Die Feeding Device

Abstract

To appropriately recognize a position of a die at a die aggregate on the basis of imaging data.SOLUTION: A die supply device comprises: a holding stage for holding a die aggregate formed by dicing a wafer on which a dicing sheet is pasted; a push-up device that has a fluorescent body and pushes up any die of the die aggregate held by the holding stage from below; an irradiation device that radiates light to the fluorescent body; and an imaging device that images the die aggregate held by the holding stage from above in a state in which the fluorescent body is irradiated with light by the irradiation device.SELECTED DRAWING: Figure 9

Description

[Technical field]

[0001] The present invention relates to a die supplying device that supplies dies from a die assembly formed by dicing a wafer with a dicing sheet attached thereto. [Background technology]

[0002] The following patent document describes a die supply device that supplies dies from a die assembly. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2007-322425 A Summary of the Invention [Problem to be solved by the invention]

[0004] An object of the present specification is to appropriately recognize the positions of dies in a die assembly based on imaging data in order to appropriately supply dies from the die assembly. [Means for solving the problem]

[0005] In order to solve the above problems, this specification discloses a die supply device that includes a holding stage that holds a die assembly formed by dicing a wafer with a dicing sheet attached thereto, a push-up device that has a phosphor and pushes up any die of the die assembly held on the holding stage from below, an irradiation device that irradiates light toward the phosphor, and an imaging device that images the die assembly held on the holding stage from above while light is irradiated onto the phosphor by the irradiation device. Effect of the Invention

[0006] In the present disclosure, a push-up device is disposed below the die assembly, and the die assembly is imaged from above by an imaging device while a phosphor included in the push-up device is irradiated with light. In this way, when the die assembly is imaged, the lower surface of the die assembly is illuminated by the light emitted by the phosphor, and the position of the die in the die assembly can be appropriately recognized based on the image data. [Brief description of the drawings]

[0007] [Figure 1] FIG. 2 is a perspective view showing an electronic component mounting machine. [Diagram 2] FIG. 2 is a plan view showing the electronic component mounting machine. [Diagram 3] FIG. [Figure 4] FIG. [Diagram 5] FIG. 2 is a block diagram showing a control device. [Figure 6] 13 is a diagram showing a die assembly in which the surface of the die opposite to the electrode surface is attached to a dicing sheet. FIG. [Figure 7] 13 is a diagram showing a die assembly in which the electrode surfaces of the dies are attached to a dicing sheet. FIG. [Figure 8] FIG. 1 is a diagram showing an image based on imaging data of a die assembly captured by a conventional method. [Figure 9] 13 is a diagram showing a die assembly imaged by a camera in a state where light is irradiated onto a phosphor of the push-up device; FIG. [Figure 10] FIG. 13 is a diagram showing an image based on imaging data of a die assembly imaged by the technique of the present specification. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings as modes for carrying out the present invention.

[0009] 1 and 2 show an electronic component mounting machine 10 according to an embodiment of the present invention. FIG. 1 is a perspective view of the electronic component mounting machine 10, and FIG. 2 is a view showing the electronic component mounting machine 10 from an above perspective with a cover 12 and the like removed. The electronic component mounting machine 10 is a work machine for mounting electronic components on a circuit board. The electronic component mounting machine 10 includes a conveying device 20, a mounting head moving device (hereinafter sometimes abbreviated as "moving device") 22, a mounting head 24, and a die supplying device 30. In the following description, the width direction of the electronic component mounting machine 10 is referred to as the X-axis direction, and the horizontal direction perpendicular to that direction is referred to as the Y-axis direction.

[0010] The transfer device 20 includes two conveyor devices 40 and 42. The two conveyor devices 40 and 42 are disposed on a base 46 so as to be parallel to each other and extend in the X-axis direction. Each of the two conveyor devices 40 and 42 transfers a circuit board in the X-axis direction by being driven by an electromagnetic motor (see FIG. 5) 47. The circuit board is fixedly held at a predetermined position by a board holding device 48 (see FIG. 5).

[0011] The moving device 22 has a pair of Y-axis guide rails 50 extending in the Y-axis direction, and an X-axis guide rail 52 extending in the X-axis direction. The X-axis guide rail 52 is suspended on the pair of Y-axis guide rails 50. The X-axis guide rail 52 moves to an arbitrary position in the Y-axis direction by driving an electromagnetic motor (see FIG. 5) 53. The X-axis guide rail 52 also holds a slider 54 movable along its own axis. The slider 54 moves to an arbitrary position in the X-axis direction by driving an electromagnetic motor (see FIG. 5) 55. The mounting head 24 is attached to the slider 54. With this structure, the mounting head 24 moves to an arbitrary position on the base 46.

