Heat absorption plate

Abstract

The present invention provides a heat absorption plate capable of efficiently absorbing both the heat generated by electronic components that generate relatively large amounts of heat and the heat generated by electronic components that generate relatively small amounts of heat. [Solution] The heat absorption plate A has a plate surface 10a that comes into contact with the first bottom surface 1a of the first electronic component 1, which generates a relatively large amount of heat, and the second bottom surface 2a of the second electronic component 2, which generates a relatively small amount of heat. A flow path P is formed inside through which a heat-absorbing liquid F capable of absorbing the heat generated by the first electronic component 1 and the second electronic component 2 flows. The flow path P has a first flow path section P1 with a relatively large flow path height and flow path cross-sectional area, and a second flow path section P2 with a relatively small flow path height and flow path cross-sectional area. The heat-absorbing liquid F exchanges heat with the first electronic component 1 in the first flow path section P1 and with the second electronic component 2 in the second flow path section P2.

Description

Technical Field

[0001] The present disclosure relates to a heat absorption plate.

Background Art

[0002] Conventionally, a heat absorption plate that absorbs heat generated by electronic components and suppresses the temperature rise of the electronic components is known. The heat absorption plate contacts a heat-generating electronic component on its surface, conducts the generated heat, and absorbs it into a heat absorption liquid that circulates inside. As a technology related to such a heat absorption plate, for example, there is one described in Patent Document 1 cited below.

[0003] Patent Document 1 discloses a heat absorption plate (a water jacket in Patent Document 1) used for a power control unit mounted in a plug-in hybrid vehicle. A flow path through which a heat absorption liquid (cooling water in Patent Document 1) circulates is formed inside the heat absorption plate. The power control unit has a plug-in charger, a smoothing module, a power module, a DCDC converter, and a bus bar module, and these electronic components are arranged so as to contact the partition wall of the heat absorption plate. Heat generated by each electronic component is conducted from the partition wall to the heat absorption liquid, and heat exchange is performed with the heat absorption liquid. Thereby, heat generated by each electronic component is absorbed by the heat absorption liquid.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In the heat absorption plate of Patent Document 1, the channel height and channel cross-sectional area are constant. On the other hand, plug-in chargers, smoothing modules, power modules, DC-DC converters, and busbar modules each generate different amounts of heat. To absorb the heat of electronic components that generate relatively large amounts of heat, it is preferable that the flow velocity of the heat-absorbing liquid flowing through the channel is relatively slow, and to absorb the heat of electronic components that generate relatively small amounts of heat, it is not necessary to relatively slow down the flow velocity of the heat-absorbing liquid flowing through the channel. The flow velocity of the heat-absorbing liquid flowing through the channel is inversely proportional to the channel cross-sectional area. In the heat absorption plate of Patent Document 1, since the channel cross-sectional area is constant, the flow velocity of the heat-absorbing liquid is constant. Therefore, it is not possible to efficiently absorb both the heat of electronic components that generate relatively large amounts of heat and the heat of electronic components that generate relatively small amounts of heat, and there was room for improvement.

[0006] Therefore, there is a need for a heat absorption plate that can efficiently absorb both the heat from electronic components that generate a relatively large amount of heat and the heat from electronic components that generate a relatively small amount of heat. [Means for solving the problem]

[0007] One embodiment of the heat absorption plate according to the present disclosure is a heat absorption plate having a plate surface in contact with a first bottom surface of a first electronic component which generates a relatively large amount of heat, and a second bottom surface of a second electronic component which generates a relatively smaller amount of heat than the first electronic component, wherein a flow channel is formed inside through which a heat-absorbing liquid capable of absorbing heat generated by the first electronic component and the second electronic component flows, and the flow channel has a first flow channel section which has a relatively large flow channel height and flow channel cross-sectional area, and a second flow channel section which has a relatively smaller flow channel height and flow channel cross-sectional area than the first flow channel section, and the heat-absorbing liquid exchanges heat with the first electronic component in the first flow channel section and with the second electronic component in the second flow channel section.

