Semiconductor device manufacturing method, display method, substrate processing apparatus, and program

The recipe editing screen with parameter and gas pattern screens in substrate processing apparatuses ensures accurate gas line and valve settings by displaying icons and warnings, preventing errors in the manufacturing process.

JP7597911B2Active Publication Date: 2024-12-10KOKUSAI DENKI KK
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Patent Information

Application Number
JP2023508178
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2021-03-22
Publication Date
2024-12-10
Estimated Expiration
2041-03-22

AI Technical Summary

Technical Problem

There is a risk of setting the wrong gas flow rate for the wrong gas line in substrate processing apparatuses, leading to potential errors in the manufacturing process.

Method used

A recipe editing screen is designed with a parameter setting area for gas flow rate and a gas pattern screen to clearly indicate the corresponding gas line, displaying icons and changing colors to confirm the correct gas line and valve settings, and displaying warnings for interlock conditions.

Benefits of technology

Prevents incorrect gas line and valve settings by clearly indicating the corresponding gas flow rate and valve states, reducing errors in the manufacturing process.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

The present invention enables identification of one of gas lines that is to be subject to gas flow rate setting by a user. Provided is a semiconductor device manufacturing method comprising: a process for displaying, on a recipe editing screen for editing a recipe including a plurality of steps, at least a parameter setting region for setting control parameters including gas flow rates of flow rate controllers and a gas pattern screen for setting the open / close status of a valve; a process for editing the recipe on the recipe editing screen; and a process for treating a substrate by executing a created recipe. In a process of creating the recipe, upon setting of a gas flow rate of a flow rate controller in the parameter setting region, a flow rate controller that is on the gas pattern screen and that corresponds to the flow rate controller to which the gas flow rate has been set is clearly indicated.
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Description

[Technical field]

[0001] The present disclosure relates to a manufacturing method of a semiconductor device, a display method, a substrate processing apparatus, and a program. [Background technology]

[0002] Generally, a substrate processing apparatus is provided with a plurality of gas lines for supplying various gases, such as a source gas, an inert gas, a reactive gas, etc., into a processing chamber. In the substrate processing apparatus, a predetermined process is performed by opening and closing valves of each gas line to supply various gases from a gas supply system to a substrate (hereinafter also referred to as a wafer) in the processing chamber.

[0003] Patent document 1 discloses a substrate processing apparatus that creates recipes by displaying, all at once on a recipe editing screen, an area for setting control parameters, an area for setting valve open / close states, and an area for displaying various parameter information.

[0004] Patent document 2 discloses a processing device that creates recipes by displaying on a recipe editing screen a recipe editing area for editing the steps of a recipe file, a sub-area for displaying combination files associated with the recipe, and a command selection area for selecting recipe editing commands and performing actual editing actions.

[0005] Patent Document 3 discloses a substrate processing apparatus that allows switching from a recipe editing screen to a gas pattern screen and allows valve opening / closing settings to be made.

[0006] However, when a user sets a gas flow rate on the recipe editing screen, there is a risk that the user may set a gas flow rate for an incorrect gas line. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] JP 2017-002353 A [Patent Document 2] International Publication No. 2019 / 186649 Brochure [Patent Document 3] JP 2006-093494 A Summary of the Invention [Problem to be solved by the invention]

[0008] According to the present disclosure, a technique is provided that allows a user to confirm which gas line the gas flow rate that he or she is about to set corresponds to. [Means for solving the problem]

[0009] According to one aspect of the present disclosure, a method for producing a recipe including a plurality of steps includes the steps of: displaying, on a recipe editing screen, a parameter setting area for setting control parameters including at least a gas flow rate of a flow rate controller; and a gas pattern screen for setting an open / closed state of a valve; editing the recipe on the recipe editing screen; processing the substrate by executing the edited recipe; having In the recipe editing step, when a gas flow rate of the flow controller is set in the parameter setting area, a technique is provided for clearly indicating the flow controller on the gas pattern screen that corresponds to the flow controller for which the gas flow rate has been set. Effect of the Invention

[0010] According to the present disclosure, it is possible to confirm which gas line the gas flow rate that the user is about to set corresponds to. [Brief description of the drawings]

[0011] [Figure 1] 1 is a vertical sectional view of a processing furnace 202 of a substrate processing apparatus 10 suitably used in an embodiment of the present disclosure. [Diagram 2]FIG. 2 is a schematic configuration diagram of a controller 240 of the substrate processing apparatus 10 preferably used in an embodiment of the present disclosure, showing a control system of the controller in a block diagram. [Diagram 3] 13 is a display example of a recipe editing screen 20 that is displayed when editing a recipe. [Figure 4] 4 is an enlarged view of a step setting area 30 of the recipe editing screen 20 shown in FIG. [Diagram 5] 4 is an enlarged view of a step content setting area 40 on the recipe editing screen 20 shown in FIG. 3. [Figure 6] FIG. 13 is a diagram showing an example of a warning display when a valve interlock condition is met when valve 243a is set to open on gas pattern screen 42. [Figure 7] FIG. 13 is a diagram showing an example of a display of a valve interlock condition when a valve for which a valve interlock condition is set is pressed and held on gas pattern screen 42. [Figure 8] FIG. 13 is a diagram showing an example of a display in which, when an arbitrary valve is selected on the gas pattern screen 42, the gas pipes connected to the selected valve are clearly shown. [Figure 9] 10 is a flowchart illustrating a flow at the start of recipe editing in the substrate processing apparatus 10 according to an embodiment of the present disclosure. [Figure 10] 4 is a flowchart illustrating a procedure for setting gas in the substrate processing apparatus 10 according to an embodiment of the present disclosure. [Figure 11] 11 is a flowchart for explaining a process performed when settings are changed in a parameter setting area 41 or a gas pattern screen 42 on a recipe editing screen 20 in the substrate processing apparatus 10 according to an embodiment of the present disclosure. [Figure 12] 13 is a flowchart illustrating a process for correspondingly displaying MFCs in a parameter setting area 41 and a gas pattern screen 42 on a recipe editing screen 20 in the substrate processing apparatus 10 according to an embodiment of the present disclosure. [Figure 13]11 is a flowchart for explaining a process performed when an arbitrary valve is selected on a gas pattern screen 42 on a recipe editing screen 20 in the substrate processing apparatus 10 according to an embodiment of the present disclosure. [Figure 14] 11 is a flowchart for explaining a process for displaying a step setting area 30 of a recipe editing screen 20 in the substrate processing apparatus 10 according to an embodiment of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] Hereinafter, an embodiment of the present disclosure will be described with reference to the drawings. First, a substrate processing apparatus 10 in which the present disclosure is implemented will be described with reference to Figs. 1 and 2. It should be noted that all of the drawings used in the following description are schematic, and the dimensional relationships of the elements, the ratios of the elements, and the like shown in the drawings do not necessarily match the actual ones. Furthermore, the dimensional relationships of the elements, the ratios of the elements, and the like between multiple drawings do not necessarily match.

