Shower head cold plate and substrate support having spiral channels and circular manifold

Abstract

A cold plate for a showerhead assembly includes a body configured to be coupled to the showerhead of a substrate processing system; a first cooling layer including first helical channels extending parallel to each other and offset from each other in the azimuthal direction; a first supply manifold for supplying coolant to each of the first helical channels; and a first return manifold for receiving coolant from each of the first helical channels. At least one of the first supply manifold and the first return manifold is circular.

Description

Cross - reference to related applications

[0001] This application claims the benefit of U.S. Provisional Application No. 63 / 451,092, filed on March 9, 2023. The entire disclosure of the application referenced above is incorporated herein by reference.

Technical Field

[0002] The present disclosure relates to the control of temperature profiles of a showerhead and a substrate support, and more particularly, to the cooling of a showerhead and a substrate support.

Background Art

[0003] The background description provided here is for the purpose of generally presenting the content of the present disclosure. Within the scope described in this background art section, research by the inventors named at the present time, as well as aspects of the description that cannot be separately regarded as prior art at the time of filing, whether explicitly or implicitly, are not recognized as prior art against the present disclosure.

[0004] A showerhead assembly can include a faceplate mounted as an electrode. A gas distribution plate is disposed on the faceplate to distribute a process gas to the faceplate. A heater plate is disposed on the gas distribution plate and can heat the gas distribution plate and the faceplate. A cold plate is disposed on the heater plate and can cool the gas distribution plate and the faceplate.

[0005] A substrate support (e.g., a pedestal or an electrostatic chuck) includes a body. Electrostatic clamping electrodes and radio - frequency (RF) electrodes, as well as cooling channels, can be disposed in the body. The cooling channels include an inlet and an outlet. A coolant is supplied from a reservoir to the inlet and returned to the reservoir through the outlet. The cooling channels extend laterally across the body and can cool the area under a substrate supported by the substrate support.

Summary of the Invention

[0006] A cold plate for a showerhead assembly is disclosed. The cold plate includes a body configured to be coupled to a showerhead of a substrate processing system; a first cooling layer including first helical channels extending parallel to each other and offset from each other in the azimuthal direction; a first supply manifold for supplying coolant to each of the first helical channels; and a first return manifold for receiving coolant from each of the first helical channels. At least one of the first supply manifold and the first return manifold is circular.

[0007] In other features, the cold plate further includes a second cooling layer located beneath the first cooling layer and including second helical channels extending parallel to each other and offset from each other in the azimuthal direction; a second supply manifold for supplying coolant to each of the second helical channels; and a second return manifold for receiving coolant from each of the second helical channels. At least one of the second supply manifold and the second return manifold is circular.

[0008] In other features, the cold plate further includes one or more first channels for supplying coolant to a first supply manifold and a second supply manifold, and one or more second channels for receiving coolant from the first return manifold and the second return manifold.

[0009] In other features, the first cooling layer includes second helical channels that extend parallel to each other and are offset from each other in the azimuthal direction. The second helical channels are located separately from the first helical channels.

[0010] In other features, the second helical channel extends parallel to the first helical channel, is offset from the first helical channel in the azimuthal and vertical directions, and extends from the first supply manifold to the first return manifold.

[0011] In other features, the cold plate further includes a second supply manifold that supplies coolant to each of the second helical channels, and a second return manifold that receives coolant from each of the second helical channels. At least one of the second supply manifold and the second return manifold is circular. The second helical channels are located radially outward from the first helical channels.

[0012] In other features, the second helical channel is wound around the same central axis as the first helical channel.

[0013] In other features, the first cooling layer includes a third helical channel that is offset perpendicularly from the first helical channel, extends parallel to the first helical channel, and is arranged alternately with the first helical channel.

[0014] In other features, the second cooling layer includes a fourth helical channel that is offset perpendicularly from the second helical channel, extends parallel to the second helical channel, and is arranged alternately with the second helical channel.

[0015] In other features, the first cooling layer includes a bore. Some of the first helical channels are wound in at least one direction toward the bore and away from the bore, and merge to form a first single channel. The first single channel is located around a portion of the bore.

[0016] In other features, the bore extends through a second cooling layer. Some of the second helical channels are wound in at least one direction toward the bore and away from the bore, and merge to form a second single channel. The second single channel is located around a portion of the bore.

[0017] In other features, the cold plate further includes a second cooling layer located beneath the first cooling layer and including third helical channels extending parallel to each other and offset from each other in the azimuthal direction; a third supply manifold supplying coolant to each of the third helical channels; and a third return manifold receiving coolant from each of the third helical channels. At least one of the third supply manifold and the third return manifold is circular.

[0018] In other features, the second cooling layer comprises a fourth helical channel extending parallel to each other and offset from each other in the azimuthal direction, the fourth helical channel comprising a fourth helical channel located separately from the third helical channel, a fourth supply manifold supplying coolant to each of the fourth helical channels, and a fourth return manifold receiving coolant from each of the fourth helical channels. At least one of the fourth supply manifold and the fourth return manifold is circular.

[0019] In other features, the first cooling layer includes a bore. Some of the first helical channels are wound in at least one direction toward the bore and away from the bore, and merge to form a first single channel. The first single channel is located around a portion of the bore.

[0020] In other features, the first cooling layer includes a second helical channel that is offset perpendicularly from the first helical channel, extends parallel to the first helical channel, and is arranged alternately with the first helical channel.

[0021] In other features, the first cooling layer includes a first cladding layer, a second cladding layer positioned above the first cladding layer, and a core layer positioned between the first and second cladding layers. The first cladding layer bonds the core layer to a first body layer of the cold plate. The second cladding layer bonds the core layer to a second body layer of the cold plate. A first helical channel is positioned in the first cladding layer and the core layer. A second helical channel is positioned in the second cladding layer and the core layer.

[0022] In other features, the first cooling layer includes a first cladding layer, a second cladding layer positioned above the first cladding layer, and a core layer positioned between the first and second cladding layers. The first cladding layer bonds the core layer to a first body layer of the cold plate. The second cladding layer bonds the core layer to a second body layer of the cold plate. A first helical channel is positioned between the first cladding layer, the core layer, and the first body layer. A second helical channel is positioned between the second cladding layer, the core layer, and the second body layer.

[0023] In other features, the first cooling layer includes a first cladding layer, a second cladding layer positioned above the first cladding layer, and a first body layer positioned between the first and second cladding layers. The first cladding layer bonds the first body layer to the first core layer of the cold plate. The second cladding layer bonds the first body layer to the second core layer of the cold plate. A first helical channel is positioned in the first cladding layer and the first body layer. A second helical channel is positioned in the second cladding layer and the second body layer.

[0024] In other features, the first spiral channel is at least one of contacting the first core layer and being partially disposed in the first core layer. The first core layer is disposed on the first cladding layer. The second spiral channel is at least one of contacting the second core layer and being partially disposed in the second core layer. The second cladding layer is disposed on the second core layer.

[0025] In other features, the first cooling layer includes the first cladding layer, the second cladding layer disposed on the first cladding layer, and the body layer disposed between the first cladding layer and the second cladding layer. The first cladding layer joins the body layer to the first core layer of the cold plate. The second cladding layer joins the body layer to the second core layer of the cold plate. The first spiral channel is disposed in the body layer and is at least one of contacting the first cladding layer and being disposed in the first cladding layer. The second spiral channel is disposed in the body layer and is at least one of contacting the second cladding layer and being disposed in the second cladding layer.

[0026] In other features, the first cooling layer includes the first brazing foil layer, the second brazing foil layer disposed on the first brazing foil layer, and the first body layer disposed between the first brazing foil layer and the second brazing foil layer. The first brazing foil layer joins the first body layer to the second body layer of the cold plate. The second brazing foil layer joins the first body layer to the third body layer of the cold plate. The first spiral channel is disposed in the first body layer and is at least one of contacting the first brazing foil layer and being disposed in the first brazing foil layer. The second spiral channel is disposed in the second body layer and is at least one of contacting the second brazing foil layer and being disposed in the second brazing foil layer.

[0027] In another aspect, the first cooling layer includes a first body layer, a second body layer disposed on the first body layer, and a brazing foil layer disposed between the joint of the second body layer and the first body layer. The first helical channel is disposed on at least one of the second body layer, in contact with the brazing foil layer, and disposed on the brazing foil layer.

[0028] In another aspect, the first helical channel is a meso-channel that facilitates the flow of coolant from the first supply manifold to the first return manifold.

[0029] In another aspect, a substrate support is disclosed that includes a body configured to support a substrate within a substrate processing system, and a cooling assembly disposed on the body. The cooling assembly includes a first cooling layer that includes first helical channels that extend parallel to each other and are azimuthally offset from each other, a first supply manifold that supplies coolant to each of the first helical channels, and a first return manifold that receives coolant from each of the first helical channels. At least one of the first supply manifold and the first return manifold is circular.

[0030] In another aspect, the cooling assembly further includes a second cooling layer disposed under the first cooling layer that includes second helical channels that extend parallel to each other and are azimuthally offset from each other, a second supply manifold that supplies coolant to each of the second helical channels, and a second return manifold that receives coolant from each of the second helical channels. At least one of the second supply manifold and the second return manifold is circular.

[0031] In another aspect, the substrate support further includes one or more first channels that supply coolant to the first supply manifold and the second supply manifold, and one or more second channels that receive coolant from the first return manifold and the second return manifold.

[0032] In other features, the first cooling layer includes second helical channels that extend parallel to each other and are offset from each other in the azimuthal direction. The second helical channels are located separately from the first helical channels.

[0033] In other features, the second helical channel extends parallel to the first helical channel, is offset from the first helical channel in the azimuthal and vertical directions, and extends from the first supply manifold to the first return manifold.

[0034] In other features, the substrate support further includes a second supply manifold that supplies coolant to each of the second helical channels. A second return manifold receives coolant from each of the second helical channels. At least one of the second supply manifold and the second return manifold is circular. The second helical channels are located radially outward from the first helical channels.

[0035] In other features, the second helical channel is wound around the same central axis as the first helical channel.

[0036] In other features, the first cooling layer includes a third helical channel that is offset perpendicularly from the first helical channel, extends parallel to the first helical channel, and is arranged alternately with the first helical channel.

[0037] In other features, the second cooling layer includes a fourth helical channel that is offset perpendicularly from the second helical channel, extends parallel to the second helical channel, and is arranged alternately with the second helical channel.

[0038] In other features, the first cooling layer includes a bore. Some of the first helical channels are wound in at least one direction toward the bore and away from the bore, and merge to form a first single channel. The first single channel is located around a portion of the bore.

[0039] In other features, the bore extends through a second cooling layer. Some of the second helical channels are wound in at least one direction toward the bore and away from the bore, and merge to form a second single channel. The second single channel is located around a portion of the bore.

[0040] In other features, the substrate support further includes a second cooling layer located beneath the first cooling layer and including third helical channels extending parallel to each other and offset from each other in the azimuthal direction; a third supply manifold for supplying coolant to each of the third helical channels; and a third return manifold for receiving coolant from each of the third helical channels. At least one of the third supply manifold and the third return manifold is circular.

[0041] In other features, the second cooling layer comprises a fourth helical channel extending parallel to each other and offset from each other in the azimuthal direction, the fourth helical channel comprising a fourth helical channel located separately from the third helical channel, a fourth supply manifold supplying coolant to each of the fourth helical channels, and a fourth return manifold receiving coolant from each of the fourth helical channels. At least one of the fourth supply manifold and the fourth return manifold is circular.

