Wafer container and size matching system therefor - Patents.com

Abstract

The wafer container includes a pod, a door, a wafer cassette having a top wall, a base plate, and a biasing member. The pod includes a side wall, a closed end, and an open end. When closed by the door, the base plate is positioned between the door and the wafer cassette, and the biasing member is compressed between the wafer cassette and the closed end of the pod. The size matching system for securing the wafer cassette within the interior space of the closed pod includes the base plate and the biasing member. The base plate includes at least one of a protrusion for connecting the base plate to the wafer cassette and a notch for connecting the base plate to the door. The biasing member is disposed in compression between the wafer cassette and the closed end of the pod.

Description

[Technical field]

[0001] FIELD OF THE DISCLOSURE The present disclosure relates generally to securing a wafer cassette within a wafer container. More particularly, the present disclosure relates to securing a wafer cassette within a pod of a wafer container. [Background technology]

[0002] A wafer container may include a wafer cassette housed with an outer pod. The wafer cassette may move relative to the rest of the pod when moved or subjected to an impact such as being dropped, bumped, or the like. Movement of the wafer cassette may lead to damage to the pod, cassette, or wafers, or lead to the generation of undesirable particles. A wafer container may be configured to accommodate a particular size of wafer cassette. Each pod may have features that are specifically configured (e.g., sized, positioned, etc.) to hold a certain size of wafer cassette. For example, a "200 mm" wafer container may include a pod that is configured to securely accommodate a "200 mm" wafer cassette (i.e., a wafer cassette sized to hold 200 mm wide wafers). Summary of the Invention

[0003] FIELD OF THE DISCLOSURE The present disclosure relates generally to securing wafer cassettes within pods of wafer containers.

[0004] By using a base plate between the door and the wafer cassette and one or more biasing members between the wafer cassette and the closed end of the pod, the wafer container can be adapted to securely hold a smaller sized wafer container within the closed pod by the base plate and one or more biasing members limiting movement of the wafer cassette relative to the closed pod.

[0005] In one embodiment, the wafer container includes a pod, a door, a wafer cassette, a base plate, and a biasing member. The pod includes one or more side walls, a closed end, an open end, and an interior space defined by the one or more side walls and the closed end. The wafer cassette includes a top wall. The door is configured to close the open end of the pod. When the open end of the pod is closed by the door, the base plate is positioned between the door and the wafer cassette, and the biasing member is compressed between the top wall of the wafer cassette and the closed end of the pod, forcing the wafer cassette and the base plate against the door.

[0006] In one embodiment, a biasing member presses the wafer cassette against the base plate when the open end is closed by the door.

[0007] In one embodiment, the biasing member includes a first end, a second end opposite the first end, a first resilient flexure, and a second resilient flexure, the first end being connected to the second end via the first resilient flexure and the second resilient flexure.

[0008] In one embodiment, when the opening is closed by the door, a first end of the biasing member contacts the pod and a second end of the biasing member contacts the wafer cassette.

[0009] In one embodiment, compression of the biasing member causes the first resilient flexure to bend at a smaller angle and the second resilient flexure to bend at a larger angle.

[0010] In one embodiment, the biasing member extends from the top wall of the wafer cassette to the closed end of the pod when the opening is closed by the door.

[0011] In one embodiment, the closed end of the pod includes an inwardly facing surface and a channel extending away from the inwardly facing surface of the closed end, and the biasing member includes a rib extending along a length of the biasing member, the biasing member being attached to the pod by the rib of the biasing member being disposed within the channel of the closed end.

[0012] In one embodiment, the base plate includes a top and a protrusion extending from the top, and the base of the wafer cassette includes a slot such that when the opening is closed by the door, the protrusion extends into the slot to couple the wafer cassette and the base plate.

[0013] In one embodiment, the base plate includes a bottom having a notch and the door includes an inwardly facing surface and a protrusion extending from the inwardly facing surface such that when the opening is closed by the door, the protrusion extends into the notch to interlock the base plate and the door.

[0014] In some embodiments, the door protrusion and the base plate protrusion have the same shape.

[0015] In one embodiment, the size-matching system is configured to secure a wafer cassette within an interior space of a closed pod. The interior space is defined by one or more side walls, a closed end, and an open end that is closed by a door of the closed pod. The size-matching system includes a base plate configured to be disposed within the interior space between the wafer cassette and the door, and a biasing member configured to be disposed in compression within the interior space between the wafer cassette and the closed end of the pod. The compressed biasing member is configured to press the wafer cassette and the base plate against the door.

[0016] The base plate has a top, a bottom, and at least one of a protrusion extending from the top of the base plate and a notch in the bottom of the base plate, the protrusion configured to extend into a slot in a wafer cassette to couple the base plate to the wafer cassette, and the notch configured to receive a protrusion on a door to couple the base plate to the door.

[0017] In some embodiments, the base plate includes a notch.

