Electronic device and method for manufacturing the same

Abstract

Provided is an electronic device that can suppress a bonding material from peeling or being damaged. The electronic device comprises an electronic component, a mounting part, and a bonding material. The electronic component has an element main surface and an element rear surface that are separated from each other in the z direction. The mounting part has a mounting surface facing the element rear surface, and the electronic component is mounted on the mounting part. The bonding material bonds the electronic component to the mounting part. The bonding material includes a base portion and a fillet portion. The base portion is sandwiched between the electronic component and the mounting part in the z direction. The fillet portion is connected to the base portion and is formed outside the electronic component when viewed in the z direction. The electronic component includes two element side surfaces and a ridge. The ridge is an intersection of the two element side surfaces and extends in the z direction. The fillet portion includes a ridge covering portion that covers at least a portion of the ridge.

Description

[Technical field]

[0001] The present disclosure relates to electronic devices and methods for manufacturing electronic devices. [Background technology]

[0002] Patent Document 1 discloses an example of a conventional electronic device. The electronic device described in Patent Document 1 includes an electronic component, a lead frame, and a bonding material. In the electronic device, the electronic component is a semiconductor element. The lead frame includes a mounting portion on which the electronic component is mounted. The mounting portion is a portion called an island or a die pad. The bonding material bonds the electronic component to the mounting portion. For example, silver paste is used as the bonding material. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2000-277679 A Summary of the Invention [Problem to be solved by the invention]

[0004] In the electronic device, the electronic components generate heat when current is applied to the electronic components. This heat generates thermal stress in the bonding material due to the difference in linear expansion coefficient between the electronic components and the mounting part (lead frame). As a result, the bonding material may peel off from the mounting part or be damaged (e.g., cracks may occur). This peeling or damage may lead to a decrease in electrical conductivity and heat dissipation in the electronic device.

[0005] The present disclosure has been made in view of the above circumstances, and has an object to provide an electronic device capable of suppressing peeling and damage of a bonding material, and a method for manufacturing an electronic device capable of suppressing peeling and damage of a bonding material. [Means for solving the problem]

[0006] An electronic device provided by a first aspect of the present disclosure comprises an electronic component having an element main surface and an element back surface spaced apart in a thickness direction, a mounting portion having a mounting surface facing the element back surface and on which the electronic component is mounted, and a bonding material for bonding the electronic component to the mounting portion, wherein the bonding material includes a base portion sandwiched between the electronic component and the mounting portion in the thickness direction, and a fillet portion connected to the base and formed on the outside of the electronic component when viewed in the thickness direction, wherein the electronic component includes a first element side surface and a second element side surface each connected to the element main surface and the element back surface, and a ridge extending in the thickness direction at the intersection of the first element side surface and the second element side surface, and the fillet portion includes a ridge covering portion covering at least a portion of the ridge.

[0007] A manufacturing method for an electronic device provided by a second aspect of the present disclosure is a manufacturing method for an electronic device including an electronic component having an element main surface and an element back surface separated in a thickness direction, a mounting portion having a mounting surface facing the element back surface and on which the electronic component is mounted, and a bonding material for bonding the electronic component to the mounting portion, the method including an application step of applying a paste-like bonding material to the mounting surface, a placement step of placing the electronic component on the paste-like bonding material, and a solidification step of solidifying the paste-like bonding material to form the bonding material, the mounting portion including a bonding region to which the electronic component is bonded, the bonding region including a corner portion overlapping a corner of the electronic component when viewed in the thickness direction, and the paste-like bonding material being applied from a center portion of the electronic component toward the corner portion at least up to the corner portion when viewed in the thickness direction. Effect of the Invention

[0008] According to the electronic device of the present disclosure, for example, peeling or damage of the bonding material can be suppressed. Also, according to the manufacturing method of the electronic device of the present disclosure, for example, it is possible to manufacture an electronic device in which peeling or damage of the bonding material is suppressed. [Brief description of the drawings]

[0009] [Figure 1]FIG. 1 is a plan view illustrating an electronic device according to an embodiment. [Diagram 2] 2 is a diagram showing the resin member 2 in FIG. 1 by using imaginary lines. [Diagram 3] FIG. 2 is a bottom view of an electronic device according to an embodiment. [Figure 4] FIG. 1 is a front view of an electronic device according to an embodiment. [Diagram 5] FIG. 1 is a side view (left side view) illustrating an electronic device according to an embodiment. [Figure 6] FIG. 3 is a cross-sectional view taken along line VI-VI in FIG. [Figure 7] FIG. 3 is a cross-sectional view taken along line VII-VII in FIG. [Figure 8] FIG. 3 is a cross-sectional view taken along line VIII-VIII in FIG. [Figure 9] FIG. 2 is a perspective view showing a joint structure using a joint material. [Figure 10] FIG. 2 is a plan view showing a joint structure using a joint material. [Figure 11] FIG. 2 is a side view showing a joint structure using a joint material. [Figure 12] FIG. 2 is a plan view showing a step (coating step) of the method for manufacturing the electronic device. [Figure 13] FIG. 4 is a side view showing a step (coating step) of the manufacturing method for the electronic device. [Figure 14] FIG. 4 is a plan view showing a step (mounting step) of a manufacturing method for an electronic device. [Figure 15] FIG. 4 is a side view showing a step (mounting step) of the manufacturing method of the electronic device. [Figure 16] 13A and 13B are plan views showing a coating step according to a modified example. [Figure 17] FIG. 13 is a perspective view showing a side covering portion (fillet portion) according to a modified example. [Figure 18] 18 is a side view showing the side covering portion (fillet portion) of FIG. 17. FIG. [Figure 19] FIG. 13 is a perspective view showing a side covering portion (fillet portion) according to a modified example. [Figure 20] 20 is a side view showing the side covering portion (fillet portion) of FIG. 19. FIG. [Figure 21] 13 is a plan view showing a side covering portion (fillet portion) according to a modified example. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Preferred embodiments of the electronic device and the method for manufacturing the electronic device according to the present disclosure will be described below with reference to the drawings.

[0011] 1 to 11 show an electronic device A1 according to one embodiment. The electronic device A1 has a package structure called, for example, a QFN (Quad Flat Non-leaded package). The electronic device A1 is mounted on a circuit board of an electronic device or the like. The electronic device A1 has, for example, a rectangular shape in a plan view. The electronic device A1 includes an electronic component 1, a resin member 2, a lead frame 3, a bonding material 4, and a plurality of connection members 5.

[0012] FIG. 1 is a plan view showing the electronic device A1. FIG. 2 is a view showing the resin member 2 in FIG. 1 by imaginary lines. FIG. 3 is a bottom view showing the electronic device A1. FIG. 4 is a front view showing the electronic device A1. FIG. 5 is a side view (left side view) showing the electronic device A1. FIG. 6 is a cross-sectional view taken along line VI-VI in FIG. 2. FIG. 7 is a cross-sectional view taken along line VII-VII in FIG. 2. FIG. 8 is a cross-sectional view taken along line VIII-VIII in FIG. 2. FIG. 9 is an enlarged perspective view of a main part showing a bonding structure using a bonding material 4. FIG. 10 is an enlarged plan view of a main part showing a bonding structure using a bonding material 4. FIG. 11 is an enlarged side view of a main part showing a bonding structure using a bonding material 4. For ease of understanding, in FIGS. 9 to 11, the electronic component 1, a part of the lead frame 3 (first lead 31 described later), and the bonding material 4 are shown.

