Display devices and molding machines

Abstract

The present invention provides a display device that suppresses display malfunctions in the display panel caused by heat generated by the processor. [Solution] The display device comprises a display panel, a housing attached to the opposite side of the display surface of the display panel, a processor located in the internal space of the housing that controls the display of the display panel, and a fan located in the internal space that circulates the air in the internal space.

Description

Technical Field

[0001] The present invention relates to a display device and a molding machine equipped with the same.

Background Art

[0002] Conventionally, a molding machine is known that includes a mold clamping device for opening and closing and clamping a mold, an injection device for injecting a molding material into the cavity of the clamped mold, and a display device for displaying the state of the device (for example, molding conditions, monitor data, alarm data) (see, for example, Patent Document 1).

[0003] In addition, among display devices such as that of Patent Document 1, there is one in which a housing containing a control board for controlling the display on the display panel is attached to the back side of the display panel and integrated (unitized).

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In recent years, due to the enlargement and high resolution of display devices and the control of touch panels superimposed on display panels, the specifications of the processors mounted on the control boards have also become higher, and accordingly, the amount of heat generated has increased. As a result, the heat in the internal space of the housing may be transmitted to the display panel, and display defects may occur in the display panel.

[0006] The present invention has been made in view of the above circumstances, and an object thereof is to provide a display device that suppresses display defects of a display panel due to heat generated by a processor.

Means for Solving the Problems

[0007] To solve the aforementioned problems, the present invention is characterized by comprising: a display panel; a housing attached to the opposite side of the display surface of the display panel; a processor disposed in the internal space of the housing for controlling the display of the display panel; and a fan disposed in the internal space for circulating the air in the internal space. [Effects of the Invention]

[0008] According to the present invention, a display device can be obtained that suppresses display defects in the display panel caused by heat generated by the processor. [Brief explanation of the drawing]

[0009] [Figure 1] This is a side view of the injection molding machine according to this embodiment. [Figure 2] This is a perspective view of the display input device from the front side. [Figure 3] This is a perspective view of the display input device from the back. [Figure 4] This is a rear view of the display input device. [Figure 5] This diagram shows the positions of the fan and temperature sensor during the effectiveness verification test. [Figure 6] This figure shows the position of the temperature sensor on the display surface during the effectiveness verification test. [Figure 7] This table shows the results of the efficacy verification test. [Modes for carrying out the invention]

[0010] The injection molding machine 10 according to the present invention will be described below with reference to the drawings. The injection molding machine 10 is a molding machine that injects molten resin (molding material) measured into a mold to form a molded product. However, the specific example of a molding machine is not limited to the injection molding machine 10, and may also be a die-casting machine that injects molten metal (molding material) into a mold to form a molded product.

[0011] [Configuration of injection molding machine 10] Figure 1 is a side view of the injection molding machine 10 according to this embodiment. As shown in Figure 1, the injection molding machine 10 mainly comprises a mold clamping device 20, an injection device 30, and a display input device 40.

[0012] The mold clamping device 20 opens and closes the mold 21 and clamps it. Specifically, the mold clamping device 20 mainly comprises a fixed die plate 23 that supports the fixed side mold 22 and a movable die plate 25 that supports the movable side mold 24. The fixed side mold 22 and the movable side mold 24 are supported so as to face each other in the left-right direction (horizontal direction) of the injection molding machine 10.

[0013] The movable die plate 25 moves left and right along the tie bar 27 as the driving force of the mold opening / closing motor (not shown) is transmitted through the toggle link mechanism 26. When the movable die plate 25 moves to the left, the fixed mold 22 and the movable mold 24 separate. On the other hand, when the movable die plate 25 moves to the right, the fixed mold 22 and the movable mold 24 come into contact, forming a cavity (internal space) inside the mold 21. When further pressure is applied in the direction that moves the movable die plate 25 to the right, the fixed mold 22 and the movable mold 24 are clamped together.

[0014] The injection device 30 plasticizes, measures, and injects the molding material. In this embodiment, the injection device 30 is positioned opposite the clamping device 20 in the horizontal direction (to the right of the clamping device 20). The injection device 30 mainly comprises a heating cylinder 31, a screw 32, a hopper 33, and a hopper block 34.

