Apparatus and method for processing a substrate in an evacuated processing chamber - Patents.com

Abstract

An apparatus and method for processing, in particular nanoembossing, a substrate (13) in a localized and fluid-tight processing chamber (14).

Description

[Technical Field]

[0001] The present invention relates to a method and apparatus for processing a substrate, and in particular to a method and apparatus for embossing, in particular nanoembossing, a substrate with improved alignment.

[0002] In the prior art, in some processing methods, it is advantageous to process substrates in a vacuum. For this purpose, in many cases, the entire device or at least the corresponding module must be evacuated. In this case, particularly a long evacuation process is disadvantageous, because frequent and long evacuation reduces productivity. In this case, processing substrates in a vacuum is often necessary to prevent embossing defects, especially air inclusions.

[0003] In this case, the invention relates in particular to a method and an apparatus for UV-NIL embossing, in which a pattern, in particular a nanopattern, can be formed by means of a soft nanopattern stamp, in particular a flexible sheet stamp.

[0004] Nanoimprint lithography (NIL) is a transfer method in which micro- and / or nanopatterns are transferred by a stamp into a curable material, such as a resist, allowing the transfer of a large number of nanopattern systems.

[0005] In principle, there is a difference between thermal NIL (hot embossed NIL) and UV-based NIL. In UV-NIL, a stamp is pressed into a flowable resist at room temperature. This completely fills the intermediate chambers of the stamp by capillary action due to the viscosity of the photoresist material. UV resist crosslinks upon exposure to UV radiation to form a stable polymer (harden).

[0006] Patterning with soft polymer stamps has several advantages over hard stamps, due to the easy fabrication of the stamps, the efficient embossing process, the very good surface properties of the respective stamp material, low cost, the reproducibility of the embossed product, and the possibility of elastic deformation of the stamp, especially during demolding.

[0007] The fabrication of high-precision nanopatterns on large surfaces can be carried out by the vacuum-free roll-to-roll method (SmartNIL). WO 2014 / 037044 describes a method and an apparatus in which a micro- and / or nanopattern stamp, in particular a flexible formed sheet stamp, and a frame are used. Furthermore, according to WO 2014 / 037044, the pattern must be pressed from the sheet stamp into the embossing material by an embossing element, in particular a rigid embossing roll.

[0008] In WO 2015 / 161868, a preload is applied to the nanopatterned stamp prior to contact. This preload is achieved by deformation of the nanopatterned stamp by a deformation means. This leads to positional errors as well as further embossing defects that deteriorate the embossing results.

[0009] The apparatus according to WO 2015 / 161868 may also be operated in a vacuum, in which case the entire apparatus must be evacuated, in which case the embossing stamp is not a flexible soft sheet stamp but a hard polymer stamp stretched on a sheet frame.

[0010] It is therefore an object of the present invention to at least partially obviate, in particular completely obviate, the drawbacks described in the prior art, and in particular to provide an improved method and device for processing, in particular embossing, substrates.

[0011] This problem is solved by the features of the independent claims. Advantageous refinements of the invention are set forth in the dependent claims. All combinations of at least two features set forth in the description, claims and / or drawings are also within the scope of the invention. In the stated ranges, values ​​lying within the stated limits are also considered as disclosed limits and can be claimed in any combination.

[0012] Therefore, the present invention relates to a method for processing a substrate, in particular for nanoembossing, comprising at least the steps of: a) providing a substrate holding mechanism for holding a substrate; b) providing a mechanism for processing the substrate; c) forming a localized and fluid-tight processing chamber between the substrate holding mechanism and the mechanism; d) evacuating the processing chamber; and e) processing the substrate, wherein the evacuation in step d) is performed after the formation of the processing chamber in step c).

[0013] In this case, instead of a substrate, a substrate stack can be processed. Although the methods and devices are described below in relation to a substrate, a substrate stack can also be processed accordingly. Processing can also include double-sided processing of the substrate, in which case a multi- or triple-stack assembly (English: triple stack) is used. This allows, for example, both sides of the substrate to be embossed.

[0014] Therefore, advantageously, a processing chamber can be formed that is significantly smaller than the local or surrounding chamber of the device. In this case, the processing chamber is at least partially formed or sealed by the mechanism and the substrate holding mechanism. In other words, a spatially separated processing chamber can be formed to surround the substrate. The processing chamber can be evacuated particularly quickly and efficiently due to its small volume.

[0015] The evacuation is performed by an evacuation means disposed on the substrate holding mechanism and / or the mechanism, whereby the process chamber can be evacuated after formation, in which case the substrate is disposed inside the process chamber, in which case processing occurs within the process chamber, in which case the process chamber is at least partially evacuated.

[0016] In a preferred embodiment of the method for processing, it is specified that the formation of the processing chamber is performed by bringing the substrate holding mechanism and the mechanism into close proximity, and that prior to this approach, the mechanism and the substrate holding mechanism are aligned with each other.

[0017] In this case, during alignment and / or approach, the substrate holding mechanism and the mechanism are aligned with each other in a way that allows for optimal processing and optimal processing results. Accurate alignment is required, especially for stamping or bonding processes. By aligning the substrate holding mechanism and the mechanism with each other, the substrate can also advantageously be aligned or positioned accurately.

[0018] The substrate is fixed to the substrate holding mechanism, preferably by a fixing element. In this case, the approach and alignment are preferably performed by an actuator or other means for alignment or approach. The alignment and approach in step c) may be performed in a different order. In this case, it is possible to first align and then approach the substrate holding mechanism to the mechanism. After the approach and formation of the processing chamber, additional alignment of the substrate or processing means may be performed. It is also possible to perform the approach and alignment in parallel.

[0019] The proximity of the substrate holding mechanism and the mechanism provides a localized, fluid-tight process chamber surrounding the substrate. This process chamber is evacuable and is at least partially defined between both holding mechanisms. In this case, the process chamber may preferably be partially defined by a seal attached to the substrate holding mechanism. In this case, the substrate holding mechanism or part of the mechanism, respectively, may form the seal. Preferably, a sealing ring is used to seal or define the process chamber.

[0020] By carrying out the alignment and approach before evacuation, it is possible to advantageously carry out local evacuation afterwards, in which case misalignment is avoided. Furthermore, it is advantageous that only the local processing chamber needs to be evacuated. Therefore, evacuation of the device or all modules is not necessary. This allows particularly fast and efficient processing of substrates.

[0021] In a preferred embodiment of the method for processing, it is specified that the formation of the processing chamber is carried out by a controllable sealing means.In other words, no access is made to form the processing chamber, and the processing chamber is sealed by a sealing means.In this case, the substrate can be loaded, for example, from the side, which allows the structural form of the device to be designed particularly small.Therefore, advantageously, only a small chamber needs to be evacuated, which can shorten the processing time.

[0022] In a preferred embodiment of the processing method, the mechanism includes a flexible sheet stamp for processing, in particular for stamping, the substrate. When processing the substrate, a fluid-tight pressure chamber between the mechanism and the sheet stamp is pressurized to bend the sheet stamp, and the processing chamber and the pressure chamber are fluidically separated from each other by the sheet stamp. In other words, two different pressure zones are formed in the device, fluidically separated from each other by the sheet stamp, so that the sheet stamp can be deformed appropriately for stamping and release by a pressure difference. In this case, the pressure chamber is pressurized with a fluid by a pressure means, which may also be formed as an exhaust means, thereby bending or deflecting the sheet stamp toward the substrate. The stamping force and deformation of the sheet stamp can be advantageously adjusted by the pressure difference. Furthermore, release after processing or stamping can advantageously be gentle or assisted by reducing the pressure difference. In this case, the pressure in the processing chamber can be adapted accordingly.

[0023] In this case, the pressure chamber is at least partially formed only by applying pressure with a fluid through the pressure means, since the sheet stamp is in direct contact with a section of the mechanism and / or the seat frame. However, it is also possible that a portion of the pressure chamber is already formed based on the structure of the seat frame or the mechanism, and that this pressure chamber is further enlarged by applying pressure. In this case, the sheet stamp seals the pressure chamber from the processing chamber. This allows for particularly gentle, defect-free embossing, especially nano-embossing.

[0024] A preferred embodiment of the processing method specifies that for processing, in particular for embossing, the pressure difference between the pressure in the processing chamber and the pressure in the pressurizing chamber is adjusted to 0-800 mbar, preferably 100-600 mbar, more preferably 200-600 mbar. In other words, the pressures formed in the processing chamber and the pressure in the pressurizing chamber are adjusted so that the desired embossing force and deformation of the sheet stamp are achieved. In this case, the pressure difference in the aforementioned range has proven particularly advantageous during tests.

[0025] A preferred embodiment of the processing method specifies aligning the substrate relative to the processing means of the mechanism in the formed processing chamber. The processing means can be, for example, a stamping means, a bonding means, a peeling means, or other processing means, in which accurate relative alignment with the substrate is advantageous. By aligning the substrate relative to the processing means of the mechanism during alignment, particularly accurate alignment before evacuation is possible. In this case, indirect alignment of the substrate relative to the processing means is also possible by aligning the substrate holding mechanism or mechanism, in which case alignment marks are preferably used.

[0026] In a preferred embodiment of the processing method, it is specified that the alignment of the substrate is carried out at standard pressure. In other words, evacuation is carried out only after the substrate has been aligned and the processing chamber has been formed. In this case, standard pressure refers to the pressure that exists in the apparatus under normal circumstances. When the substrate is loaded into the apparatus at ambient pressure, atmospheric pressure is particularly present. In this case, the approach also takes place under standard pressure. In this way, the processing method can be carried out particularly efficiently. Furthermore, alignment can be carried out particularly accurately at standard pressure.

[0027] A preferred embodiment of the method for processing specifies that the substrate is released during processing in step e), in which case the substrate can freely interact with the processing means during processing in the evacuated processing chamber, thereby achieving particularly good processing results, for example during embossing processes.

[0028] In a preferred embodiment of the method for processing, it is specified that the processing in step e) includes a complete contact of the substrate with the sheet stamp.Therefore, the substrate is embossed by the embossing stamp or is brought into contact with the embossing stamp in an evacuated processing chamber.For example, a resist in a pattern, preferably a nanopattern, previously applied to the embossing stamp can be retained on the substrate, or a specific pattern can be embossed into the substrate.In this case, the embossing stamp is flexible and can be particularly freely applied to the substrate, which allows embossing to be particularly accurate and free in an evacuated processing chamber.In this case, the substrate and the embossing stamp are in complete contact with each other, so that embossing can be performed over the entire surface.

