Wiring boards and display devices

Abstract

Suppresses the occurrence of short circuits. [Solution] The wiring board 21 comprises a first wiring 26α, a first conductive part 17Aα, a second wiring 26β, and a second conductive part 17Aβ. The first wiring 26α has a first wiring component 26Aα made of a part of the first conductive film and a second wiring component 26Bα made of a part of the second conductive film. The first conductive part 17Aα is made of a part of the first conductive film and is arranged to intersect with the second wiring component 26Bα at a first intersection point CP1. The second wiring 26β has a third wiring component 26Aβ made of a part of the first conductive film and a fourth wiring component 26Bβ made of a part of the second conductive film. The second conductive part 17Aβ is made of a part of the first conductive film and is arranged to intersect with the fourth wiring component 26Bβ at a second intersection point CP2.

Description

Technical Field

[0001] The technology disclosed in this specification relates to a wiring board and a display device in which the occurrence of a short circuit is suppressed.

Background Art

[0002] Conventionally, as an example of a wiring board used in a liquid crystal display device or the like, the one described in Patent Document 1 below is known. Patent Document 1 describes an active matrix substrate (semiconductor device) as a wiring board. The active matrix substrate includes a first wiring having a first end, a second wiring insulated from the first wiring and having a second end, a first conductive portion provided spaced apart in the vicinity of the first and second ends, an insulating layer covering these, and a second conductive portion on the insulating layer. The insulating layer has a first contact hole overlapping the first end and a second contact hole overlapping the first conductive portion. The second conductive portion is connected to the first end and the first conductive portion at the first contact hole and the second contact hole. The second end is insulated from the first conductive portion. The first conductive portion has a proximity portion protruding toward the first end. The insulating layer has a first hole overlapping the proximity portion of the first conductive portion.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the active matrix substrate described in Patent Document 1 above, the end of the gate wiring connected to the gate lead wiring through the third contact hole and the intersection point of the gate lead wiring and the CS trunk are located on the same straight line, and the straight-line distance between the end of the gate wiring and the intersection point of the gate lead wiring and the CS trunk is extremely short. For this reason, when ESD (Electrostatic Discharge) occurs, pinholes are likely to occur near the intersection point of the gate lead wiring and the CS trunk, and a short circuit between the gate lead wiring and the CS trunk is likely to occur.

[0005] The technology described herein was developed based on the circumstances described above and aims to suppress the occurrence of short circuits. [Means for solving the problem]

[0006] (1) A wiring board relating to the technology described herein comprises a first wiring, a first conductive portion intersecting a part of the first wiring, a second wiring spaced apart from the first wiring in a first direction, and a second conductive portion intersecting a part of the second wiring, wherein the first wiring has a first wiring component made of a part of a first conductive film and a second wiring component made of a part of a second conductive film with a first insulating film interposed between it and the first conductive film, the first wiring component has a first end, the second wiring component has a second end connected to the first end, the first conductive portion is made of a part of the first conductive film, and the first conductive portion intersects the second wiring component of the first wiring at a first intersection position The second wiring is arranged to intersect with the first conductive film, and the second wiring has a third wiring component made of a part of the first conductive film and a fourth wiring component made of a part of the second conductive film, wherein the third end of the third wiring component is located at a position a first distance from the first end in the first direction, and the fourth wiring component has a fourth end connected to the third end, the second conductive part is made of a part of the first conductive film, the second conductive part is arranged to intersect with the fourth wiring component of the second wiring at a second intersection position, and the second intersection position is located at a position a second distance from the first intersection position in the first direction, the second distance being different from the first distance.

[0007] (2) In addition to (1) above, the wiring board further comprises a third wiring arranged at a distance from the second wiring in the first direction, and a third conductive portion that intersects a part of the third wiring, wherein the third wiring has a fifth wiring component made of a part of the first conductive film and a sixth wiring component made of a part of the second conductive film, the fifth end of the fifth wiring component is arranged at a position a third distance from the third end in the first direction, the sixth wiring component has a sixth end connected to the fifth end, the third conductive portion is made of a part of the first conductive film, the third conductive portion is arranged to intersect the sixth wiring component of the third wiring at a third intersection position, and the third intersection position of the sixth wiring component is arranged at a position a fourth distance from the second intersection position in the first direction, the fourth distance may be different from the third distance.

[0008] (3) In addition to (2) above, the wiring board may be arranged such that the first wiring, the second wiring, and the third wiring have different distances from the first to the third, but the second to the fourth wiring is equal.

[0009] (4) In addition to (3) above, the wiring board further comprises: a fourth conductive portion made of a part of the second conductive film and connected to the second wiring component; a fifth conductive portion made of a part of the second conductive film and connected to the fourth wiring component, and spaced apart from the fourth conductive portion in the first direction; and a sixth conductive portion made of a part of the second conductive film and connected to the sixth wiring component, and spaced apart from the fifth conductive portion in the first direction, wherein the first wiring is arranged such that the first end and second end are unevenly distributed away from the fifth conductive portion in the first direction within the fourth conductive portion; the second wiring is arranged such that the third end and fourth end are unevenly distributed away from the fourth conductive portion in the first direction within the fifth conductive portion; and the third wiring is arranged such that the fifth end and sixth end are unevenly distributed near the fifth conductive portion in the first direction within the sixth conductive portion.

[0010] (5) In addition to (2) above, the wiring board may be arranged such that the first wiring, the second wiring, and the third wiring have different distances between the first and third wiring, and different distances between the second and fourth wiring.

[0011] (6) In addition to (5) above, the wiring board comprises a fourth conductive portion made of a part of the second conductive film and connected to the second wiring component, a fifth conductive portion made of a part of the second conductive film and connected to the fourth wiring component and spaced apart from the fourth conductive portion in the first direction, and a sixth conductive portion made of a part of the second conductive film and connected to the sixth wiring component and spaced apart from the fifth conductive portion in the first direction, wherein the first wiring is arranged such that the first end and the second end are unevenly distributed within the fourth conductive portion, spaced apart from the fifth conductive portion in the first direction, and the first crossing position However, the fourth conductive portion may be arranged to be biased towards the fifth conductive portion in the first direction, the third and fourth ends of the second wiring may be arranged to be biased away from the fourth conductive portion in the first direction of the fifth conductive portion, and the second intersection position may be arranged to be biased towards the fourth conductive portion in the first direction of the fifth conductive portion, and the fifth and sixth ends of the third wiring may be arranged to be biased towards the fifth conductive portion in the first direction of the sixth conductive portion, and the third intersection position may be arranged to be biased away from the fifth conductive portion in the first direction of the sixth conductive portion.

[0012] (7) In addition, the wiring board has, in addition to (5) or (6) above, the first wiring component has a first bent portion which extends from the first end toward away from the first conductive portion toward a second direction intersecting the first direction and then bent toward extending toward the first direction, and a first extended portion which extends from the end of the first bent portion toward away from the first end toward a second direction, and the third wiring component has a second bent portion which extends from the third end toward away from the second conductive portion toward a second direction and then bent toward extending toward the first direction, and from the end of the second bent portion toward the third end toward a second direction The fifth wiring component has a second extension portion that extends away from the third conductive portion, and the fifth wiring component has a third bent portion that extends away from the fifth end in the second direction and then bent to extend in the first direction, and a third extension portion that extends away from the end of the third bent portion in the second direction. The first wiring component, the third wiring component and the fifth wiring component may be arranged such that the fifth distance in the first direction between the first extension portion and the second extension portion is equal to the sixth distance in the first direction between the second extension portion and the third extension portion.

[0013] (8) In addition to (2) above, the wiring board may be arranged such that the first wiring, the second wiring, and the third wiring have different distances from the second and the fourth wiring, but the first and third wiring have equal distances.

[0014] (9) In addition to (8) above, the wiring board further comprises: a fourth conductive portion made of a part of the second conductive film and connected to the second wiring component; a fifth conductive portion made of a part of the second conductive film and connected to the fourth wiring component, and spaced apart from the fourth conductive portion in the first direction; and a sixth conductive portion made of a part of the second conductive film and connected to the sixth wiring component, and spaced apart from the fifth conductive portion in the first direction, wherein the first wiring is arranged such that the first intersection position is biased towards the fifth conductive portion in the first direction of the fourth conductive portion; the second wiring is arranged such that the second intersection position is biased towards the fourth conductive portion in the first direction of the fifth conductive portion; and the third wiring is arranged such that the third intersection position is biased away from the fifth conductive portion in the first direction of the sixth conductive portion.

[0015] (10) In addition to any of (1) to (9) above, the wiring board also includes a shift register circuit having a first unit circuit section connected to the second wiring component and a second unit circuit section connected to the fourth wiring component, wherein the first unit circuit section includes the first conductive section and the second unit circuit section includes the second conductive section, and the first conductive section and the second conductive section may be arranged side by side with an interval between them in the first direction.

[0016] (11) In addition to (10) above, the wiring board is provided with a first projection in the first conductive portion that protrudes locally toward the first end in a second direction intersecting the first direction, and the distance from the first projection to the first end is shorter than the distance from the first intersection point to the first end, and the second conductive portion is provided with a second projection that protrudes locally toward the third end in the second direction, and the distance from the second projection to the third end is shorter than the distance from the second intersection point to the third end.

[0017] (12) Further, in addition to any one of the above (1) to (9), the wiring board includes a shift register circuit having a first unit circuit portion connected to the second wiring component and a second unit circuit portion connected to the fourth wiring component, and a fourth wiring extending along the first direction between the shift register circuit and the first end portion and the third end portion in a second direction intersecting the first direction. The fourth wiring is formed of a part of the first conductive film, the first conductive portion is formed of a portion of the fourth wiring that intersects the second wiring component, and the second conductive portion may be formed of a portion of the fourth wiring that intersects the fourth wiring component.

[0018] (13) Further, in addition to the above (12), the fourth wiring of the wiring board is provided with width expansion portions that locally protrude toward the first end portion and the third end portion in the second direction. The position of the width expansion portion protruding toward the first end portion may be closer to the first end portion than the first intersection position, and the position of the width expansion portion protruding toward the third end portion may be closer to the third end portion than the second intersection position.

[0019] (14) The display device according to the technology described in this specification includes the wiring board according to any one of the above (1) to (13) and a counter substrate that is disposed opposite to the wiring board with a space therebetween.

Effects of the Invention

[0020] According to the technology described in this specification, the occurrence of short circuits can be suppressed.

Brief Description of the Drawings

[0021] [Figure 1] Plan view of the liquid crystal panel, driver, and flexible substrate according to Embodiment 1 [Figure 2] Cross-sectional view of the liquid crystal panel, driver, and flexible substrate according to Embodiment 1 [Figure 3] Plan view showing the pixel arrangement of the liquid crystal panel according to Embodiment 1 [Figure 4]Cross-sectional view of the pixel TFT provided in the display area of the array substrate constituting the liquid crystal panel according to Embodiment 1 [Figure 5] Plan view showing the shift register circuit and gate wiring provided in the array substrate according to Embodiment 1 [Figure 6] Cross-sectional view taken along line vi-vi of FIG. 5 in the array substrate according to Embodiment 1 [Figure 7] Plan view showing the shift register circuit and gate wiring provided in the array substrate according to Embodiment 2 [Figure 8] Plan view showing the shift register circuit and gate wiring provided in the array substrate according to Embodiment 3 [Figure 9] Plan view showing the shift register circuit and gate wiring provided in the array substrate according to Embodiment 4 [Figure 10] Plan view showing the shift register circuit and gate wiring provided in the array substrate according to Embodiment 5 [Figure 11] Plan view of the liquid crystal panel, driver, and flexible substrate according to Embodiment 6 [Figure 12] Plan view showing the shift register circuit and gate wiring provided in the array substrate according to Embodiment 6 [Figure 13] Cross-sectional view taken along line xiii-xiii of FIG. 12 in the array substrate according to Embodiment 6 [Figure 14] Plan view showing the shift register circuit and gate wiring provided in the array substrate according to Embodiment 7 [Figure 15] Cross-sectional view of the connection structure between the gate main body portion and the gate lead-out portion in the array substrate according to Embodiment 8 [Figure 16] Cross-sectional view of the connection structure between the gate main body portion and the gate lead-out portion in the array substrate according to Embodiment 9

Mode for Carrying Out the Invention

[0022] <Embodiment 1> Embodiment 1 will be explained with reference to Figures 1 to 6. In this embodiment, a liquid crystal display device 10 is illustrated. Note that parts of each figure show the X, Y, and Z axes, and each axis is drawn so that it corresponds to the direction shown in each figure. Also, the upper side of Figures 2, 4, and 6 is considered the front side, and the lower side of the same figure is considered the back side.

[0023] As shown in Figure 1, the liquid crystal display device 10 comprises at least a horizontally elongated rectangular liquid crystal panel (display device, display panel) 11 capable of displaying images, and a backlight device (illumination device) that irradiates the liquid crystal panel 11 with light for display purposes. The backlight device is positioned on the back side (rear side) of the liquid crystal panel 11 and includes a light source that emits white light (e.g., an LED) and an optical component that converts the light from the light source into planar light by applying an optical effect. The central part of the main surface of the liquid crystal panel 11 is designated as a display area AA where images are displayed. In contrast, the frame-like outer peripheral part of the main surface of the liquid crystal panel 11 surrounding the display area AA is designated as a non-display area NAA where images are not displayed.

[0024] As shown in Figure 1, a gate drive circuit 14 is provided in the non-display area NAA of the liquid crystal panel 11. The gate drive circuit 14 is arranged in pairs, sandwiching the display area AA from both sides in the X-axis direction. The gate drive circuit 14 is provided in a strip-shaped area extending along the Y-axis direction. The gate drive circuit 14 is for supplying scanning signals to the gate wiring 26, which will be described later, and is monolithically provided on the array substrate 21, which will be described later. The gate drive circuit 14 is a GDM (Gate Driver Monolithic) circuit. The gate drive circuit 14 includes a shift register circuit 16 that outputs scanning signals at predetermined timings and a buffer circuit for amplifying scanning signals (see Figure 5). The shift register circuit 16 will be described in more detail later.

[0025] The liquid crystal panel 11 will be described with reference to Figure 2 in addition to Figure 1. As shown in Figures 1 and 2, the liquid crystal panel 11 is formed by bonding a pair of substrates 20 and 21 together. Of the pair of substrates 20 and 21, the front side is the opposing substrate 20, and the back side is the array substrate (wiring substrate) 21. Both the opposing substrate 20 and the array substrate 21 are formed by laminating various films on the inner surface of a glass substrate. A liquid crystal layer 22 containing liquid crystal molecules, which are substances whose optical properties change when an electric field is applied, is interposed between the pair of substrates 20 and 21. A sealing portion 23 is provided between the outer edges of the pair of substrates 20 and 21 to seal the liquid crystal layer 22. The sealing portion 23 is formed in the shape of a rectangular frame surrounding the liquid crystal layer 22. Polarizing plates 15 are attached to the outer surfaces of both substrates 20 and 21.

[0026] As shown in Figures 1 and 2, the opposing substrate 20 has a shorter short side dimension than the array substrate 21. The opposing substrate 20 is bonded to the array substrate 21 such that one end in the short side direction (Y-axis direction) is aligned with it. Therefore, the other end of the array substrate 21 in the short side direction is an exposed portion 21A that protrudes laterally from the opposing substrate 20. This exposed portion 21A is entirely a non-display area (NAA), and the driver 12 and flexible substrate 13 for supplying various signals are mounted on it.