[0015] The heating cylinder 31 is a cylindrical component that extends in the left-right direction of the injection molding machine 10. The heating cylinder 31 mainly comprises a resin passage 35 and a nozzle 36. A band heater (not shown) for heating the heating cylinder 31 is attached to the outer circumferential surface of the heating cylinder 31.

[0016] The resin passage 35 is a cylindrical space extending axially (in the longitudinal direction) inside the heating cylinder 31. The resin passage 35 communicates with the outside of the heating cylinder 31 (the cavity of the mold 21) through a nozzle 36 provided at the tip (front end) of the heating cylinder 31. In other words, the resin passage 35 is a space extending axially along the nozzle 36.

[0017] The screw 32 is a cylindrical member. On the outer peripheral surface of the screw 32, a groove extending spirally along the longitudinal direction of the screw 32 (hereinafter referred to as "spiral groove") is formed. The screw 32 is accommodated in the internal space of the heating cylinder 31 in a state where it can move in the left - right direction (hereinafter referred to as "forward and backward") and rotate in the injection molding machine 10. Also, the screw 32 in the heating cylinder 31 is configured to be replaceable. In other words, different screws 32 with different specifications (for example, material, shape of the spiral groove, volume of the spiral groove) can be inserted into the heating cylinder 31.

[0018] The driving force of an injection motor (not shown) is transmitted to the screw 32 to make it move forward and backward, and the driving force of a metering motor (not shown) is transmitted to the screw 32 to make it rotate. More specifically, when the injection motor rotates forward, the screw 32 moves (advances) toward the tip of the heating cylinder 31 (that is, the nozzle 36). On the other hand, when the injection motor rotates backward, the screw 32 moves (recedes) toward the base end of the heating cylinder 31 (that is, the side opposite to the nozzle 36).

[0019] Hereinafter, among the range where the tip position of the screw 32 can reach inside the heating cylinder 31, the position closest to the nozzle 36 is referred to as "forward limit", and the position farthest from the nozzle 36 is referred to as "rearward limit". Also, the terms "forward rotation" and "backward rotation" of the injection motor do not specify the absolute rotation direction, but only specify the relative relationship (that is, forward rotation and backward rotation are rotations in opposite directions).

[0020] The hopper 33 is a funnel-shaped member that stores granular resin as raw material. The hopper block 34 is a member that supports the heating cylinder 31 and the hopper 33. The hopper 33 communicates with the resin passage 35 on the base end side from the tip of the heating cylinder 31 through the hopper block 34. The granular resin stored in the hopper 33 is supplied to the resin passage 35 of the heating cylinder 31 through an opening provided at the lower end. The granular resin used in this injection molding machine 10 is, for example, a so-called "pellet" formed in a columnar shape.

[0021] The injection device 30 causes the screw 32 to retreat while rotating by rotating the injection motor in the reverse direction and rotating the metering motor. As a result, the pellets supplied through the hopper 33 are filled (metered) into the resin passage 35 in front of the screw 32 while being plasticized. Further, the injection device 30 causes the screw 32 to advance by rotating the injection motor in the forward direction.

[0022] Resins of different types (e.g., the degree of ease of plasticization) are supplied to the hopper 33 according to the molded product. Also, the particle size (size of the particles) of the pellets supplied to the hopper 33 varies depending on a raw material supply device (not shown) that supplies raw material to the hopper 33. Furthermore, in addition to the pellets, recycled resin may be supplied to the hopper 33. The recycled resin refers to unnecessary parts (runners) separated from the molded product, resin discharged (purged) from the heating cylinder 31, and the like.

[0023] The operation of the injection molding machine 10 is controlled by a control device (not shown). More specifically, the control device controls the mold opening / closing motor, the injection motor, the metering motor, and the band heater based on various signals output from various sensors (e.g., rotary encoder, load cell, temperature sensor) and the display input device 40. Also, the control device communicates with a processor 49 described later in order to control the operation of the display input device 40.

[0024] [Configuration of the display input device 40] The display input device 40 is a human-machine interface (HMI) that includes a display (display device) for displaying various information to be communicated to the operator, and buttons, switches, dials, etc. (input devices) for receiving input operations from the operator. The display input device 40 may also include a touch panel superimposed on the display. The display input device 40 receives input operations from the operator and outputs an input signal corresponding to the received input operation to the control device. However, the display input device 40 is not limited to having both display device and input device functions, and may have only the function of a display device.

