Substrate processing equipment, manufacturing systems, methods for manufacturing articles

Abstract

In manufacturing systems equipped with multiple circuit board processing units of the same configuration, there was a need for technology to improve the efficiency of maintenance work on these units. [Solution] The substrate processing apparatus has a substrate inlet / outlet on the front and an exhaust system utility connection section and two sets of supply system utility connection sections on the rear. When assembled into the processing stage, the exhaust system utility connection section is connected to the exhaust system utility, and one of the two sets of supply system utility connection sections is connected to the supply system utility, and the substrate is loaded or unloaded along a first direction connecting the front and rear through the inlet / outlet. When removed from the processing stage, the exhaust system utility connection section is detached from the exhaust system utility, and both sets of supply system utility connection sections are detached from the supply system utility, and the apparatus moves in a second direction intersecting the first direction.

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus and the like used when manufacturing a substrate used for, for example, a display device.

Background Art

[0002] A method of manufacturing an article is known in which a liquid material is applied to a substrate and the substrate is dried in a reduced-pressure atmosphere or a vacuum atmosphere. For example, an article is manufactured using a manufacturing system including a transport device that transports a substrate, an application device that applies ink to the substrate, and a reduced-pressure drying device that dries the substrate to which the ink has been applied. In such a manufacturing system, it is important to improve the maintainability of the reduced-pressure drying device in order to improve the operation rate and shorten the tact time.

[0003] In addition, in the field of vacuum processing apparatuses used for film formation and etching, efforts have been made to improve the maintainability inside the vacuum processing chamber. Patent Document 1 describes a technique in which a vacuum processing chamber is separated from a manufacturing line and moved to a maintenance area by a moving mechanism.

[0004] The outer shape of the vacuum processing chamber described in Patent Document 1 is a hexahedron, and has an upper surface, a lower surface, a front surface through which a workpiece is carried in / out, a rear surface located on the opposite side to the front surface, and two side surfaces. A quick coupling that can be detached from a gas introduction pipe is provided on the upper surface. An opening for taking in and out the workpiece is provided on the front surface. A maintenance door is provided on the rear surface. On the side surface, a quick coupling that can be detached from an exhaust pipe and an electrical connector that can be connected to a power supply line are provided.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

[0006] In manufacturing systems equipped with multiple circuit board processing units of the same configuration, there was a need for technologies that would improve the efficiency of maintenance work on these units. [Means for solving the problem]

[0007] One aspect of the present invention is a substrate processing apparatus that is detachably incorporated into a manufacturing system capable of incorporating a substrate processing apparatus into each of a plurality of processing stages arranged vertically, the substrate processing apparatus having a substrate entrance and exit, and on the rear side opposite to the front side, comprising an exhaust system utility connection portion that is detachably connected to an exhaust system utility, and two sets of supply system utility connection portions that are detachably connected to a supply system utility, wherein when the substrate processing apparatus is incorporated into any of the plurality of processing stages, the exhaust system utility connection portion is connected to the exhaust system utility, and one of the two sets of supply system utility connection portions is connected to the supply system utility, the substrate is loaded or unloaded through the entrance and exit, and when the substrate processing apparatus is removed from any of the plurality of processing stages and moves in a second direction intersecting a first direction connecting the front and the rear side, the exhaust system utility connection portion is detached from the exhaust system utility, and both of the two sets of supply system utility connection portions are detached from the supply system utility as the apparatus moves. [Effects of the Invention]

[0008] According to the present invention, in a manufacturing system equipped with multiple substrate processing devices having the same configuration, it is possible to provide a technology that is advantageous in improving the workability of maintenance work on substrate processing devices. [Brief explanation of the drawing]

[0009] [Figure 1](a) A schematic plan view of a part of a manufacturing system incorporating multiple substrate processing units. (b) A schematic rear view of a part of a manufacturing system incorporating multiple substrate processing units, viewed from the rear. [Figure 2] A schematic side view of a part of a manufacturing system incorporating multiple circuit board processing units. [Figure 3] A schematic rear view illustrating the connection between the circuit board processing unit and the utility. [Figure 4] A schematic plan view illustrating the placement constraints of external utilities in a manufacturing system. [Figure 5] A schematic plan view illustrating the maintenance method for a circuit board processing device in a manufacturing system. [Figure 6] (a) A diagram showing one step in the procedure for removing the substrate processing equipment installed on the upper processing stage from the production line and transporting it to the maintenance area. (b) A diagram showing another step in the procedure for removing the substrate processing equipment installed on the upper processing stage from the production line and transporting it to the maintenance area. [Figure 7] (a) A diagram showing one step in the procedure for removing the substrate processing equipment installed on the lower processing stage from the production line and transporting it to the maintenance area. (b) A diagram showing another step in the procedure for removing the substrate processing equipment installed on the lower processing stage from the production line and transporting it to the maintenance area. [Figure 8] This diagram shows yet another step in the procedure for removing the substrate processing equipment, which is installed on the lower processing stage, from the manufacturing line and transporting it to the maintenance area. [Figure 9] A schematic plan view illustrating the mechanism for positioning the substrate processing device on the processing stage. [Modes for carrying out the invention]

[0010] With reference to the drawings, a substrate processing apparatus and the like according to an embodiment of the present invention will be described. The embodiments shown below are illustrative, and for example, those skilled in the art can modify the detailed configuration as appropriate without departing from the spirit of the present invention.

