Physical tack-free construction and cookware

Abstract

To provide a cooking utensil, besides improving tack-free performance on a surface, having wear resistance and being hard to drop off.SOLUTION: There is provided a physical tack-free structure to be applied to a surface of a metal base material 1, and a cooking utensil. The physical tack-free structure includes a recess structure, and a protrusion structure 3 provided on at least partial area of the recess structure. At least part of the recess structure and / or the protrusion structure includes a physical vapor deposition layer, where surface topography of the physical vapor deposition layer is similar to topography of the surface of the recess structure and / or the protrusion structure covered by the physical vapor deposition layer. The physical tack-free structure and cooking utensil have high hardness and excellent tack-free performances.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] TECHNICAL FIELD This application relates to the field of cookware, and more particularly to physical tack-free structures and cookware. [Background technology]

[0002] The tack-free performance of conventional cookware is achieved by coating a layer of polytetrafluoroethylene on the surface of the cookware. The polytetrafluoroethylene coating layer is non-toxic under normal conditions, but when the heat-receiving temperature of the coating layer reaches 260°C, it begins to volatilize, and when the temperature reaches 350°C, the polytetrafluoroethylene coating layer begins to decompose. Therefore, the use temperature of a non-stick pan with a polytetrafluoroethylene coating generally cannot exceed 250°C. However, the heating temperature of common cookware, such as a frying pan, always exceeds 260°C, which poses a security risk. In addition, the coating layer is not wear-resistant, so there is a risk of it falling off, and it is easy to be ingested by food, which will affect the health of the body. Summary of the Invention [Problem to be solved by the invention]

[0003] To solve the above technical problems, the present application provides a physical tack-free structure and cookware, which not only improves the tack-free performance of the cookware surface, but also has the advantages of being wear-resistant and not easy to fall off. [Means for solving the problem]

[0004] In a first aspect, the present application provides a physical tack-free structure applied to a surface of a metal substrate, the physical tack-free structure comprising a recessed structure and a protruding structure provided on at least a portion of the recessed structure, the physical vapor deposition layer being provided on at least a portion of the surface of the recessed structure and / or the protruding structure, the physical vapor deposition layer having a surface topography similar to the surface topography of the recessed structure and / or the protruding structure covered therewith.

[0005] By adopting the above technical solution, a concave structure is first processed on the surface of a metal substrate, and then a convex structure is processed on the surface of the concave structure. The concave structure and the convex structure can form a hydrophobic structure on the surface of the metal substrate, but such a hydrophobic structure is not wear-resistant. After the concave structure and the convex structure are processed, a layer of a physical vapor deposition layer having wear-resistant properties is further plated on the surface of the concave structure and the convex structure. The physical vapor deposition layer has a topography similar to the concave structure and the convex structure, so that the surface of the physical vapor deposition layer has a hydrophobic property similar to the concave structure and the convex structure. Therefore, the physical tack-free structure processed on the surface of the metal substrate provides the metal surface with wear resistance and tack-free properties.

[0006] In combination with the first aspect, in a further technical solution, the concave structure and the protruding structure are integral with the metal substrate, and the physical vapor deposition layer is in direct contact with the concave structure and / or the protruding structure.

[0007] By adopting the above technical solution, the concave and convex structures can be directly processed on the surface of the metal substrate, the strength of the integrated structure is higher, and the risk of falling off due to the two-body structure is reduced. The physical vapor deposition layer is in direct contact with the concave and convex structures, and there is no intermediate transition layer, which reduces the processing steps and reduces the processing costs.

[0008] In accordance with the first aspect, in a further technical solution, the recess structure includes a plurality of recesses having a depth of 45 to 85 micrometers.

[0009] By adopting the above technical solution, the multiple recesses on the surface of the metal substrate can effectively retain oil during cooking, distribute the oil more evenly, and effectively improve the tack-free performance. The multiple recesses with a depth of 45-85 micrometers not only have good oil retention effect, but also have good bonding strength with the physical vapor deposition layer, so that the physical vapor deposition coating layer can be directly plated on the surface of the recesses, without the need for the intermediate transition layer in the conventional process, ensuring strength and reducing the process and cost.

[0010] In accordance with the first aspect, in a further technical solution, the recess structure is provided such that a plurality of recesses each having a diameter of 0.3 to 0.55 mm, a depth of 55 to 75 micrometers, and a bore pitch of 0.6 to 0.8 mm are arranged in an array perpendicular to each other.

[0011] By adopting the above technical solution, the recess structure is designed to have multiple recesses with a diameter of 0.3 to 0.55 mm, a depth of 55 to 75 micrometers, and a bore pitch of 0.6 to 0.8 mm uniformly distributed perpendicularly, which not only provides a certain hydrophobicity to the surface of the metal substrate, but also improves the bonding performance between the metal substrate and the physical vapor deposition layer, and reduces the risk of the physical vapor deposition layer falling off.

[0012] In accordance with the first aspect, in a further technical solution, the thickness of the physical vapor deposition layer is 0.8 to 1.45 micrometers.

