Three-dimensional circuit using a conductive sphere

Abstract

Provided is a three-dimensional circuit using a conductive sphere useful for integration of a circuit of a magnetic memory. 【Solution means】A three-dimensional electric circuit 1 in which conductive spheres 2 that conduct electricity are in contact with each other to form an electric circuit and the electric circuit can be extended both horizontally and vertically. In addition to the three-dimensional electric circuit, another electric circuit can be installed on an insulating thin film 9 having a conductive sphere storage hole for storing or suppressing the conductive spheres built in the three-dimensional electric circuit. By using the three-dimensional electric circuit and another electric circuit in combination, it is possible to specify the position in the three-dimensional electric circuit and create magnetic data.

Description

Technical Field

[0001] The present invention relates to a three-dimensional electric circuit that can be expanded horizontally and vertically. In addition to the electric circuit, another electric circuit can be installed on each of the laminated insulating thin films incorporated in the electric circuit. By using the electric circuit and the other electric circuit in combination, it is possible to specify the position within the electric circuit and create magnetic data. The present invention relates to a three-dimensional circuit using a conductive sphere through which electricity passes.

Background Art

[0002] Conventionally, there has been no three-dimensional circuit using a conductive sphere through which electricity passes.

Summary of the Invention

Problems to be Solved by the Invention

[0003] Conventionally, the circuit of a magnetic memory that uses magnetism for information storage has been considered difficult to integrate.

Means for Solving the Problems

[0004] A three-dimensional circuit using a conductive sphere through which electricity passes has been devised, which can be used as a magnetic memory circuit that uses magnetism for information storage and can also be integrated.

Effects of the Invention

[0005] The three-dimensional circuit using a conductive sphere through which electricity passes according to the present invention is useful for the integration of a conventional magnetic memory circuit that uses magnetism for information storage and is called a magnetoresistive memory.

Brief Description of the Drawings

[0006]

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DETAILED DESCRIPTION OF THE INVENTION

[0007] First, an existing conductive material through which electricity passes is made into a spherical shape. As shown in FIGS. 1, 2, 7, and 8 which are partial enlarged views, all the spheres including the uppermost conductive sphere group 3, the second uppermost conductive sphere group 4, the third uppermost conductive sphere group 5, and the six-ring forming conductive sphere group 6 have the same size, and the spheres are in contact with each other to form a three-dimensional electric circuit. Prepare the existing conductive spheres 2, which is characterized in that.

[0008] Alternatively, conductive sphere storage holes 10 as shown in Fig. 9 are formed in an insulating thin film 9 made by flattening an existing insulating material by an existing method such as laser beam irradiation. However, the arrangement of the conductive sphere storage holes 10 corresponding to the I-I' cross-sectional view at the I-I' line position shown in Fig. 8, the J-J' cross-sectional view at the J-J' line position, etc. is the arrangement of the uppermost and lowermost conductive sphere storage holes 10 shown in Fig. 10, and the storage hole arrangement shown in the storage hole location in the I-I' cross-sectional view at the I-I' line position in Table 1. Together with the arrangement with a central storage hole added, there are three types of arrangements. Therefore, as shown in Fig. 2, the number of the insulating thin films 9 to be laminated is confirmed, and the conductive sphere storage holes 10 of the conductive line insulating thin film 11 for electric supply and the insulating thin film 9 with the conductive sphere storage holes 10 of the three types of arrangements are prepared in the required number of sheets.