[0029] A preferred embodiment of the processing method specifies that the sheet stamp is at least partially released after complete contact with the substrate during processing in step e), thereby allowing the sheet stamp to relax relative to the substrate. Therefore, in a locally evacuated processing chamber, the flexible sheet stamp is at least partially moved or displaced after complete contact, thereby allowing particularly free relaxation of the sheet stamp relative to the substrate. For this purpose, the sheet stamp is preferably deformed or released by a pressure means. In this case, the pressure means is preferably arranged on the back side of the sheet stamp, facing away from the substrate, so that, during pressurization with a fluid, a slight positive pressure is generated compared to the pressure normally present in the evacuated processing chamber, thereby releasing the sheet stamp from the holding surface. In this case, the sheet stamp does not need to be in contact with the sheet holding mechanism. Preferably, the pressure means does not vent the entire processing area, but rather generates a small positive pressure only in the back area of ​​the sheet stamp to release the sheet stamp. This allows particularly precise and gentle embossing to be performed in the processing chamber. In this embodiment of the method for processing and embossing, two pressure zones are present, which are separated by a sheet stamp. In this case, the processing chamber is fluidically separated from the rest of the processing chamber in the area behind the sheet stamp, in particular by the sheet stamp itself. The first pressure zone is defined by the configuration of the processing chamber, which may be evacuated. The second pressure zone is located in the area behind the sheet stamp (pressure zone). This second pressure zone may be vented by a pressure means.

[0030] In a preferred embodiment of the processing method, it is specified that the sheet frame for mounting the sheet stamp continues to be fixed to the mechanism. The sheet stamp is preferably fixed or tensioned on or in contact with the sheet frame. Thus, the sheet frame can be fixed to the sheet holding mechanism independently of the sheet stamp and can advantageously remain fixed when released or pressed. In this way, the sheet stamp remains fixed to the frame in a suitable embossing position, and in this case, the sheet stamp can nevertheless be particularly well pressed against the substrate. In other words, the sheet stamp can be particularly well relaxed relative to the substrate when the frame is further fixed.

[0031] In a preferred embodiment of the processing method, the pressure means additionally increases the pressure in the pressure chamber during processing, thereby adjusting the embossing force for embossing the substrate. In this case, it is particularly preferred to keep the pressure in the processing chamber constant. This allows the sheet stamp to contact or emboss the substrate particularly evenly and gently. Thus, the sheet stamp can be relaxed relative to the substrate. During the embossing process, the filling of the sheet stamp into the pattern by capillary forces is additionally assisted by a (slight) positive pressure on the back side of the pressure chamber.

[0032] In a preferred embodiment of the method for processing, it is specified that the pressure difference between the pressure in the processing chamber and the pressure in the pressure chamber is used to release the sheet stamp from the substrate. In this case, the pressure in the processing chamber is preferably kept constant. In other words, by reducing or venting the pressure in the pressure chamber, the sheet stamp can advantageously be pulled back from the embossing material.

[0033] In a preferred embodiment of the processing method, the device is configured to automatically control embossing and demolding by adjusting the pressure of the processing chamber and the pressure of the pressurizing chamber. The pressure difference between the two pressure zones is used during embossing and demolding to generate an external force acting on the sheet stamp.

[0034] The present invention further relates to an apparatus for processing a substrate, comprising at least: i) a substrate holding mechanism for holding a substrate; ii) a mechanism for processing the substrate; iii) a means for forming a localized, fluid-tight processing chamber between the substrate holding mechanism and the mechanism; vi) an exhaust means for evacuating the processing chamber; and v) a processing means for processing the substrate.

[0035] The aforementioned advantages and features of the method for processing a substrate apply correspondingly to the apparatus, which is preferably configured in such a way that evacuation of the formable processing chamber by the evacuation means can only be carried out after alignment, in which case the processing chamber is at least partially, preferably completely, arranged between the substrate holding mechanism and the mechanism.

[0036] The processing means may be at least partially arranged in the processing chamber or may act on the substrate in the processing chamber. In this case, the processing chamber is evacuated during processing. The processing means may in particular be a stamping means, a bonding or peeling means, a laser processing means or other means. Furthermore, the processing means may at least partially form a sealing means. In this way, particularly efficient processing of the substrate in the processing chamber is possible.

[0037] In this case, the device is preferably configured so that the substrate can be released, thus allowing particularly precise alignment and processing of the substrate in the processing chamber, and is therefore envisaged for efficient and precise processing of substrates or substrate stacks in a vacuum, in particular for nanoembossing the substrates.

[0038] In a preferred embodiment of the device for processing substrates, it is specified that the means is an approaching means for bringing the substrate holding mechanism and the mechanism closer together. In other words, the relative movement of the mechanism and / or the substrate holding mechanism advantageously quickly and directly forms a processing chamber. In this way, advantageously, a local processing chamber can be formed between both components.

[0039] In a preferred embodiment of the apparatus for processing a substrate, the apparatus additionally comprises an alignment means for aligning the substrate holding mechanism and the mechanism with respect to each other, and the alignment means is configured so that the substrate holding mechanism and the mechanism can be aligned with each other prior to and / or during the operation of the access means. In this case, alignment may include position adjustment. In this way, the processing chamber can be accurately formed. Furthermore, alignment of the substrate with respect to the processing means may advantageously be performed simultaneously by the alignment means. Precision alignment of the substrate after the formation of the processing chamber may additionally be performed as necessary.

[0040] In this case, during alignment and / or approach, the substrate holding mechanism and the mechanism are aligned with each other in a way that allows for optimal processing and optimal processing results. Accurate alignment is required, especially for stamping or bonding processes. By aligning the substrate holding mechanism and the mechanism with each other, the substrate can also advantageously be aligned or positioned accurately.

[0041] The substrate is fixed to the substrate holding mechanism, preferably by a fixing element. In this case, the approach and alignment are performed, for example, by an actuator. The alignment and approach may be performed in a different order. It is also possible to first align the substrate holding mechanism and then approach the mechanism. After the approach and the formation of the processing chamber, additional alignment may be performed. It is also possible to perform the approach and alignment in parallel.

[0042] The proximity of the substrate holding mechanism and the mechanism provides a localized, fluid-tight processing chamber surrounding the substrate. This processing chamber is evacuable and is at least partially formed between both holding mechanisms. In this case, the processing chamber may be formed by a seal attached to at least the substrate holding mechanism. In this case, the substrate holding mechanism or a part of the mechanism, respectively, may form the seal. Preferably, a sealing ring is used to seal or form the processing chamber. If a seal is formed between the substrate holding mechanism and the mechanism, the sealing elements preferably correspond to each other.

[0043] By carrying out the alignment and approach before evacuation, it is possible to advantageously carry out evacuation afterwards, in which case misalignment is avoided. Furthermore, it is advantageous that only a local processing chamber needs to be evacuated. Therefore, evacuation of the device or all modules is not necessary. This allows for particularly fast and efficient processing of substrates.

[0044] In a preferred embodiment of the apparatus for processing a substrate, it is specified that the substrate holding mechanism and the mechanism have corresponding sealing means, and the access means are configured so that, after the action of the access means, the corresponding sealing means form a processing chamber between the substrate holding mechanism and the mechanism. In other words, part of the processing chamber is formed by the sealing means. In this case, the sealing means may be configured so that they can be engaged with each other internally and externally at multiple points, for example, so that the substrate can be advantageously aligned with the processing means simultaneously. Therefore, the processing chamber can be advantageously formed at different positions on the mechanism and the substrate holding mechanism.

[0045] In a preferred embodiment of the apparatus for processing a substrate, the means is specified to be a controllable sealing means for forming a processing chamber between the substrate holding mechanism and the mechanism. Therefore, there is no direct approach between the mechanism and the substrate holding mechanism. Rather, the sealing means seals the chamber between the mechanism and the substrate holding mechanism, thus forming the processing chamber. In this way, the processing chamber can be advantageously formed quickly and efficiently. Furthermore, the alignment of the substrate holding mechanism and the mechanism with respect to each other may be omitted or may be performed in advance.

[0046] In a preferred embodiment of the apparatus for processing substrates, it is specified that the substrate holding mechanism and the mechanism are formed in one piece. This allows for a particularly compact design of the apparatus. Furthermore, the one-piece design makes it possible to dispense with alignment of the substrate with respect to the processing means, or preferably to perform this already during loading of the substrate into the apparatus by pushing the substrate from the side or parallel to the holding surface of the substrate holding mechanism. This avoids positioning errors and provides a processing chamber with a particularly small volume for efficient vacuum generation.

[0047] In a preferred embodiment of the apparatus for processing a substrate, the processing means comprises a flexible sheet stamp for embossing, in particular nano-embossing, the substrate. In this case, the flexible sheet stamp is intended for use in the apparatus. In this case, the sheet stamp may be provided on a sheet frame. Particularly preferably, the sheet stamp forms part of or the outer edge of the processing chamber.

[0048] In a preferred embodiment of the device for processing a substrate, the device additionally includes a pressure means for forming a fluid-tight pressure chamber between the mechanism and the sheet stamp, which is fluidically separated from the processing chamber by the sheet stamp and can be specifically deformed by the pressure means. The pressure means is, for example, a valve that can vent or exhaust the pressure chamber. In other words, the pressure can be adjusted by a corresponding amount of fluid on the side of the sheet stamp opposite the processing chamber, thereby specifically deforming or bending the sheet stamp toward the substrate. In this case, the pressure chamber is at least partially formed by the sheet stamp. In this case, the mechanism itself can define the pressure chamber, or the sheet frame can also partially define the pressure chamber. In this case, the sheet stamp can first contact the mechanism or the sheet frame on the side opposite the processing chamber, whereby the pressure chamber is only formed by the supply of fluid by the pressure means. It is also possible that part of the pressure chamber is already provided by the geometric shape of the mechanism and / or the sheet frame. In this case, the pressure chamber is enlarged by the pressure means, and the sheet stamp is then deformed in the direction of the substrate, thus allowing a particularly gentle, defect-free embossing.

[0049] In a preferred embodiment of the device for processing a substrate, the device is configured so that the pressure difference between the pressure in the processing chamber and the pressure in the pressurizing chamber can be adjusted to 0-800 mbar, preferably 100-600 mbar, and more preferably 200-600 mbar. In other words, the pressure difference is adjusted within the aforementioned range in order to precisely adjust the deformation and embossing force. In this case, the pressure difference is preferably adjusted by the pressurizing means according to a constant pressure in the processing chamber. In this way, the embossing process can advantageously be initiated by the pressurizing means.

[0050] In a preferred embodiment of the device for processing a substrate, the pressure means is simultaneously an exhaust means, whereby the sheet stamp can be released from the substrate by exhausting the pressure chamber. In other words, exhausting the pressure chamber by the pressure means can reduce the embossing force or reduce deformation during embossing. In this way, the sheet stamp can be released from the substrate or the embossing material provided on the substrate after embossing, advantageously gently.

[0051] The pressure in the area behind the sheet stamp or in the pressure chamber is adjusted to 1 mbar to 1500 mbar, preferably 1100 mbar to 1250 mbar.

[0052] In a preferred embodiment, after alignment, a rough vacuum is applied between the sheet stamp and the substrate in the processing chamber.

[0053] Upon evacuation, the pressure in the stamping chamber is less than 500 mbar, preferably less than 300 mbar, most preferably less than 250 mbar.