[0013] By adopting the above technical solution, the thickness of the physical vapor deposition layer can be controlled within a set range, so that when the physical vapor deposition layer covers the surfaces of the concave and convex structures, the physical vapor deposition layer has a topography similar to that of the concave and convex structures, and the surface of the physical vapor deposition layer has tack-free properties.

[0014] In a further technical solution in combination with the first aspect, the convex structure includes a plurality of protrusions provided on at least a part of the surface of the concave structure, and the height of the protrusions is 0.1 to 0.3 micrometers.

[0015] By adopting the above technical solution, a convex structure is provided on at least a part of the surface of the concave structure, and the height of the protrusions is designed to be 0.1 to 0.3 micrometers. In this way, the hydrophobicity of the concave structure can be further improved, the tack-free performance of the surface of the metal substrate can be improved, and the bonding strength between the physical vapor deposition coating layer and the metal substrate can be further improved, and the risk of the coating layer falling off can be reduced.

[0016] In a second aspect, the present application provides another physical tack-free structure applied to a surface of a metal substrate, the physical tack-free structure comprising a shot blasting layer provided on the surface of the metal substrate and a physical vapor deposition layer provided on the surface of the shot blasting layer, wherein a concave structure and a convex structure are formed on the surface of the shot blasting layer, and the surface topography of the physical vapor deposition layer is similar to the surface topography of the shot blasting layer covered therewith.

[0017] According to the above technical solution, first, a concave-convex structure is processed on the surface of a metal substrate by shot blasting, and the concave-convex structure can form a hydrophobic structure on the surface of the metal substrate, but such a hydrophobic structure is not wear-resistant. After the concave-convex structure is processed by shot blasting, a layer of a physical vapor deposition layer having wear-resistant properties is plated on the surface of the concave-convex structure. Since the physical vapor deposition layer has a topography similar to the concave-convex structure, the surface of the physical vapor deposition layer has a hydrophobic property similar to that of the concave-convex structure. Therefore, the physical tack-free structure processed on the surface of the metal substrate provides the metal surface with wear resistance and tack-free properties.

[0018] In combination with the second aspect, in a further technical solution, the shot blasting layer is integral with the metal substrate and the physical vapor deposition layer is in direct contact with the shot blasting layer.

[0019] By adopting the above technical solution, the uneven structure can be directly processed on the surface of the metal substrate by shot blasting, which can improve the strength of the integrated structure and reduce the risk of falling off due to the two-body structure. The physical vapor deposition layer is in direct contact with the uneven structure and has no intermediate transition layer, which reduces the processing steps, reduces the processing cost, and also achieves wear-resistant tack-free performance.

[0020] In accordance with the second aspect, in a further technical solution, an electrolytic layer is further provided between the shot blast layer and the physical vapor deposition layer.

[0021] By adopting the above technical solution, the surface of the shot blasting layer can be formed with V-shaped, C-shaped, U-shaped or randomly sized depressions of micrometer or nanometer order by electrolysis, which can further reduce the contact area between the food and the pot body, and the air in the depressions can be expanded by thermal expansion to form a repulsive force, which can effectively realize the tack-free effect. In addition, the surface of the shot blasting layer can be formed with an oxide film by electrolysis, which can change its color and improve its performance, thereby improving the performance and grade of the product.

[0022] In accordance with the second aspect, a further technical solution further provides a plasma polishing layer between the shot blasting layer and the physical vapor deposition layer.

[0023] By adopting the above technical solution, the surface of the shot blasting layer can be further processed to have a micrometer or nanometer order uneven structure, which can further improve the hydrophobicity and tack-free performance of the product surface.The plasma polishing layer can further improve the brightness of the product surface, which can improve the quality of the product.

[0024] In combination with the second aspect, in a further technical solution, the Vickers hardness of the metal substrate is 100 or more, the shot blasting layer has a plurality of recesses, the spherical diameter of the recesses is 0.3 to 0.95 mm, and the bore pitch range of the recesses is 0.3 to 0.8 mm.

[0025] It can be seen from the experimental test that the processing process of physical vapor deposition (PVD) forms the spherical diameter of the shot blasting layer on the surface of the metal substrate with Vickers hardness over 100 is 0.3-0.95mm, preferably 0.4-0.65mm, and the bore pitch range of the recess is 0.3-0.8mm, preferably 0.6mm recess, which has better tack-free performance and wear resistance.

[0026] In a third aspect, the present application provides a cookware comprising the physical tack-free structure of the first aspect, the physical tack-free structure being provided on at least a portion of a bottom area of ​​an inner surface of the cookware.

[0027] By adopting the above technical solution, at least a part of the area of ​​the inner surface of the cookware can have tack-free performance and wear resistance based on the actual design requirements.

[0028] In combination with the third aspect, in a further technical proposal, the physical tack-free structure is provided in a set area on the inner surface of the cookware, and the concave structure and the convex structure are provided outside the set area on the inner surface of the cookware.