[0008] In the heat absorption plate according to this embodiment, the first channel section, which absorbs the heat from the first electronic component that generates a relatively large amount of heat, is configured to have a relatively large channel height and channel cross-sectional area to slow down the flow velocity of the heat absorption liquid, while the second channel section, which absorbs the heat from the second electronic component that generates a relatively small amount of heat, is configured to have a relatively small channel height and channel cross-sectional area to speed up the flow velocity of the heat absorption liquid. When the same amount of heat is conducted, the amount of heat absorbed per unit volume of the heat absorption liquid is larger when the flow velocity is slower because the amount of heat conducted to the heat absorption liquid per unit time is larger. As a result, a heat absorption plate was obtained that can efficiently absorb the heat from both the first electronic component that generates a relatively large amount of heat and the second electronic component that generates a relatively small amount of heat into the heat absorption liquid. [Brief explanation of the drawing]

[0009] [Figure 1] This is a perspective view showing the schematic configuration of a power control unit including a heat absorption plate according to this embodiment. [Figure 2] This is a cross-sectional view taken along the line II-II in Figure 1. [Modes for carrying out the invention]

[0010] The embodiments of the heat absorption plate according to this disclosure will be described in detail below with reference to the drawings. The embodiments described below are illustrative examples for explaining the heat absorption plate according to this disclosure, and do not limit the heat absorption plate to these embodiments only. Therefore, the heat absorption plate according to this disclosure can be implemented in various forms without departing from its essence.

[0011] [Configuration of the heat absorption plate] Figure 1 shows a power control unit B, including a heat absorption plate A, which is installed in vehicles (not shown) such as hybrid electric vehicles (HEVs), plug-in hybrid electric vehicles (PHEVs), battery electric vehicles (BEVs), and fuel cell electric vehicles (FCEVs).

[0012] The power control unit B according to this embodiment is composed of a heat absorption plate A and a plurality of electronic components from which heat is absorbed by the heat absorption plate A. The heat absorption plate A is composed of a pair of upper plate members 10 and lower plate members 11 made of a metal with high thermal conductivity such as aluminum, joined by welding or the like (see Figures 1 and 2). The plurality of electronic components specifically include a pair of primary power modules 1 (an example of a first electronic component), a secondary power module 2 (an example of a second electronic component), a transformer coil 3, a first FET 4, a PFC coil 5, a second FET 6, a secondary coil 7, and an inverter 8. Note that the heat absorption plate A does not necessarily have to be composed of an upper plate member 10 and a lower plate member 11. The heat absorption plate A may be composed of one component or of three or more components.

[0013] Since the heat absorption plate A is installed on the vehicle in the orientation shown in Figure 1, the vertical relationship of each part of the heat absorption plate A will be explained in accordance with this orientation. Hereinafter, the vertical direction will be referred to as the Z direction, the side and direction in which the upper plate member 10 is positioned relative to the lower plate member 11 will be referred to as the Z1 side and Z1 direction, and the side and direction in which the lower plate member 11 is positioned relative to the upper plate member 10 will be referred to as the Z2 side and Z2 direction. In this case, the Z2 direction is the direction of gravity, and the Z1 direction is the direction opposite to the direction of gravity (hereinafter also referred to as the "anti-gravity direction").

[0014] Of the multiple electronic components, a pair of primary power modules 1, secondary power modules 2, transformer coil 3, first FET 4, PFC coil 5, second FET 6, and secondary coil 7 are arranged on the Z1 side, which is the side of the upper plate member 10 of the heat absorption plate A, and the inverter 8 is arranged on the Z2 side, which is the side of the lower plate member 11.

[0015] Inside the heat absorption plate A, a flow path P is formed by a groove formed in at least one of a pair of upper plate members 10 and lower plate members 11. A heat-absorbing liquid F flows through the flow path P. The heat-absorbing liquid F absorbs the heat generated by multiple electronic components contained in the power control unit B, suppressing the temperature rise of these electronic components. Hereinafter, the effect of such a heat-absorbing liquid F will also be simply referred to as "the heat-absorbing liquid F absorbs the heat of the electronic components." The lower plate member 11 has a supply port Pa at one end of the flow path P and an outlet Pb at the other end of the flow path P. The heat-absorbing liquid F flowing outside the heat absorption plate A flows into the heat absorption plate A from the supply port Pa, flows through the flow path P, and is discharged to the outside from the outlet Pb. The heat-absorbing liquid F includes water-based liquids such as antifreeze or long-life coolant mainly composed of ethylene glycol, or oil-based liquids composed of insulating oils such as paraffin. The heat-absorbing liquid F is a general term for these.

