Interface connection structure

Abstract

Provide an interface connection structure that can easily connect an interface device to a circuit board. 【Solution means】The interface connection structure includes a base and a heat dissipation connection structure and is applied to a circuit board. The circuit board has at least one connector, and the connector has a slot. The slot extends along an insertion direction perpendicular to the circuit board. The base is installed on the circuit board and includes at least one connector opening. The connector is located within the connector opening. The heat dissipation connection structure is removably connected to the base along the insertion direction, and the second housing of the heat dissipation connection structure is movably connected to the first housing of the heat dissipation connection structure and surrounds an accommodation space. The first housing includes at least one connection opening, and the accommodation space is for installing at least one interface device having a connection portion. The connection portion of the interface device is exposed from the connection opening, and the heat dissipation connection structure is connected to the base.

Description

Technical Field

[0001] The present invention relates to a connection structure, and particularly to an interface connection structure.

Background Art

[0002] When a current interface device (for example, an M.2 interface card) is electrically connected to a circuit board, it is necessary to connect it to a corresponding connector on the circuit board via an adapter board. The interface device is fixed to the adapter board with screws, and the adapter board is fixed to the circuit board with screws, which is disadvantageous for the assembly and disassembly of the interface device and the adapter board. Since screws need to be assembled and disassembled using specific tools, they are not user-friendly. In the process of fixing, problems such as screws falling, fixing positions shifting, and the circuit board being damaged due to careless use of tools are likely to occur.

Summary of the Invention

Problems to be Solved by the Invention

[0003] The present invention provides an interface connection structure capable of easily connecting an interface device to a circuit board.

Means for Solving the Problems

[0004] The interface connection structure of the present invention is applied to a circuit board. The circuit board has at least one connector, and each of the at least one connector has a slot. The slot extends along the insertion direction, and the insertion direction is perpendicular to the circuit board. The interface connection structure includes a base and a heat dissipation connection structure. The base is installed on the circuit board, and the base includes at least one connector opening. At least one connector is located within the at least one connector opening. The heat dissipation connection structure is suitable for being removably connected to the base along the insertion direction. The heat dissipation connection structure includes a first housing and a second housing. The second housing is movably connected to the first housing and together with the first housing surrounds a receiving space. The first housing includes at least one connection opening. The receiving space is suitable for installing at least one interface device, and each of the at least one interface device has a connection portion. When the interface device is installed in the receiving space, the connection portion is exposed from the connection opening, and for the heat dissipation connection structure to be connected to the base along the insertion direction, the connection portion can be inserted into the slot.

Advantages of the Invention

[0005] As described above, the heat dissipation connection structure of the interface connection structure of the present invention is used to hold the interface device, and the connection portion of the interface device is exposed from the heat dissipation connection structure. By installing the base of the interface connection structure on the circuit board and inserting the heat dissipation connection structure into the base, the connection portion of the interface device can be directly and stably connected to the connector of the circuit board.

Brief Description of the Drawings

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Embodiment for Carrying Out the Invention

[0007] FIG. 1 is a schematic diagram of an interface connection structure according to an embodiment of the present invention. FIG. 2 is a cross-sectional view of the interface connection structure of FIG. 1. FIG. 3 is an exploded view of the interface connection structure of FIG. 1. FIG. 4 is a schematic diagram of the base of FIG. 3. FIG. 5 is a schematic diagram after opening the heat dissipation connection structure of FIG. 3. FIG. 6 is an exploded view of the heat dissipation connection structure of FIG. 3. Here, in order to facilitate the explanation of the components, a first direction d1, a second direction d2, and an insertion direction d3 that are perpendicular to each other are provided. Referring to FIGS. 1 to 6, the interface connection structure 100 is used to connect at least one interface device 300 to the circuit board 200. The circuit board 200 has at least one connector 210. The interface connection structure 100 includes a base 110 and a heat dissipation connection structure 120. The base 110 is installed on the circuit board 200 along the insertion direction d3 and includes at least one connector opening 111. At least one connector 210 is located within at least one connector opening 111. The heat dissipation connection structure 120 is removably connected to the base 110 along the insertion direction d3. The insertion direction d3 is perpendicular to the surface 220 of the circuit board 200. The number of connectors 210 in this embodiment is three, and the number of interface devices 300 is two, but the present invention is not limited thereto.