[0027] The driver 12 consists of an LSI chip with an internal drive circuit. The driver 12 is mounted on the exposed portion 21A of the array substrate 21 using COG (Chip On Glass) mounting. The driver 12 processes various signals transmitted by the flexible substrate 13. As shown in Figures 1 and 2, the driver 12 is positioned adjacent to one side of the display area AA in the Y-axis direction, sandwiched between the flexible substrate 13 and the display area AA. The driver 12 has a horizontally elongated rectangular shape in its planar form. The driver 12 can supply various signals to source wiring 27 and the like provided on the array substrate 21. The flexible substrate 13 is constructed by forming a large number of wiring patterns on a substrate made of a synthetic resin material (e.g., polyimide resin) that has insulating and flexible properties. One end of the flexible substrate 13 is connected to the exposed portion 21A of the array substrate 21, and the other end is connected to an external circuit board (control board, etc.).

[0028] Next, the configuration of the display area AA on the array substrate 21 will be explained using Figure 3. On the inner surface of the display area AA on the array substrate 21, at least pixel TFTs (transistors, switching elements) 24 and pixel electrodes 25 are provided, as shown in Figure 3. Multiple pixel TFTs 24 and pixel electrodes 25 are arranged in a matrix (arrangement) with spacing along the X-axis and Y-axis directions. Around these pixel TFTs 24 and pixel electrodes 25, gate wiring (scanning wiring) 26 and source wiring (image wiring, signal wiring) 27 are arranged orthogonally (intersecting) with each other. The gate wiring 26 extends along the X-axis direction (second direction intersecting the first direction), and multiple gate wirings are arranged with spacing along the Y-axis direction (first direction). Multiple gate wirings 26 are arranged at equal pitches so that the spacing along the Y-axis direction is all equal. The source wiring 27 extends along the Y-axis direction, and multiple source wirings are arranged with spacing along the X-axis direction. Multiple source wires 27 are arranged at equal pitches so that they are all equally spaced in the X-axis direction.

[0029] As shown in Figure 3, the pixel TFT 24 includes a gate electrode 24A connected to the gate wiring 26, a source electrode 24B connected to the source wiring 27, a drain electrode 24C connected to the pixel electrode 25, and a semiconductor portion 24D made of semiconductor material connected to the source electrode 24B and the drain electrode 24C. The pixel TFT 24 is driven based on a scanning signal supplied to the gate electrode 24A by the gate wiring 26. This scanning signal includes a potential higher than the threshold voltage of the pixel TFT 24. As a result, a channel region is created in the semiconductor portion 24D, allowing charge to move between the source electrode 24B and the drain electrode 24C through the channel region. Therefore, the potential related to the image signal (data signal) supplied to the source electrode 24B by the source wiring 27 is supplied to the drain electrode 24C via the semiconductor portion 24D. Consequently, the pixel electrode 25 is charged to the potential related to the image signal. The pixel electrode 25 has a planar shape, for example, a vertically elongated, roughly rectangular shape, and is arranged in a region enclosed by two adjacent gate lines 26 spaced apart in the Y-axis direction and two adjacent source lines 27 spaced apart in the X-axis direction. Multiple pixel electrodes 25 have a uniform size when viewed in a plane (dimensions in the X-axis and Y-axis directions).

[0030] Furthermore, the display area AA of the opposing substrate 20 is provided with multiple color filters at positions opposite to each pixel electrode 25 on the array substrate 21. The color filters consist of three colors, R (red), G (green), and B (blue), arranged repeatedly in a predetermined order, and together with the pixel electrodes 25, they constitute pixels of each color (red pixels, green pixels, and blue pixels). The three pixels of red, green, and blue constitute a display pixel capable of displaying a predetermined gradation of color. In addition, a light-shielding portion (black matrix) is formed between each color filter to prevent color mixing. Of both substrates 20 and 21, the innermost surface (uppermost layer) in contact with the liquid crystal layer 22 has an alignment film (not shown) formed on it to orient the liquid crystal molecules contained in the liquid crystal layer 22.

[0031] Furthermore, as shown in Figure 4, the array substrate 21 is provided with a common electrode 28 that is superimposed on the pixel electrodes 25 at a distance from them. The common electrode 28 as a whole has a size equivalent to the display area AA. The common electrode 28 is superimposed on the lower layer side of all the pixel electrodes 25. A common potential (reference potential) is supplied to the common electrode 28. The liquid crystal panel 11 applies a predetermined electric field to the liquid crystal layer 22 based on the potential difference generated between the common electrode 28 and each pixel electrode 25, thereby enabling each pixel to display a predetermined gradation. Slits are provided in the pixel electrodes 25 that are located on the upper layer side of the common electrode 28. As the pixel TFT 24 is driven, the pixel electrodes 25 are charged to a potential based on the image signal, and a potential difference is generated between the pixel electrodes 25 and the common electrode 28. As a result, a fringe electric field (oblique electric field) is generated between the opening edge of the slit in the pixel electrode 25 and the common electrode 28, which includes a component along the main surface of the array substrate 21 as well as a component normal to the main surface of the array substrate 21. Therefore, by utilizing this fringe electric field, the orientation state of the liquid crystal molecules contained in the liquid crystal layer 22 can be controlled, and a predetermined display is made based on this orientation state of the liquid crystal molecules. In other words, the liquid crystal panel 11 according to this embodiment is set to FFS (Fringe Field Switching) mode.

[0032] Next, using Figure 4, we will explain in detail the various films laminated on the glass substrate (substrate) 21GS of the array substrate 21. Figure 4 shows the cross-sectional configuration of the pixel TFT 24. As shown in Figure 4, the glass substrate 21GS of the array substrate 21 is laminated in the following order from the bottom side (glass substrate 21GS side): a first metal film (first conductive film), a gate insulating film (first insulating film) 29, a semiconductor film, a second metal film (second conductive film), a first interlayer insulating film 30, a planarization film 31, a first transparent electrode film, a second interlayer insulating film 32, a second transparent electrode film, and an alignment film.

[0033] The first and second metal films are both single-layer films made of one type of metal material or multilayer films or alloys made of different types of metal materials, thereby possessing conductivity and light-shielding properties. The first metal film constitutes part of the gate wiring 26 and the gate electrode 24A of the pixel TFT 24. The second metal film constitutes part of the gate wiring 26, the source wiring 27, the source electrode 24B and drain electrode 24C of the pixel TFT 24, etc. The semiconductor film is made of a semiconductor material such as an oxide semiconductor material or an amorphous silicon material. The semiconductor film constitutes the semiconductor portion 24D of the pixel TFT 24, etc. The first and second transparent electrode films are made of transparent electrode materials (for example, ITO (Indium Tin Oxide) or IZO (Indium Zinc Oxide), etc.). The first transparent electrode film constitutes the common electrode 28, etc. The second transparent electrode film constitutes the pixel electrode 25, etc.

[0034] The gate insulating film 29, the first interlayer insulating film 30, and the second interlayer insulating film 32 are all types of inorganic materials (inorganic resin materials), such as SiO2 (silicon oxide, silicon oxide) and SiN x The planarization film 31 is made of an organic insulating film such as silicon nitride. The planarization film 31 is an organic insulating film made of an organic material such as PMMA (acrylic resin). The thickness of the planarization film 31 is much greater than the thickness of the gate insulating film 29, the first interlayer insulating film 30, and the second interlayer insulating film 32. The inner surface of the array substrate 21 (the surface on the liquid crystal layer 22 side) is planarized by this planarization film 31.

[0035] The configuration of the pixel TFT 24 will now be described in detail. The gate electrode 24A of the pixel TFT 24 is connected to the gate wiring 26 near the tolerance point with the source wiring 27, as shown in Figure 4. The source electrode 24B of the pixel TFT 24 is connected to the source wiring 27 near the intersection point with the gate wiring 26. The source electrode 24B extends along the X-axis direction, and the end opposite to the source wiring 27 side is connected to the semiconductor part 24D. The drain electrode 24C of the pixel TFT 24 is positioned at a distance from the source electrode 24B in the X-axis direction. The drain electrode 24C extends along the X-axis direction, with one end (left side in Figure 4, on the source electrode 24B side) connected to the semiconductor part 24D and the other end (right side in Figure 4) connected to the pixel electrode 25. Of the first interlayer insulating film 30, planarization film 31, and second interlayer insulating film 32 interposed between the drain electrode 24C and the pixel electrode 25, a pixel contact hole PXCH is provided in communication with both the drain electrode 24C and the pixel electrode 25 at a position where they overlap. The drain electrode 24C and the pixel electrode 25 are interconnected through the pixel contact hole PXCH.

[0036] As shown in Figure 4, the semiconductor portion 24D constituting the pixel TFT 24 is arranged extending along the X-axis direction. The semiconductor portion 24D has smaller dimensions in the X-axis direction than the gate electrode 24A. The semiconductor portion 24D is superimposed on the gate electrode 24A via the gate insulating film 29. One end of the semiconductor portion 24D in the X-axis direction is connected to the source electrode 24B. The other end of the semiconductor portion 24D in the X-axis direction is connected to the drain electrode 24C. The portion of the semiconductor portion 24D sandwiched between the source electrode 24B and the drain electrode 24C in the X-axis direction is such that a channel region is generated when the pixel TFT 24 is driven. The channel region is the portion of the semiconductor portion 24D that is superimposed on the gate electrode 24A but not superimposed on the source electrode 24B and the drain electrode 24C.

[0037] The gate insulating film 29 keeps the lower-layer first metal film in an insulated state from the upper-layer semiconductor film and second metal film. For example, the intersection of the gate wiring 26 made of the first metal film and the source wiring 27 made of the second metal film is kept insulated by the gate insulating film 29. Also, in the pixel TFT 24, the overlapping area of ​​the gate electrode 24A made of the first metal film and the semiconductor part 24D made of the semiconductor film is kept insulated by the gate insulating film 29. The first interlayer insulating film 30 and the planarization film 31 keep the lower-layer semiconductor film and second metal film in an insulated state from the upper-layer first transparent electrode film. The second interlayer insulating film 32 keeps the lower-layer first transparent electrode film and the upper-layer second transparent electrode film in an insulated state. For example, the common electrode 28 made of the first transparent electrode film and the pixel electrode 25 made of the second transparent electrode film are kept insulated by the second interlayer insulating film 32.

[0038] Next, the shift register circuit 16, which constitutes the gate drive circuit 14, will be described in detail using Figures 5 and 6. The shift register circuit 16 includes a unit circuit section 16U shown in Figure 5. Multiple unit circuit sections 16U are arranged in a row along the Y-axis. The multiple unit circuit sections 16U are connected to various wirings (not shown) provided in the non-display area NAA of the array substrate 21 (for example, start pulse wiring, multiple clock wiring, set wiring, reset wiring, etc.) and operate based on various signals (for example, start pulse signal, multiple clock signals, set signal, reset signal, etc.) transmitted by the various wirings. Each of the multiple unit circuit sections 16U is connected to a plurality of gate wirings 26, and by operating based on the above-mentioned signals, scanning signals can be supplied to the plurality of gate wirings 26 sequentially from the top.

[0039] The unit circuit section 16U includes multiple non-pixel TFTs and a capacitor 17 as shown in Figure 5. The multiple non-pixel TFTs included in the unit circuit section 16U are provided by patterning a first metal film, a semiconductor film, and a second metal film, similar to the pixel TFT 24 arranged in display area AA, and have a configuration that is generally the same as the pixel TFT 24 described above. The multiple non-pixel TFTs include an output TFT that outputs a signal that will be the basis of the scanning signal. The capacitor 17 bootstraps to the potential related to the output signal output from the output TFT and outputs a scanning signal that includes a potential higher than the threshold voltage of the pixel TFT 24, and is connected to the gate wiring 26.

[0040] As shown in Figure 6, the capacitor 17 has a lower electrode 17A made of a part of the first metal film and an upper electrode 17B made of a part of the second metal film and superimposed on the lower electrode 17A. A part of the gate insulating film 29 is interposed between the lower electrode 17A and the upper electrode 17B, which superimpose on each other, and this part functions as the dielectric of the capacitor 17. As shown in Figure 5, the lower electrode 17A is slightly larger in size when viewed in plan than the upper electrode 17B. The outer peripheral end portion of the lower electrode 17A is positioned so as to extend outward from the outer peripheral end of the upper electrode 17B, and is not superimposed on the upper electrode 17B. The two lower electrodes 17A that constitute the two capacitors 17 included in two adjacent unit circuit sections 16U in the Y-axis direction are arranged side by side with a gap in between in the Y-axis direction. The multiple lower electrodes 17A arranged along the Y-axis direction are arranged at equal pitches. Furthermore, the multiple upper electrodes 17B arranged along the Y-axis are also arranged at equal pitches. The gate wiring 26 is connected to the upper electrodes 17B that constitute the capacitor 17.

[0041] Next, the configuration of the gate wiring 26 connected to the unit circuit section 16U will be described in detail using Figures 5 and 6. As shown in Figure 5, the gate wiring 26 has a gate body section 26A that spans the display area AA and the non-display area NAA, and a gate lead-out section 26B that is located in the non-display area NAA. The gate body section 26A extends along the X-axis direction, traversing the entire display area AA, with one or both end portions located in the non-display area NAA. More specifically, the gate body section 26A is made of a part of the first metal film and is connected to the gate electrodes 24A of all pixel TFTs 24 that are aligned along the X-axis direction in the display area AA and form a single row. The end portion of the gate body section 26A located in the non-display area NAA is wider than the other portion and is a body-side connection section 26C that is connected to the gate lead-out section 26B.

[0042] As shown in Figure 5, one end of the gate lead-out portion 26B is connected to the gate body portion 26A, and the other end is connected to the capacitor 17. More specifically, the gate lead-out portion 26B is made of a part of the second metal film and is directly connected to the upper electrode 17B, which is made of a part of the second metal film of the capacitor 17. The gate lead-out portion 26B extends from the upper electrode 17B along the X-axis toward the gate body portion 26A (display area AA side). The portion of the gate lead-out portion 26B that extends from the upper electrode 17B intersects with the portion of the lower electrode 17A that protrudes from the outer peripheral end of the upper electrode 17B at intersection position CP. This intersection position CP coincides with the center position in the line width direction (Y-axis direction) of the portion of the gate lead-out portion 26B that intersects with the lower electrode 17A. The gate lead-out portion 26B has an end on the opposite side from the upper electrode 17B that is wider than the rest of the portion and is designated as a lead-out side connection portion 26D that connects to the gate body portion 26A. The lead-out side connection portion 26D is arranged superimposed on the body side connection portion 26C. In the portion of the gate insulating film 29 that superimposes both the body side connection portion 26C and the lead-out side connection portion 26D, a gate contact hole GCH is provided with an opening, as shown in Figure 6. The body side connection portion 26C and the lead-out side connection portion 26D are connected through the gate contact hole GCH.

[0043] In the following, when distinguishing between multiple unit circuit sections 16U, the unit circuit section 16U located at the topmost end of Figure 5 will be designated as the "first unit circuit section" and its designation will be denoted with the subscript "α". The unit circuit section 16U located second from the top of Figure 5 will be designated as the "second unit circuit section" and its designation will be denoted with the subscript "β". The unit circuit section 16U located third from the top of Figure 5 will be designated as the "third unit circuit section" and its designation will be denoted with the subscript "γ". The unit circuit section 16U located fourth from the top of Figure 5 will be designated as the "fourth unit circuit section" and its designation will be denoted with the subscript "δ". The unit circuit section 16U located fifth from the left end of Figure 5 will be designated as the "fifth unit circuit section" and its designation will be denoted with the subscript "ε". When referring to them collectively without distinction, no subscript will be added to the designation.

