Semiconductor integrated circuit device

Abstract

In this semiconductor integrated circuit device, provided is a configuration by which it is possible to sufficiently suppress the occurrence of a latch-up phenomenon. In an output circuit, an output transistor (P1) is placed separated from an ESD protective diode (D1) connected to an external output terminal, and protective resistors (R1) are placed therebetween. The protective resistors (R1) are formed divided into a plurality of resistance regions (21), and taps that supply a power supply voltage to a substrate or a well are formed between resistance regions (21). By the time the noise applied to the external output terminal reaches the output transistor (P1), it is attenuated by the protective resistors (R1) and is absorbed via the taps.

Description

[Technical field]

[0001] The present disclosure relates to a semiconductor integrated circuit device in which a core region and an I / O region are arranged on a chip, and in particular to a layout structure of I / O cells arranged in the I / O region. [Background technology]

[0002] In a semiconductor integrated circuit, input / output cells (I / O cells) are arranged around a core region, and signals are input / output to / from the outside of the semiconductor integrated circuit device and power is supplied via the I / O cells.

[0003] With the recent progress in miniaturization, the noise immunity of semiconductor integrated circuit devices is declining. In particular, the latch-up phenomenon caused by noise applied from pads in I / O cells is becoming a serious problem.

[0004] Patent Document 1 discloses a semiconductor integrated circuit device in which a diode is provided as an ESD (ElectroStatic Discharge) protection circuit for an external connection terminal, and a resistive element is disposed as a protective resistor between an output transistor and the external connection terminal. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2011-96897 A Summary of the Invention [Problem to be solved by the invention]

[0006] In the configuration disclosed in Patent Document 1, the output transistor is protected from ESD by a diode and a resistor element as an ESD protection element. However, the configuration disclosed in Patent Document 1 cannot sufficiently suppress the occurrence of the latch-up phenomenon caused by noise propagating through a well or a substrate.

[0007] An object of the present disclosure is to provide a configuration capable of sufficiently suppressing the occurrence of the latch-up phenomenon in a semiconductor integrated circuit device. [Means for solving the problem]

[0008] In a first aspect of the present disclosure, in a semiconductor integrated circuit device including an output circuit, the output circuit includes an external output terminal, a first output transistor that outputs an output signal to the external output terminal, a first ESD (ElectroStatic Discharge) protection diode connected to the external output terminal, and a first protection resistor connected between the first output transistor and the first ESD protection diode, in a planar view, the first output transistor and the first ESD protection diode are arranged at a distance from each other, and the first protection resistor is arranged between the first output transistor and the first ESD protection diode, the first protection resistor is formed in a plurality of divided resistance regions, and a tap for supplying a power supply voltage to a substrate or a well is formed between the resistance regions.

[0009] According to this embodiment, the first output transistor is disposed away from the first ESD protection diode connected to the external output terminal, and the first protection resistor is disposed therebetween. As a result, noise applied to the external output terminal is attenuated by the first protection resistor before it reaches the first output transistor. In addition, the first protection resistor is formed by being divided into a plurality of resistance regions, and a tap for supplying a power supply voltage to the substrate or well is formed between the resistance regions. As a result, the noise applied to the external output terminal is absorbed via the tap. Therefore, it is possible to suppress the propagation of noise that causes the latch-up phenomenon. Effect of the Invention

[0010] According to the present disclosure, the occurrence of the latch-up phenomenon can be sufficiently suppressed in a semiconductor integrated circuit device. [Brief description of the drawings]