[0008] Each connector 210 has a slot 211, and the slot 211 extends along the insertion direction d3. The heat dissipation connection structure 120 includes a first housing 121 and a second housing 122. The second housing 122 is movably connected to the first housing 121 via a rotation axis R and surrounds an accommodation space P1 together with the first housing 121. The accommodation space P1 can be installed with an interface device 300. Each interface device 300 has a connection portion 310. The first housing 121 includes at least one connection opening 1211, and the connection opening 1211 communicates with the accommodation space P1. When the interface device 300 is installed in the heat dissipation connection structure 120, the connection portion 310 of the interface device 300 is exposed from the corresponding connection opening 1211. At this time, since the heat dissipation connection structure 120 is connected to the base 110 along the insertion direction d3, the connection portion 310 can be inserted into the slot 211 of the corresponding connector 210.

[0009] Thereby, the interface device 300 is stably held in the heat dissipation connection structure 120 and stably connected to the connector 210 of the circuit board 200 via the base 110. Since the interface device 300 is directly connected to the circuit board 200 via the interface connection structure 100, there is no need to connect to the circuit board 200 via an adapter card (not shown). Since there is no need to use tools in the process of connecting and disconnecting the heat dissipation connection structure 120 and the base 110, tool-free disassembly and assembly can be achieved. The interface device 300 of the present embodiment is an M.2 interface card, and the connector 210 of the circuit board 200 is a corresponding M.2 connector. The connector 210 may be an NVMe (NVM Express) connector.

[0010] As shown in FIG. 3, the base 110 further includes a bottom surface 112, side surfaces 113, and a plurality of guide ribs 114. The side surfaces 113 surround and are connected to the bottom surface 112. These connector openings 111 are located on the bottom surface 112. These guide ribs 114 are connected to the side surfaces 113 and extend along the insertion direction d3. When the heat dissipation connection structure 120 is connected to the base 110, these guide ribs 114 contact the heat dissipation connection structure 120 to reduce the contact area between the base 110 and the heat dissipation connection structure 120. Thereby, the frictional force between the base 110 and the heat dissipation connection structure 120 is reduced, and it can be prevented that the frictional force is too high and it is difficult to insert the heat dissipation connection structure 120.

[0011] As shown in FIGS. 1 to 3, the heat dissipation connection structure 120 has a heat dissipation region A1 and a connection region A2. The ranges of the heat dissipation region A1 and the connection region A2 are divided by the connection method between the heat dissipation connection structure 120 and the base 110. When the heat dissipation connection structure 120 is connected to the base 110, the connection region A2 is located within the base 110, and the heat dissipation region A1 is exposed. A part of the first housing 121 and the second housing 122 is located in the heat dissipation region A1, another part of the first housing 121 and the second housing 122 is located in the connection region A2, and the connection opening 1211 is located in the connection region A2.

[0012] The material of the portion located in the heat dissipation region A1 of the first housing 121 and the second housing 122 can include a metal having better heat conduction properties, such as aluminum. When the interface device 300 is installed in the heat dissipation connection structure 120, a part of the interface device 300 is located in the heat dissipation region A1 and is thermally coupled to the heat dissipation connection structure 120. Therefore, the heat dissipation area of the interface device 300 increases, and the heat dissipation efficiency of the interface connection structure 100 can be improved. The interface connection structure 100 selectively further includes a cooling device 130. The cooling device 130 is installed in the heat dissipation region A1 of the heat dissipation connection structure 120. When the interface device 300 is installed in the heat dissipation connection structure 120, since the cooling device 130 is thermally coupled to the interface device 300, the heat dissipation performance of the interface connection structure 100 can be improved. The cooling device 130 can be installed on the first housing 121 and / or the second housing 122. The cooling device 130 includes heat dissipation fins and a fan, but the present invention is not limited thereto. For example, the heat dissipation fins may be integrated with the heat dissipation connection structure 120, and the fan may be externally mounted on the heat dissipation connection structure 120 via a fixture, but the present invention is not limited thereto.

