Wafer carrier measuring device

Abstract

To provide a wafer carrier measuring device.SOLUTION: A measuring device according to the present invention measures a wafer carrier having an open end and at least one gas flow pipe installed therein. A wafer carrier measuring device includes a mounting interface for fixing the wafer carrier. The open end of the wafer carrier faces a detection space of the measuring device. The mounting interface includes an air supply assembly that is connected to a bottom plate of the wafer carrier to supply gas to the wafer carrier. A measuring assembly is disposed within the detection space and mainly measures the flow rate of gas from the gas flow pipe within an accommodating space. The measuring assembly includes a plurality of wind speed sensing elements and a plurality of displacement sensing elements fixed to a second connecting member structure.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a wafer carrier measurement system, and more particularly to a system for measuring gas flow data from gas flow tubes within a wafer carrier. [Background technology]

[0002] 1A and 1B show an existing wafer carrier C including a housing H having a top, a bottom, a back, and a pair of sides, the housing H having an open end OP. When a door cover (not shown) is mated with the open end OP of the wafer carrier C, the door cover and the housing H form a sealed storage space S. C The storage space S C A pair of support members SM for supporting a plurality of wafers (not shown) and at least one gas flow pipe GT connected to the bottom of the housing H and extending toward the top of the housing H are arranged inside the housing H.

[0003] A bottom plate B connectable to the equipment is also provided at the bottom of the wafer carrier C, so that a non-reactive dry gas G is blown into at least one gas flow pipe (gas tower) GT via a gas valve (not shown) provided in the bottom plate B, and is supplied to the accommodation space S through the gas flow pipe GT. C In the different processes of the semiconductor manufacturing process, the wafer carrier C needs to carry out procedures such as evacuation, gas exchange, or gas backfilling. However, various factors may block the fluid flow path during the assembly stage or after the manufacturing process stage, thereby affecting the gas flow in the wafer carrier C. For example, the diffusion flow rate at the top and bottom ends of the gas flow pipe GT varies. The variation in the flow rate reduces the total gas outflow rate of the gas flow pipe GT. If gas leakage occurs due to damage or poor adhesion during the assembly process of the gas flow pipe GT, the wafer carrier C may have the problem of the flow rate of the gas flow pipe GT varying. For example, if the gas flow pipe GT is not properly installed, the flow rate out of the bottom of the gas flow pipe GT will be high when supplying air.

[0004] As described above, currently, there is a need for a measuring device or method for measuring the wafer carrier C to check whether the air supply function of the wafer carrier C is normal. Summary of the Invention [Problem to be solved by the invention]

[0005] A primary objective of the present invention is to ameliorate the problem of measurement errors that currently exist when manually measuring gas flow within a wafer carrier.

[0006] A second object of the present invention is to solve the problem of uneven air supply caused by imperfect manual assembly of gas flow pipes in a wafer carrier, and further reduced air supply effectiveness due to gas leakage. [Means for solving the problem]

[0007] Therefore, the present invention provides a measurement device for measuring a wafer carrier having an open end and at least one gas flow pipe disposed therein. The wafer carrier measurement device comprises a mounting interface for fixing a wafer carrier. The open end of the wafer carrier faces a detection space of the measurement device. The mounting interface comprises an air supply assembly coupled to a bottom plate of the wafer carrier to supply gas to the wafer carrier. A measurement assembly is disposed in the detection space for mainly measuring a flow rate of gas from the gas flow pipe in the accommodating space. The measurement assembly includes a plurality of wind speed sensing elements and a plurality of displacement sensing elements fixed to a second connecting member structure.

[0008] In one embodiment of the present invention, the measurement assembly includes a first connecting member, a plurality of second connecting members connected to the first connecting member, and a plurality of wind speed sensing elements attached to the plurality of second connecting members for measuring gas flow from different horizontal heights of the gas flow pipe.

[0009] In one embodiment of the invention, the measurement assembly further includes at least one displacement sensing element configured to determine a height and a position of the gas flow tube.

[0010] In one embodiment of the invention, the displacement sensing element is one of an imaging element, a laser sensing element or a non-contact sensing element.

[0011] In one embodiment of the present invention, the wind speed sensing element is disposed at least at a bottom end of the first connecting member to measure the gas flow from the gas flow pipe located at the bottom of the accommodating space.

