Substrate working device and substrate working method

Abstract

To make it possible to confirm in advance whether there is interference between an object and a backup member before the surface of a substrate on which the object is arranged is supported from below by a backup member.SOLUTION: In a state in which a surface Ba of both sides of a substrate B faces upward, when a work of mounting a component P (object) on the surface Ba is completed (Step S102), it is confirmed whether the component P exists at a planned support position S on the surface Ba (Steps S103 to S107). More specifically, when the mounting of the component P on the surface Ba is completed (Step S102), the presence of the component P at the planned support position S of the surface Ba is confirmed while the surface Ba on which the component P is mounted faces upward (Steps S103 to S107), that is, the presence or absence of interference between a backup pin 55 (backup member) scheduled to support the planned support position S and the component P is confirmed.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to a technique for supporting a substrate on which objects such as components or coating liquids are arranged. [Background technology]

[0002] When mounting components on both sides of a board, the following procedure is performed: first, with the board's front side facing upward, mount the components on the front side, and then, with the board's back side facing upward, mount the components on the back side. When mounting components on a board in this manner, the side facing downward out of the two sides of the board is supported by backup pins. In particular, when mounting components on the back side of the board, interference between the components and the backup pins becomes an issue, since the components are already mounted on the front side of the board facing downward.

[0003] In response to this, in Patent Document 1, the presence or absence of interference between the component and the backup pin is confirmed as follows. In other words, if the backup pin, which supports the back surface of the board from below, interferes with the component mounted on the back surface, the board is pushed up and warped upward. Therefore, the presence or absence of interference between the component and the backup pin is confirmed based on the warpage of the board obtained by measuring the distance to the front surface of the board using a distance sensor provided on the top side of the board. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2016-207912 A Summary of the Invention [Problem to be solved by the invention]

[0005] In the above method, the surface on which the components are mounted is supported from below by the backup pins, and the presence or absence of interference between the components and the backup pins is confirmed. However, if the presence or absence of interference between the components and the backup pins can be confirmed before the support by the backup pins is performed, appropriate measures, such as changing the position of the backup pins, can be taken in advance. This situation is also the same when objects other than components, such as coating liquid, are placed on both sides of the board. Therefore, there has been a demand for a technology that can confirm the presence or absence of interference between the objects and the backup members (backup pins) before the surface of the board on which the objects (components, coating liquid, etc.) are placed is supported from below by the backup members.

[0006] The present invention has been made in consideration of the above-mentioned problems, and has an object to make it possible to check in advance whether or not an object will interfere with a backup member before the surface of a substrate on which the object is placed is supported from below by the backup member. [Means for solving the problem]

[0007] The substrate working apparatus of the present invention comprises a substrate holding section that holds a substrate having a first surface and a second surface opposite to the first surface with the first surface facing upward, a working head that performs a task of placing an object on the first surface of the substrate held in the substrate holding section, and a control section that checks whether an object is present at the intended support position on the first surface of the substrate held in the substrate holding section after the task by the working head is completed.

[0008] The substrate working method of the present invention comprises the steps of holding a substrate having a first surface and a second surface opposite to the first surface with a substrate holding part with the first surface facing upward, performing an operation to place an object on the first surface of the substrate held by the substrate holding part, and, after the operation is completed, checking whether or not an object is present at the intended support position on the first surface of the substrate held by the substrate holding part.

[0009] In the present invention (board working device and board working method) configured in this manner, when the work of placing an object on the first surface of the board (first and second surfaces) is completed with the first surface facing upward, it is confirmed whether or not the object exists at the intended support position on the first surface. In other words, when the placement of the object on the first surface is completed, the presence of the object at the intended support position on the first surface is confirmed with the first surface on which the object is placed facing upward, that is, the presence or absence of interference between the object and the backup member that is intended to support the intended support position is confirmed. As a result, it is possible to confirm whether or not the object interferes with the backup member before the surface (first surface) of the board on which the object is placed is supported from below by the backup member.

[0010] The circuit board working device may also be configured so that a test member is attached to the working head, the test member having a tip portion with the same shape as a tip portion of a backup member to be used to support the intended support position from below, and the control unit verifies whether or not an object is present at the intended support position based on a result of moving the tip portion of the test member attached to the working head from above toward the intended support position until the tip portion of the test member abuts against the first surface or an object placed on the first surface. In this way, by checking whether or not an object is present at the intended support position using a test member having a tip shape in common with the backup member, it is possible to accurately check whether or not there is interference between the object and the backup member.

[0011] The substrate working device may be further configured to include a test member storage section for storing a test member, the test member being detachable from the working head, the test member being detached from the working head and stored in the test member storage section before the start of work, and the test member stored in the test member storage section being attached to the working head after the work is completed. In this configuration, the test member is detached from the working head while the working head is performing work. Therefore, work can be performed by the working head while avoiding interference between the substrate or object and the test member.

[0012] The circuit board working device may be configured to further include a camera attached to the working head, and the control unit may be configured to check whether or not an object is present at the intended support position based on a post-work image acquired by using the camera to capture an image of the intended support position from above after the work by the working head is completed. In this configuration, it is possible to check in advance whether or not there is interference between the object and the back-up member based on the post-work image captured by the camera.

[0013] The control unit may be configured to check whether an object is present at the intended support position based on a comparison between a pre-operation image obtained by capturing an image of the intended support position from above with a camera before the work head starts, and a post-operation image. In this configuration, it is possible to check in advance whether there is interference between the object and the back-up member based on a comparison between the pre-operation image and the post-operation image captured by the camera.

[0014] The substrate processing device may be further configured to include a distance sensor attached to the processing head, and the control unit may be configured to check whether or not an object is present at the intended support position based on a post-operation measured height obtained by measuring the height of the intended support position from above using the distance sensor after the processing head has completed. In this configuration, it is possible to check in advance whether or not there is interference between the object and the back-up member based on the post-operation measured height of the intended support position measured by the distance sensor.