[0054] In particular, the rough vacuum is preferably adjusted to between 300 mbar and 1 mbar, most preferably between 250 mbar and 100 mbar. In a preferred embodiment, in addition to the rough vacuum in the processing chamber, the pressure in the area behind the sheet stamp (pressure zone) during and / or after (all-over) contact between the sheet stamp and the substrate coated with embossing material is preferably adjusted to between 1100 mbar and 1250 mbar.

[0055] The pressure difference between the working chamber and the area behind the stamp (pressure zone) or pressure chamber is also used to release the stamp from the embossing material: for example, the pressure in the working chamber is set to standard pressure, while the pressure in the area behind the stamp (pressure zone) is set to 1100 mbar to 1150 mbar.

[0056] In a preferred embodiment of the device for processing a substrate, it is specified that the pressure difference between the processing chamber and the back side of the sheet stamp is used to actively control the embossing and de-embossing, thereby generating the external force used to process the substrate. The generated force, in particular the embossing force, is preferably in the range of 100 N to 10 kN.

[0057] In a preferred embodiment of the apparatus for processing a substrate, a processing chamber can be formed in the area of ​​the substrate between the substrate holding mechanism and the mechanism, thereby specifying that the substrate can be positioned entirely within the processing chamber, thereby enabling efficient processing of, in particular, commercial wafers or other semiconductor elements within the processing chamber.

[0058] In one embodiment of the device for processing substrates, it is specified that the processing means comprises bonding means, preferably means for bonding flexible and / or sheet substrates, fixed to a film frame. Flexible bonding and contact during bonding thus allows particularly efficient processing of the substrates in the processing chamber. For example, electronic and / or optical components, in particular chips (English: die), attached to a thin (carrier) substrate can be bonded to a second substrate, in particular a wafer (English: Chip-to-Wafer Bonding).

[0059] In a preferred embodiment of the device for processing a substrate, it is specified that the processing means comprises an embossing means, preferably a flexible embossing stamp, for embossing the substrate. In this case, the device is intended for particularly accurate and efficient embossing in a vacuum. In this case, the flexible embossing stamp is a soft stamp. In this case, the embossing stamp itself may have a pattern to be transferred or imprinted onto the substrate. Furthermore, the flexible embossing stamp may apply a resist or other material to the substrate. In particular, embossing by the embossing means can be carried out particularly accurately and efficiently in a vacuum. In this case, the embossing means and / or the substrate particularly preferably have a micro- or nano-pattern, which advantageously allows particularly small patterns to be formed or embossed.

[0060] In a preferred embodiment of the apparatus for processing a substrate, the mechanism is a sheet stamp holding mechanism, and the stamping means comprises a sheet stamp. The sheet stamp holding mechanism is particularly suitable for use as a mechanism in the apparatus, because the held sheet stamp allows particularly accurate patterning of the substrate in an evacuated processing or stamping chamber.

[0061] In a preferred embodiment of the apparatus for processing a substrate, the sheet stamp holding mechanism has a frame that can be fixed to the sheet holding mechanism for holding the sheet stamp. In this case, the frame holds the sheet stamp and is preferably fixed to the sheet holding mechanism by a fixing means of the sheet holding mechanism. This allows for an advantageous, indirect and flexible positioning of the sheet stamp on the sheet holding mechanism to be predefined. This allows for particularly good processing or embossing results to be achieved. Furthermore, upon release of the substrate, the substrate can be brought into particularly good contact with the sheet stamp in the embossing position. In this case, the substrate is preferably held by capillary forces in the sheet stamp attached to the frame.

[0062] In a preferred embodiment of the device for processing a substrate, the sheet stamp can be at least partially released in the processing chamber by the pressure means. In other words, at least one pressure means is present behind the sheet stamp in the region of the holding surface of the sheet holding mechanism, which pressure means allows partial venting of the processing chamber during processing or embossing. Thus, the sheet stamp, which is fastened to the frame, is advantageously at least partially releasable. Therefore, the sheet stamp can be separated and thus released by appropriate venting behind the sheet stamp, thereby enabling particularly good application or relaxation of the substrate in the processing chamber. In this case, the processing chamber is fluidically separated from the rest of the processing chamber in the region behind the sheet stamp, in particular by the sheet stamp itself. Since the frame remains particularly preferably fixed during pressure application by the pressure means, the position of the sheet stamp relative to the substrate can be advantageously predefined.

[0063] In a preferred embodiment of the device for processing substrates, it is specified that the processing chamber is at least partially formed by a frame. In other words, the frame forms a partition of the processing chamber. In this case, it is particularly preferred that the sealing means is at least partially formed by the frame. In this way, a localized and fluid-tight processing chamber can be provided particularly easily.

[0064] In a preferred embodiment of the device for processing substrates, it is specified that the sealing means are arranged on the substrate holding mechanism and / or the sheet holding mechanism so that the frame can be positioned completely inside the processing chamber. In other words, the sealing means are arranged on the outer side of the holding mechanism, in particular in the peripheral area of ​​the holding mechanism. This allows a particularly advantageous positioning of the frame and the sheet stamp completely inside the processing chamber.

[0065] A particularly important aspect is that the processing method and apparatus allow nanoembossing with extremely precise overlay alignment. This advantageously allows for the best possible control of the contact between the substrate and the stamp. In particular, the filling properties of the nanopattern with a low residual layer are best achieved by a flexible stamp that can be relaxed relative to the substrate. In particular, controlled contact or embossing is possible despite the soft and flexible embossing means.

[0066] The idea is that the stamp is first fixed and aligned, then a vacuum is applied between the substrate and stamp to prevent air entrapment, and then contact and / or embossing wave generation occurs via controlled deflection of the substrate and / or stamp. This process or method allows for efficient nanoembossing in vacuum through precise control of surface contact against a flexible stamp.

[0067] Furthermore, particularly precise control of the contact between the stamp and the substrate is possible, where the rigidity of the substrate simultaneously allows for highly accurate alignment with respect to one another.

[0068] It is also advantageous that the method and apparatus do not require the omission of a particularly flexible stamp.

[0069] Furthermore, the entire holding mechanism does not need to be loaded and aligned in a vacuum.

[0070] Therefore, despite the vacuum, faster contact and therefore higher throughput is possible than with SmartNIL (WO 2014 / 037044).

[0071] A particularly important aspect is embossing in a vacuum with a flexible sheet stamp, where the alignment of the stamp with the substrate is performed at standard pressure, where a locally evacuable embossing chamber is created between the upper and lower holding features when they are brought sufficiently close, which allows for simple contact and embossing in a vacuum, where contact between the substrate and the sheet stamp occurs via controlled deflection of the substrate and / or the sheet stamp, and the generation of embossing waves, thereby enabling nano-embossing with a sheet stamp with extremely accurate overlay alignment and without air inclusions.

[0072] In the following, the terms stamp, sheet stamp, embossing stamp and nanopattern stamp are used synonymously. Furthermore, in the following, patterning and embossing refer to the formation of micro- and / or nanopatterns.

[0073] A further important aspect is contact, in which a preload is applied to the substrate and / or sheet stamp, so that first only partial surfaces are brought into contact, and then automatic contact between the contacting surfaces occurs, in which case the entire substrate surface is preferably embossed by a thin, flexible sheet stamp in a vacuum in an embossing chamber locally separated by a seal, without repeating the steps described above.

[0074] A further particularly important aspect is that the alignment of the substrate and the sheet stamp is first carried out under standard pressure. Only then, after sufficient proximity of the upper and lower holding mechanisms, does contact via the seal create a locally defined, actively evacuated embossing chamber. In this case, the substrate and the sheet stamp are first fixed and aligned, then a vacuum is applied between the substrate and the sheet stamp in the embossing chamber to prevent air entrapment, and then contact between the substrate and the sheet stamp occurs via a controlled deflection of the substrate to be embossed, and embossing waves are generated.

[0075] The embossing wave front is actuated in the center, in particular by an actuator. The propagation of the embossing wave front presses the patterned stamp surface into a hardenable material, in particular a resist material, provided on the substrate, replicating the pattern of the sheet stamp. The process may be preferably used to emboss a first layer or a second layer in combination with precise positioning (SmartView alignment).

[0076] The application of the stamp and / or substrate may optionally be carried out in one unique module separate from the embossing process.

[0077] A key advantage is that alignment can be performed at ambient pressure, followed by defect-free contact and stamping of the fully coated substrate in vacuum. This eliminates positioning errors that can occur due to substrate motion, especially in evacuable ambient environments. The locally defined stamping chamber allows for relatively fast evacuation compared to installations that require evacuation of the entire stamping module.

[0078] For embossing with a flexible stamp in a vacuum, a sheet frame or a separate stamp holder with a frame is used. The frame may be used to define a vacuum zone or an evacuable embossing chamber. In a preferred embodiment, the entire embossing module does not need to be evacuated, since only a (rough) vacuum is regulated between the sheet stamp and the substrate in the embossing chamber.

[0079] Prior to embossing, the substrate and stamp are aligned with each other as precisely as possible, often via alignment marks.

[0080] The infrastructure may be provided in particular by an EVG SmartView system, in which case viewing between the substrate and the sheet stamp is not necessary, since the sheet stamp is preferably mainly transparent, and therefore alignment is advantageously not hindered by the sheet stamp, since the alignment optics can see through the sheet stamp.

[0081] The embossing mechanism particularly comprises a stamp holding mechanism and a mechanism for holding the nanopattern stamp. The nanopattern stamp, particularly the sheet stamp, is preferably stretched on the sheet frame.

[0082] According to an advantageous embodiment, the detection mechanism serves to accurately align the substrate and the sheet stamp by detecting their relative positions, transmitting them to a control unit, which then aligns the substrate and the sheet stamp with respect to each other.

[0083] The installation preferably comprises a system for contactless wedge error compensation between the parallel aligned sheet stamp and the substrate, as described and mentioned in detail in WO 2012 / 028166.

[0084] The main challenge during embossing is the embossing process itself, i.e., from the generation of embossing waves after the central point contact to the complete contact between the contact surfaces of the substrate and the sheet stamp. In this case, the alignment can still change significantly compared to the previous alignment. For nanoembossing with extremely precise overlay alignment, it is necessary to control the contact between the substrate and the sheet stamp as well as possible. The separation / contact between the substrate and the sheet stamp is particularly important, since it is here that defects are introduced and in this case, multiple defects can be added together.

[0085] In the critical step of bringing the aligned contact surfaces of the substrate and the sheet stamp into contact, increasingly precise positioning accuracy or offset is desired, with alignment errors of less than 100 μm, particularly less than 10 μm, preferably less than 1 μm, most preferably less than 100 nm, and most preferably less than 10 nm.

[0086] The contacting of the contact surfaces by the mechanism and the embossing of the corresponding surfaces is carried out in particular at the embossing initiation point, and the nanoimprint embossing of the substrate by the sheet stamp is carried out by the release of the substrate and / or the sheet stamp from the holding surface along the embossing corrugations that extend from the embossing initiation point to the side edges of the sheet stamp.

