Substrate cutting device and substrate cutting method

Abstract

To provide a substrate cutting device and a substrate cutting method that are capable of stably discharging the cut and separated edge material (waste material) to the outside, improving the workability of a cutting and separation operation, and moreover, an efficient cutting operation.SOLUTION: Blowing means includes a medium injection mechanism having a medium injection nozzle that injects a medium that provides a pushing force in a direction in which a substrate edge material is separated from a product side remained after the substrate edge material is cut and separated.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a substrate cutting apparatus and a substrate cutting method. [Background technology]

[0002] When manufacturing a CPU substrate (motherboard), as shown in Fig. 12, a substrate 51 having a plurality of circuit patterns formed thereon is formed, and then the substrate 51 is cut into individual pieces by a cutting and separating device, thereby forming a plurality of motherboards 52. In Fig. 12, 54 denotes a cutting line.

[0003] As shown in Fig. 12, when the substrate is cut into individual pieces, unnecessary scraps (scrap) 55 are generated on each side of the substrate. This makes it necessary to discard the scraps (scrap) 55 that are generated. For this reason, a cutting device for substrate 51 has been proposed that can efficiently collect and discharge unnecessary scraps 55 (Patent Document 1). In Patent Document 1, a molded substrate in which a plurality of electronic components such as ICs are encapsulated in a resin material is cut into individual pieces.

[0004] The device described in Patent Document 1 includes a cutting mechanism that cuts the substrate, a wastewater separation section that separates water and the waste material from wastewater containing the waste material cut by the cutting mechanism, and a waste material storage box that contains the waste material collected in the wastewater separation section.

[0005] In this case, the waste material cut by the cutting mechanism is separated from the water in the wastewater separation section, and the waste material is stored in a waste material storage box by the discharge member. That is, in the waste material discharge mechanism, first, the wastewater containing the waste material is dropped and discharged from the wastewater receiving section into the wastewater separation section, then, in the wastewater separation section, the wastewater is separated and removed from the wastewater containing the waste material and stored in the wastewater storage section, and the waste material is left in the wastewater separation section, and further, the discharge member is moved in the waste material discharge direction to move the waste material, and the waste material can be dropped and stored in the waste material storage box. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] JP 2009-297851 A Summary of the Invention [Problem to be solved by the invention]

[0007] In the device described in Patent Document 1, the waste material from the wastewater separation section is supplied to the waste material storage box by moving the discharge member toward the waste material storage box, so there is a risk that the waste material may get caught on the discharge member when the discharge member is moved, making it difficult to supply the waste material to the waste material storage box or restricting its movement. In addition, since the discharge member is moved, if it is structured to move automatically, the device configuration will be complicated, and if it is structured to move manually, the burden on the operator will be large, resulting in poor operability.

[0008] In view of the above-mentioned situation, the present invention aims to provide a substrate cutting device and a substrate cutting method that can stably discharge cut and separated scraps (waste material) to the outside, improve the workability of the cutting and separation work, and enable efficient cutting work. [Means for solving the problem]

[0009] The substrate cutting device of the present invention cuts a substrate into individual pieces, and is equipped with a table for receiving the substrate, cutting means for cutting and separating the substrate on the table, receiving means for receiving substrate scraps cut and separated from the substrate by the cutting means, and blowing means for spraying a spray medium, wherein the blowing means is equipped with a medium injection mechanism having a medium injection nozzle for spraying a medium that applies a force to push the substrate scraps in a direction away from the product side that remains after the substrate scraps have been cut and separated.

[0010] According to the substrate cutting device of the present invention, the substrate on the table can be cut and separated into individual pieces by the cutting means. The substrate scraps cut by the cutting means can be pushed away by the blowing means to the receiving means side.

[0011] The table may be provided with a backup section for receiving the substrate scraps that have been cut and separated from the substrate, and the medium ejected from the medium ejection nozzle of the medium ejection mechanism may be ejected diagonally from above the product side of the substrate scraps, thereby applying a pushing force to move the substrate scraps away from the product side.

[0012] In this way, in a machine equipped with a backup section, the cut board scraps are received by the backup section. However, the spray medium from the medium spray nozzle of the medium spray mechanism applies a force to push the board scraps away from the product. As a result, the board scraps are discharged to the outside via the backup section.

[0013] A scrap receiving surface that receives the substrate scrap material through a space is provided below the substrate scrap material that has been cut and separated from the substrate, and the spray medium from the medium spray nozzle of the medium spray mechanism is sprayed diagonally from above on the side of the substrate scrap material opposite the product, thereby applying a force to push the substrate scrap material away from the product side.

[0014] In this way, when a space is provided below the board scrap, the cut board scrap falls onto the scrap receiving surface through the space. However, the spray medium from the medium spray nozzle of the medium spray mechanism applies a force to push the board scrap away from the product, and the board scrap is discharged to the outside through the scrap receiving surface.

[0015] The medium injection mechanism includes a first injection form in which the injection medium is sprayed from the medium injection nozzle of the medium injection mechanism from the product side to the anti-product side, thereby applying a pushing force to the substrate scrap in a direction away from the product side, and a second injection form in which the injection medium is sprayed from the medium injection nozzle of the medium injection mechanism from the anti-product side to the product side, thereby applying a pushing force to the substrate scrap in a direction away from the product side, and the first injection form and the second injection form may be formed by changing the injection direction from the medium injection nozzle.

