Board Work Equipment

Abstract

To provide a substrate work device capable of suppressing deterioration in accuracy when performing a quality determination of a component by imaging a plurality of electrodes of the component.SOLUTION: A component mounting device 100 (a substrate work device) comprises: a component recognition imaging part 7 that images a component 31 containing a plurality of electrodes 31a connected to a substrate S; and a control part 8 that performs a quality determination of the component 31 by comparing an imaging result obtained by imaging the component 31 with model data 9 containing information on positions and shapes of the plurality of electrodes 31a of the component 31. The control part 8 deforms the model data 9 so as to match each of the electrodes 31a of the component 31 imaged by the component recognition imaging part 7 with each of electrodes 91 of the model data 9, and determines that the component 31 is failure when a deformation amount corresponding to each of the electrode 91 of the model data 9 is a predetermined threshold value or more.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a board working device, and more particularly to a board working device equipped with an imaging unit that images a component. [Background technology]

[0002] 2. Description of the Related Art Conventionally, inspection devices equipped with an imaging unit that captures an image of a component are known (see, for example, Patent Document 1).

[0003] The above-mentioned Patent Document 1 discloses an inspection device that includes an imaging unit that images a wafer (component) to be mounted on a board, and a control unit that matches the wafer imaged by the imaging unit with a template based on design data of the wafer to detect defects in the wafer (component). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2013-246162 A Summary of the Invention [Problem to be solved by the invention]

[0005] Here, although it is not described in the above Patent Document 1, when detecting defects by matching an imaged part with a template as in the above Patent Document 1, it is determined that the part is defective if the match rate is smaller than a predetermined value based on the overall match rate in the image. Therefore, in the case where one of the multiple electrodes of a part is significantly deformed and is a defective part, if the match rate of other electrodes is high and the overall match rate is high, the part may not be determined to be defective even though it is defective. In addition, if there are small deformations, expansions, contractions, etc. that do not result in defects for the multiple electrodes of the part, and the overall match rate is low, the part may be determined to be defective even though it is a good product (usable part). Therefore, the accuracy of determining the quality of the part by imaging the multiple electrodes of the part may decrease. Therefore, it is desired to suppress the decrease in accuracy of determining the quality of the part by imaging the multiple electrodes of the part.

[0006] The present invention has been made to solve the above-mentioned problems, and one object of the present invention is to provide a board working device that is capable of suppressing a decrease in accuracy when imaging multiple electrodes of a component and determining whether the component is good or bad. [Means for solving the problem]

[0007] A board working apparatus according to one aspect of the present invention includes an imaging unit that images a component including a plurality of electrodes connected to a board, and a control unit that compares the imaging results of the component with model data including information on the positions and shapes of the component's plurality of electrodes to determine whether the component is good or bad. The control unit is configured to deform the model data so that each electrode of the component imaged by the imaging unit matches each electrode in the model data, and to determine that the component is defective if the amount of deformation corresponding to each electrode in the model data is greater than a predetermined threshold value.

[0008] In one aspect of the present invention, the board working device includes a control unit that deforms the model data so that each electrode of the component imaged by the imaging unit matches each electrode of the model data, and determines that the component is defective when the deformation amount corresponding to each electrode of the model data is greater than a predetermined threshold. This makes it possible to obtain the deformation amount for each of the multiple electrodes, and therefore makes it possible to accurately determine the pass / fail of each of the multiple electrodes, unlike when the pass / fail determination is based on an overall match rate. This makes it possible to prevent a decrease in accuracy when the multiple electrodes of a component are imaged to determine the pass / fail of the component.

[0009] In the board working device according to the above aspect, the control unit is preferably configured to deform the model data for each of the electrodes of a component including a plurality of electrodes so that the electrodes of the component captured by the imaging unit match the electrodes of the model data, and to determine that the component is defective when the deformation amount corresponding to each electrode of the model data for at least one electrode is greater than a predetermined threshold value. With this configuration, when one of the electrodes is significantly deformed and the deformed electrode has a poor connection to the board, it can be determined that the component is defective. This makes it possible to prevent defective components from being determined to be non-defective.

[0010] In the board working device according to the above aspect, the control unit is preferably configured to deform the model data by dividing the model data into a plurality of polygonal regions and deforming the plurality of polygonal regions, thereby deforming the model data so that the electrodes of the component imaged by the imaging unit match the electrodes of the model data. With this configuration, when determining pass / fail for each of components of various sizes and shapes, a similar process of deforming the polygonal regions can be performed, making it possible to easily perform pass / fail determination processing for various components.

[0011] In the configuration in which the model data is divided into a plurality of polygonal regions and the plurality of polygonal regions is deformed, the control unit is preferably configured to deform the polygonal regions while changing the amount and direction of movement of the vertices of the divided polygonal regions of the model data. With this configuration, the polygonal regions are deformed by moving the vertices of the polygonal regions, so that it is sufficient to perform the deformation process as many times as the number of vertices of the polygonal regions. This eliminates the need to individually move points on the sides of the polygonal regions other than the vertices, thereby preventing the deformation process of the polygonal regions from becoming complicated.

[0012] In this case, the control unit is preferably configured to preset an upper limit value for the amount of movement of the vertices of the partitioned polygonal region of the model data based on a predetermined threshold value, and to deform the polygonal region of the model data within the range of the upper limit value. With this configuration, when the amount of deformation increases and exceeds the predetermined threshold value, the process of deforming the polygonal region is not continued until the electrodes of the component imaged by the imaging unit match the electrodes of the model data, so that the deformation process of the polygonal region can be efficiently terminated.

