Actively cooled gas line for ion source

Abstract

An actively cooled gas conduit for use as an ion source is disclosed. The gas conduit includes a gas channel and a cooling channel, which may be adjacent to each other over at least a portion of the length of the gas channel. The gas conduit can be constructed by joining two tubes. Alternatively, the gas conduit can be constructed using additive manufacturing such that the cooling channel and the gas channel are within the same gas conduit. In some embodiments, a return channel is also located within the gas conduit. By actively cooling the gas conduit, the temperature of the gas conduit can be lowered, reducing the possibility of clogging due to the decomposition of the supply gas.

Description

Technical Field

[0001] This application claims the priority of U.S. Patent Application No. 18 / 128,033, filed on March 29, 2023, the disclosure of which is incorporated herein by reference in its entirety. Field Embodiments of the present disclosure relate to a system for cooling a gas line in communication with an ion source.

Background Art

[0002] Background Ion sources are used to generate ions that can be used for processing workpieces such as silicon wafers. In some embodiments, ions are extracted from the ion source, excited to form an ion beam, and then implanted into the workpiece.

[0003] One such ion source is an indirectly heated cathode ion source. An indirectly heated cathode (IHC) ion source operates by supplying current to a filament disposed behind the cathode. The filament emits thermionic electrons, and those electrons are accelerated towards the cathode to heat the cathode, which then emits electrons into the arc chamber of the ion source. The cathode is disposed at one end of the arc chamber. A repeller can be disposed at the end of the arc chamber opposite the cathode. The cathode and the repeller can be biased to repel electrons and return them towards the center of the arc chamber. In some embodiments, a magnetic field is used to further confine the electrons within the arc chamber. A plurality of sides are used to connect the two ends of the arc chamber.

[0004] Proximate to the center of the arc chamber and along one of these sides, an extraction aperture is disposed through which ions generated within the arc chamber can be extracted.

[0005] The supply gas is delivered to the ion source using a gas line. The gas line may have an inlet under atmospheric conditions, while its output is at the ion source. As the gas line moves to the ion source, the temperature of the ion source rises, and the gas line may heat up. Gas bushings can be used to thermally isolate the gas line from the ion source, however, some heat will still be transferred to the gas line. Furthermore, certain supply gases may decompose at high temperatures, potentially causing clogging of the gas line and shortening the lifespan of the assembly.

[0006] Therefore, it would be beneficial to have a system that cools the gas line so that the supply gas in the gas pipe is kept at a temperature below the temperature at which the gas decomposes. [Overview of the project]

[0007] An actively cooled gas conduit for use as an ion source is disclosed. The gas conduit includes a gas channel and a cooling channel, which may be adjacent to each other over at least a portion of the length of the gas channel. The gas conduit can be constructed by joining two tubes. Alternatively, the gas conduit can be constructed using additive manufacturing such that the cooling channel and the gas channel are within the same gas conduit. In some embodiments, a return channel is also located within the gas conduit. By actively cooling the gas conduit, the temperature of the gas conduit can be lowered, reducing the possibility of clogging due to the decomposition of the supply gas.

[0008] According to one embodiment, an ion implantation system is disclosed. The ion implantation system includes an ion source and a gas bushing communicating with the interior of the ion source, the ion source and the gas bushing being located within a vacuum chamber, a vacuum flange separating the vacuum chamber from the atmospheric environment, and a gas conduit communicating with the gas bushing, the gas conduit including a gas channel having an inlet located in the atmospheric environment and an outlet communicating with the gas bushing, a cooling channel adjacent to the gas channel, and a return channel in fluid communication with the cooling channel, wherein the cooling channel is adjacent to the gas channel for at least 50% of the length of the gas channel between the vacuum flange and the outlet. In some embodiments, the cooling channel abuts the gas channel as it passes through the vacuum flange. In some embodiments, the gas channel and the cooling channel are separate tubes coupled together. In certain embodiments, the return channel is a separate tube coupled to the gas channel and the cooling channel. In some embodiments, the system includes a block of material, and the cooling channel and gas channel are created by gun-drilled holes in the block of material. In certain embodiments, the return channel is created by a gun-drilled hole in a block of material. In some embodiments, the cooling channel, return channel, and gas channel are all located within a single conduit, with an internal wall used to separate the channels. In certain embodiments, the cooling channel, return channel, and gas channel extend linearly along the length of a single conduit. In certain embodiments, the cooling channel, return channel, and gas channel extend spirally along the length of a single conduit.