[0044] Furthermore, when distinguishing between multiple capacitors 17 provided in multiple unit circuit sections 16U, the capacitor 17 provided in the first unit circuit section 16Uα shall be designated as the "first capacitor" and its designation shall be prefixed with "α", the capacitor 17 provided in the second unit circuit section 16Uβ shall be designated as the "second capacitor" and its designation shall be prefixed with "β", the capacitor 17 provided in the third unit circuit section 16Uγ shall be designated as the "third capacitor" and its designation shall be prefixed with "γ", the capacitor 17 provided in the fourth unit circuit section 16Uδ shall be designated as the "fourth capacitor" and its designation shall be prefixed with "δ", and the capacitor 17 provided in the fifth unit circuit section 16Uε shall be designated as the "fifth capacitor" and its designation shall be prefixed with "ε". When referring to them collectively without distinction, no prefix shall be prefixed to the designation.

[0045] Furthermore, when distinguishing between multiple lower electrodes 17A and upper electrodes 17B that constitute multiple capacitors 17, the lower electrodes 17A and upper electrodes 17B constituting the first capacitor 17α are designated as "first lower electrode (first conductive part)" and "first upper electrode (fourth conductive part)" and the subscript "α" is added to their designations, the lower electrodes 17A and upper electrodes 17B constituting the second capacitor 17β are designated as "second lower electrode (second conductive part)" and "second upper electrode (fifth conductive part)" and the subscript "β" is added to their designations, and the lower electrodes constituting the third capacitor 17γ 17A and the upper electrode 17B are designated as the "third lower electrode (third conductive part)" and the "third upper electrode (sixth conductive part)," and the subscript "γ" is added to their symbols. The lower electrode 17A and upper electrode 17B constituting the fourth capacitor 17δ are designated as the "fourth lower electrode" and the "fourth upper electrode," and the subscript "δ" is added to their symbols. The lower electrode 17A and upper electrode 17B constituting the fifth capacitor 17ε are designated as the "fifth lower electrode" and the "fifth upper electrode," and the subscript "ε" is added to their symbols. When referring to them collectively without distinction, no subscript is added to their symbols. The first lower electrode 17Aα and the second lower electrode 17Aβ, which are adjacent in the Y-axis direction, are arranged side by side with a gap in the Y-axis direction. The second lower electrode 17Aβ and the third lower electrode 17Aγ, which are adjacent in the Y-axis direction, are arranged side by side with a gap in the Y-axis direction. The third lower layer electrode 17Aγ and the fourth lower layer electrode 17Aδ, which are adjacent in the Y-axis direction, are arranged side by side with a gap in between in the Y-axis direction. The fourth lower layer electrode 17Aδ and the fifth lower layer electrode 17Aε, which are adjacent in the Y-axis direction, are arranged side by side with a gap in between in the Y-axis direction.

[0046] Furthermore, when distinguishing between multiple gate wirings 26, the gate wiring 26 connected to the first unit circuit section 16Uα shall be designated as the "first gate wiring" and its designation shall be prefixed with "α", the gate wiring 26 connected to the second unit circuit section 16Uβ shall be designated as the "second gate wiring" and its designation shall be prefixed with "β", the gate wiring 26 connected to the third unit circuit section 16Uγ shall be designated as the "third gate wiring" and its designation shall be prefixed with "γ", the gate wiring 26 connected to the fourth unit circuit section 16Uδ shall be designated as the "fourth gate wiring" and its designation shall be prefixed with "δ", and the gate wiring 26 connected to the fifth unit circuit section 16Uε shall be designated as the "fifth gate wiring" and its designation shall be prefixed with "ε". When referring to them collectively without distinction, no prefix shall be prefixed to the designation.

[0047] Furthermore, when distinguishing between multiple gate body parts 26A and gate lead-out parts 26B that constitute multiple gate wirings 26, the gate body part 26A and gate lead-out part 26B constituting the first gate wiring 26α are designated as "first gate body part (first wiring component)" and "first gate lead-out part (second wiring component)" and the subscript "α" is added to their symbols, the gate body part 26A and gate lead-out part 26B constituting the second gate wiring 26β are designated as "second gate body part (third wiring component)" and "second gate lead-out part (fourth wiring component)" and the subscript "β" is added to their symbols, and the gate body constituting the third gate wiring 26γ Section 26A and gate lead-out section 26B are referred to as "third gate body section (fifth wiring configuration section)" and "third gate lead-out section (sixth wiring configuration section)," and the subscript "γ" is added to their symbols; the gate body section 26A and gate lead-out section 26B constituting the fourth gate wiring 26δ are referred to as "fourth gate body section" and "fourth gate lead-out section," and the subscript "δ" is added to their symbols; the gate body section 26A and gate lead-out section 26B constituting the fifth gate wiring 26ε are referred to as "fifth gate body section" and "fifth gate lead-out section," and the subscript "ε" is added to their symbols; however, when referring to them collectively without distinction, no subscript is added to the symbols.

[0048] Furthermore, when distinguishing between multiple body-side connection parts 26C provided on multiple gate body parts 26A, the body-side connection part 26C provided on the first gate body part 26Aα is designated as the "first body-side connection part (first end)" and its designation is denoted by the subscript "α", the body-side connection part 26C provided on the second gate body part 26Aβ is designated as the "second body-side connection part (third end)" and its designation is denoted by the subscript "β", and the body-side connection part provided on the third gate body part 26Aγ is denoted by the subscript "β", and so on. The connection part 26C is designated as the "third main body side connection part (fifth end)" and its designation is denoted by the subscript "γ", the main body side connection part 26C provided on the fourth gate main body part 26Aδ is designated as the "fourth main body side connection part" and its designation is denoted by the subscript "δ", and the main body side connection part 26C provided on the fifth gate main body part 26Aε is designated as the "fifth main body side connection part" and its designation is denoted by the subscript "ε". When referring to them collectively without distinction, no subscript is added to the designation.

[0049] Furthermore, when distinguishing between multiple drawer-side connection parts 26D provided on multiple gate drawer sections 26B, the drawer-side connection part 26D provided on the first gate drawer section 26Bα is designated as the "first drawer-side connection part (second end)" and the subscript "α" is added to its reference numeral, the drawer-side connection part 26D provided on the second gate drawer section 26Bβ is designated as the "second drawer-side connection part (fourth end)" and the subscript "β" is added to its reference numeral, and the drawer-side connection part 26D provided on the third gate drawer section 26Bγ is designated as the "first drawer-side connection part (fourth end)" and the subscript "β" is added to its reference numeral, and the drawer-side connection part 26D provided on the third gate drawer section 26Bγ is designated as the "first drawer-side connection part (second end)" and the subscript "β" is added to its reference numeral, and the drawer-side connection part 26D provided on the third gate drawer section 26Bγ is designated as the "first drawer-side connection part (second end)" and the subscript "β" is added to its reference numeral, and the drawer-side connection part 26D provided on the third gate drawer section 26Bγ is designated as the "first drawer-side connection part (second end)" and the subscript "α" is added to its reference numeral, and the drawer-side connection part 26D provided on the first gate drawer section 26Bα The extension-side connection part 26D is designated as the "third withdrawal-side connection part (sixth end)" and its designation is denoted by the subscript "γ". The withdrawal-side connection part 26D provided on the fourth gate withdrawal part 26Bδ is designated as the "fourth withdrawal-side connection part" and its designation is denoted by the subscript "δ". The withdrawal-side connection part 26D provided on the fifth gate withdrawal part 26Bε is designated as the "fifth withdrawal-side connection part" and its designation is denoted by the subscript "ε". When referring to them collectively without distinction, no subscript is added to the designation.

[0050] Furthermore, when distinguishing between multiple gate contact holes GCH, the gate contact hole GCH connecting the first main body side connection part 26Cα and the first drawer side connection part 26Dα is designated as the "first gate contact hole (first contact hole)" and the subscript "α" is added to its designation; the gate contact hole GCH connecting the second main body side connection part 26Cβ and the second drawer side connection part 26Dβ is designated as the "second gate contact hole (second contact hole)" and the subscript "β" is added to its designation; and the gate contact hole GCH connecting the third main body side connection part 26Cγ and the third drawer side connection part 26Dγ is designated as the gate contact hole GCH connecting the first main body side connection part 26Cα and the first drawer side connection part 26Dα The gate contact hole GCH is referred to as the "third gate contact hole (third contact hole)" and its designation is denoted by the subscript "γ". The gate contact hole GCH connecting the fourth main body side connection part 26Cδ and the fourth drawer side connection part 26Dδ is referred to as the "fourth gate contact hole" and its designation is denoted by the subscript "δ". The gate contact hole GCH connecting the fifth main body side connection part 26Cε and the fifth drawer side connection part 26Dε is referred to as the "fifth gate contact hole" and its designation is denoted by the subscript "ε". When referring to them collectively without distinction, no subscript is added to the designation.

[0051] Furthermore, when distinguishing between multiple intersection points CP, which are the positions where multiple gate extraction sections 26B and multiple lower layer electrodes 17A intersect, the intersection point CP between the first gate extraction section 26Bα and the first lower layer electrode 17Aα is designated as the "first intersection point" and the subscript "1" is added to its designation, the intersection point CP between the second gate extraction section 26Bβ and the second lower layer electrode 17Aβ is designated as the "second intersection point" and the subscript "2" is added to its designation, and the intersection point between the third gate extraction section 26Bγ and the third The intersection point CP with the lower electrode 17Aγ is designated as the "third intersection point" and its designation is denoted with the subscript "3". The intersection point CP between the fourth gate lead-out section 26Bδ and the fourth lower electrode 17Aδ is designated as the "fourth intersection point" and its designation is denoted with the subscript "4". The intersection point CP between the fifth gate lead-out section 26Bε and the fifth lower electrode 17Aε is designated as the "fifth intersection point" and its designation is denoted with the subscript "5". When referring to them collectively without distinction, no subscript is added to the designation.

[0052] Incidentally, the gate body portion 26A that constitutes the gate wiring 26 has a larger area than the lower electrode 17A that constitutes the unit circuit portion 16U. For this reason, during the manufacturing process of the array substrate 21, for example when patterning the first metal film, the gate body portion 26A tends to accumulate more charge than the lower electrode 17A, and as a result, there is a concern that electrostatic discharge (ESD) may occur between the body side connection portion 26C and the crossing position CP. If electrostatic discharge occurs at the crossing position CP, there is a risk that the gate lead portion 26B and the lower electrode 17A will short-circuit.

[0053] Therefore, in this embodiment, the gate lead portion 26B constituting the gate wiring 26 is arranged such that one end connected to the gate body portion 26A (the connection portion with the gate body portion 26A) and the other end connected to the upper electrode 17B of the capacitor 17 (the connection portion with the upper electrode 17B) are offset in the Y-axis direction, as shown in Figure 5. Specifically, the gate lead portion 26B has a roughly L-shaped bend in its planar form and has an intersection portion 26B1 that extends along the X-axis direction and intersects with the lower electrode 17A, and an extension portion 26B2 that extends along the Y-axis direction. The intersection portion 26B1 has the other end described above and is connected to the upper electrode 17B. The extension portion 26B2 is bent from the end of the intersection portion 26B1 opposite to the upper electrode 17B side and has the one end described above, that is, the lead-side connection portion 26D.

[0054] Furthermore, two adjacent gate wirings 26 spaced apart in the Y-axis direction are configured such that, as shown in Figure 5, the direction in which the gate lead portion 26B bends, that is, the direction in which the extended portion 26B2 extends from the end of the intersection portion 26B1, is opposite. Specifically, the first gate wiring 26α has its first gate lead portion 26Bα bent upward in Figure 5, the second gate wiring 26β has its second gate lead portion 26Bβ bent downward in Figure 5, the third gate wiring 26γ has its third gate lead portion 26Bγ bent upward in Figure 5, the fourth gate wiring 26δ has its fourth gate lead portion 26Bδ bent downward in Figure 5, and the fifth gate wiring 26ε has its fifth gate lead portion 26Bε bent upward in Figure 5. In this embodiment, the first gate wiring 26α, the third gate wiring 26γ, and the fifth gate wiring 26ε have the same planar shape. Furthermore, the second gate wiring 26β and the fourth gate wiring 26δ have the same planar shape.

[0055] Thus, as shown in Figure 5, the multiple gate wirings 26 have their gate lead-out portions 26B bent in alternating directions, resulting in different distances between two adjacent body-side connection portions 26C in the Y-axis direction and between two adjacent intersection points CP in the Y-axis direction. Specifically, the first gate body portions 26Aα and 26Aβ of the first gate wiring 26α and 26β are positioned with a first distance D1 in the Y-axis direction between the first body-side connection portion 26Cα and the second body-side connection portion 26Cβ. In contrast, the first gate lead-out portions 26Bα and 26Bβ of the first gate wiring 26α and 26β are positioned with a second distance D2 in the Y-axis direction, which is different from the first distance D1, between the first intersection point CP1 and the second intersection point CP2.

[0056] Furthermore, in this embodiment, the second gate body portion 26Aβ and the third gate body portion 26Aγ of the second gate wiring 26β and the third gate wiring 26γ are positioned with a third distance D3 in the Y-axis direction between the second body side connection portion 26Cβ and the third body side connection portion 26Cγ, as shown in Figure 5. In contrast, the second gate lead portion 26Bβ and the third gate lead portion 26Bγ of the second gate wiring 26β and the third gate wiring 26γ are positioned with a fourth distance D4 in the Y-axis direction, which is different from the third distance D3, between the second intersection position CP2 and the third intersection position CP3.

[0057] Here, if the gate lead-out portion 26B were to be in a straight line extending along the X-axis direction, or if all gate wirings 26 were to have the same planar shape, then the distance between two adjacent main body-side connection portions 26C in the Y-axis direction and the distance between two adjacent intersection points CP in the Y-axis direction would be the same. In contrast, in this embodiment, the first gate wiring 26α and the second gate wiring 26β are configured such that the first distance D1 and the second distance D2 are different, so that the straight-line distance between the first main body-side connection portion 26Cα and the first intersection point CP1, and the straight-line distance between the second main body-side connection portion 26Cβ and the second intersection point CP2 are significantly larger. As a result, even if the first gate body portion 26Aα and the second gate body portion 26Aβ, which are made of the first metal film, become charged, electrostatic discharge is less likely to occur between the first main body-side connection portion 26Cα and the first intersection point CP1, and electrostatic discharge is less likely to occur between the second main body-side connection portion 26Cβ and the second intersection point CP2. Since electrostatic discharge-induced electrostatic breakdown is less likely to occur at the first intersection point CP1 and the second intersection point CP2, it becomes less likely that the first gate lead-out portion 26Bα and the first lower layer electrode 17Aα will short-circuit, or that the second gate lead-out portion 26Bβ and the second lower layer electrode 17Aβ will short-circuit.

[0058] Furthermore, compared to a case where the distance between two adjacent main body connection portions 26C in the Y-axis direction and the distance between two adjacent intersection points CP in the Y-axis direction are the same, in this embodiment, the second gate wiring 26β and the third gate wiring 26γ are configured such that the second distance D2 and the third distance D3 are different, thus ensuring a large linear distance between the third main body connection portion 26Cγ and the third intersection point CP3. As a result, even if the third gate main body portion 26Aγ, which is made of the first metal film, becomes charged, electrostatic discharge is less likely to occur between the third main body connection portion 26Cγ and the third intersection point CP3. Since electrostatic discharge is less likely to occur at the third intersection point CP3, it is less likely that the third gate lead portion 26Bγ and the third lower layer electrode 17Aγ will short-circuit.

