Optical sensor and method for manufacturing the optical sensor

Abstract

An optical sensor (10) comprises: a substrate (20) having a substrate main surface (21) that intersects with a thickness direction (Z); a light-emitting element (30) provided on the substrate main surface (21); a light-receiving element (40) provided on the substrate main surface (21); a translucent first cover (50) provided on the substrate main surface (21) so as to cover the light-emitting element (30); and a translucent second cover (60) provided on the substrate main surface (21) so as to cover the light-receiving element (40). A gap (GP) is formed between the first cover (50) and the second cover (60).

Description

[Technical field]

[0001] The present invention relates to an optical sensor and a method for manufacturing an optical sensor. [Background technology]

[0002] Patent Document 1 discloses, as an example of an optical sensor, a reflective photosensor including a substrate on which an electrode pattern is formed, a light-emitting diode arranged on the substrate, a photo IC arranged on the substrate adjacent to the light-emitting diode, an outer wall that integrally surrounds the light-emitting diode and the photo IC, and an inner wall that separates the light-emitting diode and the photo IC. This optical sensor aims to reduce crosstalk by blocking diffuse light emitted from the light-emitting diode with a light-shielding wall. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2007-13050 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, the above-mentioned optical sensor has room for improvement in terms of miniaturization of the device. An object of the present disclosure is to provide an optical sensor that can be miniaturized while reducing crosstalk, and a method for manufacturing the optical sensor. [Means for solving the problem]

[0005] The means for solving the above problems and their effects will be described below. An optical sensor that solves the above problem comprises a substrate having a substrate main surface that intersects with a thickness direction, a light-emitting element provided on the substrate main surface, a light-receiving element provided on the substrate main surface, a first cover that is translucent and provided on the substrate main surface so as to cover the light-emitting element, and a second cover that is translucent and provided on the substrate main surface so as to cover the light-receiving element, and a gap is formed between the first cover and the second cover.

[0006] In the optical sensor, a gap is provided between the first cover covering the light-emitting element and the second cover covering the light-receiving element. Therefore, the optical sensor can reduce the amount of light that is directed from the light-emitting element to the light-receiving element without being reflected by an object, compared to a case where no gap is provided between the first cover and the second cover. In other words, the optical sensor can reduce crosstalk. In addition, the optical sensor does not require a light-shielding wall between the first cover and the second cover, which makes it easier to miniaturize the device. Effect of the Invention

[0007] According to the above-described optical sensor, crosstalk can be reduced and the size can be reduced. [Brief description of the drawings]

[0008] [Figure 1] FIG. 2 is a plan view of the optical sensor according to the first embodiment. [Diagram 2] FIG. 2 is a side view of the optical sensor according to the first embodiment. [Diagram 3] FIG. 2 is a side view of the optical sensor according to the first embodiment. [Figure 4] 3A to 3C are manufacturing process diagrams of the optical sensor according to the first embodiment. [Diagram 5] FIG. 2 is a plan view of an intermediate product in manufacturing the optical sensor according to the first embodiment. [Figure 6] FIG. 3 is a side view of an intermediate product during production of the optical sensor according to the first embodiment. [Figure 7] FIG. 2 is a schematic diagram showing a part of a diced surface of the photosensor according to the first embodiment. [Figure 8] FIG. 11 is a side view illustrating the operation of the optical sensor of the comparative example. [Figure 9]FIG. 4 is a side view illustrating the operation of the optical sensor according to the first embodiment. [Figure 10] FIG. 11 is a side view of the optical sensor according to the second embodiment. [Figure 11] FIG. 11 is a side view of an optical sensor according to a modified example of the second embodiment. [Figure 12] FIG. 11 is a side view of an optical sensor according to a modified example of the second embodiment. [Figure 13] FIG. 13 is a side view of the optical sensor according to the third embodiment. [Figure 14] FIG. 13 is a side view of the optical sensor according to the fourth embodiment. [Figure 15] FIG. 13 is a side view of an optical sensor according to a modified example of the fourth embodiment. [Figure 16] FIG. 11 is a plan view of an optical sensor according to a modified example. [Figure 17] FIG. 11 is a side view of an optical sensor according to a modified example. [Figure 18] FIG. 11 is a side view of an optical sensor according to a modified example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Each embodiment of the optical sensor will be described below with reference to the drawings. Each embodiment shown below is an example of a configuration and method for embodying a technical idea, and the material, shape, structure, arrangement, dimensions, etc. of each component are not limited to those described below. Various modifications can be made to each of the following embodiments.

[0010] (First embodiment) An optical sensor 10 according to a first embodiment will be described. The optical sensor 10 is used to detect an object present at a short distance of about 6 mm from the optical sensor 10. As an example, the optical sensor 10 is applied to a wearable device such as an earphone. In this case, the object to be detected is a human body or an inner wall of a case that houses the wearable device.

[0011] 1 and 2, the optical sensor 10 includes a substrate 20, a light-emitting element 30, a light-receiving element 40, a first cover 50, a second cover 60, and bonding wires 71 and 72. In Fig. 1 and subsequent figures, the first cover 50 and the second cover 60 are illustrated in a see-through manner.

[0012] The optical sensor 10 has a rectangular plate shape. In the following description, directions defined according to the shape of the optical sensor 10 will be used. In detail, the thickness direction of the optical sensor 10 is referred to as the "thickness direction Z", the direction perpendicular to the thickness direction Z is referred to as the "first direction X", and the direction perpendicular to both the thickness direction Z and the first direction X is referred to as the "second direction Y".

[0013] The length of the optical sensor 10 in the thickness direction Z is preferably 0.3 mm or more and 0.55 mm or less, and is 0.55 mm in the first embodiment. The length of the optical sensor 10 in the first direction X and the second direction Y is preferably 0.5 mm or more and 1.0 mm or less, and is 1.0 mm in the first embodiment. In other words, the optical sensor 10 has a square shape when viewed in a plan view in the thickness direction Z.

[0014] 1 and 2, the substrate 20 has a rectangular plate shape. The material of the substrate 20 may be, for example, ceramics such as alumina or aluminum nitride, silicon, glass epoxy, or the like.

[0015] The substrate 20 has a substrate main surface 21 that intersects with the thickness direction Z, and a substrate side surface 22 that extends from an outer edge of the substrate main surface 21 in the thickness direction Z. The substrate side surface 22 is composed of four surfaces, and includes a first substrate side surface 221, a second substrate side surface 222, a third substrate side surface 223, and a fourth substrate side surface 224. As shown in FIG. 1, the first substrate side surface 221 and the fourth substrate side surface 224 extend in the first direction X, and the second substrate side surface 222 and the third substrate side surface 223 extend in the second direction Y. In addition, the second substrate side surface 222 and the third substrate side surface 223 connect the first substrate side surface 221 and the fourth substrate side surface 224.

[0016] The substrate main surface 21 is recessed with a groove 23 extending in the second direction Y. The groove 23 extends linearly from one end to the other end of the substrate main surface 21 in the second direction Y so as to divide the substrate main surface 21 into a first region A1 and a second region A2. That is, the longitudinal direction of the groove 23 is the second direction Y, and the width direction of the groove 23 is the first direction X. The position where the groove 23 is formed in the first direction X is slightly shifted from the center of the substrate main surface 21 in the first direction X. That is, the groove 23 is formed in a position closer to the second substrate side surface 222 than to the third substrate side surface 223 in the first direction X. The cross-sectional shape of the groove 23 perpendicular to the second direction Y may be semicircular or rectangular.

[0017] In plan view in the thickness direction Z, the first region A1 has a rectangular shape with the first direction X as the short side direction and the second direction Y as the long side direction. Similarly, the second region A2 has a rectangular shape with the first direction X as the short side direction and the second direction Y as the long side direction. In the first direction X, the length of the first region A1 is shorter than the second region A2, and in the second direction Y, the length of the first region A1 is equal to the length of the second region A2. Therefore, in plan view in the thickness direction Z, the area of ​​the first region A1 is smaller than the area of ​​the second region A2.

[0018] A first pad 211, a second pad 212, a third pad 213, and a fourth pad 214 made of a conductor are formed on the main surface 21 of the substrate. The first pad 211, the second pad 212, the third pad 213, and the fourth pad 214 are formed in a rectangular plate shape. In a plan view in the thickness direction Z, the first pad 211 is formed to have a size equal to that of the second pad 212 and is formed smaller than the other pads 213 and 214. On the other hand, in a plan view in the thickness direction Z, the fourth pad 214 is formed to be larger than the other pads 211 to 213. The first pad 211 and the second pad 212 are formed in the first region A1, and the third pad 213 and the fourth pad 214 are formed in the second region A2. That is, in the main surface 21 of the substrate, the first pad 211 and the second pad 212 and the third pad 213 and the fourth pad 214 are formed on both sides of the recessed groove 23, respectively.

