Method and apparatus for preparing thin film samples

Abstract

Systems and methods are provided for improved thin film sample preparation solutions. A cutting device can be used to prepare the thin film sample. The cutting device can include one or more cutting elements configured to apply a uniform cut to the thin film sample sheet as the cutting device moves over the thin film sample sheet. A cutting base can be used to hold the thin film sample sheet in place as the cutting device moves to apply the cut. The cutting base can be configured for placement on top of the thin film sample sheet. The cutting base and cutting device can be integrated together or can be separate components. The one or more cutting elements can be rotating blades. The one or more cutting elements can be evenly spaced.

Description

[Technical Field]

[0001] [Priority Claim] This patent application claims priority to and the benefit of U.S. Provisional Patent Application No. 63 / 442,363, filed January 31, 2023. The above-identified applications are incorporated herein by reference in their entireties.

[0002] The present disclosure relates generally to thin film sample handling. More specifically, various embodiments of the present disclosure relate to methods and apparatus for preparing thin film samples.

[0003] Further limitations and disadvantages of conventional approaches will become apparent to those skilled in the art when comparing such approaches with certain aspects of the present method and system described in the remainder of this disclosure with reference to the drawings. Summary of the Invention

[0004] Aspects of the present disclosure relate to testing solutions and systems used in conjunction therewith. More particularly, various embodiments according to the present disclosure relate to methods and apparatus for preparing thin film samples substantially as illustrated by or described with reference to at least one of the drawings, and as more fully set forth in the claims.

[0005] These and other advantages, aspects and novel features of the present disclosure, together with details of illustrated embodiments thereof, will be more fully understood from the following description and drawings. [Brief explanation of the drawings]

[0006] [Figure 1] FIG. 1 illustrates an exemplary apparatus for preparing thin film samples.

[0007] [Figure 2]1A-1C show different views of an exemplary apparatus for preparing thin film samples.

[0008] [Figure 3] FIG. 1 is a side view of an exemplary apparatus for preparing thin film samples.

[0009] [Figure 4] FIG. 1 is a bottom view of an exemplary apparatus for preparing thin film samples.

[0010] [Figure 5] FIG. 1 illustrates the use of an exemplary apparatus for preparing thin film samples. DETAILED DESCRIPTION OF THE INVENTION

[0011] Various embodiments of the present disclosure relate to providing improved and optimized thin film sample handling solutions, particularly with respect to preparing thin film samples for use in materials testing systems. As used herein, "thin film sample" is not limited to thin film samples but can also include foils or other sheet-like objects that are thin enough to require careful handling, such as to avoid deformation or other damage to these samples during handling. Materials testing systems are used to measure physical properties, such as tensile strength or compressive strength, of material samples. In this regard, the use and handling of thin film samples requires special care, especially when testing the material properties of thin films. In particular, handling thin film samples involves a variety of particularly challenging movements, such as preparing such samples and inserting and aligning them into a materials testing system. These movements must be performed in a manner that does not damage or otherwise affect the quality of the thin film sample. However, various difficulties and problems can arise with these movements and conventional solutions related thereto. For example, conventional solutions for preparing thin film samples can cause damage or defects in the prepared sample. In this regard, edge condition is highly relevant to the quality of thin film samples. Therefore, it is highly desirable to obtain samples with as perfect an edge as possible. However, conventional solutions for preparing thin film samples are typically based on knives or blades (eg, guillotines), which are prone to edge defects.

[0012] Solutions according to the present disclosure overcome the limitations and drawbacks of conventional solutions, particularly through the use of preparation systems and related methods that ensure samples with defect-free edges, as may occur when using conventional solutions. In particular, in various exemplary implementations, devices according to the present disclosure may employ cutting elements that ensure uniform cuts along the length of the sample. For example, some exemplary implementations may employ a cutting device having one or more rotating blades (e.g., similar to a pizza cutter) configured to apply uniform cuts as the cutting device moves, for example, over the sample sheet. In various cases, such a cutting device may include multiple evenly spaced rotating blades to provide multiple parallel cuts as the device moves. Exemplary implementations are shown and described with reference to FIGS. 1-5.

[0013] An exemplary apparatus for preparing thin film samples is shown in Figure 1. An apparatus 100 (or parts thereof) that can be used to prepare thin film samples is shown in Figure 1. As shown in Figure 1, the apparatus 100 includes a cutting base 110 and a cutting device 120.