[0059] Furthermore, the third gate body portion 26Aγ and the fourth gate body portion 26Aδ of the third gate wiring 26γ and the fourth gate wiring 26δ are positioned with a first distance D1 in the Y-axis direction between the third body side connection portion 26Cγ and the fourth body side connection portion 26Cδ, as shown in Figure 5. In contrast, the third gate lead portion 26Bγ and the fourth gate lead portion 26Bδ of the third gate wiring 26γ and the fourth gate wiring 26δ are positioned with a second distance D2 in the Y-axis direction between the third intersection point CP3 and the fourth intersection point CP4. In other words, the positional relationship between the third gate wiring 26γ and the fourth gate wiring 26δ is the same as the positional relationship between the first gate wiring 26α and the second gate wiring 26β.

[0060] Furthermore, the fourth gate body portion 26Aδ and the fifth gate body portion 26Aε of the fourth gate wiring 26δ and the fifth gate wiring 26ε are positioned with a third distance D3 in the Y-axis direction between the fourth body side connection portion 26Cδ and the fifth body side connection portion 26Cε, as shown in Figure 5. In contrast, the fourth gate lead portion 26Bδ and the fifth gate lead portion 26Bε of the fourth gate wiring 26δ and the fifth gate wiring 26ε are positioned with a fourth distance D4 in the Y-axis direction between the fourth intersection point CP4 and the fifth intersection point CP5. In other words, the positional relationship between the fourth gate wiring 26δ and the fifth gate wiring 26ε is the same as the positional relationship between the second gate wiring 26β and the third gate wiring 26γ.

[0061] The first gate wiring 26α, the second gate wiring 26β, the third gate wiring 26γ, the fourth gate wiring 26δ, and the fifth gate wiring 26ε are arranged such that the second distance D2 and the fourth distance D4 are equal, as shown in Figure 5. Specifically, each gate lead-out portion 26B provided on all gate wirings 26 is arranged to connect to the central position in the Y-axis direction of each upper electrode 17B. In other words, the gate lead-out portions 26B are provided such that their arrangement in the Y-axis direction roughly coincides with the central position in the Y-axis direction of the lower electrode 17A. Therefore, the intersection positions CP between each gate lead-out portion 26B and each lower electrode 17A are arranged at equal pitches in the Y-axis direction. That is, the second distance D2 and the fourth distance D4, which are the distances between two adjacent intersection positions CP in the Y-axis direction, are equal. In this way, the positional relationship in the Y-axis direction between the first lower electrode 17Aα and the first gate extraction portion 26Bα, the positional relationship in the Y-axis direction between the second lower electrode 17Aβ and the second gate extraction portion 26Bβ, the positional relationship in the Y-axis direction between the third lower electrode 17Aγ and the third gate extraction portion 26Bγ, the positional relationship in the Y-axis direction between the fourth lower electrode 17Aδ and the fourth gate extraction portion 26Bδ, and the positional relationship in the Y-axis direction between the fifth lower electrode 17Aε and the fifth gate extraction portion 26Bε can be made to be the same pattern.

[0062] On the other hand, the first gate wiring 26α, the second gate wiring 26β, the third gate wiring 26γ, the fourth gate wiring 26δ, and the fifth gate wiring 26ε are arranged such that the first distance D1 and the third distance D3 are different, as shown in Figure 5. More specifically, two adjacent gate wirings 26 in the Y-axis direction are arranged such that the main body side connection part 26C and the gate lead-out side connection part 26D, which are the connection points between the gate main body part 26A and the gate lead-out part 26B, are offset in the Y-axis direction from the intersection position CP (the central position in the Y-axis direction of the lower electrode 17A) to one side (upper side in Figure 5) and the other side (lower side in Figure 5). More specifically, the first gate wiring 26α is arranged such that the first main body side connection part 26Cα and the first lead-out side connection part 26Dα are biased toward the end of the first upper electrode 17Bα opposite to the second upper electrode 17Bβ side in the Y-axis direction. The first main body side connection portion 26Cα and the first lead-out side connection portion 26Dα are arranged such that one end in the Y-axis direction aligns with one end in the Y-axis direction of the first lower layer electrode 17Aα. The second gate wiring 26β is arranged such that the second main body side connection portion 26Cβ and the second lead-out side connection portion 26Dβ are biased toward the end of the second upper layer electrode 17Bβ opposite to the first upper layer electrode 17Bα side in the Y-axis direction. The other end of the second main body side connection portion 26Cβ and the second lead-out side connection portion 26Dβ is arranged such that the other end in the Y-axis direction aligns with the other end in the Y-axis direction of the second lower layer electrode 17Aβ.

[0063] As shown in Figure 5, the third gate wiring 26γ is arranged such that the third main body side connection 26Cγ and the third lead-out side connection 26Dγ are biased toward the end of the third upper layer electrode 17Bγ on the second upper layer electrode 17Bβ side in the Y-axis direction. The third main body side connection 26Cγ and the third lead-out side connection 26Dγ are arranged so that one end in the Y-axis direction aligns with the other end of the third lower layer electrode 17Aγ in the Y-axis direction. The fourth gate wiring 26δ is arranged such that the fourth main body side connection 26Cδ and the fourth lead-out side connection 26Dδ are biased toward the end of the fourth upper layer electrode 17Bδ opposite to the third upper layer electrode 17Bγ side in the Y-axis direction. The other end of the fourth main body side connection 26Cδ and the fourth lead-out side connection 26Dδ are arranged so that the other end in the Y-axis direction aligns with the other end of the fourth lower layer electrode 17Aδ in the Y-axis direction. The fifth gate wiring 26ε is arranged such that the fifth main body side connection portion 26Cε and the fifth lead-out side connection portion 26Dε are biased toward the end of the fifth upper layer electrode 17Bε on the fourth upper layer electrode 17Bδ side in the Y-axis direction. The fifth main body side connection portion 26Cε and the fifth lead-out side connection portion 26Dε are arranged so that one end in the Y-axis direction aligns with one end in the Y-axis direction of the fifth lower layer electrode 17Aε.

[0064] In this embodiment, as shown in Figure 5, the first distance D1 is greater than the third distance D3. Also, the first distance D1 is greater than the second distance D2 and the fourth distance D4. Furthermore, the third distance D3 is smaller than the second distance D2 and the fourth distance D4. The value obtained by dividing the sum of the first distance D1 and the third distance D3 by 2 is equivalent to the array spacing in the Y-axis direction of the pixel electrodes 25 in the display area AA (see Figure 3).

[0065] In this way, the straight-line distance between the first main body side connection portion 26Cα, which is located on the opposite end of the first upper electrode 17Bα in the Y-axis direction from the second upper electrode 17Bβ side, and the first crossing position CP1 can be made as large as possible. The straight-line distance between the second main body side connection portion 26Cβ, which is located on the opposite end of the second upper electrode 17Bβ in the Y-axis direction from the first upper electrode 17Bα side, and the second crossing position CP2 can be made as large as possible. The straight-line distance between the third main body side connection portion 26Cγ, which is located on the opposite end of the third upper electrode 17Bβ in the Y-axis direction, and the third crossing position CP3 can be made as large as possible. The straight-line distance between the fourth main body side connection portion 26Cδ, which is located on the opposite end of the fourth upper electrode 17Bδ in the Y-axis direction from the third upper electrode 17Bγ side, and the fourth crossing position CP4 can be made as large as possible. The linear distance between the fifth main body side connection portion 26Cε, which is located towards the end of the fifth upper electrode 17Bδ in the Y-axis direction of the fifth upper electrode 17Bε, and the fifth intersection point CP5 can be made as large as possible. As described above, by keeping the linear distance between the main body side connection portion 26C and the intersection point CP as large as possible, electrostatic discharge between the main body side connection portion 26C and the intersection point CP becomes less likely.

[0066] As described above, the array substrate (wiring substrate) 21 of this embodiment comprises a first gate wiring (first wiring) 26α, a first lower electrode (first conductive part) 17Aα that intersects with a part of the first gate wiring 26α, a second gate wiring (second wiring) 26β that is spaced apart from the first gate wiring 26α in a first direction, and a second lower electrode (second conductive part) 17Aβ that intersects with a part of the second gate wiring 26β, wherein the first gate wiring 26α is a first gate body part consisting of a part of the first metal film (first conductive film) The first gate lead portion (second wiring component) 26Bα is made up of a part of the second metal film (second conductive film) with a gate insulating film (first insulating film) 29 interposed between it and the first metal film, and the first gate body portion 26Aα has a first body side connection portion (first end) 26Cα, and the first gate lead portion 26Bα has a first lead side connection portion (second end) 26Dα connected to the first body side connection portion 26Cα, and the first lower layer electrode 17Aα is made up of a part of the first metal film, and the first lower layer electrode 17Aα is The second gate wiring 26β is arranged to intersect with the first gate lead portion 26Bα of the first gate wiring 26α at a first intersection position CP1, and the second gate wiring 26β has a second gate body portion (third wiring component) 26Aβ made of a part of the first metal film and a second gate lead portion (fourth wiring component) 26Bβ made of a part of the second metal film, and in the second gate body portion 26Aβ, the second body side connection portion (third end portion) 26Cβ is arranged at a position with a first distance D1 in the first direction from the first body side connection portion 26Cα, and the second gate lead portion The outlet portion 26Bβ has a second lead-out side connection portion (fourth end portion) 26Dβ which is connected to the second main body side connection portion 26Cβ, the second lower layer electrode 17Aβ is made of a part of the first metal film, the second lower layer electrode 17Aβ is arranged to intersect with the second gate lead-out portion 26Bβ of the second gate wiring 26β at the second intersection position CP2, the second intersection position CP2 is located at a position a second distance D2 away from the first intersection position CP1 in the first direction in the second gate lead-out portion 26Bβ, and the second distance D2 is different from the first distance D1.

[0067] If the first gate body portion 26Aα or the second gate body portion 26Aβ, which are made of the first metal film, become charged, there is a concern that electrostatic discharge may occur between the first body-side connection portion 26Cα and the first intersection point CP1, which is the intersection point between the first gate lead-out portion 26Bα, which is made of the second metal film, and the first lower layer electrode 17Aα, or between the second body-side connection portion 26Cβ and the second intersection point CP2, which is the intersection point between the second gate lead-out portion 26Bβ, which is made of the second metal film, and the second lower layer electrode 17Aβ. In this regard, the second distance D2 left between the first intersection point CP1 and the second intersection point CP2 in the first direction is different from the first distance D1 left between the first body-side connection portion 26Cα and the second body-side connection portion 26Cβ in the first direction. In this way, compared to the case where the first distance D1 and the second distance D2 are the same, a larger linear distance is secured between the first main body side connection part 26Cα and the first intersection point CP1, and between the second main body side connection part 26Cβ and the second intersection point CP2. As a result, even if the first gate main body part 26Aα and the second gate main body part 26Aβ, which are made of the first metal film, become charged, electrostatic discharge is less likely to occur between the first main body side connection part 26Cα and the first intersection point CP1, and also between the second main body side connection part 26Cβ and the second intersection point CP2. Since electrostatic discharge is less likely to occur at the first intersection point CP1 and the second intersection point CP2, it becomes less likely that the first gate lead-out part 26Bα and the first lower layer electrode 17Aα will short-circuit, or that the second gate lead-out part 26Bβ and the second lower layer electrode 17Aβ will short-circuit.

[0068] Furthermore, the device includes a third gate wiring (third wiring) 26γ that is spaced apart from the second gate wiring 26β in the first direction so as to move away from the first gate wiring 26α, and a third lower layer electrode (third conductive part) 17Aγ that intersects with a part of the third gate wiring 26γ. The third gate wiring 26γ has a third gate body part (fifth wiring component) 26Aγ made of a part of the first metal film, and a third gate lead-out part (sixth wiring component) 26Bγ made of a part of the second metal film, and in the third gate body part 26Aγ, at a position that is spaced a third distance D3 from the second body side connection part 26Cβ in the first direction. A third main body side connection part (fifth end) 26Cγ is provided, and the third gate lead-out part 26Bγ has a third lead-out side connection part (sixth end) 26Dγ connected to the third main body side connection part 26Cγ, the third lower layer electrode 17Aγ is made of a part of the first metal film, the third lower layer electrode 17Aγ is provided so as to intersect with the third gate lead-out part 26Bγ of the third gate wiring 26γ at the third intersection position CP3, the third gate lead-out part 26Bγ is provided so as to be located at a position where a fourth distance D4 is left from the second intersection position CP2 in the first direction, and the fourth distance D4 is different from the third distance D3.

[0069] As described above, the fourth distance D4 left in the first direction between the second intersection point CP2 and the third intersection point CP3 is different from the third distance D3 left in the first direction between the second main body side connection part 26Cβ and the third main body side connection part 26Cγ. In this way, a larger linear distance is secured between the third main body side connection part 26Cγ and the third intersection point CP3 compared to the case where the third distance D3 and the fourth distance D4 are the same. As a result, even if the third gate main body part 26Aγ, which is made of the first metal film, becomes charged, electrostatic discharge is less likely to occur between the third main body side connection part 26Cγ and the third intersection point CP3. Since electrostatic discharge is less likely to occur at the third intersection point CP3, it is less likely that the third gate lead-out part 26Bγ and the third lower layer electrode 17Aγ will be short-circuited.

[0070] Furthermore, the first gate wiring 26α, the second gate wiring 26β, and the third gate wiring 26γ are arranged such that the first distance D1 and the third distance D3 are different, but the second distance D2 and the fourth distance D4 are equal. In this way, the positional relationship between the first lower electrode 17Aα and the first gate lead-out portion 26Bα in the first direction, the positional relationship between the second lower electrode 17Aβ and the second gate lead-out portion 26Bβ in the first direction, and the positional relationship between the third lower electrode 17Aγ and the third gate lead-out portion 26Bγ in the first direction can be made to be the same pattern.

[0071] Furthermore, it comprises a first upper electrode (fourth conductive part) 17Bα made of a part of the second metal film and connected to the first gate lead-out portion 26Bα, a second upper electrode (fifth conductive part) 17Bβ made of a part of the second metal film and connected to the second gate lead-out portion 26Bβ and arranged at a distance from the first upper electrode 17Bα in a first direction, and a third upper electrode (sixth conductive part) 17Bγ made of a part of the second metal film and connected to the third gate lead-out portion 26Bγ and arranged at a distance from the second upper electrode 17Bβ in a first direction away from the first upper electrode 17Bα, and the first gate wiring 26α is The first main body side connection portion 26Cα and the first drawer side connection portion 26Dα are arranged such that they are offset away from the second upper electrode 17Bβ in a first direction of the first upper electrode 17Bα, the second gate wiring 26β is arranged such that the second main body side connection portion 26Cβ and the second drawer side connection portion 26Dβ are offset away from the first upper electrode 17Bα in a first direction of the second upper electrode 17Bβ, and the third gate wiring 26γ is arranged such that the third main body side connection portion 26Cγ and the third drawer side connection portion 26Dγ are offset near the second upper electrode 17Bβ in a first direction of the third upper electrode 17Bγ. The straight-line distance between the first main body side connection portion 26Cα, which is offset away from the second upper electrode 17Bβ in a first direction of the first upper electrode 17Bα, and the first intersection position CP1 can be made as large as possible. The straight-line distance between the second main body side connection portion 26Cβ, which is located away from the first upper electrode 17Bα in the first direction of the second upper electrode 17Bβ, and the second crossing position CP2 can be made as large as possible. The straight-line distance between the third main body side connection portion 26Cγ, which is located near the second upper electrode 17Bβ in the first direction of the third upper electrode 17Bγ, and the third crossing position CP3 can be made as large as possible.

