Sample holder

Abstract

This disclosure provides a sample holder capable of maintaining uniform heat distribution. [Solution] A sample holder according to one aspect of the present disclosure comprises a ceramic substrate, a heating element, a base plate, and a plurality of support members. The heating element is located on the ceramic substrate. The base plate is located opposite the ceramic substrate. The plurality of support members are located between the ceramic substrate and the base plate and support the ceramic substrate. The support members have a plurality of protrusions located opposite the ceramic substrate and contact the ceramic substrate at the plurality of protrusions.

Description

Technical Field

[0001] The present disclosure relates to a sample holder.

Background Art

[0002] Conventionally, in the semiconductor manufacturing process, a sample holder that heats a semiconductor wafer (hereinafter referred to as "wafer") to a predetermined temperature while holding it is known. Such a sample holder is used, for example, in a coater developer apparatus that performs a resist coating process and a development process.

[0003] Patent Document 1 discloses a sample holder including a ceramic body, a heating resistor located in the ceramic body, a base plate located opposite to the ceramic body, and a plurality of support members located between the base plate and the ceramic body to support the ceramic body.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In the above-described conventional technology, there is still room for further improvement in terms of improving the heat uniformity. Here, the "heat uniformity" refers to the uniformity of the in-plane temperature of the substrate on which the sample is placed.

[0006] Specifically, in the conventional technology described above, when heating a sample using a heating element, heat from the ceramic body escapes to the base plate via the support member, which may cause a relative decrease in the temperature of the ceramic body around the support member. In such cases, the uniformity of heating of the ceramic body decreases, which may prevent the sample from being heated evenly. In recent years, sample holders are sometimes required to be used at higher temperatures, but the effect of heat loss due to the support member, as described above, becomes more pronounced as the operating temperature increases.

[0007] This disclosure provides a sample holder capable of maintaining uniform heat distribution. [Means for solving the problem]

[0008] A sample holder according to one aspect of this disclosure comprises a ceramic substrate, a heating element, a base plate, and a plurality of support members. The heating element is located on the ceramic substrate. The base plate is located opposite the ceramic substrate. The plurality of support members are located between the ceramic substrate and the base plate and support the ceramic substrate. The support members have a plurality of protrusions located opposite the ceramic substrate, and the plurality of protrusions are in contact with the ceramic substrate. [Effects of the Invention]

[0009] According to this disclosure, a sample holder capable of maintaining uniform heat distribution can be provided. [Brief explanation of the drawing]

[0010] [Figure 1] Figure 1 is a cross-sectional view showing an example of the configuration of a sample holder according to the first embodiment. [Figure 2] Figure 2 is an enlarged cross-sectional view of region H1 shown in Figure 1. [Figure 3] Figure 3 is a plan view showing an example of the configuration of a support member according to the first embodiment. [Figure 4] Figure 4 is a plan view of the sample holder according to the first embodiment, viewed from above. [Figure 5]Figure 5 is a plan view showing an example of the configuration of a support member according to the second embodiment. [Figure 6] Figure 6 is a plan view showing an example of the configuration of a support member according to the third embodiment. [Figure 7] Figure 7 is a side view showing an example of the configuration of a support member according to the third embodiment. [Figure 8] Figure 8 is a plan view showing an example of the configuration of a support member according to the fourth embodiment. [Figure 9] Figure 9 is a plan view showing another example of the configuration of the support member according to the fourth embodiment. [Figure 10] Figure 10 is a plan view showing an example of the configuration of a support member according to the fifth embodiment. [Figure 11] Figure 11 is a perspective view showing an example of the configuration of a support member according to the sixth embodiment. [Figure 12] Figure 12 is a cross-sectional view showing an example of the configuration of a sample holder according to the seventh embodiment. [Figure 13] Figure 13 is a plan view of the sample holder according to the seventh embodiment, viewed from above. [Modes for carrying out the invention]

[0011] The embodiments for implementing the sample holder according to this disclosure (hereinafter referred to as "Embodiments") will be described in detail below with reference to the drawings. However, this disclosure is not limited by these embodiments. Furthermore, each embodiment can be combined as appropriate, provided that the processing content is not inconsistent. Also, the same parts are denoted by the same reference numerals in each of the following embodiments, and redundant descriptions are omitted.

