Multilayer Waveguide Transition

Abstract

The present disclosure relates to a multilayer waveguide transition (100), an inter-waveguide transition (101), and a waveguide T-junction (103). The waveguide transition (100) comprises an upper layer (1), at least one intermediate layer (2, 201, 202), and at least one lower layer (3), wherein the at least one intermediate layer (2, 201, 202) comprises an elongated waveguide channel (21), and a metasurface (4) is disposed to surround the elongated waveguide channel (21), and the metasurface (4) is disposed between the upper layer (1) and the at least one intermediate layer (2, 201, 202) and between the lower layer (3) and the at least one intermediate layer (2, 201, 202). The waveguide transition portion (100) also includes a port opening (31) disposed in the lower layer (3) and overlapping the connecting portion (C) of the elongated waveguide channel (21), and a central conductor disposed in the elongated waveguide channel (21).

Description

[Technical Field]

[0001] FIELD OF THE INVENTION The present invention relates to waveguide-to-waveguide transition structures, and more particularly to waveguide-to-waveguide transition structures with multiple physical layers. [Background technology]

[0002] Various types of waveguides or transmission lines are widely used to route electromagnetic waves to and / or from electronic components. For example, waveguides or transmission lines are commonly used to route electromagnetic waves from a transmitter to one or more antennas, which then transmit the electromagnetic waves into the air, enabling wireless transmission of data.

[0003] Many different types of waveguides exist, including hollow waveguides (such as traditional hollow rectangular waveguides) and transmission lines. These are embedded in or placed on substrate layers such as microstrip, stripline, or coplanar transmission lines. Each type of waveguide or transmission line can be further tailored to various operating frequencies. For example, for hollow rectangular waveguides, shrinking the dimensions of the waveguide as the operating frequency increases ensures that only a single mode propagates through the waveguide.

[0004] In recent years, much research has been done on other types of waveguides, such as gap waveguides. In gap waveguides, a first layer with a metamaterial structure consisting of protruding pins (sometimes called a bed of nails) is placed face-to-face with a second flat layer, allowing electromagnetic waves to propagate in the space between the first and second layers. This layout has been found to have many advantages, including good performance (e.g., low leakage) and ease of fabrication.

[0005] For example, international application publication number WO2021 / 251866 presents a multilayer waveguide with a metasurface, comprising thick and thin structures forming a metasurface. This type of waveguide can be made significantly thinner than conventional waveguides, reducing manufacturing costs and making the waveguide more compact while maintaining good radiation performance. However, with all types of waveguides or transmission lines, problems arise at interfaces where one waveguide or transmission line is coupled to another, or at interfaces between electronic components (e.g., a receiver's transmitter) and the waveguide or transmission line. Achieving low reflection and insertion loss levels at various interfaces is challenging even in a laboratory environment, and the problem is exacerbated by increased manufacturing tolerances in large-scale manufacturing. Achieving good performance transitions for the thin multilayer waveguides described above is particularly challenging. Designing high-performance transitions for this novel, very thin, multilayer waveguide design has proven challenging. That is, some multilayer waveguide designs are underutilized due to the challenges associated with feeding / extracting electromagnetic signals from these structures. Summary of the Invention

[0006] SUMMARY OF THE INVENTION The object of the present invention is to overcome at least some of the drawbacks of the above-mentioned prior art solutions, in particular the drawbacks of the transitions for multilayer waveguides with very thin layers.

[0007] According to a first aspect of the present invention, there is provided a multilayer waveguide transition comprising at least three physical layers in a stacked configuration, the at least three physical layers comprising an upper layer, at least one intermediate layer, and a lower layer. A lower surface of the upper layer faces an upper surface of at least one of the intermediate layers, and an upper surface of the lower layer faces a lower surface of at least one of the intermediate layers. The at least one intermediate layer comprises an elongated waveguide channel extending along an elongated axis having a guide portion and a connecting portion. A metasurface is disposed between the lower surface of the upper layer and the upper surface of the at least one intermediate layer, and between the upper surface of the lower layer and the lower surface of the at least one intermediate layer, so as to surround the elongated waveguide channel. The lower layer is provided with a port opening overlapping the connecting portion of the elongated waveguide channel. The elongated waveguide channel is provided with a central conductor disposed within the guide portion and extending at least partially within the connecting portion.

[0008] A metasurface disposed between the lower surface of the upper layer and the upper surface of at least one intermediate layer means that at least one of the lower surface of the upper layer and the upper surface of the at least one intermediate layer has a metasurface. The same applies to a metasurface disposed between the lower surface of the at least one intermediate layer and the upper surface of the lower layer.

[0009] The metasurface comprises a plurality of pins arranged in a regular or irregular (e.g., random) pattern. The pins form thick and thin sections. Each pin constitutes a thick section, and the spaces between the pins constitute thin sections. For example, the thick sections protrude from the thin sections and have a height corresponding to the remainder of the layer, while the thin sections are positioned lower than the remainder of the layer. That is, the metasurface can be formed as an embossment of an enclosing surface.

[0010] The height difference between the thick and thin sections is less than one-quarter of the operating wavelength. Preferably, the height difference is less than one-fifth, one-sixth, one-eighth, or one-tenth of the operating wavelength. In some embodiments, the height difference is less than one-fifteenth or one-twentieth of the operating wavelength. This allows the layers of the multi-layer waveguide to be made very thin, making the waveguide compact and low-cost to manufacture, and enabling manufacturing techniques that are not otherwise available, such as stamping and chemical etching.

[0011] In some embodiments, the height difference between the thick and thin sections is 30-80% of the thickness of the layer, for example, 50-70% of the thickness of the layer.

[0012] Furthermore, in this multilayer waveguide, the individual layers do not need to be arranged so that they are in electrical contact. The layers may be arranged slightly spaced apart from each other rather than being stacked so that they are in electrical and physical contact with each other. Preferably, the layers are arranged close to each other, for example, within one-quarter of the operating wavelength. More preferably, the layers are arranged within one-fifth, one-sixth, one-eighth, or one-tenth of the operating wavelength from each other.

[0013] The present invention is based, at least in part, on the realization that a multilayer metasurface structure and a central conductor extending within the coupling section significantly reduce insertion loss and reflection of electromagnetic waves transmitted from or to a port opening. Thus, a space-efficient, high-performance transition is provided between a port opening (e.g., coupled to a rectangular waveguide or located adjacent to a transmit / receive patch) and a central conductor waveguide extending within the multilayer waveguide. Surprisingly, this transition has been found to be highly suitable for very thin multilayer waveguide designs with metasurfaces having quarter-wavelength or smaller textures. This solves the problem of providing a high-performance transition for very thin waveguide designs, enabling this type of multilayer waveguide to be coupled to a wide range of other types of waveguide structures, such as rectangular waveguides and microstrip waveguides.

[0014] This laminated structure makes the waveguide easy to manufacture (e.g. the layers can be manufactured separately) and very compact while maintaining high performance in terms of low leakage, making this transition very suitable for use in antenna or radar devices used in road vehicles.

[0015] In some embodiments, the guide portions of the elongated waveguide channel extend away from the connecting portion in at least two different directions to form first and second guide portions having a common connecting portion, each of the first and second guide portions comprising a respective suspended central conductor that extends at least partially within the common connecting portion.