[0009] Ion implantation systems are disclosed according to other embodiments. The ion implantation system includes an ion source, a base on which the ion source is mounted, and a gas conduit communicating with the ion source, the portion of which passes through the base before entering the ion source. In some embodiments, the gas conduit enters the ion source through a surface adjacent to the base. In certain embodiments, the gas conduit includes a gas channel, a cooling channel, and a return channel. In some embodiments, the system includes a gas bushing communicating with the ion source, the gas conduit exiting the base and being fixed to a first end of the bushing conduit within the gas bushing.

[0010] An ion implantation system is disclosed according to other embodiments. The ion implantation system includes an ion source; a base on which the ion source is mounted, the base including a cooling channel and having two openings communicating with the base cooling channel; a gas bushing communicating with the interior of the ion source, the gas bushing including a bushing conduit for carrying a supply gas to the ion source; and a gas conduit communicating with the first end of the bushing conduit, wherein a fluid passing through the base cooling channel cools the bushing conduit. In some embodiments, a cooling loop communicates with the two openings of the base and is pressed against the gas bushing. In some embodiments, the gas bushing includes a cooling loop parallel to the bushing conduit for at least a portion of its length, the cooling loop communicating with the two openings of the base.

[0011] To better understand this disclosure, refer to the attached drawings. These drawings are incorporated herein by reference. [Brief explanation of the drawing]

[0012] [Figure 1] This shows a portion of an ion implantation system, including an ion source mounted on a base equipped with a gas conduit. [Figure 2A] Figure 2A shows two embodiments of a gas conduit that actively cools the supply gas. [Figure 2B] Figure 2B shows two embodiments of a gas conduit that actively cools the supply gas. [Figure 3A] Figure 3A shows a gas conduit manufactured using additive manufacturing according to two embodiments. [Figure 3B] Figure 3B shows a gas conduit manufactured using additive manufacturing according to two embodiments. [Figure 4A] Figure 4A shows four cross-sections of the gas pipeline shown in Figures 3A and 3B. [Figure 4B] Figure 4B shows four cross-sections of the gas pipeline shown in Figures 3A and 3B. [Figure 4C] Figure 4C shows four cross-sections of the gas pipeline shown in Figures 3A and 3B. [Figure 4D] Figure 4D shows four cross-sections of the gas conduit shown in Figures 3A and 3B. [Figure 5A] Figure 5A shows the inside of a gas conduit according to another embodiment. [Figure 5B] Figure 5B shows the inside of a gas conduit according to another embodiment. [Figure 5C] Figure 5C shows a diagram of the inside of a gas conduit according to another embodiment. [Figure 5D] Figure 5D shows a diagram of the inside of a gas conduit according to another embodiment. [Figure 6A] Figure 6A shows two additional embodiments of a gas conduit that actively cools the supply gas. [Figure 6B] Figure 6B shows two additional embodiments of a gas conduit that actively cools the supply gas. [Figure 7A] Figure 7A shows an embodiment of a gas bushing equipped with an active cooling function. [Figure 7B] Figure 7B shows an embodiment of a gas bushing equipped with an active cooling function. [Figure 8] An embodiment using a cooling loop connected to a base is shown. [Figure 9] This shows an embodiment in which a gas conduit passes through the base. [Figure 10A] Figure 10A shows two embodiments in which the gas conduit enters the ion source through a surface adjacent to the base. [Figure 10B]B in FIG. 10 shows two embodiments in which the gas conduit enters the ion source through the surface adjacent to the base. **DETAILED DESCRIPTION OF THE INVENTION**

