electrode active material. For example, Li Co 1 / 3 Mn 1 / 3 Ni 1 / 3 O2 and a solid solution of Li2MnO3 can be used as the positive electrode active material

[0251] In addition, when the carrier ion is an alkali metal ion other than lithium ion, or an alkaline earth metal ion, in the above lithium compound, lithium-containing composite phosphate and lithium-containing composite silicate, lithium is replaced with an alkali metal (for example, sodium (e.g., um, potassium), alkaline earth metals (e.g., calcium, strontium, varium) Compounds substituted with carriers such as magnesium, beryllium, and magnesium may also be used.

[0252] The average particle size of the primary particles of the positive electrode active material is preferably, for example, 5 nm to 100 μm.

[0253] Furthermore, for example, when a lithium-containing composite phosphate with an olivine-type structure is used as the positive electrode active material... In olivine, lithium diffusion is slow because the diffusion pathway is one-dimensional. When using lithium-containing composite phosphates with a specific structure, the positive electrode activity is used to increase the charge and discharge rate. The average particle size of the material is preferably, for example, 5 nm to 1 μm. Alternatively, the positive electrode The specific surface area of ​​the active material is preferably, for example, 10 m². 2 / g or more 50m 2 It is best to keep it below / g. .

[0254] In active materials having an olivine structure, for example, compared to active materials having a layered rock salt type crystal structure In comparison, it undergoes very little structural change during charging and discharging, and its crystal structure is stable, so overcharging, etc. It is stable even under normal operation, and when used as a positive electrode active material, it enables the creation of highly safe energy storage devices. It can be expressed.

[0255] For example, carbon-based materials, alloy-based materials, etc., can be used as the negative electrode active material.

[0256] Carbon-based materials include graphite, easily graphitizable carbon (soft carbon), and poorly graphitizable carbon (hard carbon). Examples include carbon (carbon), carbon nanotubes, graphene, and carbon black. For example, mesocarbon microbeads (MCMB), coke-based synthetic graphite, pitch-based synthetic There are artificial graphites such as solid graphite and natural graphites such as spheroidized natural graphite. Graphite also comes in the form of scales. These include shaped and spherical forms.

[0257] Graphite is formed when lithium ions are inserted into it (during the formation of lithium-graphite intercalation compounds). It exhibits a similarly low potential as lithium metal (0.1V to 0.3V vs. Li / Li + ). This allows lithium-ion secondary batteries to exhibit a high operating voltage. Furthermore, Graphite has a relatively high capacity per unit volume, low volume expansion, and is inexpensive. It is preferable because it has advantages such as higher safety compared to metal.

[0258] When the carrier ion is a lithium ion, the alloying material could be, for example, Mg, Ca , Ga, Si, Al, Ge, Sn, Pb, As, Sb, Bi, Ag, Au, Zn, Cd, Materials containing at least one of Hg, In, etc. can be used. Compared to carbon, silicon has a larger capacity, and silicon in particular has a high theoretical capacity of 4200mAh / g. The capacity of energy storage devices can be increased. Alloy materials (compound materials) using such elements. Examples of materials include Mg2Si, Mg2Ge, Mg2Sn, SnS2, V2Sn3, FeSn2, CoSn2, Ni3Sn2, Cu6Sn5, Ag3Sn, Ag3Sb, Ni 2MnSb, CeSb3, LaSn3, La3Co2Sn7, CoSb3, InSb, S Examples include bSn, etc.

[0259] Furthermore, as negative electrode active materials, SiO, SnO, SnO2, titanium dioxide (TiO2), and lithium Lithium titanium oxide (Li4Ti5O 12 ), lithium-graphite intercalation compound (Li x C6), Oxides such as niobium pentoxide (Nb2O5), tungsten dioxide (WO2), and molybdenum dioxide (MoO2 ) can be used. Here, SiO is a compound having silicon and oxygen. If the atomic ratio of silicon to oxygen is silicon:oxygen = α:β, α preferably has a value in the vicinity of β. Having a value in the vicinity here means that, for example, the absolute value of the difference between α and β is preferably 20% or less, more preferably 10% or less, with respect to the value of β.

[0260] Further, as the negative electrode active material, Li having a Li3N-type structure, which is a complex nitride of lithium and a transition metal, Li 3-x M x N (M is Co, Ni, or Cu) can be used. For example, Li 2. 6Co 0.4 N3 exhibits a large charge-discharge capacity (900 mAh / g, 1890 mAh / cm 3 ) and is preferable.

[0261] When using a complex nitride of lithium and a transition metal, since lithium ions are contained in the negative electrode active material, it can be combined with materials such as V2O5 and Cr3O8 that do not contain lithium ions as the positive electrode active material. Even when using a material containing lithium ions for the positive electrode active material, by previously desorbing the lithium ions contained in the positive electrode active material, a complex nitride of lithium and a transition metal can be used as the negative electrode active material. If the

[0262] In addition, a material that causes a conversion reaction can also be used as the negative electrode active material. For example, transition metal oxides such as cobalt oxide (CoO), nickel oxide (NiO), and iron oxide (FeO), which do not undergo an alloying reaction with lithium, may be used as the negative electrode active material. For the conversion reaction ​Materials that can produce a response include Fe2O3, CuO, Cu2O, RuO2, and Cr2O. Third-order oxides, CoS 0.89 Sulfides such as NiS and CuS, Zn3N2, Cu3N, G Nitrides such as e3N4, phosphides such as NiP2, FeP2, CoP3, FeF3, BiF3 Examples of fluorides include the following.

[0263] The average particle size of the primary particles of the negative electrode active material is preferably, for example, 5 nm to 100 μm.

[0264] The positive electrode active material layer and the negative electrode active material layer may each contain a conductive additive.

[0265] Examples of conductive additives include carbon materials, metallic materials, or conductive ceramic materials. This is possible. In addition, fibrous materials may be used as conductive additives. The content of the conductive additive is preferably 1 wt% to 10 wt%, and preferably 1 wt% to 5 wt%. A percentage of less than % is preferable.

[0266] Conductive additives can form an electrical conduction network within the electrode. This allows for the maintenance of electrical conduction pathways between the negative electrode active materials. Conductive aids are present in the active material layer. By adding the agent, an active material layer with high electrical conductivity can be realized.

[0267] Examples of conductive additives include natural graphite, artificial graphite such as mesocarbon microbeads, and carbon fibers. Fibers can be used. For example, mesophase pitch carbon fibers can be used. Carbon fibers such as isotropic pitch carbon fibers can be used. Carbon nanofibers or carbon nanotubes can be used. Notubes can be fabricated, for example, by vapor phase growth. Also, as a conductive additive, For example, carbon black (acetylene black (AB), etc.), graphite particles. Carbon materials such as ions, graphene, and fullerenes can be used. Also, for example, copper, Nickel, aluminum, silver, gold, or other metal powders or metal fibers, or conductive ceramics Materials such as kus can be used.

[0268] Graphene in flake form possesses excellent electrical properties, including high conductivity, as well as flexibility and mechanical properties. It possesses excellent physical properties, such as mechanical strength. Therefore, graphene is used as a conductive additive. This makes it possible to increase the electrical conductivity between active materials or between active materials and current collectors.

[0269] In this specification, graphene refers to single-layer graphene or graphene with two to 100 layers. It contains multilayer graphene. Monolayer graphene is a single layer of carbon molecules with π bonds. It refers to graphene. Furthermore, graphene oxide is a compound obtained by oxidizing the above-mentioned graphene. This refers to the idea that...

[0270] Graphene enables surface contact with low contact resistance, and even when thin, it is conductive. It is extremely efficient, and even with a small amount, it can efficiently form conductive paths within the active material layer.

[0271] When using an active material with a small average particle size, for example, an active material with a particle size of 1 μm or less, the specific surface area of ​​the active material The volume is large, and more conductive paths are needed to connect the active materials. In such cases, Graphene, which has very high electrical properties and can efficiently form conductive paths even in small quantities, is used. It is especially desirable that they be there.

[0272] The positive electrode active material layer and the negative electrode active material layer may each contain a binder.

[0273] In this specification, a binder has the function of binding or adhering active materials together, and It has at least one of the functions of bonding or adhering the active material layer to the current collector. The state of the binder may change during the manufacture of electrodes or batteries. For example, the binder It may exist in at least one of the following states: liquid, solid, or gel. Also, binding The agent changes from monomer to polymer during the fabrication of electrodes or batteries. There are cases where this is the case.

[0274] For example, a water-soluble polymer can be used as a binder. Examples of water-soluble polymers include: For example, polysaccharides can be used. Examples of polysaccharides include carboxymethylcellulose. (CMC), methylcellulose, ethylcellulose, hydroxypropylcellulose, di By using cellulose derivatives such as acetylcellulose and regenerated cellulose, or starch, etc. It is possible.

[0275] Additionally, styrene-butadiene rubber (SBR) and styrene-isoprene rubber are used as binders. Tylene rubber, acrylonitrile-butadiene rubber, butadiene rubber, fluororubber, ethylene Rubber materials such as propylene-diene copolymers can be used. The material may be used in combination with the aforementioned water-soluble polymer. These rubber materials have rubber elasticity. Because it is flexible and easily expands and contracts, the active material expands and contracts during charging and discharging, or when the electrodes are bent. While it is possible to obtain electrodes that are resistant to stress and highly reliable, they also have hydrophobic groups and dissolve in water. This can be difficult. In such cases, the particles are dispersed in an aqueous solution in a state where they do not dissolve in water. Therefore, a composition containing a solvent used to form the active material layer (also called an electrode mixture composition) is applied. It can be difficult to raise the viscosity to a level suitable for weaving. In this case, viscosity adjustment function Using highly water-soluble polymers, such as polysaccharides, can be expected to moderately increase the viscosity of the solution. Furthermore, the rubber material disperses uniformly with each other, resulting in a highly uniform and excellent electrode, such as an electrode film thickness. Alternatively, electrodes with high uniformity of electrode resistance can be obtained.

[0276] Alternatively, PVdF, polystyrene, methyl polyacrylate, polymethacrylate can be used as a binder. Methyl methacrylate (polymethyl methacrylate (PMMA)), sodium polyacrylate, Polyvinyl alcohol (PVA), polyethylene oxide (PEO), polypropylene oxide Polyamide, polyimide, polyvinyl chloride, polytetrafluoroethylene, polyethylene, poly Propylene, isobutylene, polyethylene terephthalate (PET), nylon, poly Crilonitrile (PAN), polyvinyl chloride, ethylene propylene diene polymer Materials such as polyvinyl acetate and nitrocellulose can be used.

[0277] You may use a combination of two or more of the above-mentioned binding agents.

[0278] The binder content relative to the total amount of the active material layer is preferably 1 wt% to 10 wt%, and 2 wt% to 8wt% is more preferable, and 3wt% to 5wt% is even more preferable.

[0279] ≪Electrolyte≫ As the solvent for electrolyte 508, an aprotic organic solvent is preferred, for example, ethylene carbohydrate. Polyethylene carbonate (EC), propylene carbonate (PC), butylene carbonate, chloroethylene Polyethylene carbonate, vinylene carbonate (VC), γ-butyrolactone, γ-valero Lactone, dimethyl carbonate (DMC), diethyl carbonate (DEC), ethyl Methyl carbonate (EMC), methyl formate, methyl acetate, methyl butyrate, 1,3-dioxy San, 1,4-dioxane, dimethoxyethane (DME), dimethyl sulfoxide, di- Tyl ether, methyl diglyme, acetonitrile, benzonitrile, tetrahydrofurcation One of the following: sulfolane, sulfolane, sultone, or any combination of two or more of these. It can be used in ratio.

[0280] Furthermore, one ionic liquid (a room-temperature molten salt) that is flame-retardant and non-volatile is used as the solvent for the electrolyte. Alternatively, by using multiple units, the internal temperature of the energy storage device may rise due to an internal short circuit or overcharging. This can also prevent the rupture or ignition of the energy storage device. Ionic liquids contain cations and anions. It consists of and contains organic cations and anions. As organic cations used in the electrolyte, four quaternary ammonium cations, tertiary sulfonium cations, and quaternary phosphonium cations, etc. Aliphatic onium cations, as well as imidazolium cations and pyridinium cations, etc. Aromatic cations are an example. In addition, monovalent amides are used as anions in the electrolyte. Anions, monovalent methide anions, fluorosulfonate anions, perfluoroalkyl Anions of tetrafluoroborate, perfluoroalkyl volate Toanion, hexafluorophosphate toanion, or perfluoroalkyl phosphate Examples include anions.

[0281] Furthermore, when lithium ions are used as the carrier electrolyte to be dissolved in the above solvent... For example, LiPF6, LiClO4, LiAsF6, LiBF4, LiAlCl4, Li SCN, LiBr, LiI, Li2SO4, Li2B 10 Cl 10 Li2B 12 Cl1 2, LiCF3SO3, LiC4F9SO3, LiC(CF3SO2)3, LiC(C2 F5SO2)3, LiN(FSO2)2, LiN(CF3SO2)2, LiN(C4F9 One type of lithium salt such as SO2)(CF3SO2), LiN(C2F5SO2)2, or this Two or more of these can be used in any combination and ratio.

[0282] Furthermore, the electrolyte used in the energy storage device may contain granular debris or elements other than the constituent elements of the electrolyte (hereinafter, It is preferable to use a highly purified electrolyte with a low content of impurities (also simply called "impurities"). Specifically, the weight ratio of impurities to the electrolyte should be 1% or less, preferably 0.1% or less. More preferably, it is 0.01% or less.

[0283] Furthermore, the electrolyte contains vinylene carbonate (VC), propane sultone (PS), tert- Butylbenzene (TBB), fluoroethylene carbonate (FEC), LiBOB, etc. Additives may be added. The concentration of the additive should be, for example, 0.1 wt% or more relative to the total solvent. It can be reduced to 5 wt% or less.

[0284] Alternatively, a polymer gel electrolyte, obtained by swelling a polymer with an electrolyte solution, may be used.

[0285] Examples of polymers include polyalkylene oxides such as polyethylene oxide (PEO). Polymers having a d-structure, PVdF, polyacrylonitrile, etc., and copolymers containing the same. Body materials can be used. For example, a combination of PVdF and hexafluoropropylene (HFP) The polymer PVdF-HFP can be used. Furthermore, the polymer has a porous structure. You may have it.

[0286] Furthermore, polymerization initiators and crosslinking agents may be added to the electrolyte to gel the electrolyte. For example, A polymerizable functional group is introduced into the cation or anion constituting the ion liquid, and a polymerization initiator is used. The ionic liquid itself may be polymerized by polymerizing them. The liquid may be gelled using a crosslinking agent.

[0287] Furthermore, by combining it with an electrolyte, solid-state batteries containing inorganic materials such as sulfide-based or oxide-based materials are also available. Using a solid electrolyte containing desaturated polymer material such as PEO (polyethylene oxide) For example, a solid electrolyte may be formed on the surface of the active material layer. When using a combination of electrolytes, the installation of a separator or spacer may not be necessary. There is.

[0288] Furthermore, by using a polymer material that gels as the solvent for the electrolyte, the risk of leakage is reduced. The overall integrity is improved. Furthermore, it becomes possible to make energy storage devices thinner and lighter. For example, polyethylene. Oxide-based, polyacrylonitrile-based, polyvinylidene fluoride-based, polyacrylate-based, Polymethacrylate polymers can be used. Also, at room temperature (e.g., 25°C) It is preferable to use a polymer that can gel the solution. Alternatively, a silicone gel or the like may be used. It may be included. In this specification, for example, polyvinylidene fluoride polymers are defined as This refers to polymers containing poly(vinylidene fluoride-(PVdF)). Contains xafluoropropylene copolymer, etc.

[0289] Furthermore, by using FT-IR (Fourier Transform Infrared Spectrophotometer) or similar instruments, the above polymer can be determined. It can be analyzed for its properties. For example, polyvinylidene fluoride polymers can be analyzed using FT-IR. The spectrum shows absorption indicative of CF bonding. Furthermore, polyacrylonitrile polymers are... Furthermore, the spectrum obtained by FT-IR shows an absorption indicative of a C≡N bond.

[0290] ≪Separator≫ Separator 507 can be made of paper, nonwoven fabric, glass fiber, ceramics, or nylon. Polyamide, Vinylon (polyvinyl alcohol-based fiber), polyester, acrylic, Synthetic fibers such as polyolefins and polyurethanes can be used. Separator 50 7 may be a single-layer structure or a laminated structure.

[0291] More specifically, separator 507 contains, for example, a fluorine-based polymer, polyethylene oxide Polyethers such as polypropylene oxide, polyethylene, polypropylene, etc. Polyolefins, polyacrylonitriles, polyvinylidene chloride, polymethyl methacrylate , polymethyl acrylate, polyvinyl alcohol, polymethacrylonitrile, polyvinyl Acetate, polyvinylpyrrolidone, polyethyleneimine, polybutadiene, polystyrene Polyethylene, polyisoprene, polyurethane polymers, polyphenylene sulfide, and this One or two of the following are selected from their derivatives, cellulose, paper, nonwoven fabric, and glass fiber. The above can be used in combination.