[0015] The control unit may be configured to check whether an object is present at the intended support position based on a comparison between a pre-operation measurement height, obtained by measuring the height of the intended support position from above with a distance sensor before the work head starts, and a post-operation measurement height. In this configuration, it is possible to check in advance whether the object will interfere with the backup member based on a comparison between the pre-operation measurement height and the post-operation measurement height of the intended support position measured by the distance sensor.

[0016] The control unit may be configured to notify the operator when it determines that an object is present at the intended support position. In this configuration, the operator can know in advance that the object will interfere with the backup member before the backup member supports the substrate.

[0017] The control unit may be configured to execute an instruction to change the intended support position in response to the notification, so that the operator can change the position supported by the backup member in advance before the backup member supports the target object, thereby preventing interference between the target object and the backup member.

[0018] It should be noted that various specific operations are assumed to be performed by the working head in the board working apparatus. Therefore, the board working apparatus may be configured such that the object is a component and the working head is a mounting head that mounts the component on a first surface of the board held by the board holding unit. Alternatively, the board working apparatus may be configured such that the object is a coating liquid and the working head is a dispensing head that applies the coating liquid to a first surface of the board held by the board holding unit. Effect of the Invention

[0019] As described above, according to the present invention, it is possible to check in advance whether or not there will be interference between the object and the backup member before the surface of the substrate on which the object is placed is supported from below by the backup member. [Brief description of the drawings]

[0020] [Figure 1] FIG. 1 is a block diagram showing an example of a component mounting system that mounts components on both sides of a substrate. [Diagram 2] FIG. 2 is a plan view showing a component mounter. [Diagram 3] 3 is a diagram showing an electrical configuration of the component mounter of FIG. 2. [Figure 4] FIG. 4 is a side view showing a schematic relationship between a nozzle, a test pin, and a backup pin. [Diagram 5]4 is a flowchart showing a first example of double-sided mounting performed on a board in the component mounting system of FIG. [Figure 6] FIG. 6 is a diagram showing an example of the height of a board measured in the double-sided mounting of FIG. 5; [Figure 7] 6 is a side view showing an example of an operation for checking whether or not components overlap with intended support positions in the double-sided mounting of FIG. 5; FIG. [Figure 8] 6 is a side view showing a schematic view of a support state of the board by the backup pins in the double-sided mounting of FIG. 5. [Figure 9] 6 is a flowchart showing a second example of double-sided mounting performed on a board in the component mounting system of FIG. [Figure 10] 10 is a flowchart showing a third example of double-sided mounting performed on a board in the component mounting system of FIG. [Figure 11] 11 is a side view showing an example of height measurement of an intended support position performed in the double-sided mounting of FIG. 10; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0021] Fig. 1 is a block diagram showing an example of a component mounting system that mounts components on both sides of a board. In this figure and the following figures, the horizontal X direction, the horizontal Y direction perpendicular to the X direction, and the vertical Z direction are appropriately shown. As shown in Fig. 1, the component mounting system 1 includes a control device 2 and two component mounters 4a and 4b arranged in series in the Y direction.

[0022] The control device 2 is a server computer and includes a calculation unit 21 configured with a processor such as a CPU (Central Processing Unit), a UI (User Interface) 22, and a communication unit 23, and the calculation unit 21 controls the UI 22 and the communication unit 23. The UI 22 has an input device such as a keyboard or a mouse, and an output device such as a display. Note that the input device and the output device do not need to be configured separately, and may be configured integrally with a touch panel display. The communication unit 23 executes communication with each of the component mounters 4a and 4b.

[0023] In this component mounting system 1, the component mounter 4a mounts components on the front side of the board, and then the component mounter 4b mounts components on the back side of the board. The board can be carried into the component mounter 4a, transported from the component mounter 4a to the component mounter 4b, and removed from the component mounter 4b by a board transport mechanism such as a conveyor or an AGV (Automatic Guided Vehicle), or by an operator. These component mounters 4a and 4b have the following common configuration.

[0024] Fig. 2 is a plan view showing a schematic diagram of a component mounter, and Fig. 3 is a diagram showing an electrical configuration of the component mounter of Fig. 2. This component mounter 4 mounts a component P at a mounting location provided on a board B. The board B is, for example, a printed circuit board, and the mounting location is, for example, a land provided on the printed circuit board.

[0025] 3, the mounter 4 includes a control unit 410, a storage unit 420, and a communication unit 430. The control unit 410 is a processor including a CPU (Central Processing Unit) and the like, and controls the entire mounter 4. The storage unit 420 is a storage device such as a HDD (Hard Disk Drive) or an SSD (Solid State Drive), and stores various data. The communication unit 430 communicates with the communication unit 23 of the control device 2.

[0026] 2, the component mounter 4 includes a pair of conveyors 41 arranged in parallel in the Y direction. The component mounter 4 transports the board B from the upstream side (left side in FIG. 2) in the Y direction (board transport direction) to a mounting work position Lo (position of board B in FIG. 2) by the conveyor 41, mounts components P on the board B held at the mounting work position Lo, and transports the board B (component-mounted board B) on which mounting of components P has been completed from the mounting work position Lo to the downstream side in the Y direction by the conveyor 41. The transport and holding of the board B by this conveyor 41 is controlled by the control unit 410.

[0027] In addition, backup pins, which will be described later, are arranged at the mounting work position Lo, and the board B held at the mounting work position Lo by the conveyor 41 is supported from below by the backup pins. The support by the backup pins corrects warping of the board B due to its own weight.