[0011] [Figure 1] FIG. 1 is a plan view showing a schematic overall configuration of a semiconductor integrated circuit device according to an embodiment; [Diagram 2] Circuit configuration diagram of an output circuit according to a first embodiment [Diagram 3] 1 is a plan view of an output circuit according to a first embodiment of the present invention; [Figure 4] Example of ESD protection diode layout structure [Diagram 5] Example of ESD protection diode layout structure [Figure 6] Example of layout structure for protection resistor [Figure 7] Example of layout structure for protection resistor [Figure 8] Example of output transistor layout structure [Figure 9] Example of output transistor layout structure [Figure 10] FIG. 1 is a diagram for explaining suppression of the occurrence of a latch-up phenomenon. [Figure 11] Another example of the planar layout structure of the output circuit according to the first embodiment [Figure 12] Circuit configuration diagram of an output circuit according to a second embodiment [Figure 13] 13 is a plan view of an output circuit according to the second embodiment; [Figure 14] 13A and 13B are diagrams showing other examples of the planar layout structure of the output circuit according to the second embodiment; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] Hereinafter, the embodiments will be described with reference to the drawings. In the following description, "VDDIO" and "VSS" refer to the power supply voltage or the power supply itself. Also, the transistors are formed on a P-type substrate and an N-type well. The transistors may be formed on a P-type well or on an N-type substrate.

[0013] (First embodiment) FIG. 1 is a plan view showing a schematic overall configuration of a semiconductor integrated circuit device according to an embodiment. The semiconductor integrated circuit device 1 shown in FIG. 1 includes a core region 2 in which an internal core circuit is formed, and an I / O region 3 provided around the core region 2 in which an interface circuit (I / O circuit) is formed. An I / O cell row 10A is provided in the I / O region 3 so as to surround the peripheral portion of the semiconductor integrated circuit device 1 in an annular shape. Although the illustration is simplified in FIG. 1, a plurality of I / O cells 10 constituting an interface circuit are arranged in the I / O cell row 10A. Although not shown in FIG. 1, a plurality of external connection pads are arranged in the semiconductor integrated circuit device 1.

[0014] Fig. 2 is a circuit configuration diagram of the output circuit 11 included in the I / O cell 10. Note that an actual output circuit includes circuit elements other than those shown in Fig. 2, but these are omitted from Fig. 2.

[0015] 2 includes an external output terminal OUT, output transistors P1 and N1, ESD (ElectroStatic Discharge) protection diodes D1 and D2, and protection resistors R1 and R2. The output transistor P1 is a P-type transistor, and the output transistor N1 is an N-type transistor.

[0016] The output transistors P1 and N1 output an output signal to the external output terminal OUT in accordance with a signal received at their gates. The output transistor P1 has a source connected to VDDIO and a drain connected to the external output terminal OUT via a protective resistor R1. The output transistor N1 has a source connected to VSS and a drain connected to the external output terminal OUT via a protective resistor R2. The protective resistors R1 and R2 are, for example, composed of wiring resistors, and the wiring is realized by wiring formed in a diffusion layer, a gate wiring layer, or a metal wiring layer, or a combination thereof.

[0017] The ESD protection diode D1 is provided between VDDIO and the external output terminal OUT, and the ESD protection diode D2 is provided between VSS and the external output terminal OUT. When high-voltage noise is input to the external output terminal OUT, a current flows to VDDIO and VSS via the ESD protection diodes D1 and D2, thereby protecting the output transistors P1 and N1.

[0018] 3 is a schematic diagram showing an example of a planar layout structure of the output circuit 11 according to this embodiment. The X direction (horizontal direction in the drawing) is the direction in which the I / O cells 10 are lined up, and the Y direction (vertical direction in the drawing) is the direction from the core region 2 toward the chip end. The upper side of the drawing is the core region 2 side, and the lower side of the drawing is the chip end side. Each region in FIG. 3 is marked with the same symbol as the corresponding circuit element in the circuit diagram in FIG. 2.

[0019] The ESD protection diodes D1 and D2 are disposed in the center in the Y direction. The output transistor P1 is disposed above the ESD protection diode D1 in the drawing and spaced apart from the ESD protection diode D1. The output transistor N1 is disposed below the ESD protection diode D2 in the drawing and spaced apart from the ESD protection diode D2.

[0020] The protective resistor R1 is disposed between the output transistor P1 and the ESD protection diode D1. The protective resistor R1 is formed to be divided into a plurality of regions (resistance regions) 21. In the example of Fig. 3, the protective resistor R1 has a rectangular shape extending in the Y direction, and is divided into four resistance regions 21 aligned in the X direction. Tap regions 23 in which a tap for supplying VSS to a P-type substrate is formed are disposed to sandwich each resistance region 21.