[0029] By adopting the above technical solution, the bottom of the inner surface of the cookware is in contact with oil and the heat-receiving area is the setting area, and a physical tack-free structure is provided in the setting area to improve the tack-free performance of the bottom when the cookware is cooking. The physical tack-free structure is provided in the bottom area of ​​the inner surface, which can not only achieve the tack-free and wear-resistant performance of the main cooking area of ​​the bottom, but also reduce the use of materials and save costs. In order to improve the tack-free performance of the entire inner surface of the cookware, the physical tack-free structure may be provided on all the inner surfaces of the cookware as necessary.

[0030] The set area may be provided at the bottom of the cookware where it is constantly rubbed, and by providing a physical tack-free structure in this area, the set area not only has wear resistance but also has tack-free performance, meeting the tack-free demand of the cookware. By providing a concave structure and a convex structure outside the set area, the tack-free performance can be achieved outside the set area, and although the wear resistance is poor, the outside of the set area does not always come into contact with the spoon, so the wear resistance can be reduced, and a certain tack-free and wear-resistant performance of the cookware can be met, and the material cost can be reduced.

[0031] In combination with the third aspect, in a further technical solution, the physical tack-free structure is provided on at least a partial area of ​​the outer surface of the cookware.

[0032] By adopting the above technical solution, a physical tack-free structure is provided on the outer surface of the cookware, which can improve the tack-free and wear-resistant performance of the outer surface of the cookware, and make the outer surface of the cookware easier to clean.

[0033] In combination with the third aspect, in a further technical proposal, the physical tack-free structure is provided in an area away from the bottom of the outer surface of the cookware, or the concave structure and the convex structure are integrally provided in an area away from the bottom of the outer surface of the cookware.

[0034] By adopting the above technical solution, areas away from the bottom of the cookware, such as the mouth of a pot, are prone to coming into contact with oil during cooking and becoming dirty. By providing a physical tack-free structure in these areas, the tack-free and wear resistance of these areas can be improved, and the cost of using materials can be reduced. By providing a concave structure and a convex structure in these areas, the tack-free performance of these areas can be improved, and since the wear resistance required for these areas is low, the concave structure and the convex structure formed integrally with the metal substrate can meet the normal wear resistance, and the material cost can be further reduced.

[0035] In a fourth aspect, the present application further provides a cookware comprising a body formed of a metal substrate, the body having a surface provided with a physical tack-free structure as described in some of the second aspects.

[0036] By adopting the above technical solution, the cookware with the physical tack-free structure can improve the tack-free performance when cooking food, reduce the probability of food sticking to the surface of the body, and further make the cookware easier to clean, improving the enjoyment of cooking.

[0037] In a further technical solution in combination with the fourth aspect, the shot blasted layer has an uneven structure having steps of 45 to 85 micrometers formed by performing a shot blasting process on the inner surface of the body after the body is molded, and the physical vapor deposition layer has a thickness of 0.8 to 1.45 micrometers.

[0038] It can be seen from the experimental test that the uneven structure with a step of 45-85 micrometers or the uneven structure with a step of 55-75 micrometers is easy to process and has good hydrophobic performance. The thickness of the physical vapor deposition layer is 0.8-1.45 micrometers, so that when the physical vapor deposition layer covers the surface of the shot blasting layer, the physical vapor deposition layer has a topography similar to the uneven structure of the shot blasting layer, and the surface of the physical vapor deposition layer has tack-free performance and wear resistance.

[0039] In a fifth aspect, the present application provides a method for processing a physical tack-free structure according to the first aspect, which is used to process a physical tack-free structure on a surface of a metal substrate, the physical tack-free structure comprising a shot blasted layer, the method comprising the steps of: A forming step of processing a metal substrate into a predetermined size and shape; a shot blasting step of performing a shot blasting process on the cut metal substrate or the molded product to form a shot blasting layer; and a plating step of heating the shot-blasted metal base material or the molded product to 200° C. to 500° C. and performing PVD plating on the surface of the shot-blasted layer in a vacuum environment.

[0040] By adopting the above technical solution, the processing cost is low and the processing efficiency is high.

[0041] In a sixth aspect, the present application further provides a method of processing a cookware applied to the cookware according to the third aspect, said method comprising the steps of: a forming step of processing a metal substrate to form a cookware body; a shot blasting step of performing a shot blasting process on the inner surface of the body to form a shot blast layer having a spherical recess on the inner surface of the body; and a plating step of heating the main body after the shot blasting to 200° C. to 500° C. and performing PVD plating on the inner surface of the main body in a vacuum environment.

[0042] By adopting the above technical solution, the conventional method of first forming a concave-convex structure on a metal plate and then stretching it to form the body of the appliance is abandoned, and the metal plate is first stretched to form the body, and then the inner surface of the body is shot blasted to form the concave-convex structure, which is a simple and low-cost process, and there is no risk of destroying the topography of the concave-convex structure after stretching, and the hydrophobic performance of the concave-convex structure is better protected, and the consistency of the tack-free performance of the product is higher.