[0028] Further, in the component mounter 4, a pair of X-axis rails 421 parallel to the X direction, an X-axis ball screw 422 parallel to the X direction, and an X-axis motor Mx (servo motor) that rotates and drives the X-axis ball screw 422 are provided, and a Y-axis rail 424 parallel to the Y direction is supported by the pair of X-axis rails 421 so as to be movable in the X direction and is fixed to the nut of the X-axis ball screw 422. A Y-axis ball screw 425 parallel to the Y direction and a Y-axis motor My (servo motor) that rotates and drives the Y-axis ball screw 425 are attached to the Y-axis rail 424, and the head unit 43 is fixed to the nut of the Y-axis ball screw 425 while being supported by the Y-axis rail 424 so as to be movable in the Y direction. Therefore, the control unit 410 can rotate the X-axis ball screw 422 by the X-axis motor Mx to move the head unit 43 in the X direction, and rotate the Y-axis ball screw 425 by the Y-axis motor My to move the head unit 43 in the Y direction. In this way, the X-axis motor Mx and the Y-axis motor My constitute an XY drive mechanism that moves the head unit 43 on the XY plane.

[0029] The head unit 43 has a so-called rotary type mounting head 431. That is, the mounting head 431 has a plurality (eight pieces) of shafts 432 arranged at equal angular intervals in a circular shape around a rotation axis, each of which is provided in the Z direction, and a nozzle (described later) is detachably attached to the lower end of each shaft 432. The plurality of shafts 432 can rotate around the rotation axis by the driving force of an R-axis motor Mr (servo motor). In addition, the shaft 432 is raised and lowered in the Z direction by a Z-axis driving mechanism Mz composed of a servo motor or an actuator or the like. This Z-axis driving mechanism Mz can output the height of the shaft 432 detected by, for example, an encoder to the control unit 410. Therefore, the control unit 410 can adjust the rotation position of the shaft 432 by controlling the R-axis motor Mr, and can adjust the height of the shaft 432 by controlling the Z-axis driving mechanism Mz. In addition, the nozzle attached to the lower end of the shaft 432 rotates and rises and falls together with the shaft 432.

[0030] Further, a board recognition camera C is attached to the head unit 43. The board recognition camera C faces downward and captures an image of the board B located at the mounting work position Lo from above. The image captured by the board recognition camera C is transferred to the control unit 410, which performs signal processing on the image received from the board recognition camera C to obtain predetermined information from the image. For example, when the board recognition camera C captures an image of a fiducial mark attached to the board B, the control unit 410 determines the position of the board B from the fiducial mark included in the image.

[0031] Further, the nozzle is connected to a pressure applying unit 433, which applies pressure to the nozzle attached to the lower end of the shaft 432 in response to a command from the control unit 410. Specifically, when the nozzle is used to suck and hold the component P, the pressure applying unit 433 applies a negative pressure to the nozzle. Further, when the nozzle is used to place the component P on a mounting location (land) of the board B, the pressure applying unit 433 applies atmospheric pressure or positive pressure to the nozzle.

[0032] As shown in FIG. 2, two component supply units 44 are arranged in the X direction on both sides of the pair of conveyors 41 in the Y direction. A plurality of tape feeders 441 are arranged in the Y direction and detachably attached to each component supply unit 44. The tape feeders 441 extend in the X direction and have component supply points 442 at their ends on the conveyor 41 side in the X direction. A component supply reel around which a tape is wound, in which small pieces of components P such as integrated circuits, transistors, and capacitors are stored at predetermined intervals, is arranged for each tape feeder 441, and the tape pulled out from the component supply reel is loaded into the tape feeder 441. The tape feeder 441 intermittently feeds the tape in the X direction toward the conveyor 41 side in response to a command from the control unit 410. As a result, the components P in the tape are fed in the X direction (feed direction) and supplied to the component supply points 442 of the tape feeder 441 in order.

[0033] Then, the mounting head 431 mounts the component P on the board B by executing the following operation based on a command from the control unit 410. That is, the mounting head 431 moves above the tape feeder 441 and brings the nozzle into contact with the component P supplied to the component supply point 442 by the tape feeder 441. Then, the mounting head 431 adsorbs (picks up) the component P by the negative pressure applied to the nozzle. The mounting head 431 transfers the component P thus held by the nozzle to the mounting point (land) of the board B at the mounting work position Lo.

[0034] Furthermore, the component mounter 4 has a test pin storage unit 45 that stores a test pin used to check the height of the upper surface of the board B held at the mounting work position Lo by the conveyor 41. This test pin is attached to the mounting head 431 when in use, and has a tip portion with a shape common to that of the backup pin.

[0035] Fig. 4 is a side view showing the relationship between the nozzle, the test pin, and the backup pin. Of the nozzle 51, the test pin 53, and the backup pin 55 shown in Fig. 4, the nozzle 51 and the test pin 53 are used in the position shown in Fig. 4 in the Z direction, while the backup pin 55 is used in the position inverted from that shown in Fig. 4 in the Z direction. The position of the backup pin 55 is shown inverted to allow for a comparison between the shapes of the test pin 53 and the backup pin 55.

[0036] The nozzle 51 is attached to the lower end of the shaft 432, and supplies negative pressure, atmospheric pressure, and positive pressure from a nozzle hole that opens at a tip 511 (lower end) of the nozzle 51. The test pin 53 is attached to the shaft 432 via the nozzle 51. That is, an insertion port for inserting the nozzle 51 from above is provided at the upper end of the test pin 53, and the nozzle 51 holds the test pin 53 by adsorbing the test pin 53 by negative pressure while inserted into the insertion port of the test pin 53. In this way, the test pin 53 can be attached to the shaft 432. A tip portion 532 of the test pin 53 in a predetermined range in the Z direction from a tip 531 (lower end) and a tip portion 552 of the backup pin 55 in a predetermined range in the Z direction from a tip 551 have the same shape.

[0037] Fig. 5 is a flow chart showing a first example of double-sided mounting executed on a board in the component mounting system of Fig. 1, Fig. 6 is a diagram showing an example of the board height measured in double-sided mounting of Fig. 5, Fig. 7 is a side view showing an example of an operation for checking whether or not a component overlaps with a planned support position in double-sided mounting of Fig. 5, and Fig. 8 is a side view showing an example of a support mode of the board by a backup pin in double-sided mounting of Fig. 5. In this double-sided mounting, component mounter 4a mounts component P on front surface Ba of board B, and then component mounter 4b mounts component P on back surface Bb of board B opposite to front surface Ba.