[0012] In one embodiment of the present invention, each wind speed sensing element comprises a sensing rod and a sensing wire, the sensing wire being a heatable metal wire.

[0013] In one embodiment of the invention, the mounting interface includes a positioning structure for aligning and positioning the wafer carrier, and an air supply assembly for supplying gas to the gas flow tube.

[0014] In one embodiment of the invention, the alignment structure comprises a pair of alignment posts for mating with a bottom plate of the wafer carrier.

[0015] In one embodiment of the invention, the system further includes a user interface for operating the measurement assembly and observing the measurement status of the gas flow tube.

[0016] In one embodiment of the present invention, the measurement assembly is connected to a moving unit within the detection space, and when the wafer carrier is fixed to the mounting interface, the measurement assembly enters the accommodating space of the wafer carrier by being driven by the moving unit. [Brief description of the drawings]

[0017] [Figure 1A]FIG. 1 is a front view showing a conventional wafer carrier. [Figure 1B] FIG. 1 is a rear view showing a conventional wafer carrier. [Diagram 2] 1 is a three-dimensional view showing a wafer carrier measuring device of the present invention. [Diagram 3] FIG. 2 is a top view showing the wafer carrier measuring device of the present invention. [Figure 4] FIG. 2 is a three-dimensional view of the measurement assembly of the present invention. [Diagram 5] FIG. 2 is a front view of the measurement assembly of the present invention. [Figure 6] FIG. 5 is an enlarged view of a portion A in FIG. 4 of the present invention. [Figure 7] FIG. 2 is a top view of the measurement assembly of the present invention. [Figure 8] FIG. 2 is a side view of the measurement assembly of the present invention. [Figure 9] FIG. 13 is a diagram showing a measurement state inside a wafer carrier measured according to the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] Referring to the wafer carrier measuring apparatus 10 of the present invention shown in Fig. 2, the wafer carrier measuring apparatus 10 is used to measure a wafer carrier C having an open end OP as shown in Figs. 1A and 1B. The wafer carrier measuring apparatus 10 includes a mounting interface 100, a measuring assembly 200 disposed in a detection space S, and a user interface 400. The mounting interface 100 mounts and positions the wafer carrier C, and introduces gas into the accommodation space S of the wafer carrier C. CSpecifically, the mounting interface 100 is provided with a movement limiting means for positioning the wafer carrier C and a plurality of nozzles for supplying gas, the movement limiting means including a plurality of positioning pins (not shown) that can be fitted into the bottom plate B of the wafer carrier C, and the nozzles can be fitted into the gas inflow module or gas inflow valve of the bottom plate B to feed gas into the gas flow pipe GT in the wafer carrier C. The detection space S has an opening, and a plane defined by the opening is perpendicular to the mounting interface 100. The opening in this embodiment is roughly formed in the vertical plane of the housing H, and the detection space S faces the open end OP of the wafer carrier C on the mounting interface 100, and the receiving space S C The measurement assembly 200 is movably accommodated in the detection space S, and the wafer carrier measurement device 10 controls the displacement of the measurement assembly 200 so that the measurement assembly 200 moves from the detection space S to the accommodation space S of the wafer carrier C. C The placement interface 100 allows the gas to enter the accommodation space S of the wafer carrier C. C When supplied to the receiving space S, the measurement assemblies 200 are each at a different horizontal height. C The gas flow data at different heights of the gas flow pipe GT in the gas flow pipe GT is measured. The user interface 400 is used for an operator to adjust the displacement of the measurement assembly 200, input the gas measurement conditions, observe the assembly state and measurement state of the gas flow pipe GT, and display the measurement results.

[0019] In another embodiment, the measurement assembly 200 is immovably housed in the detection space S, and the mounting interface 100 may include a moving means capable of pushing the wafer carrier C placed on the mounting interface 100 to reach a predetermined detection position in the detection space S. Details of the measurement assembly 200 will be described later.

[0020] Please refer to the top view of the wafer carrier measuring apparatus 10 in Fig. 3. As shown in the figure, the mounting interface 100 of the wafer carrier measuring apparatus 10 includes a plurality of positioning structures 110 and an air supply assembly 130, the positioning structures 110 align and position the bottom plate B of the wafer carrier C with the mounting interface 100, and the air supply assembly 130 supplies gas to the gas inflow module or gas inflow valve of the bottom plate B of the wafer carrier C to fill the receiving space S. C The air supply assembly 130 basically includes nozzles in a number corresponding to the number of gas inflow modules of the bottom plate B, for example, nozzles that can abut against the bottom plate B to form an airtight seal.