[0009] Next, place the conductive wire insulation film 11 shown in Fig. 10 for housing the lowermost conductive spheres 2 on a plane, fill all the conductive sphere housing holes 10 of the conductive wire insulation film 11 with the conductive spheres 2, and ensure close contact between the conductive spheres 2 by taking measures such as applying an existing conductive adhesive to the locations where the conductive spheres 2 in this layer and the upper-layer conductive spheres 2 are expected to come into contact. Then, cover it with an insulating film 9 having an arrangement with a central housing hole added to the housing hole arrangement shown at the housing hole location in the P-P' cross-sectional view at the P-P' line location in Table 1, press down on the already filled conductive spheres 2, and then fill all the empty conductive sphere housing holes 10 of the insulating film 9 with the conductive spheres 2. Ensure close contact between the conductive spheres 2 by taking measures such as applying an existing conductive adhesive to the locations where the conductive spheres 2 in this layer and the upper-layer conductive spheres 2 are expected to come into contact. After that, cover it with an insulating film 9 having the housing hole arrangement shown at the housing hole location in the O-O' cross-sectional view at the O-O' line location in Table 1, press down on the already filled conductive spheres 2, and then fill all the empty conductive sphere housing holes 10 of the insulating film 9 with the conductive spheres 2. Ensure close contact between the conductive spheres 2 by taking measures such as applying an existing conductive adhesive to the locations where the conductive spheres 2 in this layer and the upper-layer conductive spheres 2 are expected to come into contact. Then, cover it with an insulating film 9 having the housing hole arrangement shown at the housing hole location in the N-N' cross-sectional view at the N-N' line location in Table 1, press down on the already filled conductive spheres 2, and repeat this operation.

[0010] At the end of the operation, cover the conductive sphere 2 that has already been filled in with an insulating film 9 having a storage hole arrangement shown at the storage hole location in the J-J' cross-sectional view at the J-J' line in Table 1, press down on the conductive sphere 2, then fill all the empty conductive sphere storage holes 10 of the insulating film 9 with the conductive sphere 2, and at the location where the conductive sphere 2 is expected to contact the upper-layer conductive sphere 2, perform measures such as applying an existing conductive adhesive to ensure close contact between the conductive spheres 2. After that, cover it with an insulating film 9 having an arrangement with a central storage hole added to the storage hole arrangement shown at the storage hole location in the I-I' cross-sectional view at the I-I' line in Table 1, press down on the conductive sphere 2 that has already been filled in, then fill all the empty conductive sphere storage holes 10 of the insulating film 9 with the conductive sphere 2, and then cover it with the conductive supply conductive line insulating thin film 11 shown in Fig. 10 for pressing down on the uppermost conductive sphere 2 and press it down.

[0011] Finally, by covering the top and bottom surfaces of the three-dimensional circuit shown in Fig. 2 with an insulating cover 14, the three-dimensional circuit 1 using conductive spheres is completed.

[0012] When used as a memory device using a magnetic material such as a magnetoresistive memory, as shown in Figs. 1, 6, 9, and 10, utilize the conductive sphere non-existence space 7 where there are no conductive spheres 2 in the three-dimensional circuit 1 using conductive spheres, pass wiring for delivering electricity to each of the insulating thin films 9 in the laminated insulating thin film 9, and in order to identify the position within the three-dimensional circuit 1 using the conductive spheres or create magnetic data, install conductive circuit lines 15 for connecting specific conductive spheres 2 as shown in an example in Figs. 13 and 14 on each of the insulating thin films 9, and also install a magnetic material attachment area 12, an existing coil head 13, and an insulating cover 14 covering the coil head 13.

Example

[0013] First, prepare an existing conductive material that conducts electricity and is made into a spherical shape. As shown in FIGS. 1, 2, 7, and 8 (partial enlarged views), all the spheres including the uppermost conductive sphere group 3, the second uppermost conductive sphere group 4, the third uppermost conductive sphere group 5, and the 6-ring formed conductive sphere group 6 have the same size, and a three-dimensional electrical circuit is formed by the spheres contacting each other. That is, prepare the existing conductive sphere 2.

[0014] Separately, on an insulating thin film 9 made by flattening an existing insulating material, make conductive sphere storage holes 10 as shown in FIG. 9 by an existing method such as laser beam irradiation. The arrangement of the conductive sphere storage holes 10 corresponding to the I-I' cross-sectional view at the I-I' line position shown in FIG. 8, the J-J' cross-sectional view at the J-J' line position, etc. is the arrangement of the uppermost and lowermost conductive sphere storage holes 10 shown in FIG. 10, and the storage hole arrangement shown in the storage hole location in the I-I' cross-sectional view at the I-I' line position in Table 1 below, plus two other types of arrangements with a central storage hole added, for a total of three types of arrangements. Therefore, confirm the number of the insulating thin films 9 to be laminated as shown in FIG. 2, and prepare the necessary number of the electrical supply conductive line insulating thin films 11 and the insulating thin films 9 with the three types of arrangements of the conductive sphere storage holes 10 opened.