[0013] The substrate processing apparatus 10 includes a processing furnace 202 for performing processing on a wafer 200 as a substrate transferred into a housing. As shown in Fig. 1, the processing furnace 202 has a heater 207 as a heating mechanism (temperature adjustment unit). The heater 207 has a cylindrical shape and is installed vertically by being supported by a holding plate. The heater 207 also functions as an activation mechanism (excitation unit) that activates (excites) a gas by heat.

[0014] A reaction tube 203 is disposed inside the heater 207 concentrically with the heater 207. The reaction tube 203 is made of a heat-resistant material such as quartz (SiO2) or silicon carbide (SiC) and is formed in a cylindrical shape with a closed upper end and an open lower end. A processing chamber 201 is formed in the cylindrical hollow portion of the reaction tube 203. The processing chamber 201 is configured to be capable of accommodating a wafer 200. The wafer 200 is processed in the processing chamber 201.

[0015] A plurality of nozzles 249 are provided in the processing chamber 201 so as to penetrate the lower sidewall of the reaction tube 203. A plurality of gas supply pipes 232 are connected to each nozzle 249, respectively.

[0016] In the gas supply pipe 232, a mass flow controller (MFC) 241 which is a flow rate controller (flow rate control part) and a valve 243 which is an opening / closing valve are provided in this order from the upstream side.

[0017] From the gas supply pipe 232, various gases such as a source gas, an inert gas, and a reactive gas are supplied into the processing chamber 201 via the MFC 241, the valve 243, and the nozzle 249, respectively.

[0018] Further, an exhaust pipe 231 for exhausting the atmosphere of the processing chamber 201 is connected to the lower side wall of the reaction tube 203. An exhaust device 246 constituted by a vacuum pump is connected to the exhaust pipe 231 via a pressure sensor 245 as a pressure detector (pressure detection unit) for detecting the pressure in the processing chamber 201 and an APC (Auto Pressure Controller) valve 244 as a pressure regulator (pressure adjustment unit). The APC valve 244 can perform evacuation and stop evacuation in the processing chamber 201 by opening and closing the valve while the exhaust device 246 is in operation, and further, can adjust the pressure of the processing chamber 201 by adjusting the valve opening based on pressure information detected by the pressure sensor 245 while the exhaust device 246 is in operation. An exhaust system is mainly constituted by the exhaust pipe 231, the pressure sensor 245, and the APC valve 244. The exhaust device 246 may be included in the exhaust system.

[0019] The gas supply pipe 232 and the exhaust pipe 231 may be collectively referred to as gas piping.

[0020] Further, below the reaction tube 203, a seal cap 219 is provided as a furnace port cover capable of airtightly closing the lower end opening of the reaction tube 203. The seal cap 219 is made of a metal material such as SUS and is formed in a disk shape. An O-ring 220 is provided on the upper surface of the seal cap 219 as a seal member that contacts the lower end of the reaction tube 203. Below the seal cap 219, a rotation mechanism 267 is provided for rotating the boat 217 described later. A rotation shaft 255 of the rotation mechanism 267 is connected to the boat 217 through the seal cap 219. The rotation mechanism 267 is configured to rotate the boat 217 to rotate the wafers 200.

[0021] The seal cap 219 is configured to be raised and lowered in the vertical direction by a boat elevator 115 serving as a lifting mechanism installed outside the reaction tube 203. The boat elevator 115 is configured as a transfer device (transfer mechanism) that lifts and lowers the seal cap 219 to load and unload (transport) the wafer 200 into and out of the processing chamber 201.

[0022] The boat 217 as a substrate support is configured to support a plurality of wafers 200, for example 25 to 250 wafers 200, in a horizontal position and aligned vertically with their centers aligned, i.e., arranged at intervals. The boat 217 is made of a heat-resistant material such as quartz or SiC. At the bottom of the boat 217, heat insulating plates 218 made of a heat-resistant material such as quartz or SiC are supported in multiple stages in a horizontal position.

[0023] A temperature sensor 263 serving as a temperature detector is installed in the reaction tube 203. By adjusting the power supply to the heater 207 based on temperature information detected by the temperature sensor 263, the temperature distribution in the process chamber 201 becomes a desired one. The temperature sensor 263 is installed along the inner wall of the reaction tube 203.

[0024] 2, the controller 240, which is a control unit (control means), is configured as a computer including a CPU (Central Processing Unit) 240a, a RAM (Random Access Memory) 240b, a storage device 240c, and an I / O port 240d. The RAM 240b, the storage device 240c, and the I / O port 240d are configured to be able to exchange data with the CPU 240a via an internal bus 240e. An input / output device 252 configured as, for example, a touch panel, is connected to the controller 240.