[0014] The apparatus 100 can be configured to facilitate the preparation of thin film samples in an improved manner, particularly with respect to cutting such thin film samples (e.g., from thin film sample sheets). In this regard, the cutting device 120 can be configured to apply a uniform cut along the entire length of the sample piece, thereby ensuring defects or problem-free edges that can result from conventional solutions. This can be done, for example, by incorporating one or more rotating blades into the cutting device 120 that move freely as the cutting device 120 moves. The cutting base 110 can be configured to engage with the cutting device 120 to facilitate movement of the cutting device 120 as it applies the cut. For example, the cutting base 110 can be configured as a rectangular device or component having a central opening in which the cutting device 120 can be positioned and moved. To this end, the cutting base 110 can have a flat bottom side / surface to facilitate placement on the sample sheet. Additionally, the upper (top) side of the cutting device 110 can be configured (e.g., cut) to incorporate track-like features to allow the cutting device 120 to move within an opening. In this regard, the track can be designed to extend beyond the bottom surface of the cutting base 110 just far enough for the rotating blade to apply the cut. Thus, the cutting base 110 is designed to keep the cut straight and parallel as the cutting device 120 moves over the thin film sample (sheet). Furthermore, the cutting base 110 ensures that the cutting device 120 is fixed in place relative to the sample sheet, further ensuring that the sample sheet is held flat and wrinkle-free during the cut. Additionally, the combination of the cutting device 120 and the cutting base 110 can be configured to control the depth of the cut. In this regard, the depth of the cut can be determined (e.g., based on the depth of the track of the cutting base 110).Alternatively, in some embodiments, the depth of the cut can be varied, for example, by configuring the cutting base 110 so that the depth of the track and / or the overall thickness of the cutting base 110 is adjustable, by configuring the cutting device 120 so that the positioning of the cutting blade is adjustable (e.g., perpendicular to the cutting plane), etc. Various features of the cutting device 120 and cutting base 110 are shown and described in more detail below.

[0015] Figure 2 shows an exemplary apparatus for preparing thin film samples from a different perspective, showing the apparatus 100 from a different angle and revealing more components and / or details of the cutting apparatus 120.

[0016] 2, the cutting device 120 includes a handle 130 that a user can use to hold the cutting device 120 and move it within the track on the upper side of the cutting base 110. Also shown are a number of rotating blades 140 incorporated into the cutting device 120 for effecting cuts on the sample.

[0017] 3 shows a side view of an exemplary apparatus for preparing thin film samples, showing the apparatus 100 from the bottom, revealing more components and / or details of the cutting apparatus 120 and cutting base 110.

[0018] As shown in FIG. 3, the cutting base 110 has a flat bottom side / surface, allowing the cutting base 110 to be placed flat, for example, on a thin film sample. Also clearly shown in FIG. 3 is the rotating blade 140. In this regard, the rotating blade 140 is mounted on a bearing / shaft 150, which can be configured to allow free relative rotation of the rotating blade 140 as the cutting device moves within a track on the upper side of the cutting base 110. Although not shown, the cutting device 120 can incorporate additional components (e.g., springs, etc.) to maintain the positioning of the rotating blades 140, for example, the spacing between the rotating blades 140, the height of the rotating blades 140, etc.

[0019] Figure 4 shows a bottom view of an exemplary apparatus for preparing thin film samples, showing the apparatus 100 from the side and revealing more components and / or details of the cutting apparatus 120 and cutting base 110.

[0020] As shown in FIG. 4, the cutting base 110 has a flat bottom side / surface, allowing the cutting base 110 to be placed flat, for example, on a thin film sample. Also clearly shown in FIG. 3 is the rotating blade 140. In this regard, the rotating blade 140 is mounted on a bearing / shaft 150, which can be configured to allow free relative rotation of the rotating blade 140 as the cutting device moves within a track on the upper side of the cutting base 110. Although not shown, the cutting device 120 can incorporate additional components (e.g., springs, etc.) to maintain the positioning of the rotating blades 140, for example, the spacing between the rotating blades 140, the height of the rotating blades 140, etc.

[0021] Figure 5 illustrates the use of an exemplary apparatus for preparing thin film samples. Figure 5 shows the apparatus 100 and one exemplary use case scenario associated therewith.

[0022] In this regard, in the exemplary use case scenario shown in FIG. 5 , the thin film sample sheet 160 is first placed or laid flat (e.g., on a suitable flat surface). The cutting base 110 is then placed on top of the thin film sample sheet 160, and pressure is applied to the sheet by the bottom side / surface of the cutting base 110 to prevent the sheet from moving or otherwise changing shape as it is being cut. Thereafter, if the cutting device 120 is detached from the cutting base 110, the cutting device 120 can be placed in a track on the top side of the cutting base 110. The cutting device 120 can then be moved in the track such that the cutting blade 140 applies cuts (or cut lines) 170 to the thin film sample sheet 160, thus creating a plurality of thin film sample strips.