[0011] In the drawings referenced in the following description of embodiments, elements indicated by the same reference numeral have the same function unless otherwise specified. If multiple identical elements are shown in a drawing, the assignment of reference numerals and their descriptions may be omitted.

[0012] Furthermore, since drawings may be schematically represented for the convenience of illustration and explanation, the shape, size, and arrangement of elements shown in the drawings may not strictly correspond to those of actual objects. In addition, notations such as "XX or greater and YY or less" or "XX~YY" that indicate a numerical range mean a numerical range that includes the endpoints XX (lower limit) and YY (upper limit). When numerical ranges are described in steps, the upper and lower limits of each numerical range can be combined in any way.

[0013] In the following explanation, for example, when we refer to the X-plus direction, it refers to the same direction as the X-axis arrow in the illustrated Cartesian coordinate system, and when we refer to the X-minus direction, it refers to the direction 180 degrees opposite to the direction indicated by the X-axis arrow in the illustrated Cartesian coordinate system. Furthermore, when we simply refer to the X direction, it refers to the direction parallel to the X-axis, regardless of whether it is the same as or different from the direction indicated by the illustrated X-axis arrow. The same applies to directions other than X. Unless otherwise specified, in the Cartesian coordinate system XYZ coordinate system, the XY plane is the horizontal plane, and the negative Z-axis direction is the vertical direction (direction of gravity).

[0014] [Embodiment] A manufacturing system capable of incorporating a plurality of substrate processing apparatuses and a substrate processing apparatus incorporated therein will be described. FIG. 1(a) is a schematic plan view of a part of a manufacturing system in which a plurality of substrate processing apparatuses having the same configuration (same structure) are incorporated, as viewed in plan, and FIG. 1(b) is a schematic rear view of a part of the manufacturing system as viewed from the rear. Further, FIG. 2 is a side view of a part of the manufacturing system as viewed from the side. The manufacturing system according to the embodiment can be used, for example, in a part of the process of manufacturing an organic EL panel provided with an OLED.

[0015] In a manufacturing system for manufacturing an organic EL panel, ink is applied to a substrate using an inkjet coating apparatus, and the substrate coated with the ink is dried by a vacuum drying apparatus. At that time, when comparing the time required for the inkjet coating apparatus to apply ink to the substrate and the time required for the vacuum drying apparatus to dry the substrate, the former is much shorter than the latter. In order to improve the throughput of substrate manufacturing, it is advantageous to configure the manufacturing system such that a plurality of vacuum drying apparatuses are arranged for one coating apparatus and the vacuum drying apparatuses are operated in parallel.

[0016] Patent Document 1 describes a technique in a manufacturing system including one vacuum processing chamber and one preliminary vacuum chamber, in which the vacuum processing chamber is separated from the manufacturing line and moved to a maintenance area by a moving mechanism. However, what is described in Patent Document 1 is a manufacturing system including a single vacuum processing chamber, not a vacuum drying apparatus, and a method of arranging a plurality of vacuum drying apparatuses having the same configuration has not been studied.

[0017] In Patent Document 1, when separating a single vacuum processing chamber from the production line and moving it to the maintenance area, the vacuum processing chamber is configured to move in the same direction as the loading direction when loading the workpiece into the vacuum processing chamber. However, Patent Document 1 does not discuss a method suitable for installing a plurality of vacuum drying apparatuses with the same configuration in a limited factory site. Also, when arranging a plurality of units, a method suitable for separating from the production line and moving to the maintenance area has not been discussed. If a vacuum drying apparatus is configured in the same way as the vacuum processing chamber of Patent Document 1 and a plurality of units are arranged side by side in the factory site, there is a concern that the entire production system including the movement path will become huge and a large site will be required.

[0018] Further, in the vacuum processing chamber of Patent Document 1, a maintenance door is provided at the rear, but the ease of maintenance work for a vacuum drying apparatus that uniformly dries, for example, a thin and large-area substrate has not been discussed. For example, in the case of a vacuum drying apparatus that dries a thin and large-area substrate, it is difficult to secure a large opening on the rear side. Therefore, when adopting the configuration as in Patent Document 1, access and work must be carried out through a narrow opening in a maintenance work space with a large depth, resulting in a significant decrease in work efficiency.

[0019] The present invention provides a technique advantageous for improving the workability of maintenance work of a substrate processing apparatus in a production system including a plurality of substrate processing apparatuses having the same configuration.

[0020] As shown in Figure 1(a), the manufacturing system includes a substrate transport device 11 for transporting substrates to be processed, a substrate processing device 13 for processing the substrates, and a connecting part 14 for detachably connecting the substrate transport device 11 and the substrate processing device 13. As shown in Figure 1(b) or Figure 2, the manufacturing system includes an upper processing stage STU and a lower processing stage STL, which are processing positions located at different heights in the vertical direction, and each processing stage is detachably equipped with a substrate processing device 13 of the same configuration (same structure). The upper processing stage STU is equipped with a stand for installing the substrate processing device 13, and the substrate processing device 13 is fixed on the stand. The lower processing stage STL may also be equipped with a stand for installing the substrate processing device 13, but in some cases the substrate processing device 13 may be fixed to the floor of the manufacturing plant.