[0025] As shown in Figure 1, the display input device 40 is supported by the injection molding machine 10, for example, with the display surface 43 facing forward. The display input device 40 is also supported by the injection molding machine 10 in a manner that allows it to rotate, for example, around a pivot axis X extending in the vertical direction. However, the specific arrangement of the display input device 40 is not limited to the example in Figure 1.

[0026] Hereinafter, the direction in which the display surface 43 of the display input device 40 faces is defined as the front, and the opposite direction is defined as the rear. Furthermore, the left and right directions are defined when viewed from the side facing the display surface 43. Therefore, the explanation of the positional relationship when the display input device 40 is viewed from the rear, as shown in Figures 3 and 4, is reversed compared to the left and right directions in the drawings.

[0027] Figure 2 is a perspective view of the display input device 40 from the front side. Figure 3 is a perspective view of the display input device 40 from the back side. Figure 4 is a rear view of the display input device 40. In the following description, the vertical direction is an example of a first direction, and the left-right direction is an example of a second direction. However, the absolute direction is not limited to the above examples, as long as the first and second directions intersect (are orthogonal) with each other. As shown in Figures 2 to 4, the display input device 40 mainly comprises a display panel 41 and a housing 42.

[0028] The display panel 41 is, for example, a liquid crystal panel or an organic EL (Electro-Luminescence) panel. The display panel 41 generally has a rectangular parallelepiped shape. More specifically, the display panel 41 has a flattened shape in which the length in the front-to-back direction (thickness) is shorter than the length in the vertical and horizontal directions. Also, the display panel 41 is elongated vertically, with the length in the vertical direction (an example of the first direction) being longer than the length in the horizontal direction (a second direction). However, the display panel is elongated horizontally, with the length in the horizontal direction (another example of the first direction) being longer than the length in the vertical direction (a second direction). The same applies to the display surface 43, which will be described later.

[0029] A display surface 43 is formed on the surface of the display panel 41. The display surface 43 is vertically elongated, with its vertical length being longer than its horizontal length. The display surface 43 is the surface on which images (including text, video, etc.) are displayed. The display surface 43 may also be a touch panel that accepts touch operations by an operator. Furthermore, operation buttons 44 are provided on the surface of the display panel 41. In this embodiment, the operation buttons 44 are located to the right and below the display surface 43. However, the arrangement of the operation buttons 44 is not limited to the example in Figure 2. Also, the surface of the display panel 41 is not limited to operation buttons 44; switches, dials, etc., may also be placed thereon.

[0030] The housing 42 is attached to the back surface of the display panel 41 (the surface opposite to the display surface 43). The housing 42 has a roughly rectangular shape. More specifically, the housing 42 has a flattened shape in which the length in the front-to-back direction (thickness) is shorter than the length in the vertical and horizontal directions. Also, the housing 42 is elongated vertically, with the length in the vertical direction (an example of the first direction) being longer than the length in the horizontal direction (the second direction). However, the display panel is elongated horizontally, with the length in the horizontal direction (another example of the first direction) being longer than the length in the vertical direction (the second direction). Furthermore, in the first direction, the length of the housing 42 (more specifically, the internal space 48 described later) is longer than the display surface 43.

[0031] The housing 42 is composed of a front wall 45, a frame-shaped side wall 46, and a rear wall 47. The housing 42 also has an internal space 48 defined by the front wall 45, the side wall 46, and the rear wall 47. The internal space 48 houses components that control the display panel 41 (more specifically, the display of images on the display surface 43, the touch panel, and the operation buttons 44). In this embodiment, the internal space 48 houses, for example, a main board 51 on which a processor 49 and a heatsink 50 are mounted, a touch panel control board 52, a button control board 53, and a fan 54.

[0032] The front wall 45 is a rectangular wall located opposite the display surface 43 of the display panel 41. For example, the front wall 45 may be the back surface of the display panel 41. In another example, the front wall 45 may be an independent wall (panel) facing the back surface of the display panel 41. The front wall 45 defines the front of the interior space 48.