[0019] 1, the first pad 211 is formed closer to the first substrate side surface 221 than the fourth substrate side surface 224, and the second pad 212 is formed closer to the fourth substrate side surface 224 than the first substrate side surface 221. On the other hand, the third pad 213 is formed closer to the first substrate side surface 221 than the fourth substrate side surface 224, and the fourth pad 214 is formed closer to the fourth substrate side surface 224 than the first substrate side surface 221.

[0020] In addition, the first pad 211 and the third pad 213 are formed to at least partially overlap in the first direction X, and the second pad 212 and the fourth pad 214 are formed to at least partially overlap in the first direction X. The first pad 211 and the second pad 212 are formed to entirely overlap in the second direction Y, and the third pad 213 and the fourth pad 214 are formed to entirely overlap in the second direction Y. In other words, the first pad 211 and the second pad 212 are arranged in the second direction Y, and the third pad 213 and the fourth pad 214 are arranged in the second direction Y.

[0021] The first pad 211 and the fourth pad 214 are formed so as not to overlap with each other in both the first direction X and the second direction Y. Similarly, the second pad 212 and the third pad 213 are formed so as not to overlap with each other in both the first direction X and the second direction Y. Thus, in a plan view in the thickness direction Z, the first pad 211 and the fourth pad 214 are arranged at an interval on one diagonal line of the substrate main surface 21, and the second pad 212 and the third pad 213 are arranged at an interval on the other diagonal line of the substrate main surface 21.

[0022] Although not shown in the figure, the back surface of the substrate 20, which is the surface opposite to the main substrate surface 21, is provided with four back surface electrodes which are electrically connected to the four pads, namely the first pad 211, the second pad 212, the third pad 213, and the fourth pad 214, respectively.

[0023] 1 and 2, the light emitting element 30 has a substantially rectangular parallelepiped shape. The light emitting element 30 has a square shape in a plan view in the thickness direction Z. That is, the length of the light emitting element 30 in the first direction X is equal to the length of the light emitting element 30 in the second direction Y.

[0024] The light emitting element 30 is provided on the first region A1 of the substrate main surface 21. More specifically, the light emitting element 30 is mounted on the first pad 211 of the substrate main surface 21. Therefore, the light emitting element 30 is provided closer to the first substrate side surface 221 than to the fourth substrate side surface 224 in the second direction Y. The light emitting element 30 is electrically connected to the second pad 212 by a bonding wire 71.

[0025] The light emitting element 30 is, for example, an LED. The light emitting element 30 emits light in a direction substantially perpendicular to the substrate main surface 21. At this time, the light emitted by the light emitting element 30 may have a certain spread angle. The wavelength of the light emitted from the light emitting element 30 is, for example, within a range of 650 nm to 1300 nm. Furthermore, the upper surface 31 of the light emitting element 30 serves as a light emitting surface that emits light.

[0026] 1 and 2, the light receiving element 40 has a substantially rectangular parallelepiped shape. The light receiving element 40 has a rectangular shape in a plan view in the thickness direction Z. As with the second region A2, the light receiving element 40 has a first direction X as its short side direction and a second direction Y as its long side direction. The light receiving element 40 has a longer length in both the first direction X and the second direction Y than the light emitting element 30, and a length in the thickness direction Z that is equal to that of the light emitting element 30.

[0027] The light receiving element 40 is provided on the second region A2 of the substrate main surface 21 so as to be adjacent to the light emitting element 30. More specifically, the light receiving element 40 is mounted on the fourth pad 214 of the substrate main surface 21. Therefore, the light receiving element 40 is provided closer to the fourth substrate side surface 224 than to the first substrate side surface 221 in the second direction Y. The light receiving element 40 is electrically connected to the third pad 213 by a bonding wire 72.

[0028] The light receiving element 40 is configured to detect reflected light of light emitted from the light emitting element 30 toward a detection target. The light receiving element 40 outputs an analog signal according to the amount of light received. The light receiving element 40 is, for example, a photodiode, a phototransistor, or a photo IC. An upper surface 41 of the light receiving element 40 serves as a light receiving surface for receiving light.

[0029] In the first embodiment, the upper surface 31 of the light-emitting element 30 and the upper surface 41 of the light-receiving element 40 are substantially aligned in the thickness direction Z. That is, in the thickness direction Z, the length from the substrate main surface 21 to the upper surface 31 of the light-emitting element 30 is substantially equal to the length from the substrate main surface 21 to the upper surface 41 of the light-receiving element 40.

[0030] 1 and 2, the first cover 50 is provided on the substrate main surface 21 so as to cover the light emitting element 30. In the first embodiment, the first cover 50 seals the first pad 211, the second pad 212, the light emitting element 30, and the bonding wire 71. The first cover 50 is provided for the purpose of protecting these components of the optical sensor 10. The first cover 50 is formed of, for example, a resin material that is translucent with respect to the wavelength of light emitted from the light emitting element 30. Examples of such resin materials include epoxy resin, silicone resin, silicone modified epoxy resin, polyamide resin, acrylic resin, and urea resin.

[0031] The first cover 50 has a substantially rectangular parallelepiped shape and has a size equivalent to that of the first region A1 of the substrate main surface 21 when viewed in a plan view in the thickness direction Z. The first cover 50 has a first upper surface 51, a first back surface 52, a first side surface 53, and a first inclined surface 54.

[0032] The first upper surface 51 is a surface opposite to the first back surface 52 and has a rectangular shape. The first upper surface 51 faces the upper surface 31 of the light emitting element 30 in the thickness direction Z. The first back surface 52 is a surface facing the substrate main surface 21 and has a rectangular shape. The first back surface 52 has a recessed portion according to the outer shapes of the first pad 211, the second pad 212, and the light emitting element 30. The non-recessed portion of the first back surface 52 is joined to the first region A1 of the substrate main surface 21.

[0033] The first side surface 53 is a surface that intersects with the first upper surface 51, the first back surface 52, and the first inclined surface 54, and is a surface that connects the first upper surface 51, the first inclined surface 54, and the first back surface 52 in the thickness direction Z. In the first embodiment, the first side surface 53 is composed of four substantially rectangular surfaces. The first side surface 53 includes a first inner side surface 531 that faces the second cover 60, and first outer side surfaces 532, 533, and 534 that do not face the second cover 60.

[0034] The first inner side surface 531 is composed of one surface, and the first outer side surfaces 532, 533, and 534 are composed of three surfaces. The first inner side surface 531 and the first outer side surface 533 are surfaces intersecting with the first direction X, and the first outer side surface 532 and the first outer side surface 534 are surfaces intersecting with the second direction Y. The first inner side surface 531 is flush with the inner surface of the recessed groove 23 of the substrate 20. On the other hand, the first outer side surface 532 is flush with the first substrate side surface 221, the first outer side surface 533 is flush with the second substrate side surface 222, and the first outer side surface 534 is flush with the fourth substrate side surface 224.

[0035] The first inclined surface 54 is formed at a corner of the first cover 50 where the first upper surface 51 and the first inner surface 531 are connected. The first inclined surface 54 intersects with both the first upper surface 51 and the first inner surface 531. The first inclined surface 54 has a rectangular shape with the second direction Y as the longitudinal direction and a direction intersecting with both the first upper surface 51 and the first inner surface 531 as the short side direction. The formation angle of the first inclined surface 54 and the size of the first inclined surface 54 can be appropriately selected. In the first embodiment, the angle between the first inclined surface 54 and the first upper surface 51 and the angle between the first inclined surface 54 and the first inner surface 531 are equal.

[0036] As shown in FIG. 3, the first side surface 53 is rougher than the first upper surface 51. That is, the first inner side surface 531 is rougher than the first upper surface 51, and the first outer side surfaces 532, 533, and 534 are rougher than the first upper surface 51. On the other hand, the first inclined surface 54 has a surface roughness similar to that of the first upper surface 51. Note that FIG. 3 is an enlarged view of FIG. 2, and shows the uneven shape of the surface of the first inner side surface 531 and the like in an exaggerated manner compared to the actual surface. Also, in FIG. 3, the uneven shape of the surface of the first outer side surface 532 and the like is omitted.