[0012] Furthermore, in the embodiments described below, expressions such as "orthogonal" or "parallel" may be used, but these expressions do not require strict "orthogonal" or "parallel" alignment. In other words, each of the above expressions allows for deviations such as manufacturing accuracy and installation accuracy.

[0013] In addition, in each of the drawings referred to below, for the sake of easy understanding of the description, an orthogonal coordinate system may be shown that defines the X-axis direction, the Y-axis direction, and the Z-axis direction orthogonal to each other, with the Z-axis direction being the vertically upward direction.

[0014] <First Embodiment> First, the configuration of the sample holder 1 according to the first embodiment will be described with reference to FIG. 1. FIG. 1 is a cross-sectional view showing an example of the configuration of the sample holder 1 according to the first embodiment. Note that FIG. 1 corresponds to a cross-sectional view taken in the direction of the arrow I-I shown in FIG. 4 described later.

[0015] As shown in FIG. 1, the sample holder 1 includes a ceramic substrate 11, a heating resistor 12 (an example of a heating element, and a plurality of them can be confirmed in a cross-sectional view and they may be connected), a base plate 13, and a plurality of support members 14. The sample holder 1 may also include a fixing member 15, a conducting wire 19, and a plurality of heat insulating plates 20.

[0016] The ceramic substrate 11 may have, for example, a disk shape. The first surface 111 (here, the upper surface), which is one of the main surfaces of the ceramic substrate 11, is a surface on which a flat sample such as a semiconductor wafer, a liquid crystal substrate, or a circuit board is placed.

[0017] The ceramic substrate 11 may contain, for example, aluminum oxide (Al2O3), aluminum nitride (AlN), yttrium oxide (Y2O3), cordierite (2MgO·2Al2O3·5SiO2), silicon carbide (SiC), or silicon nitride (Si3N4) as a main component. The ceramic substrate 11 can be obtained, for example, by laminating and firing a plurality of green sheets.

[0018] Furthermore, conductive members may be located inside the ceramic substrate 11. For example, electrodes for electrostatic adsorption or high-frequency electrodes to which high-frequency power for plasma generation is applied may be located inside the ceramic substrate 11. Examples of metal materials that constitute the electrodes for electrostatic adsorption and high-frequency electrodes include tungsten, molybdenum, rhenium, their alloys, or platinum.

[0019] A heating resistor 12 is located on the second surface 112 (in this case, the bottom surface), which is the other main surface of the ceramic substrate 11. The heating resistor 12 may, for example, have a concentric circular shape in plan view. The heating resistor 12 is a component that generates heat when an electric current flows through it. The heating resistor 12 is provided to heat a sample placed on the first surface 111. The heating resistor 12 may have a linear pattern (meanda pattern) with multiple folded portions. The heating resistor 12 is connected to an external power supply via a conductor 19.

[0020] The heat-generating resistor 12 is composed of, for example, a metallic material. Examples of metallic materials that constitute the heat-generating resistor 12 include tungsten, molybdenum, rhenium, their alloys, or platinum. The heat-generating resistor 12 may also contain glass components such as oxides of silicon dioxide.

[0021] Furthermore, the position of the heating resistor 12 is not limited to the second surface 112 of the ceramic substrate 11. For example, the heating resistor 12 may be located inside the ceramic substrate 11.

[0022] The ceramic substrate 11 may have a plurality of slits 113 that penetrate the first surface 111 and the second surface 112 and extend along the radial direction of the ceramic substrate 11 (hereinafter referred to as the "first direction"). The slits 113 are located, for example, on the outer edge of the ceramic substrate 11. The slits 113 may be formed, for example, by cutting out the ceramic substrate 11 radially inward from the outer edge (see Figure 4). In other words, the ends of the slits 113 on the outer periphery side of the ceramic substrate 11 may be open. A fixing member 15, which will be described later, is inserted through the slits 113 along the Z-axis direction.

[0023] The base plate 13 may, for example, have a disc shape. The base plate 13 may be substantially the same shape as the ceramic substrate 11. Alternatively, the base plate 13 may have a larger diameter than the ceramic substrate 11. The base plate 13 is located below the ceramic substrate 11, away from the second surface 112 of the ceramic substrate 11. The base plate 13 has a third surface 131 (here, the top surface) located on the side of the ceramic substrate 11, and a fourth surface 132 (here, the bottom surface) located on the opposite side of the third surface 131.