[0033] The side wall 46 is a frame-shaped wall that protrudes from the outer periphery of the front wall 45 toward the rear (opposite side of the display panel) and is continuous in the circumferential direction. The side wall 46 defines the side surfaces (more specifically, the top surface, bottom surface, left side surface, and right side surface) of the internal space 48. In this embodiment, the side wall 46 is composed of, for example, a pair of long walls 55L, 55R and a pair of short walls 56U, 56L.

[0034] The pair of long walls 55L and 55R are spaced apart in the left-right direction, and each extends vertically. The inner surfaces of the long walls 55L and 55R face each other. The pair of short walls 56U and 56L are spaced apart in the vertical direction, and each extends horizontally. The inner surfaces of the short walls 56U and 56L face each other. In other words, the long walls 55L and 55R and the short walls 56U and 56L extend in directions that intersect (orthogonal) each other. Furthermore, the extended length (horizontal length) of the short walls 56U and 56L is shorter than the extended length (vertical length) of the long walls 55L and 55R.

[0035] The rear wall 47 is a rectangular wall facing the front wall 45 in the front-rear direction. The rear wall 47 is also connected to the entire circumferential area of ​​the protruding end of the side wall 46, thereby closing off the internal space 48. Furthermore, the rear wall 47 is configured to be detachable from the side wall 46.

[0036] It should be noted that "closing the internal space 48" does not necessarily mean completely blocking the outflow of air from the internal space 48 to the outside, in other words, "airtightness." The housing 42 may have openings for various cables (e.g., power cables, communication cables) to pass through, or it may have slits or the like to allow sound output from speakers placed in the internal space 48 to escape to the outside. On the other hand, the housing 42 does not necessarily have openings to actively allow air from the internal space 48 to escape to the outside. Also, the housing 42 does not have a fan for forcibly exhausting air from the internal space 48.

[0037] Furthermore, of the front wall 45, side wall 46, and rear wall 47 that define the internal space 48, the side wall 46 and the rear wall 47 are outer walls exposed to the outside of the display input device 40. The side wall 46 and the rear wall 47, which are outer walls, may, for example, have a generally flat shape without any noticeable irregularities or openings. In addition, some or all of the walls (45-47) that make up the housing 42 may be made of a metal with high thermal conductivity. The heat in the internal space 48 may be dissipated to the outside by propagating through the metal walls.

[0038] The main board 51, the touch panel control board 52, and the button control board 53 are housed in the internal space 48. Furthermore, the main board 51, the touch panel control board 52, and the button control board 53 are arranged parallel to, for example, the front wall 45 and the rear wall 47. More specifically, the main board 51, the touch panel control board 52, and the button control board 53 are supported on the rear surface (the side opposite to the display panel 41) of the base plate 57, which is supported by the front wall 45.

[0039] The main board 51 is a board that controls the operation of the display input device 40. The main board 51 is positioned slightly above (to one side of) the center in the vertical direction of the internal space 48. The processor 49 and heatsink 50 are mounted on the main board 51. More specifically, the main mounted components, including the processor 49 and heatsink 50, are mounted on the rear surface of the main board 51 (the side opposite the display panel 41). However, components may also be mounted on the front surface of the main board 51.

[0040] The processor 49 controls the operation of the display input device 40 and communicates with the control device. The processor 49 can be implemented as, for example, a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), an MPU (Micro Processing Unit), an FPGA (Field-Programmable Gate Array), or other device. The heatsink 50 dissipates the heat generated by the processor 49 towards the air in the internal space 48.

[0041] The processor 49 is mounted on the main board 51, offset to the upper (one side) of the center in the vertical direction of the internal space 48. The processor 49 is also mounted on the main board 51, offset to the right (one side) of the center in the horizontal direction of the internal space 48. The heatsink 50 is mounted on top of the processor 49 (i.e., overlapping the processor 49 when viewed from the front or back). Furthermore, the area of ​​the heatsink 50, when viewed from the front or back, is larger than the area of ​​the processor 49. In addition, the processor 49 and the heatsink 50 are positioned so that they overlap the display surface 43 when the display input device 40 is viewed from the front or back.

