Apparatus, system, and method for generating ionized gas discharge for media processing.

Abstract

The apparatus includes a processing chamber configured to contain a growth medium, at least one reservoir configured to contain at least one fluid, and a plasma reactor. The plasma reactor includes a plurality of electrodes, including a first electrode and a second electrode, and the reaction region is located between the first electrode and the second electrode. The apparatus also includes an ignition unit electrically connected to at least one of the plurality of electrodes, an injector in fluid communication with at least one reservoir, and a pressure regulator configured to transfer fluid to the injector. Various other apparatuses, systems, and methods are also disclosed.

Description

Technical Field

[0001] Cross - reference to Related Applications This PCT international application claims the benefit of, and priority to, U.S. Patent Application Nos. 18 / 222,027, 18 / 222,053, 18 / 222,080, 18 / 222,103, 18 / 222,135, 18 / 222,176, 18 / 222,220, and 18 / 222,252, each of which was filed on July 14, 2023, and the disclosure of each of which is hereby incorporated by reference in its entirety.

[0002] The present invention generally relates to the field of non - thermal plasma (NTP) technology. In particular, the present invention is directed to devices, systems, and methods for treating a target medium via an electric discharge. The range of media suitable for the devices, systems, and methods of the present invention is broad and can include, but is not limited to, growth media for plants, treatment agents for seeds, nutritional components for animal feed, liquids for use in beverage formulations, components of personal health - enhancing formulations, and surface treatment agents for equipment and industrial applications.

Background Art

[0003] The present invention can be used in different environments for specific products, performance outcomes, and improvements. In agriculture, plants are regularly subjected to numerous stresses, including, but not limited to, water scarcity, flooding, toxicity, high salinity, extreme temperatures, and the like. These stresses affect plant health and can reduce crop yields. Techniques such as chemical, physical, and biological treatments have been developed to enhance seed germination and growth under changing environmental conditions. However, existing treatments, but not limited to, can cause changes in plants, such as changes in seed morphology, gene expression, or protein levels. Crops grown using such treatments may be harmful to humans and / or the environment. What is needed is a method for producing a growth medium that can be used in fertilization, irrigation, and broadspray treatments, and that contains a stable and consistent fertilizer solution that supplies readily available nutrients essential for promoting plant growth, such as nitrogen and oxygen.

[0004] The present invention is also applicable to fields other than agriculture and can be utilized for use in other business sectors. For example, nitrogen in various chemical states is important in beverage production, including certain systems for producing soft drinks, fermented beverages, and distilled beverages and mixtures. Another example is in human healthcare, where nitric oxide has been shown to improve the performance of various skincare products, and the number of nitric oxide-containing products for human digestive health is rapidly increasing. What is needed is a cost-effective way to provide producers and manufacturers involved in a range of applications with devices and methodologies capable of processing the media used in these applications. [Overview of the Initiative]

[0005] The disclosed invention provides apparatus, systems, and methods for using the apparatus within a system for ionizing a gas to process the media described herein. The invention is distinguished from existing technologies and systems by being modularly configurable, thereby allowing for increased output and, consequently, efficiency compared to existing disclosures by connecting multiple units in parallel. This particular system offers flexibility with respect to the fluid input configuration; that is, it can utilize multiple input configurations, in contrast to existing systems that are fixed with respect to fluid inputs, including gases and water. Furthermore, the attributes of this disclosure address challenges related to power input, including the ability to accept multiple voltage types, such as AC or DC.

[0006] In one embodiment, an apparatus for processing a medium by electric discharge is described. The apparatus includes a processing chamber configured to contain a medium; at least one reservoir configured to contain at least one fluid; a plasma reactor, which includes a plurality of electrodes, at least one pair of electrodes including a first electrode and a second electrode, the at least pair of electrodes configured to generate an electric discharge in response to at least one fluid; and a reaction region positioned between the first electrode and the second electrode, configured to allow interaction between the electric discharge and the medium; an ignition unit electrically connected to at least one electrode of the at least pair of electrodes and configured to supply voltage to at least one electrode; an injector fluid-connected to at least one reservoir and configured to deliver at least one fluid through the reaction region; and a pressure regulator configured to transfer at least one fluid to the injector.

[0007] Another embodiment describes a method for processing a growth medium for use in agriculture using an electric discharge. The method includes: transferring at least one fluid contained in at least one reservoir to an injector by an atmospheric pressure system; and injecting at least one fluid through a reaction region of a plasma reactor, the injector being fluid-connected to at least one reservoir, the plasma reactor comprising at least one pair of electrodes including a first electrode and a second electrode, the reaction region being located between the first electrode and the second electrode; supplying a voltage to at least one electrode by an ignition unit electrically connected to at least one of the pair of electrodes; generating an electric discharge by the pair of electrodes in response to at least one fluid; and enabling interaction between the electric discharge and a growth medium contained in a processing chamber by the reaction region.

[0008] In another embodiment, an alternative embodiment of an apparatus for processing a medium by electric discharge is described. The apparatus includes a processing chamber, at least one reservoir, a plasma reactor, an injector, a pressure regulating system, an ignition unit comprising a voltage source configured to supply voltage, a converter configured to convert the voltage from a direct current (DC) voltage input to an alternating current (AC) voltage output, and an electrical connection interface configured to electrically connect the converter to at least one of a pair of electrodes located in the plasma reactor, the pair of electrodes comprising a first electrode and a second electrode; a feedback mechanism comprising a sensor configured to detect reaction data; and a control module communicatively connected to the feedback mechanism, configured to initiate the generation of an electric discharge in a reaction region located between the first electrode and the second electrode in response to the AC voltage output, the reaction region being configured to allow interaction between the electric discharge and the medium contained in the processing chamber.

[0009] In another embodiment, a method for processing a medium using an electric discharge is described. This method includes supplying a voltage from a voltage source, converting the voltage from a direct current (DC) voltage input to an alternating current (AC) output using a converter, electrically connecting the converter to at least one of a pair of electrodes arranged in a plasma reactor using an electrical connection interface, wherein the pair of electrodes includes a first electrode and a second electrode, initiating the generation of an electric discharge in a reaction region located between the first electrode and the second electrode using a control module, enabling interaction between the electric discharge and a growing medium contained in a processing chamber using the reaction region, and detecting reaction data using a sensor with a feedback mechanism.

[0010] In one embodiment, an apparatus for improving the injection of a plasma reactor is disclosed. The apparatus includes at least one reservoir, a plasma reactor, an ignition unit, and an injector, the injector configured to deliver at least one fluid from at least one reservoir through the reaction region of the plasma reactor, the injector includes at least one fluid outlet, the at least one fluid outlet configured to discharge at least one fluid into the plasma reactor in a conical distribution, the conical distribution including a distribution angle and droplets of at least one fluid.

[0011] In another embodiment, the steam injection system includes a fluid inlet, which is in fluid communication with a fluid reservoir and configured to transfer the fluid; a voltage regulator connected to a power source, which is configured to receive electrical energy from the power source and to convert the electrical energy, wherein the conversion of electrical energy includes adjusting the voltage of the electrical energy and changing the frequency of the voltage; and a crystalline compressor connected to the voltage regulator and the fluid inlet, which is configured to receive electrical energy converted from an iron core coil, to receive fluid from the fluid inlet, to generate steam according to the converted electrical energy and fluid, and to discharge the steam using a steam outlet.

[0012] In another embodiment, the method is a method using a steam injection system, the method comprising receiving fluid from a fluid reservoir through a fluid inlet and receiving electrical energy through a voltage regulator connected to a power source. The method also comprises converting the electrical energy by the voltage regulator, wherein the conversion of electrical energy includes adjusting the voltage of the electrical energy and changing the frequency of the electrical energy, generating steam by a crystalline compressor according to the converted electrical energy and fluid, and discharging the steam through a steam outlet.

[0013] In yet another embodiment, a low-pressure injection system for multiple fluids is provided. The system includes at least one first fluid inlet configured to receive a first fluid from a first fluid reservoir containing a first fluid, and at least one second fluid inlet configured to receive a second fluid from a second fluid reservoir containing a second fluid. The system further includes a low-pressure compressor configured to supply pressure to the second fluid received from the second fluid reservoir, and at least one injector configured to disperse a combination of the first and second fluids.

[0014] In yet another embodiment, a method is provided for using a low-pressure injection system for multiple fluids. The method includes receiving a first fluid from a first fluid reservoir containing a first fluid through at least one first fluid inlet, and receiving a second fluid from a second fluid reservoir containing a second fluid through at least one second fluid inlet. The method further includes supplying pressure to the second fluid received from the second fluid reservoir by a low-pressure compressor, and dispersing the combination of the first and second fluids by at least one injector.

[0015] In one embodiment, an apparatus for a modular plasma reactor is disclosed. The apparatus includes a modular plasma reactor, the modular plasma reactor comprising a housing, a modular ignition unit detachably connected to the modular plasma reactor, a modular injector detachably connected to the modular plasma reactor, at least one modular reservoir detachably connected to the modular injector, and a controller communicably connected to one or more of the modular ignition unit and the modular injector.

[0016] In another embodiment, a method for using a modular plasma reactor is disclosed. This method involves detachably connecting a modular ignition unit to a modular plasma reactor, wherein the modular plasma reactor includes a housing, and the method includes detachably connecting a modular injector to the modular plasma reactor, detachably connecting at least one modular reservoir to the modular injector, and communicating a controller to one or more of the modular ignition unit and modular injector.

[0017] In one embodiment, an apparatus for processing a substrate such as a food substance is disclosed. The apparatus may include a water tank connected to both a reaction chamber and a control module capable of generating control signals. The water tank has a water level line and a reservoir filled with water up to the water level line. The water tank may replenish water when it detects a decrease in water level below the water level line. More specifically, if the amount of water falls below the water level line, the water tank may automatically replenish water by drawing additional water from a water source fluidly connected to the water tank, such as a sink, reservoir, or other water container. The reaction chamber is connected to the water tank and includes a pair of electrodes, including a first electrode and a second electrode positioned opposite the first electrode, and a reaction region defined between the first and second electrodes. The reaction region can at least temporarily hold the substrate. The control module is connected to at least the reaction chamber and is capable of generating at least one control signal. The apparatus may also include an injector connecting the water tank to the reaction chamber. The injector can generate a dispersion of ultrafine water droplets from water extracted from the reservoir in response to the reception of a control signal. In addition, the apparatus may include a platform that supports at least the reaction chamber and is configured to be placed on a flat surface.

[0018] In another embodiment, a method for generating a plasma for processing a substrate in a plasma reactor is disclosed. The method may include providing a voltage by a voltage source and converting the voltage from a direct current (DC) voltage input to an alternating current (AC) output by a converter. The method also includes connecting the converter to at least one electrode of a pair of electrodes arranged in a plasma reactor by an electrical connection interface, wherein the pair of electrodes includes a reaction region defined between a first electrode and a second electrode located opposite the first electrode, and dispersing a plurality of water droplets drawn from a reservoir in a water tank fluid-connected to the plasma reactor, the reservoir storing a certain amount of water, into the reaction region. In addition, the method may include flowing a gas mixture into the plasma reactor, wherein at least some of the water droplets from the plurality of water droplets are suspended in the gas mixture and configured to generate a mist, and igniting the plasma by generating an electric discharge from the first electrode to the second electrode through the mist in the reaction region. Furthermore, the method may also include treating the substrate by exposing it to plasma for a specified period of time, and automatically replenishing the amount of water in the reservoir of the water tank by drawing additional water from a water source fluidly connected to the water tank when the amount of water falls below a specified set value.

[0019] In one embodiment, the present invention is described to be used to produce a fertilizer blend for use as a growth medium. The fertilizer blend comprises an active mixture containing reactive oxygen species and reactive nitrogen species. The fertilizer blend further comprises a marine brine solution having a filtered marine blend, wherein the marine brine solution further comprises magnesium, sulfur, potassium, and calcium.

[0020] In another aspect, a method of manufacturing a fertilizer blend for use as a growth medium is described. The method includes forming an active mixture having reactive oxygen species and reactive nitrogen species, filtering a marine blend to produce a marine brine solution, where the marine brine solution contains magnesium, sulfur, potassium, and calcium, and combining the active mixture and the marine brine solution to produce a fertilizer blend.

[0021] In yet another aspect, a method of using a fertilizer blend produced using the system of the present invention is disclosed. The method includes pouring the fertilizer blend onto a plant, where the fertilizer blend includes an active mixture having reactive oxygen species and reactive nitrogen species and a marine brine solution having a filtered marine blend, and where the marine brine solution further contains magnesium, sulfur, potassium, and calcium.

[0022] These and other aspects and features of non-limiting embodiments of the present invention will become apparent to those skilled in the art by considering the following description of specific non-limiting embodiments of the present invention in conjunction with the accompanying drawings.

[0023] For purposes of illustrating the present invention, the drawings show aspects of one or more embodiments of the present invention. However, it is to be understood that the present invention is not limited to the exact configurations and means shown in the drawings.

Brief Description of the Drawings

[0024] [Figure 1] FIG. is a diagram of an exemplary embodiment of an apparatus for treating a growth medium via an electric discharge. [Figure 2] FIG. is a diagram of an exemplary embodiment of a plasma reactor assembly. [Figure 3] FIG. is a diagram of an exemplary embodiment of an injector having a flow rate adjustment component. [Figure 4] FIG. is a diagram of an exemplary embodiment of a piezoelectric steam injector. [Figure 5]FIG. of an exemplary embodiment of an apparatus for processing a growth medium via an electric discharge using an externally attached injector. [Figure 6] FIG. of an exemplary embodiment of a method for processing a growth medium via an electric discharge. [Figure 7] FIG. of an exemplary embodiment of a segment of a conduit. [Figure 8] FIG. of an exemplary embodiment of an ignition unit. [Figure 9] Block diagram of an exemplary embodiment of a machine learning module according to one or more embodiments of the present disclosure. [Figure 10] FIG. of an exemplary embodiment of a method for processing a growth medium via an electric discharge. [Figure 11A] FIG. of an exemplary embodiment of a part of an injector for improving the injection of a plasma reactor. [Figure 11B] FIG. of an exemplary embodiment of a part of an injector for improving the injection of a plasma reactor. [Figure 11C] FIG. of an exemplary embodiment of a part of an injector for improving the injection of a plasma reactor. [Figure 12] FIG. of an exemplary embodiment of a vapor injection system for a plasma reactor. [Figure 13] FIG. of an exemplary embodiment of a plasma reactor assembly. [Figure 14] FIG. of an exemplary embodiment of an internally attached vapor injection system. [Figure 15] FIG. of an exemplary embodiment of an externally attached vapor injection system. [Figure 16] Exemplary depiction of a crystalline compressor. [Figure 17] FIG. of an exemplary embodiment of a method for using a vapor injection system. [Figure 18] FIG. of an exemplary embodiment of a low-pressure injection system for multiple fluids. [Figure 19] FIG. showing an exemplary embodiment of a low-pressure injection system for multiple fluids. [Figure 20] This is a diagram illustrating an exemplary embodiment of an internally mounted low-pressure injection system. [Figure 21] This is a diagram illustrating an exemplary embodiment of an externally mounted low-pressure injection system. [Figure 22] This is a diagram illustrating an exemplary embodiment of a method for using a low-pressure injection system for multiple fluids. [Figure 23] This is a block diagram of an exemplary embodiment of an apparatus for a modular plasma reactor. [Figure 24] This is a flowchart illustrating an example of how to use a modular plasma reactor. [Figure 25] This is a diagram illustrating an exemplary embodiment of an apparatus including a reaction chamber equipped with an automatic water replenishment unit for processing a substrate. [Figure 26-1] This is a diagram illustrating an exemplary embodiment of a method for treating a growth medium via electrical discharge. [Figure 26-2] This is a diagram illustrating an exemplary embodiment of a method for treating a growth medium via electrical discharge. [Figure 27] This is a diagram illustrating an exemplary embodiment of a fertilizer blend for use as a growth medium. [Figure 28] This is a diagram illustrating an exemplary embodiment of a method for manufacturing a fertilizer blend for use as a growth medium. [Figure 29] This specification includes one or more methodologies disclosed herein, and block diagrams of computing systems that may be used to implement any one or more of them. [Modes for carrying out the invention]

[0025] Drawings are not necessarily to scale and may be represented by dashed lines, schematics, and partial drawings. In certain cases, details that are unnecessary for understanding the embodiment or that make it difficult to recognize other details may be omitted.

[0026] Aspects of this disclosure relate to apparatus and methods for processing a medium via electrical discharge. In one embodiment, the apparatus includes a plasma reactor, which includes at least a pair of electrodes, including a first electrode and a second electrode, configured to generate an electrical discharge. The plasma reactor further includes a reaction region positioned between the first electrode and the second electrode, which is configured to allow interaction between the electrical discharge and a growing medium contained within a processing chamber.

[0027] Aspects of the present disclosure may be used to generate reactive oxygen species and reactive nitrogen species (RONS) and to alter the pH, conductivity, and oxidation-reduction potential of solution properties. Aspects of the present disclosure may also be used to affect the germination rate of a growth medium (e.g., seeds) to enhance plant growth and increase agricultural yield. This is because the apparatus is configured, at least in part, to expose the growth medium to non-thermal plasma (NTP) using a high-energy ignition system. The apparatus can generate high-voltage NTP using air, water, and an electrical load without generating any harmful emissions.

[0028] Aspects of the present disclosure may be used to monitor electrical discharge and / or growth medium and to provide the user of the apparatus with necessary information. This is because the apparatus includes, at least in part, an ignition unit with a feedback mechanism configured to detect reaction data. In one embodiment, the reaction data may include a plurality of electrical discharge parameters, fluid parameters, growth medium parameters, and the like.

[0029] Aspects of the present disclosure may be used to optimize the processing process of a growing medium by adapting to changes in voltage, fluid, and / or other factors that may affect the electrical discharge. This is because, at least in part, the apparatus includes an ignition unit with a control module communicatively connected to a feedback mechanism, the control module being configured to regulate the generation of an electrical discharge in the reaction region. The control module may adjust at least one processing parameter of the apparatus in response to reaction data detected by the feedback mechanism during the interaction between the electrical discharge and the growing medium contained in the processing chamber.

[0030] Aspects of the present disclosure may be used to monitor electrical discharge and / or growth medium and to provide the user of the apparatus with necessary information. This is because the apparatus includes, at least in part, an ignition unit with a feedback mechanism configured to detect reaction data. In one embodiment, the reaction data may include a plurality of electrical discharge parameters, fluid parameters, growth medium parameters, and the like.

[0031] Aspects of the present disclosure may be used to optimize the processing process of a growing medium by adapting to changes in voltage, fluid, and / or other factors that may affect the electrical discharge. This is because, at least in part, the apparatus includes an ignition unit with a control module communicatively connected to a feedback mechanism, the control module being configured to regulate the generation of an electrical discharge in the reaction region. The control module may adjust at least one processing parameter of the apparatus in response to reaction data detected by the feedback mechanism during the interaction between the electrical discharge and the growing medium contained in the processing chamber.

[0032] Aspects of this disclosure enable low-temperature processing of the growth medium without damaging it. Exemplary embodiments illustrating aspects of this disclosure are described below in the context of several specific examples.

[0033] Aspects of this disclosure also relate to low-pressure injection systems for multiple fluids and methods of using them. In one embodiment, the system includes at least one injector configured to disperse a mixture of a first fluid and a second fluid. Aspects of this disclosure may be used to generate microfluidic droplets, thereby allowing the second fluid to be ionized and migrate into the generated microfluidic droplets. Exemplary embodiments illustrating aspects of this disclosure are described below in the context of several specific examples.

[0034] Aspects of this disclosure relate to apparatus and methods of use for modular plasma reactors. The apparatus includes a modular plasma reactor, which includes a housing, a modular ignition unit detachably connected to the modular plasma reactor, a modular injector detachably connected to the modular plasma reactor, at least one modular reservoir detachably connected to the modular injector, and a controller communicably connected to one or more of the modular ignition unit and the modular injector.

[0035] Aspects of the present disclosure may enable low-temperature processing of the growth medium without damaging it. In some embodiments, aspects of the present disclosure may also enable a controller to detect connections between a housing including a plasma reactor and one or more of the ignition unit, injector, and pressure regulator, and to control the power supplied to one or more of the ignition unit, injector, and pressure regulator. Exemplary embodiments illustrating aspects of the present disclosure are described below in the context of several specific examples.

[0036] Aspects of the present disclosure may be used to monitor electrical discharge and / or growth medium and to provide the user of the apparatus with necessary information. This is because the apparatus includes, at least in part, an ignition unit with a feedback mechanism configured to detect reaction data. In one embodiment, the reaction data may include a plurality of electrical discharge parameters, fluid parameters, growth medium parameters, and the like.

[0037] Aspects of the present disclosure may be used to optimize the processing process of a growing medium by adapting to changes in voltage, fluid, and / or other factors that may affect the electrical discharge. This is because, at least in part, the apparatus includes an ignition unit with a control module communicatively connected to a feedback mechanism, the control module being configured to regulate the generation of an electrical discharge in the reaction region. The control module may adjust at least one processing parameter of the apparatus in response to reaction data detected by the feedback mechanism during the interaction between the electrical discharge and the growing medium contained in the processing chamber.

[0038] Aspects of this disclosure may be used to treat growth media using a combination of modified seawater and an active mixture. Aspects of this disclosure may further enable the prevention of diseases that may spread in various growth media.

[0039] Aspects of the present disclosure may be used to generate reactive oxygen species and reactive nitrogen species (RONS) and to alter the pH, conductivity, and oxidation-reduction potential of solution properties. Aspects of the present disclosure may also be used to affect the germination rate of a growth medium (e.g., seeds) to enhance plant growth and increase agricultural yield. This is because the apparatus is configured, at least in part, to expose the growth medium to non-thermal plasma (NTP) using a high-energy ignition system. The apparatus can generate high-voltage NTP using air, water, and an electrical load without generating any harmful emissions.

[0040] Aspects of this disclosure enable low-temperature processing of the growth medium without damaging it. Exemplary embodiments illustrating aspects of this disclosure are described below in the context of several specific examples.

[0041] Referring to Figure 1, an exemplary embodiment of a device 100 for processing a growth medium 104 via electrical discharge is illustrated. As used in this disclosure, “growth medium” refers to a substance or material that provides essential nutrients and environmental conditions for the growth and proliferation of microorganisms, cells, and tissues. In embodiments, one or more seeds may be placed in the growth medium 104. For the purposes of this disclosure, “seed” refers to a mature fertilized ovule of a flowering plant (i.e., angiosperm) containing an embryo within a protective outer layer, which serves as the primary means of reproduction for many plant species, enabling them to be dispersed and established as new plants. In some embodiments, the seeds may include, but are not limited to, cereal seeds (e.g., wheat, rice, corn, barley, oats, millet, etc.), legume seeds (e.g., soybeans, peas, legumes, lentils, chickpeas, peanuts, etc.), oilseed seeds (e.g., sunflower, rapeseed, flaxseed, sesame, safflower, etc.), vegetable seeds (e.g., tomatoes, peppers, cucumbers, eggplants, lettuce, spinach, etc.), and fruit seeds (e.g., watermelons, cantaloupes, apples, citrus fruits, etc.). In such embodiments, the growth medium 104 may include a nutrient-rich environment that provides the basic conditions for seed germination and growth. In some cases, the growth medium may provide environmental factors, including but not limited to temperature, pH level, oxygen, and the like, necessary for the seeds to germinate and grow into healthy plants. In an unspecified example, the growth medium 104 may include soil, which may contain inorganic particles, organic matter, water, air, living organisms, and a complex mixture of these. In another unspecified example, the growth medium 104 may include a soilless mixture, or a medium specially formulated and designed for seed germination and plant growth.

[0042] Continuing with reference to Figure 1, the apparatus 100 includes a processing chamber 108 configured to house a growth medium 104. As used in this disclosure, “processing chamber” refers to a controlled space designed to hold a particular material, substance, or object and to subject them to a particular process. In some embodiments, the processing chamber 108 may be constructed as an open system, for example, including, but not limited to, a container without a lid. In other embodiments, the processing chamber 108 may be constructed as a closed system, for example, including, but not limited to, a sealed container with an airtight seal. In some embodiments, the processing chamber 108 may be designed to provide easy access to the growth medium 104 to be processed. In non-limiting embodiments, the processing chamber 108 may include a removable door, or a hinged door or port, for loading and / or removing the growth medium 104. In another non-limiting embodiment, the processing chamber 108 may include one or more windows, with or without covers, for visual inspection or sampling during the processing process.

[0043] Continuing to refer to Figure 1, the apparatus 100 includes at least one reservoir 112. As used in this disclosure, “reservoir” means a container or storage chamber designed to hold at least one fluid used in a processing process. In a non-limiting example, the reservoir 112 is configured to contain at least one fluid. As used in this disclosure, “fluid” is defined as a gas or a liquid. The reservoir may provide a constant and controlled supply of at least one fluid for processing the growth medium 104, as will be further detailed below. In one embodiment, the fluid may include a substance that enables the generation of an electrical discharge. In some cases, at least one fluid may include a liquid, and may include, for example, water, an organic solvent, an electrolyte solution, and the like. In other cases, at least one fluid may include one or more gases, for example, but not limited to, at least one fluid may include inert gases (e.g., nitrogen, argon, helium, neon), oxygen, carbon dioxide, air, reactive gases (e.g., hydrogen, ammonia, sulfur hexafluoride), and the like. In addition, or alternatively, the apparatus 100 may include a plurality of reservoirs. In one embodiment, at least one reservoir 112 may include a first reservoir configured to contain a first fluid, and a second reservoir configured to contain a second fluid, the first fluid may include at least one gas, and the second fluid may include at least one liquid.

[0044] Continuing to refer to Figure 1, at least one reservoir 112 may be constructed from a material compatible with the at least one fluid being stored. For example, but not limited to, at least one reservoir 112 may be made from materials such as corrosion-resistant metal, plastic, and / or glass. In some cases, at least one reservoir 112 may be appropriately sized to provide a suitable supply of fluid throughout the processing process without frequent replenishment or interruption. In one embodiment, the fluid may be supplied by a pressurized hose or tube. At least one reservoir 112 may include at least one inlet, at least one outlet, or both. In a non-limiting example, at least one inlet may be used to fill at least one fluid into at least one reservoir 112, and at least one outlet may be connected to an injector or other fluid delivery component of a device 100 such as a pressure regulator and / or pressure regulating system, which will be further detailed below. At least one fluid may be introduced into at least one reservoir 112 via at least one inlet and / or discharged to an injector via at least one outlet. In the case of a device 100 having multiple reservoirs, each of the multiple reservoirs may include at least one inlet and at least one outlet. In a non-limiting example, a first reservoir configured to contain a first fluid may include a first inlet and a first outlet, and a second reservoir configured to contain a second fluid may include a second inlet and a second outlet, where the first inlet / first outlet never intersects with the second inlet / second outlet. In such embodiments, the first fluid and the second fluid cannot come into contact with each other before being discharged via the first outlet / second outlet.

[0045] Continuing to refer to Figure 1, the apparatus 100 includes a plasma reactor 116. As used in this disclosure, “plasma reactor” means a device configured to generate, maintain, and / or control plasma. For the purposes of this disclosure, “plasma” means a fourth state of matter, in addition to solids, liquids, and gases. Plasma may include a partially ionized gas consisting of a mixture of ions, electrons, and / or neutral particles (i.e., atoms and molecules). In one embodiment, plasma may be formed when at least one fluid is exposed to a high-energy source, such as heat, radiation, or an electric field, and is ionized by atoms or molecules in at least one fluid losing or gaining electrons. At least one fluid may be introduced into the plasma reactor 116 using an injector, as described below in this disclosure. In some cases, plasma may include non-thermal plasma (NTP), where non-thermal plasma refers to a type of plasma where the electron temperature is significantly higher than the temperature of heavier ions and neutral particles. In this case, electrons in the plasma have high kinetic energy, while the overall temperature of at least one fluid may remain relatively low (e.g., often around room temperature, 20–22°C / 68–72°F). In addition, or alternatively, the energy distribution between particles in a non-thermal plasma may not be in thermal equilibrium. This may be due to electrons being much lighter than ions and neutral particles, thus gaining energy more rapidly when exposed to an electric or magnetic field, resulting in a higher electron temperature. On the other hand, heavier ions and neutral particles move more slowly and remain at lower temperatures, which can result in a lower temperature for at least one fluid.

