Semiconductor manufacturing equipment, method for executing processing for semiconductor manufacturing equipment

Abstract

To prevent the misidentification of semiconductor manufacturing equipment that should be operated on. [Solution] The present disclosure provides a semiconductor manufacturing apparatus comprising: an execution instruction receiving unit that receives an instruction to execute a predetermined process relating to the operation control of the semiconductor manufacturing apparatus; an identification information receiving unit that receives an input of identification information of the semiconductor manufacturing apparatus; and an execution unit that, when the identification information of the semiconductor manufacturing apparatus set in advance in the semiconductor manufacturing apparatus and the identification information of the semiconductor manufacturing apparatus received by the identification information receiving unit are the same, executes the predetermined process in accordance with the instruction to execute the predetermined process.

Description

Technical Field

[0001] The present disclosure relates to a semiconductor manufacturing apparatus and a method for executing processing of the semiconductor manufacturing apparatus.

Background Art

[0002] Patent Document 1 discloses a technique for displaying whether to continue a shutdown operation when the shutdown operation is performed in a medical diagnostic apparatus, thereby attracting the attention of an operator and suppressing an erroneous operation of the apparatus. There are many semiconductor manufacturing apparatuses operating in a semiconductor manufacturing factory, and many of the same model types are arranged side by side.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The present disclosure provides a technique for suppressing an error in a semiconductor manufacturing apparatus to be an operation target.

Means for Solving the Problems

[0005] In view of the above problems, the present disclosure includes an execution instruction reception unit that receives an execution instruction for executing a predetermined process related to operation control of the semiconductor manufacturing apparatus for the semiconductor manufacturing apparatus, an identification information reception unit that receives an input of identification information of the semiconductor manufacturing apparatus, and when the identification information of the semiconductor manufacturing apparatus preset in the semiconductor manufacturing apparatus is the same as the identification information of the semiconductor manufacturing apparatus received by the identification information reception unit, an execution unit that executes the predetermined process in accordance with the execution instruction for the predetermined process.

[0006] Furthermore, this disclosure relates to a semiconductor manufacturing apparatus that performs predetermined processing related to the operation control of a semiconductor manufacturing apparatus in response to an operator's operation, and is characterized by comprising: at least two operation receiving means arranged at a certain distance or more apart from the semiconductor manufacturing apparatus; and an execution unit that performs the predetermined processing on the semiconductor manufacturing apparatus when it detects that the two operation receiving means have been operated at the same time.

[0007] Furthermore, this disclosure is characterized by having: an execution instruction receiving unit that receives an instruction to execute a predetermined process relating to the operation control of a semiconductor manufacturing apparatus; a reservation information storage unit that stores reservation information for the predetermined process; and an execution unit that, when the reservation information is held in the reservation information storage unit, executes the predetermined process on the semiconductor manufacturing apparatus in response to the instruction to execute the predetermined process. [Effects of the Invention]

[0008] This can help prevent the misidentification of semiconductor manufacturing equipment that should be operated on. [Brief explanation of the drawing]

[0009] [Figure 1] This is a schematic diagram of an example of a processing system that includes semiconductor manufacturing equipment and an equipment group management system. [Figure 2] This is a hardware configuration diagram of an example of semiconductor manufacturing equipment. [Figure 3] This is a diagram illustrating an example of the functional configuration of semiconductor manufacturing equipment (Example 1). [Figure 4] This figure shows an example of screen transitions displayed on a touch panel display (Example 1). [Figure 5] This is an example flowchart illustrating the process of shutting down semiconductor manufacturing equipment (Example 1). [Figure 6] This diagram illustrates an example of the placement of a hardware switch (Example 2). [Figure 7] This is a functional configuration diagram illustrating an example of the functions of semiconductor manufacturing equipment (Example 2). [Figure 8] This is a diagram showing an example of the transition of a screen displayed on a touch panel display (Example 2). [Figure 9] This is a flowchart diagram explaining an example of the process of shutting down a semiconductor manufacturing apparatus (Example 2). [Figure 10] This is a diagram showing an example of the transition of a screen displayed on a touch panel display (a modification of Example 2). [Figure 11] This is a flowchart diagram explaining an example of the process of shutting down a semiconductor manufacturing apparatus (a modification of Example 2). [Figure 12] This is a functional block diagram showing an example of the functions of a semiconductor manufacturing apparatus (Example 3). [Figure 13] This is a diagram showing an example of reservation information (Example 3). [Figure 14] This is a diagram showing an example of the transition of a screen displayed on a touch panel display (Example 3). [Figure 15] This is a flowchart diagram explaining an example of the process of shutting down a semiconductor manufacturing apparatus (Example 3). [Figure 16] This is a diagram showing an example of reservation information (a modification of Example 3). [Figure 17] This is a flowchart diagram explaining an example of the process of shutting down a semiconductor manufacturing apparatus (a modification of Example 3).