[0021] The protective resistor R2 is disposed between the output transistor N1 and the ESD protection diode D2. The protective resistor R2 is formed to be divided into a plurality of regions (resistance regions) 22. In the example of Fig. 3, the protective resistor R2 has a rectangular shape extending in the Y direction, and is divided into four resistance regions 22 arranged in the X direction. Tap regions 24 in which taps for supplying VDDIO to the N-type well are formed are disposed to sandwich each resistance region 22.

[0022] Incidentally, there are pads (not shown) on the upper layer of the ESD protection diodes D1 and D2, and these pads are each connected to the outside of the semiconductor integrated circuit device.

[0023] The layout structure of each circuit element will now be described in detail.

[0024] (Layout structure of ESD protection diode) 4 shows an example of the layout structure of the ESD protection diode D2, although wiring layers and the like are not shown.

[0025] As shown in Fig. 4, the ESD protection diode D2 is formed in the central P substrate region. The ESD protection diode D2 includes an anode portion 31 formed by a P-conductivity type fin 32 and cathode portions 33a, 33b formed by N-conductivity type fins 34a, 34b. The fins 32, 34a, 34b extend in the X direction. The anode portion 31 is connected to VSS, and the cathode portions 33a, 33b are connected to the external output terminal OUT. A diode is formed between the P-conductivity type fin 32 and the N-conductivity type fins 34a, 34b.

[0026] In addition, a guard ring 81 is formed around the ESD protection diode D2. The guard ring 81 includes an N-conductivity type fin 82 formed in an N-well. The fin 82 extends in the X-direction. The fin 82 is connected to VDDIO.

[0027] A dummy gate 41 is formed on the fin 32 of the anode portion 31 and the fins 34a, 34b of the cathode portions 33a, 33b. A dummy gate 42 is formed on the fin 82 of the guard ring 81. The dummy gates 41, 42 extend in the Y direction. By providing the dummy gates 41, 42, the uniformity of the gate pattern in the semiconductor integrated circuit device is improved, thereby improving the reliability and yield of the semiconductor integrated circuit device.

[0028] It should be noted that the dummy gates 41 and 42 do not necessarily have to be provided, and the guard ring 81 does not necessarily have to be formed.

[0029] 5 shows an example of the layout structure of the ESD protection diode D1, although wiring layers and the like are not shown.

[0030] As shown in FIG. 5, the ESD protection diode D1 is formed in the central N-well. The ESD protection diode D1 includes a cathode portion 36 formed by an N-conductivity type fin 37 and anode portions 38a, 38b formed by P-conductivity type fins 39a, 39b. The fins 37, 39a, 39b extend in the X-direction. The cathode portion 36 is connected to VDDIO, and the anode portions 38a, 38b are connected to the external output terminal OUT. A diode is formed between the N-conductivity type fin 37 and the P-conductivity type fins 39a, 39b.

[0031] A guard ring 83 is formed around the ESD protection diode D1. The guard ring 83 includes a P-conductivity type fin 84 formed in a P substrate region. The fin 84 extends in the X direction. The fin 84 is connected to VSS.

[0032] A dummy gate 43 is formed on the fin 37 of the cathode portion 36 and the fins 39a, 39b of the anode portions 38a, 38b. A dummy gate 44 is formed on a fin 84 of the guard ring 83. The dummy gates 43, 44 extend in the Y direction. By providing the dummy gates 43, 44, the uniformity of the gate pattern in the semiconductor integrated circuit device is improved, thereby improving the reliability and yield of the semiconductor integrated circuit device.

[0033] It should be noted that the dummy gates 43 and 44 may not be provided, and the guard ring 83 may not be formed.

[0034] (Protection resistor layout structure) Figure 6 shows an example of the layout structure of the protective resistor R2, although the wiring layers and other parts are not shown.

[0035] 6 and 3, the protective resistor R2 is divided into four resistor regions 22 arranged in the X direction. Gate wiring 51 is formed in each resistor region 22, and one or more resistors are formed by connecting the gate wiring 51 with wiring (not shown). The gate wiring 51 is formed on an N-type well.