[0087] The velocity of the embossing wave may be controlled by controlled release of the substrate and / or sheet stamp. Preferably, the fixing element is divided into separately controllable zones. Preferably, vacuum fixing is used.

[0088] A pin in a central hole or channel, through which gas can be introduced to create a positive pressure between the substrate holding mechanism and the substrate, is used to controllably deflect the clamped substrate (bending means and / or bending modification means). Other deformation means, such as the supply of a fluid, are possible.

[0089] In a further embodiment, a pin in a central hole or conduit through which gas can be introduced to generate positive pressure between the sheet stamp holding mechanism and the sheet stamp is used to controllably deflect the fixed sheet stamp (bending means and / or curvature changing means).

[0090] The preload and contact at the die start point are described and referenced in detail in WO 2015 / 161868, and therefore a detailed description of this will not be given here.

[0091] In a first embodiment, the substrate is fixed to an upper holding mechanism and, after contact, is pulled downwards in a controlled manner, partly due to gravity and partly due to the forces acting between the substrate and the stamp along the embossing wave. This results in the formation of radially symmetric embossing waves, particularly those progressing from the center to the side edges. The formation of this embossing wave is not limited to radially symmetric embossing waves. In an alternative embodiment, the formation of linear embossing waves is desired. For this, contact is made at the substrate edge, and the linear embossing wave tip is propagated away from the edge point.

[0092] In a second preferred embodiment, the substrate is fixed to the lower holding mechanism. During preload and contact at the stamping start point, the fixing means are only used in the edge area of ​​the substrate holding mechanism. As soon as the substrate contacts the sheet stamp, the fixing of the substrate coated with the embossing material is released by interrupting the vacuum. By reducing the negative pressure on the holding surface, the substrate can be released in a controlled manner. The fixing element is controlled accordingly. The sheet stamp remains permanently fixed to the stamp holding mechanism.

[0093] In a third preferred embodiment, the substrate is fixed to a lower holding mechanism, and the sheet stamp fixed to an upper holding mechanism is deflected by a deformation means to bring the substrate and the sheet stamp into contact. The distance between the substrate and the sheet stamp is first reduced to a precisely defined distance, and then the embossing process is started. In the embossing method, the substrate and the sheet stamp are not placed flat on top of each other, but rather the sheet stamp is first slightly pressed against the substrate by the deformation means, deforming it so that it comes into contact with each other at one point, for example, at the center M of the substrate or at one edge point R of the substrate. After the deformed, i.e., deflected, sheet stamp (toward the opposing substrate) is released, a radially symmetrical or linear embossing wave advances, resulting in continuous and uniform embossing along the embossing wave tip.

[0094] A further unique feature of the proposed invention is that after full-surface contact between the sheet stamp and the substrate, the flexible sheet stamp is "released" by applying a slight positive pressure to the backside via the pressure valve, while the sheet frame remains fixed. This allows the sheet stamp to relax relative to the substrate. The capillary forces fill the pattern, and the resulting flexibility allows the sheet stamp to adapt to the substrate surface. This allows high-resolution surface patterning to be achieved. In this case, pressure or boost in the backside area of ​​the sheet stamp (pressure zone) is used not only to relax the sheet stamp relative to the substrate, but also to simultaneously provide a uniform force during embossing, without changing the pressure or vacuum in the processing chamber. During the embossing process, the filling of the sheet stamp pattern by capillary forces is additionally assisted by the (slight) pressure on the backside. This advantageously reduces the embossing time.

[0095] In a first embodiment, it is specified that the imprint is cured and demolded externally in order to keep the alignment accuracy as high as possible. Thus, after the embossing process in the alignment and embossing module, the stack is transferred to an unloading station, and then in the curing and peeling module, the resist is crosslinked by electromagnetic radiation, in particular UV light, through a transparent sheet stamp. In a second embodiment, curing and demolding are also performed in the embossing module. Therefore, only one module is required for alignment, embossing, curing, and demolding, which allows the process time to be optimized.

[0096] The UV light used is optionally broadband or specifically tailored to the photoinitiator used in the embossing resist. The wavelength range of the curable material is in particular between 50 nm and 1000 nm, preferably between 150 nm and 500 nm, more preferably between 200 nm and 450 nm.

[0097] In an alternative embodiment, the embossing material may be thermally cured at temperatures between 0°C and 500°C, preferably between 50°C and 450°C, more preferably between 100°C and 400°C, most preferably between 150°C and 350°C, and most preferably between 200°C and 300°C.

[0098] At the end of the method, the sheet stamp is in particular detached from the substrate and the latter is unloaded. The installation preferably comprises a sensor for force monitoring to control the demolding step.

[0099] In an exemplary embodiment of a method for processing or embossing a substrate with a flexible sheet stamp, in a general embodiment, inter alia: a) coating or applying a substrate with a deposition mechanism, e.g., spin coating equipment; b) adjusting the positions of the substrate and the sheet stamp by a position adjusting mechanism at standard pressure; c) bringing the upper and / or lower retention features closer together to form a seal to form an evacuable stamping chamber; d) evacuating / forming the substrate in a defined embossing chamber between the sheet stamp and the substrate; e) imprinting the substrate in vacuum by initiating the imprint process with an actuator and an imprinting wave against the substrate and / or sheet stamp; f) releasing the substrate fixation; g) applying gas pressure behind the sheet stamp to control the sheet relaxation and embossing process; h) exposing the curable material to UV light; i) releasing the sheet stamp and the substrate from each other, in particular by evacuating the pressure chamber by the pressure means; preferably in the above order.

[0100] If an apparatus for processing a substrate is disclosed in connection with the bonding means, point a) includes more generally conceivable preparatory processes such as cleaning, surface activation, imprinting, etc.

[0101] The processing device is preferably disclosed in connection with the formation or embossing of micro- and / or nano-patterns, where a substrate, in particular together with an embossing material, can be fixed to a substrate holding mechanism and a pattern stamp can be brought into contact with the embossing material, whereby the substrate can be at least partially released from the fixation and the embossing material can be hardened, whereby the embossing material can be released from the pattern stamp.

[0102] The stamp is particularly preferably an imprint stamp for use in imprint technology. The stamp is preferably formed as a soft stamp for imprinting a substrate. The stamp is preferably formed continuously with a backplate, in which case the stamp and the backplate may generally consist of different materials. Individual or assembled stamps produced based on the use of several different materials are called hybrid stamps. In this case, the backplate may serve as a reinforcement for the stamp. Generally, a highly flexible backplate is preferred, which serves only as a support for the stamp.

[0103] The backplate may be, for example, a sheet or may be made of glass, and preferably consists of a sheet, in which case the backplate has a thickness of, in particular, less than 1000 μm, preferably less than 500 μm, more preferably less than 250 μm, and most preferably less than 100 μm.

[0104] In another embodiment, it is specified that the backplate is a very thin and flexible glass plate, in particular thinner than 10 mm, preferably thinner than 5 mm, more preferably thinner than 1 mm, most preferably thinner than 500 μm, most preferably thinner than 100 μm, and most preferably thinner than 10 μm.

[0105] In particular, technical glasses with adapted CTE coefficients of thermal expansion are suitable.

[0106] A special form of soft stamp is a sheet stamp, which consists of a thin sheet, on which a micro- and / or nano-embossed pattern is applied. The sheet and the embossed pattern form the soft stamp. In this case, a hard stamp is used as a master stamp to form a soft stamp as a negative mold for the hard stamp. The embossing material for the stamp is located on the sheet, which acts as a backplate. After the master stamp is peeled off from the hardened embossing material, the formed stamp preferably remains on the backplate, in particular on the sheet.

[0107] The soft stamp, in particular, · Thermoplastic resin, Elastomers and / or · Thermosetting resin It consists of one of the materials.

[0108] Sheet stamps, in particular, poly(organo)siloxanes (silicones), in particular polyhedral oligomeric silsesquioxanes (POSS) and / or polydimethylsiloxanes (PDMS); Perfluoropolyethers (PFPE) and / or Tetraethyl orthosilicate (TEOS) It consists of at least one of the following materials:

[0109] For embossing with a flexible stamp in a vacuum, a sheet frame or a separate stamp holder with a frame is preferably used, and the nanopattern stamp, in particular the sheet stamp, is stretched over the frame.

[0110] The frame of the sheet stamp allows for a quick and easy exchange of the stamp, and in particular the possible automation of the sheet stamp exchange simplifies the process.So-called film frames, which are standardized and standardized in the industry, are suitable as frames.

[0111] The sheet stamp with the frame is preferably larger than the substrate. The frame is used to define a local vacuum zone or an evacuable embossing chamber. In a first embodiment, when the upper and lower holding mechanisms are brought sufficiently close together, the annular seal of the substrate holding mechanism contacts the frame, thereby creating an evacuable embossing chamber between the sheet stamp with the frame and the substrate. In a further embodiment, the contact point is located directly behind the frame.

[0112] The sheet stamp is primarily UV-transparent. The wavelength range for optical transparency is in particular 100 nm to 1000 nm, preferably 150 nm to 500 nm, more preferably 200 nm to 450 nm, and most preferably 250 nm to 450 nm. The sheet stamp may also be transparent to other ranges of electromagnetic radiation. The sheet stamp may in particular be transparent in the infrared range.

[0113] In a particular embodiment, the embossing material is thermally hardened. In this embodiment, the sheet stamp does not have to be transparent to electromagnetic radiation and in particular consists of a metal foil. A particularly flexible sheet stamp can be, in particular, · plastic · metal Metal alloys It consists of at least one of the following materials:

[0114] The substrate may have any arbitrary shape, but is preferably circular. The diameter of the substrate is particularly standardized in the industry. For wafers, the industry-conventional diameters are 1 inch, 2 inches, 3 inches, 4 inches, 5 inches, 6 inches, 8 inches, 12 inches, and 18 inches. However, embodiments may essentially handle any substrate, regardless of diameter.

[0115] When aligning the sheet stamp and the substrate, they are aligned relative to each other, in particular with optical assistance. The alignment is carried out in particular by means of alignment marks located on the sheet stamp and the substrate, where the substrate and the sheet stamp have at least two alignment marks. This allows for extremely accurate positioning of the sheet stamp relative to the substrate. The sheet stamp and / or the substrate are transparent to the electromagnetic radiation used for alignment. In particular, the sheet stamp is transparent to the electromagnetic radiation used for alignment.

[0116] The substrate and the sheet stamp frame and stamp back plate are fixed to the corresponding holding mechanism by at least one fixing element, which may be switched on / off. The fixing element preferably includes: - vacuum fixtures, in particular with individually controllable vacuum channels and / or with a plurality of interconnected vacuum channels (vacuum segments), - mechanical fixings, especially fastenings, - electrical fastenings, in particular electrostatic and / or magnetic fastenings, - Adhesive fixing part is.

[0117] In this case, the fixing elements for the substrate, the sheet stamp frame and the sheet stamp back plate are preferably vacuum fixing elements, at least one fixing element being in particular electronically controllable.