[0025] The storage device 240c is composed of, for example, a flash memory, a HDD (Hard Disk Drive), etc. A control program for controlling the operation of the substrate processing apparatus, a recipe describing a predetermined processing procedure (hereinafter also referred to as a step), conditions, etc. are readably stored in the storage device 240c. A process recipe, which is mainly composed of a plurality of steps, is combined so that each step in a predetermined process can be executed by the controller 240 to obtain a predetermined result, and functions as a program.

[0026] Hereinafter, recipes including process recipes and control programs are collectively referred to simply as programs. In addition, hereinafter, process recipes are also simply referred to as recipes. When the word program is used in this specification, it may include only a recipe, only a control program, or both. The RAM 240b is configured as a memory area (work area) in which programs, data, etc. read by the CPU 240a are temporarily stored.

[0027] The I / O port 240d is connected to the above-mentioned MFC 241, valve 243, pressure sensor 245, APC valve 244, exhaust device 246, temperature sensor 263, heater 207, rotation mechanism 267, boat elevator 115, and the like.

[0028] The CPU 240a is configured to read and execute a control program from the storage device 240c, and to read a recipe from the storage device 240c in response to an input of an operation command from the input / output device 252, etc. The CPU 240a is configured to control the flow rate adjustment operation of various gases by the MFC 241, the opening and closing operation of the valve 243, the opening and closing operation of the APC valve 244 and the pressure adjustment operation by the APC valve 244 based on the pressure sensor 245, the start and stop of the exhaust device 246, the temperature adjustment operation of the heater 207 based on the temperature sensor 263, the rotation and rotation speed adjustment operation of the boat 217 by the rotation mechanism 267, the lifting and lowering operation of the boat 217 by the boat elevator 115, etc., in accordance with the contents of the read recipe.

[0029] The controller 240 can be configured by installing the above-mentioned program stored in the external storage device 250 in a computer. The external storage device 250 includes, for example, a magnetic disk such as an HDD, an optical disk such as a CD, a magneto-optical disk such as an MO, and a semiconductor memory such as a USB memory. The storage device 240c and the external storage device 250 are configured as computer-readable recording media. Hereinafter, these are collectively referred to simply as recording media. When the term recording media is used in this specification, it may include only the storage device 240c alone, only the external storage device 250 alone, or both. The program may be provided to the computer using a communication means such as the Internet or a dedicated line, without using the external storage device 250.

[0030] When editing (creating) a recipe including multiple steps, the substrate processing apparatus 10 of this embodiment displays, on a recipe editing screen, a parameter setting area for setting control parameters and a gas pattern screen including valves and gas piping. When a control parameter for, for example, an MFC (flow rate controller) is set in the parameter setting area, an icon indicating the MFC in the gas pattern screen corresponding to the MFC for which the control parameter is set is displayed.

[0031] The recipe editing screen 20 shown in Fig. 3 includes a step setting area 30 and a step content setting area 40. When a user selects a step to be edited in the step setting area 30 on the left side of the figure, the content of the selected step is displayed in the step content setting area 40 on the right side of the figure. In the step content setting area 40, a parameter setting area 41 for setting control parameters and a gas pattern screen 42 for setting the open / closed state of a valve are displayed.

[0032] That is, the recipe editing screen 20 is configured to display a parameter setting area 41 and a gas pattern screen 42 for each step. The recipe editing screen 20 also has a step setting area 30 for setting the steps of the parameter setting area 41 and the gas pattern screen 42 to be displayed.

[0033] 4, step setting area 30 is in a two-dimensional matrix format, with steps displayed in vertical axis area 31 and item types displayed in horizontal axis area 32. When a step to be edited is selected in vertical axis area 31, a selection display frame 34 is displayed and the currently selected step is clearly shown.

[0034] The step setting area 30 is configured to display whether or not the control parameter settings have been changed for each step item. In the example shown in Fig. 4, an * mark is displayed in the matrix display area 33 of the step setting area 30 for items 33a that have been changed.

[0035] Furthermore, when the control parameters are set to match the interlock conditions, a warning is displayed in the step setting area 30. Here, the interlock conditions refer to setting contents that are problematic in the substrate processing apparatus 10. The interlock conditions are preset and stored in the external storage device 250 of the controller 240. In the example shown in Fig. 4, in the matrix display area 33 of the step setting area 30, the background color of the item 33b for which the control parameters are set to match the interlock conditions is displayed in a warning color as a warning display.

[0036] In the example shown in Figure 5, nine tabs are displayed: "Outline," "Temperature," "Pressure," "MFC," "Valve," "Transport," "AUX (external equipment)," "Signal," and "Alarm."

[0037] 5 shows the state when the "outline" tab is selected. The "outline" tab shows an overview of the selected step, and displays a parameter setting area 41 for setting the main control parameters such as temperature, pressure, transport, MFC, etc., and a gas pattern screen 42 for setting the opening and closing of valves.

[0038] As shown in Figure 5, other than the "Outline" tab, it consists of multiple tabs divided by the type of control parameter. When the "Temperature", "Pressure", "MFC", "Valve", "Transport", "AUX (external equipment)", "Signal" or "Alarm" tab is selected, the setting area for the control parameters of each item is displayed.

[0039] Control parameters related to "temperature" include, for example, "control mode to be used in the step," "designation of the control table," "set value of the temperature zone," "designation of the ramp rate," and "setting of whether or not there is a step end condition."

[0040] Control parameters related to "pressure" include, for example, "control mode to be used in the step", "designation of control table", "designation of pressure command and set value", "setting of presence or absence of step end condition", and the like.

