Method for manufacturing a jig set and connector

Abstract

This tool set provides a reliable reflow solder joint for electronic components to be connected to a target area, while preventing unintended melting of the solder-plated area. [Solution] A jig set according to one aspect of the present disclosure is a jig set for holding a printed circuit board when reflow soldering an electronic component to a connection portion formed on the printed circuit board having one or more solder-plated portions, comprising: a first jig disposed on a first surface of the printed circuit board on which the connection portion is formed; and a second jig supporting a second surface of the printed circuit board opposite to the first surface, wherein at least one of the first jig and the second jig has a heat conduction reduction structure in the portion that overlaps with the solder-plated portion in a plan view to reduce heat conduction to the solder-plated portion.

Description

Technical Field

[0001] The present disclosure relates to a jig set and a method for manufacturing a connector.

Background Art

[0002] A method is known in which an electronic component is reflow soldered to a connection portion of a printed wiring board while the printed wiring board is sandwiched between a pair of jigs (see Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

[0004] A jig set according to one aspect of the present disclosure is a jig set for holding a printed wiring board when an electronic component is reflow soldered to a connection portion formed on the printed wiring board having one or more solder plating portions, the jig set including a first jig disposed on a first surface of the printed wiring board where the connection portion is formed, and a second jig that supports a second surface of the printed wiring board facing the first surface, and at least one of the first jig and the second jig has a heat conduction reduction structure that reduces heat conduction to the solder plating portion in a portion overlapping the solder plating portion in a plan view.

Brief Description of the Drawings

[0005] [Figure 1] FIG. 1 is a schematic cross-sectional view showing a state in which a jig set according to an embodiment of the present disclosure is disposed on a printed wiring board together with an electronic component. [Figure 2] FIG. 2 is a schematic plan view showing the state of FIG. 1. [Figure 3] FIG. 3 is a schematic bottom view showing the state of FIG. 1. [Figure 4]Figure 4 is a flowchart showing a method for manufacturing a connector according to one embodiment of the present disclosure. [Figure 5] Figure 5 is a schematic cross-sectional view showing a jig set according to another embodiment of the present disclosure arranged on a printed circuit board together with electronic components. [Modes for carrying out the invention]

[0006] [Issues this disclosure aims to address] During reflow soldering, the printed circuit board is placed under high-temperature hot air to melt the solder. Patent Document 1 describes that the jig body and cover that hold the printed circuit board should be made of carbon, which has excellent thermal conductivity and emissivity. In other words, Patent Document 1 describes forming the jig from a material with high thermal conductivity and emissivity in order to improve the heating efficiency of the solder.

[0007] Some printed circuit boards have one or more solder-plated areas that are not used for component mounting during reflow heating. When using the jig described in Patent Document 1 to reflow solder electronic components to the connection points of such printed circuit boards, the one or more solder-plated areas may deteriorate due to melting, discoloration, etc. As a result, problems such as variations in gloss may occur. On the other hand, if the reflow heating temperature is lowered to prevent the above deterioration, it may become difficult to adequately solder the connection points and the electronic components.

[0008] This disclosure is made based on the above circumstances and aims to provide a jig set that can reliably reflow solder joint electronic components to the connection points while preventing unintended melting of the solder-plated portion.

[0009] [Effects of this disclosure] A jig set according to one aspect of this disclosure can reliably reflow solder joints electronic components to the connection portion while preventing unintended melting of the solder-plated portion.

[0010] [Description of Embodiments in this Disclosure] First, the embodiments of this disclosure will be listed and described.

[0011] (1) A jig set according to one aspect of the present disclosure is a jig set for holding a printed circuit board having one or more solder-plated portions when reflow soldering an electronic component to a portion to be connected formed on the printed circuit board, comprising a first jig disposed on a first surface of the printed circuit board on which the portion to be connected is formed, and a second jig supporting a second surface of the printed circuit board opposite to the first surface, wherein at least one of the first jig and the second jig has a heat conduction reduction structure in the portion that overlaps with the solder-plated portion in a plan view to reduce heat conduction to the solder-plated portion.