[0016] As shown in Figure 1, the upper plate member 10 has a plate surface 10a that contacts each of the pair of primary power modules 1, secondary power module 2, transformer coil 3, first FET 4, PFC coil 5, second FET 6, and secondary coil 7. Specifically, the plate surface 10a is a part of the first heat absorption section C1 that absorbs heat from the pair of primary power modules 1, the second heat absorption section C2 that absorbs heat from the secondary power module 2, the third heat absorption section C3 that absorbs heat from the transformer coil 3, the fourth heat absorption section C4 that absorbs heat from the first FET 4, the fifth heat absorption section C5 that absorbs heat from the PFC coil 5, the sixth heat absorption section C6 that absorbs heat from the second FET 6, and the seventh heat absorption section C7 that absorbs heat from the secondary coil 7.

[0017] In this embodiment, the first bottom surface 1a of a pair of primary power modules 1 is in contact with the plate surface 10a of the first heat absorption section C1. The second bottom surface 2a of the secondary power module 2 is in contact with the plate surface 10a of the second heat absorption section C2. The third bottom surface 3a of the transformer coil 3 is in contact with the plate surface 10a of the third heat absorption section C3. The fourth bottom surface 4a of the first FET 4 is in contact with the plate surface 10a of the fourth heat absorption section C4. The fifth bottom surface 5a of the PFC coil 5 is in contact with the plate surface 10a of the fifth heat absorption section C5. The sixth bottom surface 6a of the second FET 6 is in contact with the plate surface 10a of the sixth heat absorption section C6. The seventh bottom surface 7a of the secondary coil 7 is in contact with the plate surface 10a of the seventh heat absorption section C7. Furthermore, "in contact" includes not only the case in which each electronic component is in direct contact with the plate surface 10a, but also the case in which the plate surface 10a and each electronic component are in contact via a thermal conductive sheet or gap filler, and the case in which they are in close proximity to each other without significantly hindering heat conduction.

[0018] The flow path P is formed to flow directly below (on the Z2 side of) each plate surface 10a from the first heat absorption section C1 to the seventh heat absorption section C7. The thickness of the wall between the plate surface 10a and the flow path P in the upper plate member 10 (the distance between the plate surface 10a and the flow path P) is preferably as thin as possible while ensuring the necessary strength of the upper plate member 10. This allows the heat-absorbing liquid F flowing through the flow path P to efficiently absorb the heat of the electronic components.

[0019] With such a configuration, for example, the heat of a pair of primary power modules 1 is conducted from the first bottom surface 1a through the plate surface 10a into the upper plate member 10 and absorbed by the heat-absorbing liquid F flowing through the flow path P. As a result, the temperature rise of the pair of primary power modules 1 that have released heat is suppressed, and the temperature of the heat-absorbing liquid F that has absorbed heat rises. Similarly, the heat of each of the secondary power module 2 and the secondary coils 7 from the secondary power module 2 is conducted from the second bottom surface 2a and each of the seventh bottom surfaces 7a through the plate surface 10a into the upper plate member 10 and absorbed by the heat-absorbing liquid F flowing through the flow path P. As a result, the temperature rise of each of the secondary power module 2 and the secondary coils 7 that have released heat is suppressed, and the temperature of the heat-absorbing liquid F that has absorbed heat at each location rises.

[0020] As shown in FIG. 1, the pair of primary power modules 1, the secondary power module 2, the transformer coil 3, the first FET 4, the PFC coil 5, the second FET 6, and the secondary coil 7 each have different heights (lengths along the Z direction), and their respective heat generation amounts are also different. Specifically, each of the pair of primary power modules 1, the first FET 4, and the second FET 6 has a relatively large heat generation amount, and the transformer coil 3, the PFC coil 5, and the secondary coil 7 have a relatively small heat generation amount. The secondary power module 2 has a relatively medium heat generation amount.