[0013] As shown in FIGS. 2, 5, and 6, the first housing 121 of the heat dissipation connection structure 120 includes a first member 1212 and a second member 1213 connected to each other, and the second housing 122 includes a third member 1221 and a fourth member 1222. The third member 1221 of the second housing 122 is rotatably connected to the end E1 of the first member 1212 of the first housing 121. The connection opening 1211 of the heat dissipation connection structure 120 is located in the second member 1213 of the first housing 121, and another end E2 of the first member 1212 is connected to the second member 1213 via a fixture. The fourth member 1222 is slidably connected to the third member 1221, and the second member 1213 and the fourth member 1222 are located in the connection region A2. The materials of the first member 1212 and the third member 1221 in the present embodiment may be a metal having better heat conduction properties, such as aluminum, but the present invention is not limited thereto. The materials of the second member 1213 and the fourth member 1222 may be plastic, but the present invention is not limited thereto.

[0014] The first housing 121 can optionally include a plurality of positioning members 1214 and a plurality of guide columns 1215 installed on the first member 1212. These guide columns 1215 are arranged along the insertion direction d3 and divide the accommodation space P1 into a plurality of accommodation sub-spaces P2. The interface device 300 can be installed within the accommodation sub-space P2. The positioning member 1214 can stably position the corresponding interface device 300 installed in the accommodation sub-space P2 in the heat dissipation connection structure 120 by any well-known method.

[0015] The heat dissipation connection structure 120 further includes a connecting component 124. The third member 1221 includes a first slide groove 1223, and the fourth member 1222 includes a second slide groove 1224 and an auxiliary slide groove 1225. The first slide groove 1223, the second slide groove 1224, and the auxiliary slide groove 1225 extend along the insertion direction d3. The shape of the second slide groove 1224 is gourd-shaped, but the present invention is not limited thereto. Since the connecting component 124 is connected to the third member 1221 and drilled in the auxiliary slide groove 1225, the fourth member 1222 can be movably connected to the third member 1221 and can be switched between a first position N1 (FIG. 7) and a second position N2 (FIG. 9) along the insertion direction d3. When the fourth member 1222 is in different positions, different portions of the first slide groove 1223 and the second slide groove 1224 form corresponding through holes.

[0016] FIG. 7 is a view when the fourth member in FIG. 6 is in the first position. FIG. 8 is a partially enlarged view of the fourth member in FIG. 7. Referring to FIGS. 5 to 8, specifically, the fourth member 1222 has an opening 1226 and a limiting member 1227. The opening 1226 extends along the insertion direction d3. The limiting member 1227 is connected to the inner surface S1 of the opening 1226 and includes a concave groove recessed along the insertion direction d3. The opening 1226 and the concave groove of the limiting member 1227 jointly form the second slide groove 1224. The width W1 (in the second direction d2) perpendicular to the insertion direction d3 of the first portion B1 of the second slide groove 1224 is larger than the width W2 of the second portion B2 of the second slide groove 1224 and is equal to the width W3 of the opening 1226. The width W2 of the second portion B2 is equal to the width of the concave groove of the limiting member 1227. The thickness (in the first direction d1, that is, perpendicular to the insertion direction d3) of the limiting member 1227 is smaller than the thickness of the opening 1226, but the present invention is not limited thereto.

[0017] The heat dissipation connection structure 120 further includes a fixing member 123, and the fixing member 123 is installed on the first member 1212 of the first housing 121. The fixing member 123 includes a head 1231 and a neck 1232 connected to each other. The width W4 (in the second direction d2) perpendicular to the insertion direction d3 of the head 1231 is larger than the width W5 of the neck 1232. When the fourth member 1222 is in the first position N1, the first slide groove 1223 and the first portion B1 of the second slide groove 1224 form the first through hole OP1. The width W6 of the first through hole OP1 (that is, the width W3 of the first portion B1) is larger than or equal to the width W4 of the head 1231 of the fixing member 123. Thereby, the fixing member 123 releases the second housing 122, and the second housing 122 can rotate relative to the first housing 121. When the second housing 122 is closed to the first housing 121, the neck 1232 of the fixing member 123 is formed through the first through hole OP1 (that is, the first slide groove 1223 and the first portion B1 of the second slide groove 1224), and the head 1231 of the fixing member 123 is located in the opening 1226 of the second slide groove 1224. There is a distance D between the end E3 away from the rotation axis R of the second member 1213 and the end E4 away from the rotation axis R of the fourth member 1222, and the distance D is larger than zero.