Modes for Carrying Out the Invention

[0010] Hereinafter, non-limiting exemplary embodiments of the present disclosure will be described with reference to the accompanying drawings. As an example of the mode for carrying out the present disclosure, a method for executing a process of a semiconductor manufacturing apparatus will be described with reference to the drawings.

[0011] 〔Regarding the power-off of the semiconductor manufacturing apparatus〕 A semiconductor manufacturing apparatus continuously produces substrates such as wafers for 24 hours. Therefore, when operations such as hardware or software updates and regular maintenance are required, the semiconductor manufacturing apparatus is shut down according to a schedule. Shutting down means setting the power state to a state where the above operations are possible (for example, the power-off state). An operator directly operates the semiconductor manufacturing apparatus to shut it down. However, since many semiconductor manufacturing apparatuses are operating in a semiconductor manufacturing factory and there are many identical models lined up, there may be a factor causing misoperation of the semiconductor manufacturing apparatus to be operated, that is, the semiconductor manufacturing apparatus that requires the operation (shutting down). If an operator shuts down a semiconductor manufacturing apparatus that should not be shut down, it may result in major losses such as the need to modify the manufacturing schedule or the production of substrates that cannot be shipped.

[0012] Therefore, in this embodiment, the following three methods are used to prevent an operator from shutting down a semiconductor manufacturing apparatus that should not be shut down. In other words, only the semiconductor manufacturing apparatus that should be shut down is shut down. Hereinafter, these are simply referred to as "suppressing misoperation of the semiconductor manufacturing apparatus".

[0013] (i) Request the input of a pre-registered device name of the semiconductor manufacturing apparatus, and execute shutdown when the pre-registered device name is input.

[0014] When an operator mistakenly believes that a semiconductor manufacturing apparatus is the one to be shut down (actually it is not the one to be shut down), simply displaying a confirmation message when shutting down cannot detect the misoperation of the semiconductor manufacturing apparatus. Thus, by requiring the input of the pre-registered device name, the operator can shut down the semiconductor manufacturing apparatus to be shut down without misoperation.

[0015] (ii) Hardware switches or other operation receiving means are provided on the front and rear of the semiconductor manufacturing equipment, and a shutdown operation is accepted when both the front and rear operation receiving means are pressed. Note that the front and rear are examples of locations where hardware switches or other means are placed that require two or more people to operate and are located at a certain distance apart.

[0016] Even if an operational rule is established requiring two people to confirm the shutdown process, it was not possible to enforce this rule because only one person operates the semiconductor manufacturing equipment. Thus, this disclosure makes it possible to enforce the operational rule of two people confirming the shutdown process by providing a mechanism for two people to perform the shutdown operation.

[0017] (iii) The semiconductor manufacturing equipment to be shut down is reserved from the equipment group management system described later, and the shutdown is executed for semiconductor manufacturing equipment for which a shutdown is reserved.

[0018] When an administrator instructs an operator to shut down a semiconductor manufacturing device, there is a possibility of mistakenly communicating the wrong device. Therefore, confirming that a semiconductor manufacturing device is scheduled for shutdown can prevent such miscommunication and errors.

[0019] [Regarding terminology] A predetermined process related to the operation control of semiconductor manufacturing equipment is a process that changes the operating state of the semiconductor manufacturing equipment from one in which it can perform its intended operations, such as process control, to one in which it cannot. For example, turning off the power puts the semiconductor manufacturing equipment in a state where it cannot perform its intended operations, such as process control. Turning off the power also means returning the equipment to an operating state in which hardware and software updates, periodic maintenance work, etc., can be performed. Turning off the power is, for example, a state in which power is not supplied from the power strip. In this embodiment, turning off the power may be referred to as a shutdown.

[0020] This embodiment describes a method to prevent misidentification of semiconductor manufacturing equipment 2 when it is shut down, but it can also be used to prevent misidentification of semiconductor manufacturing equipment 2 when it is restarted. Restarting means terminating the software running on the equipment and then starting it again. Restarting can involve turning off the power, or turning off only the software while the power remains on. In addition, to prevent misidentification of semiconductor manufacturing equipment 2, actions such as component replacement, maintenance, or relocation that involve turning off the power may be included, as well as starting up, arbitrary button operations, etc.

[0021] [Example System Configuration] Figure 1 is a schematic diagram of a processing system 1 having semiconductor manufacturing equipment 2 and equipment group management system 6. As shown in Figure 1, the processing system 1 of this disclosure comprises multiple semiconductor manufacturing equipment 2 (21-2 in Figure 1). n ) and a device group management system 6 and a network 5 that connects them to each other.

[0022] The semiconductor manufacturing equipment 2 is located, for example, in a cleanroom, and the administrator controls the semiconductor manufacturing equipment 2 by operating the equipment group management system 6 located in a separate room. For example, the equipment group management system 6 accepts input of a recipe (a command that specifies process conditions and procedures) and transmits the recipe to the semiconductor manufacturing equipment 2. The worker enters the cleanroom and performs "machine operation," such as transporting the substrates to be processed and executing the recipe on the semiconductor manufacturing equipment 2, by operating various buttons.