[0292] Exterior Body The outer casing 509 has a surface that is in contact with the electrolyte 508, i.e., the inner surface, which is significantly in contact with the electrolyte 508. It is preferable that no reaction occurs. Also, the battery unit 500 can be accessed from outside the battery unit 500. If moisture gets inside, a reaction may occur between the components of electrolyte 508 and the water. The outer casing 509 preferably has low moisture permeability.

[0293] The outer casing 509 can be made of, for example, polyethylene, polypropylene, polycarbonate, or iono Flexible materials such as aluminum, stainless steel, copper, and nickel are applied to a film made of materials such as polymer and polyamide. A metal thin film with excellent properties is provided, and a polyamide resin is used as the outer surface of the exterior body on top of the metal thin film. A three-layer film with an insulating synthetic resin film such as polyester resin is used. Yes, it is possible. By using this three-layer structure, the permeation of electrolyte or gas is blocked, It ensures insulation and also has electrolyte resistance. The outer casing is folded inward and overlapped, or By placing the inner surfaces of the two outer casings facing each other and applying heat, the inner material The material melts, allowing the two outer casings to fuse together and creating a sealed structure.

[0294] The battery unit 500 uses a flexible outer casing 509, thereby providing a flexible structure It can be made into a flexible structure. If it is a flexible structure, the flexible part is at least It can be implemented in a power storage device or electronic device that has some features, and can be modified in the power storage device or electronic device. The battery unit 500 can also be bent.

[0295] <Configuration Example 2> Figure 16(A) shows a perspective view of the secondary battery 200, and Figure 16(B) shows a top view of the secondary battery 200. This indicates.

[0296] Figure 17(A) shows a cross-sectional view between the dashed line C1-C2 in Figure 16(B), and Figure 17( Figure B) shows a cross-sectional view between the dashed line C3 and C4 in Figure 16(B). Note that Figure 17(A) In (B), some of the components are shown in order to clarify the diagram.

[0297] The secondary battery 200 has a positive electrode 211, a negative electrode 215, and a separator 203. The 200 further includes a positive lead 221, a negative lead 225, and an outer casing 207.

[0298] The positive electrode 211 and the negative electrode 215 each have a current collector and an active material layer. The negative electrode 215 is arranged so that the active material layers face each other via a separator 203. Yes, they are.

[0299] The electrodes (positive electrode 211 and negative electrode 215) of the secondary battery 200 are located on the inner diameter side of the curve. It is preferable that the part located on the outer diameter side is longer in the direction of curvature than the other part. By using such a configuration, when the secondary battery 200 is bent with a certain curvature, the positive electrode 211 and the negative electrode The ends of the pole 215 can be aligned. That is, the positive electrode active material layer of the positive electrode 211 can be aligned. All regions can be positioned opposite the negative electrode active material layer of the negative electrode 215. Therefore, the positive electrode active material of the positive electrode 211 can be used to contribute to the battery reaction without waste. Therefore, the capacity per unit volume of the secondary battery 200 can be increased. This configuration is secondary This is particularly effective when the curvature of the secondary battery 200 is fixed when using battery 200.

[0300] The positive lead 221 is electrically connected to multiple positive leads 211. The negative lead 225 is Multiple negative electrodes 215 are electrically connected. Positive lead 221 and negative lead 225 Each has a sealing layer 220.

[0301] The outer casing 207 comprises multiple positive electrodes 211, multiple negative electrodes 215, and multiple separators 203. Covered. The secondary battery 200 has an electrolyte (not shown) in the area covered by the outer casing 207. The secondary battery 200 is sealed by bonding three sides of the outer casing 207.

[0302] In Figures 17(A) and (B), multiple strip-shaped separators 203 are used, with a positive electrode 211 and a negative electrode 2 An example in which one separator 203 is placed between each of the 15 is shown, but this is one aspect of the present invention. This is not limited to this. A single sheet of separator can be folded in a zigzag pattern (to make it accordion-like). (or, by winding, the separator is positioned between the positive and negative electrodes.) That's good too.

[0303] For example, Figures 19(A) to (D) show the method for manufacturing secondary battery 200. Using this manufacturing method Figure 18 shows a cross-sectional view of the section between the dashed lines C1 and C2 in Figure 16(B) when this condition is met.

[0304] First, the negative electrode 215 is placed on the separator 203 (Figure 19(A)). At this time, the negative electrode The negative electrode active material layer of 215 is arranged to overlap with the separator 203.

[0305] Next, bend the separator 203 and place it on top of the negative electrode 215. Then, the positive electrode 211 is placed on top of the separator 203 (Figure 19(B)). At this time, the positive electrode 21 The positive electrode active material layer of 1 is arranged to overlap with the separator 203 and the negative electrode active material layer. Furthermore, when using an electrode in which an active material layer is formed on one side of the current collector, the positive electrode 211 The positive electrode active material layer and the negative electrode active material layer of the negative electrode 215 face each other via the separator 203. Place it.

[0306] If the separator 203 is made of a heat-sealable material such as polypropylene, the separator The manufacturing process involves heat welding the areas where the 203 electrodes overlap, and then placing the next electrode on top. This can prevent the electrodes from shifting inside. Specifically, by superimposing the negative electrode 215 or the positive electrode 211 There are no such regions, and the separators 203 overlap each other, for example, region 203 in Figure 19(B). It is preferable to heat-weld the region indicated by a.

[0307] By repeating this process, the positive electrode is separated by the separator 203, as shown in Figure 19(C). 211 and the negative electrode 215 can be stacked.

[0308] Furthermore, the separator 203, which has been repeatedly folded in advance, has multiple negative electrodes 215 and multiple The positive electrodes 211 may be arranged alternately on either side.

[0309] Next, as shown in Figure 19(C), the separator 203 contains multiple positive electrodes 211 and multiple negative electrodes Covers 215.

[0310] Furthermore, as shown in Figure 19(D), there are regions where the separators 203 overlap, for example By heat welding the region 203b shown in Figure 19(D), multiple positive electrodes 211 and multiple negative electrodes 2 Cover 15 with separator 203 and tie it.

[0311] Furthermore, multiple positive electrodes 211, multiple negative electrodes 215, and separators 203 are bound together using a binding material. You can bundle them together.

[0312] In order to stack the positive electrode 211 and the negative electrode 215 in this process, the separator 203 is 1 Within the separator 203, there is a region sandwiched between the positive electrode 211 and the negative electrode 215, and multiple positive It has an electrode 211 and a region arranged to cover a plurality of negative electrodes 215.

[0313] In other words, the separator 203 of the secondary battery 200 shown in Figures 18 and 19(D) is This is a single separator with a portion folded. Folded area of ​​separator 203. Multiple positive electrodes 211 and multiple negative electrodes 215 are sandwiched between them.

[0314] <Configuration Example 3> Figure 20(A) shows a perspective view of the secondary battery 250, and Figure 20(B) shows a top view of the secondary battery 250. This is shown. Also, Figure 20(C1) shows a cross-sectional view of the first electrode assembly 230, and Figure 20(C2) shows a cross-sectional view of the first electrode assembly 230. A cross-sectional view of the second electrode assembly 231 is shown below.

[0315] The secondary battery 250 comprises a first electrode assembly 230, a second electrode assembly 231, and a separator. The secondary battery 250 has 203, a positive electrode lead 221, a negative electrode lead 225, and It has an exterior body 207.

[0316] As shown in Figure 20(C1), the first electrode assembly 230 consists of a positive electrode 211a and a separator 2 03, the negative electrode 215a, the separator 203, and the positive electrode 211a are stacked in this order. The positive electrode 211a and the negative electrode 215a each have an active material layer on both sides of the current collector. ru.

[0317] As shown in Figure 20(C2), the second electrode assembly 231 consists of a negative electrode 215a and a separator 2 03, positive electrode 211a, separator 203, and negative electrode 215a are stacked in this order. The positive electrode 211a and the negative electrode 215a each have an active material layer on both sides of the current collector. ru.

[0318] In other words, in the first electrode assembly 230 and the second electrode assembly 231, the positive electrode and the negative electrode are The active material layers are arranged facing each other via a separator 203.

[0319] The positive lead 221 is electrically connected to multiple positive leads 211. The negative lead 225 is Multiple negative electrodes 215 are electrically connected. Positive lead 221 and negative lead 225 Each has a sealing layer 220.

[0320] Figure 21 shows an example of a cross-sectional view between the dashed line C3 and C4 in Figure 20(B). In section 21, some of the components are shown in order to clarify the diagram.

[0321] As shown in Figure 21, the secondary battery 250 comprises a plurality of first electrode assemblies 230 and a plurality of second The electrode assembly 231 is covered by a wound separator 203.

[0322] The outer casing 207 comprises a plurality of first electrode assemblies 230, a plurality of second electrode assemblies 231, and The separator 203 is covered. The secondary battery 200 has an electrolyte in the area covered by the outer casing 207 (Figure (Not shown) The secondary battery 200 is sealed by bonding three sides of the outer casing 207. It is.

[0323] For example, Figures 22(A) to (D) show a method for manufacturing a secondary battery 250.

[0324] First, the first electrode assembly 230 is placed on the separator 203 (Figure 22(A)).

[0325] Next, bend the separator 203 and place the separator 203 on the first electrode assembly 230. Stack them. Next, two sets of electrodes are placed above and below the first electrode assembly 230 via the separator 203. Stack the two electrode assemblies 231 on top of each other (Figure 22(B)).

[0326] Next, the separator 203 is wound around the two sets of second electrode assemblies 231. Furthermore, above and below the two sets of second electrode assemblies 231, via separators 203, are two sets of first The electrode assembly 230 is stacked on top of each other (Figure 22(C)).

[0327] Next, the separator 203 is wrapped around the two sets of first electrode assemblies 230 (Figure 22(D)).

[0328] In this process, multiple first electrode assemblies 230 and multiple second electrode assemblies 231 are stacked. To allow for overlapping, these electrode assemblies are arranged between spirally wound separators 203. It is placed.

[0329] Furthermore, it is preferable that the outermost electrode does not have an active material layer on its exterior.

[0330] Furthermore, in Figures 20(C1) and (C2), the electrode assembly has three electrodes and two separators. Although the configuration is shown, the present invention is not limited to this. It may include four or more electrodes and three separators. The above configuration may also be used. By increasing the number of electrodes, the capacity of the secondary battery 250 can be further improved. It can be made to have two electrodes and one separator. In cases where the amount is small, a secondary battery that is more resistant to bending can be made. Also, in Figure 21, the secondary battery The 250 shows a configuration having three sets of the first electrode assembly 230 and two sets of the second electrode assembly 231. However, the present invention is not limited to this aspect. Furthermore, a configuration having more electrode assemblies is also possible. This is also good. By increasing the number of electrode assemblies, the capacity of the secondary battery 250 can be further improved. Furthermore, a configuration with fewer electrode assemblies may be used. When there are fewer electrode assemblies, This allows for the creation of a secondary battery that is more resistant to bending.

[0331] Figure 23 also shows another example of the cross-sectional view between the dashed line C3 and C4 in Figure 20(B). As shown in Figure 23, the separator 203 is folded in an accordion shape to form the first electrode assembly. A separator 203 may be placed between 230 and the second electrode assembly 231.

[0332] This embodiment can be combined with other embodiments as appropriate.

[0333] (Embodiment 3) In this embodiment, a light-emitting device that can be used in an electronic device according to one aspect of the present invention is shown in Figure This will be explained using a plane. In this embodiment, a light-emitting device mainly using organic EL elements will be used as an example. However, the present invention is not limited to this aspect.

[0334] <Configuration Example 1> Figure 24(A) shows a plan view of the light-emitting device, and the dashed line D1-D2 in Figure 24(A) An example of a cross-sectional view is shown in Figure 24(B). The light-emitting device shown in Configuration Example 1 uses a color filter method. The light-emitting device used is a top-emission type. In this embodiment, the light-emitting device is, for example, For example, a configuration in which one color is represented by three subpixels of R (red), G (green), and B (blue), R, G A configuration in which one color is represented by four subpixels of colors B, W (white), or R, G, B, Y (yellow) Configurations such as using four sub-pixels to represent one color can be applied. There are no particular limitations on the color elements. Other colors besides RGBWY may be used; for example, cyan or magenta may be used.

[0335] The light-emitting device shown in Figure 24(A) comprises a light-emitting unit 804, a drive circuit unit 806, and an FPC 808. ru.

[0336] The light-emitting device shown in Figure 24(B) consists of a flexible substrate 701, an adhesive layer 703, an insulating layer 705, and multiple layers. transistor, conductive layer 857, insulating layer 815, insulating layer 817, multiple light-emitting elements, insulating layer 821, adhesive layer 822, colored layer 845, light shielding layer 847, insulating layer 715, adhesive layer 713, average It has a flexible substrate 711. Adhesive layer 822, insulating layer 715, adhesive layer 713, and flexible The substrate 711 transmits visible light. The light-emitting elements included in the light-emitting section 804 and the drive circuit section 806 The child and transistor are connected by flexible substrate 701, flexible substrate 711, and adhesive layer 822. It is sealed.

[0337] The light-emitting part 804 is transmitted onto the flexible substrate 701 via the adhesive layer 703 and the insulating layer 705. It has a zista 820 and a light-emitting element 830. The light-emitting element 830 is located on the lower part of the insulating layer 817. Electrode 831, EL layer 833 on lower electrode 831, upper electrode 835 on EL layer 833, The lower electrode 831 is electrically connected to the source electrode or drain electrode of the transistor 820. To connect. The end of the lower electrode 831 is covered with an insulating layer 821. Lower electrode 831 It is preferable that the material reflects visible light. The upper electrode 835 transmits visible light.

[0338] Furthermore, the light-emitting section 804 has a colored layer 845 that overlaps with the light-emitting element 830 and an insulating layer 821 that overlaps with the light-emitting element 830. It has a light-shielding layer 847 and the light-emitting element 830 and the colored layer 845. The space between the light-emitting element 830 and the colored layer 845 is filled with an adhesive layer 822. It is being done.

[0339] The insulating layer 815 has the effect of suppressing the diffusion of impurities into the semiconductor that constitutes the transistor. Furthermore, the insulating layer 817 has a planarization function to reduce surface irregularities caused by the transistor. It is preferable to select an insulating layer having such a material. When an organic material is used as the insulating layer 817, Light is emitted from the transistor or light-emitting element 830, etc., through the insulating layer 817 exposed at the end of the light-emitting device. There is a risk of impurities such as moisture entering the optical device from the outside. The intrusion of impurities may cause transients. If the star or light-emitting element 830 deteriorates, it will lead to deterioration of the light-emitting device. Therefore, Figure 24 ( As shown in B), etc., an opening is provided in the insulating layer 817 that reaches the inorganic film (here, the insulating layer 815). Even if impurities such as moisture enter from outside the light-emitting device, the transistor or light-emitting element 830 It is preferable to have a structure that makes it difficult to reach the end. It may be formed in a way that prevents it from being placed down.

[0340] The drive circuit section 806 is connected to the flexible substrate 701 via the adhesive layer 703 and the insulating layer 705. It has multiple transistors. In Figure 24(B), the transistors in the drive circuit section 806 are... This shows a single transistor.

[0341] The insulating layer 705 and the flexible substrate 701 are bonded together by an adhesive layer 703. The edge layer 715 and the flexible substrate 711 are bonded together by an adhesive layer 713. Insulating layer 70 If a highly moisture-resistant film is used for at least one of 5 and the insulating layer 715, the light-emitting element 83 This prevents impurities such as water from entering transistor 820, improving the reliability of the light-emitting device. This is preferable because it increases the value.

[0342] The conductive layer 857 has an external input terminal that transmits an external signal or potential to the drive circuit section 806. Connect electrically. Here, we show an example where an FPC808 is provided as an external input terminal. To prevent an increase in the number of steps, the conductive layer 857 is used for electrodes or components in the light-emitting part or drive circuit part. It is preferable to manufacture it using the same material and process as the wire. Here, the conductive layer 857 is made of This shows an example of a component fabricated using the same materials and process as the electrodes that make up the Rangista 820.

[0343] In the light-emitting device shown in Figure 24(B), the FPC808 is located on the flexible substrate 711. Body 825 consists of a flexible substrate 711, an adhesive layer 713, an insulating layer 715, an adhesive layer 822, and an insulating layer 8 17, and it is connected to the conductive layer 857 through an opening provided in the insulating layer 815. Connector 825 is connected to FPC808. Layer 857 is electrically connected. When conductive layer 857 and flexible substrate 711 overlap, By opening the flexible substrate 711 (or using a substrate having an opening), the conductive layer 857, The connector 825 and the FPC808 can be electrically connected.

[0344] Figures 24(A) and (B) show modified versions of the light-emitting device. Figure 25(A) is a plan view of the light-emitting device. This is shown, and an example of a cross-sectional view between the dashed-dotted line D3-D4 in Figure 25(A) is shown in Figure 25(B). Furthermore, an example of a cross-sectional view between the dashed-dotted line D5-D6 in Figure 25(A) is shown in Figure 26(A). show.

[0345] The light-emitting device shown in Figures 25(A) and (B) is the size of the flexible substrate 701 and the flexible substrate 711. This is an example of a case where the FPC808 is located on the insulating layer 715 and the flexible substrate 711 is They do not overlap. The connector 825 consists of an insulating layer 715, an adhesive layer 822, an insulating layer 817, and an insulating layer It is connected to the conductive layer 857 through an opening provided in 815. Since there is no need to provide a flexible substrate, the material of the flexible substrate 711 is not limited.

