Heat dissipation device

Abstract

To provide a heat dissipation device that can maintain the operating temperature of electronic equipment within an appropriate range. [Solution] A heat dissipation device having a heat dissipation surface, comprising a heat dissipation element located on the heat dissipation surface and including a plurality of fin structures protruding from the heat dissipation surface, and a spoiler element joined to the heat dissipation element and having at least one planar portion and a plurality of protruding portions connected to the at least one planar portion, wherein the plurality of protruding portions protrude from the at least one planar portion toward the heat dissipation surface.

Description

Technical Field

[0001] The present disclosure relates to a heat dissipation device, and more particularly to a heat dissipation device having a spoiler element for joining to a heat dissipation element.

Background Art

[0002] With the progress of science and technology, the applications of electronic devices have become increasingly common. In particular, various electronic devices equipped with semiconductor components have become indispensable in daily life. Since these electronic devices generate a large amount of thermal energy during operation, currently, these electronic devices are also equipped with heat dissipation devices to maintain stable operation of the electronic devices.

[0003] However, as the performance of electronic devices improves, conventional heat dissipation devices are unable to maintain the operating temperature of electronic devices within an appropriate range, which may affect the performance of electronic devices. Therefore, how to improve the heat dissipation device to overcome the above problems has become an urgent issue.

Summary of the Invention

Problems to be Solved by the Invention

[0004] Provide a heat dissipation device capable of maintaining the operating temperature of an electronic device within an appropriate range.

Means for Solving the Problems

[0005] Some embodiments of the present disclosure provide a heat dissipation device including a heat dissipation element and a spoiler element. The heat dissipation element has a heat dissipation surface. The heat dissipation element includes a plurality of fin structures disposed on the heat dissipation surface and protruding from the heat dissipation surface. The spoiler element is joined to the heat dissipation element, and the spoiler element has at least one planar portion and a plurality of protruding portions connected to the planar portion, and the protruding portions protrude from the planar portion toward the heat dissipation surface.

[0006] The concepts of the embodiments of this disclosure will be better understood based on the following detailed description and accompanying drawings. Note that, in accordance with standard industry practice, various features in the drawings are not necessarily depicted to scale. In fact, to provide a clearer explanation, the dimensions of various features can be arbitrarily enlarged or reduced. Similar features are indicated by similar reference numbers throughout the specification and drawings. [Brief explanation of the drawing]

[0007] [Figure 1] Figure 1 shows an exploded schematic diagram of a heat dissipation device according to several embodiments of the present disclosure. [Figure 2] Figure 2 shows a schematic cross-sectional view of a heat dissipation device along the line A-A' shown in Figure 1, according to several embodiments of the present disclosure. [Figure 3] Figure 3 shows a schematic cross-sectional view of a heat dissipation device along the line A-A' shown in Figure 1, according to several embodiments of the present disclosure. [Figure 4] Figure 4 shows a schematic cross-sectional view of a heat dissipation device along the line A-A' shown in Figure 1, according to several embodiments of the present disclosure. [Figure 5] Figure 5 shows a schematic cross-sectional view of a heat dissipation device along the line A-A' shown in Figure 1, according to some embodiments of the present disclosure. [Figure 6] Figure 6 shows a schematic cross-sectional view of a heat dissipation device along the line A-A' shown in Figure 1, according to several embodiments of the present disclosure. [Figure 7] Figure 7 shows a schematic cross-sectional view of a heat dissipation device along the line A-A' shown in Figure 1, according to several embodiments of the present disclosure. [Figure 8A] Figure 8A shows a schematic cross-sectional view of a heat dissipation device along the line A-A' shown in Figure 1, according to some embodiments of the present disclosure. [Figure 8B] Figure 8B shows a perspective view of the feature layer of a spoiler element according to several embodiments of the present disclosure. [Figure 9] Figure 9 shows an exploded schematic diagram of a heat dissipation device according to several embodiments of the present disclosure. [Figure 10] Figure 10 shows a partially enlarged schematic diagram of a heat dissipation element according to some embodiments of the present disclosure. [Figure 11] Figure 11 shows a partially enlarged schematic diagram of a spoiler element according to several embodiments of the present disclosure. [Figure 12] Figure 12 shows schematic cross-sectional views of heat dissipation devices according to several embodiments of the present disclosure. [Figure 13] Figure 13 shows a perspective view of a heat dissipation device according to several embodiments of the present disclosure. [Figure 14] Figure 14 shows a perspective view of a heat dissipation device according to several embodiments of the present disclosure. [Modes for carrying out the invention]