[0021] In order to efficiently absorb the heat of these electronic components having different heat generation amounts with the heat-absorbing liquid F, the flow path height (length along the Z direction) and the flow path cross-sectional area of the flow path P are different according to the heat generation amount of the opposing electronic components. That is, in the first heat absorption portions C1, the fourth heat absorption portions C4, and the sixth heat absorption portions C6 that face the pair of primary power modules 1, the first FET 4, and the second FET 6 having a relatively large heat generation amount, the flow path height of the flow path P is enlarged in the Z1 direction (anti-gravity direction) close to the electronic components to be relatively high, and the flow path cross-sectional area is relatively large. Hereinafter, the portions of the flow path P that constitute the first heat absorption portions C1, the fourth heat absorption portions C4, and the sixth heat absorption portions C6 are referred to as the first flow path portion P1.

[0022] On one hand, in the third heat absorption part C3, fifth heat absorption part C5, and seventh heat absorption part C7 facing the transformer coil 3, PFC coil 5, and secondary coil 7 with relatively small heat generation amounts, both the channel height and channel cross-sectional area of the channel P are made relatively smaller than those of the first channel part P1. Hereinafter, the part of the channel P that constitutes the third heat absorption part C3, fifth heat absorption part C5, and seventh heat absorption part C7 is referred to as the third channel part P3. Also, in the second heat absorption part C2 facing the secondary power module 2 with a relatively intermediate heat generation amount, both the channel height and channel cross-sectional area of the channel P are made to have a size intermediate between the first channel part P1 and the third channel part P3. Hereinafter, the part of the channel P that constitutes the second heat absorption part C2 is referred to as the second channel part P2.

[0023] In the channel P of the present embodiment, as shown in FIG. 1, the second channel part P2 that constitutes the second heat absorption part C2 is arranged on the downstream side of the first channel part P1 that constitutes the first heat absorption part C1, and the third channel part P3 that constitutes the third heat absorption part C3 is arranged on the downstream side of the second channel part P2. As described above, the channel height and channel cross-sectional area of the channel P become smaller in the order of the first channel part P1, the second channel part P2, and the third channel part P3.

[0024] In the first channel part P1 that constitutes the first heat absorption part C1, heat exchange occurs between the heat generated by the pair of primary power modules 1 and the heat absorption liquid F. In the second channel part P2 that constitutes the second heat absorption part C2, heat exchange occurs between the heat generated by the secondary power module 2 and the heat absorption liquid F. In the third channel part P3 that constitutes the third heat absorption part C3, heat exchange occurs between the heat generated by the transformer coil 3 and the heat absorption liquid F.

[0025] The first flow channel P1, which constitutes the first heat absorption section C1, is through which the heat-absorbing liquid F flowing in from the supply port Pa flows. As shown in Figure 2, the inner wall surface of the first flow channel P1 extends close to and parallel to the plate surface 10a, and on the downstream side, it extends from the parallel extension end in a direction that is inclined with respect to the Z2 direction and the downstream direction, away from the primary power module 1. Hereinafter, the wall surface at the downstream end of the inner wall surface constituting the first flow channel P1 that extends in a direction inclined with respect to the Z direction will be called the inclined surface P11. On the inclined surface P11, the flow channel height and cross-sectional area at the portion of the first flow channel P1 that extends close to and parallel to the plate surface 10a gradually decrease, and it connects to the second flow channel P2 on the downstream side. By configuring it in this way, the flow velocity of the heat-absorbing liquid F can be gradually increased, allowing the heat-absorbing liquid F to flow through the second flow channel P2.