[0042] In other features, the first cooling layer includes a bore. Some of the first helical channels are wound in at least one direction toward the bore and away from the bore, and merge to form a first single channel, which is located around a portion of the bore.

[0043] In other features, the first cooling layer includes a second helical channel that is offset perpendicularly from the first helical channel, extends parallel to the first helical channel, and is arranged alternately with the first helical channel.

[0044] In other features, the first cooling layer includes a first cladding layer, a second cladding layer positioned on top of the first cladding layer, and a core layer positioned between the first and second cladding layers. The first cladding layer bonds the core layer to a first body layer of the substrate support. The second cladding layer bonds the core layer to a second body layer of the substrate support. A first helical channel is positioned in the first cladding layer and the core layer. A second helical channel is positioned in the second cladding layer and the core layer.

[0045] In other features, the first cooling layer includes a first cladding layer, a second cladding layer positioned on top of the first cladding layer, and a core layer positioned between the first and second cladding layers. The first cladding layer bonds the core layer to a first body layer of the substrate support. The second cladding layer bonds the core layer to a second body layer of the substrate support. A first helical channel is positioned in the first cladding layer, the core layer, and the first body layer. A second helical channel is positioned in the second cladding layer, the core layer, and the second body layer.

[0046] In other features, the first cooling layer includes a first cladding layer, a second cladding layer positioned on top of the first cladding layer, and a first body layer positioned between the first cladding layer and the second cladding layer. The first cladding layer bonds the first body layer to a first core layer of the substrate support. The second cladding layer bonds the first body layer to a second core layer of the substrate support. A first helical channel is positioned in the first cladding layer and the first body layer. A second helical channel is positioned in the second cladding layer and the second body layer.

[0047] In other features, the first helical channel is either in contact with the first core layer or partially located on the first core layer. The first core layer is located on the first cladding layer. The second helical channel is either in contact with the second core layer or partially located on the second core layer. The second cladding layer is located on the second core layer.

[0048] In other features, the first cooling layer includes a first cladding layer, a second cladding layer positioned on top of the first cladding layer, and a body layer positioned between the first and second cladding layers. The first cladding layer bonds the body layer to a first core layer of the substrate support. The second cladding layer bonds the body layer to a second core layer of the substrate support. The first helical channel is positioned in the body layer and in contact with the first cladding layer, or at least one of the two positions of the body layer and the first cladding layer. The second helical channel is positioned in the body layer and in contact with the second cladding layer, or at least one of the two positions of the body layer and the second cladding layer.

[0049] In other features, the first cooling layer includes a first brazing foil layer, a second brazing foil layer positioned on top of the first brazing foil layer, and a first body layer positioned between the first brazing foil layer and the second brazing foil layer. The first brazing foil layer bonds the first body layer to a second body layer of the substrate support. The second brazing foil layer bonds the first body layer to a third body layer of the substrate support. The first helical channel is positioned in the first body layer and in contact with the first brazing foil layer, or at least one of the two positions of the first brazing foil layer. The second helical channel is positioned in the second body layer and in contact with the second brazing foil layer, or at least one of the two positions of the second brazing foil layer.

[0050] In other features, the first cooling layer includes a first body layer, a second body layer disposed on the first body layer, and a brazed foil layer disposed between the joint between the second body layer and the first body layer. The first helical channel is disposed on the second body layer and in contact with the brazed foil layer, and at least one of the above is disposed on the brazed foil layer.

[0051] In other features, the first helical channel is a mesochannel, which facilitates the flow of coolant from the first supply manifold to the first return manifold.

[0052] Other areas to which this disclosure may apply will become apparent from the detailed description, claims, and drawings. The detailed description and specific examples are for illustrative purposes only and are not intended to limit the scope of this disclosure. [Brief explanation of the drawing]

[0053] This disclosure will be better understood from the detailed description and accompanying drawings.

[0054] [Figure 1] Figure 1 is a functional block diagram of an exemplary substrate processing system, including a substrate support having a showerhead cold plate and / or channel assembly, according to an example of the present disclosure.

[0055] [Figure 2] Figure 2 is a top cross-sectional view of an exemplary mesochannel assembly.

[0056] [Figure 3] Figure 3 is a perspective view of a channel assembly including a single zone layer according to this disclosure.

[0057] [Figure 4] Figure 4 is a top cross-sectional view of a single-zone layer of a channel assembly according to this disclosure.

[0058] [Figure 5] Figure 5 is a top cross-sectional view of the dual-zone layer of another channel assembly according to this disclosure.

[0059] [Figure 6] Figure 6 is a representative cross-sectional view of the cooling assembly including the dual-zone layer shown in Figure 5, according to this disclosure.

[0060] [Figure 7]Figure 7 is an enlarged upper cross-sectional view of a channel having an offset portion and a confluence portion due to adjacent bores according to the present disclosure.

[0061] [Figure 8] Figure 8 is a magnified side cross-sectional view of a portion of a layered stack of a cooling assembly including a clad-core-clad arrangement configured to include an internal offset channel, according to the present disclosure.

[0062] [Figure 9] Figure 9 is a magnified side cross-sectional view of a portion of a layered stack of a cooling assembly comprising a clad-core-clad arrangement having at least a portion of an offset channel, according to the present disclosure.

[0063] [Figure 10] Figure 10 is a magnified side cross-sectional view of a portion of a layered stack of a cooling assembly comprising a clad-metal-clad stack having at least a portion of an offset channel, according to the present disclosure.

[0064] [Figure 11] Figure 11 is an enlarged side cross-sectional view of a portion of a layered stack of a cooling assembly, including a main layer having at least a portion of an offset channel, according to the present disclosure.

[0065] [Figure 12] Figure 12 is a magnified side cross-sectional view of a portion of a layered stack of a cooling assembly comprising a metal-brazed foil-metal stack having an offset channel, according to the present disclosure.

[0066] [Figure 13] Figure 13 is a magnified side cross-sectional view of a portion of a layered stack of a cooling assembly according to the present disclosure, which includes channels that are not vertically offset and brazing foil layers for brazing adjacent body layers.

[0067] [Figure 14]Figure 14 is a magnified side cross-sectional view of a portion of a layered stack of a cooling assembly according to the present disclosure, which includes a single layer of mesochannels and brazing foil layers for brazing adjacent body layers.

[0068] [Figure 15] Figure 15 is a magnified side cross-sectional view of a portion of a casting including an embedded mesochannel assembly having a mesochannel according to the present disclosure.

[0069] In these drawings, reference numbers may be reused to refer to similar and / or identical elements. [Modes for carrying out the invention]

[0070] In substrate processing systems, such as dielectric etching substrate processing systems, the temperature profiles of the showerhead assembly and substrate support are controlled to achieve a temperature profile across the entire substrate and a predetermined etching profile during substrate processing. The etching profile of the substrate is sensitive to temperature changes. The temperature profile is selected to meet critical dimension (CD) requirements and / or to maintain uniformity of etching dimensions for one or more features formed during processing.

[0071] The temperature of the substrate can be controlled actively and / or passively. A substrate processing system may include an active cooling system for regulating the temperature of the entire substrate during processing. The cooling system may include a temperature control reservoir, a pump, a coolant line, and one or more cooling channels. The cooling channels are located within a showerhead assembly and substrate support. A controller regulates the substrate temperature during processing by controlling the pump and adjusting the flow rate and temperature of the coolant between the coolant line and one or more cooling channels. To passively control the substrate temperature profile, various structural aspects of the cooling channels, such as their dimensions, shape, location, layout pattern, and number, can be pre-selected.

[0072] Increased RF power requirements for the etching process can lead to increased thermal load on the substrate. This necessitates additional cooling capacity from the showerhead assembly and substrate support. In addition, lowering the substrate temperature offers advantages in advanced applications such as high aspect ratio etching operations. To lower the temperature, additional thermal energy (or heat) must be extracted from the showerhead assembly and substrate support. This also necessitates additional cooling capacity from the showerhead assembly and substrate support.

[0073] Thermal load W of the substrate, substrate temperature T s Coolant temperature T fluid Heat transfer coefficient U, surface area A of the cooling channel, mass flow rate m dot, heat capacity C p , and the change in coolant temperature ΔT fluid The relationship between them is given by Equation 1. The product of the heat transfer coefficient U and the cooling area A represents the cooling capacity of the substrate support.

number

number

[0074] Conventional cooling channels for showerhead cold plates and substrate supports have a single inlet and a single outlet, and have limited cooling capacity. Conventional cooling channels have a rectangular cross-section with uniform width and height along the length of the channel. The channel cross-section refers to a cross-sectional slice that crosses the channel perpendicular to the length of the channel and / or the longitudinal centerline, which extends from the inlet to the outlet of the channel. The plane of the cross-sectional slice does not extend longitudinally along and / or parallel to the longitudinal centerline. The width and height of conventional cooling channels are typically 6 millimeters (mm) or more each, and therefore the cross-sectional area of ​​each is 36 mm². 2 That concludes the explanation. Cooling capacity is limited by the speed at which the coolant can pass through the cooling channel. To increase the cooling capacity UA, the fluid flow rate can be increased. The fluid flow rate is limited by the pressure drop across the cooling channel. The higher the fluid flow rate, the greater the pressure drop across the cooling channel. The fluid flow rate through the cooling channel is directly related to the pressure drop across the cooling channel. Also, to provide a higher pumping pressure, a larger capacity pump is required, which increases pumping costs. Therefore, the speed of the fluid flowing through conventional cooling channel configurations is limited, and as a result, the corresponding cooling capacity is also limited.

[0075] Examples described herein include a showerhead cold plate and substrate support having a cooling assembly. The cooling assembly is mounted on the cooling layer of the showerhead cold plate and substrate support. At least a portion of the exemplary cooling layer includes mesochannels. The channels of the cooling assembly are helical. Each cooling layer includes one or more zones of helical channels, each zone includes multiple channels extending parallel to each other and in the same direction between a radially inward circular manifold and a radially outward circular manifold. In some examples, adjacent channels mounted on the same cooling plate (or layer) are at least one of the following: i) offset perpendicular to each other, ii) offset to each other in a direction parallel to the central axis around which the channels are wound, and iii) offset to each other in a direction perpendicular to a plane, the plane extending parallel to the centerline of the channels, and the centerline extending from the inlet to the outlet of the channels. In other examples, adjacent channels mounted on the same cooling layer are at least one of the following: i) not offset perpendicular to each other, ii) not offset parallel to the central axis around which the channels are wound, and iii) not offset perpendicular to a plane, the plane extending parallel to the channel's centerline, and the centerline extending from the channel's inlet to its outlet. The cooling assembly provides increased cooling compared to showerhead cold plates and substrate supports with conventional cooling channels. These and other features and corresponding advantages are described below.