[0038] In step S101, the board B is carried into the mounting work position Lo of the component mounter 4a with the front surface Ba facing upward. Next, in the component mounter 4a, the mounting head 431 moves in the XY plane to mount the component P on the front surface Ba of the board B held at the mounting work position Lo (step S102). When the mounting of the component P on the front surface Ba in step S102 is completed, it is confirmed whether or not the component P mounted on the front surface Ba overlaps with the intended support position S where the backup pins 55 support the board B in the component mounter 4b that is scheduled to mount the component P on the back surface Bb of the board B (steps S103 to S107).

[0039] That is, in the component mounter 4b, as shown in FIG. 8, the board B is held at the mounting work position Lo with the front surface Ba facing downward, and the tip 551 of the backup pin 55 abuts from below against the intended support position S provided on the front surface Ba. As shown in the table of FIG. 6, the intended support position S is a position in the XY plane (in other words, a position in a planar view) specified by a position in the X direction (X coordinate) and a position in the Y direction (Y coordinate). This intended support position S is set in advance for the front surface Ba of the board B by calculation by the control device 2 or manual work by an operator. In the example of FIG. 6, a plurality of intended support positions S are provided for the front surface Ba, and the component mounter 4b arranges the backup pin 55 for each of the plurality of intended support positions S. However, the number of intended support positions S provided for the front surface Ba is not limited to a plurality, and may be one.

[0040] The component mounter 4a checks whether the component P overlaps the intended support position S by using the test pin 53. That is, in step S103, the control unit 410 moves the nozzle 51 to the upper side of the test pin storage unit 45 and adsorbs the test pin 53 to the nozzle 51. In step S104, the control unit 410 makes the tip portion 532 of the test pin 53 face the intended support position S set on the front surface Ba of the board B from above. Next, the control unit 410 lowers the shaft 432 by the Z-axis drive mechanism Mz, thereby lowering the test pin 53 toward the intended support position S until the tip portion 532 of the test pin 53 abuts against the board B or the component P. As shown in the "Component Present" column in FIG. 7, when the component P overlaps the intended support position S, the test pin 53 stops at the height at which the tip portion 532 of the test pin 53 contacts the component P. On the other hand, as shown in the "No Component" column in FIG. 7, when the component P does not overlap the intended support position S, the test pin 53 stops at the height at which the tip portion 532 of the test pin 53 contacts the surface Ba of the board B. In other words, the height at which the test pin 53 stops varies depending on whether the component P overlaps the intended support position S, and the height of the tip portion 532 when the test pin 53 stops indicates the height of the intended support position S. Therefore, the control unit 410 of the component mounter 4a measures the height H (Z coordinate) of the intended support position S based on the height of the shaft 432 indicated by the Z-axis driving mechanism Mz, and stores the measured height H (Z coordinate) in the storage unit 420. At this time, the height of the shaft 432 indicated by the Z-axis driving mechanism Mz may be treated as the height H of the intended support position S, or a value obtained by performing an operation such as subtracting the length of the test pin 53 from the height of the shaft 432 indicated by the Z-axis driving mechanism Mz may be treated as the height H of the intended support position S.

[0041] In step S106, it is determined whether or not the heights H of all the intended support positions S set on the front surface Ba of the board B have been measured. Then, steps S104 to S105 are repeated until the heights H of all the intended support positions S have been measured, and when the heights H of all the intended support positions S have been measured ("YES" in step S106), the presence or absence of interference is confirmed in step S107. Note that from the start of mounting of components P in step S102 until it is determined in step S107 that measurement of the heights H of all the intended support positions S has been completed, the board B is continuously held at the mounting work position Lo by the conveyor 41 with the front surface Ba facing upward.

[0042] When the component P overlaps the planned support position S, the tip portion 552 of the backup pin 55 arranged at the planned support position S by the component mounter 4b interferes with the component P, whereas when the component P does not overlap the planned support position S, the tip portion 552 of the backup pin 55 arranged at the planned support position S by the component mounter 4b does not interfere with the component P. Therefore, the presence or absence of interference between the component P and the backup pin 55 can be determined depending on whether the component P overlaps the planned support position S. Also, as described above, the presence or absence of overlap of the component P at the planned support position S can be determined from the height H of the planned support position S. Therefore, when the height H of the planned support position S is equal to or greater than a predetermined threshold value, it is determined that the component P overlaps the planned support position S, and the backup pin 55 arranged at the planned support position S and the component P interfere with each other. On the other hand, when the height H of the planned support position S is less than the threshold value, it is determined that the component P does not overlap the planned support position S, and the backup pin 55 arranged at the planned support position S and the component P do not interfere with each other. In step S107, if interference occurs for at least one of the multiple intended support positions S, it is determined that there is interference (YES). On the other hand, if interference does not occur for any of the multiple intended support positions S, it is determined that there is no interference (NO).

[0043] When it is determined in step S107 that interference occurs, the control unit 410 of the component mounter 4a notifies the worker that interference will occur. Such notification may be performed using the display of the UI 22 of the control device 2, or may be performed using the display of the worker's mobile terminal. In addition, in this notification, the control unit 410 instructs the worker to change the position supported by the backup pin 55 from the intended support position S where it is determined that interference occurs.

[0044] If it is determined in step S107 that there is no interference, the board B is carried out from the mounter 4a (step S109), and the board B is carried into the mounter 4b with the back surface Bb facing upward (step S110). As shown in FIG. 8, in the mounter 4b, a table 46 supporting the backup pins 55 is provided below the board B that stops at the mounting work position Lo. Then, on this table 46, the backup pins 55 are arranged to face each intended support position S on the front surface Ba of the board B, and the backup pins 55 abut against the front surface Ba of the board B at the intended support position S that faces the front surface Ba of the board B. In this way, in the mounter 4b, the components P are mounted on the back surface Bb of the board B that is held at the mounting work position Lo while being supported by the backup pins 55 (step S111). Then, when the mounting of the components P in step S111 is completed, the board B is carried out from the mounter 4b (step S112).