[0021] In one embodiment of the present invention, the positioning structure 110 includes at least a pair of positioning blocks 111 and a pair of positioning posts 112, and the bottom plate B of the wafer carrier C is fitted into the corresponding recess structures, thereby preventing the wafer carrier C from sliding or shifting on the mounting interface 100; a pair of gas inlet valves on the bottom plate B of the wafer carrier C are aligned with a pair of gas supply assemblies 130 of the mounting interface 100; and the open end OP of the wafer carrier C faces the detection space S, thereby accommodating the wafer carrier C in the receiving space S. C is connected to the detection space S.

[0022] The gas supply assembly 130 is connected to a gas supply system embedded under the mounting interface 100, so that the wafer carrier measuring device 10 supplies gas to the receiving space S of the wafer carrier C through components such as the gas supply assembly 130, the gas inlet valve of the wafer carrier C, and the gas flow pipe GT. C In the above embodiment, the positioning structures 110 and the air supply assemblies 130 are detachable from the mounting interface 100, so that the wafer carrier measuring device 10 can measure different wafer carriers by increasing or decreasing the number and positions of the positioning structures 110 and the air supply assemblies 130. Although not shown, the mounting interface 100 is configured to receive the wafer carrier C in the receiving space S. CIn accordance with an aspect of the present invention, the measurement assembly 200 can provide corresponding detection via the air supply operation of the air supply assembly 130.

[0023] Please refer to the three-dimensional view and the front view of the measurement assembly 200 in Figures 4 and 5. The measurement assembly 200 is disposed in the detection space S of the wafer carrier measurement device 10 and is mounted on a moving unit 300. The measurement assembly 200 includes a first connecting member 210 fixed to the moving unit 300, a plurality of second connecting members 220 connected to the first connecting member 210, and a plurality of second connecting members 220 symmetrically connected to the second connecting members 220. The measurement assembly 200 is disposed in the detection space S of the wafer carrier C. C The detection space S includes a plurality of pairs of wind speed sensing elements 230 facing the wind speed sensing element 230 and a plurality of displacement sensing elements 240 mounted in the detection space S. The displacement sensing elements 240 are provided at positions that do not affect the measurement of the wind speed sensing elements 230, and are arranged in the accommodation space S of the wafer carrier C. C Facing.

[0024] Specifically, the first connecting member 210 is a tower-like structure mainly composed of one or more pillars, and is connected to the moving unit 300. The plurality of second connecting members 220 and the plurality of wind speed sensing elements 230 are moved in the xy axis by the displacement of the moving unit 300. The plurality of second connecting members 220 are connected to the first connecting member 210 by a beam structure, and at least a pair of wind speed sensing elements 230 is attached to each second connecting member 220. The second connecting member 220 and the first connecting member 210 are provided with positioning structures (not shown) arranged to butt against each other. For example, the second connecting member 220 has a positioning hole for inserting the positioning post of the first connecting member 210, and the second connecting member 220 can be positioned at different vertical positions of the first connecting member 210 through a fixing means. Therefore, the second connecting member 220 can be appropriately adjusted according to the height position required for measurement of the wind speed sensing element 230. When the wafer carrier C is placed on the wafer carrier measuring device 10, the plurality of wind speed sensing elements 230 are driven via the moving unit 300 to move the wind speed sensing element 230 to the accommodation space S of the wafer carrier C. C The gas flow from the gas flow pipe GT is measured by appropriately inserting the gas flow pipe GT into the gas flow pipe GT.

[0025] The plurality of displacement sensing elements 240 are disposed in a space that does not interfere with the measurement, and are used to acquire information and determine whether the mounting height of the gas flow pipe GT of the wafer carrier C is uniform or inclined. C Preferably, the displacement sensing element 240 is disposed near the top of the wafer carrier C. The displacement sensing element 240 can be realized by a non-contact type displacement sensing element such as, but not limited to, an imaging element, a laser sensing element, etc. In one embodiment of the present invention, the displacement sensing element 240 (e.g., an imaging element) includes a lens and a photosensitive element, and each imaging element corresponds to one of the gas flow pipes GT of the wafer carrier C, and determines the position and height of the gas flow pipe GT through image recognition, thereby further determining whether each gas flow pipe GT is correctly installed.