[0018] In some embodiments, the base plate includes a protrusion and a notch. [Brief description of the drawings]

[0019] [Figure 1] FIG. 2 is an exploded view of an embodiment of a wafer container. [Diagram 2] FIG. 1 is a top perspective view of an embodiment of a base plate for a wafer container. [Diagram 3] FIG. 3 is a bottom perspective view of the base plate of FIG. 2 according to one embodiment. [Figure 4] FIG. 3 is an enlarged view of a portion of the base plate of FIG. 2, according to one embodiment. [Figure 5A] 1 is a front perspective view of an embodiment of a biasing member for a wafer container. [Figure 5B] FIG. 5B is a side view of the biasing member in FIG. 5A according to an embodiment. [Figure 6] FIG. 13 is a bottom view of an embodiment of a wafer cassette for a wafer container. [Figure 7] FIG. 13 is a bottom view of an embodiment of a pod for a wafer container. [Figure 8] 2 is a cross-sectional view of the wafer container of FIG. 1 according to one embodiment. [Figure 9A] FIG. 9 is a cross-sectional view of the coupled base plate and wafer cassette as shown in FIG. 8 according to one embodiment. [Figure 9B] FIG. 9 is a cross-sectional view of the coupled base plate and wafer cassette as shown in FIG. 8 according to one embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0020] Like numbers refer to like features.

[0021] Detailed Description The present disclosure generally relates to securing a wafer cassette within a wafer pod of a wafer container. Wafer containers are used to transport substrates, such as during semiconductor manufacturing. For example, substrates in the form of wafers can be processed to form semiconductor devices. More specifically, the present disclosure relates to a system having a base plate and a biasing member for securing a wafer cassette within a wafer pod. In some embodiments, the wafer container when assembled includes a base plate and a biasing member for securing a smaller wafer cassette with a larger wafer pod.

[0022] 1 is an exploded view of an embodiment of a wafer container 1. The wafer container 1 includes a pod 10, a door 30, a wafer cassette 40, a base plate 60, and biasing members 80A, 80B. When assembled, the wafer cassette 40 is contained within an interior space 12 defined by the pod 10 and the door 30.

[0023] In one embodiment, the size matching system includes a base plate 60 and one or more biasing members 80A, 80B. The size matching system is configured to secure the wafer cassette 40 within the pod 10. The base plate 60 is configured to limit horizontal movement of the wafer cassette 40 relative to the pod 10, while the one or more biasing members 80A, 80B are configured to limit vertical movement of the wafer cassette 40 relative to the pod 10. The size matching system may be used to adapt a pod (e.g., the pod 10) such that a smaller wafer cassette (e.g., the wafer cassette 40) may be safely and securely transported within the pod. For example, the pod may be configured to safely and securely transport a first size wafer cassette, and the size matching system may be used to adapt the pod such that a second, smaller size wafer cassette (e.g., the second wafer cassette has a size smaller than the first wafer cassette) may be safely and securely transported.

[0024] Wafer container 1 may be any such container suitable for holding one or more wafers, such as a Standard Mechanical Interface (SMIF) pod. Wafer container 1 may be used to hold one or more wafers (not shown), for example, during processing, transport, and / or storage of semiconductor wafers.

[0025] Wafer cassette 40 is a container having an interior space configured to store one or more wafers (not shown), such as semiconductor wafers. The one or more wafers may each be held within one or more wafer supports extending from the walls of wafer cassette 40. For example, wafer cassette 40 may include a number of shelves 42, each configured to support a corresponding wafer. In one embodiment, pod 40 is configured to hold a first wafer cassette (not shown) having shelves configured to hold a first size wafer (e.g., 200 mm wafers, etc.), and wafer cassette 40 is configured to hold a smaller size wafer (e.g., 150 mm wafers, etc.).

[0026] The pod 10 includes one or more side walls 14, a closed end 16, and an open end 18 (not well visible in FIG. 1 ) opposite the closed end 16. The one or more side walls 14 can be any number and arrangement of side walls forming a continuous wall such that the one or more side walls 14, together with the closed end 16, define the interior space 12 when the open end 18 is closed by the door 30. In some embodiments, there is one side wall 14 that is a continuous curved wall. In some embodiments, the one or more side walls 14 are four side walls forming a rectangular or square shape. When the door 30 is attached thereby closing the open end 18, the pod 10 and door 30 define the interior space 12 configured to receive the wafer cassette 40, the base plate 60, and the biasing members 80A, 80B.

[0027] The door 30 is configured to close the open end 18 of the pod 10. The door 30 may have a shape generally similar to that defined by the one or more side walls 14 of the pod 10. The door 30 may include one or more engagement features for joining the door 30 to the pod 10 to enclose the wafer container 1 (e.g., enclosing the interior space 12). The door 30 may have a plane defined by its length and width. The internal configuration of the assembled wafer container 1 is discussed in more detail below.

[0028] The door 30 includes an inwardly facing surface 32. The inwardly facing surface 32 of the door 30 faces toward the interior space 12 of the wafer container 1 when the pod 10 is closed with the door 30. The inwardly facing surface 32 can face toward the closed end 16 of the pod 10. The door 30 includes a protrusion 34-1 extending from the inwardly facing surface 32 of the door 30. When the pod 10 is closed with the door 30, the protrusions 34-1, 34-2 extend from the inwardly facing surface 32 into the interior space 12. For example, the protrusions 34-1, 34-2 can extend in an upward direction from the inwardly facing surface 32 (e.g., extend in a vertical direction D1 toward the closed end 16 of the pod 10).