[0037] 1 and 2, the second cover 60 is provided on the substrate main surface 21 so as to cover the light receiving element 40. In the first embodiment, the second cover 60 seals the third pad 213, the fourth pad 214, the light receiving element 40, and the bonding wire 72. The second cover 60 is provided for the purpose of protecting these components. Like the first cover 50, the second cover 60 is formed of a resin material that is translucent to the wavelength of light emitted from the light emitting element 30.

[0038] The second cover 60 has a substantially rectangular parallelepiped shape and is larger than the first cover 50. More specifically, the second cover 60 has a length in the first direction X larger than the first cover 50 and a length in both the second direction Y and the thickness direction Z equal to that of the first cover 50. The second cover 60 has a size equivalent to that of the second region A2 of the substrate main surface 21 in a plan view in the thickness direction Z. The second cover 60 has a second upper surface 61, a second back surface 62, a second side surface 63, and a second inclined surface 64.

[0039] The second upper surface 61 is a surface opposite to the second back surface 62 in the thickness direction Z, and has a rectangular shape. The second upper surface 61 faces the upper surface 41 of the light receiving element 40 in the thickness direction Z. The second back surface 62 is a surface facing the substrate main surface 21, and has a rectangular shape. The second back surface 62 has a recessed portion according to the outer shapes of the third pad 213, the fourth pad 214, and the light emitting element 30. The non-recessed portion of the second back surface 62 is joined to the second region A2 of the substrate main surface 21.

[0040] The second side surface 63 is a surface that intersects with the second upper surface 61, the second back surface 62, and the second inclined surface 64, and is a surface that connects the second upper surface 61, the second inclined surface 64, and the second back surface 62 in the thickness direction Z. In the first embodiment, the second side surface 63 is composed of four surfaces that form a substantially rectangular shape. The second side surface 63 includes a second inner side surface 631 that faces the first cover 50, and second outer side surfaces 632, 633, and 634 that do not face the first cover 50.

[0041] The second inner side surface 631 is composed of one surface, and the second outer side surfaces 632, 633, 634 are composed of three surfaces. The second inner side surface 631 and the second outer side surface 633 are surfaces intersecting with the first direction X, and the second outer side surface 632 and the second outer side surface 634 are surfaces intersecting with the second direction Y. The second inner side surface 631 is flush with the inner surface of the recessed groove 23 of the substrate 20. On the other hand, the second outer side surface 632 is flush with the first substrate side surface 221, the second outer side surface 633 is flush with the third substrate side surface 223, and the second outer side surface 634 is flush with the fourth substrate side surface 224.

[0042] The second inclined surface 64 is formed at a corner of the second cover 60 where the second upper surface 61 and the second inner surface 631 are connected. The second inclined surface 64 intersects with both the second upper surface 61 and the second inner surface 631. The second inclined surface 64 has a rectangular shape with the second direction Y as the longitudinal direction and the direction intersecting with both the second upper surface 61 and the second inner surface 631 as the short side direction. The formation angle of the second inclined surface 64 and the size of the second inclined surface 64 can be appropriately selected. In the first embodiment, the angle between the second inclined surface 64 and the second upper surface 61 and the angle between the second inclined surface 64 and the second inner surface 631 are equal.

[0043] As shown in FIG. 3, the second side surface 63 is rougher than the second upper surface 61. That is, the second inner side surface 631 is rougher than the second upper surface 61, and the second outer side surfaces 632, 633, 634 are rougher than the second upper surface 61. On the other hand, the second inclined surface 64 has a surface roughness similar to that of the second upper surface 61. Note that in FIG. 3, as with the first inner side surface 531, the uneven shape of the surface of the second inner side surface 631, etc. is exaggerated compared to the actual surface. Also, in FIG. 3, as with the first outer side surface 532, etc., the uneven shape of the surface of the second outer side surface 632 is omitted from the illustration.

[0044] As shown in Figures 1 and 2, the first cover 50 is provided in a first region A1 of the substrate main surface 21, and the second cover 60 is provided in a second region A2 of the substrate main surface 21, and in this respect, the first cover 50 and the second cover 60 can be said to be arranged in a first direction X.

[0045] Further, a gap GP is formed between the first cover 50 and the second cover 60. More specifically, the gap GP is formed in the first direction X between the first inner side surface 531 and the first inclined surface 54 of the first cover 50 and the second inner side surface 631 and the second inclined surface 64 of the second cover 60 across the second direction Y. The first cover 50 and the second cover 60 face each other in the first direction X via the gap GP. In the first embodiment, the facing direction of the first cover 50 and the second cover 60 is the first direction X. That is, the first direction X can be said to be the facing direction of the first cover 50 and the second cover 60, and can also be said to be the arrangement direction of the first cover 50 and the second cover 60.

[0046] The first inner side surface 531, the second inner side surface 631, the first inclined surface 54, and the second inclined surface 64 are surfaces facing the gap GP, and the first outer side surfaces 532, 533, 534, and the second outer side surfaces 632, 633, 634 are surfaces not facing the gap GP. In other words, the first inner side surface 531, the second inner side surface 631, the first inclined surface 54, and the second inclined surface 64 are surfaces defining the gap GP, and the first outer side surfaces 532, 533, 534, and the second outer side surfaces 632, 633, 634 are surfaces not defining the gap GP. In addition, the first inner side surface 531 and the second inner side surface 631 face the first direction X through the gap GP, and the first inclined surface 54 and the second inclined surface 64 face the first direction X through the gap GP.

[0047] As shown in Fig. 2, the first inclined surface 54 and the second inclined surface 64 extend in different directions. In the first embodiment, the first inclined surface 54 and the second inclined surface 64 extend in directions perpendicular to each other. Meanwhile, the inclination of the first inclined surface 54 with respect to the thickness direction Z and the inclination of the second inclined surface 64 with respect to the thickness direction Z are equal. Therefore, as shown in Fig. 2, the first inclined surface 54 and the second inclined surface 64 are symmetrical with respect to a line segment passing through the center of the gap GP. The formation angle and size of the first inclined surface 54 and the second inclined surface 64 do not necessarily have to be the same.

[0048] The gap GP is open upward in the thickness direction Z and in the second direction Y. In the first embodiment, the gap GP is filled with a gas, such as air, in the installation environment of the optical sensor 10. The gap GP has a first portion GP1 having a constant width in the first direction X, and a second portion GP2 whose width in the first direction X gradually increases with increasing distance from the substrate main surface 21.

[0049] The first portion GP1 is formed between the first inner side surface 531 of the first cover 50 and the second inner side surface 631 of the second cover 60, and the second portion GP2 is formed between the first inclined surface 54 of the first cover 50 and the second inclined surface 64 of the second cover 60. The first portion GP1 is closer to the substrate 20 than the second portion GP2. The first portion GP1 is connected to the second portion GP2 in the thickness direction Z.

[0050] In the first embodiment, in a plan view in the thickness direction Z, the longitudinal direction of the gap GP is the second direction Y. As shown in Fig. 2, the gap GP is connected to the groove 23 in the thickness direction Z. In other words, the groove 23 is formed in a portion of the substrate main surface 21 facing the gap GP. Note that the gap GP is preferably formed so that its width in the first direction X is, for example, not less than 0.03 mm and less than 0.1 mm.

[0051] Furthermore, when comparing the first cover 50 and the second cover 60, the first inner side surface 531 and the second inner side surface 631 have approximately the same surface roughness, and the first outer side surfaces 532, 533, 534 and the second outer side surfaces 632, 633, 634 have approximately the same surface roughness. Similarly, the first upper surface 51 and the second upper surface 61 have approximately the same surface roughness, and the first inclined surface 54 and the second inclined surface 64 have approximately the same surface roughness.

[0052] Next, there will be briefly described a manufacturing method for the optical sensor 10. The manufacturing method according to the first embodiment is a method for manufacturing a large number of optical sensors 10 at once. As shown in FIG. 4, the method for manufacturing the optical sensor 10 includes a preparation step S11, a mounting step S12, a molding step S13, and a first cutting step S14 and a second cutting step S15 as a "cutting step".

[0053] The preparation step S11 is a step of preparing a large substrate 110 that is made of the same material as the substrate 20 and is larger than the substrate 20. The mounting step S12 is a step subsequent to the preparation step S11, in which a plurality of pads 211-214 and a plurality of back electrodes, etc. are formed on the large substrate 110, and a plurality of light-emitting elements 30 and a plurality of light-receiving elements 40 are mounted on the large substrate 110.