[0024] The base plate 13 may have a plurality of through holes 133 and a plurality of through holes 134 that penetrate the third surface 131 and the fourth surface 132. The plurality of through holes 133 are located, for example, on the outer circumference of the base plate 13. Fixing members 15, which will be described later, are inserted through the plurality of through holes 133. The plurality of through holes 134 are located on the inner circumference of the base plate 13, in addition to the plurality of through holes 133. Conductors 19 are inserted through the through holes 134.

[0025] The base plate 13 may be made of metal, for example. As the metal material forming the base plate 13, for example, aluminum, stainless steel, titanium, or aluminum matrix composite materials such as AlSiC can be used.

[0026] The multiple support members 14 are positioned between the ceramic substrate 11 and the base plate 13. Specifically, the multiple support members 14 are positioned, for example, between a slit 113 located on the outer periphery of the ceramic substrate 11 and a through hole 133 located on the outer periphery of the base plate 13. The multiple support members 14 support the ceramic substrate 11 while keeping it separated from the base plate 13. The multiple support members 14 support the ceramic substrate 11 so that it is parallel to the base plate 13. The multiple support members 14 may be made of a metal such as stainless steel.

[0027] The support member 14 is, for example, a member having a substantially cylindrical shape. The support member 14 has a through hole 141 aligned in the vertical direction and a plurality of protrusions 142 positioned opposite the ceramic substrate 11. In other words, the plurality of protrusions 142 are located at the end of the support member 14 on the ceramic substrate 11 side. The support member 14 according to the first embodiment has, for example, two protrusions 142. Note that the general shape of the support member 14 is not limited to a cylindrical shape.

[0028] The support member 14 supports the ceramic substrate 11. The support member 14 contacts the ceramic substrate 11 at multiple protrusions 142. A fixing member 15, which will be described later, is inserted through the through hole 141. The detailed configuration of the support member 14 will be described later with reference to Figures 3 and 4.

[0029] With the support member 14 having the protrusion 142, the contact area between the support member 14 and the ceramic substrate 11 can be reduced compared to the case where the support member 14 does not have the protrusion 142, i.e., when the surface of the support member 14 facing the ceramic substrate 11 is a flat surface. As a result, heat is less likely to be transferred from the ceramic substrate 11 to the support member 14, and the temperature of the ceramic substrate 11 around the support member 14 does not decrease easily. Therefore, the uniformity of the heat distribution of the ceramic substrate 11 can be improved.

[0030] Furthermore, the support member 14 having protrusions 142 allows for the creation of air layers between the multiple protrusions 142. That is, an air layer can be created between the ceramic substrate 11 and the support member 14. Since the air layer functions as an insulating layer, this also makes it more difficult for heat to be transferred from the ceramic substrate 11 to the support member 14. Therefore, the uniformity of the heat distribution of the ceramic substrate 11 can be improved.

[0031] Multiple fixing members 15 fix the ceramic substrate 11 to the base plate 13. Each fixing member 15 comprises, for example, a head 151 that abuts against the first surface 111 of the ceramic substrate 11, and a shaft portion 152 that extends from the head 151 toward the base plate 13. Specifically, the head 151 abuts against the first surface 111 so as to cover at least a portion of the slit 113. The shaft portion 152 is connected to the contact surface of the head 151 with the first surface 111 and is inserted through the slit 113, the through hole 141, and the through hole 133. The tip of the shaft portion 152 may protrude from the through hole 133. The tip of the shaft portion 152 may have screw grooves on its outer circumferential surface. The fixing members 15 may be made of a metal such as stainless steel.