[0026] The wind speed sensing element of the present invention will be specifically described with reference to the enlarged three-dimensional view of the wind speed sensing element 230 of the present invention in FIG. 6 and the top view of the measurement assembly 200 in FIG. 7. Each wind speed sensing element 230 of the present invention is pivotally mounted on one end of the second connecting member 220, that is, a pair of wind speed sensing elements 230 is connected to both ends of each second connecting member 220, so that each pair of wind speed sensing elements 230 can correspond to different heights of the gas flow pipe GT inside the wafer carrier C. The wind speed sensing elements 230 can adjust the orientation of each pair of wind speed sensing elements 230 (FIG. 7) by pivoting. The pivot mechanism positions each pair of wind speed sensing elements 230 in a preferred gas flow path, so that each pair of wind speed sensing elements 230 can accurately receive the gas flow from each gas flow pipe GT at different heights and measure gas flow data.

[0027] In other embodiments, the need for the number of wind speed sensing elements 230 can be adjusted according to the number of gas flow pipes GT installed in the wafer carrier C, and the number of wind speed sensing elements 230 is not limited thereto, and as long as the gas flow data at different heights of the gas flow pipes GT in the wafer carrier C can be measured, it falls within the scope of protection of the present invention. For example, when the wafer carrier C has three gas flow pipes GT, the second connecting member 220 holds three corresponding wind speed sensing elements 230 through an appropriate arrangement, and allows the three wind speed sensing elements 230 to receive the gas flows of the three gas flow pipes GT, respectively.

[0028] In one embodiment of the present invention, the wind speed sensing element 230 is a hot-wire anemometer, and each wind speed sensing element 230 includes a sensing rod 231 and a sensing wire 232 disposed at one end of the sensing rod 231 and exposed, the sensing wire 232 being a heatable metal wire. The wind speed sensing elements 230 measure the flow speed of the gas blown out of the gas flow pipe GT at different heights. In other embodiments, the wind speed sensing element 230 may be realized by an anemometer such as an ultrasonic anemometer, a vane anemometer, or a radar anemometer. In a preferred embodiment of the present invention, the wind speed sensing element 230 is a hot-wire anemometer, and each of the wind speed sensing elements 230 includes a sensing rod 231 and a sensing wire 232 disposed at one end of the sensing rod 231 and exposed, the sensing wire 232 being a heatable metal wire. C Since the structure of the bottom of the gas flow pipe GT is relatively complicated, at least one pair of wind speed sensing elements 230 is provided between the gas flow pipe GT and the accommodation space S. C and through the measured wind speed data, it is judged whether there is a problem of reduced gas inflow effect due to improper assembly or damage of the wafer carrier C. The other wind speed sensing elements 230 can adjust the wind speed measurement position according to different wafer carriers C or different measurement conditions, for example by adjusting the horizontal height of each pair of wind speed sensing elements 230 or the distance between each pair of wind speed sensing elements 230.

