Solid oxide stack structure with improved cooling performance

Abstract

The present invention relates to a solid oxide stack structure (10) comprising electrochemical cells (12) and interconnection plates (14) arranged alternately in the stacking direction, wherein each electrochemical cell (12) is formed of an electrolyte layer (18), an anode layer (20), and a cathode layer (22), the anode layer and the cathode layer are disposed on opposite sides of the electrolyte layer (18) in the stacking direction, and each interconnection plate (14) located between two electrochemical cells (12) is in contact with the anode layer (20) of one electrochemical cell (12) and the cathode layer (22) of the other electrochemical cell (12), wherein at least one interconnection plate (14) is provided with at least one internal circuit (32) for circulating a fluid that adjusts the temperature of the two electrochemical cells (12) in contact with the interconnection plate (14).

Description

Technical Field

[0001] The present invention relates to a solid oxide stack structure that operates as an electrolyzer or a fuel cell and is designed to improve the cooling performance of a basic module.

Background Art

[0002] An electrolyzer or a solid oxide fuel cell is generally called an SOEC (Solid Oxide Electrolysis Cell) or an SOFC (Solid Oxide Fuel Cell), and is composed of an assembly of an electrolyte having two electrodes. This assembly is fixed between two interconnecting plates. This assembly is generally called an "electrochemical cell", and the interconnecting plate is generally called an "interconnector".

[0003] Therefore, an electrolyzer or a fuel cell is composed of a stack of electrochemical cells and interconnectors.

[0004] The electrochemical reaction occurring in the core part of the interconnector plate is either an endothermic reaction or an exothermic reaction. Therefore, in order to ensure the proper operation of the stack, it is important to control the temperature of the cell. This is particularly true for high-temperature electrolyzers where it is necessary to avoid the formation of an internal temperature gradient.

[0005] Therefore, the development of an industrial system incorporating a high-temperature electrolyzer involves an increase in the amount of processing gas, and thus an increase in the surface area and number of cells, as well as the number of interconnector plates.

[0006] As a result, the heat load on the system increases.

[0007] European Patent Application Publication No. 3,171,438 describes a stack composed of a plurality of cells and interconnectors, and a stack provided with cooling means on the end interconnector plate of the stack.

[0008] In this case, these end plates are thicker to accommodate means for carrying out cooling.

[0009] In the case of a multi-stack assembly comprising multiple sub-stacks or stacks, the cooling means are located within interconnector plates situated at the ends of each sub-stack.

[0010] Therefore, in the case of a multi-stack assembly, even if the number of interconnector plates equipped with cooling means is increased, the cooling of the cells located furthest from the end plates may be insufficient. [Prior art documents] [Patent Documents]

[0011] [Patent Document 1] European Patent Application Publication No. 3,171,438 [Overview of the Initiative] [Problems that the invention aims to solve]

[0012] The object of the present invention is to provide a stack comprising cells and interconnector plates, the stack comprising means for directly cooling the cells at any position on the stack. [Means for solving the problem]

[0013] The present invention proposes a solid oxide stack structure comprising electrochemical cells and interconnecting plates arranged alternately in the stacking direction. Each electrochemical cell is formed from an electrolyte layer, an anode layer, and a cathode layer, with the anode and cathode layers positioned on opposite sides of the electrolyte layer in the stacking direction. Each interconnecting plate located between two electrochemical cells is in contact with the anode layer of one electrochemical cell and the cathode layer of the other electrochemical cell. This solid oxide stack structure is characterized in that at least one interconnecting plate comprises at least one internal circuit for circulating a fluid that regulates the temperature of the two electrochemical cells in contact with the interconnecting plate.

[0014] Preferably, each interconnection plate comprises an anode plate in contact with the anode layer of one electrochemical cell, a cathode plate in contact with the cathode layer of another electrochemical cell, and a central plate located between the anode plate and the cathode plate, wherein at least one internal circuit of the interconnection plate is formed in the central plate.

[0015] Preferably, the central plate further comprises anode ducts and cathode ducts for supplying fluid to the electrochemical cell.

[0016] Preferably, the anode duct is formed hollow on the first surface of the central plate, the cathode duct is formed hollow on the second surface of the central plate, and the at least one internal circuit is formed hollow on either the first or second surface of the central plate.