[0021] The substrate transport device 11 is a mechanism for transporting substrates as workpieces, and includes, for example, a substrate transport robot 12 as shown in Figure 2. The substrate transport robot 12 can transport substrates into the substrate processing device 13 installed on the upper or lower processing stage, and transport the substrates out of the substrate processing device 13. A robot is preferably used as the substrate transport device 11, but any device that can stably transport thin, large-area substrates is acceptable, and it is not limited to a robot as shown in the figure.

[0022] The substrate processing apparatus 13 is, for example, a vacuum drying apparatus capable of drying a substrate coated with ink by a coating apparatus in a reduced-pressure atmosphere. The substrate processing apparatus according to the embodiment may be, for example, a manufacturing apparatus for manufacturing a substrate for a display device. The substrate processing apparatus may be configured, for example, as part of a film forming apparatus for forming an organic film on a substrate. The organic film may be, for example, a hole injection layer, hole transport layer, light-emitting layer, electron transport layer, or electron injection layer of an organic light-emitting element (OLED). The process for manufacturing an organic light-emitting element carried out by the substrate processing apparatus according to the embodiment may include a step of drying a substrate to which a solution containing a functional material has been applied, and forming an organic film such as a hole injection layer, hole transport layer, light-emitting layer, electron transport layer, or electron injection layer. In addition to the vacuum drying apparatus according to the embodiment, the manufacturing system for manufacturing organic light-emitting elements (OLEDs) may include apparatus for performing processes such as coating, firing, cooling, dry cleaning, electrode formation, and sealing film formation.

[0023] The substrate processing apparatus 13 is equipped with a depressurized airtight container, and the external shape of the apparatus is generally a rectangular parallelepiped or a cube. For the sake of explanation, of the six main external surfaces of each substrate processing apparatus 13, the surface at the upper end in the vertical direction (Z-positive direction) that forms the roof is called the top surface US, and the surface at the lower end when viewed vertically that forms the bottom is called the bottom surface LS. The surface with the substrate entrance and exit, i.e., the surface connected to the connection part 14, is called the front surface FS, and the surface opposite the front surface FS is called the rear surface RS. The front surface FS is connected to the rear surface RS via the top surface US, the bottom surface LS, the side surface SS1, and the side surface SS2.

[0024] The front surface FS of the substrate processing apparatus 13 is provided with an entrance / exit for loading and unloading substrates into and out of the substrate processing apparatus 13, and a shutter to shield the entrance / exit. When a substrate is loaded into the substrate processing apparatus 13 from the substrate transport device 11, or when a substrate is unloaded from the substrate processing apparatus 13 to the substrate transport device 11, the shutter is opened and the substrate moves through the entrance / exit.

[0025] In the following explanation, the direction in which the substrate moves when it is transported between the substrate transport device 11 and the substrate processing device 13 may be referred to as the first direction. In the example shown in Figures 1(a) and 2, the direction in which the substrate moves when it is loaded from the substrate transport device 11 to the substrate processing device 13 is the Y-minus direction, and the direction in which the substrate moves when it is unloaded from the substrate processing device 13 is the Y-plus direction; therefore, the first direction is the Y direction.

[0026] Furthermore, when processing the substrates brought into the substrate processing apparatus 13, the shutter is shielded, and the atmosphere inside the processing chamber where the substrates are set is controlled to a pressure and gas composition suitable for ink drying.

[0027] The top surface US of the substrate processing apparatus 13 is provided with a maintenance opening (not shown) that can be opened for maintenance work inside the substrate processing apparatus. The maintenance opening may be opened by an openable and closable door, or by removing the roof member of the processing apparatus or the ceiling panel of the processing chamber. In the case of a substrate processing apparatus that processes thin substrates with a large surface area, the internal space of the apparatus is large in plan view despite its small height. Therefore, by providing a maintenance opening on the top surface US, the efficiency of maintenance work can be increased and the working time can be reduced.

[0028] A support portion 15 is provided on the lower surface LS of the substrate processing apparatus 13 to support the main body of the substrate processing apparatus. The support portion 15 may be, for example, fixed feet used when installing the apparatus on a processing stage, or a moving mechanism (e.g., wheels) used when removing the substrate processing apparatus from the processing stage and moving it. The fixed feet or moving mechanism may be configured to be retractable or detachable from the main body of the substrate processing apparatus 13.

[0029] The rear side RS of the substrate processing apparatus 13 is provided with a utility connection section for connecting to utilities. Utilities are auxiliary equipment connected to operate the substrate processing apparatus 13, and include, for example, exhaust system utilities and supply system utilities.

[0030] The rear RS is provided with an exhaust system utility connection section 18 that is detachably connected to an exhaust system utility. The exhaust system utility is an external exhaust device necessary for operating the substrate processing device 13. The exhaust system utility connection section 18 is a coupling that detachably connects the substrate processing device 13 to an exhaust device (not shown) located outside the substrate processing device 13 (for example, a dry vacuum pump with high exhaust capacity). The exhaust system utility is used, for example, to control the pressure inside the processing chamber when the substrate processing device 13 is performing a vacuum drying process on a substrate. It is preferable that the exhaust system utility connection section be covered with a cover or cap when not connected to the exhaust system utility to prevent user contact or contamination.