[0054] The molding step S13 is a step following the mounting step S12, and is a step of forming a resin layer 120 on the large substrate 110 by resin molding using a mold. By carrying out the molding step S13, the resin layer 120 is formed to cover the upper surface of the large substrate 110 together with the pads 211-214, the light emitting elements 30, and the light receiving elements 40. In this way, the intermediate body 100 shown in Figs. 5 and 6 is formed. In the intermediate body 100, a surface 121 of the resin layer 120 is formed with a plurality of recesses 122 extending in a direction perpendicular to the thickness direction Z of the large substrate 110. The cross-sectional shape perpendicular to the longitudinal direction of the recesses 122 is an isosceles trapezoid shape. In the intermediate body 100, the surface 121 of the resin layer 120 and the inclined surface 123 of the recess 122 are both molded surfaces formed by a mold. Note that Figs. 5 and 6 show only one recess 122 due to the relationship of the illustrated area of ​​the intermediate body 100.

[0055] The first cutting step S14 is a step following the molding step S13, and is a step of cutting to form a portion corresponding to the gap GP of the optical sensor 10. The first cutting step S14 is performed by moving a rotating dicing blade along a straight line C1 shown in FIG. 5 and FIG. 6. At this time, in the resin layer 120, a portion that will later become the first cover 50 and a portion that will become the second cover 60 are separated in the first direction X. That is, in the resin layer 120, a portion between the portion that covers the light emitting element 30 and the portion that covers the light receiving element 40 is cut. The first cutting step S14 is performed in a state where the bottom of the dicing blade is located below the upper surface of the large substrate 110 in the thickness direction Z. Therefore, the recessed groove 23 formed in the substrate 20 of the optical sensor 10 is formed when the gap GP is formed in the resin layer 120.

[0056] In the first embodiment, the gap GP is formed by a dicing blade, which results in better productivity than, for example, forming the gap GP by etching, and the shape of the mold is less complex than when the gap GP is formed by a mold.

[0057] Finally, the second cutting process S15 is a process of dicing along the straight line C2 shown in Figures 5 and 6 to cut out a plurality of optical sensors 10 from the intermediate body 100. At this time, the large substrate 110 and the resin layer 120 are cut simultaneously. The same type of dicing blade may be used when cutting out the plurality of optical sensors 10 from the intermediate body 100 and when forming the gaps GP in the resin layer 120, or different types of dicing blades may be used.

[0058] Here, the surface 121 of the resin layer 120 is a portion that will later become the first upper surface 51 of the first cover 50 and the second upper surface 61 of the second cover 60, and the inclined surface 123 of the recess 122 is a portion that will later become the first inclined surface 54 of the first cover 50 and the second inclined surface 64 of the second cover 60. For this reason, in the first embodiment, the surface roughness of the first upper surface 51 and the second upper surface 61, and the first inclined surface 54 and the second inclined surface 64 are equivalent. In this respect, the first upper surface 51 and the second upper surface 61 are located on the same plane.

[0059] The groove 23 of the substrate 20, the first inner side surface 531 of the first cover 50, and the second inner side surface 631 of the second cover 60 are formed by dicing the intermediate body 100 along the straight line C1 shown in FIG. 6. Therefore, the first inner side surface 531 and the second inner side surface 631 have cut marks as shown in FIG. 7. As a result, as shown in FIG. 3, the first inner side surface 531 and the second inner side surface 631 have the same surface roughness and are rougher than the first upper surface 51 and the second upper surface 61. In addition, the cross-sectional shape perpendicular to the longitudinal direction of the groove 23 corresponds to the tip shape of the dicing blade. Furthermore, the inner surface of the groove 23 is rough.

[0060] The substrate side surface 22 and the first outer side surfaces 532, 533, 534 and the second outer side surfaces 632, 633, 634 are formed by dicing the intermediate body 100 along a straight line C2 shown in Fig. 6. Therefore, cut marks are left on the first outer side surfaces 532, 533, 534 and the second outer side surfaces 632, 633, 634 as shown in Fig. 7. As a result, as shown in Fig. 3, the first outer side surfaces 532, 533, 534 and the second outer side surfaces 632, 633, 634 have the same degree of surface roughness and are rougher than the first upper surface 51 and the second upper surface 61.

[0061] The cut marks shown in FIG. 7 are just an example and may vary depending on the diameter of the dicing blade, the moving direction of the dicing blade, the rotation speed of the dicing blade, the moving speed of the dicing blade in the dicing direction, the material of the dicing blade, the material of the resin layer 120, etc.

[0062] The operation and effects of the first embodiment will be described. For more details, a comparative optical sensor 10X will be described while comparing it with the optical sensor 10 of the first embodiment with reference to Fig. 8 and Fig. 9. Note that in Fig. 8 and Fig. 9, for ease of understanding, some components of the optical sensors 10 and 10X are omitted from the illustration.

[0063] (1) As shown in Fig. 8, in an optical sensor 10X of a comparative example including a cover 50X that integrally covers the light-emitting element 30 and the light-receiving element 40, when diffused light L1 is emitted from the light-emitting element 30, a part of the diffused light L1 is reflected by an upper surface 51X of the cover 50X toward the light-receiving element 40. In contrast, as shown in Fig. 9, in the optical sensor 10 of the first embodiment, a gap GP is provided between the first cover 50 that covers the light-emitting element 30 and the second cover 60 that covers the light-receiving element 40. Therefore, when diffused light L1 is emitted from the light-emitting element 30, the diffused light L1 passes through the gap GP and is not reflected by the first upper surface 51 of the first cover 50 and the second upper surface 61 of the second cover 60.

[0064] 9, when there is diffused light L4 passing through the gap GP and traveling from the first cover 50 to the second cover 60, a part of the diffused light L4 is reflected by the first inner surface 531 and the second inner surface 631. For this reason, the intensity of the diffused light described above tends to be reduced when it reaches the inside of the second cover 60.

[0065] Thus, compared to the optical sensor 10X of the comparative example, the optical sensor 10 can reduce the amount of light that is not reflected by an object and travels from the light-emitting element 30 to the light-receiving element 40. In other words, the optical sensor 10 can reduce crosstalk.

[0066] Furthermore, the optical sensor 10 can be easily miniaturized because it does not have a light-shielding wall between the first cover 50 and the second cover 60. Similarly, the optical sensor 10 can simplify the structure of the sensor, which can prevent the manufacturing process of the optical sensor 10 from becoming complicated.

[0067] (2) As shown in FIG. 8, in a comparative example in which the cover 50X does not have a first inclined surface 54, when diffused light L2 is emitted from the light-emitting element 30, there is a possibility that a portion of the diffused light L2 reflected by the first upper surface 51 will be directed toward the light-receiving element 40.

[0068] In this regard, as shown in Fig. 9, the optical sensor 10 of the first embodiment has a first inclined surface 54 formed on the first cover 50. Therefore, as shown in Fig. 9, the diffused light L2 is easily transmitted through the first inclined surface 54, and the diffused light L2 is not easily reflected by the first upper surface 51. As a result, the optical sensor 10 can reduce crosstalk caused by reflection of the diffused light L2 on the first upper surface 51.

[0069] (3) As shown in Fig. 8, in a comparative example in which the cover 50X is not provided with the second inclined surface 64, when diffused light L3 is emitted from the light-emitting element 30, the diffused light L3 may be reflected by the upper surface 51X of the cover 50X and directed toward the light-receiving element 40. In this regard, as shown in Fig. 9, the optical sensor 10 of the first embodiment has the second inclined surface 64 formed on the second cover 60. Therefore, as shown in Fig. 9, the diffused light L3 is less likely to enter the inside of the second cover 60 and is less likely to be directed toward the light-receiving element 40. As a result, the optical sensor 10 can reduce crosstalk caused by reflection of the diffused light L3 on the second upper surface 61.

[0070] (4) As shown in Fig. 9, in the optical sensor 10, the first outer side surfaces 532, 533, 534 of the first cover 50 are flush with the board side surface 22 (221, 222, 224), and the second outer side surfaces 632, 633, 634 of the second cover 60 are flush with the board side surface 22 (221, 223, 224). In other words, the optical sensor 10 does not include a peripheral wall surrounding the periphery of the first cover 50 and the second cover 60. Thus, the optical sensor 10 can be more easily miniaturized as a device.