[0017] Preferably, the central plate comprises a cooled plate in which at least one internal circuit is formed, and two intermediate plates distributed on each side of the cooled plate, in which an anode duct and a cathode duct are formed.

[0018] Preferably, the anode duct, the cathode duct, and each of the at least one internal circuit are formed from a notch in the intermediate plate or the plate being cooled.

[0019] Preferably, the cooled plate has a central opening in which the insert is disposed.

[0020] Preferably, each internal circuit includes a heat duct in which heat transfer occurs between the electrochemical cell in contact with the interconnecting plate, a fluid supply port, and a supply duct that communicates the port with the heat duct.

[0021] Preferably, the heat duct is formed in the insert, and the feed duct and the feed port are formed in the cooled plate.

[0022] Preferably, the heat duct is parallel to the longitudinal direction L, and the insert is received in the central opening with a gap in the longitudinal direction and without a gap in the transverse direction T.

[0023] Preferably, each interconnecting plate includes two internal circuits configured in series, and the stack structure includes an interconnecting bar that communicates the supply port of one internal circuit with the supply port of the other internal circuit.

[0024] Preferably, each interconnecting plate includes two internal circuits configured in parallel.

[0025] Preferably, all the feed ports having the same function are aligned in the stacking direction and are further in direct communication with each other.

Brief Description of the Drawings

[0026] [Figure 1] It is a schematic perspective view of a stack structure in which electrochemical cells and interconnecting plates are alternately arranged. [Figure 2] It is a detailed exploded view showing an electrochemical cell disposed between two interconnecting plates. [Figure 3] It is an exploded perspective view in both directions regarding the stacking direction of the interconnecting plate according to the first embodiment of the present invention. [Figure 4] Figure 3 shows the plan view and bottom view of the central plate of the interconnection plate. [Figure 5] This is a magnified detail diagram schematically showing the weld beads of the plates that make up the interconnecting plates. [Figure 6] This is an exploded perspective view of an interconnection plate according to a second embodiment of the present invention. [Figure 7] Figure 6 is a plan view showing the cooled plate and insert. [Figure 8] This is a schematic diagram showing the series configuration of the internal thermal control circuit. [Figure 9] This is a schematic diagram showing the parallel configuration of the internal thermal control circuit. [Figure 10] This is a plan view of an exemplary embodiment illustrating another embodiment that enables mixing of two fluids within an internal thermal control circuit. [Modes for carrying out the invention]

[0027] In the description of this invention, the orientations in the coordinate systems Z, L, and T shown in the figures correspond to the stacking direction Z, the longitudinal direction L, and the transverse direction T, respectively, but these orientations are not limiting.

[0028] General description of the stack structure Figure 1 shows a solid oxide stack structure 10 composed of electrochemical cells 12 and interconnection plates 14 arranged alternately in the stacking direction Z. Furthermore, this stack structure 10 includes two end plates 16 disposed at each end of the stack structure 10 in the stacking direction Z.

[0029] As shown in more detail in Figure 2, each electrochemical cell 12 comprises an electrolyte layer 18, an anode layer 20, and a cathode layer 22, with the anode layer 20 and the cathode layer 22 positioned on opposite sides of the electrolyte layer 18 in the stacking direction Z.

[0030] Each electrochemical cell 12 is positioned between two interconnection plates 14, and each interconnection plate 14 is positioned between two electrochemical cells 12.

[0031] Therefore, each interconnection plate 14 has an anode surface 24 that is in contact with the anode layer 20 of the electrochemical cell 12, and a cathode surface 26 that is in contact with the cathode layer 22 of the second electrochemical cell 12 located on the opposite side of the interconnection plate 14.

[0032] The interconnection plate 14 is a conductor that provides an electrical connection between the cathode layer 22 of one electrochemical cell 12 and the anode layer 20 of the other electrochemical cell 12. Therefore, these interconnection plates 14 enable current to flow from one electrochemical cell 12 to the other.

[0033] Explanation of cell operation Next, the operation of the stack structure 10 in high-temperature steam electrolysis (SOEC mode) will be described as a non-limiting example. In this operating mode, steam is decomposed into hydrogen and oxygen under the influence of voltage.

[0034] In this configuration, in each electrochemical cell 12, oxygen is discharged through the electrolyte layer 18 and the anode layer 20, while hydrogen is discharged through the cathode layer 22.