[0076] Each of the disclosed cooling assemblies comprises one or more layers of channels, which may include mesochannels, minichannels, and / or microchannels. The cross-sections of the channels disclosed herein can be of various shapes. Conventional channels have a cross-section with a hydraulic diameter Dh of 6 mm or more and a heat transfer surface area-to-channel volume ratio of 400. Mesochannels may refer to microchannels or minichannels. Mesochannels may have a cross-section with a hydraulic diameter Dh of 3.0 mm or less. Minichannels may have a cross-section with a hydraulic diameter Dh of 3.0 mm or less. In some embodiments, minichannels have a cross-section with a hydraulic diameter Dh greater than 200 μm and less than or equal to 3.0 mm and a heat transfer surface area-to-channel volume ratio of 1500 to 3000. Microchannels may have a cross-section with a hydraulic diameter Dh of 200 μm or less. In some embodiments, the microchannel has a cross-section with a hydraulic diameter Dh greater than 10 μm and less than or equal to 200 μm, and the ratio of heat transfer surface area to channel occupied volume is greater than 3000. As the heat transfer surface area for the same channel occupied volume increases, the same heat flux is removed with a smaller temperature difference.

[0077] In some embodiments, the cross-section of the channel in the cooling plate (or layer) is rectangular with corresponding width and height. In some embodiments, the channel has a cross-section with a hydraulic diameter Dh of 1.5 mm or more and less than 6.0 mm. In some embodiments, the channel has a cross-section with a hydraulic diameter Dh of 3.0 mm or less. In other embodiments, the channel has a cross-section with a hydraulic diameter Dh of 1.0 mm or less.

[0078] The use of the term "micro" does not necessarily imply that the corresponding cross-section has a width, height, and / or hydraulic diameter that is on a microscale (i.e., less than 1 mm). However, microchannels may have cross-sections with width, height, and cross-section each less than 1 mm. Each of the channels disclosed herein functions as a heat exchanger by extracting thermal energy from the body of the corresponding cooling assembly and transferring that thermal energy to the coolant in the channel.

[0079] Microchannels have a high heat transfer coefficient (e.g., 3 to 4 times that of conventional channels) and a high surface area-to-volume ratio. Microchannels are suitable for applications requiring compact designs. The small cross-sectional profile of microchannels allows for design versatility, as they can be incorporated into different plates and / or parts of the showerhead cold plate body and / or substrate supports to achieve different temperature profiles.

[0080] Each of the showerhead cold plates and substrate supports disclosed herein may include one or more pairs of manifolds, each pair of manifolds including a supply manifold and a return manifold. Each pair of manifolds is connected to its respective set of channels. Each pair of manifolds and the corresponding set of channels are fluid-connected and function as a single heat exchanger. Each heat exchanger includes channels connected in parallel between the same pair of manifolds, thereby creating two or more parallel paths. This differs from conventional channels, which are independent single channels that do not extend between manifolds and have a single fluid flow path with their respective inlets and outlets. For example, a conventional substrate support typically includes only one conventional channel.

[0081] Some examples minimize lateral temperature fluctuations across showerheads and / or substrate supports. This includes minimizing point-to-point fluctuations. Disclosed examples include channel assemblies that i) maintain a substantially uniform temperature of the cooling fluid across each zone of a cooling plate (or layer), and / or ii) minimize the temperature of the cooling fluid while maintaining a substantially uniform temperature of the cooling fluid across the cooling plate (or layer).

[0082] Power in dielectric tools has increased, for example, from 16 kilowatts to 25 kilowatts, and is continuing to increase. As power increases, so do cooling requirements. Therefore, the cooling capacity of the showerhead cold plate and substrate support is improved to maintain the showerhead and substrate support at the set temperature. As an example, a substrate processing system may have a temperature requirement of 100-150°C for the showerhead.

[0083] Extracting additional heat using a conventional showerhead cold plate requires an increase in the flow rate of coolant through the cold plate's channels and / or the heat transfer surface area. This could increase the coolant supply pressure requirements beyond the existing chiller capacity. It is not feasible to package one or more larger channels within the limited space of the showerhead cold plate to increase the heat transfer surface area of ​​the channels.

[0084] Increasing the coolant supply pressure requires additional components (such as valves), increasing the complexity and cost of the system. A chiller with a higher output pressure is also required. In addition, the components of the coolant circuit become larger and therefore occupy more space.

[0085] The examples described herein provide multilayer cooling assemblies with increased heat transfer surface area while having a parallel channel arrangement that occupies the same space as conventional cooling assemblies. The increase in heat transfer surface area can be, for example, 4 to 5 times that of conventional cooling assemblies. Compared to conventional cooling assemblies, the coolant flow rate of multilayer cooling assemblies can be increased even if the pressure drop between channels of the cooling assembly is the same. As a result, lower cooling plate temperatures are achieved with the same amount of heat load. Improved cooling is achieved without the need to increase the volume of the cooling assembly. The cooling assembly improves the uniformity of temperature distribution across the cooling plates and layers.

[0086] Figure 1 shows an exemplary substrate processing system 100, which includes a substrate support 101, shown as an electrostatic chuck, and a showerhead assembly 102. The substrate support 101 includes a cooling assembly 103, and the showerhead assembly 102 includes a cold (or cooling) plate 104. The cooling assembly 103 and / or the cold plate 104 may include or be replaced by any of the cooling assemblies disclosed herein, examples thereof and parts thereof, which are shown in the description with reference to Figures 3 to 13. The cooling assembly 103 and the cold plate 104 may include any of the features shown in Figures 3 to 13.

[0087] Figure 1 shows a capacitively coupled plasma (CCP) system, but embodiments disclosed herein are applicable to trans-coupled plasma (TCP) systems, inductively coupled plasma (ICP) systems, and / or other processing systems and plasma sources including substrate supports. Embodiments are applicable to dry etching systems, and other processing systems including showerheads and / or substrate supports. In the illustrated example, the substrate support 101 includes a body 105. The body 105 may be formed of different materials and / or different ceramic compositions. The body 105 may include, for example, aluminum, aluminum alloys, aluminum nitride (AlN3), aluminum oxide (Al2O3), and / or aluminum oxynitride (AlON). The cold plate 104 includes a body 106 which may be formed of aluminum, aluminum alloys, aluminum nitride (AlN3), aluminum oxide (Al2O3), and / or aluminum oxynitride (AlON).

[0088] The substrate processing system 100 includes a processing chamber 107. The substrate support 101 is housed within the processing chamber 107. The processing chamber 107 also houses other components, such as an upper electrode (or showerhead faceplate) 108, and includes an RF plasma. During operation, the substrate 109 is placed on the substrate support 101 and electrostatically clamped.

[0089] The showerhead assembly 102 includes a gas distribution plate 110 that introduces and distributes gas through a showerhead faceplate 108. The showerhead assembly 102 further includes a stem portion 111, one end of which is connected to the upper surface of the processing chamber 107. The gas distribution plate 110 and the showerhead faceplate 108 are collectively cylindrical and may be referred to as the showerhead. The gas distribution plate 110 and the showerhead faceplate 108 extend radially outward at the end of the stem portion 111 opposite the upper surface of the processing chamber 107. The substrate-facing surface of the showerhead faceplate 108 includes holes through which process gas or purge gas flows. The showerhead assembly 102 may include a heat plate 112 positioned on the gas distribution plate 110. A cold plate 104 may be positioned on the heat plate 112. Although the cold plate 104 is shown positioned on the heat plate 112, there may also be cases where the heat plate 112 is not included and the cold plate 104 is positioned on the gas distribution plate 110.

[0090] In one embodiment, the substrate support 101 may include one or more gas channels 113 for circulating backside gas to the back surface of the substrate 109. The substrate support 101 may also include a cooling assembly 103 for receiving coolant from a pump 116. The cold plate 104 can also receive coolant from the pump 116.

[0091] A temperature controller 114 controls the operation of the pump 116, controlling the flow and temperature of the coolant between the cooling assembly 103 and the cold plate 104. The pump 116 can circulate the coolant between i) the reservoir 115 and ii) the cooling assembly 103 and the cold plate 104. Although a single pump 116 is shown, two or more pumps may be included. In one embodiment, each of the cooling assembly 103 and the cold plate 104 includes a single coolant input and a single coolant output. In other embodiments, each of the cooling assembly 103 and the cold plate 104 includes multiple coolant inputs and coolant outputs. A valve assembly 117 may be positioned between the pump 116 and the cooling assembly 103 and the cold plate 104 and controlled by the temperature controller 114. Pairs of supply and return lines may be connected (i) between one or more pumps and the cooling assembly 103 and cold plate 104, and / or (ii) between the valve assembly 117 and the cooling assembly 103 and cold plate 104.

[0092] The RF generation system 120 generates an RF voltage and outputs it to the upper electrode 108 and one or more lower electrodes 119 on the substrate support 101. Either the upper electrode 108 or the substrate support 101 may be DC grounded, AC grounded, or at a stray potential. As just one example, the RF generation system 120 may include one or more RF generators 122 (e.g., capacitively coupled plasma RF power generators, bias RF power generators, and / or other RF power generators) that generate the RF voltage, which is supplied to the upper electrode 108 and / or the substrate support 101 by one or more matching and distribution networks 124. The electrodes that receive the RF signal, RF voltage, and / or RF power are called RF electrodes. As an example, a plasma RF generator 123, a bias RF generator 125, a plasma RF matching network 127, and a bias RF matching network 129 are shown. The plasma RF generator 123 may be a high-power RF generator that generates, for example, 6 to 10 kilowatts (kW) or more of power. The bias RF matching network supplies power to RF electrodes such as RF electrode 119.

[0093] The gas supply system 130 includes one or more gas sources 132-1, 132-2, ..., and 132-N (collectively referred to as gas source 132), where N is an integer greater than 0. The gas source 132 supplies one or more precursors and gas mixtures thereof. The gas source 132 may also supply etching gas, carrier gas, and / or purge gas. Vaporized precursors may also be used. The gas source 132 is connected to the manifold 140 by valves 134-1, 134-2, ..., and 134-N (collectively referred to as valve 134) and mass flow controllers 136-1, 136-2, ..., and 136-N (collectively referred to as mass flow controller 136). The output of the manifold 140 is supplied to the processing chamber 107. As just one example, the output of the manifold 140 is supplied to a showerhead.

[0094] Although shown separately from the system controller 160, the temperature controller 114 may be implemented as part of the system controller 160. The substrate support 101, cooling assembly 103, gas distribution plate 110, and / or cold plate 104 may include a plurality of temperature control zones, each of which includes a temperature sensor and a channel set. The temperature controller 114 monitors the temperature indicated by the temperature sensor and can adjust the temperature to a target temperature by adjusting the flow rate and / or temperature of the coolant circulating through one or more channel sets. The temperature sensor and other temperature sensors are represented by temperature sensor 143. Although temperature sensor 143 is shown connected to the processing chamber 107, at least a portion of temperature sensor 143 is located inside the processing chamber 107. Temperature sensor 143 may include a resistance temperature device, a thermocouple, a digital temperature sensor, and / or other suitable temperature sensor.

[0095] The substrate processing system 100 may also include a power supply 144 that provides power, including a high voltage, to a clamp electrode 131 for electrostatically clamping the substrate 109 to the substrate support 101. The clamp electrode receives power for electrostatically clamping the substrate 109 to the substrate support 101 and can also receive RF signals, RF voltages, and / or RF power. The power supply 144 may be controlled by a system controller 160.

[0096] The substrate processing system 100 may further include a backside vacuum controller 152. The backside vacuum controller 152 can receive gas from the manifold 140 and supply the gas to the channel 113 and / or pump 158. This improves the transfer of thermal energy between the substrate support 101 and the substrate 109. Backside gas may also be provided to improve purging of the substrate periphery and vacuum tracking of the substrate location. The channel 113 may be supplied by one or more injection ports. In one embodiment, multiple injection ports are included to improve cooling. As an example, the backside gas may include helium.