[0008] The following describes a heat dissipation device according to an embodiment of the present invention. However, it will be readily apparent that this embodiment provides many applicable inventive concepts that can be embodied in various specific situations. The specific embodiments disclosed are merely illustrative of specific ways of using this disclosure and do not limit the scope of this disclosure.

[0009] Furthermore, in some embodiments, relative terms, such as "down" or "bottom" and "up" or "top," may be used to describe the relative relationship between one element and another in the drawing. If the device in the drawing is inverted, it will be understood that the element described as being on the "down" side becomes the element described as being on the "up" side.

[0010] In this specification, terms such as “first,” “second,” etc., may be used to describe various elements, materials, and / or parts, but it will be understood that these elements, materials, and / or parts should not be limited by these terms, and that these terms are used only to distinguish different elements, materials, and / or parts. Accordingly, a first element, material, and / or part described below may be referred to as a second element, material, and / or part, without departing from the teachings of some embodiments of this disclosure, and unless otherwise specifically defined, a first or second element, material, and / or part described in the claims may be understood as any element, material, and / or part in the specification, provided that it conforms to the description in the claims.

[0011] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as those commonly understood by those skilled in the art in which this disclosure pertains. Unless otherwise defined, all terms used herein, including technical and scientific terms, have the same meaning as those commonly understood by those skilled in the art. While such meanings may be understood, terms defined in commonly used dictionaries should be interpreted in a way that is appropriate to the relevant art of this disclosure and its context or background, and should not be interpreted in an idealized or overly formal manner unless otherwise defined. Furthermore, the terms “substantially,” “approximately,” and “about” also appear in this text and are intended to encompass nearly the same and exactly the same situations or scope. Note that unless otherwise defined, any of the above terms, even if not explicitly mentioned in the description, should be interpreted as having the same meaning as the above-mentioned approximate terms.

[0012] First, as shown in Figure 1, Figure 1 shows an exploded schematic view of a heat dissipation device 100 according to several embodiments of the present disclosure. In some embodiments, the heat dissipation device 100 can be used in, for example, electronic equipment comprising semiconductor elements, or electronic equipment including other elements that generate thermal energy when operating in the electronic equipment, but the present disclosure is not limited thereto. As shown in Figure 1, the heat dissipation device 100 may include a heat dissipation element 110 and a spoiler element 120 bonded to the heat dissipation element 110. In some embodiments, the heat dissipation element 110 is attached to a heat generating element (e.g., a semiconductor element, or any element that generates thermal energy when operating in the electronic equipment). The heat dissipation element 110 has a heat dissipation surface (e.g., a heat dissipation surface 110T shown in Figure 2) to which the heat generating element (not shown) is attached. This allows the thermal energy generated by the heat generating element to be transferred from the heat dissipation surface to the external environment. In some embodiments, the heat dissipation element 110 includes a plurality of fin structures 111 located on the heat dissipation surface and protruding from the heat dissipation surface. In this embodiment, since each fin structure 111 is formed in a cylindrical shape, the fin structure 111 can also be called a columnar fin structure 111. The formation of the fin structure 111 increases the surface area on the heat dissipation element 110 (for example, on the heat dissipation surface 110T shown in Figure 2) that transmits thermal energy, thereby improving the efficiency of heat energy transmission of the heat dissipation element 110. The shape and size of the fin structure 111 described above are merely examples, and it should be understood that this disclosure is not limited thereto. Those skilled in the art will understand from this disclosure that various shapes and sizes of fin structures are included within the scope of this disclosure.