[0016] Thus, a transition is provided that splits the electromagnetic wave incident on the port opening in two, e.g., this embodiment functions as a power divider that can be used to feed two or more antennas, for example.

[0017] In some embodiments, each central conductor and / or elongated waveguide channel is wider in the coupling portion compared to the guiding portion.

[0018] A wider center conductor and / or elongated waveguide channel in the transition section compared to the guide section has been found to promote better matching performance (eg, lower loss and reflection).

[0019] In some embodiments, the central conductor enters the connecting portion along a first axis, the central conductor comprising a transverse element extending along a second axis substantially perpendicular to the first axis, the transverse element being connected to at least one of the intermediate layers at the connecting portion at both ends of the elongated waveguide channel.

[0020] For example, the center conductor is T-shaped and connects to either side of an elongated waveguide aperture.

[0021] The center conductor with transverse elements at the connecting section has several advantages. First, it improves the connection. Second, it improves the structural rigidity of the center conductor. This is important because the center conductor, being integral with at least one intermediate layer, is very thin and brittle, making it susceptible to bending when the multilayer waveguide is subjected to acceleration or vibration.

[0022] In some embodiments, at least one center conductor enters the connecting portion from an entrance side, and an air gap exists between an end of the center conductor and an opposing side of the connecting portion, the opposing side being opposite the entrance side.

[0023] The presence of the gap improves connectivity, and in some embodiments, a support tab is placed in the gap, dividing the gap in two.

[0024] In some embodiments, the elongated waveguide channel comprises an intermediate portion between each guide portion and the connecting portion, and a width of each central conductor in the intermediate portion differs from its width in at least one of the respective guide portions and the connecting portion.

[0025] The inventors have realized that by varying the width of the center conductor in the middle section, the impedance match at the transition is improved and insertion loss and reflections are reduced.

[0026] In some embodiments, each center conductor is provided with intermittently placed support stubs connecting each center conductor to at least one of the intermediate layers.

[0027] The support stubs provide structural integrity for the center conductor, which is disposed or "suspended" by the support stubs in the elongated waveguide opening. Preferably, the support stubs are disposed alternately on either side of the center conductor. The support stubs are also preferably thin, e.g., having a width of at most half, more preferably at most one-quarter, the width of the center conductor. In this way, the effect of the support stubs on signal propagation is reduced.

[0028] According to a second aspect of the present invention, there is provided an electromagnetic waveguide component comprising the multilayer waveguide transition according to the first aspect of the present invention and a printed circuit board (PCB). The PCB comprises active components connected to transmitting and / or receiving elements configured to transmit and / or receive electromagnetic waves, and the PCB may be mounted under a lower surface of the lower layer opposite the upper surface such that the transmitting and / or receiving elements are positioned to be in electromagnetic communication with the port opening. The PCB may be mounted directly to the lower layer. Alternatively, the PCB may be mounted to a spacer element positioned between the PCB and the lower layer. The spacer element may have one or more recesses or through-openings facing the PCB. The recesses or through-openings may be configured to accommodate components protruding from the PCB. Because the lower surface of the lower layer is substantially or generally flat, the spacer element may provide high structural stability and / or thermal contact between the lower layer and the PCB components.

[0029] By allowing the PCB to be mounted directly on the lower layer, the electromagnetic waveguide component can be made very compact.

[0030] In some embodiments, the transmitting and / or receiving elements are located external to the active component, or the transmitting and / or receiving elements are integrated into the same package as the active component to form a launcher within a package component.

[0031] In some embodiments, the active component is configured to be placed in thermal contact with the lower layer via a thermal pad disposed between the lower layer and the active component.

[0032] An advantage of placing the active components in thermal contact with the underlying layer is that heat dissipated from the PCB is transferred to the multilayer waveguide transition, cooling the PCB. In some embodiments, the layers are at least partially (e.g., clad) or entirely made of metal, which is a good thermal conductor. The waveguide transition thus serves the dual role of heat sink and electromagnetic waveguide.

[0033] While thermal pads have some advantages (e.g., they are rigid and therefore provide improved structural stability), other means of providing thermal contact of the active components to the underlying layers can also be used, such as thermal paste or heat pipes.

[0034] In some embodiments, a spacer element is disposed between the PCB and the lower layer, the spacer element having openings configured to allow active components or thermal pads to make thermal contact with the lower layer.

[0035] The spacer element allows a predetermined spacing between the underside of the lower layer and the PCB. This allows, for example, the selection of an appropriate heat pad or the ability to maintain the lower layer in direct contact with the active components. That is, the lower layer and the PCB are positioned at the desired spacing and held together using the same component (the spacer element), simplifying and streamlining the manufacturing process. In some embodiments, the spacer element includes at least one mounting pin configured to be melted or compressed. At least a tip of the mounting pin is configured to penetrate the lower layer. Therefore, the mounting pin can be melted or compressed from above the lower layer to secure the spacer element to the lower layer.

[0036] In some embodiments, a metasurface is disposed between the upper surface of the PCB and the lower surface of the spacer element and / or between the lower surface of the underlying layer and the upper surface of the spacer element.

[0037] The presence of a metasurface disposed between the PCB and the spacer element and / or between the spacer element and the underlying layer improves the electromagnetic wave propagation between the PCB and the waveguide transition, e.g., by reducing losses.

[0038] According to a third aspect of the present invention, there is provided a multi-layer waveguide transition according to the first aspect of the present invention, comprising a multi-layer waveguide transition forming a first waveguide transition having a first port opening in an upper layer. The waveguide transition further comprises a second upper layer and a second at least one intermediate layer, a lower surface of the second upper layer facing an upper surface of the at least one second intermediate layer, the at least one second intermediate layer comprising a second elongated waveguide channel extending along an elongated axis having a second guiding portion and a second connecting portion. A metasurface is further disposed between the lower surface of the second upper layer and the upper surface of the at least one second intermediate layer, and a metasurface is disposed between the lower surface of the second at least one intermediate layer and the upper surface of the upper layer. Additionally, the second elongated waveguide channel is provided with a central conductor disposed within the second guide portion and extending at least partially within the second connecting portion, and the first port opening is positioned to be in electromagnetic communication with the second connecting portion of at least one of the second intermediate layers.

[0039] That is, while the waveguide portions of a waveguide transition can be configured to follow any two-dimensional path within the stacked layers, the inter-waveguide transition formed by combining a multi-layer waveguide transition with a second top layer and a second middle layer can direct signals in a direction perpendicular to the layers, for example, between two multi-layer waveguides.

[0040] In some embodiments, the inter-waveguide transition further comprises a second lower layer, and the metasurface is disposed between a lower surface of the second at least one intermediate layer and an upper surface of the upper layer, and / or between the second lower layer and the at least one second intermediate layer. A second port opening is provided in the second lower layer, and the first port opening and the second port opening are arranged to overlap.

[0041] Thus, two separate waveguide transitions can be combined to form an inter-waveguide transition.

