Component mounting device and contact detection method

Abstract

To provide a component mounting device and a contact detection method capable of mounting a component on a substrate and sucking the component with an accurate load.SOLUTION: A component mounting device 100 includes a control unit 65 that controls detection of contact between a component E and a substrate Su or contact between a nozzle 61a and the component E on the basis of a current value measured by a current measuring unit 64 or a contact detection average value Ma that is the average value of the thrust force of a head 61 based on the current value in a predetermined section when performing at least one of picking up the component E and mounting the component E on the substrate Su.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a component mounting apparatus and a contact detection method, and more particularly to a component mounting apparatus and a contact detection method that are equipped with a head unit including a head to which a nozzle that holds a component is attached. [Background technology]

[0002] 2. Description of the Related Art Conventionally, component mounting apparatuses equipped with a head unit including a head to which a nozzle for holding a component is attached are known (see, for example, Patent Document 1).

[0003] The above-mentioned Patent Document 1 discloses a component mounting device (component mounting device) equipped with a mounting head (head unit) including a head to which a nozzle for holding components is attached. This component mounting device includes a servo motor and a mounting head control unit. The servo motor generates a driving force required for the lifting and lowering operation when mounting components on a board by the nozzle. The mounting head control unit is configured to control the lifting and lowering operation of the head by the servo motor. Specifically, the mounting head control unit includes a thrust detection unit and a landing detection unit.

[0004] The thrust detector in the above-mentioned Patent Document 1 detects the thrust generated in the servo motor based on the current supplied to the servo motor. The landing detector detects that the component has landed on the board based on the thrust of the servo motor reaching a thrust limit value. In this way, the mounting head controller is configured to control mounting of the component on the board by the thrust detector and the landing detector. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2019-61990 A Summary of the Invention [Problem to be solved by the invention]

[0006] However, in the component mounting device of Patent Document 1, if there is variation in the thrust detected by the thrust detection unit, the landing detection unit cannot accurately detect the landing of the component on the board, making it difficult to mount the component on the board with an accurate load. For this reason, it is desirable for the component mounting device of Patent Document 1 to mount the component on the board with an accurate load by suppressing the variation in the detected thrust and accurately detecting the landing (mounting) of the component on the board. The same is also desirable when suctioning the component.

[0007] The present invention has been made to solve the above-mentioned problems, and one object of the present invention is to provide a component mounting device and a contact detection method that are capable of mounting components on a board and suctioning the components with an accurate load. [Means for solving the problem]

[0008] In order to achieve the above object, a component mounting apparatus according to a first aspect of the present invention includes a head unit including a head to which a nozzle for holding a component is attached and a motor for moving the head in a vertical direction; a current measuring unit for measuring a current value supplied to the motor; and a current measuring unit for measuring a current value measured by the current measuring unit when performing at least one of picking up a component or mounting a component on a board. 、 or 、 Head thrust based on current value 、 of During the head descent In a given section Moving average and a control unit that performs control to detect contact between the component and the board or contact between the nozzle and the component based on the contact detection average value. 。

[0009] In the component mounting apparatus according to the first aspect of the present invention, as described above, when at least one of the component pickup and the component mounting on the board is performed, the current value measured by the current measurement unit is 、 or 、 Head thrust based on current value 、 of During the head descent In a given section Moving averageA control unit is provided to perform control to detect contact between the component and the board or between the nozzle and the component based on the contact detection average value, which is the contact detection average value. This makes it possible to determine the current value or thrust in a specified section, unlike the case where the determination is based on the thrust (current value) at only one point. Moving average By using the average value for contact detection, which is , the variation in the current value or the thrust of the head can be suppressed and the contact between the component and the board can be accurately detected, so that the component can be mounted (mounted) on the board with an accurate load. In addition, the average value for contact detection can suppress the variation in the current value or the thrust of the head and accurately detect the contact between the nozzle and the component, so that the component can be adsorbed with an accurate load. In addition, the average value for contact detection can accurately detect the contact between the component and the board or the contact between the nozzle and the component without providing a dedicated load measuring device, so that an increase in the number of components of the component mounting device and a complex structure can be suppressed, and since there is no need to provide the dedicated load measuring device, it is possible to avoid changing the design of the component mounting device.

[0010] In the component mounting device according to the first aspect, the control unit is preferably configured to detect contact between the component and the board or between the nozzle and the component based on the contact detection average value exceeding a preset contact detection threshold value, and to control the motor to decelerate or stop. With this configuration, when the contact detection average value exceeds the preset contact detection threshold value, the motor is decelerated or stopped to prevent excessive load from being applied to the component, thereby preventing damage to the component due to excessive load.

[0011] In the component mounting device according to the first aspect, the control unit is preferably configured to detect contact between the component and the board and to control to obtain the height position of the board based on the fact that the contact detection average value exceeds a preset contact detection threshold value during the descent of the head. With this configuration, the preset height position of the board can be updated, so that the component mounting operation on the board can be performed accurately and appropriately.

[0012] In this case, preferably, the contact detection threshold value is set for each nozzle height position, and the control unit is configured to perform control to detect contact between the component and the board based on the fact that the contact detection average value calculated each time the nozzle height position changes during the downward movement of the head exceeds the contact detection threshold value set for the nozzle height position corresponding to the calculated contact detection average value. With this configuration, the contact detection threshold value is appropriately set in accordance with the nozzle height position, so that contact between the component and the board can be detected more accurately.

[0013] In the component mounting device that calculates the contact detection average value while the head is descending, the control unit is preferably configured to perform control to calculate the contact detection average value while the head is descending by maintaining the head descent speed constant. By configuring in this way, by keeping the head in the constant speed state, the contact detection average value can be obtained (calculated) without the inertial force caused by the acceleration / deceleration of the head, and therefore it is possible to suppress an increase in the variation of the contact detection average value caused by the inertial force.

