Temperature sensor

JP2026103910APending Publication Date: 2026-06-25TOYOTA JIDOSHA KK

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
TOYOTA JIDOSHA KK
Filing Date
2024-12-13
Publication Date
2026-06-25

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  • Figure 2026103910000001_ABST
    Figure 2026103910000001_ABST
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Abstract

To provide a temperature sensor that can achieve both responsiveness and strength. [Solution] The temperature sensor 10 comprises a thermocouple 11, a sheath sleeve 12, a heat insulating bonding material 13, a dummy pin 14, and wiring 15. The heat insulating bonding material 13 connects the thermocouple 11 and the dummy pin 14. The dummy pin 14 is connected to the thermocouple 11 via the heat insulating bonding material 13 at all parts except the tip 112. The tip of the hot junction, where the tips of the two types of metal wires of the thermocouple 11 are in contact, is exposed from the dummy pin 14.
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