[0013] Furthermore, the spoiler element 120 is joined to the heat dissipation element 110 to form a channel. For example, a coolant (not shown) can be used and flowed through the channel formed by the spoiler element 120 and the heat dissipation element 110. This allows the heat energy generated by the heat-generating elements when the electronic device is operating to be removed by the flow of the coolant, maintaining the electronic device at an appropriate operating temperature and reducing the risk of failure due to overheating. For example, the coolant described above may include a fluorine-containing compound or other suitable polymer compound, but the present invention is not limited thereto. It should be understood that any fluid that can be applied to heat dissipation falls within the range of coolants described in this disclosure.

[0014] Figure 2 shows a schematic cross-sectional view of a heat dissipation device 100 along the line A-A' shown in Figure 1, according to some embodiments of the present disclosure. As shown in Figure 2, the spoiler element 120 has a planar portion 121 and a number of projections 122 connected to the planar portion 121. In some embodiments, the planar portion 121 is parallel to the horizontal plane (e.g., the XY plane), and the projections 122 protrude from the planar portion 121 toward the heat dissipation surface 110T. For example, the projections 122 may extend in a direction perpendicular to the planar portion 121 (e.g., in the negative Z-axis direction), but the present disclosure is not limited thereto.

[0015] In some embodiments, the protrusion 122 of the spoiler element 120 is fixedly joined onto the underlying fin structure 111. For example, the protrusion 122 can be fixed onto the underlying fin structure 111 by techniques such as mechanical locking, interference fitting, adhesion using an adhesive, soldering, diffusion welding, etc., but the present disclosure is not limited thereto. In other embodiments, for example, using 3D printing (also referred to as three-dimensional printing, additive manufacturing, layer manufacturing, etc.) technology, the spoiler element 120 (including the planar portion 121 and the protrusion 122) and the underlying fin structure 111 can be integrally manufactured. By providing the planar portion 121 that interconnects the plurality of protrusions 122 respectively fixed to the fin structure 111, the overall structural strength of the heat sink 100 can be improved, and the risk that the heat sink 100 is deformed under stress (e.g., thermal stress) can be reduced.

[0016] Also, by forming the protrusion 122 that extends towards the fin structure 111, a flow path through which a coolant (not shown) flows can be formed, and the coolant can be pressurized by the flow path, increasing the flow rate of the coolant and improving the heat dissipation efficiency of the heat sink 100. Specifically, since the cross-sectional area (e.g., measured along the Y-Z plane) at each location of the channel formed by the spoiler element 120 and the heat dissipation element 110 is not consistent, the coolant is pressurized when flowing through the narrow portion of the above-mentioned channel, increasing the flow rate of the coolant.

[0017] For example, the spoiler element 120 can be made of a metal material with high thermal conductivity such as copper, aluminum, an alloy containing copper or aluminum, other suitable materials, or a combination of the foregoing. Thereby, the heat dissipation efficiency of the heat dissipation device 100 can be further improved. In some embodiments, the spoiler element 120 can be made of an easily moldable polymer material such as plastic. Thereby, the manufacturing difficulty of the heat dissipation device 100 can be reduced. The spoiler element 120 may be made of a single material or may include a plurality of different materials. It should be understood that all possible material configurations are within the scope of the present disclosure. For example, the flat portion 121 and the protruding portion 122 of the spoiler element 120 can be made of different materials in consideration of all the advantages of the above materials. In embodiments where the flat portion 121 and the protruding portion 122 are made of different materials, the flat portion 121 and the protruding portion 122 can be fixed by techniques such as mechanical locking, interference fitting, adhesion using an adhesive, soldering, diffusion welding, etc., but the present disclosure is not limited thereto.