[0016] In this way, the substrate cutting device capable of switching between the first and second ejection modes can accommodate a variety of substrates, including substrates having a backup section for receiving substrate scraps and substrates not having a backup section for receiving substrate scraps (substrates having a space section below the substrate scraps), i.e., substrates that require a backup section when cut by the cutting means and substrates that do not require a backup section when cut by the cutting means.

[0017] The medium injection mechanism may include a first medium injection nozzle that sprays the medium from diagonally above the product side of the substrate scrap, and a second medium injection nozzle that sprays the medium from diagonally above the opposite side to the product side of the substrate scrap. In this case, the first injection form can be achieved by spraying the injection medium from the first medium injection nozzle, and the second injection form can be achieved by spraying the injection medium from the second medium injection nozzle.

[0018] In a device equipped with a first medium ejection nozzle and a second medium ejection nozzle, if a backup section is provided, the ejection medium can be ejected from the first medium ejection nozzle to push the substrate scrap away from the product. In a device equipped with no backup section and an scrap receiving surface with a space therebelow the substrate scrap, the ejection medium can be ejected from the second medium ejection nozzle to push the substrate scrap away from the product.

[0019] The medium ejection mechanism may have one medium ejection nozzle and may be capable of switching the medium ejection direction of the medium ejection nozzle. In this case, the medium ejection mechanism may be configured to have a first ejection form or a second ejection form by switching the medium ejection direction of the medium ejection nozzle.

[0020] It is preferable that there is no space on the table for arranging devices that are not used when cutting the substrate, including members for adjusting the cutting means. By setting it in this way, the turntable can be made small and light, and can be rotated with a relatively small driving force. Moreover, there is no need to increase the rigidity of the rotating part (bearings, etc.), which allows for improved design and reduced costs.

[0021] It is preferable that the medium spray nozzle of the blowing means and the substrate cutting portion of the cutting means move together as one unit. By moving them together in this manner, the position at which the medium is sprayed by the blowing means is stabilized, and the substrate scraps are stably pushed toward the receiving means.

[0022] The substrate cutting section of the cutting means may have a cutter for cutting the substrate and a cooling medium injection nozzle for injecting a cooling medium onto the cutter and the cut portion cut by the cutter. This allows the cooling medium injected from the cooling medium injection nozzle to cool the cutter and the cut portion, without reducing the cutting function of the cutter, and effectively prevents damage to the cutter and the substrate.

[0023] It is preferable to provide an XYZ moving mechanism for integrally moving the substrate cutting section of the cutting means and the medium ejection nozzle of the blowing means in the XYZ-axis direction, and a rotation drive mechanism for rotating the table in the θ direction. With this configuration, the substrate cutting section can be moved in three axial directions, the X-axis direction, the Y-axis direction, and the Z-axis direction, by the XYZ moving mechanism. Therefore, if the substrate cutting section is first raised along the Z-axis direction, lowered along the Z-axis direction, and moved along the X-axis direction, a cutting line in the X-axis direction can be formed on the substrate. After that, if the substrate cutting section is raised along the Z-axis direction, and then lowered along the Z-axis direction from the raised state, and moved along the X-axis direction, a cutting line in the X-axis direction shifted in the Y-axis direction by a predetermined pitch from the previous cutting line in the X-axis direction can be formed on the substrate. Thereafter, by forming a cutting line in the X-axis direction shifted in the Y-axis direction by a predetermined pitch in the same manner, a plurality of cutting lines in the X-axis direction shifted in the Y-axis direction by a predetermined pitch can be formed over the entire range of the Y-axis direction of the substrate. Next, by rotating the table by 90° using the rotary drive mechanism, the formed cutting lines become multiple cutting lines in the Y-axis direction, which are shifted in the X-axis direction by a predetermined pitch, over the entire range of the X-axis direction of the substrate. Therefore, by performing the above-mentioned process, multiple cutting lines in the X-axis direction, which are shifted in the Y-axis direction by a predetermined pitch, are formed over the entire range of the Y-axis direction of the substrate. This allows a matrix of cutting lines to be formed on the substrate, making it possible to separate the substrate. In this way, with an XYZ movement mechanism and a rotary drive mechanism, a matrix of cutting lines can be formed on the substrate, making it possible to separate the substrate, making it a stable substrate cutting device.

[0024] The receiving means may have a gutter member disposed on the outer periphery of the table. By providing such a gutter member, the substrate end pieces can be received by this gutter member, and the structure can be simplified.

[0025] It is preferable that the table is provided with a suction means for suctioning each of the individual substrate pieces onto the substrate placement surface of the table, so that the substrate does not shift during cutting and the cutting lines formed are stable.

[0026] Water can be used as the injection medium for the blowing means and the cooling medium for the cutting means. By using water in this way, it is possible to reduce costs and perform stable injection and cooling.

[0027] The substrate cutting method of the present invention is a substrate cutting method in which the substrate cutting device is used to cut a substrate into individual pieces, in which after the substrate scrap is cut by the cutting means, the cutter of the cutting means is raised and moved away from the substrate, and a medium injection nozzle is moved in a direction opposite to the cutting direction of the substrate scrap while an injection medium is sprayed from the medium injection nozzle.