[0031] Furthermore, the rear RS is provided with two supply system utility connection sections, a supply system utility connection section 16 and a supply system utility connection section 17, which are detachable connection sections for the utility supply device. The supply system utility connection section 16 and the supply system utility connection section 17 have identical structures, and it can be said that the rear RS has two sets of supply system utility connection sections located at different positions.

[0032] The utility supply device is equipment that supplies power, electrical signals, gas, etc., necessary for operating the substrate processing device 13, and power, electrical signals, gas, etc., are supplied to the substrate processing device 13 via the supply system utility connection section.

[0033] The supply system utility connection section is equipped with an electrical connector that can be detachably connected to the electrical wiring in order to receive power and electrical signals from the external electrical wiring. The substrate processing device 13 can receive control signals and power from the external utility supply device via the electrical connector, for example, to operate actuators such as valves and built-in pumps (e.g., turbomolecular pumps) that are equipped in the substrate processing device 13.

[0034] The supply system utility connection section is equipped with a coupling that is detachably connected to the gas supply pipe in order to receive gas from the gas supply pipe. The substrate processing apparatus 13 can receive high-pressure air necessary to operate the built-in air-driven actuator and inert gas used to control the pressure inside the processing chamber during the drying process from an external utility supply device via the coupling.

[0035] The substrate processing apparatus 13 is configured to operate when one of its two sets of supply system utility connection points is connected to an external utility supply device. In other words, it is configured to operate when control signals, power, or gas are supplied from either the supply system utility connection point 16 or the supply system utility connection point 17. For example, the internal electrical circuit of the substrate processing apparatus 13 is configured to operate regardless of which supply system utility connection point connector supplies the control signals or power. For air and gas, the apparatus is configured to operate when supplied from either supply system utility connection point, without gas leakage or inflow from the other supply system utility connection point that does not receive a supply. Specifically, the gas piping inside the substrate processing apparatus 13 is equipped with a backflow prevention valve or other valve. It is preferable that the supply system utility connection points be covered with a cover or cap when not connected to an external utility to prevent user contact or contamination.

[0036] Figure 3 is a schematic rear view illustrating the connection between the substrate processing apparatus 13 and utilities. When the substrate processing apparatus 13 is installed on the upper processing stage STU, the supply system utility connection section 16 is connected to the external utility UU, and when it is installed on the lower processing stage STL, the supply system utility connection section 17 is connected to the external utility UL. The external utility UU and external utility UL are wiring and piping for providing the same type of utility (e.g., control signals, power, air, gas, etc.) from above the substrate processing apparatus 13. The external utility UU and external utility UL are positioned at different locations when viewed in the width direction (X direction) of the substrate processing apparatus 13 and have different lengths. That is, the external utility UU is long enough to reach only the upper processing stage STU, while the external utility UL is long enough to reach the lower processing stage STL. In each substrate processing apparatus 13, the supply system utility connection section 16 and the supply system utility connection section 17 are arranged on the rear RS so as not to overlap each other in the vertical direction. Therefore, the substrate processing equipment and utilities can be connected to the upper processing stage STU and the lower processing stage STL without interfering with each other.

[0037] In the rear RS, it is preferable that the two sets of supply system utility connections (supply system utility connection 16 and supply system utility connection 17) are arranged with the exhaust system utility connection 18 in between. Furthermore, it is preferable that the two sets of supply system utility connections (supply system utility connection 16 and supply system utility connection 17) are arranged symmetrically with respect to the exhaust system utility connection 18. In order to uniformly reduce the pressure in the vacuum vessel, it is preferable to place the exhaust system utility connection 18 as close to the center of the rear RS as possible, and arranging the supply system utility connections on both sides of it is advantageous from the viewpoint of space utilization efficiency.

[0038] The side SS1 and side SS2 of the substrate processing apparatus 13 do not have utility connection points for connecting to external utilities (exhaust system utilities and supply system utilities). This is for convenience when removing the substrate processing apparatus 13 from the processing stage and moving it to the maintenance stage, as will be described later.

[0039] Figure 4 is a schematic plan view illustrating the placement constraints of external utilities (exhaust system utilities and supply system utilities) in a manufacturing system. In the manufacturing system illustrated in Figure 4, three substrate transport devices 11 are connected via an inter-process transport device 31, but this is just one example, and embodiments of the present invention are not limited to this example.

[0040] Each substrate transport device 11 has processing stages arranged in four locations in a plan view, and each of the four locations is provided with an upper processing stage STU and a lower processing stage STL. Therefore, each substrate transport device 11 can be connected to eight substrate processing devices 13 of the same configuration (same structure). In addition, one coating device 36 for applying ink to substrates is connected to each substrate transport device 11.

[0041] When an uncoated substrate is transported to the substrate transport device 11 via the inter-process transport device 31, the substrate is set in the coating device 36 via the substrate orientation adjustment device 34 and the substrate loading / unloading device 35, and ink is applied to the substrate. The ink-coated substrate is returned to the substrate transport device 11 via the substrate loading / unloading device 35 and the substrate orientation adjustment device 34, and is transported from the substrate transport device 11 to one of the eight substrate processing devices 13 for drying. After drying is complete, the substrate is unloaded from the substrate processing device 13 and returned to the substrate transport device 11, and transported via the inter-process transport device 31 to the device responsible for the next process.