[0346] Furthermore, the insulating layer formed using an organic resin with low gas barrier or moisture resistance is at the edge of the light-emitting device. It is preferable that the part not be exposed. With this configuration, the side of the light-emitting device is not exposed. The intrusion of pure substances can be suppressed. For example, as shown in Figures 25(B) and 26(A), The light-emitting device may be configured without providing an insulating layer 817 at its ends.

[0347] Furthermore, a modified example of the light-emitting section 804 is shown in Figure 26(B).

[0348] The light-emitting device shown in Figure 26(B) has insulating layer 817a and insulating layer 817b, and insulating layer 81 A conductive layer 856 is provided on 7a. The source electrode or drain electrode of transistor 820, The lower electrode of the light-emitting element 830 is electrically connected to the conductive layer 856.

[0349] The light-emitting device shown in Figure 26(B) has a spacer 823 on the insulating layer 821. By providing 23, the distance between the flexible substrate 701 and the flexible substrate 711 can be adjusted. ru.

[0350] The light-emitting device shown in Figure 26(B) has an overcoat 8 covering the colored layer 845 and the light-shielding layer 847. It has 49. The space between the light-emitting element 830 and the overcoat 849 is filled with an adhesive layer 822. Yes, they are.

[0351] Furthermore, a modified example of the light-emitting element 830 is shown in Figure 26(C).

[0352] As shown in Figure 26(C), the light-emitting element 830 has a lower electrode 831 and an EL layer 833. An optical adjustment layer 832 may be provided in between. The optical adjustment layer 832 may contain a light-transmitting guide It is preferable to use electrolytic materials. Color filter (colored layer) and microcavity structure When combined with the (optical adjustment layer), the light-emitting device according to one aspect of the present invention produces a high color purity. Light can be extracted. The thickness of the optical adjustment layer is changed according to the emission color of each subpixel. .

[0353] <Configuration Example 2> The light-emitting device shown in Figure 26(D) consists of a flexible substrate 701, an adhesive layer 703, an insulating layer 705, and a conductive Layer 814, conductive layer 857a, conductive layer 857b, light-emitting element 830, insulating layer 821, adhesive layer 7 It has 13 and a flexible substrate 711.

[0354] The conductive layers 857a and 857b are external connection electrodes for the light-emitting device, and are electrically connected to FPC and the like. It can be connected to a target.

[0355] The light-emitting element 830 has a lower electrode 831, an EL layer 833, and an upper electrode 835. The end of electrode 831 is covered with insulating layer 821. The light-emitting element 830 is bottom emission It is either a single-ended, top-emission, or dual-emission type. The electrodes, substrate, insulating layer, etc., are all transparent to visible light. The conductive layer 814 is connected to the lower electrode 831. To connect electrically.

[0356] The substrate that extracts light has a light extraction structure consisting of a hemispherical lens, a microlens array, The material may have a film with an uneven surface, a light-diffusing film, etc. For example, a resin substrate. The above lens or film is placed on top of the substrate or the lens or film, with a refractive index similar to that of the substrate or the lens or film. A substrate having a light extraction structure is formed by bonding it using an adhesive or the like. It is possible.

[0357] The conductive layer 814 is not necessarily required, but it does not cause a voltage drop due to the resistance of the lower electrode 831. It is preferable to provide it because it can suppress the electrical effect. Also, for the same purpose, the upper electrode 835 and electrical effect A conductive layer for direct connection is provided on the insulating layer 821, the EL layer 833, or the upper electrode 835, etc. You may leave it.

[0358] The conductive layer 814 is made of copper, titanium, tantalum, tungsten, molybdenum, chromium, and neodymium. Materials selected from scandium, nickel, and aluminum, or compounds mainly composed of these materials. It can be formed using gold material, etc., as a single layer or in layers. The thickness of the conductive layer 814 is For example, it can be 0.1 μm or more and 3 μm or less, preferably 0.1 μm or more and 0. It is 5 μm or less.

[0359] <Configuration Example 3> Figure 25(A) shows a plan view of the light-emitting device, and the dashed line D3-D4 in Figure 25(A) An example of a cross-sectional view is shown in Figure 27(A). The light-emitting device shown in Configuration Example 3 uses a color filter method. This is a bottom-emission type light-emitting device used.

[0360] The light-emitting device shown in Figure 27(A) consists of a flexible substrate 701, an adhesive layer 703, an insulating layer 705, and multiple layers. The transistor, conductive layer 857, insulating layer 815, colored layer 845, insulating layer 817a, insulating layer 817b, conductive layer 856, multiple light-emitting elements, insulating layer 821, adhesive layer 713, and flexible group It has a plate 711. Flexible substrate 701, adhesive layer 703, insulating layer 705, insulating layer 815, The edge layer 817a and the insulating layer 817b transmit visible light.

[0361] The light-emitting part 804 is transmitted onto the flexible substrate 701 via the adhesive layer 703 and the insulating layer 705. It has a zista 820, a transistor 824, and a light-emitting element 830. The light-emitting element 830 is Lower electrode 831 on insulating layer 817b, EL layer 833 on lower electrode 831, and EL layer 83 3 has an upper electrode 835 and a lower electrode 831 which is the source of transistor 820. It is electrically connected to the electrode or drain electrode. The end of the lower electrode 831 is covered with an insulating layer 821. The upper electrode 835 preferably reflects visible light. The lower electrode 831 reflects visible light. It transmits light. The position in which the colored layer 845 overlapping the light-emitting element 830 is provided is not particularly limited, for example For example, between insulating layer 817a and insulating layer 817b, or between insulating layer 815 and insulating layer 817a, etc. It can be installed in [location].

[0362] The drive circuit section 806 is connected to the flexible substrate 701 via the adhesive layer 703 and the insulating layer 705. It has multiple transistors. In Figure 27(A), the transistors in the drive circuit section 806 are This shows two transistors.

[0363] The insulating layer 705 and the flexible substrate 701 are bonded together by an adhesive layer 703. If a highly moisture-resistant film is used for 05, the light-emitting element 830, the transistor 820, or the transistor This prevents impurities such as water from entering the STA824, thereby increasing the reliability of the light-emitting device. preferable.

[0364] The conductive layer 857 has an external input terminal that transmits an external signal or potential to the drive circuit section 806. Connect electrically. Here, we show an example where an FPC808 is provided as an external input terminal. Furthermore, in this case, the conductive layer 857 was fabricated using the same material and process as the conductive layer 856. Here is an example.

[0365] <Configuration Example 4> Figure 25(A) shows a plan view of the light-emitting device, and the dashed line D3-D4 in Figure 25(A) An example of a cross-sectional view is shown in Figure 27(B). The light-emitting device shown in Configuration Example 4 uses a color-coding method. It is a top-emission type light-emitting device.

[0366] The light-emitting device shown in Figure 27(B) consists of a flexible substrate 701, an adhesive layer 703, an insulating layer 705, and multiple layers. transistor, conductive layer 857, insulating layer 815, insulating layer 817, multiple light-emitting elements, insulating layer It has 821, a spacer 823, an adhesive layer 713, and a flexible substrate 711. Adhesive layer 713 The flexible substrate 711 transmits visible light.

[0367] In the light-emitting device shown in Figure 27(B), the connector 825 is located on the insulating layer 815. 25 is connected to the conductive layer 857 through an opening provided in the insulating layer 815. The connector 825 is connected to the FPC808. The FPC808 and the conductive layer are connected via the connector 825. 857 connects electrically.

[0368] <Example of materials> Next, we will describe materials that can be used in light-emitting devices. Explanations of the structure may be omitted.

[0369] Materials such as glass, quartz, organic resin, metal, alloy, and semiconductor can be used for the substrate. The substrate on the side that extracts light from the light-emitting element uses a material that transmits the light.

[0370] In particular, it is preferable to use a flexible substrate. For example, an organic resin or a material having a degree of flexibility. Glass, metal, or alloy of a certain thickness can be used. For example, the thickness of the flexible substrate The particle size is preferably 1 μm to 200 μm, and more preferably 1 μm to 100 μm. A thickness of 10 μm or more and 50 μm or less is more preferable, and a thickness of 10 μm or more and 25 μm or less is even more preferable. stomach.

[0371] Because organic resins have a lower specific gravity than glass, using organic resin as a flexible substrate results in... This method allows for a light-emitting device to be made lighter compared to using lath, which is preferable.

[0372] It is preferable to use a material with high toughness for the substrate. This results in excellent impact resistance and breakage. This makes it possible to create light-emitting devices that are difficult to manufacture. For example, an organic resin substrate, or a thin metal substrate or By using an alloy substrate, it is lighter and less prone to breakage compared to using a glass substrate. This makes it possible to create a light-emitting device.

[0373] Metallic and alloy materials have high thermal conductivity and can easily conduct heat throughout the substrate, so light-emitting devices It is preferable that the localized temperature rise in the area can be suppressed. The substrate thickness is preferably 10 μm to 200 μm, and 20 μm to 50 μm. It is preferable to do so.

[0374] There are no particular limitations on the material that constitutes the metal substrate or alloy substrate, but for example, aluminum We prefer alloys of metals such as copper, nickel, aluminum alloys, or stainless steel. It can be used appropriately. Examples of materials that make up the semiconductor substrate include silicon. .

[0375] Furthermore, using a material with high thermal emissivity for the substrate helps to suppress the rise in the surface temperature of the light-emitting device. This can be done to suppress damage to the light-emitting device or a decrease in reliability. For example, the substrate is a metal substrate and thermal radiation Laminated structure with a high ratio of layers (for example, metal oxide or ceramic material can be used) That is also acceptable.

[0376] Examples of materials that are flexible and translucent include polyethylene terephthalate (PET). ), polyester resins such as polyethylene naphthalate (PEN), polyacrylonitrile Resins, polyimide resins, polymethyl methacrylate resins, polycarbonate (PC) resins Polyethersulfone (PES) resin, polyamide resin (nylon, aramid, etc.), Croolefin resin, polystyrene resin, polyamide-imide resin, polyvinyl chloride resin, Examples include polytetrafluoroethylene (PTFE) resins. In particular, those with a low coefficient of linear thermal expansion. It is preferable to use materials such as polyamide-imide resin, polyimide resin, and polyamide-imide resin. Mid resin, PET, etc. can be suitably used. Also, a substrate in which resin is impregnated into a fibrous material ( A substrate (also called a prepreg), or a substrate in which an inorganic filler is mixed with an organic resin to lower the coefficient of thermal expansion. It can also be used.

[0377] As a flexible substrate, the layer using the above material protects the surface of the device from scratches and other damage. A layer (e.g., a silicon nitride layer), or a layer of material capable of dispersing pressure (e.g., an aluminum layer) It may be constructed by laminating with a mid-resin layer, etc.

[0378] Flexible substrates can also be used by stacking multiple layers. In particular, a configuration having a glass layer This improves the barrier properties against water or oxygen, resulting in a highly reliable light-emitting device. Cut.

[0379] For example, a flexible substrate in which a glass layer, an adhesive layer, and an organic resin layer are laminated from the side closest to the light-emitting element. The glass layer can be used. The thickness of the glass layer is preferably 20 μm or more and 200 μm or less. Alternatively, the thickness should be between 25 μm and 100 μm. Glass layers of this thickness are protected from water or oxygen. It can simultaneously achieve high barrier properties and flexibility. Also, the thickness of the organic resin layer is 1 The particle size should be 0 μm or more and 200 μm or less, preferably 20 μm or more and 50 μm or less. By providing a resin layer, cracking or breakage of the glass layer is suppressed, and mechanical strength is improved. This can be achieved by applying such a composite material of glass material and organic resin to a substrate. This makes it possible to create an extremely reliable and flexible light-emitting device.

[0380] The adhesive layer can be a light-curing adhesive such as UV-curing type, a reaction-curing adhesive, a thermosetting adhesive, or Various types of curing adhesives, such as gas-type adhesives, can be used. Additionally, adhesive sheets can be used. That's good too.

[0381] Furthermore, the adhesive layer may contain a desiccant. For example, an alkaline earth metal oxide (oxidation Using a substance that adsorbs moisture by chemical adsorption, such as calcium or barium oxide. It is possible to remove moisture by physical adsorption, such as with zeolite or silica gel. A substance that adsorbs impurities may be used. If a desiccant is included, moisture and other impurities will be absorbed into the functional element. This is preferable because it can prevent intrusion and improve the reliability of the light-emitting device.

[0382] Furthermore, by including a filler or light-scattering material with a high refractive index in the adhesive layer, light from the light-emitting element can be reduced. Light extraction efficiency can be improved. For example, titanium dioxide, barium oxide, zeola Metal, zirconium, etc., can be used.

[0383] For insulating layer 705 and insulating layer 715, a highly moisture-resistant insulating film can be used. Preferably, the insulating layer 705 and the insulating layer 715 each contain impurities to the light-emitting element. It is preferable that the material has a function to prevent diffusion.

[0384] Examples of highly moisture-resistant insulating films include silicon nitride films and silicon nitride oxide films, which contain nitrogen and silicon. Examples include films containing nitrogen and aluminum, such as aluminum nitride films. Silicon oxide films, silicon oxide nitride films, aluminum oxide films, etc., may also be used.

[0385] For example, the water vapor transmission rate of a highly moisture-resistant insulating film is 1 × 10⁻⁶ -5 [g / (m 2 ·day)] The following is preferably 1 × 10 -6 [g / (m 2 ·day) Below, more preferably 1 × 10 -7 [g / (m 2 (day) More preferably 1 x 10 -8 [g / (m 2 ·da y) and below.

[0386] In the light-emitting device, at least one of the insulating layer 705 or the insulating layer 715 is used to emit light from the light-emitting element. It is necessary to allow light to pass through. Of the insulating layer 705 or insulating layer 715, the light emitted from the light-emitting element must be allowed to pass through. The insulating layer on one side is more effective than the insulating layer on the other side at wavelengths between 400 nm and 800 nm. A high average transmittance is preferable.

[0387] The structure of the transistors in the light-emitting device is not particularly limited. For example, staggered transistors It can be a standard transistor, or an inverse staggered transistor. Also, a top-gate type or The transistor structure may be any bottom-gate type. The material is not particularly limited and examples include silicon, germanium, and organic semiconductors. Alternatively, a small amount of indium, gallium, and zinc, such as In-Ga-Zn metal oxides. Alternatively, an oxide semiconductor containing at least one of these elements may be used.

[0388] The crystallinity of semiconductor materials used in transistors is not particularly limited; amorphous semiconductors, Crystalline semiconductors (microcrystalline semiconductors, polycrystalline semiconductors, single-crystal semiconductors, or semiconductors with a crystalline region in part) Any semiconductor having the properties of [the semiconductor] may be used. If a semiconductor having crystalline properties is used, transients may occur. This is preferable because it suppresses the deterioration of the stanic characteristics.

[0389] In one aspect of the present invention, the semiconductor material used in the transistor is CAAC-OS(CA xis Aligned Crystalline Oxide Semiconductor It is preferable to use tor. Unlike amorphous materials, CAAC-OS has fewer defect levels. Furthermore, it can improve the reliability of transistors. In addition, CAAC-OS has a clear grain boundary. Because it has the characteristic of not being recognized, it is possible to form a stable and uniform film over a large area. Furthermore, the stress caused when the flexible light-emitting device is bent causes clumping in the CAAC-OS film. It is less likely to cause problems.

[0390] CAAC-OS is a crystalline oxide semiconductor in which the c-axis of the crystal is oriented approximately perpendicular to the film surface. This is the case. Another crystal structure of oxide semiconductors is a nanoscale aggregate of microcrystals, n It has been confirmed that a variety of structures exist that differ from single crystals, such as ano-crystals (nc). It is recognized that CAAC-OS has lower crystallinity than single crystals and higher crystallinity compared to nc. stomach.

[0391] It is preferable to provide an undercoat to stabilize the characteristics of the transistor. The undercoat may be: Inorganic silicon oxide films, silicon nitride films, silicon oxide-nitride films, silicon nitride-oxide films, etc. It can be fabricated using an insulating film, either as a single layer or in a multilayer configuration. The underlayer is fabricated by sputtering. CVD (Chemical Vapor Deposition) method (Plasma CVD method) , thermal CVD method, MOCVD (Metal Organic CVD) method, ALD ( Formed using methods such as Atomic Layer Deposition, coating, and printing. Yes, it is possible. Note that the undercoat does not need to be provided if it is not necessary. In each of the above configuration examples, the insulating layer The 705 can also serve as the underlayer for the transistor.

[0392] As the light-emitting element, a self-emitting element can be used, and the brightness is controlled by current or voltage. This category includes elements that are controlled by [something]. For example, light-emitting diodes (LEDs), organic E Inductive elements, inorganic electroluminescent elements, etc., can be used.

[0393] Light-emitting elements include top-emission type, bottom-emission type, and dual-emission type. Either method is acceptable. The electrode that extracts light uses a conductive film that transmits visible light. Furthermore, it is preferable to use a conductive film that reflects visible light on the electrode that does not extract light. .