[0012] The mounting head 24 mounts electronic components on the circuit board. The mounting head 24 has a suction nozzle 60 provided on its lower end surface. The suction nozzle 60 is connected to a positive / negative pressure supply device (see FIG. 5) 62 via negative pressure air and positive pressure air passages. The suction nozzle 60 sucks and holds the electronic component by negative pressure, and releases the held electronic component by positive pressure. The mounting head 24 also has a nozzle lifting device (see FIG. 5) 64 that raises and lowers the suction nozzle 60. The nozzle lifting device 64 allows the mounting head 24 to change the vertical position of the electronic component it holds. The suction nozzle 60 is detachable from the mounting head 24.

[0013] The die supplying device 30 is provided at one end of the base 46 in the Y-axis direction. More specifically, a recessed storage section 86 is formed at the edge of the base 46, and a part of the die supplying device 30 is stored in the storage section 86. As shown in FIG. 3, the die supplying device 30 supplies dies 92 from a die assembly 90. The die assembly 90 is formed by dicing a wafer to which a dicing sheet is attached. The die assembly 90 is sometimes simply called a "wafer," and the die 92 is sometimes called a "chip."

[0014] The die supply device 30 has a main frame 100, a die assembly accommodating device 102, a die assembly holding device 104, a pick-up head 106, a pick-up head moving device (hereinafter sometimes abbreviated as "moving device") 108, and a die push-up unit (see Figure 4) 110.

[0015] The upper surface of the main frame 100 is generally rectangular, and a die assembly holding device 104, a pickup head 106, and a moving device 108 are disposed on the upper surface. Then, the main frame 100 is stored in the storage section 86, whereby the die supply device 30 is attached to the base 46.

[0016] The die assembly accommodating device 102 is connected to an end of the main frame 100 in the Y-axis direction, and includes a rack 111 and a lift table 112. The rack 111 is disposed on the lift table 112, and a plurality of die assemblies 90 are accommodated inside the rack 111 in a stacked state. The plurality of die assemblies 90 are moved in the vertical direction by lifting and lowering the lift table 112 by a table lift mechanism (see FIG. 5) 115. Then, the die assembly 90 located at a predetermined height is pulled out onto the die assembly holding device 104. The die assemblies 90 are available in various sizes, such as 6-inch size and 8-inch size, and the die assemblies 90 of various sizes can be accommodated in the rack 111.

[0017] As shown in Figs. 2 and 3, the die assembly holding device 104 has a pair of guide rails 116 and a holding frame 117. The pair of guide rails 116 are disposed on the main frame 100 so as to extend in the Y-axis direction, and support the holding frame 117 so as to be movable in the Y-axis direction. The holding frame 117 is moved in the Y-axis direction along the guide rails 116 by a frame moving mechanism (see Fig. 5) 118. The die assembly 90 drawn out from the die assembly accommodating device 102 is placed on the holding frame 117. A fixing mechanism 119 is disposed on the holding frame 117. The fixing mechanism 119 fixes the die assembly 90 at two opposing sides of the die assembly 90 and positions it on the upper surface of the holding frame 117.

[0018] The pick-up head 106 picks up the die 92 from the die assembly 90, and has a plurality of suction nozzles 120 attached to its underside. Each suction nozzle 120 is connected to a positive / negative pressure supply device (see FIG. 5) 121. The suction nozzle 120 suctions and holds the die 92 by negative pressure, and releases the held die 92 by positive pressure. The pick-up head 106 can be inverted up and down so that the nozzle opening of the suction nozzle 120 faces upward. This allows the die 92 suctioned and held by the suction nozzle 120 to be supplied to the upper part of the pick-up head 106. The pick-up head 106 also has an elevator device (see FIG. 5) 122, and the operation of the elevator device 122 causes each suction nozzle 120 to rise and fall.