[0023] The semiconductor manufacturing apparatus 2 may include various types of equipment depending on the process. For example, there are deposition apparatuses for forming thin films on semiconductor wafers, oxidation apparatuses for oxidizing the surface region of semiconductor wafers, diffusion apparatuses for diffusing (doping) impurities onto the surface region of semiconductor wafers, annealing apparatuses, etching apparatuses, etc. Furthermore, the semiconductor manufacturing apparatus 2 may be an apparatus that processes substrates using plasma. Such apparatuses include Atomic Layer Deposition (ALD) apparatuses, Capacitively Coupled Plasma (CCP), Inductively Coupled Plasma (ICP), Radial Line Slot Antenna (RLSA), Electron Cyclotron Resonance Plasma (ECR), Helicon Wave Plasma (HWP), etc., and any type of apparatus is applicable.

[0024] Figure 2 shows the hardware configuration diagram of semiconductor manufacturing equipment 2. Note that functions related to the semiconductor manufacturing process are omitted in Figure 2. Semiconductor manufacturing equipment 2 includes a network interface 11, a system controller 12, a data storage unit 13, a touch panel interface 14, a touch panel display 15, an input / output interface 16, and at least two hardware switches 17a, 17b, etc. When referring to any of the hardware switches 17a, 17b, "hardware switch 17" is used.

[0025] The network interface 11 is a NIC (Network Interface Card), such as an Ethernet card (registered trademark). The network interface 11 connects to the network 5 and enables communication with the device group management system 6.

[0026] The system controller 12 is a microcontroller, SoC (System on a Chip), or SiP (System in a Package) that includes a CPU, RAM, ROM, etc. The system controller 12 performs all the necessary controls for film deposition according to the recipe, including temperature, pressure, exhaust, injection of processing gas, and substrate replacement. In this embodiment, the system controller 12 also performs control related to shutdown.

[0027] The touch panel interface 14 converts signals from the touch panel display 15 into information such as the coordinates of the pressed area and which button on the screen was pressed, and notifies the system controller 12. A touch panel is an electronic component that combines a display device such as an LCD panel with a position input device such as a touchpad, and is an input device that operates equipment by pressing on the display on the screen.

[0028] The input / output interface 16 converts the state (on, off) of the hardware switch 17 into a signal and notifies the system controller 12. The hardware switch 17 is, for example, a momentary switch that turns on when pressed by an operator and turns off due to biasing force when the operator releases their hand.

[0029] The data storage unit 13 is a storage device such as an SSD (Solid State Drive), HDD (Hard Disk Drive), or ROM, and holds various types of data. The data storage unit 13 is preferably a non-volatile memory, but it may also be volatile. [Examples]

[0030] In this embodiment, we describe a power-off method in which "(i) the semiconductor manufacturing equipment requests input of a pre-registered equipment name, and if a pre-registered equipment name is entered, it performs a shutdown."

[0031] [About the features] Figure 3 is an example of a functional configuration diagram showing the functions of the semiconductor manufacturing apparatus 2 in this embodiment. The semiconductor manufacturing apparatus 2 has an execution instruction receiving unit 21, an identification information receiving unit 22, an identification information determination unit 23, an execution unit 24, and an apparatus name storage unit 25. Each of these functional units of the semiconductor manufacturing apparatus 2 is a function or means realized by the system controller 12 shown in Figure 2 executing instructions included in one or more programs installed in the semiconductor manufacturing apparatus 2.

[0032] The execution instruction receiving unit 21 displays the shutdown execution screen, described later, on the touch panel display 15 and receives a shutdown execution instruction from the operator. The shutdown execution screen may also be displayed on a display other than a touch panel.

[0033] The identification information receiving unit 22 displays the device name input screen, described later, on the touch panel display 15 and accepts the device name input from the operator. The device name input screen may also be displayed on a display other than a touch panel.

[0034] The identification information determination unit 23 determines whether the device name stored in the device name storage unit 25 matches the device name received by the identification information reception unit 22. For this reason, the device name storage unit 25 has individual device names pre-stored for each semiconductor manufacturing device 2. The device name is a combination of letters and numbers that is easy for workers to input, but the device name serves as identification information. Therefore, the device name only needs to be identification information that can identify or specify the semiconductor manufacturing device 2. However, it does not necessarily have to be unique, and the same identification information may be assigned to several semiconductor manufacturing devices 2 belonging to a group.

[0035] This section explains how to save device names. For example, an operator can directly operate the semiconductor manufacturing equipment 2 and input the device name. Alternatively, since the equipment group management system 6 communicates with the semiconductor manufacturing equipment 2, it can display the model number, serial number, etc., transmitted from the semiconductor manufacturing equipment 2, and the administrator can input the device name. Alternatively, the equipment group management system 6 can assign a unique device name (such as a combination of numbers or letters) to each semiconductor manufacturing equipment 2 in response to the administrator's operation. The semiconductor manufacturing equipment 2 can display its own device name on the touch panel display 15. The equipment group management system 6 can also display the device name transmitted from the semiconductor manufacturing equipment 2, along with information that can identify the semiconductor manufacturing equipment 2, such as the model number and serial number. Therefore, administrators and operators can know the device name of the semiconductor manufacturing equipment 2 that should be shut down.