[0013] In the configuration in which the model data is divided into a plurality of polygonal regions and the plurality of polygonal regions are deformed, the control unit is preferably configured to divide the model data into a plurality of polygonal regions based on at least one of the number, shape, and type of electrodes of the model data. With this configuration, the polygonal regions can be divided into sizes that match each of the plurality of electrodes, so that it is possible to prevent processing from becoming complicated due to excessively small divisions, and it is also possible to prevent the judgment accuracy from decreasing due to excessively large divisions. In addition, since the polygonal regions can be divided into shapes that match each of the plurality of electrodes, the polygonal regions can be easily deformed to follow the deformation of the electrodes.

[0014] In this case, the control unit is preferably configured to divide the model data into a plurality of polygonal regions so that the divided polygonal regions do not include a plurality of electrodes. With this configuration, the polygonal region can be divided so as to include one electrode among the plurality of electrodes, so that the polygonal region can be deformed to fit the one electrode. This makes it easier to perform the deformation process of the polygonal region compared to the case where the polygonal region is deformed to fit the plurality of electrodes.

[0015] In the circuit board working device according to the above aspect, the control unit is preferably configured to deform the model data by deforming a contour line of the electrode in the model data so that the electrode of the component imaged by the imaging unit matches the electrode in the model data. With this configuration, the contour line of the model data can be deformed for each of the plurality of electrodes, so that the deformation for each of the plurality of electrodes can be easily determined.

[0016] In the above-mentioned configuration for deforming the contour line of the electrode of the model data, the control unit is preferably configured to deform the contour line of the electrode while changing the amount and direction of movement of points on the contour line of the electrode of the model data. With this configuration, the model data can be easily deformed so that the contour line of the electrode of the model data matches the electrode of the captured component.

[0017] In this case, the control unit is preferably configured to preset an upper limit value for the amount of movement of points on the contour of the electrode of the model data based on a predetermined threshold value, and to deform the contour of the electrode of the model data within the range of the upper limit value. With this configuration, when the amount of deformation increases and exceeds the predetermined threshold value, the process of deforming the contour of the electrode of the model data is not continued until the electrode of the component imaged by the imaging unit matches the electrode of the model data, so that the process of deforming the contour of the electrode of the model data can be efficiently terminated.

[0018] In the configuration for deforming the contour line of the electrode of the model data, the control unit is preferably configured to first move characteristic points having characteristic shapes among a plurality of points on the contour line of the electrode of the model data. With this configuration, characteristic points having characteristic shapes such as corners, intersections, and curved surfaces on the contour line of the model data can be moved first, so that even for parts where it is difficult to uniquely determine the movement position, such as points on a straight line, the movement position can be easily determined based on the movement of the characteristic points that were moved first.

[0019] In the board working apparatus according to the above aspect, preferably, the control unit is configured to divide the model data into a plurality of polygonal regions such that each divided polygonal region does not include a plurality of electrodes; The control unit is configured to, instead of transforming the model data so that the electrodes of the component imaged by the imaging unit match the electrodes of the model data, divide the model data into a plurality of polygonal regions, perform pattern matching between the electrodes of the component imaged by the imaging unit and the electrodes of the model data within each polygonal region, and determine the quality of the component. With this configuration, the pattern matching process can be performed more quickly than when pattern matching is performed over the entire component. In addition, since the quality of the electrodes can be determined for each divided polygonal region, the quality of the component can be determined more accurately.

[0020] In the board working device according to the above aspect, preferably, a mounting head for mounting components on a board is provided, the imaging unit is configured to image the components held by the mounting head, and the control unit is configured to compare the imaging result of the components with model data including information on the positions and shapes of the electrodes of the components to determine the quality of the components held by the mounting head. With this configuration, when the components are mounted on the board, the states of the multiple electrodes of the components can be confirmed to determine the quality of the components, thereby reliably preventing defective components from being mounted on the board. Effect of the Invention

[0021] According to the present invention, as described above, it is possible to suppress a decrease in accuracy when imaging a plurality of electrodes of a component to determine whether the component is good or bad. [Brief description of the drawings]

[0022] [Figure 1] 1 is a plan view showing an outline of a component mounting apparatus according to a first embodiment of the present invention. [Diagram 2] 5A and 5B are diagrams for explaining matching between an image of a component captured by the component mounting apparatus according to the first embodiment of the present invention and model data. [Diagram 3] 5A and 5B are diagrams for explaining deformation of a grid of model data of the component mounting device according to the first embodiment of the present invention. [Figure 4] FIG. 4 is a diagram for explaining the setting of a grid of model data of the component mounting device according to the first embodiment of the present invention. [Diagram 5] 5A and 5B are diagrams for explaining movement of lattice vertices of the model data of the component mounting device according to the first embodiment of the present invention. [Figure 6] FIG. 4 is a diagram for explaining matching for each grid in the component mounting device according to the first embodiment of the present invention. [Figure 7] 5 is a flowchart for explaining a model data creation process of the component mounting device according to the first embodiment of the present invention. [Figure 8] 4 is a flowchart for explaining a component mounting process of the component mounting apparatus according to the first embodiment of the present invention. [Figure 9] 5 is a flowchart for explaining a process for determining whether or not a component is defective according to the component mounting apparatus according to the first embodiment of the present invention. [Figure 10] 13 is a diagram for explaining matching between an image of a component captured by a component mounting apparatus according to a second embodiment of the present invention and model data. FIG. [Figure 11] 13 is a diagram for explaining the movement of points on a contour line of model data of the component mounting device according to the second embodiment of the present invention. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0023] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

[0024] (First embodiment) The configuration of a component mounting apparatus 100 according to a first embodiment of the present invention will be described with reference to FIGS.