[0043] In accordance with the sixth aspect, a further technical solution further includes an electrolytic or plasma polishing step between the shot blasting step and the plating step, for forming an electrolytic layer or plasma layer on the surface of the shot blasting layer.

[0044] By adopting the above technical solution, the surface of the uneven structure formed by shot blasting can be further formed with a nanometer or micrometer uneven structure, which can further improve the hydrophobic performance and reduce the discoloration problem in the processing of the metal substrate. Effect of the Invention

[0045] In summary, the present application has at least one beneficial effect: 1. The physical tack-free structure of this application provides the metal surface with wear-resistance and tack-free properties. 2. The physical tack-free structure of the present invention can reduce the risk of falling off due to the two-body structure and has higher strength. 3. In the physically tack-free structure of the present invention, the physical vapor deposition layer is in direct contact with the concave and convex structures, and there is no intermediate transition layer, which ensures the bonding strength while reducing the number of processing steps and reducing processing costs. 4. In the cookware of the present application, physical tack-free structures can be provided in different areas of the cookware according to design needs, so that the wear-resistance and tack-free performance of the cookware during normal cooking can be met, and the cost performance of the cookware can be improved. [Brief description of the drawings]

[0046] [Figure 1] FIG. 2 is a schematic structural diagram of a metal substrate with a physical tack-free structure according to Example 1 of the present application. [Diagram 2] FIG. 2 is an enlarged schematic view of part A in FIG. [Diagram 3] FIG. 3 is a schematic cross-sectional view of the line BB in FIG. [Figure 4] FIG. 4 is an enlarged schematic view of part C in FIG. [Diagram 5] FIG. 5 is an enlarged schematic view of a portion D in FIG. [Figure 6] FIG. 6 is a schematic view of part E in FIG. 5 after enlargement and rotation. [Figure 7] FIG. 2 is a schematic diagram of the structure of Example 2 with a physical tack-free structure of the present application. [Figure 8] 1 is a structural schematic diagram of a cooking utensil according to a first embodiment of the present invention; [Figure 9] FIG. 2 is a structural schematic diagram of a cooking utensil according to a second embodiment of the present invention. [Explanation of symbols]

[0047] 1...metal substrate, 2...physical tack-free structure, 21...recess, 22...shot blast layer, 3...protrusion structure, 31...protrusion, 4...physical vapor deposition layer, 5...pot body, 51...inner surface, 511...bottom region, 52...outer surface, 521...pot mouth region, 6...handle, a...bore pitch, b...hole depth, c...protrusion height. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0048] In order to make the objectives, technical solutions and advantages of the embodiments of the present application clearer, the present application will be described in more detail below with reference to the drawings. The components of the embodiments of the present application as generally shown and described herein may be arranged and designed in a variety of different configurations. All other embodiments obtained by those skilled in the art based on the embodiments of the present application without creative labor fall within the scope of protection of the present application.

[0049] It should be noted that in the following drawings, like numerals and letters represent like items, and that once an item is defined in one drawing, it does not require further definition or interpretation in subsequent drawings.

[0050] In the description of this application, unless otherwise specified and limited, the terms "attached," "coupled," and "connected" should be understood in a broad sense, for example, may be a fixed connection, a detachable connection or an integral connection, a mechanical connection, or an electrical connection, may be a direct connection, may be an indirect connection via an intermediary, or may be communication between the insides of two members. Those skilled in the art can understand the specific meanings of the above terms in this application according to the specific circumstances.

[0051] In the description of this application, it should be noted that orientations or positional relationships indicated using terms such as "up," "down," "left," and "right" are based on orientations or positional relationships shown in the drawings, are intended to explain and simplify the description of the application, and do not indicate or imply that a device or element must have a particular direction or be constructed and operated in a particular orientation, and therefore cannot be understood as limitations of the application.

[0052] Hereinafter, several embodiments of the present application will be described in detail with reference to the drawings. Where there is no contradiction, the features of the following embodiments can be combined with each other.

[0053] Cooking utensils in this application include eating utensils and cooking utensils. Example 1

[0054] 1 to 6 are schematic structural diagrams of an embodiment of a physical tack-free structure 2. The physical tack-free structure 2 is provided on the surface of a metal substrate 1, and includes a recessed structure and a protruding structure 3 provided in at least a partial area of ​​the recessed structure, and a physical vapor deposition layer 4 is provided on at least a portion of the surface of the recessed structure and / or the protruding structure 3, and the topography of the surface of the physical vapor deposition layer 4 is similar to the topography of the surface of the recessed structure and / or the protruding structure 3 covered therewith.

[0055] Referring to FIG. 1, the physical tack-free structure 2 in this embodiment is integrally processed by a processing method such as etching in a set area on the surface of the metal substrate 1, and this embodiment is a physical tack-free structure 2 processed on the surface of the metal substrate 1 by adopting processing methods of chemical etching and physical etching.