[0029] In some embodiments, the protrusions 34-1, 34-2 are configured to directly engage with a wafer cassette (not shown) of a larger size than the wafer cassette 40. For example, the larger size wafer cassette described above may have a width larger than the wafer cassette 40 to carry wafers having a larger width than the wafer cassette 40 (e.g., the larger size wafer cassette is sized to carry 200 mm wafers, while the wafer cassette 40 is sized to carry smaller wafers, such as 150 mm wafers, 100 mm wafers, etc.). When the wafer container 1 is assembled, the base plate 60 is coupled to the door 30 via at least one protrusion 34-1 of the door 30. In some embodiments, the door 30 may include one or more of the protrusions 34-1, 34-2. The coupling of the door 30 to the base plate 60 is discussed in more detail below.

[0030] The wafer cassette 40 includes a top wall 44 and a base 48 opposite the top wall 44. The top wall 44 and the base 48 may define the top and bottom, respectively, of the wafer cassette 40. The top wall 44 includes an upper surface 46. When the wafer container 1 is assembled, the upper surface 46 of the top wall 44 of the wafer cassette 40 faces toward the closed end 16 of the pod 10. For example, the upper surface 46 of the top wall 44 is oriented in a vertical direction D1.

[0031] 2 is a top perspective view of a base plate 60, according to an embodiment. The base plate 60 includes a top 62 and a bottom 68 (not well visible in FIG. 1) opposite the top 62. The base plate 60 includes protrusions 64-1, 64-2 extending from the top 62 of the base plate 60. Each of the protrusions 64-1, 64-2 extends upward (e.g., in a vertical direction D1) from the top 62 of the base plate 60. In an embodiment, one or more of the protrusions 34-1 of the door 30 have the same shape as one or more of the protrusions 64-1 of the base plate 60 (see, e.g., FIG. 1). In an embodiment, the base plate 60 may include one or more protrusions 64-1, 64-2.

[0032] 2, the top 62 of the base plate 60 may also include one or more pads 66 for supporting the wafer cassette 40. The pads 66 may be attached to an upper surface of the base plate 60. When the wafer container 1 is assembled, the base 48 of the wafer cassette 40 rests on the one or more pads 66 on the top 62 of the base plate. For example, the pads 66 may provide a support surface for the top of the base plate 60 (excluding the protrusions 64-1, 64-2). The pads 66 may provide a cushion to reduce downward forces on the wafer cassette 40 and any wafer container therein.

[0033] 3 is a perspective view of a bottom 68 of the base plate 60. The base plate 60 includes one or more connectors 70 formed on the bottom 68 of the base plate 60. The one or more connectors 70 are configured to engage with one or more protrusions 34-1 of the door 30 to couple the door 30 and the base plate 60. In one embodiment, each connector 70 is configured to engage with a corresponding protrusion 34-1 of the door 30.

[0034] FIG. 4 is an enlarged view of one of the connectors 70 of FIG. 3. The bottom 68 of the base plate 60 includes notches 72. The notches 72 are formed in the connectors 70. The notches 72 are each configured to receive a protrusion 34-1 for connecting the door 30 and the base plate 60. The connector 70 and its corresponding protrusion 34-1 are engaged by the protrusion 34-1 extending into at least one of the notches 72 of the connector 70. When the wafer container 1 is assembled, the corresponding protrusion 34-1 extends into the at least one notch 72, connecting the protrusion 34-1 with the at least one notch 72. As shown in FIG. 4, the connector 70 of this embodiment includes six notches 72 for engaging the corresponding protrusions 34-1. In some embodiments, the connector 70 may include one or more notches 72. In some embodiments, the connector 70 may include a single notch 72. In one embodiment, the connector 70 may include two notches 72 disposed perpendicular to one another (eg, to limit movement along both the horizontal direction D2 and the orthogonal horizontal direction D3).

[0035] When the wafer container 1 is assembled, the door 30 and the base plate 60 are coupled together by one or more connectors 70 engaging with one or more of the protrusions 34-1, respectively. In particular, the door 30 and the base plate 60 are coupled in a lateral direction by at least one connector 70 engaging with the protrusion 34-1 of its corresponding door 30. The lateral coupling between the door 30 and the base plate 60 is a coupling that limits sliding movement between the door 30 and the base plate 60. For example, the lateral coupling provided by the connector 70 limits movement between the door 30 and the base plate 60 in at least one horizontal direction (e.g., in the direction of the horizontal direction D2, in the direction of the horizontal direction D3, etc.). In an embodiment, the connector 70 is configured to limit movement between the door 30 and the base plate 60 along each of the horizontal direction D2 and the second horizontal direction D3. In one embodiment, at least one of the connectors 70 is configured to engage with a protrusion 34-1 of its corresponding door 30 to limit movement between the door 30 and the base plate 60 along each of the horizontal direction D2 and the second horizontal direction D3.

[0036] As shown in FIG. 4, the notches 72 may have a width that gradually decreases over the length of the notches 72. For example, the width of the notches 72 gradually narrows from its opening. When the base plate 60 is pressed against the door 30, the projections 34-1 are forced into at least one notch 72 of the corresponding connector 70. The shape of the notches 72 is configured such that the projections 34-1 are forced into said at least one notch 72 when the base plate 60 is pressed against the door 30. Forcing the projections 34-1 into their corresponding notch or notches 72 advantageously retains the base plate 60 on the door 30 and prevents the base plate 60 from being unintentionally removed (e.g., uncoupled, etc.) from the door 30. For example, this prevents the base plate 60 from being inadvertently removed with the wafer cassette 40 when the wafer cassette 40 is lifted from the base plate 60.