[0025] As shown in FIG. 1, component mounting apparatus 100 is a component mounting apparatus that transports a board S in the X direction by a pair of conveyors 2 and mounts components 31 on the board S at a mounting position M.

[0026] The component mounting apparatus 100 includes a base 1, a pair of conveyors 2, a component supply unit 3, a head unit 4, a moving mechanism 5, a moving mechanism 6, a component recognition imaging unit 7, and a control unit 8. The component recognition imaging unit 7 is an example of an "imaging unit" in the claims. The component mounting apparatus 100 is also an example of a "board working apparatus" in the claims.

[0027] The pair of conveyors 2 are installed on a base 1 and configured to transport the board S in the X direction. The pair of conveyors 2 are provided with a holding mechanism that holds the board S during transportation in a stopped state at the mounting work position M. The pair of conveyors 2 are also configured so that the distance between them in the Y direction can be adjusted to match the dimensions of the board S.

[0028] The component supply unit 3 is disposed on the outer sides (Y1 side and Y2 side) of the pair of conveyors 2. Furthermore, the component supply unit 3 is provided with a tape feeder 30 that supplies components 31 to the mounting head 42. Furthermore, the component supply unit 3 is configured so that a plurality of tape feeders 30 can be disposed therein.

[0029] The tape feeder 30 supplies the components 31 while feeding out the component supply tape holding the components 31. Specifically, the tape feeder 30 holds a reel around which a component supply tape is wound, holding a plurality of components 31 at predetermined intervals. The tape feeder 30 is configured to feed the component supply tape on the reel toward the component supply position. The tape feeder 30 is configured to supply the components 31 from its leading end in the Y direction. Here, the components 31 include electronic components such as ICs, transistors, capacitors, resistors, and connectors.

[0030] As shown in FIG. 1, the head unit 4 is disposed above the pair of conveyors 2 and the component supply section 3, and includes multiple (five) mounting heads 42 each having a nozzle 41 attached to its lower end, and a board recognition camera 43.

[0031] The mounting head 42 is configured to mount the components 31 on the board S. Specifically, the mounting head 42 is configured to pick up the components 31 supplied from the tape feeder 30 arranged in the component supply unit 3, and mount the picked up components 31 on the board S arranged at the mounting work position M. The mounting head 42 is also configured to be capable of ascending and descending (moving in the Z direction). The mounting head 42 is also configured to pick up and hold the components 31 supplied from the tape feeder 30 by a negative pressure generated at the tip of the nozzle 41 by a negative pressure generator (not shown), and mount (mount) the components 31 at the mounting position on the board S.

[0032] The board recognition camera 43 is configured to capture an image of the fiducial mark F of the board S in order to recognize the position and posture of the board S. Then, by capturing an image of the position of the fiducial mark F and recognizing it, it is possible to accurately obtain the mounting position of the component 31 on the board S.

[0033] The moving mechanism 5 includes a motor 51. The moving mechanism 5 is configured to move the head unit 4 in the X direction along the moving mechanism 5 by driving the motor 51. The moving mechanism 5 is supported at both ends by moving mechanisms 6.

[0034] The moving mechanism 6 is fixed on the base 1. The moving mechanism 6 on the X1 side includes a motor 61. The moving mechanism 6 is configured to move the moving mechanism 5 in the Y direction perpendicular to the X direction along the moving mechanism 6 by driving the motor 61. The head unit 4 is movable in the X direction along the moving mechanism 5, and the moving mechanism 5 is movable in the Y direction along the moving mechanism 6, so that the head unit 4 is movable in the horizontal direction (XY direction). In other words, the moving mechanisms 5 and 6 are configured to move the mounting head 42 in the horizontal direction.

[0035] The component recognition imaging unit 7 is fixed on the upper surface of the base 1. The component recognition imaging unit 7 is disposed on the outer side (Y1 side and Y2 side) of the pair of conveyors 2. The component recognition imaging unit 7 is configured to image the component 31 sucked by the nozzle 41 of the mounting head 42 from the lower side (Z2 side) in order to recognize the suction state (suction posture) of the component 31 prior to mounting the component 31. This allows the control unit 8 to acquire the suction state of the component 31 sucked by the nozzle 41 of the mounting head 42. The component recognition imaging unit 7 also images the component 31 including a plurality of electrodes 31a connected to the board S. As shown in FIG. 2, the component 31 is provided with a plurality of electrodes 31a. The electrodes 31a are connected to electrodes provided on the board S or wiring connected to the board S. The electrodes 31a are also provided on the outer surface of the component 31. The electrodes 31a include lead-shaped, ball-shaped, and flat-plate-shaped electrodes.

[0036] The control unit 8 includes a CPU and a memory, and is configured to control the overall operation of the component mounting apparatus 100, such as the transport operation of the board S by the pair of conveyors 2, the mounting operation by the head unit 4, and the imaging operation by the component recognition imaging unit 7 and the board recognition camera 43.