[0029] The relationship between the measurement assembly 200 and the moving unit 300 will be specifically described with reference to a top view of the measurement assembly 200 in Fig. 7 and a side view of the measurement assembly 200 in Fig. 8. The measurement assembly 200 is fixed to the moving unit 300 and displaced in the x-axis direction via the moving unit 300 to enter the receiving space S of the wafer carrier C. C The measurement assembly 200 enters the receiving space S and is displaced in the y-axis direction via the moving unit 300. CThe moving unit 300 includes a first moving mechanism 310, a second moving mechanism 320, and a plurality of guide rails 330. The first moving mechanism 310 mainly carries the second moving mechanism 320 and displaces along the plurality of guide rails 330 on the y-axis. In a preferred embodiment of the present invention, the plurality of guide rails 330 include at least a first guide rail 331 and a second guide rail 332, and the first guide rail 331 and the second guide rail 332 are horizontally arranged in parallel to each other and pass through the first moving mechanism 310, thereby displacing the first moving mechanism 310 accurately along the y-axis along the first guide rail 331 and the second guide rail 332. In other embodiments, the present invention may use only one guide rail to realize the displacement of the first moving mechanism 310 on the y-axis. The second moving mechanism 320 is fixed to the first moving mechanism 310 and driven by a motor and a transmission mechanism to move the measuring assembly 200 to the receiving space S of the wafer carrier C. C The second moving mechanism 320 moves the measurement assembly 200 toward or away from the accommodation space S of the wafer carrier C by displacing the measurement assembly 200 in the x-axis direction along a guide rail (not shown) on the first moving mechanism 310. C In one embodiment of the present invention, the displacement sensing element 240 of the measurement assembly 200 is disposed on the first moving mechanism 310, and the displacement distance of the displacement sensing element 240 on the y-axis can be adjusted simultaneously through the displacement distance of the first moving mechanism 310 according to the needs of sensing the internal components of the wafer carrier C. In another embodiment of the present invention, the displacement sensing element 240 is disposed on the second connecting member 220 or the second moving mechanism 320, and can be operated without interfering with the measurement of the wind speed sensing element 230 to displace together with the second connecting member 220 or the second moving mechanism 320, and thus the displacement distance on the x-axis and z-axis can be adjusted according to the needs of sensing the internal components of the wafer carrier C.

[0030] When the wafer carrier measuring device 10 starts measuring, the operator controls the moving unit 300 based on an operating means (such as, but not limited to, a button, a joystick, or an application in the user interface 400) to move the measuring assembly 200 from the detection space S to the accommodation space S of the wafer carrier C. C 9, which is a schematic diagram of the wind speed data displayed on the user interface 400, in a specific embodiment of the present invention, the user can set an air filling time (Air Time) on the user interface 400, so that the air supply assembly 130 of the placement interface 100 can supply gas to the receiving space S of the wafer carrier C. C The duration for which the wind speed is supplied to the storage space S can be set, and the number of measurements (Total Insp) of the wind speed sensing element 230 can also be set. C 9. The air velocity corresponding to positions 1 (P1) to 8 (P8) in the table is measured to obtain the overall flow field distribution in the wafer carrier C, and the individual heights of the gas flow pipes GT, for example, the "Left Height" and "Right Height" in the "History Result" table, are obtained through the displacement sensing element 240. The air velocity data shown in FIG. 9 shows the air velocity data measured for the three wafer carriers C and the heights of the gas flow pipes GT, and the operator can determine whether the wafer carrier C is functioning normally based on this. In another embodiment of the present invention, the operator can preset a predetermined height of the gas flow pipes GT, and when the measured data exceeds the error range, the wafer carrier measuring device 10 automatically determines that the wafer carrier C is functioning abnormally and notifies the operator that there is an abnormality in the gas flow pipes GT. Furthermore, if the difference in wind speed between position 1 (P1) and position 2 (P2) or between position 7 (P7) and position 8 (P8) exceeds the error range, wafer carrier measuring device 10 automatically determines that the function of wafer carrier C is abnormal and informs the operator at which position the wind speed is abnormal.

[0031] 4, in a modified embodiment of the present invention, the second connecting member 220 in the measurement assembly 200 can be connected to the first connecting member 210 so as to be liftable, the wind speed sensing element 230 is connected to the second connecting member 220 so as to be horizontally slidable and pivotable, the first connecting member 210 and the second connecting member 220 can be realized by at least a slide rail or a ball screw, and the pivoting of the wind speed sensing element 230 can be realized by at least a gear structure. The first connecting member 210, the second connecting member 220, the wind speed sensing element 230, the displacement sensing element 240 and the moving unit 300 are all electrically connected to a processing unit (not shown), and the displacement sensing element 240 finds the center line of the wafer carrier C by image recognition, more specifically, the displacement sensing element 240 calculates the center line of the wafer carrier C by taking the gas flow pipe GT and the support member SM of the wafer carrier C in different images as characteristic values. After the center line of the wafer carrier C is found, the displacement sensing element 240 sends relevant data to the processing unit, and the processing unit controls the displacement of the moving unit 300 on the xy axis until the measurement assembly 200 reaches the measurement position; then, based on the position and height of the gas flow pipe GT recognized by the displacement sensing element 240, the processing unit controls the horizontal height of each second connecting member 220 in the first connecting member 210 and the interval of each pair of wind speed sensing elements 230 in the second connecting member 220, so that each wind speed sensing element 230 can be moved to an accurate measurement position, such as position 1 (P1) to position 8 (P8) shown in FIG. 9; then, the wafer carrier measuring device 10 supplies gas for a predetermined duration into the inside of the wafer carrier C, and the processing unit controls the opening and closing angles of each pair of wind speed sensing elements 230 to find the opening and closing angle at the maximum wind speed as the starting position of the wind speed sensing element 230. Through the above-mentioned operating method, the present invention can automatically correct the measurement position of the measurement assembly 200 to measure the wafer carrier C, effectively measure the flow distribution, and observe the assembly accuracy of the gas flow pipe GT. It also quickly finds the above-mentioned abnormal problems through the measurement results, thereby solving the problems of uneven gas supply caused by defects in the manual assembly of the gas flow pipe GT in the wafer carrier C, and even poor air supply effect caused by gas leakage.