[0018] FIG. 3 shows a schematic cross-sectional view of the heat dissipation device 100 along the line A-A' shown in FIG. 1 according to some embodiments of the present disclosure. The heat dissipation device 100 of the present embodiment may include elements identical or similar to those of the heat dissipation device 100 shown in FIG. 2, and these elements are denoted by the same or similar reference numerals, and the detailed description thereof will be omitted hereinafter. As shown in FIG. 3, the heat dissipation device 100 can include a heat dissipation element 110 and a spoiler element 120 joined to the heat dissipation element 110. Specifically, the difference between the present embodiment and the heat dissipation device 100 shown in FIG. 2 is that the heat dissipation element 110 includes a first fin structure 111A and a second fin structure 111B with different lengths. Similarly, the spoiler element 120 includes a first protruding portion 122A and a second protruding portion 122B with different lengths. For example, the above lengths can be measured along a direction parallel to the Z-axis, but the present disclosure is not limited thereto.

[0019] In some embodiments, the first fin structure 111A is joined to the corresponding first projection 122A, and the second fin structure 111B is joined to the corresponding second projection 122B. In these embodiments, the sum of the lengths of the first projection 122A and the first fin structure 111A is approximately equal to the sum of the lengths of the second projection 122B and the second fin structure 111B, so that the planar portion 121 of the spoiler element 120 is approximately parallel to the horizontal plane (e.g., the XY plane). In some embodiments, the length of the second fin structure 111B is shorter than the length of the first fin structure 111A, and the second fin structure 111B is located at the center of the heat dissipation element 110, but the disclosure is not limited thereto.

[0020] Figure 4 shows a schematic cross-sectional view of a heat dissipation device 100 along the line A-A' shown in Figure 1, according to several embodiments of the present disclosure. The heat dissipation device 100 of this embodiment may include elements identical or similar to those of the heat dissipation device 100 shown in Figure 2, which are indicated by the same or similar reference numerals, and a detailed description thereof is omitted below. As shown in Figure 4, the heat dissipation device 100 may include a heat dissipation element 110 and a spoiler element 120 bonded to the heat dissipation element 110. Specifically, the difference between this embodiment and the heat dissipation device 100 shown in Figure 2 is that the planar portion 121 of the spoiler element 120 is fixedly bonded to a fin structure 111 below. For example, the planar portion 121 can be fixed onto the fin structure 111 below by techniques such as mechanical locking, interlocking, adhesive bonding, soldering, and diffusion welding, but the present disclosure is not limited thereto. In other embodiments, the spoiler element 120 and the lower fin structure 111 can be manufactured in a single piece using, for example, 3D printing (also known as three-dimensional printing, additive manufacturing, or lamination). By fixing the flat portion 121 to the lower fin structure 111, the overall structural strength of the heat dissipation device 100 is improved, and the risk of the heat dissipation device 100 undergoing deformation due to stress (e.g., thermal stress) can be reduced.

[0021] Furthermore, the protrusions 122 of the spoiler element 120 are positioned in the gap between two adjacent fin structures 111. For example, in this embodiment, the protrusions 122 are provided between any two adjacent fin structures 111, but the disclosure is not limited thereto. In some other embodiments, there may be no protrusions 122 between two adjacent fin structures 111, or there may be multiple protrusions 122, and all these possible configurations are within the scope of the disclosure. Furthermore, in some embodiments, the side walls of the protrusions 122 can be in contact with the side walls of the fin structures 111. In some other embodiments, a gap may be formed between the side walls of the protrusions 122 and the side walls of the fin structures 111. This allows for a further reduction in the overall thickness of the heat dissipation device 100 on the Z axis, achieving a miniaturization effect. The above design allows for pressurization of the coolant within the channel, increasing the coolant flow velocity and improving the overall heat dissipation efficiency of the heat dissipation device 100.