[0037] Here, in the first embodiment, the control unit 8 is configured to compare the imaging result of the component 31 with the model data 9 including information on the positions and shapes of the multiple electrodes 31a of the component 31 to determine whether the component 31 is good or bad. Specifically, as shown in FIG. 2, the control unit 8 deforms the model data 9 so that each electrode 31a in the image 71 of the component 31 imaged by the component recognition imaging unit 7 matches each electrode 91 in the model data 9. Furthermore, the control unit 8 determines that the component 31 is defective when the deformation amount corresponding to each electrode 91 in the model data 9 is greater than a predetermined threshold value. Furthermore, the control unit 8 is configured to perform a pass / fail determination of the component 31 held by the mounting head 42.

[0038] Furthermore, for a part 31 including a plurality of electrodes 31a, the control unit 8 is configured to deform the model data so that the electrodes 31a of the part 31 imaged by the part recognition imaging unit 7 match the electrodes 91 in the model data 9 for each of the plurality of electrodes 31a, and to determine that the part 31 is defective when the amount of deformation corresponding to each electrode 91 in the model data 9 for at least one electrode is greater than a predetermined threshold value.

[0039] 2 and 3, the control unit 8 is configured to deform the model data 9 in a state in which the model data 9 is divided into a plurality of polygonal regions 92, and then deform the plurality of polygonal regions 92 so that the electrodes 31a of the component 31 imaged by the component recognition imaging unit 7 match the electrodes 91 of the model data 9. Specifically, the control unit 8 divides the model data 9 into a plurality of quadrilateral (lattice-like) polygonal regions 92.

[0040] 2, in order to determine a reference P1, the control unit 8 performs pattern matching between the part 31 in the image 71 and the model data 9. This determines the reference P1, which is set at the center of the part 31, for example. The control unit 8 detects the position and orientation (tilt) of the part 31 in the image 71 based on the reference P1.

[0041] The control unit 8 compares the part 31 in the image 71 with the model data 9, and transforms the model data 9 so that each electrode 31a of the part 31 in the image 71 matches each electrode 91 of the model data 9.

[0042] The control unit 8 is configured to deform the polygonal region 92 while changing the amount and direction of movement of the vertices of the divided polygonal region 92 of the model data 9, as shown in Fig. 3. Specifically, as shown in Fig. 5, the control unit 8 is configured to set in advance an upper limit value for the amount of movement of the vertices of the divided polygonal region 92 of the model data 9 based on a predetermined threshold, and to deform the polygonal region 92 of the model data 9 within the range of the upper limit value. For example, the upper limit value of the amount of movement is set to an amount equal to the predetermined threshold value plus a small margin.

[0043] The predetermined threshold value is calculated based on the dimensional data of the component 31. For example, if the tolerance of the electrode spacing (pitch) is stated in the catalog or specifications of the component 31, the predetermined threshold value is calculated as (number of electrodes-1) x tolerance. In this case, the predetermined threshold value is set based on the maximum amount of deviation as the tolerance.

[0044] Furthermore, the control unit 8 deforms the shape of the lattice of the polygonal region 92 by moving the positions of the vertices (corners) of the polygonal region 92 within a circle within the range of the upper limit value while changing the radius and angle in small increments. The control unit 8 then matches the electrodes 91 in the polygonal region 92 with the electrodes 31a in the image 71 by the deformation. The control unit 8 then adopts the deformation of the polygonal region 92 that has the best matching score. If the matching score of the adopted polygonal region 92 does not reach a certain value (if there is no match), the control unit 8 determines that the amount of deformation of the electrodes 31a of the component 31 is greater than the threshold value.

[0045] 4, the control unit 8 is configured to divide the model data 9 into a plurality of polygonal regions 92 based on at least one of the number, shape, and type of the electrodes 91 of the model data 9. The control unit 8 is configured to divide the model data 9 into a plurality of polygonal regions 92 so that a plurality of electrodes 91 are not included in the divided polygonal regions 92. Note that since it is only necessary that a plurality of electrodes 91 are not included in one polygonal region 92, the polygonal region 92 may be divided so that one electrode 91 spans a plurality of polygonal regions 92. The division of the polygonal regions 92 of the model data 9 may be performed by an operator's designation. In addition, after dividing the model data 9 into polygonal regions 92 of a predetermined size, the polygonal regions may be further divided and subdivided for each polygonal region according to the number of contour elements of the electrode 91 within the polygonal region and the convexity of the contour shape (shape coefficient for the convexity of the region).

[0046] Furthermore, the control unit 8 may determine the polygonal region 92 based on factors constituting the electrode shape and the electrode interval, such as the lead pitch and ball pitch of the electrodes 91. For example, the control unit 8 may set the length of the polygonal region to half the electrode interval.

[0047] In addition, as shown in FIG. 6, instead of deforming the model data 9 so that the electrodes 31a of the component 31 imaged by the component recognition imaging unit 7 match the electrodes 91 of the model data 9, the control unit 8 is configured to divide the model data 9 into a plurality of polygonal regions 93, and within each polygonal region 93, perform pattern matching between the electrodes 31a of the component 31 imaged by the component recognition imaging unit 7 and the electrodes 91 of the model data 9, and determine whether the component 31 is good or bad.