[0019] The moving device 108 has a pair of Y-axis guide rails 123 extending in the Y-axis direction and an X-axis guide rail 124 extending in the X-axis direction. The X-axis guide rail 124 is suspended on the pair of Y-axis guide rails 123. The X-axis guide rail 124 is moved to an arbitrary position in the Y-axis direction by the drive of an electromagnetic motor (see FIG. 5) 125. The X-axis guide rail 124 also holds a slider 126 movable along its own axis. The slider 126 is moved to an arbitrary position in the X-axis direction by the drive of an electromagnetic motor (see FIG. 5) 127. The pickup head 106 is attached to the slider 126. With this structure, the pickup head 106 moves to an arbitrary position on the main frame 100. A camera (see FIG. 5) 128 is attached to the lower end surface of the slider 126 in a state facing downward. As a result, the camera 128 captures an image of an arbitrary position on the main frame 100.

[0020] Further, a clamp 129 is attached to the back surface of the X-axis guide rail 124 of the moving device 108. The clamp 129 grips the die assembly 90 accommodated in the rack 111 of the die assembly accommodating device 102. Then, by moving the X-axis guide rail 124 in the Y-axis direction, the die assembly 90 gripped by the clamp 129 moves in the Y-axis direction. As a result, the die assembly 90 accommodated in the rack 111 is pulled out onto the holding frame 117.

[0021] The die push-up unit 110 is disposed below the holding frame 117 of the die assembly holding device 104, and includes a push-up device (see FIG. 4) 130, a lifting device (see FIG. 5) 132, and a moving device (see FIG. 5) 134. As shown in FIG. 4, the push-up device 130 includes a housing 136, a lid 138, a rod holder 140, a lifting rod 142, a push-up pin 144, and a pin holder 146. The housing 136 is generally cylindrical and disposed below the holding frame 117 in an upright position. The lid 138 is generally cylindrical with a lid and covers the opening at the upper end of the housing 136. A through hole 148 is formed in the center of the lid of the lid 138.

[0022] The rod holder 140 has a cylindrical shape and is fixed in an upright state inside the housing 136. The lift rod 142 is held in the rod holder 140 so as to be movable in the vertical direction, and is raised and lowered by the drive of an electromagnetic motor (see FIG. 5) 149. The upper end of the lift rod 142 is located inside the cover 138, and a push pin 144 is fixed to the upper end of the lift rod 142 coaxially with the lift rod 142. Therefore, the push pin 144 also rises and falls as the lift rod 142 rises and falls. The pin holder 146 has a generally short cylindrical shape and is fixed to the upper end of the rod holder 140 so as to be coaxial with the rod holder 140. The push pin 144 is held in the rod holder 140 so as to be movable in the vertical direction. The upper end of the push-up pin 144 held by the rod holder 140 extends upward from the upper end surface of the rod holder 140, and the upper end of the push-up pin 144 is inserted into a through hole 148 of the lid body 138. When the lift-up rod 142 is in the lowest position, the upper end surface of the push-up pin 144 coincides with the upper end surface of the lid body 138 in the vertical direction. In other words, the upper end surface of the push-up pin 144 and the upper end surface of the lid body 138 are flush with each other. As the lift-up rod 142 rises, the upper end of the push-up pin 144 protrudes from the upper end surface of the lid body 138.

[0023] Further, the lifting device 132 raises and lowers the push-up device 130 in the up-down direction. The moving device 134 moves the push-up device 130 to any position in the X-axis direction and Y-axis direction below the die assembly holding device 104. With this structure, the die push-up unit 110, which will be described in detail later, pushes up any die of the die assembly 90 held by the die assembly holding device 104 with the push-up pins 144.

[0024] As shown in FIG. 5, the electronic component mounting machine 10 includes a control device 150. The control device 150 includes a controller 152, a plurality of drive circuits 154, and an image processing device 156. The plurality of drive circuits 154 are connected to the electromagnetic motors 47, 53, 55, 125, 127, 149, the substrate holding device 48, the positive and negative pressure supply devices 62, 121, the nozzle lifting device 64, the table lifting mechanism 115, the frame moving mechanism 118, the lifting devices 122, 132, and the moving device 134. The controller 152 includes a CPU, a ROM, a RAM, and the like, and is mainly a computer, and is connected to the plurality of drive circuits 154. As a result, the operation of the transport device 20, the moving device 22, and the like is controlled by the controller 152. Furthermore, the controller 152 is also connected to the image processing device 156. The image processing device 156 is a device for processing image data captured by the camera 128. As a result, the controller 152 obtains various information from the image data.