[0022] Figure 5 shows a schematic cross-sectional view of a heat dissipation device 100 along the line A-A' shown in Figure 1, according to several embodiments of the present disclosure. The heat dissipation device 100 of this embodiment may include the same or similar elements as the heat dissipation device 100 shown in Figure 2, these elements are indicated by the same or similar reference numerals, and a detailed description is omitted below. As shown in Figure 5, the heat dissipation device 100 may include a heat dissipation element 110 and a spoiler element 120 bonded to the heat dissipation element 110. Specifically, the difference between this embodiment and the heat dissipation device 100 shown in Figure 3 is that the spoiler element 120 also includes a third protrusion 122C located between two adjacent first protrusions 122A (or second protrusions 122B). The third protrusion 122C is located in the gap between two adjacent fin structures 111. For example, in this embodiment, one third projection 122C is provided between any two adjacent fin structures 111, but the disclosure is not limited thereto. In some other embodiments, there may be no projections 122 between two adjacent fin structures 111, or there may be multiple projections 122, and all these possible configurations are within the scope of the disclosure. The above design allows the coolant to be pressurized in the channel, increasing the coolant flow rate and improving the overall heat dissipation efficiency of the heat dissipation device 100.

[0023] Figure 6 shows a schematic cross-sectional view of a heat dissipation device 100 along the line A-A' shown in Figure 1, according to several embodiments of the present disclosure. The heat dissipation device 100 of this embodiment may include elements identical or similar to those of the heat dissipation device 100 shown in Figure 2, which are indicated by the same or similar reference numerals, and a detailed description thereof is omitted below. As shown in Figure 6, the heat dissipation device 100 may include a heat dissipation element 110 and a spoiler element 120 bonded to the heat dissipation element 110. Specifically, the difference between this embodiment and the heat dissipation device 100 shown in Figure 2 is that the spoiler element 120 further has a plurality of additional protrusions 125 connected to the planar portion 121, the additional protrusions 125 projecting away from the planar portion 121 and away from the heat dissipation surface 110T. In other words, the additional protrusions 125 and 122 are located on the opposite side of the planar portion 121, respectively. The above design increases the disturbance of the coolant flow both inside and outside the channel, thereby improving the heat exchange capacity of the coolant and enhancing the overall heat dissipation efficiency of the heat dissipation device 100. In some embodiments, the width of each additional projection 125 may be greater than the width of each projection 122. The above width may be measured, for example, along the X-axis, but is not limited to this disclosure. In other embodiments, the width of each additional projection 125 may be less than or equal to the width of each projection 122.

[0024] Figure 7 shows a schematic cross-sectional view of a heat dissipation device 100 along the line A-A' shown in Figure 1, according to several embodiments of the present disclosure. The heat dissipation device 100 of this embodiment may include elements identical or similar to those of the heat dissipation device 100 shown in Figure 2, which are indicated by the same or similar reference numerals, and a detailed description is omitted below. As shown in Figure 7, the heat dissipation device 100 may include a heat dissipation element 110 and a spoiler element 120 bonded to the heat dissipation element 110. Specifically, the difference between this embodiment and the heat dissipation device 100 shown in Figure 2 is that the heat dissipation element 110 includes a first fin structure 111A and a second fin structure 111B of different lengths. For example, the above lengths can be measured along a direction parallel to the Z-axis, but the present disclosure is not limited thereto.

[0025] The first fin structure 111A and the second fin structure 111B can be arranged alternately and joined to the planar portion 121 and the projection portion 122 of the spoiler element 120, respectively. For example, the first fin structure 111A may be joined to the planar portion 121, and the second fin structure 111B, which is shorter in length than the first fin structure 111A, may be joined to the projection portion 122. In this embodiment, the spoiler element 120 has a plurality of planar portions 121 that are not in direct contact with each other (for example, a gap is formed horizontally (e.g., along the X-axis) between adjacent planar portions 121), and the projection portion 122 of the spoiler element 120 extends diagonally to connect adjacent planar portions 121, forming a V-shaped projection structure. In some embodiments, the projection portion 122 of the spoiler element 120 may also extend vertically to connect adjacent planar portions 121, forming a U-shaped projection structure. However, this disclosure is not limited to the shape of the protrusion 122 described above, and any shape of the protrusion 122 that can be connected to any adjacent planar portion 121 is included within the scope of this disclosure. The above design makes it possible to further reduce the manufacturing cost of the spoiler element 120 and at the same time improve the heat dissipation efficiency of the heat dissipation device 100.