[0018] FIG. 9 is a schematic view when the fourth member in FIG. 7 is in the second position. FIG. 10 is a partially enlarged view of the fourth member in FIG. 9. The fourth member 1222 can slide along the insertion direction d3 to the second position N2 relative to the third member 1221 when receiving a force. When the fourth member 1222 is in the second position N2, the distance between the end E3 of the second member 1213 and the end E4 of the fourth member 1222 is zero. The second portions B2 of the first slide groove 1223 and the second slide groove 1224 form the second through hole OP2. The width W7 of the second through hole OP2 (that is, the width W2 of the second portion B2) is smaller than the width W4 of the head 1231 and larger than or equal to the width W5 of the neck portion 1232. The width W7 in this embodiment is larger than the width W4, but the present invention is not limited thereto. Thereby, the head 1231 of the fixing member 123 can limit the movement of the second housing 122 (limiting member 1227) relative to the first housing 121 in the first direction d1 and the second direction d2, thereby restricting the rotation of the second housing 122 relative to the first housing 121 and enabling the second housing 122 to be stably closed to the first housing 121.

[0019] When the heat dissipation connection structure 120 is connected to the base 110 (FIG. 1), the fourth member 1222 can be located at the first position N1. The fourth member 1222 is pushed by the bottom surface 112 (FIG. 4) of the base 110 during the process of being inserted into the base 110 and moves to the second position N2. The user may first move the fourth member 1222 to the second position N2 and then insert the heat dissipation connection structure 120 into the base 110.

[0020] Also, as shown in FIGS. 7 and 9, the fourth member 1222 of the second housing 122 further includes an operation opening B3 and a recess 1228, and the third member 1221 of the second housing 122 further includes a convex portion 1229. The user's finger can push the fourth member 1222 through the operation opening B3, and by combining the convex portion 1229 and the recess 1228, the sliding distance of the fourth member 1222 relative to the third member 1221 can be limited.

[0021] As shown in FIGS. 3 and 4, the base 110 further includes a first positioning hole 115, an auxiliary opening 116, and a second positioning hole 117, and the heat dissipation connection structure 120 further includes a first positioning protrusion 125 and a second positioning protrusion 126. The first positioning hole 115 and the auxiliary opening 116 are located on the side surface 113 of the base 110. The auxiliary opening 116 is U-shaped and surrounds the first positioning hole 115. The second positioning hole 117 is located on the bottom surface 112 of the base 110. The first positioning protrusion 125 extends along the second direction d2, and the second positioning protrusion 126 extends along the insertion direction d3. The first positioning protrusion 125 and the second positioning protrusion 126 are located on the second member 1213 of the first housing 121 and respectively correspond to the first positioning hole 115 and the second positioning hole 117.

[0022] When the heat dissipation connection structure 120 is connected to the base 110, since the first positioning protrusion 125 is located in the first positioning hole 115 and the second positioning protrusion 126 is located in the second positioning hole 117, the heat dissipation connection structure 120 can be more stably connected to the base 110. When removing the heat dissipation connection structure 120 from the base 110, the portion of the side surface 113 of the base 110 where the first positioning hole 115 is provided can be slightly deformed through the auxiliary opening 116, so that the first positioning protrusion 125 can be separated from the first positioning hole 115, and the heat dissipation connection structure 120 can be smoothly moved from the base 110.

[0023] As described above, the heat dissipation connection structure of the interface connection structure of the present invention is used to hold the interface device, and the connection portion of the interface device is exposed from the heat dissipation connection structure. By installing the base of the interface connection structure on the circuit board and inserting the heat dissipation connection structure into the base, the connection portion of the interface device can be directly and stably connected to the connector of the circuit board.

Industrial Applicability

[0024] The interface connection structure of the present invention can easily connect the interface device to the circuit board.