[0097] The temperature controller 114 can control the operation of the pump 116 and / or other coolant circulation pumps and / or valve assembly 117 based on parameters detected from the temperature sensor 143 in the processing chamber 107. The back surface vacuum controller 152 controls the flow rate of back surface gas (e.g., helium) to the channel 113 for cooling the substrate 109 by controlling the flow from one or more gas sources 132 to the channel 113. The back surface vacuum controller 152 controls the pressure and flow rate of the gas supplied to the channel 113 based on parameters detected from the temperature sensor 143. In one embodiment, the temperature controller 114 and the back surface vacuum controller 152 are implemented as a single integrated controller. During the deposition process, the substrate 109 may be heated in the presence of a high-power plasma. The gas flow through the gas channel 113 can lower the temperature of the substrate 109.

[0098] The reactant can be discharged from the processing chamber 107 using valves 156 and pumps 158. The system controller 160 can control the components of the substrate processing system 100, including control of the supplied RF power level, the pressure and flow rate of the supplied gas, and RF matching. The system controller 160 controls the state of valves 156 and pumps 158. A robot 164 may be used to feed substrates onto the substrate support 101 and to remove substrates from the substrate support 101. For example, the robot 164 can transfer substrates between the substrate support 101 and the load lock 166. The robot 164 may be controlled by the system controller 160. The system controller 160 can control the operation of the load lock 166.

[0099] Valves, gas pumps, power supplies, RF generators, etc., as referred to herein may be referred to as actuators. Microchannels, gas channels, etc., as referred to herein may be referred to as temperature control elements.

[0100] The substrate support 101 and the cold plate 104 may each have a laminated structure having multiple plates and / or layers, as will be further described below. For example, the substrate support 101 and / or the cold plate 104 may each include multiple plates and / or layers, including one or more channel layers, one or more crossover layers, a manifold layer, an intermediate layer, and so on. The manifold can be mounted on the same layer as the channel or on a different layer. The composition and materials of the layers will be further described below.

[0101] In the illustrated example, electrodes 119 and 131 are located on the top layer of the substrate support 101. The cooling assembly 103 is located on one or more other layers. Although a single cooling assembly is shown, the body 105 may include any number of cooling assemblies and / or channel assemblies located on any number of channel layers, each layer may include any number of channels having various sizes, shapes, layout patterns, and dimensions.

[0102] Figure 2 shows a channel assembly 200 including a supply (or input) manifold 202, a channel 204, and a return (or output) manifold 206. The supply manifold 202 receives the coolant 208. The coolant 208 passes through the supply manifold 202 to the channel 204 and then to the return manifold 206. The channel 204 can be extended in a parallel arrangement as shown in the figure. The output of the return manifold is coolant 208', which is hotter than the received coolant 208. The channel 204 facilitates the flow of coolant from the supply manifold 202 to the return manifold 206.

[0103] The example in Figure 2 is a simplified representation. Examples in Figures 3 to 6 include channel assemblies having multiple layers. Each layer is helical and contains channels wound in parallel, with the channels having i) inputs offset from each other in the azimuthal direction, and ii) outputs offset from each other in the azimuthal direction. The inputs are connected to a first manifold, and the outputs are connected to a second manifold. The manifolds may be annular (or ring-shaped) and / or irregular in shape to minimize space.

[0104] The manifolds disclosed herein may be arranged far apart from each other in different locations as shown in the figures, or, if there are multiple zones, they may be arranged in close proximity, for example, manifolds in different zones may be close to each other. The manifolds may be arranged in a center-hot or edge-hot configuration. The term "center-hot" refers to the central and / or radially inward annular region of the substrate support, cold plate, cooling plate, cooling layer, etc. The term "edge-hot" refers to the outer edge and / or radially outward annular region of the substrate support, cold plate, cooling plate, cooling layer, etc.

[0105] The channels disclosed herein can be implemented as mesochannels with increased surface area for extracting thermal energy from surrounding materials. By increasing the number of smaller channels, the entire mesochannel has a larger external channel surface area than a single conventional channel. Thermal energy is transferred to the coolant in the mesochannel and passes through it. Compared to conventional cooling channels, mesochannels have a higher surface area-to-volume ratio and an increased heat transfer coefficient U. Increasing the number of channels also increases the number of channel sides, which leads to an increase in surface area. The sum of the surface areas of the sides of a mesochannel is greater than the sum of the surface areas of a conventional channel. The total volume of a mesochannel may be smaller than the volume of a single conventional channel, but the larger surface area of ​​a mesochannel provides cooling equivalent to or better than that of a conventional channel. The total surface area-to-volume ratio of a mesochannel is much higher than that of a conventional channel. The heat transfer coefficient U is a function of the fluid velocity. Generally, the smaller the cross-sectional area of ​​the channel, the higher the velocity of the coolant passing through the channel. Due to the small cross-sectional area of ​​the mesochannel, the fluid velocity increases, and therefore the heat transfer coefficient also increases. The heat transfer coefficient U of a corresponding mesochannel assembly may be, for example, twice that of a conventional cooling channel assembly. Mesochannels increase the cooling capacity UA while maintaining a similar fluid pressure drop between the inlet and outlet of the mesochannel. Depending on the design, the pressure drop may be slightly higher or slightly lower than that of a conventional cooling channel.

[0106] When conventional cooling channels are used to provide the same thermal load as when using a mesochannel assembly, the driving temperature difference between the fluid to the substrate support and the mesochannel assembly is much smaller than the temperature difference for conventional cooling channels to achieve the same substrate temperature. Mesochannels can provide 2 to 3 times more heat transfer than conventional cooling channel configurations. This allows the fluid inlet temperature to the mesochannel to be much higher than for conventional channels at the same substrate temperature. Conventional channels require the fluid temperature to be lowered to -60°C to -100°C in certain processes. Using mesochannels, this coolant temperature can be raised to -30°C to -70°C, significantly reducing the need for cryogenic temperature control at the pump end. Ensure that the pump capacity is greater than a predetermined minimum capacity and the flow rate is greater than a predetermined minimum flow rate to prevent the coolant temperature from exceeding a predetermined maximum temperature. If the flow rate is too slow, the temperature of the entire substrate support may exceed the set maximum temperature threshold.

[0107] The mesochannels disclosed herein can operate in single-phase mode or two-phase mode. Single-phase mode refers to the case where the coolant flowing through the mesochannel remains in a liquid state. Two-phase mode refers to the case where the coolant flowing through the mesochannel changes between a liquid state and a gaseous state. Latent heat is generated when the coolant transitions between a liquid state and a gaseous state. Mesochannels have approximately 70% less volume for the same amount of heat load compared to conventional cooling channels. Even without boiling, the heat transfer coefficient U may increase by 100% compared to conventional channels. With boiling, the heat transfer coefficient U may increase by more than 300% compared to conventional channels.

[0108] As described above, the cross-sectional area of ​​the mesochannel is small (e.g., hydraulic diameter Dh is less than 3.0 mm), providing a structure with design versatility. For example, if the hydraulic diameter Dh is 2.0 mm, the width or height may be 4 mm or less. The mesochannel assembly can be incorporated into substrate supports, cold plates, and / or parts thereof in various arrangements. The mesochannel assembly can be located in various places and on one or more layers while making space for other components. In one embodiment, a first plate is machined to form the mesochannel groove (three sides of the microchannel), and a second plate is attached to the first plate to provide the fourth side of the mesochannel. Vacuum brazing can be performed to connect the second plate to the first plate. The second plate may be sealed and / or bonded to the first plate. In another embodiment, the mesochannel is formed using additive manufacturing techniques. In addition to brazing, three-dimensional (3D) printing can be performed to form at least a portion of the mesochannel assemblies disclosed herein. Other examples are shown and explained with reference to Figures 7 to 13.

[0109] The channels in the following example can have various sizes, cross-sectional shapes, and cross-sectional areas, and therefore exhibit different flow velocities and pressures. The flow q per channel is given by the cross-sectional area A of the channel. c It is equal to the product of and the flow velocity v. In one embodiment, the size and shape of the channels are determined such that the flow velocity of each channel is less than 2.5 meters per second (m / s) in order to avoid channel erosion.

[0110] Figure 3 shows a channel assembly 300 including layers 302 and 304. Each of layers 302 and 304 has a single cooling zone with its respective set of channels. The first layer 302 includes a first channel 306, and the second layer includes a second channel (not shown in Figure 3). The second channel can be configured similarly to the first channel 306. In one embodiment, the channels of layers 302 and 304 are implemented as mesochannels. Layer 302 includes a first manifold 310 and a second manifold 312. Layer 304 includes a third manifold and a fourth manifold (not shown in Figure 3). The third and fourth manifolds may be configured similarly to the first manifold 310 and the second manifold 312. One of the first manifold 310 and the second manifold 312 is an input (or supply) manifold, and the other is an output (or return) manifold. The manifolds of layers 302 and 304 are connected to first channels 320, 322 and second channels 324, 326, respectively. In one embodiment, manifold 310 is molded to minimize space and bypasses the mounting hole location, central bore 327, and channels 320, 322. The central bore 327 can be used to supply process gas to a showerhead.

[0111] In one embodiment, the first channels 320 and 322 are implemented as input (or supply) channels, and the second channels 324 and 326 are implemented as output (or return) channels. In another embodiment, the first channels 320 and 322 are implemented as output channels, and the second channels 324 and 326 are implemented as input channels. In yet another embodiment, channels 320 and 326 are implemented as input channels, and channels 322 and 324 are implemented as output channels. In yet another embodiment, channels 322 and 324 are implemented as input channels, and channels 320 and 326 are implemented as output channels.

[0112] In one embodiment, layers 302 and 304 are mounted as layers of the main body of a substrate support or as a cold plate of a showerhead assembly. In another embodiment, layer 302 is mounted as a cooling plate laminated on layer 304, which is mounted as another cooling plate.

[0113] Each channel in layers 302, 304 is helical, wound parallel to each other, and has inputs offset from each other in the azimuthal direction, and outputs offset from each other in the azimuthal direction. In one embodiment, the channels may be the same length. Each channel in layers 302, 304 has a first end that is fluid-coupled to one of the radially inward manifolds (e.g., manifold 310) and a second end that is fluid-coupled to one of the radially outward manifolds (e.g., manifold 312). By being circular, manifolds 310, 312 and other manifolds disclosed herein distribute and return the coolant uniformly to improve 360° temperature uniformity around the corresponding cooling assemblies and the corresponding cooling layers and / or plates.

[0114] Each of the channel sets of layers 302 and 304, and each of the other channel sets disclosed herein, are wound in the same direction (e.g., clockwise or counterclockwise) around the same central axis.

[0115] Figure 4 shows a single-zone layer 400 of a channel assembly. Layer 400 is helical and includes a single set of channels 402 having inputs that are spirally wound, parallel to each other, spaced apart from one another and offset from one another in the azimuthal direction, and outputs that are offset from one another in the azimuthal direction and equidistant from one another. The channels 402 are wound around the centerline of layer 400, represented by point 404. In one embodiment, the channels 402 have the same length. The channels 402 have a first end that is fluidly coupled to a radially inward manifold 410 and a second end that is fluidly coupled to a radially outward manifold, represented by circle 412. A spiral 414 is shown as one representation of the channels 402 and has a first end 416 and a second end 418. The spiral 414 is provided not as an exact trace of one path of channel 402, but as a representation of channel 402, showing the schematic shape of each channel 402. The first end 416 or the second end 418 may be implemented as an input, and the other end as an output. Layer 400 may be configured as shown in Figure 7 and / or as one or more layers in any of Figures 8 to 13.