[0013] For convenience of explanation, three mutually orthogonal directions are defined as the x-direction, the y-direction, and the z-direction. The z-direction is the thickness direction of the electronic device A1. The x-direction is the left-right direction in the plan view of the electronic device A1 (see FIG. 1). The y-direction is the up-down direction in the plan view of the electronic device A1 (see FIG. 1). One of the x-directions is the x1-direction, and the other of the x-directions is the x2-direction. Similarly, one of the y-directions is the y1-direction, the other of the y-directions is the y2-direction, one of the z-directions is the z1-direction, and the other of the z-directions is the z2-direction. In the following explanation, "plan view" refers to the view in the z-direction. The z-direction is also referred to as the "thickness direction." The x-direction is an example of the "first direction," and the y-direction is an example of the "second direction."

[0014] The electronic component 1 is an element that exerts an electrical function of the electronic device A1. The electronic component 1 is, for example, an integrated circuit element, an active function element, or a passive function element. The electronic component 1 is, for example, a semiconductor element made of a semiconductor material. Examples of the semiconductor material include Si (silicon), SiC (silicon carbide), Ge (germanium), GaAs (gallium arsenide), and GaN (gallium nitride). In this embodiment, the electronic component 1 is made of silicon. The electronic component 1 is, for example, rectangular in a plan view.

[0015] As shown in FIG. 2 and FIG. 6 to FIG. 11, the electronic component 1 has an element main surface 11, an element back surface 12, and a plurality of element side surfaces 131 to 134. The element main surface 11 and the element back surface 12 are spaced apart in the z direction. The element main surface 11 faces the z2 direction, and the element back surface 12 faces the z1 direction. The element back surface 12 faces the lead frame 3. A plurality of principal surface electrodes 111 are formed on the element main surface 11. Each of the plurality of principal surface electrodes 111 is exposed on the element main surface 11. A back surface electrode 121 is formed on the element back surface 12. The back surface electrode 121 is exposed on the element back surface 12. The back surface electrode 121 is formed over substantially the entire surface of the element back surface 12. The number, arrangement, shape, and planar dimensions of the respective principal surface electrodes 111 and back surface electrodes 121 are not limited to the examples shown in FIG. 2 and FIG. 6 to FIG. 8, and are appropriately changed depending on the electronic component 1 used. Each of the multiple element side surfaces 131 to 134 is sandwiched between the element principal surface 11 and the element rear surface 12 in the z direction, and is connected to both the element principal surface 11 and the element rear surface 12. Each of the element side surfaces 131 to 134 stands upright from the element rear surface 12, and stands upright in this embodiment. As shown in Figures 6, 7, and 9, the element side surfaces 131 and 133 are spaced apart in the x direction. The element side surface 131 faces the x1 direction, and the element side surface 133 faces the x2 direction. The element side surfaces 132 and 134 are spaced apart in the y direction. The element side surface 132 faces the y1 direction, and the element side surface 134 faces the y2 direction. The multiple element side surfaces 131 to 134 are examples of a "first element side surface," a "second element side surface," a "third element side surface," and a "fourth element side surface," respectively.

[0016] As shown in Fig. 2 and Figs. 8 to 11, electronic component 1 has multiple ridges 141 to 144. Ridge 141 is an intersection between element side surface 131 and element side surface 132. Ridge 142 is an intersection between element side surface 132 and element side surface 133. Ridge 143 is an intersection between element side surface 133 and element side surface 134. Ridge 144 is an intersection between element side surface 134 and element side surface 131. Each of ridges 141 to 144 extends in the z direction. The multiple ridges 141 to 144 correspond to the four corners of electronic component 1 in a plan view. Ridge 141 is an example of a "ridge", and each of ridges 142 to 144 is an example of an "additional ridge".

[0017] The resin member 2 is a sealing material that protects the electronic component 1. The resin member 2 is made of an insulating resin material. For example, a black epoxy resin is used as the resin material. The resin member 2 covers the electronic component 1, a part of the lead frame 3, and a plurality of connection members 5. The resin member 2 is rectangular in plan view.

[0018] The resin member 2 has a resin main surface 21, a resin back surface 22, and a plurality of resin side surfaces 231-234. As shown in Figs. 4-8, the resin main surface 21 and the resin back surface 22 are spaced apart in the z direction. The resin main surface 21 faces the z2 direction, and the resin back surface 22 faces the z1 direction. Each of the plurality of resin side surfaces 231-234 is sandwiched between the resin main surface 21 and the resin back surface 22 in the z direction, and is connected to both the resin main surface 21 and the resin back surface 22. Each of the resin side surfaces 231-234 stands upright from the resin back surface 22, and stands upright in this embodiment. As shown in Figs. 1-4, the resin side surfaces 231 and 233 are spaced apart in the x direction. The resin side surface 231 faces the x1 direction, and the resin side surface 233 faces the x2 direction. As shown in Figs. 1-3 and 5, the resin side surfaces 232 and 234 are spaced apart in the y direction. The resin side surface 232 faces the y1 direction, and the resin side surface 234 faces the y2 direction.

[0019] The lead frame 3 supports the electronic component 1 and is electrically connected to the electronic component 1. A part of the lead frame 3 is exposed from the resin member 2, and this exposed part is an external terminal of the electronic device A1. The lead frame 3 is made of, for example, a metal. For example, Cu (copper), a Cu alloy, nickel, a nickel alloy, or a 42 alloy is used as the metal. In this embodiment, the lead frame 3 is made of Cu. The lead frame 3 is formed, for example, by etching a metal plate. The lead frame 3 may be formed by machining a metal plate, such as punching or bending, instead of etching. The lead frame 3 includes a first lead 31 and a plurality of second leads 32.

[0020] 1 to 3, the first lead 31 is disposed in the center of the electronic device A1 in a plan view and extends to both ends of the electronic device A1 in the x and y directions. The first lead 31 includes a mounting portion 311, a plurality of terminal portions 312, and a connecting portion 313, as shown in FIGS. 1 to 3 and 6 to 8.

[0021] The electronic component 1 is mounted on the mounting portion 311, as shown in Fig. 2, Fig. 6 to Fig. 8, and Fig. 9. The mounting portion 311 has, for example, a rectangular shape in plan view, as shown in Fig. 2 and Fig. 10. Each side of the mounting portion 311 in plan view is approximately parallel to the x direction or the y direction.

[0022] As shown in FIG. 6 to FIG. 8, the mounting portion 311 has a mounting surface 311a and a back surface 311b. The mounting surface 311a and the back surface 311b are spaced apart in the z direction. The mounting surface 311a faces the z2 direction, and the back surface 311b faces the z1 direction. The mounting surface 311a faces the electronic component 1 (element back surface 12). The electronic component 1 is mounted on the mounting surface 311a. The mounting surface 311a may be plated. The material of this plating is appropriately selected according to the material of the bonding material 4. For example, when the lead frame 3 is Cu and the bonding material 4 is solder, the wettability of the solder (bonding material 4) can be improved by plating the mounting surface 311a with Ag or Ni. As shown in FIG. 2 and FIG. 6 to FIG. 8, the back surface 311b is exposed from the resin back surface 22 and serves as an external terminal of the electronic device A1. As shown in FIGS. 6 to 8, rear surface 311b is flush with resin rear surface 22. As shown in FIGS.

[0023] 1 and 2, the terminals 312 are disposed at four corners of the electronic device A1 in a plan view, one for each. Each of the terminals 312 has, for example, a rectangular shape in a plan view.