[0012] The jig set is such that at least one of the first jig and the second jig has a heat conduction reduction structure in the portion that overlaps with the solder-plated portion in a plan view, thereby reducing heat conduction to the solder-plated portion. This prevents the solder-plated portion, which is not used for component mounting during reflow soldering, from unintentionally melting due to reflow heating. Therefore, the jig set can reliably reflow solder-bond electronic components to the connection points while preventing the solder-plated portion from unintentionally melting.

[0013] (2) In (1) above, the heat conduction reduction structure may be a recess provided on the surface on which the printed circuit board is placed. According to this embodiment, it is possible to easily and reliably prevent the solder plated portion from unintentionally melting due to reflow heating.

[0014] (3) In (1) or (2) above, the first jig and the second jig may each have the heat conduction reduction structure. According to this embodiment, the heat conduction reduction structure can be easily provided in accordance with the position of the solder plated portion, so that the solder plated portion can be prevented from unintentionally melting due to reflow heating more easily and reliably.

[0015] (4) In any of (1) to (3) above, the heat conduction reducing structures formed on the first jig and the second jig may face each other. According to this embodiment, the solder-plated portion can be sandwiched between the heat conduction reducing structure formed on the first jig and the heat conduction reducing structure formed on the second jig. As a result, it is possible to more easily and reliably prevent the solder-plated portion from unintentionally melting due to reflow heating.

[0016] (5) In any of (1) to (4) above, the first jig may include resin and glass cloth impregnated with the resin. According to this embodiment, the heat insulation properties of the first jig can be easily improved. As a result, the solder-plated portion can be prevented from unintentionally melting due to reflow heating more easily and reliably.

[0017] (6) In any of (1) to (5) above, the second jig may be mainly composed of metal. According to this embodiment, the heating efficiency of the solder used to join the connected part and the electronic component can be improved while preventing the solder plating part from heating up due to the heat conduction reduction structure.

[0018] (7) In any of (1) to (6) above, the first jig may be partially placed on the printed circuit board so as to cover the one or more solder-plated portions, and the second jig may support the entire surface of the printed circuit board. This embodiment makes it easier to improve both the heat insulation efficiency of the solder-plated portions and the heating efficiency of the solder that joins the connected portions and the electronic components.

[0019] (8) In any of (1) to (7) above, a cover jig may be further provided which is positioned around the portion to be connected on the first surface. According to this embodiment, the orientation of the printed circuit board during reflow soldering can be easily stabilized by sandwiching the printed circuit board between the second jig and the cover jig. As a result, the electronic component can be more easily reflow soldered to the portion to be connected.

[0020] (9) In (8) above, the second jig may have a through-hole between the connection portion and the cover jig. According to this aspect, the temperature rising efficiency of the solder for joining the connection portion and the electronic component can be easily improved.

[0021] (10) A method for manufacturing a connector according to an aspect of the present disclosure is a method for manufacturing a connector using the jig set according to any one of (1) to (9) above, including a step of holding the printed wiring board with the first jig and the second jig, a step of arranging the electronic component on the connection portion, and a step of performing reflow soldering to join the electronic component to the connection portion in a state where the printed wiring board is held by the holding step and the electronic component is arranged on the connection portion by the arranging step.

[0022] Since the method for manufacturing the connector performs reflow soldering to join the electronic component to the connection portion using the jig set, deterioration of the solder plating portion can be prevented, and a connector in which the electronic component is reliably joined to the connection portion by reflow soldering can be manufactured.

[0023] In the present disclosure, "plan view" means a view in the thickness direction of the printed wiring board. "Main component" means the component with the largest content in terms of mass conversion, for example, a component with a content of 50% by mass or more. In the present disclosure, when simply referred to as "metal", it is a concept including alloys.

[0024] [Details of Embodiments of the Present Disclosure] Preferred embodiments of this disclosure will be described below with reference to the drawings. Note that, regarding the numerical values ​​described herein, it is possible to adopt only one of the upper and lower limits, or to combine the upper and lower limits as desired. This specification includes all possible numerical ranges that can be combined. Furthermore, the figures are schematic and may not correspond to actual shapes, dimensions, proportions, etc. Also, in this disclosure, descriptions such as "First," "Second," etc., are for distinguishing the components to which they are attached and do not limit the number, order, priority, etc.