[0048] That is, after performing matching to determine the reference P1, the control unit 8 divides the model data 9 into lattice-like polygonal regions 93 and calculates a matching score for each polygonal region 93. If the matching score is equal to or greater than a predetermined value, the control unit 8 determines that there is no deformation of the electrodes 31a of the component 31. Furthermore, for polygonal regions 93 having scores smaller than a predetermined value, the control unit 8 performs pattern matching within the polygonal regions 93 and determines the amount of positional displacement as the amount of deformation based on a threshold value. Note that if no match is found within the polygonal region 93, the pattern matching may be performed by including adjacent polygonal regions 93 in the search range.

[0049] (Model data creation process) Next, a process of creating the model data 9 by the control unit 8 of the component mounting apparatus 100 will be described with reference to Fig. 7. Note that the model data 9 may be created by a control unit of an apparatus other than the component mounting apparatus 100.

[0050] 7, the control unit 8 captures an image of a non-defective component 31 using the component recognition imaging unit 7. In step S2, the control unit 8 extracts a contour line from the captured image by edge detection and creates contour model data. The contour line includes the contour line of the component 31 and the contour lines of the electrodes 31a of the component 31.

[0051] In step S3, the control unit 8 sets a center reference (reference P1) of the contour model. In step S4, the control unit 8 divides the contour model and sets regions 92 in the shape of lattice polygons.

[0052] In step S5, the control unit 8 sets a predetermined threshold value for the amount of deformation used for determining acceptability. In step S6, the control unit 8 stores the created model data 9 in the storage unit.

[0053] (Component mounting processing) Next, the component mounting process performed by the control unit 8 of the component mounting apparatus 100 will be described with reference to FIG.

[0054] 8, the control unit 8 reads the created and stored model data 9. In step S12, the control unit 8 causes the mounting head 42 to pick up the component 31 from the component supply unit 3. The control unit 8 also causes the component recognition imaging unit 7 to capture an image of the component 31 picked up by the mounting head 42.

[0055] In step S13, the control unit 8 uses pattern matching to acquire the pickup attitude of the component 31. In step S14, the control unit 8 determines whether the component 31 picked up by the mounting head 42 is good or bad.

[0056] In step S15, the control unit 8 judges whether or not the part 31 is determined to be defective. If the part 31 is not defective (if the part is a non-defective product), the process proceeds to step S16, and if the part 31 is defective, the process proceeds to step S17.

[0057] In step S16, the control unit 8 mounts the components 31 picked up by the mounting head 42 on the board S. Thereafter, the mounting process is repeated for other components 31. In addition, in step S17, the control unit 8 discards the components 31 determined to be defective. Then, the process returns to step S12.

[0058] (Part quality check process) Next, the part quality determination process in step S14 in FIG. 8 will be described with reference to FIG.

[0059] In step S21, control unit 8 sets the first lattice-like polygonal region 92 as the target to be deformed. In step S22, control unit 8 sets the first vertex of polygonal region 92 as the target to be deformed (moved).

[0060] In step S23, the control unit 8 initializes the radius of the deformation, and in step S24, the control unit 8 initializes the angle of the deformation to 0 degrees.

[0061] In step S25, the control unit 8 matches the electrodes 31a of the component 31 in the image 71 with the electrodes 91 in the polygonal region 92 deformed by moving the positions of the vertices, and calculates a matching score.

[0062] In step S26, the control unit 8 increases the angle of deformation by the increment. In step S27, the control unit 8 judges whether the angle of deformation has reached 360 degrees. That is, it judges whether the vertices of the polygonal region 92 have been moved one revolution at a certain radius to deform the polygonal region 92. If the angle has reached 360 degrees, the process proceeds to step S28, and if the angle has not reached 360 degrees, the process returns to step S25.

[0063] In step S28, the control unit 8 increases the radius of the deformation by the increment. In step S29, the control unit 8 judges whether the radius of the deformation has exceeded the upper limit. The upper limit of the radius of the deformation is set to an amount obtained by adding a small margin to a predetermined threshold (predetermined threshold + α). If the upper limit is exceeded, the process proceeds to step S30, and if the upper limit is not exceeded, the process returns to step S24.

[0064] In step S30, the control unit 8 adopts the deformation amount with the maximum matching score as the deformation amount of this vertex. In step S31, the control unit 8 judges whether the score is less than a certain value or the deformation amount is greater than a threshold. If the score is less than a certain value or the deformation amount is greater than the threshold, the process proceeds to step S32, and if the score is equal to or greater than a certain value and the deformation amount is equal to or less than the threshold, the process proceeds to step S33.

[0065] In step S32, the control unit 8 determines that the component 31 is defective, and then the process of determining whether the component is defective or not is terminated.

[0066] In step S33, control unit 8 targets the next vertex of polygonal region 92 for deformation (movement). Note that vertices that overlap with adjacent polygonal regions 92 and have already been targeted are excluded from the targets because they have already been moved. In step S34, it is determined whether the process of deforming (moving) all vertices of the target polygonal region 92 has been completed. If the process has been completed, the process proceeds to step S35, and if the process has not been completed, the process returns to step S23.

[0067] In step S35, control unit 8 targets the next polygonal region 92 for deformation. In step S36, it is determined whether or not the deformation process has been completed for all polygonal regions 92 in model data 9. If the process has been completed, the process proceeds to step S37, and if the process has not been completed, the process returns to step S22.

[0068] In step S37, the control unit 8 determines that the component 31 is a non-defective product, and then the process of determining whether the component is defective or not is terminated.

[0069] (Effects of the first embodiment) In the first embodiment, the following effects can be obtained.