[0015]

Table 1

[0016] Next, place the conductive wire insulation film 11 shown in FIG. 10 for accommodating the lowermost conductive spheres 2 on a plane, fill all the conductive sphere accommodation holes 10 of the conductive wire insulation film 11 with the conductive spheres 2, and perform measures such as applying an existing conductive adhesive at the locations where the conductive spheres 2 are expected to contact the upper-layer conductive spheres 2 to ensure close contact between the conductive spheres 2. Then, cover it from above with an insulating film 9 having an arrangement with a central accommodation hole added to the accommodation hole arrangement shown at the accommodation hole location in the P-P' cross-sectional view at the P-P' line location in Table 1 above, press down on the already filled conductive spheres 2, and then fill all the empty conductive sphere accommodation holes 10 of the insulating film 9 with the conductive spheres 2. Perform measures such as applying an existing conductive adhesive at the locations where the conductive spheres 2 are expected to contact the upper-layer conductive spheres 2 to ensure close contact between the conductive spheres 2. After that, cover it with an insulating film 9 having the accommodation hole arrangement shown at the accommodation hole location in the O-O' cross-sectional view at the O-O' line location in Table 1 above, press down on the already filled conductive spheres 2, and then fill all the empty conductive sphere accommodation holes 10 of the insulating film 9 with the conductive spheres 2. Perform measures such as applying an existing conductive adhesive at the locations where the conductive spheres 2 are expected to contact the upper-layer conductive spheres 2 to ensure close contact between the conductive spheres 2. After that, cover it with an insulating film 9 having the accommodation hole arrangement shown at the accommodation hole location in the N-N' cross-sectional view at the N-N' line location in Table 1 above, and repeat the operation of pressing down on the already filled conductive spheres 2.

[0017] At the end of the operation, cover with the insulating film 9 having the storage hole arrangement shown at the storage hole location in the J-J' cross-sectional view at the J-J' line in Table 1 above, press down on the already inserted conductive spheres 2, then fill all the empty conductive sphere storage holes 10 in the insulating film 9 with the conductive spheres 2, and at the location where the conductive sphere 2 in the upper layer is expected to contact the existing conductive sphere 2, take measures such as applying an existing conductive adhesive to ensure close contact between the conductive spheres 2. After that, cover with the insulating film 9 having an arrangement with a central storage hole added to the storage hole arrangement shown at the storage hole location in the I-I' cross-sectional view at the I-I' line in Table 1 above, press down on the already inserted conductive spheres 2, then fill all the empty conductive sphere storage holes 10 in the insulating film 9 with the conductive spheres 2. Finally, cover with the conductive line insulating thin film 11 for electrical supply shown in Fig. 10 to press down on the uppermost conductive sphere 2 and press it down.

[0018] Finally, by covering the top and bottom surfaces of the three-dimensional circuit shown in Fig. 2 with the insulating cover 14, the three-dimensional circuit 1 using conductive spheres is completed.

[0019] When used as a memory device using a magnetic material such as a magnetoresistive memory, as shown in Figs. 1, 6, 9, and 10, utilize the conductive sphere non-existence space 7 where there are no conductive spheres 2 in the three-dimensional circuit 1 using conductive spheres, pass wiring for delivering electricity to each of the insulating thin films 9 in the laminated state of the insulating thin films 9, and in order to identify the position within the three-dimensional circuit 1 using the conductive spheres or create magnetic data, install conductive circuit lines 15 for connecting specific conductive spheres 2 as shown in an example in Figs. 13 and 14 on each of the insulating thin films 9, and also install the magnetic material attachment area 12, the existing coil head 13, and the insulating cover 14 covering the coil head 13.

Industrial Applicability

[0020] The three-dimensional circuit using conductive spheres of the present invention is a new circuit form and enables the integration of memory circuits that use magnetism for information storage, so it can be utilized in the industrial field dealing with computers.