[0046] Continuing to refer to Figure 1, the plasma reactor 116 includes at least one pair of electrodes 120a-b, the at least one pair of electrodes including a first electrode 120a and a second electrode 120b. As used in this disclosure, “electrode” means a conductor used to establish electrical contact with a conductive medium, and / or a medium that can become conductive when given a sufficient voltage difference, such as the at least one fluid described above. The at least one pair of electrodes 120a-b are configured to generate an electric discharge in response to at least one fluid. As used in this disclosure, “electric discharge” means the phenomenon in which an electric current flows between two or more conductive surfaces (i.e., at least one pair of electrodes 120a-b) through at least one fluid, resulting in ionization and subsequent release of energy in the form of light, heat, or sound. In non-limiting embodiments, the at least one pair of electrodes 120a-b may receive a voltage supplied from an ignition unit, which is further detailed below. This voltage is applied between the surfaces of the at least one pair of electrodes 120a-b, generating an electric field between the first electrode 120a and the second electrode 120b. Such an electric field can accelerate free electrons and other charged particles in at least one fluid, initiating a chain reaction of ionization events, which in turn can lead to the formation of conductive channels (i.e., plasma) of charged particles such as ions and electrons that allow current to flow between the first electrode 120a and the second electrode 120b.

[0047] Continuing to refer to Figure 1, each of the at least pair of electrodes 120a-b may be constructed from a metal or metal alloy such as copper, which has certain conductivity and the ability to withstand high temperatures and chemical reactions. In one embodiment, the at least pair of electrodes 120a-b may include at least one cathode and at least one anode. For the purposes of this disclosure, “cathode” means an electrode that is negatively charged in an electrical circuit, while for the purposes of this disclosure, “anode” means an electrode that is positively charged in an electrical circuit. In some cases, at least one cathode may be an electrode where reduction occurs (i.e., the cathode gains electrons), and at least one anode may be an electrode where oxidation occurs (i.e., it loses electrons). In a non-limiting embodiment, the first electrode 120a may include an anode electrically connected to the ignition unit as described above, and the second electrode 120b may include a cathode electrically connected to ground 124. In this disclosure, “earthing” means a common reference point or conductive path that provides a reference point for voltage measurement, a current return path, and a means for safely dissipating excess electrical energy. Earthing 124 may be connected directly to a conductive surface of the earth or otherwise connected through an earthing electrode conductor. Such a connection establishes a reference voltage level (i.e., zero volts) to which other voltages in the device 100 can be measured. In addition, or alternatively, earthing 124 provides a path for safely dissipating excess electrical energy to the earth, reducing the risk of electric shock, fire, or equipment damage to the device 100.

[0048] Continuing to refer to Figure 1, the plasma reactor includes a reaction region 128 positioned between a first electrode 120a and a second electrode 120b, the reaction region 128 configured to allow interaction between the electrical discharge (i.e., plasma) and the growth medium 104. As used in this disclosure, “reaction region” refers to a designated region or space within the plasma reactor 116 where a particular chemical or physical reaction occurs. In some embodiments, generating plasma in the reaction region may include generating reactive oxygen species (ROS) and reactive nitrogen species (RNS), both of which are highly reactive molecules formed primarily by the interaction of molecular oxygen (O2) and molecular nitrogen (N2) with high-energy species such as free radicals, ions, and / or electrons generated by the electrical discharge as described above. In some cases, ROS may include, but are not limited to, superoxide (O2·-), hydroxyl radicals (-OH), and hydrogen peroxide (H2O2). Plasma collides with O2 molecules, causing dissociation, ionization, or excitation, which then leads to the formation of RNS through further reactions. In some cases, RNS may include, but are not limited to, nitric oxide (-NO), nitrogen dioxide (-NO2), peroxynitrite (ONOO-), and similar substances. Plasma collides with nitrogen molecules N2 or other nitrogen-containing molecules, causing dissociation, ionization, or excitation, which then leads to the formation of RNS through further reactions. In one embodiment, the interaction of plasma, oxygen, nitrogen, and water may produce additional acids such as nitrite (HNO2) and nitric acid (HNO3). These acids may be further oxidized to form NO2 and NO3.

[0049] Continuing with Figure 1, ROS and RNS can facilitate various chemical and physical reactions within the reaction region 128 of the plasma reactor 116 during the processing. In one embodiment, ROS and RNS can readily participate in oxidation and reduction reactions. For example, but not limited to, ROS and RNS can oxidize organic compounds, reducing their stability and leading to their degradation or denaturation. In another embodiment, ROS and RNS can effectively inactivate or kill microorganisms such as bacteria, viruses, and fungi. For example, but not limited to, ROS and RNS can damage the cellular structure of microorganisms and inhibit their metabolic functions by attacking cell walls, cell membranes, proteins, nucleic acids and the like. In further embodiments, ROS and RNS can modulate cellular processes such as cell signaling, gene expression, and immune responses in both prokaryotic and eukaryotic cells. For example, but not limited to, at low concentrations, ROS and RNS can act as signaling molecules that modulate cellular functions, while at higher concentrations, they can induce cellular stress, damage, or apoptosis. In other embodiments, ROS and RNS may also react with other molecules or species to generate secondary active species.

[0050] In a non-limiting example, continuing to refer to Figure 1, the reaction region 128 may include a space between a first electrode 120a and a second electrode 120b, in which charge is generated and plasma is produced depending on at least one fluid. In one embodiment, the reaction region 128 may include a gap between at least a pair of electrodes 120a-b, with the first electrode 120a being parallel to the second electrode 120b (i.e., in corona discharge). In another embodiment, the reaction region 128 may include a cylindrical space within a coaxial electrode arrangement. In a non-limiting example, at least a pair of electrodes 120a-b may be arranged in a flared configuration (i.e., in gliding arc discharge). In yet another embodiment, the electrodes may be a single tapered shape having a wide portion and a narrow portion, in which the electrodes may be mounted in the center of a circular metal cylinder, and both gas and water may be injected tangentially to extend the arc or plasma discharge. The first electrode 120a may be configured to branch off from the second electrode 120b in a branched configuration. For example, but not limited to, the first electrode 120a and the second electrode 120b may be slightly inclined. At least one pair of electrodes 120a-b may have a gap between the first electrode 120a and the second electrode 120b, which may be narrow at one end and gradually widen towards the other end. For example, but not limited to, the first electrode 120a may be close to each other at one end and further apart at the other end. In some cases, each electrode of at least one pair of electrodes 120a-b may include various shapes such as linear, curved, or helical, but not limited to. In some cases, each electrode of at least one pair of electrodes 120a-b may be symmetrically arranged on both sides of the plasma reactor 116 along the fluid discharge axis of the fluid outlet of the injector, as shown below. The distance between the first electrode 120a and the second electrode 120b can be adjusted to control the intensity of the electrical discharge.

[0051] Referring further to Figure 1, in some embodiments, the reaction region 128 may include multiple arc points between the first electrode 120a and the second electrode 120b. As used in this disclosure, “arc point” refers to the flow of electrons between the first electrode 120a and the second electrode 120b. In some cases, an arc point may indicate the starting point of an electrical discharge. In some cases, the location of an arc point may be influenced by various factors such as the shape and material of at least a pair of electrodes 120a-b, the distance between the first electrode 120a and the second electrode 120b within the at least a pair of electrodes 120a-b, the voltage received, the properties of at least one fluid, and the like. In non-limiting examples, an arc point may include a region where current “jumps” or “arc discharges” from the first electrode 120a to the electrode 120b. The first arc point may be formed in the narrowest gap between the first electrode 120a and the second electrode 120b. The first arc point may include the electric field of maximum strength. As the plasma is generated by the electrical discharge from the plasma reactor 116, the first arc point may move along the surface of at least one pair of electrodes 120a-b due to the influence of the electric field and the flow of at least one fluid. This movement injects the remaining multiple arc points along the surface of at least one pair of electrodes 120a-b, ensuring a continuous non-equilibrium plasma that promotes the generation of the aforementioned ROS and / or RNS. The plasma reactor 116 and its elements are described in further detail below with reference to Figure 2.

[0052] Continuing to refer to Figure 1, the apparatus 100 includes an ignition unit 132 electrically connected to at least one of at least one pair of electrodes 120a-b. As used in this disclosure, “ignition unit” is an electrical component responsible for supplying the initial voltage necessary to initiate an electrical discharge between the electrodes. In a non-limiting embodiment, the ignition unit is configured to supply voltage to at least one electrode. The at least one electrode may include a first electrode 120a (i.e., an anode), and the ignition unit 132 may include a power supply. As used in this disclosure, “power supply” means any system, device, or means that supplies power, such as electricity, to a device, but is not limited to these. The power supply may supply power to the ignition unit 132 and / or other devices or components in the apparatus 100 described in this disclosure, for example, but not limited to, the plasma reactor 116, an injector, any computing device, and / or similar. In a non-limiting embodiment, the apparatus 100 may be electrically connected to a power supply. In some embodiments, a power source may be electrically connected externally to the device 100. In one such embodiment, the power source may include an external power source. In non-limiting examples, the external power source may include a wall outlet connection, a battery, a DC power source, a renewable energy source, a fuel cell, a generator, and the like. In one embodiment, the power source may include direct current (DC) power. In another embodiment, the power source may include alternating current (AC) power. In some embodiments, in addition, or alternatively, the power source may include AC or DC renewable power. In non-limiting examples, AC or DC renewable power may include power generated from renewable energy sources such as solar, wind, hydro, geothermal, and biomass. In some embodiments, the power source may include one or more battery cells. In non-limiting examples, the battery cells may be lithium-ion, alkaline, lithium metal, or similar. In some cases, transmitting power may include using a single continuous conductor 136. As used herein, “continuous conductor” means an electrical conductor made from a conductive material capable of transmitting electric current without interruption over a certain distance.Conductive materials may include any material that conducts electric current, and non-limiting examples may include various metals such as copper, steel, or aluminum, carbon conductive materials, or any other suitable conductive material.

[0053] Continuing to refer to Figure 1, in some embodiments, the ignition unit 132 may be configured to convert a lower input voltage from a power source (e.g., 110V / 220V for AC voltage, or 12V / 24V for DC voltage) to a higher output voltage, thereby supplying the electrical energy necessary to drive the plasma reactor 116. In one embodiment, the ignition unit may also convert AC to AC. For example, an AC-to-AC converter may be used to convert an AC waveform having a particular frequency and amplitude to an AC waveform having a different frequency and amplitude. For example, an AC voltage controller may be a thyristor-based device that directly converts a fixed alternating voltage to a variable alternating voltage without changing the frequency. The AC voltage controller may be a phase-controlled device, and therefore a forced commutation circuit may not be required, and natural commutation or line commutation may be used. In non-limiting embodiments, the ignition unit 132 may include an ignition transformer. As used in this disclosure, “ignition transformer” means an electrical transformer designed to produce a high voltage output used to initiate an electrical discharge as described above. An electric transformer is a passive electrical device that transfers electrical energy from one circuit to another through the process of electromagnetic induction. In some cases, an electric transformer can be used to increase or decrease the voltage level of an alternating current (AC) electrical signal while maintaining the same frequency. In a non-limiting example, an ignition transformer may be configured to step up the input voltage from a lower level (from the power source) to a higher voltage level required for the plasma reactor 116 to generate an electric arc (i.e., an arc point).

[0054] In some embodiments, the ignition transformer may include two sets of windings, which may include a primary winding and a secondary winding. The two sets of windings may be wound around a magnetic core. In some cases, the primary winding may be connected to a lower voltage input, while the secondary winding may generate a higher voltage output. In a non-limiting embodiment, the ignition unit 132 may include an ignition transformer configured to convert power received from a power source into a high-voltage discharge in the voltage range of 6kV to 30kV. In another embodiment, the voltage range may be 3kV to 18kV.

[0055] Continuing to refer to Figure 1, in some embodiments, the ignition unit 132 may have the function of converting an AC voltage that periodically oscillates between positive and negative values ​​to a direct current (DC) with a constant polarity (positive or negative) that does not change over time, thereby allowing the connected electrodes to generate a controlled electrical discharge and / or a stable electrical discharge for generating and / or maintaining a plasma. In some cases, the apparatus 100 may need to convert the AC power supply to a DC power supply to perform pulsed operation. During pulsed plasma operation, the plasma reactor 116 may operate in pulsed mode, with a short period of plasma generation and maintenance followed by a period of no electrical discharge. The DC power supply is suitable for pulsed plasma operation because it is easily controlled and can be switched on and off as needed. In some cases, the apparatus 100 may convert the AC power supply to a DC power supply to reduce electrode wear and contamination. For example, but not limited to, in an AC powered plasma reactor 116, the constant change in electrode polarity can accelerate electrode wear and release electrode material into the generated plasma. In one embodiment, the ignition unit may also convert AC to AC. For example, an AC-to-AC converter may be used to convert an AC waveform having a specific frequency and amplitude to an AC waveform having a different frequency and amplitude. For example, an AC voltage controller may be a thyristor-based device that directly converts a fixed alternating voltage to a variable alternating voltage without changing the frequency. The AC voltage controller may be a phase-controlled device, and therefore a forced commutation circuit may not be required, and natural commutation or line commutation may be used. By using a DC power supply, the electrodes can maintain a constant polarity, reducing wear and contamination and extending the life of the electrodes. In a non-limiting embodiment, the ignition unit 132 may include a rectifier. As used in this disclosure, “rectifier” means an electrical device or circuit that converts AC to DC. A rectifier may be constructed using one or more diodes, where a diode is a semiconductor device that allows current to flow in only one direction, having low resistance to forward current (when the voltage is positive) and high resistance to reverse current (when the voltage is negative).In some cases, rectifiers may include, but are not limited to, half-wave rectifiers, full-wave rectifiers, and similar types.

[0056] Continuing with reference to Figure 1, in some embodiments, the ignition unit 132 may include a power regulator (i.e., a filter). As described herein, “power regulator” is an electrical device in unit 1 that performs power regulation or power redistribution, and “power regulation” or “power redistribution” as described herein means the process of maintaining the voltage of a power source below its maximum value, while operating, non-operating, or charging. In non-limiting examples, a power regulator may be used to remove or attenuate unwanted frequencies, noise, or voltage fluctuations from the output voltage or current. A power regulator may include, but is not limited to, passive filters, active filters, EMI / RFI filters, voltage regulators, and the like. In addition, or alternatively, the ignition unit 132 may include a balancer. As described herein, “balancer” means an electrical device that performs power balancing. Here, “power balancing” as described herein means the process of balancing electrical energy from one or more first power sources (e.g., powerful batteries) to one or more second power sources (e.g., weak batteries). Those skilled in the art will recognize, by examining the entirety of this disclosure, various devices / components that may be used within the ignition unit 132 of the apparatus 100.

[0057] Continuing to refer to Figure 1, the apparatus 100 includes at least one reservoir 112 and a fluid-connected injector 140. As used in this disclosure, “injector” refers to an element designed to inject at least one fluid into the plasma reactor 116, specifically into the reaction region 128 of the plasma reactor 116. In a non-limiting example, the injector 140 is configured to supply at least one fluid through the reaction region. At least one fluid may then be used by the plasma reactor 116 to generate plasma. For the purposes of this disclosure, “fluid connection” refers to a path or link that enables the transfer of at least one fluid. In a non-limiting example, the fluid connection between the injector 140 and at least one reservoir 112 may be established using, but not limited to, tubes, pipes, hoses, channels, or various other elements that form a continuous path for the flow of at least one fluid.

[0058] Continuing to refer to Figure 1, the injector 140 may include at least one fluid inlet 144. As used in this disclosure, “fluid inlet” means an inlet point into which at least one fluid is injected before being fed into the reaction area 128 of the plasma reactor 116 or into any other process described herein. In a non-limiting example, at least one fluid inlet 144 may be connected to the outlet of at least one reservoir 112 as described above. In some cases, at least one fluid inlet 144 may be designed to provide a secure, leak-free connection to at least one reservoir. For example, but not limited to, at least one fluid inlet 144 may be sealed using one or more sealing elements such as O-rings, gaskets, thread sealants, and the like, thereby ensuring a tight seal and / or preventing leakage or contamination. The injector 140 may include at least one fluid outlet 148. As used in this disclosure, “fluid outlet” refers to an outlet point from which at least one fluid is discharged from the injector 140 into the reaction region 128 of the plasma reactor 116. In some cases, at least one fluid outlet 148 may be configured to allow at least one fluid to be discharged to an intended location within the reaction region 128. For example, but not limited to, at least one fluid outlet 148 may be located midway between and directly above at least one pair of electrodes 120a-b. At least one fluid outlet 148 may be located at a distance from at least one pair of electrodes 120a-b or the reaction region 128. This distance may affect the time and space available for at least one fluid to mix and interact with the plasma or other process components. In some cases, at least one fluid outlet 148 may be configured to provide an optimal flow pattern and distribution of at least one fluid into the reaction region 128. In a non-limiting example, at least one fluid outlet 148 may include a nozzle (i.e., an opening of a special shape) designed to produce a directional, high-speed flow of at least one fluid, thereby improving mixing and dispersion within the reaction region 128.Such nozzles may include, but are not limited to, swirl nozzles, fan spray nozzles, impact jet nozzles, porous nozzles, atomizing nozzles, and the like.

[0059] In addition, or alternatively, continuing with reference to Figure 1, the injector 140 may include one or more valves configured to monitor, control, or otherwise regulate the flow of at least one fluid delivered to the reaction region 128 of the plasma reactor 116. As used in this disclosure, “valve” means a component that controls fluid communication between two or more components (e.g., between at least one reservoir 112 and the injector 140). Exemplary and non-limiting examples of valves include directional valves, control valves, selection valves, multiport valves, check valves, and the like. Valves may include any suitable valve structure, including ball valves, butterfly valves, needle valves, globe valves, gate valves, wafer valves, regulating valves, and the like. Valves may be included in a manifold of a hydraulic or pneumatic circuit that allows for multiple ports and flow paths, for example. Valves may be actuated by any known method, including, but not limited to, hydraulic, pneumatic, mechanical, or electrical energy. For example, in some cases, valves may be actuated by an energized solenoid or electric motor. The valve actuator and thereby the valve itself may be controlled by a computing device, as will be further detailed below. The computing device may communicate with the valve, for example, via one or more of the following: electrical communication, hydraulic communication, pneumatic communication, mechanical communication, and so on. Furthermore, the injector 140 and its elements are described in more detail below in this disclosure.

[0060] Continuing with reference to Figure 1, the apparatus 100 includes a pressure regulator configured to transfer at least one fluid to an injector. As used in this disclosure, “pressure regulator” or “pressure regulating system” means a component and / or mechanism designed to control and maintain the pressure of at least one fluid, such pressure driving the flow of at least one fluid into the plasma reactor 116. In one embodiment, the fluid flow rate may be regulated by the gas pressure, since higher gas pressure results in a greater fluid flow. In some cases, higher gas pressure also regulates the fluid droplet size, for example, higher gas pressure means a smaller droplet size. In one embodiment, the pressure regulating system may include an atmospheric pressure system. As used in this disclosure, “atmospheric pressure system” means a mechanism that controls the pressure of at least one fluid injected into the plasma reactor 116 at or near atmospheric pressure. For the purposes of this disclosure, “atmospheric pressure” refers to the pressure exerted by the weight of the air in the Earth’s atmosphere at sea level, which is approximately 101.3 kilopascals (kPa) or 14.7 pounds per square inch (psi). In some embodiments, a pressure regulator and / or pressure regulating system may ensure that at least one fluid being discharged into the reaction region 128 of the plasma reactor 116 is maintained at or near atmospheric pressure. In some embodiments, a pressure regulator and / or pressure regulating system may play a role in transferring fluid from at least one reservoir 112 to an injector 140, providing a constant and controlled flow of at least one fluid into the reaction region 128 of the plasma reactor 116.

[0061] Continuing to refer to Figure 1, the pressure regulator and / or pressure regulating system may, in some cases, include a fluidizing component connected to at least one reservoir 112, configured to cause at least one fluid to flow from at least one fluid inlet 144 of the injector 140 or at least one outlet of the reservoir 112 to at least one fluid outlet 148 of the injector 140. The pressure regulator may include the aforementioned valve. In some embodiments, the fluidizing component may include a passive fluidizing component configured to initiate a passive fluidizing process. As used in this disclosure, “passive fluidizing component” means a component that imparts passive fluidization to at least one fluid, wherein for the purposes of this disclosure, “passive fluidization” means a fluid flow that is induced without any external actuator, field, or power source. As described herein, “passive fluidizing process” means a set of actions or steps performed by the passive fluidizing component to impart passive fluidization to at least one fluid. In a non-limiting example, using a pressure regulator and / or pressure regulating system including a passive flow component, the injector 140 may be able to deliver at least one fluid through the reaction region 128 depending on the passive flow process. The passive flow component employs one or more passive flow techniques to initiate the passive flow process, and these techniques may include, for example, but are not limited to, osmosis, capillary action, surface tension, pressure, gravity-driven flow, hydrostatic flow, vacuum, and the like. The passive flow component may be in fluid communication with at least one reservoir 112.

[0062] Continuing with reference to Figure 1, in other embodiments, the fluid component may include an active fluid component configured to initiate an active fluid process. As used in this disclosure, “active fluid component” means a component that imparts an active flow to a fluid, where, for the purposes of this disclosure, “active flow” means a fluid flow induced by an external actuator, field, or power source. As described in this disclosure, “active fluid process” means a set of operations or steps performed by the active fluid component to impart an active flow to at least one fluid. In some embodiments, the active fluid component may be electrically connected to a power source as described above. In non-limiting examples, using a pressure regulator and / or pressure regulating system including an active fluid component, the injector 140 may be able to deliver at least one fluid through the reaction region 128 in response to the active fluid process. A pressure regulator and / or pressure regulating system may be configured to pressurize at least one fluid entering the reaction region 128 of the plasma reactor 116. For example, but not limited to, the active fluid components of the pressure regulator and / or pressure regulating system may include one or more pumps. The pumps may include substantially constant pressure pumps (e.g., centrifugal pumps) or substantially constant flow pumps (e.g., positive displacement pumps, gear pumps, and the like). The pumps may be hydrostatic or dynamic. As used in this disclosure, “pump” means a mechanical power source that converts mechanical power into fluid energy. The pump may generate a flow with enough power to overcome the pressure induced by the load at the pump outlet. The pump may generate a vacuum at the pump inlet, thereby forcing fluid from the reservoir into the pump inlet, and mechanically delivering this fluid to the pump outlet. A hydrostatic pump is a positive displacement pump.

[0063] The hydrodynamic pump may be a fixed-displacement pump whose displacement cannot be adjusted, or a variable-displacement pump whose displacement can be adjusted. Exemplary and non-limiting pumps include gear pumps, rotary vane pumps, screw pumps, vent-axis pumps, in-line axial piston pumps, radial piston pumps, and similar types. The pump may be driven by any rotary mechanical power source, such as an electric motor or a power extraction from a power source, but is not limited to these. The pump may be in fluid communication with at least one reservoir 112. Continuing to refer to Figure 1, the apparatus 100 may further include a condenser 156 located in the reaction region above or below the processing chamber. As used in this disclosure, “condenser” refers to a component configured to collect reactive products generated from an electrical discharge within the reaction region 128 of the plasma reactor 116. The condenser 156 may be made of steel wool, metallic wool, copper, carbon steel, and similar materials. The condenser 156 may be located at or near the outlet and / or attached to the bottom of the reaction region 128 to allow evaporated water to condense into droplets. In one embodiment, the condenser 156 may be a piece of steel wool located at the bottom of the apparatus 100 or in a conduit or pipe connected thereto. In some cases, the condenser 156 may be located inside the conduit. In one embodiment, the condenser 156 may be integrated into the conduit itself, rather than being an external component. Here, the conduit may include a pipe that allows the flow of a fluid, such as a gas or liquid, from one part of the condenser 156 to another part, or from the condenser 156 to another component of the apparatus 100. In some embodiments, the condenser 156 may be intentionally placed between reaction regions 128 configured to collect reactive products before they come into contact with the growth medium 104 contained within the processing chamber 108. In some cases, the reactive products may include the ions, free radicals, electrons, excited molecules, and the like described above. For example, but not limited to, ROS and / or RNS. In other cases, reactive products may include by-products or waste generated during the processing.In non-limiting examples, reactive products may include carbon monoxide (CO) and / or carbon dioxide (CO2), which may be produced as a result of the decomposition of the growth medium 104 or as a result of the reaction of electrical discharge with impurities in the growth medium 104. Other exemplary by-products or wastes may include, but are not limited to, ozone, volatile organic compounds (VOCs), and similar compounds.

[0064] Continuing to refer to Figure 1, the condenser 156 may include a cooling chamber. As used in this disclosure, “cooling chamber” refers to a component configured to rapidly cool reactive products arriving from (i.e., falling into) the reaction region 128 of the plasma reactor. In some embodiments, the cooling chamber may be configured to ensure efficient heat transfer and maintain optimal temperature conditions for the condensation process. The cooling chamber may be constructed from a material having thermal conductivity, such as copper, aluminum, stainless steel, and the like, but is not limited to these. In some cases, the material may also have chemical resistance to the reactive products and at least one fluid used in the system. The cooling chamber may be constructed from a material that is non-conductive, such as plastics, glass, fiberglass, and the like, but is not limited to these. In some embodiments, the cooling chamber of the condenser 156 may be designed in a shape that matches the shape of the plasma reactor 116 or the processing chamber 108. For example, but not limited to, the cooling chamber may be designed in a cylindrical shape that matches the shape of the plasma reactor 116 and the processing chamber 108, thereby optimizing the flow of reactive products and maximizing the contact surface area between the cooling medium and the reactive products. Here, the cooling medium may include water, air, a refrigerant, and / or the like, configured to efficiently remove heat from the reactive products. In some cases, the heat transfer process may be further enhanced by equipping the inside of the cooling chamber with fins, coils, plates, and / or the like (i.e., by increasing the surface area of ​​the cooling chamber). In a non-limiting example, the cooling chamber may include a heat exchanger, which may be configured to facilitate heat transfer from the reactive products to the cooling medium.

[0065] Continuing to refer to Figure 1, the condenser 156 may include a collection surface. As used in this disclosure, “collection surface” refers to a designated area within the condenser 156 where the reactive products come into contact with the cooling chamber and undergo a phase change, transitioning from a first state to a second state. In non-limiting examples, the collection surface may be configured to allow the reactive products in a gaseous state to transition to a liquid state. Such a transition may enable the apparatus 100 to efficiently collect the condensed material and subsequently process or transfer it. In some embodiments, the collection surface may include, but not limited to, ridges, channels, and various surface features of the same kind to facilitate the flow of the condensed / collected material. In non-limiting examples, the collection surface may include a flat surface, where the flat surface may include a plurality of channels or grooves designed to facilitate the outflow of the condensed reactive products from the collection surface. In addition, or alternatively, the collection surface may include a surface finish. For example, but not limited to, the collection surface may be finished or treated (e.g., using hydrophobic coatings, hydrophilic coatings, and / or similar) to increase wettability and reduce surface tension, thereby further improving condensation efficiency and fluid flow.

[0066] Continuing to refer to Figure 1, the condenser 156 may include at least one conduit. As used in this disclosure, “conduit” refers to a passage for a substance (i.e., condensed reactive product) to move from one place to another within the apparatus 100. In non-limiting examples, the condenser 156 may use one or more conduits to transfer the condensed reactive product from the collection surface to the growth medium 104 contained in the processing chamber 108. In some cases, the conduits may be designed to have a circular cross-sectional shape. In some cases, the conduits may be thermally insulated to maintain a desired temperature of the condensed reactive product and / or to prevent any undesirable chemical reactions during transfer using materials such as glass fibers. In some embodiments, one or more conduits may be connected to the collection surface in a manner that ensures a leak-free connection. For example, but not limited to, such connections between the collection surface and one or more conduits may be established using threaded fittings, compression fittings, flanges and the like. In some embodiments, one or more conduits may be routed from the collection surface to the processing chamber 108, minimizing interference with other components of the apparatus 100, in order to ensure a smooth flow of condensed reactive products. For example, but not limited to, appropriate support and / or fastening of the conduits may be installed to prevent them from bending, vibrating, or being subjected to any other mechanical stress that could cause leakage or damage. In addition, or alternatively, the conduits may incorporate one or more valves to regulate the flow of condensed reactive products into the processing chamber 108. The valves may include any valves described herein. Those skilled in the art will recognize, by examining the entirety of this disclosure, a variety of devices / components that may be used within the condenser 156 of the apparatus 100.