[0041] Examples of control parameters related to "MFC" include "setting values ​​for each MFC", "designation of ramp rate", and "setting with or without step end condition".

[0042] An example of a control parameter related to the "valve" is "gas pattern editing (valve ON / OFF)".

[0043] Examples of control parameters related to "transport" include "designation of loader command" and "designation of execution conditions (eg, speed, etc.) of the loader command to be used."

[0044] Examples of control parameters related to "AUX (external device)" include "designation of setting value for each AUX", "setting of presence or absence of step end condition", etc. Since AUX (external device) is read-only, the controller 240 verifies whether the read value matches the condition against the set value.

[0045] An example of a control parameter related to "signal" is "signal ON / OFF designation". Specifically, "signal ON / OFF designation" designates ON / OFF of a specific signal for the controller 240. The controller 240 starts or prohibits operation depending on the signal state.

[0046] An example of a control parameter related to "Alarm" is "Alarm Condition". The alarm condition specifies, for example, whether or not an alarm is to be generated for each monitoring value. In the "Alarm" tab, the settings currently being used are displayed in the form of an alarm condition table in which multiple alarm conditions are summarized in a tabular format.

[0047] It should be noted that these control parameters are merely examples, and the parameters displayed on the recipe editing screen 20 can be set appropriately depending on the recipe.

[0048] The gas pattern screen 42 shows a network of gas pipes connecting various components such as multiple MFCs 241, multiple valves 243, a processing furnace, a vaporizer, an exhaust device, and a pressure regulator, each of which is displayed as an icon.

[0049] On this gas pattern screen, it is possible to monitor the open / closed state, which indicates whether the current valve is in an open or closed state. Specifically, when the valve is in an open state or a closed state, the display color of the valve changes, allowing the user to know whether the valve is in an open state or a closed state.

[0050] Furthermore, in addition to the function of monitoring the open / closed state of the valves, the gas pattern screen 42 is also provided with an operation function that allows the user to switch the open / closed state of any valve. When the user uses this valve operation function, the user can switch between the open state and the closed state by tapping the image of the valve 243 displayed on the gas pattern screen 42.

[0051] The controller 240 is configured to be able to create recipes on the recipe editing screen 20, which creates recipes including multiple steps, while displaying a parameter setting area 41 for setting control parameters including at least the gas flow rate of the MFC, and a gas pattern screen 42 for setting the open / closed state of the valves.

[0052] Furthermore, when a gas flow rate of an MFC is set on the gas flow rate list 50 in the parameter setting area 41, the controller 240 is configured to clearly indicate on the gas pattern screen 42 the MFC corresponding to the MFC for which the gas flow rate has been set. The way of clearly indicating the MFC 241 on the gas pattern screen 42 corresponding to the MFC for which the gas flow rate has been set can be in various modes, for example, by changing the display color of the MFC 241 on the gas pattern screen 42, changing the display size, changing the line type of the drawn line, changing the display brightness, and the like.

[0053] Furthermore, the controller 240 is configured to, for example, when an MFC is selected on the gas pattern screen 42, clearly indicate the MFC on the gas flow rate list 50 that corresponds to the selected MFC. The method of clearly indicating the MFC on the gas flow rate list 50 may, for example, be to move the selection position of the selection cursor 50a in the gas flow rate list 50 to the position of the MFC selected on the gas pattern screen 42. In addition, various other modes are possible, such as changing the display color or display size of the MFC on the gas flow rate list 50.

[0054] The example shown in FIG. 5 shows that when the gas flow rate of an MFC named “MFC_3” is set in the MFC list 50 in the parameter setting area 41, the display color of MFC 241a, which is “MFC_3”, is changed on the gas pattern screen 42.

[0055] In addition, when any valve is selected on the gas pattern screen 42, the controller 240 is configured to determine the open / closed state of the any valve, and when any valve on the gas pattern screen 42 is set to open, to check the prohibition conditions (hereinafter referred to as valve interlock conditions) that prohibit the valve from being set to an open state, and if the valve meets the valve interlock conditions, to display a warning as shown in FIG. 6.

[0056] 6 shows a state in which a message "Valve interlock condition is violated" is displayed as a warning display because the valve interlock condition is met when the valve 243a is set to open on the gas pattern screen 42. Note that the manner of displaying the warning is not limited to displaying the message as described above, and various other modes are possible, such as changing the display color of the valve 243a, changing the display size, changing the line type of the drawn line, and changing the display brightness.

[0057] Furthermore, when a valve for which a valve interlock condition is set is selected by long tapping on the gas pattern screen 42, the controller 240 is configured to display the valve interlock condition on the gas pattern screen 42, as shown in Fig. 7. Note that the selection for displaying the valve interlock condition is not limited to a long tap, and any selection method different from the selection method used when setting the valve to open / close, such as a right click of the mouse, may be used.

[0058] Furthermore, the controller 240 is configured so that when an arbitrary valve is selected on the gas pattern screen 42, the controller 240 clearly indicates the gas piping connected to the selected valve, as shown in FIG.

[0059] 8 shows a state in which the gas pipes connected before and after the valve 243b are displayed in bold lines when the valve 243b is selected on the gas pattern screen 42. Note that the way in which the gas pipes are displayed is not limited to the bold line display as described above, and various other modes are possible, such as changing the display color of the gas pipes, changing the line type of the drawn line of the gas pipes, changing the display brightness of the gas pipes, etc.

[0060] In this way, by clearly indicating the gas pipes connected to the selected valve on the gas pattern screen 42, it becomes clear which gas pipe the valve selected by the user is associated with, which is expected to prevent erroneous settings.