[0042] When the manufacturing system is viewed from above, a utility area 33 is provided on the rear RS side of each substrate processing device 13, where external utilities for operating each substrate processing device 13 are concentrated. On the other hand, a utility non-placement area 32 is provided on the side (X direction) of the side SS1 and side SS2 of each substrate processing device 13, where virtually no external utilities are placed.

[0043] Figure 5 is a schematic plan view of the manufacturing system, illustrating the maintenance method for the substrate processing apparatus 13 in the manufacturing system. In addition to the parts shown in Figure 4, Figure 5 also shows the front-end processing apparatus 41, the back-end processing apparatus 42, and the maintenance area 44.

[0044] The pre-processing apparatus 41 is an apparatus that performs a pre-treatment process that is carried out prior to the ink application / drying process performed in the part shown in Figure 4. The pre-processing apparatus 41 may be, for example, a pure water cleaning apparatus, a UV cleaning apparatus, a vacuum film deposition apparatus, an etching apparatus, a heating apparatus, a cooling apparatus, etc.

[0045] The post-processing apparatus 42 is an apparatus that performs post-processing steps after the ink application / drying process is completed in the part shown in Figure 4. The post-processing apparatus 42 may be, for example, a firing apparatus, a vacuum film deposition apparatus, an etching apparatus, a dicing apparatus, a heating apparatus, a cooling apparatus, etc.

[0046] The maintenance area 44 is a space for performing maintenance work on the substrate processing equipment 13 after it has been removed from the substrate transport device 11, and is equipped with the necessary equipment and jigs for maintenance work. In the illustrated manufacturing system, up to 24 substrate processing equipment 13 can be in operation, but some of these may require maintenance work for reasons such as having processed a predetermined number of substrates, having been operated for a predetermined period of time, or having a malfunction discovered. Due to space constraints, it is difficult to perform maintenance work on the substrate processing equipment 13 while it is still attached to the substrate transport device 11. Therefore, when a substrate processing equipment 13 requires maintenance work, it is removed from the substrate transport device 11 and transported to the maintenance area 44, where the maintenance work is performed. In the maintenance area 44, a maintenance opening provided on the top surface US of the substrate processing equipment 13 is opened, and necessary maintenance and inspection work, such as inspection of the inside of the equipment, cleaning and washing, and replacement of parts, is performed.

[0047] In the manufacturing system of this embodiment, for example, more identical board processing devices 13 with the same configuration (same structure) than the maximum number that can operate simultaneously (24 in this case) can be prepared, and maintained board processing devices 13 can be kept on standby in the maintenance area 44. In this case, when maintenance work is required on a board processing device 13 connected to the manufacturing line, it is possible to quickly replace it with a maintained board processing device 13. By operating in this manner, it is possible to always connect and operate the maximum number of board processing devices 13 on the manufacturing line, and the throughput of the manufacturing system can be maintained at a high level.

[0048] The procedure for removing the substrate processing apparatus 13 from the processing stage and transporting it to the maintenance area 44 will be described. First, the procedure for removing the substrate processing apparatus 13, which is installed on the upper processing stage STU shown in Figure 1(b), from the production line and transporting it to the maintenance area 44 shown in Figure 5 will be described. Figures 6(a) and 6(b) are schematic diagrams illustrating the transport procedure.

[0049] First, all utility connection parts located on the rear RS of the substrate processing device 13 to be removed are detached from the external utility, and the connection part 14 located on the front FS is detached from the substrate transport device 11.

[0050] Next, as shown in Figure 6(a), the substrate processing apparatus 13 is lifted in the Z-plus direction by the crane 43. The crane 43 is a moving mechanism capable of moving the substrate processing apparatus 13 while it is lifted. At this stage, the substrate processing apparatus 13 moves in a second direction (Z direction) that intersects with the first direction (Y direction) connecting the front surface FS and the rear surface RS. In this case, the second direction can be said to be the opposite direction to the direction of gravity. As shown in Figure 4, in the manufacturing line according to this embodiment, a utility placement area 33 is provided on the first direction (Y direction) side with respect to the rear surface RS, but no external utilities are placed directly above the top surface US. Therefore, in this embodiment, the substrate processing apparatus 13 moving in the second direction (Z direction) does not interfere with external utilities.

[0051] As shown in Figure 6(b), the substrate processing apparatus 13 is lifted by the crane 43 to a position higher than another substrate processing apparatus 13 installed on another upper processing stage STU, or higher than the substrate transport device 11. Then, while suspended by the crane 43, it moves along the path TR1 with the crane 43. The path TR1 is a route that passes over the upper processing stage STU and leads to the maintenance area 44, as schematically shown in Figure 5. Once it reaches above the maintenance area 44, the substrate processing apparatus 13 is lowered onto a maintenance workbench (not shown) and removed from the crane 43.

[0052] Next, we will explain the procedure for removing the substrate processing apparatus 13, which is installed on the lower processing stage STL shown in Figure 1(b), from the production line and transporting it to the maintenance area 44 shown in Figure 5. Figures 7(a), 7(b), and 8 are schematic diagrams illustrating the transport procedure.