[0025] With the above-mentioned configuration, the electronic component mounting machine 10 performs a mounting operation of mounting the die 92 on the circuit board. Specifically, the circuit board is transported to a work position by a command from the controller 152 of the control device 150, and the circuit board is fixedly held at that position. In addition, the die supply device 30 supplies the die 92 using the pickup head 106.

[0026] Specifically, the lift table 112 is raised and lowered by a command from the controller 152, and any one of the die assemblies 90 housed in the rack 111 is moved to a position facing the clamp 129. Then, the die assembly 90 is gripped by the clamp 129, and the X-axis guide rail 124 is moved in the Y-axis direction. As a result, the die assembly 90 gripped by the clamp 129 is pulled out onto the holding frame 117. The die assembly 90 pulled out from the rack 111 is positioned on the holding frame 117 shown by the solid line in FIG. 2. The die assembly 90 pulled out onto the holding frame 117 is fixed by the fixing mechanism 119. Next, the camera 128 moves above the die assembly 90, and the die assembly 90 is imaged by the camera 128. Then, the controller 152 calculates the position of each of the multiple dies 92 in the die assembly 90 based on the image data. Next, the pick-up head 106 moves to above the die 92 to be picked up, and the die 92 is sucked and held by the suction nozzle 120 .

[0027] At this time, the push-up device 130 moves to below the die 92 sucked and held by the suction nozzle 120 of the pickup head 106, and the lifting rod 142 rises at that position. As a result, the die 92 is lifted and peeled off from the dicing sheet, thereby supporting the pick-up of the die 92 by the suction nozzle 120. In detail, the push-up device 130 moves to below the die 92 to be picked up by the operation of the moving device 134. Then, the push-up device 130 rises by the operation of the lifting device 132 until the cover body 138 of the push-up device 130 comes into contact with the lower surface of the die assembly 90 held by the holding frame 117. Next, with the die 92 sucked and held by the suction nozzle 120, the lifting rod 142 rises. As a result, the die 92 sucked and held by the suction nozzle 120 is lifted by the push-up pin 144, and the die 92 is peeled off from the dicing sheet. Then, the suction nozzle 120 moves up, whereby the die 92 is picked up by the suction nozzle 120 .

[0028] This allows the die 92 attached to the dicing sheet to be appropriately picked up by the suction nozzle 120. When the lifting rod 142 rises, that is, when the push-up pins 144 lift the die 92, the suction nozzle 120 rises by an amount corresponding to the amount of lifting of the lifting rod 142. This suppresses the load on the die 92 sandwiched between the push-up pins 144 and the suction nozzle 120. The amount of lifting of the lifting rod 142, that is, the amount of lifting of the die 92 by the push-up pins 144, is set according to the adhesive strength of the dicing sheet, and is about 0.1 to 0.5 mm.

[0029] Next, when the die 92 is picked up by the suction nozzle 120, the pickup head 106 is inverted up and down. As a result, the die 92 suction-held by the suction nozzle 120 is supplied above the pickup head 106. When the die 92 is supplied above the pickup head 106, the mounting head 24 moves above the pickup head 106, and the suction nozzle 60 suction-holds the die 92. In other words, the die 92 is transferred from the suction nozzle 120 of the pickup head 106 to the suction nozzle 60 of the mounting head 24. Then, the mounting head 24 moves above the circuit board, and the die 92 is mounted on the circuit board.

[0030] Moreover, the die supplying device 30 can directly supply the die 92 without using the pick-up head 106. More specifically, after the die assembly 90 is pulled out onto the holding frame 117 from the rack 111, the holding frame 117 is moved in the Y-axis direction. As a result, the die assembly 90 is positioned above the holding frame 117 as shown by the dotted line in FIG. 2. Then, the mounting head 24 moves above the die assembly 90, and the die 92 is picked up by the suction nozzle 60, whereby the die 92 is suction-held. When the die 92 is picked up by the suction nozzle 60, the die 92 is pushed up by the die push-up unit 110 in the same manner as when the die 92 is picked up by the suction nozzle 120. Then, the die 92 picked up by the suction nozzle 60 is mounted on the circuit board.