[0028] When cutting the substrate scraps with the cutting means, the spray medium is sprayed from the media spray nozzle. However, in this case, since the cutter is inserted into the gap between the cut end faces facing each other, the spray medium does not easily enter between the cut end faces, and the substrate scraps may not be pushed toward the receiving means side in an unsteady manner. For this reason, the cutter of the cutting means is raised, and the spray medium is sprayed from the media spray nozzle while moving in the opposite direction (the return direction from the cutting end of the cutter to the cutting start end of the cutter) to the cutting direction (the moving direction of the cutter when cutting), thereby stabilizing the pushing of the substrate scraps toward the receiving means side. In other words, the substrate scraps to be cut off can be pushed toward the receiving means side by the spray medium without the cutter being present, and the precision of the pushing can be improved. Effect of the Invention

[0029] In the present invention, the substrate scraps cut by the cutting means can be swept toward the receiving means by the blowing means, so that the substrate scraps can be stably supplied to the receiving means and do not stagnate on a table, etc., eliminating the need for an operator to remove the substrate scraps. In particular, the turntable only needs to be rotated 90 degrees when switching between cutting the substrates along the column direction and cutting the substrates along the row direction, resulting in excellent productivity and no need to change the orientation of the medium ejection nozzle, which simplifies the device and achieves low costs.

[0030] In the substrate cutting method of the present invention, the substrate scrap can be stably separated from the product side of the substrate by moving the medium spray nozzle in a direction opposite to the substrate scrap cutting direction while spraying the spray medium from the medium spray nozzle used when cutting the scrap. [Brief description of the drawings]

[0031] [Figure 1] 1 is a simplified cross-sectional view of a substrate cutting device showing an embodiment of the present invention. [Diagram 2] 2 is a simplified cross-sectional view of the substrate cutting device shown in FIG. 1 with a medium ejection nozzle omitted. [Diagram 3] 2 is a simplified plan view of the substrate cutting device shown in FIG. [Figure 4] 2 is a cross-sectional view of a main part of the substrate cutting device shown in FIG. [Diagram 5] 4A shows a sequence for forming cutting lines on a substrate, in which FIG. 4A is a simplified diagram showing a state in which cutting lines are formed in the X-axis direction, and FIG. 4B is a simplified diagram showing a state rotated 90° from the state shown in FIG. 4A. [Figure 6] FIG. 2 is a simplified diagram showing a state in which cutting lines are formed in a matrix on a substrate using the substrate cutting device shown in FIG. [Figure 7] FIG. 4 is a simplified plan view showing the ejection direction of a medium from a first medium ejection nozzle. [Figure 8] 5A and 5B show the direction of medium ejection from the second medium ejection nozzle, in which (a) is a simplified side view during travel on the outward path, and (b) is a simplified side view during travel on the return path. [Figure 9]FIG. 11 is a simplified plan view showing the ejection direction of the medium from a second medium ejection nozzle. [Figure 10] FIG. 11 is a simplified front view showing the ejection direction of the medium from the second medium ejection nozzle. [Figure 11] FIG. 11 is a simplified cross-sectional view of a substrate cutting device showing a comparative example. [Figure 12] 1 is a simplified diagram showing a state in which cutting lines are formed in a matrix on a substrate. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0032] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0033] FIG. 1 shows a substrate cutting device according to the present invention, which comprises a table 2 for receiving a substrate 1, cutting means 3 for cutting and separating the substrate 1 on the table 2, receiving means 4 for receiving substrate scraps 1b cut and separated from the substrate 1 by the cutting means 3, blowing means 5 for spraying a jet medium to push the substrate scraps 1b cut by the cutting means towards the receiving means 4, and guide means 6 for guiding the substrate scraps 1b to the receiving means 4.

[0034] The substrate 1 has a plurality of circuit patterns formed thereon, and is cut into individual pieces to form substrate pieces 1a, which are CPU substrates (motherboard substrates), as shown in Fig. 6. When the substrate pieces 1a are formed as products by creating cutting lines L1 and L2 in a matrix on the substrate 1 in this manner, the substrate scraps 1b are formed as waste materials on the four sides of the substrate 1.

[0035] The table 2 has an upper wall that is square in plan view, and forms a plurality of small block piece portions 10 divided therein, as shown in Figs. 1 and 2. That is, the small block piece portions 10 correspond to the substrate pieces 1a formed by cutting and separating them by the cutting device. The table 2 is provided with a suction means 11 that suctions the substrate pieces 1a to each of the small block piece portions 10. The suction means 11 includes a vacuum mechanism (not shown), and a vacuum passage 12 is formed in the table. Each of the small block piece portions 10 is provided with a suction port 13, which is connected to the vacuum passage 12. Therefore, by driving the vacuum mechanism to put the vacuum passage 12 in a negative pressure state, each of the substrate pieces 1a is suctioned to each of the small block piece portions 10 through the suction port 13. Note that a vacuum pump, a vacuum ejector, or the like is used as the vacuum mechanism.

[0036] Furthermore, this table 2 rotates in the θ direction around its center by a rotation drive mechanism (not shown). The rotation drive mechanism is composed of, for example, a drive motor (such as a servo motor) and a drive force transmission mechanism that transmits the rotational drive force of the drive motor to the table 2. The drive force transmission mechanism can be composed of a gear mechanism, a belt mechanism, or the like.