[0025] [First Embodiment] <Jig Set> The jig set 1 shown in Figures 1 to 3 holds the printed circuit board 100 when reflow soldering an electronic component 200 to a connection portion 110 formed on the printed circuit board 100 having one or more solder-plated portions 101. The jig set 1 comprises a first jig 10 positioned on the first surface 100a of the printed circuit board 100 where the connection portion 110 is formed, and a second jig 20 supporting the second surface 100b of the printed circuit board 100 that faces the first surface 100a. At least one of the first jig 10 and the second jig 20 of the jig set 1 has a heat conduction reduction structure 11, 21 in the portion that overlaps with the solder-plated portion 101 in a plan view, which reduces heat conduction to the solder-plated portion 101.

[0026] The jig set 1 has heat conduction reduction structures 11 and 21 in the portion of the first jig 10 and the second jig 20 that overlaps with the solder-plated portion 101 in a plan view, thereby reducing heat conduction to the solder-plated portion 101. This prevents the solder-plated portion 101, which is not used for component mounting during reflow soldering, from unintentionally melting due to reflow heating. Therefore, the jig set 1 can reliably reflow solder-bond electronic components 200 to the connection portion 110 while preventing the solder-plated portion 101 from unintentionally melting.

[0027] Furthermore, the jig set 1 shown in Figures 1 to 3 further includes a cover jig 30 positioned around the connection portion 110 on the first surface 100a of the printed circuit board 100. By including the cover jig 30, the jig set 1 allows the printed circuit board 100 to be sandwiched between the second jig 20 and the cover jig 30, making it easy to stabilize the orientation of the printed circuit board 100 during reflow soldering. As a result, the electronic component 200 can be more easily reflow soldered to the connection portion 110.

[0028] [Printed wiring board] The jig set 1 can be used with a known printed circuit board 100. Figures 1 and 2 illustrate the state before reflow soldering, with an electronic component 200 placed on the connection portion 110 of the printed circuit board 100. As shown in Figures 1 and 2, in this embodiment, the printed circuit board 100 has an insulating substrate 120, one or more connection portions 110 placed on the substrate 120, and one or more pad portions 130 placed on the substrate 120. The connection portion 110 is the part that is reflow soldered to the electronic component 200, and a solder portion 111 is placed on its surface. The pad portion 130 has a conductive main body portion 102 placed on the substrate 120 and a solder plating portion 101 placed on the main body portion 102. In this disclosure, the term "on" includes both direct and indirect connections. For example, the term "on a substrate" includes both cases where a component is placed directly on the substrate and cases where it is placed indirectly on the substrate with other layers in between.

[0029] The printed circuit board 100 may be a rigid printed circuit board, a flexible printed circuit board, or a flex-rigid printed circuit board. If the substrate 120 is flexible, the main components of the substrate 120 may include, for example, polyimide, polyethylene terephthalate, liquid crystal polymer, and fluororesin. If the substrate 120 is not flexible, the main components of the substrate 120 may include, for example, glass epoxy, paper phenol, paper epoxy, glass composite, and glass.

[0030] The connected portion 110 is conductive. The connected portion 110 may be, for example, part of a conductive pattern arranged on a substrate 120. This conductive pattern may include one or more wirings (not shown). The connected portion 110 is mainly composed of, for example, copper. The connected portion 110 may have, for example, an electroplated layer. More specifically, for example, the connected portion 110 may have a two-layer structure consisting of a conductive underlayer formed by sputtering or the like and an electroplated layer, or it may have a three-layer structure consisting of a conductive underlayer, an electroless plating layer and an electroplated layer. The components of the conductive underlayer, the electroless plating layer and the electroplated layer may be the same or different.

[0031] As described above, a solder portion 111 is placed on the portion to be connected 110. The solder portion 111 is formed, for example, by solder paste. The solder portion 111 may also be printed on the portion to be connected 110. Known methods can be used to print the solder portion 111, for example, screen printing. The solder portion 111 includes solder particles and flux. During reflow soldering, the solder particles in the solder portion 111 melt and solidify, joining the portion to be connected 110 and the electronic component 200.

[0032] The pad portion 130 is positioned at a distance from the connected portion 110 in a plan view. The pad portion 130 may be arranged on only one side of the substrate 120, or on both sides of the substrate 120. In Figures 1 and 2, the pad portions 130 are arranged on both sides of the substrate 120. The arrangement of the pad portions 130 on the substrate 120 is not particularly limited and can be set according to the required application. In Figures 1 and 2, the pad portions 130 are arranged at opposing positions on either side of the substrate 120.