[0061] This gas pattern screen is configured to display at least the valves provided from the supply system that supplies raw materials such as gas to the reaction chamber to the exhaust system that depressurizes the reaction chamber to a vacuum atmosphere. Also, various parameters of the above-mentioned MFC, vaporizer, exhaust device, pressure regulator, and other components displayed on the gas pattern screen can be set.

[0062] In this way, by selecting an icon displayed on the gas pattern screen 42 to display an operation screen, parameters for various components such as the MFC 241, the vaporizer, the exhaust device, and the pressure regulator can be set.

[0063] In addition, since various control parameters can be set while displaying the gas pattern screen 42 on which icons are displayed from the gas supply side to the exhaust system, it is expected that erroneous settings can be prevented.

[0064] Next, a flow at the start of recipe editing in the substrate processing apparatus 10 of this embodiment will be described with reference to the flowchart of FIG.

[0065] In FIG. 9, first, in S101, the user starts recipe editing, and in S102, the user checks whether the step to be edited is known. If the step to be edited is known, in S103, the user selects the step to be edited from step setting area 30, causes the contents of the step to be edited to be displayed in step content setting area 40, and in S104, editing of the step is started.

[0066] If the step to be edited is not known in S102, the user selects the step in which the target item has been changed in the step setting area 30 in S105, and checks in S106 whether the selected step is the desired editing step.

[0067] If the selected step is the desired editing step in S106, the user starts editing the step in S104. If the selected step is not the desired editing step, the user returns to S105 and repeats the selection and confirmation until the desired editing step is found.

[0068] Next, a flow of gas setting in the substrate processing apparatus 10 of this embodiment will be described with reference to the flowchart of FIG.

[0069] 10, first, in S201, the user starts editing a step and starts setting gases within the step. Then, in S202, the user performs an open / close setting operation for the target valve, in S203, sets the flow rate of the target MFC, and in S204, ends the gas setting.

[0070] Next, a process when the settings are changed in the parameter setting area 41 or the gas pattern screen 42 on the recipe editing screen 20 in the substrate processing apparatus 10 of this embodiment will be described with reference to a flowchart in FIG.

[0071] In FIG. 11, first, in S301, when the controller 240 receives a setting change in the parameter setting area 41 or the gas pattern screen 42, in S302, it determines whether or not the changed setting is an inconsistent setting that meets the interlock condition.

[0072] If it is determined in S302 that the changed setting is not an inconsistent setting (if the determination result is No), the controller 240 updates to the changed setting in S303.

[0073] If it is determined in S302 that the changed settings are inconsistent settings (if the determination result is Yes), then in S304, the controller 240 updates the background color of the relevant area of ​​the matrix display area 33 in the step setting area 30 to a warning color, as shown in item 33b of FIG. 4, to notify the user that the settings are inconsistent, and then in S303, updates the settings to the changed settings.

[0074] Next, a process for displaying MFCs in association with each other in the parameter setting area 41 and the gas pattern screen 42 on the recipe editing screen 20 in the substrate processing apparatus 10 of this embodiment will be described with reference to a flowchart in FIG.

[0075] In FIG. 12, first, in S401, the controller 240 displays the parameter setting area 41 including the gas flow rate list 50 and the gas pattern screen .

[0076] Next, in S402, when the controller 240 receives a change in the selection status of an MFC in either the gas flow rate list 50 or the gas pattern screen 42, in S403, it determines whether a change in the selection status of an MFC has occurred in the gas flow rate list 50.

[0077] Then, in S403, if it is determined that a change in the selection state of the MFC has occurred in the gas flow rate list 50 (if the determination result is Yes), the controller 240 changes the display color of the MFC selected in the gas flow rate list 50 on the gas pattern screen 42 in S404, and updates the drawing on the recipe editing screen 20 in S405.

[0078] Furthermore, if it is determined in S403 that no change has occurred in the selection state of the MFC in the gas flow rate list 50 (if the determination result is No), that is, if it is determined that a change has occurred in the selection state of the MFC in the gas pattern screen 42, the controller 240 moves the selection position of the selection cursor 50a to the MFC corresponding to the gas pattern screen 42 in the gas flow rate list 50 in S406, and updates the drawing on the recipe editing screen 20 in S405.

[0079] In this way, by displaying the MFCs in correspondence with each other on the gas flow list 50 in the parameter setting area 41 and the gas pattern screen 42, it becomes clear which gas line the gas flow rate the user is trying to set corresponds to, which is expected to prevent erroneous setting. Also, it goes without saying that the MFM is the same as the above-mentioned MFC.

[0080] Next, a process performed when an arbitrary valve is selected on the gas pattern screen 42 on the recipe editing screen 20 in the substrate processing apparatus 10 of this embodiment will be described with reference to a flowchart in FIG.

[0081] In FIG. 13, first, in S501, the controller 240 displays the gas pattern screen 42.

[0082] Next, in S502, when an arbitrary valve is selected on the gas pattern screen 42, the controller 240 determines whether the selection is made by a long tap.

[0083] If it is determined in S502 that the selection is made by a long tap (if the determination result is Yes), the controller 240 determines in S503 whether or not a valve interlock condition is set for the selected valve.

[0084] In S503, if it is determined that a valve interlock condition is set for the selected valve (if the determination result is Yes), in S504, the controller 240 displays the valve interlock condition on the gas pattern screen 42 as shown in FIG. 7.

[0085] If it is determined in S503 that a valve interlock condition is not set for the selected valve (if the determination result is No), the controller 240 displays a message indicating that a valve interlock condition is not set for the selected valve on the gas pattern screen 42 in S505.

[0086] Also, if it is determined in S502 that the selection is not a long tap (if the determination result is No), the controller 240 assumes that the selection for the valve is an instruction to switch the open / closed state of the valve, and in S506 determines whether the selected valve is in an open state.