[0067] Continuing to refer to Figure 1, the apparatus 100 may include, but is not limited to, a computing device configured to control various internal components such as a plasma reactor 116, an ignition unit 132, an injector 140, a condenser 156, and the like. The computing device may include, but is not limited to, any computing device described in this disclosure, including, but not limited to, microcontrollers, microprocessors, digital signal processors (DSPs), and / or systems on a chip (SoC) described in this disclosure. The computing device may include, be contained in, and / or communicate with a mobile device such as a mobile phone or smartphone. The computing device may include a single computing device operating independently, or two or more computing devices operating in coordination, in parallel, sequentially, or the like. Two or more computing devices may be contained together within a single computing device, or contained within two or more computing devices. The computing device may interface with or communicate with one or more additional devices, which are further detailed below in this disclosure, via a network interface device. The network interface device may be used to connect the computing device to one or more networks and one or more devices. Examples of network interface devices include, but are not limited to, network interface cards (e.g., mobile network interface cards, LAN cards), modems, and any combination thereof. Examples of networks include, but are not limited to, wide area networks (e.g., the Internet, enterprise networks), local area networks (e.g., networks associated with offices, buildings, campuses, or other relatively small geographical spaces), telephone networks, data networks associated with telephone / voice providers (e.g., data and / or voice networks of mobile communications providers), direct connections between two computing devices, and any combination thereof.The network may employ wired and / or wireless communication modes. In general, any network topology may be used. Information (e.g., data, software, etc.) may be communicated to and from computers and / or computing devices. Computing devices may include, but are not limited to, a computing device or cluster of computing devices at a first location and a second computing device or cluster of computing devices at a second location. Computing devices may include one or more computing devices dedicated to data storage, security, traffic distribution for load balancing, and the like. A computing device may distribute one or more computing tasks across multiple computing devices of that computing device, as described below, and such multiple computing devices may operate in parallel, serial, redundantly, or in any other manner used for task or memory distribution between computing devices. A computing device may be implemented using a “shared-nothing” architecture in which data is cached on the workers, which in one embodiment may enable the scalability of device 100 and / or computing devices.

[0068] Continuing to refer to Figure 1, the computing device may be designed and / or configured to perform any method, method step, or series of method steps in any order and to any degree of repetition in any embodiment described herein. For example, the computing device may be configured to repeatedly perform a single step or sequence until a desired or instructed result is achieved. The repetition of a step or series of steps may be performed iteratively and / or recursively, using the output of a preceding iteration as the input to a subsequent iteration, which may involve aggregating the inputs and / or outputs of the iterations to produce an aggregated result, decreasing or subtracting one or more variables, such as global variables, and / or dividing a larger processing task into a set of smaller processing tasks that are processed iteratively. The computing device may perform any step or series of steps described herein in parallel, for example, two or more times using two or more parallel threads, processor cores, and the like, simultaneously and / or substantially simultaneously. Task division between parallel threads and / or processes may be performed according to any protocol suitable for task division between iterations. Those skilled in the art will, by examining the entirety of this disclosure, recognize various ways of handling steps, sets of steps, processing tasks, and / or data using iteration, recursion, and / or parallel processing, including subdividing, sharing, or otherwise handling them.

[0069] Continuing to refer to Figure 1, in some embodiments, internal components of the apparatus 100 may communicate with a computing device using one or more signals. As used in this disclosure, “signal” means a human-readable and / or machine-readable representation of data, including, for example, electrical and / or digital signals from one device to another. Signals may be transmitted using any suitable communication connection. As used in this disclosure, “communicatively connected” means connected by a connection, attachment or link that enables the reception and / or transmission of information between two or more related elements. For example, but not limited to, such connection may be wired or wireless, direct or indirect, and enable the reception and / or transmission of data and / or signals between two or more components, circuits, devices, systems, and such. The data and / or signals between them may, in particular, include, but are not limited to, electrical, electromagnetic, magnetic, video, audio, radio, and microwave data and / or signals, combinations thereof, and such. Communication connections can be achieved, for example, directly or through one or more intermediary devices or components, via wired or wireless electronic, digital, or analog communications. Furthermore, communication connections may include electrically coupling or connecting at least one output of one device, component, or circuit to at least one input of another device, component, or circuit. For example, this may be via a bus or other means for communication between elements of a computing device. Communication connections may also include, for example, indirect connections via wireless connections, radio communications, low-power wide-area networks, optical communications, magnetic, capacitive, or optical coupling, and similar means. In some embodiments, the term “communicatively coupled” may be used instead of “communicatively connected” in this disclosure. Signals may include optical signals, hydraulic signals, pneumatic signals, mechanical signals, electrical signals, digital signals, analog signals, and similar types.In some cases, signals may be used to communicate with a computing device, for example, via one or more ports. In some cases, signals may be transmitted and / or received by a computing device, for example, via input / output ports. Analog signals may be digitized, for example, via an analog-to-digital converter. In some cases, analog signals may be processed before digitization, for example, via any analog signal processing step described herein. In some cases, digital signals may be used to communicate between two or more devices, including but not limited to computing devices. In some cases, digital signals may be communicated via one or more communication protocols, including but not limited to Internet Protocol (IP), Controller Area Network (CAN) protocols, serial communication protocols (e.g., Universal Asynchronous Transceiver [UART]), parallel communication protocols (e.g., IEEE 128 [Printer Port]), and similar types.

[0070] Referring further to Figure 1, the apparatus 100 and / or computing device may, in some cases, perform one or more signal processing steps on a signal. For example, the apparatus 100 and / or computing device may analyze, modify, and / or synthesize a signal representing data to improve the signal, for example, by improving transmission, storage efficiency, or signal-to-noise ratio. Exemplary signal processing methods may include analog, continuous-time, discrete, digital, nonlinear, and statistical. Analog signal processing may be performed on non-digitized or analog signals. Exemplary analog processing may include passive filters, active filters, adder mixers, integrators, delay lines, companders, multipliers, voltage-controlled filters, voltage-controlled oscillators, phase-locked loops, and / or any other processing using operational amplifiers or other analog circuit elements. Continuous-time signal processing may, in some cases, be used to process signals that change continuously within a domain, such as time. Exemplary and non-limiting continuous-time processing may include time-domain processing, frequency-domain processing (Fourier transform), and complex frequency-domain processing. Discrete-time signal processing can be used when signals are sampled discontinuously or at discrete time intervals (i.e., temporally quantized). Analog discrete-time signal processing can process signals using the following exemplary circuits: sample-and-hold circuits, analog time-division multiplexers, analog delay lines, and analog feedback shift registers. Digital signal processing can be used to process digitized discrete-time sampled signals. Generally, digital signal processing can be performed by computing devices, or other dedicated digital circuits such as application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or dedicated digital signal processors (DSPs), but not limited to these. Digital signal processing can be used to perform any combination of typical arithmetic operations, including fixed-point and floating-point, real and complex numbers, as well as multiplication and addition. Digital signal processing can additionally manipulate cyclic buffers and lookup tables.Further non-restrictive examples of algorithms that can be implemented based on digital signal processing techniques include the Fast Fourier Transform (FFT), finite impulse response (FIR) filters, infinite impulse response (IIR) filters, and adaptive filters such as Wiener filters and Kalman filters. Statistical signal processing can be used to process signals as random functions (i.e., stochastic processes) by utilizing their statistical properties. For example, in some embodiments, a signal may be modeled with a probability distribution exhibiting noise, which can then be used to reduce noise in the processed signal.

[0071] Continuing to refer to Figure 1, the apparatus 100 may include, but is not limited to, a housing 160 configured to house various internal components such as a processing chamber 108, a plasma reactor 116, an ignition unit 132, an injector 140, a pressure regulator, a condenser 156, a computing device, and the like. As used in this disclosure, “housing” refers to an exterior structure or housing that houses and supports various internal components of the apparatus 100. In some cases, the housing 160 may provide the apparatus 100 with protection, stability, and / or organization functions. In one embodiment, the housing 160 may be designed to house and securely hold the internal components of the apparatus 100. In some cases, the housing 160 may include multiple layers, with one or more internal components of the apparatus 100 intentionally placed in each of the layers, thereby minimizing physical or functional interference between the internal components of the apparatus 100. In non-limiting embodiments, the housing 160 may include a first layer incorporating an ignition unit 132, a second layer incorporating an injector 140, a third layer incorporating a plasma reactor 116, and a fourth layer incorporating a processing chamber 108 housing a growth medium 104. Each layer may be physically isolated but functionally connected by various means (e.g., fluid connections, electrical connections, and the like). For example, but not limited to, a continuous conductor 136 may be used to connect the ignition unit 132 to at least one of at least a pair of electrodes 120a-b of the plasma reactor 116 and configured to transmit power from the first layer of the housing 160 to the third layer of the housing 160, where the continuous conductor may extend from the first layer of the housing 160 to the third layer of the housing 160, passing outside the second layer of the housing 160. As another example, but not limited to, at least one fluid outlet 148 of the injector 140 may be mechanically fixed to the bottom of a second layer of the housing 160 or to the top of a third layer, where at least one fluid outlet 148 may include a first end connected to the injector 140 and a second end extending into the third layer of the housing 160 incorporating the plasma reactor 116.In such embodiments, at least one fluid contained in at least one reservoir 112 may be injected into the plasma reactor 116 and further introduced through the reaction region 128 from the second layer of the housing 160 to the third layer of the housing 160. In addition, or alternatively, the housing 160 may include appropriate insulators for electrode wires (continuous conductors 136) configured to prevent electrical short circuits or interference with other components within the housing 160. As a non-limiting example, insulators may be used where the continuous conductors 136 pass through the housing 160, as will be further detailed with reference to Figure 2.

[0072] Referring here to Figure 2, Figure 2 is an exemplary embodiment of the plasma reactor assembly 200. The plasma reactor assembly 200 may include a housing 204. In one embodiment, the housing 204 may be part of the housing 160 as described above. In another embodiment, the housing 204 may be a separate housing configured to house only the plasma reactor 116. In a non-limiting example, the plasma reactor 116 may be double-housed, where the housing 204 may be located within a third layer of the housing 160 as shown in Figure 1. At least a pair of electrodes 120a-b, and a reaction region 128 between the electrodes of at least a pair of electrodes 120a-b may be located within the housing 204. In some cases, the housing 204 may be injection molded by an injection mold. As used in this disclosure, “injection mold” refers to a manufacturing tool for producing plastic parts. Manufacturing the housing 204 may involve using an injection molding process, which may involve the use of an injection mold configured to produce a specific shape and features of the housing 204. In some embodiments, the injection mold may include two half-molds clamped together, each having one or more cavities between them, which may define the shape of the housing 204. In some cases, but not limited to, a material such as molten plastic may be injected into the injection mold under high pressure to fill the space and take on the shape of the injection mold. The injection molding process may include a cooling process configured to cool and / or solidify the injected material. The injection mold can then be opened and the finished housing 204 can be removed. In some embodiments, the injection mold may be precisely machined to the desired shape and size of the housing 204. In non-limiting examples, the housing 204 may include a hollow cylinder.

[0073] Continuing to refer to Figure 2, one or more continuous conductors 136a-b may pass through the housing 204 and at one end there be electrically connected to at least one electrode 208 of at least one pair of electrodes 120a-b. In some cases, at least one electrode 208 may include a first electrode 120a. In other cases, at least one electrode 208 may include a second electrode 120b. The other end of the continuous conductors 136a-b may be connected to the ignition unit 132 or ground 124, as described above with reference to Figure 1. In some embodiments, one or more insulators 212a-b may be used where the continuous conductors 136a-b pass through the housing 204. For the purposes of this disclosure, “insulator” means a material that does not readily conduct heat, electricity, or sound. In non-limiting examples, the insulators 212a-b may include electrical insulators, which are materials having high electrical resistivity. The electrical insulator does not readily conduct electric current, thereby preventing the flow of electricity between the plasma reactor 116 and other components except the ignition unit 132, reducing the risk of short circuits, electric shocks, interference, and the like. Exemplary electrical insulators may include plastics, ceramics, glass, rubber, and the like.

[0074] Continuing to refer to Figure 2, each of at least one pair of electrodes 120a-b may include a pitch angle 216. In a non-limiting embodiment, at least one electrode 208 may include a pitch angle 216 of 6 to 8 degrees such that the angle between the faces of at least one pair of electrodes is 12 to 16 degrees. As used in this disclosure, the “pitch angle” of an electrode refers to the angle between the longitudinal axis of the electrode and a reference plane or reference axis within the plasma reactor 116. In one embodiment, the conical shape of the ejector discharge may be 12 to 15 degrees, and the pitch angle of electrode 208 may be 6 to 8 degrees. In one embodiment, the pitch of the ejector may coincide with that of electrode 208, or vice versa. In some cases, the pitch angle 216 may affect the properties of the plasma generated between the electrodes in the reaction region 128, including, but not limited to, the electric field distribution, the efficiency of the electrical discharge process, and the interaction with active species in the plasma (e.g., ROS, RNS, and similar).

[0075] Continuing with reference to Figure 2, the injector 140 may be connected to the plasma reactor 116 via the injector mounting flange 220. As used in this disclosure, “injector mounting flange” refers to a mechanical component used to securely and leaklessly fasten the injector 140 to the housing 204. In a non-limiting example, the injector mounting flange 220 may include an interface 224 between the injector 140 and the plasma reactor 116. In some cases, at least one fluid outlet 148 of the injector 140 may include a threaded adapter. Both at least one fluid outlet 148 and the interface 224 may include threaded portions. For example, but not limited to, at least one fluid outlet 148 / interface 224 may include a male threaded portion / female threaded portion, where the male and female threaded portions are compatible (i.e., matched). The injector 140 may be screwed into the injector mounting flange 220 via at least one fluid outlet 148 with a threaded adapter at the interface 224. In one embodiment, the bottom of the injector 140 may be a fluid outlet 148 having an opening at its bottom, which may allow gas and water to be discharged in a controlled conical spray. The outside of the fluid outlet 148 may be threaded. The mounting flange 220 may have an interface 224 having a fitting thread in its center, which may allow the injector 140 to be securely connected to the interface. In one embodiment, the position of the fluid outlet 148 within the mounting flange 220 may allow for discharge of gas and water directly into the center of the reaction region 128.

[0076] Referring next to Figure 3, an exemplary embodiment of the injector 140 with a flow rate adjustment component 304 is shown. In some embodiments, the injector 140 may include a plurality of fluid inlets 144a-b. As a non-limiting example, the injector 140 may include a first fluid inlet 144a fluid-connected to a first reservoir, where the first fluid inlet may be configured to receive a first fluid from the first reservoir. The first fluid may include one or more of the gases described above. The injector 140 may include a second fluid inlet 144b fluid-connected to a second reservoir, where the second fluid inlet 144b may be configured to receive a second fluid from the second reservoir. The second fluid may include a liquid such as water, but is not limited to this. In some cases, at least one fluid outlet 148 may be configured to discharge a mixture of the first and second fluids into the plasma reactor in the form of droplets. As used in this disclosure, “droplet” refers to a small, spherical liquid particle. In non-limiting embodiments, the injector 140 may generate droplets by different mechanisms, including, but not limited to, pressure-driven atomization, ultrasonic atomization, electrostatic atomization, and the like. The injector 140 may split a second fluid into small droplets, which can then be dispersed and mixed with the first fluid. In some cases, the droplets may carry reactants into the reaction region 128 of the plasma reactor 116. In some cases, the droplets may facilitate mixing and interaction between different fluids or active species within the plasma reactor, thereby improving the efficiency and / or uniformity of the processing process.

[0077] Continuing with reference to Figure 3, as used in this disclosure, “flow control component” refers to a device that enables precise control and adjustment of the flow rate of fluid through an injector. In some cases, the flow control component 304 may include a manual flow control valve that can be manually adjusted to regulate the flow rate of fluid through the injector 140. In non-limiting embodiments, the opening of the valve, or the opening of at least one fluid outlet 148, may be changed by turning a knob, thereby allowing more or less fluid to pass through the injector 140 or be injected into the plasma reactor 116. In addition, or alternatively, the flow control component 304 may include an 8x turndown ratio. As used in this disclosure, “turndown ratio” is a measure of the versatility and flexibility of the flow control component 304, indicating how well it can adapt to different flow requirements in a system. Such a flow control component 304 may control the flow rate of fluid over a range of 8 times the minimum flow rate. For example, if the minimum flow rate of the flow rate adjustment component 304 is 1 gallon / min (GPM), a turndown ratio of 8 times may indicate that the flow rate adjustment component 304 can effectively adjust the flow rate from 1 GPM to 8 GPM. In a non-limiting example, at least one fluid outlet 148 of the injector 140 may discharge gas and water droplets 308 of 5-8 μm in a conical spray 312 of 12-15 degrees. In one embodiment, the adjustment component 304 may terminate the fluid flow.

[0078] Referring next to Figure 4, exemplary embodiments of piezoelectric steam injectors, such as piezoelectric steam injector 400, are shown. As used in this disclosure, “piezoelectric steam injector” refers to a type of injector 140 that utilizes piezoelectric technology to generate steam by atomizing at least one liquid (i.e., a second fluid) into tiny droplets, as described above. “Steam” as used herein refers to the gaseous phase of water (i.e., the second fluid), which occurs when water molecules escape from their liquid state and gain enough energy to disperse into the surrounding air (i.e., the first fluid). “Piezoelectric technology” as used herein refers to technology based on the piezoelectric effect. The piezoelectric effect refers to the phenomenon in which certain materials generate an electric charge when subjected to mechanical stress, or vice versa (i.e., undergo mechanical deformation when exposed to an electric field). In some cases, materials such as ceramics (e.g., lead zirconate titanate), quartz crystals, polymers, and the like may exhibit such an effect. Piezoelectric steam injector 400 may include a piezoelectric element. For example, but not limited to, a ceramic disc or plate may be used to generate mechanical vibrations at a specific frequency when a voltage is applied by a power supply 404. The power supply 404 may include any of the power supplies described above, such as a DC power supply. The mechanical vibrations may be transmitted to at least one fluid input from at least one fluid inlet (i.e., a first fluid inlet 144a and / or a second fluid inlet 144b), thereby splitting at least one fluid into fine droplets of mist, which then evaporate to form water vapor. In a non-limiting example, at least one fluid outlet 148 of the piezoelectric water vapor injector 400 may discharge a conical discharge of water vapor and air at at least 90 degrees. In one embodiment, the piezoelectric water vapor injector 400 may have a single inlet for water only. In one embodiment, the piezoelectric water vapor injector 400 may discharge into a chamber characterized by a port into which water enters and a second port through which air and water vapor exit into a reaction region 128. In another embodiment, the piezoelectric steam injector 400 can directly distribute steam to the plasma reactor 116, and a second gas-only injector can directly discharge to the reaction region 128.

[0079] Referring next to Figure 5, an exemplary embodiment of the apparatus 100 for processing a growth medium via electrical discharge using an externally mounted injector 504 is illustrated. As used in this disclosure, “externally mounted injector” refers to an injector that is installed outside the apparatus 100, rather than being integrated into the apparatus 100 as described above with reference to Figures 1 to 4. The externally mounted injector 504 may include, but is not limited to, any of the above injectors such as injector 140 (air and water injector), piezoelectric steam injector 400, and similar types. In some embodiments, the externally mounted injector 504 may be designed to deliver at least one fluid from at least one reservoir 112 into the plasma reactor 116 from an external location via a tube 508. In a non-limiting example, the externally mounted injector 504 may be mechanically fixed to the outside of the housing 160. In some cases, externally mounted injectors 504 may be attached to the outside of the housing 160 by fastening screws or bolts, clamps or clips, sliding or snap-fit ​​connections, and / or similar means.

[0080] In addition, or alternatively, continuing with reference to Figure 5, the ignition unit 132 may include a coil 512. As used in this disclosure, “coil” means a conductive wire wound in a spiral or helical manner that generates an electromagnetic field when an electric current flows through it. In a non-limiting example, the coil 512 may be electrically connected to at least one electrode (i.e., the first electrode 120a) of at least one pair of electrodes 120a-b configured to initiate an electric discharge within the plasma reactor 116. The coil may include an induction coil or a high-voltage transformer coil, which may generate high-voltage electric pulses necessary to generate an electric discharge between the first electrode 120a and the second electrode 120b.

[0081] Referring next to Figure 6, a flow diagram of an exemplary embodiment of method 600 for processing a growth medium via electrical discharge is shown. Method 600 includes step 605 of transferring at least one fluid contained in at least one reservoir to an injector by an atmospheric pressure system. In some embodiments, the at least one reservoir may include a first reservoir configured to contain a first fluid and a second reservoir configured to contain a second fluid, where the first fluid may contain at least one gas and the second fluid may contain at least one liquid. In some embodiments, a pressure regulator may be configured to pressurize the at least one fluid entering the reaction region. This may be carried out as described herein, but is not limited to.

[0082] Continuing with reference to Figure 6, Method 600 includes step 610 of injecting at least one fluid through a reaction region of a plasma reactor by an injector fluid-connected to at least one reservoir, wherein the plasma reactor may include at least a pair of electrodes, including a first electrode and a second electrode, and the reaction region is located between the first electrode and the second electrode. In some embodiments, the injector may include a first fluid inlet fluid-connected to a first reservoir and configured to receive a first fluid from the first reservoir, a second fluid inlet fluid-connected to a second reservoir and configured to receive a second fluid from the second reservoir, and at least one fluid outlet configured to discharge a mixture of the first and second fluids into the plasma reactor in the form of droplets. In the method of claim 11, the injector comprises a flow rate control component configured to regulate the flow rate of at least one fluid entering the reaction region. This can be implemented as described herein, but is not limited thereto.

[0083] Continuing with reference to Figure 6, method 600 includes step 615 of supplying voltage to at least one electrode by an ignition unit electrically connected to at least one of a pair of electrodes. In some embodiments, the ignition unit may include an ignition circuit configured to convert power received from a power source into a high-voltage discharge of 6kV to 30kV. This can be implemented as described herein, but is not limited to this.

[0084] Continuing with reference to Figure 6, Method 600 includes step 620 of generating an electrical discharge in response to at least one fluid using at least a pair of electrodes. In some embodiments, the first electrode of the at least pair of electrodes may be configured to branch off from the second electrode of the at least pair of electrodes. In some embodiments, the angle between the faces of the at least pair of electrodes may be 12 to 16 degrees. In other embodiments, the electrode pitch angle may be 6 to 8 degrees, and the conical shape of the injector discharge may be 12 to 15 degrees. In some embodiments, the reaction region may include a plurality of arc points between the first electrode of the at least pair of electrodes and the second electrode of the at least pair of electrodes. This may be carried out as described herein, but is not limited to.

[0085] Continuing with reference to Figure 6, Method 600 includes step 625, which enables interaction between the electrical discharge and the growth medium contained within the processing chamber by a reaction region. This can be carried out as described herein, but is not limited to.

[0086] Continuing with reference to Figure 6, Method 600 may include the step of collecting the active species generated during the generation of an electrical discharge in the reaction region using a condenser located in the reaction region above the processing chamber. Method 600 may further include the step of transferring the active species to the processing chamber using the condenser. This may be carried out as described herein, but is not limited to this.

[0087] Referring next to Figure 7, exemplary embodiments of the conduit segments 700 are shown. The conduit 700 may include any conduit as described above with reference to Figure 1. In some embodiments, the conduit 700 may include pipes that allow the flow of a fluid, such as a gas or liquid, from one part of the condenser 156 to another part, or from the condenser 156 to another component of the apparatus 100. In some cases, the conduit of the condenser 156 may include multiple conduit segments, and the multiple conduit segments are connected to each other. In a non-limiting example, multiple short conduit segments may be connected to form a longer conduit within the condenser 156 to provide a longer passage for the fluid. In some cases, the connection between two segments of the conduit may be established via a mechanical interface. In non-limiting embodiments, a segment of the conduit 700 may include a body 708, a first mechanical interface 704a, and a second mechanical interface 704b, where the first mechanical interface 704a may be connected to the first conduit segment at the proximal end 712 of the body 708, and the second mechanical interface 704b may be connected to the second conduit segment at the distal end 716 of the body 708. In some cases, the mechanical interfaces may include a swivel joint, where, as used herein, “swivel joint” means a mechanical device used to connect two or more components, such as a segment of a conduit, in a manner that allows rotational movement along a connecting axis. The swivel joint may be designed to withstand the pressure exerted by the flowing fluid and the mechanical stress caused by rotation. Connected conduit segments, such as the first and second conduit segments, may include a conforming profile at their respective corresponding ends that allows for assembly and secure connection. In some cases, the proximal end 712 may include an outlet for the fluid, while the distal end 716 may include an inlet for the fluid, and vice versa. Other exemplary mechanical interfaces may include, but are not limited to, elbow joints, tree joints, cross joints, union joints, coupling joints, reducer joints, flange joints, and / or similar types.

[0088] Continuing to refer to Figure 7, in some cases the condenser 156 may be located inside the conduit. In one embodiment, the condenser 156 may be integrated inside the conduit itself, rather than being an external component. In some cases, the condenser 156 may be constructed from a heat-conducting material such as copper or aluminum, but not limited to these. In a non-limiting example, the condenser 156 may include stainless steel wool and may be configured to allow a fluid, such as water vapor, to condense back into water droplets, as described herein, but not limited to these. In such embodiments, the conduit may function not only as a fluid passage but also as a container for the condenser 156 and as a secondary path for heat dissipation.

[0089] Referring next to Figure 8, an exemplary embodiment of the ignition unit 132 is shown. The ignition unit includes a voltage source 804. As used in this disclosure, “voltage source” refers to an electrical device that provides a stable and continuous potential difference (i.e., voltage) between two points in an electrical circuit. In some embodiments, the voltage source 804 may supply the energy necessary for the operation of various circuits, devices, and / or components within the apparatus 100. In a non-limiting example, the ignition unit 132 may include an ignition circuit, where the ignition circuit is an electrical system / circuit used to initiate the formation of plasma in the plasma reactor 116 as described above with reference to Figures 1 and 2. The voltage source 804 connected within the ignition may provide the electrical energy necessary to generate and / or maintain an electrical discharge between at least one pair of electrodes 120a and 120b in the reaction region 128. In one embodiment, the voltage source 804 may include an AC power supply, which may provide a sinusoidal or non-sinusoidal waveform having a specific frequency, amplitude, and / or phase angle. In another embodiment, the voltage source 804 may include a direct current (DC) power supply, which may provide a constant voltage level. In a further non-limiting example, the voltage source 804 may include one or more batteries. For example, but not limited to, the ignition unit 132 may include a portable or standalone ignition unit, where the battery stores electrical energy in the form of chemical energy and can convert it to electrical energy as needed. In some cases, the battery may include, but not limited to, lead-acid batteries, lithium-ion batteries, nickel-metal hydride batteries, and similar types.

[0090] Continuing to refer to Figure 8, the ignition unit 132 includes a converter 808. As used in this disclosure, “converter” refers to an electrical component that converts electrical energy from one waveform to another. In some cases, the converter 808 may modify the voltage, current, waveform, and / or similar characteristics of electrical energy. In one embodiment, the converter 808 is configured to convert a voltage from a DC voltage input to an AC voltage output. In some cases, electrical discharges may be generated and maintained more efficiently using AC than DC. For example, but not limited to, an AC voltage oscillating between a first electrode 120a and a second electrode 120b may assist the plasma reactor 116 in ionizing at least one injected fluid, maintaining a plasma, and / or preventing the accumulation of charge on at least a pair of electrodes 120a-b. In a non-limiting example, the converter 808 may include a DC-AC converter, which may convert a DC voltage input to an AC voltage output having a specific waveform, frequency, and / or amplitude. In one embodiment, the converter 808 may also convert AC to AC. For example, an AC-to-AC converter may be used to convert an AC waveform having a particular frequency and amplitude to an AC waveform having a different frequency and amplitude. For example, an AC voltage controller may be a thyristor-based device that directly converts a fixed alternating voltage to a variable alternating voltage without changing the frequency. The AC voltage controller may be a phase-controlled device, and therefore a forced commutation circuit may not be required, and natural commutation or power supply commutation may be used. In one such embodiment, the converter may include an inverter. In an unspecified example, the converter 808 may include a switching circuit, which refers to an electrical circuit designed to quickly turn a device on and off in order to control the flow of current or voltage through the circuit. The switching circuit may generate a series of square wave pulses that approximate the shape of the AC waveform. For example, but not limited to, the converter 808 may convert a DC and / or AC voltage input to a pulse output such as a symmetric or asymmetric square wave, pulse train, and / or triangular sawtooth, or any other waveform.In some cases, the frequency of the square wave pulse may be determined by an oscillator, which is an electrical circuit that generates a periodic signal or waveform (e.g., a sine wave, a square wave, etc.). In some cases, the converter 808 may use electronic circuits to change the frequency of the periodic signal. For example, but not limited to, the converter 808 may include frequency multipliers, frequency dividers, frequency mixers, phase-locked loops (PLLs), and / or similar devices to increase or decrease the frequency of the periodic signal.