[0032] The sample holder 1 may also have a nut 16, a spring member 17, and a spring stopper 18. The nut 16, spring member 17, and spring stopper 18 are located on the fourth surface 132 side of the base plate 13 and are inserted through the shaft portion 152 of the fixing member 15. The nut 16, spring member 17, and spring stopper 18 are positioned in the order of spring member 17, spring stopper 18, and nut 16, in order of proximity to the fourth surface 132 of the base plate 13. The nut 16 is screwed into a threaded groove provided at the tip of the shaft portion 152. The spring member 17 biases the spring stopper 18 and nut 16 away from the fourth surface 132 of the base plate 13. In other words, the spring member 17 biases the base plate 13 towards the ceramic substrate 11. Furthermore, the biasing force of the spring member 17 presses the head 151 of the fixing member 15 against the first surface 111 of the ceramic substrate 11, thereby biasing the ceramic substrate 11 toward the base plate 13. As a result, the ceramic substrate 11 and the base plate 13 are integrally fixed together via the multiple support members 14.

[0033] The multiple heat shields 20 may, for example, have a disc shape with a smaller diameter than the ceramic substrate 11. The multiple heat shields 20 are located between the ceramic substrate 11 and the base plate 13. The multiple heat shields 20 are spaced apart from each other along the vertical direction. The multiple heat shields 20 may be spaced at equal intervals. The heat shields 20 may be made of, for example, metal. The multiple heat shields 20 may be fixed to the base plate 13 by, for example, a fixing mechanism (not shown).

[0034] The sample holder 1 according to the first embodiment may have, for example, two heat shields 20. Specifically, it may have a first heat shield 21 and a second heat shield 22. The number of heat shields 20 is not limited to two, but may be three or more.

[0035] The first heat shield 21 is positioned opposite the second surface 112 of the ceramic substrate 11. The first heat shield 21 has a fifth surface 211 that faces the second surface 112 and a sixth surface 212 that is located opposite the fifth surface 211. The first heat shield 21 has a plurality of first through holes 213 that penetrate the fifth surface 211 and the sixth surface 212. Conductors 19 may be inserted through the first through holes 213.

[0036] The first heat shield 21 reflects the heat radiated from the ceramic substrate 11 back towards the ceramic substrate 11 through its reflector effect. This reduces the heat dissipation from the ceramic substrate 11.

[0037] The second heat shield 22 is positioned opposite the sixth surface 212 of the first heat shield 21. The second heat shield 22 has a seventh surface 221 opposite the sixth surface 212 and an eighth surface 222 located opposite the seventh surface 221. The second heat shield 22 has a plurality of second through holes 223 that penetrate the seventh surface 221 and the eighth surface 222. The second through holes 223 may be positioned opposite the first through holes 213 of the first heat shield 21. Conductors 19 may be inserted through the second through holes 223.

[0038] The second heat shield 22 reflects heat radiated from the first heat shield 21 back towards the first heat shield 21 through its reflector effect. This reduces heat dissipation from the first heat shield 21, thereby improving the reflector effect of the first heat shield 21. Consequently, heat dissipation from the ceramic substrate 11 can be more effectively reduced.

[0039] An air layer is located between the first heat shield 21 and the second heat shield 22. This air layer functions as an insulating layer. As a result, heat dissipation from the ceramic substrate 11 to the base plate 13 can be reduced.

[0040] The first heat shield 21 and the second heat shield 22 may have the same shape.

[0041] One end of the conductor 19 is connected to the heating resistor 12, and the other end is connected to an external power supply. The conductor 19 may be made of metal. As described above, the conductor 19 is inserted through the first through hole 213 of the first heat shield 21, the second through hole 223 of the second heat shield 22, and the through hole 134 of the base plate 13. By supplying current to the heating resistor 12 from the external power supply via the conductor 19, the heating resistor 12 can be made to heat up.

[0042] Next, the configuration of the fixing member 15 according to the first embodiment will be described in more detail with reference to Figure 2. Figure 2 is an enlarged cross-sectional view of the region H1 shown in Figure 1.

[0043] As shown in Figure 2, the shaft portion 152 of the fixing member 15 may have a first portion 1521 and a second portion 1522. The first portion 1521 is inserted through the through hole 141 of the support member 14. The second portion 1522 is located between the head portion 151 of the fixing member 15 and the first portion 1521, and is inserted through the slit 113 of the ceramic substrate 11. The diameter of the second portion 1522 is smaller than the diameter of the first portion 1521.

[0044] A step 153 is located between the first portion 1521 and the second portion 1522, due to the difference in diameter between the first portion 1521 and the second portion 1522. The step 153 may be located on the base plate 13 side of the second surface 112 of the ceramic substrate 11. In other words, the step 153 may be located below the contact surface between the ceramic substrate 11 and the protrusion 142. With this configuration, the second portion 1522 is located between the multiple protrusions 142.