Explanation of Reference Numerals

[0021] 1 A three-dimensional circuit made by arranging conductive spheres 2 in conductive sphere storage holes 10 formed in an insulating thin film 9, having a horizontal spread as shown in FIG. 1 and a vertical spread as shown in FIG. 2, and made using conductive spheres 2 A small sphere made of an existing conductive material that conducts electricity. As shown in FIGS. 1, 2, 7, and 8 which are partial enlarged views, all the spheres including the top conductive sphere group 3, the second upper conductive sphere group 4, the third upper conductive sphere group 5, and the 6-ring conductive sphere group 6 have the same size, and a three-dimensional electrical circuit is formed by the spheres contacting each other. An existing conductive sphere constituting the three-dimensional circuit 1 made using conductive spheres, characterized in that 3 As shown in FIGS. 1, 2, 7, and 8 which are partial enlarged views, in the three-dimensional circuit 1 made using conductive spheres, it is a conductive sphere group located at the uppermost part in the vertical direction. As shown in FIG. 10, using the conductive sphere storage holes 10 of the conductive line insulating thin film 11 for power supply, the conductive spheres 2 located at the uppermost part can be connected linearly in a hexagonal shape, or the conductive sphere storage holes 10 can be connected linearly in a triangular shape. The top conductive sphere group arranged in the horizontal direction as shown in FIG. 3 4 As shown in FIGS. 1, 2, 7, and 8 which are partial enlarged views, in the three-dimensional circuit 1 made using conductive spheres, it is a conductive sphere group located second from the top in the vertical direction. When a magnetic body attachment area 12 and a coil head 13 shown in FIGS. 11 and 12 are installed on the insulating thin film 9, it also contributes to magnetizing the magnetic body, and the second upper conductive sphere group arranged in the horizontal direction as shown in FIG. 4 5 As shown in FIGS. 1, 2, 7, and 8 which are partial enlarged views, in the three-dimensional circuit 1 made using conductive spheres, it is a conductive sphere group located third from the top in the vertical direction. When a magnetic body attachment area 12 and a coil head 13 shown in FIGS. 11 and 12 are installed on the insulating thin film 9, it also contributes to magnetizing the magnetic body as shown in FIG. 13, and the third upper conductive sphere group arranged in the horizontal direction as shown in FIG. 5 6 As shown in FIGS. 1, 2, and FIGS. 7 and 8 which are partial enlarged views, in the three-dimensional circuit 1 made using conductive spheres, it is a group of conductive spheres located at the fourth, sixth, etc. from the top in the vertical direction. When the magnetic body attachment area 12 and the coil head 13 shown in FIGS. 11 and 12 are installed on the insulating thin film 9, it will contribute to the magnetization of the magnetic body shown in FIG. 14, and as shown in FIG. 6, six rings of the conductive spheres 2 will be continuously formed in the horizontal direction. Six-ring forming conductive sphere group 7 As shown in FIGS. 1, 6, 9, and 10, in the three-dimensional circuit 1 using conductive spheres, it is a space where the conductive spheres 2 do not exist, and it serves as a passage for the wiring that delivers electricity to each insulating thin film 9. Conductive sphere non-existence space 8 As shown in FIG. 2, in the three-dimensional circuit 1 using conductive spheres, it consists of three second conductive spheres 2 from the top, four third conductive spheres 2 from the top, six conductive spheres 2 that form six rings and are located inside the outer three of the four third conductive spheres 2 from the top, four fifth conductive spheres 2 from the top, six conductive spheres 2 that form six rings and are located inside the outer three of the four fifth conductive spheres 2 from the top and are located at the sixth from the top, four seventh conductive spheres 2 from the top, and three second conductive spheres 2 from the bottom. It is a group of the conductive spheres 2 having the shape of the plan view shown in FIG. 7 and the front view shown in FIG. 8. To clearly show the arrangement of each conductive sphere storage hole 10 and the arrangement of the conductive spheres 2, it is made into a group that fits within the G-G' line section in FIG. 1 and the G-G' line section in FIG. 2, and in the H-H' line section in FIG. 2 excluding the topmost and bottommost conductive spheres 2, it is made by omitting the conductive spheres 2 from the eighth from