[0031] In this way, the die supplying device 30 can supply the die 92 by two methods, and the supplied die 92 is held by the suction nozzle 60 of the mounting head 24 and mounted on the circuit board. That is, in the first supplying method, the die 92 is picked up from the die assembly 90 by the suction nozzle 120 of the pick-up head 106, and the pick-up head 106 is inverted up and down, so that the die 92 is supplied to the suction nozzle 60 of the mounting head 24 while being held by the suction nozzle 120. In the second supplying method, the die 92 is supplied to the suction nozzle 60 of the mounting head 24 directly from the die assembly 90.

[0032] Therefore, when the die 92 is supplied while being held by the pickup head 106, the die 92 is supplied to the suction nozzle 60 of the mounting head 24 with the position of the die 92 in the die assembly 90 inverted up and down. Then, since the die 92 held by the suction nozzle 60 of the mounting head 24 is mounted on a circuit board, the suction nozzle 60 of the mounting head 24 needs to hold the die 92 with the electrode surface facing downward. Therefore, in the die 92 supplied while being held by the pickup head 106, as shown in FIG. 6, the surface opposite to the electrode surface on which the electrodes 160 are arranged is attached to the dicing sheet 162, and the electrode surface faces upward. Therefore, when the suction nozzle 120 of the pickup head 106 holds the die 92 from the die assembly 90, the electrode surface of the die 92 faces upward. Then, when the pickup head 106 is inverted up and down, the electrode surface of the die 92 held by the suction nozzle 120 faces downward. As a result, when holding the die held by the pickup head 106, the suction nozzle 60 of the mounting head 24 can hold the die 92 in a position with the electrode surface facing downward.

[0033] On the other hand, when the die 92 is supplied directly from the die assembly 90 to the mounting head 24, the die 92 is held by the suction nozzle 60 of the mounting head 24 in the same orientation as the die 92 in the die assembly 90. Thus, the die 92 supplied directly from the die assembly 90 to the mounting head 24 has the electrode surface on which the electrodes 160 are arranged attached to the dicing sheet 162 in the die assembly 90, as shown in Fig. 7, and the surface opposite to the electrode surface faces upward. Therefore, when holding the die directly from the die assembly 90, the suction nozzle 60 of the mounting head 24 can hold the die 92 in an orientation with the electrode surface facing downward.

[0034] In this way, in the die supplying device 30, the die supplied while being held by the pickup head 106 has the surface opposite to the electrode surface in the die assembly 90 attached to the dicing sheet 162, and the electrode surface faces upward. Therefore, when the die assembly 90 is imaged by the camera 128 in order to calculate the position of the die in the die assembly 90, the electrode surface of the die in the die assembly 90 is imaged. Then, the position of the die in the die assembly 90 is calculated based on the image data of the electrode surface. At this time, the position of the electrode is recognized based on the image data, and the position of the die is calculated based on the position of the electrode. This allows the position of the die in the die assembly 90 to be properly calculated.

[0035] On the other hand, the die directly supplied from the die assembly 90 has its electrode surface attached to the dicing sheet 162 in the die assembly 90, and the surface opposite to the electrode surface faces upward. Therefore, when the die assembly 90 is imaged by the camera 128 in order to calculate the position of the die in the die assembly 90, the surface opposite to the electrode surface of the die in the die assembly 90 is imaged. Then, based on the image data of the surface opposite to the electrode surface, the position of the die in the die assembly 90 is calculated, but since the surface opposite to the electrode surface is generally made of only resin and is a flat surface, it is difficult to recognize the position of the die. In addition, since the gap between adjacent dies in the die assembly 90 is not so large, it is difficult to individually recognize each of the multiple dies in the die assembly 90. Specifically, for example, in an image based on the image data of the surface opposite to the electrode surface, as shown in FIG. 8, there are some places where the gap between adjacent dies 92 can be recognized, but there are also some places where the gap between adjacent dies 92 cannot be recognized. In this way, the positions of the dies 92 in the die assembly 90 cannot be calculated appropriately using imaging data of an image that includes areas where the gaps between adjacent dies 92 cannot be recognized.