[0042] In some embodiments, each port opening is slit-shaped having two connected elongated slit segments extending along respective slit port axes, the slit segment axes forming an angle of 10 to 80 degrees, or preferably 25 to 65 degrees, or most preferably about 45 degrees.

[0043] The presence of slit sections that are angularly offset from one another facilitates coupling between multi-layer waveguide transitions.

[0044] According to a fourth aspect of the present invention, there is provided a multilayer waveguide T-junction comprising at least three physical layers in a stacked configuration. The at least three physical layers comprise an upper layer, at least one intermediate layer, and a lower layer. Additionally, a lower surface of the upper layer faces an upper surface of at least one of the intermediate layers, and an upper surface of the lower layer faces a lower surface of at least one of the intermediate layers. At least one of the intermediate layers comprises an elongated waveguide channel having a first portion extending from a first end to a second end along a first axis, and a second portion connected to the first portion at a junction located between the first end and the second end of the first portion and extending along a second axis to a third end, the second axis being substantially perpendicular to the first axis. A metasurface is disposed between the lower surface of the upper layer and the upper surface of at least one of the intermediate layers, and between the upper surface of the lower layer and the lower surface of at least one of the intermediate layers, so as to surround the elongated waveguide channel. The elongated waveguide channel also includes a suspended center conductor at the first and second portions, the width of the first portion of the center conductor tapering at the junction such that the width of the center conductor decreases from the first end toward the junction and from the second end toward the junction.

[0045] That is, the waveguide junction can function as a compact power divider / combiner confined to the multilayer waveguide, and therefore the junction can be made very thin and compact.

[0046] In some embodiments, the first portion of the center conductor has a distal side and a proximal side, the proximal side being closer to the third end, the second portion of the center conductor being connected to the proximal side of the first portion of the center conductor, the distal side of the second portion of the center conductor tapering toward the proximal side at the junction, and / or the width of the second portion of the center conductor increasing from a first width to a second width at the junction to the proximal side of the second portion of the center conductor.

[0047] It is understood that the taper and / or increase in width from the first width to the second width can be continuous or stepwise. Tapering the distal side and / or increasing width has been found to facilitate coupling and reduce loss, reflections, etc.

[0048] In some embodiments of the first, second, third or fourth aspect of the present invention, the metasurface comprises a thick section and a thin section, and the height difference between the thick section and the thin section is less than the wavelength at the operating frequency divided by 5, preferably less than the wavelength divided by 8, and most preferably less than the wavelength divided by 10.

[0049] This allows the waveguide to be made very thin and compact.

[0050] Any feature or advantage described with respect to the first aspect of the present invention shares the same feature or advantage with the invention according to the second, third and fourth aspects.

[0051] Aspects of the present invention will now be described in more detail with reference to the accompanying drawings, in which presently preferred embodiments are shown. [Brief explanation of the drawings]

[0052] [Figure 1a] FIG. 1a illustrates an exploded view of a multi-layer waveguide transition according to some embodiments. [Figure 1b] FIG. 1b is a top view of the center conductors of the bottom and middle layers of a multi-layer waveguide transition according to some embodiments. [Figure 1c] FIG. 1c is a perspective view of a lower layer of a multi-layer waveguide transition according to some embodiments. [Figure 2] FIG. 2 illustrates a top view of the center conductors of the bottom and middle layers of a multi-layer waveguide transition with a bend according to some embodiments. [Figure 3] FIG. 3 is a perspective view of an assembled multi-layer waveguide transition according to some embodiments. [Figure 4a] FIG. 4a is a top view of the center conductors of the bottom and middle layers of a multi-layer waveguide transition with power distribution according to some embodiments. [Figure 4b] FIG. 4b is a perspective view of a multi-layer waveguide transition with power distribution according to some embodiments with the top layer lifted. [Figure 5a] FIG. 5a is an exploded view of a waveguide-to-waveguide transition according to some embodiments. [Figure 5b] FIG. 5b shows a top view of the center conductors of the bottom and middle layers of one multi-layer waveguide at a waveguide-to-waveguide transition according to some embodiments. [Figure 5c] FIG. 5c illustrates a cross-sectional perspective view of a waveguide-to-waveguide transition according to some embodiments. [Figure 6a] FIG. 6a illustrates a cross-sectional view of an electromagnetic waveguide component according to some embodiments. [Figure 6b] FIG. 6b illustrates a cross-sectional view of a lower layer with an opening according to some embodiments. [Figure 6c] FIG. 6c is a top-down view of a PCB having active components connected to multiple transmitting and / or receiving elements according to some embodiments. [Figure 6d] FIG. 6d is a perspective view of the underside of a spacer element according to some embodiments. [Figure 6e] FIG. 6e is a perspective view of a top side of a spacer element according to some embodiments. [Figure 7a] FIG. 7a shows the center conductors of the bottom and middle layers of a waveguide junction according to some embodiments. [Figure 7b] FIG. 7b illustrates a perspective view of a waveguide junction with the top layer lifted according to some embodiments. [Figure 8a] FIG. 8a is a cross-sectional view of a multi-layer waveguide having one intermediate layer according to some embodiments. [Figure 8b] FIG. 8b is a cross-sectional view of a multi-layer waveguide having three intermediate layers according to some embodiments. DETAILED DESCRIPTION OF THE INVENTION

[0053] In the following detailed description, preferred embodiments of the present invention will be described. However, it should be understood that the features of various embodiments are interchangeable between embodiments and can be combined in various ways, unless otherwise specified. In the following description, many specific details are set forth to provide a thorough understanding of the present invention. However, it will be apparent to those skilled in the art that the present invention can be practiced without these specific details. In other instances, well-known structures and functions are not described in detail to avoid obscuring the present invention.

[0054] FIG. 1a shows a multilayer waveguide 10 according to some embodiments. The multilayer waveguide 10 comprises three physical layers 1, 2, 3: a top layer 1, at least one middle layer 2, and a bottom layer 3. In the embodiment shown in FIG. 1a, there is only one middle layer 2, which allows for a compact design. However, as will be explained below with respect to FIG. 8b, there may be more than one middle layer 2.

[0055] In some embodiments, the upper layer 1 and the lower layer 3 are thicker than the at least one intermediate layer 2. For example, the upper layer 1 and the lower layer 3 are 300 μm to 500 μm thick, while the at least one intermediate layer 2 is 50 μm to 200 μm thick, e.g., 100 μm thick. The above example thicknesses are suitable for simple and cost-effective manufacturing, but are merely exemplary and may vary outside these ranges depending on factors such as operating frequency. The above example thicknesses are suitable for an operating frequency of 77 GHz.

[0056] Each layer 1, 2, and 3 can be individually fabricated from a single piece of metal. Layers 1, 2, and 3 can all be fabricated from the same metal. Alternatively, it is contemplated that at least one layer is fabricated from a first metal and at least one other layer is fabricated from a second, different metal. In some embodiments, top layer 1 and bottom layer 3 are fabricated from a first metal, and at least one middle layer 2 is fabricated from a second, different metal. For example, top layer 1 and bottom layer 3 are fabricated from brass, and at least one middle layer 2 is fabricated from copper. Because the majority of losses occur in at least one middle layer 2, it is preferable to use the most conductive metal for at least one middle layer 2. In contrast, top layer 1 and bottom layer 3 can be fabricated from a cheaper, less conductive material, such as brass. In addition to brass and copper, another suitable metal for fabricating layers 1, 2, and 3 is aluminum.