[0045] With the fixing member 15 having the first portion 1521 and the second portion 1522, the air layer formed between the multiple protrusions 142 can be made larger compared to the case where the diameter of the shaft portion 152 is constant with the diameter of the first portion 1521. As a result, heat from the ceramic substrate 11 is less likely to be transferred to the base plate 13, thereby improving the uniformity of the heat distribution of the ceramic substrate 11.

[0046] Next, the configuration of the support member 14 according to the first embodiment will be described in more detail with reference to Figures 3 and 4.

[0047] Figure 3 is a plan view showing an example of the configuration of the support member 14 according to the first embodiment. As shown in Figure 3, the support member 14 may have a first through groove 143 extending in a first direction (the X-axis direction in Figure 3) between a plurality of protrusions 142. In the first embodiment, the width of the first through groove 143 may be the same as, for example, the diameter of the through hole 141. Figure 3 is a diagram showing the configuration of the support member 14 located in region H2 in Figure 4, which will be described later.

[0048] Figure 4 is a plan view of the sample holder 1 according to the first embodiment, viewed from above. As shown in Figure 4, the support member 14 is positioned in correspondence with the slit 113 of the ceramic substrate 11. Specifically, the support member 14 is positioned such that the first through groove 143 overlaps with the slit 113. The width of the first through groove 143 may be the same as the width of the slit 113. However, it is not limited to this, and the width of the first through groove 143 may be greater than the width of the slit 113.

[0049] With this configuration, the air layer of the first through groove 143 is located directly beneath the air layer located inside the slit 113 of the ceramic substrate 11. This allows an air layer to be provided directly beneath the slit 113 over almost the entire area of ​​the slit 113. As a result, heat is less likely to be transferred from the ceramic substrate 11 to the support member 14, and the temperature around the support member 14 of the ceramic substrate 11 does not decrease easily. Therefore, the uniformity of the heat distribution of the ceramic substrate 11 can be improved.

[0050] Furthermore, with this configuration, even if the ceramic substrate 11 undergoes thermal expansion in the first direction, the slit 113 and the first through groove 143 both extend in the first direction and are positioned to overlap each other, making it less likely for the ceramic substrate 11 to be damaged.

[0051] In the first embodiment, the shape of the protrusion 142 in plan view is arc-shaped, but the shape of the protrusion 142 is not limited to this. For example, the shape of the protrusion 142 in plan view may be square or circular. Even in such cases, it is sufficient that the first through groove 143 is formed between the multiple protrusions 142.

[0052] Furthermore, although the number of protrusions 142 is two in the first embodiment, the number of protrusions 142 is not limited to this, and may be, for example, three or more. Even in such cases, it is sufficient that the first through groove 143 is formed between the multiple protrusions 142.

[0053] <Second Embodiment> Next, the configuration of the support member 14 according to the second embodiment will be described with reference to Figure 5. Figure 5 is a plan view showing an example of the configuration of the support member 14 according to the second embodiment. Note that Figure 5 shows the configuration of the support member 14 located in region H2 in Figure 4.

[0054] As shown in Figure 5, the support member 14 according to the second embodiment may further have a second through groove 144 extending in a second direction perpendicular to the first direction, i.e., in a direction relatively aligned with the circumferential direction of the ceramic substrate 11. In this case, the multiple protrusions 142 may be spaced apart from each other and arranged circumferentially.

[0055] With this configuration, an air layer can be positioned along the second direction directly beneath the slit 113 of the ceramic substrate 11. For example, the area of ​​the outer periphery of the ceramic substrate 11 where the support member 14 is not located is exposed to the surrounding air. If an air layer along the second direction is positioned directly beneath the slit 113, the area near the support member 14 can also be exposed to air in the same way as described above. Therefore, the temperature of the outer periphery of the ceramic substrate 11 can be made uniform.

[0056] Furthermore, with this configuration, the temperature of the ceramic substrate 11 in the vicinity of the support member 14 can be made uniform. Specifically, the difference between the temperature of the ceramic substrate 11 in the vicinity of the support member 14 in the first direction and the temperature of the ceramic substrate 11 in the vicinity of the support member 14 in the second direction can be reduced. Therefore, the temperature of the ceramic substrate 11 in the vicinity of the support member 14 can be made uniform.