[0072] Furthermore, the shift register circuit 16 includes a first unit circuit section 16Uα connected to a first gate lead section 26Bα and a second unit circuit section 16Uβ connected to a second gate lead section 26Bβ. The first unit circuit section 16Uα includes a first lower electrode 17Aα, and the second unit circuit section 16Uβ includes a second lower electrode 17Aβ. The first lower electrode 17Aα and the second lower electrode 17Aβ are arranged side by side with a gap between them in the first direction. The area of ​​the first lower electrode 17Aα included in the first unit circuit section 16Uα is smaller than that of the first gate body section 26Aα of the first gate wiring 26α. Similarly, the area of ​​the second lower electrode 17Aβ included in the second unit circuit section 16Uβ is smaller than that of the second gate body section 26Aβ of the second gate wiring 26β. Therefore, if the first gate body portion 26Aα and the second gate body portion 26Aβ, which are made of the first metal film, become charged, there is a concern that electrostatic discharge may occur between the first body side connection portion 26Cα and the first intersection point CP1, and between the second body side connection portion 26Cβ and the second intersection point CP2. However, by ensuring a large linear distance between the first body side connection portion 26Cα and the first intersection point CP1, and between the second body side connection portion 26Cβ and the second intersection point CP2, it is possible to make it difficult for such electrostatic discharge to occur.

[0073] Furthermore, the liquid crystal panel (display device) 11 according to this embodiment comprises the array substrate 21 described above and a counter substrate 20 arranged opposite to the array substrate 21 with a gap between them. With a liquid crystal panel 11 having such a configuration, the occurrence of short circuits in the array substrate 21 is suppressed, making it less likely for display defects caused by short circuits to occur.

[0074] <Embodiment 2> Embodiment 2 will be explained with reference to Figure 7. This Embodiment 2 shows a case where the configuration of the gate wiring 126 is changed. Note that redundant explanations of the structure, operation, and effects, which are the same as those described in Embodiment 1, will be omitted.

[0075] In this embodiment, the first gate wiring 126α, second gate wiring 126β, third gate wiring 126γ, fourth gate wiring 126δ, and fifth gate wiring 126ε are arranged such that the first distance D101 and the third distance D103 are equal, as shown in Figure 7. Specifically, the main body side connection part 126C and the lead-out side connection part 126D provided on all gate wiring 126 are arranged in the Y-axis direction such that their arrangement in the Y-axis direction generally coincides with the central position of the lower electrode 117A in the Y-axis direction. Therefore, the main body side connection part 126C and the lead-out side connection part 126D are arranged at equal pitch in the Y-axis direction. In other words, the first distance D103 and the third distance D103, which are the distances between two adjacent main body side connection parts 126C and lead-out side connection parts 126D in the Y-axis direction, are equal. In this way, the first gate body 126Aα, the second gate body 126Aβ, the third gate body 126Aγ, the fourth gate body 126Aδ, and the fifth gate body 126Aε can be arranged at equal pitches.

[0076] On the other hand, the first gate wiring 126α, the second gate wiring 126β, the third gate wiring 126γ, the fourth gate wiring 126δ, and the fifth gate wiring 126ε are arranged such that the second distance D102 and the fourth distance D104 are different, as shown in Figure 7. Specifically, two adjacent gate wirings 126 in the Y-axis direction are arranged such that the intersection position CP between the gate lead-out portion 126B and the lower electrode 117A is shifted in the Y-axis direction by one side (upper side in Figure 7) and the other side (lower side in Figure 7) with respect to the main body side connection portion 126C and the lead-out side connection portion 126D (the central position in the Y-axis direction of the lower electrode 117A). The gate lead-out portion 126B is arranged to connect to one of the two corners located on the main body side connection portion 126C and the lead-out side connection portion 126D side (right side in Figure 7) of the upper electrode 117B in the X-axis direction. More specifically, the first gate wiring 126α is positioned such that the first intersection point CP101 is biased towards the end of the first upper electrode 117Bα on the side of the second upper electrode 117Bβ in the Y-axis direction. The first gate lead-out portion 126Bα is positioned so that the side edge on the other side (lower side in Figure 7) in the Y-axis direction aligns with the other end of the first upper electrode 117Bα in the Y-axis direction. The second gate wiring 126β is positioned such that the second intersection point CP102 is biased towards the end of the second upper electrode 117Bβ on the side of the first upper electrode 117Bα in the Y-axis direction. The second gate lead-out portion 126Bβ is positioned so that the side edge on one side (upper side in Figure 7) in the Y-axis direction aligns with the one end of the second upper electrode 117Bβ in the Y-axis direction.

[0077] As shown in Figure 7, the third gate wiring 126γ is positioned such that the third intersection point CP103 is biased towards the end of the third upper electrode 117Bγ in the Y-axis direction, opposite to the second upper electrode 117Bβ side. The third gate lead-out portion 126Bγ is positioned so that the other side edge in the Y-axis direction aligns with the other end of the third upper electrode 117Bγ in the Y-axis direction. The fourth gate wiring 126δ is positioned such that the fourth intersection point CP104 is biased towards the end of the fourth upper electrode 117Bδ in the Y-axis direction, towards the third upper electrode 117Bγ side. The fourth gate lead-out portion 126Bδ is positioned so that one side edge in the Y-axis direction aligns with the one end of the fourth upper electrode 117Bδ in the Y-axis direction. The fifth gate wiring 126ε is positioned such that the fifth intersection position CP105 is located towards the end of the fifth upper electrode 117Bε opposite to the fourth upper electrode 117Bδ in the Y-axis direction. The fifth gate lead-out portion 126Bε is positioned so that the other side edge in the Y-axis direction aligns with the other end of the fifth upper electrode 117Bε in the Y-axis direction.

[0078] In this embodiment, as shown in Figure 7, the fourth distance D104 is greater than the second distance D102. Also, the fourth distance D104 is greater than the first distance D101 and the third distance D103. Also, the second distance D102 is smaller than the first distance D101 and the third distance D103. The first distance D101 and the third distance D103 are equivalent to the array spacing in the Y-axis direction of the pixel electrodes 25 in the display area AA (see Figure 3).

[0079] In this way, the straight-line distance between the first main body side connection part 126Cα and the first intersection point CP101, which is located near the end of the first upper layer electrode 117Bα on the side of the second upper layer electrode 117Bβ in the Y-axis direction, can be made as large as possible. The straight-line distance between the second main body side connection part 126Cβ and the second intersection point CP102, which is located near the end of the second upper layer electrode 117Bβ on the side of the first upper layer electrode 117Bα in the Y-axis direction, can be made as large as possible. The straight-line distance between the third main body side connection part 126Cγ and the third intersection point CP103, which is located near the end of the third upper layer electrode 117Bγ on the side opposite to the second upper layer electrode 117Bβ in the Y-axis direction, can be made as large as possible. The straight-line distance between the fourth main body connection part 126Cδ and the fourth intersection point CP104, which is located near the end of the fourth upper electrode 117Bδ on the side of the third upper electrode 117Bγ in the Y-axis direction, can be made as large as possible. The straight-line distance between the fifth main body connection part 126Cε and the fifth intersection point CP105, which is located near the end of the fifth upper electrode 117Bε on the side opposite to the fourth upper electrode 117Bδ in the Y-axis direction, can be made as large as possible. As described above, by keeping the straight-line distance between the main body connection part 126C and the intersection point CP as large as possible, electrostatic discharge between the main body connection part 126C and the intersection point CP becomes less likely.

[0080] As described above, according to this embodiment, the first gate wiring 126α, the second gate wiring 126β, and the third gate wiring 126γ are arranged such that the first distance D101 and the third distance D103 are equal, although the second distance D102 and the fourth distance D104 are different. In this way, the first gate body 126Aα, the second gate body 126Aβ, and the third gate body 126Aγ can be arranged at equal pitches.

[0081] Furthermore, the electrode comprises a first upper electrode 117Bα made of a part of the second metal film and connected to the first gate extraction portion 126Bα, a second upper electrode 117Bβ made of a part of the second metal film and connected to the second gate extraction portion 126Bβ and positioned at a distance from the first upper electrode 117Bα in a first direction, and a third upper electrode 117Bγ made of a part of the second metal film and connected to the third gate extraction portion 126Bγ and positioned at a distance from the second upper electrode 117Bβ in a first direction away from the first upper electrode 117Bα. The first gate wiring 126α is arranged such that the first intersection point CP101 is biased towards the second upper electrode 117Bβ in a first direction of the first upper electrode 117Bα, the second gate wiring 126β is arranged such that the second intersection point CP2 is biased towards the first upper electrode 117Bα in a first direction of the second upper electrode 117Bβ, and the third gate wiring 126γ is arranged such that the third intersection point CP103 is biased away from the second upper electrode 117Bβ in a first direction of the third upper electrode 117Bγ. The straight-line distance between the first main body side connection part 126Cα and the first intersection point CP101, which is biased towards the second upper electrode 117Bβ in a first direction of the first upper electrode 117Bα, can be made as large as possible. The straight-line distance between the second main body side connection part 126Cβ and the second crossing point CP102 of the second upper layer electrode 117Bβ, which is located near the first upper layer electrode 117Bα in the first direction, can be made as large as possible. The straight-line distance between the third main body side connection part 126Cγ and the third crossing point CP103 of the third upper layer electrode 117Bγ, which is located away from the second upper layer electrode 117Bβ in the first direction, can be made as large as possible.

[0082] <Embodiment 3> Embodiment 3 will be explained with reference to Figure 8. This Embodiment 3 shows a case where the configuration of the gate wiring 226 is changed from Embodiments 1 and 2 described above. Note that redundant explanations of the structure, operation, and effects, which are the same as those described in Embodiments 1 and 2, will be omitted.

[0083] In this embodiment, the first gate wiring 226α, second gate wiring 226β, third gate wiring 226γ, fourth gate wiring 226δ, and fifth gate wiring 226ε are arranged such that, as in Embodiment 1, the first distance D201 and the third distance D203 are different, and as in Embodiment 2, the second distance D202 and the fourth distance D204 are different. Specifically, two adjacent gate wirings 226 in the Y-axis direction are arranged such that, as in Embodiment 1, the main body side connection part 226C and the lead-out side connection part 226D are offset in the Y-axis direction from the central position of the lower electrode 217A in the Y-axis direction to one side (upper side in Figure 8) and the other side (lower side in Figure 8). In addition, two adjacent gate wirings 226 in the Y-axis direction are arranged, similar to Embodiment 2, such that the intersection position CP between the gate lead portion 226B and the lower electrode 217A is offset in the Y-axis direction by one side (upper side in Figure 8) and the other side (lower side in Figure 8) relative to the central position of the lower electrode 217A in the Y-axis direction. The specific arrangement of each gate wiring 226α to 226ε is as described in Embodiments 1 and 2.

[0084] In this embodiment, as shown in Figure 8, the first distance D201 is equal to the first distance D1 in Embodiment 1, and the third distance D203 is equal to the third distance D3 in Embodiment 1 (see Figure 5). Similarly, in this embodiment, the second distance D202 is equal to the second distance D102 in Embodiment 2, and the fourth distance D204 is equal to the fourth distance D104 in Embodiment 2 (see Figure 7). The difference between the first distance D201 and the third distance D203 is greater than the difference between the first distance D1 and the third distance D3 in Embodiment 1, and also greater than the difference between the first distance D101 and the third distance D103 in Embodiment 2. Similarly, the difference between the second distance D202 and the fourth distance D204 is greater than the difference between the second distance D2 and the fourth distance D4 in Embodiment 1, and also greater than the difference between the second distance D102 and the fourth distance D104 in Embodiment 2.

[0085] In this way, the straight-line distance between the first main body side connection portion 226Cα, which is located near the end of the first upper electrode 217Bα opposite to the second upper electrode 217Bβ side in the Y-axis direction, and the first intersection point CP201, which is located near the end of the first upper electrode 217Bα on the second upper electrode 217Bβ side in the Y-axis direction, can be maximized. The straight-line distance between the second main body side connection portion 226Cβ, which is located near the end of the second upper electrode 217Bβ on the third upper electrode 217Bγ side in the Y-axis direction, and the second intersection point CP202, which is located near the end of the second upper electrode 217Bβ on the first upper electrode 217Bα side in the Y-axis direction, can be maximized. The straight-line distance between the third main body side connection portion 226Cγ, which is located towards the end of the third upper electrode 217Bγ on the side of the second upper electrode 217Bβ in the Y-axis direction, and the third crossing position CP203, which is located towards the end of the third upper electrode 217Bγ on the opposite side of the second upper electrode 217Bβ in the Y-axis direction, can be maximized. The straight-line distance between the fourth main body side connection portion 226Cδ, which is located towards the end of the fourth upper electrode 217Bδ on the side of the fifth upper electrode 217Bε in the Y-axis direction, and the fourth crossing position CP204, which is located towards the end of the fourth upper electrode 217Bδ on the side of the third upper electrode 217Bγ in the Y-axis direction, can be maximized. The linear distance between the fifth main body side connection portion 226Cε, which is located towards the end of the fifth upper electrode 217Bε on the side of the fourth upper electrode 217Bδ in the Y-axis direction, and the fifth intersection point CP205, which is located towards the end of the fifth upper electrode 217Bε on the opposite side of the Y-axis direction from the fourth upper electrode 217Bδ, can be maximized. As described above, by maximizing the linear distance between the main body side connection portion 226C and the intersection point CP, electrostatic discharge between the main body side connection portion 226C and the intersection point CP becomes even less likely.

[0086] As described above, according to this embodiment, the first gate wiring 226α, the second gate wiring 226β, and the third gate wiring 226γ are arranged such that the first distance D201 and the third distance D203 are different, and the second distance D202 and the fourth distance D204 are different. This arrangement is suitable for maximizing the straight-line distance between the first main body side connection part 226Cα and the first intersection point CP201, the straight-line distance between the second main body side connection part 226Cβ and the second intersection point CP202, and the straight-line distance between the third main body side connection part 226Cγ and the third intersection point CP203.

[0087] Furthermore, it comprises a first upper electrode 217Bα made of a part of the second metal film and connected to the first gate extraction portion 226Bα, a second upper electrode 217Bβ made of a part of the second metal film and connected to the second gate extraction portion 226Bβ and spaced apart from the first upper electrode 217Bα in the first direction, and a third gate extraction portion 226Bγ made of a part of the second metal film and connected to the second upper electrode 217Bβ The first gate wiring 226α comprises a third upper electrode 217Bγ which is spaced apart from the first upper electrode 217Bα in a first direction, and the first gate wiring 226α has a first body-side connection part 226Cα and a first lead-side connection part 226Dα which are unevenly distributed away from the second upper electrode 217Bβ in a first direction of the first upper electrode 217Bα, and the first crossing position CP201 ​​is of the first upper electrode 217Bα The second gate wiring 226β is arranged such that, in its first direction, it is biased towards the second upper electrode 217Bβ, and the second main body side connection part 226Cβ and the second lead-out side connection part 226Dβ are biased away from the first upper electrode 217Bα in the first direction of the second upper electrode 217Bβ, and the second crossing position CP202 is arranged such that, in the first direction of the second upper electrode 217Bβ, it is biased towards the first upper electrode 217Bα, and the third gate wiring 226γ is arranged such that, in its third direction, it is biased towards the second upper electrode 217Bβ in the third upper electrode 217Bγ, and the third crossing position CP203 is arranged such that, in the first direction of the third upper electrode 217Bγ, it is biased away from the second upper electrode 217Bβ. The straight-line distance between the first main body side connection portion 226Cα, which is located away from the second upper electrode 217Bβ in a first direction of the first upper electrode 217Bα, and the first crossing position CP201, which is located near the second upper electrode 217Bβ in a first direction of the first upper electrode 217Bα, can be maximized. The straight-line distance between the second main body side connection portion 226Cβ, which is located away from the first upper electrode 217Bα in a first direction of the second upper electrode 217Bβ, and the second crossing position CP202, which is located near the first upper electrode 217Bα in a first direction of the second upper electrode 217Bβ, can be maximized.The straight-line distance between the third main body side connection portion 226Cγ, which is located near the second upper electrode 217Bβ in the first direction of the third upper electrode 217Bγ, and the third crossing position CP203, which is located away from the second upper electrode 217Bβ in the first direction of the third upper electrode 217Bγ, can be maximized.