[0057] In some embodiments, at least one layer 1, 2, 3 is made of a non-metallic material (e.g., a dielectric material such as plastic or other polymer-based material) and is coated with a thin outer layer of metal (e.g., brass, copper, or aluminum). Layers 1, 2, 3 may be coated on both the upper surface 1a, 2a, 3a and the lower surface 1b, 2b, 3b. It is also contemplated that layers 1, 2, 3 may be coated only on one side. For example, it is contemplated that only the lower and upper surfaces of upper layer 1 and lower layer 3 facing other layers may be coated, i.e., these layers may be coated only on the side facing other layers.

[0058] A metasurface 4 is disposed between the lower surface 1b of the upper layer 1 and the upper surface 2a of at least one intermediate layer 2, and a metasurface 4 is disposed between the upper surface 3a of the lower layer 3 and the lower surface 2b of at least one intermediate layer 2. In the embodiment shown in FIG. 1a, the metasurface 4 is disposed on the upper surface 3a of the lower layer 3 facing the flat surface of the lower surface 2b of at least one intermediate layer 2, and on the lower surface 1b of the upper layer 1 facing the flat surface of the upper surface 2a of at least one intermediate layer 2. Alternatively, the metasurface 4 is disposed on the lower surface 2b of at least one intermediate layer facing the flat surface of the upper surface 3a of the lower layer and / or on the upper surface 2a of at least one intermediate layer 2 facing the flat surface at the bottom of the upper layer 1.

[0059] In other words, the metasurface 4 can be configured in many ways. Preferably, every interface between two layers is provided with a metasurface 4 on at least one of the layers. More preferably, each metasurface faces the flat portion of the adjacent layer. That is, only one metasurface is disposed between two adjacent layers. Generally, the metasurface 4 is a repeating or random structure that forms an electromagnetic bandgap (EBG) structure that prevents electromagnetic waves from propagating in the space between layers 1, 2, and 3. The metasurface 4 can be defined by multiple negative layer volumes, e.g., a series of through-holes in a layer surrounding an elongated channel, or multiple positive layer volumes, e.g., multiple pins surrounding an elongated channel. While the metasurface is implemented as pins in FIG. 1 , multiple through-holes can also be utilized, as detailed in International Application WO 2019 / 083439, which is incorporated herein by reference in its entirety.

[0060] The metasurface 4 comprises a plurality of thick sections 41 (i.e., pins) and thin sections 42 arranged in a regular or irregular pattern. In FIG. 1a, the pins are substantially square in shape, but this shape is merely illustrative and many different shapes are contemplated. For example, the pins can be circular, elliptical, triangular, hexagonal, or any polygonal shape. Also, while the pins 41 are depicted with flat tops, it is contemplated that the pins have rounded, conical, or pyramidal tops. In some embodiments, each face comprising the metasurface has a flat portion surrounding the metasurface, with the thick sections having a thickness corresponding to the layer thickness in the flat portion and the thin sections having a thickness less than the thickness in the flat portion. For example, each layer is fabricated from a sheet material having a thickness corresponding to the flat portion. The metasurface 4 is constructed by etching the thick sections 42 to form thin sections 41 between them.

[0061] At least one intermediate layer 2 has an elongated channel 21 (also referred to as an elongated channel or an aperture). The elongated channel 21, together with the upper layer 1 and the lower layer 3, defines a waveguide. In some embodiments, this is achieved by providing an interruption 45 in the metasurface 4 that corresponds to the elongated channel 21. The interruption 45 can be a channel, such as a flat section, where the metasurface 4 structure does not follow the elongated channel 21. The metasurface 4 prevents electromagnetic waves from propagating in the vertical space between layers 1, 2, and 3. That is, the electromagnetic waves are confined to propagate along the elongated waveguide channel. As shown in Figure 1a, the metasurface 4 is positioned to surround the elongated channel 21. This achieves confinement of the electromagnetic waves.

[0062] The lower layer 3 also has a port opening 31 that overlaps at least a part of the connecting portion of the waveguide channel 21 .

[0063] 1b, a top-down view of bottom layer 3 is shown with elements of at least one intermediate layer 2 superimposed on bottom layer 3. At least one intermediate layer has a center conductor 25 disposed within elongated channel 21. Center conductor 25 may be suspended within elongated channel 21, supported by support stubs 27 connecting intermediate layer 2 to center conductor 25. For example, center conductor 25 may be formed by etching, stamping, or otherwise removing material from at least one intermediate layer 2 to form the suspended center conductor 25. Center conductor 25 disposed within an elongated waveguide channel forms a coaxial waveguide.

[0064] The lower layer 3 also includes a port opening 31 that overlaps at least a portion of the elongated channel 21 and the central conductor 25. The port opening 31 is where the waveguide is connected to an external device (e.g., another waveguide or a transmitting and / or receiving element). The port opening 31 is surrounded by the metasurface 4 to prevent electromagnetic waves from leaking out of the waveguide. The port opening 31 in the lower layer 3 at least partially overlaps the elongated channel 21. For example, a portion of the elongated channel 21 is configured to coincide with the port opening 31 in a projection normal to the layer 3.

[0065] Similarly, central conductor 25 also extends to at least partially overlap port opening 31. In the embodiment shown in Figure 1b, central conductor 25 includes a transverse element that spans the portion of elongated channel 21 that overlaps port opening 31. Transverse element 26 and central opening 25 may form a T-shape.

[0066] Also shown in FIG. 1b is an embodiment in which the width of center conductor 25 varies along its range, for example to allow for better conformance and transitionability.

[0067] The elongated channel 21 includes a waveguide portion A in which the width L1 of the central conductor 25 is constant. The width L4 of the elongated channel 21 is greater than the width L1 of the central conductor 25. That is, the central conductor 25 may be disposed within the elongated channel 21 while being spaced apart on both sides from the remainder of at least one intermediate layer. Optionally, one or more support stubs 27 are present to support the central conductor 25 in the waveguide portion A.

[0068] The elongated channel 21 further includes a connecting portion C that at least partially (or entirely) overlaps the underlying port opening 31. In the illustrated embodiment, the connecting portion C of the elongated channel 21 has a width L7 that is greater than the width L4 of the waveguide portion A, and a length L6. The width of the central conductor 25 also increases from L1 at the waveguide portion A to L7 at the transverse element 26 of the central conductor 25 that is located at the connecting portion C.

[0069] To achieve good connectivity, it is beneficial to leave some void space in the elongated channel 25 within the connecting portion C. As shown in FIG. 1b, a void L9 exists between the transverse element 26 and the distal end of the elongated channel 21. Optionally, a support stub 27 may be placed in the void L9 to provide structural stability. Similarly, a void L8 exists between the outer end of the transverse element 26 and the proximal side of the elongated channel 21. The center conductor 25 enters the connecting portion from the proximal side and extends to the distal end opposite the proximal side.