[0013] As described above, the gas line is typically used to supply the feed gas to the ion source. FIG. 1 shows a part of an ion implantation system including an ion source 10. This configuration also includes a gas conduit 100 in fluid communication with the ion source 10. In many configurations, the ion source 10 is mounted on a base 20, which typically functions as a heat sink. In some embodiments, a base cooling channel 21 is disposed within the base 20, and a cooling fluid passes through the base cooling channel 21 to remove heat from the base 20. The connection to the base cooling channel 21 can be disposed in the atmospheric environment 2 outside the vacuum chamber 1.

[0014] Furthermore, the gas conduit 100 extends from the atmospheric environment 2 to the gas bushing 30. The inlet of the gas conduit 100 is attached to a gas cylinder and is positioned within the atmospheric environment 2. The outlet of the gas conduit 100 is at the gas bushing 30 within the vacuum chamber 1. The gas bushing 30 includes a bushing conduit 31 and serves to form a fluid communication between the ion source 10 and the gas conduit 100. The gas bushing 30 enters an opening positioned on one surface of the ion source 10, and that surface is not adjacent to the base 20. In some embodiments, the gas bushing 30 may be a ceramic material to reduce the thermal conductivity from the ion source 10 to the gas conduit 100. In other embodiments, the gas bushing 30 may be a metal such as stainless steel or tantalum. The gas conduit 100 is attached to the first end of the bushing conduit 31, and the second end of the bushing conduit 31 is disposed at the ion source 10.

[0015] The outer wall 40 is used to separate the vacuum chamber 1 from the atmospheric environment 2. The gas conduit 100 extends through the outer wall 40 to the ion source 10. The vacuum flange 50 is used to maintain the pressure difference between the vacuum chamber 1 and the atmospheric environment 2.

[0016] In the embodiments shown in Figures 1 to 6B, the gas conduit 100 includes a gas channel, a cooling channel, and a return channel. In these embodiments, the cooling channel is adjacent to the gas channel and parallel to the gas channel for at least a portion of its path from the vacuum flange 50 to the gas bushing 30. In some embodiments, as the gas channel passes through the vacuum flange 50, the cooling channel abuts against the gas channel. In some embodiments, the cooling channel extends from the vacuum flange 50 toward the gas bushing 30 and terminates at or near the gas bushing 30. In some embodiments, the cooling channel terminates at a distance of less than 6 inches from the gas bushing 30. In other embodiments, the cooling channel terminates at a distance of less than 4 inches from the gas bushing 30. In yet another embodiment, the cooling channel may terminate within 2 inches from the gas bushing 30. In some embodiments, the cooling channel is parallel to the gas channel for a distance of at least 6 inches. In some embodiments, the return channel is also adjacent to and parallel to the gas channel. In some embodiments, the cooling channel is adjacent to the gas channel for at least 50% of its length from the vacuum flange 50 to the gas bushing 30.

[0017] During operation, the cooling channel communicates with a source of cooling fluid, such as water, cooled gas, or other suitable fluid. The coolant enters the cooling channel inlet, which is in the atmospheric environment 2, passes through the cooling channel, through the junction to the return channel, and is discharged from the return channel outlet, which is also in the atmospheric environment 2. The gas channel can be used to transport a supply gas to the ion source 10. The supply gas may be any suitable gas, such as a boron-containing gas, a phosphorus-containing gas, an arsenic-containing gas, an aluminum-containing gas, hydrogen, or an inert gas.