[0037] The position of the protrusions 34-1 may be different in different embodiments of the door 30. For example, the pair of rearward protrusions 34-1 as shown in Figure 2 is in a first position. In another embodiment, the pair of rearward protrusions 34-1 may have a second position in which the protrusions are more widely spaced apart (e.g., the pair of rearward protrusions 34-1 in Figure 2 are more widely spaced apart in the horizontal direction D3).

[0038] 3 and 4 , a pair of connectors 70 (e.g., the rear pair of connectors 70) may each include a first opening 74 and a second opening 76. Each of the openings 74, 76 is formed with at least one notch 72. Each opening 74, 76 of the connectors 70 may include two or more notches 72, and at least one of the notches 70 may be shared by the openings 74, 76.

[0039] The pair of first openings 74 are positioned closer to each other than the pair of second openings 76 (e.g., the distance between the two first openings 74 in the horizontal direction D1 is smaller than the distance between the two second openings 76 in the horizontal direction D1). The first openings 74 are positioned such that they engage with a door having a set of rearward projections in a first position (e.g., projections 34-1 as positioned in FIG. 2). The second openings 76 are positioned such that they engage with a door having a pair of rearward projections in a second position (e.g., a door embodiment having projections 34-1 spaced wider apart in the horizontal direction D3 than shown in FIG. 2). The two pairs of openings 74, 76 allow the base plate 60 to be used with two different embodiments of the door 30 (e.g., a first door embodiment having closely spaced projections and a second door embodiment having more widely spaced projections).

[0040] FIG. 5A is a front perspective view of an embodiment of a biasing member 80A. FIG. 5B is a side view of the biasing member 80A. The biasing member 80A includes a first end 82A, a second end 84A, a first resilient flexure 86A, and a second resilient flexure 88A. The second end 84A is opposite the first end 82A along a length L1 of the biasing member 80A. The length L1 of the biasing member 80A extends from its first end 82A to its second end 84A. When attached to the pod 10, the length L1 of the biasing member 80A extends along a vertical direction D1.

[0041] The first end 82A is connected to the second end 84A through a first elastic flexure 86A and a second elastic flexure 88A. For example, the first end 82A is connected to the second end 84A through a continuous first elastic flexure 86A and a second elastic flexure 88A. The first elastic flexure 86A is between the first end 82A and the second elastic flexure 88A. The second elastic flexure 88A is between the first elastic flexure 86A and the second end 84A.

[0042] The first resilient flexure 86A has a bend angle α1 and the second resilient flexure 88A has a bend angle α2. The biasing member 80A is configured to be compressed when its second end 84A is forced upward. For example, the biasing member 80A is configured to be compressed by a force F1 applied to its second end 84A in a vertical direction D1. The length L1 of the biasing member 80A decreases as it is compressed. Compression reduces the bend angle α1 of the first resilient flexure 86A and increases the bend angle α2 of the second resilient flexure 88A. In one embodiment, the biasing member 80A compresses by folding its first resilient flexure 86A and expanding its second resilient flexure 88A. The biasing member 80A is fabricated from a resilient flexible polymer. The polymer of biasing member 80A is configured to allow bending of resilient flexures 86A, 88A while having the resilience to return resilient flexures 86A, 88A to their original shapes (e.g., original flex angle α1, original flex angle α2, etc.) when biasing member 80A is no longer in an uncompressed state. The biasing member may be fabricated, for example, but not limited to, polycarbonate. In some embodiments, the entire biasing member 80A may be formed (e.g., molded) from a single material.

[0043] When biasing member 80A is compressed, it is configured to exert a downward bias. For example, second end 84A of compressed biasing member 80A exerts a force F2 in a vertically downward direction D4, which is opposite to the vertically upward direction D1. For example, the downward force F2 is caused by taut resilient flexures 86A, 88A attempting to return to their uncompressed shape.

[0044] The biasing member 80A includes at least one rigid support 92A extending along the length L1 of the biasing member 80A. The at least one rigid support 92A can be provided between the first end 82A and the first resilient flexure 86A. The portion of the biasing member 80A extending from the first end 82A to the first resilient flexure 86A includes the at least one rigid support 92A and is configured to have rigidity. For example, the portion of the biasing member 80A has a rigid structure and is configured not to bend when the biasing member 80A is compressed. In an embodiment, the biasing member 90A can be fabricated (e.g., molded) from a single material, and the one or more rigid supports 92A can provide rigidity to that portion of the biasing member 90A.

[0045] The biasing member 80A also includes a pair of ribs 90A. The ribs 90A are on either side of the biasing member 80A and extend along the length L1 of the biasing member 80A. The ribs 90A may be provided on a first end 82A of the biasing member 80A. The ribs 90A are positioned between the first end 82A and the first resilient flexure 86A of the biasing member 80A. The ribs 90A are each configured to slide into a corresponding channel 22A (shown in FIGS. 7 and 8 ) of the pod 10. The biasing member 80A may be attached to the pod 10 by disposing each of the ribs 90A in a corresponding channel 22A of the pod 10. Attachment of the biasing member 80A is discussed in more detail below.

[0046] FIG. 6 is a bottom view of the wafer cassette 40. The base 48 of the wafer cassette 40 includes a lower surface 50 and slots 52-1, 52-2. The slots 52-1, 52-2 are formed in the bottom of the wafer cassette 40. The slots 52-1, 52-2 are formed by one or more side walls. In this embodiment, the wafer cassette 40 includes two first slots 52-1 and two second slots 52-1. Each first slot 52-1 is defined by a plurality of side walls 54-1 extending from the lower surface 50 of the base plate 48. As shown in FIG. 6, each slot 52-1 may also include an open side 56-1. For example, along a horizontal plane, each first slot 52-1 is surrounded by a plurality of side walls 54-1 and an open side 56-1.