[0036] The tap regions 24 are arranged to sandwich each resistor region 22. In each tap region 24, an N-conductivity type fin 52 is formed on an N-well, and the fin 52 serves as a tap. Each fin 52 extends in the X direction and is connected to VDDIO. A dummy gate 45 extending in the Y direction is formed in each fin 52.

[0037] Although the gate wiring 51 constituting the protective resistor is formed on an N-type well, it may be formed on a P-type substrate. Also, the tap of the tap region 24 may be a P-conductivity type fin formed on a P-type substrate and connected to VSS.

[0038] Figure 7 shows an example of the layout structure of the protective resistor R1, although the wiring layers and the like are not shown.

[0039] 7 and 3, the protective resistor R1 is divided into four resistor regions 21 arranged in the X direction. Gate wiring 53 is formed in each resistor region 21, and one or more resistors are formed by connecting the gate wiring 53 with wiring (not shown). The gate wiring 53 is formed on an N-type well.

[0040] The tap regions 23 are arranged to sandwich each resistance region 21. In each tap region 23, a P-conductivity type fin 54 is formed on a P-type substrate, and the fin 54 serves as a tap. Each fin 54 extends in the X direction and is connected to VSS. A dummy gate 46 extending in the Y direction is formed in each fin 54.

[0041] Although the gate wiring 53 constituting the protective resistor is formed on the N-type well, it may be formed on a P-type substrate. Also, the tap of the tap region 23 may be an N-conductivity type fin formed on the N-type well and connected to VDDIO.

[0042] In this example, the protective resistor is configured by the gate wiring, but is not limited to this and may be configured by a fin, a metal wiring, etc. Alternatively, the resistor may be configured by a combination of the gate wiring, the fin, the metal wiring, etc.

[0043] Moreover, the dummy gates 45 and 46 do not necessarily have to be provided.

[0044] Further, although the tap has a diffusion region with a fin structure here, the present invention is not limited to this.

[0045] (Layout structure of output transistor) 8 shows an example of the layout structure of the output transistor N1, although wiring layers and the like are not shown.

[0046] As shown in Fig. 8, in the region of the output transistor N1 in the center, a plurality of N-conductivity type fins 61 each extending in the X direction and arranged side by side in the Y direction, and a plurality of gate wirings 62 each extending in the Y direction and arranged side by side in the X direction are formed. The fins 61 and the gate wirings 62 overlapping in a plan view form a transistor. The transistors are connected in parallel by wiring (not shown). The drain of each transistor is connected to the external output terminal OUT via a protective resistor R2.

[0047] In addition, a guard ring 85 is formed around the output transistor N1. The guard ring 85 includes a P-conductivity type fin 86 formed on a P substrate. The fin 86 extends in the X direction. The fin 86 is connected to VSS. A dummy gate 47 is formed in the fin 86.

[0048] It is not essential to provide the dummy gate 47. Also, it is not essential to form the guard ring 85.

[0049] 9 shows an example of the layout structure of the output transistor P1, although wiring layers and the like are not shown.

[0050] As shown in Fig. 9, in the region of the output transistor P1 in the center, a plurality of P-conductivity type fins 66 each extending in the X direction and arranged side by side in the Y direction, and a plurality of gate wirings 67 each extending in the Y direction and arranged side by side in the X direction are formed. The fins 66 and the gate wirings 67 overlapping in a plan view form a transistor. The transistors are connected in parallel by wiring (not shown). The drain of each transistor is connected to the external output terminal OUT via a protective resistor R1.

[0051] In addition, a guard ring 87 is formed around the output transistor P1. The guard ring 87 includes an N-conductivity type fin 88 formed in an N-well. The fin 88 extends in the X-direction. The fin 88 is connected to VDDIO. A dummy gate 48 is formed in the fin 88.

[0052] It is not essential to provide the dummy gate 48. Also, it is not essential to form the guard ring 87.