[0053] First, all utility connection parts located on the rear RS of the substrate processing device 13 to be removed are detached from the external utility, and the connection part 14 located on the front FS is detached from the substrate transport device 11.

[0054] Next, as shown in Figure 7(a), the substrate processing apparatus 13 moves along the path TR2 by a moving mechanism (e.g., wheels). The path TR2 is a path that moves in the X direction from the processing stage STL, as shown in Figure 5. That is, the substrate processing apparatus 13 moves in a second direction (X direction) that intersects the first direction (Y direction) connecting the front FS and the rear RS in the horizontal plane. As shown in Figure 4, in the manufacturing line according to this embodiment, a utility placement area 33 is provided on the first direction (Y direction) side with respect to the rear RS, and a utility non-placement area 32 is provided on the side (X direction side) of the side SS1 and side SS2. Therefore, in this embodiment, the substrate processing apparatus 13 moving in the second direction (X direction) does not interfere with external utilities. The substrate processing apparatus 13 moves along the path TR2 in the X direction to a position where it does not interfere with the upper processing stage STU even when lifted upward.

[0055] Next, as shown in Figure 7(b), the substrate processing apparatus 13 is lifted by a crane 43, which is a moving mechanism, to a position higher than another substrate processing apparatus 13 installed on the upper processing stage STU, or higher than the substrate transport device 11. Then, as shown in Figure 8, while suspended by the crane 43, it moves along the path TR1 together with the crane 43. The path TR1 is a route that passes over the upper processing stage STU and leads to the maintenance area 44, as schematically shown in Figure 5. Once it reaches above the maintenance area 44, the substrate processing apparatus 13 is lowered onto a maintenance workbench (not shown) and removed from the crane 43.

[0056] Next, the procedure for transporting and mounting the substrate processing device, which has undergone maintenance in the maintenance area 44, to the processing stage will be described. Basically, the substrate processing device 13 should be transported and mounted to the processing stage in the reverse order of the procedure described above. In order to enable high-precision and rapid positioning (position adjustment) of the substrate processing device 13 on the processing stage, it is desirable to provide a positioning mechanism 51 on the processing stage. As shown in the schematic plan view of Figure 9, the positioning mechanism 51 may be, for example, a convex part that serves as a position reference that can abut against the corners or sides of the substrate processing device 13.

[0057] As described above, according to this embodiment, in a manufacturing system equipped with multiple substrate processing devices of the same configuration, the workability of maintenance work on the substrate processing devices can be improved. Furthermore, it is possible to realize a manufacturing system with high throughput and a compact floor area occupied within the factory.

[0058] [Other embodiments] It should be noted that the present invention is not limited to the embodiments described above, and many modifications are possible within the technical concept of the present invention.

[0059] For example, we have given an example of a manufacturing system in which a substrate processing device is placed on two vertically arranged processing stages, but the number of vertically arranged processing stages is not limited to two; it may be three or more. In that case, it is desirable for the substrate processing device to be equipped with a number of supply system utility connection units corresponding to the number of vertically arranged processing stages, at different locations on the rear RS.

[0060] Furthermore, although an example was shown in which a single exhaust system utility connection is provided on the rear RS, it is also possible to provide multiple exhaust system utility connection points on each substrate processing device and use different exhaust system utility connection points depending on the processing stage being installed.

[0061] The embodiment also includes a maintenance method for a substrate processing apparatus, which is carried out by a control computer of a manufacturing system equipped with a substrate processing apparatus according to the embodiment, controlling at least a portion of the substrate processing apparatus, utility equipment, and crane (transport mechanism for transporting the substrate processing apparatus).

[0062] Furthermore, embodiments of the present invention also include a method for manufacturing articles in which a control computer of a manufacturing system equipped with a substrate processing apparatus according to an embodiment controls at least a portion of the substrate processing apparatus, utility equipment, substrate transport apparatus, coating apparatus, and crane.

[0063] The substrate processing apparatus according to this embodiment can be suitably applied to a manufacturing system for manufacturing substrates used in organic EL display devices. However, the present invention may also be implemented in drying apparatuses and manufacturing systems used when manufacturing substrates or articles for other applications. For example, it may be applied to a manufacturing system for manufacturing energy storage elements by coating a substrate with a liquid containing an electrical material and drying it. Alternatively, it may be applied to a manufacturing system for manufacturing optical elements by coating a substrate with a liquid containing an optical material such as a reflective material or an antistatic material and drying it.

[0064] The present invention can also be realized by supplying a program that implements one or more of the functions of the embodiments to a system or device via a network or storage medium, and by having one or more processors in the computer of that system or device read and execute the program. It can also be realized by a circuit (e.g., an ASIC) that implements one or more functions.