[0014] In the component mounting device that calculates the contact detection average value in the constant speed state, the control unit is preferably configured to perform control to acquire the height position of the board based on the calculated contact detection average value exceeding the contact detection threshold value while maintaining the constant speed state after decelerating when the head is lowered. With this configuration, the board height position can be acquired based on a comparison between the contact detection average value in a state in which the variation caused by the inertial force is suppressed and the contact detection threshold value, so that the board height position can be acquired more accurately.

[0015] In the component mounting device that acquires the height position of the board in the constant speed state, the control unit is preferably configured to perform control to store an estimated height position of the board surface based on the height position of the board when the height positions of the same mounting positions on each of the multiple boards are approximately the same height position a predetermined number of times or more when components are mounted on each of the multiple boards in the constant speed state. With this configuration, components can be mounted using the stored information on the estimated height position of the board surface without acquiring the height position of the board in the constant speed state, so that an increase in the mounting time of the components on the board can be suppressed accordingly. Note that approximately the same height may be the same height position, or may be a height position within a certain range with respect to the same height position.

[0016] In the component mounting device that acquires the above-mentioned estimated height position, the control unit is preferably configured to perform control to mount components on the board by switching from a constant speed state for acquiring the height position of the board to a non-constant speed descent state in which the head is lowered toward the estimated height position without maintaining a decelerated state and switching to a constant speed state when lowering the head, based on the acquisition of the estimated height position. With this configuration, by switching to the non-constant speed descent state after acquiring the estimated height position, an increase in the time required to mount components on the board can be suppressed compared to the case in which components are continuously mounted on the board in a constant speed state.

[0017] In the component mounting device that switches to the non-constant speed descent state, the control unit is preferably configured to perform control to switch from the non-constant speed descent state to the constant speed state and reacquire the height position of the board based on the contact detection average value at the estimated height position becoming less than the contact detection threshold value. With this configuration, when the contact between the component and the board cannot be detected at the estimated height position, the height position of the board can be reacquired, so that the component can be mounted on the board at the reacquired height position of the board, thereby making it possible to reliably mount the component on the board.

[0018] In the component mounting device that acquires the above-mentioned estimated height position, the control unit is preferably configured to control to notify that the height position of the board surface is abnormal when the contact detection average value becomes equal to or greater than a contact abnormality detection threshold value for detecting excessive contact between the board and the component after acquiring the estimated height position. With this configuration, the user can be sure to know the abnormality of excessive contact between the board and the component, and therefore the user can be sure to perform the work to eliminate the abnormality of excessive contact between the board and the component.

[0019] A contact detection method according to a second aspect of the present invention includes a step of lowering a head having a nozzle for holding a component by a motor, and detecting a current value measured by a current measuring unit that measures a current value supplied to the motor when at least one of picking up the component and mounting the component on a board is performed. 、 or 、 Head thrust based on current value 、 of During the head descent In a given section Moving average and detecting contact with the board or the component based on the contact detection average value, which is

[0020] In the contact detection method according to the second aspect of the present invention, as described above, when at least one of the component pickup and the component mounting on the board is performed, a current measurement unit measures a current value supplied to the motor. 、 or 、 Head thrust based on current value 、 of During the head descent In a given section Moving average A step of detecting contact with a board or a component based on the contact detection average value, which is the average value of the current value or the thrust in a predetermined section, is provided. Moving average By using the average value for contact detection, which is , the variation in the current value or the thrust force of the head can be suppressed and the contact between the component and the board can be accurately detected, so that a contact detection method capable of mounting (mounting) the component on the board with an accurate load can be obtained. Also, by using the average value for contact detection, the variation in the current value or the thrust force of the head can be suppressed and the contact between the nozzle and the component can be accurately detected, so that a contact detection method capable of adsorbing the component with an accurate load can be obtained. A component mounting device according to a third aspect of the present invention comprises a head unit including a head to which a nozzle for holding a component is attached and a motor for moving the head in an up and down direction, a current measuring unit for measuring a current value supplied to the motor, and a control unit for controlling detection of contact between the component and the board or contact between the nozzle and the component based on a contact detection average value which is the average value over a predetermined interval of the current value measured by the current measuring unit or the head thrust force based on the current value when at least one of adsorbing a component or mounting the component on a board is performed, and the control unit is configured to detect contact between the component and the board and to control acquisition of the height position of the board based on the fact that the contact detection average value exceeds a predetermined contact detection threshold value while the head is descending. Effect of the Invention

[0021] According to the present invention, as described above, mounting of components on a board and suction of the components can be performed with an accurate load. [Brief description of the drawings]

[0022] [Figure 1] 1 is a plan view showing a component mounting apparatus according to an embodiment; [Diagram 2] 1 is a side view showing a component mounting apparatus according to an embodiment; [Diagram 3] 2 is a block diagram showing the relationship between a control device and a head unit of the component mounting apparatus according to the embodiment. FIG. [Figure 4] 11 is a graph showing the relationship between the change in head thrust over time and the height position of the nozzle in the component mounting device according to one embodiment. [Diagram 5] 6 is a graph showing changes in the height position and speed of the nozzle when the control unit of the component mounting device according to the embodiment is in a constant speed state. [Figure 6] 11 is a graph showing changes in the height position and speed of the nozzle when the control unit of the component mounting device according to the embodiment is in a non-constant speed lowering state. [Figure 7] 11 is a graph showing changes in the height position and speed of the nozzle in a reacquisition state of the control unit of the component mounting device according to the embodiment. [Figure 8] 13 is a diagram showing a screen for notifying an abnormality in the height position of a board surface on a display unit of the component mounting device according to the embodiment; FIG. [Figure 9] 1 is a flowchart showing a first part of a contact detection method in a component mounting apparatus according to an embodiment. [Figure 10] 11 is a flowchart showing a middle part of a contact detection method in a component mounting apparatus according to an embodiment. [Figure 11] 11 is a flowchart showing a latter part of a contact detection method in a component mounting apparatus according to an embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0023] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

[0024] (Component mounting equipment) The configuration of a component mounting apparatus 100 according to an embodiment of the present invention will be described with reference to FIGS.