[0036] The execution unit 24 shuts down the semiconductor manufacturing equipment 2. For example, the execution unit 24 checks whether the heater temperature, pressure, gas injection status, substrate transport status, etc., are in a state where shutdown is possible. If these are in a state where shutdown is possible, the execution unit 24 saves data from RAM to SSD, closes files, terminates OS processing, and finally cuts off the power to the semiconductor manufacturing equipment 2.

[0037] [Example of screen transitions] Next, with reference to Figure 4, we will explain an example of screen transitions displayed on the touch panel display 15. Figure 4 shows an example of screen transitions displayed on the touch panel display 15 when the system is shut down.

[0038] Figure 4(a) shows an example of the shutdown execution screen 100. The shutdown execution screen 100 is a screen that accepts a shutdown execution command. The shutdown execution screen 100 has a message 101 that says "Press the Yes button if you want to shut down", a Yes button 102, and a No button 103. When the user presses the Yes button 102, the semiconductor manufacturing equipment 2 accepts the shutdown execution command, and the shutdown execution screen 100 transitions to the equipment name input screen 110 shown in Figure 4(b).

[0039] Figure 4(b) shows an example of the device name input screen 110. The device name input screen 110 includes a message 111 that reads "Please enter the device name and press the verification button," a device name input field 112, a verification button 113, and a cancel button 114. • The device name input field 112 is where the worker enters the name of the semiconductor manufacturing equipment 2 that is to be shut down. The matching button 113 is a button that allows an operator to request the semiconductor manufacturing equipment 2 to verify whether the equipment name stored in the equipment name storage unit 25 matches the equipment name entered in the equipment name input field 112. If they match, a shutdown is performed. The cancel button 114 is a button used to return to the shutdown execution screen 100.

[0040] Figure 4(c) shows an example of the device name input screen 110 with the software keyboard 115 displayed. The software keyboard 115 appears when the worker touches the device name input field 112. The worker can use the software keyboard 115 to input the device name of the semiconductor manufacturing equipment 2 that has been instructed.

[0041] [Shutdown procedure] Figure 5 is a flowchart illustrating the process of shutting down semiconductor manufacturing equipment 2. The explanation assumes that the worker is viewing the shutdown execution screen 100.

[0042] First, the execution instruction receiving unit 21 determines whether or not it has received an execution instruction to shut down (S11). That is, it determines whether or not the "Yes" button 102 was pressed on the shutdown execution screen 100 in Figure 4(a).

[0043] If the determination in step S11 is Yes, the identification information receiving unit 22 displays the device name input screen 110 on the touch panel display 15. The worker touches the device name input field 112 to display the software keyboard 115 (S12). The worker operates the software keyboard 115 to enter the device name of the semiconductor manufacturing equipment 2 as instructed by the manager verbally, by email, on paper, etc. After entering the information, the worker closes the software keyboard 115 using the close button 116 and presses the verification button 113.

[0044] When the matching button 113 is pressed, the identification information determination unit 23 retrieves the device name stored in the device name storage unit 25 and determines whether it matches the device name entered in the device name input field 112 (S13).

[0045] If the decision in step S13 is Yes, the execution unit 24 starts the shutdown of the semiconductor manufacturing equipment 2 in accordance with the execution instruction (S14).

[0046] If the determination in step S13 is No, the identification information receiving unit 22 displays an error message on the touch panel display 15 (S15). The error message may be, for example, "Device name does not match."

[0047] In this case, the worker can clear the error message (which may be cleared automatically) and then operate the software keyboard 115 again to enter the name of the semiconductor manufacturing equipment 2 that has been instructed. If the identification information receiving unit 22 does not find a match even after the matching button 113 has been pressed N times, it may disable the display of the equipment name input screen 110 for a certain period of time. In this way, the power-off method of this disclosure makes it easier to prevent the misidentification of the semiconductor manufacturing equipment 2.

[0048] [Main effects] If the operator mistakenly believes that semiconductor manufacturing equipment 2 is the one to be shut down (when it is not), simply displaying a confirmation message during shutdown would not allow them to notice the mistake. According to this embodiment, by having semiconductor manufacturing equipment 2 request input of a pre-registered equipment name before the shutdown is performed, this disclosure can suppress the misidentification of semiconductor manufacturing equipment 2 as the one to be shut down. [Examples]

[0049] In this embodiment, we describe a power-off method in which "(ii) operation receiving means such as hardware switches are provided on the front and rear of the semiconductor manufacturing equipment, and a shutdown operation is accepted when both the front and rear operation receiving means are pressed."