[0035] The interconnection plate 14 further has the function of enabling the flow of gas intended to react within the electrolytic cell 12. For this purpose, each anode surface 24 is provided with an anode duct 28, and each cathode surface 26 is provided with a cathode duct 30.

[0036] Therefore, vapor (H2O) is supplied to the cathode duct 30, and a mixture of the generated hydrogen and the remaining unreacted vapor is released.

[0037] Meanwhile, scavenging gas is supplied to the anode duct 28, and a mixture of the scavenging gas and the generated oxygen is released from there.

[0038] Basic structure of interconnection plates As shown in more detail in Figure 3, the interconnection plate 14 is composed of three parts and forms a multilayer structure. This multilayer structure consists of a central plate 38 having an anode duct 28 and a cathode duct 30, an anode plate 40 covering the first surface 42 of the central plate 38 on which the anode duct 28 is formed, and a cathode plate 44 covering the second surface 46 of the central plate 38 on which the cathode duct 30 is formed.

[0039] The anode plate 40 has an anode surface 24 of the interconnection plate 14 that is in contact with the anode layer 20 of the electrochemical cell 12, and the cathode plate 44 has a cathode surface 26 of the interconnection plate 14 that is in contact with the cathode layer 22 of the electrochemical cell 12.

[0040] The anode duct 28 is formed hollow on the first surface 42 of the central plate and is composed of, for example, a hollow groove. Similarly, the cathode duct 30 is formed hollow on the second surface 46 of the central plate 38 and is composed of a hollow groove.

[0041] Furthermore, the interconnection plate 14 is provided with openings 36 for communicating with the ducts 28 and 30. Preferably, these openings 36 are formed in the three plates 38, 40, and 44 that make up the interconnection plate 14.

[0042] According to one non-limiting preferred embodiment, the interconnection plate 14 has a rectangular and preferably square main shape, the edges of which are parallel to the longitudinal direction L or the transverse direction T.

[0043] Therefore, each of the three plates 38, 40, and 44 has two communication openings 36 associated with the anode duct 28. These two openings 36 are parallel to the longitudinal direction L, and each longitudinal opening 36 is positioned along one of the two opposing longitudinal edges of the interconnecting plate 14.

[0044] Furthermore, each of the three plates 38, 40, and 44 has two communication openings 36 associated with the cathode duct 30. These two openings 36 are parallel to the lateral direction T, and each lateral opening 36 is positioned along one of the two opposing lateral edges of the interconnecting plate 14.

[0045] Therefore, the dimensions of the interconnection plate 14 in the plane, i.e., perpendicular to the stacking direction Z, are larger than the dimensions of the electrochemical cell 12. The electrochemical cell 12 is positioned in the center of the interconnection plate, as shown by the dashed quadrilateral Q in Figure 4.

[0046] In a non-limiting preferred embodiment, the anode duct 28 extends linearly and laterally T from the longitudinal opening 36 to the electrochemical cell 12, and the cathode duct 30 extends linearly and longitudinally L from the later opening 36 to the electrochemical cell 12.

[0047] The anode plate 40 and cathode plate 44 are fixed to the first surface 42 and second surface 46 of the central plate 38, respectively, by welding or the like, thereby closing the anode duct 28 and cathode duct 30 at their openings in the stacking direction, and thus sealing and isolating each duct 28 and 30.

[0048] General principle of the present invention: Cooled interconnection plate Regardless of whether the stack structure 10 operates as an electrolytic device or a fuel cell, temperature control of the electrochemical cell 12 is crucial.

[0049] To this end, at least one interconnection plate 14, and preferably each interconnection plate 14, is provided with at least one internal circuit 32 for circulating a fluid that regulates the temperature of the two electrochemical cells 12 in contact with the interconnection plate 14, in addition to the anode duct 28 and cathode duct 30.

[0050] Preferably, the interconnection plate 14 comprises two internal temperature control circuits 32, namely an internal cooling circuit 32 and an internal heating circuit 32. According to one modified embodiment, the interconnection plate 14 comprises a single internal temperature control circuit 32 suitable for use in heating or cooling the electrochemical cell 12.

[0051] Each of these internal circuits 32 is isolated from the anode duct 28 and cathode duct 30 to avoid mixing of different fluids.

[0052] The following description refers to an interconnection plate having two internal temperature control circuits 32. By similarity, it will be understood that a modified embodiment in which the interconnection plate 14 has a single internal temperature control circuit 32 can be inferred.