[0053] According to this embodiment, the output transistor P1 is disposed away from the ESD protection diode D1 connected to the external output terminal OUT, and a protection resistor R1 is disposed therebetween. The output transistor N1 is disposed away from the ESD protection diode D2 connected to the external output terminal OUT, and a protection resistor R2 is disposed therebetween. As a result, noise applied to the external output terminal OUT is attenuated by the protection resistors R1 and R2 before it reaches the output transistors P1 and N1. In addition, the protection resistor R1 is formed by being divided into a plurality of resistance regions 21, and a tap for supplying VSS to the P-type substrate is formed in a tap region 23 between the resistance regions 21. The protection resistor R2 is formed by being divided into a plurality of resistance regions 22, and a tap for supplying VDDIO to the N-type well is formed in a tap region 24 between the resistance regions 22. As a result, the noise applied to the external output terminal OUT is absorbed through the tap. Therefore, it is possible to suppress the propagation of noise that causes the occurrence of the latch-up phenomenon. In addition, since the tap regions 23 and 24 are distributed in a plurality of regions, the effect of absorbing noise can be obtained more uniformly.

[0054] The suppression of the occurrence of the latch-up phenomenon will be described with reference to Fig. 10. Fig. 10 is a schematic cross-sectional view of a semiconductor integrated circuit device according to this embodiment. From the right side of the drawing, an ESD protection diode D2, a protection resistor R2 and a well tap section (protection resistor R2 is not shown), an output transistor N1, and other transistors are arranged in this order.

[0055] Now, let us assume that noise is applied to the external output terminal OUT (A in Figure 10). If this noise is not sufficiently reduced and propagates to the area of ​​the output transistor N1 or other transistors, the propagated noise will cause a current to flow in the base of the parasitic bipolar transistor. This will cause a latch-up phenomenon via the parasitic transistor, resulting in a large current between VDDIO and VSS (B in Figure 10).

[0056] On the other hand, in the configuration according to the present embodiment, the protective resistor R2 between the ESD protection diode D2 and the output transistor N1 separates the diode D2 from other transistors, thereby attenuating noise. Also, through the tap provided in the region of the protective resistor R2, noise at the external output terminal OUT (A in FIG. 10) is absorbed by the path D in FIG. 10, and fluctuations in the potential of the base node (C in FIG. 10) of the parasitic bipolar transistor can be suppressed. This makes it possible to suppress noise propagating to the output transistor N1 and other transistor regions, and to suppress the occurrence of the latch-up phenomenon.

[0057] (Modification) Fig. 11 is a schematic diagram showing another example of the planar layout structure of the output circuit 11. In the example of Fig. 11, the protective resistor R1 has a rectangular shape extending in the X direction and is divided into four resistor regions 21A arranged in the Y direction. Tap regions 23A in which taps for supplying VSS to the P-type substrate are formed are arranged to sandwich each resistor region 21A.

[0058] The protective resistor R2 has a rectangular shape extending in the X direction and is divided into four resistor regions 22A arranged in the Y direction. Tap regions 24A, in which taps for supplying VDDIO to the N-type well are formed, are arranged to sandwich each resistor region 22A.

[0059] This modification also provides the same effects as those of the above-described embodiment. That is, the noise applied to the external output terminal OUT is attenuated by the protective resistors R1 and R2 before it reaches the output transistors P1 and N1. Moreover, the noise applied to the external output terminal OUT is absorbed through the taps formed in the tap regions 23A and 24A. Therefore, the propagation of noise that causes the latch-up phenomenon can be suppressed. In addition, since the tap regions 23A and 24A are distributed in a plurality of regions, the effect of absorbing noise can be obtained more uniformly.

[0060] In addition, in Fig. 3, the protective resistors R1 and R2 are divided in the X direction, and in Fig. 11, the protective resistors R1 and R2 are divided in the Y direction, but the dividing directions may be mixed. For example, the layout may be such that the protective resistor R1 is divided in the X direction, and the protective resistor R2 is divided in the Y direction.

[0061] Second embodiment Fig. 12 is a circuit diagram of an output circuit 12 according to this embodiment. The circuit configuration in Fig. 12 is almost the same as that in Fig. 2, but the positions at which protective resistors are inserted are different. That is, in the output circuit 12 in Fig. 12, a protective resistor R3 is provided instead of the protective resistors R1 and R2 in Fig. 2. In Fig. 12, the drains of the output transistors P1 and N1 are connected to each other, and the protective resistor R3 is provided between the external output terminal OUT and the drains of the output transistors P1 and N1.