[0050] [Example of hardware switch placement] First, an example of the arrangement of the hardware switches 17 will be explained with reference to Figure 6. Figure 6 is a diagram showing an example of the arrangement of the hardware switches 17 in relation to an external perspective view of the semiconductor manufacturing equipment 2. Hardware switches 17a and 17b (an example of two operation receiving means) are arranged in two locations on the front and rear of the semiconductor manufacturing equipment 2. The two hardware switches 17a and 17b are not limited to the front and rear, but only need to be separated by a distance sufficient to prevent one worker from pressing them simultaneously (hereinafter simply referred to as a certain distance or more). Therefore, hardware switch 17a may be arranged on the front, rear, left and right sides, or top, and hardware switch 17b may be arranged on a different front, rear, left and right sides, or top than hardware switch 17a. However, two hardware switches 17a and 17b may be arranged on the same surface as long as they are separated by a certain distance or more. Therefore, the certain distance can be about 2 [m].

[0051] Furthermore, it is preferable that one of the two hardware switches 17a and 17b is located near the touch panel display 15. This allows one worker to press the hardware switch 17 while viewing the touch panel display 15. Moreover, one worker can simultaneously operate the touch panel display 15 and press the hardware switch 17.

[0052] Alternatively, both hardware switches 17a and 17b may be soft keys displayed on the touch panel display 15. In this case, for example, the touch panel display 15 is provided on the rear of the semiconductor manufacturing equipment 2. Or, one of the two hardware switches 17a and 17b may be a hardware switch 17, and the other may be a soft key displayed on the touch panel display 15. In this case, for example, the hardware switch 17 is located on the rear of the semiconductor manufacturing equipment 2.

[0053] Furthermore, at least one of the two hardware switches 17a and 17b only needs to have the function to detect the operation or presence of a worker, and may be a simple touch sensor or ultrasonic sensor without a display. Alternatively, at least one of the two hardware switches 17a and 17b may be an IC card reader. In this case, since the worker holds the IC card over the reader, a record of the worker who performed the operation can be kept. Hardware switches 17, soft keys, touch sensors, ultrasonic sensors, and IC card readers are examples of operation reception means.

[0054] Note that there may be three or more hardware switches 17. Having three or more workers perform the shutdown procedure can more reliably reduce the chances of mix-ups.

[0055] [About the features] Figure 7 is an example of a functional configuration diagram showing the functions of the semiconductor manufacturing apparatus 2 in this embodiment. The semiconductor manufacturing apparatus 2 in Figure 7(a) has a shutdown operation start unit 31, a first operation detection unit 32, a second operation detection unit 33, an operation determination unit 34, an execution instruction reception unit 35, and an execution unit 36. Each of these functional units of the semiconductor manufacturing apparatus 2 is a function or means realized by the system controller 12 shown in Figure 2 executing instructions included in one or more programs installed in the semiconductor manufacturing apparatus 2. Although hardware switches 17a and 17b are hardware components, they are shown in the diagram for convenience of explanation.

[0056] The shutdown operation initiation unit 31 displays the shutdown initiation screen, described later, on the touch panel display 15 and accepts the start of the shutdown operation in response to the operator's input.

[0057] The first operation detection unit 32 detects the pressing of hardware switch 17a, and the second operation detection unit 33 detects the pressing of hardware switch 17b. While the first operation detection unit 32 detects the pressing of hardware switch 17a, it continuously (or repeatedly) outputs an ON signal to the operation determination unit 34. While the second operation detection unit 33 detects the pressing of hardware switch 17b, it continuously (or repeatedly) outputs an ON signal to the operation determination unit 34.

[0058] The operation determination unit 34 determines whether the first operation detection unit 32 and the second operation detection unit 33 output ON signals at the same time. In other words, the operation determination unit 34 determines whether both hardware switches 17 are in a pressed state.

[0059] The execution instruction receiving unit 35 displays a shutdown execution screen when the operation determination unit 34 determines that the first operation detection unit 32 and the second operation detection unit 33 have outputted ON signals at overlapping times. Therefore, the execution instruction receiving unit 35 in this embodiment can accept a shutdown execution instruction when both hardware switches 17 are pressed.

[0060] The function of the execution unit 36 ​​may be the same as in Example 1.

[0061] Figure 7(b) shows a functional configuration diagram of the semiconductor manufacturing apparatus 2 in a modified example of Embodiment 2. The functions of each functional unit are the same as in Figure 7(a). In this modified example, after the execution instruction receiving unit 35 receives an execution instruction for shutdown, the operation determination unit 34 determines that the first operation detection unit 32 and the second operation detection unit 33 have outputted ON signals in overlapping time, and then the execution unit 36 ​​executes the shutdown.

[0062] [Example of screen transitions] Next, with reference to Figure 8, we will explain an example of screen transitions displayed on the touch panel display 15. Figure 8 shows an example of screen transitions displayed on the touch panel display 15 when the system is shut down.