[0023] Optionally, excess portions of the thin film sample sheet 160 can be cut off (or alternatively, if enough sheet remains, the cutting base 110 can be moved up and more thin film sample strips can be made using the cutting device 120).

[0024] One exemplary apparatus for preparing a thin film sample, according to the present disclosure, includes a cutting device configured to cut the thin film sample, the cutting device including one or more cutting elements configured to apply a uniform cut to the thin film sample sheet as the cutting device moves over the thin film sample sheet.

[0025] In one exemplary embodiment, the apparatus further comprises a cutting base configured for placement on top of the thin film sample sheet, the cutting base configured to maintain the thin film sample sheet as the cutting apparatus moves to apply the cut.

[0026] In one exemplary embodiment, the cutting base includes a track that allows movement of the cutting device while applying the cut.

[0027] In one exemplary embodiment, the cutting base and cutting device are separate components.

[0028] In one exemplary embodiment, the cutting base and cutting device are integrated together.

[0029] In one exemplary embodiment, the cutting device includes a handle for moving the cutting device when applying the cut.

[0030] In one exemplary embodiment, the one or more cutting elements include a rotating blade.

[0031] In one exemplary embodiment, the one or more cutting elements are evenly spaced apart.

[0032] One exemplary method of preparing a thin film sample, according to the present disclosure, includes engaging a thin film sample sheet with a cutting device, the cutting device having one or more cutting elements configured to apply uniform cuts to the thin film sample sheet as the cutting device moves over the thin film sample sheet, and operating the cutting device to create a plurality of thin film sample strips from the thin film sample.

[0033] In one exemplary embodiment, the method further includes securing a cutting device onto the thin film sample sheet while applying the uniform cut.

[0034] In one exemplary embodiment, the method further includes using a cutting base configured for placement on an upper surface of the thin film sample sheet to secure the cutting device onto the thin film sample sheet, the cutting base configured to maintain the thin film sample sheet as the cutting device moves to apply the cut.

[0035] In one exemplary embodiment, the securing includes placing a cutting base on top of the thin film sample sheet.

[0036] In one exemplary embodiment, the cutting base and the cutting device are separate components, and the method further includes engaging the cutting base and the cutting device after placing the cutting base on top of the thin film sample sheet.

[0037] In one exemplary embodiment, the cutting base and cutting device are integrated together into a single device, and the securing includes placing the single device on top of the thin film sample sheet.

[0038] In one exemplary embodiment, the cutting device includes a handle for moving the cutting device when applying the cut, and operating the cutting device includes using the handle to move the cutting device over the thin film sample sheet.

[0039] In one exemplary embodiment, the uniform cuts are equally spaced.

[0040] As used herein, "and / or" means any one or more of the items in the list connected by "and / or." As an example, "x and / or y" means any element of the three-element set {(x), (y), (x, y)}. In other words, "x and / or y" means "one or both of x and y." As another example, "x, y and / or z" means any element of the seven-element set {(x), (y), (z), (x, y), (x, z), (y, z), (x, y, z)}. In other words, "x, y and / or z" means "one or more of x, y and z." As used herein, the term "exemplary" means serving as a non-limiting example, instance, or illustration. As used herein, the term "for example" begins a list of one or more non-limiting examples, instances, or illustrations.

[0041] As used herein, the terms “circuit” and “circuitry” refer to physical electronic components (e.g., hardware) and any software and / or firmware (“code”) that can comprise, be executed by, and / or be otherwise associated with the hardware. For example, as used herein, a particular processor and memory (e.g., a volatile or non-volatile memory device, a general-purpose computer-readable medium, etc.) can comprise a first “circuit” when executing a first one or more lines of code, and a second “circuit” when executing a second one or more lines of code. Furthermore, a circuit can include analog and / or digital circuitry. Such circuitry can, for example, operate on analog and / or digital signals. It should be understood that a circuit can be within a single device or chip, on a single motherboard, in a single chassis, in multiple enclosures in a single geographic location, in multiple enclosures distributed across multiple geographic locations, etc. Similarly, the term "module" can refer, for example, to a physical electronic component (e.g., hardware) and any software and / or firmware ("code") that can comprise, be executed by, and / or be otherwise associated with the hardware.