Description of Symbols

[0025] A1 Heat dissipation area A2 Connection area B1 First part B2 Second part B3 Operation opening D Distance d1 First direction d2 Second direction d3 Insertion direction E1, E2, E3, E4 Ends N1 First position N2 Second position OP1 First through hole OP2 Second through hole P1 Accommodation space P2 Sub-accommodation space R Rotation axis S1 Inner surface W1, W2, W3, W4, W5, W6, W7 Widths 100 Interface connection structure 110 Base 111 Connector opening 112 Bottom surface 113 Side surface 114 Guide rib 115 First positioning hole 116 Auxiliary opening 117 Second positioning hole 120 Heat dissipation connection structure 121 First housing 1211 Connection opening 1212 First member 1213 Second member 1214 Positioning member 1215 Guide column 122 Second housing 1221 Third member 1222 Fourth member 1223 First slide groove 1224 Second slide groove 1225 Auxiliary slide groove 1226 Opening 1227 Limiting member 1228 recess 1229 protrusion 123 fixing member 1231 head 1232 leading end 124 connecting component 125 first positioning protrusion 126 second positioning protrusion 130 cooling device 200 circuit board 210 connector 211 slot 220 surface 300 interface device 310 connection part

Claims

1. An interface connection structure for a circuit board, the circuit board having at least one connector, each of the at least one connector having a slot, the slot extending along an insertion direction, and the insertion direction being perpendicular to the circuit board, comprising: The interface connection structure is a base mounted to the circuit board and including at least one connector opening, the at least one connector being positioned within the at least one connector opening; a heat dissipation connection structure adapted to be detachably connected to the base along the insertion direction, the heat dissipation connection structure including a first housing and a second housing, the second housing being movably connected to the first housing and surrounding an accommodation space together with the first housing, the first housing including at least one connection opening, the accommodation space being adapted to install at least one interface device, and each of the at least one interface device having a connection portion; Including, When the at least one interface device is installed in the accommodation space, the connection portion is exposed from the at least one connection opening, and the heat dissipation connection structure is suitable for connecting to the base along the insertion direction, so that the connection portion can be inserted into the slot.

2. the first housing includes a first member and a second member connected to each other; the second housing is movably connected to the first member, the at least one connecting opening is located in the second member; The interface connection structure according to claim 1 , wherein the second member is located within the base when the heat dissipation connection structure is connected to the base.

3. the second housing includes a third member and a fourth member, the third member is rotatably connected to the first housing, the fourth member is slidably connected to the third member; The interface connection structure according to claim 1 , wherein the fourth member is located within the base when the heat dissipation connection structure is connected to the base.

4. The heat dissipation connection structure further includes a fixing member, the third member includes a first slide groove; the fourth member includes a second slide groove; the fixing member is mounted on the first housing and includes a head and a neck connected to each other; The width of the head is greater than the width of the neck, The interface connection structure according to claim 3 , wherein the neck portion is provided in the first slide groove and the second slide groove when the second housing is closed to the first housing.

5. When the fourth member is in a first position, the first slide groove and the second slide groove form a first through hole, and a width of the first through hole is greater than or equal to the width of the head portion; 5. The interface connection structure of claim 4, wherein when the fourth member is in the second position, the first slide groove and the second slide groove form a second through hole, and the width of the second through hole is smaller than the width of the head and greater than or equal to the width of the neck.

6. the heat dissipation connection structure has a heat dissipation region and a connection region, When the at least one interface device is disposed on the heat dissipation connection structure, a portion of the at least one interface device is located in the heat dissipation area and is thermally coupled to the heat dissipation connection structure; The interface connection structure according to claim 1 , wherein when the heat dissipation connection structure is connected to the base, the connection area is located within the base and the heat dissipation area is exposed.

7. a portion of the first housing and a portion of the second housing are located in the heat dissipation region, Another portion of the first housing and the second housing is located in the connection region; The interface connection structure according to claim 6 , wherein the connection opening is located in the connection area.

8. Further comprising a cooling device; The cooling device is installed in the heat dissipation connection structure; The interface connection structure according to claim 1 , wherein the cooling device is thermally coupled to the at least one interface device when the at least one interface device is installed on the heat dissipation connection structure.

9. the at least one connector on the circuit board is an M.2 connector; 2. The interface connection structure according to claim 1, wherein the at least one interface device is an M.2 interface card.

10. the base includes a plurality of guide ribs extending along the insertion direction; The interface connection structure as claimed in claim 1 , wherein the guide rib contacts the heat dissipation connection structure when the heat dissipation connection structure is connected to the base.

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