[0037] The cutting means 3 includes a disk-shaped cutter 15, a motor 16 for rotating the cutter 15 about its axis, and an injection mechanism for injecting a cooling medium (e.g., cooling water). The injection mechanism has a cooling medium injection nozzle (not shown) disposed near the rotating cutter 15, and injects the cooling medium from a cooling medium supply source (not shown) onto the cutter 15 or the portion of the substrate 1 cut by the cutter 15 through the cooling medium injection nozzle.

[0038] In this case, the substrate cutting section M, which is composed of the cutter 15, motor 16, medium ejection nozzle, etc., can be moved in mutually orthogonal X-axis, Y-axis, and Z-axis directions by an XYZ movement mechanism (not shown). Here, the X-axis and Y-axis directions are directions shown in the coordinate system of Fig. 5 on a horizontal plane, and the Z-axis direction is the vertical direction. The XYZ movement mechanism can use an XYZ stage or an XYZ arm.

[0039] The receiving means 4 has gutter members 20 (20a, 20b) disposed on the outer periphery of the table 2. As shown in FIG. 3, the gutter members 20 are disposed in front and behind the table 2 and are made of frames having upward openings. That is, as shown in FIG. 1, the front gutter member 20a has a front wall 21a, a rear wall 22a and a bottom wall 23a, and receives the scrap 1b guided by the guide means 6. The rear gutter member 20b has a front wall 21b, a rear wall 22b and a bottom wall 23b, and receives the scrap 1b guided by the guide means 6. In this case, the table 2 is provided with a backup section 60 that receives the board scrap 1b cut from the board 1.

[0040] 3, guide members 25 (25a, 25b) that guide scrap material 1b between gutter members 20a, 20b are arranged on both sides of table 2. Guide member 25 includes an inclined plate 26 that inclines downward from the middle of front and rear gutter members 20a, 20b toward the front, and an inclined plate 27 that inclines downward from the middle of front and rear gutter members 20a, 20b toward the rear. Therefore, scrap material 1b that falls into guide member 25 (25a, 25b) is guided by inclined plates 26, 27 of guide member 25 and supplied to front gutter member 20a or rear gutter member 20b.

[0041] The guide means 6 has guide plates 30 attached to the four sides of the table 2, respectively, and inclined obliquely downward from the substrate 1 side toward the receiving means 4 side. On the upper surface 31 of this guide plate 30, a plurality of grooves 32 are provided at a predetermined pitch along the corresponding side of the table 2 in a direction perpendicular to the corresponding side.

[0042] 1 and 2, the guide means 6 may be provided with a lower guide plate 35 disposed below the guide plate 30 on the side of each gutter member 20a, 20b as shown in Fig. 3 and Fig. 4. In this case, the lower guide plate 35 is inclined obliquely downward from the substrate 1 side toward the receiving means 4 side, and its outer edge portion protrudes outward beyond the guide plate 30. Similarly to the guide plate 30, a recessed groove may be provided on the upper surface.

[0043] The blowing means 5 includes a medium injection mechanism 8 having a pair of first and second medium injection nozzles 40A, 40B as a medium injection unit attached to the substrate cutting unit M, which is composed of the cutter 15, the motor 16, and a cooling medium injection nozzle, and water is also injected from the first and second medium injection nozzles 40A, 40B as the injection medium W (see FIG. 7) to the cutting portion of the substrate. That is, the blowing means 5 includes the first and second medium injection nozzles 40A, 40B and a supply source (not shown) that supplies water as the injection medium W to the first and second medium injection nozzles 40A, 40B. Therefore, the substrate cutting unit M and the first and second medium injection nozzles 40A, 40B are moved together by the XYZ movement mechanism. Each medium injection nozzle 40A, 40B is attached integrally to the cutter support frame.

[0044] In the illustrated example, one moving unit A is provided, which is made up of the substrate cutting section M and the medium ejection nozzles 40 (40A, 40B). However, in consideration of cutting efficiency, it is preferable to provide two moving units A. When two moving units A are provided, they are disposed symmetrically with respect to the substrate 1.

[0045] As shown by the solid line in FIG. 1, the first medium injection nozzle 40A injects the injection medium W (see FIG. 7) from its injection port 40Aa along the inclination of the guide plate 30 of the guide means 6 of one gutter member 20a, and as shown by the imaginary line in FIG. 1, the second medium injection nozzle 40B injects the injection medium W (see FIG. 7) from its injection port 40Aa along the inclination of the guide plate 30 of the guide means 6 of the other gutter member 20b.

[0046] 7, the ejection medium W from the first medium ejection nozzle 40A is directed obliquely outward (opposite the product side) with respect to the traveling direction of the cutter 15. Therefore, the substrate end 1b is swept away obliquely outward (opposite the product side) with respect to the traveling direction of the cutter 15, and is separated from the product.

[0047] That is, the product side of the injection medium W injected from the first injection nozzle 40A is injected as indicated by the arrow X1, and the anti-product side of the injection medium W injected from the first injection nozzle 40A flows as indicated by the arrow X2. Therefore, the flow is as indicated by the arrow X3 from the upstream side to the downstream side in the running direction (cutting direction). Therefore, the substrate end material 1b is stably swept away on the back-up section 60 toward the receiving means 4 side.