[0065] This specification discloses at least the following: [Matter 1] A substrate processing device that is detachably incorporated into a manufacturing system capable of incorporating a substrate processing device into each of a plurality of processing stages arranged vertically, Equipped with an entrance and exit for the circuit board, On the rear side opposite the front, it is equipped with an exhaust system utility connection section that detachably connects to the exhaust system utility, and two sets of supply system utility connection sections that detachably connect to the supply system utility, When the substrate processing apparatus is incorporated into any of the plurality of processing stages, The exhaust system utility connection section is connected to the exhaust system utility, One of the two sets of supply system utility connection parts is connected to the supply system utility, The substrate is brought in or brought out through the entrance / exit, When the substrate processing apparatus is removed from one of the plurality of processing stages and moves in a second direction intersecting the first direction connecting the front and rear surfaces, The exhaust system utility connection is removed from the exhaust system utility, and both sets of supply system utility connection parts are removed from the supply system utility before being moved. A substrate processing apparatus characterized by the following: [Matter 2] The two sets of supply system utility connection parts are positioned so as not to overlap each other in the vertical direction. A substrate processing apparatus as described in item 1, characterized by the features described above. [Matter 3] The system is configured to operate when either of the two sets of supply system utility connection units is connected. A substrate processing apparatus according to item 1 or 2, characterized by the above. [Matter 4] The two sets of supply system utility connection sections are arranged with the exhaust system utility connection section in between. A substrate processing apparatus according to any one of items 1 to 3, characterized by the features described herein. [Matter 5] The two sets of supply system utility connection parts are arranged symmetrically around the exhaust system utility connection part. A substrate processing apparatus as described in item 4, characterized by the features described above. [Matter 6] Each of the two sets of supply system utility connection parts is provided with a connection part that is detachably connected to a gas supply pipe. A substrate processing apparatus according to any one of items 1 to 5, characterized by the features described herein. [Matter 7] The system is equipped with a mechanism to prevent gas leakage or inflow from the other supply system utility connection when one of the two sets of supply system utility connection parts is connected to the gas supply pipe. A substrate processing apparatus according to item 6, characterized by the features described therein. [Matter 8] Each of the two sets of supply system utility connection sections is equipped with a connector that can be detachably connected to electrical wiring. A substrate processing apparatus according to any one of items 1 to 7, characterized by the features described herein. [Matter 9] The front is provided with the aforementioned entrance, The substrate is brought in or brought out along the first direction through the entrance / exit. A substrate processing apparatus according to any one of items 1 to 8, characterized by the above. [Matter 10] The top surface has a maintenance opening that can be opened and closed. A substrate processing apparatus according to any one of items 1 to 9, characterized by the features described herein. [Matter 11] A manufacturing system equipped with a substrate processing apparatus as described in any one of items 1 to 10, Each of the plurality of processing stages has a utility-free region in the second direction where neither the exhaust system utility nor the supply system utility is located. A manufacturing system characterized by the following features. [Matter 12] A maintenance stage for maintaining the substrate processing apparatus is provided at a location different from the aforementioned multiple processing stages. A manufacturing system as described in item 11, characterized by the features described herein. [Matter 13] The substrate processing apparatus is equipped with a moving mechanism for moving it between the plurality of processing stages and the maintenance stage. The manufacturing system according to item 12, characterized by the features described above. [Matter 14] The moving mechanism includes a crane capable of lifting the substrate processing device. A manufacturing system as described in item 13, characterized by the features described herein. [Matter 15] The aforementioned plurality of processing stages comprises a lower processing stage and an upper processing stage, The moving mechanism includes a mechanism for moving the substrate processing apparatus from the lower processing stage in a second direction that intersects the first direction in the horizontal plane. A manufacturing system as described in item 13 or 14, characterized by the features described herein. [Matter 16] The aforementioned plurality of processing stages comprises a lower processing stage and an upper processing stage, When the substrate processing apparatus is removed from the upper processing stage, the substrate processing apparatus is moved in the second direction opposite to the direction of gravity. A manufacturing system according to any one of items 10 to 12, characterized by the features described herein. [Matter 17] The aforementioned plurality of processing stages comprises a lower processing stage and an upper processing stage, When the substrate processing apparatus is removed from the lower processing stage, the substrate processing apparatus is moved in a second direction that intersects the first direction in the horizontal plane. A manufacturing system according to any one of items 11 to 16, characterized by the features described herein. [Matter 18] Each of the plurality of processing stages is equipped with a positioning mechanism for adjusting the position of the substrate processing apparatus. A manufacturing system according to any one of items 11 to 17, characterized by the features described herein. [Matter 19] The apparatus further comprises a coating device for applying liquid to the substrate. A manufacturing system according to any one of items 11 to 18, characterized by the features described herein. [Matter 20] The device further comprises at least one of the following: a cleaning device, a vacuum deposition device, a firing device, an etching device, a heating device, a cooling device, and a dicing device. A manufacturing system according to any one of items 11 to 19, characterized by the features described herein. [Matter 21] Using the substrate processing apparatus described in any one of items 1 to 10, the substrate coated with ink is dried. A method for manufacturing an article, characterized by the following: [Matter 22] The aforementioned ink is a liquid containing functional materials. A method for manufacturing an article as described in item 21, characterized by the following: [Matter 23] The aforementioned ink is a liquid used to form one of the hole injection layer, hole transport layer, light-emitting layer, electron transport layer, or electron injection layer of an organic EL element. A method for manufacturing an article as described in item 21 or 22, characterized by the features described herein. [Explanation of Symbols]