[0118] The vacuum clamp preferably comprises a plurality of vacuum channels opening into the holding surface of the holding mechanism, the vacuum channels preferably being individually controllable.

[0119] In a preferred embodiment, several vacuum paths are grouped together to form vacuum path segments that are individually controllable and may therefore be evacuated or vented, but each vacuum segment is independent of another vacuum segment, which allows for the possibility of constructing individually controllable vacuum segments.

[0120] Each of these individually controllable vacuum paths or vacuum segments may be Sheet stamp frame, The outer unpatterned areas of the backplate and / or Patterned stamp area on backplate The holding surface of the holding mechanism for the sheet stamp is used to define separate fixing elements or fixing zones for the stamping process, thereby improving control of the stamping process.

[0121] The vacuum segments for fixing the substrate to the substrate holding mechanism are preferably configured in an annular manner, which allows precise fixing and / or release of the substrate to the substrate holding mechanism in a radially symmetrical manner, in particular from the inside to the outside. Alternatively, linear fixing and / or release of the substrate and / or sheet stamp to the holding mechanism is also possible.

[0122] In a first embodiment of the holding mechanism for the sheet stamp and / or the substrate, a pin in a central hole or conduit through which a gas can be introduced to generate a positive pressure between the holding surface of the holding mechanism for the substrate and the substrate is used to controllably deflect the fixed sheet stamp and / or substrate, which in this case remains annularly fixed at the edge region.

[0123] In a second embodiment of the holding mechanism for the sheet stamp and / or the substrate, an inner vacuum segment used as a vacuum clamp can be switched, via which gas and / or a gas mixture can be pumped into an intermediate chamber between the holding surface of the holding mechanism and the back side of the sheet stamp or the back side of the substrate, thereby controllably bending the sheet stamp and / or the substrate clamped at their edges. In this case, at least one clamping element can simultaneously be used as a bending means after switching. The design of the vacuum zone or vacuum segment allows for active control of the pressure zone as a bending means for embossing.

[0124] The choice of process gases introduced as gases and / or gas mixtures can have additional effects on the processing of the substrate (embossing, imprinting, bonding), for example, deionized gases can be used to counteract static buildup, or slightly humidified helium (He) or nitrogen (N) gases can be used to control humidity.

[0125] The main advantage of the device is that the alignment or positioning of the substrate and the sheet stamp is carried out with high precision under standard pressure, and then the formation of a spatially defined, local, evacuable stamping chamber allows for easy, defect-free stamping in vacuum.

[0126] A sheet stamp frame may be used to define a vacuum zone or evacuable stamping chamber.

[0127] In this case, a defined area or processing chamber is sealed off by a seal, in particular an annular seal, between an upper holding mechanism and a lower holding mechanism.

[0128] In a preferred embodiment, an annular seal is located on the retaining mechanism for the substrate.

[0129] The ventable embossing chamber is created by bringing the upper and lower holding mechanisms closer together and forming a sealed ventable embossing chamber after contact between the stamp holding mechanism and the substrate holding mechanism, which includes an annular seal. In a preferred embodiment, the seal is located behind the sheet stamp frame, so that the entire sheet stamp frame is located within the embossing chamber.

[0130] In the region of the impression chamber, preferably in the holding device for the substrate, a vacuum inlet opening for active evacuation of the impression chamber is located, which in one embodiment of the invention is a provided vacuum hole or a corresponding vacuum element, which allows controlled evacuation of the impression chamber.

[0131] In a preferred embodiment, only a rough vacuum is applied between the sheet stamp and the substrate in a locally defined impression chamber.

[0132] A particular advantage of the embodiment and process is that it is not necessary to evacuate the entire apparatus or the entire embossing module. Thus, evacuation of the embossing chamber is only performed when a vacuum is required. The smaller chamber that has to be evacuated allows for simple embossing in a vacuum.

[0133] In particular, the alignment and positioning of the substrate and the sheet stamp are first carried out at standard pressure, and then, for defect-free embossing, the embossing process is carried out only after evacuation of the embossing chamber.

[0134] After the stamping process, the substrate and the sheet stamp are preferably brought into contact over their entire surfaces. After the contact between the sheet stamp and the substrate over their entire surfaces, the flexible sheet stamp may be separated by a slight positive pressure from a pressure valve. The pressure valve is preferably located in an outer region of the backplate or sheet. This outer region does not have a pattern and is not part of the stamp surface. During this time, the sheet stamp frame remains fixed to the sheet stamp holding mechanism, allowing the sheet stamp to relax relative to the substrate. Capillary forces fill the pattern, and the flexibility imparted at this point allows the sheet stamp to adapt to fit the substrate surface. This allows high-resolution surface patterning to be performed.

[0135] The stamp holding mechanism has at least one pressure valve for, inter alia, moving the sheet stamp away from the holding surface of the holding mechanism on the backside. Preferably, the at least one pressure valve is a fluid element capable of releasing a gas and / or a gas mixture to generate a positive pressure between the holding surface of the stamp holding mechanism and the sheet stamp. The pressure valve is preferably located in an outer region of the backplate or sheet. This outer region does not have a patterning and is not part of the stamp surface.

[0136] In the first embodiment, the vacuum fixtures for the sheet stamp frame and for the area of ​​the backplate are separated from the fluid element (detachment element) for positive pressure to detach the sheet stamp, whether patterned or not.

[0137] In a second embodiment, the vacuum clamps for the individual clamping elements, particularly the outer unpatterned areas of the backplate, can be switched and supplied with positive pressure, allowing the individual clamping elements to be used simultaneously as breakaway elements, if desired, thereby relaxing the sheet.

[0138] In a preferred embodiment of the method for alignment and embossing, it is specified that pressure or increased pressure in the area (pressure zone) behind the sheet stamp is used not only to relax the sheet stamp against the substrate but also to simultaneously provide an even force during embossing. During the embossing process, the filling of the sheet stamp pattern by capillary forces is additionally assisted by a (slight) pressure from the backside.

[0139] In a preferred embodiment of the method for aligning and embossing, it is specified that the pressure difference between the processing chamber and the area behind the sheet stamp (pressure zone) is also used to release the sheet stamp from the embossing material.

[0140] A preferred embodiment of the method for alignment and embossing specifies that the pressure regulation and pressure control provide active control of the pressure zones for embossing and demolding in the working chamber and pressure zone, respectively, whereby the resulting pressure difference between the two pressure zones is used during embossing and demolding to generate an external force acting on the sheet stamp.

[0141] The dimensions of the individual nanopatterns of the embossing means or the embossing pattern of the sheet stamp are preferably in the micrometer and / or nanometer range, and the dimensions of the individual nanopatterns of the embossing means, in particular the flexible sheet stamp, are less than 1000 μm, preferably less than 10 μm, more preferably less than 100 nm, and even more preferably less than 10 nm.

[0142] The accuracy with which the detection equipment, particularly the alignment optics, can be moved individually is better than 1 mm, preferably better than 100 μm, somewhat more preferably better than 10 μm, more preferably better than 1 μm, even more preferably better than 100 nm, most preferably better than 10 nm, and particularly preferably better than 1 nm.

[0143] In a preferred embodiment, after alignment, only a rough vacuum is applied between the sheet stamp and the substrate in a locally defined impression chamber (processing chamber).

[0144] During evacuation, the pressure in the stamping chamber is less than 500 mbar, preferably less than 300 mbar, most preferably less than 250 mbar. In particular, a rough vacuum is preferably adjusted to between 300 mbar and 1 mbar, most preferably between 250 mbar and 100 mbar.

[0145] The pressure in the area behind the sheet stamp (pressure zone) is preferably adjusted to 1 mbar to 1500 mbar. In a preferred embodiment, in addition to the rough vacuum in the processing chamber, during and / or after (all-over) contact between the sheet stamp and the substrate coated with embossing material, the pressure in the area behind the sheet stamp (pressure zone) is preferably adjusted to 1100 mbar to 1250 mbar.

[0146] The pressure difference between the working chamber and the area behind the sheet stamp (pressure zone) is also used to release the sheet stamp from the embossing material: for example, the pressure in the working chamber is adjusted to standard pressure, while the pressure in the area behind the sheet stamp (pressure zone) is adjusted to 1100 mbar to 1150 mbar.

[0147] In a preferred embodiment of the device for processing a substrate, it is specified that the pressure difference between the processing chamber and the back side of the sheet stamp is used to actively control the embossing and demolding, thereby generating the external force used to process the substrate, preferably in the range of 100N to 10kN.

[0148] The UV light used is optionally broadband or specifically tailored to the photoinitiator used in the embossing resist. The wavelength range of the curable material is in particular between 50 nm and 1000 nm, preferably between 150 nm and 500 nm, more preferably between 200 nm and 450 nm.

[0149] Further advantages, features and details of the invention will become apparent from the following description of preferred embodiments and the drawings. [Brief explanation of the drawings]

[0150] [Figure 1a] 1 is a schematic cross-sectional view of the apparatus of the first embodiment in a first method step; FIG. [Figure 1b] 3 is a schematic cross-sectional view of the apparatus of the first embodiment in a second method step. FIG. [Figure 1c] 5 is a schematic cross-sectional view of the apparatus of the first embodiment in a third method step. FIG. [Figure 1d] 4 is a schematic cross-sectional view of the apparatus of the first embodiment in a fourth method step. FIG. [Figure 1e] FIG. 10 is a schematic cross-sectional view of the apparatus of the first embodiment in a fifth method step. [Figure 2a] 3 is a schematic cross-sectional view of the apparatus of the second embodiment in a first method step. FIG. [Figure 2b] 5 is a schematic cross-sectional view of the apparatus of the second embodiment in a second method step. FIG. [Figure 2c] 5 is a schematic cross-sectional view of the apparatus of the second embodiment in a third method step. FIG. [Figure 2d] FIG. 10 is a schematic cross-sectional view of the apparatus of the second embodiment in a fourth method step. [Figure 2e] FIG. 10 is a schematic cross-sectional view of the apparatus of the second embodiment in a fifth method step. [Figure 2f] FIG. 10 is a schematic cross-sectional view of the apparatus of the second embodiment in a sixth method step. [Figure 2g] FIG. 10 is a schematic cross-sectional view of the apparatus of the second embodiment in a first method step in an exposure and demolding module with a substrate / stamp stack. [Figure 2h] FIG. 10 is a schematic cross-sectional view of the apparatus of the second embodiment at a second method step in the exposure and release module with the substrate / stamp stack. [Figure 2i] FIG. 10 is a schematic cross-sectional view of the apparatus of the second embodiment in a third method step in the exposure and release module with a substrate / stamp stack. [Figure 2j] FIG. 10 is a schematic cross-sectional view of the apparatus of the second embodiment at a fourth method step in the exposure and release module with the substrate / stamp stack. [Figure 3a] 10 is a schematic cross-sectional view of the apparatus of the third embodiment in a first method step with a loaded substrate and a sheet stamp with a sheet frame. [Figure 3b] 5 is a schematic cross-sectional view of the apparatus of the third embodiment in a second method step. FIG. [Figure 3c] 5 is a schematic cross-sectional view of the apparatus of the third embodiment in a third method step. FIG.