[0071] (5) In the optical sensor 10, the first inner side surface 531 and the second inner side surface 631 are rougher than the first upper surface 51 and the second upper surface 61. For this reason, as shown in Fig. 9, when diffuse light L4 is emitted from the light-emitting element 30, the diffuse light L4 is reflected, scattered, or refracted when it exits the first cover 50 into the gap GP or enters the second cover 60 from the gap GP. In this way, the optical sensor 10 can weaken the diffuse light L4 by the rough first inner side surface 531 and the second inner side surface 631.

[0072] (6) In the optical sensor 10, the first outer side surfaces 532, 533, and 534 are rougher than the first upper surface 51 and the second upper surface 61. Therefore, in the optical sensor 10, the diffused light emitted from the light-emitting element 30 can be prevented from leaking out of the optical sensor 10 through the first outer side surfaces 532, 533, and 534.

[0073] (7) In the optical sensor 10, the second outer side surfaces 632, 633, 634 are rougher than the first upper surface 51 and the second upper surface 61. For this reason, the optical sensor 10 can prevent light incident on the second cover 60 from the outside in the first direction X and the second direction Y from reaching the light receiving element 40.

[0074] (8) As shown in Fig. 1, in plan view in the thickness direction Z, the light-emitting element 30 and the light-receiving element 40 are arranged to be shifted in the second direction Y, which is the direction in which the gap GP extends. More specifically, in plan view in the thickness direction Z, the light-emitting element 30 and the light-receiving element 40 are arranged so as not to overlap in the second direction Y. Therefore, in the optical sensor 10, the light-emitting element 30 and the light-receiving element 40 can be arranged farther away from each other than in a case in which the light-emitting element 30 and the light-receiving element 40 are arranged so as to overlap at least partially in the second direction Y. In this way, the optical sensor 10 can further reduce crosstalk.

[0075] (9) As shown in Fig. 9, the optical sensor 10 detects an object 200 that is present at a distance Ln of 6 mm or less from the upper surfaces of the first cover 50 and the second cover 60. Therefore, in the optical sensor 10, most of the light emitted from the light-emitting element 30 is reflected by the object 200 and tends to travel toward the light-receiving element 40. Therefore, the optical sensor 10 can ensure a sufficient S / N ratio for detecting the object 200 even if crosstalk becomes strong, since it does not include a light-shielding wall.

[0076] Second embodiment An optical sensor 10A according to the second embodiment will be described with reference to Fig. 10. In the second embodiment, components common to the first embodiment are denoted by the same reference numerals and will not be described. The optical sensor 10A according to the second embodiment differs from the optical sensor 10 according to the first embodiment mainly in the configuration relating to the gap GP.

[0077] As shown in FIG. 10, the optical sensor 10A includes a substrate 20, a light emitting element 30, a light receiving element 40, a first cover 50A, a second cover 60A, bonding wires 71 and 72, and a light-shielding ink 80.

[0078] The first cover 50A has a generally rectangular parallelepiped shape and has a first upper surface 51, a first back surface 52, and a first side surface 53. The second cover 60A has a generally rectangular parallelepiped shape and has a second upper surface 61, a second back surface 62, and a second side surface 63.

[0079] The light-shielding ink 80 is an ink of a color that absorbs the wavelength of light emitted by the light-emitting element 30. The light-shielding ink 80 is filled in the gap GP between the first cover 50 and the second cover 60. The light-shielding ink 80 is preferably solidified in the gap GP, but may be in a liquid or gel state as long as it can remain in the gap GP. In the second embodiment, the gap GP is formed between the first cover 50 and the second cover 60, and even if the gap is filled with the light-shielding ink 80, the gap GP is considered to be formed.

[0080] The effects of the second embodiment will be described. (10) Since the gap GP between the first cover 50A and the second cover 60A is filled with the light-blocking ink 80, the light sensor 10A can absorb the diffuse light emitted from the light-emitting element 30 with the light-blocking ink 80. In this way, the light sensor 10A can further reduce crosstalk. Furthermore, the light sensor 10A of the second embodiment can obtain the effects (1), (4) to (9) of the first embodiment.

[0081] The second embodiment can be modified and implemented as follows. 11 and 12, the optical sensor 10A of the second embodiment may be optical sensors 10A1 and 10A2 including a first cover 50 having a first inclined surface 54 and a second cover 60 having a second inclined surface 64. In this case, as shown in FIG. 11, the optical sensor 10A1 may include light-blocking ink 80A1 that is filled in a first portion GP1 of the gap GP between the first inner side surface 531 and the second inner side surface 631. Also, as shown in FIG. 12, the optical sensor 10A2 may include light-blocking ink 80A2 that is filled in the entire gap GP.

[0082] Third embodiment An optical sensor 10B according to the third embodiment will be described with reference to Fig. 13. In the third embodiment, components common to the first embodiment will be denoted by the same reference numerals and will not be described. The optical sensor 10B of the third embodiment differs from the optical sensor 10 of the first embodiment mainly in that it includes a lens.

[0083] As shown in FIG. 13, the optical sensor 10B includes a substrate 20, a light emitting element 30, a light receiving element 40, a first cover 50B, a second cover 60B, bonding wires 71 and 72, a first lens 81, and a second lens 82.

[0084] The first cover 50B has a substantially rectangular parallelepiped shape. The first cover 50B has a first upper surface 51, a first back surface 52, and a first side surface 53. The second cover 60B has a substantially rectangular parallelepiped shape. The second cover 60B has a second upper surface 61, a second back surface 62, and a second side surface 63.

[0085] The first lens 81 is formed on the first upper surface 51 of the first cover 50B. The first lens 81 collects light emitted from the light-emitting element 30 and tilts the direction of light emitted from the light-emitting element 30 so that the light reflected by an object tends to travel toward the light-receiving element 40. The second lens 82 is formed on the second upper surface 61 of the second cover 60B. The second lens 82 collects light that is about to enter the second cover 60 toward the light-receiving element 40.

[0086] The first lens 81 and the second lens 82 are both Fresnel lenses. In this respect, the first lens 81 is an example of a "first Fresnel lens", and the second lens 82 is an example of a "second Fresnel lens". The first lens 81 and the second lens 82 may be formed separately from the first cover 50B and the second cover 60B, or may be formed integrally with the first cover 50B and the second cover 60B. When the first lens 81 and the second lens 82 are formed integrally with the first cover 50B and the second cover 60B, the first lens 81 and the second lens 82 can be formed simultaneously with the first cover 50B and the second cover 60B, for example, in the molding step S13.

[0087] The effects of the third embodiment will be described. (11) Since the optical sensor 10B includes the first lens 81 and the second lens 82, most of the light emitted from the light emitting element 30 is reflected by the object 200, and the reflected light from the object 200 tends to travel toward the light receiving element 40. Furthermore, since the first lens 81 and the second lens 82 are Fresnel lenses, an increase in the length of the optical sensor 10B in the thickness direction Z is suppressed. Furthermore, the optical sensor 10B of the third embodiment can obtain the effects (1), (4) to (9) of the first embodiment.

[0088] The third embodiment can be modified and implemented as follows. The first lens 81 and the second lens 82 may be normal condenser lenses. The optical sensor 10B may include at least one of the first lens 81 and the second lens 82.

[0089] (Fourth embodiment) An optical sensor 10C according to a fourth embodiment will be described with reference to Fig. 14. In the fourth embodiment, components common to the first embodiment are denoted by the same reference numerals and will not be described. The optical sensor 10C according to the fourth embodiment differs from the optical sensor 10 according to the first embodiment mainly in the configuration of the light emitting element.

[0090] 14, the optical sensor 10C includes a substrate 20, a light-emitting element 30C, a light-receiving element 40, a first cover 50C, a second cover 60C, and bonding wires 71 and 72. Note that the bonding wires 71 and 72 are not shown in FIG.

[0091] The light emitting element 30C is mounted on the first pad 211 and connected to the second pad 212 via a bonding wire 71. The length of the light emitting element 30C in the thickness direction Z is shorter than the length of the light receiving element 40 in the thickness direction Z.

[0092] The first cover 50C has a substantially rectangular parallelepiped shape. The first cover 50C has a first upper surface 51, a first back surface 52, and a first side surface 53. The second cover 60C has a substantially rectangular parallelepiped shape. The second cover 60C has a second upper surface 61, a second back surface 62, and a second side surface 63.