[0394] Conductive films that transmit visible light include, for example, indium oxide and indium tin oxide (ITO:I). Indium zinc oxide, zinc oxide (ZnO), gallium It can be formed using zinc oxide with added um, etc. Also, gold, silver, platinum, magnesium Nesium, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium Metal materials such as titanium, alloys containing these metal materials, or nitrogen from these metal materials The material (for example, titanium nitride) can also be used by forming it thinly enough to be translucent. This can be done. In addition, the laminated film of the above materials can be used as a conductive film. For example, silver and ma Using a magnesium alloy and ITO multilayer film can improve conductivity, which is desirable. It seems so. Alternatively, graphene or similar materials may be used.

[0395] Examples of conductive films that reflect visible light include aluminum, gold, platinum, silver, nickel, and tungsten. Metal materials such as tetracellulose, chromium, molybdenum, iron, cobalt, copper, or palladium, Alloys containing these metal materials can be used. In addition, if the above metal material or alloy contains ran It may also contain tannins, neodymium, or germanium. Tan alloy, aluminum and nickel alloy, aluminum and neodymium alloy, aluminum Aluminum-containing alloys such as aluminum-nickel-lanthanum alloys (Al-Ni-La) (Aluminum alloy), silver and copper alloy, silver, palladium and copper alloy (Ag-Pd-Cu, (Also written as APC), it can be formed using silver-containing alloys such as silver-magnesium alloys. It is possible. Alloys containing silver and copper are preferred because they have high heat resistance. Furthermore, an aluminum alloy film By laminating a metal film or metal oxide film in contact with it, oxidation of the aluminum alloy film is suppressed. This is possible. Examples of materials for the metal film and metal oxide film include titanium and titanium oxide. It is possible to laminate a conductive film that transmits visible light with a film made of a metal material. For example, multilayer films of silver and ITO, or multilayer films of a silver-magnesium alloy and ITO can be used. It is possible.

[0396] The electrodes can be formed using either a vapor deposition method or a sputtering method. Alternatively, using an ejection method such as inkjet printing, a printing method such as screen printing, or a plating method. It can be formed by doing so.

[0397] A voltage higher than the threshold voltage of the light-emitting element is applied between the lower electrode 831 and the upper electrode 835. Then, holes are injected into the EL layer 833 from the anode side, and electrons are injected from the cathode side. The electrons and holes recombine in the EL layer 833, causing the light-emitting material in the EL layer 833 to emit light. do.

[0398] The EL layer 833 has at least an emissive layer. The EL layer 833 has layers other than the emissive layer, Materials with high hole injection potential, materials with high hole transport potential, hole blocking materials, materials with high electron transport potential , substances with high electron injection properties, or bipolar substances (substances with high electron transport and hole transport properties) It may further have layers containing (quality, etc.).

[0399] The EL layer 833 can use either low molecular weight compounds or high molecular weight compounds, and is inorganic. It may contain compounds. Each layer constituting the EL layer 833 is deposited by a vapor deposition method (vacuum deposition). It can be formed by methods such as (including) transfer, printing, inkjet, and coating. ru.

[0400] The light-emitting element 830 may contain two or more types of light-emitting materials. This allows for, for example, white light to be emitted. It is possible to realize a light-emitting element that emits colored light. For example, the light emission of each of two or more types of light-emitting materials White light emission can be obtained by selecting light-emitting materials that are complementary in color. For example, light-emitting objects that emit light in colors such as R (red), G (green), B (blue), Y (yellow), or O (orange). Using a light-emitting material that exhibits emission containing two or more spectral components of colors from R, G, and B. This can be done by using a light-emitting material that emits blue light and a light-emitting material that emits yellow light. This is also acceptable. In this case, the emission spectrum of the light-emitting substance that exhibits yellow emission is the spectrum of green and red It is preferable that the component is included. Also, the emission spectrum of the light-emitting element 830 is in the visible wavelength range. (For example, within the range of 350nm to 750nm, or 400nm to 800nm, etc.) It is preferable to have two or more peaks within the enclosed area.

[0401] The EL layer 833 may have multiple light-emitting layers. The layers may be stacked in contact with each other, or they may be stacked with a separation layer in between. For example, a separation layer may be provided between the fluorescent emission layer and the phosphorescent emission layer.

[0402] The separation layer, for example, is formed from the excited state of the phosphorescent material generated in the phosphorescent layer to the fluorescence in the fluorescent layer. To prevent energy transfer to materials via the Dexter mechanism (especially triplet energy transfer) It can be provided in [location]. The separation layer only needs to be a few nanometers thick. Specifically, 0.1n m to 20nm or less, or 1nm to 10nm or less, or 1nm to 5nm or less The separation layer is made of a single material (preferably a bipolar material) or multiple materials (preferably This includes hole-transporting materials and electron-transporting materials.

[0403] The separation layer may be formed using the material contained in the light-emitting layer that is in contact with the separation layer. This makes it easier to fabricate light-emitting devices and reduces the driving voltage. For example, if the phosphorescent light-emitting layer is When the separation layer consists of a host material, an assist material, and a phosphorescent material (guest material), the host It may be formed from a striker material and an assisting material. In other words, the above configuration is a phosphorescent material. The phosphorescent layer has a region that does not contain phosphorescent material, and the phosphorescent layer has a region that contains phosphorescent material. It becomes possible to deposit the abscission layer and the phosphorescent layer with or without the phosphorescent material. By doing so, it becomes possible to deposit the separation layer and the phosphorescent layer in the same chamber. This allows for a reduction in manufacturing costs.

[0404] Furthermore, the light-emitting element 830 may be a single element having one EL layer, or it may generate charge It may also be a tandem element having multiple EL layers stacked with layers in between.

[0405] The light-emitting element is preferably placed between a pair of highly moisture-resistant insulating films. This prevents impurities such as water from entering the light-emitting element, thus suppressing a decrease in the reliability of the light-emitting device. Yes, it is possible. Specifically, as described above, the insulating layer 705 and insulating layer 715 are made of materials with high moisture resistance. When a high-performance insulating film is used, the light-emitting element is positioned between a pair of highly moisture-resistant insulating films, and the signal of the light-emitting device is... It can suppress the decline in reliability.

[0406] Examples of insulating layer 815 include silicon oxide film, silicon oxide nitride film, aluminum oxide film. Inorganic insulating films such as aluminum films can be used. Also, insulating layer 817, insulating layer 817a, and For example, the insulating layer 817b can be polyimide, acrylic, polyamide, or polyimide. Organic materials such as mido and benzocyclobutene resins can be used. Dielectric constant materials (low-k materials), etc., can be used. Furthermore, multiple insulating films can be stacked. By doing so, each insulating layer may be formed.

[0407] The insulating layer 821 is formed using an organic insulating material or an inorganic insulating material. For example, polyimide resin, polyamide resin, acrylic resin, siloxane resin, epoxy Resins, or phenolic resins, etc., can be used. In particular, photosensitive resin materials can be used for the lower part. An opening is formed on the electrode 831, and the side wall of the opening is formed as an inclined surface with curvature. It is preferable to form it in such a way.

[0408] The method for forming the insulating layer 821 is not particularly limited. For example, photolithography, spat Evaporative methods, vapor deposition, droplet ejection (inkjet, etc.), printing methods (screen printing, offset printing) Printing (or similar methods) can be used.

[0409] Spacer 823 can be formed using inorganic insulating materials, organic insulating materials, metal materials, etc. For example, inorganic insulating materials or organic insulating materials can be used in the insulating layer. Various materials can be used. Examples of metallic materials include titanium and aluminum. Yes, it is possible. The configuration involves electrically connecting the spacer 823 containing conductive material with the upper electrode 835. This suppresses the potential drop caused by the resistance of the upper electrode 835. Also, spacer 8 23 may have a forward taper shape or a reverse taper shape.

[0410] A light-emitting device that functions as an electrode or wiring for a transistor, or as an auxiliary electrode for a light-emitting element. The conductive layer used is, for example, molybdenum, titanium, chromium, tantalum, tungsten, and Metallic materials such as luminium, copper, neodymium, scandium, or alloy materials containing these elements. It can be formed as a single layer or in layers using [a specific material]. Furthermore, the conductive layer may be made of a conductive metal acid. It may also be formed using an oxide. Examples of conductive metal oxides include indium oxide (In2O3). (etc.), tin oxide (SnO2, etc.), ZnO, ITO, indium zinc oxide (In2O3- (ZnO, etc.) or materials containing silicon oxide can be used. Cut.

[0411] A colored layer is a colored layer that transmits light in a specific wavelength range. For example, red, green, blue, or A color filter that transmits light in the yellow wavelength range can be used. Each colored layer is Etching is performed using various materials, including printing, inkjet, and photolithography methods. They are formed at the desired positions using methods such as molding. In addition, in the case of white sub-pixels, the light-emitting element overlaps with the sub-pixel. A transparent or white resin may be placed on top.

[0412] The light-shielding layer is placed between adjacent colored layers. The light-shielding layer blocks light from adjacent light-emitting elements. To block light and suppress color mixing between adjacent light-emitting elements, the edges of the colored layer are separated by a light-blocking layer. By providing it so that it overlaps with the other, light leakage can be suppressed. As for the light-shielding layer, Materials that block light emission from the optical element can be used, such as metallic materials, pigments, or dyes. A black matrix can be formed using a resin material containing a light-shielding agent. If placed in areas other than the light-emitting section, such as the drive circuit section, unintended light leakage due to guided light, etc. It is preferable because it can be suppressed.

[0413] Furthermore, an overcoat may be provided to cover the colored layer and the light-shielding layer. This prevents impurities contained in the colored layer from diffusing into the light-emitting element. The bar coat is made of a material that transmits light from the light-emitting element, such as a silicon nitride film. Using an inorganic insulating film such as a silicon oxide film, or an organic insulating film such as an acrylic film or a polyimide film This can be done, and a laminated structure of an organic insulating film and an inorganic insulating film may also be used.

[0414] Furthermore, when applying the adhesive layer material onto the colored layer and light-shielding layer, the overcoat material is It is preferable to use a material with high wettability for the adhesive layer material. For example, overcoat The material used is an oxide conductive film such as an ITO film, or a metal such as an Ag film that is thin enough to be translucent. It is preferable to use a membrane.

[0415] By using a material with high wettability relative to the adhesive layer material for the overcoat, adhesion is achieved. The layer material can be applied uniformly. This makes it possible to bond a pair of substrates together. This helps to prevent foam from getting mixed in and thus reduces display defects.

[0416] Various anisotropic conductive films (ACF) can be used as connectors. ductive film), or anisotropic conductive paste (ACP: Anisotropic You can use things like (c) Conductive Paste.

[0417] As described above, one aspect of the present invention can be applied to light-emitting devices, display devices, input / output devices, etc. It is possible. As a display element, for example, EL elements (EL elements including organic and inorganic materials, organic E L elements, inorganic EL elements), LEDs (white LEDs, red LEDs, green LEDs, blue LEDs, etc.) (e.g., liquid crystal elements, electrophoretic elements, MEMS (micro-electro-mechanical systems)) Examples include display elements using (M).

[0418] Furthermore, a light-emitting device according to one aspect of the present invention may be used as a display device or as an illumination device. It may be. For example, a light source such as a backlight or frontlight, i.e., a display device It can also be used as a lighting device for that purpose.

[0419] This embodiment can be combined with other embodiments as appropriate.

[0420] (Embodiment 4) In this embodiment, the present invention relates to an input / output device that can be used in an electronic device according to one aspect of the present invention. The following will be explained using drawings. Note that the components of the input / output device will be explained in Embodiment 3. For components similar to those of the light-emitting device described above, please also refer to the previous description. It is possible. In addition, this embodiment illustrates a touch panel using a light-emitting element, but this It's not limited.

[0421] <Configuration Example 1> Figure 28(A) is a top view of the input / output device. Figure 28(B) is a top view of Figure 28(A) from the dashed line A- This is a cross-sectional view between B and the dashed line C-. Figure 28(C) is a cross-sectional view of Figure 28(A) along the dashed line E- This is a cross-sectional view between F's points.

[0422] The touch panel 390 shown in Figure 28(A) includes a display unit 301 (which also serves as an input unit) and a scan line drive. Driving circuit 303g(1), image pixel driving circuit 303g(2), image signal line driving circuit 303s (1) and the imaging signal line driving circuit 303s(2) are included.

[0423] The display unit 301 has a plurality of pixels 302 and a plurality of imaging pixels 308.

[0424] Pixel 302 has multiple sub-pixels. Each sub-pixel has a light-emitting element and a pixel circuit.

[0425] The pixel circuit can supply power to drive the light-emitting element. The pixel circuit receives a selection signal. It is electrically connected to the wiring that can supply the signal. The pixel circuit also supplies the image signal. It can be wired and electrically connected.

[0426] The scan line drive circuit 303g(1) can supply a selection signal to the pixel 302.

[0427] The image signal line driving circuit 303s(1) can supply image signals to the pixels 302.

[0428] A touch sensor can be configured using the imaging pixels 308. Specifically, imaging pixels 3 08 can detect fingers or other objects touching the display unit 301.

[0429] The imaging pixel 308 has a photoelectric conversion element and an imaging pixel circuit.

[0430] The imaging pixel circuit can drive the photoelectric conversion element. The imaging pixel circuit provides control signals. It is electrically connected to the wiring that can supply power. In addition, the imaging pixel circuit is supplied with power potential. It can be wired and electrically connected.

[0431] One example of a control signal is selecting the imaging pixel circuit that reads out the recorded imaging signal. A signal that can do this, a signal that can initialize the imaging pixel circuit, and a signal that the imaging pixel circuit detects light Examples include signals that can determine the timing of notification.

[0432] The image pixel driving circuit 303g(2) can supply control signals to the image pixel 308. .

[0433] The imaging signal line driving circuit 303s(2) can read out the imaging signal.

[0434] As shown in Figures 28(B) and (C), the touch panel 390 consists of a flexible substrate 701 and an adhesive layer It comprises 703, an insulating layer 705, a flexible substrate 711, an adhesive layer 713, and an insulating layer 715. Furthermore, the flexible substrate 701 and the flexible substrate 711 are bonded together by an adhesive layer 360.

[0435] The flexible substrate 701 and the insulating layer 705 are bonded together with an adhesive layer 703. The plate 711 and the insulating layer 715 are bonded together with an adhesive layer 713. Substrate, adhesive layer, and insulating layer For materials that can be used for the layers, please refer to Embodiment 3.

[0436] Pixel 302 has sub-pixels 302R, 302G, and 302B (Figure 28). (C)). In addition, sub-pixel 302R has a light-emitting module 380R, and sub-pixel 302G has a light-emitting module It has an optical module 380G, and the sub-pixel 302B has an emissive module 380B.

[0437] For example, sub-pixel 302R has a light-emitting element 350R and a pixel circuit. The pixel circuit has a light-emitting element It includes a transistor 302t that can supply power to child 350R. Also, an emitting module The element 380R consists of a light-emitting element 350R and an optical element (for example, a colored layer 3 that transmits red light). It has 67R).

[0438] The light-emitting element 350R has the lower electrode 351R, the EL layer 353, and the upper electrode 352 in this order. They are stacked (Figure 28(C)).

[0439] The EL layer 353 consists of a first EL layer 353a, an intermediate layer 354, and a second EL layer 353b. They are stacked in the following order.

[0440] Furthermore, to efficiently extract light of a specific wavelength, the light-emitting module 380R has a micro A cavity structure can be incorporated. Specifically, it allows for the efficient extraction of specific types of light. Even if an EL layer is placed between a film that reflects visible light and a film that semi-reflects and semi-transmits light, good.

[0441] For example, the light-emitting module 380R has an adhesive layer in contact with the light-emitting element 350R and the colored layer 367R. It has 360. The colored layer 367R is located in a position that overlaps with the light-emitting element 350R. As a result, A portion of the light emitted by the light-emitting element 350R passes through the adhesive layer 360 and the colored layer 367R, as shown in Figure As shown by the arrow inside, the light is emitted to the outside of the light-emitting module 380R.

[0442] The touch panel 390 has a light-shielding layer 367BM. The light-shielding layer 367BM is a colored layer (for example) It is provided so as to surround the colored layer 367R.

[0443] The touch panel 390 has an anti-reflective layer 367p positioned to overlap the display unit 301. For example, a circular polarizing plate can be used as the protective layer 367p.

[0444] The touch panel 390 has an insulating layer 321. The insulating layer 321 is made up of transistors 302t, etc. It covers the pixel circuit or imaging pixel circuit. It can be used as a layer for this purpose. Furthermore, it can be used to expand impurities to transistors such as transistor 302t. It is preferable to cover the transistor 302t, etc., with an insulating layer that can suppress dispersion.

[0445] The touch panel 390 has a partition wall 328 that overlaps the end of the lower electrode 351R. A spacer 329 that controls the distance between the flexible substrate 701 and the flexible substrate 711 is placed on the partition wall 328. To possess.

[0446] The image signal line driving circuit 303s(1) includes a transistor 303t and a capacitor 303c. Furthermore, the drive circuit can be formed on the same substrate using the same process as the pixel circuit. (Figure 28) As shown in B), the transistor 303t has a second gate 304 on the insulating layer 321. It may be. The second gate 304 is electrically connected to the gate of transistor 303t. They may be present, or different potentials may be applied to them. Also, if necessary, a second Even if the gate 304 is provided on transistor 308t or transistor 302t, etc. good.