[0045] In this way, in the first example of double-sided mounting, when the work of mounting the component P (object) on the front surface Ba (first surface) of both surfaces (front surface Ba and back surface Bb) of the board B is completed with the front surface Ba facing upward (step S102), it is confirmed whether the component P exists at the intended support position S on the front surface Ba (steps S103 to S107). In other words, when the mounting of the component P on the front surface Ba is completed (step S102), the presence of the component P at the intended support position S on the front surface Ba is confirmed with the front surface Ba on which the component P is mounted facing upward (steps S103 to S107), that is, the presence or absence of interference between the backup pin 55 (backup member) intended to support the intended support position S and the component P is confirmed. As a result, it is possible to confirm whether or not the component P interferes with the backup pin 55 before the front surface Ba of the board B on which the component P is mounted is supported from below by the backup pin 55.

[0046] Further, a test pin 53 (test member) is attached to the mounting head 431 (working head) (step S103). This test pin 53 has a tip portion 532 having the same shape as a tip portion 552 of a backup pin 55 that is to support the intended support position S from below. Then, the control unit 410 checks whether or not a component P is present at the intended support position S based on a result of moving the tip portion 532 of the test pin 53 attached to the mounting head 431 from above toward the intended support position S until the tip portion 532 of the test pin 53 abuts against the front surface Ba or the component P mounted on the front surface Ba (steps S104 to S107). In this way, by checking whether or not a component P is present at the intended support position S using the test pin 53 having a tip shape common to the backup pin 55, it is possible to accurately check whether or not there is interference between the component P and the backup pin 55.

[0047] Furthermore, the component mounter 4a is provided with a test pin storage unit 45 (test member storage section) that stores test pins 53 that are detachable from the mounting head 431. Before component mounting (work) in step S102 begins, the test pins 53 are detached from the mounting head 431 and stored in the test pin storage unit 45. On the other hand, when component mounting in step S102 is completed, the test pins 53 are attached to the mounting head 431 from the test pin storage unit 45 (step S103). In this configuration, the test pins 53 are detached from the mounting head 431 while the mounting head 431 is mounting components. Therefore, component mounting can be performed by the mounting head 431 while avoiding interference between the board B or component P and the test pins 53.

[0048] Furthermore, when the control unit 410 determines that the component P is present at the intended support position S ("YES" in step S107), it notifies the worker (step S108). In this configuration, the worker can know in advance, before the support by the test pin 53, that the component P and the test pin 53 will interfere with each other.

[0049] Furthermore, the control unit 410 executes an instruction to change the intended support position S in the notification (step S108). In this configuration, before the support by the test pin 53, the worker can change the position supported by the test pin 53 in advance, thereby preventing interference between the component P and the test pin 53.

[0050] Fig. 9 is a flow chart showing a second example of double-sided mounting performed on a board in the component mounting system of Fig. 1. The following description will focus on the differences from the first example of double-sided mounting, and will omit the description of the commonalities with the first example as appropriate. In step S201, the board B is carried into the mounting work position Lo of the component mounter 4a with the front surface Ba facing upward.

[0051] Next, the control unit 410 faces the board recognition camera C from above toward the intended support positions S provided on the front surface Ba of the board B held at the mounting work position Lo, and acquires image data Ib indicating the images of the intended support positions S by capturing images of the intended support positions S with the board recognition camera C (step S202), and stores this image data Ib in the storage unit 420 (step S203). In step S204, it is determined whether or not the images of all the intended support positions S set on the front surface Ba of the board B have been captured. Then, steps S202 to S203 are repeated until the images of all the intended support positions S have been captured, and when the images of all the intended support positions S have been captured ("YES" in step S204), the process proceeds to step S205.

[0052] In step S205, in the component mounter 4a, the mounting head 431 moves in the XY plane while mounting a component P on the front surface Ba of the board B held at the mounting work position Lo. When mounting of the component P on the front surface Ba is completed in step S205, it is confirmed whether or not the component P mounted on the front surface Ba overlaps with the intended support position S where the backup pins 55 support the board B in the component mounter 4b that is scheduled to mount the component P on the back surface Bb of the board B (steps S206 to S209).

[0053] That is, in step S206, the control unit 410 has the board recognition camera C face the intended support position S from above, captures the intended support position S with the board recognition camera C, and obtains image data Ia showing the image of the intended support position S (step S206), and stores this image data Ia in the storage unit 420 (step S207). In step S208, it is determined whether or not the images of all the intended support positions S set on the front surface Ba of the board B have been captured. Then, steps S206 to S207 are repeated until the images of all the intended support positions S have been captured, and when the images of all the intended support positions S have been captured ("YES" in step S208), the process proceeds to step S209. Note that, from the start of the image capture of the intended support position S in step S202 until it is determined in step S208 that the images of the intended support positions S have been captured, the board B is continuously held at the mounting work position Lo by the conveyor 41 with the front surface Ba facing upward.

[0054] In step S209, the control unit 410 checks whether a component P overlaps the intended support position S by determining whether there is a difference between the image data Ib and image data Ia capturing the same intended support position S. That is, the image data Ib is acquired by capturing an image of the intended support position S before mounting the component P on the front surface Ba (step S205), and the image data Ia is acquired by capturing an image of the intended support position S after mounting the component P on the front surface Ba (step S205). Therefore, when the component P mounted in step S205 does not overlap the intended support position S, no difference occurs between the image data Ib and image data Ia, whereas when the component P mounted in step S205 overlaps the intended support position S, a difference occurs between the image data Ib and image data Ia. Therefore, it is determined that the component P does not overlap the intended support position S where there is no difference between the image data Ib and image data Ia, that is, no interference occurs between the backup pin 55 supporting the intended support position S and the component P. On the other hand, it is determined that a component P overlaps an intended support position S where there is a difference between the image data Ib and the image data Ia, that is, interference will occur between the backup pin 55 supporting the intended support position S and the component P. In step S209, if interference occurs at at least one intended support position S among the multiple intended support positions S, it is determined that there is interference (YES). On the other hand, if interference does not occur at all intended support positions S among the multiple intended support positions S, it is determined that there is no interference (NO). Then, steps S210 to S214 are executed in the same manner as steps S108 to S112 described above.

