Floor structure and floor structure construction method

Abstract

To provide a floor structure and a construction method of the floor structure that includes a wiring path under the floor but does not cause insulation defects.SOLUTION: A floor structure includes: a wiring floor section that comprises down floor plates disposed below subfloor plates with spacer materials therebetween, first floor support materials supporting the underside of the down floor plates, and first insulation materials disposed at least below the down floor plates, to form a wiring space between the subfloor plates and the down floor plates, and to form a wiring connection port in the subfloor plates for connecting wires to the space above the subfloor plates; and a general floor section that comprises a second floor support material disposed below an adjacent subfloor plate disposed flush with the subfloor plates to support the underside of the adjacent subfloor plate, and a second insulation material disposed at least below the adjacent subfloor plate.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a floor structure that allows wiring to be installed under the floor and a method for constructing the floor structure. [Background technology]

[0002] Conventionally, double-layered floors have been known, mainly for office OA floors, with wiring space provided below the floor surface (see Patent Document 1). For example, in Patent Document 1, upper and lower side materials are formed with floor joists in between, and the space between the upper and lower side materials serves as the wiring space. Also, for example, a spacer member capable of forming a gap between a floorboard and the underlying floor surface or floor beams is arranged, and wiring is stored in a groove formed under the floorboard by the spacer member (see Patent Documents 2 and 3). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2018-100538 A [Patent Document 2] JP 2007-16437 A [Patent Document 3] JP 2010-1600 A Summary of the Invention [Problem to be solved by the invention]

[0004] For example, in the case of a house, the floor is constructed by placing slats on the floor beams, and then joists are placed on the slats, and floorboards are placed on the joists. Insulation is placed between the joists to maintain airtightness and thermal insulation from the outside. However, since insulation cannot be placed in the location where the wiring path is installed, there is a problem that insulation defects occur and airtightness and thermal insulation cannot be maintained. In addition, for example, the connection part of the outlet, etc. must be connected on the floor, so there is a problem of airtightness and thermal insulation due to insulation defects.

[0005] Therefore, an object of the present invention is to provide a floor structure and a construction method for the floor structure that have a wiring path under the floor and do not cause insulation defects. [Means for solving the problem]

[0006] The floor structure of the present invention is characterized in having a down floor board arranged below the sub-floor board with a spacer material in between, a first floor support material supporting the underside of the down floor board, and a first insulating material arranged at least below the down floor board, wherein a wiring space is formed between the sub-floor board and the down floor board and a wiring connection port is formed in the sub-floor board for connecting wiring to the space above the sub-floor board, and a general floor section having a second floor support material arranged below an adjacent sub-floor board arranged flush with the sub-floor board and supporting the underside of the adjacent sub-floor board, and a second insulating material arranged at least below the adjacent sub-floor board.

[0007] The floor structure of the present invention is characterized in that the first floor support material is a first joist fixed to the side of the joist supported by the floor beam, and the second floor support material is a second joist placed on the upper surface of the joist and fixed thereto.

[0008] The construction method of the floor structure of the present invention is a construction method for constructing the above-mentioned floor structure, and is characterized by comprising the steps of: laying a general floor panel that is integrated with the adjacent sub-floor board, the second joist, and the second insulating material that is arranged at least between the second joist, to form the general floor section; laying a wiring floor panel that is integrated with the down floor board, the first joist, and the first insulating material that is arranged at least between the first joist; and providing the spacer material and the sub-floor board on top of the down floor board, to form the wiring floor section.

[0009] The floor structure of the present invention is characterized in that the first floor support material is a first floor slab fixed to the upper surface of a beam, and the second floor support material is a second floor slab thicker than the first floor slab fixed to the upper surface of the beam. Effect of the Invention

[0010] According to the floor structure of the present invention, a wiring floor section and a general floor section are provided, and a wiring space is formed by providing a spacer material between the subfloor board and the down floor board in the wiring floor section, and a first insulating material is formed below the down floor board, so that the wiring cable is wired above the first insulating material and below the subfloor board, and no insulation loss occurs due to the wiring space. Also, the wiring connection port is formed penetrating only the subfloor board and opening toward the space above, so that no loss occurs in the first insulating material, and the wiring connection port can be provided on the floor surface while maintaining the airtightness and insulation of the space above the floor.