[0447] The imaging pixel 308 has a photoelectric conversion element 308p and an imaging pixel circuit. The imaging pixel circuit is Light irradiated onto the photoelectric conversion element 308p can be detected. The imaging pixel circuit is a transistor Includes ZISTA 308t. For example, a pin-type photodiode is used as the photoelectric conversion element 308p. It is possible to be there.

[0448] The touch panel 390 has wiring 311 that can supply signals, and terminals 319 are provided. It is located on line 311. It can supply signals such as image signals and synchronization signals. C309 is electrically connected to terminal 319. FPC309 is a printed circuit board ( A PWB (Power Wheel Bridge) may be installed.

[0449] Note that transistors such as transistor 302t, transistor 303t, transistor 308t, etc. Zista can be formed in the same process, or they can be formed in different processes. That's good too.

[0450] <Configuration Example 2> Figures 29(A) and (B) are perspective views of the touch panel 525. For clarity, representative images are shown. The constituent elements are shown. Figure 30 is a cross-sectional view between the dashed line X1 and X2 shown in Figure 29(A). ru.

[0451] As shown in Figures 29(A) and (B), the touch panel 525 includes a display unit 521 and a scan line drive. It has a circuit 303g(1) and a touch sensor 595, etc. Furthermore, the touch panel 525 is It has a flexible substrate 701, a flexible substrate 711, and a flexible substrate 590.

[0452] The touch panel 525 has multiple pixels and multiple wirings 311. The multiple wirings 311 are The multiple wirings 311 are located on the outer periphery of the flexible substrate 701. It is routed all the way to the terminal 319, and a part of it makes up terminal 319. Terminal 319 is FPC529( 1) Connect electrically to it.

[0453] The touch panel 525 has a touch sensor 595 and multiple wires 598. 598 is electrically connected to the touch sensor 595. Multiple wires 598 are connected to the flexible substrate 5 It is routed around the outer periphery of 90, and a portion of it forms a terminal. This terminal is FPC52 It is electrically connected to 9(2). Note that in Figure 29(B), the flexible substrate 59 is shown for clarity. Electrodes of the touch sensor 595 provided on the back side of 0 (the side facing the flexible substrate 701) The wiring and other connections are shown with solid lines.

[0454] For example, a capacitive touch sensor can be applied to the touch sensor 595. Examples of capacitance methods include surface capacitance and projected capacitance. Here, we will focus on projected capacitance. This example shows the case where a capacitive touch sensor is applied.

[0455] Projected capacitance methods include self-capacitance methods and mutual capacitance methods. Using this method is preferable because it enables simultaneous multi-point detection.

[0456] The touch sensor 595 can detect the proximity or contact of an object to be detected, such as a finger. Various sensors can be applied.

[0457] The projected capacitive touch sensor 595 has electrodes 591 and 592. 91 is electrically connected to one of the multiple wires 598, and electrode 592 is connected to one of the multiple wires 598 Connect electrically to one of the others.

[0458] As shown in Figures 29(A) and (B), the electrode 592 consists of multiple electrodes arranged repeatedly in one direction. It has a shape in which quadrilaterals are connected at their corners.

[0459] Electrode 591 is quadrilateral and is repeatedly arranged in a direction intersecting the direction in which electrode 592 extends. The multiple electrodes 591 are not necessarily arranged in a direction perpendicular to one electrode 592. It is not necessary to position them so that they form an angle of less than 90 degrees.

[0460] Wiring 594 is provided crossing electrode 592. Wiring 594 is connected to one of electrode 592 The two electrodes 591 that are sandwiched are electrically connected. At this time, the intersection of electrode 592 and wiring 594 A shape that minimizes the area of ​​the electrode is preferable. This reduces the area where the electrode is not provided. The area can be reduced, and the unevenness of light transmittance can be reduced. As a result, the touch sensor 595 It can reduce unevenness in the brightness of transmitted light.

[0461] Furthermore, the shapes of electrodes 591 and 592 are not limited to these and can take on various shapes.

[0462] As shown in Figure 30(A), the touch panel 525 consists of a flexible substrate 701, an adhesive layer 703, It has an insulating layer 705, a flexible substrate 711, an adhesive layer 713, and an insulating layer 715. The flexible substrate 701 and the flexible substrate 711 are bonded together by an adhesive layer 360.

[0463] The adhesive layer 597 is applied to the flexible substrate 590 such that the touch sensor 595 overlaps the display unit 521. It is bonded to the flexible substrate 711. The adhesive layer 597 is translucent.

[0464] Electrodes 591 and 592 are formed using a light-transmitting conductive material. Examples of conductive materials include indium oxide, indium tin oxide, indium zinc oxide, Conductive oxides such as zinc oxide and zinc oxide with added gallium can be used. Alternatively, a film containing graphene can be used. The film containing graphene can be formed, for example, in a film-like structure. A film containing graphene oxide can be formed by reduction. Methods of reduction include: Methods such as applying heat can be cited.

[0465] Furthermore, conductive films such as electrodes 591, 592, and wiring 594 constitute the touch panel. Materials used for wiring or electrodes include transparent materials such as indium oxide, tin oxide, and zinc oxide. Examples include a bright conductive film (for example, ITO). Also, wiring or Materials that can be used for electrodes are preferably those with low resistance. Examples include silver and copper. Aluminum, carbon nanotubes, graphene, metal halides (such as silver halide) ) and the like may also be used. Furthermore, extremely thin (for example, with a diameter of several nanometers), multiple Metal nanowires composed of several conductors may be used. Alternatively, the conductors may be arranged in a mesh-like structure. A metal mesh made of the same material may also be used. For example, Ag nanowires, Cu nanowires, Al nanowires, Ag mesh, Cu mesh, Al mesh, etc. may also be used. If Ag nanowires are used for the wiring or electrodes that make up the touch panel, This allows for a transmittance of 89% or more and a sheet resistance of 40Ω / □ to 100Ω / □. Also, materials that can be used for the wiring or electrodes that constitute the touch panel as described above. Examples include metal nanowires, metal meshes, carbon nanotubes, and graphene. Because it has high transmittance in visible light, electrodes used in display elements (for example, pixel electrodes or common It may also be used as a conductive electrode, etc.

[0466] After depositing a light-transmitting conductive material onto a flexible substrate 590 by sputtering, Unnecessary parts are removed using various patterning techniques such as photolithography, and electrodes are then processed. 591 and electrode 592 can be formed.

[0467] Electrodes 591 and 592 are covered with an insulating layer 593. Also, an opening reaching electrode 591 The opening is provided in the insulating layer 593, and the wiring 594 electrically connects the adjacent electrodes 591. Optical conductive materials can increase the aperture ratio of the touch panel, making them suitable for wiring 594. It can be used appropriately. Furthermore, materials with higher conductivity than electrodes 591 and 592 can be used. Because it can reduce air resistance, it can be suitably used in wiring 594.

[0468] Furthermore, an insulating layer is provided to cover the insulating layer 593 and the wiring 594 to protect the touch sensor 595. It is possible.

[0469] Furthermore, the connection layer 599 electrically connects the wiring 598 and the FPC 529(2).

[0470] The display unit 521 has a plurality of pixels arranged in a matrix. The pixels are the same as in Configuration Example 1. Since it is a matter of appearance, the explanation will be omitted.

[0471] As shown in Figure 30(B), instead of using the flexible substrate 590, the flexible substrate 701 and flexible substrates are used. A touch panel may be constructed using two flexible substrates 711. Layer 715 is bonded with adhesive layer 713, and touch sensor 59 is in contact with insulating layer 715. A 5 is provided. In contact with the insulating layer 589 covering the touch sensor 595, there is a colored layer 367R And a light-shielding layer 367BM is provided. The insulating layer 589 is not provided, and a colored layer 367R or a light-shielding layer is provided. The optical layer 367BM may be provided in contact with the wiring 594.

[0472] <Configuration Example 3> Figure 31 is a cross-sectional view of the touch panel 525B. The touch panel described in this embodiment 525B is a point that displays the supplied image information on the side where the transistor is located and The touch sensor is located on the flexible substrate 701 side of the display unit, which is a key feature of the touch panel in Configuration Example 2. This is different from the Ru-525. Here, we will explain the different configuration in detail, and how to use a similar configuration. Where possible, refer to the explanation above.

[0473] The colored layer 367R is located in a position that overlaps with the light-emitting element 350R. Also, the light emission shown in Figure 31(A) Element 350R emits light towards the side where transistor 302t is located. A portion of the light emitted by the light-emitting element 350R passes through the colored layer 367R, in the direction of the arrow shown in the figure. It is emitted to the outside of the luminescent module 380R.

[0474] The touch panel 525B has a light-shielding layer 367BM in the direction from which light is emitted. BM is provided so as to surround the colored layer (for example, colored layer 367R).

[0475] The touch sensor 595 is located on the flexible substrate 701 side, not the flexible substrate 711 side. (Figure 31(A)).

[0476] The adhesive layer 597 makes the flexible substrate 590 flexible so that the touch sensor 595 overlaps the display area. It is bonded to the substrate 701. The adhesive layer 597 is translucent.

[0477] Furthermore, the configuration when a bottom-gate type transistor is applied to the display unit 521 is shown in Figure 31( As shown in A) and (B).

[0478] For example, a semiconductor layer containing oxide semiconductors, amorphous silicon, etc., is shown in Figure 31(A). This can be applied to transistors 302t and 303t.

[0479] For example, a semiconductor layer containing polycrystalline silicon, etc., is used in the transistor 302t shown in Figure 31(B). It can also be applied to transistor 303t.

[0480] Furthermore, the configuration when a top-gate type transistor is applied is shown in Figure 31(C).

[0481] For example, a single-crystal silicon film, etc., that has been transferred from a polycrystalline silicon or single-crystal silicon substrate, etc. The semiconductor layer containing it is used in transistors 302t and 303t shown in Figure 31(C). It can be applied.

[0482] As described in Embodiment 1 and other embodiments, an electronic device according to one aspect of the present invention comprises a display panel and a power storage device. They are stacked together. Figures 32(A) and (B) show the case where a touch panel and a thin rechargeable battery are stacked together. Examples of cross-sectional views are shown below. The touch panel shown in Figure 32(A) is the same as the one shown in Figure 30(A). The configuration is similar to that of the touch panel 525, and the thin secondary battery shown in Figure 32(A) is similar to that of Figure 1 The configuration is the same as that of the battery unit 500 shown in 4(A). The touch panel shown in Figure 32(B) Nell has a similar configuration to the touch panel 525 shown in Figure 30(B), and is shown in Figure 32(B). The thin secondary battery shown has the same configuration as the battery unit 500 shown in Figure 14(B).

[0483] Figures 32(A) and (B) show the flexible substrate 701 of the touch panel and the battery unit. Although an example in which the exterior body 509 makes contact has been shown, one aspect of the present invention is not limited thereto. The Nel and battery unit may be fixed to each other with adhesive or the like. Also, the touch panel A circuit board or the like may be located between the battery unit and the rechargeable battery unit.

[0484] In Figure 32(A), the sub-pixel 302R of the touch panel and the scan line driving circuit 303g(1) Figures 33(A) and (B) show modified examples of a stacked structure of a touch panel and a thin secondary battery. vinegar.

[0485] Figure 33(A) shows an example where the insulating layer 705 and the outer casing 509 are bonded together with the adhesive layer 703. This illustrates the present invention, which provides a transistor and light-emitting element fabricated on a fabricated substrate. The components may be placed on top of the secondary battery.

[0486] Furthermore, in Figure 33(B), the flexible substrate 701 and the insulating layer 705 are bonded together by the adhesive layer 703a. This shows an example in which the flexible substrate 701 and the outer casing 509 are bonded together with an adhesive layer 703b. .

[0487] The transistor 848 shown in Figure 34 is a top-gate type transistor with a back gate electrode. It is a type of transistor. Figure 34(A) is a top view of the 848 transistor. Figure 34(B) is This is a cross-sectional view between the dashed line X1 and X2 in Figure 34(A). Figure 34(C) is a cross-sectional view between the dashed line X1 and X2 in Figure 34(A). This is a cross-sectional view between the dashed line Y1 and Y2 in the diagram.

[0488] In transistor 848, the semiconductor layer 742 is formed on a protrusion provided in the insulating layer 772. By providing the semiconductor layer 742 on the protrusions provided in the insulating layer 772, the semiconductor layer 74 The sides of side 2 can also be covered with electrode 743. That is, transistor 848 can be covered with electrode 74 The structure has the ability to electrically surround the semiconductor layer 742 with the electric field 3. In this way, the electric field of the conductive film electrically surrounds the semiconductor layer in which the channel is formed. The structure of a transistor is called a surrounded channel (s-channel). It is called a structure. Also, a transistor having an s-channel structure is called an "s-channel transistor". It is also called an "EL-type transistor" or "S-channel transistor".

[0489] In the s-channel structure, channels are formed throughout the entire (bulk) semiconductor layer 742. It is also possible to increase the drain current of the transistor in an s-channel structure. This allows for obtaining an even larger on-current. Also, the electric field of electrode 743 This allows for the depletion of the entire channel formation region formed in the semiconductor layer 742. Therefore, in an s-channel structure, the off-current of the transistor can be further reduced. It is possible.

[0490] Electrode 723 is provided on a substrate 771 having an insulating surface. Electrode 723 is backgay It can function as an electrode.

[0491] The electrode 744a provided on the insulating layer 729 is located on the insulating layer 726, the insulating layer 728, and the insulating layer The opening 747c provided in 729 is electrically connected to the semiconductor layer 742. Furthermore, the electrode 744b provided on the insulating layer 729 is connected to the insulating layer 726, the insulating layer 728, and In the opening 747d provided in the insulating layer 729, the semiconductor layer 742 is electrically connected. Yes, they are.

[0492] The electrode 743 provided on the insulating layer 726 is provided on the insulating layer 726 and the insulating layer 772. At openings 747a and 747b, the electrode 723 is electrically connected. The same potential is supplied to electrodes 746 and 723. Also, apertures 747a and 7 47b does not need to be provided in either case. Also, both openings 747a and 747b It is not necessary to provide a method. If neither opening 747a nor opening 747b is provided, electrode 7 Different potentials can be supplied to electrode 23 and electrode 746.

[0493] Furthermore, the semiconductor used in transistors having an s-channel structure is an oxide semiconductor. A conductor, or a single crystal silicon transposed from a polycrystalline silicon or single crystal silicon substrate, etc. Examples include silicone, such as that found in concrete.

[0494] This embodiment can be combined with other embodiments as appropriate.

[0495] (Embodiment 5) In this embodiment, an electronic device according to one aspect of the present invention will be described using Figures 35 to 40. .

[0496] One aspect of the present invention is an electronic device having a display panel, an energy storage device, a circuit, and a encapsulant. The display panel has the function of displaying information using power supplied from the energy storage device. The circuit is, It has an antenna. The circuit has the function of wirelessly charging the energy storage device. The encapsulant has inside It has a display panel, a power storage device, and a circuit. At least a portion of the encapsulant transmits visible light. It has the function of doing so. In one embodiment of the present invention, the electronic device may be able to be attached to the arm. Furthermore, the structure connected to the sealing body may be attached to the arm.

[0497] By using a sealing material, the sealed components such as the display panel, energy storage device, and circuits are protected. This allows for the creation of robust electronic devices. Furthermore, by using a highly waterproof seal, protection It is possible to create electronic devices with high water resistance that can be used underwater.

[0498] In the manufacture of an electronic device according to one aspect of the present invention, the display panel and the energy storage device are collectively enclosed by a encapsulant. It can be covered and sealed. Therefore, it is possible to easily manufacture reliable electronic devices. This can be done. And by making the sealing body into a shape that is easy to attach to the human body, such as a strip, the sealing body It can be attached to the human body and used as a wearable device.

[0499] An electronic device according to one aspect of the present invention can charge a power storage device using contactless power transmission. Therefore, there is no need to remove the energy storage device from the encapsulation during charging. The entire seal can be completely covered with the seal, further enhancing the waterproofing of electronic devices. ru.

[0500] In one embodiment of the present invention, even if one or more components of the sealed body are flexible, That's fine. For example, the display panel or the energy storage device may be flexible, or the display panel Both the energy storage device and the energy storage device may be flexible.

[0501] Since the sealing body is flexible, at least one of the display panel and the energy storage device is flexible. If present, these can be protected without impairing their flexibility. As described above, by applying one aspect of the present invention, a highly reliable, safe, and flexible electric device can be constructed. Sub-devices can be realized. If the electronic device is flexible, it can be easily attached and detached. This is desirable because it provides the user with a comfortable fit and other benefits.

[0502] In the electronic device of this embodiment, the entire object to be sealed is covered with a flexible sealant. It is possible to cover the sealed object with a flexible sealant so that it can be repeatedly bent and stretched. This makes it possible to create electronic devices that are less likely to be damaged even when exposed to strong currents.

[0503] Furthermore, by using a highly heat-resistant encapsulant, the display panel can be driven even at high temperatures. It can also bend electronic devices reversibly even at high temperatures. In this case, heat resistance It is even preferable to use a high-quality display panel and energy storage device.

[0504] In this embodiment, an example is given where the display device described in detail in Embodiment 6 is applied to the display panel. The details will be explained below. Furthermore, the electronic equipment of this embodiment may be modified as described in Embodiment 1. The configuration can be applied.