[0025] As shown in FIG. 1, the component mounting apparatus 100 is configured to mount components (electronic components) E, such as ICs, transistors, capacitors, and resistors, on a printed circuit board (substrate Su) arranged on the component mounting apparatus 100.

[0026] Here, in the component mounting apparatus 100, the transport direction in which the substrate Su is transported is the X1 direction, the opposite direction to the transport direction in which the substrate Su is transported is the X2 direction, and the combined direction of the X1 and X2 directions is the X direction. The horizontal direction perpendicular to the X direction is the Y direction, one side of the Y direction is the Y1 direction, and the other side of the Y direction is the Y2 direction. The vertical direction perpendicular to the X and Y directions is the Z direction (vertical direction), one side of the Z direction is the Z1 direction (upward direction), and the other side of the Z direction is the Z2 direction (downward direction).

[0027] The component mounting apparatus 100 includes a base 1, a feeder placement section 2, a board transport section 3, a support section 4, a pair of rail sections 5, a head unit 6, a component recognition camera 7, a board recognition camera 8, a control device 9, and a display section 10.

[0028] (Base) The base 1 is a base on which each component is arranged in the component mounting apparatus 100. On the base 1, a board transport section 3, a rail section 5, and a component recognition camera 7 are provided as components. A control device 9 is also provided inside the base 1. The base 1 is also provided with feeder arrangement sections 2 on both sides in the Y direction (the Y1 direction side and the Y2 direction side) on which a plurality of tape feeders 2a can be arranged.

[0029] (Tape feeder) The tape feeder 2a is a component supplying device that supplies components E to be mounted on the board Su. The tape feeder 2a holds a reel (not shown) around which a component supply tape is wound, the component supply tape holding a plurality of components E at predetermined intervals.

[0030] (Substrate transport section) As shown in FIG. 1, the board transport section 3 is configured to carry in a board Su from outside the component mounting apparatus 100, and transport the board Su in a transport direction (X1 direction).

[0031] The substrate transport section 3 includes a pair of conveyors 31 and a motor (not shown). Each of the pair of conveyors 31 has a pulley (not shown) and a ring-shaped transport belt looped around the pulley. The substrate transport section 3 is electrically connected to a control device 9. The substrate transport section 3 is configured to control the transport speed of the substrate Su placed on the pair of conveyors 31 by controlling the motor (not shown) based on a control signal from the control device 9.

[0032] (Support part) The support unit 4 is configured to support the head unit 6, which moves to mount the component E on the substrate Su, so as to be movable in the X direction. The support unit 4 includes a ball screw shaft 41 and a motor 42. The ball screw shaft 41 extends in the X direction. The support unit 4 is electrically connected to the control device 9. As a result, the support unit 4 is configured to control the motor 42 based on a control signal from the control device 9 to control the movement of the head unit 6, which is attached to a ball nut engaged with the ball screw shaft 41, in the X direction.

[0033] (Rail section) The pair of rail portions 5 are configured to support the support portion 4 movably in the Y direction. The rail portion 5 includes a ball screw shaft 51, a guide rail 52, and a motor 53. The ball screw shaft 51 extends in the Y direction. The guide rail 52 extends in the Y direction. The rail portion 5 is electrically connected to a control device 9. The rail portion 5 is configured to control the motor 53 based on a control signal from the control device 9 to control the movement of the support portion 4 attached to a ball nut engaged with the ball screw shaft 51 in the Y direction.

[0034] With this configuration, the head unit 6 is movable on the base 1 within a horizontal plane (in the X and Y directions).

[0035] (Head unit) As shown in FIGS. 2 and 3, the head unit 6 is a head unit for mounting components, and is configured to move in the Z1 direction (upward) of the substrate Su and perform a predetermined operation (mounting operation) on the substrate Su.

[0036] Specifically, the head unit 6 includes a head 61, a Z-axis motor 62, an R-axis motor 63, a current measuring unit 64, a control unit 65, and a storage unit 66. The Z-axis motor 62 is an example of the "motor" in the claims.

[0037] A nozzle 61a that holds a component E is attached to the head 61. A spring 67 is attached to the nozzle 61a to absorb the load when mounting (mounting) the component E on the board Su. The head 61 is configured to mount the component E held by the nozzle 61a at a target mounting position (not shown) on the board Su that is fixed to the board work position. Multiple heads 61 (four heads) are arranged in a line in the X direction.

[0038] Each of the heads 61 is connected to a pressure generator (not shown) and configured to be able to hold (suck) the component E to a nozzle 61a attached to the tip by the negative pressure generated by the pressure generator. Also, each of the heads 61 is configured to be able to mount the component E on the board Su by switching the negative pressure generated by the pressure generator to positive pressure.

[0039] The Z-axis motor 62 is configured to raise and lower the head 61 in the Z direction (up and down direction), and the R-axis motor 63 is configured to rotate the head 61 around a rotation axis.

[0040] The current measuring unit 64 measures the current value supplied to the Z-axis motor 62. The control unit 65 is configured to control the head unit 6. Specifically, the control unit 65 is a motor driver for controlling the Z-axis motor 62. The control unit 65 is a CPU (Central Processing Unit). The storage unit 66 is a storage device having memories such as a ROM (Read Only Memory) and a RAM (Random Access Memory). The storage unit 66 stores a head control program for raising and lowering the head 61. The control of the raising and lowering operation of the head 61 by the Z-axis motor 62 will be described in detail later.