[0087] If it is determined in S506 that the selected valve is in an open state (if the determination result is Yes), the controller 240 sets the selected valve to a closed state in S507.

[0088] If it is determined in S506 that the selected valve is not in an open state (if the determination result is No), that is, if it is determined that the selected valve is in a closed state, the controller 240 determines in S508 whether or not a valve interlock condition is set for the selected valve.

[0089] If it is determined in S508 that a valve interlock condition is set for the selected valve (if the determination result is Yes), the controller 240 determines in S509 whether the open setting for the selected valve matches the valve interlock condition.

[0090] If it is determined in S509 that the open setting for the selected valve meets the valve interlock condition (if the determination result is Yes), in S510, the controller 240 displays a warning on the gas pattern screen 42 as shown in FIG. 6, and in S511, sets the selected valve to an open state.

[0091] If it is determined in S508 that the valve interlock condition is not set for the selected valve (if the determination result is No), or if it is determined in S509 that the open setting for the selected valve does not match the valve interlock condition (if the determination result is No), the controller 240 does not display a warning on the gas pattern screen 42, and in S511 sets the selected valve to an open state.

[0092] In this way, when any valve is selected on gas pattern screen 42, the open / closed state of the arbitrary valve is determined, and when any valve on gas pattern screen 42 is set to open, the valve interlock conditions are checked, and a warning is displayed if the valve meets the valve interlock conditions, which is expected to have the effect of preventing erroneous valve setting.

[0093] In addition, when a valve for which a valve interlock condition is set is selected by a long tap on the gas pattern screen 42, the valve interlock condition is displayed on the gas pattern screen 42 so that the user can visually confirm the valve interlock condition, which is expected to have the effect of preventing erroneous valve setting.

[0094] Next, a process for displaying the step setting area 30 on the recipe editing screen 20 in the substrate processing apparatus 10 of this embodiment will be described with reference to a flowchart of FIG.

[0095] 14, first, in S601, the controller 240 displays the recipe editing screen 20 including the step setting area 30 and the step content setting area 40. The recipe editing screen 20 is configured so that the user selects a step to be edited in the step setting area 30, and the content of the selected step is displayed in the step content setting area 40.

[0096] Next, in S602 to S608, the controller 240 performs a process of determining whether or not there are any changes or settings that match the interlock conditions (inconsistent settings) for each item of each step.

[0097] In the determination process, for each item of each step, in S603, the controller 240 determines whether or not there is a change in the control parameter from the reference setting for the item being determined. Here, the reference setting may be an initial setting stored in advance in the substrate processing apparatus 10, or may be a setting in a file created and stored by the user.

[0098] If it is determined in S603 that there are no changes from the standard settings (if the determination result is No), in S604, the controller 240 sets the corresponding part of the matrix display area 33 to "Text: None" and "Background color: None" as shown in FIG. 4.

[0099] If it is determined in S603 that there are changes from the reference settings (if the determination result is Yes), the controller 240 determines in S605 whether or not there are control parameter settings (inconsistent settings) that match the interlock conditions for the item being determined.

[0100] If it is determined in S605 that there are no inconsistent settings (if the determination result is No), in S606, the controller 240 sets the corresponding location in the matrix display area 33 to “Text: *” and “Background color: None”, as shown in item 33a in FIG. 4.

[0101] If it is determined in S605 that there is an inconsistent setting (if the determination result is Yes), in S607, the controller 240 sets the corresponding location in the matrix display area 33 to “Text: *” and “Background color: Warning color”, as shown in item 33b in FIG. 4.

[0102] In this way, by configuring the recipe editing screen 20 to have a parameter setting area to be displayed and a step setting area 30 for setting steps on the gas pattern screen, and a step content setting area 40, the parameter information set for each step can be visually confirmed by the user in the step content setting area 40, which is expected to have the effect of preventing erroneous settings.

[0103] In addition, by displaying in the step setting area 30 whether or not the control parameters have been changed from the reference settings, the user can visually confirm the changes in the control parameters set for each step, which is expected to prevent erroneous settings.

[0104] Furthermore, if there is a control parameter setting in the step setting area 30 that matches an interlock condition, a warning is displayed for the user to visually confirm, so that the user can be made to release the interlock without fail.

[0105] Although various typical embodiments of the present disclosure have been described above, the present disclosure is not limited to those embodiments and can be used in appropriate combination.

[0106] For example, the substrate processing apparatus 10 in the embodiment of the present disclosure can be applied not only to a semiconductor manufacturing apparatus for manufacturing semiconductors, but also to an apparatus for processing glass substrates such as an LCD device. The substrate processing includes, for example, CVD, PVD, processing for forming an oxide film or a nitride film, processing for forming a film containing metal, annealing processing, oxidation processing, nitriding processing, diffusion processing, etc. It goes without saying that the substrate processing apparatus can also be applied to various substrate processing apparatuses such as an exposure apparatus, a coating apparatus, a drying apparatus, a heating apparatus, etc. [Explanation of symbols]

[0107] 10 Substrate processing equipment 20 Recipe editing screen 30 Step Setting Area 40 Step content setting area 200 wafers (substrates) 202 Processing furnace 240 Controller 241 Mass Flow Controller (MFC) 243 Valve

Claims

1. A step of displaying, on a recipe editing screen for creating a recipe including a plurality of steps, a parameter setting area for setting control parameters including at least a gas flow rate of a flow rate controller, and a gas pattern screen for setting an open / closed state of a valve; editing the recipe on the recipe editing screen; processing the substrate by executing the edited recipe; A method for manufacturing a semiconductor device comprising the steps of: In the step of editing the recipe, when a gas flow rate of the flow rate controller is set in the parameter setting area, the flow rate controller corresponding to the gas flow rate set is clearly indicated on the gas pattern screen; The step of editing the recipe includes a step of setting an open / closed state of a valve on the gas pattern screen, In the step of setting the open / closed state of a valve on the gas pattern screen, when an arbitrary valve is selected on the gas pattern screen, the open / closed state of the arbitrary valve is judged, and when the arbitrary valve on the gas pattern screen is set to open, a prohibition condition that prohibits the valve from being set to an open state is confirmed, and if the valve matches the prohibition condition, a warning is displayed. A method for manufacturing a semiconductor device.