[0063] Figure 8(a) shows an example of the shutdown start screen 120. The shutdown start screen 120 is the screen where the operator accepts the start of the shutdown operation. The execution of the shutdown is not yet accepted on this screen. The shutdown start screen 120 has a message 121 that says "Do you want to perform the shutdown operation?", a yes button 122, and a no button 123. When the user presses the yes button 122, the shutdown start screen 120 transitions to the hardware switch press prompt screen 130 shown in Figure 8(b).

[0064] Figure 8(b) shows an example of a hardware switch press prompt screen 130. The hardware switch press prompt screen 130 has a message 131 that says, "Please press the hardware switches on the front and rear of the device simultaneously." Upon seeing this message 131, the two workers press the hardware switches 17a and 17b on the front and rear, respectively. It is also advisable for the semiconductor manufacturing device 2 to emphasize the hardware switches 17a and 17b, for example, by flashing them, while the hardware switch press prompt screen 130 is displayed.

[0065] If both hardware switches 17a and 17b are pressed, the hardware switch press prompt screen 130 transitions to the shutdown execution screen 140.

[0066] Figure 8(c) shows an example of the shutdown execution screen 140. The shutdown execution screen 140 may be the same as in Example 1. When the user presses the Yes button 142 on the shutdown execution screen 140, the semiconductor manufacturing equipment 2 accepts the shutdown execution instruction. When the user presses the No button 143, the shutdown execution screen 140 transitions to the shutdown start screen 120.

[0067] The shutdown execution screen 140 is not displayed unless both hardware switches 17a and 17b are pressed, thus preventing a single worker from mistakenly using the wrong semiconductor manufacturing equipment 2.

[0068] Furthermore, the shutdown execution screen 140 may be displayed only while both hardware switches 17a and 17b are pressed. This can more effectively enforce the operational rule that shutdowns are performed by two people who confirm the process.

[0069] [Shutdown procedure] Figure 9 is a flowchart illustrating the process of shutting down semiconductor manufacturing equipment 2. The explanation assumes that the worker has displayed the shutdown start screen 120.

[0070] First, the shutdown operation initiation unit 31 determines whether or not it has received a request to start a shutdown operation (S21). That is, it determines whether or not the "Yes" button 132 was pressed on the shutdown initiation screen 120 in Figure 8(a).

[0071] If the determination in step S21 is Yes, the screen transitions to the hardware switch press prompt screen 130 shown in Figure 8(b). Then, the operation determination unit 34 determines whether the first operation detection unit 32 and the second operation detection unit 33 output ON signals at the same time (S22). To suppress erroneous operation, the operation determination unit 34 may ignore overlapping ON signals within a predetermined time.

[0072] If the determination in step S22 is No, the hardware switch press prompt screen 130 will remain displayed, but the operation determination unit 34 should display an error message after a certain period of time (S25), and return to the main screen (not shown) or the shutdown start screen 120. The error message may be, for example, "Neither of the two hardware switches 17 were pressed."

[0073] If the determination in step S22 is Yes, the execution instruction receiving unit 35 displays the shutdown execution screen 140 shown in Figure 8(c) and determines whether the Yes button 142 has been pressed (S23). In other words, when both hardware switches 17 are pressed, the semiconductor manufacturing equipment 2 becomes capable of receiving a shutdown execution instruction.

[0074] If the decision in step S23 is Yes, the execution unit 36 ​​starts the shutdown of the semiconductor manufacturing apparatus 2 in accordance with the execution instruction (S24).

[0075] If the decision in step S23 is No, the execution unit 36 ​​displays an error message on the touch panel display 15 (S25). First, if the No button 143 is pressed, it is appropriate to return to the main screen or the shutdown start screen 120. If neither the Yes button 142 nor the No button 143 is pressed, the shutdown execution screen 140 remains displayed, but the operation decision unit 34 displays an error message after a certain period of time and returns to the main screen or the shutdown start screen 120. The error message is something like "Shutdown was not performed".

[0076] <Variations of the operating procedure> As shown in Figures 8 and 9, the shutdown procedure does not have to follow the sequence of shutdown start screen 120 → hardware switch press prompt screen 130 → shutdown execution screen 140, but can also follow the sequence of shutdown execution screen 140 → hardware switch press prompt screen 130. Figure 10 shows the latter screen transition. The shutdown execution screen 140 in Figure 10(a) is the same as in Figure 8c), and the hardware switch press prompt screen 130 in Figure 10(b) is the same as in Figure 8(b).

[0077] In this case, if two workers simultaneously press the hardware switch 17, the shutdown will be performed without any further button operation.

[0078] Figure 11 is a flowchart illustrating the process of shutting down semiconductor manufacturing equipment 2. The explanation assumes that the operator has displayed the shutdown execution screen 140.

[0079] First, the execution instruction receiving unit 35 determines whether or not it has received an execution instruction for shutdown (S31). That is, it determines whether or not the "Yes" button 142 was pressed on the shutdown execution screen 140 in Figure 10(a).