[0042] The touch panel control board 52 outputs signals (position signals indicating the position touched by the operator) from the touch panel superimposed on the display surface 43 to the control device. The touch panel control board 52 is positioned, for example, slightly above (to one side of) the center in the vertical direction of the internal space 48. Also, the touch panel control board 52 is positioned, for example, slightly to the left (to the other side of) the center in the horizontal direction of the internal space 48. In other words, the touch panel control board 52 is positioned to the left of the main board 51.

[0043] The button control board 53 outputs signals from the operation buttons 44 (operation signals indicating that an operator has pressed a button) to the control device via the main board 51. The button control board 53 is located, for example, near the center in the vertical direction of the internal space 48. In other words, the button control board 53 is located below the main board 51 and the touch panel control board 52.

[0044] Among the mounted components on each of the circuit boards 51-53, the heat sink 50 has the largest protrusion. Also, the protrusion (height) of the mounted components on the touch panel control board 52 and the button control board 53 (especially the touch panel control board 52) is sufficiently smaller (lower) than that of the heat sink 50 on the main board 51. Furthermore, most of the components housed in the internal space 48 are located above the vertical center. In other words, the region below the vertical center of the internal space 48 has a lower density of components than the region above the vertical center.

[0045] Here, among the components housed in the internal space 48 of the enclosure 42, the processor 49 generates the most heat. To exhaust the heat generated by the processor 49 to the outside of the enclosure 42, one might consider installing an exhaust fan and louvers on the rear wall 47. However, installing an exhaust fan and louvers on the rear wall 47 would reduce the aesthetic appeal of the display input device 40 and increase its cost. Furthermore, when the display input device 40 is rotated, the exhaust fan and louvers protruding from the rear wall 47 may interfere with other components.

[0046] Furthermore, the heat resistance temperature of the components housed in the internal space 48 is sufficiently higher than the heat generated by the processor 49, so there is no need to forcibly exhaust the air from the internal space 48. In contrast, the heat resistance temperature of the display panel 41 is lower than that of the components housed in the internal space 48, and localized temperature increases may cause display malfunctions. Therefore, in the display input device 40 according to this embodiment, the ambient temperature throughout the internal space 48 is equalized by circulating the air in the internal space 48 with a fan 54.

[0047] [Explanation of the installation location and airflow of Fan 54] The fan 54 is housed in the internal space 48 (more specifically, supported by the base plate 57) to circulate (in other words, agitate) the air in the internal space 48. In this embodiment, the fan 54 draws in air from one side (from above in this embodiment) and discharges it to the other side (downward in this embodiment), as indicated by the arrows in Figure 4. That is, the fan 54 generates an airflow directed downward (in other words, away from the processor 49).

[0048] Here, the fan 54 is positioned below the main board 51 (more specifically, the processor 49 and heatsink 50) and the touch panel control board 52. In other words, the fan 54 is positioned closer to the center in the vertical direction than the processor 49 and heatsink 50. That is, the fan 54 is positioned far from the short walls 56U and 56L on both the intake side (upper side) and the exhaust side (lower side).

[0049] Furthermore, the fan 54 is positioned to the left of the button control board 53. In other words, the fan 54 is positioned close to the long wall 55L. That is, the fan 54 generates an airflow that flows downward along the long wall 55L. The fan 54 also generates an airflow that flows in the direction of the lowest density of components housed in the internal space 48. Moreover, the fan 54 is positioned on the opposite side of the processor 49 and heatsink 50, with the center of the internal space 48 in the left-right direction. This prevents the airflow generated by the fan 54 from hitting obstacles and dispersing.

[0050] As a result, the air generated by the fan 54 diffuses to some extent, but the majority flows downward. In other words, the center of the fan-shaped diffused airflow is directed downward (i.e., parallel to the front wall 45 and the rear wall 47), as indicated by the arrow in Figure 4. Furthermore, the air that hits the long wall 55L flows downward along the long wall 55L and hits the short wall 56L. The air that hits the short wall 56L then flows to the right along the short wall 56L. Similarly, the air in the internal space 48 is convected as the air flows along the inner surface of the side wall 46.