[0011] According to the floor structure of the present invention, the second joist placed on and fixed to the upper surface of the joists supports the underside of the adjacent sub-floor board, while the first joist fixed to the side of the joists supports the underside of the down floor board. Therefore, without changing the height of the joists, the down floor board can be lowered below the adjacent sub-floor board, and wiring space can be formed with good construction properties.

[0012] According to the floor structure construction method of the present invention, a general floor section is formed by arranging a general floor panel in which an adjacent subfloor board, a second joist, and a second insulating material are integrated, a wiring floor panel in which a down floor board, a first joist, and a first insulating material are integrated is laid, and a spacer material and a subfloor board are provided on the down floor board to form the wiring floor section, which improves construction efficiency compared to the case where a subfloor board, a joist, and an insulating material are installed one by one. Also, since the general floor section is formed with a general floor panel and the wiring floor section is formed with a wiring floor panel, it is sufficient to replace the general floor panel with a wiring floor panel only in the area where wiring is to be passed, provide a spacer material and a subfloor board to form the wiring floor section, and form the general floor section in the other areas, so that a wiring connection port such as an outlet for connecting wiring to a desired position on the floor surface can be formed with little effort.

[0013] According to the floor structure of the present invention, a wiring space is formed by the difference in thickness between a first floor slab and a second floor slab that is thicker than the first floor slab, so that a wiring space under the floor can be formed without compromising workability and without any insulation defects. [Brief description of the drawings]

[0014] [Figure 1] FIG. 2 is a cross-sectional view perpendicular to the joists showing the floor structure of the first embodiment. [Diagram 2] FIG. 2 is a cross-sectional view parallel to the joists showing the floor structure of the first embodiment. [Diagram 3] A cross-sectional view perpendicular to the joists showing the floor structure of the first embodiment in which the first and second insulating materials are omitted for ease of explanation. [Figure 4] A cross-sectional view parallel to the joists showing the floor structure of the first embodiment in which the first insulation material and the second insulation material are omitted for ease of explanation. [Diagram 5] (A) is an enlarged view of part A in FIG. 4, and (B) is an enlarged view of part B in FIG. [Figure 6] FIG. 2 is a diagram showing a construction method for the floor structure of the first embodiment, illustrating the state in which the wiring floor panel and the general floor panel are attached to the joists. [Figure 7] 13 is a diagram illustrating the state in which the spacer material and the floor sub-plate are fixed onto the down floor plate. FIG. [Figure 8] FIG. 11 is a cross-sectional view showing a floor structure of a second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0015] First Embodiment Hereinafter, a floor structure 1a according to a first embodiment of the present invention and a construction method thereof will be described with reference to Figs. 1 to 7. The floor structure 1a of this embodiment is, for example, a floor structure 1a formed on the first floor of a detached house, and is a floor structure 1a that forms the floor surface of a relatively large living space. The building in which the floor structure 1a of this embodiment is used is not limited to a detached house, but may be an apartment building or various non-residential facilities. In addition, the floor structure 1a of this embodiment is not limited to being provided on the first floor, but the floor structure 1a has a space above it that is an indoor space and a space below it that is outdoors, and is a structure that requires thermal insulation and airtightness.

[0016] As shown in Figs. 1, 2, and 5, the floor structure 1a of this embodiment includes a floor beam 12 erected on a foundation or concrete floor 11, a slat 13 erected on the floor beam 12, a wiring floor section 2 supported by the slat 13 to form a wiring space S under a floor base plate 14, and a general floor section 3 in which no wiring space S is formed. The floor beam 12 is made of steel, for example, and is formed so that the height can be adjusted by rotating a turnbuckle. The floor beam 12 is fixed at the lower end plate to the foundation or concrete floor 11 by driving a screw for concrete, and the support plate formed at the upper end is fixed to the steel slat 13 with a screw to erect it. The slat 13 is a steel rectangular tube, and although not shown, a meandering rib is pressed on the side to increase rigidity. A plurality of floor beams 12 are erected on the foundation or concrete floor 11, and the slat 13 is erected on the plurality of floor beams 12 and fixed horizontally. A plurality of joists 13 are installed in parallel with a space therebetween.