[0055] In this way, in the second example of double-sided mounting, when the operation of mounting the component P on the front surface Ba of the board B is completed with the front surface Ba facing upward (step S205), it is confirmed whether the component P exists at the intended support position S on the front surface Ba (steps S206 to S209). In other words, when the mounting of the component P on the front surface Ba is completed (step S205), the presence of the component P at the intended support position S on the front surface Ba is confirmed with the front surface Ba on which the component P is mounted facing upward (steps S206 to S209), that is, whether or not there is interference between the backup pins 55 that are intended to support the intended support position S and the component P is confirmed. As a result, it is possible to confirm whether or not there is interference between the component P and the backup pins 55 before the front surface Ba of the board B on which the component P is mounted is supported from below by the backup pins 55.

[0056] Furthermore, a board recognition camera C (camera) is attached to the mounting head 431, and the control unit 410 checks whether or not a component P is present at the intended support position S based on image data Ia (post-operation image) acquired by imaging the intended support position S from above with the board recognition camera C after component mounting by the mounting head 431 (step S205) is completed (steps S206 to S209). With this configuration, it is possible to check in advance whether or not there is interference between the component P and the backup pin 55 based on the image data Ia captured by the board recognition camera C.

[0057] Furthermore, the control unit 410 acquires image data Ib (pre-operation image) by imaging the intended support position S from above with the board recognition camera C before the mounting head 431 starts mounting components (step S205) (steps S202 to S203). Then, the control unit 410 checks whether or not a component P is present at the intended support position S based on a comparison between the image data Ib and image data Ia (step S209). With this configuration, it is possible to check in advance whether or not there is interference between the component P and the backup pin 55 based on a comparison between the image data Ib and image data Ia captured by the board recognition camera C.

[0058] Fig. 10 is a flow chart showing a third example of double-sided mounting performed on a board in the component mounting system of Fig. 1, and Fig. 11 is a side view showing a schematic example of height measurement of an intended support position performed in double-sided mounting of Fig. 10. The following description will focus on differences from the second example of double-sided mounting, and descriptions of commonalities with the second example will be omitted as appropriate.

[0059] In this third example, a distance sensor D shown in Fig. 11 is attached to the head unit 43. This distance sensor D faces downward and measures the height of the intended support position S by detecting the distance to the intended support position S of the board B located at the mounting work position Lo, and the height measured by the distance sensor D (measured height) is transferred to the control unit 410. The type of the distance sensor D is not particularly limited, but for example, a TOF (Time of Flight) type sensor can be used.

[0060] In step S301, the board B is carried into the mounting work position Lo of the component mounter 4a with the front surface Ba facing upward. Next, the control unit 410 measures the height of the intended support position S by the distance sensor D while facing the intended support position S provided on the front surface Ba of the board B held at the mounting work position Lo from above, thereby obtaining a measured height Hb (step S302), and stores this measured height Hb in the storage unit 420 (step S303). In step S304, it is determined whether or not the measurement of the heights of all the intended support positions S set on the front surface Ba of the board B has been completed. Then, steps S302 to S303 are repeated until the measurement of the heights of all the intended support positions S has been completed, while when the measurement of the heights of all the intended support positions S has been completed ("YES" in step S304), the process proceeds to step S305.

[0061] In step S305, in the component mounter 4a, the mounting head 431 moves in the XY plane while mounting a component P on the front surface Ba of the board B held at the mounting work position Lo. When mounting of the component P on the front surface Ba is completed in step S305, it is confirmed whether or not the component P mounted on the front surface Ba overlaps with the intended support position S where the backup pins 55 support the board B in the component mounter 4b that is scheduled to mount the component P on the back surface Bb of the board B (steps S306 to S309).

[0062] That is, in step S306, the control unit 410 measures the height of the intended support position S by using the distance sensor D while facing the intended support position S from above, thereby obtaining a measured height Ha (step S306), and stores this measured height Ha in the storage unit 420 (step S307). In step S308, it is determined whether or not the measurement of the heights of all the intended support positions S set on the front surface Ba of the board B has been completed. Then, steps S306 to S307 are repeated until the measurement of the heights of all the intended support positions S is completed, while when the measurement of the heights of all the intended support positions S is completed ("YES" in step S308), the process proceeds to step S309. Note that, from the start of the measurement of the heights of the intended support positions S in step S302 until it is determined that the measurement of the heights of the intended support positions S is completed in step S308, the board B is continuously held at the mounting work position Lo by the conveyor 41 with the front surface Ba facing upward.

[0063] In step S309, the control unit 410 checks whether a component P overlaps the intended support position S by determining whether there is a difference between the measured height Hb and the measured height Ha of the same intended support position S. That is, the measured height Hb is obtained by measuring the height of the intended support position S before mounting the component P on the front surface Ba (step S305), and the measured height Ha is obtained by measuring the height of the intended support position S after mounting the component P on the front surface Ba (step S305). Therefore, when the component P mounted in step S305 does not overlap the intended support position S, no difference occurs between the measured height Hb and the measured height Ha, whereas when the component P mounted in step S305 overlaps the intended support position S, a difference occurs between the measured height Hb and the measured height Ha (FIG. 11). Therefore, it is determined that the component P does not overlap the intended support position S where there is no difference between the measured height Hb and the measured height Ha, that is, no interference occurs between the backup pin 55 supporting the intended support position S and the component P. On the other hand, it is determined that a component P overlaps an intended support position S where there is a difference between the measured height Hb and the measured height Ha, that is, interference occurs between the backup pin 55 supporting the intended support position S and the component P. In step S309, if interference occurs at at least one intended support position S among the multiple intended support positions S, it is determined that there is interference (YES). On the other hand, if interference does not occur at all intended support positions S among the multiple intended support positions S, it is determined that there is no interference (NO). Then, steps S310 to S314 are executed in the same manner as steps S108 to S112 described above.