[0093] 14, in the thickness direction Z, the length Ln1 from the substrate main surface 21 to the upper surface 31C of the light-emitting element 30C is shorter than the length Ln2 from the substrate main surface 21 to the upper surface 41 of the light-receiving element 40. In other words, in the thickness direction Z, the length from the upper surface 31C of the light-emitting element 30C to the first upper surface 51 of the first cover 50C is longer than the length from the upper surface 41 of the light-receiving element 40 to the second upper surface 61 of the second cover 60C. In this way, the upper surface 31C of the light-emitting element 30C and the upper surface 41 of the light-receiving element 40 are positioned offset from each other in the thickness direction Z.

[0094] The effects of the fourth embodiment will be described. (12) In the optical sensor 10C, the upper surface 41 of the light receiving element 40 is shifted upward from the upper surface 31C of the light emitting element 30C. Therefore, as shown in FIG. 14, when there is diffuse light L5 emitted from the light emitting element 30C in the first direction X or in a direction slightly tilted from the first direction X, the diffuse light L5 is less likely to reach the upper surface 41 of the light receiving element 40. In this way, the optical sensor 10C can further reduce crosstalk. Also, the optical sensor 10C of the fourth embodiment can obtain the effects (1), (4) to (9) of the first embodiment.

[0095] The fourth embodiment can be modified and implemented as follows. As shown in Fig. 15, the optical sensor 10C may be an optical sensor 10C1 including a light emitting element 30 and a light receiving element 40C. As shown in Fig. 15, in the thickness direction Z, the length Ln1 from the substrate main surface 21 to the upper surface 31 of the light emitting element 30 is longer than the length Ln2 from the substrate main surface 21 to the upper surface 41C of the light receiving element 40C. That is, in the thickness direction Z, the length from the upper surface 31 of the light emitting element 30 to the first upper surface 51 of the first cover 50C is shorter than the length from the upper surface 41C of the light receiving element 40C to the second upper surface 61 of the second cover 60C. Note that the bonding wires 71 and 72 are not shown in Fig. 15.

[0096] As long as the length Ln1 and the length Ln2 are different, the length of the light emitting element 30C in the thickness direction Z and the length of the light receiving element 40 in the thickness direction Z may be equal. In this case, a conductive intervening portion may be provided between the first pad 211 and the light emitting element 30C, or a conductive intervening portion may be provided between the fourth pad 214 and the light receiving element 40. The thickness of the first pad 211 on which the light emitting element 30C is mounted may be different from the thickness of the fourth pad 214 on which the light receiving element 40 is mounted. The thickness of the portion of the substrate 20 on which the first pad 211 is formed may be different from the thickness of the portion on which the fourth pad 214 is formed.

[0097] Each embodiment can be modified as follows: Each embodiment and the following modified examples can be combined with each other to the extent that there is no technical contradiction. The optical sensors 10, 10A to 10C may detect an object that is present at a distance Ln greater than 6 mm from the surfaces of the first cover 50 and the second cover 60. In this case, it is preferable to change the shapes, sizes, positional relationships, etc. of the components of the optical sensors 10, 10A to 10C in order to ensure a sufficient S / N ratio.

[0098] The outer shape of the optical sensors 10, 10A to 10C does not have to be square when viewed in a plan view in the thickness direction Z. For example, the outer shape of the optical sensors 10, 10A to 10C may be rectangular, polygonal, or circular.

[0099] 16, the optical sensor 10 may be an optical sensor 10D. In the optical sensor 10D, the first pad 211 and the fourth pad 214 may be formed adjacent to each other in the first direction X, and the second pad 212 and the third pad 213 may be formed adjacent to each other in the first direction X. In other words, the first pad 211 and the fourth pad 214 may be formed to overlap at least partially in the first direction X, and the second pad 212 and the third pad 213 may be formed to overlap at least partially in the first direction X. In other words, it is sufficient that the light emitting element 30 and the light receiving element 40 are provided in regions defined by the recessed groove 23.

[0100] 17, the optical sensor 10 may be an optical sensor 10E in which the groove 23 is not formed in the substrate 20. That is, when manufacturing the optical sensor 10E, dicing may be performed along the straight line C1 shown in FIGS. 5 and 6 with the lower end of the dicing blade aligned with the substrate main surface 21 in the thickness direction Z.

[0101] As shown in FIG. 18, the optical sensor 10 may be an optical sensor 10F that is provided on the substrate main surface 21 and includes a connection portion 90 that connects the first cover 50 and the second cover 60. The connection portion 90 has a columnar shape with its height direction being the second direction Y. The connection portion 90 connects the first cover 50 and the second cover 60 across the second direction Y. In other words, the connection portion 90 has the same length in the second direction Y as both the first cover 50 and the second cover 60. In addition, the cross-sectional shape of the connection portion 90 in the second direction Y is the same.

[0102] The connection portion 90 has a connection portion upper surface 91 that intersects with the thickness direction Z. The connection portion upper surface 91 is a concave curved surface that is recessed toward the substrate main surface 21 and faces the gap GP. For this reason, in the optical sensor 10F, it can be said that the gap GP is formed between the first inner side surface 531 of the first cover 50, the second inner side surface 631 of the second cover 60, and the connection portion upper surface 91 of the connection portion 90. In other words, it can be said that the gap GP is formed between the first cover 50, the second cover 60, and the connection portion 90. In this way, the first cover 50 and the second cover 60 may be configured to be separated from each other, or may be configured to be connected to each other as long as the gap GP is formed.

[0103] If the length from the substrate main surface 21 to the connecting portion upper surface 91 in the thickness direction Z is taken as the thickness Th of the connecting portion 90, the thickness Th of the connecting portion 90 is preferably shorter than the length Ln1 from the substrate main surface 21 to the upper surface 31 of the light-emitting element 30, and more preferably shorter than the length from the substrate main surface 21 to the light-emitting layer of the light-emitting element 30. Moreover, the thickness Th of the connecting portion 90 is preferably shorter than the length Ln2 from the substrate main surface 21 to the upper surface 41 of the light-receiving element 40, and more preferably shorter than the length from the substrate main surface 21 to the light-receiving layer of the light-receiving element 40.

[0104] As described above, the connection portion upper surface 91 is curved. In this configuration, the thickness Th of the connection portion 90 is the length from the substrate main surface 21 to the portion of the connection portion upper surface 91 that is closest to the substrate main surface 21.

[0105] 18, the thickness Th of the connection portion 90 is shorter than the length Ln3 of the gap GP in the thickness direction Z and shorter than the length Ln4 of the first portion GP1 in the thickness direction Z. Therefore, the area occupied by the gap GP between the first cover 50 and the second cover 60 is larger than the area occupied by the connection portion 90. However, this is not limited to this, and the thickness Th of the connection portion 90 can be set arbitrarily, and may be longer than the length Ln4 of the first portion GP1 in the thickness direction Z, for example.

[0106] The length Ln3 of the gap GP in the thickness direction Z is the length from the connection portion top surface 91 (e.g., the portion of the connection portion top surface 91 closest to the substrate main surface 21) to the upper ends of the first top surface 51 and the second top surface 61 in the thickness direction Z. The length Ln4 of the first portion GP1 in the thickness direction Z is the length from the connection portion top surface 91 (e.g., the portion of the connection portion top surface 91 closest to the substrate main surface 21) to the upper ends of the first inner side surface 531 and the second inner side surface 631 in the thickness direction Z.

[0107] 5 and 6 in a state in which the lower end of a dicing blade is positioned above the substrate main surface 21 in the thickness direction Z. Therefore, the connection portion 90 is formed from the same resin material as the first cover 50 and the second cover 60, and the connection portion 90 is formed integrally with the first cover 50 and the second cover 60.

[0108] 18, the first cover 50 and the second cover 60 are integrated by the connection portion 90, thereby increasing the strength of the optical sensor 10F. Furthermore, the optical sensor 10F has a thickness Th of the connection portion 90 that is less than the length Ln1 from the substrate main surface 21 to the upper surface 31 of the light-emitting element 30, thereby preventing the light emitted from the light-emitting element 30 from passing through the connection portion 90 and traveling toward the light-receiving element 40. In other words, the optical sensor 10F can reduce crosstalk caused by the provision of the connection portion 90.

[0109] The shape of the light emitting element 30 and the light receiving element 40 does not have to be a rectangular parallelepiped. For example, the shape of the light emitting element 30 and the light receiving element 40 may be a cube, a columnar shape, or a plate shape.

[0110] The light emitting element 30 may be a semiconductor laser element. The semiconductor laser element is, for example, a VCSEL (Vertical Cavity Surface Emitting LASER) that emits laser light in a vertical direction. This can reduce the diffusion of light emitted from the light emitting element 30.