[0018] The embodiments shown in Figures 2A and 2B can be manufactured using conventional manufacturing techniques. Figure 2A shows a first embodiment of the gas conduit 100. In this embodiment, the gas conduit 100 includes three tubes joined by welding or other means. Thus, in this embodiment, the gas channel 110, the cooling channel 120, and the return channel 130 are separate tubes joined together. For example, these tubes may be made of stainless steel, nickel, tantalum, or other metals. In some embodiments, the outer diameter of the tubes is 0.250 inches to 0.375 inches, and the wall thickness is 0.02 inches to 0.035 inches. The inner diameter of the tubes may be 0.20 inches to 0.35 inches. The inlet 111 to the gas channel 110 is located in the atmospheric environment 2 outside the vacuum flange 50. The outlet 113 of the gas channel 110 is attached to the first end of the bushing conduit 31 in the gas bushing 30 (see Figure 1). Before reaching the gas bushing 30, the outlet of the cooling channel 120 is attached to the inlet of the return channel 130 at a joint 125 or the like. Both the cooling inlet 121 and the return outlet 131 are located within the atmospheric environment 2. Therefore, apart from the connection of the gas channel 110 to the first end of the bushing conduit 31 within the gas bushing 30, there are no seals or other fluid connections within the vacuum chamber 1.

[0019] Figure 2B shows a second embodiment. In this embodiment, three holes are created in a block 140 of material, which may be a metal such as stainless steel, nickel, or tantalum, or a ceramic, by gun-drilling, so that the holes penetrate the entire block 140 of material. These holes function as a gas channel 110, a cooling channel 120, and a return channel 130. The diameter of the holes is 0.20 to 0.305 inches, and the spacing between the holes is 0.02 to 0.05 inches. The inlet 111 to the gas channel 110 is located in the atmospheric environment 2 outside the vacuum flange 50. The cooling channel 120 and the return channel 130 can be connected at a joint 125 in the block 140 of material to form a loop. As previously mentioned, both the cooling inlet 121 and the return outlet 131 are located in the atmospheric environment 2. In this embodiment, the gas channel 110 extends beyond the block 140 of material. This can be achieved by passing a tube 112 through a bore associated with the gas channel, the tube 112 being longer than the length of the material block 140. Alternatively, the tube 112 can be attached to the distal end of the material block 140. Figure 2B shows the material block 140 extending to the vacuum flange 50, but it should be noted that in other embodiments, the material block 140 does not have to extend to the vacuum flange 50. Due to the gun-drilled holes, the cooling channel 120 and the gas channel 110 are parallel to each other through at least part of the path from the vacuum flange 50 to the gas bushing 30.

[0020] Figures 2A and 2B show embodiments that can be manufactured using conventional manufacturing techniques, but other embodiments can also be created using additive manufacturing.

[0021] Figure 3A shows a gas conduit 100 that can be formed using additive manufacturing according to the first embodiment. In this embodiment, the gas conduit 100 can be stainless steel, nickel, tantalum, or other metal. Alternatively, the gas conduit 100 can be a non-porous chamber ceramic material that does not interact with the supply gas. Furthermore, the cross-section of the gas conduit 100 includes a gas channel 150, a cooling channel 160, and a return channel 170. The total cross-sectional area of ​​these channels may be approximately the same as the total cross-sectional area of ​​the separate tubes described in Figure 2A. In some embodiments, the total cross-sectional area is 0.09 in². 2 ~0.3in 2 These three channels can be located between the gas channel 160 and the gas channel 170. As described above, the inlet 151 to the gas channel 150 can be located within the atmospheric environment 2. At the joint 165 in front of the gas bushing 30, the cooling channel 160 and the return channel 170 are connected, and the fluid passes through the cooling inlet 161 in the cooling channel 160, enters the return channel 170, and is discharged from the return outlet 171. Figure 3B shows a gas conduit 100 that can be formed using additive manufacturing according to the second embodiment. Similar to the embodiment in Figure 3A, the gas conduit 100 includes three channels. However, the three channels extend spirally along the length of the gas conduit 100. As described above, there is a joint 165 where the cooling channel 160 and the return channel 170 are connected, and the fluid passes through the cooling channel 160, enters the return channel 170, and is discharged from the return outlet 171.