[0062] 13 is a schematic diagram showing an example of a planar layout structure of the output circuit 12 according to this embodiment. The X direction (horizontal direction in the drawing) is the direction in which the I / O cells 10 are lined up, and the Y direction (vertical direction in the drawing) is the direction from the core region 2 toward the chip end. The upper side of the drawing is the core region 2 side, and the lower side of the drawing is the chip end side. Each region in FIG. 13 is marked with the same symbol as the corresponding circuit element in the circuit diagram in FIG. 12. There are pads (not shown) on the upper layer of the ESD protection diodes D1 and D2, and these pads are each connected to the outside of the semiconductor integrated circuit device.

[0063] The ESD protection diodes D1 and D2 are arranged adjacent to each other in the Y direction. The output transistors P1 and N1 are arranged adjacent to each other in the Y direction. The ESD protection diodes D1 and D2 are arranged at the bottom in the Y direction in the drawing. The output transistors P1 and N1 are arranged above the ESD protection diodes D1 and D2 in the drawing and spaced apart from the ESD protection diodes D1 and D2.

[0064] The protection resistor R3 is disposed between the output transistors P1, N1 and the ESD protection diodes D1, D2. The protection resistor R3 is formed by being divided into a plurality of regions (resistance regions) 121. In the example of FIG. 13, the protection resistor R3 is a rectangle extending in the Y direction and is divided into four resistance regions 121 arranged in the X direction. Between the resistance regions 121, a tap region 122 in which a tap for supplying VSS to a P-type substrate is formed, and a tap region 123 in which a tap for supplying VDDIO to an N-type well are formed are disposed. In the example of FIG. 13, the tap regions 122 and the tap regions 123 are disposed alternately in the Y direction. That is, in a single region between the resistance regions 121, a tap for supplying VSS to a P-type substrate and a tap for supplying VDDIO to an N-type well are formed.

[0065] According to this embodiment, the output transistors P1 and N1 are disposed apart from the ESD protection diodes D1 and D2 connected to the external output terminal OUT, and a protection resistor R3 is disposed between them. As a result, noise applied to the external output terminal OUT is attenuated by the protection resistor R3 before it reaches the output transistors P1 and N1. The protection resistor R3 is formed by dividing it into a plurality of resistance regions 121, and a tap for supplying VSS to the P-type substrate is formed in a tap region 122 between the resistance regions 121, and a tap for supplying VDDIO to the N-type well is formed in a tap region 123 between the resistance regions 121. As a result, the noise applied to the external output terminal OUT is absorbed through the tap. Therefore, it is possible to suppress the propagation of noise that causes the occurrence of the latch-up phenomenon. In addition, since the tap regions 122 and 123 are distributed in a plurality of regions, the effect of absorbing noise can be obtained more uniformly.

[0066] In addition, tap region 122, in which a tap for supplying VSS to the P-type substrate is formed, functions to absorb noise from ESD protection diode D1, and tap region 123, in which a tap for supplying VDDIO to the N-type well is formed, functions to absorb noise from ESD protection diode D2.

[0067] The positions of the ESD protection diodes D1 and D2 may be interchanged. Also, the positions of the output transistors P1 and N1 may be interchanged.

[0068] (Modification) 14(a) and (b) are schematic diagrams showing another example of the planar layout structure of the output circuit 12. In the example of Fig. 14(a), between the resistance regions 121, tap regions 122A in which a tap for supplying VSS to a P-type substrate is formed and tap regions 123A in which a tap for supplying VDDIO to an N-type well are formed are alternately arranged in the X direction.

[0069] In the example of Fig. 14(b), the protective resistor R3 has a rectangular shape extending in the X direction and is divided into four resistor regions 121A arranged in the Y direction. Between the resistor regions 121A, a tap region 122B in which a tap for supplying VSS to the P-type substrate is formed, and a tap region 123B in which a tap for supplying VDDIO to the N-type well are formed are arranged. In the example of Fig. 13, the tap regions 122B and the tap regions 123B are arranged alternately in the X direction.

[0070] In the example of FIG. 14(b), the tap regions 122B and the tap regions 123B may be arranged alternately in the Y direction.