[0151] In the drawings, identical components or components having identical functions are designated by identical reference numerals. The drawings may not be to scale.

[0152] 1a to 1e show a method for processing as an embossing process in an alignment and embossing module in a first embodiment, similar to fusion bonding, with a sheet stamp on the bottom and a substrate on the top. It is also possible to reverse the arrangement, typically with a sheet stamp on top and a substrate on the bottom, as shown in FIGS. 2a to 2j in a second embodiment. In this case, the processing mechanism is shown in the drawings as, for example, an embossing mechanism. The processing mechanism may also be, for example, a laser processing mechanism, a coating mechanism, a bonding mechanism, or a peeling mechanism. In this case, a local processing chamber can be configured to surround the substrate between the mechanism or an element of the mechanism and the substrate holding mechanism.

[0153] The main advantage of the device is that the positioning and approach of the substrate and the mechanism or sheet stamp is first carried out with high positioning accuracy under standard pressure, and then defect-free simple embossing is possible in vacuum in a spatially defined, evacuable embossing chamber.

[0154] FIG. 1a shows the apparatus with a holding mechanism 1 for holding a substrate 13 and a holding mechanism 2 for holding a sheet stamp 12 with a sheet frame 9. The holding mechanism 1 for the substrate includes a central opening for guiding an actuator 8 or an actuator mechanism (not shown). In this first exemplary embodiment, the embossing process (nanoimprint process) is initiated in the center of the substrate by the actuator 8. The actuator 8 may have various forms or configurations. Instead of an actuator pin or pins as the actuator 8, fluid or gas pressure is alternatively possible. The openings for the actuator 8 shown in FIG. 1a may have different sizes and shapes.

[0155] In Fig. 1a, a sheet stamp 12 with a sheet frame 9 is already held in the holding mechanism 2 for a sheet stamp. The sheet frame 9 is fixed via fixing elements 11 and vacuum path segments (not shown) distributed on the holding surface of the holding mechanism 2, which fix defined zones on the back side of the sheet. Fig. 1a also shows the holding mechanism 1 for a substrate, on which a substrate 13 has been loaded. The substrate 13 is fixed by vacuum or negative pressure via vacuum paths 6. In the preferred embodiment shown in Fig. 1a, several vacuum paths 6 are grouped together to form vacuum path segments which are individually controllable and can therefore be evacuated or vented.

[0156] The holding mechanism for a substrate 1 shown in Figure 1a comprises a seal, in particular a sealing ring 7, by means of which, after contact with the underlying holding mechanism for a sheet stamp 2, a spatially defined and sealed embossing chamber 14 is formed. Since the stamp, in particular the sheet stamp 12 with its frame 9, is usually larger than the substrate 13, loading of the stamp or application of the stamp preferably takes place outside the substrate zone.

[0157] In the next process step shown in Figure 1b, the upper and lower holding mechanisms 1 and 2 are aligned and brought together, then come into contact at the seal 7, forming an embossing chamber 14. This embossing chamber 14 is evacuated via a vacuum line 5 provided in the substrate holding mechanism 1. A frame 9 is used to define a local vacuum zone or evacuable embossing chamber 14 according to Figure 1b. Alternatively, a seal behind the frame 9 is also possible.

[0158] In the next process step shown in FIG. 1c, after the evacuation of the embossing chamber 14 and thus the creation of a vacuum between the substrate 13 and the sheet stamp 12, the sheet stamp 12 and the substrate 13 are brought into contact, as close to a point as possible, over a partial surface. The contact shown in FIG. 1c is achieved by a concentric deformation of the substrate 13, particularly in its center, by pressure applied via the actuator 8. In this case, the substrate 13 remains annularly fixed in its edge region. The substrate 13 is deflected in a controlled manner until it contacts the sheet stamp 12, and then released and, after complete release, comes into contact with the sheet stamp 12 over its entire surface. In this case, the vacuum prevents any air entrapment.

[0159] In order to controllably deflect the fixed substrate 13, instead of a pin as an actuator 8 in the central hole of the substrate holding mechanism, a conduit can be used that can generate positive pressure by introducing gas between the holding surface of the substrate holding mechanism and the substrate 13.

[0160] The vacuum clamping for the substrate 13 preferably consists of a number of vacuum channels 6 opening into the holding surface of the substrate holding mechanism. In a preferred embodiment, several vacuum channels 6 are grouped together to form vacuum channel segments, which can be individually controlled. The vacuum segments for clamping the substrate to the substrate holding mechanism are preferably configured in an annular shape. This allows for a controlled release of the substrate 13 from the substrate holding mechanism after contact, which is radially symmetrical, in particular from the inside to the outside.

[0161] 1d shows the end of the embossing wave, where the tip of the embossing wave has reached the edge of the substrate 13. The substrate 13 and the sheet stamp 12 are now in contact over almost the entire surface, and the substrate 13 is no longer fixed to the upper substrate holding mechanism. The actuator 8 may initially remain in contact with the substrate and / or may be moved back into the central opening, if desired.

[0162] The holding mechanism 2 for the sheet stamp shown in Figures 1a to 1e has an additional valve or gas line, in particular at least one pressurization valve 10 for lifting the sheet stamp 12 from the holding surface of the holding mechanism 2 for the sheet stamp on its backside. Preferably, this at least one pressurization valve 10 is a fluid element that can let out a gas and / or a gas mixture to generate a positive pressure between the holding surface of the stamp holding mechanism and the sheet stamp 12. The pressurization valve is preferably located in an outer area of ​​the backplate or sheet of the sheet stamp 12. This outer area does not have a patterning and is not part of the stamp surface.

[0163] 1e, after full-surface contact between the sheet stamp 12 and the substrate 13, the flexible sheet stamp 12 is "released" by the positive pressure between the outer holding surface of the sheet stamp holding mechanism and the sheet stamp 12. Meanwhile, the sheet stamp frame 9 remains fixed to the sheet stamp holding mechanism, allowing the sheet stamp 12 to relax relative to the substrate. Capillary forces fill the pattern, and the flexibility now imparted to the sheet stamp 12 allows it to adapt to fit the substrate surface. The peripheral pressure difference is used as an additional external force, which can improve filling properties.

[0164] In order to keep the alignment accuracy as high as possible, it is specified that the imprint is cured and demolded externally in a second module of the apparatus, which, although alternatively possible with the design, would significantly complicate the design and could result in undesirable heat input.

[0165] 2a-2j show the process steps in a second embodiment of the apparatus and method.

[0166] The apparatus has a group of modules with a common working chamber, which can be sealed against the surrounding atmosphere if necessary. The apparatus preferably consists of at least two modules. Alignment and embossing are carried out in the first module shown in Figures 2a to 2f. Curing and demolding are carried out in the second module shown in Figures 2g to 2j. Application can be carried out in a dedicated module separate from the embossing process.

[0167] In a first method step, the substrate 13' and the sheet stamp 12' are loaded, held and fixed in the respective holding mechanisms 1', 2'.

[0168] 2a shows a holding mechanism 1' for holding a substrate 13' and a holding mechanism 2' for holding a sheet stamp 12' with a sheet back plate and a sheet frame 9' of the apparatus. In this second embodiment, the sheet stamp 12' is located on the upper side in the holding mechanism for the sheet stamp 2', and the substrate 13' is located on the lower side in the holding mechanism for the substrate 1'.

[0169] In Fig. 2a, a sheet stamp 12' with a backplate and a sheet frame 9' is already held in a holding mechanism 2' for a sheet stamp. The sheet frame 9' is fixed via fixing elements 11' and vacuum path segments (not shown) distributed on the holding surface of the holding mechanism 2', which fix defined zones on the backside of the sheet. In particular, the patterned stamp area and the unpatterned area of ​​the (sheet) backplate are divided into different vacuum path segments.

[0170] In FIG. 2a, a substrate 13' is placed on the loading pins 17 of the substrate holding mechanism 1'.

[0171] 2b shows the substrate 13' after being held on the holding surface of the holder 3' of the substrate holding mechanism 1', where loading is performed from above. The substrate 13' is fixed by vacuum or negative pressure via the vacuum lines 6'. In a preferred embodiment, several vacuum lines 6' are grouped together to form vacuum line segments that are individually controllable and may therefore be evacuated or vented (not shown).

[0172] Alternatively or additionally to vacuum fixation, in another embodiment, mechanical fixation for the substrate 13' is possible when the substrate 13' is located in an underlying holding mechanism as shown in the embodiment according to Figures 2a to 2j.

[0173] Coating the substrate 13' or applying the embossing material (embossing resist) to the substrate 13' can optionally be performed in a separate module separate from the embossing process, or in an alignment and embossing module after fixing the substrate 13'. The present invention can be used in combination with established industrial coating methods, such as spin coating. Thus, the substrate is coated quickly, defect-free, full-surface, particle-free, and standardized, which also provides throughput advantages during the embossing step. In a first embodiment, the substrate 13' is coated with the embossing material before loading. In another embodiment, the substrate 13' is coated by a deposition mechanism (not shown) only after loading and fixing.

[0174] In a second method step, shown in Figure 2c, the sheet stamp 12' is aligned relative to the substrate 13', in particular by means of optical assistance 15. The sheet stamp 12' and the substrate 13' are brought relatively close to one another.

[0175] In a preferred embodiment, it is specified that the substrate 13' and / or the holding mechanism for the substrate 1' is movable with at least three degrees of freedom, preferably at least four degrees of freedom, more preferably at least five degrees of freedom, and most preferably all six degrees of freedom.

[0176] In the alignment and embossing module shown in FIGS. 2a to 2f, there are positioned adjustment units 16, particularly for the substrate 13′ and the sheet stamp 12′, respectively, on the upper and lower sides. Each adjustment unit is associated with a corresponding holding mechanism 1′, 2′. Each holding mechanism 1′, 2′ has six degrees of freedom: three degrees of translation along the X, Y, and Z directions, and three degrees of rotation about the X, Y, and Z axes. The translational degrees of freedom serve to displace the holding mechanisms 1′, 2′, and thus the substrate 13′ or the sheet stamp 12′, within the XY plane defined by the X and Y directions, and to bring the substrate 13′ and the sheet stamp 12′ closer to each other along the Z direction. The rotational possibilities about the X, Y, and Z axes serve to perform wedge error compensation (WEC Z axis 18) and / or orientation of the substrate and / or the sheet stamp. Rotations about the X, Y, and Z axes are sometimes referred to as tilts, especially since they are rotations with small angles of rotation.

[0177] The Z direction or Z axis extends perpendicular to the holding surface of the holding mechanism 1, 1', 1'', 2, 2', 2'' in the loading position as a plane normal. The X and Y directions or X and Y axes extend perpendicular to each other and parallel to or within the holding surface of the holding mechanism.

[0178] In another embodiment, it is specified that the positioning, holding and movement systems of the upper and lower holding mechanisms 1, 1', 1'', 2, 2', 2'' for at least one degree of freedom are configured with a coarse drive mechanism and a fine drive mechanism.