[0057] In the support member 14 according to the second embodiment, the number of protrusions 142 and the shape of the protrusions 142 in plan view are not particularly limited. It is sufficient that a first through groove 143 and a second through groove 144 are formed between the multiple protrusions 142.

[0058] <Third Embodiment> Next, the configuration of the support member 14 according to the third embodiment will be described with reference to Figures 6 and 7. Figure 6 is a plan view showing an example of the configuration of the support member 14 according to the third embodiment. Figure 7 is a side view showing an example of the configuration of the support member 14 according to the third embodiment. Figures 6 and 7 show the configuration of the support member 14 located in region H2 in Figure 4.

[0059] As shown in Figures 6 and 7, in the third embodiment, the protrusion 142 may have a contact surface 1421 that contacts the ceramic substrate 11 and a side surface 1422 connected to the contact surface 1421. The corner located between the contact surface 1421 and the side surface 1422 may be rounded.

[0060] With this configuration, the stress on the protrusion 142 from the ceramic substrate 11 can be alleviated. In addition, since heat flow is less likely to concentrate at the corner, the uniform heating of the ceramic substrate 11 near the support member 14 can be easily maintained.

[0061] In the third embodiment, an example is shown where the support member 14 has a first through groove 143 and a second through groove 144, i.e., there are four protrusions 142. However, the number of protrusions 142 is not limited to four. There may be two protrusions 142, or three or more.

[0062] Furthermore, in the support member 14 according to the third embodiment, the number of protrusions 142 and the shape of the protrusions 142 in plan view are not particularly limited.

[0063] <Fourth Embodiment> Next, the configuration of the support member 14 according to the fourth embodiment will be described with reference to Figure 8. Figure 8 is a plan view showing an example of the configuration of the support member 14 according to the fourth embodiment. Note that Figure 8 shows the configuration of the support member 14 located in region H2 in Figure 4.

[0064] As shown in Figure 8, in the support member 14 according to the fourth embodiment, the multiple protrusions 142 may be located away from the edge of the opening of the through hole 141 in a plan view. In addition, even in the configuration shown in Figure 8, the corners located between the contact surface and the side surface may be rounded.

[0065] With this configuration, compared to the case where the multiple protrusions 142 are positioned to be in contact with the edge of the opening of the through hole 141 in a plan view, the air layer located in the region surrounded by the multiple protrusions 142 can be made larger. In other words, a larger air layer can be provided between the ceramic substrate 11 and the support member 14. Therefore, heat transfer from the ceramic substrate 11 to the support member 14 can be further reduced. Consequently, the uniformity of heat distribution in the ceramic substrate 11 can be further improved.

[0066] Figure 9 is a plan view showing another example of the configuration of the support member 14 according to the fourth embodiment. Figure 8 shows an example in which the protrusion 142 has a fan shape in plan view. However, as shown in Figure 9, the protrusion 142 may have, for example, an arc shape in plan view. Also, the corners located between the contact surface and the side surface may be rounded.

[0067] Thus, in the support member 14 according to the fourth embodiment, the shape of the protrusions 142 in plan view is not particularly limited. Furthermore, the number of protrusions 142 is also not particularly limited.

[0068] <Fifth Embodiment> Next, the configuration of the support member 14 according to the fifth embodiment will be described with reference to Figure 10. Figure 10 is a plan view showing an example of the configuration of the support member 14 according to the fifth embodiment. Note that Figure 10 shows the configuration of the support member 14 located in region H2 in Figure 4.

[0069] As shown in Figure 9, in the fifth embodiment, when the thickness of the support member 14 located far from the center of the ceramic substrate 11 along the radial direction of the ceramic substrate 11 is the first thickness (L1 in Figure 10), and the thickness of the support member 14 located near the center of the ceramic substrate 11 is the second thickness (L2 in Figure 10), the first thickness may be thinner than the second thickness.