[0017] As shown in Figures 1, 2, and 5, the wiring floor section 2 is formed by a first joist 40 whose end is fixed to the side of the joists 13 and is spanned between the joists 13, a down floor board 41 whose underside is supported by the first joist 40, a first insulating material 42 arranged along the underside of the down floor board 41, a spacer material 15 fixed to the upper surface of the down floor board 41, and a floor sub-board 14 fixed on top of the spacer material 15.

[0018] The first joist 40 is a joist formed of square timber. Groove-shaped joist support metal fittings 43 that open upward are fixed to the side surfaces of the joists 13 on both sides so as to face each other, and the first joist 40 is installed between the joists 13 by inserting the ends of the first joist 40 into the joist support metal fittings 43 and fixing them with screws (not shown). Note that the "first floor support material" in the present invention corresponds to the first joist 40 in this embodiment.

[0019] The down floorboard 41 is a plywood fixed to the upper surface of the first joist 40. The down floorboard 41 is formed, for example, in a square or rectangular shape, and the first joist 40 is fixed to the lower surface of the down floorboard 41 along both side edges of the down floorboard 41. The length of the first joist 40 is equal to the distance between the adjacent joists 13. The down floorboard 41 is formed to protrude from both ends of the first joist 40 by about half the length of the joists 13, and when the first joist 40 is installed between the joists 13, the down floorboard 41 is arranged to extend above the joists 13.

[0020] 1 and 2, the first insulating material 42 is formed in a rectangular plate shape, and is stored between two first joists 40 fixed to the underside of both side edges of the down floor board 41. The upper surface of the first insulating material 42 abuts the underside of the down floor board 41, and the lower surface is formed to a position lower than the underside of the first joists 40. The first insulating material 42 can be, for example, an inorganic fiber insulating material, an expanded plastic foam insulating material, or any other known insulating material.

[0021] As shown in FIG. 6, the down floor board 41, the first joist 40, and the first insulation material 42 are formed and installed as an integrated wiring floor panel 4, which simplifies the installation process.

[0022] The spacer material 15 fixed to the upper surface of the down floor board 41 is formed of a square timber whose cross-sectional shape is longer in the width direction than in the height direction, as shown in Fig. 5, and is fixed to the upper surfaces of both side edges of the down floor board 41. The floor base board 14 is a plate material fixed to the upper surface of the spacer material 15, and is disposed above the down floor board 41 at a distance equal to the height of the spacer material 15. The floor base board 14 is made of plywood, and is installed between the two spacer materials 15 of the down floor board 41. A wiring space S capable of storing a wiring cable 16 is formed between the down floor board 41 and the floor base board 14.

[0023] The wiring cable 16 is, for example, an electric cable. The wiring cable 16 is not limited to this, and various wiring cables 16 such as an antenna line, a LAN cable, a telephone line, and a gas line can be stored. A desired floor decorative material 17 is then attached on the underfloor board 14. A wiring connection port 18 is formed in the underfloor board 14 and the floor decorative material 17 at a position where the wiring is connected to the space above. The wiring connection port 18 is formed, for example, of a cylindrical member with a lid that is inserted and fixed in a circular hole provided in the underfloor board 14 and the floor decorative material 17, and is configured so that a plug can be inserted and removed from the space above the floor to the outlet 7 stored inside.

[0024] The wiring floor section 2 extends from the floor in the center of the room to an exterior wall or partition wall 19, and the wiring cable 16 is pulled into the exterior wall or partition wall 19 and connected to a power source.

[0025] As shown in Figs. 3 and 4, the general floor section 3 has a second joist 50 placed and fixed on the upper surface of the joists 13, an adjacent floor base plate 51 whose underside is supported by the second joist 50, and a second insulating material 52 arranged along the underside of the adjacent floor base plate 51. The second joist 50 is a joist formed of a square timber. The underside of the end of the second joist 50 abuts against the upper surfaces of two adjacent joists 13 and is fixed to the joists 13 with screws (not shown), so that the second joist 50 is erected on the joists 13. Note that the "second floor support material" in the present invention corresponds to the second joist 50 in this embodiment.