[0091] Continuing with reference to Figure 8, the converter 808 may include a transformer. For the purposes of this disclosure, “transformer” means an electrical device used to transfer electrical energy from a first circuit to a second circuit via electromagnetic induction. In one embodiment, a transformer may be used to increase or decrease the voltage of an AC power supply, to isolate circuits from each other, and / or to match the impedance of a load to a power supply. In a non-limiting example, the transformer may include an ignition transformer, as described above with reference to Figure 1. In addition, or alternatively, the switching circuit may include, but not limited to, power MOSFETs, IGBTs, thyristors, and / or similar elements, to control the flow of current through the circuit. In a non-limiting example, the switching circuit may be controlled. For example, solid elements in the switching circuit may be turned on and off by a control module that monitors or controls the output voltage and current of the converter 808, as will be further detailed below. In some embodiments, the converter 808 may be configured to convert a DC voltage input into a high-voltage discharge at a frequency of up to 10,000 kHz (10 MHz). Converters 808 configured to convert a DC voltage input into an AC voltage output may be implemented using a variety of circuit topologies, including but not limited to H-bridge, full-bridge, or half-bridge configurations, and may incorporate pulse-width modulation (PWM) for voltage and frequency control.

[0092] Continuing to refer to Figure 8, the ignition unit 132 may include dielectric barrier discharge (DBD) operation. As used in this disclosure, “dielectric barrier discharge (DBD)” refers to a type of plasma discharge occurring between two electrodes separated by a dielectric material. In some cases, the dielectric material may function as an insulator 212a-b as described above, preventing direct current flow between at least one pair of electrodes. In a non-limiting example, DBD operation may include applying a high voltage supplied by a voltage source 804 and converted via a converter 808 to at least one pair of electrodes 120a-b, where the first electrode 120a and / or the second electrode 120b may be insulated by a dielectric. The dielectric material may include, but is not limited to, quartz, ceramics, glass and the like. Instead of multiple arc points, multiple fine plasma filaments may be formed between at least one pair of electrodes 120a-b, which may have a very short lifetime, on the order of a few nanoseconds. In some embodiments, due to its short lifetime, the DBD may become a non-thermal (cold) plasma, where heavy particles may receive far less energy from the alternating field than lighter, faster electrons. In some embodiments, the DBD operation may be operated at atmospheric pressure via a pressure regulation system, as described above with reference to Figure 1.

[0093] Continuing to refer to Figure 8, in some embodiments, the converter 808 may be capable of converting an AC voltage input to a DC voltage output. In some cases, the ignition unit 132 may need to convert the AC power supply to a DC power supply for the apparatus 100 to perform pulsed operation. During pulsed plasma operation, the plasma reactor 116 may operate in pulsed mode, with plasma being generated and maintained for a short period, followed by a period without electrical discharge. The DC power supply is suitable for pulsed plasma operation because it is easily controlled and can be switched on and off as needed. In some cases, the apparatus 100 may convert the AC power supply to a DC power supply to reduce electrode wear and contamination. For example, in an AC-powered plasma reactor 116, the constant change in electrode polarity can accelerate electrode wear and release electrode material into the generated plasma. By using a DC power supply, the electrodes can maintain a constant polarity, reducing wear and contamination and extending electrode life. In non-limiting embodiments, the ignition unit 132 may include a rectifier. As used in this disclosure, “rectifier” means an electrical device or circuit that converts AC to DC. A rectifier may be constructed using one or more diodes, where a diode is a semiconductor device that allows current to flow in only one direction, having low resistance to forward current (when the voltage is positive) and high resistance to reverse current (when the voltage is negative). In some cases, a rectifier may include, but is not limited to, a half-wave rectifier, a full-wave rectifier, and similar types.

[0094] Continuing with reference to Figure 8, the ignition unit 132 includes an electrical connection interface 812 configured to electrically connect the converter 808 to at least one electrode of at least one pair of electrodes 120a-b located within the plasma reactor 116. As used in this disclosure, “electrical connection interface” refers to a physical and electrical configuration that enables the transfer of electrical energy or signals between two or more devices and / or components. In non-limiting examples, the electrical connection interface 812 may establish an electrical connection between the voltage source 804 / converter 808 and at least one electrode of at least one pair of electrodes 120a-b. Such an electrical connection may allow current to flow between the voltage source 804 / converter 808 and at least one electrode of at least one pair of electrodes 120a-b (i.e., an AC voltage output). In non-limiting examples, the electrical connection interface 812 may include an electrical connector, which is an electromechanical device used to form an electrical connection. In some embodiments, the electrical connection interface 812 may include male and female configurations. For example, but not limited to, the electrical connection interface 812 may include male components that connect to female components. In a non-limiting example, at least one electrode may include a screw terminal, which may allow one end of the continuous conductor 136 to be attached by tightening a screw. The other end of the continuous conductor 136 may include a male component, such as a plug, which may connect to a female component located on the ignition unit 132, such as a socket. Other exemplary embodiments of the electrical connection interface 812, but not limited to, may include cables, terminals, connectors, wire-to-board / board-to-board connections, and the like.

[0095] Continuing with reference to Figure 8, the ignition circuit includes a feedback mechanism 816. The feedback mechanism 816 includes a sensor 820 configured to detect reaction data 824. As used in this disclosure, “reaction data” means the reactions that occur in the reaction area 128 of the plasma reactor 116, and information relating to the process or operation of the apparatus 100 that initiates, induces, or otherwise maintains the reactions. In some cases, the reactions may include, but are not limited to, the generation of electrical discharge, plasma generation, and / or any chemical reactions described above in this disclosure. In one embodiment, the reaction data 824 may include a plurality of electrical discharge parameters 828. For the purposes of this disclosure, “electrical discharge parameters” means measurable characteristics or features of an electrical discharge process (i.e., plasma generation, electric arc, and the like). In non-limiting examples, the electrical discharge parameters 828 may include, but are not limited to, voltage, current, discharge frequency, waveform, phase angle, and the like. In one embodiment, the reaction data 824 may include a plurality of fluid parameters 832. For the purposes of this disclosure, “fluid parameter” means a measurable property or characteristic of the fluids involved in the processing process (i.e., the first fluid and / or the second fluid). In non-limiting examples, fluid parameters 832 include, but are not limited to, flow rate, pressure, fluid temperature, fluid viscosity, fluid density, fluid turbidity or clarity, and the like. In further embodiments, reaction data 824 may include a plurality of growth medium parameters 836. For the purposes of this disclosure, “growth medium parameter” means a measurable property or characteristic of the growth medium housed in the processing chamber 108 during the processing process. In non-limiting examples, growth medium parameters 836 may include, but are not limited to, optical properties, growth medium temperature, humidity level in the processing chamber 108, optical properties of the growth medium (e.g., growth, absorption, reflectance, transmittance, etc.), and the like.

[0096] Continuing with reference to Figure 8, where used in this disclosure, “feedback mechanism” refers to a system that returns information (i.e., the response data 824 above) about the output, results, or other performance of a device, component, or system to a control element (i.e., a control module, as described later). In one embodiment, the feedback mechanism 816 may include a negative feedback mechanism. In this case, the response data 824 provided by the feedback loop may be used to counteract or negate a change in the system output or device operation. In such an embodiment, the feedback mechanism 816 may maintain the performance of the device within a desired range or setpoint, even in the presence of disturbances or changes in operating conditions. In another embodiment, the feedback mechanism 816 may include a positive feedback mechanism. In this case, the response data 824 provided by the feedback loop may be used to amplify or enhance a change in the system output or device operation. In such an embodiment, the feedback mechanism 816 may result in a rapid change or exponential growth in the behavior of the system, such as amplification of a signal electrical circuit within the device 100, but is not limited to this.

[0097] Continuing with reference to Figure 8, as used in this disclosure, “sensor” means a device that senses, measures, or otherwise converts physical, chemical, or environmental properties into an electrical signal, the signal of which may be processed and / or analyzed by a feedback mechanism 816 of the connected device / system. In some embodiments, sensor 820 may include at least one sensor selected from a plurality of sensors consisting of voltage sensors, moisture sensors, temperature sensors, and light sensors. As used in this disclosure, “voltage sensor” means a device configured to measure a different voltage range (mV to kV) between two points in an electrical circuit. In some cases, a voltage sensor may operate at different frequencies, from DC to high-frequency AC. For example, but not limited to, a voltage sensor may be configured to measure either an AC voltage and / or a DC voltage. In a non-limiting example, a voltage sensor may be connected across at least a pair of electrodes 120a to b, or within a reaction region 128, to continuously monitor a voltage level. Such a voltage sensor may include a high-voltage probe with a resistive voltage divider.

[0098] Continuing to refer to Figure 8, as used in this disclosure, “moisture sensor” refers to a device configured to detect the amount of moisture present in a material or space, for example, but not limited to, in a processing chamber 108 connected to a plasma reactor 116. A feedback mechanism 816 may be used to monitor the moisture content or humidity of the growth medium or processing chamber 108. In non-limiting embodiments, the moisture sensor may include a capacitive moisture sensor, which is a type of moisture sensor that operates by measuring the capacitance of a sensing element. The sensing element may also refer to a thin film or hygroscopic material, for example, but not limited to a polymer or metal oxide, that absorbs or releases fluid molecules based on ambient humidity. A capacitive moisture sensor may include two electrodes separated by the sensing element, thereby forming a capacitor. When the sensing element contains moisture, the capacitance of the capacitive moisture sensor may change because at least one fluid molecule in the material increases the effective area of ​​the electrode. In a non-limiting embodiment, the sensor 820 may determine the moisture level in the processing chamber 108 by measuring the change in capacitance of a capacitive moisture sensor. In addition, or alternatively, in another non-limiting embodiment, the moisture sensor may include a resistive moisture sensor, which is a type of moisture sensor that functions by measuring the electrical resistance of a sensing element in a similar manner. In a non-limiting embodiment, an electric current may be passed through the sensing element and the voltage drop across the electrodes may be measured. The resistance may be calculated based on Ohm's law. The sensor 820 may then determine the moisture level according to the calculated resistance of the sensing element.

[0099] Continuing with reference to Figure 1, where used in this disclosure, “temperature sensor” means a device configured to measure the temperature of other devices / components within the apparatus 100. In non-limiting examples, sensor 820 may include, but is not limited to, thermocouples, thermistors, thermometers, passive infrared sensors, resistance temperature sensors (RTDs), semiconductor-based integrated circuits (ICs), combinations thereof, or other non-disclosed sensor types, either alone or in combination. For the purposes of this disclosure, “temperature” means a measure of the thermal energy of a system, as understood by those skilled in the art. The temperature measured by the temperature sensor may be measured in Fahrenheit (°F), Celsius (°C), Kelvin (°K), or on another scale, either alone or in combination. In some embodiments, sensor 820 may be configured to use the temperature sensor to measure the temperature of the ignition unit 132, the plasma reactor 116, and / or the processing chamber 108 during the processing process. In other embodiments, the temperature sensor may be configured to measure the temperature of the ambient environment around the apparatus 100.

[0100] Continuing to refer to Figure 1, in further embodiments, the sensor 820 may include an optical device. As used in this disclosure, “optical device” means any device that generates, transmits, detects, or otherwise functions using electromagnetic radiation, including but not limited to ultraviolet light, visible light, near-infrared light, infrared light, and the like. In some embodiments, the optical device may include one or more waveguides. As used in this disclosure, “waveguide” means a component configured to propagate electromagnetic radiation, including but not limited to ultraviolet light, visible light, near-infrared light, infrared light, and the like. Waveguides may include optical waveguides, optical fibers, and the like. Waveguides may include gratings within a transparent material. In some cases, the waveguide may be configured to function as one or more optical devices, for example, resonators (e.g., microring resonators), interferometers, and the like. In some cases, the waveguide may be configured to propagate electromagnetic radiation (EMR). In a non-limiting example, sensor 820 may include a sensor capable of optical communication with one or more waveguides. Such a sensor may be configured to detect variations in at least one optical property related to the growing medium 104. As used in this disclosure, “optical property” means any detectable property related to electromagnetic radiation, e.g., UV, visible light, infrared radiation, and the like.

[0101] Continuing to refer to Figure 1, in some embodiments, the sensor 820 may include at least one photodetector. In some cases, the sensor 820 may include a plurality of photodetectors, e.g., at least one first photodetector and at least one second photodetector. In some cases, at least one first photodetector and / or at least one second photodetector may be configured to measure one or more of the first and second optical outputs from the first and second waveguides, respectively. As used in this disclosure, “photodetector” means any device that is sensitive to light and thereby capable of detecting light. In some cases, a photodetector may include a photodiode, photoresistor, photosensor, photovoltaic chip, and the like. In some cases, a photodetector may include a germanium-based photodiode. Photodetectors may include, but are not limited to, avalanche photodiodes (APDs), single-photon avalanche diodes (SPADs), silicon photomultiplier tubes (SiPMs), photomultiplier tubes (PMTs), microchannel plates (MCPs), microchannel plate photomultiplier tubes (MCP-PMTs), indium gallium arsenide semiconductors (InGaAs), photodiodes, and / or photosensitive circuit elements or photon detection circuit elements, semiconductors, and / or transducers. As used herein, an avalanche photodiode (APD) refers to a diode (e.g., pn, PIN, and others) that is reverse-biased so that carriers generated by a single photon can trigger a short, transient "avalanche" of photocurrent on the order of milliamperes or more. This avalanche is caused by electrons being accelerated through the high-field region of the diode, causing collisional ionization of covalent bonds in the bulk material, which in turn trigger further collisional ionization of electron-hole pairs. APDs inherently possess a gain stage through avalanche multiplication. When the reverse bias is below the breakdown voltage, the gain of the APD is generally linear. For silicon APDs, this gain is on the order of 10 to 100. The material of the APD can contribute to the gain. Germanium APDs can detect infrared light up to a wavelength of 1.7 micrometers.InGaAs can detect infrared radiation up to a wavelength of 1.6 micrometers. Cadmium mercury telluride (HgCdTe) can detect infrared radiation up to a wavelength of 14 micrometers. An APD reverse-biased well above its breakdown voltage is called a single-photon avalanche diode, or SPAD. In this case, the np field is high enough to maintain an avalanche of current with a single photon, and is therefore called the "Geiger mode." Because this avalanche current rises rapidly (in sub-nanoseconds), the arrival time of an incident photon can be estimated using the detection of the avalanche current. SPADs can be pulled down below the breakdown voltage once triggered to reset or quench the avalanche current before another photon can be detected. This is because, while the avalanche current is active, the effect of carriers from additional photons on the current in the diode is negligible. At least one first photodetector may be configured to generate a first signal in response to variations in the optical properties of the first waveguide, the first signal may include, but not limited to, any voltage and / or current waveforms. In addition, or alternatively, the sensor device may include a second photodetector located downstream of the beam from the second waveguide. In some embodiments, the second photodetector may be configured to measure variations in the optical properties of the second waveguide and generate a second signal in response to variations in the optical properties of the second waveguide.

[0102] Continuing to refer to Figure 1, the photodetector may, in some cases, include an optical sensor array, for example, a one-dimensional array, for instance. The optical sensor array may be configured to detect variations in the optical properties of the waveguide. In some cases, the first and / or second photodetector may be wavelength-dependent. For example, the first and / or second photodetector may have a narrow wavelength range to which each of the first and second photodetectors is sensitive, for instance. As a further non-limiting example, a bandpass filter and / or filter set, and wavelength-specific optical filters of that kind, may be placed before each of the first and second photodetectors. In any case, a splitter may divide the output from the optical matrix multiplier as described below and provide it to each of the first and second photodetectors. Alternatively, or additionally, one or more optical elements may split the output from the waveguide before it is supplied to each of the first and second photodetectors, so that each of the first and second photodetectors receives a separate wavelength and / or set of wavelengths. For example, but not limited to, a wavelength demultiplexer may be placed between the waveguide and the first and / or second photodetectors. A wavelength demultiplexer may be configured to separate one or more light or light arrays in a wavelength-dependent manner. As used in this disclosure, “wavelength demultiplexer” means a device configured to separate two or more wavelengths of light from a shared optical path. In some cases, a wavelength demultiplexer may include at least one dichroic beam splitter. In some cases, a wavelength demultiplexer may include any of a hot mirror, a cold mirror, a short-pass filter, a long-pass filter, a notch filter, and the like. An exemplary wavelength demultiplexer may include part number WDM-11P, manufactured by OZ Optics (Otawa, Ontaio, Canada). Further examples of demultiplexers may include, but are not limited to, diffraction gratings, prisms, and / or any other devices and / or components for separating light by wavelength, as can be imagined by those skilled in the art by considering the entirety of this disclosure.In some cases, at least one light detector may be able to communicate with a computing device (i.e., by the detected signal) as described later in this disclosure.

[0103] Continuing to refer to Figure 8, the ignition unit 132 may include, but is not limited to, a control module 840 communicably connected to the feedback mechanism 816, which is configured to control various other components of the ignition unit 132, such as a voltage source 804, a converter 808, a feedback mechanism 816, and the like. The control module may include analog or digital control circuits, or any combination thereof, and may include, for example, operational amplifier circuits, transistor-based circuits, or other analog circuits, combinational logic circuits using one or more gates, synchronous or asynchronous sequential logic circuits using one or more registers, latches, or other state-holding elements, finite state machines, and the like. The control module 840 may include any computing device described in this disclosure, including but not limited to microcontrollers, microprocessors, digital signal processors (DSPs), and / or system-on-a-chip (SoCs) described in this disclosure. The computing device may include, be contained in, and / or communicate with a mobile device such as a mobile phone or smartphone. The control module 840 may include a single computing device operating independently, or it may include two or more computing devices operating in coordination, in parallel, sequentially, or similar manner. The two or more computing devices may be contained together within a single computing device, or contained within two or more computing devices. The control module 840 may interface with or communicate with one or more additional devices, as further detailed below in this disclosure, via a network interface device. The network interface device may be used to connect the control module 840 to one or more networks and one or more devices. Examples of network interface devices include, but are not limited to, network interface cards (e.g., mobile network interface cards, LAN cards), modems, and any combination thereof.Examples of networks include, but are not limited to, wide area networks (e.g., the Internet, enterprise networks), local area networks (e.g., networks associated with offices, buildings, campuses, or other relatively small geographical spaces), telephone networks, data networks associated with telephone / voice providers (e.g., data and / or voice networks of mobile communications providers), direct connections between two computing devices, and any combination thereof. Networks may employ wired and / or wireless communication modes. In general, any network topology may be used. Information (e.g., data, software, etc.) may be communicated to and from computers and / or computing devices. Control module 840 may include, but is not limited to, a computing device or cluster of computing devices at a first location and a second computing device or cluster of computing devices at a second location. Control module 840 may include one or more computing devices specialized for data storage, security, traffic distribution for load balancing, and the like. The control module 840 may distribute one or more computing tasks across multiple computing devices of the computing device, as described below, and these multiple computing devices may operate in parallel, serial, redundantly, or in any other manner used for task or memory distribution between computing devices. The control module 840 may be implemented using a “shared nothing” architecture in which data is cached on the workers, which in one embodiment may enable scalability of the device 100 and / or computing devices.

[0104] Continuing with reference to Figure 8, the control module 840 may be designed and / or configured to perform any method, method step, or series of method steps in any order and to any degree of repetition in any embodiment described herein. For example, the control module 840 may be configured to repeatedly perform a single step or sequence until a desired or instructed result is achieved. The repetition of a step or series of steps may be performed iteratively and / or recursively, using the output of a preceding repetition as the input to a subsequent repetition, which may involve aggregating the inputs and / or outputs of the repetitions to produce an aggregated result, decreasing or subtracting one or more variables such as global variables, and / or dividing a larger processing task into a set of smaller processing tasks that are processed iteratively. The control module 840 may perform any step or series of steps described herein in parallel, for example, simultaneously and / or substantially simultaneously, using two or more parallel threads, processor cores, and the like to perform the step two or more times. Task division between parallel threads and / or processes may be performed according to any protocol suitable for task division between iterations. Those skilled in the art will, by examining the entirety of this disclosure, recognize various ways of handling steps, sets of steps, processing tasks, and / or data using iteration, recursion, and / or parallel processing, including subdividing, sharing, or otherwise handling them.

[0105] Continuing with reference to Figure 8, where used in this disclosure, “communicatively connected” means connected by a connection, attachment, or link that enables the reception and / or transmission of information between two or more related elements. For example, but not limited to, such connection, which may be wired or wireless, direct or indirect, enables the reception and / or transmission of data and / or signals between two or more components, circuits, devices, systems, and such. The data and / or signals between them may, but not limited to, electrical, electromagnetic, magnetic, video, audio, radio, and microwave data and / or signals, combinations thereof, and such. A communicative connection may be achieved, for example, directly or through one or more intervening devices or components, via wired or wireless electronic, digital, or analog communications. Furthermore, a communicative connection may include electrically coupling or connecting at least one output of one device, component, or circuit to at least one input of another device, component, or circuit. For example, but not limited to, this could be via a bus or other means for communication between elements of a computing device. Communication connections may also include, for example, but not limited to, wireless connections, radio communications, low-power wide-area networks, optical communications, magnetic, capacitive, or optical coupling, and indirect connections via such means. In some embodiments, the term “communicatively coupled” may be used in this disclosure instead of “communicatively connected.”

[0106] Continuing with reference to Figure 8, in some embodiments, internal components of the apparatus 100 may communicate with the control module 840 using one or more signals. As used in this disclosure, “signal” means a human-readable and / or machine-readable representation of data, including, for example, electrical and / or digital signals from one device to another. Signals may be transmitted using any suitable communication connection. Signals may include optical signals, hydraulic signals, pneumatic signals, mechanical signals, electrical signals, digital signals, analog signals, and the like. In some cases, signals may be used to communicate with the control module 840, for example, via one or more ports. In some cases, signals may be transmitted and / or received by the control module 840, for example, via input / output ports. Analog signals may be digitized, for example, via an analog-to-digital converter. In some cases, analog signals may be processed before digitization, for example, via any analog signal processing step described in this disclosure. In some cases, digital signals may be used to communicate between two or more devices, including but not limited to the feedback mechanism 816 and the control module 840. In some cases, digital signals may be communicated via one or more communication protocols, including, but not limited to, the Internet Protocol (IP), Controller Area Network (CAN) protocols, serial communication protocols (e.g., Universal Asynchronous Transceiver [UART]), parallel communication protocols (e.g., IEEE 128 [Printer Port]), and similar types.

[0107] Referring further to Figure 8, the control module 840 may, in some cases, perform one or more signal processing steps on a signal. For example, the control module 840 may analyze, modify, and / or synthesize a signal representing data to improve the signal, for example, by improving transmission, storage efficiency, or signal-to-noise ratio. Exemplary signal processing methods may include analog, continuous-time, discrete, digital, nonlinear, and statistical. Analog signal processing may be performed on non-digitized or analog signals. Exemplary analog processing may include passive filters, active filters, adder mixers, integrators, delay lines, companders, multipliers, voltage-controlled filters, voltage-controlled oscillators, phase-locked loops, and / or any other processing using operational amplifiers or other analog circuit elements. Continuous-time signal processing may, in some cases, be used to process signals that change continuously within a domain, such as time. Exemplary and non-limiting continuous-time processing may include time-domain processing, frequency-domain processing (Fourier transform), and complex frequency-domain processing. Discrete-time signal processing can be used when signals are sampled discontinuously or at discrete time intervals (i.e., temporally quantized). Analog discrete-time signal processing can process signals using the following exemplary circuits: sample-and-hold circuits, analog time-division multiplexers, analog delay lines, and analog feedback shift registers. Digital signal processing can be used to process digitized discrete-time sampled signals. Generally, digital signal processing can be performed by computing devices, or other dedicated digital circuits such as application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or dedicated digital signal processors (DSPs), but not limited to these. Digital signal processing can be used to perform any combination of typical arithmetic operations, including fixed-point and floating-point, real and complex numbers, as well as multiplication and addition. Digital signal processing can additionally manipulate cyclic buffers and lookup tables.Further non-restrictive examples of algorithms that can be implemented based on digital signal processing techniques include the Fast Fourier Transform (FFT), finite impulse response (FIR) filters, infinite impulse response (IIR) filters, and adaptive filters such as Wiener filters and Kalman filters. Statistical signal processing can be used to process signals as random functions (i.e., stochastic processes) by utilizing their statistical properties. For example, in some embodiments, a signal may be modeled with a probability distribution exhibiting noise, which can then be used to reduce noise in the processed signal.

[0108] Continuing to refer to Figure 8, the control module 840 is configured to initiate the generation of an electric discharge in a reaction region 128 located between the first electrode 120a and the second electrode 120b, depending on the AC voltage output. The control module 840 can adjust the voltage provided by the voltage source 804. In a non-limiting example, the control module 840 may apply the AC voltage output supplied by and converted by the converter 808 to at least one of the pair of electrodes 120a-b. An AC electric field can be established between the first electrode 120a and the second electrode 120b in the reaction region 128. When the AC electric field becomes sufficiently strong, the electric discharge can ionize at least one fluid passing through the reaction region 128, thereby generating an electric discharge. The reaction region 128 is then configured to allow interaction between the electric discharge and the growth medium 104. The control module 840 may receive reaction data 824 detected by the sensor 820 in the feedback mechanism 816 during the interaction between the electrical discharge and the growth medium 104. The reaction data 824 may include, but is not limited to, a plurality of electrical discharge parameters 828, fluid parameters 832, growth medium parameters 836, and any other reaction data described herein. The feedback mechanism 816 may provide such reaction data 824 to the control module 840. The control module 840 may process the reaction data 824 and adjust the operation of the ignition unit 12 accordingly, as further detailed below, to maintain optimal discharge conditions and achieve the desired processing effect.

[0109] Continuing with reference to Figure 8, in one embodiment, the control module 840 may adjust at least one processing parameter 844 of the apparatus 100 in response to reaction data 824. As used in this disclosure, “processing parameter” refers to an operating parameter configured to optimize the processing process based on information received from the feedback mechanism 816 as described above (e.g., reaction data 824). In one embodiment, the processing parameter 844 may include an AC voltage. For example, but not limited to, the control module 840 may adjust the amplitude of the AC voltage supplied to at least one of at least one of the pair of electrodes 120a to b, in which case the AC voltage may affect the intensity of the electrical discharge and the energy transmitted to the plasma. In another embodiment, the processing parameter 844 may include an AC frequency. For example, but not limited to, the control module 840 may change the AC frequency of the AC voltage, in which case the AC frequency may affect the generation of a particular plasma species or the rate of a chemical reaction. In a further embodiment, the processing parameter 844 may include a pulse width, where the pulse width refers to the duration or time interval during which a pulse signal is in its “on” state. In non-limiting embodiments, the ignition unit 132 may include pulse width modulation for modulating the AC voltage provided by the voltage source 804 or output by the converter 808. The control module 840 may adjust the pulse width of the modulated signal to control the output of the AC voltage to at least one of the at least pair of electrodes 120a-b. In other embodiments, the processing parameter 844 may include a phase angle, which represents the difference in timing or position between two waveforms having the same frequency. In non-limiting embodiments, the control module 840 may control the phase angle between the voltage waveform and the current waveform to optimize the power transfer of the ignition unit 132 and maintain a stable electrical discharge in the plasma reactor 116. Other exemplary embodiments of the processing parameter 844 may include, but are not limiting, the fluid flow rate of at least one fluid, the fluid composition of at least one fluid, and the like.

[0110] Continuing with reference to Figure 8, the control module 840 may use a machine learning module to implement one or more algorithms or generate one or more machine learning models, such as a processing machine learning model, to determine at least one processing parameter 844. However, the machine learning module is illustrative and may not be required to generate one or more machine learning models to perform any machine learning described herein. In one or more embodiments, one or more machine learning models may be generated using training data. The training data may include inputs and corresponding predetermined outputs, as a result, the machine learning model may use the provided exemplary input-output correlations to construct algorithms and / or relationships, thereby enabling the machine learning model to determine its own output for an input. The training data may include correlations that the machine learning process can use to model relationships between data elements of two or more categories. Exemplary inputs and outputs may be from a database, such as any database described herein, or may be provided by a user of the device 100. In other embodiments, the machine learning module may obtain a training set by querying a communicably connected database containing historical inputs and outputs. Training data may include inputs from various types of databases, resources, and / or user inputs, and outputs correlated to each of those inputs, so that a machine learning model can determine the outputs. Correlations may indicate causal and / or predictive links between data, which can be modeled by the machine learning model as relationships, such as mathematical relationships, as will be further detailed below. In one or more embodiments, training data may be formatted and / or organized according to categories of data elements, for example, by associating data elements with one or more descriptors corresponding to categories of data elements. As a non-limiting example, training data may include data entered in a standardized form by a person or process, so that inputs of a given data element in a given field of that form can be mapped to one or more descriptors of a category.Elements within the training data can be linked to category descriptors by tags, tokens, or other data elements. A machine learning module can be used to generate a processing machine learning model using the training data. The processing machine learning model can be trained on correlated inputs and outputs of the training data. The training data can be a dataset that has already been transformed from raw data, whether manually, machine-generated, or otherwise. The training data may contain previous outputs so that the processing machine learning model iteratively generates outputs. A processing machine learning model using a machine learning process may output transformed data based on the inputs of the training data.