[0047] Each second slot 52-2 is defined by a plurality of side walls 54-2. As shown in FIG. 6, each slot 52-2 may also include an open side 56-2. For example, along a horizontal plane, each first slot 52-2 is surrounded by a plurality of side walls 54-2 and an open side 56-2. The base 48 may include a protrusion 58 that provides at least one of the side walls 54-2 of each of the two second slots 52-2 (e.g., the protrusion 58 provides the side wall 54-2 of the first one of the second slots 52-2 and the side wall 54-2 of the second one of the second slots 52-2). In an embodiment, the protrusion 58 may be a wall that extends vertically between the slots 52-2. The first slot 52-1 and the second slot 52-2 may overlap in a vertical direction (e.g., along a direction into the page of FIG. 6, along the vertical direction D1 of FIG. 1).

[0048] 7 is a bottom view of the pod 10. The pod 10 includes a closed end 16, an open end 18, and one or more side walls 14. The pod 10 may also include channels 22A, 22B for attaching the biasing members 80A, 80B to the pod 10. The closed end 16 of the pod 10 includes an inwardly facing surface 20 and the channels 22A, 22B. The inwardly facing surface 20 faces the interior space 12 of the wafer container 1. Each of the channels 22A, 22B extends from the inwardly facing surface 20 of the closed end 16. For example, each channel 22A, 22B may extend in a vertical direction D4 from the inwardly facing surface 20 of the closed end 16 toward the open end 18 of the pod 10 (see, for example, FIG. 8).

[0049] The pod 10 may include a pair of channels 22A for a first biasing member 80A and a pair of channels 22B for a second biasing member 80A. For example, each rib 90A of the biasing member 80A is disposed in a corresponding one of the channels 22A. The biasing member 80A may be attached to the pod 10 by sliding its first end 82A between two channels 22A. Each rib 90A on the first end 82A of the biasing member 80A slides into the corresponding channel 22A. The first end 82A of the biasing member 80A is disposed between its corresponding pair of channels 22A. The biasing member 80A has at least one rib 90A disposed in its corresponding slot 22A of the pod 10 for coupling the biasing member 80A to the pod 10. In one embodiment, the biasing member 80A is retained within the channel 22A by being press-fit between the two channels 22A.

[0050] The attachment provided by the channels 22A may be configured to limit sliding movement between the first end 82A of the biasing member 80A and the closed end 16 of the pod 10. For example, the attachment provided by the channels 22A, 22B may limit horizontal movement (e.g., in the horizontal direction D2, in the second horizontal direction D3, etc.) between the first end 82A of the biasing member 80A and the closed end 16 of the pod 10. The attachment between the channels 22A and their corresponding biasing members 80A may also be configured to retain the biasing members 80A on the pod 10 when the biasing members 80A are no longer compressed (e.g., when the pod 10 is opened to remove the wafer cassette 40 from the wafer container 1, etc.).

[0051] FIG. 8 is a bottom view of the wafer container 1. The cross section of FIG. 8 is taken along line IIX-IIX in FIG. 1 (when the wafer container 1 is assembled). When assembled, the open end 18 of the pod 10 is closed by the door 30, and the wafer cassette 40, the base plate 60, and the biasing members 80A, 80B are housed within the interior space 12. The door 30 can seal the open end 18 of the pod 10 and close the interior space 12. The wafer cassette 40 is stacked on the base plate 60 and the door 30, and is positioned between the base plate 60 and the compressed one or more biasing members 80A, 80B. The base plate 60 is stacked on the door 30, and is positioned between the door 30 and the wafer cassette 40. The base 48 of the wafer cassette 40 contacts the top 62 of the base plate 60, and the bottom 68 of the base plate 60 contacts the inwardly facing surface 32 of the door 30. For example, the exterior wall of the bottom 68 of the base plate 60 may contact the inwardly facing surface 32 of the door 30 .

[0052] When the wafer container 1 is assembled, the projections 64-1, 64-2 each extend toward the closed end 16 of the pod 10. Each projection 64-1, 64-2 is configured to extend into one of the slots 52-1, 52-2 (shown in FIGS. 6 and 8 ) in the base 48 of the wafer cassette 40. The engagement of the projections 64-1, 64-2 with the corresponding slots 52-1, 52-2 couples the base plate 60 to the wafer cassette 40. In particular, the projections 64-1, 64-2 extending into the corresponding slots 52-1, 52-2 couple the wafer cassette 40 to the base plate 60 in a lateral direction. The lateral coupling between the wafer cassette 40 and the base plate 60 is a coupling that limits sliding movement between the wafer cassette 40 and the base plate 60. For example, the lateral coupling provided by the protrusions 64-1, 64-2 limits movement between the wafer cassette 40 and the base plate 60 in at least one horizontal direction (e.g., in the horizontal direction D2, in the horizontal direction D3 perpendicular to the horizontal direction D2, etc.). In an embodiment, the protrusions 64-1, 64-2 are configured to limit movement between the wafer cassette 40 and the base plate 60 along each of the horizontal direction D2 and the second horizontal direction D3. In an embodiment, the protrusion 64-1 and one of its corresponding slots 52-1 are configured to limit movement along each of the horizontal direction D2 and the second horizontal direction D3. As shown in FIG. 8, the first protrusion 34-1 can extend through the slot 52-2 such that the second protrusion 64-1 reaches its corresponding slot 52-1.