[0026] The adjacent subfloor board 51 is a plywood fixed to the upper surface of the second joist 50. The adjacent subfloor board 51 is formed, for example, in a square or rectangular shape, and three second joists 50 are fixed to the lower surface of the adjacent subfloor board 51 in parallel to each other. The length of the second joists 50 is formed to be longer than the distance between the adjacent joists 13 by about the width of the joists 13, and both ends overlap about half of the joists 13. The adjacent subfloor board 51 has a length almost equal to that of the second joist 50, and one end of the second joist 50 protrudes slightly from the edge of the adjacent subfloor board 51 and the other end is positioned slightly inside the edge of the adjacent subfloor board 51, and is fixed so as to be slightly offset from the adjacent subfloor board 51, and when the adjacent subfloor board 51 is laid, the offset portion becomes a joint, and the second joist 50 and the adjacent subfloor board 51 are integrated to form the surface of the floor base.

[0027] 1 and 2, the second insulating material 52 is formed in a rectangular plate shape, and is formed along the underside of the adjacent subfloor boards 51, between the second joists 50, and between the outermost second joists 50 and the edge of the adjacent subfloor boards 51. The upper surface of the second insulating material 52 abuts against the underside of the adjacent subfloor boards 51, and the lower surface is formed to a position lower than the underside of the first joists 40. The first insulating material 42 can be, for example, an inorganic fiber insulating material, an expanded plastic foam insulating material, or any other known insulating material.

[0028] As shown in FIG. 6, the adjacent subfloor boards 51, the second joists 50, and the second insulation material 52 are formed and installed as an integrated general floor panel 5, which simplifies the construction of the floor structure 1a.

[0029] The construction method for the floor structure formed as above is to erect floor beams 12 at predetermined positions on foundation or concrete floor 11, and erect joists 13 on said floor beams 12 parallel to each other at equal intervals. Then, joist support hardware 43 is fixed to the side of joist 13 at the position where first joist 40 is to be fixed, and wiring floor panel 4 is placed and fixed with screws so that the end of first joist 40 is inserted into joist support hardware 43. Furthermore, general floor panel 5 is laid on joist 13 so that the end of second joist 50 is placed on top of joist 13, and fixed with screws. The first joist 40 is installed on the side of the joist 13, and the second joist 50 is installed on the upper surface of the joist 13. Therefore, as shown in FIG. 7, the first joist 40 is located at a lower position than the second joist 50, and the down floor board 41 of the wiring floor panel 4 is located at a lower position than the adjacent floor base board 51 of the general floor panel 5, forming a groove-shaped wiring space S with the down floor board 41 as the bottom. Then, as shown in FIG. 7, a wiring cable 16 such as an electric cable is stored in the wiring space S, a spacer material 15 is fixed on the down floor board 41, and a floor base board 14 is provided on the spacer material 15 to close the wiring space S. The floor base board 14 and the adjacent floor base board 51 of the general floor panel 5 are arranged flush with each other, and a floor decorative material 17 is attached on the floor base board 14 and the adjacent floor base board 51 to complete the construction method of the floor structure.

[0030] Thus, according to the floor structure 1a of this embodiment, the wiring cable 16 is wired in the wiring space S formed between the floor sub-floor board 14 of the wiring floor section 2 and the down floor board 41, and is connected to the floor through the wiring connection port 18, and the first insulation material 42 is formed along the lower surface of the down floor board 41, so that the route for connecting the wiring cable 16 to the floor is arranged above the insulation material, and the loss of the insulation material can be suppressed. The first joist 40 supporting the down floor board 41 is erected on the side of the slats 13, and the second joist 50 supporting the adjacent floor sub-floor board 51 is erected on the upper surface of the slats 13, so that the down floor board 41 is lower than the adjacent floor sub-floor board 51, and therefore the wiring space S can be formed with good workability without changing the height of the slats 13.