[0070] In the fifth embodiment, the support member 14 has a smaller heat capacity on the outer circumference side of the ceramic substrate 11 than on the inner circumference side. Although heat dissipation from the support member 14 to the outside is more likely to occur on the outer circumference side of the ceramic substrate 11 than on the inner circumference side, the above configuration makes it possible to reduce the temperature difference between the outer circumference of the support member 14 located on the outer circumference side of the ceramic substrate 11 and the temperature of other parts of the support member 14. As a result, a decrease in temperature on the outer circumference side of the ceramic substrate 11 is less likely to occur, and the uniformity of the heat distribution of the ceramic substrate 11 can be further improved. In addition, even in the configuration shown in Figure 10, the corners located between the contact surface and the side surface may be rounded.

[0071] <Sixth Embodiment> Next, the configuration of the support member 14 according to the sixth embodiment will be described with reference to Figure 11. Figure 11 is a perspective view showing an example of the configuration of the support member 14 according to the sixth embodiment. Note that Figure 11 shows the configuration of the support member 14 located in region H2 in Figure 4.

[0072] As shown in Figure 11, in the sixth embodiment, the support member 14 may have a distance between two adjacent protrusions 142 (L3 in Figure 11) that is greater than the average height of the two adjacent protrusions 142 (L4 in Figure 11).

[0073] With this configuration, an air layer is easily maintained in the region surrounded by the multiple protrusions 142. For example, if the protrusions 142 are made too high, heat-induced convection may form in the region surrounded by the multiple protrusions 142, causing the air layer to be lost and reducing the heat insulation effect. The support member 14 according to the sixth embodiment can reduce the occurrence of the above convection, thereby further improving the uniformity of the heat of the ceramic substrate 11. In addition, even in the configuration shown in Figure 11, the corners located between the contact surface and the side surface may be rounded.

[0074] <Seventh Embodiment> Next, the configuration of the sample holder 1 according to the seventh embodiment will be described with reference to Figures 12 and 13. Figure 12 is a cross-sectional view showing an example of the configuration of the sample holder 1 according to the seventh embodiment. Figure 13 is a plan view of the sample holder 1 according to the seventh embodiment, viewed from above. Note that Figure 12 corresponds to the cross-sectional view taken along the line XII-XII shown in Figure 13.

[0075] In the first to sixth embodiments, the slit 113 had a so-called notched shape, with the outer edge of the ceramic substrate 11 open. On the other hand, as shown in Figures 12 and 13, the slit 113 in the seventh embodiment may have a closed outer edge. Even with this configuration, an air layer can be provided directly below the slit 113, thereby improving the uniformity of the heat distribution of the ceramic substrate 11.

[0076] Although the present disclosure has been described in detail above, this disclosure is not limited to the embodiments described above, and various modifications and improvements are possible without departing from the gist of this disclosure.

[0077] The embodiments disclosed herein should be considered in all respects as illustrative and not restrictive. Indeed, the embodiments described above can be embodied in a variety of forms. Furthermore, the embodiments described above may be omitted, replaced, or modified in various ways without departing from the scope and spirit of the appended claims.

[0078] Furthermore, this technology can also be configured as follows. (1) Ceramic substrate and A heating element located on the ceramic substrate, A base plate positioned opposite the ceramic substrate, A plurality of support members are located between the ceramic substrate and the base plate and support the ceramic substrate. Equipped with, The support member is a sample holder having a plurality of protrusions positioned opposite the ceramic substrate, and the plurality of protrusions contact the ceramic substrate. (2) The ceramic substrate is provided with a plurality of slits extending along a first direction which is the radial direction of the ceramic substrate, The sample holder according to (1), wherein the support member is positioned corresponding to the slit and has a first through groove along the first direction between the plurality of protrusions. (3) The sample holder according to (2), wherein the support member has a second through groove along a second direction perpendicular to the first direction. (4) The support member has a through hole having an opening surrounded by the plurality of protrusions, The sample holder according to any one of (1) to (3), wherein the plurality of protrusions are separated from the edge of the opening in a plan view. (5) The support member has a through hole having an opening surrounded by the plurality of protrusions, A sample holder according to any one of (1) to (4), wherein, in the radial direction of the ceramic substrate, the first thickness further from the center of the ceramic substrate is thinner than the second thickness closer to the center of the ceramic substrate. (6) The aforementioned multiple protrusions are spaced apart from each other and arranged circumferentially. The sample holder according to any one of (1) to (5), wherein the distance between two adjacent protrusions is greater than the average height of the two adjacent protrusions. (7) The aforementioned protrusion is, The contact surface that contacts the ceramic substrate, The side surface connected to the aforementioned contact surface Equipped with, The corner between the contact surface and the side surface is rounded, the sample holder according to any one of (1) to (6) above. (8) The base plate further comprises a plurality of fixing members for fixing the ceramic substrate, The aforementioned ceramic substrate is The first surface on which the sample is placed, The second surface is located opposite the first surface, A plurality of slits extending along a first direction which is the radial direction of the ceramic substrate and Equipped with, The support member has a through hole that opens at a position facing the ceramic substrate, The aforementioned fixing member is The head that is in contact with the first surface, A shaft portion is inserted through the slit and the through hole and extends from the head toward the base plate. Equipped with, The aforementioned shaft portion is A first portion inserted through the aforementioned through hole, A second portion is located between the head and the first portion, is inserted through the slit, and has a smaller diameter than the first portion. Includes, The sample holder according to any one of (1) to (7), wherein the step difference due to the difference in diameter between the first part and the second part is located on the base plate side of the second surface. [Explanation of Symbols]