[0053] As shown in FIG. 8 , the projection 34-1 of the door 30 is not vertically aligned with the slot 52-1 of the wafer cassette 40 (e.g., the projection 34-1 does not fit within the slot 52-1, the projection 34-1 does not abut a sidewall of the slot 52-1 to prevent horizontal movement). For example, the pod 10 may have originally been designed for use with a wafer cassette larger than the wafer cassette 40. The larger wafer cassette has a larger width (e.g., in the horizontal direction D3) than the wafer cassette 40. Reducing the wafer cassette 40 from the larger wafer cassette results in at least one of the slots 52-1 no longer being aligned with its corresponding projection 34-1. The base plate 60 and one or more biasing members 80A, 80B are configured to secure the wafer cassette 40 within the pod 10 and door 30 having a configuration incompatible with properly securing the wafer cassette 40 within the interior space 12 of the wafer container 1.

[0054] For brevity, the following description is directed to the first biasing member 80A. It should be appreciated that embodiments of the wafer container 1 including a second biasing member 80B may have a similar configuration as described for the first biasing member 80A. In the illustrated embodiment, two biasing members 80A, 80B may advantageously provide a more consistent downward pressure along the horizontal plane against the wafer cassette 40. In another embodiment, the wafer container 1 may be configured with a single biasing member 80A.

[0055] 8, biasing member 80A is positioned between the wafer cassette 40 and the closed end 16 of the pod 10. The biasing member 80A extends from the upper surface 46 of the top wall 44 of the cassette 40 to the inwardly facing surface 20 of the closed end 16 of the pod 10. In the closed pod 10, the biasing member 80A is compressed between the top wall 44 of the wafer cassette 40 and the closed end 16 of the pod 10. The biasing member 80A in the assembled wafer container 1 is configured to be disposed in compression between the top wall 44 of the wafer cassette 40 and the closed end 16 of the pod 10.

[0056] Closing the open end 18 of the pod 10 with the door 30 compresses the biasing member 80A. The height (e.g., in the vertical direction D1) of the coupled wafer cassette 40 and base plate 60 is greater than the vertical space between the second end 84A of the biasing member 80A (when uncompressed) and the closed door 30. When the door 30 is moved to its closed position as shown in FIG. 8 (e.g., moved vertically upward to seal the open end 18 of the pod 10), the stacked door 30, base plate 60, and wafer cassette 40 are forced upward against the biasing member 80A, compressing the biasing member 80A. The top wall 44 of the wafer cassette 40 pushes the second end 84A of the biasing member 80A vertically upward (e.g., in the vertical direction D1). The second end 84 A moves vertically upward toward the closed end 16 of the pod 10 and the biasing member 80 A is compressed between the wafer cassette 40 and the closed end 16 of the pod 10 .

[0057] A first end 82A of the biasing member 80A contacts the closed end 16 of the pod 10, and a second end 84A of the biasing member 80A contacts the top wall 44 of the wafer cassette 40. For example, the first end 82A contacts the inwardly facing surface 20 of the closed end 16, and the second end 84A contacts the upper surface 46 of the top wall 44 of the wafer cassette 40. The second end 84A contacts a flat surface of the wafer cassette 40 such that contact is minimized (e.g., contacts a flat portion of the upper surface 46 of the wafer cassette 40).

[0058] The compression tensions the biasing member 80A such that a downward force (e.g., downward force F2 in FIG. 5B ) is applied by the biasing member 80A. The compressed biasing member 80A presses down on the top wall 44 of the wafer cassette 40. The compressed biasing member 80A presses the wafer cassette 40 and base plate 60 against the inwardly facing surface 32 of the door 30. The compressed biasing member 80A presses the wafer cassette 40 against the top 62 of the base plate 60, which presses the base plate 60 against the inwardly facing surface 32 of the door 30. The wafer cassette 40 and base plate 60 are compressed along a vertical direction (e.g., in vertical direction D1, vertical direction D4) between the compressed biasing member 80A and the door 30.

[0059] The downward force applied by the compressed biasing member 80A generally prevents upward movement of the wafer cassette 40 and the base plate 60 (e.g., in the vertically upward direction D1). The downward force by the compressed biasing member 80A is also further configured to prevent the cassette 40 from decoupling from the base plate 60 and to prevent the base plate 60 from decoupling from the door 30. For example, the downward force is configured to prevent vertically upward movement of the cassette 40 sufficient to pull the protrusions 64-1, 64-2 of the base plate 60 out of their corresponding slots 52-1, 52-2 of the cassette 40. For example, the downward force is configured to prevent vertically upward movement of the cassette 40 and the base plate 60 relative to the door 30 sufficient to pull the protrusions 34-1 of the door 30 out of their corresponding notch or notches 72 of the base plate 60.

[0060] As discussed above, the base plate 60 is laterally coupled to each of the wafer cassette 40 and the door 30. The base plate 60 laterally couples the wafer cassette 40 to the door 30. The closed door 30 is joined to the pod 10 such that the base plate 60 couples to the wafer cassette 40 laterally relative to the pod 10 via the closed door 30. When the wafer container 1 is assembled, the base plate 60 can advantageously limit horizontal movement of the wafer cassette 40 relative to the pod 10 (e.g., in horizontal direction D2, in horizontal direction D3, etc.).