2. A step of displaying, on a recipe editing screen for creating a recipe including a plurality of steps, a parameter setting area for setting control parameters including at least a gas flow rate of a flow rate controller, and a gas pattern screen for setting an open / closed state of a valve; editing the recipe on the recipe editing screen; processing the substrate by executing the edited recipe; A method for manufacturing a semiconductor device comprising the steps of: In the step of editing the recipe, when a gas flow rate of the flow rate controller is set in the parameter setting area, the flow rate controller corresponding to the gas flow rate set is clearly indicated on the gas pattern screen; The step of editing the recipe includes a step of setting an open / closed state of a valve on the gas pattern screen, In the step of setting the open / closed state of the valve on the gas pattern screen, when an arbitrary valve is selected on the gas pattern screen, the open / closed state of the arbitrary valve is determined, and further, when a valve for which a prohibition condition for prohibiting the valve from being opened is set is selected on the gas pattern screen, the prohibition condition is displayed on the gas pattern screen. A method for manufacturing a semiconductor device.

3. A step of displaying, on a recipe editing screen for creating a recipe including a plurality of steps, a parameter setting area for setting control parameters including at least a gas flow rate of a flow rate controller, and a gas pattern screen for setting an open / closed state of a valve; editing the recipe on the recipe editing screen; processing the substrate by executing the edited recipe; A method for manufacturing a semiconductor device comprising the steps of: In the step of editing the recipe, when a gas flow rate of the flow rate controller is set in the parameter setting area, the flow rate controller corresponding to the gas flow rate set is clearly indicated on the gas pattern screen; Furthermore, the recipe editing screen displays the parameter setting area and the gas pattern screen for each step, The recipe editing screen has a parameter setting area to be displayed and a step setting area for setting a step of a gas pattern screen, and when the control parameters are set so as to meet an interlock condition, a warning is displayed in the step setting area. A method for manufacturing a semiconductor device.

4. In the step of setting the valve open / closed state on the gas pattern screen, When any valve is selected on the gas pattern screen, the gas pipes connected to the selected valve are clearly indicated.

3. The method for manufacturing a semiconductor device according to claim 1 or 2.

5. The gas pattern screen is configured to display at least valves provided from a supply system that supplies a raw material to a reaction chamber to an exhaust system that depressurizes the reaction chamber to a vacuum atmosphere. The method for manufacturing a semiconductor device according to any one of claims 1 to 3.

6. The gas pattern screen is further configured to display at least one or more icons of a flow controller, a vaporizer, an exhaust device, and a pressure regulator. The method for manufacturing a semiconductor device according to claim 5.

7. The icon indicating at least one of a flow rate controller, a vaporizer, an exhaust device, and a pressure regulator is displayed on the gas pattern screen in a manner that allows parameters to be set. The method for manufacturing a semiconductor device according to claim 6.

8. Furthermore, the recipe editing screen is configured to allow setting of a parameter related to at least one of temperature and pressure as the control parameter. The method for manufacturing a semiconductor device according to any one of claims 1 to 3.

9. Furthermore, the recipe editing screen has a switching button for switching the type of the control parameters to be displayed. The method for manufacturing a semiconductor device according to any one of claims 1 to 3.

10. The various parameters displayed on the recipe editing screen are selected from at least one of temperature, pressure, valve, flow rate controller, transport, external device, and signal. The method for manufacturing a semiconductor device according to any one of claims 1 to 3.

11. The step setting area displays whether or not the setting of the control parameter for each step has been changed. The method for manufacturing a semiconductor device according to claim 3.

12. A display method for displaying, on a recipe editing screen for editing a recipe including a plurality of steps, a step content display area including a parameter setting area for setting a control parameter including at least a gas flow rate of a flow rate controller, which is displayed for each step, and a step setting area for setting a step of the displayed step content display area, displaying in the step setting area whether or not the setting of the control parameter for each step has been changed; When the control parameters are set to match the interlock conditions, a warning is displayed in the step setting area. Display method.

13. When a predetermined step is selected in the step setting area, The content set for the predetermined step is displayed in the step content display area. The display method according to claim 12.

14. A program executed in a substrate processing apparatus including a control unit for setting a plurality of parameters to create a recipe and for processing a substrate by executing the created recipe, A procedure for displaying, on a recipe editing screen for creating a recipe including a plurality of steps, a parameter setting area for setting control parameters including at least a gas flow rate of a flow rate controller, and a gas pattern screen for setting an open / close state of a valve; and a procedure for editing a recipe on the recipe editing screen, the procedure including a procedure for setting an open / closed state of a valve on the gas pattern screen, In the recipe editing step, when a gas flow rate of the flow controller is set in the parameter setting area, a step of clearly indicating the flow controller on the gas pattern screen corresponding to the flow controller for which the gas flow rate has been set; The procedure for setting an open / closed state of a valve on the gas pattern screen includes a procedure for, when an arbitrary valve is selected on the gas pattern screen, judging the open / closed state of the arbitrary valve, checking prohibition conditions that prohibit the valve from being opened when the arbitrary valve on the gas pattern screen is set to be open, and displaying a warning if the valve matches the prohibition conditions. A program for causing the substrate processing apparatus to execute the program by a computer.