[0088] <Embodiment 4> Embodiment 4 will be explained with reference to Figure 9. This Embodiment 4 shows a case where the configuration of the gate wiring 326 is changed from Embodiment 3 described above. Note that redundant explanations of the structure, operation, and effects, which are the same as those of Embodiment 1 described above, will be omitted.

[0089] In this embodiment, the lower electrode 317A is provided with a projection 33 that protrudes locally toward the main body connection portion 326C (right side in Figure 9) in the X-axis direction, as shown in Figure 9, in the portion closer to the main body connection portion 326C (right side in Figure 9) than the intersection position CP. The projection 33 is made of a part of the first metal film and is directly connected to the lower electrode 317A. The projection 33 is positioned so as not to overlap with the upper electrode 317B. The projection 33 is positioned so as to connect to one of the two corners of the lower electrode 317A located toward the main body connection portion 326C and the draw-out side connection portion 326D in the X-axis direction. Here, the gate draw-out portion 326B is positioned so as to connect to one of the two corners of the upper electrode 317B located toward the main body connection portion 326C and the draw-out side connection portion 326D in the X-axis direction. In contrast, the projection 33 is connected to the corner of the lower electrode 317A that is furthest from the gate extraction portion 326B in the Y-axis direction. Furthermore, the projection 33 is positioned with a gap in the X-axis direction relative to the main body side connection portion 326C and the extraction side connection portion 326D.

[0090] In the following, when distinguishing between multiple protrusions 33, the protrusion 33 provided on the first lower electrode 317Aα will be referred to as the "first protrusion" and its designation will be denoted with the subscript "α", the protrusion 33 provided on the second lower electrode 317Aβ will be referred to as the "second intersection position" and its designation will be denoted with the subscript "β", the protrusion 33 provided on the third lower electrode 317Aγ will be referred to as the "third intersection position" and its designation will be denoted with the subscript "γ", the protrusion 33 provided on the fourth lower electrode 317Aδ will be referred to as the "fourth intersection position" and its designation will be denoted with the subscript "δ", and the protrusion 33 provided on the fifth lower electrode 317Aε will be referred to as the "fifth intersection position" and its designation will be denoted with the subscript "ε". When referring to them collectively without distinction, no subscript will be added to the designation.

[0091] As shown in Figure 9, the first projection 33α is provided at a corner of the first lower electrode 317Aα that is closer to the first main body side connection portion 326Cα than the first intersection position CP301, and protrudes locally toward the first main body side connection portion 326Cα in the X-axis direction. The second projection 33β is provided at a corner of the second lower electrode 317Aβ that is closer to the second main body side connection portion 326Cβ than the second intersection position CP302, and protrudes locally toward the second main body side connection portion 326Cβ in the X-axis direction. The third projection 33γ is provided at a corner of the third lower electrode 317Aγ that is closer to the third main body side connection portion 326Cγ than the third intersection position CP303, and protrudes locally toward the third main body side connection portion 326Cγ in the X-axis direction. The fourth projection 33δ is provided at the corner of the fourth lower layer electrode 317Aδ that is closer to the fourth main body side connection portion 326Cδ than the fourth intersection position CP304, and protrudes locally toward the fourth main body side connection portion 326Cδ in the X-axis direction. The fifth projection 33ε is provided at the corner of the fifth lower layer electrode 317Aε that is closer to the fifth main body side connection portion 326Cε than the fifth intersection position CP305, and protrudes locally toward the fifth main body side connection portion 326Cε in the X-axis direction.

[0092] In this way, the first protrusion 33α provided on the first lower electrode 317Aα is positioned closer to the first main body side connection portion 326Cα than to the first intersection position CP301. Therefore, when the first gate main body portion 326Aα, which is made of the first metal film, becomes charged, electrostatic discharge can preferentially occur between the first main body side connection portion 326Cα and the first protrusion 33α. This makes it less likely for electrostatic discharge to occur at the first intersection position CP301. The second protrusion 33β provided on the second lower electrode 317Aβ is positioned closer to the second main body side connection portion 326Cβ than to the second intersection position CP302. Therefore, when the second gate main body portion 326Aβ, which is made of the first metal film, becomes charged, electrostatic discharge can preferentially occur between the second main body side connection portion 326Cβ and the second protrusion 33β. This makes it less likely for electrostatic discharge to occur at the second intersection position CP302. The third projection 33γ provided on the third lower electrode 317Aγ is positioned closer to the third main body side connection portion 326Cγ than to the third intersection position CP303. Therefore, when the third gate main body portion 326Aγ, which is made of the first metal film, is charged, electrostatic discharge can preferentially occur between the third main body side connection portion 326Cγ and the third projection 33γ. This makes it less likely for electrostatic discharge to occur at the third intersection position CP303. The fourth projection 33δ provided on the fourth lower electrode 317Aδ is positioned closer to the fourth main body side connection portion 326Cδ than to the fourth intersection position CP304. Therefore, when the fourth gate main body portion 326Aδ, which is made of the first metal film, is charged, electrostatic discharge can preferentially occur between the fourth main body side connection portion 326Cδ and the fourth projection 33δ. This makes it less likely for electrostatic discharge to occur at the fourth intersection position CP304. The fifth projection 33ε provided on the fifth lower electrode 317Aε is positioned closer to the fifth main body side connection portion 326Cε than to the fifth intersection position CP305. Therefore, when the fifth gate main body portion 326Aε, which is made of the first metal film, becomes charged, electrostatic discharge can preferentially occur between the fifth main body side connection portion 326Cε and the fifth projection 33ε. This makes it less likely for electrostatic discharge to occur at the fifth intersection position CP305. As described above, since electrostatic discharge is less likely to occur at the intersection position CP, it becomes less likely for the gate lead portion 326B and the lower electrode 317A to short-circuit.Furthermore, even if electrostatic discharge occurs between the main body connection part 326C and the protrusion 33, the protrusion 33 is not superimposed on the upper electrode 317B, thus preventing a short circuit between the lower electrode 317A and the upper electrode 317B.

[0093] As described above, according to this embodiment, the first lower electrode 317Aα is provided with a first projection 33α that protrudes locally toward the first main body side connection portion 326Cα in a second direction intersecting the first direction, and the distance from the first projection 33α to the first main body side connection portion 326Cα is shorter than the distance from the first intersection point CP301 to the first main body side connection portion 326Cα. The second lower electrode 317Aβ is provided with a second projection 33β that protrudes locally toward the second main body side connection portion 326Cβ in a second direction, and the distance from the second projection 33β to the second main body side connection portion 326Cβ is shorter than the distance from the second intersection point CP302 to the second main body side connection portion 326Cβ. The first projection 33α provided on the first lower electrode 317Aα is positioned closer to the first main body side connection portion 326Cα than to the first intersection point CP301. Therefore, when the first gate body portion 326Aα, which is made of the first metal film, is charged, electrostatic discharge can preferentially occur between the first body-side connection portion 326Cα and the first protrusion 33α. This makes it less likely for electrostatic discharge to occur at the first intersection position CP301. The second protrusion 33β provided on the second lower layer electrode 317Aβ is positioned closer to the second body-side connection portion 326Cβ than to the second intersection position CP302. Therefore, when the second gate body portion 326Aβ, which is made of the first metal film, is charged, electrostatic discharge can preferentially occur between the second body-side connection portion 326Cβ and the second protrusion 33β. This makes it less likely for electrostatic discharge to occur at the second intersection position CP302.

[0094] <Embodiment 5> Embodiment 5 will be explained with reference to Figure 10. This Embodiment 5 shows a case where the configuration of the gate wiring 426 is changed from Embodiment 1 described above. Note that redundant explanations of the structure, operation, and effects, which are the same as those of Embodiment 1 described above, will be omitted.

[0095] As shown in Figure 10, the gate body portion 426A according to this embodiment has a bent portion 34 with a curved planar shape that is connected to the main body side connection portion 426C, and an extended portion 35 connected to the bent portion 34. The bent portion 34 has a planar shape that is approximately L-shaped, and is arranged to extend from the main body side connection portion 426C along the X-axis toward the opposite side from the lower electrode 417A (right side in Figure 10), then bend and extend along the Y-axis. The direction in which the bent portion 34 is bent in the gate body portion 426A is opposite to the direction in which the extended portion 426B2 is bent toward the intersection portion 426B1 in the gate pull-out portion 426B. The extended portion 35 is arranged to extend from the end of the bent portion 34 opposite to the main body side connection portion 426C along the X-axis toward the opposite side from the main body side connection portion 426C. The extension portion 35 extending along the X-axis is located on the same line as the intersection portion 426B1 extending along the X-axis. In other words, the dimension of the bent portion 34 extending along the Y-axis is adjusted so that the extension portion 35 and the intersection portion 426B1 are aligned on the same line.

[0096] In the following, when distinguishing between multiple bent portions 34 and extended portions 35, the bent portions 34 and extended portions 35 included in the first gate body 426Aα will be referred to as the "first bent portion" and the "first extended portion," with the subscript "α" added to their designation; the bent portions 34 and extended portions 35 included in the second gate body 426Aβ will be referred to as the "second bent portion" and the "second extended portion," with the subscript "β" added to their designation; and the bent portions 34 and extended portions 35 included in the third gate body 426Aγ will be referred to as " The third bend and third extension are denoted by the subscript "γ", the bend 34 and extension 35 included in the fourth gate body 426Aδ are denoted by the subscript "δ", the bend 34 and extension 35 included in the fifth gate body 426Aε are denoted by the subscript "ε", and when referring to them collectively without distinction, no subscript is added to the symbols.

[0097] As shown in Figure 10, the first bent portion 34α, which constitutes the first gate body portion 426Aα, extends from the first body-side connection portion 426Cα along the X-axis direction to the opposite side of the first lower layer electrode 417Aα, then bends and extends along the Y-axis direction toward the bottom of Figure 10. The direction in which the first bent portion 34α is bent is opposite to the direction in which the extended portion 426B2 is bent relative to the intersection portion 426B1 at the first gate lead-out portion 426Bα (upper side of Figure 10). The first extended portion 35α extends from the end of the first bent portion 34α along the X-axis direction to the opposite side of the first body-side connection portion 426Cα. The second bent portion 34β, which constitutes the second gate body portion 426Aβ, extends from the second body-side connection portion 426Cβ along the X-axis direction to the opposite side of the second lower layer electrode 417Aβ, then bends and extends along the Y-axis direction toward the top of Figure 10. The direction in which the second bent portion 34β is bent is opposite to the direction in which the extended portion 426B2 is bent relative to the intersection portion 426B1 at the second gate pull-out portion 426Bβ (lower side of Figure 10). The second extension portion 35β extends from the end of the second bent portion 34β along the X-axis direction on the opposite side from the second main body side connection portion 426Cβ.

[0098] As shown in Figure 10, the third bent portion 34γ, which constitutes the third gate body portion 426Aγ, extends from the third body side connection portion 426Cγ along the X-axis direction to the opposite side of the third lower layer electrode 417Aγ, then bends and extends along the Y-axis direction toward the bottom of Figure 10. The direction in which the third bent portion 34γ is bent is opposite to the direction in which the extended portion 426B2 is bent relative to the intersection portion 426B1 at the third gate lead-out portion 426Bγ (upper side of Figure 10). The fourth bent portion 34δ, which constitutes the fourth gate body portion 426Aδ, extends from the fourth body side connection portion 426Cδ along the X-axis direction to the opposite side of the fourth lower layer electrode 417Aδ, then bends and extends along the Y-axis direction toward the top of Figure 10. The direction in which the fourth bent portion 34δ is bent is opposite to the direction in which the extended portion 426B2 is bent relative to the intersection portion 426B1 at the fourth gate extraction portion 426Bδ (lower side of Figure 10). The fifth bent portion 34ε, which constitutes the fifth gate body portion 426Aε, extends from the fifth body side connection portion 426Cε along the X-axis direction to the opposite side from the fifth lower layer electrode 417Aε, then bends and extends along the Y-axis direction toward the lower side of Figure 10. The direction in which the fifth bent portion 34ε is bent is opposite to the direction in which the extended portion 426B2 is bent relative to the intersection portion 426B1 at the fifth gate extraction portion 426Bε (upper side of Figure 10).

[0099] The first gate body portion 426Aα and the second gate body portion 426Aβ of the first gate wiring 426α and the second gate wiring 426β are positioned with a fifth distance D5 in the Y-axis direction between the first extension portion 35α and the second extension portion 35β, as shown in Figure 10. The second gate body portion 426Aβ and the third gate body portion 426Aγ of the second gate wiring 426β and the third gate wiring 426γ are positioned with a sixth distance D6 in the Y-axis direction between the second extension portion 35β and the third extension portion 35γ. This sixth distance D6 is equal to the fifth distance D5. In other words, the first gate body portion 426Aα, the second gate body portion 426Aβ, and the third gate body portion 426Aγ are arranged such that the first extension portion 35α, the second extension portion 35β, and the third extension portion 35γ are arranged at equal pitches in the Y-axis direction. The fifth distance D5 and the sixth distance D6 are equivalent to the arrangement spacing in the Y-axis direction of the pixel electrodes 25 in the display area AA (see Figure 3).

[0100] Furthermore, the third gate body portion 426Aγ and the fourth gate body portion 426Aδ of the third gate wiring 426γ and the fourth gate wiring 426δ are positioned at a fifth distance D5 in the Y-axis direction between the third extension portion 35γ and the fourth extension portion 35δ, as shown in Figure 10. In other words, the positional relationship between the third gate wiring 426γ and the fourth gate wiring 426δ is the same as the positional relationship between the first gate wiring 426α and the second gate wiring 426β. Also, the fourth gate body portion 426Aδ and the fifth gate body portion 426Aε of the fourth gate wiring 426δ and the fifth gate wiring 426ε are positioned at a sixth distance D6 in the Y-axis direction between the fourth extension portion 35δ and the fifth extension portion 35ε. In other words, the positional relationship between the fourth gate wiring 426δ and the fifth gate wiring 426ε is the same as the positional relationship between the second gate wiring 426β and the third gate wiring 426γ.

[0101] Even if the first main body side connection part 426Cα, the second main body side connection part 426Cβ, the third main body side connection part 426Cγ, the fourth main body side connection part 426Cδ, and the fifth main body side connection part 426Cε are unevenly distributed towards the ends of the first upper layer electrode 417Bα, the second upper layer electrode 417Bβ, the third upper layer electrode 417Bγ, the fourth upper layer electrode 417Bδ, and the fifth upper layer electrode 417Bε in the Y-axis direction, according to this embodiment, the first bent part 34α and the second bent part The fifth distance D5 created between the first extension portion 35α and the second extension portion 35β by the portion 34β, the third bending portion 34γ, the fourth bending portion 34δ, and the fifth bending portion 34ε, the sixth distance D6 created between the second extension portion 35β and the third extension portion 35γ, the fifth distance D5 created between the third extension portion 35γ and the fourth extension portion 35δ, and the sixth distance D6 created between the fourth extension portion 35δ and the fifth extension portion 35ε become equal. As a result, the first extension portion 35α, the second extension portion 35β, the third extension portion 35γ, the fourth extension portion 35δ, and the fifth extension portion 35ε can be arranged at equal pitches.