[0070] A T-shaped center conductor transverse element 26 that flares into port opening 31 provides a good transition, although it is envisioned that many other shapes for center conductor 25 in connecting portion C are possible. Regardless of the shape used in connecting portion C, there can be challenges in providing an adequate impedance match between waveguide portion A and connecting portion C to avoid reflections and excessive insertion loss.

[0071] To this end, in some embodiments, an intermediate portion B is provided between the waveguide portion A and the connecting portion C of the elongated channel 21. In the intermediate portion B, the width of the central conductor 25 varies to facilitate impedance matching between the waveguide portion A and the connecting portion C. In the illustrated embodiment, the width of the central conductor 25 in the intermediate portion B varies from a first width L1 to a second width L2 to a third width L3, and then back to the second width L2 as the central conductor 25 approaches the connecting portion C.

[0072] The first width L1 is the width of the central conductor 25 at the guide portion A, the second width L2 is the width of the central conductor 25 entering the connecting portion 25, and the third width L3 is smaller than the first width L1 and the second width L2. In some embodiments, the second width L2 is larger than the first width L1. However, it is understood that the width configurations and variations in the middle portion B are merely exemplary and that many other width configurations are possible.

[0073] Referring further to FIG. 1c, a perspective view of the lower layer 3 is shown. The lower layer 3 has a port opening 31 positioned to at least partially overlap the elongated channel 21. The port opening 31 extends through the lower layer 3 from the upper surface 3a to the lower surface 3b. A metasurface 4, including a thick section 41 and a thin section 42, is disposed on the upper surface 3a of the lower layer 3, facing the at least one intermediate layer. Alternatively, the upper surface 3a of the lower layer 3 is flat, and the metasurface 4 is disposed on the lower surface of the at least one intermediate layer. A region 35 of the lower layer 3 is free of the thick section 42 of the metasurface. The region 35 is configured to overlap the elongated channel of the at least one intermediate layer. In this manner, the metasurface 4 can surround the elongated channel and form a waveguide.

[0074] The upper layer may be identical to the lower layer 3, except that it does not have the port openings 31 and is inverted relative to the lower layer 3 so that the metasurface 4 of the upper layer faces the upper surface of the at least one intermediate layer.

[0075] 2 shows a top view of intermediate layer 2 having curved elongated channel 21 and curved central conductor 25. In the illustrated embodiment, the 90 degree bend is provided in mid-section B of elongated channel 21, although the bend may be provided elsewhere along elongated channel 21, such as in waveguide section A. The width of central conductor 25 may vary as discussed above with respect to FIG. 1b, whether or not a bend is provided in mid-section B.

[0076] By providing one or more bends in the elongated channel 21, the electromagnetic signals to / from the connecting portion C can be guided in a desired direction parallel to the layers forming the waveguide, while freely positioning the connecting portion C, the transverse element 26, and the port openings in the underlying layers.

[0077] FIG. 3 shows a perspective view of a waveguide transition 10 comprising an upper layer 1, a middle layer 2, and a lower layer 3. The lower layer 3 has a port opening (not shown) through which an electromagnetic signal can enter the waveguide. The electromagnetic signal propagates along an elongated channel 21 in a direction parallel to layers 1, 2, and 3. The elongated channel also has a central conductor 25 suspended within the middle layer 2, making the waveguide a coaxial waveguide. Preferably, each metasurface is positioned facing the flat surface of the adjacent layer. In the embodiment shown in FIG. 2, the middle layer 2 does not have a metasurface and is substantially flat on both its upper and lower surfaces. The upper layer 1 and the lower layer 3 each include a metasurface facing the flat middle layer 2.

[0078] FIG. 4a shows the middle layer 2 of the waveguide transition. The placement of the thick metasurface sections is highlighted. The elongated channel 21 includes first and second waveguide portions A1 and A2 extending away from a common connecting portion C. Each waveguide portion A1, A2 includes a respective center conductor 25a, 25b extending at least partially into the common connecting portion C of the elongated channel 21, at least partially overlapping a port opening 31 located in the underlying layer. The center conductors 25a and 25b are separated by an air gap at the common connecting portion C. In this manner, the waveguide transition functions as a power divider, dividing an electromagnetic signal entering the two portions through the port opening into two portions, each propagating along a respective waveguide portion A1, A2. Each central conductor 25a, 25b preferably has a widened portion 28a, 28b that extends at least into the common connecting portion C and, optionally, at least partially into the respective waveguide portion A1, A2 or any respective intermediate portion (not shown).

[0079] 4b, the waveguide transition of FIG. 4a is shown in a perspective view with the top layer 1 lifted up, revealing the middle layer 2 with the common connecting portion C and respective waveguide portions A1 and A2, as well as central conductors 25a and 25b extending away from the common connecting portion C. The thick and thin sections 41 forming the metasurface are arranged to surround the waveguide portions A1 and A2 and the common connecting portion C. The bottom layer 3 has port openings (not shown) where electromagnetic signals can enter and exit the waveguide transition from and to a hollow waveguide, such as a rectangular waveguide.

[0080] FIG. 5 shows an exploded view of a waveguide-to-waveguide transition 101 including a first waveguide transition 10 and a second waveguide transition 10′. Each of the first waveguide transition 10 and the second waveguide transition 10′ may be present in any of the embodiments described herein. Each waveguide transition 10, 10′ has a port opening 31 in the lower layer 3′ and the upper layer 1, respectively. The waveguide transitions 10, 10′ are positioned relative to each other such that the port openings 31 are in electromagnetic communication with each other. For example, the port openings 31 are aligned with each other. At least one middle layer of each waveguide transition 10, 10′ further includes a respective elongated channel 21, 21′ and a central conductor extending within the elongated channel 21, 21′. The central conductor of each waveguide transition 10, 10′ extends to at least partially overlap the port opening 31. In this manner, an electromagnetic signal propagating along the elongated channel of the first waveguide transition 10 can enter the second waveguide transition 10' through the communication port opening 31 and propagate along the elongated channel 21' of the second waveguide transition 10'.

[0081] In some embodiments, the bottom layer 3' of the second waveguide transition 10' or the top layer 1 of the first waveguide transition 10 is omitted, leaving one of the top layer 1 of the first transition 10 and the bottom layer 3' of the second transition 10' to function as a single layer separating at least one middle layer 2, 2' of each transition 10, 10'. That is, only five layers can be used to form the inter-waveguide transition 101, rather than six layers 1, 2, 3, 1', 2', 3' total. This results in a thinner inter-waveguide transition 101.

[0082] 5b, a top view of the first waveguide transition 10 shows how the port opening 31 in the lower layer 3 overlaps the central opening 25 extending within the elongated channel. The elongated channel has a waveguide portion A and a connecting portion C. The connecting portion at least partially overlaps the port opening 31. As with the embodiment described in FIG. 1b, it has been found that varying the width of the central conductor 25 at or at least near the connecting portion C improves connectivity between the two waveguide transitions. It has been found that the central conductor may taper (e.g., stepwise or continuously tapered) at the connecting portion from its width at waveguide portion A to a narrower width at the connecting portion C as it transitions to another waveguide transition via the port opening 31. In the illustrated embodiment, at least a portion of the width reduction (e.g., the width reduction step) overlaps the extent of the port opening 31.