[0022] As described above, there is a joint 165 where the cooling channel 160 and the return channel 170 are connected, and the fluid passes through the cooling channel 160, enters the return channel 170, and is discharged from the return outlet 171. In these figures, the gas conduit 100 is shown as cylindrical, but other shapes are also possible. In Figure 4A, the three channels (gas channel 150, cooling channel 160, and return channel 170) each occupy a wedge shape within the gas conduit 100. In this embodiment, three internal walls 142 are arranged within the gas conduit 100, each internal wall 142 extending inward from the internal wall of the gas conduit 100 and intersecting at a common point within the gas conduit 100. The thickness of the internal walls 142 is 0.2 to 0.4 inches, but other dimensions can also be used. The wedge shapes are shown as being the same size, but it is understood that the cross-sectional area of ​​each channel may differ as needed. Furthermore, the common point does not need to be at the center of the cross-section. Furthermore, in other embodiments, the three internal walls 142 may not intersect at a common point, but each may extend across the gas conduit 100 and be attached to the internal wall of the gas conduit 100 at two points.

[0023] Figure 4B shows an embodiment similar to that in Figure 4A, in which the internal leak monitoring conduit 172 is located near the center of the gas conduit 100. The inner diameter of the internal leak monitoring conduit 172 can be 0.05 inches or more. Each internal wall 142 extends from the inner wall of the gas conduit 100 to the outer wall of the internal leak monitoring conduit 172. Note that each channel communicates with the internal leak monitoring conduit 172, and leaks in any of the channels can be detected using the internal leak monitoring conduit 172.

[0024] Figure 4C shows an embodiment in which the central portion of the gas conduit 100 functions as a gas channel 150, with the cooling channel 160 and the return channel 170 each occupying a portion of the outer annular ring surrounding the gas channel 150. Again, the cross-sectional areas of the three channels do not have to be equal. Furthermore, the cross-sectional area of ​​each channel may be the same as that described above with respect to Figure 2A.

[0025] Figure 4D shows an embodiment in which the central portion of the gas conduit 100 functions as a gas channel 150, with a cooling channel 160 and a return channel 170 each occupying an outer annular ring surrounding the gas channel 150. In some embodiments, the annular ring functioning as the cooling channel 160 is adjacent to the gas channel 150, and the return channel 170 is the outermost annular ring. Again, the cross-sectional areas of the three channels do not have to be equal.

[0026] Of course, the three channels can be arranged in other ways. In a particular embodiment, the channels are arranged such that the cooling channel 160 is adjacent to the gas channel 150.

[0027] Figure 5A shows another embodiment in which a portion of the interior of the gas conduit 100 is a gyroid-shaped grid 155. A gyroid is defined as "a triple-period minimum surface that repeats in three different directions in space, like a crystal." By definition, the grid 155 has two volumes / flow paths that never intersect, which allows for a very high heat exchange rate between the fluids passing through the grid 155. Therefore, to maximize the cooling of the gas channel 150, the cooling channel 160 and the gas channel 150 are placed within the grid 155. Figures 5B to 5D show a different embodiment incorporating a return channel 170. In Figure 5B, the internal wall 142 is used to define the wedge-shaped portion of the gas conduit reserved for the return channel 170. The wedge-shaped portion is similar to that described in Figure 4A. Alternatively, the portion of the cross-section used for the return channel 170 may have a different shape. In Figure 5C, the internal leak monitoring conduit 172 can be positioned in the center of the gas conduit, similar to the embodiment shown in Figure 4B. In Figure 5D, an outer annular ring is used to provide a return channel 170. Note that the embodiment shown in Figure 5D can also be modified so that the return channel 170 is the central conduit and the grid 155 is positioned around the return channel 170.