[0024] As shown in FIGS. 3 to 5 and 8, each terminal portion 312 has a main surface 312a, a back surface 312b, and two end surfaces 312c. In each terminal portion 312, the main surface 312a and the back surface 312b are spaced apart in the z direction. The main surface 312a faces the z2 direction, and the back surface 312b faces the z1 direction. As shown in FIG. 8, the main surface 312a is flush with the mounting surface 311a. As shown in FIGS. 3 and 8, the back surface 312b is exposed from the resin back surface 22. The two end surfaces 312c are connected to the main surface 312a and the back surface 312b, respectively, and are perpendicular to the main surface 312a and the back surface 312b. The two end surfaces 312c are each exposed from one of the multiple resin side surfaces 231 to 234. One of the two end faces 312c faces outward in the x direction, and the other of the two end faces 312c faces outward in the y direction. The back surface 312b and the two end faces 312c are external terminals of the electronic device A1.

[0025] As shown in Figures 1, 2 and 8, each of the multiple connecting portions 313 is connected to the mounting portion 311 and each of the terminal portions 312. As shown in Figures 1 and 2, each of the connecting portions 313 extends radially from each of the four corners of the mounting portion 311 in a plan view, and is connected to each of the terminal portions 312. The thickness (dimension in the z direction) of the connecting portion 313 is, for example, approximately half the thickness of the mounting portion 311. The connecting portion 313 is formed, for example, by half-etching processing.

[0026] As shown in Fig. 8, each connecting portion 313 has a main surface 313a and a back surface 313b. In each connecting portion 313, the main surface 313a and the back surface 313b are spaced apart in the z direction. The main surface 313a faces the z2 direction, and the back surface 313b faces the z1 direction. As shown in Fig. 8, the main surface 313a is flush with the mounting surface 311a and the main surface 312a. The main surface 313a and the back surface 313b are covered with the resin member 2.

[0027] A plating layer (not shown) is formed on the portion of the first lead 31 exposed from the resin member 2. In the electronic device A1, the plating layer is formed on the back surface 311b, the back surface 312b, and each end surface 312c. The plating layer is made of a material having higher solder wettability than the base material of the first lead 31, for example, Au. The plating layer is formed by, for example, displacement electroless plating. It is not necessary that the plating layer is formed.

[0028] As shown in FIG. 2, the second leads 32 are electrically connected to the main surface electrodes 111 of the electronic component 1 through the connection members 5. As shown in FIGS. 1 to 3, the second leads 32 are arranged at both ends in the x direction and both ends in the y direction of the electronic device A1 in a plan view, and are spaced apart from each other. The second leads 32 are spaced apart from the first lead 31. The electronic device A1 includes, in a plan view, a plurality of second leads 32 arranged along the resin side surface 231, a plurality of second leads 32 arranged along the resin side surface 232, a plurality of second leads 32 arranged along the resin side surface 233, and a plurality of second leads 32 arranged along the resin side surface 234. The second leads 32 arranged along the resin side surface 231 and the second leads 32 arranged along the resin side surface 233 are each arranged between two terminal portions 312 adjacent to each other in the y direction. The multiple second leads 32 arranged along the resin side surface 232 and the multiple second leads 32 arranged along the resin side surface 234 are each arranged between two terminal portions 312 adjacent to each other in the x-direction. Each second lead 32 includes a terminal portion 321 and a connection portion 322.

[0029] Each of the terminal portions 321 has, for example, a rectangular shape in a plan view as shown in Fig. 2. A part of each of the terminal portions 321 is exposed from the resin member 2.

[0030] As shown in FIGS. 2 to 6, each terminal portion 321 has a main surface 321a, a back surface 321b, and an end surface 321c. In each terminal portion 321, the main surface 321a and the back surface 321b are spaced apart in the z direction. The main surface 321a faces the z2 direction, and the back surface 321b faces the z1 direction. The back surface 321b is exposed from the resin back surface 22. The end surface 321c is connected to the main surface 321a and the back surface 321b. The end surface 321c is exposed from one of the multiple resin side surfaces 231 to 234. The back surface 321b and the end surface 321c are external terminals of the electronic device A1.

[0031] As shown in FIG. 2, each of the multiple connection parts 322 extends from the terminal part 321 toward the mounting part 311. Each connection member 5 is joined to each connection part 322. The second leads 32 arranged parallel to both ends of the mounting part 311 in the y direction have the connection parts 322 inclined more toward the y direction as they are arranged closer to both ends in the x direction. The second leads 32 arranged parallel to both ends of the mounting part 311 in the x direction have the connection parts 322 inclined more toward the x direction as they are arranged closer to both ends in the y direction. This is to make it easier to connect each main surface electrode 111 of the electronic component 1 to the terminal part 321 of each second lead 32 with the connection member 5. The connection parts 322 of the second leads 32 arranged at the most both ends in the x direction (adjacent to the coupling parts 313) extend approximately parallel to the direction in which the adjacent coupling parts 313 extend. It should be noted that each connection portion 322 does not have to be inclined with respect to the x direction or the y direction.

[0032] In each second lead 32, as shown in FIG. 6, the thickness (dimension in the z direction) of the connection portion 322 is, for example, about half the thickness of the terminal portion 321. The connection portion 322 is formed, for example, by half etching. Each connection portion 322 has a main surface 322a and a back surface 322b. The main surface 322a and the back surface 322b are spaced apart in the z direction. The main surface 322a faces the z2 direction, and the back surface 322b faces the z1 direction. The main surface 322a is a surface to which the connection member 5 is bonded. The main surface 321a and the main surface 322a are flush with each other. The back surface 322b is covered with the resin member 2. The thickness of the connection portion 322 may be the same as the thickness of the terminal portion 321. In this case, the back surface 321b and the back surface 322b are flush with each other, and the back surface 322b is exposed from the resin member 2 (resin back surface 22).

[0033] In each second lead 32, a plating layer (not shown) is formed on a portion exposed from the resin member 2. In the electronic device A1, the plating layer is formed on the back surface 321b and the end surface 321c. The plating layer is similar to the plating layer of the first lead 31, and is made of, for example, Au, and is formed by substitution-type electroless plating. Note that the plating layer does not necessarily have to be formed.

[0034] The bonding material 4 bonds the electronic component 1 to the lead frame 3. The bonding material 4 is, for example, sintered silver. The bonding material 4 is not limited to sintered silver, but may be other sintered metals such as sintered copper, or may be other conductive bonding materials such as solder or silver paste. The bonding material 4 is not limited to conductive bonding materials, but may be insulating bonding materials. However, the bonding material 4 is an insulating bonding material only when the back electrode 121 is not provided on the electronic component 1, or when conduction between the back electrode 121 of the electronic component 1 and the mounting portion 311 via the bonding material 4 is not required. The bonding material 4 is interposed between the electronic component 1 and the mounting portion 311 (first lead 31). The bonding material 4 is in contact with the element back surface 12 and the mounting surface 311a. Conduction between the back electrode 121 and the mounting portion 311 is achieved via the bonding material 4. The bonding material 4 includes a base portion 41 and a fillet portion 42.

[0035] 9, the base 41 is sandwiched between the electronic component 1 and the mounting portion 311 in the z direction. The base 41 completely overlaps the electronic component 1 in a plan view. The base 41 contacts the entire surface of the element back surface 12. The base 41 has, for example, a rectangular shape in a plan view. The base 41 has a substantially uniform thickness (dimension in the z direction).

[0036] As shown in Figs. 9 and 11, the fillet portion 42 is connected to the base portion 41 and is formed on the outside of the electronic component 1 in a plan view. As shown in Fig. 10, the fillet portion 42 is formed around the entire circumference of the electronic component 1 in a plan view. As shown in Figs. 9 and 11, the fillet portion 42 protrudes upward in the z direction from the base portion 41 along each of the element side surfaces 131 to 134. The fillet portion 42 includes a plurality of side covering portions 431 to 434 and a plurality of ridge covering portions 441 to 444. In this embodiment, the ridge covering portion 441 is an example of a "ridge covering portion", and each of the ridge covering portions 442 to 444 is an example of an "additional ridge covering portion". Moreover, the side covering portion 431 is an example of a "first covering portion", and the side covering portion 432 is an example of a "second covering portion".