[0064] In this way, in the third example of double-sided mounting, when the operation of mounting the component P on the front surface Ba of the board B is completed with the front surface Ba facing upward (step S305), it is confirmed whether the component P exists at the intended support position S on the front surface Ba (steps S306 to S309). In other words, when the mounting of the component P on the front surface Ba is completed (step S305), the presence of the component P at the intended support position S on the front surface Ba is confirmed with the front surface Ba on which the component P is mounted facing upward (steps S306 to S309), that is, whether or not there is interference between the backup pin 55 intended to support the intended support position S and the component P is confirmed. As a result, before the front surface Ba of the board B on which the component P is mounted is supported from below by the backup pin 55, it is possible to confirm whether or not there is interference between the component P and the backup pin 55.

[0065] Further, a distance sensor D is attached to the head unit 43, and the control unit 410 checks whether or not a component P is present at the intended support position S based on a measured height Ha (post-operation measured height) obtained by measuring the height of the intended support position S from above after component mounting by the head unit 43 (step S305) is completed using the distance sensor D (steps S306 to S309). In this configuration, the presence or absence of interference between the component P and the backup pin 55 can be checked in advance based on the measured height Ha of the intended support position S measured by the distance sensor D. Note that various sensors capable of measuring the distance to an object can be used as the distance sensor D, and a laser sensor can be given as an example.

[0066] Furthermore, the control unit 410 acquires a measured height Hb (pre-operation measured height) by measuring the height of the intended support position S from above using the distance sensor D before the head unit 43 starts mounting components (step S305) (steps S302 to S303). Then, the control unit 410 checks whether or not a component P is present at the intended support position S based on a comparison between the measured height Hb and the measured height Ha (step S309). With this configuration, it is possible to check in advance whether or not there is interference between the component P and the backup pin 55 based on a comparison between the measured height Hb and the measured height Ha of the intended support position S measured by the distance sensor D.

[0067] As described above, in this embodiment, component mounter 4 corresponds to an example of a "board working device" of the present invention, conveyor 41 corresponds to an example of a "board holding section" of the present invention, control unit 410 corresponds to an example of a "control section" of the present invention, mounting head 431 corresponds to an example of a "working head" or "mounting head" of the present invention, test pin storage unit 45 corresponds to an example of a "test member storage section" of the present invention, test pin 53 corresponds to an example of a "test member" of the present invention, tip portion 532 corresponds to an example of a "tip portion" of the present invention, backup pin 55 corresponds to an example of a "backup member" of the present invention, and tip portion 552 corresponds to an example of a "backup member" of the present invention. "tip portion", substrate B corresponds to an example of a "substrate" of the present invention, front surface Ba corresponds to an example of a "first surface" of the present invention, back surface Bb corresponds to an example of a "second surface" of the present invention, substrate recognition camera C corresponds to an example of a "camera" of the present invention, distance sensor D corresponds to an example of a "distance sensor" of the present invention, measurement height Ha corresponds to an example of a "post-work measurement height" of the present invention, measurement height Hb corresponds to an example of a "pre-work measurement height" of the present invention, image data Ia corresponds to an example of a "post-work image" of the present invention, image data Ib corresponds to an example of a "pre-work image" of the present invention, and part P corresponds to an example of an "object" or "part" of the present invention.

[0068] The present invention is not limited to the above-mentioned embodiment, and various modifications can be made to the above-mentioned embodiment without departing from the spirit of the present invention. For example, the method of mounting the test pin 53 to the shaft 432 is not limited to suction by the nozzle 51 at the lower end of the mounting head 431. In other words, the test pin 53 may be configured to be detachable from the shaft 432, so that the nozzle 51 is removed from the shaft 432, and then the test pin 53 is attached to the lower end of the shaft 432 in the same manner as the nozzle.

[0069] 9, the presence or absence of interference in step S209 may be determined based only on the image data Ia acquired in steps S206 and S207 without executing steps S202 and S203. In this case, the control unit 410 executes image processing to search for an image of a component P overlapping the intended support position S from the image data Ia, and determines that interference will occur if the corresponding image is confirmed, and determines that interference will not occur if the corresponding image is not confirmed (step S209). Even in this modified example, the control unit 410 checks whether or not a component P exists at the intended support position S based on image data Ia (post-operation image) acquired by capturing an image of the intended support position S from above by the board recognition camera C after the component mounting by the mounting head 431 is completed. In this way, the presence or absence of interference between the component P and the backup pin 55 can be confirmed in advance based on the image data Ia captured by the board recognition camera C.

[0070] 10, the presence or absence of interference in step S309 may be determined based only on the measured height Ha acquired in steps S306 and S307 without executing steps S302 and S303. In this case, the control unit 410 determines that an overlapping component P exists at the intended support position S and interference will occur if the measured height Ha is equal to or greater than a predetermined threshold, and determines that an overlapping component P does not exist at the intended support position S and interference will not occur if the measured height Ha is less than the threshold (step S309). Even in this modified example, the control unit 410 checks whether or not a component P exists at the intended support position S based on the measured height Ha (measured height after operation) acquired by measuring the height of the intended support position S after component mounting by the mounting head 431 is completed from above using the distance sensor D. In this way, the presence or absence of interference between the component P and the backup pin 55 can be confirmed in advance based on the measured height Ha of the intended support position S measured by the distance sensor D.

[0071] In the above, it has been described that the component mounters 4a and 4b have a common configuration as shown in Fig. 2. However, even if the component mounters 4a and 4b have different configurations, the above embodiment can be similarly applied.