[0048] As described below, the direction of the ejection medium from the first and second medium ejection nozzles 40A, 40B may be any direction that separates the cut board scrap 1b from the product side (board piece 1a side) and pushes it toward the guide plate 30 of the guide means 6. For this reason, the ejection angles α1, α2 (angles seen from the cutter travel direction) of the ejection medium from the first and second medium ejection nozzles 40A, 40B are preferably set in the range of 30° to 60°. In this case, the ejection angles α1, α2 of the ejection medium do not have to be the same as the inclination angles β1, β2 of the guide plates 30, 30.

[0049] Furthermore, the flow velocity and flow rate of the jetting medium jetted from the first and second medium jetting nozzles 40A, 40B can be set in various ways within a range in which the cut substrate end material 1b can be pushed toward the guide plate 30 of the guide means 6. In this case, the flow velocity and flow rate of the jetting medium can be changed depending on the jetting angles α1, α2 of the jetting medium from the first and second medium jetting nozzles 40A, 40B, the type of jetting medium, etc.

[0050] Incidentally, in this type of substrate cutting device, it is common to place devices such as a grindstone for grinding cutter 15 of cutting means 3, a Y-axis correction checker, a Z-axis correction checker, etc. For this reason, in conventional substrate cutting devices, such devices are generally placed on table 2 on which substrate 1 is placed and held.

[0051] However, if such equipment is placed on table 2, the weight of table 2 including the equipment becomes large, and a large driving force is required to rotate table 2, and the rigidity of the rotating parts (bearings, etc.) also needs to be high.

[0052] Therefore, in the present invention, there is no space for arranging devices that are not used when cutting the substrate, including members (such as grindstones) for adjusting the cutting means 3. Therefore, the devices that are not used when cutting the substrate are arranged in a location other than the table 2.

[0053] Next, a method for cutting and separating the substrate 1 using the substrate cutting device configured as described above will be described. First, the substrate 1 is placed on the table 2. Then, the substrate 1 is sucked for each small block piece 10 by the suction means 11. In this state, the moving unit body A, which is composed of the substrate cutting part M and the medium ejection nozzles 40 (40A, 40B), is driven by the XYZ movement mechanism to form a cutting line L1 on the substrate 1, as shown in Figures 5(a) and (b).

[0054] That is, the substrate cutting section M, and in turn the movable unit body A, are raised along the Z-axis direction, then lowered along the Z-axis direction, and moved along the X-axis direction shown by the coordinate axes in Fig. 5(a), thereby forming a cutting line in the X-axis direction on the substrate. In this case, if there are two movable unit bodies A, first, one movable unit body A forms the cutting line L1 on the front side, and the other unit body A forms the cutting line L1 on the rear side.

[0055] Thereafter, each unit body A is raised along the Z-axis, and then one of the moving unit bodies A is moved rearward in the Y-axis direction by a predetermined pitch, and then lowered from the raised state along the Z-axis direction, and moved along the X-axis direction. This makes it possible to form a cutting line L1 in the X-axis direction on the substrate 1 that is shifted rearward in the Y-axis direction by a predetermined pitch from the previous cutting line in the X-axis direction. In addition, the other moving unit body A is moved forward in the Y-axis direction by a predetermined pitch, and then lowered from the raised state along the Z-axis direction, and moved along the X-axis. This makes it possible to form a cutting line L1 in the X-axis direction on the substrate 1 that is shifted forward in the Y-axis direction by a predetermined pitch from the previous cutting line in the X-axis direction.

[0056] Thereafter, by similarly forming cutting lines L1 in the X-axis direction, which are shifted in the Y-axis direction by a predetermined pitch, multiple cutting lines L1 in the X-axis direction, which are shifted in the Y-axis direction by a predetermined pitch, can be formed over the entire Y-axis range of the substrate, as shown in Figure 5(a).

[0057] Next, by using the rotary drive mechanism to rotate the table 90° as shown in FIG. 5(b), the formed cutting lines L1 become multiple cutting lines in the Y-axis direction, shifted in the X-axis direction by a predetermined pitch, over the entire range of the X-axis direction of the substrate.

[0058] Therefore, by carrying out the above-mentioned process, a plurality of cutting lines L2 in the X-axis direction, which are shifted in the Y-axis direction by a predetermined pitch, are formed over the entire range of the substrate in the Y-axis direction, as shown in Fig. 6. This allows a matrix of cutting lines L1, L2 to be formed on the substrate 1, making it possible to separate the substrate 1.

[0059] Incidentally, when the cutting lines L1 and L2 are formed, a cooling medium (cooling water) is sprayed by the cutting means 3, and a jetting medium (sprayed water) is sprayed from the blowing means 5. Therefore, when the scrap 1b is cut and separated from the substrate 1, it is pushed toward the guide plate 30 by the jetting medium, as shown in FIG.

[0060] Incidentally, when cutting the substrate 1 in a matrix, for example, by cutting the substrate 1 along the row direction, the direction in which the first substrate scrap 1b is cut and separated from the product differs from the direction in which the last substrate scrap 1b is cut and separated from the product. However, the substrate cutting device includes a pair of medium ejection nozzles 40A, 40B, and the pair of medium ejection nozzles 40A, 40B apply a force to push the substrate scraps in opposite directions, so that whether it is the first substrate scrap 1b or the last substrate scrap 1b, each substrate scrap 1b can be pushed in a direction to move it away from the product.