[0026] Figure 8A shows a schematic cross-sectional view of a heat dissipation device 100 along the line A-A' shown in Figure 1, according to some embodiments of the present disclosure. The heat dissipation device 100 of this embodiment may include elements identical or similar to those of the heat dissipation device 100 shown in Figure 2, and these elements are indicated by the same or similar reference numerals. A detailed description is omitted below. As shown in Figure 8A, the heat dissipation device 100 may include a heat dissipation element 110 and a spoiler element 120 bonded to the heat dissipation element 110. Specifically, the difference between this embodiment and the heat dissipation device 100 shown in Figure 2 is that the spoiler element 120 further has a feature layer 126 located on the surface of the spoiler element 120 with respect to the protrusion 122 (i.e., the surface away from the fin structure 111).

[0027] Figure 8B shows a perspective view of the feature layer 126 of the spoiler element 120 according to several embodiments of the present disclosure. As shown in Figure 8B, a plurality of bumps 126P can be formed on the feature layer 126. The above design increases the disturbance of the coolant flow above the spoiler element 120, improving the heat exchange capacity of the coolant and improving the overall heat dissipation efficiency of the heat dissipation device 100. In other embodiments, a plurality of recesses (not shown) may be formed on the feature layer 126, which can also achieve the same effect as providing bumps 126P. In this embodiment, the bumps 126P are arranged in a matrix, but it should be understood that other embodiments in which the bumps 126P are arranged in any other regular or irregular manner are also included within the scope of the present disclosure.

[0028] Figure 9 shows an exploded schematic view of a heat dissipation device 200 according to several embodiments of the present disclosure. The heat dissipation device 200 of this embodiment may include the same or similar elements as the heat dissipation device 100 shown in Figure 1, and these elements are indicated by the same or similar reference numerals. A detailed explanation is omitted below. As shown in Figure 9, the heat dissipation device 200 may include a heat dissipation element 110 and a spoiler element 120 bonded to the heat dissipation element 110. Specifically, the difference between the heat dissipation device 200 of this embodiment and the heat dissipation device 100 shown in Figure 1 is that the heat dissipation element 110 includes a plurality of fin structures 112 located on a heat dissipation surface (e.g., the heat dissipation surface 110T shown in Figure 10) and protruding from the heat dissipation surface. In this embodiment, since each of the fin structures 112 is formed in a sheet-like manner, the fin structures 112 can also be called sheet-like fin structures 112. The formation of the fin structure 112 increases the surface area on the heat dissipation element 110 (for example, on the heat dissipation surface 110T shown in Figure 10) that transfers thermal energy, thereby improving the efficiency of heat energy transfer by the heat dissipation element 110. The shape and size of the fin structure 111 described above are merely examples, and the disclosure is not limited thereto. Those skilled in the art will understand from this disclosure that various shapes and sizes of fin structures are included within the scope of this disclosure.

[0029] Figure 10 shows a partially enlarged schematic view of a heat dissipation element 110 according to several embodiments of the present disclosure. As shown in Figure 10, each of the fin structures 112 has a plurality of accommodating grooves 112R formed therein. In some embodiments, the depth of the accommodating grooves 112R may be less than the height of the fin structure 112 (e.g., the height measured along the Z-axis), i.e., the accommodating grooves 112R do not divide the fin structure 112 into multiple separate parts, but the present invention is not limited thereto. Providing accommodating grooves 112R may be advantageous for joining a projection 122 (see, for example, Figure 11) onto the fin structure 112.

[0030] Figure 11 shows a partially enlarged schematic view of a spoiler element 120 according to several embodiments of the present disclosure. Each of the protrusions 122 has a plurality of accommodating grooves 127 formed therein. In some embodiments, the depth of the accommodating grooves 127 may be approximately equal to the height of the protrusion 122 (e.g., the height measured along the Z-axis), i.e., the accommodating grooves 127 can divide the protrusion 122 into a plurality of separate parts, but the present invention is not limited thereto. By providing the accommodating grooves 127, it may be advantageous to align, for example, the accommodating groove 112R on the fin structure 112 with the accommodating groove 127 on the protrusion 122, and join the fin structure 112 onto the protrusion 122. As described above, the accommodating groove 112R may be formed on the fin structure 112 and the accommodating groove 127 may be formed on the protrusion 122 simultaneously, but the present disclosure is not limited thereto. The accommodating groove 112R and the accommodating groove 127 can be selectively formed, or the accommodating groove 112R and the accommodating groove 127 can be omitted, thereby reducing the manufacturing cost and time of the heat dissipation device 100.