[0026] In this embodiment, in a plan view along the direction perpendicular to the plate surface 10a (Z direction), the first area S1 (see Figure 1) where the portion of the first flow channel P1 closest to the first bottom surface 1a of each of the pair of primary power modules 1 (the portion of the inner wall surface of the first flow channel P1 that extends close to and parallel to the plate surface 10a) overlaps with the first bottom surface 1a is configured to be larger than the second area S2 (see Figure 1) where the portion of the second flow channel P2 closest to the second bottom surface 2a of the secondary power module 2 overlaps with the second bottom surface 2a. However, for example, if the primary power modules 1 are arranged such that a portion of the first bottom surface 1a overlaps with the inclined surface P11 in a plan view, the portion of the first bottom surface 1a that overlaps with the inclined surface P11 is excluded. This is because heat exchange does not occur between the portion of the first bottom surface 1a that overlaps with the inclined surface P11 in a plan view and the heat absorbing liquid F. In this embodiment, since both the first bottom surface 1a and the second bottom surface 2a are in full contact with the plate surface 10a, the area of ​​the first bottom surface 1a becomes the first area S1, and the area of ​​the second bottom surface 2a becomes the second area S2 (see Figure 1).

[0027] The statement that the entire surfaces of the first bottom surface 1a and the second bottom surface 2a are in contact with the plate surface 10a refers to the following state. Below, as an example, we will explain the case in which the entire surface of the first bottom surface 1a is in contact with the plate surface 10a. As shown in Figure 2, assuming a virtual extension surface (shown by a dashed line) that extends in the direction of the plate surface 10a along the inclined surface P11 in the first flow channel P1, the primary power module 1 is positioned such that the contact surface of the primary power module 1 with the plate surface 10a is located inside the virtual intersection line L1 where the virtual extension surface and the plate surface 10a intersect. That is, the contact surface of the primary power module 1 with the plate surface 10a is located upstream of the virtual intersection line L1 in the flow direction of the heat absorbent liquid F in the flow direction of the heat absorbent liquid F. With the primary power module 1 positioned in this manner, the entire first bottom surface 1a of the primary power module 1 faces the heat absorption liquid F in the closest possible proximity, so that the heat from the primary power module 1 is efficiently absorbed by the heat absorption liquid F. Similarly, the second bottom surface 2a of the secondary power module 2 is also positioned so that its entire surface is in contact with the plate surface 10a, just like the primary power module 1. The fourth bottom surface 4a of the first FET 4, the sixth bottom surface 6a of the second FET 6, and the seventh bottom surface 7a of the secondary coil 7 are also positioned so that their entire surfaces are in contact with the plate surface 10a.

[0028] The flow velocity of the heat-absorbing liquid F flowing through the channel P is inversely proportional to the cross-sectional area of ​​the channel. In other words, the flow velocity of the heat-absorbing liquid F is slowest when flowing through the first channel P1 among the first to third channel P3. When the same amount of heat is conducted, the amount of heat absorbed per unit volume by the heat-absorbing liquid F is larger when the flow velocity is slower because the amount of heat conducted to the heat-absorbing liquid F per unit time is greater. Furthermore, the first channel P1 of the first heat absorption section C1 is located on the upstream side of the channel P formed in the heat absorption plate A, and the temperature of the heat-absorbing liquid F flowing through this first channel P1 is relatively low. In this embodiment, the pair of primary power modules 1 that cause the heat-absorbing liquid F flowing through the first channel P1 of the first heat absorption section C1 to absorb heat have a relatively large amount of heat generation. Thus, based on conditions such as the flow rate and temperature of the heat-absorbing liquid F, and the relatively large heat generation of the primary power module 1, the heat-absorbing liquid F flowing through the first flow channel P1 of the first heat-absorbing section C1 can absorb the largest amount of heat.

[0029] Then, the heat-absorbing liquid F, which has absorbed the heat from the primary power module 1 in the first flow channel P1, gradually increases its flow velocity and flows into the second flow channel P2. Since the flow channel height and flow channel cross-sectional area of ​​the second flow channel P2 are smaller than those of the first flow channel P1, the flow velocity of the heat-absorbing liquid F is faster than that of the first flow channel P1. However, since the amount of heat generated by the secondary power module 2 is relatively smaller than that of the primary power module 1, even if the flow velocity of the heat-absorbing liquid F is relatively fast, it can sufficiently absorb the heat generated by the secondary power module 2.