[0080] If the determination in step S31 is Yes, the screen transitions to the hardware switch press prompt screen 130 shown in Figure 10(b). Then, the operation determination unit 34 determines whether the first operation detection unit 32 and the second operation detection unit 33 output ON signals at the same time (S32).

[0081] If the determination in step S32 is Yes, the execution unit 36 ​​starts the shutdown of the semiconductor manufacturing apparatus 2 in accordance with the execution instruction (S33).

[0082] If the decision in step S32 is No, the execution unit 36 ​​displays an error message on the touch panel display 15 (S34). If the decision in step S32 is No, the hardware switch press prompt screen 130 remains displayed, but after a certain period of time, it is desirable to display an error message and return to the main screen or shutdown execution screen 140. For example, the error message may be, "Neither of the two hardware switches 17 was pressed."

[0083] [Main effects] According to this embodiment, by providing a mechanism for two people to perform the shutdown operation, it is possible to enforce an operational rule that requires two people to verify the operation while working. [Examples]

[0084] In this embodiment, we will describe a power-off method in which "(iii) the semiconductor manufacturing equipment 2 to be shut down is reserved from the equipment group management system 6, and if the semiconductor manufacturing equipment 2 is reserved for shutdown, the shutdown is performed."

[0085] [About the features] Figure 12 is an example of a functional configuration diagram showing the functions of the semiconductor manufacturing apparatus 2 in this embodiment. The semiconductor manufacturing apparatus 2 has a reservation receiving unit 41, an execution instruction receiving unit 42, a reservation determination unit 43, an execution unit 44, and a reservation information storage unit 45. Each of these functional units of the semiconductor manufacturing apparatus 2 is a function or means realized by the system controller 12 shown in Figure 2 executing instructions included in one or more programs installed in the semiconductor manufacturing apparatus 2.

[0086] The reservation reception unit 41 receives shutdown reservations from the device group management system 6 and stores the reservation information in the reservation information storage unit 45.

[0087] Figure 13 shows an example of reservation information. The reservation information includes the reservation details for each reservation date and time. One of the reservation details is a shutdown. The reservation information may be deleted once the reservation details are executed, or older reservation information may be deleted when the reservation information reaches a certain capacity.

[0088] Returning to Figure 12, the execution instruction receiving unit 42 displays the shutdown execution screen on the touch panel display 15 and receives a shutdown instruction from the operator. The shutdown execution screen may also be displayed on a display other than a touch panel.

[0089] The reservation determination unit 43 determines whether a shutdown is scheduled and whether a predetermined time has elapsed since the reservation acceptance date and time. If a shutdown is scheduled and the predetermined time has not elapsed since the reservation acceptance date and time, the reservation determination unit 43 requests the execution unit 44 to shut down. Since it can be determined that the semiconductor manufacturing equipment 2 for which a shutdown is scheduled is not the semiconductor manufacturing equipment 2 that was mistakenly communicated, mistakes due to communication errors can be prevented.

[0090] The function of the execution unit 44 may be the same as in Example 1.

[0091] [Screen example] Figure 14 shows an example of the screen transitions displayed on the touch panel display 15 during shutdown. Figure 14(a) is the shutdown execution screen 150. The shutdown execution screen 150 in Figure 14(a) is the same as in Figure 4(a). In this embodiment, the shutdown is accepted when the operator presses the Yes button 152 on the shutdown execution screen 150. The shutdown execution screen 150 transitions to the reservation confirmation screen 160.

[0092] Figure 14(b) shows an example of the reservation confirmation screen 160. The reservation confirmation screen 160 has a message 161 that says "Reservation being confirmed".

[0093] [Shutdown procedure] Figure 15 is a flowchart illustrating the process of shutting down semiconductor manufacturing equipment 2. The explanation assumes that the operator is viewing the shutdown execution screen.

[0094] First, the execution instruction receiving unit 42 determines whether or not it has received an execution instruction to shut down (S41). That is, it determines whether or not the "Yes" button 152 was pressed on the shutdown execution screen 150 in Figure 14(a).

[0095] If the determination in step S41 is Yes, the reservation confirmation screen 160 shown in Figure 14(b) is displayed, and the reservation determination unit 43 determines whether or not reservation information related to shutdown is stored in the reservation information storage unit 45 (S42).

[0096] If the determination in step S42 is No, the reservation determination unit 43 displays an error message (S43). The error message may be, for example, "Shutdown is not reserved." In this case, the screen transitions to the main screen or the shutdown execution screen 150.

[0097] If the determination in step S42 is Yes, the reservation determination unit 43 determines whether a predetermined amount of time has elapsed from the reservation acceptance date and time of the shutdown reservation information to the current time (S44).

[0098] The designated time can be, for example, the time required for the work, ranging from a few hours to a full day. In other words, it is assumed that the administrator reserves a shutdown in the device group management system 6 on the day, and that a worker who receives a shutdown instruction from the administrator performs the shutdown work on the same day.