[0041] (Parts recognition camera) The component recognition camera 7 is a camera for capturing an image of the component E held (sucked) by the nozzle 61a prior to mounting the component E on the board Su. The component recognition camera 7 is fixed on the base 1, and configured to capture an image of the component E held (sucked) by the nozzle 61a from below the component E (Z2 direction).

[0042] (Board recognition camera) The board recognition camera 8 is attached to the head unit 6, and is a mark imaging camera that images an FI mark (Fiducial Mark: not shown) attached to the upper surface of the board Su prior to mounting the component E on the board Su. The FI mark is a mark for confirming the position of the board Su.

[0043] (Control device) The control device 9 includes a control unit 91 as a CPU and a storage unit 92, and controls the operation of the component mounting apparatus 100. The control device 9 is electrically connected to the tape feeder 2a, the board transport unit 3, the support unit 4, the rail unit 5, the head unit 6, the component recognition camera 7, and the board recognition camera 8.

[0044] The storage unit 92 is a storage device having memories such as ROM and RAM. A component mounting program is stored in the storage unit 92. The component mounting program is a program for performing a mounting process of a component E to be mounted on a board Su. The storage unit 92 also stores a preset initial board surface height position Z0, board warpage information Tb which is information on the magnitude of upward or downward warpage of the board Su, and a component thickness Tc of the component E.

[0045] (Display) The display unit 10 (see FIG. 1) is configured with a liquid crystal display, etc. The display unit 10 is configured to display information transmitted from the control device 9 on the screen.

[0046] (Thrust-based contact detection) In the component mounting apparatus 100, the spring 67 that absorbs the load applied to the component E when mounting (mounting) the component E on the board Su is attached to the nozzle 61a. However, since a thin or small component E may be mounted, it is desired to suppress the load applied to the component E when mounting the component E on the board Su as much as possible. For this reason, it is conceivable to measure the thrust of the head 61 when mounting (mounting) the component E on the board Su and detect the contact between the component E and the board Su based on the measured thrust of the head 61. However, if a dedicated load measuring device is provided to measure the thrust of the head 61 applied to the component E when mounting the component E on the board Su, the number of components of the component mounting apparatus 100 will increase and a design change of the component mounting apparatus 100 will be required. In addition, there is a possibility that the contact position between the component E and the board Su will be erroneously detected due to the variation in the thrust of the head 61 when mounting (mounting) the component E on the board Su (see the two-dot chain line in FIG. 4).

[0047] 4, the control unit 65 of this embodiment is configured to perform control to detect contact between the component E and the board Su based on a contact detection average value Ma, which is an average value in a predetermined section of the thrust of the head 61 based on the current value measured by the current measurement unit 64, when mounting the component E on the board Su. That is, the control unit 65 is configured to perform control to detect contact between the component E and the board Su based on a moving average value of the thrust of the head 61, when mounting the component E on the board Su. In this way, the contact detection average value Ma is a moving average value.

[0048] Specifically, the control unit 65 is configured to detect contact between the component E and the board Su based on the fact that the contact detection average value Ma has exceeded a preset contact detection threshold value Th, and to control the Z-axis motor 62 to decelerate or stop. The control unit 65 is also configured to detect contact between the component E and the board Su based on the fact that the contact detection average value Ma has exceeded a preset contact detection threshold value Th, during the downward movement of the head 61, and to control the board 62 to acquire a height position H of the board Su. The height position H of the board Su is calculated by adding a height position Hn of the tip (lower end) of the nozzle 61a and the thickness of the component E.

[0049] The contact detection threshold value Th is set for each height position Hn of the tip (lower end) of the nozzle 61a. The contact detection threshold value Th is set in advance by performing a lifting operation multiple times in which the nozzle 61a is lowered and raised without contacting the component E with the board Su, while calculating a moving average value of the thrust of the head 61. That is, the contact detection threshold value Th is calculated by adding three times the standard deviation of the thrust of the head 61 for each height position Hn of the nozzle 61a to the average value of the thrust of the head 61 for each height position Hn of the nozzle 61a when the above-mentioned lifting operation is performed multiple times.

[0050] In this way, the control unit 65 is configured to perform control to detect contact between the component E and the board Su based on the fact that the contact detection average value Ma calculated each time the height position Hn of the nozzle 61a changes during the descent of the head 61 exceeds the contact detection threshold value Th set at the height position Hn of the nozzle 61a corresponding to the calculated contact detection average value Ma.

[0051] Here, as shown in FIG. 5, when acquiring the height position H of the substrate Su during the descent of the head 61, the control unit 65 is configured to perform control to measure the thrust of the head 61 in a state in which the inertial force of the head 61 caused by the acceleration / deceleration of the Z-axis motor 62 is suppressed. Specifically, the control unit 65 is configured to perform control to calculate the contact detection average value Ma during the descent of the head 61 in a constant speed state T1 in which the descent speed of the head 61 is kept constant. Here, the descent indicates the timing when the height position Hn of the nozzle 61a becomes a predetermined height position Hd during the descent of the head 61. The predetermined height position Hd is acquired by calculating the difference between the initial substrate surface height position Z0 and the component thickness Tc of the component E and the set value. The set value is appropriately set according to the component thickness Tc and the warp of the substrate Su. The control unit 65 may also acquire the contact detection average value Ma in a state in which the head 61 is slightly accelerated and decelerated, instead of the constant speed state T1.