[0116] Figure 5 shows a dual-zone layer 500 of another channel assembly (e.g., channel assembly 600 in Figure 6). Layer 500 contains two zones, each having a set of channels 502 and 504. The lead wires of the numerical indicator 502 are in contact with the end portion of channel 502. Channel 504 is radially outward from channel 502. The temperatures of the first and second zones can be controlled independently to provide different amounts of cooling. For example, more cooling can be provided in the first zone, which may be radially inward from the second zone. This situation may occur, for example, when the dual-zone layer 500 is implemented in a cooling assembly for a cold plate used to cool a showerhead. As another example, more cooling can be provided in the second zone, which may be radially outward from the first zone. Channels 502 and 504 are wound around the centerline of layer 500, represented by point 505.

[0117] Channel 502 is helical, wound parallel to each other, spaced equally apart and offset from each other in the azimuthal direction, and has inputs and outputs offset from each other in the azimuthal direction and spaced equidistant from each other. Channel 504 is helical, wound parallel to each other, spaced equally apart and offset from each other in the azimuthal direction, and has inputs and outputs offset from each other in the azimuthal direction and spaced equidistant from each other. In one embodiment, channels 502 have the same length. In one embodiment, channels 504 have the same length. Channel 502 may have the same length as channel 504 or a different length. Channel 502 may have the same cross-sectional area that can be maintained from the inlet to the outlet of channel 502. Channel 504 may have the same cross-sectional area that can be maintained from the inlet to the outlet of channel 504. Channel 502 may have the same cross-sectional area as channel 504 or a different cross-sectional area.

[0118] The number of channels per zone may directly relate to the flow rate of the coolant to each zone. This affects the heat transfer coefficient of the zone. The number of channels can be set based on the pressure drop and / or flow requirements for each zone, depending on the application.

[0119] Channel 502 has a first end fluid-coupled to a radially inward manifold 510 and a second end fluid-coupled to a radially outward manifold, represented by a circle 512. Channel 504 has a first end fluid-coupled to a radially inward manifold, represented by a circle 514, and a second end fluid-coupled to a radially outward manifold, represented by a circle 516. Manifolds 512 and 514 are located on the inner and outer circumferences of an annular region 515 that lies radially between the zones of channels 502 and 504. The annular region 515 is channel-free and separates channels 502 and 504.

[0120] Helical 519 is shown as one representation of channel 502 and has a first end 517 and a second end 518. Helical 520 is shown as one representation of channel 504 and has a first end 522 and a second end 524. Helical 519 and 520 are provided as one representation of channel 502 and one representation of channel 504, respectively, rather than precisely following the two paths of channels 502 and 504, and represent the schematic shapes of channels 502 and 504, respectively. The first end 516 or the second end 518 may be implemented as an input, and the other end as an output. The first end 522 or the second end 524 may be implemented as an input, and the other end as an output. Manifolds 510, 512, 514, and 516 are circular to improve temperature uniformity in the azimuthal direction.

[0121] Figure 6 shows a main body 601 having the dual-zone layer 500 of Figure 5, another dual-zone layer 602 configured similarly to the dual-zone layer 500, and a channel assembly 600 including corresponding supply and return channels. Layer 500 includes channels 502, 504 and manifolds 510, 512, 514, 516. Channels 502, 504 extend parallel to each other, are offset from each other in the azimuthal direction, and are spaced equally apart. Layer 602 includes channels 606, 608 and manifolds 610, 612, 614, 616. Channels 606, 608 are configured similarly to channels 502, 504. Channels 606, 608 extend parallel to each other, are offset from each other in the azimuthal direction, and are spaced equally apart. In one embodiment, channels 606 and 608 have the same pattern as channels 502 and 504, are positioned below channels 502 and 504, and are aligned laterally with channels 502 and 504. Manifolds 610, 612, 614, and 616 are configured similarly to manifolds 510, 512, 514, and 516.

[0122] Layer 500 also includes one or more bores (including one exemplary bore 540, which is shown). The bores may be for the passage of, for example, a lift pin, a sensor, a probe, an electrode, etc. For example, portions of adjacent channels, such as a selected portion of channel 504, are offset from each other and / or merge to provide space for a bore (e.g., bore 540). This is further illustrated and described with reference to Figure 7.

[0123] As an example, channel 630 may be fluid-coupled to manifolds 510, 514, 612, and 616. Channel 632 may be fluid-coupled to manifolds 512, 516, 610, and 614. In one embodiment, as shown, channel 630 is an inlet channel and channel 632 is an outlet channel. In another embodiment, channel 630 is an outlet channel and channel 632 is an inlet channel. Other inlet and outlet channel arrangements may be implemented if any of manifolds 510, 512, 514, 516 and manifolds 610, 612, 614, 616 are supply manifolds or return manifolds. Manifolds 510, 512, 514, 516, 610, 612, 614, and 616 are shown on the same layer as the corresponding channels 502, 504, 606, and 608, although manifolds 510, 512, 514, 516, and 610, 612, 614, and 616 may be on different layers from channels 502, 504, 606, and 608. Parts of channels 630 and 632 are shown on the outside of the body 601, but all of channels 630 and 632 may be located on one or more layers of the body 601.

[0124] Layers 500 and 602 can be configured as described below with reference to any of Figures 7 to 13. The body 601 includes a central bore 640. The central bore 640 can be used to supply process gas when the cooling assembly is mounted as part of the cold plate and / or showerhead assembly of the upper plate. The central bore 640 can be used to pass electrical lines for electrodes and / or sensors, and / or to supply backside gas when the cooling assembly is mounted as part of the substrate support.

[0125] Figure 7 shows a channel (partially designated 700) having offset and confluence sections due to adjacent bores. Bores 702, 704, and 706 are shown as examples. An exemplary offset section is shown (partially designated 708). The offset section is located around portions of bores 702, 704, and 706. The offset section bypasses and does not follow a normal helical path that could extend through the locations of bores 702, 704, and 706. The offset section is provided to prevent fluid in the corresponding channel from leaking into bores 702, 704, and 706. An exemplary confluence section (or manifold) 710 is shown with a single channel 712 connecting the confluence section. The single channel 712 may have a minimum cross-sectional area equal to the sum of the cross-sectional areas of the corresponding confluence channels. As an example, the minimum cross-sectional area of ​​channel 712 may be equal to the sum of the cross-sectional areas of the three channels that merge into channel 712.

[0126] Figures 8 to 15 below illustrate various cladding layers, core layers, and body layers. Each cladding layer can be mounted as a brazed foil layer that melts during the brazing process (e.g., vacuum brazing) to join adjacent layers to the cladding layer. The core layer does not melt during the brazing process. The body layer may also not melt during the brazing process.

[0127] Figure 8 shows a portion of the layered stack 800 of a cooling assembly including a clad-core-clad arrangement with internal offset channels. The cooling assembly includes a first cooling layer 802 which includes a first clad layer 804, a first core layer 806, a second clad layer 808, a first channel set 810, and a second channel set 812. The first channel set 810 can extend perpendicularly through the first clad layer 804 and perpendicularly to the first core layer 806. The second channel set 812 is perpendicularly offset from the first channel set 810, partially extends perpendicularly to the first core layer 806, and can extend through the second clad layer 808.

[0128] The cooling assembly further includes a second cooling layer 820 comprising a third cladding layer 822, a second core layer 824, a fourth cladding layer 826, a third channel set 828, and a fourth channel set 830. The third channel set 828 can extend through the third cladding layer 822 and partially extend into the second core layer 824. The fourth channel set 830 can be offset perpendicularly from the third channel set 828, partially extend perpendicularly into the second core layer 824, and extend through the fourth cladding layer 826. The third channel set 828 can be radially aligned with the first channel set 810. The fourth channel set 830 can be radially aligned with the second channel set 812.

[0129] Layers 804, 806, and 808 are positioned between the main body layers 840 and 842. Layers 822, 824, and 826 are positioned between the main body layers 842 and 844. In one embodiment, the main body layers 840, 842, and 844 are mounted as metal layers. For example, the cladding layers 804, 808, 822, and 826 may be formed from aluminum cladding material, the core layers 806 and 824 may be formed from aluminum alloy, and the main body layers 840, 842, and 844 may be formed from aluminum. In the example in Figure 8, channels 810, 812, 828, and 830 are machined into the cladding layers 804, 808, 822, and 826 and the core layers 806 and 824. As an example, the width W of each channel 810, 812, 828, 830 and / or other channels disclosed herein may be 1.5 to 2.0 millimeters (mm), and the height H of each channel 810, 812, 828, 830 and / or other channels disclosed herein may be 3.0 to 5.0 mm. Core layers 806, 824 can be brazed to body layers 840, 842, 844 by melting cladding layers 804, 808, 822, 826. Even if cladding layers 804, 808, 822, 826 are melted, channels 810, 812, 828, 830 are not filled.

[0130] The first channel set 810 is arranged radially alternately with respect to the second channel set 812. The third channel set 828 is arranged radially alternately with respect to the fourth channel set 830. Channel 810 is shown offset perpendicularly from channel 812, but channel 810 does not have to be offset perpendicularly from channel 812. Channel 810 is offset perpendicularly from channel 812, providing a radial gap (or bridge joint) between channels along the same cladding layer for brazing. An exemplary gap G is shown. The gap G between channels is provided to ensure that the wall thickness is not too thin for brazing and that the brazing area is set to a minimum size.

[0131] Figure 9 shows a portion 900 of a layered stack of a cooling assembly, including a clad-core-clad arrangement with some offset channels. The cooling assembly includes a first cooling layer 902, which includes a first clad layer 904, a first core layer 906, a second clad layer 908, a first channel set 910, and a second channel set 912. The first channel set 910 is partially located in the first clad layer 904, extends through the first core layer 906, and extends perpendicularly to the body layer 940. The second channel set 912 is perpendicularly offset from the first channel set 910, is partially located in the first core layer 906, extends through the second clad layer 908, and extends perpendicularly to the body layer 942.

[0132] The cooling assembly further includes a second cooling layer 920 comprising a third cladding layer 922, a second core layer 924, a fourth cladding layer 926, a third channel set 928, and a fourth channel set 930. The third channel set 928 is partially located in the third cladding layer 922, extends through the second core layer 924, and extends perpendicularly to the main body layer 942. The fourth channel set 930 is perpendicularly offset from the third channel set 928, is partially located in the second core layer 924, extends through the fourth sublayer layer 926, and extends perpendicularly to the main body layer 944. The third channel set 928 may be radially aligned with the first channel set 910. The fourth channel set 930 may be radially aligned with the second channel set 912.