[0070] In the first embodiment, as described above, the model data 9 is deformed so that each electrode 31a of the component 31 imaged by the component recognition imaging unit 7 matches each electrode 91 of the model data 9, and a control unit 8 is provided that determines that the component 31 is defective when the deformation amount corresponding to each electrode 91 of the model data 9 is greater than a predetermined threshold. This makes it possible to obtain the deformation amount for each of the multiple electrodes, and therefore makes it possible to accurately determine the pass / fail of each of the multiple electrodes, unlike a case where the pass / fail determination is made based on an overall matching rate. This makes it possible to prevent a decrease in accuracy when the pass / fail determination of the component 31 is made by imaging the multiple electrodes 31a of the component 31.

[0071] In the first embodiment, as described above, the control unit 8 is configured to deform the model data for each of the electrodes 31a of the component 31 including the electrodes 31a so that the electrodes 31a of the component 31 imaged by the component recognition image capture unit 7 match the electrodes 91 of the model data 9, and to determine that the component 31 is defective when the amount of deformation corresponding to each electrode 91 of the model data 9 for at least one electrode is greater than a predetermined threshold. This makes it possible to determine that the component 31 is defective when one electrode 31a of the multiple electrodes 31a is significantly deformed and the deformed electrode 31a has a poor connection to the board S. This makes it possible to prevent a defective component 31 from being determined to be a non-defective product.

[0072] In the first embodiment, as described above, the control unit 8 is configured to deform the model data 9 in a state in which the model data 9 is divided into a plurality of polygonal regions 92, and then deform the plurality of polygonal regions 92, thereby deforming the model data 9 so that the electrodes 31a of the component 31 imaged by the component recognition imaging unit 7 match the electrodes 91 in the model data 9. This allows a similar process of deforming the polygonal regions 92 to be performed when determining the pass / fail of each of the components 31 of various sizes and shapes, making it possible to easily perform the pass / fail determination process for various components 31.

[0073] In the first embodiment, as described above, the control unit 8 is configured to deform the polygonal region 92 while changing the amount and direction of movement of the vertices of the partitioned polygonal region 92 of the model data 9. As a result, the polygonal region 92 is deformed by moving the vertices of the polygonal region 92, so that it is sufficient to perform the deformation process as many times as the number of vertices of the polygonal region 92. As a result, it is not necessary to individually move points on the sides of the polygonal region 92 other than the vertices, so that it is possible to prevent the deformation process of the polygonal region 92 from becoming complicated.

[0074] In the first embodiment, as described above, the control unit 8 is configured to preset an upper limit value for the amount of movement of the vertices of the partitioned polygonal region 92 of the model data 9 based on a predetermined threshold value, and to deform the polygonal region 92 of the model data 9 within the range of the upper limit value. As a result, when the amount of deformation increases and exceeds the predetermined threshold value, the process of deforming the polygonal region 92 is not continued until the electrodes 31a of the component 31 imaged by the component recognition imaging unit 7 match the electrodes 91 of the model data 9, so that the deformation process of the polygonal region 92 can be efficiently terminated.

[0075] In the first embodiment, as described above, the control unit 8 is configured to divide the model data 9 into a plurality of polygonal regions 92 based on at least one of the number, shape, and type of the electrodes 91 of the model data 9. This allows the polygonal region 92 to be divided into sizes that match each of the plurality of electrodes 91, making it possible to prevent processing from becoming complicated due to excessively small divisions and to prevent the determination accuracy from decreasing due to excessively large divisions. In addition, since the polygonal region 92 can be divided into shapes that match each of the plurality of electrodes 91, the polygonal region 92 can be easily deformed to follow the deformation of the electrode 31a.

[0076] In the first embodiment, as described above, the control unit 8 is configured to divide the model data 9 into a plurality of polygonal regions 92 so that the divided polygonal regions 92 do not include a plurality of electrodes 91. This allows the polygonal region 92 to be divided so that one electrode 91 out of the plurality of electrodes 91 is included, and therefore the polygonal region 92 can be deformed to fit one electrode 31a. This makes it easier to perform the deformation process of the polygonal region 92 compared to the case where the polygonal region 92 is deformed to fit a plurality of electrodes 31a.

[0077] In the first embodiment, instead of transforming the model data 9 so that the electrodes 31a of the component 31 imaged by the component recognition imaging unit 7 match the electrodes 91 of the model data 9, as described above, the control unit 8 is configured to divide the model data 9 into a plurality of polygonal regions 93, perform pattern matching between the electrodes 31a of the component 31 imaged by the component recognition imaging unit 7 and the electrodes 91 of the model data 9 in each polygonal region 93, and determine the quality of the component 31. This allows the pattern matching process to be performed more quickly than when pattern matching is performed over the entire component 31. In addition, since the quality of the electrodes 31a can be determined for each divided polygonal region 93, the quality of the component 31 can be determined more accurately.

[0078] In the first embodiment, as described above, a mounting head 42 that mounts the components 31 on the board S is provided, the component recognition imaging unit 7 is configured to image the components 31 held by the mounting head 42, and the control unit 8 is configured to compare the imaging result of the components 31 with model data 9 including information on the positions and shapes of the electrodes 31a of the components 31 to determine whether the components 31 held by the mounting head 42 are good or bad. As a result, when the components 31 are mounted on the board S, the states of the multiple electrodes 31a of the components 31 can be checked to determine whether the components 31 are good or bad, so that mounting of defective components on the board S can be reliably prevented.