[0037] 8 to 11, the ridge covering portion 441 covers at least a portion of the ridge 141. In this embodiment, the ridge covering portion 441 covers a lower end of the ridge 141 in the z direction, and does not cover an upper end of the ridge 141 in the z direction. The ridge covering portion 441 connects the side covering portion 431 and the side covering portion 432, as shown in FIG.

[0038] 9 and 10, the ridge covering portion 442 covers at least a portion of the ridge 142. In this embodiment, the ridge covering portion 442 covers a lower end of the ridge 142 in the z direction, and does not cover an upper end of the ridge 142 in the z direction. The ridge covering portion 442 connects the side covering portion 432 and the side covering portion 433, as shown in FIG.

[0039] The ridge covering portion 443 covers at least a portion of the ridge 143, as shown in Fig. 10. In this embodiment, the ridge covering portion 443 covers a lower end of the ridge 143 in the z direction, and does not cover an upper end of the ridge 143 in the z direction. The ridge covering portion 443 connects the side covering portion 433 and the side covering portion 434, as shown in Fig. 10.

[0040] 9 and 10, the ridge covering portion 444 covers at least a portion of the ridge 144. In this embodiment, the ridge covering portion 444 covers a lower end of the ridge 144 in the z direction, and does not cover an upper end of the ridge 144 in the z direction. The ridge covering portion 444 connects the side covering portion 434 and the side covering portion 431, as shown in FIG.

[0041] The side covering portion 431 covers at least a part of the element side surface 131, as shown in Figs. 9 to 11. In the element side surface 131, the edge on the z2 direction side, i.e., the edge on the element main surface 11 side, is exposed from the side covering portion 431 when viewed in the x direction, and the edge on the z1 direction side, i.e., the edge on the element back surface 12 side, is covered by the side covering portion 431 when viewed in the x direction. As shown in Fig. 10, the side covering portion 431 is sandwiched between and connected to the ridge covering portion 444 and the ridge covering portion 441. As shown in Fig. 10, the side covering portion 431 is aligned with the ridge covering portion 444 and the ridge covering portion 441 in the y direction.

[0042] 9 and 10, the side covering portion 432 covers at least a part of the element side surface 132. In the element side surface 132, the edge on the z2 direction side, i.e., the edge on the element main surface 11 side, is exposed from the side covering portion 432 when viewed in the y direction, and the edge on the z1 direction side, i.e., the edge on the element back surface 12 side, is covered by the side covering portion 432 when viewed in the y direction. As shown in FIG. 10, the side covering portion 432 is sandwiched between and connected to the ridge covering portion 441 and the ridge covering portion 442. As shown in FIG. 10, the side covering portion 432 is aligned with the ridge covering portion 441 and the ridge covering portion 442 in the x direction.

[0043] The side covering portion 433 covers at least a part of the element side surface 133, as shown in Fig. 10. In the element side surface 133, the edge on the z2 direction side, i.e., the edge on the element main surface 11 side, is exposed from the side covering portion 433 when viewed in the x direction, and the edge on the z1 direction side, i.e., the edge on the element back surface 12 side, is covered by the side covering portion 433 when viewed in the x direction. As shown in Fig. 10, the side covering portion 433 is sandwiched between and connected to the ridge covering portion 442 and the ridge covering portion 443. As shown in Fig. 10, the side covering portion 433 is aligned with the ridge covering portion 442 and the ridge covering portion 443 in the y direction.

[0044] The side covering portion 434 covers at least a part of the element side surface 134, as shown in Fig. 10. In the element side surface 134, the edge on the z2 direction side, i.e., the edge on the element main surface 11 side, is exposed from the side covering portion 434 when viewed in the y direction, and the edge on the z1 direction side, i.e., the edge on the element back surface 12 side, is covered by the side covering portion 434 when viewed in the y direction. As shown in Fig. 10, the side covering portion 434 is sandwiched between and connected to the ridge covering portion 443 and the ridge covering portion 444. As shown in Fig. 10, the side covering portion 434 is aligned with the ridge covering portion 443 and the ridge covering portion 444 in the x direction.

[0045] As shown in FIG. 9 and FIG. 11, the center of each of the side covering portions 431-434 in the longitudinal direction is recessed in the z1 direction relative to both end edges in the longitudinal direction. Therefore, in each of the side covering portions 431-434, the dimension d11 in the z direction of the center of each of the longitudinal directions is smaller than the dimension d12 in the z direction of each of the end edges in the longitudinal direction. FIG. 11 shows the dimensions d11 and d12 of the side covering portion 431. Also, each of the side covering portions 431-434 has a raised portion 439 formed between the center of each of the longitudinal directions and each of the end edges in the longitudinal direction. The raised portion 439 is raised in the z2 direction, that is, toward the element main surface 11 side. In each of the side covering portions 431-434, the raised portion 439 has the largest dimension in the z direction among the side covering portions 431-434. 11 shows a protruding portion 439 in the side covering portion 431. The longitudinal direction in each of the side covering portions 431, 433 is the y direction, and the longitudinal direction in each of the side covering portions 432, 434 is the x direction. Note that the dimensions d11, d12 in each of the side covering portions 431-434 may be the same among the multiple side covering portions 431-434 or may differ from each other.

[0046] As shown in FIG. 10, in plan view, the central portion in the longitudinal direction of each of side covering portions 431 to 434 is recessed toward each of element side surfaces 131 to 134 relative to both end edge portions in the longitudinal direction.

[0047] As shown in Figs. 6 and 7, in each of the side covering portions 431-434, the inclination α11 (see Fig. 7) is greater than the inclination α12 (see Fig. 6). As shown in Fig. 7, the inclination α11 is an angle between the mounting surface 311a and each edge portion in the longitudinal direction of each of the side covering portions 431-434, and is the inclination degree of the surface of the edge portion with respect to the mounting surface 311a. As shown in Fig. 6, the inclination α12 is an angle between the mounting surface 311a and the center portion of each of the side covering portions 431-434 in the longitudinal direction, and is the inclination degree of the surface of the center portion with respect to the mounting surface 311a. In each of the side covering portions 431-434, the inclination gradually changes from the inclination α12 to the inclination α11 from the center portion toward each edge portion in each longitudinal direction. The inclination angle α11 may be the same as the inclination angle α12, or may be smaller than the inclination angle α12.

[0048] In the example shown in Fig. 6 and Fig. 7, the surface of each of the side covering parts 431, 433 is convexly curved when viewed in the y direction, but is not limited to this and may be a flat surface or may be concavely curved. Alternatively, two or more of a convexly curved portion, a concavely curved portion, and a flat portion may be mixed. Similarly, the surface of each of the side covering parts 432, 434 is convexly curved when viewed in the x direction, but is not limited to this and may be a flat surface or may be concavely curved. Alternatively, two or more of a convexly curved portion, a concavely curved portion, and a flat portion may be mixed.

[0049] The multiple connection members 5 provide electrical continuity between two parts spaced apart from each other. Each connection member 5 is, for example, a bonding wire. Each connection member 5 may be a bonding ribbon or a plate-shaped lead member instead of a bonding wire. The constituent material of each of the multiple connection members 5 may be, for example, any of a metal containing Au, a metal containing Al, and a metal containing Cu. Each connection member 5 is formed, for example, by a well-known wire bonder. As shown in FIG. 2, each connection member 5 is bonded to the main surface electrode 111 of the electronic component 1 and the connection portion 322 (main surface 322a) of each second lead 32, and provides electrical continuity between the main surface electrode 111 and the second lead 32.