[0053] As shown in more detail in Figure 4, each internal temperature control circuit 32 is equipped with a heat duct 48 through which heat transfer occurs between the interconnection plate 14 and the electrochemical cell 12. These heat ducts 48 extend into zones geometrically corresponding to the electrochemical cell 12 so as to be located in the stacking direction Z. As shown in Figure 4, the heat ducts 48 are contained within the dashed quadrilateral Q corresponding to the electrochemical cell 12.

[0054] Furthermore, each internal temperature control circuit 32 is equipped with a supply duct 50 for supplying or discharging a thermal control fluid to or from the heat duct 48.

[0055] Finally, the interconnection plate includes a supply port 52 for a thermally regulated fluid that communicates with the supply duct 50 of the internal circuit 32.

[0056] Here, the supply ports 52 are located at the four corners of the interconnection plate 14 and have a circular shape. This arrangement allows for the supply of temperature-controlled fluid to the interconnection plate 14 without the need to change the arrangement and shape of the communication openings 36 associated with the anode duct 28 and cathode duct 30. It will be understood that this embodiment is not limiting, and other shapes or arrangements of the supply ports 52 are also possible.

[0057] Therefore, these internal temperature control circuits 32 are designed so as not to reduce the efficiency of supplying the elements necessary for the operation of the electrochemical cell to the electrochemical cell via the anode duct 28 and cathode duct 30.

[0058] Integrated central plate As shown in Figures 3 and 4, according to the first embodiment, the central plate 38 of the interconnection plate 14 consists of a single plate on which the anode duct 28, cathode duct 30, and internal temperature control circuit 32 are formed.

[0059] As described above, the anode duct 28 and cathode duct 30 are formed hollow within the first surface 42 or the second surface 46 of the central plate 38.

[0060] Furthermore, the internal temperature control circuit 32 is formed on either the first surface 42 or the second surface 46 of the central plate 38, and here it is formed hollow on the second surface 46 of the central plate 38.

[0061] One advantage of this embodiment is that, compared to a central plate 38 without an internal temperature control circuit 32, the only additional steps required to manufacture the central plate 38 are machining steps.

[0062] As a non-limiting example, the thickness of the central plate 38 is 0.4 mm to 1 mm.

[0063] Various ducts 28, 30, 50, and 52 are formed by machining processes such as milling, electrolytic corrosion, additive manufacturing, or bonding of pre-machined plates.

[0064] Preferably, the depth of the ducts 28, 30, 50, and 52 is less than half the thickness of the central plate 38.

[0065] As described above, fixing the anode plate 40 and cathode plate 44 to the central plate 38 is done to seal and isolate the anode duct 28, cathode duct 30, and internal temperature control circuit 32, thus forming an independent chamber. Preferably, this fixing is done by welding plates 40 and 44 to the central plate 38.

[0066] As shown in Figure 5, a continuous liquid-tight weld bead 54 is formed around each chamber that constitutes the anode duct 28, the cathode duct 30, and the internal temperature control circuit 32.

[0067] A discontinuous weld bead 56 may be formed between one of these chambers. The primary function of these discontinuous weld beads 56 is to ensure the integral mechanical retention of the assembly of plates 38, 40, and 44.

[0068] Split central plate Figures 6 and 7 show a second embodiment of the interconnection plate 14, which includes an internal circuit 32 for thermal control.

[0069] According to this second embodiment, the interconnection plate 14 comprises an anode plate 40 and a cathode plate 44 similar to those in the previous embodiment. Furthermore, the interconnection plate 14 comprises a central plate 38 consisting of a plurality of components superimposed in the stacking direction Z.

[0070] Therefore, the central plate 38 itself is composed of two intermediate plates 58 arranged on each side of the cooled plate 60.

[0071] These intermediate plates 58 are substantially identical to each other and both include an anode duct 28 and a cathode duct 30. The anode duct 28 or cathode duct 30 of the intermediate plate 58 may or may not be connected to the fluid circuit.

[0072] By using the same intermediate plate 58, the number of part numbers used can be reduced, and the assembly of the interconnecting plate 14 and therefore the stack structure 10 can be simplified.