[0079] Second embodiment Next, a second embodiment of the present invention will be described with reference to Fig. 10 and Fig. 11. Unlike the first embodiment in which the model data 9 is deformed by dividing the model data 9 into a plurality of polygonal regions 92 and deforming the polygonal regions 92, the second embodiment will describe an example of a configuration in which the model data 9 is deformed by moving points on the contours of electrodes 91 of the model data 9.

[0080] Here, in the second embodiment, the control unit 8 is configured to compare the imaging result of the component 31 with the model data 9 including information on the positions and shapes of the multiple electrodes 31a of the component 31 to determine the quality of the component 31. The control unit 8 also deforms the model data 9 so that each electrode 31a in the image 71 of the component 31 captured by the component recognition imaging unit 7 matches each electrode 91 in the model data 9. The control unit 8 also determines that the component 31 is defective when the amount of deformation corresponding to each electrode 91 in the model data 9 is greater than a predetermined threshold value.

[0081] 10, the control unit 8 is configured to deform the model data 9 so that the electrodes 31a of the component 31 imaged by the component recognition imaging unit 7 match the electrodes 91 in the model data 9. The control unit 8 is also configured to deform the contour line of the electrodes 91 in the model data 9 by changing the movement amount and movement direction of the points 94 on the contour line of the electrodes 91 in the model data 9, as shown in FIG.

[0082] That is, in the second embodiment, the control unit 8 moves the points 94 constituting the contour line in various ways to determine the positions where the points 94 overlap the edges (contours) of the electrodes 31a of the component 31 in the image 71. Furthermore, the control unit 8 determines the positions where all the points 94 overlap the edges (contours) of the electrodes 31a of the component 31 in the image 71. Note that when determining the positions by moving each point one by one, if a unique position cannot be determined, the control unit 8 may determine the positions by moving multiple points 94 collectively.

[0083] Furthermore, the control unit 8 is configured to set in advance an upper limit of the amount of movement of the point 94 on the contour of the electrode 91 of the model data 9 based on a predetermined threshold, and to deform the contour of the electrode 91 of the model data 9 within the range of the upper limit. For example, the upper limit of the amount of movement is set to an amount equal to the predetermined threshold plus a small margin.

[0084] 11, the control unit 8 is configured to move characteristic points 94a having characteristic shapes among a plurality of points 94 on the contour line of the electrode 91 of the model data 9 first. Specifically, the control unit 8 moves characteristic points 94a having characteristic shapes such as corners, intersections, and curved surfaces first. Thereafter, the control unit 8 moves other points 94b such as straight lines. The control unit 8 obtains the amount of deformation from pattern matching for obtaining the reference P1, and judges the quality of the part 31 based on the amount of deformation. Here, the contour line is represented by connecting the points 94. The control unit 8 obtains the amount of deformation (amount of movement) for all the points 94, and judges the part 31 to be defective if the amount of deformation (amount of movement) exceeds a predetermined threshold value.

[0085] Other configurations of the second embodiment are similar to those of the first embodiment.

[0086] (Effects of the second embodiment) In the second embodiment, the following effects can be obtained.

[0087] In the second embodiment, similarly to the first embodiment, it is possible to prevent a decrease in accuracy when imaging the plurality of electrodes 31a of the component 31 and determining whether the component 31 is good or bad.

[0088] Furthermore, in the second embodiment, as described above, the control unit 8 is configured to deform the model data 9 by deforming the contour line of the electrode 91 in the model data 9 so that the electrodes 31a of the component 31 imaged by the component recognition imaging unit 7 match the electrodes 91 in the model data 9. This allows the contour line of the model data 9 to be deformed for each of the multiple electrodes, making it possible to easily determine the deformation for each of the multiple electrodes 31a.

[0089] Furthermore, in the second embodiment, as described above, the control unit 8 is configured to deform the contour line of the electrode 91 while changing the movement amount and movement direction of the point 94 on the contour line of the electrode 91 in the model data 9. This makes it possible to easily deform the model data 9 so that the contour line of the electrode 91 in the model data 9 matches the electrode 31a of the imaged component 31.

[0090] Also, in the second embodiment, as described above, the control unit 8 is configured to preset an upper limit value for the amount of movement of the point 94 on the contour of the electrode 91 of the model data 9 based on a predetermined threshold value, and to deform the contour of the electrode 91 of the model data 9 within the range of the upper limit value. As a result, when the amount of deformation increases and exceeds the predetermined threshold value, the process of deforming the contour of the electrode 91 of the model data 9 is not continued until the electrode 31a of the component 31 imaged by the component recognition imaging unit 7 matches the electrode 91 of the model data 9, so that the process of deforming the contour of the electrode 91 of the model data 9 can be efficiently terminated.

[0091] Furthermore, in the second embodiment, as described above, the control unit 8 is configured to first move the feature point 94a having a characteristic shape among the multiple points 94 on the contour line of the electrode 91 of the model data 9. This allows the feature point 94a having a characteristic shape, such as a corner, intersection, or curved surface on the contour line of the model data 9, to be moved first, so that even for a portion whose movement position is difficult to uniquely determine, such as a point 94b on a straight line, the movement position can be easily determined based on the movement of the feature point 94a that was moved first.

[0092] Other effects of the second embodiment are similar to those of the first embodiment.

[0093] (Modification) The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The scope of the present invention is indicated by the claims, not by the description of the embodiments above, and further includes all modifications (variations) within the meaning and scope of the claims.