[0050] Next, a method for manufacturing the electronic device A1 will be described with reference to Fig. 12 to Fig. 15. Fig. 12 and Fig. 14 are enlarged plan views of a main part showing one step of the method for manufacturing the electronic device A1. Fig. 13 and Fig. 15 are enlarged side views of a main part showing one step of the method for manufacturing the electronic device A1.

[0051] First, the lead frame 3 is prepared. Specifically, a metal plate containing Cu is etched to form a plurality of lead frames 3. Each lead frame 3 includes a first lead 31 and a plurality of second leads 32. The first lead 31 includes a mounting portion 311, a plurality of terminal portions 312, and a plurality of connecting portions 313. The mounting portion 311 has a mounting surface 311a facing the z2 direction. Each second lead 32 includes a terminal portion 321 and a connecting portion 322. In the step of preparing the lead frame 3 (preparation step), the formed plurality of lead frames 3 are continuous with each other.

[0052] Next, as shown in FIG. 12 and FIG. 13, the paste-like bonding material 49 is applied to the mounting surface 311a of the mounting portion 311. The paste-like bonding material 49 is, for example, a sintered metal paste (silver paste or copper paste, etc.). In the step of applying the paste-like bonding material 49 (application step), for example, a dispenser is used. As shown in FIG. 12 and FIG. 13, the mounting surface 311a includes a bonding region 391 to which the electronic component 1 is bonded. The bonding region 391 is a region of the mounting surface 311a that overlaps with the entire electronic component 1 in a planar view when the electronic component 1 is bonded. Therefore, in a planar view, the bonding region 391 has substantially the same shape as the electronic component 1 (rectangular in this embodiment) and is the same size as the electronic component 1. The bonding region 391 includes four corner portions 392. The four corner portions 392 are portions that overlap with the four corners of the electronic component 1 in a planar view when the electronic component 1 is bonded. In the application step, the paste-like bonding material 49 is applied linearly along trajectories L1 and L2 shown in FIG. 12. The trajectories L1 and L2 are application trajectories of the paste-like bonding material 49 by a dispenser. The trajectories L1 and L2 are linear trajectories passing through a center 393 from one of a pair of corner portions 392 diagonally positioned in the bonding region 391 to the other. In the example shown in FIG. 12, the start point and the end point of each trajectory L1 and L2 overlap with each corner portion 392, but may be set outside the bonding region 391 in plan view relative to each corner portion 392. The application trajectory of the paste-like bonding material 49 is not limited thereto. For example, the paste-like bonding material 49 may be applied radially from the center 393 of the bonding region 391 to each of the four corner portions 392 in plan view.

[0053] As shown in Figs. 12 and 13, the applied paste-like bonding material 49 completely covers all of the four corner portions 392 and is formed in an X-shape in a plan view. In this embodiment, the trajectories L1 and L2 along which the paste-like bonding material 49 is applied start and end at the corner portions 392, so that the applied paste-like bonding material 49 is formed outside the joining region 391 beyond the corner portions 392. Also, as shown in Fig. 13, the paste-like bonding material 49 has a protruding portion 491 when viewed from the side (x direction or y direction). The protruding portion 491 is a portion of the paste-like bonding material 49 that rises in the z2 direction and is formed on the center 393 of the joining region 391. The protruding portion 491 is formed when the paste-like bonding material 49 is applied along the trajectories L1 and L2, and the two trajectories L1 and L2 intersect with each other. The applied paste-like bonding material 49 has a line width W1 (see FIG. 12) of, for example, 200 μm to 300 μm, and a thickness (dimension in the z direction) of, for example, 100 μm to 150 μm (excluding the protruding portion 491). Note that the paste-like bonding material 49 is curved in a semicircular shape when viewed in the traveling direction of each of the tracks L1 and L2, and the above-mentioned thickness is the size of the maximum portion (excluding the protruding portion 491).

[0054] Next, as shown in FIG. 14 and FIG. 15, the electronic component 1 is placed on the paste-like bonding material 49. In the step of placing the electronic component 1 (placement step), for example, a known die bonder is used. When the electronic component 1 is placed on the paste-like bonding material 49 in the placement step, the weight of the electronic component 1 spreads the paste-like bonding material 49. The paste-like bonding material 49 may be spread not only by the weight of the electronic component 1 but also by the pressing force when the die bonder presses the electronic component 1. The spread paste-like bonding material 49 covers the entire bonding region 391 and protrudes outward over the entire circumference of the bonding region 391, as shown in FIG. 14 and FIG. 15. At this time, the paste-like bonding material 49 has substantially the same shape as the bonding material 4.

[0055] Next, the paste-like bonding material 49 is solidified to form the bonding material 4. In this embodiment, since a sintered metal paste is used as the paste-like bonding material 49, in the process of solidifying the paste-like bonding material 49 (solidification process), the paste-like bonding material 49 is solidified by sintering. By this sintering, the solvent in the paste-like bonding material 49 volatilizes and disappears, and metal particles (silver particles or copper particles, etc.) in the paste-like bonding material 49 are bonded to each other, so that the paste-like bonding material 49 is solidified to form the bonding material 4. The solidification process is appropriately changed depending on the material of the paste-like bonding material 49. For example, when the paste-like bonding material 49 is a thermosetting metal paste, the paste-like bonding material 49 is heated in the solidification process. By this heating, the resin material in the metal paste is hardened, so that the paste-like bonding material 49 is solidified to form the bonding material 4. In the present disclosure, the "metal paste" refers to a conductive material composed of, for example, metal fine particles, fine particles (binder) such as epoxy resin, and a solvent.

[0056] Next, a plurality of connection members 5 are formed. Each of the plurality of connection members 5 is formed, for example, by a well-known wire bonder. One end of each connection member 5 is joined to the main surface electrode 111 of the electronic component 1, and the other end is joined to the connection portion 322 (main surface 322a) of each second lead 32.

[0057] Next, the resin member 2 is formed. In the step of forming the resin member 2 (resin forming step), for example, a well-known transfer molding machine or compression molding machine is used. For example, insulating epoxy resin is used as the resin member 2. The lead frame 3 is partially exposed from the formed resin member 2.

[0058] Thereafter, the resin member 2 and the lead frame 3 are cut into individual pieces for each electronic component 1. Through the above steps, the electronic device A1 is formed. Note that the above-mentioned manufacturing method is an example, and the present invention is not limited to this.

[0059] The functions and advantages of the electronic device A1 and the method for manufacturing the electronic device A1 are as follows.

[0060] In the electronic device A1, the bonding material 4 that bonds the electronic component 1 to the lead frame 3 includes a fillet portion 42. The fillet portion 42 includes a ridge covering portion 441 that covers at least a part of the ridge 141. The ridge 141 is an intersection between the element side surface 131 and the element side surface 132, and corresponds to one of the four corners of the electronic component 1 in a plan view. With this configuration, the ridge 141 (the lower corner of the electronic component 1) of the electronic component 1 is protected by the bonding material 4 (the ridge covering portion 441 of the fillet portion 42). Heat generated when the electronic component 1 is energized applies thermal stress to the bonding material 4 due to the difference in linear expansion coefficient between the electronic component 1 and the lead frame 3. The thermal stress applied to the bonding material 4 is greatest near the lower four corners of the electronic component 1, so peeling or damage of the bonding material 4 is likely to progress from near the ridge 141 of the electronic component 1. In particular, in conventional electronic devices, the edges 141 are exposed from the bonding material 4, and peeling and damage of the bonding material 4 are prominent near the four corners on the lower side of the electronic component 1. In the electronic device A1, the edges 141 are protected by the edge covering portions 441, thereby improving the resistance of the bonding material 4 near the edges 141 against peeling and damage. Therefore, the electronic device A1 can suppress peeling and damage of the bonding material 4. This improves the reliability of the electronic device A1.