[0111] Continuing to refer to Figure 8, in an embodiment, tuning at least one processing parameter 844 may include determining at least one processing parameter 844 using a machine learning model, such as a processing machine learning model. The processing machine learning model may be trained with training data, such as processing training data. Determining at least one processing parameter 844 based on reaction data 824 using a machine learning model may include receiving user processing training data. In one embodiment, the processing training data may include a plurality of reaction data 824, each correlated with at least one processing parameter 844. In another embodiment, each element of the reaction data 824 may correlate with a plurality of processing parameters 844. For example, but not limited to, the processing training data may be used to show that the reaction data can indicate a particular processing parameter 844. The control module may tune the processing parameter 844 to ensure accurate and effective processing of the growth medium 104 and optimize the processing process for desired results. In one embodiment, the processing training data may include a plurality of electrical discharge parameters 828, each correlated with at least one processing parameter 844. In such embodiments, processing training data can be used to demonstrate how one or more electrical discharge parameters 828 can represent one or more processing parameters 844. In another embodiment, the processing training data may also include a plurality of fluid parameters 832, each correlated with at least one processing parameter 844. In such embodiments, the processing training data can be used to demonstrate how one or more fluid parameters 832 can represent one or more processing parameters 844. In a further embodiment, the processing training data may further include a plurality of growth medium parameters 836, each correlated with at least one processing parameter 844. In such embodiments, the processing training data can be used to demonstrate how one or more growth medium parameters 836 can represent one or more processing parameters 844.Determining at least one processing parameter 844 using a machine learning model may further include training the processing machine learning model based on processing training data and determining at least one processing parameter 844 using the trained processing machine learning model.

[0112] Referring next to Figure 9, an exemplary embodiment of a machine learning module 900 capable of performing one or more machine learning processes as described herein is shown. The machine learning module may use a machine learning process to perform steps, methods, processes, and the like of decision, classification, and / or analysis as described herein. As used herein, “machine learning process” means a process that automatically generates an algorithm to be executed by a computing device / module to produce an output 908 based on given data provided as input 912, using training data 904. This is in contrast to a non-machine learning software program, where the commands to be executed are predetermined by the user and written in a programming language.

[0113] Continuing to refer to Figure 9, where used in this disclosure, “training data” means data containing correlations that a machine learning process can use to model relationships between data elements of two or more categories. For example, but not limited to, training data 904 may contain multiple data entries, each entry representing a set of data elements that have been recorded, received, and / or generated, and the data elements may be correlated by coexistence within a given data entry, proximity within a given data entry, or similar means. Multiple data entries within training data 904 may exhibit one or more tendencies of correlations between categories of data elements. For example, but not limited to, higher values ​​of a first data element belonging to a first category of data elements may tend to correlate with higher values ​​of a second data element belonging to a second category of data elements, and this correlation may indicate a proportional or other mathematical relationship linking the values ​​belonging to the two categories. Multiple categories of data elements may be associated with training data 904 according to various correlations. Correlation can indicate causal and / or predictive links between categories of data elements, which can be modeled as relationships such as mathematical relationships by machine learning processes, as will be further detailed below. The training data 904 may be formatted and / or organized according to the categories of data elements, for example, by associating the data elements with one or more descriptors corresponding to the categories of the data elements. As a non-limiting example, the training data 904 may include data entered in a standardized form by a person or process, so that the input of a given data element in a given field of that form can be mapped to one or more descriptors of a category. Elements within the training data 904 may be linked to category descriptors by tags, tokens, or other data elements.For example, but not limited to, the training data 904 may be provided in a fixed-length format, a comma-separated values ​​(CSV) format that links the data location to a category, and / or in an Extensible Markup Language (XML), JavaScript Object Notation (JSON), or similar self-describing format, which may allow a process or device to detect the category of the data.

[0114] Alternatively, or additionally, continuing to refer to Figure 9, the training data 904 may contain one or more uncategorized elements; that is, the training data 904 may be unformatted or may not contain descriptors for some elements of the data. Machine learning algorithms and / or other processes may sort the training data 904 according to one or more classifications, for example, using natural language processing algorithms, tokenization, correlation detection in raw data, and the like, and the categories may be generated using correlation and / or other processing algorithms. As a non-limiting example, in a corpus of text, phrases constituting a number "n" compound words, such as nouns modified by other nouns, may be identified according to the statistically significant frequency of n-grams containing such words in a particular order. Such n-grams may be categorized as linguistic elements such as "words" that should be tracked as well as single words, and new categories may be generated as a result of statistical analysis. Similarly, in data entries containing some text data, a person's name may be identified by referencing a list of terms, a dictionary, or other glossary, enabling ad-hoc classification by machine learning algorithms and / or automatic association of data with descriptors within a data entry, or automatic organization into a predetermined format. The ability to automatically classify data entries may enable the same training data 904 to be applicable to two or more different machine learning algorithms, as will be further detailed below. The training data 904 used by the machine learning module 900 may correlate any input data described herein to any output data described herein.

[0115] Referring further to Figure 9, the training data may be filtered, sorted, and / or selected using one or more supervised and / or unsupervised machine learning processes and / or models, as further detailed below. Such models may include, but are not limited to, a training data classifier 916. The training data classifier 916 may include a “classifier,” which, as used in this disclosure, means a machine learning model, such as a mathematical model, neural network, or program, produced by a machine learning algorithm known as a “classification algorithm,” as further detailed below, that sorts the input into categories or bins of data and outputs categories or bins of data and / or labels associated therewith. The classifier may be configured to output at least one data point that labels or identifies clustered datasets, datasets determined to be close under the distance metric described below, or similar. The distance metric may include, but is not limited to, any norm, such as the Pythagorean norm. The machine learning module 900 may generate a classifier using a classification algorithm defined as the process by which a computing device and / or any module and / or component operating on it derives a classifier from training data 904. Classification may be performed using, but is not limited to, linear classifiers including logistic regression and / or naive Bayes classifiers, nearest neighbor classifiers such as k-nearest neighbor classifiers, support vector machines, least squares support vector machines, Fisher's linear discriminant, quadratic classifiers, decision trees, boosted trees, random forest classifiers, learning vector quantization, and / or neural network-based classifiers.

[0116] Continuing with reference to Figure 9, the machine learning module 900 may be configured to perform a lazy learning process 920 and / or protocol. This process and / or protocol may alternatively be referred to as a “lazy load” or “call on demand” process and / or protocol, and may be a process in which machine learning is performed by combining an input to be transformed into an output with a training set to derive an algorithm used to generate an output on demand. For example, an initial series of simulations may be performed to cover initial heuristics and / or “first guesses” in the output and / or relationships. In a non-limiting example, the initial heuristics may include ranking the relationships between the input and elements of the training data 904. The heuristics may include selecting several highest-ranking relationships and / or elements of the training data 904. Lazy learning may implement any suitable lazy learning algorithm, including but not limited to the K-nearest neighbor algorithm, the lazy Naive Bayes algorithm, or similar. Those skilled in the art will recognize, by examining the entire disclosure, a variety of lazy learning algorithms that may be applied to generate the output as described herein. This may include, but is not limited to, applications of delayed learning in machine learning algorithms, which will be discussed in more detail below.

[0117] Alternatively, or in addition, continuing to refer to Figure 9, the machine learning processes described herein may be used to generate a machine learning model 924. Where used herein, “machine learning model” means a mathematical and / or algorithmic representation of the relationship between inputs and outputs, generated using any machine learning process, including, but not limited to, any process as described above, and stored in memory. Inputs are fed into the machine learning model 924 once it has been created, and outputs are generated based on the derived relationships. For example, a linear regression model generated using a linear regression algorithm may, but not limited to, compute a linear combination of the input data using coefficients derived during the machine learning process to compute the output data. As a further non-limiting example, a machine learning model 924 may be generated by creating an artificial neural network, such as a convolutional neural network, which includes an input layer of a node, one or more hidden layers, and an output layer of a node. Connections between nodes can be created through a process of "training" the network, in which elements from a set of 904 training data are applied to the input nodes, and then a suitable training algorithm (such as the Levenberg-Marquardt method, conjugate gradient method, simulated annealing, or other algorithms) is used to adjust the connections and weights between nodes in adjacent layers of the neural network, thereby generating the desired values ​​at the output nodes. This process is sometimes called deep learning.

[0118] Continuing to refer to Figure 9, the machine learning algorithm may include at least one supervised machine learning process 928. The at least one supervised machine learning process 928 refers to an algorithm that takes a training set relating a plurality of inputs to a plurality of outputs, as defined herein, and attempts to find one or more mathematical relationships relating the inputs to the outputs, where each of the one or more mathematical relationships is optimized according to a predetermined criterion specified for the algorithm using a predetermined scoring function. For example, the supervised learning algorithm may include the above-mentioned response data as inputs, at least one processing parameter as an output, and a scoring function that represents a desired form of the relationship to be detected between the inputs and outputs. The scoring function may, for example, attempt to minimize the probability that a given input is not associated with a given output by maximizing the probability that a given input and / or combination of input elements is associated with a given output. The scoring function may be expressed as a risk function representing the “expected loss” of an algorithm relating inputs and outputs, which can be calculated as an error function representing the degree to which the predictions generated by the relationship are inaccurate compared to a given input-output pair provided in the training data 904. Those skilled in the art will, by examining the entirety of this disclosure, understand various possible variations of at least one supervised machine learning process 928 that may be used to determine the relationship between inputs and outputs. The supervised machine learning process may include the classification algorithm defined above.

[0119] Referring further to Figure 9, the machine learning process may include at least one unsupervised machine learning process 932. As used herein, an unsupervised machine learning process refers to a process that derives inferences in a dataset regardless of labels, and as a result, the unsupervised machine learning process is free to discover any structures, relationships, and / or correlations provided in the data. A response variable may not be required in an unsupervised process and may be used to discover interesting patterns and / or inferences between variables, to determine the degree of correlation between two or more variables, or for similar purposes.

[0120] As shown subsequently in Figure 9, the machine learning module 900 may be designed and configured to create a machine learning model 924 using techniques for developing linear regression models. Linear regression models may include ordinary least-squares regression, which aims to minimize the square of the difference between the predicted and actual outcomes according to a suitable norm (e.g., the vector space distance norm) for measuring such a difference, and the coefficients of the resulting linear equation may be modified to improve minimization. Linear regression models may include ridge regression, where the function to be minimized is a least-squares function and a term obtained by multiplying the square of each coefficient by a scalar quantity to penalize large coefficients. Linear regression models may include a least absolute contraction and selection operator (LASSO) model, where ridge regression is combined with multiplying the least-squares term by a coefficient obtained by dividing 1 by twice the number of samples. Linear regression models may include a multitask lasso model, where the norm applied to the least-squares term of the lasso model is the Frobenius norm, which is equal to the square root of the sum of the squares of all terms. Linear regression models may include elastic network models, multitask elastic network models, minimum angle regression models, LARS lasso models, orthogonal matching tracking models, Bayesian regression models, logistic regression models, stochastic gradient descent models, perceptron models, passive-aggressive algorithms, robust regression models, Huber regression models, or any other suitable models that a person skilled in the art may conceive by considering the entirety of this disclosure. In one embodiment, the linear regression model may be generalized to a polynomial regression model, thereby searching for a polynomial (e.g., a quadratic, cubic, or higher-order expression) that provides the best fit between the predicted output and the actual output. As will become apparent to a person skilled in the art by considering the entirety of this disclosure, similar techniques as described above may be applied to minimize the error function.

[0121] Continuing to refer to Figure 9, machine learning algorithms may include, but are not limited to, linear discriminant analysis. Machine learning algorithms may include quadratic discriminant analysis. Machine learning algorithms may include kernel ridge regression. Machine learning algorithms may include support vector machines, but are not limited to, support vector classification-based regression processes. Machine learning algorithms may include stochastic gradient descent algorithms, including classification and regression algorithms based on stochastic gradient descent. Machine learning algorithms may include nearest neighbor algorithms. Machine learning algorithms may include various forms of latent space regularization, such as variational regularization. Machine learning algorithms may include Gaussian processes, such as Gaussian process regression. Machine learning algorithms may include cross-decomposition algorithms, including partial least squares and / or canonical correlation analysis. Machine learning algorithms may include naive Bayes methods. Machine learning algorithms may include decision tree-based algorithms, such as decision tree classification or regression algorithms. Machine learning algorithms may include ensemble methods, such as bagging meta-estimators, randomized tree forests, AdaBoost, gradient tree boosting, and / or voting classifier methods. Machine learning algorithms may include neural network algorithms, including convolutional neural network processes.

[0122] Referring now to Figure 10, a flowchart of an exemplary embodiment of method 1000 for processing a growth medium via electrical discharge is shown. Method 1000 includes step 1005 of providing a voltage by a voltage source. This can be carried out as described herein, but is not limited to.

[0123] Continuing with reference to Figure 10, Method 1000 includes step 1010 of converting a direct current (DC) voltage input to an alternating current (AC) output voltage using a converter. In some embodiments, the converter may be configured to convert the DC voltage input to a high-voltage discharge of 10,000 kHz (10 MHz). This may be carried out as described herein, but is not limited to this.

[0124] Continuing to refer to Figure 10, Method 1000 includes step 1015 of electrically connecting the converter to at least one electrode of a pair of electrodes arranged in a plasma reactor by an electrical connection interface, the pair of electrodes including a first electrode and a second electrode. In some embodiments, the first electrode of the pair of electrodes may be configured to branch off from the second electrode of the pair of electrodes. In some embodiments, each electrode of the pair of electrodes may have a pitch angle of 6 to 8 degrees (such that the total angle between the pair of electrodes is 12 to 16 degrees). In some embodiments, at least one electrode of the pair of electrodes may include a dielectric insulator. This can be implemented as described herein, but is not limited to this.

[0125] Continuing to refer to Figure 10, Method 1000 includes step 1020, in which a control module initiates the generation of an electrical discharge within a reaction region positioned between a first electrode and a second electrode. In some embodiments, the reaction region may include a plurality of arc points between the first electrode of at least a pair of electrodes and the second electrode of at least a pair of electrodes. This can be carried out as described herein, but is not limited to this.

[0126] Continuing with reference to Figure 10, Method 1000 includes step 1025, which enables interaction between the electrical discharge and the growth medium contained within the processing chamber by a reaction region. This can be carried out as described herein, but is not limited to.

[0127] Continuing with reference to Figure 10, Method 1000 includes step 1030 of detecting reaction data using a sensor by a feedback mechanism. In some embodiments, the sensor may include at least one sensor selected from a plurality of sensors consisting of a voltage sensor, a current sensor, a temperature sensor, a moisture sensor, and a light sensor. In some embodiments, the reaction data may include a plurality of electrical discharge parameters, a plurality of fluid parameters, and a plurality of growth medium parameters. This may be carried out as described herein, but is not limited to these.

[0128] Continuing to refer to Figure 10, Method 1000 may include the steps of: having a control module receive response data detected by a sensor from a feedback mechanism; and having the control module adjust at least one processing parameter of the apparatus in accordance with the response data. In some embodiments, adjusting at least one processing parameter may include the control module training a processing machine learning model using processing training data, where processing training data may include a plurality of response data as inputs correlated to a plurality of processing parameters as outputs; and having the control module determine at least one processing parameter in accordance with the trained processing machine learning model. This may be carried out as described herein, but is not limited to these.

[0129] Next, referring to Figures 11A–11C, some exemplary embodiments of the injector 1100 for a plasma reactor are shown. As used in this disclosure, “plasma reactor” refers to a device configured to generate, maintain, and / or control plasma. For the purposes of this disclosure, “plasma” refers to a fourth state of matter, in addition to solids, liquids, and gases. Plasma may include a partially ionized gas consisting of a mixture of ions, electrons, and / or neutral particles (i.e., atoms and molecules). In one embodiment, plasma may be formed when at least one fluid is exposed to a high-energy source, such as heat, radiation, or an electric field, and is ionized by atoms or molecules in at least one fluid losing or gaining electrons. At least one fluid may be introduced into the plasma reactor using the injector 1100 as described below in this disclosure. In some cases, plasma may include non-thermal plasma (NTP), where non-thermal plasma refers to a type of plasma where the electron temperature is significantly higher than the temperature of heavier ions and neutral particles. In this case, electrons in the plasma have high kinetic energy, while the overall temperature of at least one fluid may remain relatively low (e.g., often around room temperature, 30–32°C / 68–72°F). In addition, or alternatively, the energy distribution between particles in a non-thermal plasma may not be in thermal equilibrium. This may be due to electrons being much lighter than ions and neutral particles, thus gaining energy more rapidly when exposed to an electric or magnetic field, resulting in a higher electron temperature. Heavier ions and neutral particles, on the other hand, move more slowly and remain at lower temperatures, which may result in a lower temperature for at least one fluid. As used in this disclosure, “fluid” means a flowable gaseous or liquid material, including, but not limited to, water, nitrogen, oxygen, and / or other gases and / or liquids.

[0130] Continuing with reference to Figures 11A–11C, as used in this disclosure, “injector” refers to a component designed to inject at least one fluid into a plasma reactor. Specifically, the injection may occur in the reaction region of the plasma reactor. In a non-limiting example, injector 1100 is configured to deliver at least one fluid through the reaction region of the plasma reactor. As used in this disclosure, “reaction region” refers to a designated region or space within the plasma reactor where a particular chemical or physical reaction occurs. At least one fluid may then be used by the plasma reactor to generate plasma. For the purposes of this disclosure, “fluid connection” refers to a path or link that enables the transfer of at least one fluid. In a non-limiting example, the fluid connection between injector 1100 and at least one reservoir may be established using, but not limited to, tubes, pipes, hoses, channels, or various components of the same kind, thereby forming a continuous path for the flow of at least one fluid.

[0131] Continuing to refer to Figures 11A–11C, in some embodiments, the injector 1100 includes at least one fluid outlet 1104a–d. As used in this disclosure, “fluid outlet” refers to an outlet point from which at least one fluid is discharged from the injector 1100 into the reaction region of the plasma reactor. In some embodiments, at least one fluid outlet 1104a–d is configured to discharge at least one fluid into the plasma reactor in a conical distribution 1112. For the purposes of this disclosure, “conical distribution” of droplets refers to the shape of the distribution of droplets of at least one fluid that resembles a cone shape. As a non-limiting example, at least one fluid dispersed from at least one fluid outlet 1104a–d may form a conical distribution 1112 by hydrodynamics. For example, but not limited to, when at least one fluid exits the nozzle of at least one fluid outlet 1104a–d, the fluid first moves linearly before coming into contact with the surrounding air. When at least one fluid enters the air, it is subjected to aerodynamic forces such as air resistance and turbulence, and spreads out into a conical distribution 1112. This phenomenon is known as the Coanda effect, which explains the tendency of a fluid jet to adhere to a nearby surface, such as the surface of air surrounding a droplet 1116. The conical distribution 1112 may also be influenced by the size and shape of the nozzles of at least one fluid outlet 1104a-d, the pressure and velocity of at least one fluid, and the characteristics of the surrounding air. In some embodiments, the conical distribution 1112 includes a distribution angle. For the purposes of this disclosure, “distribution angle” of the conical distribution refers to the angle between the vertical axis of the conical distribution and a reference plane or axis in the plasma reactor. As a non-limiting example, the distribution angle of the conical distribution of at least one fluid may include a variety of angles, such as 12°, 13°, 14°, 15° and so on. In some embodiments, the conical distribution of a droplet may correspond to the shape of a pair of electrodes in the plasma reactor. As a non-limiting example, if the pitch angle of a pair of electrodes is 6° (i.e., the angle between the pair of electrodes is 12°), the distribution angle of the conical distribution of at least one fluid may include 12°. In some embodiments, the conical distribution 1112 includes at least one fluid droplet 1116.As used in this disclosure, “droplet” refers to a small, spherical liquid particle. In some embodiments, at least one fluid outlet 1104a–d can discharge droplets 1116 of varying sizes of at least one fluid. In non-limiting embodiments, droplets may include ultrafine droplets. For the purposes of this disclosure, “ultrafine droplet” refers to a droplet having a diameter of less than 110 micrometers. For example, but not limited to, the diameters of ultrafine droplets 1116 may include 5 μm, 6 μm, 7 μm, 8 μm and the like. In some cases, at least one fluid outlet 1104a–d may be configured to allow at least one fluid to be discharged to an intended location within the reaction region. For example, but not limited to, at least one fluid outlet 1104a–d may be located in the center and directly above at least one pair of electrodes.

[0132] Continuing to refer to Figures 11A to 11C, in some embodiments, at least one fluid outlet 1104a to d may be configured to generate nitrogen oxide (NOx) concentrations. For example, but not limited to, when the plasma reacts with air, the plasma may generate a variety of active species, including nitrogen oxide (NOx). The active species disclosed herein are further described below. NOx species may, for example, react with droplet 1116 in the plasma reactor to form nitric acid. Since nitric acid is highly soluble in at least one fluid, it may be absorbed by droplet 1116, leading to an increase in the NOx concentration in the ultrafine droplet. At least one fluid outlet 1104a to d may be positioned at a distance from at least one pair of electrodes or reaction regions. This distance may affect the time and space available for at least one fluid to mix and interact with the plasma or other process components. In some cases, at least one fluid outlet 1104a-d may be configured to provide an optimal flow pattern and dispersion of at least one fluid into the reaction region. In non-limiting examples, at least one fluid outlet 1104a-d may include a nozzle (i.e., an opening of a special shape). For the purposes of this disclosure, “nozzle” means a component configured to form a directional, high-speed flow of at least one fluid. In some embodiments, a nozzle may improve the mixing and dispersion of at least one fluid within the reaction region. Such nozzles may include, but are not limited to, swirl nozzles, fan spray nozzles, impact jet nozzles, porous nozzles, atomizing nozzles, and the like. In another non-limiting example, such nozzles may include, but are not limited to, ultrasonic nozzles, compressed air nozzles, high-pressure nozzles, low-pressure nozzles, aerodynamic nozzles, microfog nozzles, mist line nozzles, and the like. In some embodiments, at least one fluid outlet 1104a-d may be configured to discharge a mixture of the first fluid and the second fluid into the plasma reactor in droplet form from the first fluid inlet and the second fluid inlet.

[0133] Continuing to refer to Figures 11A to 11C, in one embodiment, at least one fluid outlet 1104a to d may include ultrasonic atomization to generate droplets 1116. As a non-limiting example, at least one fluid outlet 1104a to d may use high-frequency sound waves to generate waves on the surface of at least one fluid, which in turn release droplets 1116 into the air. In another embodiment, at least one fluid outlet 1104a to d may include pneumatic atomization to generate droplets 1116. As a non-limiting example, at least one fluid outlet 1104a to d may use compressed air to force water through a nozzle to generate ultrafine droplets. In yet another embodiment, at least one fluid outlet 1104a to d may include centrifugal atomization to generate droplets 1116. As a non-limiting example, at least one fluid outlet 1104a-d may use a rotating disk or wheel to blow droplets 1116 outward to generate ultrafine droplets. In another embodiment, at least one fluid outlet 1104a-d may include electrostatic atomization. As a non-limiting example, at least one fluid outlet 1104a-d may use an electric field to decompose a flow of at least one fluid into droplets 1116, which are then charged and repelled from one another to generate ultrafine droplets. In another embodiment, at least one fluid outlet 1104a-d may include thermal atomization. As a non-limiting example, at least one fluid outlet 1104a-d may use a method in which at least one fluid is heated to generate vapor, which is then condensed using a cooling system and returned to droplets 1116 to generate ultrafine droplets.

[0134] Continuing to refer to Figures 11A to 11C, in some embodiments, at least one fluid outlet 1104a to d may include a plurality of at least one fluid outlets 1104a to d. In some embodiments, at least one fluid outlet 1104a to d may be configured to discharge at least one fluid 1108a to d. As a non-limiting example, at least one fluid outlet 1104a may be configured to discharge at least one fluid 1108a. As another non-limiting example, at least one fluid outlet 1104b may be configured to discharge at least one fluid 1108b. As yet another non-limiting example, at least one fluid outlet 1104b may be configured to discharge at least one fluid 1108b. As yet another non-limiting example, at least one fluid outlet 1104c may be configured to discharge at least one fluid 1108c. As yet another non-limiting example, at least one fluid outlet 1104c may be configured to discharge at least one fluid 1108d. In some embodiments, at least one fluid outlet 1104a-d may be configured to discharge a mixture of at least one fluid 1108a-c. In a non-limiting example, at least one fluid 1108d may contain a mixture of at least one fluid 1108a-c. In a non-limiting example, at least one fluid outlet 1104d may be configured to discharge at least one fluid 1108d, in which case at least one fluid 1108d may contain a mixture of at least one fluid 1108a-c. In some embodiments, at least one fluid outlet 1104a-d may discharge a conical distribution 11 of droplets 11 of at least one fluid 1108a-c. The conical distribution 1112 of droplets 1116 of at least one fluid 1108a-c disclosed herein may correspond to a conical spray 312 (see Figure 3).

[0135] The conical distribution 11 of droplets of at least one fluid 1104a-c has been described in more detail with respect to Figure 1. In some embodiments, at least one fluid outlet 1104a-d may be fluidically connected to at least one reservoir 112. As another non-limiting example, at least one fluid outlet 1104a may be fluidically connected to a first reservoir 112 which may contain at least one fluid 1108a. As yet another non-limiting example, at least one fluid outlet 1104b may be fluidically connected to a second reservoir 112 which may contain at least one fluid 1108b. As yet another non-limiting example, at least one fluid outlet 1104c may be fluidically connected to a third reservoir 112 which may contain at least one fluid 1108a. In some embodiments, as shown in Figure 11A, at least one fluid 1108a-c may be mixed externally. In some embodiments, as shown in Figure 11B, at least one fluid 1108a-c may be mixed internally. In some embodiments, as shown in Figure 11C, at least one fluid 1108a-c may be mixed within the injector reservoir 1120. For the purposes of this disclosure, “injector reservoir” means a container or storage chamber of an injector designed to hold at least one fluid used in a processing process. In some embodiments, the injector reservoir 1120 may be fluidically connected to at least one reservoir 112. As a non-limiting example, the injector reservoir 1120 may be fluidically connected to the outlet of at least one reservoir 112.

[0136] Referring now to Figure 12, an exemplary embodiment of the steam injection system 1200 is presented. In one embodiment, the system 1200 includes a fluid inlet 1204 that is in fluid communication with a fluid reservoir 1208. In one embodiment, the fluid inlet 1204 may receive fluid from the fluid reservoir 1208. As used herein, “fluid inlet” refers to an inlet point into which fluid can be injected into the steam injection system before use in the manner described herein. In some non-limiting examples, the fluid inlet 1204 may include, but is not limited to, tubes, pipes, hoses, channels, or similar components to form a continuous path for the flow of fluid. As used herein, “fluid communication” refers to a path or link that enables the transfer of at least one fluid. As used herein, “reservoir” refers to, for example, a storage system for fluid. In one embodiment, the fluid inlet 1204 may be configured to receive fluid from the fluid reservoir 1208. In embodiments, the fluid reservoir 1208 may include a plurality of reservoirs. In one embodiment, the fluid reservoir 1208 may be sealed to substantially prevent leakage of the fluid stored in the fluid reservoir 1208. In some embodiments, the fluid reservoir 1208 may be permeable to allow some fluid, such as air, to freely pass in and out of the fluid reservoir 1208, although this is not limited to some embodiments. In another embodiment, the fluid reservoir 1208 may be completely sealed. In some embodiments, the fluid reservoir 1208 may include a storage reservoir. In one embodiment, the fluid reservoir 1208 may include a pressure reservoir that provides a pressure difference between the inside and outside of the reservoir. In some cases, the fluid reservoir 1208 may be insulated to prevent, for example, electrical and / or thermal transfer between the inside and outside of the reservoir. In one embodiment, the fluid inlet 1204 may be hydraulically connected to the fluid reservoir 1208. In some embodiments, the fluid inlet 1204 may include a pump. In one embodiment, the pump may be configured to pump fluid in one direction from the fluid reservoir 1208 to other components of the steam injection system 1200. In some embodiments, the pump may include multiple pumps and / or several valves.In one embodiment, several valves may include at least one check valve. As used in this disclosure, “check valve” means a one-way valve / check valve that opens with the movement and pressure of a fluid and closes to prevent backflow of the fluid and / or pressure. In exemplary embodiments, the check valve may be a ball check valve, a swing check valve, a tilt disc check valve, or any of the same kind. Those skilled in the art will see from reading this disclosure that there are many methods that can be used to control the flow of fluid from the fluid reservoir 1208 to other components of the vapor injection system 1200. As used in this disclosure, “fluid” means a flowable gaseous or liquid material, including, but not limited to, water, nitrogen, oxygen, and / or other gases and / or liquids.