[0030] The heat-absorbing liquid F, which has absorbed heat from the secondary power module 2 in the second flow channel P2, flows into the third flow channel P3 with an even higher flow velocity. Since the third flow channel P3 has a smaller flow channel height and cross-sectional area than the second flow channel P2, the flow velocity of the heat-absorbing liquid F is faster than in the second flow channel P2. However, since the amount of heat generated by the transformer coil 3 is relatively small compared to the secondary power module 2, the heat-absorbing liquid F can sufficiently absorb the heat generated by the transformer coil 3 even with a relatively high flow velocity.

[0031] As described above, the heat absorption plate A according to this embodiment is configured such that in the first flow channel P1, which absorbs the heat from the primary power module 1, which generates a relatively large amount of heat, the flow channel height and cross-sectional area are relatively increased to slow down the flow velocity of the heat absorption liquid F, and in the second flow channel P2, which absorbs the heat from the secondary power module 2, which generates a relatively small amount of heat, the flow channel height and cross-sectional area are relatively decreased to increase the flow velocity of the heat absorption liquid F. When the same amount of heat is conducted, the amount of heat absorbed per unit volume of the heat absorption liquid F is greater when the flow velocity is slower because the amount of heat conducted to the heat absorption liquid F per unit time is greater. As a result, both the heat from the primary power module 1, which generates a relatively large amount of heat, and the heat from the secondary power module 2, which generates a relatively small amount of heat, can be efficiently absorbed by the heat absorption liquid F. A similar relationship holds between the flow path P of the fourth heat absorption section C4 and the flow path P of the fifth heat absorption section C5, and between the flow path P of the sixth heat absorption section C6 and the flow path P of the seventh heat absorption section C7. In other words, regardless of the relative amount of heat generated, the heat generated by all electronic components in contact with the heat absorption plate A can be efficiently absorbed by the heat absorption liquid F.

[0032] Furthermore, in the heat absorption plate A, the primary power module 1, which generates a relatively large amount of heat, is placed in the first flow path P1 of the first heat absorption section C1, which is upstream of the flow path P. Electronic components are then arranged in the order of secondary power module 2 and transformer coil 3, which generate a relatively smaller amount of heat, as you move downstream to the second heat absorption section C2 and the third heat absorption section C3. This allows the heat from the primary power module 1, which generates a relatively large amount of heat, to be absorbed by the heat absorption liquid F before the heat from the secondary power module 2 and transformer coil 3, which generate a relatively small amount of heat, is absorbed, thus enabling more efficient heat absorption by the heat absorption liquid F.

[0033] Furthermore, the heat absorption plate A is configured such that, in a plan view, the first area S1, which overlaps with the first bottom surface 1a of the primary power module 1 (which generates relatively more heat) in the first flow channel P1, is larger than the second area S2, which overlaps with the second bottom surface 2a of the secondary power module 2 (which generates relatively less heat) in the second flow channel P2, where it overlaps with the second bottom surface 2a. In this way, each electronic component has a bottom area corresponding to its relative heat generation and is close to the flow channel P, allowing heat to be absorbed by the heat absorption liquid F more efficiently.

[0034] [Other Embodiments] (1) In the above embodiment, the entire first bottom surface 1a of the primary power module 1 and the second bottom surface 2a of the secondary power module 2 were in contact with the plate surface 10a. However, for example, if a part of the first bottom surface 1a is arranged to overlap with the inclined surface P11, the entire first bottom surface 1a does not have to be in contact with the plate surface 10a. However, even in this case, in a plan view, the first area S1 (see Figure 1) where the first bottom surface 1a overlaps with the part of the first flow channel P1 that is closest to the first bottom surface 1a of the first electronic component is larger than the second area S2 (see Figure 1) where the second bottom surface 2a overlaps with the part of the second flow channel P2 that is closest to the second bottom surface 2a of the second electronic component. That is, the part of the first bottom surface 1a that overlaps with the inclined surface P11 in a plan view is excluded from the first area S1. This is because heat exchange does not occur between the part that overlaps with the inclined surface P11 in a plan view and the heat absorbing liquid F.