[0073] Preferably, the anode duct 28 and cathode duct 30 are composed of recesses formed in each intermediate plate 58, that is, these ducts open on each surface of the intermediate plate 58. Preferably, in the stacking direction Z, the anode duct 28 and cathode duct 30 are defined on one side by the anode plate 40 or cathode plate 44 and on the other side by the cooled plate 60.

[0074] As described above, the anode duct 28 and cathode duct 30 can be sealed by continuous weld beads 54 and, where applicable, discontinuous weld beads 56.

[0075] The cooled plate 60 includes a central opening 62, a supply duct 50 that allows for the transport of thermal conditioning fluid to the central opening 62, and a supply port 52. Similar to the first embodiment, each supply port 52 is located at one of the four corners of the cooled plate 60, and each supply duct 50 extends from its associated supply port 52 to the central opening 62.

[0076] Similar to the intermediate plate 58, the central opening 62, the supply duct 50, and the supply port 52 are formed by notches in the cooled plate 60, i.e., they open on each side of the cooled plate 60. When the central plate 38 is assembled, the central opening 62, the supply duct 50, and the supply port 52 are defined by two intermediate plates 58 fixed on each side of the cooled plate 60 in the stacking direction Z.

[0077] According to the illustrated embodiment, the central opening 62 receives the insert 64 shown in Figure 7, and a heat duct 48 is formed within this insert 64. The dimensions of the insert 64 and the central opening 62 are defined to allow for the supply of thermal conditioning fluid to the insert 64. That is, the insert 64 is received in the central opening 62 with gaps on each side in the longitudinal direction L of the heat duct 48, and is received in the opening in the lateral direction T without any gaps.

[0078] Application examples Regardless of whether the embodiment of the central plate 38 is a single unit or multiple plates, it will be understood that, without departing from the present invention, the structure of the heat duct 48, in particular the arrangement of the internal circuits 32 of the same interconnection plates 14 relative to each other, and / or the arrangement of the internal circuits 32 of other interconnection plates 14, can take different embodiments.

[0079] Series configuration In the first example shown in Figure 8, the internal circuits 32 of each interconnection plate 14 are configured in series. Therefore, as indicated by the arrows in this figure, the thermal conditioning fluid enters the interconnection plate 14 from the first supply port 52, passes through the first internal circuit 32, exits through the second supply port, re-enters the same interconnection plate 14 through the third supply port 52, is supplied to the second internal circuit 32, and exits the interconnection plate 14 through the fourth supply port 52.

[0080] To enable the series connection of the internal circuits 32, the second supply port 52 of one internal circuit 32 is connected to the third supply port 52 of the other internal circuit 32 by a connecting bar 68.

[0081] parallel configuration According to the second embodiment shown in Figure 9, the internal circuits 32 of each interconnection plate 14 are configured in parallel. Therefore, as indicated by the arrows in this figure, the thermal conditioning fluid enters the interconnection plate 14 through the first supply port 52, passes through the first internal circuit 32, and exits through the second supply port 52. Similarly, the same fluid or a different fluid enters the same interconnection plate 14 through the fourth supply port 52, is supplied to the second internal circuit 32, and exits the interconnection plate 14 through the third supply port 52.

[0082] Here again, all of the first supply ports 52 of all interconnection plates 14 are aligned in the stacking direction Z and communicate with each other. The same applies to the second supply ports 52, the third supply ports 52, and the fourth supply ports 52.

[0083] According to this second embodiment, the internal circuits 32 associated with the first supply port 52 and the second supply port 52 are independent of the internal circuits 32 associated with the third supply port 52 and the fourth supply port 52.

[0084] This second embodiment makes it possible to form two mutually independent thermal regulating fluid circuits.

[0085] Therefore, it is possible to circulate a first fluid in one of these two circuits, for example, for the purpose of cooling an electrochemical cell, and to circulate a second fluid in the other of these two circuits, for example, for the purpose of heating an electrochemical cell.

[0086] Configuration for fluid mixing Figure 10 shows an example of another embodiment of the present invention in which the heat duct 48 is grouped into a single internal circuit 32. This internal circuit 32 is supplied with two different fluids, here supplied by a first supply port 52 and a fourth supply port 52.

[0087] These two fluids are mixed within the internal circuit 32, and the mixing causes a chemical reaction that is either exothermic or endothermic. The products of this chemical reaction are discharged through the other two supply ports 52.