[0028] Note that each of these embodiments includes a joint 165 used to connect the cooling channel 160 and the return channel 170.

[0029] Figures 2A to 5D show a single gas conduit 100 containing three channels that are very close to each other, such as within 0.1 inches, but other embodiments are also possible. For example, as mentioned above, cooling of the gas channels occurs when there is heat exchange with the cooling channels. Therefore, in another embodiment, the cooling channels and gas channels are adjacent to each other, but the return channel is physically separated from these two channels. For example, in one embodiment shown in Figure 6A, the cooling channel 120 and the gas channel 110 are a combined pipe, while the return channel 130 is a pipe that is physically separated from the two combined pipes. As before, a joint 125 is used to connect the cooling channel 120 and the return channel 130.

[0030] Furthermore, this arrangement can also be used for additive manufacturing. For example, the gas conduit 100 may have a cross-section with only two channels. These may be a central channel which may be a gas channel 150 and a second channel which may be an annular ring which may be a cooling channel 160. In another embodiment, an internal wall 142 may be used to separate the gas channel 150 from the cooling channel 160. In yet another embodiment, the interior of the gas conduit may be in the shape of a grid 155. In these embodiments, the return channel 170 is located in a separate conduit that is physically separated from the gas conduit 100.

[0031] Figure 6B shows another embodiment utilizing conventional manufacturing techniques. This embodiment is similar to the embodiment shown in Figure 2B, except that the return channel 130 is physically separated from the material block 141.

[0032] Again, in each of these embodiments, a joint is used to connect the cooling channel to the return channel. Since the return channel is physically separated from the gas conduit, a small pipe section can be used to connect the cooling channel and the return channel.

[0033] All of the embodiments described above introduce a cooling channel adjacent to and parallel to the gas channel for at least a portion of the length from the vacuum flange 50 to the gas bushing 30. In some embodiments, the cooling channel is parallel to the gas channel for a distance of at least 6 inches. In some embodiments, the cooling channel is parallel to the gas channel as it approaches the gas bushing 30, as it becomes adjacent to the gas channel. For example, in some embodiments, the cooling channel may be adjacent to the gas channel within 6 inches from the gas bushing 30. In other embodiments, the cooling channel may be adjacent to the gas channel within 4 inches from the gas bushing 30. In yet another embodiment, the cooling channel may be adjacent to the gas channel within 2 inches from the gas bushing 30. In some embodiments, the cooling channel is adjacent to the gas channel along at least a portion of the length from the vacuum flange 50 to the outlet 113, where it is attached to the gas bushing 30. In some embodiments, this portion is at least 50% of the length from the vacuum flange 50 to the outlet 113. In some embodiments, this portion is at least 75% of the length from the vacuum flange 50 to the outlet 113.

[0034] However, other embodiments are also possible. For example, as shown in Figure 1, the base 20 includes base cooling channels 21. In some embodiments, these base cooling channels 21 may be used to cool a gas conduit.

[0035] Figure 7A shows a side view of an embodiment utilizing base cooling channels 21 located within the base 20. Figure 7B shows a front view of this embodiment. These base cooling channels 21 can be arranged throughout the base 20 and are used to carry a cooling fluid to maintain the base 20 at a predetermined temperature. In this embodiment, a gas bushing 32 is modified to allow the introduction of the cooling fluid from the base 20. The gas bushing 32 can be a conductive material that can withstand the high temperatures in its region, such as graphite, or a metal such as tungsten, tantalum, or stainless steel. Alternatively, a non-porous ceramic material that does not interact with the supply gas may be used. The gas bushing 32 typically includes a bushing conduit 31 extending from the gas conduit 100 to the ion source 10. The gas bushing 32 also includes at least one path having an inlet and an outlet, which is also called a cooling loop 34. The inlet is in fluid communication with an internal cooling channel 123, and the outlet is in fluid communication with an internal return channel 133. As described above, the internal cooling channel 123 and the internal return channel 133 are connected such that the cooling fluid flows from the inlet through the cooling loop 34 (i.e., the internal cooling channel 123 and the internal return channel 133) and out the outlet. The inlet and outlet each communicate with the base cooling channel 21 of the base 20. The cooling loop 34 may have a cross-sectional area similar to that of the cooling channels described above. Furthermore, in this embodiment, the inlet and outlet of the cooling loop 34 of the gas bushing 32 are sealed to the openings in the base 20 corresponding to the base cooling channel 21. For example, the gas bushing 32 can be bolted to the base 20 and the gas bushing 32 can be sealed to the openings in the base 20 using an O-ring or another compression seal. Furthermore, the cooling loop 34 may be parallel to the bushing conduit 31 for at least a portion of its length.