[0031] Figure 12 shows a schematic cross-sectional view of a heat dissipation device 100 according to several embodiments of the present disclosure. As shown in Figure 12, a coolant can be used to flow into a channel formed by the spoiler element 120 and the heat dissipation element 110 along direction I, and out of the channel along direction O. In some embodiments, directions I and O can be any directions parallel to the XY plane. This allows the thermal energy generated by the heat-generating elements when the electronic device is operating to be removed by the flow of the coolant, thereby maintaining the electronic device at an appropriate operating temperature and reducing the risk of failure due to overheating. For example, the coolant may include a fluorine-containing compound or other suitable polymer compound, but the present invention is not limited thereto.

[0032] Figure 13 shows a perspective view of a heat dissipation device 100 according to several embodiments of the present disclosure. The heat dissipation device 100 of this embodiment may include elements identical or similar to those of the heat dissipation device 100 shown in Figure 12, and these elements are indicated by the same or similar reference numerals. A detailed explanation is omitted below. As shown in Figure 13, the heat dissipation device 100 may include a heat dissipation element 110 and a spoiler element 120 bonded to the heat dissipation element 110. Specifically, the difference between this embodiment and the heat dissipation device 100 shown in Figure 12 is that the first opening 120E1 and the second opening 120E2 are formed to penetrate the spoiler element 120, so that the first opening 120E1 and the second opening 120E2 expose a portion of the fin structure 111 on the heat dissipation surface. In this embodiment, a coolant can be used to flow into the first opening 120E1 along direction I and out through the second opening 120E2 along direction O. In some embodiments, directions I and O can be any directions that are not parallel to the XY plane. By providing the first opening 120E1 and the second opening 120E2, the effect of changing the flow direction of the coolant can be achieved, allowing the heat dissipation device 100 to meet the user's needs.

[0033] Figure 14 shows a perspective view of a heat dissipation device 100 according to several embodiments of the present disclosure. The heat dissipation device 100 of this embodiment may include elements identical or similar to those of the heat dissipation device 100 shown in Figure 12, and these elements are indicated by the same or similar reference numerals. A detailed description is omitted below. As shown in Figure 14, the heat dissipation device 100 may include a heat dissipation element 110 and a spoiler element 120 bonded to the heat dissipation element 110. Specifically, the difference between this embodiment and the heat dissipation device 100 shown in Figure 12 is that the opening 120E is formed to penetrate the spoiler element 120, so the opening 120E exposes a portion of the fin structure 111 on the heat dissipation surface. In this embodiment, a coolant can be used to flow into the channel formed by the spoiler element 120 and the heat dissipation element 110 along direction I and out through the opening 120E along direction O. In some embodiments, direction I can be any direction parallel to the XY plane, and direction O can be any direction not parallel to the XY plane, but the present invention is not limited thereto. In some embodiments, directions I and O can be swapped, i.e., the coolant can flow into the opening 120E and out through a channel formed by the spoiler element 120 and the heat dissipation element 110 along direction I. By providing the opening 120E, the effect of changing the flow direction of the coolant can be achieved, allowing the heat dissipation device 100 to meet the user's needs.

[0034] In summary, this disclosure provides a heat dissipation device equipped with spoiler elements for bonding to a heat dissipation element. Specifically, by providing spoiler elements bonded to a fin structure, the overall structural strength of the heat dissipation device can be improved, and the risk of deformation due to stress (e.g., thermal stress) on the heat dissipation device can be reduced. Furthermore, the coolant flowing through the channel can be pressurized to increase the coolant flow rate and improve the heat dissipation efficiency of the heat dissipation device. The spoiler elements can also be made of a metal material with high thermal conductivity or a polymer material that is easy to mold. This can further improve the heat dissipation efficiency of the heat dissipation device or reduce the difficulty of manufacturing the heat dissipation device.