[0083] The narrow central conductor in the connecting portion may connect to the distal side of the elongated channel 21. The distal side is opposite the side where the waveguide portion A enters the connecting portion C. This provides improved structural stability, although it is possible for the central conductor 25 not to contact the distal side.

[0084] The port openings 31 are preferably elongated with at least one bend, as this has been found to enhance electromagnetic coupling between the waveguide transitions 10, 10'. For example, the first and second port openings 31 may be oriented such that their respective first slit portion axes A S1 and the second slit portion axis A S2 The slit portion has at least a first elongated portion and a second elongated portion extending along the slit portion axis A. S1 and slit part axis A S2 The transitions 10, 10' form an angle of 10 to 80 degrees, or preferably 25 to 65 degrees, and most preferably about 45 degrees. Having more than one slit section allows for many different slit shapes. For example, the port opening 31 between the transitions 10, 10' can be S-, Z-, or C-shaped.

[0085] FIG. 5c shows a cross-sectional perspective view of an inter-waveguide transition 101 according to some embodiments. The inter-waveguide transition is similar to the inter-waveguide transitions of FIGS. 5a and 5b, except that in this embodiment, the elongated waveguide channels of the first and second waveguide transitions 10, 10′ extend away from each other in different directions. In the inter-waveguide transition of FIG. 5a, an electromagnetic signal propagating in a first direction along the first elongated waveguide channel 21 toward the port opening 31 propagates through the port opening 31 into the second elongated waveguide channel 21′ and then propagates along a second direction opposite the first direction. In the inter-waveguide transition of FIG. 5c, an electromagnetic signal propagating in a first direction along the first elongated waveguide channel 21 toward the port opening 31 propagates through the port opening 31 into the second elongated waveguide channel 21′ and continues propagating in the first direction. That is, the direction of extension along the elongated channels of each waveguide at the waveguide-to-waveguide transition may be the same or different. For example, each elongated waveguide channel 21, 21' extends away from port opening 31 along a respective axis. The respective axes form an angle of approximately zero degrees (as shown in FIG. 5a) or approximately 180 degrees (as shown in FIG. 5c). It is further contemplated that the elongated waveguide channels may be arranged in other manners such that the respective axes form any angle between 0 and 350 degrees, e.g., approximately 45 degrees or approximately 90 degrees.

[0086] FIG. 6a illustrates an electromagnetic component 102 according to some embodiments. The electromagnetic component includes a waveguide transition and a PCB 5 disposed in contact with the electromagnetic waveguide transition. In FIG. 6a, a lower layer 3 of the waveguide transition is shown. Optionally, there is a metasurface disposed on an upper surface 3a of the lower layer 3. A lower surface 3b of the lower layer 3 faces the PCB 5.

[0087] The PCB 5 further includes active components 51. The active components 51 may be, for example, at least one of an amplifier, a mixer, an active filter, or a processor. The active components 51 generate heat, which must be dissipated. It is recognized that because the layer 3 of the waveguide transition is a metal layer, e.g., fabricated as a solid metal piece or from a non-metallic layer coated with metal, these layers are characterized by good thermal conductivity. To this end, the PCB 5 with the active components 51 is placed against the lower surface 3b of the lower layer 3 of the waveguide transition. In some embodiments, the active components include a heat pad 53 placed on top of the active components 51. The heat pad 53 bridges the gap between the active components 51 and the lower layer 3, bringing them into thermal contact with each other. The heat pad 53 is typically made of a silicone material or wax. The heat pad 53 may also be implemented as a layer of thermal paste.

[0088] The PCB 5 and the lower layer 3 may be attached to one another using a spacer element 55 disposed between the PCB 5 and the lower layer 3 of the waveguide transition. FIG. 6a shows a cross section of the spacer element 55. Through-openings 56 are provided to allow the active component 51 and / or the heat pad 53 to contact the lower layer 3. Additionally or alternatively, the spacer element 55 may include at least one through-opening and / or recess that allows one or more additional components to be disposed between the PCB 5 and the lower layer 3. In some situations, each layer, including the lower layer 3, is essentially flat on one side. Essentially flat layers have been found to be advantageous for manufacturing. The spacer element also allows components protruding from the PCB 5 to be accommodated below the lower layer 3.

[0089] In some embodiments, the spacer element 55 has a mounting pin 59 configured to pass through the lower layer 3. With further reference to Figure 6b, it is shown that the lower layer 3 can have a pin-receiving hole 32 formed therethrough, such that the mounting pin 59 can pass through the pin-receiving hole 32 and be melted or compressed from the upper surface 3a of the lower layer 3 to secure the lower layer to the spacer element 55 and PCB 5.

[0090] FIG. 6c schematically illustrates a top view of a PCB 5 having an active component 51. The active component 51 is connected to multiple transmit and / or receive elements 52 offset along the PCB 5 from the active component. The transmit and / or receive elements 52 may be, for example, patch antennas integrated into the PCB 5 and electrically connected to terminals of the active component 51. Each transmit and / or receive element 52 is positioned below an aperture-through opening disposed in the spacer element 55 and an aperture port in the lower layer 3 of the waveguide transition section. In this manner, electromagnetic signals transition from / to the transmit and / or receive elements 52 to the elongated channel waveguide of the waveguide transition section disposed on the top of the PCB 5. At the same time, the waveguide transition section functions as a heat sink, dissipating some of the heat generated by the active component 51. In this manner, an electromagnetic component comprising both the active component 51 and a passive waveguide structure can be made very compact while maintaining high connectivity and heat dissipation capabilities.

[0091] In some embodiments, active component 51 is a "launcher in a package" component that includes both active elements (eg, amplifiers and / or processors) and transmit / receive elements.

[0092] FIG. 6d shows a perspective view of a spacer element 55 according to some embodiments. The spacer element 55 has through-holes 56 that allow active components and / or thermal pads to directly contact the underside of the lower layer. The underside 55b of the spacer element 55 is configured to face the PCB when positioned between the PCB and the lower layer. The PCB can be attached to the spacer element 44, for example, via screws. The screws are inserted from the backside of the PCB and engage with screw holes 57 located on the underside of the spacer element 55. The spacer element 55 can also include a metasurface 4 surrounding any openings 54 that are positioned to confine electromagnetic waves propagating between the lower layer and the PCB. Thus, the spacer element 55 can have a metasurface 4 located on one of the upper and lower sides 55b to prevent electromagnetic waves from leaking in a direction parallel to the layer. The lower side 55b of the spacer element 55 can also include at least one locating pin 58. The locating pins 58 are configured to cooperate with corresponding locating slots in the PCB to ensure proper positioning of the spacer element 55 relative to the PCB.

[0093] 6c and 6d, the spacer element 55 has one opening 54 for each transmit / receive element 52 present on the PCB 5, and each opening is surrounded by the metasurface 4. In the illustrated example, the PCB 5 has three transmit / receive elements 52 on one side of the active component 51 and four transmit / receive elements 52 on the other side of the active component 51. Therefore, the spacer element 55 has three openings and four openings on each side of the through opening 56, respectively. The active components 51 are to be disposed in the through openings 56.