[0137] Continuing to refer to Figure 12, in some embodiments, the fluid inlet 1204 may include a fluid circuit configured to direct fluid into components of the steam injection system 1200. In one embodiment, the fluid circuit may be connected to a controller 1212 and configured to control the flow of fluid from the fluid reservoir 1208 to other components of the steam injection system 1200. The controller 1212 may include any computing device described in this disclosure, including but not limited to microcontrollers, microprocessors, digital signal processors (DSPs), and / or system-on-a-chip (SoCs) described herein. The computing device may include, be contained in, and / or communicate with a mobile device such as a mobile phone or smartphone. The controller 12 may include a single computing device operating independently, or it may include two or more computing devices operating in coordination, in parallel, sequentially, or similar manner. Two or more computing devices may be contained together within a single computing device, or they may be contained within two or more computing devices. The controller 1212 may interface with or communicate with one or more additional devices, as further detailed below in this disclosure, via a network interface device. The network interface device may be used to connect the controller 1212 to one or more of various networks and one or more devices. Examples of network interface devices include, but are not limited to, network interface cards (e.g., mobile network interface cards, LAN cards), modems, and any combination thereof.Examples of networks include, but are not limited to, wide area networks (e.g., the Internet, enterprise networks), local area networks (e.g., networks associated with offices, buildings, campuses, or other relatively small geographical spaces), telephone networks, data networks associated with telephone / voice providers (e.g., data and / or voice networks of mobile communications providers), direct connections between two computing devices, and any combination thereof. Networks may employ wired and / or wireless communication modes. In general, any network topology may be used. Information (e.g., data, software, etc.) may be communicated to and from computers and / or computing devices. Controller 12 may include, but is not limited to, a computing device or cluster of computing devices at a first location and a second computing device or cluster of computing devices at a second location. Controller 12 may include one or more computing devices dedicated to data storage, security, traffic distribution for load balancing, and similar functions. The controller 1212 may distribute one or more computing tasks across multiple computing devices of the computing device, as described below, and these multiple computing devices may operate in parallel, serial, redundantly, or in any other manner used for task or memory distribution across computing devices. The controller 1212 may be implemented using a “shared nothing” architecture in which data is cached on the workers, which in one embodiment may enable the scalability of the system 1200 and / or computing devices.

[0138] Continuing with reference to Figure 12, the controller 1212 may be designed and / or configured to execute any method, method step, or series of method steps in any order and to any degree in any embodiment of the present disclosure. For example, the controller 1212 may be configured to repeatedly execute a single step or sequence until a desired or instructed result is achieved. The repetition of a step or series of steps may be performed iteratively and / or recursively, using the output of a preceding iteration as the input to a subsequent iteration, which may involve aggregating the inputs and / or outputs of the iterations to produce an aggregated result, decreasing or subtracting one or more variables such as global variables, and / or dividing a larger processing task into a set of smaller processing tasks that are processed iteratively. The controller 12 may execute any step or series of steps described in the present disclosure in parallel, for example, executing a step two or more times using two or more parallel threads, processor cores and the like, simultaneously and / or substantially simultaneously. Task division between parallel threads and / or processes may be performed according to any protocol suitable for task division between iterations. Those skilled in the art will, by examining the entirety of this disclosure, recognize various ways of handling steps, sets of steps, processing tasks, and / or data using iteration, recursion, and / or parallel processing, including subdividing, sharing, or otherwise handling them.

[0139] Continuing to refer to Figure 12, the controller 1212 may transmit pump commands to the pump, for example, via a pump command signal. As used in this disclosure, “pump command signal” means a signal representing a pump command. As used in this disclosure, “pump command” means communication directed to any pump described herein. In some cases, pump commands may be used to affect the performance of the pump. In some embodiments, the controller 1212 may receive pump data from the pump connected to the fluid inlet 1204, for example, via a pump data signal. As used in this disclosure, “pump data signal” means a signal representing pump data. As used in this disclosure, “pump data” means information related to any pump described herein. In some cases, the pump data may represent the performance and / or operation of the pump.

[0140] Continuing to refer to Figure 12, the system 1200 may include a voltage regulator 1216 connected to a power supply 1220. As used herein, “voltage regulator” means a device that can adjust the voltage level and frequency of an electric current and convert the type of electric current. In some embodiments, the voltage regulator 1216 may include a rectifier. As used herein, “rectifier” means a device or component configured to convert alternating current (AC) to direct current (DC). In some embodiments, the voltage regulator 1216 may include an inverter. As used herein, “inverter” means a device or component configured to convert direct current (DC) to alternating current (AC). In one embodiment, the voltage regulator 1216 may include a boost converter. As used herein, “boost converter” means a device or component configured to increase the voltage level of an electric current. As used herein, “transformer” means a device configured to transfer electrical energy from one circuit to another through electromagnetic induction. In one embodiment, the voltage regulator 1216 is configured to receive electrical energy from the power supply 1220. As used herein, “power source” means any system, device, or means that supplies power, such as electricity, to a device, but is not limited to this. In embodiments, power source 1220 may include a generator. In embodiments, power source 1220 may include a power outlet connected to a power grid. In some embodiments, controller 1212 may be connected to a power source. In embodiments, a voltage regulator may be further configured to convert electrical energy. In some embodiments, converting electrical energy may include adjusting the voltage of the electrical energy. In further embodiments, converting electrical energy may include adjusting the voltage of the electrical energy to a range of 1210 volts to 220 volts. In some embodiments, voltage regulator 1216 may include a transformer. In some embodiments, voltage regulator 1216 may use a transformer to regulate the electrical energy. In embodiments, converting electrical energy may include changing the frequency of the voltage.In further embodiments, converting electrical energy may include changing the voltage frequency to 20 kilohertz (kHz). In some embodiments, converting electrical energy may include changing the voltage frequency to 30 kilohertz (kHz). In non-limiting examples, the voltage regulator 1216 may convert electrical energy by receiving AC electrical energy from the power supply 1220, and the voltage regulator 1216 may convert the AC electrical energy to DC electrical energy using a rectifier component. The voltage regulator 1216 may then increase the voltage to 220V using a boost converter component, and subsequently increase the frequency to 20kHz using an inverter component. In some embodiments, the voltage regulator 1216 may convert the AC electrical energy to pulsed DC electrical energy using a rectifier. In embodiments, the voltage regulator 1216 may convert the AC electrical energy to a multi-rate waveform using a rectifier in combination with a filter, amplifier, and / or digital signal processor. As used herein, “multirate waveform” refers to a type of signal sampled at multiple rates, each rate corresponding to a specific frequency range of interest. In embodiments, a multirate waveform may include multiple waveforms such as square waves, sawtooth waves, triangular waves, and similar types. As used herein, “square wave” refers to a periodic signal that alternates between binary values, such as 0 and 1. As used herein, “sawtooth wave” refers to a periodic signal having a linear rise and a sudden drop. As used herein, “triangular wave” refers to a periodic signal having a linear rise and a linear fall. In some embodiments, the voltage regulator 1216 may use an inverter to convert DC electrical energy to AC electrical energy. In some embodiments, the voltage regulator 1216 may use an inverter to convert pulsed DC electrical energy to AC electrical energy. In one embodiment, the voltage regulator 1216 may also perform AC-to-AC conversion. For example, an AC-to-AC converter may be used to convert an AC waveform having a particular frequency and amplitude to an AC waveform having a different frequency and amplitude.For example, an AC voltage controller may be a thyristor-based device that directly converts a fixed alternating voltage to a variable alternating voltage without changing the frequency. An AC voltage controller may be a phase-controlled device, and therefore a forced commutation circuit may not be required, and natural commutation or power supply commutation may be used. As will be apparent to those skilled in the art upon reading this disclosure, the components described herein are merely illustrative, and the voltage regulator 1216 may include many other components not described herein, and the components may be used in other orders not described herein.

[0141] Continuing with reference to Figure 12, in one embodiment, the system 1200 may include a core coil 1224 connected to a voltage regulator 1216. In some embodiments, the voltage regulator 1216 may include the core coil 1224. In one embodiment, the core coil 1224 may be configured to transmit electrical energy converted from the voltage regulator 1216. In other embodiments, the voltage regulator 1216 may be further configured to transmit converted electrical energy. As used herein, “core coil” refers to a type of inductor or magnetic component consisting of a wire coil wound around an iron or ferromagnetic core that resists changes in current passing through it. In some embodiments, the voltage regulator 1216 may include two or more coils of insulated wire wound around a common core. In non-limiting examples, the core coil 1224 may transmit electrical energy converted from the voltage regulator 1216.

[0142] Continuing with reference to Figure 12, in one embodiment, the system 1200 includes a crystalline compressor 1228. As used herein, “crystalline compressor” refers to a piezoelectric element used to generate pressure fluctuations or ultrasonic waves in a fluid. As used herein, “piezoelectric element” refers to a device that generates oscillating pressure waves or ultrasonic vibrations using piezoelectric material, such as certain types of crystals, which can change their shape and / or dimensions when a voltage is applied. In some embodiments, the crystalline compressor 1228 may be connected to an iron core coil 1224. In a non-limiting example, the iron core coil 1224 is used to connect a voltage regulator 1216 and the crystalline compressor 1228, and can maintain the characteristics of the converted electrical energy, such as set voltage and frequency, during transmission. In some embodiments, the crystalline compressor 1228 may be connected to a fluid inlet 1204. In some embodiments, the crystalline compressor 1228 may be connected to a voltage regulator 1216. In one embodiment, the crystalline compressor 1228 may be configured to receive the converted electrical energy from the iron core coil 1224. In one embodiment, the crystallographic compressor 1228 may receive electrical energy converted from the voltage regulator 1216. In an embodiment, the crystallographic compressor 1228 may receive fluid from the fluid inlet 1204. In some embodiments, the crystallographic compressor 1228 may be communicatively connected to a controller 1212. In some embodiments, the controller 1212 may be a piezo controller. The piezo controller may include the "Open-Loop Piezo Controller" manufactured by Thorlabs Inc., based in Newton, New Jersey, USA.

[0143] Continuing with reference to Figure 12, in one embodiment, the crystalline compressor 1228 generates steam 1232 depending on the converted electrical energy and fluid. In a non-limiting example, the crystalline compressor 1228 may generate steam 1232, such as water vapor, by applying ultrasonic vibrations to a fluid such as water. In some embodiments, the crystalline compressor discharges steam using a steam outlet 1236. As used herein, “steam outlet” refers to an outlet point from which steam is discharged. In a non-limiting example, the steam outlet 12 may include a fog nozzle configured to discharge steam. In some embodiments, a steam injection system 1200 may be connected to a plasma reactor. In some embodiments, the steam injection system 1200 may be further configured to discharge steam into a plasma reactor. As used in this disclosure, “plasma reactor” refers to a device configured to generate, maintain, and / or control plasma. For the purposes of this disclosure, “plasma” refers to a fourth state of matter, in addition to solid, liquid, and gas. Plasma can include a partially ionized gas consisting of a mixture of ions, electrons, and / or neutral particles (i.e., atoms and molecules). In one embodiment, plasma can be formed when vapor is exposed to a high-energy source, such as heat, radiation, or an electric field, and is ionized by atoms or molecules in the vapor losing or gaining electrons. In an embodiment, vapor may be introduced into a plasma reactor using a vapor injection system 1200. In some embodiments, the plasma may include non-thermal plasma (NTP), a type of plasma in which the electron temperature is significantly higher than that of the heavier ions and neutral particles. In this case, the electrons in the plasma have high kinetic energy, while the overall temperature of the vapor may remain relatively low (e.g., often around room temperature, 20-22°C / 68-72°F). In addition, or alternatively, the energy distribution between particles in a non-thermal plasma may not be in thermal equilibrium. This may be due to the fact that electrons are much lighter than ions and neutral particles, and therefore gain energy more rapidly when exposed to an electric or magnetic field, resulting in a higher electron temperature.On the other hand, heavier ions and neutral particles move more slowly and remain at lower temperatures, which can result in lower vapor temperatures.

[0144] Referring now to Figure 13, which is a diagram of an exemplary embodiment of the plasma reactor housing assembly 1300. The plasma reactor housing assembly 1300 may include a housing 1304. In another embodiment, the housing 1304 may be a separate housing configured to house only the plasma reactor. In a non-limiting example, the plasma reactor housing assembly 1300 may be a double housing, and the housing 1304 may be located in another layer of housing 1304. In some cases, the housing 1304 may be injection molded using an injection mold. As used in this disclosure, “injection mold” refers to a manufacturing tool for producing a plastic part. Manufacturing the housing 1304 may involve using an injection molding process, which may involve using an injection mold configured to produce a specific shape and features of the housing 1304. In some embodiments, the injection mold may include two half-molds clamped together, each having one or more cavities between them, which may define the shape of the housing 1304. In some cases, but not limited to, a material such as molten plastic may be injected into the injection mold under high pressure to fill the space and take on the shape of the injection mold. The injection molding process may include a cooling process configured to cool and / or solidify the injected material. The injection mold can then be opened and the finished housing 1304 can be removed. In some embodiments, the injection mold may be precisely machined to the desired shape and size of the housing 1304. In non-limiting examples, the housing 1304 may include a hollow cylinder.

[0145] Continuing to refer to Figure 13, in some embodiments, one or more continuous conductors 1308a-b may pass through the housing 1304, with one end electrically connected to at least one electrode 1312. As used herein, “electrode” means a conductor used to establish electrical contact with a conductive medium, and / or a medium that can become conductive by being given a sufficient voltage difference, such as the vapor described above. In embodiments, at least one electrode 1312 may include one or more electrodes 1312. In embodiments, one or more electrodes 1312 may be configured to generate an electrical discharge in response to vapor 1232. As used in this disclosure, “electrical discharge” means the phenomenon in which an electric current flows between two or more conductive surfaces (i.e., at least one pair of electrodes 1312) via vapor 1232, causing ionization and subsequently the release of energy in the form of light, heat, or sound. In embodiments, the other end of the continuous conductors 1308a-b may be connected to an ignition unit or a grounding connection. In some embodiments, one or more insulators 1316a-b may be used where the continuous conductors 1308a-b pass through the housing 1304. For the purposes of this disclosure, “insulator” means a material that does not readily conduct heat, electricity, or sound. In non-limiting examples, insulators 1316a-b may include electrical insulators, where an electrical insulator means a material having high electrical resistivity. Electrical insulators do not readily conduct electric current, thereby preventing the flow of electricity between other components and the plasma reactor, reducing the risk of short circuits, electric shock, interference, and the like. Exemplary electrical insulators may include plastics, ceramics, glass, rubber, and the like.

[0146] Continuing to refer to Figure 13, each electrode of at least one pair of electrodes 1312 may have a pitch angle 1320. In a non-limiting example, at least one electrode 1312 may have a pitch angle 1320 of 6 degrees (i.e., the angle between the pair of electrodes 1312 is 12 degrees). As used in this disclosure, the “pitch angle” of an electrode refers to the angle between the longitudinal axis of the electrode and a reference plane or reference axis within the plasma reactor. In some cases, the pitch angle 1320 may affect the properties of the plasma generated between the electrodes 1312 within the reaction region of the plasma reactor. This includes, but is not limited to, the electric field distribution, the efficiency of the electrical discharge process, and interactions with active species in the plasma (e.g., ROS, RNS, and similar).

[0147] Continuing to refer to Figure 13, the steam injection system 1200 may be connected to the plasma reactor in the plasma reactor housing assembly 1300 via an injector mounting flange 1324. As used in this disclosure, “injector mounting flange” refers to a mechanical component used to securely and leaklessly fasten the steam injection system 1200 to the housing 1304. In a non-limiting example, the injector mounting flange 1324 may include an interface 1328 between the steam injection 1200 and the plasma reactor. In some cases, the steam outlet 123 of the steam injection system 1200 may include a threaded adapter. Both the steam outlet 123 and the interface 1328 may include threaded portions. For example, but not limited to, the steam outlet 123 / interface 1328 may include a male threaded portion / female threaded portion, where the male and female threaded portions are compatible (i.e., matched). The steam injection system 1200 can be screwed into the injector mounting flange 1324 via a steam outlet 1236 equipped with a threaded adapter at interface 1328.

[0148] Referring next to Figure 14, an exemplary embodiment of apparatus 1400 with an internally mounted steam injection system 1200 is shown. Apparatus 1400 may include an internal injection system, such as the steam injection system 1200, which is located inside apparatus 1400. As used in this disclosure, “internal injection system” means an injection system installed inside apparatus 1400. The injection system may be any injection system described in this disclosure. In some embodiments, the internal injection system may be designed to deliver steam 1232 from a fluid reservoir 1208 into a plasma reactor 1512.

[0149] Continuing to refer to Figure 14, an apparatus 1400 for processing the growth medium 104 via electrical discharge. The apparatus 1400 may include the growth medium 1404 in a processing chamber 1408. The apparatus 1400 may include a plasma reactor 1412. The plasma reactor 1412 may include at least a pair of electrodes 1416a-b. The first electrode 1416a may include an anode electrically connected to an ignition unit, and the second electrode 1416b may include a cathode electrically connected to ground 1420. The plasma reactor 1412 may include a reaction region 1424 positioned between the first electrode 1416a and the second electrode 1416b. The apparatus 1400 may include an ignition unit 1428 electrically connected to at least one of the pair of electrodes 1416a-b. The apparatus 1400 may further include a condenser 1432 located in a reaction region 1424 above the processing chamber 1408.

[0150] Referring next to Figure 15, an exemplary embodiment of the apparatus 1500 with an internally mounted steam injection system 1200 is presented. The apparatus 1500 may include an external injection system, such as the steam injection system 1200, located outside the apparatus 1500. As used in this disclosure, “externally mounted injection system” means an injection system that is located outside the apparatus 1500, rather than being integrated into the apparatus 1500 as described above with reference to Figure 14. The injection system may be any injection system described in this disclosure. The apparatus 1500 may include a growth medium 1504 in a processing chamber 1508. The apparatus 1500 may include a plasma reactor 1512. The plasma reactor 1512 may include at least a pair of electrodes 1516a and 1516b. The first electrode 1516a may include an anode electrically connected to an ignition unit, and the second electrode 1516b may include a cathode electrically connected to ground 1520. The plasma reactor 1512 may include a reaction region 1524 located between a first electrode 1516a and a second electrode 1516b. The apparatus 1500 includes an ignition unit 1528 electrically connected to at least one of the pair of electrodes 1516a-b. The apparatus 1500 may further include a condenser 1532 located within the reaction region 1524 above the processing chamber 1508.

[0151] Referring now to Figure 16, an exemplary block diagram 1600 of a crystalline compressor 1228 is presented. In this exemplary embodiment, the crystalline compressor 1228 includes a crystal 1604. In this exemplary embodiment, the crystalline compressor 1228 includes a compression chamber 1608. As used herein, “compression chamber” refers to a sealed component capable of withstanding high levels of pressure. In embodiments, the compression chamber may receive a fluid 1612. In embodiments, the compression chamber 1608 may be in fluid communication with a fluid inlet 1204. In one embodiment, the crystal 1604 may be activated by converted electrical energy 1616. In one embodiment, the crystalline compressor 1228 may receive converted electrical energy 1616 from an iron core coil 1224. In embodiments, the crystalline compressor 1228 may receive converted electrical energy 1616 directly from a voltage regulator 1216. In non-limiting examples, the crystal 1604 may be activated by converted electrical energy 1616, which, upon activation, generates ultrasonic pressure, causing the fluid 1612 to change its state from liquid to vapor 1232 depending on the pressure generated by the crystal. In some embodiments, the pressure level generated by the crystal 1604 may be controlled via a controller 1212. In some embodiments, the vapor 1232 may exit the compression chamber 1608 through a vapor outlet 1236. As will be apparent to those skilled in the art upon reading this disclosure, the crystalline compressor 1228 is described as an example, and the crystalline compressor 1228 may include many embodiments of the crystalline compressor 1228 not described herein.

[0152] Continuing to refer to Figure 16, in some embodiments, system 1200 may be a piezoelectric steam injector. As used in this disclosure, “piezoelectric steam injector” refers to a type of injector, such as steam injection system 1200, that utilizes piezoelectric technology to generate steam by atomizing at least one liquid (i.e., a second fluid) into tiny droplets, as described above. As used herein, “steam” refers to the gaseous phase of water (i.e., the second fluid), which occurs when water molecules escape from their liquid state and gain enough energy to disperse into the surrounding air (i.e., the first fluid). As used herein, “piezoelectric technology” refers to technology based on the piezoelectric effect. The piezoelectric effect refers to the phenomenon in which certain materials generate an electric charge when subjected to mechanical stress, or vice versa (i.e., undergo mechanical deformation when exposed to an electric field). In some cases, materials such as ceramics (e.g., lead zirconate titanate), quartz crystals, polymers, and the like may exhibit such an effect. The crystalline compressor 1228 may include a piezoelectric element. For example, but not limited to, a ceramic disc or plate may be used to generate mechanical vibrations at a specific frequency when a voltage is applied by the power supply 1220. The power supply 1220 may include any of the power supplies described above, such as a DC power supply. The mechanical vibrations may be transmitted to the fluid introduced from the fluid inlet 1204, thereby breaking down at least one fluid into fine droplets of mist, which are then evaporated to form water vapor.

[0153] Referring now to Figure 17, a flow diagram of an exemplary embodiment of method 1700 using the steam injection system 1200 is presented. Method 1700 includes receiving fluid from the fluid reservoir 1208 by fluid inlet 1204 in step 1705. In some embodiments, receiving the fluid includes using at least one pump. In some embodiments, at least one pump connected to the fluid inlet 1204 may be communicatively connected to a controller 1212. This may be implemented as described herein, but is not limited to this.

[0154] Continuing with reference to Figure 17, method 1700 includes, in step 1710, receiving electrical energy from the power supply 1220 by a voltage regulator 1216. In some embodiments, the voltage regulator 1216 may be communicatively connected to a controller 1212. In non-limiting examples, the controller 1212 may be used to regulate the amount of electrical energy received from the power supply 1220. This may be implemented as described herein, but is not limited to this.

[0155] Continuing to refer to Figure 17, in step 1715, method 1700 includes converting electrical energy. In embodiments, converting electrical energy may include adjusting the voltage of the electrical energy. In further embodiments, adjusting the voltage may include adjusting the voltage to a range of 1210 volts to 220 volts. In some embodiments, converting electrical energy may include changing the frequency of the voltage. In further embodiments, changing the frequency may include changing the frequency to 20 kHz. In some embodiments, changing the frequency may include changing the frequency to 30 kHz. In some embodiments, the voltage and / or frequency to be adjusted or modified may be set by controller 1212. This may be carried out as described herein, but is not limited to.

[0156] Continuing with reference to Figure 17, Method 1700 may include the transmission of the converted electrical energy by the iron core coil 1224. In some embodiments, Method 1700 may further include the transmission of the converted electrical energy by the iron core coil 1224 to a crystalline compressor 1228. In some embodiments, Method 1700 may include the direct transmission of the converted electrical energy from a voltage regulator 1216 to the crystalline compressor 1228. In one embodiment, the voltage regulator 1216 may include the iron core coil 1224. In some embodiments, Method 1700 may include the transmission of the converted electrical energy by the voltage regulator 1216. This can be implemented as described herein, but is not limited to these embodiments.

[0157] Continuing to refer to Figure 17, in step 1720, method 1700 includes generating steam 1232 by a crystalline compressor 1228 depending on the converted electrical energy and fluid. In embodiments, generating steam 1232 may further include using a controller 1212. In some embodiments, the amount of fluid and / or modified electrical energy used may be set by the controller 1212. In some embodiments, this may be carried out without limitation as described herein.

[0158] Continuing to refer to Figure 17, Method 1700 includes, in step 1725, discharging the steam 1232 using the steam outlet 1236. In some embodiments, Method 1700 may further include discharging the steam 1232 into a plasma reactor using the steam outlet 1236. This can be carried out as described herein, but is not limited to this.

[0159] Broadly speaking, aspects of the present disclosure relate to low-pressure injection systems for multiple fluids and methods for using the same. In one embodiment, the system includes at least one injector configured to disperse a mixture of a first fluid and a second fluid. Aspects of the present disclosure may be used to generate microfluidic droplets, thereby allowing the second fluid to be ionized and migrate into the generated microfluidic droplets. Exemplary embodiments illustrating aspects of the present disclosure are described below in the context of several specific examples.

[0160] Referring next to Figure 18, an exemplary embodiment of a pressure injection system 1800 for multiple fluids is shown. In one embodiment, the low-pressure injection system 1800 for multiple fluids includes at least one first fluid inlet 1804. The at least one first fluid inlet 1804 may be connected to communicate with a first fluid reservoir 1808. As used in this disclosure, “first fluid inlet” means an inlet point from which at least a first fluid 1812 can be injected into the pressure injection system before use in the manner described herein. In one embodiment, the at least one first fluid inlet 1804 may be configured to receive the first fluid 1812 from the first fluid reservoir 1808. As used in this disclosure, “reservoir” means, for example, a storage system for fluids. In some cases, the first fluid reservoir 1808 may include multiple reservoirs. In some cases, the first fluid reservoir 1808 may be sealed to substantially prevent leakage of the fluid stored in the first fluid reservoir. In some cases, the first fluid reservoir 1808 may be permeable to allow some fluid, such as air, to freely pass in and out of the first fluid reservoir 1808, but not limited to this. Alternatively, the first fluid reservoir 1808 may be completely sealed. In some cases, the first fluid reservoir 1808 may include a storage reservoir. In some cases, the first fluid reservoir 1808 may include a pressure reservoir that provides a pressure difference between the inside and outside of the reservoir. In some cases, the first fluid reservoir 1808 may be insulated, for example, to prevent electrical and / or thermal transfer between the inside and outside of the reservoir. Where used in this disclosure, and continuing with reference to Figure 18, “fluid” means a flowable gaseous or liquid material, including, but not limited to, water, nitrogen, oxygen, and / or other gases and / or liquids.

[0161] Continuing to refer to Figure 18, the first fluid reservoir 1808 may provide a constant and controlled supply of the first fluid 1812 for use in the pressure injection system 1800, as will be further detailed below. In one embodiment, the first fluid 1812 may include liquids, and for example, but not limited to, at least one fluid may include water, organic solvents, electrolyte solutions, and the like. Continuing to refer to Figure 18, the first fluid reservoir 1808 may be constructed from a material compatible with the first fluid 1812 stored therein. For example, but not limited to, the first fluid reservoir 1808 may be made from any material such as corrosion-resistant metal, plastic, and / or glass. In some cases, the first fluid reservoir 1808 may be appropriately sized to provide a suitable supply of the first fluid 1812 without frequent replenishment or interruption. The first fluid reservoir 1808 may include at least one inlet, at least one outlet, or both. In a non-limiting example, at least one inlet may be used to fill the first fluid reservoir 1808 with the first fluid 1812, and at least one outlet may be connected to the first fluid line 1816 or any other fluid delivery component of the 1800 as described herein. The first fluid 1812 may be introduced into the first fluid reservoir 1808 via at least one inlet and / or discharged to the pressure injection system 1800 via at least one outlet. If the 1800 has a plurality of first fluid reservoirs 1808, each of the plurality of reservoirs may include at least one inlet and at least one outlet. In a non-limiting example, a first reservoir configured to contain a first fluid may include a first inlet and a first outlet, and a second reservoir configured to contain a first fluid may include a second inlet and a second outlet, where the first inlet / first outlet never intersects with the second inlet / second outlet. In such an embodiment, the first fluid 1812 is not discharged from the second first fluid reservoir 1808 through the second outlet until the first first fluid reservoir 1808 is empty.

[0162] Referring further to Figure 18, the first fluid line 1816 may be configured to provide fluid communication between the first fluid reservoir 1808 and at least one first fluid inlet 1804. For the purposes of this disclosure, “fluid communication” means a path or link that enables the transfer of at least one fluid. In a non-limiting example, the fluid connection between the first fluid reservoir 1808 and at least one first fluid inlet 1804 may be established using the first fluid line 1816. In one exemplary embodiment, the first fluid line 1816 may be a variety of components, including but not limited to tubes, pipes, hoses, channels, and the like, for forming a continuous path for the flow of at least one fluid. In one embodiment, at least one first fluid inlet 1804 may be hydraulically connected to the first fluid reservoir 1808. In some cases, the first fluid line may include a first pump 1820. In one embodiment, the first pump 1820 may be configured to pump the first fluid 1812 in one direction to a pressure injection system. In some cases, the first pump 1820 may include a plurality of pumps and / or several valves. In one embodiment, the several valves may include at least one check valve. As used in this disclosure, “check valve” means a one-way valve / check valve that opens with the movement and pressure of the fluid and closes to prevent backflow of the fluid and / or pressure. In exemplary embodiments, the check valve may be a ball check valve, a swing check valve, an inclined disc check valve, and one of the same kind. In some cases, the first pump 1820 and / or the first fluid line 1816 may include a fluid circuit configured to direct the first fluid into the pressure injection system 1800. In one embodiment, the fluid circuit may be connected to a controller 1824, such as any computing device shown in Figure 29, and is configured to control the flow of a first fluid 1812 to at least one first fluid inlet 1804 and / or a low-pressure injection system 1800.