[0052] Furthermore, when lowering the head 61, the control unit 65 is configured to perform control to acquire the height position H of the board Su based on the calculated average value for contact detection Ma exceeding the threshold value for contact detection Th while maintaining the constant speed state T1 after decelerating. The constant speed state T1 is a speed state of the head 61 in the contact detection section N1 for detecting contact between the component E and the board Su and acquiring the height position H of the board Su.

[0053] Here, the control unit 65 is configured to perform control to store an estimated height position He of the board surface based on the height position H of the board Su when the height position H of the same mounting point (mounting position) on each of the multiple boards Su is approximately the same height position a predetermined number of times or more when the components E are mounted on each of the multiple boards Su at a constant speed state T1. Note that approximately the same height may be the same height position H, or may be a height position H that falls within a certain range with respect to the same height position H. In addition, the certain range varies depending on the thickness of the component E because the measurement accuracy of the height position H of the board Su differs depending on the type of component E. For example, the certain range becomes narrower as the thickness of the component E becomes thinner. In addition, the estimated height position He is calculated based on the difference between the component thickness Tc and the board warp information Tb from the initial board surface height position Z0 set in advance.

[0054] 6, the control unit 65 is configured to mount the component E on the board Su without switching to the constant speed state T1 after acquiring the estimated height position He of the board surface in order to suppress an increase in the mounting time of the component E on the board Su due to the constant speed state T1. Specifically, the control unit 65 is configured to perform control to mount the component E on the board Su by switching from the constant speed state T1 for acquiring the height position H of the board Su to a non-constant speed descent state T2 in which the head 61 is lowered toward the estimated height position He without switching to the constant speed state T1 while maintaining the deceleration state when lowering the head 61 based on the acquisition of the estimated height position He.

[0055] Furthermore, the control unit 65 is configured to perform control to detect contact between the component E and the board Su based on the contact detection average value Ma in the contact detection section N2 after the non-constant speed descending state T2, and to obtain the height position H of the board Su. Here, in the contact detection section N2, the state of the head 61 is a stopped state in which movement has been stopped.

[0056] 7, the control unit 65 is configured to perform control to switch from the non-constant speed descent state T2 to the constant speed state T1 and reacquire the height position H of the substrate Su when it is not possible to detect contact between the component E and the substrate Su at the estimated height position He. That is, when it is detected in the contact detection section N2 that the component E and the substrate Su were not in contact in the non-constant speed descent state T2, the control unit 65 is configured to perform control to switch from the non-constant speed descent state T2 to the constant speed state T1 and reacquire the height position H of the substrate Su. In addition, when it is not possible to detect contact between the component E and the substrate Su in the contact detection section N2, the control unit 65 is configured to perform control to switch from the non-constant speed descent state T2 to the constant speed state T1 and reacquire the height position H of the substrate Su in the contact detection section N3.

[0057] 8, the control unit 65 is configured to control the display unit 10 to notify that the height position H of the board surface is abnormal when the contact detection average value Ma becomes equal to or greater than a contact abnormality detection threshold value for detecting excessive contact between the board Su and the component E after acquiring the estimated height position He. Here, the contact abnormality detection threshold value is greater than the contact detection threshold value Th. Furthermore, the control unit 65 is configured to control the display unit 10 to notify that the height position H of the board surface is abnormal even when the current height position H of the board Su is outside a predetermined range based on a comparison between the average value of the multiple height positions H up to the previous time and the current height position H.

[0058] (Contact detection method) Hereinafter, a contact detection method for detecting contact between the component E and the board Su by the control unit 65 will be described with reference to FIGS.

[0059] 9, in step S1, the head 61 moves horizontally to a mounting position (mounting position) on the board Su. At this time, information on the board Su, information on the component mounting device 100, information on the component thickness Tc of the component E, and information on a preset initial board surface height position Z0 are transmitted from the control device 9 to the control unit 65. In step S2, it is determined whether or not this is the first mounting point. If it is the first mounting point, proceed to step S3. If it is not the first mounting point, proceed to step S6.

[0060] In step S3, the head 61 starts to lower the component E toward the initial board surface height position Z0. In step S4, it is determined whether or not the component E has reached a predetermined height position Hd above the initial board surface height position Z0. If the predetermined height position Hd has been reached, the process proceeds to step S5, and if the predetermined height position Hd has not been reached, step S4 is repeated. In step S5, the head 61 descends at a constant speed state T1. Then, the process proceeds to step S10 shown in FIG. 10.

[0061] As shown in FIG. 9, in step S6, it is determined whether or not height information (information on the height position H of the board Su) is stored a predetermined number of times at the same mounting point (mounting position) as another board Su. If height information is not stored a predetermined number of times, the process proceeds to step S3, and if height information is stored a predetermined number of times, the process proceeds to step S7. In step S7, the head 61 starts to descend in the non-constant speed descending state T2. At this time, board warpage information Tb is acquired. Then, an estimated height position He is calculated based on the board warpage information Tb. Then, the head 61 descends the component E toward the estimated height position He.

[0062] In step S8, it is determined whether the bottom end position of the component E based on the height position Hn of the nozzle 61a has reached the estimated height position He. If the bottom end position of the component E has reached the estimated height position He, the process proceeds to step S9. If the bottom end position of the component E has not reached the estimated height position He, the process repeats step S8. Then, the process proceeds to step S10.

[0063] As shown in Fig. 10, in step S10, it is determined whether the average value Ma for contact detection has exceeded the contact detection threshold value Th. If the average value Ma for contact detection has exceeded the contact detection threshold value Th, the process proceeds to step S11, and if the average value Ma for contact detection is equal to or less than the contact detection threshold value Th, the process proceeds to step S18. In step S11, it is determined whether the average value Ma for contact detection is equal to or more than the contact abnormality detection threshold value. If the average value Ma for contact detection is equal to or more than the contact abnormality detection threshold value, the process proceeds to step S21, and if the average value Ma for contact detection is less than the contact abnormality detection threshold value, the process proceeds to step S12.