[0035] While embodiments and advantages of this disclosure are disclosed above, it should be understood that anyone with ordinary skill in the art may modify, substitute, and replace them without departing from the spirit and scope of this disclosure. Furthermore, the scope of protection of this disclosure is not limited to the processes, machines, manufactures, composition of materials, apparatus, methods, and steps in the specific embodiments described herein. Anyone with ordinary skill in the art can understand from the contents of this disclosure current or future processes, machines, manufactures, composition of materials, apparatus, methods, and steps, insofar as they perform substantially the same function or achieve substantially the same results as the embodiments described herein. Furthermore, the scope of each patent application constitutes a separate embodiment, and the scope of protection of this disclosure also includes combinations of the scope and embodiments of each patent application. [Explanation of Symbols]

[0036] 100, 200 heat dissipation devices 110 Heat dissipation element 110T heat dissipation surface 111 Fin structure (columnar fin structure) 111A First fin structure 111B Second fin structure 112 Fin structure (sheet-like fin structure) 112R housing groove 120 spoiler element 120E opening 120E1 First opening 120E2 Second opening 121 Plane section 122 Protrusion 122A First protrusion 122B Second protrusion 122C Third projection 125 Additional protrusions 126 Feature Layers 126P Bump 127 Retaining groove AA Line I, O direction

Claims

1. A heat dissipation element having a heat dissipation surface and including a plurality of fin structures located on the heat dissipation surface and protruding from the heat dissipation surface, and A spoiler element is bonded to the heat dissipation element and has at least one planar portion and a plurality of protrusions connected to the at least one planar portion, the plurality of protrusions projecting from the at least one planar portion toward the heat dissipation surface, A heat dissipation device that includes a heat dissipation device.

2. The heat dissipation device according to claim 1, wherein each of the plurality of protrusions is joined to at least one of the plurality of fin structures.

3. The heat dissipation device according to claim 1, wherein the plurality of protrusions include a plurality of first protrusions and a plurality of second protrusions, and the lengths of the plurality of first protrusions and the plurality of second protrusions are different.

4. The heat dissipation device according to claim 3, wherein the plurality of fin structures include a plurality of first fin structures joined to the plurality of first protrusions and a plurality of second fin structures joined to the plurality of second protrusions, and the sum of the lengths of the plurality of first protrusions and the lengths of the plurality of first fin structures is equal to the sum of the lengths of the plurality of second protrusions and the lengths of the plurality of second fin structures.

5. The heat dissipation device according to claim 1, wherein at least one planar portion of the spoiler element is joined to the plurality of fin structures, and the plurality of protrusions are each located between two adjacent fin structures of the plurality of fin structures.

6. The heat dissipation device according to claim 1, wherein the spoiler element further has a plurality of additional protrusions connected to the at least one planar portion, the plurality of additional protrusions projecting from the at least one planar portion in a direction away from the heat dissipation surface.

7. The heat dissipation device according to claim 1, wherein the spoiler element has a plurality of planar portions that are not in direct contact with each other, and the plurality of protrusions of the spoiler element extend to connect two adjacent planar portions of the plurality of planar portions.

8. The heat dissipation device according to claim 1, wherein the spoiler element further has a feature layer located on the surface of the spoiler element opposite to the plurality of protrusions, and a plurality of bumps or a plurality of recesses are formed on the feature layer.

9. The heat dissipation device according to claim 1, wherein the plurality of accommodating grooves are formed on the plurality of fin structures of the heat dissipation element or on the plurality of protrusions of the spoiler element.

10. The heat dissipation device according to claim 1, wherein at least one opening is formed to penetrate the spoiler element and expose a portion of the plurality of fin structures on the heat dissipation surface.

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