15. A step of displaying a step content display area including a parameter setting area for setting control parameters including at least a gas flow rate of a flow rate controller for each step on a recipe editing screen for editing a recipe including a plurality of steps; displaying a step setting area for setting a step in the step content display area; a step of displaying in the step setting area whether or not the setting of the control parameter for each step has been changed; a step of displaying a warning in the step setting area when the control parameters are set to match an interlock condition; A procedure for displaying, on a recipe editing screen for creating a recipe including a plurality of steps, a parameter setting area for setting control parameters including at least a gas flow rate of a flow rate controller, and a gas pattern screen for setting an open / close state of a valve; editing a recipe on the recipe editing screen; processing the substrate by executing the edited recipe; having In the recipe editing step, when a gas flow rate of the flow rate controller is set in the parameter setting area, the flow rate controller corresponding to the gas flow rate set is clearly indicated on the gas pattern screen; The step of editing the recipe includes a step of setting an open / closed state of a valve on the gas pattern screen, The procedure for setting an open / closed state of a valve on the gas pattern screen includes a procedure for determining an open / closed state of an arbitrary valve when the arbitrary valve is selected on the gas pattern screen, and further, a procedure for displaying the prohibition condition on the gas pattern screen when a valve for which a prohibition condition for prohibiting the valve from being opened is set is selected on the gas pattern screen. A program that is executed by a computer in a substrate processing apparatus.

16. A program executed in a substrate processing apparatus having a control unit for setting a plurality of parameters to create a recipe and for processing a substrate by executing the created recipe, A procedure for displaying, on a recipe editing screen for creating a recipe including a plurality of steps, a parameter setting area for setting control parameters including at least a gas flow rate of a flow rate controller, and a gas pattern screen for setting an open / close state of a valve; and editing the recipe on the recipe editing screen. In the recipe editing step, when a gas flow rate of the flow rate controller is set in the parameter setting area, the flow rate controller corresponding to the gas flow rate set is clearly indicated on the gas pattern screen; Furthermore, the recipe editing screen displays the parameter setting area and the gas pattern screen for each step, The recipe editing screen has a parameter setting area to be displayed and a step setting area for setting a step of a gas pattern screen, and when the control parameters are set so as to meet an interlock condition, a warning is displayed in the step setting area. A program for causing the substrate processing apparatus to execute the program by a computer.

17. A substrate processing apparatus including a control unit capable of setting a plurality of parameters to create a recipe and executing the created recipe to process a substrate, The control unit is A process of displaying, on a recipe editing screen for editing a recipe including a plurality of steps, a parameter setting area for setting control parameters including at least a gas flow rate of a flow rate controller, and a gas pattern screen for setting an open / close state of a valve; A process of editing a recipe on the recipe editing screen, the process including a process of setting an open / closed state of a valve on the gas pattern screen; configured to run In the process of editing the recipe, when a gas flow rate of the flow rate controller is set in the parameter setting area, the flow rate controller corresponding to the gas flow rate set is clearly indicated on the gas pattern screen; In the process of setting the open / closed state of a valve on the gas pattern screen, when an arbitrary valve is selected on the gas pattern screen, the open / closed state of the arbitrary valve is determined, and when the arbitrary valve on the gas pattern screen is set to open, a prohibition condition that prohibits the valve from being set to an open state is confirmed, and if the valve matches the prohibition condition, a warning is displayed. Substrate processing equipment.

18. A substrate processing apparatus including a control unit capable of setting a plurality of parameters to create a recipe and executing the created recipe to process a substrate, comprising: The control unit is A process of displaying, on a recipe editing screen for editing a recipe including a plurality of steps, a parameter setting area for setting control parameters including at least a gas flow rate of a flow rate controller, and a gas pattern screen for setting an open / closed state of a valve; A process of editing a recipe on the recipe editing screen, the process including a process of setting an open / closed state of a valve on the gas pattern screen; configured to run In the process of editing the recipe, when a gas flow rate of the flow rate controller is set in the parameter setting area, the flow rate controller corresponding to the gas flow rate set is clearly indicated on the gas pattern screen; In the process of setting the open / closed state of a valve on the gas pattern screen, when an arbitrary valve is selected on the gas pattern screen, the open / closed state of the arbitrary valve is determined, and when a valve for which a prohibition condition for prohibiting the valve from being opened is selected on the gas pattern screen, the prohibition condition is controllably displayed on the gas pattern screen. Substrate processing equipment.

19. A substrate processing apparatus including a control unit capable of setting a plurality of parameters to create a recipe and executing the created recipe to process a substrate, comprising: The control unit is A process of displaying, on a recipe editing screen for editing a recipe including a plurality of steps, a parameter setting area for setting control parameters including at least a gas flow rate of a flow rate controller, and a gas pattern screen for setting an open / closed state of a valve; A process of editing a recipe on the recipe editing screen; configured to run In the process of editing the recipe, when a gas flow rate of the flow rate controller is set in the parameter setting area, the flow rate controller corresponding to the gas flow rate set is clearly indicated on the gas pattern screen; Furthermore, the recipe editing screen displays the parameter setting area and the gas pattern screen for each step, The recipe editing screen has a parameter setting area to be displayed and a step setting area for setting a step of a gas pattern screen, and is configured to be controllable so as to display a warning in the step setting area when the control parameters are set so as to meet an interlock condition. Substrate processing equipment.

Citation Information

Patent Citations

  • Semiconductor manufacturing apparatus

    JP2001189248A

  • Substrate processor

    JP2006093494A

  • Substrate processing apparatus, simulation device, program, and simulation method

    JP2014157458A

  • Substrate treatment apparatus, and production method of semiconductor device

    JP2017002353A

  • Recipe creation method, semiconductor device manufacturing method, processing device, and program

    WO2019186649A1