[0061] 9A is a cross-sectional view of the coupled wafer cassette 40 and base plate 60 of FIG. 8. The cross-sectional view of FIG. 9A is taken along line IX of FIG. A -IX A9A is a horizontal cross-sectional view along the line 9A. The protrusions 64-2 of the base plate 60 extend into the second slots 52-2 of the wafer cassette 40. Each of the protrusions 64-2 may be configured to contact at least one side wall 54-2 of the second slots 52-2 of the wafer cassette 40. The contact between the protrusions 64-2 and the slots 52-2 prevents horizontal movement between the wafer cassette 40 and the base plate 60 (e.g., in the first horizontal direction D2, in the second horizontal direction D3). As shown in FIG. 9A, the protrusions 58 of the wafer cassette 40 can fit into the space between the pair of protrusions 64-2. The protrusions 58 can directly contract each of the pair of protrusions 64-2. The protrusions 58 contact each of the pair of protrusions 64-2 to prevent movement in at least one horizontal direction (e.g., in the horizontal direction D2).

[0062] 9B is a cross-sectional view of the coupled wafer cassette 40 and base plate 60 of FIG. 8. The cross-sectional view of FIG. 9B is taken along line IX of FIG. B -IX B9B is a horizontal cross-sectional view along the line 9A. The protrusions 64-1 of the base plate 60 extend into the first slots 52-1 of the wafer cassette 40. Each of the protrusions 64-1 may be configured to contact at least one sidewall 54-1 of the first slots 52-1 of the wafer cassette 40. The contact between the protrusions 64-1 and the slots 52-1 prevents horizontal movement between the wafer cassette 40 and the base plate 60 (e.g., sliding of the wafer cassette 40 on the base plate 60, movement in the first horizontal direction D2, movement in the second horizontal direction D3). As shown in FIG. 9B, the second protrusion 62-1 is configured not to extend into the first slots 52-1 of the wafer cassette 50. For example, as shown in FIGS. 9A and 9B, the first protrusion 64-1 may have a height greater than the second protrusion 64-2 (e.g., in the vertical direction D1 as shown in FIG. 8). In general, the compressed biasing member 80A can advantageously limit vertical movement of the wafer cassette 40 relative to the pod 10, while the base plate 60 limits horizontal movement of the wafer cassette 40 relative to the pod 10. The biasing member 80A and base plate 60 limit movement of the wafer cassette 40 within the interior space 12 so as to allow safe and reliable transport of the wafer cassette 40 within the wafer container 1.

[0063] Aspects: Any of the embodiments 1 to 10 can be combined with any of the embodiments 11 to 18.

[0064] Embodiment 1. A wafer container comprising: a pod including one or more side walls, a closed end, an open end, and an interior space defined by the one or more side walls and the closed end; a door configured to close the open end of the pod; a wafer cassette including a top wall; a base plate; and a biasing member, wherein when the open end is closed by the door, the base plate is positioned between the door and the wafer cassette, and the biasing member is compressed between the top wall of the wafer cassette and the closed end of the pod, pressing the wafer cassette and the base plate against the door.

[0065] Aspect 2. The wafer container of aspect 1, wherein the biasing member presses the wafer cassette against the base plate when the open end is closed by the door.

[0066] Aspect 3. A wafer container as described in aspect 1 or 2, wherein the biasing member includes a first end, a second end opposite the first end, a first resilient flexure, and a second resilient flexure, the first end being connected to the second end via the first resilient flexure and the second resilient flexure.

[0067] Aspect 4. The wafer container of aspect 3, wherein when the opening is closed by the door, a first end of the biasing member contacts the pod and a second end of the biasing member contacts the wafer cassette.

[0068] Aspect 5. The wafer container of aspect 3 or 4, wherein compression of the biasing member decreases the bend angle of the first resilient flexure and increases the bend angle of the second resilient flexure.

[0069] Aspect 6. A wafer container according to any one of aspects 1 to 5, wherein the biasing member extends from the top wall of the wafer cassette to the closed end of the pod when the opening is closed by the door.

[0070] Embodiment 7. A wafer container as described in any one of embodiments 1 to 6, wherein the closed end of the pod includes an inwardly facing surface and a channel extending away from the inwardly facing surface of the closed end, the biasing member includes a rib extending along the length of the biasing member, and the biasing member is attached to the pod by the rib of the biasing member being disposed within the channel of the closed end.

[0071] Aspect 8. A wafer container according to any one of aspects 1 to 7, wherein the base plate includes a top and a protrusion extending from the top, and the base of the wafer cassette includes a slot, and when the opening is closed by the door, the protrusion extends into the slot to connect the wafer cassette and the base plate.

[0072] Embodiment 9. A wafer container as described in any one of embodiments 1 to 8, wherein the base plate includes a bottom having a notch and the door includes an inwardly facing surface and a protrusion extending from the inwardly facing surface, wherein when the opening is closed by the door, the protrusion extends into the notch to connect the base plate and the door.

[0073] Embodiment 10. A wafer container as described in embodiment 9, wherein the base plate includes a top and a protrusion extending from the top, the base of the wafer cassette includes a slot, and when the opening is closed by the door, the protrusion extends into the slot to connect the wafer cassette and the base plate, and the protrusion of the door and the protrusion of the base plate have the same shape.