[0033] As described above, the pad portion 130 has a conductive main body portion 102 placed on the substrate 120 and a solder-plated portion 101 placed on the main body portion 102. The main body portion 102 may be part of the conductive pattern. The main body portion 102 is mainly composed of copper, for example. The specific layer structure of the main body portion 102 may be the same as that of the connected portion 110.

[0034] The solder-plated portion 101 can be formed, for example, by immersing the surface of the main body portion 102 in a solder bath. The type of solder included in the solder-plated portion 101 is not particularly limited and may be lead-free solder such as SnAgCu alloy, SnZnBi alloy, or SnAgInBi alloy.

[0035] When reflow soldering the connected portion 110 and the electronic component 200, no other electronic components are mounted on the solder-plated portion 101. The solder-plated portion 101 is used, for example, for electrical testing, insertion into connectors, electrical connection with a circuit board, and electrical or thermal contact with a housing.

[0036] [Electronic components] The electronic component 200 has a terminal portion (not shown) that is soldered to the connected portion 110. The type of electronic component 200 is not particularly limited, and various types can be used depending on the application.

[0037] [First jig] The first jig 10 is placed on the first surface 100a of a printed circuit board 100, which is horizontally arranged such that the first surface 100a is the top surface and the second surface 100b is the bottom surface. The first jig 10 is an insulating member that insulates the solder-plated portion 101 from hot air during reflow soldering.

[0038] The first jig 10 is positioned to surround the solder-plated portion 101. The first jig 10 seals the area around the solder-plated portion 101 to insulate it from the hot air during reflow soldering. The first jig 10 may be placed for each solder-plated portion 101, for example. Alternatively, one first jig 10 may be placed for multiple solder-plated portions 101.

[0039] The first jig 10 is partially positioned on the printed circuit board 100 so as to cover one or more solder-plated portions 101. For example, as shown in Figure 2, the first jig 10 is positioned on the solder-plated portions 101 in a plan view, but does not have to be positioned on the portion to be connected 110. In other words, the first jig 10 may be positioned so as not to provide any heat insulation effect with respect to the portion to be connected 110.

[0040] The first jig 10 may be placed directly on the substrate 120, or it may be placed on the substrate 120 with the cover jig 30 in between. Placing the first jig 10 directly on the substrate 120 may provide a more significant heat insulation effect on the solder-plated portion 101.

[0041] The material of the first jig 10 can be one that has heat resistance to the reflow heating temperature and appropriate heat insulation properties. The material may include, for example, a resin and a glass cloth impregnated with the resin. According to this embodiment, the heat insulation properties of the first jig 10 can be easily improved. As a result, it is possible to more easily and reliably prevent the solder-plated portion 101 from unintentionally melting due to reflow heating.

[0042] Examples of the above-mentioned resins include epoxy resins, phenolic resins, polyimides, and fluororesins. Examples of the above-mentioned glass cloths include glass woven fabrics and glass nonwoven fabrics. The first jig 10 may include, for example, a glass cloth epoxy resin substrate in which a glass nonwoven fabric is impregnated with epoxy resin, or it may include a glass cloth epoxy resin laminate.

[0043] The first jig 10 has a heat conduction reduction structure 11 in the portion that overlaps with the solder-plated portion 101 in a plan view. The heat conduction reduction structure 11 encompasses the solder-plated portion 101 in a plan view.

[0044] The heat conduction reduction structure 11 only needs to overlap with the solder-plated portion 101 in a plan view, and may, for example, overlap with the solder-plated portion 101 located on the opposite side of the substrate 120 (i.e., the second surface 100b of the printed wiring board 100). However, from the viewpoint of improving the heat insulation effect on the solder-plated portion 101, it may also overlap with the solder-plated portion 101 located on the front side of the substrate 120 (i.e., the first surface 100a of the printed wiring board 100).