[0036] For this reason, it is possible to adjust the illumination pattern when the die assembly 90 is imaged so that the gap between the adjacent dies 92 can be appropriately recognized based on the imaging data. Specifically, it is possible to image the die assembly 90 using a suitable illumination pattern from among illumination patterns using at least one of lateral illumination that irradiates light from the side of the die assembly 90 toward the die assembly 90 and epi-illumination that irradiates light from above the die assembly 90 toward the die assembly 90. However, when the die assembly 90 is imaged using an illumination pattern using only lateral illumination, it is difficult for light to enter the gap between the adjacent dies, so that the gap between the adjacent dies cannot be recognized, and the position of the die 92 in the die assembly 90 cannot be appropriately calculated. In addition, when the die assembly 90 is imaged using an irradiation pattern based only on epi-illumination, light is reflected from the entire surface of the die assembly 90, and the entire die assembly 90 becomes whitish, so that the gaps between adjacent dies cannot be recognized, and the position of the die 92 in the die assembly 90 may not be properly calculated. In addition, when the die assembly 90 is imaged using an irradiation pattern based on side illumination and epi-illumination, the brightness difference between the gaps between adjacent dies and the dies becomes small, so that the gaps between adjacent dies cannot be recognized, and the position of the die 92 in the die assembly 90 may not be properly calculated. Furthermore, in order to identify a suitable irradiation pattern from among the multiple irradiation patterns, the die assembly 90 must be imaged in all of the multiple irradiation patterns and the image data must be analyzed, which is very time-consuming and burdensome for the operator.

[0037] Also, it is possible to adjust the imaging conditions such as the shutter speed when the die assembly 90 is imaged so that the gap between the adjacent dies 92 can be appropriately recognized based on the imaging data. That is, for example, it is possible to change the shutter speed and image the die assembly 90 to identify the shutter speed at which the gap between the adjacent dies can be recognized. However, in order to identify one suitable shutter speed, it is necessary to image the die assembly 90 at different shutter speeds and analyze the imaging data, which is very time-consuming and burdensome for the operator.

[0038] In view of this, in the die supply device 30, as shown in Fig. 9, a side lighting device 180 is disposed to the side of the push-up device 130 disposed below the die assembly 90. A fluorescent seal is attached to the surface of the pin holder 146 disposed inside the push-up device 130. As a result, light is irradiated from the side lighting device 180 toward the pin holder 146, causing the fluorescent seal attached to the surface of the pin holder 146 to emit light, and the die assembly 90 is illuminated from below by the fluorescent seal, making it easier to recognize the gaps between adjacent dies in the die assembly 90.

[0039] In detail, a side illumination 180 is disposed on the side of the push-up device 130, and the side illumination 180 irradiates light toward the pin holder 146 disposed inside the push-up device 130. The pin holder 146 is disposed inside a lid 138 of the push-up device 130, and the lid 138 is formed of a semi-transparent (milky white) material such as resin. Therefore, the light irradiated from the side illumination 180 passes through the side surface of the lid 138 and is irradiated onto the pin holder 146. Then, the pin holder 146 emits light as the pin holder 146 emits light, and the light passes through the upper surface of the semi-transparent lid 138 that covers the pin holder 146, and illuminates the lower surface of the die assembly 90. At this time, light illuminating the bottom surface of the die assembly 90 passes through the dicing sheet 162 of the die assembly 90 and leaks out onto the top surface of the die assembly 90 through gaps between adjacent dies of the die assembly 90 .

[0040] Therefore, when the pin holder 146 is irradiated with light by the side illumination 180, the die assembly 90 is imaged by the camera 128 disposed above the die assembly 90, and light leaking from the gaps between adjacent dies of the die assembly 90 is imaged. As a result, the gaps between adjacent dies of the die assembly 90 can be appropriately recognized based on the image data of the die assembly 90. Specifically, in an image based on the image data of the die assembly 90 imaged in a state in which the pin holder 146 is irradiated with light by the side illumination 180, all of the gaps between adjacent dies 92 can be clearly recognized, as shown in FIG. 10. As a result, the position of the die 92 in the die assembly 90 can be appropriately calculated by using the image data of an image in which all of the gaps between adjacent dies 92 can be clearly recognized.

[0041] Furthermore, by capturing an image of the die assembly 90 while the pin holder 146 is illuminated with light by the side illumination 180, the gaps between adjacent dies 92 can be clearly recognized, and therefore there is no need to adjust the illumination pattern, shutter speed, and the like. In other words, the illumination pattern may be such that the pin holder 146 is illuminated with light by the side illumination 180, and the shutter speed may be a general shutter speed at which the light can be recognized. This allows the position of the die 92 in the die assembly 90 to be stably and appropriately calculated without imposing a burden on the operator.