[0111] The first inner side surface 531 of the first cover 50 and the second inner side surface 631 of the second cover 60 do not have to be formed into a rough surface. Similarly, at least one of the first outer side surfaces 532, 533, 534 of the first cover 50 does not have to be formed into a rough surface, and at least one of the second outer side surfaces 632, 633, 634 of the second cover 60 does not have to be formed into a rough surface.

[0112] The first inclined surface 54 of the first cover 50 and the second inclined surface 64 of the second cover 60 may be formed as rough surfaces. In this case, the first inclined surface 54 and the second inclined surface 64 may be roughened by roughening the surface of a mold, or the first inclined surface 54 and the second inclined surface 64 may be roughened by processing after resin molding.

[0113] A mirror film or a light-shielding film may be provided on the first inner surface 531 of the first cover 50 to prevent the diffuse light emitted from the light-emitting element 30 from entering the inside of the second cover 60. Similarly, a mirror film or a light-shielding film may be provided on the second inner surface 631 of the second cover 60 to prevent the diffuse light emitted from the light-emitting element 30 from entering the inside of the second cover 60.

[0114] The gap GP between the first cover 50 and the second cover 60 may be formed by a mold when the resin layer 120 is molded. The first upper surface 51 of the first cover 50 and the second upper surface 61 of the second cover 60 may be offset in the thickness direction Z.

[0115] A dicing blade does not have to be used to dice the intermediate body 100. For example, dicing may be performed using a laser. (Additional Note) Next, technical ideas based on the above-described embodiments and modifications will be described below.

[0116] (Appendix 1) a substrate having a substrate main surface intersecting a thickness direction; a light emitting element provided on the main surface of the substrate; a light receiving element provided on the main surface of the substrate; a first cover having a light-transmitting property and provided on the main surface of the substrate so as to cover the light-emitting element; a second cover having light transmitting properties and provided on the main surface of the substrate so as to cover the light receiving element; Equipped with The optical sensor has a gap between the first cover and the second cover.

[0117] (Appendix 2) the first cover has a first top surface intersecting the thickness direction and a first side surface intersecting the first top surface, the second cover has a second upper surface intersecting the thickness direction and a second side surface intersecting the second upper surface, The first side surface includes a first inner side surface facing the gap and a first outer side surface not facing the gap, The optical sensor of claim 1, wherein the second side includes a second inner side facing the gap and a second outer side not facing the gap.

[0118] (Appendix 3) The optical sensor described in Appendix 2, wherein the first cover has a first inclined surface that intersects with both the first top surface and the first inner surface at a corner where the first top surface and the first inner surface are connected.

[0119] (Appendix 4) The optical sensor of claim 2 or 3, wherein the second cover has a second inclined surface that intersects with both the second upper surface and the second inner surface at a corner where the second upper surface and the second inner surface are connected.

[0120] (Appendix 5) The substrate has a substrate side surface, 5. The optical sensor according to claim 2, wherein the first outer side surface and the second outer side surface are flush with a side surface of the substrate in the thickness direction.

[0121] (Appendix 6) The optical sensor according to any one of claims 2 to 5, wherein the first inner surface is rougher than the first upper surface.

[0122] (Appendix 7) The optical sensor according to any one of claims 2 to 6, wherein the second inner surface is rougher than the second upper surface.

[0123] (Appendix 8) The optical sensor according to any one of claims 2 to 7, wherein the first outer surface is rougher than the first upper surface.

[0124] (Appendix 9) The optical sensor according to any one of claims 2 to 8, wherein the second outer surface is rougher than the second upper surface.

[0125] (Appendix 10) 10. The optical sensor according to claim 1, further comprising a light-blocking ink filled in the gap.

[0126] (Appendix 11) 10. The optical sensor according to claim 1, wherein the gap is filled with air. (Appendix 12) 12. The optical sensor according to claim 1, wherein an upper surface of the light-emitting element and an upper surface of the light-receiving element are offset from each other in the thickness direction.

[0127] (Appendix 13) 13. The optical sensor according to claim 12, wherein a length from the main surface of the substrate to an upper surface of the light-emitting element in the thickness direction is shorter than a length from the main surface of the substrate to an upper surface of the light-receiving element.

[0128] (Appendix 14) 14. The optical sensor according to claim 2, wherein the first upper surface and the second upper surface are located on the same plane.

[0129] (Appendix 15) 15. The optical sensor according to claim 2, further comprising a first Fresnel lens formed on the first upper surface.

[0130] (Appendix 16) 16. The optical sensor according to claim 2, further comprising a second Fresnel lens formed on the second upper surface.

[0131] (Appendix 17) the first cover and the second cover face each other across the gap, the gap extends in a direction perpendicular to a direction in which the first cover and the second cover face each other in a plan view in the thickness direction, 17. The optical sensor according to claim 1, wherein the light emitting element and the light receiving element are arranged to be shifted from each other in a direction in which the gap extends when seen in a plan view in the thickness direction.

[0132] (Appendix 18) 18. The optical sensor according to claim 1, wherein a groove recessed in the thickness direction is formed in a portion of the main surface of the substrate facing the gap.

[0133] (Appendix 19) the substrate main surface has a first region and a second region defined by the groove, The light emitting element is provided on the first region, the light receiving element is provided on the second region, the first cover is provided on the first region so as to cover the light emitting element, the second cover is provided on the second region so as to cover the light receiving element, 19. The optical sensor of claim 18, wherein, in a plan view in the thickness direction, the light receiving element is larger than the light emitting element, and the second region is larger than the first region.

[0134] (Appendix 20) the first cover and the second cover face each other across the gap, The groove extends in a direction perpendicular to a direction in which the first cover and the second cover face each other in a plan view in the thickness direction, The first region and the second region are rectangular in shape with the width direction of the groove as a short side direction and the extension direction of the groove as a long side direction, The length of the first region in the short side direction is shorter than the length of the second region in the short side direction, 20. The optical sensor of claim 19, wherein the first region has a length in the longitudinal direction that is equal to a length in the longitudinal direction of the second region.

[0135] (Appendix 21) the first cover and the second cover face each other across the gap, The groove extends in a direction perpendicular to a direction in which the first cover and the second cover face each other in a plan view in the thickness direction, the substrate has first and second pads arranged in the first region in a direction in which the groove extends, and third and fourth pads arranged in the second region in a direction in which the groove extends, the light emitting element is mounted on the first pad and electrically connected to the second pad; 21. The optical sensor according to claim 19, wherein the light receiving element is mounted on the fourth pad and electrically connected to the third pad.

[0136] (Appendix 22) the first pad is formed so as to at least partially overlap the third pad in a width direction of the groove, but not to overlap the fourth pad; 22. The optical sensor according to claim 21, wherein the second pad is formed so as to at least partially overlap with the fourth pad in a width direction of the groove, but not overlap with the third pad.

[0137] (Appendix 23) a connection portion provided on the main surface of the substrate and connecting the first cover and the second cover; 18. The optical sensor according to any one of claims 1 to 17, wherein the gap is formed among the first cover, the second cover, and the connection portion.

[0138] (Appendix 24) The connection portion has a connection portion upper surface facing the gap, 24. The optical sensor of claim 23, wherein a thickness of the connection portion, which is a length from the main surface of the substrate to an upper surface of the connection portion in the thickness direction, is shorter than a length from the main surface of the substrate to an upper surface of the light-emitting element.

[0139] (Appendix 25) The connection portion has a connection portion upper surface facing the gap, 25. The optical sensor of claim 23, wherein a thickness of the connection portion, which is a length from the main surface of the substrate to an upper surface of the connection portion in the thickness direction, is shorter than a length of the gap in the thickness direction.

[0140] (Appendix 26) the first cover and the second cover face each other across the gap, the substrate has a rectangular shape in a plan view in the thickness direction, and includes a first substrate side surface and a fourth substrate side surface extending in a direction in which the first cover and the second cover face each other, and a second substrate side surface and a third substrate side surface connecting the first substrate side surface and the fourth substrate side surface extending in a direction perpendicular to the direction in which the first cover and the second cover face each other, the light emitting element is provided at a position closer to the first substrate side surface than to the fourth substrate side surface, 26. The optical sensor according to claim 1, wherein the light receiving element is provided at a position closer to a side surface of the fourth substrate than to a side surface of the first substrate.

[0141] (Appendix 27) 27. The optical sensor according to claim 1, wherein the light emitting element is a semiconductor laser element that emits laser light in a vertical direction.

[0142] (Appendix 28) 28. The optical sensor according to claim 1, wherein the optical sensor has a square shape when viewed in a plan view in the thickness direction.