[0056] Referring to FIG. 2, the physical tack-free structure 2 includes a recess structure, and the recess structure is composed of a plurality of recesses 21 arranged in an array in a perpendicular manner. The cross section of the recess 21 in this embodiment is circular, and may be designed to be polygonal, for example, hexagonal or rectangular, according to the needs of design and production. The diameter of the recess 21 is 0.3 to 0.55 mm, and most preferably 0.4 to 0.45 mm. The bore pitch a of the recess 21 is in the range of 0.6 to 0.8 mm, and most preferably 0.6 mm. When the recess 21 is polygonal, the polygons are uniformly arranged, and the diameter of the inscribed circle of the polygon is 0.3 to 0.55 mm, and most preferably 0.4 to 0.45 mm.

[0057] Referring to FIG. 3, the recesses 21 are formed by chemically etching the surface of the metal base 1, and the hole depth b of the recesses 21 is 45 to 85 micrometers, and most preferably 55 to 75 micrometers.

[0058] With reference to FIG. 4, the convex structure 3 is processed on the surface of the concave structure by etching, and in this embodiment, the etching process for the convex structure 3 is physical etching process.

[0059] 5, the convex structure 3 includes a plurality of protrusions 31 provided on at least a portion of the surface of the concave structure, and the height of the protrusions 31 is 0.1 to 0.3 micrometers. This figure shows only the structure of the protrusions 31, and when etching the surface of the concave structure with a plasma source, the shape of the protrusions 31 is irregular, but the height range of each protrusion 31 needs to be controlled to 0.1 to 0.3 micrometers.

[0060] Referring to FIG. 6, a physical vapor deposition layer 4 is provided on the surface of at least a part of the concave and / or convex structures 3, and by setting and controlling the PVD coating process parameters, the topography of the surface of the physical vapor deposition layer 4 is similar to that of the concave and / or convex structures 3 coated thereon, thereby achieving a tack-free effect on the surface of the metal substrate 1. The physical vapor deposition layer 4 is in direct contact with the concave and / or convex structures 3, and the thickness of the physical vapor deposition layer 4 is 0.8-1.45 micrometers. The conventional PVD coating layer cannot be directly contacted and bonded to the metal substrate 1, and it is necessary to provide a transition layer between the PVD coating layer and the metal substrate 1. For example, the patents with application numbers CN202121169683.5 and CN202222426611.5 both adopt the form of a transition layer to achieve bonding. The transition layer not only has good bonding strength with the coating layer, but also has good bonding strength with the metal substrate 1, ensuring good bonding strength between the PVD coating layer and the metal substrate 1, and is not easy to fall off. The physical tack-free structure 2 of the present application is researched as a new structure through theoretical analysis and long-term experimental testing, and directly processes a structure related to the surface of the metal substrate 1, which not only realizes good bonding strength between the PVD coating layer and the metal substrate 1, but also improves the tack-free performance of the surface of the metal substrate 1, and has wear resistance, so that the wear resistance and tack-free performance of the surface of the metal substrate 1 can be maintained for a long time. The metal substrate 1 is a metal material such as carbon steel, alloy steel, stainless steel, and titanium alloy.

[0061] A protruding structure 3 is provided on some of the concave structures, and a physical vapor deposition layer 4 coating layer is plated on the surfaces of some of the convex structures 3, or some of the concave structures, or some of the concave structures and some of the convex structures 3, so that a number of combination structures can be formed on the surface of the metal substrate 1, and different surface effects can be achieved according to different usage needs, or different surface effects can be achieved in different regions on the surface of the metal substrate 1.

[0062] JPEG0007606589000001.jpg170165

[0063] As can be seen from the performance comparison test, the physical vapor deposition thickness of items 5 to 8 is in the range of 0.8 to 1.45 μm, and the comprehensive performance is optimal when the PVD etching depth is 0.1 to 0.3 μm, and the cost of this parameter range is also the most reasonable.

[0064] When the physical vapor deposition thickness is less than 0.8 μm and the PVD etching depth is less than 0.1 μm, the bonding strength of the plating layer is very poor and only reaches level 3, making it easy to fall off; the hardness is 600-800 HV, which is insufficient in hardness and has poor wear resistance; and the tack-free effect of boiled eggs is level III, which means poor tack-free effect.

[0065] When the physical vapor deposition thickness is less than 0.8 μm and the PVD etching depth is more than 0.3 μm, the hardness of the plating layer is 300-800 HV, the hardness is insufficient, the wear resistance is poor, and the tack-free effect of boiled eggs is grade III, and the tack-free effect is poor.

[0066] When the physical vapor deposition thickness exceeds 1.45μm and the PVD etching depth is less than 0.1μm, the bonding strength of the plating layer is very poor and only reaches level 3, making it easy to fall off. Although the hardness requirement of 1500-2000HV can be achieved, the cost is high due to the waste of raw materials, and the tack-free effect of boiled eggs is only grade III, resulting in poor tack-free effect.