[0179] In a preferred embodiment it is specified that the holding mechanism 1,1',1'',2,2',2'' has a central open-loop control unit for open-loop control and / or a central closed-loop control unit for closed-loop control of the movement and / or flow, in particular the position of the fixing and holding mechanism 1,1',1'',2,2',2'' of the substrate 13,13' and the sheet stamp 12,12'. Furthermore, the holding mechanism 1,1',1'',2,2',2'' has at least one sensor (not shown) for measuring influencing factors, in particular at least one distance and / or position sensor.

[0180] In the third method step shown in FIG. 2c, after the holding mechanisms 1′, 2′ are brought sufficiently close to one another, a locally defined, evacuable embossing chamber 14′ is formed. In this case, a seal 7′, particularly an annular seal, seals a defined area 14′ between the upper and lower holding mechanisms 2′, 1′. This area can be evacuated if necessary. In a preferred embodiment, the annular seal 7′ is located in the substrate holding mechanism 1′. The evacuable embossing chamber 14′ is formed by bringing the upper and lower holding mechanisms close together and forming a seal after the stamp holding mechanism 2′ comes into contact with the substrate holding mechanism 1′ equipped with the annular seal 7′. In a preferred embodiment, the seal is located behind the sheet stamp frame 9′, so that the entire sheet stamp frame 9′ is located within the embossing chamber. In an alternative embodiment, the seal 7′ may be attached to both holding mechanisms, or only to one of the holding mechanisms 1′, 2′.

[0181] In the region of the impression chamber 14', preferably in the holding device for the substrate 1', a vacuum inlet opening 5' for the active evacuation of the impression chamber 14' is located, which in accordance with a preferred embodiment of the invention is a provided vacuum hole or a corresponding vacuum element that allows controlled evacuation of the impression chamber 14'.

[0182] 2c shows the embossing chamber 14' formed by contacting the upper and lower holding features 1' and 2' with the sealing ring 7' after aligned assembly. The gap between the substrate 13' and the sheet stamp 12' is reduced to a precisely defined gap, after which the embossing process can begin.

[0183] The sheet stamp 12' is further aligned relative to the substrate 13' by the optical auxiliary means 15, after which evacuation of the embossing chamber 14' is initiated. A further precise alignment of the sheet stamp 12' relative to the substrate 13' can also be performed after evacuation of the embossing chamber 14'. In this case, the alignment is advantageously performed in advance, in particular by the optical auxiliary means 15, prior to evacuation of the working chamber, so that particularly accurate alignment can be performed at standard pressure. Furthermore, the substrate 13' can also be rotated after evacuation of the working chamber, for example to compensate for wedge errors. This is performed in particular by the WEC 18.

[0184] In the fourth method step shown in Fig. 2d, the stamping material is embossed by the sheet stamp 12'. In this case, an actuator is used to bend the substrate 13' convexly, particularly in the center, so that it first contacts the sheet stamp 12' at its central portion (not shown). During deformation, the substrate 13' remains fixed, particularly at its periphery, by the substrate holding mechanism 1'.

[0185] In this second embodiment of the holding mechanism for substrates 1', an inner vacuum segment acting as a vacuum clamp is switchable, above which gas and / or gas mixtures are pumped into an intermediate chamber between the holding surface of the holding mechanism for substrates 1' and the backside of the substrate, thereby allowing a substrate clamped at its edges to be controllably deflected. Thus, at least one central clamping element can be used simultaneously as a bending means after switching.

[0186] After release of the deformed or deflected substrate 13', the progression of the embossing waves results in continuous and uniform embossing along the embossing wave tips.

[0187] 2d, the substrate 13 and the sheet stamp 12' are joined by capillary forces to the embossing material located between them and are brought into contact over the entire surface. For this, at least the sheet stamp 12' must be highly flexible. Due to the viscosity of the embossing material, the intermediate spaces of the sheet stamp 12' are also filled, particularly completely, by capillary action.

[0188] A further unique feature of the proposed invention is that after full-surface contact between the sheet stamp 12' and the substrate 13', the flexible sheet stamp 12' is relaxed by a slight positive pressure on the backside via the pressure valve 10', while the sheet frame 9' remains fixed. Thus, the sheet stamp 12' can be relaxed relative to the substrate 13'. Capillary forces fill the pattern, and the flexibility now imparted to the sheet stamp 12' allows it to adapt to fit the substrate surface. This allows high-resolution surface patterning to be performed.

[0189] In a fifth method step, the embossing material is hardened. In order to maintain the highest possible alignment accuracy, it is specified that the imprint is hardened externally and demolded. According to Figures 2e and 2f, after the opening of the embossing chamber, the frame 9' together with the sheet stamp and the substrate stack is removed from the upper sheet stamp holding mechanism 2' and transferred to a hardening and demolding module.

[0190] According to Figures 2g and 2h, after the embossing process, in the alignment and embossing module, the sheet stamp / substrate stack is transferred to an unloading station (not shown), and then in the curing and peeling module, the embossing material or resist is crosslinked by UV light through the transparent sheet stamp.

[0191] The curing and peeling module shown in Figure 2g is similar to the alignment and stamping module shown in Figures 2a to 2f and has a holding mechanism 1'' for the substrate and a holding mechanism 2'' for the sheet stamp, which will not be described in detail here.

[0192] After fixing the sheet stamp / substrate stack in the sheet stamp holding mechanism 2" shown in Figure 2g, the holding mechanisms 1", 2" are brought closer together to a defined distance as shown in Figure 2h, thereby forming a chamber 14" defined by the annular seal 7". This chamber 14" can be evacuated if necessary. A UV lamp house 19 allows irradiation of the embossing resist with UV light. In this case, temperature control and, if necessary, temperature compensation are performed during curing with UV radiation.

[0193] In a sixth method step, according to Figures 2i and 2j, the release of the sheet stamp 12' from the embossing material takes place. At the end of the method, in a curing and peeling module, the sheet stamp 12' is in particular detached from the substrate 13', which is then unloaded. The installation preferably has a force monitoring sensor for controlling the release step.

[0194] In the curing and peeling module shown in Figures 2g to 2j, a positioning unit 16' for the holding mechanism 1'' is located especially below. The holding mechanism 1'' has especially six degrees of freedom, namely three degrees of freedom of translation along the X, Y and Z directions and three degrees of freedom of rotation about the X, Y and Z axes. The translational degrees of freedom serve for the displacement of the holding mechanism 1'' and thus the substrate 13' within the XY plane defined by the X and Y directions, as well as for the relative movement of the substrate 13' and the sheet stamp 12' along the Z direction. The rotational possibilities about the X, Y and Z axes serve for performing wedge error compensation (WEC Z axis 18') and / or orientation of the substrate 13' for demolding.

[0195] 2h and 2i show a line 5'' which may optionally be used as a vacuum line to evacuate the chamber 14'' or as a pressure valve to pressurize the chamber 14'' with a gas or gas mixture or to create a positive pressure in the chamber 14''. Demolding is assisted by pressurizing the chamber 14'' between or around the sheet stamp 12' and the substrate 13'. This can have a precise additional effect on demolding. Additionally, the flexible sheet stamp 12' may be relaxed by a slight positive pressure on its backside by a pressure valve 10'' during demolding, while the sheet frame 9' remains fixed.

[0196] 3a to 3c show an apparatus and method for processing as an embossing process in a third embodiment, with a sheet stamp mounted on a film frame 9' on the upper side and a substrate 13'' on the lower side. In the apparatus shown in FIGS. 3a to 3c, alignment, embossing, curing, and demolding are preferably performed in the same module. The apparatus shown in FIGS. 3a to 3c has a fixed structural form in which the lower and upper parts of the apparatus, in which the holding mechanism is integrated, are inseparable. The substrate holding mechanism, which includes a positioning unit 16' with a holding surface for holding the substrate 13'', is integrated in the lower part of the apparatus and is dimensioned to minimize space as much as possible. Advantageously, this allows for the creation of a processing chamber 14''' that is as small as possible. The evacuable processing chamber 14''', which is spatially partitioned to surround the substrate, is defined by gate valves 20, 20'. The gate valves 20, 20' are loading and unloading openings for gas-tightly sealing the processing chamber, and are formed in the walls of the process chamber. The evacuation is carried out by means of evacuation means 5'', which are arranged in a mechanism by which the processing chamber 14''' can be evacuated after closing the gate valves 20, 20'. In this case, the substrate 13'' and the sheet stamp 12'' with the film frame 9' are arranged inside the processing chamber 14'''. Processing then takes place in the processing chamber.

[0197] In an exemplary embodiment of the method by the apparatus shown in Figures 3a to 3c, steps c) approaching the upper and / or lower holding mechanisms and d) creating evacuation / vacuum in a defined embossing chamber between the sheet stamp and the substrate can be optionally interchanged.

[0198] Preferably, a lower substrate holding mechanism with a position adjustment unit 16' is brought close to the upper stamp.

[0199] In Fig. 3a, the sheet stamp with backplate and film frame 9' is already held in the holding mechanism for the sheet stamp. The holding is performed by the film frame loading unit 21 after its introduction into the apparatus via the gate valves 20, 20'. The sheet frame 9' is fixed via fixing elements 11' and vacuum path segments (not shown) distributed on the holding surface of the holding mechanism 2', which fix defined zones on the backside of the sheet. In particular, the patterned stamp area and the unpatterned area of ​​the (sheet) backplate are divided into different vacuum path segments.

[0200] The sheet stamp is stretched in a frame, in particular a film frame 9'.

[0201] The substrate may be temporarily stored (not shown) and transferred by a handling mechanism (not shown), e.g., a robotic arm, through one of the gate valves 20, 20′ onto the substrate loading pins 17′ into the process chamber. The gate valves 20, 20′ are then closed again. The presence of two gate valves 20, 20′ allows for more flexibility during the process. One gate valve may, for example, be used for the introduction and removal of the substrate 13″, while the second gate valve is used for the introduction and removal of the sheet stamp 12″ with the film frame 9′. Multiple and / or different substrates may be embossed with a single sheet stamp. The sheet stamp may remain in the apparatus shown in FIG. 3a for multiple embossing processes.

[0202] FIG. 3 a shows a substrate 13″ coated with embossed resist after it has been held on the holding surface of a holder of a holding mechanism for the substrate, where loading over loading pins 17′ takes place from above after introduction into the apparatus via gate valves 20, 20′. The substrate 13″ is fixed by vacuum or negative pressure via a vacuum line. In a preferred embodiment, several vacuum lines are grouped together to form vacuum line segments which are individually controllable and can therefore be evacuated or vented (not shown). Alternatively or additionally to vacuum fixation, in another embodiment, a mechanical fixation for the substrate 13″ is possible when the substrate 13″ is located in the lower holding mechanism as shown in the embodiment according to FIG. 3 a.

[0203] According to an advantageous embodiment, a detection mechanism, in particular comprising optical systems 15o, 15u, detects the relative positions and transmits them to a control unit, which then causes the substrate and the sheet stamp to be aligned with each other, thereby accurately aligning the substrate 13'' and the sheet stamp 12''.