[0036] The base cooling channel 21 can be utilized in other ways. Figure 8 shows another embodiment. In this embodiment, the gas conduit 100 includes only the gas channel. The cooling loop 180 is attached to the base 20 and communicates with an opening in the base corresponding to the base cooling channel 21, allowing the cooling fluid to flow from the base 20 through the cooling loop 180 and back to the base 20. The cooling loop 180 can be pressed against the gas bushing 30, for example, by using a clamp block 185. In some embodiments, the cooling loop 180 is welded to the base 20, and as a result, there is no sealed connection within the vacuum chamber 1. In some embodiments, the cooling loop 180 is clamped to the gas bushing 30.

[0037] Figure 9 shows another embodiment. In this embodiment, the base 20 is configured such that at least a portion of the gas conduit 100 passes through the base 20. For example, the base 20 may form part of the boundary between the vacuum chamber 1 and the atmospheric environment 2. The gas conduit 100 can enter the base 20 in the atmospheric environment 2 and travel through the base 20 toward the gas bushing 30. The gas conduit 100 then exits the base 20, and the exposed portion of the gas conduit 100 connects to the first end of the bushing conduit 31 of the gas bushing 30. Since the base 20 is maintained at a predetermined temperature, the gas conduit 100 is also maintained at this temperature as it passes through the base 20. Furthermore, in some embodiments, the base 20 is configured such that a base cooling channel 21 is located near the gas conduit 100. For example, the base cooling channel 21 may be within 0.05 inches to 1 inch of the gas conduit 100. In some embodiments, the gas conduit 100 is a separate tube passing through the base 20. In other embodiments, the gas conduit 100 is machined into the base 20.

[0038] Figures 10A to 10B show other embodiments in which the gas conduit 100 passes through the base 20 or a cavity within the base 20. In Figure 10A, the gas conduit 100 includes a gas channel 150, a cooling channel 160, and a return channel 170. This gas conduit 100 can be any embodiment shown in Figures 2A to 2B, Figures 3A to 3B, Figures 4A to 4D, or Figures 5A to 5D. This gas conduit 100 passes through the base 20 or a cavity and enters the ion source 10 from a surface adjacent to the base 20. The inlet of the gas channel 150 and the cooling channel 160 are both located within the atmospheric environment 2. Furthermore, a joint 165 is located within the gas conduit 100, enabling fluid communication between the cooling channel 160 and the return channel 170. In this way, only the gas conduit enters the ion source 10.

[0039] Figure 10B shows another embodiment in which the gas conduit 100 passes through the base 20. This gas conduit 100 passes through the base 20 and enters the ion source 10 from a surface adjacent to the base 20. The inlet of the gas channel 150 is located within the atmospheric environment 2. As described above, the base 20 has one or more base cooling channels 21 located therein. The gas conduit 100 is cooled because it is in close proximity to the base cooling channels 21.

[0040] The embodiments described in this application may have numerous advantages. As previously mentioned, certain supply gases decompose at high temperatures. For example, some gases decompose at 400°C, while others decompose at a lower temperature of around 300°C. By utilizing a cooling channel adjacent to the gas flow path, the temperature of the supply gas can be maintained at a lower temperature. In one experiment, the maximum temperature of the gas channel wall could be reduced to below 400°C. This makes it possible to utilize gases with lower decomposition temperatures without clogging.