[0099] There may be cases where the administrator wants to reserve a shutdown in the equipment group management system 6 in advance. For example, the administrator might want to set a shutdown reservation one week to one month in advance. In this case, it would be good if the administrator could also set a specific time. For example, if the administrator sets a shutdown reservation one week in advance, the administrator would set the specific time to one week and register it in the reservation information. Note that the shutdown reservation may also be set by an operator for the semiconductor manufacturing equipment 2.

[0100] If the determination in step S44 is No, the reservation determination unit 43 displays an error message (S46). The error message may be, for example, "A predetermined amount of time has elapsed since the reservation was accepted. Please check the semiconductor manufacturing equipment 2 to be shut down." In this case, the screen transitions to the main screen or the shutdown execution screen 150.

[0101] If the determination in step S44 is Yes, the execution unit 44 starts shutting down the semiconductor manufacturing apparatus 2 in accordance with the execution instruction (S45).

[0102] Furthermore, if the system is configured to delete the shutdown reservation information after the shutdown is performed, the decision in step S44 is unnecessary. However, the presence of step S44 allows for a reliable determination of whether a reservation exists, even if the system is configured not to delete the shutdown reservation information after the shutdown is performed, or even if the system is configured to do so but the shutdown reservation information is not deleted.

[0103] <Variation> The administrator may schedule a date and time for the shutdown. In this case, the worker can only perform the shutdown at the scheduled time.

[0104] Figure 16 shows an example of reservation information in this modified example. In the reservation information in Figure 16, the executable date and time are newly registered. The executable date and time is the range of dates and times (start and end) in which the work of the reserved content can be performed. The semiconductor manufacturing equipment 2 accepts a shutdown command if the current time is within this date and time range.

[0105] Figure 17 is a flowchart illustrating the process of shutting down semiconductor manufacturing equipment 2 in this modified example. The explanation assumes that the operator is viewing the shutdown execution screen. Note that the explanation of Figure 17 mainly focuses on the differences from Figure 15.

[0106] In Figure 17, the processing in step S44-2 is different. Specifically, the reservation determination unit 43 determines whether the current time falls within the executionable date and time (date and time range) of the reservation information (S44-2). This allows the worker to execute the reserved shutdown without considering the reservation acceptance date and time.

[0107] [Main effects] According to this embodiment, even if the administrator mistakenly communicates the target semiconductor manufacturing equipment 2 when instructing an operator to shut down, the system can prevent miscommunication by confirming that the shutdown is scheduled.

[0108] 〔others〕 For example, Examples 1 to 3 can be implemented in all or any two combinations thereof. In this way, the present disclosure can further reduce the possibility of misidentification of the semiconductor manufacturing equipment 2.

[0109] Furthermore, the processing system 1 in Figure 1 is just one example, and it goes without saying that there are various system configurations depending on the application and purpose. The classification of equipment, such as the equipment group management system 6 and semiconductor manufacturing equipment 2 in Figure 1, is just one example. [Explanation of Symbols]

[0110] 1. Processing System 2. Semiconductor manufacturing equipment 6. System Management System 21 Execution Instruction Reception Department 22 Identification Information Reception Department 23 Identification Information Determination Unit 24 Execution Department 25 Device name storage section 45 Reservation Information Storage Unit

Claims

1. An execution instruction receiving unit that receives an instruction to execute a predetermined process related to the operation control of a semiconductor manufacturing apparatus, A reservation information storage unit that stores reservation information for the predetermined process, When the reservation information is held in the reservation information storage unit, the execution unit executes the predetermined process on the semiconductor manufacturing apparatus in response to the instruction to execute the predetermined process, A semiconductor manufacturing apparatus characterized by having the following features.

2. The semiconductor manufacturing apparatus according to claim 1, wherein the reservation information is stored in the reservation information storage unit, and if a predetermined time has not elapsed from the reservation acceptance date and time of the reservation information until the execution instruction acceptance unit receives an execution instruction for the predetermined process, the execution unit executes the predetermined process on the semiconductor manufacturing apparatus.

3. The semiconductor manufacturing apparatus according to claim 1, wherein the reservation information is stored in the reservation information storage unit, and when the execution instruction receiving unit receives an execution instruction for the predetermined process within the range of dates and times in which the predetermined process can be executed as registered in the reservation information, the execution unit executes the predetermined process on the semiconductor manufacturing apparatus.

4. The semiconductor manufacturing apparatus according to any one of claims 1 to 3, characterized in that the predetermined process is to turn off the power to the semiconductor manufacturing apparatus, shut it down, or restart it.

5. A step of receiving an instruction to execute a predetermined process related to the operation control of a semiconductor manufacturing apparatus, If reservation information for the predetermined process is stored in the reservation information storage unit in advance, the semiconductor manufacturing apparatus is to perform the predetermined process in response to an instruction to perform the predetermined process. A method for executing processing in a semiconductor manufacturing apparatus, characterized by having the following features.

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