[0061] In electronic device A1, fillet portion 42 of bonding material 4 includes a plurality of ridge covering portions 441-444. The plurality of ridge covering portions 441-444 respectively cover the lower edge portions of the plurality of ridges 141-144 of electronic component 1. In other words, the lower four corners of electronic component 1 are covered with fillet portion 42. This configuration can improve resistance of bonding material 4 to peeling and damage near the lower four corners of electronic component 1. Therefore, electronic device A1 can suppress peeling and damage of bonding material 4.

[0062] In the electronic device A1, the bonding material 4 includes a base 41. The base 41 is sandwiched between the electronic component 1 and the mounting portion 311 and completely overlaps the electronic component 1. The base 41 is in contact with the entire surface of the element rear surface 12. In the conventional electronic device, there was a portion between the electronic component 1 and the mounting portion 311 where the bonding material 4 was not filled. In other words, there was an area on the element rear surface 12 of the electronic component 1 that was not in contact with the bonding material 4. If the electronic component 1 had a minute scratch (for example, chipping present at the edge of the element rear surface 12) in this area, damage (such as a crack) of the electronic component 1 could progress from this scratch to the inside of the electronic component 1. On the other hand, in the electronic device A1, the entire surface of the element rear surface 12 is in contact with the bonding material 4 (base 41), so the element rear surface 12 is protected by the bonding material 4 (base 41). Therefore, according to the electronic device A1, even if the element rear surface 12 of the electronic component 1 has a minute scratch, the progress of damage to the electronic component 1 starting from the scratch can be suppressed.

[0063] In the electronic device A1, the bonding material 4 is made of, for example, sintered silver. Sintered silver has lower ductility than solder. Therefore, when the bonding material 4 is made of sintered silver, the thermal stress applied to the bonding material 4 is larger than when the bonding material 4 is made of solder. This is because the ductility of solder allows the bonding material 4 to relax the thermal stress more than sintered silver. In other words, when the bonding material 4 is made of sintered silver, the bonding material 4 is more likely to peel off or break due to thermal stress than when the bonding material 4 is made of solder. Therefore, when the bonding material 4 is made of sintered silver, protecting the ridge 141 with the fillet portion 42 (ridge covering portion 441) as described above is more effective in suppressing the peeling or breakage of the bonding material 4 than when the bonding material 4 is made of solder.

[0064] In the electronic device A1, the electronic component 1 is a semiconductor element made of, for example, silicon, and the lead frame 3 is made of, for example, Cu. In this case, the difference in linear expansion coefficient between silicon and Cu is large, so the thermal stress acting on the bonding material 4 is large. In other words, the bonding material 4 is likely to peel off or break due to the thermal stress. Therefore, when the electronic component 1 made of silicon is bonded to the mounting portion 311 (lead frame 3) made of Cu using the bonding material 4, protecting the ridge 141 with the fillet portion 42 (ridge covering portion 441) as described above is effective in suppressing the peeling or breakage of the bonding material 4.

[0065] In the manufacturing method of the electronic device A1, in the application step, the paste-like bonding material 49 is applied up to each corner portion 392 of the bonding region 391, so that the four corners of the bonding region 391 are covered with the paste-like bonding material 49. As a result, when the electronic component 1 is placed on the paste-like bonding material 49 in the placing step, the paste-like bonding material 49 spreads so as to cover at least a part of each of the edges 141 to 144 of the electronic component 1. That is, the fillet portion 42 including the edge covering portion 441 is formed in the bonding material 4. Therefore, according to the manufacturing method of the present disclosure, the electronic device A1 in which peeling or damage of the bonding material 4 is suppressed can be manufactured.

[0066] In the manufacturing method of the electronic device A1, in the application step, the paste-like bonding material 49 is applied in an X-shape in plan view. In the application step different from the present embodiment, it is possible to form the fillet portion 42 including each of the ridge covering portions 441 to 444 by applying the paste-like bonding material 49 to the entire surface of the bonding region 391 or a wider area than the entire surface. However, in this case, when the electronic component 1 is placed in the placing step, the paste-like bonding material 49 may spread widely outside the electronic component 1 in plan view. In this case, the paste-like bonding material 49 may flow out to an unintended place, and there is a concern that, for example, an unintended short circuit may occur. The unintended short circuit includes a short circuit between the main surface electrodes 111 of the electronic component 1. In addition, there is a concern that the material cost of the unnecessarily spread portion may increase the cost. Therefore, in the manufacturing method of the present disclosure, the paste-like bonding material 49 is applied in an X-shape, so that the fillet portion 42 including each of the ridge covering portions 441 to 444 may be formed, while suppressing the occurrence of the unintended short circuit and the increase in cost.

[0067] In the application step of the above embodiment, the paste-like bonding material 49 is applied linearly along the tracks L1 and L2, but the present invention is not limited to this. For example, as shown in FIG. 16, a plurality of dot-shaped paste-like bonding materials 49 may be applied in an X-shape. For ease of understanding, in FIG. 16, the paste-like bonding material 49 (see FIG. 12) in the above embodiment is shown by imaginary lines. Each paste-like bonding material 49 is, for example, hemispherical. In this case, the same bonding material 4 as in FIG. 9 to FIG. 11 is also formed. As another application mode of the paste-like bonding material 49, first, there is an "* (asterisk)" shape or a "※ (star mark)" shape used in an electronic component 1 having a large rectangular planar shape (typically a large square). The "※" shape is a shape formed by four line segments arranged in an "X" shape and four "· (dots)" arranged between two adjacent line segments in the x direction or y direction of the four line segments. Secondly, there is a shape embodiment in which ">", "-", and "<" are arranged adjacently or adjacently in this order along the longitudinal direction, which is used in a horizontally elongated rectangular electronic component 1.

[0068] In the electronic device A1, the shape of each of the side covering portions 431-434 is not limited to the above. For example, as shown in Figs. 17 and 18, the side covering portions 431-434 may not have the protruding portion 439 (see Fig. 11). Also, as shown in Figs. 19 and 20, the center portion in each of the side covering portions 431-434 in the longitudinal direction may not be recessed in the z1 direction from both end portions in the longitudinal direction, and the dimension d11 and the dimension d12 may be substantially the same. Furthermore, as shown in Fig. 21, the center portion in each of the side covering portions 431-434 in the longitudinal direction may not be recessed toward the element side surfaces 131-134 from both end portions in the longitudinal direction in a plan view. Alternatively, the center portion in each of the longitudinal directions may protrude from both end portions in the longitudinal direction to the opposite side of the element side surfaces 131-134 in a plan view. Each of the side covering portions 431 to 434 in these modified examples is formed by appropriately adjusting the amount of application of the paste-like bonding material 49, the application trajectory, and the line width W1 in the application process, the way in which the paste-like bonding material 49 spreads in the placement process, and the wettability of the paste-like bonding material 49 to the mounting portion 311 (lead frame 3), etc.

[0069] In the above embodiment, the electronic device A1 has a QFN type package structure, but is not limited to this. For example, other package structures such as a TO (Transistor Outline) package type, a SOP (Small Outline Package) type, a QFP (Quad Flat Package) type, and a BGA (Ball Grid Array) type may be used. In this case, the shape of the lead frame 3 is appropriately changed according to these package structures.