[0041] This disclosure is not limited in scope by the specific embodiments described herein. In fact, a person skilled in the art will see from the above description and accompanying drawings a variety of embodiments and modifications other than those described herein, in addition to the embodiments and modifications to this disclosure. Thus, such embodiments and modifications other than those described herein are intended to be included within the scope of this disclosure. Furthermore, while this disclosure has been described in the context of a specific implementation in a specific environment for a specific purpose, a person skilled in the art will recognize that the usefulness of this disclosure is not limited to this context, and that it can be usefully implemented in any number of environments for any number of purposes. Accordingly, the claims described below should be interpreted in light of the entire scope and essence of this disclosure as described herein.

Claims

1. An ion implantation system, Ion source and, A gas bushing that communicates with the inside of the ion source, wherein the ion source and the gas bushing are located within a vacuum chamber, and the gas bushing and A vacuum flange that separates the vacuum chamber from the atmospheric environment, A gas conduit communicating with the aforementioned gas bushing, A gas channel having an inlet located in the atmospheric environment and an outlet communicating with the gas bushing, A cooling channel adjacent to the gas channel, and The return channel that communicates with the cooling channel and fluid The gas conduit including Includes, An ion implantation system in which the cooling channel abuts the gas channel along at least 50% of the length of the gas channel between the vacuum flange and the outlet.

2. The ion implantation system according to claim 1, wherein the cooling channel abuts against the gas channel as it passes through the vacuum flange.

3. The ion implantation system according to claim 1, wherein the gas channel and the cooling channel are separate tubes that are coupled together.

4. The ion implantation system according to claim 3, wherein the return channel is a separate tube coupled to the gas channel and the cooling channel.

5. It further includes blocks of material, The ion implantation system according to claim 1, wherein the cooling channel and the gas channel are created by gun-drilled holes in a block of the material.

6. The ion implantation system according to claim 5, wherein the return channel is created by a gun-drilled hole in a block of material.

7. The ion implantation system according to claim 1, wherein the cooling channel, the return channel, and the gas channel are all located within a single conduit, and the inner wall is used to separate the channels.

8. The ion implantation system according to claim 7, wherein the cooling channel, the return channel, and the gas channel extend linearly over the length of the conduit.

9. The ion implantation system according to claim 7, wherein the cooling channel, the return channel, and the gas channel extend spirally over the length of the conduit.

10. An ion implantation system, Ion source and, A base on which the ion source is placed, A gas conduit communicating with the ion source, wherein a portion of the gas conduit passes through the base before entering the ion source. An ion implantation system that includes this.

11. The ion implantation system according to claim 10, wherein the gas conduit enters the ion source through a surface adjacent to the base.

12. The ion implantation system according to claim 11, wherein the gas conduit includes a gas channel, a cooling channel, and a return channel.

13. The ion implantation system according to claim 10, further comprising a gas bushing in communication with the ion source, wherein the gas conduit extends from the base and is fixed to a first end of a bushing conduit within the gas bushing.

14. An ion implantation system, Ion source and, The base on which the ion source is located includes a base cooling channel and has two openings communicating with the base cooling channel, A gas bushing that communicates with the interior of the ion source, and includes a bushing conduit for transporting supply gas to the ion source, A gas conduit communicating with the first end of the bushing conduit and Includes, An ion implantation system in which a fluid passing through the base cooling channel cools the bushing conduit.

15. The ion implantation system according to claim 14, wherein the cooling loop communicates with two openings in the base and the cooling loop is pressed against the gas bushing.

16. The ion implantation system according to claim 14, wherein the gas bushing includes a cooling loop parallel to the bushing conduit for at least a portion of its length, and the cooling loop communicates with two openings in the base.

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