[0505] A display device according to one aspect of the present invention responds to ambient brightness or the conditions under which external light is incident on the display device. By switching the elements used for display (selecting which display element to use for display), The user can clearly see the display on the display device, regardless of the ambient light. In bright environments, it is preferable to use ambient light and reflective liquid crystal elements for display. For example, in dimly lit environments, it is preferable to use light-emitting elements such as organic EL elements for display. The display device may use multiple types of display elements simultaneously to perform the display.

[0506] An electronic device according to one aspect of the present invention has a sensor that detects the brightness of the environment in which the electronic device is used. It is preferable to have a photodiode or an image sensor. In electronic devices, the elements used for display are automatically switched off based on the brightness detected by the sensor. It is preferable that the display state of the display device be automatically changed according to the brightness of the operating environment. This would enhance convenience for users of electronic devices.

[0507] An electronic device according to one aspect of the present invention allows the user of the electronic device to manually switch the elements used for display. It is preferable that this be done.

[0508] Next, the electronic device of this embodiment will be described in detail.

[0509] Figure 35(A) shows a perspective view of the electronic device 101. Also, Figure 35(B) shows a perspective view of the electronic device 10 Figure 35(B) shows a top view of 1, and Figure 35(C) shows a cross-sectional view between the dashed line A and B in Figure 35(B). Figure 35(F) shows a cross-sectional view between points C and D, indicated by the dashed line.

[0510] The electronic device 101 includes a display panel 10, a power storage device 20, a circuit 30, and a encapsulant 40. In Figure 35(A), etc., the portion of the display panel 10 that can be seen by the user is shown as electronic device 1. This is indicated as the display unit 15 for 01.

[0511] <Display section 15> The electronic device 101 has a display unit 15. In Figures 35(A), (C), (F), etc., the display The indicator part 15 is a plane. In Figure 35(C), etc., an arrow is shown in the electronic device 101. The side that is facing outwards becomes the display side.

[0512] The display unit 15 may be flexible. That is, the display unit 15 can be deformed. The curvature of can be changed from the state shown in Figure 35(A). Also, the display unit 15 is It is not necessary for the object to be deformable from a flat surface or a curved surface.

[0513] If the flexibility of the display panel is lower than the flexibility of the sealing body, then the electronic device according to one embodiment of the present invention When worn on the arm or other body part, the radius of curvature of the display unit 15 hardly changes, and the end of the electronic device... It is preferable to have a flexible shape.

[0514] <Sealing body 40> The electronic device 101 has a seal 40. In Figure 35(A), the seal 40 has a curved surface. It has. From a state having a curved surface as shown in Figure 35(A), to a flat state as shown in Figure 35(B). The sealant 40 can be deformed into a flat state. The sealant 40 can be used in the electronic device 101. The details are the same as in Embodiment 1, so the explanation will be omitted.

[0515] In the electronic device 101, a display panel 10, a power storage device 20, and a circuit 30 are stacked. The stacking order of these panels is not particularly limited, as long as the user can see the display on the display panel 10. Furthermore, these do not necessarily have to be stacked; the display panel 10 and the energy storage device 2 may be placed on the same plane. Two or more of either circuit 0 and circuit 30 may be present.

[0516] For example, as shown in Figure 35(F), the electronic device 101 has a circuit 30 on the energy storage device 20. It may have a display panel 10 on the circuit 30. When the sealant 40 is attached to the arm, The configuration consists of a power storage device 20, a circuit 30, and a display panel 10 stacked in order from the arm side. If present, the user can see the display on the display panel 10. Alternatively, from the side closest to the arm, The circuit 30, the energy storage device 20, and the display panel 10 may be stacked in that order.

[0517] The space sealed by the sealant 40 is preferably in a reduced-pressure atmosphere or an inert atmosphere. i. By creating these atmospheres, the display panel This can improve the reliability of the 10th place ranking.

[0518] Figures 35(D) and (E) are different from Figure 35(C) and are shown in Figure 35(B), respectively. This is a cross-sectional view between the dotted lines A and B. Also, Figure 35(G) is different from Figure 35(F), and is a cross-sectional view of Figure 35(F). This is a cross-sectional view between the dashed lines C and D in 5(B).

[0519] In Figures 35(C) and (F), the sealing body 40 on the front (display side) of the electronic device 101 is the sealed body The figure shows, but is not limited to, an example where the sides are covered and the back surface of the electronic device 101 is flat. As shown in 35(D) and (G), the sealing body 40 on the front (display side) and back side of the electronic device 101 Both sides of the sealing body 40 cover the sides of the sealed object, and the electronic device 101 is not covered by other parts on both the front and back. It may have a portion that protrudes more than the band portion, etc. Also, as shown in Figure 35(E) The sealing body 40 on the back of the electronic device 101 covers the side of the sealed object, and the electronic device 101 The front (display) side may be flat. Also, as shown in Figure 35(C), electronic equipment The portion of 101 including the display unit 15 may protrude more than other parts (such as the band portion). Also, as shown in Figure 35(E), other parts (such as the band) are located on the back side of the electronic device 101. It may have a part that protrudes more than that.

[0520] Figures 36 to 39 show electronic devices different from electronic device 101.

[0521] Figure 36(A) shows a perspective view of the electronic device 101a. Also, Figure 37(A) shows the electronic device 10 Figure 37(B) shows a top view of 1a and a cross-sectional view between the dashed lines EF in Figure 37(A). Figure 37(F) shows a cross-sectional view between the dashed lines GH. Also, Figure 36(B) shows the electronics A perspective view of container 101b is shown.

[0522] Figures 36(A) and (B) show an example where the display unit 15 is flat. Figure 36(A) shows an energy storage device. This is an example where both the component 20 and the circuit 30 are flexible and have curved surfaces. Figure 36(B) shows This is an example where the energy storage device 20 is flexible and has a curved surface. In Figures 36(A) and (B), The flexibility of the display panel 10 is not a concern. In Figure 36(B), the flexibility of the circuit 30 is not a concern. stomach.

[0523] The electronic device 101a has a display unit 15. The electronic device 101a also has a sealing body 40. The electronic device 101a also has a display panel 10 and a power storage device 20 inside the encapsulation body 40. It also has a circuit 30.

[0524] In the electronic device 101a, the display panel 10 overlaps with the energy storage device 20, and the circuit 30 overlaps with the energy storage device 2 It overlaps with 0, and the display panel 10 and the circuit 30 do not overlap. In this way, the encapsulant 40 The part that functions as a band may also contain the material to be sealed. For example, a flexible material When using the energy storage device 20, the energy storage device 20 is placed in a wide area inside the sealing body 40. This makes it possible to create electronic devices that can be used for extended periods on a single charge.

[0525] As detailed in Embodiment 1, the inside of the sealing body 40 contains a buoyancy material and a rubber-elastic member. It may have at least one of the following:

[0526] Figures 37(C) to (E) are different from Figure 37(B), and are different from the one in Figure 37(A). This is a cross-sectional view between the dotted lines EF.

[0527] For example, in the space 42 shown in Figures 37(B), (C), (D), and (F), a buoyancy material or rubber elastic material is placed. It is preferable to fasten the fastening member.

[0528] As shown in Figure 37(B), the display panel 10 and the energy storage device 20, or the circuit 30 and the energy storage device 2 The zeros may be touching each other. Also, as shown in Figure 37(C), the display panel 10 and storage The electrical device 20 does not need to be in contact. Similarly, the circuit 30 and the energy storage device 20 do not need to be in contact. This is also acceptable. Furthermore, the display panel 10, the energy storage device 20, and the circuit 30 are each connected to the encapsulant 40. They may be in contact. In Figures 37(B) and (C), the energy storage device 20 and the sealant 40 are in contact. An example is shown. Figure 37(C) shows an example where the display panel 10 and the sealing body 40 are in contact. As shown in Figure 37(D), the sealant 40 and the object to be sealed do not need to be in contact. Two or more of the display panel 10, energy storage device 20, circuit 30, and sealing body 40 are in contact with each other. If there are parts that can be attached, they may be fixed with adhesive or the like, or they may be attached so that they can be moved relative to each other. It's okay to do so.

[0529] Furthermore, as shown in Figure 37(E), the inside of the sealant 40 may be sufficiently depressurized. As a result, the display panel 10, the energy storage device 20, and the circuit 30, etc., deteriorate due to impurities, etc. This can suppress the problem. Furthermore, it allows for the thinning and weight reduction of electronic devices.

[0530] In Figures 37(B) and (F), the sealing body 40 on the front (display side) of the electronic device 101a is sealed. This example shows, but is not limited to, a body covering with a flat back surface of the electronic device 101a. As shown in Figure 37(D), the sealing body 40 on the front (display side) and back side of the electronic device 101a Both sides of the sealant 40 cover the sides of the sealed object, and the electronic device 101a is not covered by other parts on both the front and back sides. It may have a portion that protrudes more than the band portion, etc.

[0531] Figure 38(A) shows a perspective view of electronic device 101c. Also, Figure 39(A) shows electronic device 1 Figure 39(B) shows a top view of 01c and a cross-sectional view between the dashed lines J and K in Figure 39(A). This will be shown.

[0532] The electronic device 101c has a seal 40 and a band 155. Inside the seal 40 is a surface The display panel 10, circuit 30, energy storage device 20, etc. are included. The sealant 40 and band 155 are They are connected. Preferably, the sealant 40 and the band 155 are detachably connected. .

[0533] Furthermore, the electronic equipment 101d shown in Figure 38(B) and the electronic equipment 101e shown in Figure 38(C) Even if the band 155 has a recess and the sealant 40 is placed inside the recess, Good. If the sealant 40 protrudes relative to the band 155, the electronic device may be affected during use. The display unit 15 may be scratched due to the device rubbing against or colliding with other objects, and further This could damage the electronic device. Therefore, the surfaces of the band 155 and the sealant 40 are roughly the same. It is preferable that the band 155 and the sealant 40 can be connected so as to form a single plane. The recess of part 155 may be deeper than the thickness of the sealing body 40.

[0534] Electronic device 101d is an example in which the display unit 15 is flat. Electronic device 101e is an example in which the display unit 1 5 is an example of a curved surface.

[0535] Figures 38(A) and 39(A) show examples where the width of the sealant 40 and the width of the band 155 are equal. The present invention is shown, but is not limited to this. As shown in Figure 39(C), the sealing body 4 The width of 0 may be narrower than the width of band 155. Alternatively, as shown in Figure 39(D), The width of the sealing body 40 may be wider than the width of the band 155.

[0536] Next, an example of a component of an electronic device according to one aspect of the present invention is shown.

[0537] The element 151 shown in Figure 40(A) consists of the display panel 10, the energy storage device 20, the circuit 30, and the encapsulation. It has a body 40. The sealing body 40 contains a display panel 10, a power storage device 20, and a circuit 30 inside. It has. In the following, the display panel 10, the energy storage device 20, and the circuit 30 are collectively referred to as a sealed body. It is sometimes written as follows.

[0538] Element 151 is, for example, element 151a in Figure 38(A), element 151b in Figure 38(B), and As shown in element 151c of Figure 38(C), the sealant 40 is used connected to the band 155. This is possible. Alternatively, as shown in Figures 37(A) to (E), the sealing body 40 can be formed in a strip shape. The sealing body 40 itself may be attached to the arm.

[0539] An example of the connection relationships of the sealed body is shown in a block diagram in Figure 40(B).

[0540] The display panel 10 has a display element 13. The display panel 10 is supplied from the energy storage device 20. It has a function to display information using available power.

[0541] Furthermore, the display panel 10 has a function that displays information using power supplied from sources other than the energy storage device 20. It may have.

[0542] The energy storage device 20 has a portion that overlaps with the display panel 10.

[0543] The energy storage device 20 may also have a function to supply power to devices other than the display panel 10.

[0544] The circuit 30 has an antenna 31. The antenna 31 has a portion that overlaps with the display panel 10. The circuit 30 can charge the energy storage device 20 wirelessly (or contactlessly). .

[0545] The portion where the display panel 10 and the circuit 30 overlap each other, or the portion where the display panel 10 and the energy storage device 20 The overlapping portions of the elements allow for miniaturization of element 151. In particular, the table It is preferable to provide overlapping sections for the three components: the display panel 10, the energy storage device 20, and the circuit 30. It seems so. Miniaturizing element 151 is particularly effective when a band is provided separately from the sealant 40. Furthermore, when the sealing body 40 is used as a band for electronic equipment, the miniaturization of element 151 is possible. If not required, the portion where the display panel 10 and the circuit 30 overlap each other, or the display panel 10 The and the energy storage device 20 do not need to have any overlapping portions.

[0546] The energy storage device 20 preferably has a portion that overlaps with the circuit 30. For example, the antenna 31 At least a portion of it may overlap with the energy storage device 20. Antenna 31 is on display panel 10 The antenna 31 is positioned between the battery storage device 20, so that it is not easily visible to the user of the electronic device. By stacking the display panel 10, the power storage device 20, and the circuit 30 in such a way, the electronic device This is preferable as it helps to prevent damage to the appearance. Display between the external antenna and antenna 31. Even with panel 10 in place, radio waves can still be transmitted and received. In other words, an external antenna is The radio waves to be transmitted pass through the display panel 10, and the antenna 31 receives the radio waves.

[0547] If the operating environment for electronic devices is determined, then a display panel capable of displaying information under that environment and A power storage device capable of supplying power to the display panel in that environment is used.

[0548] An electronic device according to one aspect of the present invention is preferably usable in low-temperature and high-temperature environments. Alternatively, an electronic device according to one aspect of the present invention may operate over a wide temperature range (for example, 0°C to 100°C). Preferably used at temperatures between -25°C and 150°C, more preferably between -50°C and 200°C. It is preferable that it can be used. An electronic device according to one aspect of the present invention can be used both indoors and outdoors. That's fine.

[0549] A display panel in an electronic device according to one aspect of the present invention is capable of operating in environments of 0°C and 100°C. It is preferable that each display can be shown separately. Furthermore, the energy storage of an electronic device according to one aspect of the present invention The device supplies power to the display panel in both 0°C and 100°C environments. It is preferable that this be possible.

[0550] Electronic devices may have switches. In Figures 40(C) and (D), the sealed body is The display panel 10, the energy storage device 20, the circuit 30, the circuit 50, and the switch 51 are shown.

[0551] For example, as shown in Figure 40(C), when switch 51 is in the off state, circuit 30 is wireless The energy storage device 20 can be charged using this method.

[0552] For example, as shown in Figure 40(D), when switch 51 is in the ON state, the energy storage device 20 Power can be supplied to the display panel 10.

[0553] The following describes in detail the components of an electronic device according to one aspect of the present invention.

[0554] <Display Panel 10> The display panel 10 has a display element 13. An example of the configuration of the display panel 10 is shown in the embodiment. Section 6 will describe the display device in detail. The display panel has detection elements such as touch sensors. That's fine.

[0555] The display panel 10 uses either an active matrix system or a passive matrix system. It is possible.

[0556] The display panel 10 may be flexible. For example, the support substrate and encapsulation of the display element 13. By using a film on at least one of the substrates, the flexibility of the display panel 10 is increased. It is possible.

[0557] For example, the display panel may have a radius of curvature of 1m or more and 10m or less, preferably a radius of curvature of 1m or more. It is preferable that electronic devices can be used while bent within a range of 5m or less. If the panel has higher flexibility, it can be bent within a range of a radius of curvature of 1 mm or more and less than 1 m. Electronic devices may also be used.

[0558] The display panel 10 is preferably capable of displaying information in both low-temperature and high-temperature environments. For example, an environment between -100°C and 0°C, preferably between -100°C and -25°C. The following environments, more preferably environments between -100°C and -50°C, are examples of high-temperature environments. For example, an environment between 100°C and 300°C, preferably between 150°C and 300°C. The following environments, more preferably environments between 200°C and 300°C, are listed below. Panel 10 operates not only in low-temperature or high-temperature environments, but also in environments higher than 0°C but below 100°C. It can be displayed in the following way. For example, the display panel 10 can be displayed at room temperature (20°C to 30°C). It can be displayed.

[0559] The display element 13 may be a light-emitting element, a liquid crystal element, an electrophoretic element, or a MEMS (microelectrolytic device). Display elements using electromechanical systems can be applied. As the element, a self-illuminating element can be used, and the brightness can be controlled by current or voltage. The elements being controlled fall within that category. For example, light-emitting diodes (LEDs), organic EL elements. Inorganic EL elements, etc., can be used.

[0560] The higher the heat resistance of the display element 13, the better. For example, an organic EL element can be used as the display element 13. When used, the glass transition temperature of each organic compound contained in the organic EL element is 100°C or higher. A temperature of 00°C or lower is preferred, and a temperature of 150°C to 300°C is more preferred.

[0561] <Energy storage device 20> Details and configuration examples of the energy storage device 20 can be found in Embodiments 1 and 2, so please refer here. I will omit the explanation.

[0562] In electronic devices, the display element 13 and the energy storage device 20 may be arranged in a stacked configuration. The larger the overlapping area between the display element 13 and the energy storage device 20, the more the heat generated by the display element 13 is utilized. This allows the energy storage device 20 to be heated over a wide area. Compared to high-temperature environments, it operates in low-temperature environments. Even when using energy storage devices that are difficult to implement, the reliability of electronic equipment can be improved.