[0051] Here, in the airflow shown by the arrows in Figure 4, the downstream air is pushed and moved by the upstream air. Therefore, by controlling the airflow immediately after it is generated by the fan 54 (i.e., by suppressing diffusion and directing it downward along the long wall 55L), the airflow shown by the arrows in Figure 4 can be realized. Also, although Figure 4 illustrates the convection of air only around the outer perimeter of the internal space 48, in reality, some of the diffused air flows towards the center of the internal space 48, so over time the air convection extends to the center of the internal space 48.

[0052] [Explanation of the effectiveness confirmation test] Next, with reference to Figures 5 to 7, we will describe the effectiveness verification test that confirmed the relationship between the installation position of the fan 54 and the temperature of the internal space 48 of the housing 42. Figure 5 shows the positions of fans α, β, γ and temperature sensors A and B in the effectiveness verification test. Figure 6 shows the positions of temperature sensors C, D, and E on the display surface 43 in the effectiveness verification test. Figure 7 is a table showing the results of the effectiveness verification test. Note that the temperature (°C) in the table in Figure 7 is the value obtained by subtracting the ambient temperature from the temperature measured by temperature sensors A to E.

[0053] First, as the first test, fans α, β, and γ were used to generate airflow in the direction of the black arrows, and temperature sensors A and B were used to measure the ambient temperature of the internal space 48. As shown in Figure 5, fan α is installed near the short wall 56U and generates airflow downwards. Fan β is installed near the main board 51 and generates airflow toward the processor 49 (heat sink 50). Fan γ is installed approximately in the center in the vertical direction and near the long wall 55L and generates airflow downwards. Temperature sensor A measures the ambient temperature of the upper part of the internal space 48. Temperature sensor B measures the ambient temperature of the lower part of the internal space 48.

[0054] Figure 7(A) shows the temperature measurements taken by temperature sensors A and B when fans α, β, and γ are rotated. According to Figure 7(A), when fan γ is rotated, the upper ambient temperature measured by temperature sensor A is the lowest, and the lower ambient temperature measured by temperature sensor B is the highest. In other words, by using fan γ, the upper ambient temperature where the processor 49, which is the main heat source, is installed, and the lower ambient temperature are equalized. That is, it was confirmed that the position of fan γ is the optimal location for fan 54 among fans α, β, and γ.

[0055] In contrast, since fan β blows air directly onto the heatsink 50, the temperature of the upper atmosphere is lower than that of fan α, but the temperature difference between the upper and lower atmospheres is not as even as with fan γ. This is thought to be because when airflow is generated toward the heatsink 50 side, which has many obstacles, the airflow diffuses, and convection does not occur throughout the entire internal space 48. In other words, it was confirmed that the best location for installing fan 54 is a place with few obstacles on the downstream side (exhaust side) of the airflow.

[0056] Furthermore, although there were few obstacles on the exhaust side (bottom), the short wall 56U narrowed the space on the intake side (top), so it is thought that the effect of convection of air in the internal space 48 was insufficient. In other words, it was confirmed that the best location for installing fan 54 is one where ample space can be secured on both the intake and exhaust sides.

[0057] Next, as a second test, the temperature was measured using temperature sensors A to E in three cases: when no fan was installed inside the housing 42, when airflow was generated downward from fan γ (black arrow), and when airflow was generated upward from fan γ (hatched arrow). As shown in Figure 6, temperature sensor C measures the surface temperature of the upper right side of the display surface 43. Temperature sensor D measures the surface temperature of the upper left side of the display surface 43. Temperature sensor E measures the surface temperature of the bottom of the display surface 43.

[0058] Figure 7(B) shows the temperature measurement results from temperature sensors A to E when three types of fans I, II, and III with different specifications are installed at the position of fan γ and the airflow is switched. Fan I has a rotation speed of 6200 rpm and an airflow of 5.3 CFM. Fan II has a rotation speed of 8000 rpm and an airflow of 7.4 CFM. Fan III has a rotation speed of 12400 rpm and an airflow of 11.7 CFM.

[0059] As shown in Figure 7(B), when fan II generates a downward airflow and when fan III generates a downward airflow, the difference in temperature measured by temperature sensor A and temperature sensor B is small (i.e., the temperature of the internal space 48 is normalized), and the difference in temperature measured by temperature sensors C, D and temperature sensor E is also small (i.e., the temperature of the display surface 43 is normalized). Furthermore, in these two patterns, although the measured values ​​of temperature sensors A to E are slightly lower with fan III, the difference is small enough that it can be considered identical in practical terms. On the other hand, using a fan with a higher rotation speed or airflow can increase costs and cause noise, so it was confirmed that generating a downward airflow with fan II is optimal.