[0070] In the above embodiment, the electronic device A1 is of a lead frame type, but is not limited thereto. For example, it may be of an interposer type. That is, the electronic component 1 may be bonded to, for example, a silicon substrate, a ceramic substrate, or a glass substrate instead of the lead frame 3. In addition, the configuration of the present disclosure may be applied to a structure in which the electronic component 1 is bonded to a certain support member (mounting portion) via a bonding material 4.

[0071] The electronic device and the manufacturing method of the electronic device according to the present disclosure are not limited to the above-mentioned embodiment. The specific configuration of each part of the electronic device according to the present disclosure and the specific processing of each step of the manufacturing method of the electronic device according to the present disclosure can be freely designed. For example, the electronic device and the manufacturing method of the electronic device according to the present disclosure include the following embodiments. [Appendix 1] an electronic component having a main surface and a back surface of an element spaced apart from each other in a thickness direction; a mounting portion having a mounting surface facing a rear surface of the element and on which the electronic component is mounted; a bonding material for bonding the electronic component to the mounting portion; It is equipped with the bonding material includes a base portion sandwiched between the electronic component and the mounting portion in the thickness direction, and a fillet portion connected to the base portion and formed on an outer side of the electronic component as viewed in the thickness direction, the electronic component includes a first element side surface and a second element side surface connected to the element main surface and the element back surface, respectively, and an edge that is an intersection of the first element side surface and the second element side surface and extends in the thickness direction; The fillet portion includes a ridge covering portion that covers at least a portion of the ridge. [Appendix 2] the fillet portion further includes a first covering portion covering at least a portion of the first element side surface and a second covering portion covering at least a portion of the second element side surface, The electronic device of claim 1, wherein the first covering portion and the second covering portion are each connected to the edge covering portion. [Appendix 3] an edge of the first element side surface connected to the element main surface is exposed from the first covering portion when viewed in a first direction perpendicular to the first element side surface, The electronic device described in Appendix 2, wherein an edge connected to the element main surface of the second element side surface is exposed from the second covering portion when viewed in a second direction perpendicular to the second element side surface. [Appendix 4] The electronic component has a rectangular shape when viewed in the thickness direction, 4. The electronic device of claim 3, wherein the thickness direction, the first direction, and the second direction are perpendicular to each other. [Appendix 5] the electronic component further includes a third element side, a fourth element side, and a plurality of additional edges; the third element side surface is connected to the element principal surface and the element back surface and is spaced apart from the first element side surface in the first direction; the fourth element side surface is connected to the element principal surface and the element back surface and is spaced apart from the second element side surface in the second direction; the multiple additional edges are generated at an intersection of the first element side surface and the fourth element side surface, at an intersection of the second element side surface and the third element side surface, and at an intersection of the third element side surface and the fourth element side surface, and each extends in the thickness direction; The electronic device of claim 4, wherein the fillet portion further includes a plurality of additional ridge covering portions that cover the plurality of additional ridges. [Appendix 6] An electronic device as described in Appendix 4 or Appendix 5, wherein in the first covering portion, the thickness direction dimension of the central portion in the second direction is smaller than the thickness direction dimension of the edge portion connected to the edge covering portion. [Appendix 7] 7. The electronic device of claim 4, wherein the first covering portion has a protruding portion protruding toward the element main surface side between a central portion in the second direction and an edge portion connected to the ridge covering portion. [Appendix 8] The electronic device according to any one of claims 4 to 7, wherein the first covering portion has a central portion in the second direction recessed toward a side surface of the first element when viewed in the thickness direction. [Appendix 9] An electronic device described in any one of Appendix 4 to Appendix 8, wherein in the first covering portion, the inclination of the edge portion connected to the ridge covering portion relative to the mounting surface is greater than the inclination of the central portion relative to the mounting surface in the second direction. [Appendix 10] An electronic device described in any one of Appendix 4 to Appendix 9, wherein in the second covering portion, the thickness direction dimension of the central portion in the first direction is smaller than the thickness direction dimension of the edge portion connected to the edge covering portion. [Appendix 11] The electronic device of any one of Appendix 4 to Appendix 10, wherein the second covering portion has a protruding portion protruding toward the element main surface side between a central portion in the first direction and an edge portion connected to the ridge covering portion. [Appendix 12] The electronic device according to any one of claims 4 to 11, wherein the second covering portion has a central portion in the first direction recessed toward a side surface of the second element when viewed in the thickness direction. [Appendix 13] An electronic device described in any one of Appendix 4 to Appendix 12, wherein the inclination of the edge portion connected to the ridge covering portion with respect to the mounting surface is greater than the inclination of the central portion with respect to the mounting surface in the first direction. [Appendix 14] 14. The electronic device according to claim 1, wherein the fillet portion is formed around the entire periphery of the electronic component when viewed in the thickness direction. [Appendix 15] 15. The electronic device according to claim 1, wherein the electronic component is made of a semiconductor material. [Appendix 16] The electronic component has a main surface electrode formed on the main surface of the element, the mounting portion is a part of a lead frame, 16. The electronic device according to claim 1, wherein the lead frame further includes a terminal portion that is electrically connected to the main surface electrode and spaced apart from the mounting portion. [Appendix 17] 17. The electronic device of claim 16, wherein the lead frame is made of a metal containing Cu. [Appendix 18] The electronic component has a back electrode formed on a back surface of the element, 18. The electronic device according to claim 1, wherein the back electrode is electrically connected to the mounting portion via the bonding material. [Appendix 19] 19. The electronic device according to claim 1, wherein the bonding material is made of sintered silver. [Appendix 20] an electronic component having a main surface and a back surface of an element spaced apart from each other in a thickness direction; a mounting portion having a mounting surface facing a rear surface of the element and on which the electronic component is mounted; a bonding material for bonding the electronic component to the mounting portion; A method for manufacturing an electronic device comprising: a coating step of coating a paste-like bonding material on the mounting surface; a placing step of placing the electronic component on the paste-like bonding material; a solidification step of solidifying the paste-like bonding material to form the bonding material; Including, the mounting portion includes a bonding area to which the electronic component is bonded, the bonding region includes a corner portion overlapping a corner of the electronic component when viewed in the thickness direction, A method for manufacturing an electronic device, wherein the paste-like bonding material is applied from a center portion of the electronic component toward the corner portion, as viewed in the thickness direction, at least up to the corner portion. [Explanation of symbols]

[0072] A1:Electronic equipment 1: Electronic components 11: Element main surface 111: Main surface electrode 12: Back side of element 121: Back electrode 131-134: Side of element 141~144: Ridge 2: Resin material 21: Resin main surface 22: Resin back 231~234: Resin side 3: Lead frame 31: First lead 311: Mounting section 311a: Mounting surface 391:Joint area 392: Corner section 393 :center 311b: Back side 312:Terminal section 312a: Main surface 312b: Back side 312c: End face 313:Connection part 313a: Main surface 313b: Back side 32: 2nd lead 321:Terminal section 321a: Main surface 321b: Back side 321c: End face 322: Connection 322a: Main surface 322b: Back side 4: Bonding material 41: Base 42: Fillet part 431-434: Side covering section 439 :Protuberance 441~444: Ridge covering section 49: Paste-type bonding material 491:Protrusion 5: Connection parts

Claims

1. An electronic component having a main surface and a back surface spaced apart in a thickness direction; a mounting portion having a mounting surface facing a rear surface of the element and on which the electronic component is mounted; a bonding material for bonding the electronic component to the mounting portion; It is equipped with the bonding material includes a base portion sandwiched between the electronic component and the mounting portion in the thickness direction, and a fillet portion connected to the base portion and formed on an outer side of the electronic component as viewed in the thickness direction, the electronic component includes a first element side surface and a second element side surface connected to the element main surface and the element back surface, respectively, and an edge that is an intersection of the first element side surface and the second element side surface and extends in the thickness direction; The fillet portion includes a ridge covering portion that covers at least a portion of the ridge, the fillet portion further includes a first covering portion covering at least a portion of the first element side surface and a second covering portion covering at least a portion of the second element side surface, The first covering portion and the second covering portion are each connected to the edge covering portion, an edge of the first element side surface connected to the element main surface is exposed from the first covering portion when viewed in a first direction perpendicular to the first element side surface; an edge of the second element side surface connected to the element main surface is exposed from the second covering portion when viewed in a second direction perpendicular to the second element side surface; The electronic component has a rectangular shape when viewed in the thickness direction, the thickness direction, the first direction, and the second direction are perpendicular to each other, In the first covering portion, a central portion in the second direction is recessed toward a side surface of the first element when viewed in the thickness direction. electronic equipment.