[0035] (2) In the above embodiment, the downstream end of the second channel section P2 connected to the third channel section P3 did not have an inclined surface like the inclined surface P11 of the first channel section P1, but it is not limited to this. An inclined surface similar to the inclined surface P11 of the first channel section P1 may be formed at the downstream end of the second channel section P2.

[0036] (3) Although not mentioned in the above embodiment, the pair of primary power modules 1, secondary power modules 2, transformer coil 3, first FET 4, PFC coil 5, second FET 6, and secondary coil 7 arranged on the Z1 side may be mounted on a single substrate (not shown) or multiple substrates (not shown) arranged at the same height. In other words, the heights of the first heat absorption section C1 to the seventh heat absorption section C7 may be set such that the first bottom surface 1a to the seventh bottom surface 7a contact the plate surface 10a of the upper plate member 10 while the mounting surfaces of these electronic components are at the same height. By configuring in this way, the mounting density of the substrate can be increased and the routing of wiring can be simplified, so that the power control unit B can be manufactured at low cost.

[0037] In the heat absorption plate A described in the above embodiment, the following configuration can be envisioned.

[0038] <1> One embodiment of the heat-absorbing plate (A) is a plate surface (10a) that comes into contact with the first bottom surface (1a) of a first electronic component (1) which generates relatively large amounts of heat, and the second bottom surface (2a) of a second electronic component (2) which generates relatively less heat than the first electronic component (1). The heat-absorbing plate (A) has a flow channel (P) through which a heat-absorbing liquid (F) capable of absorbing heat generated by the first electronic component (1) and the second electronic component (2) flows. The flow channel (P) has a first flow channel section (P1) which has a relatively large flow channel height and flow channel cross-sectional area, and a second flow channel section (P2) which has a relatively smaller flow channel height and flow channel cross-sectional area than the first flow channel section (P1). The heat-absorbing liquid (F) exchanges heat with the first electronic component (1) in the first flow channel section (P1) and with the second electronic component (2) in the second flow channel section (P2).

[0039] In the heat absorption plate (A) according to this embodiment, the first channel section (P1), which absorbs the heat of the first electronic component (1), which generates a relatively large amount of heat, into the heat absorption liquid (F), has a relatively large channel height and channel cross-sectional area to slow down the flow velocity of the heat absorption liquid (F), while the second channel section (P2), which absorbs the heat of the second electronic component (2), which generates a relatively small amount of heat, into the heat absorption liquid (F), has a relatively small channel height and channel cross-sectional area to speed up the flow velocity of the heat absorption liquid (F). When the same amount of heat is conducted, the amount of heat absorbed per unit volume by the heat absorption liquid (F) is larger when the flow velocity is slower because the amount of heat conducted to the heat absorption liquid (F) per unit time is larger. As a result, a heat absorption plate (A) was obtained that can efficiently absorb both the heat of the first electronic component (1), which generates a relatively large amount of heat, and the heat of the second electronic component (2), which generates a relatively small amount of heat, into the heat absorption liquid (F).

[0040] <2> the above <1> In the heat absorption plate (A) described above, it is preferable that, when viewed in a direction perpendicular to the plate surface (10a), the first area (S1) in which the portion of the first flow channel (P1) closest to the first bottom surface (1a) of the first electronic component (1) overlaps with the first bottom surface (1a) is larger than the second area (S2) in which the portion of the second flow channel (P2) closest to the second bottom surface (2a) of the second electronic component (2) overlaps with the second bottom surface (2a).

[0041] According to this embodiment, in a view perpendicular to the plate surface (10a), the first area (S1) in which the part of the first channel (P1) closest to the first bottom surface (1a) of the first electronic component (1), which generates relatively more heat, overlaps with the first bottom surface (1a) is larger than the second area (S2) in which the part of the second channel (P2) closest to the second bottom surface (2a) of the second electronic component (2), which generates relatively less heat, overlaps with the second bottom surface (2a). In this way, the first electronic component (1) and the second electronic component (2) have bottom areas corresponding to their relative heat generation and are close to the channel (P), so that heat can be absorbed by the heat absorption liquid (F) more efficiently.

[0042] <3> the above <1> or <2> In the heat absorption plate (A) described above, it is preferable that the second flow channel (P2) is located downstream of the first flow channel (P1) in the flow channel (P).