[0163] Continuing to refer to Figure 18, the controller 1824 may include any computing device described in this disclosure, including but not limited to microcontrollers, microprocessors, digital signal processors (DSPs), and / or system-on-a-chip (SoCs) described herein. A computing device may include, be contained in, and / or communicate with a mobile device such as a mobile phone or smartphone. The controller 1824 may include a single computing device operating independently, or two or more computing devices operating in coordination, in parallel, sequentially, or similar manner. Two or more computing devices may be contained together within a single computing device, or within two or more computing devices. The controller 1824 may interface with or communicate with one or more additional devices, as further detailed below in this disclosure, via a network interface device. The network interface device may be used to connect the controller 1824 to one or more networks and one or more devices. Examples of network interface devices include, but are not limited to, network interface cards (e.g., mobile network interface cards, LAN cards), modems, and any combination thereof. Examples of networks include, but are not limited to, wide area networks (e.g., the Internet, enterprise networks), local area networks (e.g., networks associated with offices, buildings, campuses, or other relatively small geographical spaces), telephone networks, data networks associated with telephone / voice providers (e.g., data and / or voice networks of mobile communications providers), direct connections between two computing devices, and any combination thereof. Networks may employ wired and / or wireless communication modes. In general, any network topology can be used.Information (e.g., data, software, etc.) may be communicated to and from computers and / or computing devices. Controller 1824 may include, but is not limited to, a computing device or cluster of computing devices at a first location and a second computing device or cluster of computing devices at a second location. Controller 1824 may include one or more computing devices dedicated to data storage, security, traffic distribution for load balancing, and the like. Controller 1824 may distribute one or more computing tasks across multiple computing devices of the computing device, as described below, and the multiple computing devices may operate in parallel, serial, redundantly, or in any other manner used for task or memory distribution between computing devices. Controller 1824 may be implemented using a “shared nothing” architecture in which data is cached on workers, which in one embodiment may enable scalability of system 1800 and / or computing devices.

[0164] Continuing to refer to Figure 18, the controller 1824 may be designed and / or configured to execute any method, method step, or series of method steps in any order and to any degree in any embodiment of the present disclosure. For example, the controller 1824 may be configured to repeatedly execute a single step or sequence until a desired or instructed result is achieved. The repetition of a step or series of steps may be performed iteratively and / or recursively, using the output of a preceding iteration as the input to a subsequent iteration, which may involve aggregating the inputs and / or outputs of the iterations to produce an aggregated result, decreasing or subtracting one or more variables such as global variables, and / or dividing a larger processing task into a set of smaller processing tasks that are processed iteratively. The controller 1824 may execute any step or series of steps described in the present disclosure in parallel, for example, executing a step two or more times using two or more parallel threads, processor cores and the like, simultaneously and / or substantially simultaneously. Task division between parallel threads and / or processes may be performed according to any protocol suitable for task division between iterations. Those skilled in the art will, by examining the entirety of this disclosure, recognize various ways of handling steps, sets of steps, processing tasks, and / or data using iteration, recursion, and / or parallel processing, including subdividing, sharing, or otherwise handling them.

[0165] Continuing to refer to Figure 18, the controller 1824 may communicate with the first pump 1820. For example, the controller 1824 may, in some cases, send pump commands to at least one of the first pumps 1820, for example, via pump command signals. As used in this disclosure, “pump command signal” means a signal representing a pump command. As used in this disclosure, “pump command” means communication directed to any pump described herein. In some cases, pump commands may be used to affect the performance of the first pump 1820. In some embodiments, the controller 1824 may receive pump data from the first pump 1820, for example, via pump data signals. As used in this disclosure, “pump data signal” means a signal representing pump data. As used in this disclosure, “pump data” means information related to any pump described herein. In some cases, the pump data may represent the performance and / or operation of the first pump 1820.

[0166] Referring further to Figure 18, the pressure injection system 1800 for multiple fluids includes at least one second fluid inlet 1828. The at least one second fluid inlet 1828 may be connected to communicate with a second fluid reservoir 1832. As used herein, “second fluid inlet” means an inlet point from which at least one second fluid 1836 can be injected into the pressure injection system before use in the manner described herein. In one embodiment, the at least one second fluid inlet 1828 may be configured to receive the second fluid 1836 from the second fluid reservoir 1832. The second fluid reservoir 1832 may be any reservoir described herein. In some cases, the second fluid reservoir 1832 may include multiple reservoirs. For example, the second fluid reservoir 1832 may be sealed to substantially prevent leakage of the fluid stored in the second fluid reservoir. In some cases, the second fluid reservoir 1832 may be permeable to allow some fluid, such as air, to freely pass in and out of the second fluid reservoir 1832. Alternatively, the second fluid reservoir 1832 may be completely sealed. In some cases, the second fluid reservoir 1832 may include a storage reservoir. In some cases, the second fluid reservoir 1832 may include a pressure reservoir that provides a pressure difference between the inside and outside of the reservoir. In some cases, the second fluid reservoir 1832 may be insulated, for example, to prevent electrical and / or thermal transfer between the inside and outside of the reservoir.

[0167] Continuing to refer to Figure 18, the second fluid reservoir 1832 may provide a constant and controlled supply of the second fluid 1836 for use in the pressure injection system 1800, as will be further detailed below. In one embodiment, the second fluid 1836 may include gases, and for example, but not limited to, oxygen gas, nitrogen gas, and similar substances. Continuing to refer to Figure 18, the second fluid reservoir 1832 may be constructed from a material compatible with the second fluid 1836 stored within it. For example, but not limited to, the second fluid reservoir 1832 may be made from materials such as corrosion-resistant metals, plastics, and / or glass. In some cases, the second fluid reservoir 1832 may be appropriately sized to provide a suitable supply of the second fluid 1836 without frequent replenishment or interruptions. The second fluid reservoir 1832 may include at least one inlet, at least one outlet, or both. In a non-limiting example, at least one inlet may be used to fill the second fluid reservoir 1832 with the second fluid 1836, and at least one outlet may be connected to the second fluid line 1840 or any other fluid delivery component of the 1800 as described herein. The second fluid 1836 may be introduced into the second fluid reservoir 1832 via at least one inlet and / or discharged to the pressure injection system 1800 via at least one outlet. If the 1800 has a plurality of second fluid reservoirs 1832, each of the plurality of reservoirs may include at least one inlet and at least one outlet. In a non-limiting example, a first reservoir configured to contain a second fluid may include a first inlet and a first outlet, and a second reservoir configured to contain a second fluid may include a second inlet and a second outlet, where the first inlet / first outlet never intersects with the second inlet / second outlet. In such an embodiment, the second fluid 1836 is not discharged from the second second fluid reservoir 1832 through the second outlet until the first second fluid reservoir 1832 is empty.Furthermore, in one exemplary embodiment, the pressure injection system 1800 includes a first fluid reservoir 1808 configured to contain a first fluid and possibly including a first inlet and a first outlet, and a second fluid reservoir 1832 configured to contain a second fluid and possibly including a second inlet and a second outlet, wherein the first inlet or first outlet never intersects with the second inlet or second outlet. In such an embodiment, the first fluid and the second fluid cannot come into contact with each other before being discharged into the pressure injection system 1800.

[0168] Referring further to Figure 18, the second fluid line 1840 may be configured to provide fluid communication between the second fluid reservoir 1832 and at least one second fluid inlet 1828. For the purposes of this disclosure, “fluid communication” means a path or link that enables the transfer of at least one fluid. In a non-limiting example, the fluid connection between the second fluid reservoir 1832 and at least one second fluid inlet 1828 may be established using the second fluid line 1840. In one exemplary embodiment, the second fluid line 1840 may be a variety of components, including but not limited to tubes, pipes, hoses, channels, and the like, for forming a continuous path for the flow of at least one fluid. In one embodiment, at least one second fluid inlet 1828 may be pneumatically connected to the second fluid reservoir 1832. In some cases, the second fluid line 1840 may include a second pump 1844. In one embodiment, a second pump 1844 may be configured to pump a second fluid 1836 in one direction to a pressure injection system 1800. In some cases, the second pump 1844 may include a plurality of pumps and / or several second valves. In one embodiment, the several second valves may include at least one second check valve. The second check valve may be any check valve described herein. In some cases, the second pump 1844 and / or the second fluid line 1840 may include a fluid circuit configured to direct the first fluid into the pressure injection system 1800. In one embodiment, the fluid circuit may be connected to a controller 1824, such as any computing device described in Figure 6 and herein, which is configured to control at least one second fluid inlet 1828 and the flow of the second fluid 1836 to the pressure injection system 1800.

[0169] Continuing to refer to Figure 18, the controller 1824 may communicate with the second pump 1844. For example, the controller 1824 may, in some cases, transmit pump commands to the second pump 1844, for example, via a pump command signal. The pump command signal may be any pump command signal described herein. The pump command may be any pump command described herein. In some cases, the pump command may be used to influence the performance of the second pump 1844. In some embodiments, the controller 1824 may receive pump data from the second pump 1844, for example, via a pump data signal. The pump data signal and pump data may be any pump data described herein. In some cases, the pump data may represent the performance and / or operation of the second pump 1844.

[0170] As shown subsequently in Figure 18, the system 1800 includes a low-pressure compressor 1848 configured to provide pressure to a second fluid received from a second fluid reservoir. The pressure compressor 1848 may include a pneumatic compression device. In some embodiments, the pressure compressor 1848 may include a hydraulic, pneumatic, or other compressor. Furthermore, the pressure compressor 1848 may be a piston compressor, a diaphragm compressor, a helical screw compressor, a sliding vane compressor, a scroll compressor, a rotary lobe compressor, a centrifugal compressor, and the like. The pressure compressor 1848 may be configured to apply pressure to the system 1800, the second fluid 1836, and / or at least one injector 1856. In some embodiments, the pressure compressor 1848 may be configured to apply pressure between about 2 bar and about 7 bar. In some embodiments, the pressure compressor 1848 may be automated. The pressure compressor 1848 may be automated to apply pressure to 18 for a set period of time. In some embodiments, the pressure compressor 1848 may be configured to gradually apply increasing pressure to the system 1800. In other embodiments, the pressure compressor 1848 may be automated to apply a constant pressure to the system 1800. As a non-limiting example, the pressure compressor 1848 may be driven by direct current (DC) power. As used in this disclosure, “direct current” refers to a unidirectional flow of current. In some embodiments, the pressure compressor 1848 may be driven by power having a changing or reversing voltage level, such as alternating current (AC) power generated by an AC generator and / or inverter, or otherwise changing power, such as power generated by a switching power supply. In some embodiments, the system 1800 may include a high-pressure compressor configured to provide pressure to a second fluid received from a second fluid reservoir. The high-pressure compressor may include dynamic compressors such as rotary screw compressors, reciprocating air compressors, or centrifugal compressors, and similar types. For example, a dynamic air compressor can generate power by drawing in air with rapidly rotating blades, restricting the air to create pressure, and storing the kinetic energy as static pressure within the compressor.High pressure can include compressions exceeding 150 PSI and may range from 1000 PSI to 6000 PSI. In some embodiments, the high-pressure compressor may be automated. In a non-limiting example, the high-pressure compressor may be driven by direct current (DC) power. As used in this disclosure, “direct current” refers to a unidirectional flow of current. In some embodiments, the high-pressure compressor may be driven by power having a changing or reversing voltage level, such as alternating current (AC) power generated by an AC generator and / or inverter, or otherwise changing power, such as power generated by a switching power supply.

[0171] As shown subsequently in Figure 18, the controller 1824 may communicate with the pressure compressor 1848. For example, the controller 1824 may, in some cases, send compressor commands to the pressure compressor 1848, for example, via compressor command signals. As used in this disclosure, “compressor command signals” means signals representing compressor commands. As used in this disclosure, “compressor commands” means communications directed to any compressor described herein. In some cases, compressor commands may be used to affect the performance of the pressure compressor 1848. In some cases, the controller 1824 may receive compressor data from the pressure compressor 1848, for example, via compressor data signals. As used in this disclosure, “compressor data signals” means signals representing compressor data. As used in this disclosure, “compressor data” means information related to any compressor described herein. In some cases, pump data may represent the performance and / or operation of the pressure compressor 1848.

[0172] Referring further to Figure 18, the system 1800 may include a combination reservoir 1852. The combination reservoir 1852 may be configured to receive a first fluid 1812 from at least one first fluid inlet 1804 and a second fluid 1836 from at least one second fluid inlet 1828. The at least one first fluid inlet 1804 and the at least one second fluid inlet 1828 may be used to fill the combination reservoir 1852 with the first fluid 1812 and the second fluid 1836, respectively. Furthermore, the combination reservoir 1852 may be configured to combine the first fluid 1812 and the second fluid 1836 to form a combination of the first fluid 1812 and the second fluid 1836. In embodiments, combining the first fluid 1812 and the second fluid 1836 may include generating droplets of the first fluid 1812. As used in this disclosure, “droplet” refers to a small, spherical liquid particle. In non-limiting examples, the combination reservoir 1852 may generate droplets by different mechanisms, including, but not limited to, pressure-driven atomization, ultrasonic atomization, electrostatic atomization, and the like. The combination reservoir 1852 may be constructed from a material compatible with the first fluid 1812 and the second fluid 1836 to be combined. For example, but not limited to, the first fluid reservoir 1808 may be made from any material such as corrosion-resistant metal, plastic, and / or glass.

[0173] Continuing to refer to Figure 18, the system 1800 includes at least one injector 1856 configured to distribute a combination of a first fluid and a second fluid. As used in this disclosure, “injector” means a component designed to distribute at least one fluid to at least one of several applications. In non-limiting examples, the system 1800 and at least one injector 1856 may be configured for use in industrial, agricultural, and similar applications. For example, the system 1800 and at least one injector 1856 may be configured for use in painting or surface coating of various articles, supplying waste oil to furnaces for heating, or supplying waste oil to plasma reactors, humidity control in greenhouses, odor control, and chemical engineering, and similar applications. Those skilled in the art will recognize the various applications to which the system 1800 and at least one injector 1856 may be configured.

[0174] Referring further to Figure 18, at least one injector 1856 may include at least one inlet 1860 of a first fluid injector. As used in this disclosure, “inlet of a first fluid injector” means an inlet point where at least a first fluid can be additionally injected into at least one injector 1856 before being discharged by at least one injector 1856 in the manner described herein. In a non-limiting example, the inlet 1860 of at least one first fluid injector may be connected to the outlet of at least one first reservoir 1808 as described above. In some cases, the inlet 1860 of at least one first fluid injector may be designed to provide a secure, leak-free connection to at least one first reservoir 1808. For example, but not limited to, at least one inlet 1860 of a first fluid injector may be sealed using one or more sealing elements such as O-rings, gaskets, thread sealants and the like, thereby ensuring a tight seal and / or preventing leakage or contamination.

[0175] Continuing to refer to Figure 18, at least one injector 1856 may include at least one inlet 1864 for a second fluid injector. As used in this disclosure, “inlet for a second fluid injector” means an inlet point where at least a second fluid can be additionally injected into at least one injector 1856 before being discharged by at least one injector 1856 in the manner described herein. In a non-limiting example, the inlet 1864 for at least one second fluid injector may be connected to the outlet of at least one second reservoir 1832 as described above. In some cases, the inlet 1864 for at least one second fluid injector may be designed to provide a secure, leak-free connection to at least one first reservoir 1808. For example, but not limited to, at least one inlet 1864 of a second fluid injector may be sealed using one or more sealing elements such as O-rings, gaskets, thread sealants and the like, thereby ensuring a tight seal and / or preventing leakage or contamination.

[0176] Continuing to refer to Figure 18, at least one injector 1856 may include at least one fluid outlet 1868. As used in this disclosure, “fluid outlet” means an outlet point from which at least one fluid is discharged from at least one injector 1856. In some cases, at least one fluid outlet 1868 may be configured to allow at least one fluid to be discharged to an intended location outside the low-pressure injection system 1800. For example, but not limited to, at least one fluid outlet 188 may be positioned adjacent to a surface for painting and / or surface coating. In some cases, at least one fluid outlet 1868 may be configured to disperse the fluid in an optimal flow pattern and in a dispersion of at least one fluid. In addition, or alternatively, at least one injector 1856 and / or at least one fluid outlet 188 may be configured to disperse a combination of first fluids in one of a plurality of first fluid spray volumes. In such embodiments, the plurality of first fluid spray volumes may include 4 to 25 liters per minute. In addition, or alternatively, at least one injector 1856 and / or at least one fluid outlet 188 may be configured to disperse the second fluid of the combination into one of a plurality of second fluid spray volumes. In such embodiments, the plurality of second fluid spray volumes may include flow rates from 4 liters to 25 liters per minute. Furthermore, or alternatively, at least one injector 1856 and / or at least one fluid outlet 1868 may be configured to disperse the combination in one of a plurality of spray patterns, which are described in more detail in Figure 19. In such embodiments, the plurality of spray patterns include broad cone shapes, narrow cone shapes, and the like. In a non-limiting example, at least one fluid outlet 188 may include a nozzle (i.e., an opening of a special shape) designed to produce a directional, high-speed flow of at least one fluid, thereby improving mixing and dispersion within the reaction region. Such nozzles may include, but are not limited to, swirl nozzles, fan spray nozzles, impact jet nozzles, porous nozzles, atomizing nozzles, and the like.For example, a nozzle may include an orifice opening into a chamber into which the liquid to be sprayed is supplied under pressure. Then, depending on the edge profile of the orifice and the design of the internal pressurized chamber, a spray with a spray pattern, flow rate, and spray angle can be generated through the orifice, and furthermore, there are various spray patterns that can be generated by the nozzle, such as flat fan patterns, hollow cone patterns, perfect cone patterns, solid stream patterns, mist / fog patterns, and the like. For example, in a flat fan spray pattern, the liquid is formed into a fan-shaped sheet of fluid. This can consist of droplets or a waterfall-like sheet of water. A flat fan can have a spray angle of 15 to 145 degrees depending on the nozzle design. The fan can be formed by a simple-shaped orifice or by deflecting the spray on a formed deflection surface. As a further example, in a perfect cone pattern, the liquid is broken down into droplets that are more or less uniformly concentrated within a cone of the generated spray. In this case as well, the cone can vary between 30 and 170 degrees depending on the nozzle design. A perfect cone can be formed by axial and tangential whirl nozzles, as well as helical nozzles. For example, a solid flow pattern may include a simple jet of focused fluid that does not have true droplets. A solid flow can be formed by forcing fluid through a molded orifice, which concentrates the spray into a jet. As another example, a mist / fog pattern produces a uniform mist or fog with little to no impact. The pattern may start as a perfect cone or a hollow cone, but at a very short distance from the nozzle orifice, the pattern loses coherence and forms a mist or fog. Many hollow cone nozzles and perfect cone nozzles can eventually form a mist if sprayed at sufficient pressure.

[0177] In addition, or alternatively, continuing with reference to Figure 18, at least one injector 1856 may include one or more valves configured to monitor, control, or otherwise regulate the flow of at least one fluid. As used in this disclosure, “valve” means a component that controls fluid communication between two or more components (e.g., between a combination reservoir 1852 and at least one injector 1856). Exemplary, non-limiting valves include directional valves, control valves, selection valves, multiport valves, check valves, pilot-operated flow control valves, proportional flow control valves, throttle flow control valves, spool flow control valves, and the like. For example, a pilot valve controls the position of an orifice or spool, enabling the valve to maintain a consistent flow rate despite any changes in system pressure. This valve may be controlled by a system pressure signal, thereby ensuring that the valve responds quickly to any changes in operating conditions. As a further example, a proportional flow control valve may include a variable orifice that regulates the flow rate of the working fluid. An electrical signal controls the size of the orifice, enabling the valve to maintain a precise flow rate. Valves can also include any suitable valve structure, including ball valves, butterfly valves, needle valves, globe valves, gate valves, wafer valves, control valves, and similar types. Valves can be included in manifolds of hydraulic or pneumatic circuits, for example, enabling multiple ports and flow paths. For example, flow control valves can control the volumetric flow rate of fluid flowing through them. Generally, changing the size of an orifice is a way in which the flow rate can be set and adjusted. For example, opening and closing a tapered needle that moves in and out of an orifice, or a gap inside a ball valve, can change this rate. Depending on the parameters of the valve, the flow rate may increase when the valve is opened to 100 percent of its travel, and a nearly fully open valve allows for increased flow rate, thus resulting in improved productivity and the elimination of bottlenecks or pinches. Valves can be actuated by any known method, including, but not limited to, hydraulic, pneumatic, mechanical, or electrical energy.For example, in some cases, the valve may be actuated by an energized solenoid or electric motor. For example, a pressure-compensated flow control valve refers to a hydraulic component that regulates a constant fluid volume flow rate within a hydraulic system despite fluctuations in system pressure. These valves may be useful when it is necessary to maintain a constant speed in a hydraulic cylinder regardless of the stress the cylinder is subjected to. Since speed is directly proportional to the hydraulic flow rate, the speed of a hydraulic cylinder may depend on the amount of fluid flowing through it. The valve actuator, and thereby the valve itself, may be controlled by a computing device, as will be further detailed below. 1824 may communicate with the valve, for example, via one or more of the following: electrical communication, hydraulic communication, pneumatic communication, mechanical communication, and so on. Furthermore, the injector 18 and its elements are described in more detail below in this disclosure.

[0178] Referring further to Figure 18, in addition, or alternatively, at least one injector 1856 may decompose the first fluid into small droplets, which may then be dispersed and mixed with the second fluid. Furthermore, at least one injector 1856 may be configured to adjust the droplet size of the first fluid 1812 from the combined reservoir 1852. For example, the smaller the droplet size, the larger the surface area of ​​the spray for any given volume of fluid. This is accompanied by various factors that affect droplet size, such as pressure, type of spray pattern, spray angle, specific gravity of the fluid, viscosity, and surface tension of the nozzle type, and similar factors. For example, with respect to a nozzle, the higher the fluid pressure, the smaller the droplet size. For any given hydraulic nozzle, the relationship between pressure and average droplet size can be expressed as follows:

number

[0179] Continuing to refer to Figure 18, at least one injector 1856 may include a flow control knob 1872. As used in this disclosure, “flow control knob” means a component that enables precise control and adjustment of the flow rate of fluid through at least one injector 1856. In some cases, the flow control knob 1872 may include a manual flow control valve that can be manually adjusted to adjust the fluid flow rate through at least one injector 1856. The flow control valve may include any suitable type of flow control valve, including, without limitation, ball valves, needle valves, butterfly valves, and similar types. In a non-limiting example, the flow control knob 1872 is configured such that by rotating the knob, a valve opening, or the opening of at least one fluid outlet 1868, can be opened and / or closed, allowing more or less fluid to pass through at least one injector 1856. In addition, or alternatively, the flow control knob 1872 may include a 10x turndown ratio. As used in this disclosure, “turndown ratio” refers to a measure of the versatility and flexibility of the flow rate through at least one injector 1856 controlled by the flow control knob 1872. For example, the turndown ratio may further refer to the range of the device’s operating range and is defined as the ratio of the maximum capacity to the minimum capacity. For example, a device with a maximum output of 10 units and a minimum output of 2 units may have a turndown ratio of 5. In flow measurement, the turndown ratio indicates the range of flow rates that the flow meter can measure with acceptable accuracy. The flow control knob 1872 may be connected to a flow control valve. For example, a typical control valve with equal percentage flow characteristics may have a turndown ratio of 30:1, but if the valve is oversized and throttling at its lower end, its turndown ratio may drop to 3:1 or less. In one embodiment, the flow control knob 1872 can control the flow rate of a fluid over a range of 10 times the minimum flow rate. For example, if the minimum flow rate of the flow control knob 1872 is 1.75 liters per minute (GPM), a turndown ratio of 10 times may indicate that the flow control knob 1872 can effectively adjust the flow rate through at least one injector 1856 from 1.75 GPM to 17.5 GPM.In an exemplary embodiment, the flow rate adjustment knob 1872 is configured to change the fluid flow rate up to 10 liters per minute.

[0180] Referring next to Figure 19, an exemplary embodiment of the injector 1856 is shown. As stated above, “injector” refers to a component designed to distribute at least one fluid to at least one of several applications. In non-limiting examples, the injector 1856 may be configured for use in industrial applications, agricultural applications, and the like. For example, the injector 1856 may be configured for use in painting or surface coating of various articles, supplying waste oil to furnaces for heating, or supplying waste oil to plasma reactors, humidity control in greenhouses, odor control, and chemical engineering, and the like. In non-limiting embodiments, the spray patterns include broad conical shapes, narrow conical shapes, and the like. In such embodiments, at least one fluid outlet 1868 of at least one injector 1856 may discharge a combination 1904 of a first fluid and a second fluid in a conical spray 1908 having any angle of about 12 to about 15 degrees. The first fluid may be any first fluid discussed herein. The second fluid may be any second fluid discussed herein.

[0181] Referring next to Figure 20, an exemplary embodiment of the apparatus 2000 for processing the growth medium 2004 via electrical discharge is illustrated. The apparatus 2000 may include a housing 2060 configured to house various internal components described herein. The apparatus 2000 may include an internal injection system, such as a low-pressure injection system 1800, located inside the apparatus 2000. As used in this disclosure, “internal injection system” means an injection system installed inside the apparatus 2000. The injection system may be any injection system described herein. In some embodiments, an external injection system may be designed to deliver at least one fluid into the plasma reactor 2012 from a first fluid reservoir 1808 and a second fluid reservoir 1832.

[0182] Continuing to refer to Figure 20, the apparatus 2000 for processing the growth medium 2004 via electrical discharge. The apparatus 2000 may include the growth medium 2004 in a processing chamber 2008. The apparatus 2000 may include a plasma reactor 2012. The plasma reactor 2012 may include at least a pair of electrodes 2016a-b. The first electrode 2016a may include an anode electrically connected to an ignition unit, and the second electrode 2016b may include a cathode electrically connected to ground 2020. The plasma reactor 2012 may include a reaction region 2024 positioned between the first electrode 2016a and the second electrode 2016b. The apparatus 2000 may include an ignition unit 2028 electrically connected to at least one of the pair of electrodes 2016a-b. The apparatus 2000 may further include a condenser 2032 located within a reaction region 2024 above the processing chamber 2008.

[0183] Referring next to Figure 21, an exemplary embodiment of apparatus 2100 for processing a growth medium 2004 via electrical discharge is illustrated. Apparatus 2100 may include an externally mounted injection system, such as a low-pressure injection system 1800 located outside apparatus 2100. As used in this disclosure, “externally mounted injection system” means an injection system located outside apparatus 22100, rather than being integrated into apparatus 2100 as described above with reference to Figure 20. The injection system may be any injection system described in this disclosure. Apparatus 2100 may include a growth medium 2104 in a processing chamber 2108. Apparatus 2100 may include a plasma reactor 2112. The plasma reactor 2112 may include at least a pair of electrodes 2116a and 2116b. The first electrode 2116a may include an anode electrically connected to an ignition unit, and the second electrode 2116b may include a cathode electrically connected to ground 2120. The plasma reactor 2112 may include a reaction region 2124 located between a first electrode 21166a and a second electrode 2116b. The apparatus 2100 may include an ignition unit 2128 electrically connected to at least one electrode of the pair of electrodes 2116a-b. The apparatus 2100 may further include a condenser 2132 located within the reaction region 2124 above the processing chamber 2008.

[0184] Referring next to Figure 21, an exemplary embodiment of the apparatus 2100 for processing a growth medium via electrical discharge is illustrated. In some embodiments, the external injection system may be designed to deliver at least one fluid from a first fluid reservoir 1808 and a second reservoir 1832 into the plasma reactor 2112 from an external location via tube 2136. In non-limiting examples, the external injection system may be mechanically fixed to the outside of the housing. In some cases, the external injection system may be attached to the outside of the housing via screw or bolt fastening, clamp or clip fastening, sliding or snap-fit ​​connections, and / or similar.

[0185] Referring next to Figure 22, a flow diagram of an exemplary embodiment of Method 2200 for using a low-pressure injection system for multiple fluids is shown. Method 600 includes step 2205 of receiving a first fluid from a first fluid reservoir containing the first fluid through at least one first fluid inlet. In some embodiments, at least one first fluid inlet may be hydraulically connected to the first fluid reservoir. In addition, or alternatively, the first fluid may be a liquid. This may be implemented as described herein, but is not limited to this.

[0186] Continuing with reference to Figure 22, method 2200 includes step 2210 of receiving a second fluid from a second fluid reservoir containing the second fluid at at least one second fluid inlet. In some embodiments, at least one second fluid inlet may be pneumatically connected to the second fluid reservoir. In addition, or alternatively, the second fluid may be a gas. This may be implemented as described herein, but is not limited to this.