[0031] Furthermore, according to the construction method of the floor structure 1a of this embodiment, a general floor section 3 is formed by arranging a general floor panel 5 which is integrated with an adjacent floor sub-board 51, a second joist 50, and a second insulation material 52, and a wiring floor panel 4 which is integrated with a down floor board 41, a first joist 40, and a first insulation material 42 is laid, and a spacer material 15 and a floor sub-board 14 are provided on top of the down floor board 41 to form the wiring floor section 2, thereby improving on-site construction ease and allowing wiring connection ports 18 such as an outlet 7 for connecting a wiring cable 16 to any position on the floor surface to be formed with little effort.

[0032] Second Embodiment Next, a floor structure 1b according to a second embodiment of the present invention will be described with reference to FIG. 8. The same components as those in the first embodiment are denoted by the same reference numerals and will not be described. The floor structure 1b of this embodiment is a floor structure 1b formed on an upper floor, for example, above the first floor of a detached house, and forms the floor surface of the indoor living space of a protruding portion formed to protrude from the first floor to the outdoor side. The protruding portion may be, for example, an overhang, or may be a structure in which an independent column is provided below the protruding portion, as long as the space below the protruding portion is an outdoor space. The building in which the floor structure 1b of this embodiment is used is not limited to a detached house, but may be an apartment house or various non-residential facilities.

[0033] The floor structure 1b of this embodiment comprises a wiring floor section 2 in which a wiring space S is formed by being supported by beams 6, which are the structural frame of the building, and a general floor section 3 in which no wiring space S is formed. The beams 6 are H-shaped steel with flanges arranged above and below. The wiring floor section 2 comprises a first floor slab 20 whose end is fixed to the upper flange of the beams 6, a down floor plate 21 fixed onto the first floor slab 20, a spacer material 15 fixed to the upper surface of the down floor plate 21, a floor base plate 14 fixed to the upper surface of the spacer material 15, and a first insulating material 22 fixed along the lower surface of the first floor slab 20.

[0034] The first deck 20 is, for example, an extruded cement molded plate, and is formed to a thickness of 60 mm. The material and thickness of the first deck 20 are not limited to these, but it is formed to be thinner than the second deck 30 described below. Both ends of the first deck 20 are fixed to the upper flanges of the beams 6, and the first deck 20 is installed between adjacent beams 6. In this embodiment, the first deck 20 corresponds to the "first floor supporting material" in the present invention.

[0035] The down floor plate 21 is a particle board laid on the first floor slab 20 with a moisture-proof sheet sandwiched therebetween. The down floor plate 21 is laid over the entire upper surface of the first floor slab 20. The spacer material 15 fixed to the upper surface of the down floor plate 21 is formed of a square timber whose cross-sectional shape is longer in the width direction than in the height direction, and a plurality of pieces are arranged in parallel. The floor base plate 14 is a plate material fixed to the upper surface of the spacer material 15, and is arranged above the down floor plate 21 with a distance equal to the height of the spacer material 15 from the down floor plate 21. The floor base plate 14 is made of plywood and is installed between the plurality of spacer materials 15, and a wiring space S capable of storing the wiring cable 16 is formed between the down floor plate 21 and the floor base plate 14. The first insulation material 22 is an insulation material fixed under the first floor slab 20. For example, the first insulation material 22 can be an inorganic fiber insulation material, an expanded plastic foam insulation material, or any other known insulation material.

[0036] The wiring cable 16 is, for example, an electric cable. As in the first embodiment, the wiring cable 16 may be various wiring such as an antenna line, a LAN cable, a telephone line, a gas line, etc. A desired floor covering material 17 is attached on the underfloor board 14. A wiring connection port 18 is formed in the underfloor board 14 and the floor covering material 17 at a position where the wiring is connected to the space above. The wiring connection port 18 is formed, for example, of a cylindrical member with a lid that is inserted and fixed in a circular hole provided in the underfloor board 14 and the floor covering material 17, and is configured so that a plug can be inserted and removed from the space above the floor to the outlet 7 stored inside. The wiring floor part 2 extends from the floor in the center of the room to the outer wall or partition wall 19, and the wiring cable 16 is drawn into the inside of the outer wall or partition wall 19 and connected to a power source.

[0037] The general floor section 3 has a second deck 30 whose end is fixed to the upper flange of the beam 6, an adjacent floor sub-floor plate 51 fixed onto the second deck 30, and a second insulation material 32 fixed along the underside of the second deck 30.