[0043] In this embodiment, a first electronic component (1) that generates a relatively large amount of heat is placed in the first channel section (P1), which is upstream of the channel (P), and a second electronic component (2) that generates a relatively small amount of heat is placed in the second channel section (P2), which is downstream. As a result, the heat from the first electronic component (1), which generates a relatively large amount of heat, can be absorbed by the heat-absorbing liquid (F) before the heat from the second electronic component (2), which generates a relatively small amount of heat, can be absorbed, thus allowing the heat to be absorbed by the heat-absorbing liquid (F) more efficiently.

[0044] <4> the above <1> from <3> In the heat absorption plate (A) described in any one of the above, the flow path (P) has a third flow path section (P3) which has a flow path height and flow path cross-sectional area that is relatively smaller than the second flow path section (P2), and it is preferable that the third flow path section (P3) is located downstream of the second flow path section (P2) in the flow path (P).

[0045] According to this embodiment, a second flow channel section (P2) is arranged on the relatively upstream side of the flow channel (P), and a third flow channel section (P3) is arranged on the relatively downstream side, having a flow channel height and flow channel cross-sectional area that are relatively smaller than those of the second flow channel section (P2). As a result, by placing a second electronic component (2) that generates a relatively large amount of heat in the second flow channel section (P2) and an electronic component that generates a relatively small amount of heat in the third flow channel section (P3), the heat from the second electronic component (2), which generates a relatively large amount of heat, can be absorbed by the heat-absorbing liquid (F) before the heat from the electronic component that generates a relatively small amount of heat is absorbed, thus allowing the heat to be absorbed by the heat-absorbing liquid (F) even more efficiently.

[0046] <5> the above <4> In the heat absorption plate (A) described above, it is preferable that at least one of the first flow channel section (P1) and the second flow channel section (P2) has a downstream end that gradually decreases in flow channel height and flow channel cross-sectional area and connects to the second flow channel section (P2) and the third flow channel section (P3).

[0047] According to this embodiment, the flow velocity of the heat-absorbing liquid (F) can be gradually increased, so that the heat-absorbing liquid (F) can be smoothly circulated through the second flow channel (P2). [Industrial applicability]

[0048] This disclosure is applicable to heat absorption plates. [Explanation of symbols]

[0049] 1: Primary power module (first electronic component), 1a: First bottom surface, 2: Secondary power module (second electronic component), 2a: Second bottom surface, 10a: Plate surface, A: Heat absorption plate, F: Heat absorption liquid, P: Flow channel, P1: First flow channel section, P2: Second flow channel section, P3: Third flow channel section, S1: First area, S2: Second area

Claims

1. A heat-absorbing plate having a plate surface in contact with the first bottom surface of a first electronic component which generates a relatively large amount of heat, and the second bottom surface of a second electronic component which generates a relatively smaller amount of heat than the first electronic component, A channel is formed inside through which a heat-absorbing liquid capable of absorbing the heat generated by the first and second electronic components flows. The flow path has a first flow path section with a relatively large flow path height and flow path cross-sectional area, and a second flow path section with a relatively smaller flow path height and flow path cross-sectional area than the first flow path section. The heat-absorbing liquid is a heat-absorbing plate that performs heat exchange with the first electronic component in the first channel section and with the second electronic component in the second channel section.

2. The heat-absorbing plate according to claim 1, wherein, in a view perpendicular to the plate surface, the first area in the first flow channel portion closest to the first bottom surface of the first electronic component and the first bottom surface overlap, is larger than the second area in the second flow channel portion closest to the second bottom surface of the second electronic component and the second bottom surface overlap.

3. The aforementioned flow path has a third flow path section in which the flow path height and the flow path cross-sectional area are relatively smaller than those of the second flow path section. The heat absorption plate according to claim 1 or 2, wherein the third flow channel is located downstream of the second flow channel in the flow channel.

4. The heat absorption plate according to claim 3, wherein at least one of the first flow channel and the second flow channel ends with the flow channel height and flow channel cross-sectional area gradually decreasing as it connects to the second flow channel and the third flow channel.

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