[0187] Continuing to refer to Figure 22, Method 2200 includes step 2215 of providing pressure to the second fluid received from the second fluid reservoir by a low-pressure compressor. In some embodiments, the low-pressure compressor may be configured to output a pressure between about 2 bar and about 7 bar. This may be carried out as described herein, but is not limited to this.

[0188] Continuing to refer to Figure 22, Method 2200 includes step 2220 of dispersing a combination of the first fluid and the second fluid by at least one injector. In some embodiments, at least one injector may be configured to disperse the first fluid of the combination at one of a plurality of first fluid spray volumes. In addition, or alternatively, the plurality of fluid spray volumes may include 4 to 25 liters per minute. In further embodiments, at least one injector may be configured to disperse the combination at one of a plurality of spray patterns. In one embodiment, the plurality of spray patterns may include a conical shape. In yet another embodiment, at least one injector may be configured to disperse the second fluid of the combination at one of a plurality of second fluid flow rates. In addition, or alternatively, the plurality of second fluid flow rates may include second fluid flow rates of 4 to 25 liters per minute. Furthermore, at least one injector may include an inlet for at least one first fluid injector connected to the first fluid reservoir. Here, the inlet of at least one first fluid injector is configured to receive additional first fluid from a first fluid reservoir. In addition, or alternatively, at least one injector may further include the inlet of at least one second fluid injector connected to a second fluid reservoir, where the inlet of at least one second fluid injector is configured to receive additional second fluid from the second fluid reservoir. Furthermore, at least one injector may be configured to adjust the droplet size of the first fluid. In embodiments, the droplet size of the first fluid includes 5 microns to 50 microns. This may be implemented as described herein, but is not limited to this.

[0189] Continuing with reference to Figure 22, Method 2200 may include, during the operation of at least one injector, changing the combined fluid flow rate of the first and second fluids by means of a flow rate adjustment knob. In some embodiments, the flow rate adjustment knob may be configured to change the fluid flow rate up to 10 liters per minute. In addition, or alternatively, the flow rate adjustment knob may be configured to change the injector flow rate to a turndown ratio of 10. This may be carried out as described herein, but is not limited to this.

[0190] Referring next to Figure 23, a block diagram of an exemplary embodiment of apparatus 2300 for a modular plasma reactor 2304 is shown. Apparatus 2300 includes a modular plasma reactor 2304. For the purposes of this disclosure, “modular plasma reactor” means a plasma reactor that can be detachably connected to other modules. Where used in this disclosure, “plasma reactor” means a device configured to generate, maintain, and / or control plasma. For the purposes of this disclosure, “plasma” means a fourth state of matter, in addition to solid, liquid, and gas. Plasma may include a partially ionized gas consisting of a mixture of ions, electrons, and / or neutral particles (i.e., atoms and molecules). In one embodiment, plasma can be formed when at least one fluid is exposed to a high-energy source, such as heat, radiation, or an electric field, and is ionized by atoms or molecules in at least one fluid losing or gaining electrons. At least one fluid may be introduced into the modular plasma reactor 2304 using an injector, as described below in this disclosure. In some cases, the plasma may include non-thermal plasma (NTP), a type of plasma where the electron temperature is significantly higher than that of heavier ions and neutral particles. In this case, the electrons in the plasma have high kinetic energy, while the overall temperature of at least one fluid may remain relatively low (e.g., often around room temperature, 20–22°C / 68–72°F). In addition, or alternatively, the energy distribution between particles in a non-thermal plasma may not be in thermal equilibrium. This may be due to the fact that electrons are much lighter than ions and neutral particles, and therefore gain energy more rapidly when exposed to an electric or magnetic field, resulting in a higher electron temperature. Heavier ions and neutral particles, on the other hand, move more slowly and remain at lower temperatures, which may result in a lower temperature for at least one fluid.

[0191] Continuing with reference to Figure 23, the modular plasma reactor 2304 includes a housing 2308. As used in this disclosure, “housing” means an exterior structure configured to house a number of components, such as components of the apparatus 2300 described herein. In some cases, the housing 2308 may include, but not limited to, durable, lightweight materials such as plastic, metal, and the like. In some embodiments, the housing 2308 may be scalable in size. In some embodiments, the housing 2308 may be designed and configured to protect sensitive components of the apparatus 2300 from damage or contamination. In some embodiments, the housing 2308 may be portable. For the purposes of this disclosure, “portable” means an object designed to be transported from place to place. In a non-limiting example, the portable housing 2308 may include an exterior case for components of the apparatus 2300. The housing 2308 may be configured to protect, for example, components of a modular plasma reactor 2304, at least one modular reservoir 2312, a modular ignition unit 2316, a modular pressure regulator, a controller 2320, and similar items, separately or together, for example. In some embodiments, the housing 2308 may include one or more flat surfaces on the housing 2308. For the purposes of this disclosure, “flat surface” means the surface of an object that is smooth and flat, without any significant curvature or ridges. In an unlimiting example, the housing 2308 may include flat surfaces so that the housing 2308 can be securely mounted on the ground. In another unlimiting example, the housing 2308 may include flat surfaces so that the housing 2308 can be mounted on another flat surface. In yet another unlimiting example, the housing 2308 may include flat surfaces so that another object having a flat surface can be mounted on the housing 2308. In some embodiments, the housing 2308 may include one or more surface coatings and / or surface modifications that reduce the possibility of undesirable adhesion or interference with external components such as debris, foreign matter, liquids and the like.In addition, or alternatively, the housing 2308 may further include mechanisms such as latches, clips, or other fasteners that help to secure the housing 2308 in place during use.

[0192] Continuing to refer to Figure 23, in some embodiments, the housing 2308 may include at least one opening that provides a path for intermodule connections for communication. In a non-limiting example, at least one opening in the housing 2308 of a modular injector 2324 may provide a path for at least one fluid inlet of the modular injector 2324 to be connected to an outlet of at least one modular reservoir 2312. At least one fluid inlet of the modular injector 2324 and at least one outlet of the modular reservoir 2312 are disclosed below in more detail. In another non-limiting example, at least one opening in the housing 2308 of a modular plasma reactor 2304 may provide a path for one or more continuous conductors of a modular ignition unit 2316 to be connected to at least one electrode of the modular plasma reactor 2304. At least one electrode disclosed herein is described below in more detail. In another non-limiting example, at least one opening in the housing 2308 of the modular plasma reactor 2304 may provide a path for at least one fluid outlet of the modular injector 2324 to be fluidly connected to the modular plasma reactor 2304. At least one fluid outlet of the modular injector 2324 is described further below.

[0193] Continuing to refer to Figure 23, as used in this disclosure, “communication” refers to the attribute of two or more related elements interacting with each other, for example, within a particular domain or in a particular manner. In some cases, communication between two or more related elements may be of a particular attribute, such as, but not limited to, electrical communication, fluid communication, informational communication, mechanical communication, and the like. As used in this disclosure, “informational communication” refers to the attribute of two or more related elements interacting with each other via information flow or information in general. For example, but not limited to, communication between modular injector 2324 and controller 2320 may include informational communication. For example, but not limited to, communication between modular ignition unit 2316 and controller 2320 may include informational communication. As used in this disclosure, “mechanical communication” refers to the attribute of two or more related elements interacting with each other via mechanical means, such as mechanical effort (e.g., force) and flow (e.g., velocity). As used in this disclosure, “electrical communication” means the property of two or more related elements interacting with each other via electric current or electricity in general. For example, but not limited to, communication between modular injector 2324 and modular ignition unit 2316 may include electrical communication through one or more continuous conductors. As used in this disclosure, “fluid communication” means the property of two or more related elements interacting with each other via fluid flow or fluid in general. For example, but not limited to, communication between modular injector 2324 and at least one modular reservoir 2312 may include fluid communication, where at least one fluid flows between modular injector 2324 and at least one modular reservoir 2312. At least one fluid is disclosed in more detail below. As used in this disclosure, “fluid” means a flowable gaseous or liquid material, including, but not limited to, water, nitrogen, oxygen, and / or other gases and / or liquids.

[0194] Continuing with reference to Figure 23, the housing 2308 may further include a processing chamber configured to house a growth medium. As used in this disclosure, “processing chamber” means a controlled space designed to hold a particular material, substance, or object and subject them to a particular process. In embodiments, the processing chamber may be constructed as an open system, for example, including, but not limited to, a container without a lid. In other embodiments, the processing chamber may be constructed as a closed system, for example, including, but not limited to, a sealed container with an airtight seal. In some embodiments, the processing chamber may be designed to provide easy access to the growth medium being processed. In non-limiting embodiments, the processing chamber may include a removable door, or a hinged door or port, for loading and / or removing the growth medium. In another non-limiting embodiment, the processing chamber may include one or more windows, with or without covers, for visual inspection or sampling during the processing process.

[0195] Continuing to refer to Figure 23, the apparatus 2300 includes a modular ignition unit 2316. In some embodiments, the modular ignition unit 2316 is detachably connected to a modular plasma reactor 2304. For the purposes of this disclosure, “detachably connected” means that an object connected to another object can be detached from the other object without damaging or destroying those objects. In some embodiments, the modular ignition unit 2316 may include a housing 2308 as disclosed above. In some embodiments, the detachable connection may include a screw connection. For the purposes of this disclosure, “screw connection” means a type of connection that involves mating male and female halves together to form a connection for holding threads together. In non-limiting examples, a screw connection may be made by a male-female mating component. In non-limiting examples, a male-female mating component may include a male component or plug that is inserted into a female component or socket. In some cases, a screw connection may be detachable. In some cases, screw connections may be removable but require a special tool or key for removal. In some embodiments, screw connections may be achieved by plug-and-socket mating, pogo pin contacts, crown spring mating, and one or more of the same kind. In some cases, screw connections may be keyed to ensure proper alignment of mating components. In some cases, screw connections may be lockable. As used in this disclosure, “mating component” means a component that mates with at least one other component. In non-limiting examples, a mating component may include a connector. In other embodiments, a removable connection may include a bayonet connection. A bayonet connection may use a locking mechanism that allows two components to be connected by inserting them into place and rotating them. In other embodiments, a removable connection may include a snap-fit ​​connection. In some embodiments, a snap-fit ​​connection may include a set of tabs or hooks that engage in place when two components are pressed together.In non-limiting examples, snap-fit ​​connections may include snap-fit ​​clips, snap-fit ​​tabs, snap-fit ​​hinges, snap-fit ​​latches, snap-fit ​​hooks, snap-fit ​​pins, and the like. In another embodiment, a detachable connection may include a latch connection. A latch connection uses a latch or locking mechanism to secure two components together. In non-limiting examples, a latch connection may include cabinet latches, door latches, aircraft fasteners, and the like. In another embodiment, a detachable connection may include a clamp connection. In some embodiments, a clamp connection uses a clamp or compression mechanism to hold two components together. In non-limiting examples, a clamp connection may include hose clamps, C-clamps, pipe clamps, wire rope clamps, shaft collars, spring clamps, and the like. In another embodiment, a detachable connection may include a magnetic connection. In some embodiments, a magnetic connection uses magnets to hold two components together. In some embodiments, a detachable connection may include connectors, screws, adapters, feedthroughs, and the like. For the purposes of this disclosure, “connector” means a component configured to create an electrical or mechanical connection between two or more objects. Examples of connectors include plug-and-socket connectors, terminal blocks, crimp connectors, and similar types. For the purposes of this disclosure, “feedthrough” means an electrical component of a form that allows electrical signals or power to pass through a barrier or enclosure while maintaining insulation between the inside and outside of the enclosure.

[0196] Continuing with reference to Figure 23, in one embodiment, the modular ignition unit 2316 may be detachably connected to the modular plasma reactor 2304 using one or more continuous conductors. As used herein, “continuous conductor” means an electrical conductor made from a conductive material capable of transmitting electric current uninterrupted over a certain distance. In non-limiting examples, the conductive material may include any material that conducts electric current, and in non-limiting examples, may include various metals such as copper, steel, or aluminum, carbon conductive materials, or any other suitable conductive material. In another embodiment, the modular ignition unit 2316 may be detachably connected to the modular plasma reactor 2304 using connectors or adapters. In some embodiments, connectors may be used to connect wires or cables to each other. In non-limiting examples, connectors may connect one or more continuous conductors. In another embodiment, the modular ignition unit 2316 may be detachably connected to the modular plasma reactor 2304 using a high-voltage feedthrough. For the purposes of this disclosure, “high-voltage feedthrough” means a sealed electrical connector designed to transmit high-voltage current through a vacuum chamber or pressurized chamber, such as the housing of a plasma reactor. Continuing to refer to Figure 23, for the purposes of this disclosure, “modular ignition unit” means an ignition unit that can be detachably connected to other modules. As used in this disclosure, “ignition unit” means an electrical component responsible for supplying the initial voltage necessary to initiate an electrical discharge between electrodes. In a non-limiting embodiment, the modular ignition unit 2316 may be configured to supply voltage to at least one electrode. At least one electrode is disclosed in further detail below. In some embodiments, the modular ignition unit 2316 may include a power supply. As used in this disclosure, “power supply” means any system, device, or means that supplies power, such as electricity, to a device, but is not limited to this.The power supply may provide power to the modular ignition unit 2316 and / or other devices or components within the apparatus 2300 described herein, for example, but not limited to, the modular plasma reactor 2304, the modular injector 2324, any computing device, and similar devices. In a non-limiting example, the controller 2320 may be electrically connected to the power supply. In a non-limiting example, the controller 2320 may control power to any component of the apparatus 2300 as described below. In some embodiments, the power supply may be electrically connected externally to the controller 2320. In such embodiments, the power supply may include, but not limited to, an external power source such as a wall outlet. In some cases, transmitting power may include the use of one or more continuous conductors. In some embodiments, the power supply may include a battery. In one embodiment, the power supply may include direct current (DC) power. In another embodiment, the power supply may include alternating current (AC) power. In some embodiments, in addition, or alternatively, the power supply may include AC or DC renewable power. As a non-limiting example, AC or DC renewable electricity may include electricity generated from renewable energy sources such as solar, wind, hydro, geothermal, and biomass.

[0197] Continuing with reference to Figure 23, in some embodiments, the modular ignition unit 2316 may be configured to convert a lower input voltage from a power source (e.g., 110V / 220V for AC voltages, or 12V / 24V for DC voltages) to a higher output voltage, thereby supplying the electrical energy necessary to drive the modular plasma reactor 2304. In non-limiting embodiments, the modular ignition unit 2316 may include an ignition transformer. As used in this disclosure, “ignition transformer” means an electrical transformer designed to produce a high-voltage output used to initiate an electrical discharge. Here, the electrical transformer refers to a passive electrical device that transfers electrical energy from one circuit to another through the process of electromagnetic induction. In some cases, an electrical transformer may be used to increase or decrease the voltage level of an alternating current (AC) electrical signal while maintaining the same frequency. In non-limiting embodiments, the ignition transformer may be configured to step up the input voltage from a lower level (from the power supply) to a higher voltage level required by the modular plasma reactor 2304 to generate an electric arc (i.e., an arc point). In some embodiments, the ignition transformer may include two sets of windings, which may include a primary winding and a secondary winding. The two sets of windings may be wound around a magnetic core. In some cases, the primary winding may be connected to a lower voltage input, while the secondary winding may generate a higher voltage output. In non-limiting embodiments, the modular ignition unit 2316 may include an ignition transformer configured to convert power received from the power supply into a high-voltage discharge of 6kV to 30kV. In another embodiment, the voltage range may be 3kV to 18kV. Continuing to refer to Figure 23, in some embodiments, the modular ignition unit 2316 may have the function of converting an AC voltage that periodically oscillates between positive and negative values ​​into a DC voltage with a constant polarity (positive or negative) that does not change over time, thereby enabling the connected electrodes to generate a controlled electrical discharge and / or a stable electrical discharge for generating and / or maintaining a plasma. In some cases, the device 2300 may need to convert the AC power supply to a DC power supply in order to perform pulsed operation.During pulsed plasma operation, the modular plasma reactor 2304 can operate in pulse mode, where plasma is generated and maintained for a short period, followed by a period without electrical discharge. The DC power supply is suitable for pulsed plasma operation because it is easily controlled and can be switched on and off as needed. In some cases, the apparatus 2300 can convert the AC power supply to a DC power supply to reduce electrode wear and contamination. For example, but not limited to, in an AC-powered modular plasma reactor 2304, the constant change in electrode polarity can accelerate electrode wear and release electrode material into the generated plasma. By using a DC power supply, the electrodes can maintain a constant polarity, reducing wear and contamination and extending electrode life. In one embodiment, the apparatus 2300 can also convert AC to AC. For example, an AC-to-AC converter can be used to convert an AC waveform with a specific frequency and amplitude to an AC waveform with a different frequency and amplitude. For example, an AC voltage controller may be a thyristor-based device that directly converts a fixed alternating voltage to a variable alternating voltage without changing the frequency. The AC voltage controller may be a phase control device and therefore a forced commutation circuit may not be required, and natural commutation or line commutation may be used. In a non-limiting embodiment, the modular ignition unit 2316 may include a rectifier. As used in this disclosure, “rectifier” means an electrical device or circuit that converts AC to DC. A rectifier may be constructed using one or more diodes, where a diode is a semiconductor device that allows current to flow in only one direction, having low resistance to forward current (when the voltage is positive) and high resistance to reverse current (when the voltage is negative). In some cases, a rectifier may include, but is not limited to, a half-wave rectifier, a full-wave rectifier, and the like.

[0198] Continuing with reference to Figure 23, in some embodiments, the modular ignition unit 2316 may include a power regulator (i.e., a filter). As described herein, “power regulator” means an electrical device in a power source that performs power regulation or redistribution, and as described herein, “power regulation” or “power redistribution” means the process of maintaining the voltage of a power source below its maximum value, whether operating, non-operating, or charging. In non-limiting examples, a power regulator may be used to remove or attenuate unwanted frequencies, noise, or voltage fluctuations from the output voltage or current. A power regulator may include, but is not limited to, passive filters, active filters, EMI / RFI filters, voltage regulators, and the like. In addition, or alternatively, the modular ignition unit 2316 may include a balancer. As described herein, “balancer” means an electrical device that performs power balancing. Here, “power balancing” means, for the purposes of this disclosure, the process of balancing electrical energy from one or more first power sources (e.g., powerful batteries) to one or more second power sources (e.g., weak batteries). Those skilled in the art will recognize, by examining the entirety of this disclosure, various devices / components that may be used within the modular ignition unit 2316 of the apparatus 2300.

[0199] Continuing with reference to Figure 23, in addition, or alternatively, in some embodiments, the plasma reactor 2304 may include an onboard ignition unit. For the purposes of this disclosure, “onboard ignition unit” means an ignition unit contained within the housing containing the plasma reactor. In some embodiments, the onboard ignition unit may be directly connected to the modular plasma reactor 2304 using the continuous conductors, feedthroughs, connectors, or adapters described above. In some embodiments, the onboard ignition unit is directly connected to the modular plasma reactor 2304. As a non-limiting example, in a direct connection, the onboard ignition unit may be physically attached to at least the electrodes of the modular plasma reactor 2304 or to other components inside the housing 2308. As another non-limiting example, the onboard ignition unit may be directly connected to the modular plasma reactor 2304 using a variety of techniques such as welding, soldering, brazing, adhesive bonding, or mechanical fasteners, but not limited to these. As a non-limiting example, mechanical fasteners may include bolts, screws, nuts, washers, rivets, pins, and the like. In some embodiments, the controller 2320 may be detachably connected to the onboard ignition unit. In some embodiments, the controller 2320 may be configured to control power to the onboard ignition unit to supply the initial voltage necessary to initiate an electrical discharge between the electrodes.

[0200] Continuing with reference to Figure 23, the modular ignition unit 2316 may also include a coil. As used in this disclosure, “coil” means a conductive wire wound in a spiral or helical manner that generates an electromagnetic field when an electric current flows through it. In a non-limiting example, a coil may be electrically connected to at least one electrode of at least one pair of electrodes of the modular plasma reactor 2304, which is configured to initiate an electric discharge within the modular plasma reactor 2304. In a non-limiting example, a coil may include an induction coil or a high-voltage transformer coil. For the purposes of this disclosure, “induction coil” means an electronic component that stores energy in a magnetic field when an electric current flows through it. In a non-limiting example, an induction coil may include a wire coil wound around a core material such as iron, ferrite, and the like that amplifies the magnetic field. In some embodiments, an induction coil or a high-voltage transformer coil may generate a high-voltage electric pulse necessary to cause an electric discharge between a first and a second electrode of at least one pair of electrodes of the modular plasma reactor 2304. By passing a high-frequency current through an induction coil, an oscillating magnetic field can be created. This magnetic field can then induce an electric current in a gas or plasma, ionizing it and producing a plasma discharge (e.g., inductively coupled plasma (ICP)). In some embodiments, the magnetic field formed around the induction coil can be used to confine the plasma within a modular plasma reactor 2304.

[0201] Continuing with reference to Figure 23, the apparatus 2300 includes a modular injector 2324. For the purposes of this disclosure, “modular injector” means an injector that can be detachably connected to other modules. As used in this disclosure, “injector” means a component designed to inject at least one fluid into a plasma reactor, specifically into the reaction region of a plasma reactor. In a non-limiting example, the modular injector 2324 may be configured to supply at least one fluid through the reaction region. The reaction region and at least one fluid disclosed herein are described below. The at least one fluid may then be used by the modular plasma reactor 2304 to generate plasma. In some embodiments, the modular injector 2324 is detachably connected to the modular plasma reactor 2304. In some embodiments, the modular injector 2324 may be connected to the modular plasma reactor 2304 using an injector mounting flange. As used in this disclosure, “injector mounting flange” means a rim protruding from an object that is used to mount an injector to the housing of a plasma reactor. In a non-limiting example, the injector mounting flange may include an interface between the modular injector 2324 and the modular plasma reactor 2304. In some cases, at least one fluid outlet of the modular injector 2324 may include a threaded adapter. Both at least one fluid outlet and the interface may include threaded portions. For example, but not limited to, at least one fluid outlet / interface may include a male threaded portion and a female threaded portion, where the male and female threaded portions are compatible (i.e., matched). The modular injector 2324 may be screwed into the injector mounting flange at the interface using at least one fluid outlet together with a threaded adapter. An exemplary configuration of the modular injector 2324, at least one fluid outlet of the modular injector 2324, the injector mounting flange, and the interface is shown in Figure 2.

[0202] Continuing to refer to Figure 23, the modular injector 2324 may include at least one fluid inlet. As used in this disclosure, “fluid inlet” means an inlet point into which at least one fluid is injected before being supplied to the reaction area of ​​the modular plasma reactor 2304 or to other processes described herein. In a non-limiting example, at least one fluid inlet may be connected to the outlet of at least one modular reservoir 2312 as described above. In some cases, at least one fluid inlet may be designed to provide a secure, leak-free connection to at least one reservoir. For example, but not limited to, at least one fluid inlet may be sealed using one or more sealing elements such as O-rings, gaskets, thread sealants and the like, thereby ensuring a tight seal and / or preventing leakage or contamination. The modular injector 2324 may include at least one fluid outlet. As used in this disclosure, “fluid outlet” refers to an outlet point from which at least one fluid is discharged from the modular injector 2324 into the reaction region of the modular plasma reactor 2304. In some cases, at least one fluid outlet may be configured to allow at least one fluid to be discharged to an intended location within the reaction region. For example, but not limited to, at least one fluid outlet may be located midway between and directly above at least one pair of electrodes. At least one fluid outlet may be located at a distance from at least one pair of electrodes or the reaction region. This distance may affect the time and space available for at least one fluid to mix and interact with the plasma or other process components. In some cases, at least one fluid outlet may be configured to provide an optimal flow pattern and dispersion of at least one fluid into the reaction region. In a non-limiting example, at least one fluid outlet may include a nozzle (i.e., a specially shap...

Claims

1. A processing chamber configured to contain a medium, A reservoir configured to contain at least one fluid, It is a plasma reactor, A plurality of electrodes, including a first electrode and a second electrode, wherein the plurality of electrodes are configured to generate an electrical discharge in response to at least one fluid, A plasma reactor comprising: a reaction region disposed between the first electrode and the second electrode, configured to enable interaction between the electrical discharge and the medium; An ignition unit is electrically connected to at least one of the plurality of electrodes and configured to supply voltage to the at least one electrode, An injector is fluidly connected to the at least one reservoir and configured to deliver the at least one fluid through the reaction region, A pressure regulator configured to transfer the aforementioned fluid to the injection device, A device including a device.

2. The aforementioned at least one reservoir, A first reservoir configured to contain a first fluid, The system includes a second reservoir configured to contain a second fluid, The first fluid includes a gas, and The apparatus according to claim 1, wherein the second fluid includes a liquid.

3. The apparatus according to claim 2, wherein the injector is configured to discharge a mixture of the first fluid and the second fluid into the plasma reactor in droplet form.

4. The first electrode is branched from the second electrode, and The apparatus according to claim 1, wherein the reaction region includes a plurality of arc points between the first electrode and the second electrode.

5. The injector includes a flow rate adjustment component configured to regulate the flow of the at least one fluid entering the reaction region, The apparatus according to claim 1, wherein the pressure regulator is configured to pressurize the at least one fluid entering the reaction region.

6. The apparatus according to claim 1, wherein the ignition unit includes an ignition circuit configured to convert power received from a power source into a high-voltage discharge of 6 kV to 30 kV.

7. The apparatus further comprises a condenser located in the reaction region above the processing chamber, and the condenser is To collect the active species generated during the generation of the electrical discharge within the reaction region, and The apparatus according to claim 1, configured to transfer the active species to the processing chamber.

8. The apparatus according to claim 1, wherein the first electrode and the second electrode are electrically isolated from each other by a dielectric material.

9. The apparatus according to claim 1, wherein the first electrode and the second electrode include different shapes.

10. The apparatus according to claim 1, wherein the injector includes a fluid outlet configured to discharge the at least one fluid to the plasma reactor in a conical distribution, and the conical distribution includes droplets of the at least one fluid.

11. Each of the at least pair of electrodes includes a pitch angle of 6 to 8 degrees, and The apparatus according to claim 10, wherein the distribution angle of the conical distribution includes 12 degrees to 15 degrees.

12. The apparatus according to claim 10, wherein the droplets include ultrafine droplets having a diameter of 5 μm to 8 μm.

13. The apparatus according to claim 1, wherein the injector includes a piezoelectric steam injector.

14. The aforementioned injector is, A first fluid inlet fluidly connected to the first reservoir of at least one of the reservoirs, A second fluid inlet is fluid-connected to a second reservoir of at least one of the reservoirs, A fluid outlet configured to discharge the combination of the first fluid from the first reservoir and the second fluid from the second reservoir to the plasma reactor, The apparatus according to claim 1, including the following:

15. The apparatus according to claim 14, further comprising a low-pressure compressor configured to apply a pressure of 2 to 7 bar to the second fluid received from the second reservoir.

16. The apparatus according to claim 1, wherein at least one of the at least one reservoir, the ignition unit, or the injector is detachably connected to the plasma reactor.

17. An apparatus comprising a processing chamber, at least one reservoir, a plasma reactor, an injector, a pressure regulating system, and an ignition unit, wherein the ignition unit is A voltage source configured to supply voltage, A converter configured to convert a direct current (DC) voltage input to an alternating current (AC) voltage output, An electrical connection interface configured to electrically connect the converter to at least one electrode among a plurality of electrodes arranged in the plasma reactor, wherein the plurality of electrodes include a first electrode and a second electrode, and the electrical connection interface A feedback mechanism including a sensor configured to detect reaction data, A control module that is communicably connected to the feedback mechanism, In response to the AC voltage output, the generation of an electrical discharge is initiated within the reaction region located between the first electrode and the second electrode, and The control module is configured to enable interaction between the electrical discharge and the medium contained within the processing chamber, The apparatus, including the said apparatus.

18. The control module is The response data detected by the sensor is received from the feedback mechanism, and The apparatus according to claim 17, configured to adjust at least one processing parameter of the apparatus in accordance with the reaction data.

19. The apparatus according to claim 18, wherein adjusting the at least one processing parameter includes training a processing machine learning model using processing training data.

20. Transferring at least one fluid to the injector, The injector is used to deliver the at least one fluid through the reaction region of the plasma reactor of the present invention, The plasma reactor includes a plurality of electrodes, including a first electrode and a second electrode, and The reaction region is located between the first electrode and the second electrode, and the feeding is performed. A voltage is supplied to at least one electrode by an ignition unit electrically connected to at least one of the plurality of electrodes, The plurality of electrodes generate an electrical discharge in accordance with the at least one fluid, The reaction region enables interaction with the electrical discharge and the medium contained within the processing chamber, Methods that include...

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