[0079] 1. Sample holder 11 Ceramic substrate 12 Heat-generating resistor 13 Base Plate 14 Support Member 15 Fixing member 16 nuts 17 Spring component 18 Spring stopper 19 Conductor 20 Heat shield 21. First heat shield 22. Second heat shield 111 Page 1 112 Side 2 113 Slits 131 Page 3 132 Page 4 133, 134, 141 Through holes 142 Convex part 143 First through groove 144 Second through groove 151 Head 152 Shaft 153 steps 211 Page 5 212 Page 6 213 First through hole 221 Page 7 222 Page 8 223 Second through hole 1421 Contact surface 1422 Side view 1521 Part 1 1522 Part 2

Claims

1. Ceramic substrate and A heating element located on the ceramic substrate, A base plate positioned opposite the ceramic substrate, A plurality of support members are located between the ceramic substrate and the base plate and support the ceramic substrate. Equipped with, The support member is a sample holder having a plurality of protrusions positioned opposite the ceramic substrate, and the plurality of protrusions contact the ceramic substrate.

2. The ceramic substrate is provided with a plurality of slits extending along a first direction which is the radial direction of the ceramic substrate, The sample holder according to claim 1, wherein the support member is positioned corresponding to the slit and has a first through groove along the first direction between the plurality of protrusions.

3. The sample holder according to claim 2, wherein the support member has a second through groove along a second direction perpendicular to the first direction.

4. The support member has a through hole having an opening surrounded by the plurality of protrusions, The sample holder according to claim 1, wherein the plurality of protrusions are separated from the edge of the opening in a plan view.

5. The support member has a through hole having an opening surrounded by the plurality of protrusions, The sample holder according to claim 1, wherein, in the radial direction of the ceramic substrate, the first thickness further from the center of the ceramic substrate is thinner than the second thickness closer to the center of the ceramic substrate.

6. The aforementioned multiple protrusions are spaced apart from each other and arranged circumferentially. The sample holder according to claim 1, wherein the distance between two adjacent protrusions is greater than the average height of the two adjacent protrusions.

7. The aforementioned protrusion is, The contact surface that contacts the ceramic substrate, The side surface connected to the aforementioned contact surface Equipped with, The sample holder according to claim 1, wherein the corners between the contact surface and the side surface are rounded.

8. The base plate further comprises a plurality of fixing members for fixing the ceramic substrate, The aforementioned ceramic substrate is The first surface on which the sample is placed, The second surface is located opposite the first surface, A plurality of slits extending along a first direction which is the radial direction of the ceramic substrate and Equipped with, The support member has a through hole that opens at a position facing the ceramic substrate, The aforementioned fixing member is The head that is in contact with the first surface, A shaft portion is inserted through the slit and the through hole and extends from the head toward the base plate. Equipped with, The aforementioned shaft portion is A first portion inserted through the aforementioned through hole, A second portion is located between the head and the first portion, is inserted through the slit, and has a smaller diameter than the first portion. Includes, The sample holder according to claim 1, wherein the step difference due to the difference in diameter between the first portion and the second portion is located on the base plate side of the second surface.

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