[0045] The heat conduction reduction structure 11 may be formed such that a material with low thermal conductivity is applied to the portion that comes into contact with the solder-plated portion 101. For example, as shown in Figures 1 and 2, the heat conduction reduction structure 11 may be a recess 11a provided on the surface on which it is placed on the printed circuit board 100. In this case, air is applied to the portion that comes into contact with the solder-plated portion 101 as a material with low thermal conductivity. By making the heat conduction reduction structure 11 a recess 11a, it is possible to easily and reliably prevent the solder-plated portion 101 from unintentionally melting due to reflow heating.

[0046] The recess 11a is provided so as to surround the solder-plated portion 101. More specifically, the recess 11a is defined by a circumferential surface that extends in the thickness direction of the printed circuit board 100 at a distance from the solder-plated portion 101, and a top surface connected to the leading edge of the circumferential surface. The internal space and external space of the recess 11a may be separated by the glass cloth epoxy resin substrate or glass cloth epoxy resin laminate described above.

[0047] Since the first jig 10 has a recess 11a as a heat conduction reduction structure 11, the solder-plated portion 101 is insulated by air. In other words, the solder-plated portion 101 is insulated from the hot air during reflow in two stages: by the first jig 10 and by the air. As a result, the heat insulation effect on the solder-plated portion 101 is more pronounced.

[0048] The lower limit of the temperature difference between the inside and outside of the recess 11a under reflow heating temperature may be 10°C or 15°C. A temperature difference greater than or equal to the lower limit makes it easy to prevent unintended melting of the solder-plated portion 101. On the other hand, the upper limit of the temperature difference is not particularly limited, but from the viewpoint of ease of manufacturing the first jig 10, it may be, for example, 40°C or 30°C.

[0049] The lower limit of the average depth D1 of the recess 11a may be 1.5 mm, 2.0 mm, 3.0 mm, or 4.0 mm, from the viewpoint of obtaining sufficient heat insulation effect from air. On the other hand, the upper limit of the average depth D1 may be 10.0 mm or 7.0 mm, from the viewpoint of preventing the first jig 10 from becoming too large. Note that "average depth" means the average value of the depths of any 10 points.

[0050] The first jig 10 may include a magnet (not shown) so as to attract the second jig 20, which will be described later, by magnetic force. According to this embodiment, the first jig 10 can be easily fixed onto the printed circuit board 100. The first jig 10 may also have a positioning part (not shown) for positioning relative to the second jig 20. An example of such a positioning part is a pin hole through which a guide pin can be inserted while positioned relative to the pin hole of the second jig 20.

[0051] [Second jig] The second jig 20 supports the second surface 100b of the printed circuit board 100, which is horizontally positioned such that the first surface 100a becomes the upper surface and the second surface 100b becomes the lower surface. The second jig 20 may also be a conveying jig positioned on a conveying member such as a belt conveyor that is transported into a reflow oven.

[0052] As shown in Figures 1 and 3, the second jig 20 may be provided to support the entire surface of the printed circuit board 100. In this embodiment, the first jig 10 and the cover jig 30 described later can be easily aligned with respect to the second jig 20. Note that "supporting the entire surface of the printed circuit board" means that, in a plan view, the second jig is positioned to encompass the printed circuit board.

[0053] Furthermore, by partially positioning the first jig 10 on the printed circuit board 100 so as to cover one or more solder-plated portions 101, and by supporting the entire surface of the printed circuit board 100 with the second jig 20, it is easier to improve both the heat insulation efficiency of the solder-plated portions 101 and the heating efficiency of the solder portions 111 that join the connected portions 110 and the electronic components 200.

[0054] The main component of the second jig 20 may be, for example, a metal. Examples of such metals include aluminum and magnesium. By using a metal as the main component of the second jig 20, the heat conduction reduction structure 21 prevents the solder plating portion 101 from overheating, while increasing the thermal conductivity of the second jig 20 itself, thereby improving the heating efficiency of the solder portion 111 that joins the connected portion 110 and the electronic component 200. Furthermore, by using a metal as the main component of the second jig 20, its durability can be increased.

[0055] The second jig 20 has a heat conduction reduction structure 21 in the portion that overlaps with the solder-plated portion 101 in a plan view. The heat conduction reduction structure 21 encompasses the solder-plated portion 101 in a plan view.