[0038] The second deck 30 is made of ALC, for example, and is formed to a thickness of 100 mm. The material and thickness of the second deck 30 are not limited to these, but it is formed to be thicker than the first deck 20. Both ends of the second deck 30 are fixed to the upper flanges of the beams 6, and the second deck 30 is installed between adjacent beams 6. The "second floor supporting material" in the present invention corresponds to the second deck 30 in this embodiment.

[0039] The adjacent subfloor board 31 is a particle board laid on the second floor slab 30 with a moisture-proof sheet sandwiched therebetween. The adjacent subfloor board 31 is laid over the entire upper surface of the second floor slab 30. A floor decorative material 17 is attached to the adjacent subfloor board 31. The second insulating material 32 is an insulating material fixed under the second floor slab 30. The second insulating material 32 may be, for example, an inorganic fiber insulating material, an expanded plastic foam insulating material, or any other known insulating material. The first insulating material 22 and the second insulating material 32 may be integrally configured.

[0040] As described above, in the floor structure 1b of this embodiment, the wiring space S is formed by the difference in thickness between the first floor slab 20 and the second floor slab 30 which is thicker than the first floor slab 20, so that a wiring space S under the floor can be formed without any insulation defects without reducing workability.

[0041] Depending on the building, the floor structure 1a of the first embodiment may be used as the floor structure for the first floor, and the floor structure 1b of the second embodiment may be used as the floor structure for the protruding portion formed on the second or higher floors of the building.

[0042] It goes without saying that the embodiment of the present invention is not limited to the above-mentioned embodiment, and can be modified as appropriate without departing from the scope of the concept of the present invention. [Industrial Applicability]

[0043] The floor structures 1a, 1b and the method for constructing the floor structures according to the present invention are suitable, for example, as floor structures 1a, 1b and the method for constructing the floor structures of a house having a large spacious room. [Explanation of symbols]

[0044] 1a Floor structure (first embodiment) 1b Floor structure (second embodiment) 2 Wiring Floor 3 General floor section 4 Wiring Floor Panel 5 General floor panels 14 Floor base plate 15 Spacer material 20 First floor slab (first floor support material of the second embodiment) 21 Down floor board (second embodiment) 22 First insulation material (second embodiment) 30 Second floor slab (second floor support material of the second embodiment) 31 Adjacent floor base plate (second embodiment) 32 Second insulation material (second embodiment) 40 First joist (first floor support member of the first embodiment) 41 Down floor board (first embodiment) 42 First insulation material (first embodiment) 50 Second joist (second floor support material of the first embodiment) 51 Adjacent floor base plate (first embodiment) 52 Second insulation material (first embodiment) S Wiring space

Claims

1. a wiring floor section comprising a down floor plate disposed below a sub-floor plate with a spacer material sandwiched therebetween, a first floor support material supporting the underside of the down floor plate, and a first insulating material disposed at least below the down floor plate, wherein a wiring space is formed between the sub-floor plate and the down floor plate, and a wiring connection port is formed in the sub-floor plate for connecting wiring to the space above the sub-floor plate; A general floor section having a second floor support material that is arranged below an adjacent subfloor board that is arranged flush with the subfloor board and supports the underside of the adjacent subfloor board, and a second insulating material that is arranged at least below the adjacent subfloor board; A floor structure comprising:

2. The first floor support member is a first joist fixed to a side surface of a joist supported by a floor beam, 2. The floor structure according to claim 1, wherein the second floor support material is a second joist that is placed on and fixed to an upper surface of the joists.

3. A method for constructing the floor structure according to claim 2, comprising the steps of: A process of laying a general floor panel in which the adjacent floor base plate, the second joist, and the second insulation material disposed at least between the second joists are integrated to form the general floor portion; A step of laying a wiring floor panel in which the down floor board, the first joist, and the first insulation material disposed at least between the first joists are integrated; providing the spacer material and the floor base plate on the down floor plate to form the wiring floor section; A construction method for a floor structure comprising the steps of:

4. The first floor support is a first floor slab fixed to an upper surface of a beam, The floor structure according to claim 1, wherein the second floor support is a second floor slab that is thicker than the first floor slab and is fixed to the upper surface of the beam.

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