[0094] For example, in the above first and second embodiments, the board working device of the present invention is applied to a component mounting device, but the present invention is not limited to this. The board working device of the present invention may be applied to a board inspection device that inspects a board on which components are mounted. In this case, the quality of the components mounted on the board may be judged.

[0095] In the above first and second embodiments, an example of a configuration for determining whether a component picked up by a mounting head is acceptable is shown, but the present invention is not limited to this. In the present invention, the quality of a component before it is picked up by a mounting head may be determined.

[0096] In the first embodiment, the model data is divided into quadrilateral polygonal regions, but the present invention is not limited to this. In the present invention, the model data may be divided into triangular or polygonal regions having five or more sides.

[0097] In addition, in the above embodiment, an example of a configuration in which one head unit is provided has been shown, but the present invention is not limited to this. In the present invention, a plurality of head units may be provided.

[0098] In the above embodiment, an example of a configuration in which a pair of conveyors for transporting a board is provided is shown, but the present invention is not limited to this. In the present invention, multiple pairs of conveyors for transporting a board may be provided. For example, the present invention may be applied to a component mounting device that can transport boards in parallel and mount components on the boards in parallel.

[0099] In the above embodiment, for convenience of explanation, the control process of the control unit is described using a flow-driven flowchart in which the process is performed in order according to the process flow, but the present invention is not limited to this. In the present invention, the control process of the control unit may be performed by an event-driven process in which the process is performed on an event-by-event basis. In this case, the control process may be performed completely event-driven, or may be performed by combining event-driven and flow-driven processes. [Explanation of symbols]

[0100] 7 Part recognition imaging unit (imaging unit) 8. Control Unit 9 Model Data 31 parts 31a electrode 42 Mounting head 92 Polygon shaped areas 94a Minutiae 100 Component mounting equipment (substrate work equipment) S-substrate

Claims

1. an imaging unit that images a component including a plurality of electrodes connected to a substrate; a control unit that compares an imaging result of the component with model data including information on the positions and shapes of a plurality of electrodes of the component to determine whether the component is good or bad; the control unit is configured to deform the model data so that each electrode of the component imaged by the imaging unit matches each electrode of the model data, and to determine that the component is defective if the amount of deformation corresponding to each electrode of the model data is greater than a predetermined threshold.

2. 2. The board working device according to claim 1, wherein the control unit is configured to deform the model data for a component including a plurality of electrodes so that the electrodes of the component imaged by the imaging unit match the electrodes of the model data for each of the plurality of electrodes, and to determine that the component is defective when an amount of deformation corresponding to each electrode of the model data for at least one electrode is greater than a predetermined threshold value.

3. 3. The board working device according to claim 1, wherein the control unit is configured to deform the model data by dividing the model data into a plurality of polygonal regions and deforming the plurality of polygonal regions so that electrodes of the component imaged by the imaging unit match electrodes of the model data.

4. 4. The board working apparatus according to claim 3, wherein the control unit is configured to deform the polygonal region divided in the model data by changing a movement amount and a movement direction of vertices of the polygonal region.

5. 5. The board working apparatus of claim 4, wherein the control unit is configured to preset an upper limit value for the amount of movement of a vertex of a partitioned polygonal area of ​​the model data based on the predetermined threshold value, and to deform the polygonal area of ​​the model data within a range of the upper limit value.

6. The substrate working apparatus according to any one of claims 3 to 5, wherein the control unit is configured to divide the model data into a plurality of polygonal shaped regions based on at least one of the number, shape, and type of electrodes of the model data.

7. 7. The substrate working apparatus according to claim 6, wherein the control unit is configured to divide the model data into a plurality of polygonal regions such that each divided polygonal region does not include a plurality of electrodes.

8. 3. The board working device according to claim 1, wherein the control unit is configured to deform the model data by deforming contour lines of the electrodes of the model data so that the electrodes of the component imaged by the imaging unit match the electrodes of the model data.

9. 9. The substrate working apparatus according to claim 8, wherein the control unit is configured to deform the contour line of the electrode while changing a movement amount and a movement direction of a point on the contour line of the electrode of the model data.

10. 10. The board working apparatus of claim 9, wherein the control unit is configured to preset an upper limit value for the amount of movement of points on the contour line of the electrode of the model data based on the predetermined threshold value, and to deform the contour line of the electrode of the model data within a range of the upper limit value.

11. The substrate working apparatus according to any one of claims 8 to 10, wherein the control unit is configured to move a characteristic point having a characteristic shape among a plurality of points on a contour line of the electrode of the model data first.

12. The control unit is configured to partition the model data into a plurality of polygonal regions such that no polygonal region includes more than one electrode; The board working device according to any one of claims 1 to 6 and 8 to 11, wherein the control unit is configured to, instead of transforming the model data so that the electrodes of the component imaged by the imaging unit match the electrodes of the model data, divide the model data into a plurality of polygonal regions, and within each polygonal region, perform pattern matching between the electrodes of the component imaged by the imaging unit and the electrodes of the model data, to determine whether the component is good or bad.

13. A mounting head is provided for mounting components onto a board, the imaging unit is configured to capture an image of a component held by the mounting head, The board working device according to any one of claims 1 to 12, wherein the control unit is configured to compare the imaging results of the component with the model data including information on the position and shape of the component's electrodes, and to perform a quality determination of the component held by the mounting head.

Images