[0133] Layers 904, 906, and 908 are positioned between the main body layers 940 and 942. Layers 922, 924, and 926 are positioned between the main body layers 942 and 944. In one embodiment, the main body layers 940, 942, and 944 are mounted as metal layers. For example, the cladding layers 904, 908, 922, and 926 may be formed from aluminum cladding material, the core layers 906 and 924 may be formed from an aluminum alloy, and the main body layers 940, 942, and 944 may be formed from aluminum. In the example in Figure 9, channels 910, 912, 928, and 930 are machined into the cladding layers 904, 908, 922, and 926 and the core layers 906 and 924. The core layers 906 and 924 can be brazed to the main body layers 940, 942, and 944 by melting the cladding layers 904, 908, 922, and 926. Even if the cladding layers 904, 908, 922, and 926 melt, the channels 910, 912, 928, and 930 will not be filled.

[0134] The first channel set 910 is arranged radially alternately with respect to the second channel set 912. The third channel set 928 is arranged radially alternately with respect to the fourth channel set 930. Channels 910 are shown offset perpendicularly from channel 912, but channel 910 does not have to be offset perpendicularly from channel 912. Channels 910 are offset perpendicularly from channel 912, creating a radial gap between channels along the same cladding layer for brazing.

[0135] Figure 10 shows a portion 1000 of a layered stack of a cooling assembly, which includes a clad-metal-clad stack with offset channels. The cooling assembly includes a first cooling layer 1002 which includes a first clad layer 1004, a first body layer 1006, a second clad layer 1008, a first channel set 1010, and a second channel set 1012. The first channel set 1010 extends vertically through the first clad layer 1004, contacts the first core layer 1013, and partially extends vertically to the first body layer 1006. The second channel set 1012 is offset vertically from the first channel set 1010, partially extends vertically to the first body layer 1006, and contacts the second clad layer 1008. The first core layer 1013 is located on the first channel set 1010 and the first body layer 1006.

[0136] The cooling assembly further includes a second cooling layer 1020 which includes a third cladding layer 1022, a second body layer 1024, a fourth cladding layer 1026, a third channel set 1028, and a fourth channel set 1030. The third channel set 1028 extends through the third cladding layer 1022, contacts the second core layer 1023, and partially extends perpendicularly to the second body layer 1024. The fourth channel set 1030 is offset perpendicularly from the third channel set 1028, partially extends perpendicularly to the second body layer 1024, and contacts the fourth cladding layer 1026. The third channel set 1028 may be radially aligned with the first channel set 1010. The fourth channel set 1030 may be radially aligned with the second channel set 1012.

[0137] A fifth cladding layer 1032 may be placed on the first core layer 1013. A second core layer 1023 may be placed between the second cladding layer 1008 and the third cladding layer 1022. A third core layer 1034 may be placed below the fourth cladding layer 1026. A sixth cladding layer 1036 may be placed below the third core layer 1034.

[0138] Layers 1004, 1013, and 1032 are positioned between the main body layers 1006 and 1040. Layers 1026, 1034, and 1036 are positioned between the main body layers 1024 and 1044. In one embodiment, the main body layers 1006, 1024, 1040, and 1044 are mounted as metal layers. For example, the cladding layers 1004, 1008, 1022, 1026, 1032, and 1036 may be formed from aluminum cladding material, the core layers 1013, 1023, and 1034 may be formed from an aluminum alloy, and the main body layers 1006, 1024, 1040, and 1044 may be formed from aluminum. In the example in Figure 10, channels 1010, 1012, 1028, and 1030 may be machined into cladding layers 1004 and 1022, and partially machined into one or more of layers 1008, 1013, 1023, and 1026. Core layers 1013, 1023, and 1034 can be brazed to body layers 1006, 1024, 1040, and 1044 by melting cladding layers 1004, 1008, 1022, 1026, 1032, and 1036. Channels 1010, 1012, 1028, and 1030 are not filled even if cladding layers 1004, 1008, 1022, 1026, 1032, and 1036 are melted.

[0139] The first channel set 1010 is arranged radially alternately with respect to the second channel set 1012. The third channel set 1028 is arranged radially alternately with respect to the fourth channel set 1030. Channel 1010 is shown offset perpendicularly from channel 1012, but channel 1010 does not have to be offset perpendicularly from channel 1012. Channel 1010 is offset perpendicularly from channel 1012, creating a radial gap between channels along the same cladding layer for brazing.

[0140] Figure 11 shows a portion 1100 of a layered stack of a cooling assembly including a body layer with offset channels. The cooling assembly includes a first cooling layer 1102 which includes a first cladding layer 1104, a first body layer 1106, a second cladding layer 1108, a first channel set 1110, and a second channel set 1112. The first channel set 1110 is in contact with the first cladding layer 1104 and extends partially perpendicular to the first body layer 1106. The second channel set 1112 is offset perpendicularly from the first channel set 1110, extends partially perpendicular to the first body layer 1106, and is in contact with the second cladding layer 1108. A first core layer 1113 is positioned on the first channel set 1110 and the first body layer 1106.

[0141] The cooling assembly further includes a second cooling layer 1120 comprising a third cladding layer 1122, a second body layer 1124, a fourth cladding layer 1126, a third channel set 1128, and a fourth channel set 1130. The third channel set 1128 is in contact with the third cladding layer 1122 and partially extends perpendicularly to the second body layer 1124. The fourth channel set 1130 is offset perpendicularly from the third channel set 1128, partially extends perpendicularly to the second body layer 1124, and is in contact with the fourth cladding layer 1126. The third channel set 1128 may be radially aligned with the first channel set 1110. The fourth channel set 1130 may be radially aligned with the second channel set 1112.

[0142] A fifth cladding layer 1132 may be placed on the first core layer 1113. A second core layer 1123 may be placed between the second cladding layer 1108 and the third cladding layer 1122. A third core layer 1134 may be placed below the fourth cladding layer 1126. A sixth cladding layer 1136 may be placed below the third core layer 1134.

[0143] Layers 1104, 1113, and 1132 are positioned between the main body layers 1106 and 1140. Layers 1126, 1134, and 1136 are positioned between the main body layers 1124 and 1144. In one embodiment, the main body layers 1106, 1124, 1140, and 1144 are mounted as metal layers. For example, the cladding layers 1104, 1108, 1122, 1126, 1132, and 1136 may be formed from aluminum cladding material, the core layers 1113, 1123, and 1134 may be formed from aluminum alloy, and the main body layers 1106, 1124, 1140, and 1144 may be formed from aluminum. In the example in Figure 11, channels 1110, 1112, 1128, and 1130 can be partially machined to the cladding layers 1104, 1108, 1122, and 1126, and also partially machined to the body layers 1106 and 1124. Core layers 1113, 1123, and 1134 can be brazed to the body layers 1106, 1124, 1140, and 1144 by melting the cladding layers 1104, 1108, 1122, 1126, 1132, and 1136. Even if the cladding layers 1104, 1108, 1122, 1126, 1132, and 1136 are melted, channels 1110, 1112, 1128, and 1130 will not be filled.

[0144] The first channel set 1110 is arranged radially alternately with respect to the second channel set 1112. The third channel set 1128 is arranged radially alternately with respect to the fourth channel set 1130. Channels 1110 are shown offset perpendicularly from channels 1112, but channels 1110 do not have to be offset perpendicularly from channels 1112. Channels 1110 are offset perpendicularly from channels 1112, creating a radial gap between channels along the same cladding layer for brazing.

[0145] Figure 12 shows a portion 1200 of a layered stack of a cooling assembly including a metal-brazed foil-metal stack with offset channels. The cooling assembly includes a first cooling layer 1202 which includes a first brazed foil layer 1204, a first body (or metal) layer 1206, a second brazed foil layer 1208, a first channel set 1210, and a second channel set 1212. The first channel set 1210 is in contact with the first brazed foil layer 1204 and can be partially extended perpendicular to the first body layer 1206. The second channel set 1212 is offset perpendicularly from the first channel set 1210, can be partially extended perpendicular to the first body layer 1206, and can be in contact with the second brazed foil layer 1208.

[0146] The cooling assembly further includes a second cooling layer 1220 comprising a third brazed foil layer 1222, a second body layer 1224, a fourth brazed foil layer 1226, a third channel set 1228, and a fourth channel set 1230. The third channel set 1228 is in contact with the third brazed foil layer 1222 and can be partially extended perpendicularly to the second body (or metal) layer 1224. The fourth channel set 1230 is offset perpendicularly from the third channel set 1228, can be partially extended perpendicularly to the second body layer 1224, and can be in contact with the fourth sublayer layer 1226. The third channel set 1228 can be radially aligned with the first channel set 1210. The fourth channel set 1230 can be radially aligned with the second channel set 1212.

[0147] Layers 1204, 1206, and 1208 are positioned between the main body layers 1240 and 1242. Layers 1222, 1224, and 1226 are positioned between the main body layers 1242 and 1244. In one embodiment, the main body layers 1206, 1224, 1240, 1242, and 1244 are mounted as metal layers. For example, the brazed foil layers 1204, 1208, 1222, and 1226 may be formed from aluminum material, and the main body layers 1206, 1224, 1240, 1242, and 1244 may be formed from aluminum. In the example in Figure 12, channels 1210, 1212, 1228, and 1230 may be partially machined into the brazed foil layers 1204, 1208, 1222, and 1226, and also partially machined into the main body layers 1206 and 1224. The main body layers 1206 and 1224 can be brazed to the main body layers 1240, 1242, and 1244 by melting the brazing foil layers 1204, 1208, 1222, and 1226. Even if the brazing foil layers 1204, 1208, 1222, and 1226 melt, the channels 1210, 1212, 1228, and 1230 will not be filled.

[0148] The first channel set 1210 is arranged radially alternately with respect to the second channel set 1212. The third channel set 1228 is arranged radially alternately with respect to the fourth channel set 1230. Channel 1210 is shown offset perpendicularly from channel 1212, but channel 1210 does not have to be offset perpendicularly from channel 1212. Channel 1210 is offset perpendicularly from channel 1212, creating a radial gap between channels along the same brazing foil layer for brazing.

[0149] Figure 13 shows a portion 1300 of a layered stack of a cooling assembly, including non-offset channels and brazing foil layers for brazing adjacent body layers. The cooling assembly includes i) a first cooling layer 1302 including a first brazing foil layer 1304 and a first channel set 1306, and ii) a second cooling layer 1308 including a second brazing foil layer 1310 and a second channel set 1312. The first brazing foil layer 1304 is located between body layers 1314 and 1316. The second brazing foil layer 1310 is located between body layers 1316 and 1318. Body layers 1314 and 1316 are brazed together by melting the first brazing foil layer 1304. Body layers 1316 and 1318 are brazed together by melting the second brazing foil layer 1310. The first channel set 1306 is not offset from each other in the vertical direction. The second channel set 1312 is not offset from each other in the vertical direction.

[0150] Figure 14 shows a portion 1400 of a layered stack of a cooling assembly, which includes a single layer of mesochannels and brazing foil layers for brazing adjacent body layers. The cooling assembly includes a cooling layer 1402 which includes a brazing foil layer 1404 and a channel set 1406. The brazing foil layer 1404 is positioned between body layers 1414, 1416. The body layers 1414, 1416 are brazed together by melting the first brazing foil layer 1404. The channel sets 1406 are not offset perpendicularly to each other. As an example, the body layers 1404, 1406 may be copper plates, and at least one of the plates (e.g., body layer 1414) is machined to have the channel set 1406.