[0061] In contrast, in a device equipped with one medium ejection nozzle set to a fixed ejection direction, the turntable is rotated to accommodate this, but it is necessary to change the orientation of the medium ejection nozzle, which is less efficient to use, and when changing the orientation of the medium ejection nozzle, a mechanism is required to change the orientation, which leads to a complicated device configuration. However, in the present invention, the table 2 only needs to be rotated 90 degrees when switching between cutting the substrate 1 along the column direction and cutting the substrate 1 along the row direction, and there is no need for a configuration to change the orientation of the medium ejection nozzle 40.

[0062] When cutting the substrate scrap 1b, the injection medium (water) and the cooling medium (cooling water) flow from the substrate side to the gutter members 20 (20a, 20b) through the grooves 32 of the guide plate 30. Therefore, the substrate scrap 1b swept toward the guide plate 30 flows into the gutter members 20 (20a, 20b).

[0063] In this device, the XYZ movement mechanism, the rotary drive mechanism, the cutting means 3, the blowing means 5, etc. are controlled by a control means (not shown) to carry out the cutting process. The control means is, for example, a microcomputer with a CPU (Central Processing Unit) at the center and ROM (Read Only Memory), RAM (Random Access Memory), etc. connected to each other via a bus. The ROM stores programs and data executed by the CPU.

[0064] In the present invention, the board scraps 1b cut by the cutting means 3 can be swept away towards the receiving means 4 by the blowing means 5, and when swept away, the board scraps 1b are guided to the receiving means 4 by the guide means 6. Therefore, the board scraps 1b can be stably supplied to the receiving means 4 and do not stagnate on the table 2 or the like, eliminating the need for an operator to remove the board scraps 1b.

[0065] As the guide means 6 has the guide plate 30 having the recessed groove 32 on its upper surface, the substrate scrap 1b can be supplied to the receiving means 4 without adhering to the guide plate 30, stabilizing the recovery operation of the substrate scrap 1b. Also, as the medium ejection nozzle 40 and the substrate cutting unit M can move integrally, the medium can be ejected stably against the substrate scrap 1b, and the substrate scrap 1b can be stably pushed away.

[0066] The cutter 15 and the cutting area can be cooled by the cooling medium sprayed from the cooling medium spray nozzle, which does not impair the cutting function of the cutter 15 and effectively prevents damage to the cutter 15 and the substrate 1. As the device is provided with an XYZ movement mechanism and a rotation drive mechanism, it can form a matrix of cutting lines L1, L2 on the substrate 1, enabling the substrate 1 to be divided into individual pieces, making the device a stable substrate cutting device.

[0067] Since the gutter member 20 is provided, the substrate end material 1b can be received by this gutter member 20, and further, the structure can be simplified.

[0068] The provision of the lower guide plate 35 makes it possible to guide the receiving means 4 to a position that cannot be reached by the upper guide plate 30, and prevents the discharge of the substrate scraps 1b outside the receiving means 4. In addition, in cases where the upper guide plate 30 cannot be made large in consideration of the rotation space required for rotating the table 2, the provision of such a lower guide plate 35 has the advantage that this device can be installed in a location where a large rotation space cannot be secured. The provision of a groove on the upper surface of the lower guide plate 35 allows the ejection medium to flow through this groove, so that the substrate scraps 1b flow toward the receiving means 4 without adhering to the guide plate 30.

[0069] Since each small substrate piece 1a is adsorbed to the small block piece portion 10 by the adsorption means 11, the substrate 1 does not shift during cutting, and the cut lines L1, L2 that are formed are stable. By using water as the spray medium of the blowing means 5 and the cooling medium of the cutting means 3, it is possible to reduce costs and achieve stable spraying and cooling.

[0070] Incidentally, Fig. 11 shows, as a comparative example, a case where the guide means 6 is not provided. In this way, without the guide means 6, even if the scraps 1b are blown away by the blowing means 5, they are difficult to collect in the gutter members 20 (20a) (20b), and there is a risk that they will accumulate on the steps of the table 2. If the scraps 1b accumulate in this way, they may cause equipment errors, and in order to prevent this, it is necessary for an operator to periodically (at short intervals) remove the scraps 1b, which reduces workability.

[0071] In contrast, by providing a guide means 6 as in the present invention, scrap material 1b will not accumulate in any area other than the gutter member 20, and there is no need for workers to remove the scrap material 1b at short intervals, thereby significantly improving workability.

[0072] When cutting the substrate scrap 1b with the cutting means 3, the spray medium is sprayed from the media spray nozzle. In this case, the cutter 15 is inserted into the gap between the cut end faces facing each other, so the spray medium W does not easily enter between the cut end faces, and the substrate scrap 1b may not be pushed toward the receiving means 4 side in an unstable manner. For this reason, the cutter 15 of the cutting means 3 is raised, and the spray medium is sprayed from the media spray nozzle 40A (40B) while moving in the opposite direction to the cutting direction (the moving direction of the cutter 15 when cutting) (the return direction from the cutting end of the cutter 15 to the cutting start end of the cutter 15), thereby stabilizing the pushing of the substrate scrap 1b toward the receiving means 4 side. In other words, the substrate scrap 1b to be cut can be pushed toward the receiving means 4 side by the spray medium without the cutter 15 being present, and the precision of the pushing can be improved.