[0072] In addition, an example of the board working device is not limited to the component mounter 4 described above. Therefore, the board working device may be, for example, a coating device (dispenser) described in JP 2017-205710 A. In this coating device, a dispense head (working head) applies a liquid coating liquid such as adhesive or cream solder to a board held by a conveyor (board holding unit). The surface Ba of the board B on which the coating liquid has been applied by the coating device faces downward in a device (coating device or component mounter 4) that performs work on the board B after the coating device, and is supported by backup pins 55 at the intended support position S. Therefore, in the coating device, after the coating work of the coating liquid by the dispense head is completed, it can be confirmed as described above whether the coating liquid (target object) exists at the intended support position S of the surface Ba of the board B held by the conveyor. [Explanation of symbols]

[0073] 4...Component mounting machine (board work device) 41...Conveyor (substrate holder) 410...Control unit 431...Mounting head (working head) 45...Test pin storage unit (test material storage section) 53...Test pin (test member) 532...Tip part 55...Backup pin (backup part) 552...Tip part B: Substrate Ba…Surface (first side) Bb…Back side (2nd side) C…Board recognition camera (camera) D...Distance sensor Ha…Measurement height (measurement height after work) Hb…Measurement height (measurement height before work) Ia…Image data (after processing) Ib...Image data (image before processing) P…Part (object)

Claims

1. a substrate holder configured to hold a substrate having a first surface and a second surface opposite to the first surface with the first surface facing upward; a work head that performs an operation of placing an object on the first surface of the substrate held by the substrate holding unit; a control unit that confirms whether or not the object is present at a planned support position on the first surface of the substrate held by the substrate holding unit after the operation by the working head is completed; Equipped with A test member is attached to the working head, the test member has a tip portion having the same shape as a tip portion of a backup member to be used for supporting the intended support position from below, The control unit of the board working device checks whether the object is present at the intended support position based on the result of moving the tip portion of the test member attached to the working head from above toward the intended support position until the tip portion of the test member abuts the first surface or the object placed on the first surface.

2. The test member storage unit further includes a test member storage unit for storing the test member. the test member is detachable from the work head; The test member is detached from the work head and stored in the test member storage section before the start of the work, 2. The substrate processing device according to claim 1, wherein the test member stored in the test member storage section is attached to the processing head after the processing is completed.

3. a substrate holder configured to hold a substrate having a first surface and a second surface opposite to the first surface with the first surface facing upward; a work head that performs an operation of placing an object on the first surface of the substrate held by the substrate holding unit; a control unit that checks whether or not the object is present at a planned support position on the first surface of the substrate held by the substrate holding unit after the operation by the working head is completed; and A camera attached to the work head; Equipped with The control unit of the board working device checks whether the object is present at the intended support position based on a post-work image obtained by capturing an image of the intended support position from above with the camera after the work by the work head is completed.

4. The board working device of claim 3, wherein the control unit checks whether the object is present at the intended support position based on a comparison between a pre-work image obtained by capturing an image of the intended support position from above with the camera before the work head starts working and the post-work image.

5. a substrate holder configured to hold a substrate having a first surface and a second surface opposite to the first surface with the first surface facing upward; a work head that performs an operation of placing an object on the first surface of the substrate held by the substrate holding unit; a control unit that checks whether or not the object is present at a planned support position on the first surface of the substrate held by the substrate holding unit after the operation by the working head is completed; and A distance sensor attached to the work head; Equipped with The control unit of the substrate working device checks whether the object is present at the intended support position based on a post-work measurement height obtained by measuring the height of the intended support position from above using the distance sensor after the work is completed by the work head.

6. The control unit confirms whether the object is present at the intended support position based on a comparison between a pre-work measurement height obtained by measuring the height of the intended support position from above using the distance sensor before the work head starts the work and the post-work measurement height.

7. The board working apparatus according to claim 1 , wherein the control unit notifies an operator when it determines that the object is present at the intended support position.

8. The board working apparatus according to claim 7 , wherein the control unit issues an instruction to change the intended supporting position in the notification.

9. the object is a part, 9. The board working device according to claim 1, wherein the working head is a mounting head that mounts the components on the first surface of the board held by the board holding part.

10. the object is a coating liquid, 9. The substrate working device according to claim 1, wherein the working head is a dispense head that applies the coating liquid to the first surface of the substrate held by the substrate holding part.

11. a step of holding a substrate having a first surface and a second surface opposite to the first surface, with the first surface facing upward, by a substrate holding part; performing an operation of placing an object on the first surface of the substrate held by the substrate holding unit using a working head; after the operation is completed, confirming by a control unit whether or not the object is present at a planned support position of the first surface of the substrate held by the substrate holder; Equipped with A test member is attached to the working head, the test member has a tip portion having the same shape as a tip portion of a backup member to be used for supporting the intended support position from below, The control unit of the circuit board working method checks whether the object is present at the intended support position based on the result of moving the tip portion of the test member attached to the work head from above toward the intended support position until the tip portion of the test member contacts the first surface or the object placed on the first surface.

12. a step of holding a substrate having a first surface and a second surface opposite to the first surface, with the first surface facing upward, by a substrate holding part; performing an operation of placing an object on the first surface of the substrate held by the substrate holding unit using a working head; after the operation is completed, confirming by a control unit whether or not the object is present at a planned support position of the first surface of the substrate held by the substrate holder; Equipped with A camera is provided that is attached to the work head; The control unit confirms whether the object is present at the intended support position based on a post-work image obtained by imaging the intended support position from above with the camera after the work by the work head is completed.

13. a step of holding a substrate having a first surface and a second surface opposite to the first surface, with the first surface facing upward, by a substrate holding part; performing an operation of placing an object on the first surface of the substrate held by the substrate holding unit using a working head; after the operation is completed, confirming by a control unit whether or not the object is present at a planned support position of the first surface of the substrate held by the substrate holder; Equipped with A distance sensor is provided attached to the work head; The control unit confirms whether the object is present at the intended support position based on a post-work measurement height obtained by measuring the height of the intended support position from above using the distance sensor after the work is completed by the work head.

Images