[0071] This modification also provides the same effects as those of the above-described embodiment. That is, the noise applied to the external output terminal OUT is attenuated by the protective resistor R3 before it reaches the output transistors P1 and N1. Moreover, the noise applied to the external output terminal OUT is absorbed via the taps formed in the tap regions 122 and 123. Therefore, the propagation of noise that causes the latch-up phenomenon can be suppressed. In addition, since the tap regions 122 and 123 are distributed in a plurality of regions, the effect of absorbing noise can be obtained more uniformly.

[0072] In the above embodiment, the protective resistors R1, R2, and R3 are divided into four resistance regions, but the number of resistance regions is not limited to four.

[0073] In the above-mentioned embodiment, the output circuit has a single-stage P-type and N-type output transistors, but is not limited to this and may have a configuration in which multiple stages of transistors, such as two or three stages, are connected in series. Also, the output circuit in the above-mentioned embodiment may be an input / output circuit including an input circuit. [Industrial Applicability]

[0074] The present disclosure can sufficiently suppress the occurrence of the latch-up phenomenon in a semiconductor integrated circuit device, and is therefore useful for improving the performance of, for example, a semiconductor chip. [Explanation of symbols]

[0075] 1. Semiconductor integrated circuit device 11,12 Output circuit 21,21A,22,22A resistance area 52,54 Fin 121,121A resistance area OUT External output terminal P1, N1 output transistor D1, D2 ESD protection diodes R1,R2,R3 Protection resistor

Claims

1. A semiconductor integrated circuit device including an output circuit, The output circuit includes: An external output terminal, a first output transistor that outputs an output signal to the external output terminal; a first ESD (ElectroStatic Discharge) protection diode connected to the external output terminal; a first protection resistor connected between the first output transistor and the first ESD protection diode; the first output transistor and the first ESD protection diode are disposed apart from each other in a plan view, and the first protection resistor is disposed between the first output transistor and the first ESD protection diode, The first protection resistor is formed in a plurality of separate resistor regions, and a tap for supplying a power supply voltage to a substrate or a well is formed between the resistor regions. A semiconductor integrated circuit device comprising:

2. 2. The semiconductor integrated circuit device according to claim 1, the first output transistor and the first ESD protection diode are spaced apart from each other in a first direction; The plurality of resistance regions are arranged separately in a second direction perpendicular to the first direction. A semiconductor integrated circuit device comprising:

3. 2. The semiconductor integrated circuit device according to claim 1, the first output transistor and the first ESD protection diode are spaced apart from each other in a first direction; The plurality of resistance regions are arranged separately in the first direction. A semiconductor integrated circuit device comprising:

4. 2. The semiconductor integrated circuit device according to claim 1, The tap has a diffusion region with a fin structure. A semiconductor integrated circuit device comprising:

5. 2. The semiconductor integrated circuit device according to claim 1, A tap for supplying a first power supply voltage to the substrate or the well, and a tap for supplying a second power supply voltage different from the first power supply voltage to the substrate or the well are formed in a single region between the resistor regions. A semiconductor integrated circuit device comprising:

6. 2. The semiconductor integrated circuit device according to claim 1, The output circuit includes: a second output transistor that outputs an output signal to the external output terminal; a second ESD protection diode connected to the external output terminal; a second protection resistor connected between the second output transistor and the second ESD protection diode; the second output transistor and the second ESD protection diode are disposed apart from each other in a plan view, and the second protection resistor is disposed between the second output transistor and the second ESD protection diode, The second protection resistor is formed in a plurality of separate second resistor regions, and a tap for supplying a power supply voltage to a substrate or a well is formed in a region between the second resistor regions. A semiconductor integrated circuit device comprising:

7. 2. The semiconductor integrated circuit device according to claim 1, The output circuit includes: a second output transistor that outputs an output signal to the external output terminal; a second ESD protection diode connected to the external output terminal; In a plan view, the second output transistor is disposed adjacent to the first output transistor, and the second ESD protection diode is disposed adjacent to the first ESD protection diode, The first protection resistor is disposed between the first and second output transistors and the first and second ESD protection diodes. A semiconductor integrated circuit device comprising:

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