[0067] When the physical vapor deposition thickness exceeds 1.45 μm and the PVD etching depth exceeds 0.3 μm, the bonding strength can reach level 2 or above and the hardness can meet the requirements of 1500-2000 HV, but the cost will be high due to the waste of raw materials, and the tack-free effect of the boiled eggs is grade III, and the tack-free effect is poor.

[0068] When the physical vapor deposition thickness is within the range of 0.8-1.45 μm and the PVD etching depth is 0.1-0.3 μm, the bonding strength reaches level 2, the hardness is 1500-2000 HV, the tack-free effect of boiled eggs is grade II, and the cost performance is the best. Example 2

[0069] 7 is a structural schematic diagram of Example 2 of the physical tack-free structure 2. The physical tack-free structure 2 includes a shot blasted layer 22 provided on the surface of a metal substrate 1, a physical vapor deposition layer 4 is provided on the surface of the shot blasted layer 22, the recesses 21 on the surface of the metal substrate 1 are formed by shot blasting, and the surface topography of the physical vapor deposition layer 4 is similar to the surface topography of the shot blasted layer 22 coated thereon.

[0070] The physical tack-free structure 2 in this embodiment is formed by integrally processing a set area on the surface of the metal base material 1 by a processing method such as shot blasting or roll pressing, and then applying PVD plating.

[0071] The shot blast layer 22 of this embodiment is an uneven structure processed on the surface of the metal substrate 1 using a shot blast processing method, and the shot blast layer 22 is formed by arranging a plurality of recesses 21 regularly or irregularly, and the cross section of the recesses 21 in this embodiment is circular. The diameter of the recesses 21 is 0.3 to 0.95 mm, and most preferably 0.4 to 0.65 mm, and the recesses 21 are spherical recesses 21 formed by spraying the surface of the metal substrate 1 with a pressure of 2 Mpa to 8 Mpa through a steel ball of 0.6 to 1 mm, and the diameter of the recesses 21 is a spherical diameter. In addition, a circular, elliptical or polygonal shape, for example a hexagon or a square, can be processed according to the design needs by a processing method such as a roll press. The bore pitch a of the recesses 21 is in the range of 0.3 to 0.8 mm, and most preferably 0.6 mm, and the range of the bore pitch a here means the ball center distance of the recesses 21. When the recesses 21 are polygonal, the polygons may be uniformly arranged by rolling or may be irregularly arranged as necessary, and the diameter of the inscribed circle of the polygon is 0.3 to 0.95 mm, and most preferably 0.4 to 0.65 mm.

[0072] The shot blast layer 22 is a surface formed by connecting the recesses 21 and the protrusions 31 between the recesses 21, which are formed by shot blasting the inner surface of the main body after molding of the main body, and has a recess depth b of 45 to 85 micrometers, and most preferably 55 to 75 micrometers. The shot blast layer 22 is integral with the metal substrate 1, and the physical vapor deposition layer 4 is in direct contact with the shot blast layer 22.

[0073] A physical vapor deposition layer 4 is provided on at least a part of the surface of the shot blast layer 22, and the thickness of the plating film can be controlled by setting the PVD coating process parameters, and the topography of the surface of the physical vapor deposition layer 4 is similar to that of the shot blast layer 22 coated thereon, thereby achieving a tack-free effect on the surface of the metal substrate 1. The physical vapor deposition layer 4 is in direct contact with the shot blast layer 22, and the thickness of the physical vapor deposition layer 4 is 0.8-1.45 micrometers. The conventional PVD coating layer cannot be directly contacted and bonded with the metal substrate 1, and it is necessary to provide a transition layer between the PVD coating layer and the metal substrate 1. For example, the patents with application numbers CN202121169683.5 and CN202222426611.5 both adopt the form of a transition layer to realize bonding. The transition layer not only has excellent bonding strength with the coating layer, but also has excellent bonding strength with the metal substrate 1, which ensures good bonding strength between the PVD coating layer and the metal substrate 1 and is not easy to fall off. The physical tack-free structure of the present application is a new structure researched through theoretical analysis and long-term experimental tests, and a concave-convex structure corresponding directly to the surface of the metal substrate 1 is shot blasted, which not only realizes good bonding strength between the PVD coating layer and the metal substrate 1, but also improves the tack-free performance of the surface of the metal substrate 1, and has wear resistance, so that the wear resistance and tack-free performance of the surface of the metal substrate 1 can be maintained for a long time. The metal substrate 1 is a metal material such as carbon steel, alloy steel, stainless steel, titanium alloy, etc. Example 3

[0074] 7, the difference from Example 2 is that an electrolytic layer or plasma polishing layer is further provided between the shot blasting layer 22 and the physical vapor deposition layer 4. An electrolytic layer or plasma polishing layer is provided on the surface of some of the shot blasting layers 22, and a physical vapor deposition layer 4 coating layer is plated on the surface of some of the electrolytic layers or plasma polishing layers, or on the surface of some of the shot blasting layers 22, or on the surface of some of the shot blasting layers 22 and some of the electrolytic layers / or plasma polishing layers, so that a number of combination structures can be formed on the surface of the metal substrate 1, and different surface effects can be achieved according to different usage needs, or different surface effects can be achieved in different regions on the surface of the metal substrate 1.