[0204] In the first embodiment, the sheet stamp 12" is furthermore aligned relative to the substrate 13" by optical auxiliary means 15o, 15u before evacuation of the embossing chamber 14'" is started. A further precision alignment of the sheet stamp 12" relative to the substrate 13" can be performed after evacuation of the embossing chamber 14'". Furthermore, the substrate 13" can be rotated after evacuation of the working chamber 14'", for example to compensate for wedge errors. This is performed in particular by a WEC 18' (English: wedge error compensation).

[0205] In the next method step, shown in Figure 3b, the distance between the substrate 13'' and the sheet stamp 12'' is reduced to a precisely defined distance, after which the embossing process begins. Preferably, the lower substrate holding mechanism is brought relatively closer to the sheet stamp 12''.

[0206] In the next method step shown in FIG. 3c, the embossing material is embossed by the sheet stamp 12''. In a preferred embodiment of the holding mechanism for the sheet stamp with the film frame, an inner vacuum segment serving as a vacuum clamp is switchable, above which gas and / or a gas mixture is pumped into an intermediate chamber between the holding surface of the holding mechanism for the sheet stamp with the film frame and the back side of the sheet stamp, so that the sheet stamp clamped at its edges can be controllably deflected. Therefore, at least one central clamping element can simultaneously be used as a bending means after switching.

[0207] Contact in the apparatus shown in Figure 3b is preferably made after the approach of the lower substrate holding mechanism, in which case a preload is applied to the upper sheet stamp so that first only a partial surface of the sheet stamp 12'' is brought into contact with the substrate 13'', and then automatic contact between the contact surfaces occurs, in which case the entire substrate surface is preferably embossed by the thin, flexible sheet stamp in a vacuum without repeating the above-mentioned steps in the embossing chamber 14'''.

[0208] After full-surface contact between the sheet stamp 12'' and the substrate 13'', the flexible sheet stamp 12'' shown in FIG. 3c is "released" by a positive pressure between the outer holding surface of the sheet stamp holding mechanism and the sheet stamp 12''. Meanwhile, the sheet stamp frame 9' remains fixed to the sheet stamp holding mechanism, allowing the sheet stamp 12'' to relax relative to the substrate 13''. Capillary forces fill the pattern with the embossing resist, and the resulting flexibility allows the sheet stamp 12'' to adapt to the substrate surface. Additionally, a difference in ambient pressure can be used as an additional external force, which can improve the filling characteristics. For this purpose, the pressure behind the sheet stamp 12'' in the sheet stamp pressure chamber 23 and the pressure or vacuum in the processing chamber 14''' are appropriately adjusted. The pressure in the processing chamber 14''' is preferably between 1 mbar and 1100 mbar. During evacuation, the pressure in the processing chamber is less than 500 mbar, preferably less than 300 mbar, most preferably less than 250 mbar. In particular, a rough vacuum is preferably adjusted to between 300 mbar and 1 mbar, most preferably between 250 mbar and 100 mbar.

[0209] The pressure in the pressure chamber 23 behind the sheet stamp 12" is preferably between 1 mbar and 1500 mbar. The pressure difference (ambient pressure difference) between the processing chamber 14"' and the sheet stamp pressure chamber 23 is between 0 and 800 mbar, preferably between 100 and 600 mbar, more preferably between 200 and 600 mbar. A pressure difference of 500 mbar corresponds, for example, to a force of 4.5 kN, which may be used as an additional force in the embossing process.

[0210] The UV lamp house 19' allows irradiation of the embossing resist with UV light. Temperature control and, if necessary, temperature compensation are performed during curing with UV radiation. The sheet stamp material is preferably at least partially transparent to the wavelength range of electromagnetic radiation that crosslinks the embossing material on the substrate during UV curing. In this case, the optical transmittance is particularly greater than 20%, preferably greater than 50%, more preferably greater than 80%, and most preferably greater than 95%. The sheet stamp may also be transparent to other ranges of electromagnetic radiation. Other adjacent components of the upper holding mechanism and a section of the upper part of the apparatus adjacent to the UV lamp house 19' are also made of UV- and / or IR-transparent materials.

[0211] In the final method step (not shown), the sheet stamp 12" is released from the embossing material. At the end of the method, the sheet stamp 12" is in particular detached from the substrate 13", which is then unloaded. The installation preferably has force monitoring sensors for controlling the demolding step. In the device shown in FIGS. 3a to 3c, an adjustment unit 16' for the holding mechanism for the substrate is located in particular on the underside. The holding mechanism has in particular six degrees of freedom: three translational degrees of freedom along the X, Y and Z directions and three rotational degrees of freedom about the X, Y and Z axes. The translational degrees of freedom serve for the displacement of the holding mechanism and thus the substrate 13" within the XY plane defined by the X and Y directions, as well as for the relative movement of the substrate 13" and the sheet stamp 12" along the Z direction. The rotatability about the X, Y and Z axes serves to perform wedge error compensation (English: WEC Z axis 18') and / or orientation of the substrate 13'' for demolding. [Explanation of symbols]

[0212] 1,1',1'' Board holding mechanism, holding mechanism for board 2,2',2'' processing mechanism, sheet stamp holding mechanism, sheet stamp holding mechanism 3,3' Substrate holder, substrate holder 4,4' Sheet Stamp Holder 5,5',5'' Exhaust means, exhaust means, vacuum line Fixing element for 6,6' board 7,7' Seal, sealing means 8 Actuator (Pin) 9,9' frames, stamp frames, sheet frames, film frames 10, 10', 10'' Pressurizing means, gas pipeline Fixing elements for 11,11' seat frame 12,12',12'' Processing means, embossing means, stamp, embossing stamp, flexible sheet stamp 13,13',13'' boards, board stacks 14,14',14'',14'' Processing room, vacuum stamping room, room 15,15o,15u Alignment Optical System 16,16' Position adjustment unit (alignment stage) 17,17' PCB loading pin 18,18' WEC Z-axis (Wedge Error Compensation) 19,19' UV lamp house 20,20' Sealing means, gate valve, shielding spool (gate valve) 21 Loading unit for sheet frames (film frames) with sheet stamps 22 Processing mechanism, chamber, process chamber, process module 23 Pressure Chamber

Claims

1. A method for processing a substrate (13), in particular for nanoembossing, comprising: a) providing a substrate holding mechanism (1, 1', 1'') for holding the substrate (13); b) providing a mechanism (2, 2', 2'', 22) for processing said substrate (13); c) forming a localized and fluid-tight processing chamber (14, 14', 14'') between said substrate holding mechanism (1, 1', 1'') and said mechanism (2, 2', 2'', 22); d) evacuating the processing chamber (14, 14', 14''); e) processing the substrate (13); At least The evacuation in step d) is carried out after the formation of the processing chamber (14, 14', 14'') in step c). method.

2. 2. The method of claim 1, wherein the forming of the processing chamber (14, 14', 14'') is performed by bringing the substrate holding mechanism (1, 1', 1'') and the mechanism (2, 2', 2'') closer together, and prior to the bringing together, the mechanism (2, 2', 2'') and the substrate holding mechanism (1, 1', 1'') are aligned with each other.

3. 2. The method of claim 1, wherein said forming of said processing chamber (14, 14', 14'') is performed by controllable sealing means (20, 20').

4. 4. The method according to claim 1, wherein the mechanism (2, 2', 2'', 22) has a flexible sheet stamp (12'') for processing, in particular embossing, the substrate (13), and in step e) a fluid-tight pressure chamber (23) between the mechanism (22) and the sheet stamp (12'') is pressurized to bend the sheet stamp (12'', the processing chamber (14, 14', 14'') and the pressure chamber (23) being fluid-separated from each other by the sheet stamp (12, 12', 12'').

5. 5. The method according to claim 4, wherein for processing, in particular embossing, the pressure difference between the pressure in the processing chamber (14, 14', 14'') and the pressure in the pressurizing chamber (23) is adjusted to 0 to 800 mbar, preferably 100 to 600 mbar, more preferably 200 to 600 mbar.

6. An apparatus for processing a substrate (13), comprising: i) a substrate holding mechanism (1, 1', 1'') for holding the substrate (13); ii) a mechanism (2, 2', 2'', 22) for processing the substrate (13); iii) means for forming a localized, fluid-tight processing chamber (14, 14', 14'') between the substrate holding mechanism (1, 1', 1'') and the mechanism (2, 2', 2'', 22); vi) exhaust means (5, 5') for evacuating the processing chamber (14, 14', 14''); v) processing means (12, 12', 12'') for processing the substrate; An apparatus having at least

7. 7. The apparatus according to claim 6, wherein said means is an approaching means for bringing said substrate holding mechanism (1, 1', 1'') and said mechanism (2, 2', 2'') closer to each other.

8. 8. The apparatus according to claim 7, further comprising alignment means for aligning the substrate holding mechanism (1, 1', 1'') and the mechanism (2, 2', 2'', 22) with respect to each other, the alignment means being configured such that the substrate holding mechanism (1, 1', 1'') and the mechanism (2, 2', 2'') can be aligned with each other prior to and / or during operation of the access means.

9. 9. The apparatus according to claim 7 or 8, wherein the substrate holding mechanism (1, 1', 1'') and the mechanism (2, 2', 2'', 22) have corresponding sealing means (7, 7'), and the access means are configured such that after action of the access means, the corresponding sealing means (7, 7') form the processing chamber (14, 14', 14'') between the substrate holding mechanism (1, 1', 1'') and the mechanism (2, 2', 2'').

10. 7. The apparatus of claim 6, wherein said means is a controllable sealing means (20, 20') for forming said processing chamber (14, 14', 14'') between said substrate holding mechanism (1, 1', 1'') and said mechanism (22).

11. 11. Apparatus according to claim 10, wherein the substrate holding mechanism (1, 1', 1'') and the mechanism (22) are formed integrally.

12. 12. Apparatus according to at least one of claims 6 to 11, wherein the processing means comprises a flexible sheet stamp (12'') for embossing, in particular nanoembossing, the substrate (13).

13. 13. The apparatus according to claim 12, further comprising a pressure means (10, 10', 10'') for forming a fluid-tight pressure chamber (23) between the mechanism (22) and the sheet stamp (12''), the pressure chamber (23) being fluidly separated from the processing chamber (14, 14', 14'') by the sheet stamp (12''), the sheet stamp (12'') being precisely deformable by the pressure means (10'').

14. 13. The apparatus according to claim 12, wherein the apparatus is configured such that the pressure difference between the pressure in the processing chamber (14, 14', 14'') and the pressure in the pressurizing chamber (23) is adjustable to 0-800 mbar, preferably 100-600 mbar, more preferably 200-600 mbar.

15. 15. The apparatus according to claim 13 or 14, wherein the pressure means (10'') is simultaneously an evacuation means, whereby the sheet stamp (12'') can be released from the substrate (13) by evacuation of the pressure chamber (23).

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