[0056] The heat conduction reduction structure 21 only needs to overlap with the solder-plated portion 101 in a plan view, and may, for example, overlap with the solder-plated portion 101 located on the opposite side of the substrate 120 (i.e., the first surface 100a of the printed wiring board 100). However, from the viewpoint of improving the heat insulation effect on the solder-plated portion 101, it may also overlap with the solder-plated portion 101 located on the front side of the substrate 120 (i.e., the second surface 100b of the printed wiring board 100).

[0057] As shown in Figure 1, the heat conduction reduction structure 21 may be a recess 21a provided on the surface on which it is placed on the printed circuit board 100. According to this embodiment, it is possible to easily and reliably prevent the solder-plated portion 101 from unintentionally melting due to reflow heating.

[0058] The recess 21a is provided so as to surround the solder-plated portion 101. More specifically, the recess 21a is defined by a circumferential surface that extends in the thickness direction of the printed circuit board 100 at a distance from the solder-plated portion 101, and a top surface connected to the leading edge of the circumferential surface.

[0059] Since the second jig 20 has a recess 21a as a heat conduction reduction structure 21, the solder-plated portion 101 is insulated by air.

[0060] The lower limit of the average depth D2 of the recess 21a may be 1.0 mm or 1.5 mm, from the viewpoint of obtaining sufficient heat insulation effect from air. On the other hand, the upper limit of the average depth D2 may be 4.0 mm, 3.0 mm or 2.5 mm, from the viewpoint of handling the jig set 1, etc.

[0061] The temperature difference inside and outside the recess 21a under reflow heating temperature can be the same as the temperature difference inside and outside the recess 11a in the first jig 10.

[0062] In this embodiment, the first jig 10 and the second jig 20 each have a heat conduction reduction structure 11 and 21. According to this embodiment, the heat conduction reduction structures 11 and 21 can be easily provided corresponding to the position of the solder-plated portion 101. Therefore, it is possible to more easily and reliably prevent the solder-plated portion 101 from unintentionally melting due to reflow heating.

[0063] As shown in Figure 1, the heat conduction reduction structures 11 and 21 formed on the first jig 10 and the second jig 20 may face each other. In this embodiment, the solder-plated portion 101 can be sandwiched between the heat conduction reduction structure 11 formed on the first jig 10 and the heat conduction reduction structure 21 formed on the second jig 20. As a result, it is possible to more easily and reliably prevent the solder-plated portion 101 from unintentionally melting due to reflow heating. In Figure 1, solder-plated portions 101 are formed on both sides of the substrate 120, and the heat conduction reduction structures 11 and 21 are arranged for these solder-plated portions 101, respectively. However, even if the solder-plated portion 101 is formed on only one side of the substrate 120, by providing a pair of heat conduction reduction structures 11 and 21 so as to sandwich the solder-plated portion 101 from both sides of the printed circuit board 100, it is possible to more easily and reliably prevent the unintentional melting of the solder-plated portion 101.

[0064] As shown in Figures 2 and 3, the second jig 20 has through holes 22 around the printed circuit board 100 in a plan view. The through holes 22 are formed in the portion adjacent to the part to be connected 110. The second jig 20 may have a pair of through holes 22 arranged on either side of the part to be connected 110 in a plan view. By having through holes 22, the second jig 20 can send hot air during reflow to the soldered part 111 through the through holes 22. As a result, the part to be connected 110 and the electronic component 200 can be reflow soldered more easily.

[0065] As shown in Figure 2, the through hole 22 may be formed between the part to be connected 110 and the cover jig 30 described later. The second jig 20 has a through hole 22 between the part to be connected 110 and the cover jig 30, which makes it easy to improve the heating efficiency of the solder joint 111 that joins the part to be connected 110 and the electronic component 200.

[0066] As shown in Figure 1, the second jig 20 may have a thin-walled portion 20a in the part that overlaps with the connected portion 110 in a plan view. The thin-walled portion 20a is a portion that is thinner than the other parts. By having the thin-walled portion 20a, the second jig 20 makes it easier to raise the temperature of the soldered portion 111 through the second jig 20.

[0067] The lower limit of the average thickness of the thin-walled portion 20a may be 0.5 mm or 2.0 mm, from the viewpoint of reliably supporting the printed circuit board 100. On the other hand, the upper limit of the average thickness of the thin-walled portion 20a may be 4.0 mm or 3.0 mm, from the viewpoint of promoting the temperature rise of the solder portion 111.