[0073] In the above embodiment, the table 2 was provided with a backup section 60 for receiving the substrate scrap 1b. However, as shown in Figures 8(a) and (b), instead of providing the backup section 60, a scrap receiving surface 62 may be provided below the substrate scrap 1b via a space 61.

[0074] In this way, when the space 61 is provided, the second jet nozzle 40B arranged on the opposite side to the product is used as the jet nozzle 40 used to push the substrate end material 1b toward the receiving means 4. Note that Fig. 8(a) shows the jetting state of the jet medium W from the second jet nozzle 40B while cutting the substrate 1, and Fig. 8(b) shows the jetting state of the jet medium W from the second jet nozzle 40B without cutting the substrate 1.

[0075] As shown in Figure 10, the injection port 40Ba of this second injection nozzle 40B is provided upstream in the running direction (cutting direction) of the cutter 15, and when viewed from the running direction of the cutter 15, as shown in Figures 8(a) and (b), the water spreads out in a triangular shape from the injection port 40Ba of the second injection nozzle 40B and is injected onto the scrap receiving surface 62, and in a planar view, as shown in Figure 9, the water spreads out in a triangular shape from the injection port 40Ba and is injected so as to hit the vertical end surface 63 of the space portion 61 from the opposite product side.

[0076] Therefore, the product side of the injection medium W injected from the second injection nozzle 40B is injected as shown by the arrow X4, hits the vertical end surface 63 of this space portion 61, and flows as shown by the arrow X5. The non-product side of the injection medium W injected from the second injection nozzle 40B flows as shown by the arrow X6. Therefore, it flows from the upstream side to the downstream side in the traveling direction (cutting direction) as shown by the arrow X7. Moreover, this flow is formed before the board scrap 1b falls onto the scrap receiving surface 62, so that the board scrap 1b is interposed between the board scrap 1b and the scrap receiving surface 62, and the board scrap 1b is stably swept away on the scrap receiving surface 62 toward the receiving means 4 side.

[0077] In the above embodiment, the injection nozzle 40 includes a first injection nozzle 40A that injects the medium from the product side to the anti-product side, and a second injection nozzle 40B that injects the medium from the anti-product side to the product side. That is, in the embodiment, by using the first injection nozzle 40A, a first injection form can be formed in which the injection medium is sprayed from the product side to the anti-product side to impart a sweeping force to the substrate end material in a direction away from the product side, and by using the first injection nozzle 40A, a second injection form can be formed in which the injection medium is sprayed from the anti-product side to the product side to impart a sweeping force to the substrate end material in a direction away from the product side.

[0078] Alternatively, the medium ejection nozzle 40 may be provided with only one unit. In this case, the one unit of the ejection nozzle 40 may be configured to be displaced between a first ejection form and a second ejection form. Specifically, the medium ejection nozzle 40 may be configured to be displaced so as to be in line symmetry.

[0079] In this way, the substrate cutting device capable of switching between the first and second ejection modes can accommodate a variety of substrates, including those having a backup section 60 for receiving substrate scrap 1b and those not having a backup section 60 for receiving substrate scrap 1b (those having a space section 61 below substrate scrap 1b). That is, the device can accommodate substrates 1 that require a backup section 60 when cut by cutting means 3 and substrates 1 that do not require a backup section 60 when cut by cutting means 3.

[0080] Incidentally, even when there is no backup section 60 as shown in Fig. 8 and the like, it is preferable to provide guide means 6 having a guide plate 30 as shown in Fig. 1 and to discharge the substrate end material 1b into the gutter member 20 via this guide means 6. However, it is also possible to discharge the substrate end material 1b directly from the space portion 61 into the gutter member 20 without providing such guide means 6. Therefore, even when there is a backup section 60 as shown in Fig. 1, it is also possible to discharge the substrate end material 1b directly from the backup section 60 into the gutter member 20 without providing such guide means 6.

[0081] Although the embodiment of the present invention has been described above, various modifications are possible without being limited to the above embodiment. For example, in the above embodiment, water is used as the injection medium W, but various fluids such as various liquids other than water, gas, and liquid containing bubbles may be used. As a fluid other than water, a cleaning liquid for cleaning the substrate may be used. In addition, air may be used as the gas. The inclination angle of the guide plate 30, the width dimension of the groove 32, the depth dimension of the groove 32, the cross-sectional shape of the groove 32, the number of the grooves 32, the arrangement pitch of the grooves 32, etc. can be set arbitrarily within a range in which the cut and separated end material can be pushed toward the receiving means 4 without adhering to the guide plate 30. In addition, the lower guide plate 35 may not be provided.

[0082] The number of moving unit bodies A only needs to be one or more, so it may be three or four. Therefore, the number of medium ejection nozzles 40 only needs to be one or more for the moving unit A, so it may be three or more. The arrangement pitch of the cutting lines L1, L2 to be formed can also be set arbitrarily. That is, it can be set in various ways depending on the size of the small block piece portion 10 of the table 2. Also, although a disc cutter is used as the cutter 15 of the cutting means 3, other cutting tools such as a router bit may also be used.

[0083] The number and size of the small block pieces 10 of the table 2 can be set as desired. In the illustrated example, the small block pieces 10 are square when viewed from above, but they may be rectangular.

