Temperature sensor
JP2026103910APending Publication Date: 2026-06-25TOYOTA JIDOSHA KK
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- TOYOTA JIDOSHA KK
- Filing Date
- 2024-12-13
- Publication Date
- 2026-06-25
Smart Images

Figure 2026103910000001_ABST
Abstract
To provide a temperature sensor that can achieve both responsiveness and strength. [Solution] The temperature sensor 10 comprises a thermocouple 11, a sheath sleeve 12, a heat insulating bonding material 13, a dummy pin 14, and wiring 15. The heat insulating bonding material 13 connects the thermocouple 11 and the dummy pin 14. The dummy pin 14 is connected to the thermocouple 11 via the heat insulating bonding material 13 at all parts except the tip 112. The tip of the hot junction, where the tips of the two types of metal wires of the thermocouple 11 are in contact, is exposed from the dummy pin 14.
Need to check novelty before this filing date? Find Prior Art