[0102] As described above, according to this embodiment, the first gate body portion 426Aα has a first bent portion 34α which extends from the first body side connection portion 426Cα toward the first lower electrode 417Aα in a second direction intersecting the first direction and then bent to extend toward the first direction, and a first extended portion 35α which extends from the end of the first bent portion 34α toward the first body side connection portion 426Cα in a second direction and then bent to extend toward the first direction, and from the end of the second bent portion 34β toward the second body side connection portion 426Cβ in a second direction and then bent to extend toward the first direction, and The first gate body 426Aα, the second gate body 426Aβ, and the third gate body 426Aγ are arranged such that a fifth distance D5 is set between the first extension 35α and the second extension 35β in the first direction, and a sixth distance D6 is set between the second extension 35β and the third extension 35γ in the first direction. Even if the first main body-side connection portion 426Cα, the second main body-side connection portion 426Cβ, and the third main body-side connection portion 426Cγ are unevenly located near the first upper layer electrode 417Bα, the second upper layer electrode 417Bβ, and the third upper layer electrode 417Bγ in the first direction, the fifth distance D5 created between the first extension portion 35α and the second extension portion 35β by the first bending portion 34α, the second bending portion 34β, and the third bending portion 34γ, and the sixth distance D6 created between the second extension portion 35β and the third extension portion 35γ become equal. This makes it possible to arrange the first extension portion 35α, the second extension portion 35β, and the third extension portion 35γ at equal pitches.

[0103] <Embodiment 6> Embodiment 6 will be described with reference to Figures 11 to 13. This Embodiment 6 shows the case in which a common trunk wiring (fourth wiring) 36 is added to Embodiment 3 described above. Note that redundant explanations of the structure, operation, and effects, which are the same as those of Embodiment 3 described above, will be omitted.

[0104] As shown in Figure 11, a common trunk wiring 36 is provided in the non-display area NAA of the liquid crystal panel 511, which is connected to a common electrode 28 (see Figure 4) and a flexible substrate 513. The common trunk wiring 36 consists of a frame-shaped portion 36A that surrounds the display area AA around its entire circumference, and a lead-out portion 36B that is drawn out from the frame-shaped portion 36A and routed to the flexible substrate 513. The frame-shaped portion 36A is connected to the common electrode 28 via a common branch wiring (not shown). A common potential signal is supplied to the common trunk wiring 36 from an external circuit board via the flexible substrate 513.

[0105] The portion of the frame-shaped part 36A that constitutes the common trunk wiring 36 that extends along the Y-axis is positioned at a distance from the shift register circuit 516 in the X-axis direction toward the display area AA side (right side in Figure 12), as shown in Figure 12. The portion of the frame-shaped part 36A that extends along the Y-axis is positioned at a distance from the main body side connection part 526C and the lead-out side connection part 526D in the X-axis direction toward the opposite side of the display area AA side (left side in Figure 12). In this way, the portion of the frame-shaped part 36A that extends along the Y-axis is positioned between the shift register circuit 516 and the multiple main body side connection parts 526C in the X-axis direction.

[0106] As shown in Figure 13, the common trunk wiring 36 is made up of a part of the first metal film. The portion of the frame-shaped portion 36A constituting the common trunk wiring 36 that extends along the Y-axis is arranged to intersect with a plurality of gate lead portions 526B that are arranged along the Y-axis, as shown in Figures 12 and 13. The portions of the common trunk wiring 36 that intersect with the plurality of gate lead portions 526B each constitute a conductive portion 37. A gate insulating film 529 is interposed between the plurality of conductive portions 37 and the plurality of gate lead portions 526B, keeping them in an insulated state.

[0107] Hereafter, when distinguishing between multiple conductive parts 37, the conductive part 37 consisting of the portion that intersects with the first gate lead portion 526Bα of the common trunk wiring 36 will be referred to as the "first conductive part" and its designation will be denoted by the subscript "α", the conductive part 37 consisting of the portion that intersects with the second gate lead portion 526Bβ of the common trunk wiring 36 will be referred to as the "second conductive part" and its designation will be denoted by the subscript "β", and the conductive part consisting of the portion that intersects with the third gate lead portion 526Bγ of the common trunk wiring 36 will be referred to as the "first conductive part". The part 37 is designated as the "third conductive part" and its designation is denoted with the subscript "γ". The conductive part 37 consisting of the portion that intersects with the fourth gate lead-out portion 526Bδ of the common trunk wiring 36 is designated as the "fourth conductive part" and its designation is denoted with the subscript "δ". The conductive part 37 consisting of the portion that intersects with the fifth gate lead-out portion 526Bε of the common trunk wiring 36 is designated as the "fifth conductive part" and its designation is denoted with the subscript "ε". When referring to them collectively without distinction, no subscript is added to the designation.

[0108] In this embodiment, the common trunk wiring 36 is positioned closer to the main body connection portion 526C than to the shift register circuit 516 in the X-axis direction. Therefore, there is a concern that if the gate main body portion 526A, which is made of the first metal film, becomes charged, electrostatic discharge may occur between the main body connection portion 526C and the intersection position CP. In this regard, as described in embodiments 1 and 3, the gate wirings 526 have their gate lead portions 526B bending in alternating directions, so that the distance between two adjacent main body connection portions 526C in the Y-axis direction and the distance between two adjacent intersection positions CP in the Y-axis direction are different. As a result, the straight-line distances between the first main body connection part 526Cα and the first intersection point CP501, the second main body connection part 526Cβ and the second intersection point CP502, the third main body connection part 526Cγ and the third intersection point CP503, the fourth main body connection part 526Cδ and the fourth intersection point CP504, and the fifth main body connection part 526Cε and the fifth intersection point CP505 are all large, making it difficult for electrostatic discharge to occur as described above.

[0109] As described above, according to this embodiment, the shift register circuit 516 has a first unit circuit section 516Uα connected to a first gate lead section 526Bα and a second unit circuit section 516Uβ connected to a second gate lead section 526Bβ, and a common trunk wiring (fourth wiring) 36 extending along the first direction between the shift register circuit 516 and the first main body side connection section 526Cα and the second main body side connection section 526Cβ in a second direction intersecting the first direction, wherein the common trunk wiring 36 is made of a part of the first metal film, the first conductive part 37α is made of the part of the common trunk wiring 36 that intersects with the first gate lead section 526Bα, and the second conductive part 37β is made of the part of the common trunk wiring 36 that intersects with the second gate lead section 526Bβ. The common trunk wiring 36, including the first conductive portion 37α and the second conductive portion 37β, is positioned closer to one end and the second main body side connection portion 526Cβ than to the shift register circuit 516 in the second direction. Therefore, if the first gate main body portion 526Aα and the second gate main body portion 526Aβ, which are made of the first metal film, become charged, there is a concern that electrostatic discharge may occur between the first main body side connection portion 526Cα and the first intersection point CP501, and between the second main body side connection portion 526Cβ and the second intersection point CP502. However, by ensuring a large linear distance between the first main body side connection portion 526Cα and the first intersection point CP501, and between the second main body side connection portion 526Cβ and the second intersection point CP502, such electrostatic discharge can be made less likely to occur.

[0110] <Embodiment 7> Embodiment 7 will be explained with reference to Figure 14. This Embodiment 7 shows a case where the configuration of the common trunk wiring 636 is changed from Embodiment 6 described above. Note that redundant explanations of the same structure, operation, and effects as in Embodiment 6 will be omitted.

[0111] As shown in Figure 14, the common trunk wiring 636 according to this embodiment is provided with a widened portion 38. The widened portion 38 is provided by widening the common trunk wiring 636 so as to protrude locally toward the main body side connection portion 626C (right side in Figure 14) in the X-axis direction. The widened portion 38 is provided in the part of the common trunk wiring 636 that is closer to the main body side connection portion 626C than to the intersection point CP in the Y-axis direction. Specifically, the widened portion 38 is positioned such that the distance from the intersection point CP is the maximum and the distance from the main body side connection portion 626C is the minimum.

[0112] More specifically, as shown in Figure 14, multiple widening sections 38 are provided at spaced intervals in the Y-axis direction along the common trunk wiring 636. The multiple widening sections 38 include at least one widening section 38 positioned offset in the Y-axis direction from the first intersection point CP601 side relative to the first main body side connection section 626Cα, one widening section 38 located between the second main body side connection section 626Cβ and the third main body side connection section 626Cγ in the Y-axis direction, and one widening section 38 located between the fourth main body side connection section 626Cδ and the fifth main body side connection section 626Cε in the Y-axis direction. In general, the multiple widening sections 38 include one located between the 2n-th main body side connection section 626C and the (2n+1)-th main body side connection section 626C, counting from the top of Figure 14 (n: natural number).

[0113] In this manner, when the gate body portion 626A, which is made of the first metal film, becomes charged, electrostatic discharge can be preferentially generated between the body-side connection portion 626C and the widening portion 38, making electrostatic discharge less likely to occur at the intersection point CP. If electrostatic discharge is less likely to occur at the intersection point CP, it becomes less likely that the gate lead-out portion 626B and the lower electrode 617A will short-circuit. Furthermore, even if electrostatic discharge occurs between the body-side connection portion 626C and the widening portion 38, the widening portion 38 has a single-layer structure and is not superimposed on other wiring or electrodes, thus preventing a short circuit in the common trunk wiring 636.

[0114] As described above, according to this embodiment, the common trunk wiring 636 is provided with widened portions 38 that locally protrude toward the first main body side connection portion 626Cα and the second main body side connection portion 626Cβ in the second direction. The position of the widened portion 38 protruding toward the first main body side connection portion 626Cα is closer to the first main body side connection portion 626Cα than to the first intersection point CP601, and the position of the widened portion 38 protruding toward the second main body side connection portion 626Cβ is closer to the second main body side connection portion 626Cβ than to the second intersection point CP602. The widened portions 38 provided on the common trunk wiring 636 are arranged to be closer to the first main body side connection portion 626Cα and the second main body side connection portion 626Cβ than to the first intersection point CP601 and the second intersection point CP602. Therefore, when the first gate body portion 626Aα or the second gate body portion 626Aβ, which are made of the first metal film, become charged, electrostatic discharge can preferentially occur between the first body-side connection portion 626Cα or the second body-side connection portion 626Cβ and the widening portion 38. This makes it less likely for electrostatic discharge to occur at the first intersection position CP601 and the second intersection position CP602.

[0115] <Embodiment 8> Embodiment 8 will be explained with reference to Figure 15. This Embodiment 7 shows a case where the connection structure between the gate body 726A and the gate pull-out section 726B is changed from Embodiment 1 described above. Note that redundant explanations of the structure, operation, and effects, which are the same as those of Embodiment 1 described above, will be omitted.

[0116] As shown in Figure 15, the array substrate 721 according to this embodiment has a connecting electrode 39 for connecting the gate body portion 726A and the gate lead portion 726B. In this embodiment, the body-side connecting portion 726C of the gate body portion 726A and the lead-side connecting portion 726D of the gate lead-out portion 726B are not directly connected, but are connected via the connecting electrode 39. In this embodiment, the entire area of ​​the lead-side connecting portion 726D overlaps with the body-side connecting portion 726C, but the body-side connecting portion 726C includes a portion that does not overlap with the lead-side connecting portion 726D. The connecting electrode 39 consists of a portion different from the common electrode 28 (see Figure 5) in the first transparent electrode film located on the upper layer side of the planarization film 731. The connecting electrode 39 is arranged to overlap both the body-side connecting portion 726C and the lead-side connecting portion 726D. A gate contact hole GCH700 is provided in communication with the gate insulating film 729, the first interlayer insulating film 730, and the planarization film 731, which are located below the connecting electrode 39. The gate contact hole GCH700 includes a first range A1 that overlaps with the drawer-side connecting portion 726D, and a second range A2 that overlaps with the main body-side connecting portion 726C but does not overlap with the drawer-side connecting portion 726D. The first range A1 of the gate contact hole GCH700 is provided in communication with the first interlayer insulating film 730 and the planarization film 731. The connecting electrode 39 and the drawer-side connecting portion 726D are connected through the first range A1 of the gate contact hole GCH700. The second range A2 of the gate contact hole GCH700 is provided in communication with the gate insulating film 729, the first interlayer insulating film 730, and the planarization film 731. The connecting electrode 39 and the main body side connecting portion 726C are connected through the second range A2 of the gate contact hole GCH700.

[0117] <Embodiment 9> Embodiment 9 will be described with reference to Figure 16. This Embodiment 9 shows a case where the connection structure between the gate body 726A and the gate pull-out section 726B is changed from Embodiment 8 described above. Note that redundant explanations of the structure, operation, and effects, which are the same as those of Embodiment 8 described above, will be omitted.

[0118] As shown in Figure 16, the connecting electrode 839 according to this embodiment is connected to the main body side connecting portion 826C of the gate main body portion 826A and the drawer side connecting portion 826D of the gate drawer portion 826B through two gate contact holes GCH801 and GCH802. One of the gate contact holes GCH801 is provided in communication with the first interlayer insulating film 830 and the planarization film 831 interposed between the connecting electrode 839 and the drawer side connecting portion 826D. One of the gate contact holes GCH801 is arranged superimposed on the connecting electrode 839 and the drawer side connecting portion 826D. The connecting electrode 839 and the drawer side connecting portion 826D are connected through one of the gate contact holes GCH801. The other gate contact hole GCH802 is provided in communication with the gate insulating film 829, the first interlayer insulating film 830 and the planarization film 831 interposed between the connecting electrode 839 and the main body side connecting portion 826C. The other gate contact hole GCH802 is positioned at a distance from the first gate contact hole GCH801, overlapping with the connecting electrode 839 and the main body side connecting portion 826C, but not overlapping with the drawer side connecting portion 826D. The connecting electrode 839 and the main body side connecting portion 826C are connected through the other gate contact hole GCH802.

[0119] <Other Embodiments> The technology disclosed herein is not limited to the embodiments described above in the description and drawings, but also includes, for example, the following embodiments.

[0120] (1) The planar shape of the gate pull-out sections 26B, 126B, 226B, 426B, 526B, 626B, 726B, and 826B does not have to be L-shaped. For example, the extended sections 26B2 and 426B2 of the gate pull-out sections 26B, 126B, 226B, 426B, 526B, 626B, 726B, and 826B may extend along diagonal directions with respect to the X-axis and Y-axis directions. Furthermore, for example, the gate extraction portions 26B, 126B, 226B, 426B, 526B, 626B, 726B, and 826B may extend along diagonal directions with respect to the X-axis and Y-axis directions from a position adjacent to the upper electrodes 17B, 117B, 217B, and 317B to the extraction-side connection portions 26D, 126D, 226D, 326D, 526D, 726D, and 826D.

[0121] (2) The direction in which each gate pull-out section 26B, 126B, 226B, 426B, 526B, 626B, 726B, 826B bends is also the opposite of the direction shown in each plan view. Specifically, the extended sections 26B2, 426B2 of the first gate pull-out sections 26Bα, 126Bα, 226Bα, 426Bα, 526Bα are bent and then extend downward in each plan view, the extended sections 26B2, 426B2 of the second gate pull-out sections 26Bβ, 126Bβ, 226Bβ, 426Bβ, 526Bβ are bent and then extend upward in each plan view, and the third gate pull-out sections 26Bγ, 126Bγ, 226Bγ, 42 The extended portions 26B2 and 426B2 of 6Bγ and 526Bγ may be bent and then extend downward in each plan view, the extended portions 26B2 and 426B2 of the fourth gate pull-out portions 26Bδ, 126Bδ, 426Bδ, and 526Bδ may be bent and then extend upward in each plan view, and the extended portions 26B2 and 426B2 of the fifth gate pull-out portions 26Bε, 126Bε, 426Bε, and 526Bε may be bent and then extend downward in each plan view.