[0563] <Circuit 30> Details of circuit 30 can be found in Embodiment 1, so a detailed explanation is omitted here. .

[0564] <Circuit 50> Circuit 50 converts the power supplied from the energy storage device 20 into power to drive the display element 13. It has the function of driving the display element 13 using the output voltage of the energy storage device 20. It may also have a function to convert (boost or buck) the voltage.

[0565] <Switch 51> Details of switch 51 can be found in Embodiment 1, so their description is omitted here. do.

[0566] The environment in which the electronic device according to one aspect of the present invention can be used is not limited to an atmospheric environment. These electronic devices can be used, for example, in water between 0°C and 100°C. (Display panel) The wide operating temperature range of the battery and energy storage device, and the fact that the display panel and energy storage device are sealed Because it is sealed, the electronic device according to one aspect of the present invention is highly suitable for use underwater. High reliability can be ensured.

[0567] The components of the electronic device in this embodiment can also be modified according to the information described with reference to Figure 8. Cut.

[0568] The electronic device and its components in this embodiment are the arm-mounted electronic device shown in Figures 9 and 10. It can also be applied.

[0569] This embodiment can be combined with other embodiments as appropriate.

[0570] (Embodiment 6) In this embodiment, a display device that can be used in an electronic device according to one aspect of the present invention is shown in Figure This will be explained using a surface. In this embodiment, a display device mainly using liquid crystal elements and organic EL elements The above is an example, but the present invention is not limited thereto. For components similar to those in Embodiment 3, please refer to the previous description.

[0571] A display device according to one aspect of the present invention has a first display element and a second display element. The element has a reflective layer that has the function of reflecting light. The first display element controls the transmission of light. It has the function of having an opening. The reflective layer has an opening. The second display element is the part that overlaps with the opening. The second display element has the function of emitting light toward the aperture. The aperture is It is preferable that the area of ​​the injection layer is between 5% and 20% of the total area of ​​the injection layer.

[0572] For example, when sufficient ambient light is incident on the display device (such as in a bright environment), the ambient light and the first Display elements can be used to perform the display. This reduces the power consumption of the display device. It is possible to do so even if the area around the display device is dark and there is little ambient light entering the display device. The display can be made using the second display element. In dimly lit environments, the first display... The display may be performed by driving both the first display element and the second display element. Alternatively, in a dimly lit environment... Below, display may be performed using only the second display element. Thus, one aspect of the present invention This results in a highly visible and convenient display device or an all-weather display, regardless of ambient light. The device can be realized.

[0573] A display device according to one aspect of the present invention has one second display element for each first display element. It is also fine to have one or more. For example, the number of pixels composed of the first display element and the second If the number of pixels composed of the display elements is the same, then the display using the first display element and the second Displaying with a display element is preferable because it achieves equivalent resolution.

[0574] The display device having the above configuration further includes signal lines, pixel circuits, a first conductive layer, a second conductive layer, and It is preferable to have an insulating layer. The second display element is electrically connected to the pixel circuit. The display element 1 is electrically connected to the first conductive layer. The first conductive layer is connected via an insulating layer. It has a portion that overlaps with the second conductive layer. The first conductive layer is electrically connected to the second conductive layer. The second conductive layer is electrically connected to the pixel circuit. The pixel circuit is electrically connected to the signal line. The pixel circuit consists of a first display element and a second display element, which are arranged with an insulating layer in between. It can drive both children.

[0575] Alternatively, a display device according to one aspect of the present invention has a liquid crystal element and a light-emitting element. The liquid crystal element is a liquid It has a crystal layer, a first conductive layer, and a second conductive layer. The first conductive layer has the function of reflecting light. The first conductive layer has an opening. The light-emitting element has a layer containing a light-emitting material, and a third It has a conductive layer and a fourth conductive layer. The light-emitting element has a portion that overlaps with the opening. The child has the function of emitting light toward the aperture. The aperture is 5% of the area of ​​the first conductive layer. It is preferable that the area be 20% or less of the above area.

[0576] A display device according to one aspect of the present invention has a reflective liquid crystal element as the first display element, and an organic EL It has an element as a second display element.

[0577] Therefore, when sufficient ambient light is incident on the display device, ambient light and reflective liquid crystal elements are used. The display can be shown in a dark environment where the surroundings of the display device are dark and there is little ambient light entering the display device. Even so, display can be performed using an organic EL element. Thus, according to one aspect of the present invention A display device that is highly visible and convenient regardless of ambient light, or an all-weather display device. This can be achieved.

[0578] The display device having the above configuration further includes signal lines, pixel circuits, a fifth conductive layer, a sixth conductive layer, and It is preferable to have an insulating layer. The light-emitting element is electrically connected to the pixel circuit. Liquid crystal element It is electrically connected to the fifth conductive layer. The fifth conductive layer is connected to the sixth conductive layer via the insulating layer. It has an overlapping portion. The fifth conductive layer is electrically connected to the sixth conductive layer. The electroplating is electrically connected to the pixel circuit. The pixel circuit is electrically connected to the signal line. The basic circuit drives both the light-emitting element and the liquid crystal element, which are arranged with an insulating layer in between. can.

[0579] Figure 41 shows the circuit diagram of the pixel circuit of the display device of this embodiment. This is a circuit diagram of path 630(i,j) and pixel circuit 630(i,j+1).

[0580] The pixel circuits 630(i,j) and 630(i,j+1) shown in Figure 41 are switches, respectively. It includes SW1, switch SW2, capacitive element C1, capacitive element C2, and transistor M. In Figure 41, the first display element 650 and the second display element are shown within the dotted line frame indicating the pixel circuit. Although element 640 is included, in the following explanation, these will be treated as not being included in the pixel circuit. I will reveal it.

[0581] Figure 41 shows an example where switch SW1 and switch SW2 each have transistors. This shows that switch SW1 and switch SW2 are transistors using oxide semiconductors. It is preferable to have a zista.

[0582] Regarding the connection relationships in the pixel circuits 630(i,j) and 630(i,j+1) shown in Figure 41: I will explain.

[0583] Pixel circuit 630(i,j) consists of signal line S1(j), signal line S2(j), and scan line G1(i). It is electrically connected to scan line G2(i), wiring CSCOM, and wiring ANO.

[0584] The pixel circuit 630(i,j+1) has signal line S1(j+1), signal line S2(j+1), and scanning Line G1(i), scan line G2(i), wiring CSCOM, and wiring ANO are electrically connected. ru.

[0585] Furthermore, the voltage used for the signal supplied to signal line S2(j) is the same as the voltage supplied to signal line S1(j+1). If the voltage used for the signal is different, separate signal line S1(j+1) from signal line S2(j). Arrange them. In Figure 41, signal line S2(j+1) is arranged adjacent to signal line S2(j). Here is an example.

[0586] The gate of switch SW1 is electrically connected to scan line G1(i). One of the sources or drains is electrically connected to the signal line S1(j), and the other is connected to a capacitive element. One electrode of C1 and one electrode of the first display element 650 are electrically connected.

[0587] The other electrode of the capacitive element C1 is electrically connected to the wiring CSCOM.

[0588] The other electrode of the first display element 650 is electrically connected to the wiring VCOM1.

[0589] The gate of switch SW2 is electrically connected to scan line G2(i). Either the source or the drain is electrically connected to the signal line S2(j), and the other is a transient The gate and back gate of the starter M, and one electrode of the capacitive element C2 are electrically connected. ru.

[0590] Either the source or drain of transistor M is connected to the wiring ANO and the other side of capacitive element C2. One electrode is electrically connected to the other, and the other is electrically connected to one electrode of the second display element 640. ru.

[0591] The other electrode of the second display element 640 is electrically connected to the wiring VCOM2.

[0592] The pixel circuit 630(i,j) is electrically connected to the first display element 650(i,j). The pixel circuit 630(i,j) is electrically connected to the second display element 640(i,j).

[0593] Figure 42(A) shows a block diagram illustrating the arrangement of pixels and wiring in the display device 600. Figures 42(B-1) and (B-2) show the openings 65 of the display device 600, respectively. This is a schematic diagram explaining 1H.

[0594] As shown in Figure 42(A), the display device 600 has i scan lines G1, i scan lines G2, j signal lines S1, j signal lines S2, j wiring CSCOM, j wiring ANO, m× It has n pixels 602, a drive circuit GD, and a drive circuit SD. where i is between 1 and m. It is an integer such that j is an integer between 1 and n (inclusive), and m and n are integers greater than or equal to 1.

[0595] The display device 600 shown in Figure 42 has pixels 602(i,j).

[0596] Scan line G1(i), scan line G2(i), wiring CSCOM, and wiring ANO are, respectively, A group of pixels 602(i,1) to 6 arranged in the row direction (indicated by arrow R in the figure) It is electrically connected to 02(i,n).

[0597] Signal lines S1(j) and S2(j) are in the column direction (indicated by arrow C in the figure). ) is electrically connected to another group of pixels 602(1,j) to 602(m,j) arranged in ). It will continue.

[0598] For example, the pixel 602(i,j+1) adjacent to pixel 602(i,j) in the row direction is pixel 6 It is preferable to have an opening such that the arrangement of the opening 651H relative to 02(i,j) is different. It looks like it (Figure 42 (B-1)).

[0599] Alternatively, for example, a pixel 602(i+1,j) adjacent to pixel 602(i,j) in the column direction is The aperture is provided in a manner different from the arrangement of the aperture 651H with respect to pixel 602(i,j). This is preferable (Figure 42(B-2)).

[0600] Alternatively, the aperture 651H may be located at the same position for all pixels.

[0601] The drive circuit GD is electrically connected to the scan line G1(i). The drive circuit GD has a shift rail. Various sequential circuits such as zistas can be used. The drive circuit GD includes transistors and Capacitive elements and the like can be used. The transistor in the drive circuit GD is in the pixel circuit 6 It can be formed using the same process as the transistors included in 30(i,j).

[0602] The drive circuit SD is electrically connected to the signal line S1(j). The drive circuit SD includes, for example, An integrated circuit can be used. Specifically, the drive circuit SD is formed on a silicon substrate. A modified integrated circuit can be used.

[0603] For example, using the COG (Chip on glass) method, the pixel circuit 630(i,j) The drive circuit SD can be implemented on the pads that are electrically connected to it. Specifically, anisotropic A conductive film can be used to mount integrated circuits onto pads.

[0604] Figure 43(A) is a bottom view of the display device 600 (a view of the side opposite to the display surface). Figure 43 (B-1) and (B-2) are bottom views illustrating some of the components of the display device 600, respectively. Yes. Figure 43(B-2) is a lower view that omits some of the components shown in Figure 43(B-1) for explanation. This is a diagram. Figure 43(A) shows an example where one unit has three pixels 602(i,j). This indicates.

[0605] Figure 44(A) shows the dashed lines X1-X2 and X shown in Figures 43(A), (B-1), and (B-2). These are cross-sectional views at points 3-X4, X5-X6, X7-X8, X9-X10, and X11-X12. Figures 44(B) to (D) show the transitions that can be used in the display device 600. This is an example of a standard configuration.

[0606] In Figure 44(A), the first display element 650(i,j) is displayed by controlling the intensity of the reflected ambient light. The direction of the display is indicated by a dashed arrow. Also, in Figure 44(A), the second display element 640( The direction in which i,j) displays is indicated by a solid arrow. In this way, the second display element 640( i,j) displays in the same direction as the first display element 650(i,j) displays. It is possible.

[0607] As shown in Figure 44(A), the drive circuit GD has a transistor MD.

[0608] As shown in Figure 44(A), pixel 602(i,j) is the first display element 650(i,j) , second display element 640(i,j), first conductive layer 681, second conductive layer 682, insulating layer It has 621 and a pixel circuit 630(i,j). In Figure 44(A), the pixel circuit 630( Of i and j), transistor M and switch SW1 are shown.

[0609] The first display element 650(i,j) has a first electrode 651(i,j), a second electrode 652, and has a layer 653 containing liquid crystal material. The second electrode 652 is connected to the first electrode 651 (i,j ) are positioned so that an electric field is formed between them to control the orientation of the liquid crystal material.

[0610] The display device 600 preferably has alignment films AF1 and AF2. The included layer 653 is located between the alignment layer AF2 and the alignment layer AF1.

[0611] The first display element 650(i,j) has a reflective layer that has the function of reflecting incident light. Furthermore, the first display element 650(i,j) has a function to control the intensity of reflected light. The reflective layer has an opening 651H. In Figure 44(A), the first electrode 651(i,j) This example shows a structure having a conductive layer that transmits light and a conductive layer that reflects light, laminated together. A reflective layer may be provided separately from electrode 651(i,j).

[0612] As shown in Figure 44(A), the side end of the first electrode 651(i,j) is embedded in the insulating layer 621. It's embedded.

[0613] A light-emitting element can be used for the second display element 640(i,j). 640(i,j) is the third electrode 641(i,j), the fourth electrode 642, and a light-emitting material It has a layer 643(j) containing a substance. The insulating layer 668 is at the end of the third electrode 641(i,j) The insulating layer 668 formed along the periphery of the third electrode 641(i,j) covers the third This prevents short circuits between electrode 641(i,j) and the fourth electrode 642.

[0614] The second display element 640(i,j) has the function of emitting light toward the aperture 651H. .

[0615] The second display element 640(i,j) is the area that the first display element 650(i,j) displays. Display can be placed in the area enclosed by (Figure 43 (B-1), (B-2)). Table 1 The display element 650(i,j) displays in the region overlapping with the first electrode 651(i,j), and the second The display element 640(i,j) displays in the area that overlaps with the aperture 651H.

[0616] The first conductive layer 681 is electrically connected to the first display element 650(i,j). Figure 44 In (A), the first conductive layer 681 and the first electrode 651(i,j) are electrically connected. An example is shown. The first conductive layer 681 can be a single layer or a multilayer structure. The conductive layer 681 may function as the first electrode 651(i,j).

[0617] The second conductive layer 682 includes a region that overlaps with the first conductive layer 681. It can have a single-layer structure or a laminated structure.

[0618] The insulating layer 621 includes a region sandwiched between the second conductive layer 682 and the first conductive layer 681. .

[0619] In region 691c, the second conductive layer 682 is electrically connected to the first conductive layer 681. ru.

[0620] The second conductive layer 682 is electrically connected to the pixel circuit 630(i,j). Figure 44(A) Then, the second conductive layer 682 and the conductive layer 612b are electrically connected.

[0621] The conductive layers 612a and 612b are connected to the transistor switch SW1, one of which is the base layer of the transistor. One side functions as a drain, and the other side functions as a drain. The conductive layer 612a is connected to the signal line S1(j ) is electrically connected to . Alternatively, the conductive layer 612a can be said to be part of the signal line S1(j). (Figures 41 and 44(A)).

[0622] The first electrode 651(i,j) of the first display element 650(i,j) is a first conductive layer Electrically, through 681 and the second conductive layer 682, the conductive layer 612b of the switch SW1 and the electrical They are connected. In other words, the first display element 650(i,j) is connected to the pixel circuit 630(i It is electrically connected to the first display element 650(i,j) and the pixel circuit. The method of electrically connecting 630(i,j) is not limited to this. For example, the first The electrode 651(i,j) and the conductive layer 612b are connected to the first conductive layer 681 or the second conductive layer It may be electrically connected via one side of 682, or via the first electrode 651(i,j) The conductive layer 612b may be directly connected to it.

[0623] Either the source or the drain of transistor M is electrically connected to wiring ANO. The third electrode 641(i,j) of the second display element 640(i,j) is connected to the connection portion 66 In step 2, the other side of the source or drain of transistor M is electrically connected. As a result, the second display element 640(i,j) is electrically connected to the pixel circuit 630(i,j) The transistor M is connected to the third electrode 641(i,j) via the insulating layer 661. They overlap.

[0624] Furthermore, the display device 600 has a conductive layer 619b and a conductive layer 611b (Figure 44(A ))

[0625] The insulating layer 621 includes a region sandwiched between the conductive layer 619b and the conductive layer 611b.

[0626] The conductive layer 619b is electrically connected to the conductive layer 611b in region 691b. The conductive layer 611b is electrically connected to the pixel circuit 630(i,j).

[0627] The conductive layer 619b is connected to a flexible printed circuit board (FPC) via the ACF connector. It is electrically connected to the (s). As a result, power is supplied to the pixel circuit via the conductive layer 619b. This can supply a signal. In Figure 44(A), the connection part of the conductive layer 619b with the FPC However, the example shown is located on the display surface side of the display device 600, but it is located on the side opposite to the display surface. That's good too.

[0628] Pixel 602(i,j) further comprises a colored layer CF, a light-shielding layer BM, an insulating layer 671, and a functional film. It has 670.

[0629] The colored layer CF has a region that overlaps with the first display element 650(i,j). The light-shielding layer BM is An opening is provided in the region that overlaps with the first display element 650(i,j).

[0630] The colored layer CF has an area that overlaps with the second display element 640(i,j). The light-shielding layer BM is An opening is provided in the region that overlaps with the second display element 640(i,j).

[0631] The insulating layer 671 is located between the colored layer CF and the layer 653 containing the liquid crystal material, or between the light-shielding layer BM and the liquid crystal material It is placed between layers 653 which include the colored layer CF. This makes the unevenness based on the thickness of the colored layer CF flat. It is possible to add a layer 65 containing liquid crystal material from the light-shielding layer BM or the colored layer CF, etc. The diffusion of impurities into 3 can be suppressed.