[0094] 6e shows an upper surface 55a of the spacer element 55. The upper surface 55a may also include a metasurface 4 surrounding the elongated channel and configured to confine electromagnetic radiation propagating to / from the PCB to / from the waveguide transition. FIG. 6e also shows a mounting pin 59 configured to penetrate the lower layer and secure the lower layer to the spacer element 55.

[0095] The spacer elements 55 may be made of metal (e.g., copper, brass, aluminum) or may be made of a material coated with a metal layer. Also, the spacer elements 55 may be much thicker than the thickness of the layers at the waveguide transition. Therefore, the manufacturing tolerances for the spacer elements 55 may generally be much rougher than those for the layers at the waveguide transition. That is, the metasurface 4 of the spacer elements may be different from the metasurface 4 of the waveguide transition layer (e.g., the height difference between the thick and thin sections may be much larger).

[0096] 7a and 7b illustrate a multilayer waveguide junction according to some embodiments. The junction may be a T-junction having three input / output ports: a first port, a second port, and a third port. At least one intermediate layer 2 includes an elongated channel. The elongated channel has a first portion 21a extending between the first and second ports and a second portion 21b connected to the first portion 21a at a point between the first and second ports, thereby forming a three-way junction. Each elongated channel portion 21a, 21b further includes a central conductor portion 251, 252. The central conductor portions 251, 252 connect at a junction, with the first central conductor portion 251 extending along the first elongated channel portion 21a and the second central conductor portion 252 extending along the second elongated channel portion 21b.

[0097] The width of the second central conductor portion 252 can increase as it approaches the junction. For example, as shown in Figure 7a, the width of the central conductor is L1, and increases to L2 as the second central conductor portion 252 approaches the junction, where L2 is greater than L1. This increased width can promote connectivity.

[0098] The first central conductor portion 251 has a distal side and a proximal side. The second central conductor portion 252 is connected to the proximal side of the first central conductor portion 251. As the first central conductor portion 251 approaches the junction from the first and second ports, the first central conductor portion 251 tapers (e.g., linearly tapered). The tapering is only on the distal side. That is, the distance between the periphery of the elongated channel and the central conductor increases distally as the first central conductor portion 251 approaches the junction, but this distance remains constant proximally.

[0099] In some embodiments, the first central conductor portion 251 further includes a support stub 27 at the junction to promote structural stability.

[0100] The multilayer waveguide junction can be used as a signal splitter and / or combiner. While the waveguide transitions shown in Figures 4a and 4b function as splitters and / or combiners, the waveguide junctions shown in Figures 7a and 7b illustrate alternative splitters and / or combiners. For example, the waveguide junctions can be connected to the waveguide portions of the waveguide transitions shown in Figures 1a-1c to form a waveguide system in which electromagnetic signals are combined and / or split at locations offset from the port openings 31.

[0101] Figure 8a shows a cross-section of a multilayer waveguide with three layers: a top layer 1, a middle layer 3, and a bottom layer 3. The cross-section shows a coaxial waveguide channel with a central conductor 21 arranged as a coaxial conductor. Figures 8a and 8b also show thick and thin sections 41, 42, and interruptions 45 in the metasurface that form part of the coaxial waveguide.

[0102] Figure 8b shows a cross-sectional view of a multilayer waveguide with five layers: top layer 1, three middle layers 2, 201, and 202, and bottom layer 3. From top to bottom, the middle layers are arranged as follows: middle layer 201 is first, middle layer 2 is second, and middle layer 202 is third. Each of middle layers 201 and 202 features a metasurface and faces middle layer 2, which is flat and does not have a metasurface. Top layer 1 has a metasurface on its bottom surface facing the flat top surface of middle layer 201. Bottom layer 3 also has a metasurface disposed on its top surface facing the flat bottom surface of middle layer 202.

[0103] More intermediate layers may be added as needed. Preferably, at least one metasurface is provided in the space between each adjacent pair of layers. More preferably, only one metasurface is provided in the space between each adjacent pair of layers, with the metasurface facing the flat surface of the adjacent layer.

[0104] Those skilled in the art will appreciate that the present invention is not limited to the preferred embodiment described above. Rather, many modifications and variations are possible within the scope of the appended claims. For example, multi-layer electromagnetic components can be connected to waveguide junctions and / or inter-waveguide transitions to form waveguide systems.

Claims

1. A multi-layer waveguide transition (100) comprising at least three physical layers (1, 2, 201, 202, 3) in a stacked configuration, At least three of said physical layers (1, 2, 201, 202, 3) An upper layer (1), At least one intermediate layer (2, 201, 202); a lower layer (3), The lower surface (1b) of the upper layer (1) faces the upper surface (2a) of at least one of the intermediate layers (2, 201, 202), and the upper surface (3a) of the lower layer (3) faces the lower surface (2b) of at least one of the intermediate layers (2, 201, 202), At least one of said intermediate layers (2, 201, 202) comprises an elongated waveguide channel (21) extending along an elongated axis having a guide portion (A) and a connecting portion (C), a metasurface (4) is disposed between the lower surface (1b) of the upper layer (1) and the upper surface (2a) of at least one of the intermediate layers (2, 201, 202), and between the upper surface (3a) of the lower layer (3) and the lower surface (2b) of at least one of the intermediate layers (2, 201, 202), so as to surround the elongated waveguide channel (21); The lower layer (3) is provided with a port opening (31) that overlaps the connecting portion (C) of the elongated waveguide channel (21); A multilayer waveguide transition (100) in which the elongated waveguide channel (21) is provided with a central conductor (25) disposed within the guide portion (A) and extending at least partially into the connecting portion (C).

2. The guide portion (A) of the elongated waveguide channel (21) has a first guide portion (A) having a common connecting portion (C). １ ) and the second guide portion (A ２ ) extending away from the connecting portion (C) in at least two different directions to form a The first guide portion (A １ ) and the second guide portion (A ２ 2. The multi-layer waveguide transition (100) of claim 1, wherein each of said first and second waveguides (25a, 25b) comprises a respective suspended center conductor (25a, 25b) that extends at least partially into said common connecting portion (C).

3. 3. A multi-layer waveguide transition (100) according to claim 1 or claim 2, wherein each central conductor (25) is wider in the connecting portion (C) compared to the guiding portion (A).

4. The multilayer waveguide transition (100) according to any one of claims 1 to 3, wherein the elongated waveguide channel (21) is wider in the connecting portion (C) compared to the guiding portion (A).

5. The central conductor (25) enters the connecting portion (C) along a first axis (X), The central conductor (25) comprises a transverse element (26) extending along a second axis (Y) substantially perpendicular to the first axis (X); The multilayer waveguide transition (100) according to any one of claims 1 to 4, wherein the transverse elements (26) are connected to at least one of the intermediate layers (2, 201, 202) at the connecting portions (C) at both ends of the elongated waveguide channel (21).

6. At least one central conductor (25) enters said connecting portion (C) from the inlet side, 6. The multilayer waveguide transition (100) according to claim 1, wherein an air gap (L9) exists between an end of the central conductor (25) and an opposite side of the connecting portion (C), the opposite side being opposite to the inlet side.