[0122] (3) When the above (2) is applied to the configuration described in Embodiment 5, for example, the first bent portion 34α may extend downward in Figure 10, the second bent portion 34β may extend upward in Figure 10, the third bent portion 34γ may extend downward in Figure 10, the fourth bent portion 34δ may extend upward in Figure 10, and the fifth bent portion 34ε may extend downward in Figure 10.

[0123] (4) The positions in the Y-axis direction of the gate lead-out sections 26B, 126B, 226B, 426B, 526B, 626B, 726B, and 826B in the portion connected to the upper electrodes 17B, 117B, 217B, and 317B can be changed as appropriate, in addition to those shown in the figure.

[0124] (5) The positions in the Y-axis direction of the main body side connection parts 26C, 126C, 226C, 326C, 426C, 526C, 626C, 726C, 826C and the drawer side connection parts 26D, 126D, 226D, 326D, 526D, 726D, 826D can be changed as appropriate, in addition to those shown. Also, the positions in the X-axis direction of the main body side connection parts 26C, 126C, 226C, 326C, 426C, 526C, 626C, 726C, 826C and the drawer side connection parts 26D, 126D, 226D, 326D, 526D, 726D, 826D can be changed as appropriate, in addition to those shown.

[0125] (6) The multiple gate wirings 26, 126, 226, 326, 426, 526 may include three different types, where the position in the Y-axis direction of the gate lead-out sections 26B, 126B, 226B, 426B, 526B, 626B, 726B, 826B connects to the upper electrodes 17B, 117B, 217B, 317B, and the position in the Y-axis direction of the main body side connection sections 26C, 126C, 226C, 326C, 426C, 526C, 626C, 726C, 826C and the lead-out side connection sections 26D, 126D, 226D, 326D, 526D, 726D, 826D are different.

[0126] (7) In the configuration described in Embodiment 4, the arrangement of the protrusions 33 in the Y-axis direction can be changed as appropriate in addition to the arrangement shown.

[0127] (8) In the configurations described in Embodiments 6 and 7, the line width in the frame-shaped portion 36A of the common trunk wiring 36, 636 can be changed as appropriate in addition to the figures shown. Furthermore, the positional relationship in the X-axis direction of the shift register circuits 16, 516, the main body side connection portions 26C, 126C, 226C, 326C, 426C, 526C, 626C, 726C, 826C and the lead-out side connection portions 26D, 126D, 226D, 326D, 526D, 726D, 826D with respect to the frame-shaped portion 36A of the common trunk wiring 36, 636 can be changed as appropriate in addition to the figures shown.

[0128] (9) In the configuration described in Embodiment 7, the arrangement of the widening portion 38 in the Y-axis direction can be changed as appropriate in addition to the arrangement shown.

[0129] (10) The circuit elements constituting the unit circuit section 16U may include TFTs in addition to the capacitor 17, and the electrodes constituting the TFTs may be "conductive parts" that intersect with the gate lead-out sections 26B, 126B, 226B, 426B, 526B, 626B, 726B, and 826B.

[0130] (11) The pixel electrode 25 may be made of a first transparent electrode film, and the common electrode 28 may be made of a second transparent electrode film. In this case, it is preferable to form a slit in the common electrode 28 for orientation control.

[0131] (12) The driver 12 may be mounted on the flexible circuit board 13 using COF (Chip On Film).

[0132] (13) The planar shape of the liquid crystal panel 11,511 may be a vertically elongated rectangle, square, circle, semicircle, vertically elongated oval, ellipse, trapezoid, etc.

[0133] (14) The semiconductor film material provided on the array substrate 21 may be a polycrystalline polysilicon material or the like.

[0134] (15) The display mode of the LCD panel 11,511 may be other than FFS mode, such as TN (Twisted Nematic) mode, VA (Vertical Alignment) mode, or IPS (In Plane Switching) mode.

[0135] (16) The display device may be other than the liquid crystal panel 11,511 (such as an organic EL (Electro Luminescence) display panel) or an EPD (microcapsule electrophoretic display panel).

[0136] (17) The configurations described in each embodiment can be combined as appropriate.

[0137] (17) In the configurations described in embodiments 8 and 9, the main body side connection parts 726C, 826C and the drawer side connection parts 726D, 826D may be arranged so as not to overlap each other.

[0138] (18) In the configurations described in embodiments 8 and 9, the connecting electrodes 39 and 839 may be made up of a part of the second transparent electrode film. [Explanation of Symbols]

[0139] 11,511…Liquid crystal panel (display device), 16,516…Shift register circuit, 16Uα,516Uα…First unit circuit section, 16Uβ,516Uβ…Second unit circuit section, 17Aα,317Aα,417Aα…First lower electrode (first conductive part), 17Aβ,317Aβ,417Aβ…Second lower electrode (second conductive part), 17Aγ,317Aγ,417Aγ…Third lower electrode (third conductive part), 17Bα,117Bα,217Bα,417Bα…First upper electrode (fourth conductive part), 17Bβ,117Bβ,217Bβ,417Bβ…Second upper electrode (fifth conductive part) ,17Bγ,117Bγ,217Bγ,417Bγ...Third upper electrode (sixth conductive part), 20...Opposite substrate, 21...Array substrate (wiring substrate), 26α,126α,226α,426α...First gate wiring (first wiring), 26β,126β,226β,426β...Second gate wiring (second wiring), 26γ,126γ,226γ,426γ...Third gate wiring (third wiring), 26Aα,126Aα,326Aα,426Aα,526Aα,626Aα...First gate body part (first wiring configuration part), 26Aβ,126Aβ,326Aβ,426Aβ,526Aβ ,626Aβ…Second gate body (third wiring configuration), 26Aγ,126Aγ,326Aγ,426Aγ,526Aγ…Third gate body (fifth wiring configuration), 26Bα,126Bα,226Bα,426Bα,526Bα…First gate lead-out section (second wiring configuration), 26Bβ,126Bβ,226Bβ,426Bβ,526Bβ…Second gate lead-out section (fourth wiring configuration), 26Bγ,126Bγ,226Bγ,426Bγ,526Bγ…Third gate lead-out section (sixth wiring configuration), 26Cα,126Cα,226Cα,326Cα ,426Cα,526Cα,626Cα…First main body side connection part (first end), 26Cβ,126Cβ,226Cβ,326Cβ,426Cβ,526Cβ,626Cβ…Second main body side connection part (third end), 26Cγ,126Cγ,226Cγ,326Cγ,426Cγ,526Cγ,626Cγ…Third main body side connection part (fifth end), 26Dα,226Dα…First drawer side connection part (second end), 26Dβ,226Dβ…Second drawer side connection part (fourth end), 26Dγ,226Dγ…Third drawer side connection part (sixth end), 29,529,729,829...Gate insulating film (first insulating film), 33α...First protrusion, 33β...Second protrusion, 34α...First bend, 34β...Second bend, 34γ...Third bend, 35α...First extension, 35β...Second extension, 35γ...Third extension, 36,636...Common main wiring (fourth wiring), 37α...First conductive part, 37β...Second conductive part, 37γ...Third conductive part, 38...Wide-out part, CP1,CP101,CP201,CP301,CP501,C P601...1st crossing point, CP2, CP102, CP202, CP302, CP502, CP602...2nd crossing point, CP3, CP103, CP203, CP303, CP503, CP603...3rd crossing point, D1, D101, D201...1st distance, D2, D102, D202...2nd distance, D3, D103, D203...3rd distance, D4, D104, D204...4th distance, D5...5th distance, D6...6th distance

Claims

1. First wiring and, A first conductive portion that intersects with a part of the first wiring, A second wiring is arranged with a gap between it and the first wiring in a first direction, It comprises a second conductive portion that intersects with a part of the second wiring, The first wiring comprises a first wiring component consisting of a part of the first conductive film, and a second wiring component consisting of a part of the second conductive film with a first insulating film interposed between it and the first conductive film. The first wiring component has a first end, The second wiring component has a second end connected to the first end, The first conductive portion consists of a part of the first conductive film, The first conductive portion is arranged to intersect with the second wiring component of the first wiring at a first intersection point. The second wiring comprises a third wiring component made of a part of the first conductive film and a fourth wiring component made of a part of the second conductive film. In the third wiring configuration, the third end is positioned at a first distance from the first end in the first direction. The fourth wiring component has a fourth end connected to the third end, The second conductive portion consists of a part of the first conductive film, The second conductive portion is arranged to intersect with the fourth wiring component of the second wiring at a second intersection point. In the fourth wiring configuration, the second intersection point is located at a position a second distance from the first intersection point in the first direction, and the second distance is different from the first distance, in a wiring board.

2. A third wiring is arranged with a gap between it and the second wiring so as to move away from the first wiring in the first direction, It comprises a third conductive portion that intersects with a part of the third wiring, The third wiring comprises a fifth wiring component made of a part of the first conductive film and a sixth wiring component made of a part of the second conductive film. In the fifth wiring configuration, the fifth end is positioned at a third distance from the third end in the first direction. The sixth wiring component has a sixth end connected to the fifth end, The third conductive portion consists of a part of the first conductive film, The third conductive portion is arranged to intersect with the sixth wiring component of the third wiring at a third intersection point. The wiring board according to claim 1, wherein in the sixth wiring configuration, the third intersection point is located at a position a fourth distance away from the second intersection point in the first direction, and the fourth distance is different from the third distance.

3. The wiring board according to claim 2, wherein the first wiring, the second wiring, and the third wiring are arranged such that the distance between the first and third wirings are different, but the distance between the second and fourth wirings are equal.

4. A fourth conductive portion, which is made of a part of the second conductive film and is connected to the second wiring component, A fifth conductive portion, which is made of a part of the second conductive film, is connected to the fourth wiring component and is spaced apart from the fourth conductive portion in the first direction, The present invention comprises a sixth conductive portion which is made of a part of the second conductive film, is connected to the sixth wiring component, and is spaced apart from the fifth conductive portion so as to move away from the fourth conductive portion in the first direction, The first wiring is arranged such that its first and second ends are unevenly distributed, away from the fifth conductive portion in the first direction of the fourth conductive portion. The second wiring is arranged such that the third and fourth ends are unevenly distributed, away from the fourth conductive portion in the first direction of the fifth conductive portion. The wiring board according to claim 3, wherein the third wiring is arranged such that the fifth end and the sixth end are biased towards the fifth conductive portion in the first direction of the sixth conductive portion.

5. The wiring board according to claim 2, wherein the first wiring, the second wiring, and the third wiring are arranged such that the first distance and the third distance are different, and the second distance and the fourth distance are different.

6. A fourth conductive portion, which is made of a part of the second conductive film and is connected to the second wiring component, A fifth conductive portion, which is made of a part of the second conductive film, is connected to the fourth wiring component and is spaced apart from the fourth conductive portion in the first direction, The present invention comprises a sixth conductive portion which is made of a part of the second conductive film, is connected to the sixth wiring component, and is spaced apart from the fifth conductive portion so as to move away from the fourth conductive portion in the first direction, The first wiring is arranged such that its first and second ends are offset from the fifth conductive portion in the first direction of the fourth conductive portion, and its first intersection point is offset from the fifth conductive portion in the first direction of the fourth conductive portion. The second wiring is arranged such that the third and fourth ends are offset from the fourth conductive portion in the first direction of the fifth conductive portion, and the second intersection position is offset from the fourth conductive portion in the first direction of the fifth conductive portion. The wiring board according to claim 5, wherein the third wiring is arranged such that the fifth end and the sixth end are biased towards the fifth conductive portion in the first direction of the sixth conductive portion, and the third intersection position is biased away from the fifth conductive portion in the first direction of the sixth conductive portion.

7. The first wiring component includes a first bent portion that extends from the first end toward the first conductive portion toward the first conductive portion toward the second direction intersecting the first direction and then bent toward the first direction, and a first extended portion that extends from the end of the first bent portion toward the first end toward the second direction, The third wiring component has a second bent portion that extends from the third end in the second direction away from the second conductive portion and then bends to extend in the first direction, and a second extended portion that extends from the end of the second bent portion in the second direction away from the third end, The fifth wiring component has a third bent portion that extends from the fifth end toward the third conductive portion in the second direction and then bent toward the first direction, and a third extended portion that extends from the end of the third bent portion toward the fifth end in the second direction, The wiring board according to claim 5, wherein the first wiring component, the third wiring component, and the fifth wiring component are arranged such that the fifth distance between the first extension and the second extension in the first direction is equal to the sixth distance between the second extension and the third extension in the first direction.

8. The wiring board according to claim 2, wherein the first wiring, the second wiring, and the third wiring are arranged such that the second distance and the fourth distance are different, but the first distance and the third distance are equal.

9. A fourth conductive portion, which is made of a part of the second conductive film and is connected to the second wiring component, A fifth conductive portion, which is made of a part of the second conductive film, is connected to the fourth wiring component and is spaced apart from the fourth conductive portion in the first direction, The present invention comprises a sixth conductive portion which is made of a part of the second conductive film, is connected to the sixth wiring component, and is spaced apart from the fifth conductive portion so as to move away from the fourth conductive portion in the first direction, The first wiring is arranged such that the first crossing position is biased towards the fifth conductive portion in the first direction of the fourth conductive portion. The second wiring is arranged such that the second crossing position is biased towards the fourth conductive portion in the first direction of the fifth conductive portion. The wiring board according to claim 8, wherein the third wiring is arranged such that the third intersection position is off-center from the fifth conductive portion in the first direction of the sixth conductive portion.

10. The shift register circuit comprises a first unit circuit section connected to the second wiring configuration section and a second unit circuit section connected to the fourth wiring configuration section, The first unit circuit section includes the first conductive section, and the second unit circuit section includes the second conductive section. The wiring board according to any one of claims 1 to 9, wherein the first conductive portion and the second conductive portion are arranged side by side with an interval between them in the first direction.

11. The first conductive portion is provided with a first projection that protrudes locally toward the first end in a second direction intersecting the first direction, and the distance from the first projection to the first end is shorter than the distance from the first intersection point to the first end. The wiring board according to claim 10, wherein the second conductive portion is provided with a second projection that protrudes locally toward the third end in the second direction, and the distance from the second projection to the third end is shorter than the distance from the second intersection point to the third end.

12. A shift register circuit having a first unit circuit connected to the second wiring configuration and a second unit circuit connected to the fourth wiring configuration, The device comprises a fourth wiring that extends along the first direction between the shift register circuit and the first and third ends in a second direction intersecting the first direction, The fourth wiring consists of a part of the first conductive film, The first conductive portion consists of the portion that intersects with the second wiring component in the fourth wiring, The wiring board according to any one of claims 1 to 9, wherein the second conductive portion is the portion that intersects with the fourth wiring component in the fourth wiring.

13. The fourth wiring is provided with widened portions that protrude locally toward the first and third ends in the second direction. The wiring board according to claim 12, wherein the position of the widened portion protruding toward the first end is closer to the first end than the first intersection point, and the position of the widened portion protruding toward the third end is closer to the third end than the second intersection point.

14. A wiring board according to any one of claims 1 to 9, A display device comprising: an opposing substrate arranged opposite to the wiring substrate with a space between them;

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