[0068] The thin-walled portion 20a may be provided so as to be in contact with the through hole 22. This embodiment makes it easier to raise the temperature of the solder portion 111.

[0069] The second jig 20 may include a magnet (not shown) so as to attract the first jig 10 and the cover jig 30 described later by magnetic force. The second jig 20 may also have a positioning part (not shown) for positioning the first jig 10 and the cover jig 30. Examples of such positioning parts include pin holes through which guide pins can be inserted while positioned relative to the pin holes of one or both of the first jig 10 and the cover jig 30.

[0070] [Cover jig] The cover jig 30 is plate-shaped. The cover jig 30 holds the printed circuit board 100 flat by sandwiching it between itself and the second jig 20. The cover jig 30 may be placed over the entire surface of the printed circuit board 100, or it may be placed partially on the printed circuit board 100.

[0071] As shown in Figure 2, the cover jig 30 has an opening 31 for exposing the connected portion 110. In plan view, the through hole 22 of the second jig 20 is located inside the opening 31.

[0072] The cover jig 30 is mainly composed of, for example, metal. A good example of the main component of the cover jig 30 is stainless steel. The cover jig 30 may be arranged to attract the second jig 20 by magnetic force. In this case, examples of the stainless steel include martensitic stainless steel and ferritic stainless steel. By arranging the cover jig 30 to attract the second jig 20 by magnetic force, displacement relative to the second jig 20 can be prevented, thereby facilitating the reflow soldering of the electronic component 200 to the connection portion 110.

[0073] The cover jig 30 may have a positioning part (not shown) for positioning relative to the second jig 20. The positioning part may be, for example, a pin hole through which a guide pin can be inserted while positioned relative to the pin hole of the second jig 20.

[0074] <Manufacturing method for connecting components> Next, with reference to Figure 4, a method for manufacturing a connector using the jig set 1 (hereinafter also simply referred to as "the manufacturing method") will be described. The manufacturing method comprises a step S1 of holding the printed circuit board 100 with the first jig 10 and the second jig 20, a step S2 of placing the electronic components 200 on the connection portion 110, and a step S3 of reflow soldering the electronic components 200 to the connection portion 110 while the printed circuit board 100 is held by the holding step S1 and the electronic components 200 are placed on the connection portion 110 by the placing step S2.

[0075] This manufacturing method uses the jig set 1 to reflow solder the electronic component 200 to the part to be connected 110, thereby preventing deterioration of the solder-plated part 101 and enabling the production of a connected body in which the electronic component 200 is reliably reflow soldered to the part to be connected 110.

[0076] (The holding process) In the holding step S1, the printed circuit board 100 is placed on the second jig 20, and then the first jig 10 and the cover jig 30 are placed on the printed circuit board 100. In the holding step S1, the printed circuit board 100 may be sandwiched between the second jig 20, the first jig 10, and the cover jig 30, and then the first jig 10 and the second jig 20, and the cover jig 30 and the second jig 20 may be positioned. Alternatively, in the holding step S1, the printed circuit board 100 may be positioned relative to the first jig 10 and the second jig 20, and the cover jig 30 and the second jig 20.

[0077] (Placement process) The placement process S2 may be performed before the holding process S1, after the holding process S1, or in parallel with the holding process S1.

[0078] In the placement step S2, with the solder portion 111 already placed on the connection portion 110, the electronic component 200 is placed on the solder portion 111.

[0079] In this manufacturing method, the state shown in Figures 1 to 3 is achieved by performing the holding step S1 and the placement step S2.

[0080] (The process of reflow soldering) In the reflow soldering step S3, the printed circuit board 100 is held by the holding step S1 and the electronic components 200 are placed on the connection parts 110 by the placement step S2. The printed circuit board 100 is then transported to the reflow oven, and the connection parts 110 and the electronic components 200 are reflow soldered together.

[0081] In step S3, which involves reflow soldering, the part to be connected 110 and the electronic component 200 are reflow soldered together, while preventing the melting of one or more solder-plated parts 101.

[0082] [Other embodiments] The embodiments disclosed herein should be considered in all respects to be illustrative and not restrictive. The scope of the present invention is not limited to the configurations of the embodiments described above, but is indicated by the claims, and all modifications within the meaning and scope equivalent to the claims are intended to be included.