[0074] Aspect 11. A size matching system for securing a wafer cassette within an interior space of a closed pod, the interior space being defined by one or more side walls, a closed end, and an open end closed by a door of the closed pod, the size matching system including: a base plate having a top and a bottom, the base plate configured to be disposed within the interior space between the wafer cassette and the door, the base plate including at least one of: a protrusion extending from the top of the base plate, the protrusion configured to extend into a slot of the wafer cassette to couple the base plate to the wafer cassette, and a notch at the bottom of the base plate, the notch configured to receive the protrusion of the door to couple the base plate to the door; and a biasing member configured to be disposed in compression within the interior space between the wafer cassette and the closed end of the pod, the biasing member in compression pressing the wafer cassette and the base plate against the door.

[0075] Aspect 12. The size matching system of aspect 11, wherein the biasing member is configured to press the wafer cassette against the base plate when disposed in compression within the interior space between the wafer cassette and the closed end of the pod.

[0076] Aspect 13. A size-fitting system as described in aspect 11 or 12, wherein the biasing member includes a first end, a second end opposite the first end, a first elastic flex portion, and a second elastic flex portion, and the first end is connected to the second end via the first elastic flex portion and the second elastic flex portion.

[0077] Aspect 14. The size matching system of aspect 13, wherein the biasing member is configured to be compressed and disposed between the wafer cassette and the closed end of the pod within the interior space such that a first end of the biasing member contacts the pod and a second end of the biasing member contacts the wafer cassette.

[0078] Aspect 15. The size-fitting system of aspect 13 or 14, wherein the biasing member is configured to compress to reduce a bending angle of the first resilient flexure and increase a bending angle of the second resilient flexure.

[0079] Aspect 16. A size-fitting system as described in any one of aspects 11 to 15, wherein the closed end of the pod includes an inward-facing surface and a channel extending away from the inward-facing surface of the closed end, the biasing member includes a rib extending along the length of the biasing member, and the biasing member is configured to be attached to the pod by sliding the rib of the biasing member into the channel of the closed end.

[0080] Aspect 17. A size-fitting system according to any one of aspects 11 to 16, wherein the base plate includes a notch.

[0081] Aspect 18. A size-fitting system according to any one of aspects 11 to 17, wherein the base plate comprises a protrusion and a notch.

[0082] The examples disclosed herein should be considered in all respects as illustrative and not restrictive. The scope of the invention is indicated not by the foregoing description but rather by the appended claims, and all changes that come within the meaning and range of equivalency of the claims are intended to be embraced therein.

Claims

1. a pod including one or more side walls, a closed end, an open end, and an interior space defined by the one or more side walls and the closed end; a door configured to close the open end of the pod; a wafer cassette including a top wall; A base plate; A biasing member, when the open end is closed by the door, the base plate is positioned between the door and the wafer cassette, and the biasing member is compressed between the top wall of the wafer cassette and the closed end of the pod to press the wafer cassette and the base plate against the door; the base plate includes a top and a protrusion extending from the top, the base of the wafer cassette includes a slot; when the open end is closed by the door, the protrusion of the base plate extends into the slot to connect the wafer cassette and the base plate; the base plate includes a bottom having a notch, and the door includes an inwardly facing surface and a protrusion extending from the inwardly facing surface; when the open end is closed by the door, the protrusion of the door extends into the notch to connect the base plate and the door; The protrusion of the door and the protrusion of the base plate have the same shape. Wafer container.

2. A wafer container as described in claim 1, wherein the biasing member includes a first end, a second end opposite the first end, a first elastic flex portion, and a second elastic flex portion, and the first end is connected to the second end via the first elastic flex portion and the second elastic flex portion.

3. The closed end of the pod includes an inwardly facing surface and a channel extending away from the inwardly facing surface of the closed end; 2. The wafer container of claim 1, wherein the biasing member includes a rib extending along a length of the biasing member, the biasing member being configured to be attached to the pod by sliding the rib of the biasing member into the channel in the closed end.

4. 1. A wafer container having a size-fitting system for securing a wafer cassette within an interior space of a closed pod, the interior space being defined by one or more side walls, a closed end, and an open end closed by a door of the closed pod, the size-fitting system comprising: a base plate having a top and a bottom and configured to be disposed within the interior space between the wafer cassette and the door, a protrusion extending from a top of the base plate, the protrusion configured to extend into a slot of the wafer cassette to couple the base plate to the wafer cassette; and a notch in the bottom of the base plate configured to receive a protrusion on the door to connect the base plate and the door. A base plate including at least one of a biasing member configured to be disposed in compression within the interior space between the wafer cassette and a closed end of the pod, the biasing member being compressed to bias the wafer cassette and the base plate against the door; Including, The protrusion of the door and the protrusion of the base plate have the same shape. Wafer container with size matching system.

5. 5. The wafer container having a size matching system of claim 4, wherein the biasing member includes a first end, a second end opposite the first end, a first resilient flexure, and a second resilient flexure, the first end being connected to the second end via the first resilient flexure and the second resilient flexure.

6. the closed end of the pod includes an inwardly facing surface and a channel extending away from the inwardly facing surface of the closed end; the biasing member includes a rib extending along a length of the biasing member, the biasing member being configured to be attached to the pod by sliding the rib of the biasing member into the channel in the closed end. A wafer container having the size matching system of claim 4.

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