7. The elongated waveguide channel (21) comprises an intermediate portion (B) between each guide portion (A) and the connecting portion (C), The multilayer waveguide transition (100) according to any one of claims 1 to 6, wherein a width of each central conductor (25) in the intermediate portion (B) is different from a width in at least one of the respective guide portions (A) and the connecting portion (C).

8. 8. The multilayer waveguide transition (100) according to any one of claims 1 to 7, wherein each central conductor (25) is provided with intermittently arranged support stubs (27) connecting each central conductor (25) to at least one of the intermediate layers (2, 201, 202).

9. A multilayer waveguide transition according to any one of claims 1 to 8; a printed circuit board or PCB (5) comprising active components (51) connected to transmitting and / or receiving elements (52) configured to transmit and / or receive electromagnetic waves; the PCB (5) is configured to be mounted under a lower surface (3b) opposite to the upper surface (3a) of the lower layer (3) so that the transmitting and / or receiving element (52) is arranged to be able to electromagnetically communicate with the port opening (31); The transmitting and / or receiving element (52) is arranged externally to the active component (51), or the transmitting and / or receiving element (52) is integrated into the same package as the active component (51) so as to form a launcher within the package component (102).

10. 11. The electromagnetic waveguide component according to claim 9 or 10, wherein the active component (51) is configured to be arranged in thermal contact with the lower layer (3) via a thermal pad (53) arranged between the lower layer (3) and the active component (51).

11. a spacer element (55) disposed between the PCB (5) and the lower layer (3); 11. The electromagnetic waveguide component (102) according to claim 9 or claim 10, wherein the spacer element (55) is provided with at least one through opening or recess configured to accommodate at least one component extending from an upper side of the PCB (5), the upper side of the PCB (5) facing a lower side of the spacer element (55).

12. 12. The electromagnetic waveguide component of claim 11, wherein a metasurface (4) is arranged between the upper surface of the PCB (5) and the lower surface of the spacer element (55) and / or between the lower surface of the lower layer (3) and the upper surface of the spacer element (55).

13. a multilayer waveguide transition according to claim 1 or any one of claims 5 to 11, forming a first waveguide transition (10) having a first port opening (31) in the upper layer (1); A second upper layer (1'); and a second at least one intermediate layer (2'), The lower surface of the second upper layer (1') faces the upper surface of at least one second intermediate layer (2'), At least one of the second intermediate layers (2') comprises a second elongated waveguide channel (21') extending along an elongated axis having a second guiding portion and a second connecting portion; A metasurface (4) is disposed between the lower surface of the second upper layer (1') and the upper surface of the at least one second intermediate layer (2'), and a metasurface (4) is disposed between the lower surface of the second at least one intermediate layer (2') and the upper surface of the upper layer (1); the second elongated waveguide channel is provided with a center conductor disposed within the second guide portion and extending at least partially into the second connecting portion; The first port opening (31) is arranged in electromagnetic communication with the second coupling portion of the at least one second intermediate layer (2'), the waveguide-to-waveguide transition (101).

14. Further provided with a second lower layer (3'), The metasurface (4) disposed between the lower surface of the second at least one intermediate layer (2') and the upper surface of the upper layer (1) is disposed between the second lower layer (3') and the at least one second intermediate layer (2'); A second port opening is provided in the second lower layer (3'), 14. The waveguide-to-waveguide transition (101) of claim 13, wherein the first port opening (31) and the second port opening are arranged to overlap.

15. Each port opening (31) is aligned with a respective slit port axis (A Ｓ１ , A Ｓ２ ) a slit shape having two connected elongated slit portions extending along the The slit portion axis (A Ｓ１ , A Ｓ２ 15. The inter-waveguide transition (101) according to claim 13 or claim 14, wherein the first and second waveguides form an angle of 10 to 80 degrees, or preferably 25 to 65 degrees, or most preferably about 45 degrees.

16. A multi-layer waveguide T-junction (103) comprising at least three physical layers (1, 2, 201, 202, 3) in a stacked configuration, At least three of said physical layers (1, 2, 201, 202, 3) An upper layer (1), At least one intermediate layer (2, 201, 202); a lower layer (3), The lower surface (1b) of the upper layer (1) faces the upper surface (2a) of at least one of the intermediate layers (2, 201, 202), and the upper surface (3a) of the lower layer (3) faces the lower surface (2b) of at least one of the intermediate layers (2, 201, 202), At least one of the intermediate layers (2, 201, 202) comprises an elongated waveguide channel (21) having a first portion extending from a first end to a second end along a first axis, and a second portion connected to the first portion at a junction located between the first end and the second end of the first portion and extending along a second axis to a third end; the second axis is substantially perpendicular to the first axis; a metasurface (4) is disposed between the lower surface (1b) of the upper layer (1) and the upper surface (2a) of at least one of the intermediate layers (2, 201, 202), and between the upper surface (3a) of the lower layer (3) and the lower surface (2b) of at least one of the intermediate layers (2, 201, 202), so as to surround the elongated waveguide channel (21); The elongated waveguide channel (21) is provided with a center conductor (25) suspended in the first and second portions; a multilayer waveguide T-junction (103), wherein the width of the first portion of the center conductor is tapered at the junction (25) such that the width of the center conductor decreases from the first end toward the junction and from the second end toward the junction.

17. the first portion of the center conductor has a distal side and a proximal side, the proximal side being closer to the third end; the second portion of the center conductor is connected to the proximal side of the first portion of the center conductor; the distal side of the second portion of the center conductor tapers toward the proximal side at the junction; and / or 17. The multi-layer waveguide T-junction (103) of claim 16, wherein the width of the second portion of the center conductor increases from a first width to a second width at a connection to the proximal side of the second portion of the center conductor.

18. The metasurface (4) comprises a thick section (41) and a thin section (42), and the height difference between the thick section (41) and the thin section (42) is less than the wavelength at the operating frequency divided by 5, preferably less than the wavelength divided by 8, and most preferably less than the wavelength divided by 10. The multilayer waveguide transition (100) according to any one of claims 1 to 8, the electromagnetic waveguide component according to any one of claims 9 to 12, the waveguide-to-waveguide transition (101) according to any one of claims 13 to 15, or the waveguide T-junction (103) according to any one of claims 16 to 17.

19. The multilayer waveguide transition (100) according to any one of claims 1 to 8 or claim 18, the electromagnetic waveguide component according to any one of claims 9 to 12 or claim 18, the inter-waveguide transition (101) according to any one of claims 13 to 15 or claim 18 or the multilayer waveguide T-junction (103) according to any one of claims 16 to 18, wherein at least one of the at least three physical layers (1, 2, 201, 202, 3) is made from a metallic material or from a non-metallic material coated with a metallic layer, preferably wherein each of the at least three physical layers (1, 2, 201, 202, 3) is made from a metallic material or from a non-metallic material coated with a metal, respectively.

20. 20. The multilayer waveguide transition (100) of claim 19, any of the electromagnetic waveguide components of claim 19, the waveguide-to-waveguide transition (101) of claim 19, or the multilayer waveguide T-junction (103) of claim 19, wherein at least two layers of the at least three physical layers are made from or coated with respective metallic materials that are different metallic materials.

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