[0060] [Effects of the Embodiment] According to the above embodiment, by using the fan 54 to circulate (stir) the air in the internal space 48 of the housing 42, the ambient temperature of the internal space 48 can be equalized (Figure 7(A)), and the surface temperature of the display surface 43 can be equalized (Figure 7(B)). In other words, the localized rise in the surface temperature of the display panel 41 due to the heat generated by the processor 49 is suppressed, and thus display defects of the display panel 41 can be suppressed.

[0061] Furthermore, according to the above embodiment, by positioning the fan 54 near the long wall 55L, the airflow generated by the fan 54 can be directed along the long wall 55L. This allows for more efficient convection of the air in the internal space 48 compared to diffusing the airflow toward the center of the internal space 48. However, the fan 54 may also generate airflow along the short walls 56U and 56L.

[0062] Furthermore, according to the above embodiment, by generating an airflow from the fan 54, which is positioned near the center in the vertical direction, toward the opposite side of the processor 49, it is possible to suppress the air generated by the fan 54 from hitting obstacles and diffusing. This allows for efficient convection of the air in the internal space 48.

[0063] Furthermore, according to the above embodiment, by reducing the density of components downstream of the airflow generated by the fan 54, it is possible to suppress the air generated by the fan 54 from hitting obstacles and diffusing. This allows for efficient convection of the air in the internal space 48.

[0064] The embodiments described above are illustrative for explaining the present invention and are not intended to limit the scope of the invention to those embodiments only. Those skilled in the art can implement the present invention in various other forms without departing from the spirit of the invention. [Explanation of symbols]

[0065] 10…Injection molding machine, 20…Clamping device, 21…Mold, 22…Fixed side mold, 23…Fixed die plate, 24…Movable side mold, 25…Movable die plate, 26…Toggle link mechanism, 27…Tie bar, 30…Injection device, 31…Heating cylinder, 32…Screw, 33…Hopper, 34…Hopper block, 35…Resin passage, 36…Nozzle, 40…Display input device, 41…Display panel, 42…Housing, 43…Display surface, 44…Operation buttons, 45…Front wall, 46…Side wall, 47…Rear wall, 48…Internal space, 49…Processor, 50…Heat sink, 51…Main board, 52…Touch panel control board, 53…Button control board, 54…Fan, 55L, 55R…Long wall, 56L, 56U…Short wall, 57…Base plate

Claims

1. Display panel and, A housing attached to the opposite side of the display panel from the display surface, A processor is located inside the enclosure and controls the display of the display panel. A display device characterized by comprising a fan arranged in the internal space for circulating the air in the internal space.

2. In the display device according to claim 1, The aforementioned enclosure is The front wall located on the opposite side of the display surface of the display panel, A frame-shaped side wall protruding from the outer periphery of the front wall toward the side opposite to the display panel, It comprises a rear wall connected to the protruding end of the side wall and closing the internal space, The display device is characterized in that the fan generates an airflow along the inner surface of the side wall.

3. In the display device according to claim 2, The aforementioned side wall is A long wall extending in the first direction, It extends in a second direction intersecting the first direction and comprises a short wall that is shorter than the long wall, The display device is characterized in that the fan generates an airflow along the inner surface of the long wall toward the first direction.

4. In the display device according to claim 3, The processor is positioned in the internal space, offset to one side from the center in the first direction. The display device is characterized in that the fan is located closer to the center in the first direction than the processor and generates an airflow directed away from the processor.

5. In the display device according to claim 4, The processor is positioned in the internal space, offset to one side from the center in the second direction. The display device is characterized in that the fan is positioned in the internal space, offset from the center in the second direction to the other side.

6. In the display device according to claim 5, The display device is characterized in that the fan generates an airflow in the first direction toward the side with a lower density of components housed in the internal space.

7. A mold clamping device that opens and closes the mold and clamps it, An injection device for injecting molding material into the cavity of the clamped mold, A molding machine characterized by comprising the display device described in claim 1.

Images