the top to the third from the bottom in FIG. 2. Explanatory conductive sphere group 9 It is a thin film made by flattening an existing insulating material. As shown in FIGS. 2, 8, 9, and 10, it has conductive sphere storage holes 10 for bringing each conductive sphere 2 into contact with each other and arranging them regularly in the horizontal direction, and it is made possible to install the magnetic body attachment area 12 and the coil head 13 shown in FIGS. 11 and 12, and it is also made possible to install the conductive circuit line 15 shown in FIGS. 13 and 14. Insulating thin film made of existing insulating material 10 As shown in FIGS. 9 and 10, in order to bring the conductive spheres 2 into contact with each other and arrange them regularly in the horizontal direction, there are a plurality of holes for accommodating the conductive spheres formed in each insulating thin film 9. Taking the location of the K-K' line in FIG. 8 as an example, it is a hole for accommodating the third conductive sphere 2 from the top in the horizontal arrangement shown in FIG. 5, and at the same time, it is a hole for holding down the fourth conductive sphere 2 from the top in the horizontal arrangement shown in FIG. 6. Therefore, the size of the hole is set to a certain size that fits both the third conductive sphere 2 from the top and the fourth conductive sphere 2 from the top. As shown in Table 1, the arrangement of the holes varies depending on the vertical position. Conductive sphere accommodation holes 11 As shown in FIG. 10, it is a conductive loop insulating thin film that has a plurality of holes 10 for accommodating the conductive spheres for holding down the uppermost conductive sphere 2 in the horizontal arrangement shown in FIG. 3, and also has a conductive circuit line 15 that connects all the plurality of holes 10 for accommodating the conductive spheres to each other. Also, it is a conductive loop insulating thin film that has a plurality of holes 10 for accommodating the lowermost conductive sphere 2 in the horizontal arrangement shown in FIG. 3, and also has a conductive circuit line 15 that connects all the plurality of holes 10 for accommodating the conductive spheres to each other. The conductive circuit line 15 has a wiring in a hexagonal shape shown in FIG. 10, or a wiring in a triangular shape that linearly connects the holes 10 for accommodating the conductive spheres to each other. Electric supply conductive loop insulating thin film 12 As shown in FIGS. 11, 12, 13, and 14, a magnetic body adhesion area installed on the insulating thin film 9 by an existing method such as spraying magnetic powder on the insulating thin film 9 13 An existing conductive coil in which a thin wire made of an existing conductive material that conducts electricity is formed in a spiral shape. As shown in FIGS. 11, 12, 13, and 14, it is installed on the magnetic body adhesion area 12 and is one of the existing magnetization devices made using an existing mechanism in which the magnetic body adhesion area 12 is magnetized when an electric current is passed through the conductive sphere 2. Coil head 14 As shown in FIG. 11, an insulating cover that covers the coil head 13 by an existing method such as spraying an existing insulating material in order to prevent electricity from leaking externally from the existing coil head 13 A thin wire made of an existing conductive material that conducts electricity. As shown in FIGS. 10, 11, 13, and 14, it connects a plurality of conductive sphere storage holes 10 to each other, and is installed on the insulating thin film 9 so that a thin wire made of the conductive material contacts the stored conductive spheres 2 to conduct electricity, thereby connecting specific ones of the conductive spheres 2 to each other, a conductive circuit wire

Claims

[Claim 1] A three-dimensional electric circuit using conductive spheres, characterized in that the conductive spheres that conduct electricity come into contact with each other to form an electric circuit, and the electric circuit can be expanded both horizontally and vertically, and in addition to the three-dimensional electric circuit, another electric circuit can be installed in an insulating thin film that has conductive sphere storage holes that store and hold down the conductive spheres and is built into the three-dimensional electric circuit, and by using the three-dimensional electric circuit in combination with the other electric circuit, it is possible to specify a position within the three-dimensional electric circuit and create magnetic data.

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