[0064] In step S12, the component E is mounted (mounted) on the board Su. In step S13, after the component E is mounted on the board Su, the head 61 starts to rise. In step S14, the height position H of the board Su at the time when the contact detection average value Ma becomes equal to or greater than the contact detection threshold value Th is stored. In step S15, it is determined whether or not the height position H of the board Su exceeds the average value of the height position H of the board Su up to the previous time. If the height position H of the board Su exceeds the average value of the height position H of the board Su up to the previous time, the process proceeds to step S17, and if the height position H of the board Su is equal to or less than the average value of the height position H of the board Su up to the previous time, the process proceeds to step S16. In step S16, the control unit 65 transmits the height position H of the board Su to the control device 9, and the height position H of the board Su is stored in the control device 9. Then, the process proceeds to step S26 in FIG. 11. In addition, in step S17, the user is notified that the height position H of the board surface is abnormal, and then the process proceeds to step S28 in FIG. 11.

[0065] Furthermore, in step S18, the head 61 starts to descend in the constant speed state T1. In step S19, it is determined whether the average value Ma for contact detection has exceeded the threshold value Th for contact detection. If the average value Ma for contact detection has exceeded the threshold value Th for contact detection, the process proceeds to step S20, and if the average value Ma for contact detection is equal to or less than the threshold value Th for contact detection, the process repeats step S19. After the component E is mounted on the board Su in step S20, the process proceeds to step S13.

[0066] Furthermore, after the component E is mounted on the board Su in step S21, the operation of the component mounting apparatus 100 is stopped in step S22. In step S23, the stored height position H of the board Su is reset (deleted). In step S24, it is determined whether or not production is to be continued. If production is to be continued, the process proceeds to step S16, and if production is not to be continued, the contact detection method is terminated.

[0067] In step S26, it is determined whether height information (information on the height position H of the substrate Su) is stored a predetermined number of times at the same mounting point (mounting position) as another substrate Su. That is, it is determined whether the height position H of the substrate Su at approximately the same height position is stored a predetermined number of times or more. If the information on the height position H at the same height position is stored a predetermined number of times, the process proceeds to step S27. If the information on the height position H at approximately the same height position is not stored a predetermined number of times, the process proceeds to step S28. In step S27, substrate warpage information Tb is created based on the height position H of the substrate Su at approximately the same height position a predetermined number of times or more, and the substrate warpage information Tb is stored. In step S28, the head 61 stops at the initial position (upward end position). In step S29, it is determined whether there is a next mounting point (mounting position). If there is a next mounting point, the process returns to step S1, and if there is no next mounting point, the contact detection method ends.

[0068] (Effects of this embodiment) In this embodiment, the following effects can be obtained.

[0069] In this embodiment, as described above, the component mounting apparatus 100 includes a control unit 65 that performs control to detect contact between the component E and the substrate Su based on the average value for contact detection Ma, which is the average value of the thrust of the head 61 based on the current value in a predetermined section, when mounting the component E on the substrate Su. As a result, unlike the case of judging based on the thrust (current value) at only one point, the average value for contact detection Ma, which is the average value of the current value or thrust in a predetermined section, can be used to suppress the variation in the current value or the thrust of the head 61 and accurately detect the contact between the component E and the substrate Su, so that the component E can be mounted (mounted) on the substrate Su with an accurate load. In addition, the average value for contact detection Ma can accurately detect the contact between the component E and the substrate Su without providing a dedicated load measuring device, so that an increase in the number of components of the component mounting apparatus 100 and a complex structure can be suppressed. In addition, since there is no need to provide a dedicated load measuring device, it is possible to avoid design changes to the component mounting apparatus 100.

[0070] Furthermore, in this embodiment, as described above, the control unit 65 is configured to detect contact between the component E and the board Su based on the fact that the contact detection average value Ma has exceeded the preset contact detection threshold value Th, and to control the Z-axis motor 62 to decelerate or stop. In this way, by decelerating or stopping the Z-axis motor 62 when the contact detection average value Ma has exceeded the preset contact detection threshold value Th, it is possible to prevent an excessive load from being applied to the component E, and therefore to prevent damage to the component E caused by the excessive load.

[0071] In this embodiment, as described above, the control unit 65 is configured to detect contact between the component E and the board Su and to perform control to acquire the height position H of the board Su based on the fact that the contact detection average value Ma exceeds the preset contact detection threshold value Th while the head 61 is moving downward. This makes it possible to update the preset height position H of the board Su, thereby enabling the mounting operation of the component E on the board Su to be performed accurately and appropriately.

[0072] In this embodiment, as described above, the contact detection threshold value Th is set for each height position Hn of the nozzle 61a. The control unit 65 is configured to perform control to detect contact between the component E and the board Su based on the fact that the contact detection average value Ma calculated each time the height position Hn of the nozzle 61a changes during the downward movement of the head 61 exceeds the contact detection threshold value Th set for the height position Hn of the nozzle 61a corresponding to the calculated contact detection average value Ma. As a result, the contact detection threshold value Th is appropriately set in accordance with the height position Hn of the nozzle 61a, so that the contact between the component E and the board Su can be detected more accurately.

[0073] Furthermore, in this embodiment, as described above, the control unit 65 is configured to perform control to calculate the contact detection average value Ma by keeping the descent speed of the head 61 constant during the descent of the head 61 in the constant speed state T1. As a result, by keeping the head 61 in the constant speed state T1, it is possible to obtain (calculate) the contact detection average value Ma in a state where no inertial force caused by acceleration / deceleration of the head 61 is applied, and therefore it is possible to suppress an increase in the variation of the contact detection average value Ma caused by the inertial force.