[0632] The functional film 670 includes a region that overlaps with the first display element 650(i,j). It includes a region that overlaps with the second display element 640(i,j). The functional film 670 is the first display The substrate 690 is positioned between the indicator element 650(i,j).

[0633] The second display element 640(i,j) is sealed by the adhesive layer 605 and the substrate 610. The sealing method for the second display element 640(i,j) is not limited to this. For example, gas The second display element 640(i,j) can be covered with a highly barrier insulating film. In addition, the adhesive layer 605 and the substrate 610 may not be provided.

[0634] The substrate 690 has an area that overlaps with the substrate 610. The functional layer 660 is located on the substrate 610 and the substrate It is arranged between 690. The functional layer 660 consists of the pixel circuit 630(i,j) and the second display element. 640(i,j), insulating layer 616, insulating layer 618, insulating layer 621, insulating layer 661, and insulating It includes an edge layer 668. The adhesive layer 695 has the function of bonding the functional layer 660 and the substrate 690. The structure KB has the function of providing a predetermined gap between the functional layer 660 and the substrate 690. .

[0635] The thickness of the substrate 690 is preferably thin. For example, the substrate 690 may have a thickness of 0.2 mm or Alkali-free glass polished to a thickness of 0.1 mm can be suitably used.

[0636] The display device 600 includes a conductive layer 619a, a conductive layer 611a, and a conductive material CP.

[0637] The insulating layer 621 includes a region sandwiched between the conductive layer 619a and the conductive layer 611a.

[0638] The conductive layer 619a is electrically connected to the conductive layer 611a in region 691a. The conductive layer 611a is electrically connected to the pixel circuit 630(i,j).

[0639] The conductive material CP is sandwiched between the conductive layer 619a and the second electrode 652. The electrodes 652 are electrically connected. For example, conductive particles can be used as the conductor CP. Cut.

[0640] The following are examples of materials that can be used in display devices. It is used in plates, adhesive layers, transistors, light-emitting elements, conductive layers, insulating layers, colored layers, and light-shielding layers. For details on the materials that can be used, please refer to the description in Embodiment 3. I will omit the explanation.

[0641] The first display element 650(i,j) has a display element that has a function to control the reflection or transmission of light. A child can be used. For example, a configuration combining a liquid crystal element and a polarizing plate, or a shutter - A type of MEMS display element can be used. By using a reflective display element, This allows for reduced power consumption of the display panel. Specifically, reflective liquid crystal display elements This can be used as the first display element 650(i,j).

[0642] IPS (In-Plane-Switching) mode, TN (Twisted Ne matic mode, FFS (Fringe Field Switching) mode , ASM(Axially Symmetric aligned Micro-cel l) Mode, OCB (Optically Compensated Birefringence) gence) mode, FLC (Ferroelectric Liquid Crystal) al) mode, AFLC (AntiFerroelectric Liquid Cry It is possible to use a liquid crystal element that can be driven using a driving method such as stal mode. can.

[0643] Also, for example, vertical orientation (VA) mode, specifically MVA (Multi-Domain Vertical Alignment) mode, PVA (Patterned Ve (Electrical Alignment) mode, ECB (Electrically Co ntrolled Birefringence) mode, CPA(Continuouou) mode s Pinwheel Alignment) mode, ASV (Advanced Suspension) This liquid crystal element can be driven using a driving method such as per-view mode. It is possible.

[0644] For example, thermotropic liquid crystals, low molecular weight liquid crystals, polymer liquid crystals, polymer dispersed liquid crystals, ferroelectric Liquid crystals, antiferroelectric liquid crystals, etc. can be used. Alternatively, cholesteric phase, smectic... Using liquid crystal materials exhibiting phases such as cubic, chiral, nematic, and isotropic phases is possible. Yes, it is possible. Alternatively, a liquid crystal material exhibiting a blue phase can be used.

[0645] The reflective layer uses a material that reflects visible light. For example, the reflective layer may contain silver, silver and Materials containing palladium, or materials containing silver and copper, etc., can be used.

[0646] The reflective layer can reflect light that has passed through layer 653 containing the liquid crystal material.

[0647] The reflective layer may have irregularities on its surface. This allows it to reflect incident light in various directions. This allows for a white display.

[0648] The first electrode 651(i,j) may be used as a reflective layer. Alternatively, a layer 653 containing liquid crystal material may be used. A reflective layer may be placed between the first electrode 651(i,j) and the liquid crystal material. A first translucent electrode 651(i,j) may be placed between the layers 653 containing the material. .

[0649] The total area of ​​opening 651H can be set as appropriate. (Relative to the total area of ​​non-openings) If the ratio of the total area of ​​651H is small, the display using the first display element 650(i,j) It can be made brighter. Also, the ratio of the total area of ​​openings 651H to the total area of ​​non-openings is large. This makes the display using the second display element 640(i,j) brighter. The area of ​​the aperture 651H is determined so that sufficient brightness can be obtained even when using the display. It is preferable.

[0650] Furthermore, if the area of ​​the aperture 651H is small, the electric field applied to the layer 653 containing the liquid crystal material will not be uniform. This allows for suppression of a decrease in the display quality of the first display element 650(i,j). Aperture 651H If the area is large, the light emitted by the second display element 640(i,j) will be outside the display device. This can improve the efficiency of retrieval.

[0651] The shape of the opening 651H is not particularly limited and can be, for example, a polygon such as a square, an ellipse, a circle, It can be cross-shaped, elongated stripe-shaped, slit-shaped, or checkerboard-shaped. The opening 651H is adjacent to They may be positioned close to the pixels. Preferably, the aperture 651H is positioned close to the sub-pixels of the same color. They are arranged in this way. As a result, the light emitted by the second display element 640(i,j) is directed to the adjacent other This suppresses the phenomenon (also known as crosstalk) where light is incident on the colored layer located in the subpixels of a color. Cut.

[0652] A conductive material that transmits visible light can be used for the second electrode 652. For example, the second The electrode 652 can be made of a conductive oxide such as an indium-containing conductive oxide. Alternatively, the second electrode 652 may have a thin layer (for example, 1 nm or more in thickness) that allows light to pass through. A metal film (less than 10 nm) can be used. Alternatively, the second electrode 652 may contain silver. Metal nanowires, such as nanowires, can be used.

[0653] Specifically, the second electrode 652 contains indium oxide, indium tin oxide, and indium Zinc oxide, zinc oxide, zinc oxide with added gallium, zinc oxide with added aluminum These can be used.

[0654] The structural KB may use organic materials, inorganic materials, or composite materials of organic and inorganic materials. This is possible. Structure KB has the function of a spacer. Also, as structure KB, Granular spacers may be used. As granular spacers, silica, or resin or It is preferable to use an elastic material such as rubber. The granular spacer is compressed in the vertical direction. It may take on a different shape.

[0655] For alignment films AF1 and AF2, for example, polyimide can be used. It is preferable to form them using rubbing or photo-alignment techniques so as to be oriented in that direction. For example, a film containing soluble polyimide can be used as the orientation film AF1 or orientation film AF2. can.

[0656] The functional film 670 may include a polarizing plate, a phase difference plate, a diffusion film, an anti-reflective film, or a light-gathering film, etc. Alternatively, a polarizing plate containing a dichroic dye can be used in the functional film 670. Yes, it is possible. Additionally, it can have an antistatic coating to suppress dust adhesion, and a water-repellent coating to make it harder for dirt to stick. A hard coat film or the like that suppresses the occurrence of scratches during use can be used in the functional film 670. .

[0657] The display device has transistors of one or more configurations. For example, the display device has, At least one of the transistors with the configurations shown in 44(B) to (D) can be applied. .

[0658] The switch SW1 shown in Figure 44(B) consists of a conductive layer 604, an insulating layer 606, a semiconductor layer 608, It has conductive layers 612a and 612b. The conductive layer 604 functions as a gate. Of the conductive layers 612a and 612b, one functions as a source and the other as a drain. It functions as a gate. The insulating layer 606 functions as a gate insulating layer. Switch SW1 is The configuration is not limited to that shown in Figure 44(B), but may also be as shown in Figures 44(C) and (D).

[0659] The transistors M and MD shown in Figure 44(C) have a conductive layer 604 and an insulating layer 60 6. It has a semiconductor layer 608, a conductive layer 612a, a conductive layer 612b, and a conductive layer 624. The conductive layer 604 functions as a gate. Of the conductive layer 612a and conductive layer 612b, one One acts as the source and the other as the drain. The insulating layer 606 is the gate insulating layer It functions as a back gate. The conductive layer 624 and the semiconductor An insulating layer 616 is located between layers 608. Conductive layers 624 and 604 are semiconductors. It has an overlapping portion via layer 608. The conductive layer 624 is the same as the insulating layer 616 and the insulating layer 618. It is located in between. Transistors M and MD may have the same configuration, Different configurations are also possible. For example, transistor M and transistor MD are, The configuration can be any of those shown in Figures 44(B) to (D). In transistor M, the width of conductive layer 604 is narrower than the width of conductive layer 624, It is not limited. In the transistor MD shown in Figure 44(A), the width of the conductive layer 604 is the conductive It is wider than the width of layer 624, but is not limited to that.

[0660] The transistor shown in Figure 44(D) consists of a conductive layer 604, an insulating layer 606, a semiconductor layer 608, and a conductive layer 608. It has an electrolytic layer 612a and a conductive layer 612b. The conductive layer 604 functions as a gate. The insulating layer 606 functions as a gate insulating layer.

[0661] The semiconductor layer 608 has a first region 608a and a second region 608 that do not overlap with the conductive layer 604. The semiconductor layer 608 further comprises a first region 608a and a second region 608b. It has a third region 608c in between. The third region 608c overlaps with the conductive layer 604.

[0662] The first region 608a and the second region 608b have lower resistivity compared to the third region 608c. One region functions as the source region, and the other functions as the drain region. First region 6 Region 08a is electrically connected to the conductive layer 612a. The second region 608b is connected to the conductive layer 612 It is electrically connected to b.

[0663] As described in Embodiment 1 and other embodiments, an electronic device according to one aspect of the present invention comprises a display panel and a power storage device. They are stacked together. Figure 45 shows an example of a cross-sectional view when the display panel and the thin secondary battery are stacked together. The display panel shown in Figure 45 has the same configuration as the display device 600 shown in Figure 44(A). Furthermore, the thin secondary battery shown in Figure 45 is similar to the battery unit 500 shown in Figure 14(A). It is structured.

[0664] In Figure 45, the circuit board 610 of the display panel and the casing 509 of the battery unit are in contact. Although an example has been shown, the present invention is not limited thereto. The display panel and the battery unit are bonded together. They may be fixed to each other by an agent or the like. Also, between the display panel and the battery unit, It may have a roadbed or the like.

[0665] This embodiment can be combined with other embodiments as appropriate. [Explanation of Symbols]

[0666] AF1 alignment layer AF2 alignment layer C1 Capacitive element C2 Capacitive element G1 scan line G2 scan line S1 signal line S2 signal line SW1 Switch SW2 Switch VCOM1 Wiring VCOM2 Wiring 10 Display Panel 11 Light-emitting element 12a terminal 12b terminal 13 Display elements 15 Display 15a Display section 15b Display section 15c Display section 20 Energy storage devices 21a electrode 21b Electrode 30 circuits 31 Antenna 32 controllers 33a terminal 33b terminal 34 terminals 35 Electronic Components 40 Sealing body 41 Sealing area 41a Sealing area 41b Sealing area 42 Space 45 Wiring 50 circuits 51 switches 52a terminal 52b terminal 53a Wiring 53b Wiring 55 Circuit board 68 Antenna 70 areas 91 Fasteners 93 Aperture 95 Sealing part 97 bands 100 Electronic equipment 100a electronic equipment 100b electronic equipment 100c electronic equipment 100d electronic equipment 100e electronic equipment 101 Electronic equipment 101a Electronic equipment 101b Electronic equipment 101c Electronic equipment 101d Electronic equipment 101e Electronic equipment 150 elements 150a element 150b element 151 elements 151a element 151b element 151c element 155 bands 200 Secondary battery 203 Separator 203a area 203b area 207 Exterior 211 Positive electrode 211a positive electrode 215 negative electrode 215a negative electrode 220 Sealing layer 221 Positive lead 225 Negative lead 230 Electrode assembly 231 Electrode assembly 250 Secondary battery 281 Tab Area 282 Tab Area 301 Display section 302 pixels 302B subpixels 302G sub-pixels 302R sub-pixel 302t transistor 303c capacity 303g(1) Scan line drive circuit 303g(2) Image Pixel Driving Circuit 303s(1) Image signal line driving circuit 303s(2) Imaging signal line drive circuit 303t transistor Gate 304 308 image pixels 308p Photoelectric element 308t transistor 309 FPC 311 Wiring 319 terminals 321 Insulating layer 328 Bulkhead 329 Spacer 350R light-emitting element 351R lower electrode 352 Upper electrode 353 EL layer 353a EL layer 353b EL layer 354 Middle Class 360 adhesive layer 367BM light shielding layer 367p anti-reflection layer 367R colored layer 380B Light-Emitting Module 380G Light-Emitting Module 380R Light-Emitting Module 390 Touch Panel 500 Battery Units 501 Positive electrode current collector 502 Positive electrode active material layer 503 Positive electrode 504 Negative electrode current collector 505 Negative electrode active material layer 506 negative electrode 507 Separator 508 Electrolyte 509 Exterior 510 Positive Lead 511 Negative lead 521 Display section 525 Touch Panel 525B Touch Panel 529 FPC 589 Insulating layer 590 Flexible substrate 591 Electrode 592 Electrode 593 Insulating layer 594 Wiring 595 Touch Sensor 597 Adhesive layer 598 Wiring 599 Connectivity Layer 600 display device 602 pixels 604 Conductive layer 605 Adhesive layer 606 Insulating layer 608 Semiconductor layer 608a area 608b area 608c area 610 circuit board 611a Conductive layer 611b Conductive layer 612a conductive layer 612b conductive layer 616 Insulating layer 618 Insulating layer 619a Conductive layer 619b conductive layer 621 Insulating layer 624 Conductive layer 630-pixel circuit 640 Second display element 641 Third electrode 642 Fourth electrode 643 Layer containing luminescent material 650 First display element 651 First electrode 651H opening 652 Second electrode 653 Layer containing liquid crystal material 660 Functional Layers 661 Insulating layer 662 Connection part 668 Insulating layer 670 Functional membrane 671 Insulating layer 681 First conductive layer 682 Second conductive layer 690 circuit boards 691a area 691b area 691c area 695 Adhesive layer 701 Flexible substrate 703 Adhesive layer 703a adhesive layer 703b adhesive layer 705 Insulating layer 711 Flexible substrate 713 Adhesive layer 715 Insulating layer 723 Electrode 726 Insulating layer 728 Insulating layer 729 Insulating layer 742 Semiconductor layer 743 Electrode 744a electrode 744b electrode 746 Electrode 747a aperture 747b aperture 747c aperture 747d aperture 771 circuit board 772 Insulating layer 804 Light-emitting part 806 Drive Circuit Section 808 FPC 814 Conductive layer 815 Insulating layer 817 Insulating layer 817a Insulating layer 817b Insulating layer 820 transistors 821 Insulating layer 822 Adhesive layer 823 Spacer 824 transistors 825 Connector 830 Light-emitting elements 831 Lower electrode 832 Optical adjustment layer 833 EL layer 835 Upper electrode 845 Colored layer 847 Light blocking layer 848 transistors 849 Overcoat 856 Conductive layer 857 Conductive layer 857a Conductive layer 857b Conductive layer

Claims

1. An electronic device having a light-emitting element, an energy storage device, a circuit, and a encapsulant, The sealing body comprises a first film and a second film. The light-emitting element, the energy storage device, and the circuit are sealed by the first film and the second film. The light-emitting element has the function of being able to emit light using power supplied from the energy storage device, The circuit comprises an antenna and a controller, the antenna having the function of receiving power from an external source, the controller having the function of converting the power received by the antenna and outputting it to the energy storage device, and the circuit having the function of charging the energy storage device through the antenna and the controller. At least a portion of the sealing body has the function of being able to transmit light emitted by the light-emitting element, The electronic device has a portion having a curved surface, and the light-emitting element is arranged in the portion having the curved surface. The aforementioned electronic device can be worn by the user, An electronic device in which the energy storage device, the antenna, and the light-emitting element are stacked in this order.

2. An electronic device having a light-emitting element, an energy storage device, a circuit, and a encapsulant, The light-emitting element, the energy storage device, and the circuit are sealed by the sealing body. The light-emitting element has the function of being able to emit light using power supplied from the energy storage device, The circuit comprises an antenna and a controller, the antenna having the function of receiving power from an external source, the controller having the function of converting the power received by the antenna and outputting it to the energy storage device, and the circuit having the function of charging the energy storage device through the antenna and the controller. At least a portion of the sealing body has the function of being able to transmit light emitted by the light-emitting element, The electronic device has a portion having a curved surface, and the light-emitting element is arranged in the portion having the curved surface. The aforementioned electronic device can be worn by the user, An electronic device in which the energy storage device, the antenna, and the light-emitting element are stacked in this order.

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