[0042] In the above description, the die assembly 90 in which the electrode surface of the die is attached to the dicing sheet 162 is imaged by the camera 128 in a state where the pin holder 46 is irradiated with light. That is, as shown in FIG. 7, the die assembly 90 in a position where the surface opposite to the electrode surface faces upward is imaged by the camera 128 in a state where the pin holder 46 is irradiated with light. On the other hand, the die assembly 90 in which the surface opposite to the electrode surface of the die is attached to the dicing sheet 162 may be imaged by the camera 128 in a state where the pin holder 46 is irradiated with light. That is, as shown in FIG. 6, the die assembly 90 in a position where the electrode surface faces upward may be imaged by the camera 128 in a state where the pin holder 46 is irradiated with light. In this way, the die assembly 90 with the electrode surface facing upward is imaged by the camera 128 while the pin holder 46 is irradiated with light, and it is possible to recognize the gap between adjacent dies, not the electrodes 160 on the electrode surface, based on the image data, and calculate the position of the die in the die assembly 90. This makes it unnecessary to create image processing data for analyzing the position of the electrode based on the image data. Note that, when the die assembly 90 with the electrode surface facing downward is imaged, as described above, the fluorescent seal attached to the pin holder 146 is irradiated by the side illumination 180, but when the die assembly with the electrode surface facing upward is imaged, it may be irradiated by the epi-illumination. Incidentally, whether the die 92 is supplied from the die assembly with the electrode surface facing downward or from the die assembly with the electrode surface facing upward is specified in advance by the part data of the job. When the die 92 is supplied from a die assembly in which the electrode surface faces upward, the position of the electrodes can be accurately recognized and the die can be attached to the circuit board. On the other hand, when the die 92 is supplied from a die assembly in which the electrode surface faces downward, even if the die is difficult to recognize by epi-illumination, the position of the die can be recognized by recognizing the gap between adjacent dies by the emission of the fluorescent stickers attached to the pin holder 146.

[0043] Incidentally, in the above embodiment, the die supply device 30 is an example of a die supply device. The die assembly 90 is an example of a die assembly. The die 92 is an example of a die. The holding frame 117 is an example of a holding stage. The camera 128 is an example of an imaging device. The push-up device 130 is an example of a push-up device. The lid body 138 is an example of a cover. The pin holder 146 is an example of a phosphor. The control device 150 is an example of a calculation device. The dicing sheet 162 is an example of a dicing sheet. The side lighting 180 is an example of an irradiation device.

[0044] The present invention is not limited to the above embodiment, and can be embodied in various forms with various modifications and improvements based on the knowledge of those skilled in the art. Specifically, for example, in the above embodiment, a fluorescent sticker is attached to the surface of the pin holder 146, but the pin holder 146 may be made of a material that fluoresces when irradiated with light. Also, in the above embodiment, the pin holder 146 functions as a fluorescent material, but it is not limited to the pin holder 146, and various members such as the lid 138 that constitute the push-up device 130 can be made to function as a fluorescent material.

[0045] In the above embodiment, the lid 138 is made of a semi-transparent (milky white) material, but it may be made of various materials as long as they are light-transmitting materials. In addition, when the lid is made of a material that does not transmit light, a hole may be formed in the lid so that light can pass through the hole. [Explanation of symbols]

[0046] 30: Die supply device 90: Die assembly 92: Die 117: Holding frame (holding stage) 128: Camera (imaging device) 130: Push-up device 138: Lid (cover) 146: Pin holder (phosphor) 150: Control device (arithmetic device) 162: Dicing sheet 180: Side lighting (illumination device)

Claims

1. a holding stage for holding a die assembly formed by dicing a wafer with a dicing sheet attached thereto; a push-up device having a phosphor and configured to push up from below any die of the die assembly held by the holding stage; an irradiation device that irradiates light toward the phosphor; an imaging device that images the die assembly held by the holding stage from above in a state in which the phosphor is irradiated with light by the irradiation device; A die supply device comprising:

2. The push-up device is The phosphor disposed inside the push-up device; A cover formed of a transparent material and covering an upper end of the push-up device; 10. The die feed apparatus of claim 1, further comprising:

3. 3. The die supplying device according to claim 1, further comprising the holding stage for holding a die assembly having a dicing sheet attached to an electrode surface of the die.

4. 4. The die supplying device according to claim 1, further comprising a calculation device that recognizes gaps between adjacent dies and calculates positions of the dies based on image data of the die assembly captured by the imaging device.

Images