[0074] Furthermore, in this embodiment, as described above, the control unit 65 is configured to perform control to acquire the height position H of the substrate Su based on the calculated average value for contact detection Ma exceeding the contact detection threshold value Th while maintaining the constant speed state T1 after decelerating when the head 61 is lowered. This makes it possible to acquire the height position H of the substrate Su based on a comparison between the average value for contact detection Ma in a state in which the variation caused by the inertial force is suppressed and the contact detection threshold value Th, thereby making it possible to acquire a more accurate height position H of the substrate Su.

[0075] Furthermore, in this embodiment, as described above, the control unit 65 is configured to perform control to store an estimated height position He of the board surface based on the height position H of the board Su when the height position H of the same mounting position on each of the multiple boards Su is approximately the same height position a predetermined number of times or more when the components E are mounted on each of the multiple boards Su in a constant speed state. This makes it possible to mount the components E using the stored information on the estimated height position He of the board surface without acquiring the height position H of the board Su in the constant speed state T1, thereby suppressing an increase in the mounting time for the components E on the board Su.

[0076] Furthermore, in this embodiment, as described above, the control unit 65 is configured to perform control to mount the components E on the board Su by switching from the constant speed state T1 for acquiring the height position H of the board Su to a non-constant speed descent state T2 in which the head 61 is lowered toward the estimated height position He without maintaining the deceleration state and entering the constant speed state T1 when lowering the head 61 based on the acquisition of the estimated height position He. As a result, by switching to the non-constant speed descent state T2 after acquiring the estimated height position He, it is possible to suppress an increase in the mounting time of the components E on the board Su compared to the case in which mounting of the components E on the board Su is continued in the constant speed state T1.

[0077] Furthermore, in this embodiment, as described above, the control unit 65 is configured to perform control to switch from the non-constant speed descent state T2 to the constant speed state T1 and reacquire the height position H of the board Su based on the fact that the contact detection average value Ma at the estimated height position He becomes less than the contact detection threshold value Th. In this way, by reacquiring the height position H of the board Su when contact between the component E and the board Su cannot be detected at the estimated height position He, the component E can be mounted on the board Su at the reacquired height position H of the board Su, so that the component E can be reliably mounted on the board Su.

[0078] Furthermore, in this embodiment, as described above, the control unit 65 is configured to perform control to notify the user that the height position H of the board surface is abnormal when the contact detection average value Ma becomes equal to or greater than the contact abnormality detection threshold value for detecting excessive contact between the board Su and the component E after acquiring the estimated height position He. This allows the user to be reliably informed of the abnormality of excessive contact between the board Su and the component E, and therefore allows the user to reliably perform work to eliminate the abnormality of excessive contact between the board Su and the component E.

[0079] Furthermore, in this embodiment, as described above, the contact detection method includes step S10 of detecting contact with the board Su or the component E based on the contact detection average value Ma, which is the average value in a predetermined section of the thrust of the head 61 based on the current value supplied to the Z-axis motor 62, when mounting the component E on the board Su. As a result, unlike the case of making a judgment based on the thrust (current value) of only one point, by using the contact detection average value Ma, which is the average value of the current value or thrust of the head 61 in a predetermined section, it is possible to suppress the variation in the current value or the thrust of the head 61 and accurately detect the contact between the component E and the board Su, and therefore it is possible to obtain a contact detection method that enables the component E to be mounted on the board Su with an accurate load.

[0080] [Variations] The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The scope of the present invention is indicated by the claims, not by the description of the embodiments above, and further includes all modifications (variations) within the meaning and scope of the claims.

[0081] For example, in the above embodiment, the control unit 65 is configured to perform control to detect contact between the component E and the board Su based on the contact detection average value Ma when mounting the component E on the board Su, but the present invention is not limited to this. In the present invention, the control unit may be configured to perform control to detect contact between the nozzle and the component based on the contact detection average value when picking up the component. This makes it possible to accurately detect contact between the nozzle and the component by suppressing variations in the current value or the thrust force of the head using the contact detection average value, and therefore to pick up the component with an accurate load.

[0082] In the above embodiment, the control unit 65 is configured to perform control to notify that the height position H of the substrate surface is abnormal when the height position H of the current substrate Su is outside a predetermined range based on a comparison between the average value of the height positions H of the multiple substrates Su up to the previous time and the height position H of the current substrate Su, but the present invention is not limited to this. In the present invention, the control unit may be configured to perform control to notify that the height position of the substrate surface is abnormal when the height position of the current substrate is outside a predetermined range based on a comparison between the median value of the height positions of the multiple substrates up to the previous time and the height position of the current substrate.

[0083] In the above embodiment, the contact detection threshold value Th is calculated by adding three times the standard deviation of the head 61 thrust force at each height position Hn of the nozzle 61a to the average value of the head thrust force at each height position Hn of the nozzle 61a when the lifting and lowering operation is performed multiple times, but the present invention is not limited to this. In the present invention, the contact detection threshold value may be calculated by adding the maximum value of three times the standard deviation of the head thrust force at each height position of the nozzle to the average value of the head thrust force at each height position of the nozzle when the lifting and lowering operation is performed multiple times.

[0084] In the above embodiment, the control unit 65 is configured to perform control to calculate the contact detection average value Ma by keeping the descent speed of the head 61 constant during the descent of the head 61 in a constant speed state T1, but the present invention is not limited to this. In the present invention, the control unit may be configured to perform control to calculate the contact detection average value without keeping the descent speed during the descent of the head.