[0075] Referring to FIG. 6, the difference from Example 1 is as follows: the convex structure 3 is processed on the surface of the shot blast layer 22 by electrolytic or plasma polishing, whereas in this example, the processing of the convex structure 3 is electrolytic processing.

[0076] 5, the differences from Example 1 are as follows: the convex structure 3 includes a plurality of protrusions 31 provided on at least a portion of the surface of the shot blast layer 22, the height of the protrusions 31 is 45-85 micrometers, and the electrolytic layer is a surface formed by connecting the protrusions 31 to each other. This figure shows only the structure of the protrusions 31, and when etching the surface of the shot blast layer 22 by electrolysis or plasma polishing, the shape of the protrusions 31 is irregular, but the height range of each protrusion 31 needs to be controlled to 45-85 micrometers. Example 4

[0077] Referring to FIG. 8, this embodiment discloses a cookware, specifically a frying pan, which includes a pan body 5 and a handle 6, and the bottom area 511 of the inner surface 51 of the pan body 5 of the frying pan is provided with any of the physical tack-free structures 2 in the above embodiments. In practical applications, the entire area of ​​the inner surface 51 of the pan body 5 may be provided with the physical tack-free structure 2 to achieve better tack-free performance. In this embodiment, only a frying pan is used as an example, and in practical applications, the physical tack-free structure 2 can be applied to the surface of all cookware, including eating utensils and cooking utensils. In this embodiment, only a frying pan is used as an example, and in practical applications, the physical tack-free structure can be applied to the surface of all cookware, including eating utensils and cooking utensils, including but not limited to cookware containers (such as soy milk machine cups, rice cookers, pressure cookers, pot inner pots or oven cases), juicer cups, spoons, etc. Example 5

[0078] 9, the differences between this embodiment and embodiment 4 are as follows: outer surface 52 of pot body 5 in this embodiment is also provided with physical tack-free structure 2, which is provided at the pot mouth position away from the pot bottom; in practical application, to achieve good tack-free performance of outer surface 52, physical tack-free structure 2 may be provided in the entire area of ​​outer surface 52; or concave structure and convex structure 3 are integrally provided in pot mouth area 521 away from the bottom of outer surface 52 of pot body 5. Example 6

[0079] With reference to FIGS. 1 to 7, this embodiment further discloses a method for processing a physical tack-free structure used for processing the physical tack-free structure 2 in Example 1, Example 2, or Example 3 on the surface of a metal substrate 1, and the processing method includes: A forming step of processing the metal base material 1 into a predetermined shape and size; A step of subjecting the cut metal substrate 1 or the molded product to shot blasting, in which shots of 0.6 to 1 mm are sprayed at a pressure of 2 MPa to 8 MPa for 3 seconds to 5 minutes until a shot blast layer 22 having a spherical recess 21 is formed on the surface of the metal substrate 1 or the molded product; and a plating step of heating the shot-blasted metal base material 1 or the molded product to 200° C. to 500° C. and performing PVD plating on the inner surface in a vacuum environment. Example 7

[0080] Referring to Figs. 8-9, this embodiment further discloses a processing method for the cookware in the embodiment 4 or the embodiment 5. The processing method includes: A forming step of processing the metal substrate 1 to form a pot body 5 of the frying pan; A step of performing shot blasting on the inner surface 51 of the frying pan body 5, in which shots of 0.6 to 1 mm are sprayed at a pressure of 2 MPa to 8 MPa for 3 seconds to 5 minutes until a shot blast layer 22 having a spherical recess 21 is formed on the inner surface 51 of the pan body 5; an electrolysis step of forming an electrolytic layer by performing electrolytic processing on the surface of the shot blast layer 22; and a plating step of heating pot body 5 after electrolysis to 200° C. to 500° C. and performing PVD plating on inner surface 51 of the body in a vacuum environment.

[0081] The above describes the basic principle, main features and advantages of the present invention. Those skilled in the art will understand that the present invention is not limited to the above embodiments, and the above embodiments and the description are only illustrative of the principles of the present invention, and the present invention may further include various changes, modifications, substitutions and variations without departing from the spirit and scope of the present invention, and all of these changes, modifications, substitutions and variations are included in the scope of the present invention that is claimed for protection.

Claims

1. A physical tack-free structure (2) applied to a surface of a metal substrate (1), the physical tack-free structure (2) comprising a recessed structure and a protruding structure (3) provided in at least a partial area of ​​the recessed structure, a physical vapor deposition layer (4) provided on at least a portion of the surface of the recessed structure and / or the protruding structure (3), and the topography of the surface of the physical vapor deposition layer (4) is similar to the topography of the surface of the recessed structure and / or the protruding structure (3) covered therewith.