[0032] In short, the wafer carrier measuring device disclosed in the present invention can simply and accurately measure the state of gas flow in the gas flow pipes within the wafer carrier, and determine whether the wafer carrier is functioning normally. [Explanation of symbols]

[0033] 10 Wafer carrier measuring device 100 Placement Interface 110 Positioning structure 111 Positioning block 112 Positioning post 130 Air supply assembly 200 Measurement Assembly 210 First connecting member 220 Second connecting member 230 Wind Speed ​​Sensing Element 231 Sensing Rod 232 Sensing wire 240 Displacement Sensing Element 300 Mobile Units 310 1st movement mechanism 320 Second movement mechanism 330 Guide Rail 331 First guide rail 332 Second guide rail 400 User Interface B Bottom plate C Wafer Carrier G Gas GT Gas Flow Pipe H-frame OP open end S detection space S C Storage space SM Support Member

Claims

1. A wafer carrier measuring device for measuring a wafer carrier having an open end and at least one gas flow pipe therein, a mounting interface for fixing the wafer carrier and supplying a gas to an accommodation space of the wafer carrier, the accommodation space being in communication with a gas outlet hole of the gas flow pipe; a measurement assembly movably accommodated within the detection space, the detection space corresponding to a position of the open end; A wafer carrier measurement device, wherein when the wafer carrier is fixed to the mounting interface and the mounting interface supplies gas to the accommodation space of the wafer carrier, the measurement assembly moves from the detection space into the accommodation space and can respectively measure gas flow data of the gas flow pipe at different horizontal heights.

2. The measurement assembly includes: A first connecting member; a plurality of second connecting members connected to the first connecting members and vertically spaced apart from one another; a plurality of wind speed sensing elements attached to the plurality of second connecting members for measuring gas flow from different horizontal heights of the gas flow pipe; 2. The wafer carrier measurement apparatus of claim 1 including:

3. The wafer carrier measurement apparatus of claim 1 , wherein the measurement assembly further comprises at least one displacement sensing element configured to determine a height and a position of the gas flow tube.

4. The wafer carrier measurement apparatus of claim 3 , wherein the displacement sensing element is one of an imaging element, a laser sensing element, or a non-contact sensing element.

5. 3. The wafer carrier measuring device of claim 2, wherein at least one of the plurality of wind speed sensing elements is at the same height as a bottom end of the first connecting member to measure gas flow from the gas flow pipe located at the bottom of the storage space.

6. 3. The wafer carrier measuring apparatus of claim 2, wherein each wind speed sensing element comprises a sensing rod and a sensing wire, the sensing wire being a heatable metal wire.

7. The placement interface includes: a positioning structure for aligning and positioning the wafer carrier; an air supply assembly for supplying gas to the gas flow pipe; 2. The wafer carrier measurement apparatus of claim 1 including:

8. 8. The wafer carrier measuring apparatus of claim 7, wherein the alignment structure comprises a pair of alignment posts for mating with a bottom plate of the wafer carrier.

9. 3. The wafer carrier measurement apparatus of claim 2, further comprising a user interface for operating the measurement assembly and for observing a measurement status of the gas flow tube.

10. The wafer carrier measuring apparatus of claim 1, wherein the measuring assembly is connected to a moving unit within the detection space, and when the wafer carrier is fixed to the mounting interface, the measuring assembly enters the accommodating space of the wafer carrier by being driven by the moving unit.

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