[0083] For example, as shown in Figure 5, the jig set 51 may have a heat conduction reduction structure 61 in only one of the first jig 60 and the second jig 70. In the jig set 51 of Figure 5, only the first jig 60 has the heat conduction reduction structure 61. Also, in the jig set 51, the thickness of the second jig 70 is uniformly formed (it does not have the thin-walled portion 20a described above). Even in this embodiment, it is possible to prevent the melting of one or more solder-plated portions 101 during reflow solder joining of the connected portion 110 and the electronic component 200. Furthermore, the jig set 51 does not include the cover jig described above. Even without the cover jig, the jig set 51 can prevent the melting of one or more solder-plated portions 101 during reflow solder joining of the connected portion 110 and the electronic component 200 by including the first jig 60 and the second jig 70. In Figure 5, only the first jig 60 has the heat conduction reduction structure 61, but it is also possible to have only the second jig 70 have the heat conduction reduction structure.

[0084] Other structures besides the aforementioned recesses can also be used for the heat conduction reduction structure. For example, the heat conduction reduction structure may be formed by using a different material than the other parts. Specifically, the heat conduction reduction structure may be formed by using a material with a lower thermal conductivity than the other parts.

[0085] If the first jig and the second jig each have the heat conduction reduction structure, it is also possible to ensure that the heat conduction reduction structure formed on the first jig and the heat conduction reduction structure formed on the second jig do not face each other.

[0086] The specific structures of the first and second jigs described above are not limited to those described in the embodiments above. For example, the first jig may be formed to also serve as the cover jig. Furthermore, the second jig may have a structure that does not have the through-holes described above.

[0087] In this disclosure, the specific structure of the printed circuit board is not particularly limited. For example, in the printed circuit board, the solder-plated portion does not need to be located on the pad portion. With this jig set, regardless of the arrangement or number of solder-plated portions, melting of the solder-plated portion during reflow soldering between the connected portion and the electronic component can be prevented. [Explanation of Symbols]

[0088] 1. 51 Jig Set 10, 60 First jig 11, 21, 61 Heat conduction reduction structure 11a, 21a recess 20, 70 Second Jig 20a Thin-walled section 22 Through hole 30 Cover jig 31 Aperture 100 Printed Wiring Boards 100a, Page 1 100b 2nd side 101 Soldering section 102 Main body 110 Connected part 111 Soldering section 120 circuit boards 130 Pad section 200 Electronic Components Average depth of the D1 and D2 recesses

Claims

1. A jig set for holding a printed circuit board when reflow soldering an electronic component to a connection portion formed on a printed circuit board having one or more solder-plated portions, A first jig is positioned on the first surface of the printed circuit board in which the connection portion is formed, A second jig supporting the second surface of the printed circuit board opposite to the first surface, Equipped with, A jig set in which at least one of the first jig and the second jig has a heat conduction reduction structure in the portion that overlaps with the solder-plated portion in a plan view, thereby reducing heat conduction to the solder-plated portion.

2. The jig set according to claim 1, wherein the heat conduction reduction structure is a recess provided on the surface on which the printed circuit board is placed.

3. The jig set according to claim 1, wherein the first jig and the second jig each have the heat conduction reduction structure.

4. The jig set according to claim 3, wherein the heat conduction reduction structures formed on the first jig and the second jig face each other.

5. The first jig is a jig set according to claim 1, comprising a resin and a glass cloth impregnated with the resin.

6. The above-mentioned second jig is a jig set according to claim 1, wherein the jig set is mainly composed of metal.

7. The first jig described above is partially placed on the printed circuit board so as to cover the one or more solder-plated portions described above. The jig set according to claim 1, wherein the second jig supports the entire surface of the printed circuit board.

8. The jig set according to claim 1, further comprising a cover jig positioned around the connected portion on the first surface described above.

9. The jig set according to claim 8, wherein the second jig has a through hole between the connected portion and the cover jig.

10. A method for manufacturing a connector using the jig set described in any one of claims 1 to 9, The process of holding the printed circuit board with the first jig and the second jig described above, The steps include: placing the electronic component in the connected portion; With the printed circuit board held in place by the holding step and the electronic components placed in the connection area by the placement step, the electronic components are reflow soldered to the connection area. A method for manufacturing a connector comprising the components described.

Images