[0042] As used herein, a circuitry or module is "operable" to perform a function whenever it contains the necessary hardware and code (if either is necessary) to perform that function, regardless of whether performance of that function is disabled or not enabled (e.g., by a user-configurable setting, factory trim, etc.).

[0043] Other embodiments of the present disclosure may provide a non-transitory computer-readable medium and / or storage medium having machine code and / or a computer program stored thereon, the machine code and / or the computer program having at least one code section executable by a machine and / or computer, thereby causing the machine and / or computer to perform the processes described herein.

[0044] Accordingly, various embodiments of the present disclosure can be implemented in hardware, software, or a combination of hardware and software. The present disclosure can be implemented in a centralized fashion in at least one computing system, or in a distributed fashion where different elements are spread across several interconnected computing systems. Any type of computing system or other device adapted to perform the methods described herein is suitable. A typical combination of hardware and software can be a general-purpose computing system with programs or other code that, when loaded and executed, controls the computing system to perform the methods described herein. Another typical implementation can include application-specific integrated circuits or chips.

[0045] Various embodiments of the present disclosure may also be embedded in a computer program product that includes all features that enable the implementation of the methods described herein and that is capable of executing these methods when loaded into a computer system. A computer program in this context means any expression of a set of instructions in any language, code, or notation that is intended to cause a computer-capable system to perform a specific function, either directly or after one or both of the following: a) conversion into another language, code, or notation; b) reproduction in a different material form.

[0046] While the present disclosure has been described with reference to certain specific embodiments, those skilled in the art will recognize that various changes can be made and equivalents substituted without departing from the scope of the present disclosure. For example, blocks and / or components of the disclosed examples can be combined, divided, rearranged, and / or otherwise modified. In addition, many modifications can be made to adapt a particular situation or material to the teachings of the present disclosure without departing from the scope of the present disclosure. Therefore, the present disclosure is not limited to the particular embodiments disclosed; rather, the present disclosure is intended to include all embodiments falling within the scope of the appended claims.

Claims

1. 1. An apparatus for preparing a plurality of thin film samples, comprising: Cutting apparatus configured to cut a plurality of thin film samples Equipped with the cutting device comprises one or more cutting elements configured to apply a plurality of uniform cuts to the thin film sample sheet as the cutting device moves over the thin film sample sheet. Device.

2. 10. The apparatus of claim 1, further comprising a cutting base configured for placement on top of the thin film sample sheet, the cutting base configured to maintain the thin film sample sheet as the cutting device moves to apply the cut.

3. The device of claim 2 , wherein the cutting base comprises a track that allows movement of the cutting device while applying the cut.

4. The device of claim 2 , wherein the cutting base and the cutting device are separate components.

5. The device of claim 2 , wherein the cutting base and the cutting device are integrated together.

6. 10. The device of claim 1, wherein the cutting device comprises a handle for moving the cutting device when applying the cut.

7. The device of claim 1 , wherein the one or more cutting elements include a plurality of rotating blades.

8. The device of claim 1 , wherein the one or more cutting elements are equally spaced apart.

9. 1. A method for preparing a thin film sample, comprising: engaging a thin film sample sheet with a cutting device; the cutting device comprises one or more cutting elements configured to apply a plurality of uniform cuts to the thin film sample sheet as the cutting device moves over the thin film sample sheet. engaging the thin film sample sheet with a cutting device; operating the cutting device to create a plurality of thin film sample strips from the thin film sample; A method comprising:

10. 10. The method of claim 9, further comprising securing the cutting device onto the thin film sample sheet while applying the uniform plurality of cuts.

11. 11. The method of claim 10, further comprising using a cutting base configured for placement on top of the thin film sample sheet to secure the cutting device onto the thin film sample sheet, the cutting base configured to maintain the thin film sample sheet as the cutting device moves to apply the cut.

12. The method of claim 11 , wherein said securing comprises placing said cutting base on top of said thin film sample sheet.

13. 12. The method of claim 11, wherein the cutting base and the cutting device are separate components, the method further comprising engaging the cutting base and the cutting device after placement of the cutting base on top of the thin film sample sheet.

14. 12. The method of claim 11, wherein the cutting base and the cutting device are integrated together into a single device, and the securing comprises placing the single device on top of the thin film sample sheet.

15. 10. The method of claim 9, wherein the cutting device includes a handle for moving the cutting device when applying the cut, and operating the cutting device includes using the handle to move the cutting device over the thin film sample sheet.

16. The method of claim 1 , wherein the uniform cuts are equally spaced.

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