[0143] (Appendix 29) 29. The optical sensor of claim 28, wherein the length of one side is 0.5 mm or more and 1.0 mm or less when viewed in a plan view in the thickness direction.

[0144] (Appendix 30) 30. The optical sensor according to claim 1, wherein an object present within a range of 6 mm or less from the first cover and the second cover is detected.

[0145] (Appendix 31) a substrate having a substrate main surface intersecting a thickness direction; a light emitting element provided on the main surface of the substrate; a light receiving element provided on the main surface of the substrate; a first cover having a light-transmitting property and provided on the main surface of the substrate so as to cover the light-emitting element; a second cover having light transmitting properties and provided on the main surface of the substrate so as to cover the light receiving element; A method for manufacturing an optical sensor comprising: a molding step of molding a resin layer covering the main surface of the substrate together with the light emitting element and the light receiving element; a cutting process for forming a gap between the first cover and the second cover by cutting a portion of the resin layer between a portion covering the light-emitting element and a portion covering the light-receiving element. (Appendix 32) a substrate having a substrate main surface intersecting a thickness direction; a VCSEL provided on the main surface of the substrate and emitting laser light in a vertical direction; a light receiving element provided on the main surface of the substrate; a first cover having optical transparency and provided on the main surface of the substrate so as to cover the VCSEL; a second cover having light transmitting properties and provided on the main surface of the substrate so as to cover the light receiving element; Equipped with A gap is formed between the first cover and the second cover, The gap is filled with air, The optical sensor has a groove recessed in the thickness direction in a portion of the main surface of the substrate facing the gap. (Appendix 33) a substrate having a substrate main surface intersecting a thickness direction; a VCSEL provided on the main surface of the substrate and emitting laser light in a vertical direction; a light receiving element provided on the main surface of the substrate; a first cover having optical transparency and provided on the main surface of the substrate so as to cover the VCSEL; a second cover having light transmitting properties and provided on the main surface of the substrate so as to cover the light receiving element; Equipped with A gap is formed between the first cover and the second cover, The gap is filled with air, A method for manufacturing an optical sensor, comprising the steps of: forming a groove recessed in a thickness direction in a portion of the main surface of the substrate facing the gap; a molding step of molding a resin layer covering the main surface of the substrate together with the VCSEL and the light receiving element; a cutting process for forming the gap between the first cover and the second cover by cutting a portion of the resin layer between the portion covering the VCSEL and the portion covering the light receiving element, and forming the groove in the substrate. [Explanation of symbols]

[0146] 10, 10A, 10A1, 10A2, 10B, 10C, 10C1, 10D, 10E, 10F...Optical sensors 10X: Optical sensor for comparison 20...Substrate 21...Main surface of substrate 211…First pad 212…Second pad 213…3rd pad 214…4th pad 22…Side of board 221…First board side 222…Second board side 223…Third board side 224…4th board side 23...Groove 30, 30C...Light emitting element 31,31C…Top surface 40, 40C…Photodetector 41,41C…Top surface 50, 50A, 50B, 50C...First cover 50X: Cover for comparison 51...1st top surface 51X…Top surface 52…First back 53...1st side 531…First inner surface 532…First outer surface 533...first outer surface 534...First outer surface 54…First slope 60, 60A, 60B, 60C...Second cover 61…Second top surface 62…Second back 63…Second side 631…Second inner surface 632…Second outer surface 633…Second outer surface 634…Second outer surface 64...Second slope 71,72…Bonding wire 80, 80A1, 80A2...Light-blocking ink 81...First lens (an example of a first Fresnel lens) 82...Second lens (an example of a second Fresnel lens) 90…Connection 91…Connection top 100...Intermediate 110...Large board 120…Resin layer 121…Surface 122…Recess 123...Slope 200…object A1…First area A2…Second area GP…Gap GP1…Part 1 GP2…Second part L1~L5…Diffused light X…first direction Y: Second direction Z: Thickness direction

Claims

1. a substrate having a substrate main surface intersecting a thickness direction; a VCSEL provided on the main surface of the substrate and emitting laser light in a vertical direction; a light receiving element provided on the main surface of the substrate; a first cover having optical transparency and provided on the main surface of the substrate so as to cover the VCSEL; a second cover having a light-transmitting property and provided on the main surface of the substrate so as to cover the light-receiving element; Equipped with A gap is formed between the first cover and the second cover, The gap is filled with air, The width of the gap is equal to or greater than 0.03 mm and less than 0.1 mm, the first cover and the second cover have side surfaces that define the gap and that are light transmissible; The optical sensor has a groove recessed in the thickness direction in a portion of the main surface of the substrate facing the gap.

2. the first cover has a first top surface intersecting the thickness direction and a first side surface intersecting the first top surface, the second cover has a second top surface intersecting the thickness direction and a second side surface intersecting the second top surface, The first side surface includes a first inner side surface facing the gap and a first outer side surface not facing the gap, The optical sensor of claim 1 , wherein the second side includes a second inner side facing the gap and a second outer side not facing the gap.

3. The optical sensor according to claim 2 , wherein the first cover has a first inclined surface at a corner where the first upper surface and the first inner side surface are connected, the first inclined surface intersecting both the first upper surface and the first inner side surface.

4. The optical sensor according to claim 2 or claim 3, wherein the second cover has a second inclined surface at a corner where the second upper surface and the second inner surface are connected, the second inclined surface intersecting both the second upper surface and the second inner surface.

5. The substrate has a substrate side surface, The optical sensor according to any one of claims 2 to 4, wherein the first outer surface and the second outer surface are flush with the substrate side surface in the thickness direction.

6. The optical sensor according to any one of claims 2 to 5, wherein the first inner surface is rougher than the first upper surface.

7. The optical sensor according to any one of claims 2 to 6, wherein the second inner surface is rougher than the second upper surface.

8. The optical sensor according to any one of claims 2 to 7, wherein the first outer surface is rougher than the first upper surface.

9. The optical sensor according to any one of claims 2 to 8, wherein the second outer surface is rougher than the second upper surface.

10. 10. The optical sensor according to claim 2, wherein an upper surface of the VCSEL and an upper surface of the light receiving element are offset from each other in the thickness direction.

11. The optical sensor according to claim 10 , wherein a length from the main surface of the substrate to an upper surface of the VCSEL in the thickness direction is shorter than a length from the main surface of the substrate to an upper surface of the light receiving element.

12. The optical sensor according to any one of claims 2 to 11, wherein the first upper surface and the second upper surface are located on the same plane.

13. The optical sensor according to any one of claims 2 to 12, further comprising a first Fresnel lens formed on the first upper surface.

14. The optical sensor according to any one of claims 2 to 13, further comprising a second Fresnel lens formed on the second upper surface.

15. the first cover and the second cover face each other across the gap, the gap extends in a direction perpendicular to a direction in which the first cover and the second cover face each other in a plan view in the thickness direction, 15. The optical sensor according to claim 1, wherein the VCSEL and the light receiving element are arranged to be shifted from each other in a direction in which the gap extends when viewed in a plan view in the thickness direction.

16. the substrate main surface has a first region and a second region defined by the groove, the VCSEL is disposed on the first region, the light receiving element is provided on the second region, the first cover is provided on the first region so as to cover the VCSEL; the second cover is provided on the second region so as to cover the light receiving element, 16. The optical sensor according to claim 1, wherein, in a plan view in the thickness direction, the light receiving element is larger than the VCSEL, and the second region is larger than the first region.

17. a substrate having a substrate main surface intersecting a thickness direction; a VCSEL provided on the main surface of the substrate and emitting laser light in a vertical direction; a light receiving element provided on the main surface of the substrate; a first cover having optical transparency and provided on the main surface of the substrate so as to cover the VCSEL; a second cover having a light-transmitting property and provided on the main surface of the substrate so as to cover the light-receiving element; Equipped with A gap is formed between the first cover and the second cover, The gap is filled with air, The width of the gap is equal to or greater than 0.03 mm and less than 0.1 mm, the first cover and the second cover have side surfaces that define the gap and that are light transmissible; A method for manufacturing an optical sensor, comprising the steps of: forming a groove recessed in a thickness direction in a portion of the main surface of the substrate facing the gap; a molding step of molding a resin layer that covers the main surface of the substrate together with the VCSEL and the light receiving element; a cutting process for forming the gap between the first cover and the second cover by cutting a portion of the resin layer between the portion covering the VCSEL and the portion covering the light receiving element, and forming the groove in the substrate.

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