[0085] In the above embodiment, the control unit 65 is configured to perform control to store the height position H of the board Su as an estimated height position He of the board surface when the height position H of the board Su is substantially the same height position for a predetermined number of times or more when the components E are mounted on the board Su multiple times at a constant speed T1, but the present invention is not limited to this. In the present invention, the control unit does not have to perform control to store the height position of the board as an estimated height position of the board surface when the height position of the board is substantially the same height position for a predetermined number of times or more when the components E are mounted on the board multiple times at a constant speed T1.

[0086] In the above embodiment, the control unit 65 is configured to switch to the non-constant speed descent state T2 in which the head 61 is lowered toward the estimated height position He based on the acquisition of the estimated height position He, and to perform control to mount the component E on the board Su while acquiring the contact detection average value Ma, but the present invention is not limited to this. In the present invention, the control unit does not have to switch to the non-constant speed descent state in which the head is lowered toward the estimated height position based on the acquisition of the estimated height position.

[0087] In the above embodiment, the control unit 65 is configured to perform control to switch from the non-constant speed descent state T2 to the constant speed state T1 and reacquire the height position of the board Su when contact between the component E and the board Su cannot be detected at the estimated height position He, but the present invention is not limited to this. In the present invention, the control unit does not need to perform control to switch from the non-constant speed descent state to the constant speed state and reacquire the height position of the board when contact between the component E and the board cannot be detected at the estimated height position He.

[0088] In the above embodiment, for convenience of explanation, the control process of the control unit 65 is described using a flow-driven flowchart in which the process is performed in order according to the process flow, but the present invention is not limited to this. In the present invention, the control process of the control unit may be performed by an event-driven process in which the process is performed on an event-by-event basis. In this case, the control process may be performed completely event-driven, or may be performed in a combination of event-driven and flow-driven. [Explanation of symbols]

[0089] 6 Head Unit 61 Head 61a Nozzle 62 Z-axis motor 64 Current measurement section 65 Control Unit 100 Component mounting equipment E Parts H Height position of the board Hd Predetermined height position He Estimated height position Ma Average value for contact detection Su substrate T1 Constant speed state T2 Non-constant speed descent state Th Threshold for contact detection

Claims

1. a head unit including a head to which a nozzle for holding a component is attached and a motor for moving the head in a vertical direction; a current measuring unit that measures a value of a current supplied to the motor; a control unit that performs control to detect contact between the component and the board, or contact between the nozzle and the component, based on a contact detection average value, which is a moving average value of the current value measured by the current measuring unit, or the thrust of the head based on the current value, over a predetermined section during the descent of the head, when at least one of adsorbing the component or mounting the component on a board is performed.

2. 2. The component mounting device according to claim 1, wherein the control unit is configured to detect contact between the component and the board or between the nozzle and the component based on the contact detection average value exceeding a preset contact detection threshold value, and to control the motor to slow down or stop.

3. 3. The component mounting device according to claim 1, wherein the control unit is configured to detect contact between the component and the board and to obtain a height position of the board based on the average value for contact detection exceeding a preset threshold value for contact detection while the head is descending.

4. the contact detection threshold value is set for each height position of the nozzle, 4. The component mounting device according to claim 3, wherein the control unit is configured to perform control to detect contact between the component and the board based on the fact that the contact detection average value calculated each time the height position of the nozzle changes during the descent of the head exceeds the contact detection threshold value set at the height position of the nozzle corresponding to the calculated contact detection average value.

5. 5. The component mounting device according to claim 3, wherein the control unit is configured to control the calculation of the contact detection average value by maintaining a constant speed state in which the descent speed of the head is kept constant during the descent of the head.

6. 6. The component mounting device according to claim 5, wherein the control unit is configured to perform control to acquire a height position of the board based on the calculated average value for contact detection exceeding the threshold value for contact detection while decelerating and then maintaining the constant speed state when the head is lowered.

7. 7. The component mounting device according to claim 6, wherein the control unit is configured to perform control to store an estimated height position of the board surface based on the height position of the board when, when the components are mounted on each of the plurality of boards at the constant speed, the height position of the same mounting position on each of the plurality of boards is approximately the same height position a predetermined number of times or more.

8. 8. The component mounting device according to claim 7, wherein the control unit is configured to control mounting of the component on the board by switching from the constant speed state for acquiring the height position of the board to a non-constant speed descent state in which the head is lowered toward the estimated height position without maintaining a decelerated state and entering the constant speed state when lowering the head based on the acquisition of the estimated height position.

9. 9. The component mounting device according to claim 8, wherein the control unit is configured to switch from the non-constant speed descent state to the constant speed state based on the average value for contact detection at the estimated height position becoming less than the threshold value for contact detection, and to perform control to re-acquire the height position of the board.

10. The control unit is configured to control the component mounting device according to any one of claims 7 to 9, so that after acquiring the estimated height position, if the contact detection average value becomes equal to or greater than a contact abnormality detection threshold value for detecting excessive contact between the board and the component, the control unit performs control to notify that the height position of the board surface is abnormal.

11. A step of lowering a head having a nozzle attached thereto and holding a part by a motor; and detecting contact with the board or the component based on a contact detection average value, which is a moving average value of the current value measured by a current measuring unit that measures the current value supplied to the motor, or the thrust of the head based on the current value, over a predetermined section during the descent of the head when at least one of adsorbing the component or mounting the component on the board is performed.

12. A head unit including a head to which a nozzle for holding a part is attached and a motor for moving the head in an up and down direction; a current measuring unit that measures a value of a current supplied to the motor; a control unit that performs control to detect contact between the component and the board or contact between the nozzle and the component based on a contact detection average value that is an average value over a predetermined interval of the current value measured by the current measuring unit or the thrust of the head based on the current value when at least one of suctioning the component or mounting the component on a board is performed, the control unit is configured to detect contact between the component and the board and to obtain the height position of the board based on the fact that the contact detection average value exceeds a predetermined contact detection threshold value while the head is descending.

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