2. An electronic component having a main surface and a back surface of an element spaced apart in a thickness direction; a mounting portion having a mounting surface facing a rear surface of the element and on which the electronic component is mounted; a bonding material for bonding the electronic component to the mounting portion; It is equipped with the bonding material includes a base portion sandwiched between the electronic component and the mounting portion in the thickness direction, and a fillet portion connected to the base portion and formed on an outer side of the electronic component as viewed in the thickness direction, the electronic component includes a first element side surface and a second element side surface connected to the element main surface and the element back surface, respectively, and an edge that is an intersection of the first element side surface and the second element side surface and extends in the thickness direction; The fillet portion includes a ridge covering portion that covers at least a portion of the ridge, the fillet portion further includes a first covering portion covering at least a portion of the first element side surface and a second covering portion covering at least a portion of the second element side surface, The first covering portion and the second covering portion are each connected to the edge covering portion, an edge of the first element side surface connected to the element main surface is exposed from the first covering portion when viewed in a first direction perpendicular to the first element side surface; an edge of the second element side surface connected to the element main surface is exposed from the second covering portion when viewed in a second direction perpendicular to the second element side surface; The electronic component has a rectangular shape when viewed in the thickness direction, the thickness direction, the first direction, and the second direction are perpendicular to each other, In the first covering portion, an inclination angle of an edge portion connected to the ridge covering portion with respect to the mounting surface is larger than an inclination angle of a central portion with respect to the mounting surface in the second direction. electronic equipment.

3. An electronic component having a main element surface and a back element surface spaced apart in a thickness direction; a mounting portion having a mounting surface facing a rear surface of the element and on which the electronic component is mounted; a bonding material for bonding the electronic component to the mounting portion; It is equipped with the bonding material includes a base portion sandwiched between the electronic component and the mounting portion in the thickness direction, and a fillet portion connected to the base portion and formed on an outer side of the electronic component as viewed in the thickness direction, the electronic component includes a first element side surface and a second element side surface connected to the element main surface and the element back surface, respectively, and an edge that is an intersection of the first element side surface and the second element side surface and extends in the thickness direction; The fillet portion includes a ridge covering portion that covers at least a portion of the ridge, the fillet portion further includes a first covering portion covering at least a portion of the first element side surface and a second covering portion covering at least a portion of the second element side surface, The first covering portion and the second covering portion are each connected to the edge covering portion, an edge of the first element side surface connected to the element main surface is exposed from the first covering portion when viewed in a first direction perpendicular to the first element side surface; an edge of the second element side surface connected to the element main surface is exposed from the second covering portion when viewed in a second direction perpendicular to the second element side surface; The electronic component has a rectangular shape when viewed in the thickness direction, the thickness direction, the first direction, and the second direction are perpendicular to each other, In the second covering portion, a central portion in the first direction is recessed toward a side surface of the second element when viewed in the thickness direction. electronic equipment.

4. An electronic component having a main element surface and a back element surface spaced apart in a thickness direction; a mounting portion having a mounting surface facing a rear surface of the element and on which the electronic component is mounted; a bonding material for bonding the electronic component to the mounting portion; It is equipped with the bonding material includes a base portion sandwiched between the electronic component and the mounting portion in the thickness direction, and a fillet portion connected to the base portion and formed on an outer side of the electronic component as viewed in the thickness direction, the electronic component includes a first element side surface and a second element side surface connected to the element main surface and the element back surface, respectively, and an edge that is an intersection of the first element side surface and the second element side surface and extends in the thickness direction; The fillet portion includes a ridge covering portion that covers at least a portion of the ridge, the fillet portion further includes a first covering portion covering at least a portion of the first element side surface and a second covering portion covering at least a portion of the second element side surface, The first covering portion and the second covering portion are each connected to the edge covering portion, an edge of the first element side surface connected to the element main surface is exposed from the first covering portion when viewed in a first direction perpendicular to the first element side surface; an edge of the second element side surface connected to the element main surface is exposed from the second covering portion when viewed in a second direction perpendicular to the second element side surface; The electronic component has a rectangular shape when viewed in the thickness direction, the thickness direction, the first direction, and the second direction are perpendicular to each other, the second covering portion has an edge portion connected to the ridge covering portion, the edge portion having a larger inclination with respect to the mounting surface than a central portion of the second covering portion having a larger inclination with respect to the mounting surface in the first direction; electronic equipment.

5. the electronic component further includes a third element side, a fourth element side, and a plurality of additional edges; the third element side surface is connected to the element principal surface and the element rear surface and is spaced apart from the first element side surface in the first direction; the fourth element side surface is connected to the element principal surface and the element rear surface and is spaced apart from the second element side surface in the second direction; the multiple additional edges are generated at an intersection of the first element side surface and the fourth element side surface, at an intersection of the second element side surface and the third element side surface, and at an intersection of the third element side surface and the fourth element side surface, and each extends in the thickness direction; The electronic device according to claim 1 , wherein the fillet portion further includes a plurality of additional ridge covering portions that cover the plurality of additional ridges.

6. In the first covering portion, a dimension in the thickness direction of a central portion in the second direction is smaller than a dimension in the thickness direction of an edge portion connected to the edge covering portion.

6. An electronic device according to claim 1.

7. the first covering portion has a protruding portion protruding toward the element main surface side between a central portion in the second direction and an edge portion connected to the edge covering portion; 7. An electronic device according to claim 1.

8. In the second covering portion, a dimension in the thickness direction of a central portion in the first direction is smaller than a dimension in the thickness direction of an edge portion connected to the edge covering portion.

8. An electronic device according to any one of claims 1 to 7.

9. the second covering portion has a protruding portion protruding toward the element main surface side between a central portion in the first direction and an edge portion connected to the edge covering portion; 9. An electronic device according to any one of claims 1 to 8.

10. The fillet portion is formed over the entire periphery of the electronic component as viewed in the thickness direction.

10. An electronic device according to any one of the preceding claims.

11. The electronic component is made of a semiconductor material.

11. An electronic device according to any one of claims 1 to 10.

12. The electronic component has a main surface electrode formed on the main surface of the element, the mounting portion is a part of a lead frame, the lead frame further includes a terminal portion that is electrically connected to the main surface electrode and is spaced apart from the mounting portion.

12. An electronic device according to any one of the preceding claims.

13. The lead frame is made of a metal containing Cu.

13. The electronic device of claim 12.

14. The electronic component has a back electrode formed on a back surface of the element, The back electrode is electrically connected to the mounting portion via the bonding material.

14. An electronic device according to any one of claims 1 to 13.

15. The bonding material is made of sintered silver.

15. An electronic device according to any one of the preceding claims.

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