[0151] Figure 15 shows a portion 1500 of a casting 1501 including an embedded mesochannel assembly (or insert) 1502 and an embedded mesochannel 1504. A mesochannel assembly, such as any of the mesochannel assemblies disclosed herein, can be embedded in a casting (e.g., an aluminum casting). The mesochannel 1504 may be formed in the insert 1502. In one embodiment, the insert is formed of copper, Inconel (a nickel-chromium superalloy), or other suitable material. In one embodiment, the insert is formed of copper, such as allowing a coolant, such as water, to flow through the insert 1502. The casting 1501 is formed on top of the insert 1502. As an example, the insert 1502 can be formed using a 3D printing process. The casting 1501 is formed using a manufacturing process in which a liquid material is injected into a mold containing the insert 1502, resulting in the casting 1501 being formed around the insert 1502.

[0152] The embodiments shown in Figures 14 and 15 can provide performance similar to conventional alternatives, but with a smaller volume and minimized weight and material costs.

[0153] The foregoing description is purely illustrative and is not intended to limit the Disclosure, its application, or its use. The broad teachings of the Disclosure can be implemented in various forms. Thus, while the Disclosure includes specific examples, the true scope of the Disclosure should not be limited to such examples, as other modifications will become apparent upon consideration of the drawings, specification, and the claims below. It should be understood that one or more steps in the Method may be performed in a different order (or simultaneously) without altering the principles of the Disclosure. Furthermore, while each embodiment is described above as having specific features, it is possible to implement one or more of these features described in relation to any embodiment of the Disclosure in other embodiments and / or combine them with any feature of any other embodiment (even if such combinations are not explicitly described). In other words, the described embodiments are not mutually exclusive, and substituting one or more embodiments with one or more is within the scope of the Disclosure.

[0154] The spatial and functional relationships between elements (e.g., modules, circuit elements, semiconductor layers, etc.) are described using a variety of terms, including “connected,” “engaged,” “joined,” “adjacent,” “next to,” “above,” “upwards,” “below,” and “located.” Furthermore, when a relationship between a first element and a second element is described in the above disclosure, unless it is explicitly described as “direct,” the relationship may be a direct relationship in which no other intervening elements exist between the first and second elements, or it may be an indirect relationship in which one or more intervening elements exist (spatially or functionally) between the first and second elements. As used herein, the expression “at least one of A, B, and C” should be interpreted as logic using non-exclusive logic OR (A or B or C) and not as “at least one of A, at least one of B, and at least one of C.”

[0155] In some embodiments, the controller is part of a system, and such a system may be part of the examples described above. Such a system may include semiconductor processing equipment comprising one or more processing tools, one or more chambers, one or more processing platforms, and / or specific processing components (such as a wafer pedestal, a gas flow system, etc.). These systems may be integrated with electronic equipment for controlling system operation before, during, and after processing of semiconductor wafers or substrates. Such electronic equipment may be referred to as a “controller” and may control various components or sub-components of one or more systems. Depending on the processing requirements and / or the type of system, the controller may be programmed to control any of the processes disclosed herein. Such processes may include supplying processing gases, setting temperature (e.g., heating and / or cooling), setting pressure, setting vacuum, setting power, setting radio frequency (RF) generator settings, setting RF matching circuit settings, setting frequency, setting flow rate, setting fluid supply, setting position and operation, loading and unloading wafers to and from tools and other transfer tools connected to or interlocked with a particular system, and / or loading and unloading wafers to and from a load lock.

[0156] In a broad sense, a controller may be defined as an electronic device having various integrated circuits, logic, memory, and / or software that receive and issue instructions, control operations, enable cleaning operations, enable endpoint measurements, etc. Integrated circuits may include chips in the form of firmware that store program instructions, chips defined as digital signal processors (DSPs), application-specific integrated circuits (ASICs), and / or one or more microprocessors, i.e., microcontrollers that execute program instructions (e.g., software). Program instructions are instructions communicated to the controller in the form of various individual settings (or program files) that may define operating parameters for performing a particular process on or for a semiconductor wafer or for a system. In some embodiments, the operating parameters may be part of a recipe defined by a process engineer to realize one or more processing steps in the fabrication of one or more layers, materials, metals, oxides, silicon, silicon dioxide, surfaces, circuits, and / or wafer dies.

[0157] In some embodiments, the controller may be part of a computer integrated with or coupled to the system, or otherwise networked to the system, or coupled to such a computer, or a combination thereof. For example, the controller may be in the “cloud” or may be all or part of the fab host computer system. This enables remote access to wafer processing. The computer may enable remote access to the system to monitor the current progress of fabrication operations, review the history of past fabrication operations, review trends or performance criteria from multiple fabrication operations, modify parameters of the current process, set processing steps following the current process, or start a new process. In some examples, a remote computer (e.g., a server) can provide process recipes to the system over a network. Such a network may include a local network or the internet. The remote computer may include a user interface that enables entry or programming of parameters and / or settings, which are then communicated from the remote computer to the system. In some examples, the controller receives instructions in the form of data. Such data identifies parameters for each processing step performed during one or more operations. It should be understood that the parameters may be specific to the type of process being performed and the type of tools to which the controller is configured to interact or control. Therefore, as described above, the controller may be distributed, for example, by including one or more separate controllers that are networked together and cooperate toward a common purpose (such as the processes and controls described herein). An example of a distributed controller for such purposes would be one or more integrated circuits on a chamber that communicate with one or more integrated circuits that are remotely located (e.g., at the platform level or as part of a remote computer) and combined to control the processes in the chamber.

[0158] Exemplary systems may include, but are not limited to, plasma etching chambers or modules, deposition chambers or modules, spin rinse chambers or modules, metal plating chambers or modules, cleaning chambers or modules, bevel edge etching chambers or modules, physical vapor deposition (PVD) chambers or modules, chemical vapor deposition (CVD) chambers or modules, atomic layer deposition (ALD) chambers or modules, atomic layer etching (ALE) chambers or modules, ion implantation chambers or modules, tracking chambers or modules, and any other semiconductor processing systems that may be used in connection with or for the fabrication and / or manufacture of semiconductor wafers.

[0159] As described above, depending on one or more process steps performed by the tool, the controller may communicate with one or more other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, nearby tools, tools located throughout the factory, a main computer, another controller, or tools used for material handling to load and unload wafer containers to and from tool locations and / or load ports within the semiconductor manufacturing plant.

Claims

1. A cold plate for a shower head assembly, A main body configured to be coupled to the shower head of a circuit board processing system, A first cooling layer comprising a plurality of first helical channels extending parallel to each other and offset from each other in the azimuthal direction, A first supply manifold that supplies coolant to each of the first plurality of helical channels, A first return manifold that receives coolant from each of the first plurality of helical channels and Equipped with, At least one of the first supply manifold and the first return manifold is circular. Cold plate.

2. A cold plate according to claim 1, further, A second cooling layer is provided, which is located below the first cooling layer and comprises a plurality of second helical channels that extend parallel to each other and are offset from each other in the azimuthal direction, A second supply manifold that supplies coolant to each of the second plurality of helical channels, A second return manifold that receives coolant from each of the second plurality of helical channels and Equipped with, At least one of the second supply manifold and the second return manifold is circular. Cold plate.

3. A cold plate according to claim 2, further, A first one or more channels supplying coolant to the first supply manifold and the second supply manifold, A cold plate comprising: a first return manifold and a second one or more channels for receiving coolant from the second return manifold.

4. A cold plate according to claim 1, A cold plate comprising a first cooling layer having a plurality of second helical channels extending parallel to each other and offset from each other in the azimuthal direction, wherein the plurality of second helical channels are arranged separately from the plurality of first helical channels.

5. A cold plate according to claim 4, The second plurality of helical channels extend parallel to the first plurality of helical channels, are offset from the first plurality of helical channels in the azimuthal and vertical directions, and extend from the first supply manifold to the first return manifold, forming a cold plate.

6. A cold plate according to claim 4, further, A second supply manifold that supplies coolant to each of the second plurality of helical channels, The system comprises a second return manifold that receives coolant from each of the second plurality of helical channels, At least one of the second supply manifold and the second return manifold is circular, The second plurality of helical channels are arranged radially outward from the first plurality of helical channels. Cold plate.

7. A cold plate according to claim 4, A cold plate in which the second plurality of helical channels are wound around the same central axis as the first plurality of helical channels.

8. A cold plate according to claim 4, A cold plate comprising a first cooling layer which includes a third plurality of helical channels offset vertically from the first plurality of helical channels, extending parallel to the first plurality of helical channels, and arranged alternately with the first plurality of helical channels.

9. A cold plate according to claim 8, A cold plate comprising a second cooling layer which includes a fourth plurality of helical channels offset vertically from the second plurality of helical channels, extending parallel to the second plurality of helical channels, and arranged alternately with the second plurality of helical channels.

10. A cold plate according to claim 4, The first cooling layer comprises a bore, Some of the first plurality of helical channels are wound in at least one direction toward the bore and toward the bore, and merge to form a first single channel, the first single channel being positioned around a portion of the bore. Cold plate.

11. A cold plate according to claim 10, The bore extends through the second cooling layer, Some of the second plurality of helical channels are wound in at least one direction toward the bore and toward the bore, and merge to form a second single channel. The second single channel is located around a portion of the bore. Cold plate.

12. A cold plate according to claim 4, further, A second cooling layer is provided, which is located beneath the first cooling layer and comprises a third plurality of helical channels that extend parallel to each other and are offset from each other in the azimuthal direction. A third supply manifold that supplies coolant to each of the third plurality of helical channels, The system comprises a third return manifold that receives coolant from each of the third plurality of helical channels, At least one of the third supply manifold and the third return manifold is circular. Cold plate.

13. A cold plate according to claim 12, The aforementioned second cooling layer is A fourth plurality of helical channels extending parallel to each other and offset from each other in the azimuthal direction, wherein the fourth plurality of helical channels are arranged separately from the third plurality of helical channels, A fourth supply manifold that supplies coolant to each of the fourth plurality of helical channels, A fourth return manifold that receives coolant from each of the fourth plurality of helical channels and Equipped with, At least one of the fourth supply manifold and the fourth return manifold is circular. Cold plate.

14. A cold plate according to claim 1, The first cooling layer comprises a bore, Some of the first plurality of helical channels are wound in at least one direction toward the bore and toward the bore, and merge to form a first single channel, the first single channel being positioned around a portion of the bore. Cold plate.

15. A cold plate according to claim 1, A cold plate comprising a first cooling layer which includes a second plurality of helical channels offset vertically from the first plurality of helical channels, extending parallel to the first plurality of helical channels, and arranged alternately with the first plurality of helical channels.

16. A cold plate according to claim 15, The first cooling layer is The first cladding layer, A second cladding layer is placed on top of the first cladding layer, A core layer disposed between the first cladding layer and the second cladding layer Equipped with, The first cladding layer bonds the core layer to the first body layer of the cold plate. The second cladding layer bonds the core layer to the second body layer of the cold plate. The first plurality of helical channels are arranged in the first cladding layer and the core layer. The second plurality of helical channels are arranged in the second cladding layer and the core layer. Cold plate.

17. A cold plate according to claim 15, The first cooling layer is The first cladding layer, A second cladding layer is placed on top of the first cladding layer, A core layer disposed between the first cladding layer and the second cladding layer Equipped with, The first cladding layer bonds the core layer to the first body layer of the cold plate. The second cladding layer bonds the core layer to the second body layer of the cold plate. The first plurality of helical channels are arranged in the first cladding layer, the core layer, and the first body layer. The second plurality of helical channels are arranged in the second cladding layer, the core layer, and the second body layer. Cold plate.