[0084] Incidentally, when a backup 60 is provided, it is sufficient that the size of the backup portion 60 can be received therein. Furthermore, when a space portion 61 is provided, the size of the space portion 61 should be such that the medium ejected from the medium ejection nozzle 40B creates a medium flow as shown in Figure 9, and the cut substrate scrap 1b that falls onto the scrap receiving surface 62 flows along this flow away from the product, and falls into the gutter member 20. [Explanation of symbols]

[0085] 1 Board 1a PCB piece 1b Substrate scrap 2 Tables 3 Cutting means 4. Receiving means 5. Blowing means 6 Guide means 15 cutter 16 Motor 20, 20a, 20b gutter parts 25, 25a, 25b Guide members 30 Guide plate 31 Top side 32 Groove 35 Lower guide plate 40, 40A, 40B Media injection nozzle

Claims

1. A substrate cutting device for cutting a substrate into individual pieces, the device comprising: a table for receiving the substrate; cutting means for cutting and separating the substrate on the table; receiving means for receiving substrate scraps cut and separated from the substrate by the cutting means; and blowing means for blowing a jetting medium; The blowing means is equipped with a medium injection mechanism having a medium injection nozzle that sprays a medium to apply a pushing force to the substrate scrap in a direction away from the product side that remains after the substrate scrap is cut and separated, and a scrap receiving surface that receives the substrate scrap through a space is provided below the substrate scrap that has been cut and separated from the substrate, and the substrate cutting device is characterized in that the injection medium from the medium injection nozzle of the medium injection mechanism is sprayed diagonally from above on the opposite side of the substrate scrap, applying a pushing force to the substrate scrap in a direction away from the product side.

2. A substrate cutting device for cutting a substrate into individual pieces, comprising: a table for receiving the substrate; cutting means for cutting and separating the substrate on the table; receiving means for receiving substrate scraps cut and separated from the substrate by the cutting means; and blowing means for spraying a jet medium, The blowing means is equipped with a medium injection mechanism having a medium injection nozzle that injects a medium to impart a pushing force to the substrate scrap in a direction away from the product side that remains after the substrate scrap is cut and separated, and is equipped with a first injection form in which the injection medium is sprayed from the medium injection nozzle of the medium injection mechanism from the product side to the anti-product side to impart a pushing force to the substrate scrap in a direction away from the product side, and a second injection form in which the injection medium is sprayed from the media injection nozzle of the media injection mechanism from the anti-product side to the product side to impart a pushing force to the substrate scrap in a direction away from the product side, and a substrate cutting device characterized in that the first injection form and the second injection form are formed by changing the injection direction from the media injection nozzle.

3. The substrate cutting device according to claim 2, characterized in that the table is provided with a backup section which receives the substrate scrap material which has been cut and separated from the substrate, and the ejection medium from the medium ejection nozzle of the medium ejection mechanism is ejected diagonally from above the product side of the substrate scrap material, thereby applying a force to push the substrate scrap material away from the product side.

4. The substrate cutting device described in claim 2, characterized in that the medium injection mechanism includes a first medium injection nozzle that sprays from diagonally above the product side of the substrate scrap, and a second medium injection nozzle that sprays from diagonally above the opposite product side of the substrate scrap.

5. 3. The substrate cutting device according to claim 2, wherein the medium ejection mechanism has one medium ejection nozzle, and the medium ejection direction of the medium ejection nozzle can be switched.

6. The substrate cutting device according to any one of claims 1 to 5, characterized in that there is no space on the table for placing equipment that is not used when cutting the substrate, including members for adjusting the cutting means.

7. 7. The substrate cutting device according to claim 1, wherein a medium ejection nozzle of the blowing means and a substrate cutting portion of the cutting means move integrally.

8. 8. The substrate cutting apparatus according to claim 7, wherein the substrate cutting section of the cutting means has a cutter for cutting the substrate and a cooling medium injection nozzle for injecting a cooling medium onto the cutter or onto the cut portion cut by the cutter.

9. The substrate cutting device according to claim 8, further comprising an XYZ movement mechanism for integrally moving the substrate cutting portion of the cutting means and the medium ejection nozzle of the blowing means in the XYZ axial directions, and a rotation drive mechanism for rotating the table in the θ direction.

10. 10. The substrate cutting device according to claim 1, wherein the receiving means has a gutter member disposed on the outer periphery of the table.

11. The substrate cutting apparatus according to any one of claims 1 to 10, further comprising a suction means provided on the table for suctioning each of the individual substrate pieces onto a substrate placement surface of the table.

12. 12. The substrate cutting device according to claim 1, wherein the ejection medium of the blowing means and the cooling medium of the cutting means are water.

13. A substrate cutting method for cutting a substrate into individual pieces using a substrate cutting device, comprising: The substrate cutting device cuts a substrate into individual pieces, and includes a table for receiving the substrate, cutting means for cutting and separating the substrate on the table, receiving means for receiving substrate scraps cut and separated from the substrate by the cutting means, and blowing means for spraying a spray medium, and the blowing means includes a medium spray mechanism having a medium spray nozzle for spraying a medium that applies a force to the substrate scraps in a direction away from the product side that remains after the substrate scraps have been cut and separated, A substrate cutting method characterized in that after cutting a substrate scrap with a cutting means, the cutter of the cutting means is raised and moved away from the substrate, and a medium spray nozzle is moved in a direction opposite to the cutting direction of the substrate scrap while spraying a spray medium from the medium spray nozzle used when cutting the scrap.

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