[0066] 11...Substrate transport device / 12...Substrate transport robot / 13...Substrate processing device / 14...Connection part / 15...Support part / 16...Supply system utility connection part / 17...Supply system utility connection part / 18...Exhaust system utility connection part / 31...Inter-process transport device / 34...Substrate attitude adjustment device / 35...Substrate loading / unloading device / 36...Coating device / 41...Front-end processing device / 42...Back-end processing device / 43...Crane / 44...Maintenance area / 51...Positioning mechanism / FS...Front / LS...Bottom / RS...Rear / SS1...Side / SS2...Side / STL...Lower processing stage / STU...Upper processing stage / UL...External utility / US...Top / UU...External utility

Claims

1. A substrate processing device that is detachably incorporated into a manufacturing system capable of incorporating a substrate processing device into each of a plurality of processing stages arranged vertically, Equipped with an entrance and exit for the circuit board, On the rear side opposite the front, it is equipped with an exhaust system utility connection section that can be detachably connected to an exhaust system utility, and two sets of supply system utility connection sections that can be detachably connected to a supply system utility. When the substrate processing apparatus is incorporated into any of the plurality of processing stages, The exhaust system utility connection section is connected to the exhaust system utility, One of the two sets of supply system utility connection parts is connected to the supply system utility. The substrate is brought in or brought out through the entrance / exit, When the substrate processing apparatus is removed from one of the plurality of processing stages and moves in a second direction intersecting the first direction connecting the front and rear surfaces, The exhaust system utility connection is removed from the exhaust system utility, and both sets of supply system utility connection parts are removed from the supply system utility before being moved. A substrate processing apparatus characterized by the following:

2. The two sets of supply system utility connection parts are positioned so as not to overlap each other in the vertical direction. The substrate processing apparatus according to claim 1.

3. The system is configured to operate when either of the two sets of supply system utility connection units is connected. The substrate processing apparatus according to claim 1.

4. The two sets of supply system utility connection sections are arranged with the exhaust system utility connection section in between. The substrate processing apparatus according to claim 1.

5. The two sets of supply system utility connection parts are arranged symmetrically around the exhaust system utility connection part. The substrate processing apparatus according to feature 4.

6. Each of the two sets of supply system utility connection parts is provided with a connection part that is detachably connected to a gas supply pipe. The substrate processing apparatus according to claim 1.

7. The system is equipped with a mechanism to prevent gas leakage or inflow from the other supply system utility connection when one of the two sets of supply system utility connection parts is connected to the gas supply pipe. The substrate processing apparatus according to claim 6.

8. Each of the two sets of supply system utility connection sections is equipped with a connector that can be detachably connected to electrical wiring. The substrate processing apparatus according to claim 1.

9. The front is provided with the aforementioned entrance, The substrate is loaded or unloaded along the first direction through the entrance / exit. The substrate processing apparatus according to claim 1.

10. The top surface has a maintenance opening that can be opened and closed. The substrate processing apparatus according to claim 1.

11. A manufacturing system comprising a substrate processing apparatus according to any one of claims 1 to 10, Each of the plurality of processing stages has a utility-free region in the second direction where neither the exhaust system utility nor the supply system utility is located. A manufacturing system characterized by the following features.

12. A maintenance stage for maintaining the substrate processing apparatus is provided at a location different from the aforementioned multiple processing stages. The manufacturing system according to feature 11.

13. The substrate processing apparatus is equipped with a moving mechanism for moving it between the plurality of processing stages and the maintenance stage. The manufacturing system according to claim 12, characterized by the features described above.

14. The moving mechanism includes a crane capable of lifting the substrate processing device. The manufacturing system according to claim 13, characterized in that it is a feature of the present invention.

15. The aforementioned plurality of processing stages comprises a lower processing stage and an upper processing stage, The moving mechanism includes a mechanism for moving the substrate processing apparatus from the lower processing stage in a second direction that intersects the first direction in the horizontal plane. The manufacturing system according to claim 13, characterized in that it is a feature of the present invention.

16. The aforementioned plurality of processing stages comprises a lower processing stage and an upper processing stage, When the substrate processing apparatus is removed from the upper processing stage, the substrate processing apparatus is moved in the second direction opposite to the direction of gravity. The manufacturing system according to feature 11.

17. The aforementioned plurality of processing stages comprises a lower processing stage and an upper processing stage, When the substrate processing apparatus is removed from the lower processing stage, the substrate processing apparatus is moved in a second direction that intersects the first direction in the horizontal plane. The manufacturing system according to feature 11.

18. Each of the plurality of processing stages is equipped with a positioning mechanism for adjusting the position of the substrate processing apparatus. The manufacturing system according to feature 11.

19. The apparatus further comprises a coating device for applying liquid to the substrate. The manufacturing system according to feature 11.

20. The device further comprises at least one of the following: a cleaning device, a vacuum film deposition device, a firing device, an etching device, a heating device, a cooling device, and a dicing device. The manufacturing system according to feature 11.

21. Using the substrate processing apparatus described in any one of claims 1 to 10, a substrate coated with ink is dried. A method for manufacturing an article, characterized by the following:

22. The aforementioned ink is a liquid containing functional materials. A method for manufacturing an article according to claim 21, characterized by the features described above.

23. The aforementioned ink is a liquid used to form one of the hole injection layer, hole transport layer, light-emitting layer, electron transport layer, or electron injection layer of an organic EL element. A method for manufacturing an article according to claim 21, characterized by the features described above.

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