18. A cold plate according to claim 15, The first cooling layer is The first cladding layer, A second cladding layer is placed on top of the first cladding layer, A first main body layer is disposed between the first cladding layer and the second cladding layer. Equipped with, The first cladding layer bonds the first main body layer to the first core layer of the cold plate. The second cladding layer bonds the first main body layer to the second core layer of the cold plate. The first plurality of helical channels are arranged in the first cladding layer and the first body layer. The second plurality of helical channels are arranged in the second cladding layer and the second body layer. Cold plate.

19. A cold plate according to claim 18, The first plurality of helical channels are at least one of the following: in contact with the first core layer and / or partially located on the first core layer. The first core layer is disposed on the first cladding layer, The second plurality of helical channels are at least one of the following: in contact with the second core layer and / or partially located on the second core layer. The second cladding layer is disposed on the second core layer. Cold plate.

20. A cold plate according to claim 15, The first cooling layer is The first cladding layer, A second cladding layer is placed on top of the first cladding layer, A main body layer disposed between the first cladding layer and the second cladding layer Equipped with, The first cladding layer bonds the main body layer to the first core layer of the cold plate. The second cladding layer bonds the main body layer to the second core layer of the cold plate. The first plurality of helical channels are arranged in the main body layer and in contact with the first cladding layer, and at least one of the above is arranged in the first cladding layer. The second plurality of helical channels are arranged in the main body layer and in contact with the second cladding layer, and at least one of the second cladding layer is arranged in the second cladding layer. Cold plate.

21. A cold plate according to claim 15, The first cooling layer is The first brazed foil layer, A second brazing foil layer is placed on top of the first brazing foil layer, A first body layer is disposed between the first brazed foil layer and the second brazed foil layer. Equipped with, The first brazed foil layer is bonded to the second body layer of the cold plate by the first body layer. The second brazed foil layer joins the first main body layer to the third main body layer of the cold plate. The first plurality of helical channels are arranged in the first body layer and in contact with the first brazed foil layer, and at least one of the above is arranged in the first brazed foil layer. The second plurality of helical channels are arranged in the second body layer and in contact with the second brazed foil layer, and at least one of the above is arranged in the second brazed foil layer. Cold plate.

22. A cold plate according to claim 1, The first cooling layer is The first main layer, A second body layer is disposed on the first body layer, A brazing foil layer is disposed between the joint between the second main body layer and the first main body layer. Equipped with, The first plurality of helical channels are arranged in the second body layer and in contact with the brazed foil layer, and at least one of the above is arranged in the brazed foil layer. Cold plate.

23. A cold plate according to claim 22, The first plurality of helical channels are machined into the second body layer, forming a cold plate.

24. A cold plate according to claim 1, The first plurality of helical channels are mesochannels, which facilitate the flow of coolant from the first supply manifold to the first return manifold, forming a cold plate.

25. A cold plate according to claim 1, The first cooling layer is Castings and, An insert embedded in the casting, comprising the first plurality of helical channels A cold plate equipped with [a specific feature].

26. A substrate support, A main body configured to support a circuit board within a circuit board processing system, The main body is arranged, A first cooling layer comprising a plurality of first helical channels extending parallel to each other and offset from each other in the azimuthal direction, A first supply manifold that supplies coolant to each of the first plurality of helical channels, A first return manifold that receives coolant from each of the first plurality of helical channels and A cooling assembly comprising Equipped with, At least one of the first supply manifold and the first return manifold is circular. Substrate support.

27. A substrate support according to claim 26, The cooling assembly further, A second cooling layer is provided, which is located below the first cooling layer and comprises a plurality of second helical channels that extend parallel to each other and are offset from each other in the azimuthal direction, A second supply manifold that supplies coolant to each of the second plurality of helical channels, A second return manifold that receives coolant from each of the second plurality of helical channels and Equipped with, At least one of the second supply manifold and the second return manifold is circular. Substrate support.

28. A substrate support according to claim 27, further, A first one or more channels supplying coolant to the first supply manifold and the second supply manifold, A second one or more channels that receive coolant from the first return manifold and the second return manifold, A substrate support comprising the above.

29. A substrate support according to claim 26, A substrate support comprising a first cooling layer comprising a plurality of second helical channels extending parallel to each other and offset from each other in the azimuthal direction, wherein the plurality of second helical channels are arranged separately from the plurality of first helical channels.

30. A substrate support according to claim 29, A substrate support comprising a second plurality of helical channels extending parallel to the first plurality of helical channels, offset from the first plurality of helical channels in the azimuthal and vertical directions, and extending from the first supply manifold to the first return manifold.

31. A substrate support according to claim 29, further, A second supply manifold that supplies coolant to each of the second plurality of helical channels, The system comprises a second return manifold that receives coolant from each of the second plurality of helical channels, At least one of the second supply manifold and the second return manifold is circular, The second plurality of helical channels are arranged radially outward from the first plurality of helical channels. Substrate support.

32. A substrate support according to claim 29, A substrate support wherein the second plurality of helical channels are wound around the same central axis as the first plurality of helical channels.

33. A substrate support according to claim 29, A substrate support comprising a first cooling layer which includes a third plurality of helical channels offset vertically from the first plurality of helical channels, extending parallel to the first plurality of helical channels, and arranged alternately with the first plurality of helical channels.

34. A substrate support according to claim 33, The substrate support comprises a second cooling layer which includes a fourth plurality of helical channels that are offset vertically from the second plurality of helical channels, extend parallel to the second plurality of helical channels, and are arranged alternately with the second plurality of helical channels.

35. A substrate support according to claim 29, The first cooling layer comprises a bore, Some of the first plurality of helical channels are wound in at least one direction toward the bore and toward the bore, and merge to form a first single channel, the first single channel being positioned around a portion of the bore. Substrate support.

36. A substrate support according to claim 35, The bore extends through the second cooling layer, Some of the second plurality of helical channels are wound in at least one direction toward the bore and toward the bore, and merge to form a second single channel. The second single channel is located around a portion of the bore. Substrate support.

37. A substrate support according to claim 29, further, A second cooling layer is provided, which is located beneath the first cooling layer and comprises a third plurality of helical channels that extend parallel to each other and are offset from each other in the azimuthal direction. A third supply manifold that supplies coolant to each of the third plurality of helical channels, A third return manifold that receives coolant from each of the third plurality of helical channels and Equipped with, At least one of the third supply manifold and the third return manifold is circular. Substrate support.

38. A substrate support according to claim 37, The aforementioned second cooling layer is A fourth plurality of helical channels extending parallel to each other and offset from each other in the azimuthal direction, wherein the fourth plurality of helical channels are arranged separately from the third plurality of helical channels, A fourth supply manifold that supplies coolant to each of the fourth plurality of helical channels, A fourth return manifold that receives coolant from each of the fourth plurality of helical channels and Equipped with, At least one of the fourth supply manifold and the fourth return manifold is circular. Substrate support.

39. A substrate support according to claim 26, The first cooling layer comprises a bore, Some of the first plurality of helical channels are wound in at least one direction toward the bore and toward the bore, and merge to form a first single channel, the first single channel being positioned around a portion of the bore. Substrate support.

40. A substrate support according to claim 26, A substrate support comprising a first cooling layer which includes a second plurality of helical channels offset vertically from the first plurality of helical channels, extending parallel to the first plurality of helical channels, and arranged alternately with the first plurality of helical channels.

41. A substrate support according to claim 40, The first cooling layer is The first cladding layer, A second cladding layer is placed on top of the first cladding layer, A core layer disposed between the first cladding layer and the second cladding layer Equipped with, The first cladding layer bonds the core layer to the first main body layer of the substrate support, The second cladding layer bonds the core layer to the second main body layer of the substrate support. The first plurality of helical channels are arranged in the first cladding layer and the core layer. The second plurality of helical channels are arranged in the second cladding layer and the core layer. Substrate support.

42. A substrate support according to claim 40, The first cooling layer is The first cladding layer, A second cladding layer is placed on top of the first cladding layer, A core layer disposed between the first cladding layer and the second cladding layer Equipped with, The first cladding layer bonds the core layer to the first main body layer of the substrate support, The second cladding layer bonds the core layer to the second main body layer of the substrate support. The first plurality of helical channels are arranged in the first cladding layer, the core layer, and the first body layer. The second plurality of helical channels are arranged in the second cladding layer, the core layer, and the second body layer. Substrate support.

43. A substrate support according to claim 40, The first cooling layer is The first cladding layer, A second cladding layer is placed on top of the first cladding layer, A first main body layer is disposed between the first cladding layer and the second cladding layer. Equipped with, The first cladding layer bonds the first main body layer to the first core layer of the substrate support, The second cladding layer bonds the first main body layer to the second core layer of the substrate support. The first plurality of helical channels are arranged in the first cladding layer and the first body layer. The second plurality of helical channels are arranged in the second cladding layer and the second body layer. Substrate support.

44. A substrate support according to claim 43, The first plurality of helical channels are at least one of the following: in contact with the first core layer and / or partially located on the first core layer. The first core layer is disposed on the first cladding layer, The second plurality of helical channels are at least one of the following: in contact with the second core layer and / or partially located on the second core layer. The second cladding layer is disposed on the second core layer. Substrate support.

45. A substrate support according to claim 40, The first cooling layer is The first cladding layer, A second cladding layer is placed on top of the first cladding layer, A main body layer disposed between the first cladding layer and the second cladding layer Equipped with, The first cladding layer bonds the main body layer to the first core layer of the substrate support, The second cladding layer bonds the main body layer to the second core layer of the substrate support, The first plurality of helical channels are arranged in the main body layer and in contact with the first cladding layer, and at least one of the first cladding layer. The second plurality of helical channels are arranged in the main body layer and in contact with the second cladding layer, and at least one of these is arranged in the second cladding layer. Substrate support.

46. A substrate support according to claim 40, The first cooling layer is The first brazed foil layer, A second brazing foil layer is placed on top of the first brazing foil layer, A first body layer is disposed between the first brazed foil layer and the second brazed foil layer. Equipped with, The first brazed foil layer bonds the first main body layer to the second main body layer of the substrate support, The second brazed foil layer bonds the first main body layer to the third main body layer of the substrate support. The first plurality of helical channels are arranged in the first body layer and in contact with the first brazed foil layer, and at least one of the above is arranged in the first brazed foil layer. The second plurality of helical channels are arranged in the second body layer and in contact with the second brazed foil layer, and at least one of the above is arranged in the second brazed foil layer. Substrate support.

47. A substrate support according to claim 26, The first cooling layer is The first main layer, A second body layer is disposed on the first body layer, A brazing foil layer is disposed between the joint between the second main body layer and the first main body layer. Equipped with, The first plurality of helical channels are arranged in the second body layer and are in contact with the brazed foil layer, or are arranged in the brazed foil layer, at least one of the above. Substrate support.

48. A substrate support according to claim 47, A substrate support having the first plurality of helical channels machined into the second main body layer.

49. A substrate support according to claim 26, The first plurality of helical channels are mesochannels and are substrate supports that facilitate the flow of coolant from the first supply manifold to the first return manifold.

50. A substrate support according to claim 26, The first cooling layer is Castings and, An insert embedded in the casting, comprising the first plurality of helical channels A substrate support comprising the above.

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