[0088] In yet another embodiment of the stack structure 10, the interconnection plates 14 are arranged parallel to each other and aligned in the stacking direction Z. Preferably, all of these interconnection plates 14 have the same orientation in this stack, all of the supply ports 52 having the same function are aligned in the stacking direction Z, and are in direct communication with each other.

[0089] Therefore, as shown in Figures 8 and 9, all first supply ports 52 of all interconnection plates 14 are aligned in the stacking direction Z and communicate with each other. The same applies to the second supply ports 52, the third supply ports 52, and the fourth supply ports 52.

[0090] Furthermore, as shown in Figure 8, when the internal ducts 32 are configured in series, the assembly formed by all the second supply ports 52 is connected to the assembly formed by the third supply port 52 by a single interconnection bar 68. [Explanation of Symbols]

[0091] 10 Solid Oxide Stack Structure 12 Electrochemical Cells 14 Interconnection Plate 16 End Plate 18 Electrolyte layer 20 anode layers 22 Cathode Layer 24 Anode surface 26 Cathode surface 28 Anode duct 30 Cathode Duct 32 Internal circuit, internal temperature adjustment circuit, internal cooling circuit, internal heating circuit 36 Opening, communication opening 38 Central Plate 40 Anode Plates 42 First side 44 Cathode Plates 46. ​​The second side 48 Heat duct 50 supply ducts 52 supply ports 54. Continuous liquid-tight weld beads 56. Discrete weld beads 58 Intermediate plate 60 Cooled Plate 62 Central opening 64 Inserts 68 Interconnection Bar L Longitudinal direction Q Quadrilateral (dashed line) S coordinate system T horizontal direction Z stacking direction

Claims

1. A solid oxide stack structure (10) comprising electrochemical cells (12) and interconnection plates (14) arranged alternately in the stacking direction Z, wherein each electrochemical cell (12) is formed of an electrolyte layer (18), an anode layer (20), and a cathode layer (22), and the anode layer (20) and the cathode layer (22) are disposed on opposite sides of the electrolyte layer (18) in the stacking direction Z. Each interconnection plate (14) located between the two electrochemical cells (12) is in contact with the anode layer (20) of one electrochemical cell (12) and the cathode layer (22) of the other electrochemical cell (12). At least one interconnection plate (14) is provided with at least one internal circuit (32) for circulating a fluid that regulates the temperature of the two electrochemical cells (12) that are in contact with the interconnection plate (14), Each interconnection plate (14) comprises an anode plate (40) in contact with the anode layer (20) of one electrochemical cell (12), a cathode plate (44) in contact with the cathode layer (22) of another electrochemical cell, and a central plate (38) located between the anode plate (40) and the cathode plate (44). The central plate (38) of the interconnection plate (14) is equipped with at least one internal circuit (32), In a solid oxide stack structure (10), the central plate (38) further comprises an anode duct (28) and a cathode duct (30) for supplying fluid to the electrochemical cell (12), The solid oxide stack structure (10) is characterized in that the central plate (38) is a single-piece plate, the anode duct (28) is formed hollow on the first surface (42) of the central plate (38), the cathode duct (30) is formed hollow on the second surface (46) of the central plate (38), and the at least one internal circuit (32) is formed hollow on either the first surface (42) or the second surface (46) of the central plate (38).

2. The stack structure (10) according to claim 1, characterized in that each internal circuit (32) comprises a heat duct (48) through which heat is transferred to the electrochemical cell (12) in contact with the interconnection plate (14), a fluid supply port (52), and a supply duct (50) that connects the port (52) to the heat duct (48).

3. The stack structure (10) according to claim 1, characterized in that the heat duct (48) is parallel to the longitudinal direction L, and the insert is received with a gap in the central opening (62) with a gap, having a gap in the longitudinal direction and no gap in the lateral direction T.

4. The stack structure (10) according to claim 1, characterized in that each interconnection plate (14) has two internal circuits (32) configured in series, and the stack structure has an interconnection bar (68) that connects the supply port (52) of one internal circuit (32) to the supply port (52) of the other internal circuit (32).

5. The stack structure (10) according to claim 1, characterized in that each interconnection plate (14) comprises two internal circuits (32) configured in parallel.

6. The stack structure (10) according to claim 1, characterized in that all of the supply ports (52) having the same function are aligned in the stacking direction Z and are in direct communication with one another.

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