2. The physical tack-free structure (2) of claim 1, characterized in that the concave structure and the protruding structure (3) are integral with the metal substrate (1) and the physical vapor deposition layer (4) is in direct contact with the concave structure and / or the protruding structure (3).

3. The physical tack-free structure (2) of claim 1, characterized in that the recessed structure comprises a plurality of recesses (21) having a depth of 45 to 85 micrometers.

4. The physical tack-free structure (2) according to claim 3, characterized in that the recess structure is provided such that a plurality of recesses (21) each having a diameter of 0.3 to 0.55 mm, a depth of 55 to 75 micrometers, and a bore pitch (a) of 0.6 to 0.8 mm are arranged in an array crossing each other.

5. The physical tack-free structure (2) according to claim 1, characterized in that the thickness of said physical vapor deposition layer (4) is between 0.8 and 1.45 micrometers.

6. The physical tack-free structure (2) according to claim 1, characterized in that the convex structure (3) includes a plurality of protrusions (31) provided on at least a portion of the surface of the concave structure, and the height of the protrusions (31) is 0.1 to 0.3 micrometers.

7. A physical tack-free structure (2) applied to a surface of a metal substrate (1), the physical tack-free structure (2) comprising a shot blasted layer (22) provided on the surface of the metal substrate (1) and a physical vapor deposition layer (4) provided on the surface of the shot blasted layer (22), wherein a concave structure and a convex structure are formed on the surface of the shot blasted layer (22), and the surface topography of the physical vapor deposition layer (4) is similar to the surface topography of the shot blasted layer (22) covered therewith.

8. 8. The physical tack-free structure (2) of claim 7, characterized in that the shot blasted layer (22) is integral with the metal substrate (1) and the physical vapor deposition layer (4) is in direct contact with the shot blasted layer (22).

9. The physical tack-free structure (2) according to claim 7, further comprising an electrolytic layer between the shot blast layer (22) and the physical vapor deposition layer (4).

10. 8. The physical tack-free structure (2) according to claim 7, further comprising a plasma polishing layer between the shot blasting layer (22) and the physical vapor deposition layer (4).

11. The physical tack-free structure (2) according to claim 7, characterized in that the metal substrate (1) has a Vickers hardness of 100 or more, the shot blasted layer (22) has a plurality of recesses (21), the spherical diameter of the recesses (21) is 0.3 to 0.95 mm, and the bore pitch (a) of the recesses (21) is in the range of 0.3 to 0.8 mm.

12. A cooking utensil comprising the physical tack-free structure (2) according to claim 1, characterized in that the physical tack-free structure (2) is provided on at least a partial area of ​​the bottom of the inner surface (51) of the cooking utensil.

13. The cooking utensil according to claim 12, characterized in that the physical tack-free structure (2) is provided in a set area on the inner surface (51) of the cooking utensil, and the concave structure and the convex structure (3) are provided outside the set area on the inner surface (51) of the cooking utensil.

14. The cookware of claim 12, characterized in that the physical tack-free structure (2) is provided on at least a partial area of ​​the outer surface (52) of the cookware.

15. The cooking utensil according to claim 14, characterized in that the physical tack-free structure (2) is provided in an area away from the bottom of the outer surface (52) of the cooking utensil, or the concave structure and the convex structure (3) are integrally provided in an area away from the bottom of the outer surface (52) of the cooking utensil.

16. A cookware comprising a body formed of a metal substrate (1), the surface of said body being provided with a physical tack-free structure (2) according to claim 7.

17. The cooking utensil according to claim 16, characterized in that the shot blast layer (22) has an uneven structure having steps of 45 to 85 micrometers formed by performing a shot blasting treatment on the inner surface (51) of the body after the body is molded, and the thickness of the physical vapor deposition layer (4) is 0.8 to 1.45 micrometers.

18. A method for fabricating a physical tack-free structure (2) according to claim 7 on a metal substrate (1), the method comprising the steps of: A forming step of processing a metal substrate (1) into a predetermined size and shape; a shot blasting step of performing a shot blasting process on the cut metal substrate (1) or the molded product to form a shot blasted layer (22); and a plating step of heating the shot-blasted metal substrate (1) or the molded product to 200°C to 500°C and performing PVD plating on the surface of the shot-blasted layer (22) in a vacuum environment.

19. A method for processing a cookware, the method being applied to the cookware according to claim 16, the method comprising the steps of: A molding step of processing a metal substrate (1) to form a cookware body; a shot blasting step of performing a shot blasting process on the inner surface (51) of the body to form a shot blast layer (22) having a spherical recess (21) on the inner surface (51) of the body; and a plating step of heating the body after shot blasting to 200°C to 500°C and performing PVD plating on the inner surface (51) of the body in a vacuum environment.

20. The processing method according to claim 19, further comprising an electrolytic or plasma polishing processing step between the shot blasting step and the plating step, for forming an electrolytic or plasma layer on the surface of the shot blasting layer (22).

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